April 2013

NASA/TM–2013-217986

Flight Avionics Hardware Roadmap

Avionics Steering Committee
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April 2013

NASA/TM–2013-217986

Flight Avionics Hardware Roadmap

Avionics Steering Committee
Available from:

NASA Center for AeroSpace Information

7115 Standard Drive

Hanover, MD 21076-1320

443-757-5802
1	

Preface

All	 roadmaps	 represent	 a	 snapshot	 in	 time	 and	 are	 expected	 to	 evolve	 over	 time.	 This	

roadmap	used	the	best	available	information	from	multiple	sources	to	build	a	strategy	for	

NASA’s	Avionics	Steering	Committee	(ASC)	which	represents	through	its	line	management	

representatives	 the	 agency’s	 avionics	 workforce	 chartered	 out	 of	 the	 Office	 of	 Chief	

Engineer	 (OCE).	 It	 is	 understood	 that	 Centers,	 Directorates,	 Divisions,	 Offices,	 and	 other	

organizations	may	be	independently	engaging	in	roadmapping	efforts	with	overlap	to	this	

ASC	 effort.	 Whenever	 possible	 we	 have	 attempted	 to	 draw	 from	 these	 other	 efforts	 in	

building	 this	 roadmap.	The	ASC	 recognizes	 the	 value	 of	 roadmapping	at	many	levels	and	

views	these	activities	as	synergistic.		

The	approach	 taken	by	 the	roadmapping	 team	was	 to	 focus	on	 “the	80‐percent	solution,”	

i.e.,	 to	identify	 technologies	 for	NASA	 use	 that	would	meet	 on	the	 order	 of	 80‐percent	 of	

defined	NASA	needs,	specifically	avoiding	high‐cost	technologies	with	limited	utility	to	the	

broader	NASA	mission	 set.	 The	 team	 also	 focused	 on	 developing	 a	 document	 that	 would	

inform,	 but	 not	 proscribe,	 future	 NASA	 technology	 development	 investments	 such	 as	

common	 avionics,	 high‐performance	 space	 computing,	 or	 next	 generation	 spacecraft	

interconnect	initiatives.		
2	

Core Team Members

 Dr.	Robert	Hodson,	LaRC,	Avionics	Technology	Roadmap	Study	Lead

 Mary	McCabe,	JSC,	Human	Interface	Technology	Lead	

 Paul	Paulick,	KSC,	Instrumentation	Technology	Lead	

 Tim	Ruffner,	GRC,	CD&H	Technology	Lead	

 Rafi	Some,	JPL,	Foundational	Technology	Co‐Lead	

 Dr.	Yuan	Chen,	LARC,	Foundational	Technology	Co‐Lead	

 Sharada	Vitalpur,	JSC,	Communications	and	Tracking	Technology	Lead	

 Mark	Hughes,	SSC	

 Kuok	Ling,	ARC	

 Matt	Redifer,	DFRC	

 Shawn	Wallace,	MSFC	

Acknowledgements

Special	 thanks	 to	 the	 many	 others	 that	 supported	 this	 roadmapping	 effort:	 Jacque	

Myrann/JSC,	 Andy	 Romero/JSC,	 Vic	 Studer/JSC,	 Stephen	 Horan/LaRC,	 William	

Hopkins/MSFC,	 Polly	 Estabrook/JPL,	 Vanessa	 Kuroda/ARC,	 David	 Buchanan/GRC,	 Dr.	

Fernando	 Figueroa/SSC,	 William	 Witherow/MSFC,	 Angela	 Shields/MSFC,	 Dr.	 James	

Currie/MSFC,	 Peter	 Johnson/KSC,	 Aaron	 Sherman/KSC,	 Dr.	 Joe	 Zhou/LaRC,	 Neil	

Coffey/LaRC,	Nick	Trombetta/LaRC.	

	 	
3	

Contents

Preface	...........................................................................................................................................................................	1

Core	Team	Members	...............................................................................................................................................	2

Acknowledgements	.................................................................................................................................................	2

Contents	........................................................................................................................................................................	3

List	of	Figures	.............................................................................................................................................................	5

Introduction	................................................................................................................................................................	6

NASA	Missions	...........................................................................................................................................................	7

Foundational	Technology	..................................................................................................................................	10

Processor	Technology	and	Radiation‐Hardening	by	Design	(RHBD)	Library	........................	10

Radiation‐Hardened	(RH)	Extreme	Temperature	Technology	.....................................................	11

Electronic	Packaging	Technology	..............................................................................................................	12

RHBD	Network	Technology	..........................................................................................................................	13

RH	Memory	Technology	.................................................................................................................................	14

RH	Reconfigurable	Field‐Programmable	Gate	Arrays	(FPGAs)	for	Computing	Technology

	...................................................................................................................................................................................	15

Nano‐electronic	Technology	........................................................................................................................	16

Command	and	Data	Handling	(C&DH)	Technology	................................................................................	17

Processing	............................................................................................................................................................	17

Network	Devices	and	Interconnect	Hardware	.....................................................................................	19

RHBD	Memory	Cards/Subsystems	............................................................................................................	19

Spaceflight	Instrumentation	.............................................................................................................................	20

Sensors	..................................................................................................................................................................	20

Sensor/Instrumentation	Systems	..............................................................................................................	21

Communications	and	Tracking	........................................................................................................................	23

Networking	Communications	(Internetworking	Communications)	..........................................	23

Optical	Communications	for	Deep	Space	................................................................................................	23

Miniature	reconfigurable	communications	for	Beyond	Earth	Orbit	EVA	applications	......	24

Space‐Based	Radios	Using	Ultra	Wide	Band	or	Other	Formats	....................................................	24

Low	 Power,	 High	 Rate	 RF	 to	 Support	 High‐rate	 Communications	 from	 NEN	 and	 Deep	

Space	Network	(DSN)	(Bridge	Gap	to	Optical)	.....................................................................................	25

Low	Voltage/Low	Power	Transceiver	Module	Energy	Harvesting	Technology	...................	25
4	

Spectrum	analysis	tool	for	Low	Earth	Orbit	(LEO),	DSN,	etc.	........................................................	25

C&T	Revolutionary	Concepts	.......................................................................................................................	26

Human	Interface	Technology	...........................................................................................................................	27

Auditory	Interface	Technologies	................................................................................................................	27

Tactile	Interface	Technologies	....................................................................................................................	28

Visual	Interface	Technologies	......................................................................................................................	29

Multi‐Sense	Interface	Technologies	..........................................................................................................	31

Acronyms	..................................................................................................................................................................	33
5	

List of Figures

Figure	1.	Example	technology	flow	from	foundational	technologies	through	NASA	missions.

	..........................................................................................................................................................................................	6

Figure	2.	Potential	future	NASA	missions	and	capabilities	(vehicles,	stages,	habitats,	etc).	...	7	

Figure	3.	Foundational	Technology	timeline.	............................................................................................	10	

Figure	4.	Command	and	Data	Handling	Technology	timeline.	..........................................................	17	

Figure	5.	Spaceflight	Instrumentation	Technology	timeline.	.............................................................	20	

Figure	6.	Communications	and	Tracking	Technology	timeline.	........................................................	23	

Figure	7.	Human	Interface	Technology	timeline.	....................................................................................	27	

	 	
6	

Introduction

As	 part	 of	 NASA’s	 Avionics	 Steering	 Committee’s	 stated	 goal	 “to	 advance	 the	 avionics	

discipline	 ahead	 of	 program	 and	 project	 needs,”	 the	 committee	 initiated	 a	 multi‐Center	

technology	 roadmapping	 activity	 to	 create	 a	 comprehensive	 avionics	 roadmap.	 	 The	

roadmap	is	intended	to	strategically	guide	avionics	technology	development	to	effectively	

meet	 future	 NASA	 missions’	 needs.	 The	 scope	 of	 the	 roadmap	 aligns	 with	 the	 twelve	

avionics	 elements	 defined	 in	 the	 ASC	 charter,	 but	 is	 subdivided	 into	 the	 following	 five	

areas:	

 Foundational	Technology	(including	devices	and	components)	

 Command	and	Data	Handling	

 Spaceflight	Instrumentation	

 Communication	and	Tracking	

 Human	Interfaces		

This	 effort	 addressed	 only	 flight	 avionics	 hardware	 and	 did	 not	 consider	 ground‐based	

electronics,	flight	software,	or	ground	software.	The	decision	to	focus	on	flight	avionics	was	

driven	by	the	following	considerations:	

1. General	purpose	ground‐based	electronics	 such	as	are	used	 to	 support	general	

design,	test,	and	simulation	activities	will	utilize	state‐of‐the‐art	commercial‐off‐

the‐shelf	products	and	 there	is	no		reason	 for	NASA	 to	 track	or	invest	in	it	as	a	

technology	area.	

