* 1

A RMY R ESEARCH LABOIWTORY

Evaluation of Electrical Resistivity

Characteristics of Metalized 4H-Sic for

Application to Electric Guns

by Gary L. Katulka

Approved for public release; distribution is unlimited.
I

.

The findings in this report are not to be construed as an official

Department of the Amy position unless so designated by other

authorized documents.

Citation of manufacturer’s or trade names does not constitute an

offkial endorsement or approval of tie use thereof.

Destroy this report when it is no longer needed. Do not return

it to the originator.

- I
Abstract

The experiments described demonstrate the electrical behavior of Sic and metal

ohmic-contact layers as a function of thermal stress. It has been determined from these

experiments that both titanium (Ti) and tantalum (Ta) metalization structures will provide a

stable electrical ohmic-contact with n-type SIC after exposure to elevated temperatures for short

bursts of time that are considered relevant for pulsed-powered electric weapon technologies. The

Ti-Sic structure investigated exhibited a stable current-voltage (I-V) characteristic to as much

as 800” C for a lo-min burst, while Ta metalizations provided a stable I-V characteristic on Sic

even after a temperature burst of 1,000” C for as long as a 3-min interval. For samples of n-type,

4H Sic, metalized with (Ti), the standard deviation in resistance (resistivity) of the measured

samples is less than 0.17 ohms for a sample having an average resistance of 4.45 ohms. For the

Ta contact on Sic, the standard deviation in resistance is 0.05 ohms for a sample having an

average resistance of 4.25 ohms. The experiments showed that for both Ti and Ta metalized Sic

samples, the change in resistivity of annealed samples is between 3.8% and 1.2% compared to

the average values of sample resistance based upon the I-V measurement technique used. These

results indicate the ability of Ti-SiC and Ta-SiC structures to perform in a stable manner without

significant electrical degradation to the metal contact, Sic substrate, or the metal-semiconductor

interface as a function of high-temperature burst conditions.

ii
Acknowledgments

Support for this work was provided by the U.S. Army Electric Gun Program, managed by

Drs. Ed Schmidt and William Oberle from the U.S. Army Research Laboratory (ARL), and

Dr. Ian McNab of the Institute for Advanced Technology (IAT), The University of Texas at

Austin. Technical assistance with rapid thermal annealing procedures was provided by Dr. Paul

Berger at the University of Delaware. Also, thanks is owed to Dr. Melanie Cole (ARL), Ingolf

Rau, and Michael Dashiell of the electrical engineering department at the University of Delaware

for technical discussions, assistance with metalization techniques, and review of the final

manuscript.

. . . 111
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iv
Table of Contents

1.

2.

3.

4.

5.

6.

7.

Acknowledgments ....................................................................................................

List of Figures ..........................................................................................................

Introduction .............................................................................................................

Benefits of Sic in Electric Gun Missions ..............................................................

Experimental Procedure and Results....................................................................

Ti-SiC I-V Results ...................................................................................................

Ta-SiC I-V Results ..................................................................................................

Conclusions ..............................................................................................................

References ................................................................................................................

Distribution List ......................................................................................................

Report Documentation Page ..................................................................................

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Vi
List of Figures

Figure

1.

2.

3.

4.

5.

6.

7.

8.

9.

ETC and EM Railgun Concepts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Calculated Solid-State Material Mass as a Function of Current Density for

a 3-ms Power Pulse and a Semiconductor Dopant Concentration

of 1 x 1014 cms3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrical (I-V) Characterization Arrangement for Metalized Sic Sample

Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ti-SiC Sample As-Deposited and Annealed at 600” C for 5 min . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Ti-SiC Sample As-Deposited and Annealed at 1,120” C for 2 min . . . . . . . . . . . . . . . . . . . . . . . . . .

Ti-Sic Sample I-V Characteristics for As-Deposited and Annealed Samples

at 300,600,800, and 1,120” C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current-Voltage Characteristic for Ta-SiC As-Deposited Sample . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current-Voltage Characteristic for Ta-SiC Sample Annealed at 1,120” C

for 3 min . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current-Voltage Characteristic for Ta-SiC Sample Annealed at 600, 1,000,

and 1,120” C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

PaRe

1

4

8

9

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1. Introduction

Improved weapon performance can be quantified in terms of increased muzzle kinetic energy

(KE), greater armor penetration, shorter projectile time of flight, or improved target accuracy.

