Summus, Ltd.
          434 Fayetteville Street mall - Suite 600, Raleigh, NC 27601
                    919-8077-5600 (main) 919-807-5601 (fax)



Mr. Hank Byun
Samsung Electronics of America, Inc.
105 Challenger Road
Ridgefield Park, NJ

Dear Mr. Byun:

         We are pleased to present  this  non-binding  letter of intent  ("LOI")
which  documents  the proposal and intent of Summus,  Ltd.  ("SUMMUS"),  Samsung
Electronics of America, Inc.,  ("SAMSUNG"),  and High Speed Net Solutions,  Inc.
("HSNS"),  with respect to certain business relationships as described below. As
the  parties  have  previously  discussed,  SUMMUS is engaged  in the  research,
development,  licensing and sale of its Dynamic WaveletTM based technologies and
products ("SUMMUS  Technology"),  which technology embodies substantial know-how
and other  intellectual  property  which are the sole and exclusive  property of
SUMMUS,  and which are  protected by  applicable  domestic  and foreign  patent,
trademark  and  copyright  laws.  The  parties to this  letter  envision a joint
development  agreement or similar arrangement whereby SUMMUS Technologies may be
applied  and  modified,  and  other  technologies   developed,   for  particular
applications  with respect to certain  semiconductor,  consumer  electronics and
computer  hardware  and  software  products  and systems of SAMSUNG.  HSNS shall
participate  in these  negotiations  and  discussions in its role as a marketing
partner  with  SUMMUS.  The parties to this letter  intend to conduct good faith
negotiations  to better  define the terms and  conditions  of proposed  business
projects  outlined herein,  with a goal of developing and executing a definitive
agreement (the "Agreement")  containing the specific terms and conditions.  This
letter is not intended to nor does it create any legal or binding obligations on
any of the parties hereto except as expressly herein.

         Our  understanding  of the proposed  project(s) and arrangements are as
follows:

         1. Apply SUMMUS Dynamic  WaveletTM  technology to SAMSUNG  products The
parties shall enter into a joint development agreement and related agreements to
integrate  and  optimize  SUMMUS  Dynamic  WaveletTM   technology  on  SAMSUNG's
strategic  digital signal processor ("DSP") platform for sale as a semiconductor
component.   The  parties  envision  that  SUMMUS  will  grant  a  nonexclusive,
royalty-bearing  license  to  SAMSUNG  for the use of  such  technology  in such
applications.  Such royalty  shall be based upon the sale of the DSP chip set by
SAMSUNG  containing  SUMMUS  technology.  Such  work  will  include  payment  of
nonrecurring  engineering  fees from SAMSUNG to SUMMUS in an amount to be agreed
upon.

         2. This  proposal  is subject to the  preparation  and  execution  of a
mutually  satisfactory  definitive agreement (the "Agreement"),  containing such
terms and conditions regarding  licensing,  ownership of inventions and payments
as the  parties  shall  agree  upon.  This  proposal  is further  subject to the
completion of a technical due diligence investigation by SUMMUS and SAMSUNG with
respect to each such party's  technology  and to fulfill the  obligations of the
Agreement.
<PAGE>

         Upon  acceptance by you of this letter,  we shall commence the drafting
of a definitive  agreement for your review and comment. The parties will use the
their best  efforts to complete  negotiations  and execute the  Agreement  on or
before April 15, 2000.

         3.  SAMSUNG  and  SUMMUS  agree to provide  each other with  reasonable
access to each other's personnel,  documents and technology to enable each party
to ascertain the feasibility of the above proposed Agreement. SAMSUNG and SUMMUS
mutually  agree  that each may  become  aware of  information  of the other of a
confidential  nature  concerning  the  technologies  and  business of such party
during the course of the  technical  due  diligence  investigation.  SAMSUNG and
SUMMUS  specifically  agree  that any  such  information  will be used  only for
purposes of effecting the  transactions  contemplated  by this letter and for no
other purpose.  No rights or licenses to any party's  intellectual  property are
granted or conveyed to any person in any respect by virtue of this letter or the
negotiations  contemplated  hereby.  All parties to this letter  agree that each
party will hold any  information  regarding the other in strict  confidence  and
will not  disclose  it  except to  persons  participating  in this  transaction,
including the parties'  attorneys and accountants or other advisors,  until such
time as such  information  is no longer  confidential  other than by reason of a
violation of this paragraph or the Confidentiality  Agreement executed March 15,
1999,  by and between  SAMSUNG and SUMMUS.  SAMSUNG and SUMMUS  acknowledge  and
confirm the  Confidentiality  Agreement,  and further acknowledge and agree that
the  requirements of this paragraph 3 shall not diminish or limit any provisions
of such Confidentiality Agreement.

         4. Each of  the  parties  shall pay its own expenses in connection with
 the negotiation and execution of the Agreement.

         5. SAMSUNG and SUMMUS will make this relationship  public at a mutually
agreeable time that will be communicated  in writing,  but no later than 30 days
after the signing of the definitive agreement.

         6. SAMSUNG and  SUMMUS  acknowledge  that HSNS has served as  marketing
agent in  assisting  to develop the proposed  business  venture  between the two
companies.

         7. SUMMUS hereby acknowledges that it has entered into a Master License
Agreement  ("MLA")  with HSNS  dated  February  14,  2000 and that the terms and
conditions of the Agreement shall not violate HSNS's rights under the MLA.

         8. As a pre-condition  to the execution of the Agreement,  SUMMUS shall
obtain an opinion  from HSNS  counsel  that the term of the  Agreement  does not
violate  the right so HSNS  under the terms of the MLA and shall  also  obtain a
waiver  from HSNS in which HSNS  agrees not to  enforce  against  Samsung or its
successors,  assigns,  licensees or  sublicenses  any rights of HSNS that may be
infringed by the exercise of rights under the Agreement.

         If the foregoing is acceptable, SAMSUNG and HSNS should sign and date a
copy of this letter and return it to us. This letter is intended to evidence the
preliminary   understandings   that  we  have  reached  regarding  the  proposed
transactions  and our mutual intent to negotiate in good faith to enter into the
Agreement. This letter does not obligate the parties to enter into any agreement
or  engage  in  any  business  transactions  or  endeavors,  including,  without
limitation, those outlined herein. The parties hereto acknowledge and agree that
execution of the Agreement shall be subject to appraisal of upper management and
legal counsel of the parties. However, by acceptance of this letter, the parties
hereto each agree to be bound by paragraphs 6 and 7 and 8.


                                           Sincerely,


                                           /s/ W. Bradford Silvernail
                                           W. Bradford Silvernail
                                           Chief Executive Officer, Summus, Ltd.


SAMSUNG                                     HSNS

By: /s/ Hank Byun                           By: /s/ Andrew Fox
    -----------------------                     --------------

Date:      2/5/00                           Date:     2/15/00
      ---------------------                       -----------


cc:      M. G. Boyd                 M.H. Baik
         Dr. B. Jawerth             K. Park