2. Ground	 computing	 that	 will	 benefit	 from	 utilization	 of	 the	 same

electronic/avionics	equipment	that	is	used	 for	 flight	systems,	e.g.,	hardware‐in‐

the‐loop	 testbeds,	should	be	using	 the	 flight	avionics	chosen	 for	 the	mission	or	

mission	 set	 that	 they	 are	 supporting,	 and	 thus	 will	 be	 driven	 by	 the	 flight	

avionics	that	are	the	subject	of	this	roadmap.	

Foundational	technology	comprises	low‐level	fabrication	and	materials	technologies	(such	

as	 Complementary	Metal‐Oxide	Semiconductor	 [CMOS]	 processes),	 devices	 built	 on	 these	

technologies	 (such	 as	 transistors),	 and	 components	 built	 up	 from	 these	 devices	 (such	 as	

processors	and	memory	chips).	Command	and	Data	Handling,	Spaceflight	Instrumentation,	

Communication	 and	 Tracking,	 and	 Human	 Interfaces	 are	 avionics	 subsystem‐level	

technology	areas	that	are	enabled	by	and	built	from	foundational	technology	components.		

Avionics	 systems	are	 considered	 to	 be	mature	enough	 for	 project	infusion	at	Technology	

Readiness	Level	 (TRL)	6.	Projects	can	 then	utilize	 these	systems	 to	build	capabilities	 that	

enable	or	enhance	NASA	missions.	See	the	example	technology	flow	below.	
7	

Foundational

Technology

time in years

C&DH

Instrumentation

Missions &

Capabilities

5 10 15 20

F1 F2 F3 F4

CDH1

I1

Device

&Components

Systems &

Subsystems

inTechnology

Categories

Missions,

Vehicles&

Stages

Figure 1. Example technology flow from foundational technologies through NASA missions

The	 subsystem	 categories	 (Command	 and	 Data	 Handling,	 Spaceflight	 Instrumentation,	

Communication	 and	 Tracking,	 and	Human	 Interfaces)	 were	 those	 areas	identified	 by	 the	

ASC	charter	as	comprising	“avionics.”	The	roadmapping	team	analyzed	each	of	the	14	Office	

of	the	Chief	Technologist	(OCT)	Technology	Roadmaps	to	identify	technology	needs	in	each	

of	these	areas	to	support	future	NASA	projects	and	mapped	them	into	these	subcategories.	

The	 roadmap	looks	 out	 over	 a	 20‐year	 period.	 The	 near	 term	 tends	 to	 focus	 on	 evolving	

technologies	 while	 longer‐term	 technologies	 tend	 to	 be	 more	 revolutionary	 than	

evolutionary.	This	long‐term	view	allows	for	a	balanced	push‐pull	technology	portfolio	and	

development	strategy	with	broad	TRL	diversity.	A	long‐term	technology	view	also	requires	

that	 the	 roadmap	 be	 revisited	 periodically	 as	 new	 and	 unforeseen	 breakthroughs	 occur,	

NASA’s	missions	change,	and	funding	profiles	affect	technology	timelines.		

NASA Missions

time in years

Potential

Missions &

Capabilities

MARS SAMPLE RETURN MARS SAMPLE RETURN

COM. CREW SLS TF MPCV LUNAR SURFACE EL. LUNAR ASCENT STAGE

ROBOTIC MISSIONS (MARS) SLS DSH IN‐SPACE PROP.

ROBOTIC MISSIONS (MOON) CRYO PROP

ROBOTIC MISSIONS (NEA) LUNAR DESCENT STAGE

SEV

2011 2020 2030

Figure	2.	Potential	future	NASA	missions	and	capabilities	(vehicles,	stages,	habitats,	etc).	
8	

A	new	class	of	future	NASA	missions	is	the	primary	driver	of	avionics	technology.	As	NASA	

missions	move	farther	from	Earth	and	become	increasingly	more	complex,	new	challenges	

arise.	In	support	of	new	exploration	and	science	destinations,	NASA	has	adopted	a	flexible	

capabilities‐based	approach.	This	allows	certain	vehicles,	habitats,	satellites,	and	stages	to	

be	 designed	 and	 built	 without	 a	 specific	 destination	 being	 selected.	 Current	 Design	

Reference	 Missions	 (DRMs)	 and	 roadmaps	 focus	 on	 Near	 Earth	 Asteroids	 (NEA),	 Earth’s	

Moon,	Mars,	and	primitive	bodies	within	 the	solar	system	as	well	as	operations	in	unique	

orbits	 such	 as	 the	 L1	 and	 L2	 Lagrange	 Points.	 From	 an	 avionics	 perspective	 these	 new	

capabilities	 and	 missions	 will	 present	 unique	 challenges.	 Key	 avionics	 drivers	 will	 be	

reliability	 and	 autonomy.	 Long‐duration	 crewed	 missions	 as	 well	 as	 space‐based	

observatories	 and	 solar	 system	 tours	 will	 require	 sophisticated	 reliability	 and	 fault	

tolerance.	 The	 current	 exploration	 DRMs	 call	 for	 348	 to	 399	 days	 of	 reliable	 operation,	

while	robotic	science	missions	specify	many	years	of	unattended	operation.	Furthermore,	

the	 communication	 delays	 and	 challenging	 orbital	 dynamics	 of	NEA	 and	 extreme	 science	

missions	 require	 increased	 autonomy	 and	 on‐board	 decision	 infrastructure.	 Traditional	

solutions	to	reliability	and	autonomy	increase	processing	demands	and	redundancy	which	

in	turn	drives	system	mass	and	power.		Advanced	technologies	and	approaches	are	needed	

to	support	these	challenging	missions.	

NASA’s	short‐term	strategy	is	to	continue	robotic	exploration	of	the	Moon,	Mars,	and	NEAs.	

The	 Lunar	 Atmosphere	 and	Dust	 Environment	 Explorer	is	 scheduled	 for	launch	in	 2013,	

Mars	 Science	 Laboratory	 launched	 this	 year,	 Mars	 Atmosphere	 and	 Volatile	 Evolution	

mission	is	targeting	a	2013	launch,	the	Exobiology	on	Mars	mission	has	a	2016	launch,	and	

the	 Origins‐Spectral	 Interpretation‐Resource	 Identification‐Security‐Regolith	 Explorer,	

mission	is	planning	to	launch	an	asteroid	sample	and	return	mission	in	2016.		

While	 robotic	 exploration	 continues,	NASA	will	 develop	 capabilities	in	 support	 of	 human	

exploration	 to	 destinations	 such	 as	 the	 Moon,	 a	 NEA,	 and	 eventually	 Mars.	 The	 NASA	

Human	 Architecture	 Team	 has	 identified	 nine	 transportation	 elements:	 Solar	 Electrics	

Propulsion,	 Chemical	 Propulsion	 Stage,	 Deep	 Space	 Habitat,	 Space	 Exploration	 Vehicle,	

Lunar	Orbit	Rendezvous	Lander,	Cargo	Carrier,	Space	Launch	System	(SLS),	Multi‐Purpose	

Crew	 Vehicle	 (MPCV),	 and	 Nuclear	 Thermal	 Propulsion.	 The	 first	two	 elements,	 SLS	 and	

MPCV,	are	planned	for	2020,	with	test	flights	as	early	as	2017.	Other	elements	depicted	in	

later	 years	 on	 the	 roadmap	 build	 capability	 for	 more	 sophisticated	 and	 challenging	

missions.		Extremely	challenging	robotic	missions	(i.e.,	Mars	Sample	Return)	are	also	being	

considered.		