Advanced high-power electric weapon concepts such as electrothermal-chemical (ETC) or

electromagnetic (EM) gun systems, which are illustrated in the representative diagrams of

Figure 1, have the demonstrated ability to improve the ballistic performance by as much as 30%

over conventional guns with respect to projectile muzzle KE in ETC guns, or up to as much as

7 km/s muzzle velocity with EM railguns [ 1,2].

Breech Projectile

ELECTROTHERMAL

CHEMICAL GUN (-2005):

0 Mostly chemical

energy

ELECTROMAGNEK

RAILGUN (42015):

Prime

Power / \

Plasma Cartridge Propellant

POW Conducting Rails

l All electric

Figure 1. ETC and EM Railgun Concepts.

Other benefits of ETC gun technology include the ability to improve the ignition

reproducibility by as much as a factor of 25-75 over large-caliber conventional chemical guns,

which may have direct benefits toward lethality improvement due to increased target

accuracy [3]. However, in order to fully provide the performance benefits offered by electric

gun technologies, the integration of optimized high-power and high-temperature materials must

1
be provided first. High-power materials will allow for improved reliability of pulsed-powered

electric gun components or extend peak power capability, thereby minimizing the mass and

volume of electric gun pulsed-power supplies. In addition, with the integration of optimized

power electronics, the mobility of future combat systems can also be improved compared to

current conventional combat vehicles due to reductions in system mass and volume as well as

due to the improvements possible with electric vehicle propulsion and suspension technology

that are presently under investigation.

From an electronic materials viewpoint, the compound single-crystalline semiconductor

silicon carbide (Sic) is considered an excellent candidate for high-energy, pulsed-power

electronics applications involving electric weapon technology. This is due to the fundamental

material and electronic properties of Sic, which include its wide bandgap (2.3-3.2 eV), its high

thermal conductivity (4.9 W/cm-K), its high melting point (3,000” C), and its electronic transport

properties that may provide advanced electronic device designs having high blocking voltage and

high-power transmission capability [4, 51. The main advantages of Sic pulsed-power systems

compared to conventional Si systems are improved lifetime and reliability at high temperatures

as well as reduced material mass and volume, which are allowable due to the greatly improved

voltage, power, and temperature handling that are possible with devices fabricated in Sic. In

order to realize the significant potential gains with Sic materials and devices, however, largearea prototype samples operating in the anticipated system environments must first be

characterized. While single-crystalline Sic can theoretically perform well under extreme

conditions, the material must first interact reliably with a metal contact in a stable manner.

To determine the feasibility of a Sic-metal contact operating at elevated temperatures for

periods of time relevant to electric weapon concepts, experiments have been carried out with

single-crystalline, 4H (hexagonal crystal), n-type Sic. The Sic samples under study were

obtained from Cree Research, Inc., and metal contacts were deposited by sputtering with metal

layers, which followed by annealing at high temperatures for varying amounts of time. Resultant

samples were characterized with a current-voltage (I-V) measurement technique to first test for

an ohmic (nonrectifying) contact and also to characterize the thermal stability of the electrical

2
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properties at elevated temperature over varying lengths of time. The duration of

high-temperature annealing was as long as 5 min, and all samples were annealed in an argon

environment to avoid unwanted impurity contamination from oxygen or nitrogen into the

metal-semiconductor layers.

Ultimately, more detailed analysis such as x-ray diffraction (XRD) and transmission electron

microscopy (TEM) can be applied to the analysis to determine long-term effects of high

temperatures on the characteristics of tested samples. The preliminary experimental results show

that the titanium (Ti) and tantalum (Ta) layers on n-type Sic substrates provide stable ohmic

contacts even after exposure to temperatures as high as 800 and 1,000” C for short periods of

time. The Ta-SiC contacts had a smaller deviation in resistance over a larger temperature range

than the Ti-SiC contacts. It is concluded that based upon preliminary I-V measurement results of

the metal-sic samples at the temperatures and periods of time investigated that the prototype

materials are favorable for pulsed-power electric gun device applications.