These	missions,	characterized	by	long	duration,	vast	distances,	harsh	environments,	and	in	

some	cases	the	human	element,	require	new	avionics	technologies	to	be	developed	to	meet	

mission	requirements	for	exploration	and	safely	bring	crews	back	to	Earth.		

In	 the	 following	 sections,	 we	 identify	 the	 key	 technologies	 needed	 to	 support	 these	

missions	and	the	time	frames	in	which	they	are	needed,	or	are	expected	to	be	available.		
9	

Many	of	these	technologies	are	anticipated	to	be	developed	by	industry	or	other	agencies	

e.g.,	Department	 of	Defense,	Department	 of	Energy,	and	need	 only	 be	monitored	 to	 track	

their	progress	and	determine	when	they	can	be	adopted	for	insertion	into	NASA	missions.	

A	minority	of	the	technologies	discussed	below	will	require	NASA	investment	to	mature	in	

a	way	that	will	be	of	use	to	NASA.		
10	

Foundational Technology		

Figure 3. Foundational Technology timeline.

Processor Technology and Radiation‐Hardening by Design (RHBD) Library

F1:		45‐Nanometer	(nm)	commercial	multi‐core	processor		

F2:		32‐nm	commercial	multi‐core	processor		

F3:		RHBD	bulk	CMOS	Library	for	digital	Application‐Specific	Integrated	Circuits	(ASICs)	by	

QML	IBM	90‐nm	CMOS	line		

F4:		RHBD	Silicon‐On‐Insulator	(SOI)	Library	digital	ASICs	by	QML	IBM	45‐nm	SOI	line		

F5:		90‐nm	bulk	CMOS	or	45‐nm	SOI	RHBD	multi‐core	processor		

A	Boeing‐developed	RHBD	90‐nm	bulk	CMOS	standard	cell	library	was	originally	funded	by	

the	Defense	Threat	Reduction	Agency	(DTRA)	and	the	Defense	Advanced	Research	Projects	

Agency	 (DARPA)	 and	 is	 currently	 in	 the	 process	 of	 being	 commercialized	 by	 several	

companies.	 The	 library	 provides	 the	 capability	 to	 relatively	 inexpensively	 develop	

radiation‐hardened	 digital	 ASICs.	 A	 QML‐certified	 line	 is	 expected	 to	 be	 implemented	 at	

IBM	with	expected	QML	certification	in	2014.		It	is	expected	that	DTRA	will	initiate	a	follow	

on	45‐nm	RBHD	program	with	the	IBM	SOI	CMOS	process	with	a	target	completion	date	of	

2014.	Similar	efforts	are	ongoing	at	other	companies.	NASA	does	not	need	to	invest	in	this	

semiconductor	 technology,	 though	 additional	 funding	 could	 be	 used	 to	 accelerate	 the	

development	schedule	and	to	influence	the	types	of	cells	to	be	developed,	the	testing	to	be	

performed,	 and	 the	 selection	 and	 fidelity	 of	 the	 development	 vehicles	 to	 be	

designed/validated.	However,	NASA	can	use	this	standard	cell	library	and	associated	tools	

to	 develop	 ASICs	 and	 standard	 products	 at	 greatly	 reduced	 costs,	 compared	 to	 current	

approaches.	

Digital	ASICs,	with	possible	extension	in	some	environments	to	mixed‐signal	ASICs,	based	

on	 SOI	 RHBD	 have	 the	 potential	 to	 operate	 beyond	 the	 military	 standard	 temperature	

range	 of	 ‐55°C	 to	 125°C,	 as	 well	 as	 providing	 radiation	 hardness.	 CMOS	 and	 SOI	 are	

demonstrated	 to	 generally	 work	 well	 at	 low	 temperatures	 with	 faster	 speed	 and	 lower	

leakage	 current,	 but	 work	 is	 required	 to	 determine	 operational	 characteristics	 over	 the	
11	

wider	 temperature	 range	 and	 to	 develop	 design	 rules,	 tools,	 and	 possibly	 circuit	 library	

modifications	 to	enable	wider	 temperature	operation.	This	will	 require	NASA	investment	

as	 only	NASA	will	 utilize	 these	 capabilities,	 but	it	leverages	the	DTRA/DARPA	 sponsored	

RHBD	standard	cell	library	and	associated	tool	set.		

A	 general	 purpose	 multi‐core	 processor	 and	 a	 Single	 Instruction	 Multiple	 Data	 (SIMD)	

multicore	 processor	 utilizing	 90‐nm	 RHBD	 have	 been	 developed	 or	 are	 in	 development,	

and	could	be	ready	 for	mission	insertion	within	a	relatively	short	 time.	These	processors	

are	derived	 from	commercial	processors	and	similar	 to	 the	commercial	 two‐	 to	 four‐core	

machines	currently	in	use.	The	Maestro	processor	contains	49	general	purpose	processor	

cores,	 four	 high	 speed	 Double	 Data	 Rate	 (DDR)	 2	 memory	 ports,	 four	 10	 Gigabits	 Per	

Second	 (Gb/s)	XAUI	 Input/Output	 (I/O)	ports	as	well	as	Gigabit	Ethernet	and	GPIO	ports	

and	is	similar	to	a	cluster	computer	architecture	on	a	single	chip.	While	this	processor	has	

been	 incorporated	 into	 several	 board‐level	 products	 for	 evaluation	 and	 software	

development,	 it	 is	 not	 applicable,	 in	 general,	 to	 NASA	 missions	 due	 to	 a	 lack	 of	 power	

management	and	fault	tolerance	capabilities.	A	second‐generation	machine	in	either	90‐nm	

RHBD,	 or	 in	 45‐nm	 SOI	 CMOS	 RHBD,	 based	 on	 the	 Maestro	 architecture	 and	 compatible	

with	 the	Maestro	 software	 suite,	 would	 support	 a	 broad	 range	 of	NASA	missions	 and	 be	

relatively	 easily	 inserted	 into	 future	 missions.	 Depending	 on	 technology	 selection	 and	

levels	of	power	management	and	fault	tolerance	included,	it	could	be	available	at	TRL6	in	

the	2013‐15	time	frame.	Such	a	machine	would	be	greatly	enhancing,	if	not	be	enabling,	for	

Mars	Sample	Return,	Asteroid/Comet	Sample	Return,	NEA,	and	human	and	human‐robotic	

precursor	missions.	

Radiation‐Hardened (RH) Extreme Temperature Technology

F6:		0.5‐Micrometer	(	μm)	Silicon‐Germanium	(SiGe)	RHanalog	ASICs		

F7:		130‐nm/180‐nm	SiGe	RH	analog	ASICs		

F8:		0.5‐μm	SiGe	RH	wide	temperature	analog	interface	and	analog/digital	conversion	

component		

F9:		130‐nm	SiGe	RH	wide	temperature	analog	interface	and	analog/digital	conversion	

component		

F10:		RH	wide	temperature	SiGe	switching	point	of	load	converter	in	0.5‐μm		

F11:		RH	wide	temperature	SiGe	switching	point	of	load	converter	in	130‐nm		

F12:		Silicon	carbide	(SiC)	mixed	signal	electronics	for	high	temperature	application	

F13:		Gallium	nitride	(GaN)	radio	frequency	electronics	for	high	temperature	applications	

F14:		Structured	RH	wide	temperature	ASICs	

SOI	and	SiGe	have	been	demonstrated	as	the	digital	and	analog	 technologies	of	choice	 for	

radiation‐hardened	 extreme	 environment	 electronic	 application	 in	 a	 wide	 temperature	
12	

range	 beyond	 the	 military	 standard	 of	 ‐55°C	 to	 125°C.	 SOI	 and	 SiGe	 for	 extreme	

temperature	 radiation‐hardened	 analog	 ASICs	 exhibiting	 radiation	 hardness	 to	 300	

kilorads	 (krad)	 and	 capable	 of	 operation	 over	 a	 temperature	 range	 of	 at	 least	 ‐140°C	 to	

125°C	have	been	demonstrated.	Analog	ASICs	in	0.35‐μm	SOI	and	0.5‐μm	SiGe	have	either	

been	developed	or	are	being	developed	for	motor	control	systems	capable	of	operating	for	

long	 lifetimes	 in	 the	 Mars	 environment	 (‐135°C	 to	 85°C).	 Currently,	 the	 0.5‐μm	 SiGe	

technology	needs	additional	investment	to	complete	circuit	library	and	tools	development.	

A	 next‐generation	 SOI	 and	 SiGe	 extreme	 temperature	 RH	 technology	 would	 provide	

additional	 capability,	 reduced	 power,	 and	 long‐term	 availability	 of	 the	 technology.	

Recommended	 target	 date	 for	 completion	 of	 a	 0.5‐μm	 SiGe	 circuit	 library	 and	 calibrated	

tool	 set	is	2013	 to	 support	 future	missions,	including	Mars	2018	and	projected	primitive	

body	 science	 missions.	 A	 recommended	 target	 date	 for	 completion	 of	 180/130‐nm	

technology	is	 2016	 to	 support	a	 broad	 range	 of	 future	missions	including	ExtraVehicular	

Activity	(EVA),	primitive	bodies,	and	future	Mars	missions.	

SiC	 and	 GaN	 have	 been	 demonstrated	 as	 potential	 technologies	 for	RH	 high	 temperature	

applications	beyond	300°C.	There	have	been	many	process	and	reliability	improvements	as	

well	as	design	enhancements	in	these	technologies	during	the	past	years	that	position	them	

as	 the	 most	 promising	 candidates	 for	 high	 temperature	 applications	 for	 NASA	 missions,	

especially	an	in	situ	mission	to	Venus.	

RH	structured	ASICs	are	becoming	available	today.	These	components	can	survive	extreme	

environments,	provide	quick	turn	around,	and	be	procured	at	relatively	low	cost	for	digital	

and	mixed‐signal	ASICs	(they	may	not	be	as	radiation	hardened	or	as	extreme	temperature	

capable	as	SOI	or	SiGe	RHBD	ASICs,	but	they	are	significantly	lower	cost,	faster	turnaround,	

and	 suitable	 for	 a	 broad	 range	 of	 missions).	 Need	 date	 is	 2014	 to	 support	 all	 future	

missions.	With	additional	investment	by	NASA,	development	of	additional	configurations	of	

structured	 ASICs,	 as	 well	 as	 additional	 extreme	 temperature	 characterization	 of	 these	

devices	can	be	provided	by	the	companies	currently	developing	these	components.	

Electronic Packaging Technology

F15:		Advanced	electronic	packaging	qualification	

F16:		Through	Silicon	Via	(TSV)	chip	stack	technology	for	space	qualification	and	

applications			

There	are	several	advanced	packaging	technologies	that	would	improve	mass,	volume,	and	

power	 of	 spacecraft	 avionics.	 Candidate	 technologies	 include:	 stacked	

chips/packages/modules,	 high	 density	 interconnect,	 and	 chip‐on‐board	 technologies.	

Guidelines	 and	 design	 rules	 for	 use	 in	 space	 environments,	 as	 well	 as	 qualification	

requirements	and	procedures,	need	to	be	developed	for	a	minimal	but	optimum	subset	of	

available	 commercial	 packaging	 technologies.	 Once	 this	 is	 done,	 qualification	 of	 this	

optimal	 subset	 can	 proceed.	 This	 is	 not	 a	 traditional	 technology	 investment,	 but	 an	
13	

adaptation	 and	 qualification	 of	 existing	 commercial/military	 technologies,	 and	 should	 be	

coordinated	 with	 programs	 such	 as	 the	 NASA	 Electronic	 Parts	 and	 Packaging	 Program.	

Recommended	 target	date	is	2014	 to	support	Mars	2018,	Europa,	and	 future	science	and	

exploration	missions,	all	of	which	will	benefit	from	the	volume	and	mass	reduction	of	these	

advanced	packaging	technologies.	

TSV	chip	stacks	allow	direct	stacking	of	silicon	chips	with	metalized	vias	placed	anywhere	

throughout	 the	 chip.	 	 This	 basic	technology,	 developed	 by	 the	Massachusetts	 Institute	 of	

Technology	 (MIT)	 Lincoln	 Laboratory,	 is	 currently	 available	 from	 several	 commercial	

vendors.	It	provides	the	ability	to	develop	a	series	of	stackable	integrated	circuits	that	can	

be	mixed	and	matched	as	necessary	to	provide	required	capability.	The	advantage	here	is	

that	 due	 to	 extremely	 short	 distances	 and	 low	 capacitance	 of	 interconnect,	 the	 stack	

essentially	operates	as	a	single	chip	with	all	 the	power	and	speed	advantages	inherent	in	

monolithic	 systems.	 Additionally,	 due	 to	 elimination	 of	 single	 chip	 packaging	 and	

interconnect,	 volume	 and	 mass	 are	 reduced	 and	 reliability	 increased.	 The	 technology	 is	

being	developed	for	commercial	use,	but	NASA	use	requires	extension	of	the	technology	to	

extreme	 temperatures	 and	 across	 multiple	 semiconductor	 processes,	 e.g.,	 SOI	 CMOS	 and	

SiGe.	 	 Recommended	 target	 date	 is	 2018	 to	 support	 future	 missions	 including	 EVA	 and	

small/micro‐satellites	for	all	exploration	and	science	missions.	

RHBD Network Technology

F17:		90‐nm	CMOS	RHBD	network	interface	and	switch	components		

F18:		45‐nm	SOI	RHBD	network	interface	and	switch	components		

F19:		RH	fiber	optic	transceivers	for	>3‐Gb/s	data	process	and	transmit		

Future	 NASA	 space	 missions	 will	 require	 extremely	 high	 bandwidth	 spacecraft	

interconnect	 systems.	 The	 venerable	 1	 Megabit	 Per	 Second	 (Mb/s)	 1553	 is	 being	

superseded	 by	 250‐Mb/s	 SpaceWire	 and,	 in	 the	 Human	 Exploration	 and	 Operations	

Mission	 Directorate	 (HEOMD),	 by	 the	 upcoming	 1‐Gb/s	 Time‐Triggered	 Gigabit	 Ethernet	

(TTGbE)	 standard.	 Next	 generation	 missions,	 however,	 with	 multi‐gigabit	 instruments,	

onboard	 science,	 and	 autonomy	 processing,	 will	 require	 multi‐gigabit	 interconnect	

bandwidth	as	well	as	real‐time	determinism,	fault	tolerance,	power/bandwidth	scalability,	

and	 seamless	 interoperability	 between	 copper,	 fiber	 optic,	 and	 wireless	 physical	 (phy)	

media	layers.	Host	data	transmission	modes	including	broadcast/multicast/point‐to‐point,	

and	synchronous/asynchronous	will	also	be	required.	Several	standards	for	space	systems	

are	likely	to	emerge,	including	time‐triggered	10‐gigabit	ethernet,	a	space	version	of	Serial	

Rapid	 I/O,	 and	 Space	 Fiber.	 The	 Next	 Generation	 Spacecraft	 Interconnect	 System	

committee	is	 developing	 one	 such	 standard	 with	 participation	 from	 NASA,	 the	 Air	 Force	

Research	 Laboratory,	 Space	 and	 Missile	 Command,	 the	 National	 Reconnaissance	 Office	

(NRO),	 the	 Naval	 Research	 Laboratory,	 the	 American	 Institute	 of	 Aeronautics	 and	

Astronautics,	 VITA,	 Lockheed	 Martin	 Airospace	 Corp.,	 Boeing	 Corp.,	 British	 Aviation	
14	

Electronics,	 Honeywell	 Corp.,	 and	 others.	 Network	 interfaces,	 routers,	 switches,	 and	

endpoints	 supporting	 these	 protocols,	 as	 well	 as	 Serializer/Dererializers	 and	 phy‐layer	

transceivers	will	be	forthcoming	from	space	avionics	and	component	vendors,	most	likely	

implemented	 in	 90‐nm	 and	 below	 RHBD	 technologies.	 There	is	 a	 concern	 that,	 as	in	 the	

past,	offerings	from	multiple	vendors	will	not	be	interoperable.	The	NGSIS	is	attempting	to	

ensure	 interoperability	 by	 virtue	 of	 a	 tight	 specification	 and	 validation	 criteria	 that	

guarantee	 interoperability,	 but	 NASA	 will	 need	 to	 invest	 resources	 to	 ensure	 that	 these	

standards	meet	unique	NASA	requirements	as	well	as	to	ensure	both	interoperability	and	

ease	of	use	of	component	offerings.		