2. Benefits of Sic in Electric Gun Missions

Significant advantages can be realized from high-temperature pulsed-power materials such as

those necessary for electric combat systems. The main advantage of Sic for electric gun

applications is in the ability to operate under high-current density and high-temperature

conditions. The higher operating temperature in Sic is allowable due to the fact that the

temperature at which thermally generated carriers in the bulk material exceed the dopant

concentration is above 900” C, compared to 200” C for equivalently doped Si 161. The overall

system benefit with novel Sic power electrical systems is the reduction in mass and volume of

pulsed-power components, which effectively increases the specific energy density of an electric

gun pulsed-power system.

To illustrate the benefit of high-temperature capability, the results from calculations shown in

Figure 2 provide an approximation of solid-state material mass required as a function of assumed

3
Figure 2.

6000 8000 10000 12000 14Qoo 16000

Current Density (A/arPP)

Calculated Solid-State Material Mass as Function of Current Density for a 34x1s

Power Pulse and a Semiconductor Dopant Concentration of 1 x 1014 cm-3.

operating current density. The calculations are based upon the simplified expression for total

energy, Q, deposited to a given mass, m, having a known specific heat, C, for an allowed

temperature rise, AT, as indicated in

AQ = mCAT = IPdt = J12Rdt. (1)

The resistance of the material for (1) is calculated from the simple resistivity expression for a

semiconductor, which is

p z---JWN, ’

(2)

4
where q is the electronic charge, p is the carrier mobility, and Nn is the dopant concentration. At

a given current, as indicated in Figure 2, significant reductions in mass can be realized through

the use of Sic due to its improved tolerance of higher temperature. The higher maximum

intrinsic temperature (900” C for Sic vs. 200” C for Si) allows for increased maximum current

density or reduced solid-state mass for a given current density. As indicated in Figure 2, Sic

operating at 500” C and 700” C results in mass reductions of approximately 45% and 60%,

respectively, compared to the conventional Si pulsed-power counterpart, which is limited to a

180” C operational temperature.

Other electric gun applications of high-temperature materials include railgun contact

materials or ETC plasma generator device components, which can also potentially provide

improved weapon performance due to reduced rail erosion in EM guns or improved surface

ablation properties for plasma generator components in ETC guns, With EM weapons systems,

it is typical to achieve high current densities in rails and armatures, and in ETC guns

high-temperature plasma sources are generated that can produce detrimental effects to electrical

conducting metallic components. In recent tests conducted on EM rail material, for example, it

has been demonstrated experimentally that a simulant aluminum (Al) armature on a Ti substrate

produced the best performance in terms of minimizing rail material deposition [7]. In addition,

ETC gun plasma sources are known to operate in the lO,OOO-20,000 K temperature region,

which can potentially lead to metal surface erosion and alterations to the low molecular weight

plasma that is sought for ETC ignition and combustion control [8,9]. It has been reported that a

significant percentage (l&23%) of the total energy contained in the typical ETC plasma source

is consumed by ablation and dissociation of polyethylene and copper components of ETC plasma

generators [ 11. In EM and ETC guns, the use of novel high-temperature materials such as

metal-sic structures can potentially lead to significant improvements to the lifetime or overall

performance of future combat systems of interest to the Army.

5
3. Experimental Procedure and Results

The experimental approach was to develop a feasibility analysis of various candidate

high-temperature materials to determine the electrical performance as a function of elevated

temperatures under burst conditions. The candidate materials were metal-sic systems that are

expected to perform reliably at elevated temperatures. A study of the literature on Sic systems

for non-pulsed-power applications indicated that Ni, Ti, Ta, and W metals on Sic perform well

with regard to specific contact resistance [lo] o Ti and Ta are chosen here as metals for Sic due

to their known high melting temperature (1,660” C and 2,990” C, respectively), demonstrated

erosion properties (with Ti), and a history of quality ohmic contacts achieved with Sic substrates

for other non-pulsed-powered applications [ 11, 12, 133.