Copper	interconnect	at	these	speeds	is	relatively	well	understood,	but	difficult	to	achieve	in	

radiation	hardened	and	extreme	 temperature	capable	versions	with	 the	desired	isolation,	

fault	 tolerance,	 and	 power	 management	 features	 that	 are	 available	 in	 fiber	 optic.	 Fiber	

optic	 implementations,	 however,	 do	 not	 provide	 extreme	 radiation	 and	 temperature	

tolerance,	while	 copper	wire	implementations	are	 not	well	 suited	 to	longer	 transmission	

distances	and	do	not	offer	good	isolation	at	high	frequency.		

Radiation	hardened	fiber	optic	phy‐layer	technology	is	progressing	to	the	point	where	it	is	

a	viable	alternative	to	copper	in	many	spacecraft	systems.	Radiation	tolerance	of	100	krad	

has	been	achieved	with	data	rates	of	>3	Gb/S	over	hundreds	of	meters	in	extremely	small	

packages	with	easy	assembly,	and	good	tolerance	of	temperature,	vibration,	and	shock.	In	

addition	to	reducing	power	and	providing	electromagnetic	interference‐free	operation	and	

electrical	isolation,	 this	phy‐layer	medium	can	provide	 transparent	and	seamless	chip‐to‐

chip,	 board‐to‐board,	 and	 box‐to‐box	interconnect.	 NASA	investment	is	 required	 to	 meet	

NASA’s	 unique	 requirements	 (radiation,	 shock,	 vibration,	 temperature,	 long	 life,	 high	

reliability).	The	recommended	target		date	is	2014	to	support	future	high	data	rate	science	

instruments	and	exploration	missions.	

Wireless	interconnect	phy‐layer	is	not	being	addressed.	Wireless	interconnect	offers	a	host	

of	 advantages	in	NASA	missions,	eliminating	 the	mass,	 power,	 and	 unreliability	 of	 cables	

and	 connectors,	 providing	 ease	 of	 integration	 and	 test,	 and	 allowing	 simpler	

reconfiguration,	sparing,	fault	tolerance,	and	retrofitting	of	systems.	NASA	support	will	be	

required	 to	 develop	 a	 wireless	 standard	 compatible	 with	 the	 advanced	 protocol(s)	

currently	under	development	and	interoperable	with	wire	and	fiber	optic	based	systems.	

RH Memory Technology

F20:		High	density	RH	memory	components	in	Static	RAM	(SRAM)	and	Dynamic	RAM	

technologies	

F21:		20‐nm	Silicon‐Oxide‐Nitride‐Oxide	Silicon	(SONOS)	and	Phase‐Change	RAM	(PCRAM)	

flash	memory		

F22:		130‐nm	Ferroelectric	RAM	(FeRAM)	flash	memory	

F23:		65‐nm	Magnetoresistive	RAM	(MRAM)	flash	memory		
15	

F24:		Resistive	memory		

Currently,	radiation	hardened	CMOS	SRAM,	SONOS	and	PCRAM	are	available	as	volatile	and	

non‐volatile	memory	options	up	to	16‐Mb	per	die.	One‐time‐programmable	Programmable	

Read‐Only	 Memories	 and	 Metal‐Nitride‐Oxide‐Silicon	 electrically	 Erasable	 PROMs	 have	

been	used	in	space	applications	since	the	1990s.	Today,	RH	high‐density	memories	utilizing	

more	advanced	memory	 technologies	are	needed	 for	 space	 systems	to	 provide	improved	

power	 utilization	 at	 orders	 of	 magnitude	 increase	 in	 density	 (which	 translates	 to	 mass,	

volume,	and	complexity	reduction).	While	RHBD	can	be	applied	to	achieve	RH	non‐volatile	

memory	 cells	 at	 the	 cost	 of	 additional	 power	 and	 density,	 other	 non‐volatile	 memory	

technologies,	such	as	PCRAM,	MRAM,	FeRAM	and	Resistive	RAM,	provide	improved	density	

and	power	utilization	with	improved	radiation	tolerance.	These	memory	cell	technologies	

will,	 however,	 still	 require	 RH	 CMOS	 control	 logic,	 which	 can	 be	 provided	 by	 RHBD	

technologies	 with	 minimal	 impact	 to	 overall	 component	 power	 or	 density.	 These	

alternative	 memory	 cell	 technologies	 are	 at	 relatively	 low	 TRL	 levels	 and	 will	 require	

investment	 to	 mature	 them	 into	 reliable,	 manufacturable	 technologies	 and	 to	 then	 use	

these	 memory	 technologies	 to	 develop	 memory	 components	 and	 embeddable	 macros	

suitable	for	use	in	NASA	missions.			

RH Reconfigurable Field‐Programmable Gate Arrays (FPGAs) for Computing

Technology

F25:		RH	FPGAs	for	reconfigurable	computing			

F26:		RH	reconfigurable	compute‐element	chips	for	reconfigurable	computing		

Radiation‐hardened	and	extreme	 temperature‐capable	FGPAs	 for	use	in	avionics	systems,	

both	 as	 single	 function	 implementation	 vehicles	 and	 as	 core	 elements	 in	 reconfigurable	

computing	are	required	to	meet	the	processing	throughput,	flexibility,	fault	tolerance,	and	

power‐to‐performance	levels	desired	for	future	NASA	spacecraft.	These	components	can	be	

developed	by	utilizing		RHBD	libraries	and	processes	from	several	sources.		

Radiation‐hardened	devices,	fault‐tolerant	architectures,	reusable	cores,	development	tools	

and	 practices,	 and	 validation	 and	 integration	 standards	 are	 needed	 for	 reconfigurable	

computing	for	space	system	applications.	These	deficiencies	translate	to	technology	gaps	in	

the	 reconfigurable	 computing	 development	 path	 from	 the	 FPGA‐based	 reconfigurable	

machines	 of	 today	 to	 more	 general	 morphware‐based	 machines	 of	 tomorrow.	 In	

overcoming	 these	 gaps,	 technology	 developments	 in	 fault	 tolerance,	 system‐on‐chip	

architectures,	 design‐time	 tools	 and	 reconfigurable	 hardware	 run‐time	 systems,	 and	 re‐

usability	via	integration	standards	and	system	modularity	are	required.		

In	 addition	 to	 standard	 FPGA	 architectures,	 higher	level	 reconfigurable	 architectures	 are	

highly	 desirable	 as	 they	 provide	 the	 ability	 to	 work	 at	 higher	 levels	 of	 integration	 at	

reduced	power	 for	a	given	level	of	performance.	 Instead	of	working	at	 the	virtual	gate	or	

look‐up	 table	 level,	 these	 devices	 work	 at	 the	 compute‐element	 level,	 allowing	 higher	
16	

power	efficiency	and	simplified	design.	As	with	FPGAs,	they	need	to	be	implemented	in	90‐

nm	and	below	RHBD	technologies.		

Nano‐electronic Technology

F27:		Carbon	nanowire‐based	transistors	and	electronics	

F28:		Carbon	nanotube‐based	transistors	and	electronics		

F29:		Graphene‐based	Terahertz	(THz)	transistor	technology		

F30:		Graphene‐based	high‐speed	circuits	and	electronics		

Nano‐technology	 including	 carbon	 nanowire,	 carbon	 nanotube,	 and	 graphene‐based	

technologies	 are	 promising	 candidates	 to	 sustain	 the	 relentless	 progress	 in	 scaling	 for	

CMOS	devices.	With	nanowire	and	nanotube	 field‐effect	transistors	and	devices	as	well	as	

graphene‐based	 300GHz	 transistors	 having	 been	 demonstrated,	 the	 nanotechnology	

roadmap	 projects	 THz	 transistor	 technology	 by	 2020,	 and	 graphene‐based	 high‐speed	

circuits	 and	 electronics	 by	 2028.	 	Nanowire,	 nanotube	 and/or	 graphene‐based	ASICS	 are	

projected	 to	 replace	 silicon‐based	 electronics	 in	 future	 electronic	 systems	 and	 can	 be	

applied	in	most	applications,	such	as	digital,	photonics,	analog,	and	mixed‐signal.		

Fundamentally,	these	nano‐technologies	offer	higher	levels	of	integration	and	lower	power	

through	smaller	transistors	and	higher	electron	mobility	than	is	achievable	in	silicon‐based	

technologies.	They	also	offer	inherent	radiation	hardness	and	robustness	to	environmental	

stresses.	Graphene	is	a	mono‐layer	of	carbon	in	a	“chickenwire”	configuration.	It	offers	high	

electron	 mobility	 and	 radiation	 hardness	 at	 extremely	 small	 feature	 size	 and	 thus	 low	

power.	 Transistor	 equivalent	 structures	 have	 been	 built	 using	 stacked	 (mono)	 layers	 of	

graphene	 and	 separating	 dielectrics,	 but	 deposition	 and	 patterning	 methods	 suitable	 for	

large‐scale	manufacturing	have	not	 yet	been	developed.	Carbone	nanotube	and	nanowire	

technologies	promise	extremely	high	conductivity	wiring	both	on‐chip	and	off,	but	suitable	

manufacturing	 technologies	 have	 not	 yet	 been	 developed.	 Investment	 by	 NASA	 will	 be	

required	 to	 tailor	 these	 technologies	 and	 devices	 to	 NASA’s	 unique	 requirements,	 but	 as	

these	technologies	are	not	yet	at	TRL3,	it	is	not	clear	what	investments	will	be	required	to	

meet	NASA	needs.		
17	

Command and Data Handling (C&DH) Technology

C&DH

time in years

2011 2020 2030

CDH1

CDH2

CDH3

CDH4

CDH5

CDH6

CDH7

CDH8

CDH10 CDH9

CDH12

CDH11

CDH13

Figure 4. Command and Data Handling Technology timeline.

C&DH	refers	 to	 the	board‐	and	subsystem‐level	integrated	components	using	devices	and	

foundational	 technologies.		NASA’s	 future	endeavors	will	often	require	integrated	devices	

and	systems	which	are	RHBD	and	capable	of	performing	with	the	lowest	mass	and	power	

profiles	 that	 can	 be	 achieved.	 	 However,	 it	 is	 also	 expected	 that	 some	 commercial	 non‐

radiation	 hardened,	 higher	 performance	 capabilities	 should	 also	 be	 leveraged	 to	 meet	

performance,	 fault	 tolerance	 and	 recovery,	 power	 management,	 or	 other	 unique	

requirements.	It	is	expected	that	these	systems	will	have	some	inherent	radiation	tolerance	

but	not	to	the	level	of	RHBD	devices	and	systems.	

Processing

CDH1:		Single	Board	Computer	(SBC)	–	90‐nm	RHBD	multicore	processor	

CDH2:		SBC	–	45‐nm	RHBD	multicore	processor	

High	 performance	 multicore	 computing	 in	 the	 commercial	 sector	 provides	 orders	 of	

magnitude	 increase	 in	 processing	 throughput	 as	 compared	 to	 independent	 chips	 with	

several	processors	on	a	board.	NASA	should	leverage	the	work	that	the	NRO	has	invested	

through	Boeing	to	develop	a	RHBD	multicore	processor	called	Maestro	49,	based	upon	the	

Tilera	 Tile64	 processor,	 itself	 an	 outgrowth	 of	 the	 Raw	 processor	 developed	 by	 MIT	 for	

DARPAs	 Polymorphic	 Computing	 Program.	 	 In	 addition	 to	 the	 processor	 itself,	 NRO	

developed	 a	 complete	 software	 suite	 as	 well	 as	 software	 development	 tools	 and	 system.		

Final	test	and	debug	of	the	Maestro	system	as	well	as	radiation	 testing	is	currently	under	

way.	However,	specific	shortfalls	of	the	Maestro	design	include:	insufficient	fault	tolerance,	

non‐deterministic	 programming	 model,	 high	 power	 consumption	 and	 thermal	 load,	 poor	

power	and	energy	management	and	scalability,	and	severely	suboptimal	I/O	and	memory	

interfaces.	 	NASA	 can	leverage	 all	 of	 this	 previous	work	 by	 developing	 a	 next	 generation	

Maestro‐type	machine	by	adding	 fault	 tolerance,	power	management,	and	other	requisite	

features.			

CDH3:		SBC	–	45‐nm	non‐RHBD	multicore	processor	

CDH4:		SBC	–	32‐nm	non‐RHBD	multicore	processor		

Non‐RHDB	 CMOS	 and	 SOI	 technology	 advances	 (90‐nm	 down	 to	 32‐nm)	 should	 be	

leveraged	to	the	greatest	extent	possible	to	provide	low‐cost,	high‐performance	options	for	
18	

non‐critical,	 specialized	 applications.	 Both	 general‐purpose	 processing	 as	 well	 as	

specialized	computing	architecture	trends	should	be	leveraged.	

CDH5:		Low	power,	extreme	environment	45‐nm	System	On	Chip	(SOC)	

With	 the	advent	of	90‐nm,	45‐nm,	and	eventually	32‐nm	commercial	and	RHBD	ASICS,	as	

well	 as	 radiation‐hardened,	 structured	 ASICS	 now	 becoming	 available,	 it	 is	 feasible	 to	

develop	 extremely	 low	 mass/volume/power,	 highly	 capable	 avionics	 as	 a	 SOC	 for	 small	

spacecraft.	Such	a	device	would,	ideally,	be	built	 from	a	set	of	standardized	modular,	plug	

and	 play	 IP	 modules	 that	 could	 be	 relatively	 easily	 ported	 and	 validated	 in	 a	 modular,	

piece‐wise	fashion	to	next	generation	semiconductor	processes.	

CDH7:		RHDB	reconfigurable	computer	architecture		

Reconfigurable	 (or	 hybrid)	 computing	 architectures	 take	 advantage	 of	 the	 flexibility	 of	

software	in	combination	with	 the	high	performance	of	hardware	by	processing	with	very	

flexible	high‐speed	computing	fabrics	like	FPGAs.		This	enables	the	loading	of	a	new	circuit	

on	 the	 reconfigurable	 fabric	 of	 the	 FPGA	 during	 runtime.	 	 It	 is	 expected	 that	 NASA’s	

missions	 will	 require	 ever‐increasing	 autonomy	 to	 make	 real‐time	 and	 non‐real‐time	

decisions.		In	addition,	the	flexibility	afforded	by	reconfigurable	systems	will	result	in	lower	

mass‐to‐orbit	to	perform	a	wider	range	of	functions	for	any	particular	mission.	

CDH10:		Three‐Dimensional	(3‐D),	highly‐integrated	computer	system	

Three‐dimensional	 integration	 uses	 multiple	 vertical	 layers	 of	 transistors	 to	 improve	

performance	instead	of	the	single	layer	of	transistors	that	most	modern	integrated	circuits	

use	today.		3‐D	integrated	circuits	can	be	built	using	wafer‐on‐wafer,	die‐on‐wafer,	or	die‐

on‐die	 methodologies	 to	 potentially	 offer	 vast	 improvements	 in	 cost,	 bandwidth,	 power,	

and	 volume	 using	 TSV	 technology.	 	 TSV	 allows	 semiconductor	 die	 and	 wafers	 to	

interconnect	 to	each	other	at	higher	levels	of	density.		A	3‐D,	highly‐integrated	computer	

system	 with	 processing,	 interface,	 and	 memory	 resources	 based	 upon	 TSV	 technology	

might	be	possible	in	the	2025	–	2030	timeframe.	

CDH11:		Ultra‐low	power	radiation‐hardened,	graphene‐based	computer	

Graphene	is	basically	a	layer	of	carbon	 that	is	only	one	atom	 thick	with	extremely	strong	

physical	properties	and	highly	conductive	of	electricity.	Electrons	can	 fly	across	graphene	

at	blazing	speeds.	The	 future	potential	of	 this	material	is	immense	and	it	is	expected	 that	

graphene	 will	 eventually	 change	 the	 entire	 landscape	 of	 computing	 infrastructure	 as	 a	

replacement	 for	 silicon.	 	 A	 radiation‐hardened,	 low‐power	 computer	 based	 upon	 this	

technology	would	be	enabling	for	future	NASA	missions.