4. Ti-SiC 1-V Results

The results of the current-voltage (I-V) characteristics, obtained as illustrated by the

simplified schematic diagram in Figure 3, of the Ti-Sic samples examined are given in

Figures 4-6. The I-V characteristics are obtained by the measurement of the current flowing

through the metalized sample as a function of the junction voltage applied across the sample. As

shown in Figure 3, the current is monitored by an ammeter (Fluke 87) as a function of applied

voltage, which is provided from a calibrated DC voltage generator (Date1 8500). Results from

I-V measurements of a Ti-Sic sample are shown in Figure 4.

The two I-V measurement curves shown are for a Ti-SiC sample “as-deposited” and after a

600” C anneal in forming gas (85% Nz9 15% Hz) for a burst of 5 min. As indicated by the

measurements, the annealed sample displays a reduced slope, which reflects an overall increase

in resistivity by about a factor of 2. The reason for the unexpected increased resistivity displayed

by the annealed sample is not clear, but may be due to the relatively low annealing temperature

used. A temperature of 600” C may not be high enough to form a desirable silicide phase at the

metal semiconductor interface, which is generally known to reduce contact resistivity and

6
Figure 3. Electrical (I-V) Characterization Arrangement for Metalized

Sic Sample Materials.

16

- 14

2v 12

3 10

8 8

1 6

E 4

r.z2

0

20 30 40 50 60 70 80 90

Junction Voltage (mV)

Figure 4. Ti-SiC Sample As-Deposited and Annealed at 600° C for 5 min.

provide a stable ohmic contact [ 141. The second reason may be the nitrogen content of the

forming gas that was used during the annealing to reduce the effects of oxygen. It is considered

unlikely but possible that a nitride phase was formed during the anneal that contributed to the

degradation in contact quality as indicated by the increase in resistivity. Steps taken to alleviate

this problem included increasing the initial anneal temperature to above 1,100” C, where Ti-Sic

phases are known to form [ 151, and using argon as the ambient gas during all high-temperature

7
20

18

a 16

g 14

40 50 60 70 80 90

Junction Voltage (mv)

Figure 5. Ti-SiC Sample as-Deposited and Annealed at 1,120’ C for 2 min.

1 -+-as deposited

+1120,2min

4300,5min

--+4-- 600,5min

+I+ 800, Smin

0 20 40 60 80 100

Forward Voltage (mV)

Figure 6. Ti-SiC Sample I-V Characteristics for As-Deposited and Annealed Samples

at 300,600,800, and 1,120’ C.

steps to remove the possibility of nitride formation on the sample surfaces. The I-V results of a

second Ti-Sic sample annealed at 1,120” C for 2 min in argon are shown in Figure 5, together

with the “as-deposited” curve. Figure 5 shows that the Ti-Sic contact resistance decreased after

annealing in argon, in contrast to the increasing resistance observed in Figure 4. It is believed

that this important change is due to the substitution of argon-forming gas, which prevented the

formation of a nitride. Further high-temperature annealing was performed on the Ti-Sic sample

having the I-V characteristics of Figure 5. Annealing was performed at 300,600, and 800” C for

a 5-min duration at each level, and an I-V measurement was performed at the completion of each

anneal to determine the effect on the resistivity. Results from the three additional anneals of the

8
Ti-Sic system, together with the I-V curves from the as-deposited and the 1,120” C initial

annealing step, are given in the plots of Figure 6.

5. Ta-SiC I-V Results

Similar high-temperature annealing experiments were conducted with Ta metalization layers

on equivalent Sic substrates used as Ti-SiC experiments. The resulting I-V curves are given in

Figures 7-9. An outstanding feature of the Ta metalization on Sic was revealed by the I-V curve

for the as-deposited sample as shown in Figure 7. It is noted that the as-deposited Ta layer

produces a rectifying (Schottky barrier) contact as opposed to the ohmic contact of Ti-Sic. The

rectifying behavior is indicated by the exponential relationship observed in the I-V measurement

of the Ta-SiC sample. However, an ohmic contact was achieved in the Ta-SiC system after an

anneal cycle of 1,120” C for 3 min as indicated by the I-V curve of Figure 8.

25

0

0 1 2 3 4 5 6

Forward Voltage 0

Figure 7. Current-Voltage Characteristic for Ta-SiC As-Deposited Sample.

Additional testing was performed with the Ta-Sic prototype sample at elevated temperatures

of 600 and 1,000” C for varying burst lengths. The I-V results of these experiments are given in

Figure 9, which indicate a stable I-V and, therefore, stable ohmic contact structure under all

temperature conditions investigated.

9
40 60

Forward Voltage (mV)

Figure 8. Current-Voltage Characteristic for Ta-SiC Sample Annealed

at 1,120” C for 3 min.

25

2 20

z

aJ 15

s

--e 1120,3min

5: 10

2

EI+600,smin

-.--A- 1000,2min

Lz& 5

0

0 20 40 60 80 100

Forward Voltage (mV)

Figure 9. Current-Voltage Characteristic for Ta-SiC Sample Annealed

at 600,1,000, and 1,120” C.

6. Conclusions

Based upon the results from the I-V measurements obtained for the Ti and Ta metalization

layers on the n-type Sic substrate employed in the experiments, it has been determined that both

metals offer a reliable and stable electrical contact to n-type 4H Sic for elevated temperature

operation. The temperature ranges considered for the Ti and Ta systems were 300-1,120” C and

600-l ,120” C, respectively, and the temperature burst duration ranged from 2 to 5 min. The

standard deviation calculated from the I-V measurements taken on the Ti-Sic system at the

high-temperature bursts gives a value of a 0.167 ohms for an average sample resistivity of

10
4.45 ohms. This value of standard deviation represents approximately 3.8% of the average value

of sample resistivity. The Ta-SiC system investigated through I-V measurements produced an

even smaller standard deviation of only 0.05 ohms for a sample having an average resistivity of

4.25 ohms, which represents approximately 1.2% of the average sample resistivity. The results

from the Ti and Ta on n-type Sic experiments are considered relevant to high-temperature

electric weapons operating in the range of 300-1,120” C. Based upon the experiments and

calculations performed, it is estimated that a mass reduction of between 45 and 60% of

solid-state electronic material could be realized using Sic compared to Si for the electric gun

applications considered here and operating at elevated temperatures for short periods of time. In

order to completely assess the feasibility of high-temperature electronic materials for

optimization of pulsed-power electric gun systems, however, it will be necessary to further

characterize the fundamental long-term behavior of candidate material systems in anticipated

environments. This will include continued long-term effects of high temperatures,

large-amplitude current densities, and high electric fields upon the specific physical (electrical

and mechanical) properties of candidate materials of interest.

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7.

8.

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10.

11.

12.

7, References

Oberle, W. F., and G. P. Wren. “An Analysis of Ballistic Parameters/Mechanisms Affecting

Efficiency in Electrothermal-Chemical (ETC) Guns.” IEEE Transitions on Magnetics,

vol. 33, no. 1, January 1997.

Fair, H. D. “Electromagnetic Launch: A Review of the U.S. National Program,” IEEE

Transitions on Magnetics, vol. 33, no. 1, January 1997.

Katulka, G. L., and J. Dyvik. “Experimental Results of Electrical Plasma Ignition in

120~mm Solid Propellant Tank Gun Firings.” Proceedings of 33rd JANNAF Combustion

Meeting, CPIA Publication 653, vol. 3, Monterey, CA, November 1996.

Neudeck, P. G. “Progress in Silicon Carbide Semiconductor Electronics Technology.”

Journal of Electronic Materials, vol. 24, no. 4, 1995.

Sze, S. Physics of Semiconductor Devices. Second ed., New York: Wiley, 1981.

Burke, T., et al. “Silicon Carbide Thyrsitors for Electric Guns.” IEEE Transitions on

Magnetics, vol. 33, no. 1, January 1997.

Bauer, D., and J. Juston. “Rapid Testing for Multishot Railgun Bore Life.” IEEE

Transitions on Magnetics, vol. 33, no. 1, January 1997.