CDH13:		Digital	signal	processing	

In	 addition	 to	 multicore	 Multiple	 Instruction	 stream	 Multiple	 Data	 stream	 (MIMD)	

processors,	 NASA	 can	 leverage	 other	 technologies	 being	 developed	 for	 the	 signal	

processing	community.	These	include	SIMD	and	Very	Long	Instruction	Word	architectures	
19	

with	 high	 memory	 bandwidth	 and	 multiple	 processing	 units	 for	 image	 processing	 and	

other	highly	parallelizable	applications.		

Network Devices and Interconnect Hardware

CDH8:		90‐nm	and	45‐nm	RHBD	card‐level	network	interface	controllers	and	network	

switches	

CDH9:		High	performance	(10‐Gb/s+),	low	power,	scalable	interconnect	

CDH11:		Gigabit‐rate	network	router	

Network	interface	controller,	switch,	and	router	technology	maturation	is	needed.	Network	

switch	 technologies	 are	 needed	 to	 support	 fault	 tolerant	 networking	 in	 building	 highly	

reliable	 systems	 and	 to	 meet	 data	 transfer	 demands	 for	 future	 missions.	 Coupling	 time‐

triggered	switch	technologies	and	other	commercial	network	technologies	with	radiation‐

hardened/radiation‐tolerant	 processes	 will	 produce	 next	 generation	 high‐speed	 low‐

power	networking	architectures,	including	components	such	as	gigabit	network	routers.		

RHBD Memory Cards/Subsystems

CDH6:		Volatile	mass	memory	cards/subsytems	

CHD12:		Non‐volatile	mass	memory	cards/subsystems	

Commercial	memory	cards	have	poor	radiation	characteristics,	while	traditional	radiation	

hardened	memory	devices	are	low	density	and	relatively	slow.	Radiation‐hardened,	high‐

density,	high‐speed	memory	devices	(volatile	and	non‐volatile)	are	needed	in	combination	

with	 advanced	 processors	 and	 instruments	 to	 survive	 the	 expected	 environments	 that	

NASA	will	encounter	and	to	provide	the	required	performance.		Radiation	hardened,	multi‐

gigabit	 DDR2	 and	 DDR3	 SDRAMs	 are	 feasible	 and	 necessary	 to	 build	 these	 systems.	 	 In	

addition	 to	 cards	 and	 modules,	 file‐based	 recorders	 are	 needed	 for	 data	 storage	 and	

retrieval	in	data‐centric	architectures	required	for	autonomous	systems.		
20	

Spaceflight Instrumentation		

Instrumentation

time in years

2011 2020 2030

I7 I12 I3 I13

I2 I4 I8

I10 I5 I14

I11 I6

I9

I1

Figure 5. Spaceflight Instrumentation Technology timeline.

Spaceflight	 instrumentation	 refers	 to	 the	 sensors	 and	 systems	 used	 to	 measure	

environments	or	behaviors	of	spaceflight	systems,	subsystems,	or	components.		A	sensor	is	

generally	 a	 single	 device	 used	 for	 making	 measurements,	 or	 a	 highly	 miniature	 set	 of	

components	able	to	make	‘smart’	measurements.		A	‘smart’	measurement	results	from	the	

basic	 sensor	 reading	 being	 manipulated	 (e.g.,	 adjusting	 the	 reading	 based	 upon	 a	

calibration	curve	or	taking	multiple	measurements	and	synthesizing	them	into	a	single	data	

point).

An	 instrumentation	 system	 is	 composed	 of	 multiple	 distributed	 elements,	 modules,	 or	

components	that	function	together	to	process	sensor	measurements.	

Sensors

I1:		Miniaturized	space‐qualified	pressure	sensors	for	wide	temperature	range	

measurements	

SOI	 MicroElectroMechanical	 Systems(MEMS)	 pressure	 sensors	 are	 highly	 radiation	

tolerant	 and	 can	 measure	 real‐time	 pressure	 at	 high	 temperatures	 and	 in	 harsh	

environments.	 Transducers	 can	 be	 packaged	 for	 a	 wide	 range	 of	 temperature	 (‐250F	 to	

+350F).	

I2:		Diamond	MEMS	pressure	sensor	

Current	 approaches	 to	 hydrazine	measurements	 require	isolation	of	 the	 pressure	 sensor	

from	the	hydrazine	environment,	reducing	accuracy	of	the	measurement	and	producing	a	

potential	 failure	 point.	 	 These	 failure	 points	 are	 realized	 regularly	 on	 longer	 duration	

missions	and	often	require	additional	sensors	be	flown	as	a	back‐up.		The	proposed	sensor	

eliminates	 these	 systems	 providing	 simpler	 measurement	 approaches,	 improved	

measurement	accuracy	leading	 to	reduced	margin	requirements,	and	eliminates	 the	need	

for	redundant	sensors	on	longer	duration	missions.		

I3:		Optical	fluid	sensing	for	high	vibration	and	shock	environments	

Designs	using	optical	sensors	based	upon	laser	excitation	and	interferometric	 techniques	

to	determine	fluid	depth	in	flow,	or	 fluid	amount	when	dominated	by	surface	tension	and	

viscosity	 forces,	 rather	 than	gravity,	 should	 be	 developed.	Applications	include	 cryogenic	

storage	tanks	and	the	flow	of	reactive	cooling	fluids.				
21	

I4:		Multi‐channel	cryogenic	pressure	sensor	for	high	vibration	and	shock	environments		

Designs	using	miniature	piezo‐resistive	silicon	pressure	sensors	to	measure	cryogenic	fluid	

pressure	 accurately	 to	 within	 0.25‐percent	 full	 scale	 should	 be	 developed.	 Applications	

include	 rocket	 engines,	 cryogenic	 wind‐tunnels,	 industrial	 cooling,	 and	 cryogenic	 gas	

production.			

I5:		Molecular	detection/trace	gas	detection	sensors	

Development	 of	 intelligent,	 autonomous,	 distributed	 sensors	 (wired	 and	 wireless)	 for	

highly	sensitive	gas	detection	is	desired.	The	sensors	are	based	on	nanostructures	that	can	

potentially	respond	to	a	single	molecule.	

I6:		Development	of	cryogenic	video	cameras		

Developments	in	sensing	of	cryopropellants	in	microgravity	and	under	impulse	are	needed	

for	 in‐space	 propulsion	 systems	 for	 characterization	 of	 liquid	 level,	 slosh,	 and	 flow.			

Currently,	video	imaging	is	done	through	conventional	cameras	looking	through	windows	

which	can	present	 fracture	problems.	Alternative	approaches	 to	immerse	 the	imager	into	

the	 fluids	 present	 problems	 of	 both	 thermal	 control	 and	 assurance	 that	 the	 imager	

hardware	does	not	contaminate	the	fluids.		

Sensor/Instrumentation Systems

I7:		Radio	Frequency	(RF)	Identification	(RFID)/Surface	Acoustic	Wave	(SAW)	wireless	

instrumentation	system	

Technology	 based	 on	 SAW	 development	at	 the	 device	level	and	with	 the	interrogator	RF	

system	 should	 be	 developed.	 A	 SAW‐based	 instrumentation	 system	 helps	 to	 reduce	

instrumentation	design	complexity	and	avionics	mass	while	reducing	power	requirements	

through	passive	sensing.					

I8:		Spacecraft	Integrated	System	Health	Management	(ISHM)/Integrated	Vehicle	Health	

Management	(IVHM)	

Development	 of	 reliable,	 believable	 (i.e.,	 no	 false‐positives)	 sensing	 devices	 to	enable	 the	

ISHM/IVHM	 type	 of	implementations	is	 needed. ISHM	 systems	include:	 sensors,	anomaly	

detection,	 diagnosis,	 prognostics,	 user	 interfaces	 to	 provide	 integrated	 awareness	 of	

system	condition,	and	new	systems	engineering	processes	enabled	by	intelligent	elements	

that	are	part	of	the	ISHM	knowledge	architecture.						

I9:		Distributed/reconfigurable	sensor	modules	in	spacecraft		

Developments	 in	 reconfigurable	 distributed	 avionics	 architecture	 can	 be	 based	 upon	 a	

small	 number	 of	 multi‐purpose	 modules	 that	 can	 be	 individually	 changed	 to	 drive	 and	

sense	a	variety	of	mechanical	and	electrical	components,	characterized	generally	as	either	a	

multi‐purpose	 electronic	 drive	 module	 or	 a	 multi‐functional	 signal‐conditioning	 module.		