White, K., I. Stobie, W. Oberle, G. Katulka, and S. Driesen. “Combustion Control

Requirements in High Loading Density, Solid Propellant ETC Gun Firings.” IEEE

Transitions on Magnetics, vol. 33, no. 1, January 1997.

Katulka, G., W. Oberle, G. Wren, J. Okamitsu, and N. Messina. “Pulsed Power and High

Energy Plasma Simulations for Application to Electrothermal-Chemical Guns.” IEEE

Transitions on Magnetics, vol. 33, no. 1, January 1997.

Cooper, J. “Critical Material and Processing Issues of Sic Electronic Devices.” Materials

Science and Engineering B44, 1997.

Moki, A., P. Shenoy, D. Alok, B. Baliga, K. Wongchotigul, and M. Spencer. “Low

Resistivity as-Deposited Ohmic Contacts to 3C-Sic.” Journal of Electronic Materials,

vol. 24, no. 4, 1995.

Weast, R. (ed.). CRC Handbook of Chemistry and Physics. Boca Raton, FL: CRC Press,

Inc., 1985.

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13. Palmour, J., H. Kong, and R. Davis. “Characterization ok Device Parameters in

High-Temperature Metal-Oxide-Semiconductor Field-Effect Transistors in Sic Thin Films.”

Journal of Applied Physics, vol. 64, no. 4, 14 August 1988.

14. Sze, S. VLSI Technology. Second ed., New York: McGraw-Hill, 1988.

15. McHale, A. Phase Equilibria Diagrams. Vol. X, Westerville, OH: The American Ceramic

Society, 1994.

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A DJETRICH

AMSRL WM TA

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NO. O F

COPIES ORGANIZATION

ABERDEEN PROVING GROUND (cant)

Ah!lSRLWMTD

W BRUCHEY

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ANIILER

17
INTBNTIONALLY LEFT BLANK.

18
Evaluation of Electrical Resistivity CharacterWics o

DAAA21-93-C-0101

REPORT NUMBER

Aberdeen Proving Ground, MD 21005-5066 ARL-TR-1937

9. SPONSORlNG/MONlTORlNG AGENCY NAMES(S) AND ADDRESS 10.SPONSORING/MONlTORlNG

AGENCY REPORT NUMBER

11. SUPPLEMENTARY NOTES

12a. DISTRIBUTION/AVAILABILITY STATEMENT 12b. DISTRIBUTION CODE

Approved for public release; distribution is unlimited.

13. ABSTRACT(Maximum 200 woIcIs)

The experiments described demonstrate the electrical behavior of SIC and metal ohmic-contact layers as a function of

hermal stress. It has been determined from these experiments that both titanium (Ti) and tantalum (Ta) metalization

;tructures will provide a stable electrical ohmic-contact with n-type SIC after exposure to elevated temperatures for short

~sts of time that are considered relevant for pulsed-powered electric weapon technologies. The Ti-Sic structure

nvestigated exhibited a stable current-voltage (I-V) characteristic to as much as 800” C for a 10&n burst, while Ta

netalizations provided a stable I-V characteristic on Sic even after a temperature burst of 1,000” C for as long as a

knin interval. For samples of n-type, 4H Sic, metal&d with (Ti), the standard deviation in resistance (resistivity) of

he measured samples is less than 0.17 ohms for a sample having an average resistance of 4.45 ohms. For the Ta contact

ur Sic, the standard deviation in resistance is 0.05 ohms for a sample having an average resistance of 4.25 ohms. The

:xperiments showed that for both Ti and Ta metal&d Sic samples, the change in resistivity of annealed samples is

xtween 3.8% and 1.2% compared to the average values of sample resistance based upon the I-V measurement

echnique used. These results indicate the ability of Ti-Sic and Ta-SiC structures to perform in a stable manner without

;ignificant electrical degradation to the metal contact, SIC substrate, or the metal-semiconductor interface as a function

If high-temperature burst conditions.

14. SUBJECT TERMS 15. NUMBER OF PAGES

22

Fwer conditioning, energy storage 16. PRICE CODE

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OF REPORT OF THIS PAGE OF ABSTRACT

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USN 7540-01~28C-5500 19

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Prescribed by ANSI Std. 239-l 8 298102
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