The	 generic	 drive	 module	 can	 be	 configured	 to	 drive	 and	 control	 a	 variety	 of	 spacecraft	
22	

avionics	components:		valves,	motors,	solenoids,	pin	pullers,	thermostats,	and	heaters.			A	

generic	 sensor	module	will	 be	able	 to	 sense	and	 record	data	 from	a	 variety	 of	spacecraft	

avionics	sensors:		thermocouples,	resistive	temperature	devices,	potentiometers,	encoders,	

tachometers,	accelerometers,	gyroscopes,	and	level	and	pressure	sensors.			

I10:		Smallsat	attitude	determination/control	instruments	

Development	 of	 inexpensive	 attitude	 determination/control	 instruments	 for	 small	

satellites	(e.g.,	nanosat	or	cubesat)	is	desired.	These	instruments	must	be	designed	to	use	

low	power	and	small	volume	and	provide	high	precision	to	increase	pointing	accuracy.	

I11:		Autonomous	landing	instrumentation	

Development	of	precision	landing	and	hazard	avoidance	instrumentation	 for	autonomous	

landings	 is	 needed	 including	 instruments	 and	 associated	 processing	 systems	 for	 high‐

precision	 vehicle	 velocity	 vector	 determination,	 and	 altitude	 and	 attitude	 determination.	

Examples	include	Doppler	lidar	velocimeters,	flash	lidar,	and	radar	mapping	systems.		

I12:		Docking	and	close	proximity	operations	instrumentation	

Instruments	and	associated	processing	 systems	 that	enable	 safe	 real‐time	navigation	and	

maneuvering	in	close	proximity	to	small	bodies,	e.g.,	comets	and	asteroids	as	well	as	small	

moons	 and	 other	 primitive,	 low	 mass	 (low	 gravity)	 objects	 are	 desired.	 Used	 for	

autonomous	 robotic,	 teleoperated	 robotic,	 and	 crewed	 missions,	 these	 instruments	 are	

enabling	 for	 future	 solar	 system	 exploration	 and	 science	 missions.	 Examples	 include	

Doppler	lidar	velocimeters,	flash	lidar,	and	radar	mapping	systems.			

I13:		Portable	photo‐acoustic	system	for	planetary	exploration	

Photo‐acoustic	 systems	 are	 designed	 to	 detect	 specific	 molecular	 species	 with	 high	

sensitivity	 (up	 to	 parts	 per	 trillion),	 using	 an	 array	 of	 microphones	 and	 array	 of	

infrared/ultraviolet	 light‐emitting	 diodes	 to	 determine	 exact	 location	 and	 quantity	 of	

gaseous	species	of	interest.	

I14:		Autonomous	lab	on	a	chip		

Development	 of	 miniature	 autonomous	 instrument	 sensors	 using	 ‘smart’	 materials	 (i.e.,	

materials	 with	 properties	 that	 can	 change	 in	 a	 controlled	 fashion	 by	 external	 stimuli)	 is	

desired.	 These	 instrument	 sensors	 have	 built‐in	 capabilities	 to	 support	 sampling,	 sensor	

cleaning,	and	waste	rejection	schemes.	
23	

Communications and Tracking

C&T

time in years

2011 2020 2030

CT1 CT2

CT4

CT3

CT5

CT6 CT7 CT8

CT9

CT10

CT11

CT12

CT13 CT14

CT15 CT19 CT20 CT21 CT22

CT16

CT17

CT18

Figure 6. Communications and Tracking Technology timeline.

Networking Communications (Internetworking Communications)

CT1:		Delay	Tolerant	Networking	(DTN)	technology	maturation	and	validation	using	multi‐

center,	International	Partner	and	potentially	International	Space	Station	(ISS).	

CT2:		Communications	Security	(COMSEC)/mission	assurance	technologies	for	networked	

space	communications	

CT3:		Mesh	networking	protocols	–	ad‐hoc	protocols		(includes		EVA	applications	for	in‐

space	and	surface	communications)	

CT4:		Surface	wireless	networks	

CT5:		Navigation/location	aware	networking	

Current	 space	 communication	 scenarios,	 for	 the	 most	 part,	 have	 involved	 fundamental	

point‐to‐point	 links	 between	 a	 spacecraft	 and	 Earth.	 Today’s	 specialized	 link‐layer	

protocols	and	carefully	planned	and	scheduled	link	operations	have	thus	far	been	adequate	

to	 meet	 the	 needs	 of	 missions.	 	 However,	 with	 a	 more	 networked	 communications	

architecture	 that	 is	 envisioned	 for	 deep	 space	 exploration	 and	 planetary	 surface	

operations,	 existing	 protocols	 and	 methodologies	 will	 need	 to	 evolve.	 	 Internetworking	

protocols	 that	 handle	 long	 link	 propagation	 delays	 and	 outages,	 and	 support	 surface	

wireless	 and	 proximity,	 quality	 of	 service,	 network	 management	 and	 information	

assurance,	 ad‐hoc	 networking,	 etc.,	 are	 critical	 in	 providing	 reliable,	 end‐to‐end	

communications.		The	above	 foundational	 technologies	provide	 the	necessary	 framework	

for	networked	communications	for	deep	space	exploration.	

Optical Communications for Deep Space

CT6:		OCT	optical	communications	demonstration		

CT7:		Deep	Space	(DS)	optical	terminal	

CT8:		DS	optical	ground	stations	
24	

NASA	 is	 currently	 migrating	 to	 Ka‐band	 for	 high‐rate	 communications.	 	 However,	 it	 is	

anticipated	that	the	demand	for	higher	data	rates	will	exceed	the	capacity	available	in	the	

Ka‐band	 spectrum	 given	 the	 mass	 and	 power	 constraints.	 	 At	 this	 stage,	 optical	

communications	 provide	 access	 to	 unregulated	 spectrum	 and	will	 support	 the	 data	 rates	

needed	by	 the	next	generation	instruments,	sensors,	etc.		Main	challenges	 for	deep	space	

are	 the	 atmospheric	 issues	 and	 accurate	 acquisition	 and	 tracking	 of	 the	 target.	 These	

advances	will	be	made	with	OCT	TDM	and	other	developmental	test	objectives.		

Miniature reconfigurable communications for Beyond Earth Orbit EVA

applications

CT1:	DTN	

CT3:	Mesh	networking	protocols	–	ad‐hoc	protocols		(includes		EVA	applications	for	in‐

space	and	surface	communications)	

CT5:	Surface	wireless	networks		

CT9:	Methods	for	proximity	tracking	or	localization	in	a	Global	Positioning	System	(GPS)‐

deprived	environment	

Methods	 for	 proximity	 tracking	 or	 localization	 are	 required	 for	 both	 robotic	 and	 human	

surface‐	 and	 space‐based	 operations.	 	 In	 some	 cases,	 proximity	 tracking	 is	 required	 to	

supplement	global	 tracking	by	providing	greater	accuracy	 relative	 to	local	landmarks.		 In	

other	 cases,	 proximity	 tracking	 is	 required	 during	 outages	 or	 gaps	 in	 a	 global	 tracking	

service.	 	 Examples	 include	 a	 robotic	 element	 or	 rover	 finding	 its	 way	 back	 to	 a	 base	 or	

intra‐habitat	navigation	by	a	free‐flyer	within	ISS	or	a	deep	space	habitat.	

Space‐Based Radios Using Ultra Wide Band or Other Formats		

CT1:		DTN	

CT2:		COMSEC	

CT3:		Mesh	networking	protocols	–	ad‐hoc	protocols		(includes		EVA	applications	for	in‐

space	and	surface	communications)	

CT4:		Surface	wireless	networks	

CT9:		Methods	for	proximity	tracking	or	localization	in	a	GPS‐deprived	environment		

A	 next	 generation,	 miniature,	 reconfigurable	 radio	 is	 called	 for	 to	 support	 the	 mass,	

volume,	 and	 power	 constraints	 of	 deep	 space	 exploration	 suits	 (2018‐2020).	 It	 should	

incorporate	DTN,	mesh	networking,	surface	wireless	networks,	navigation/location	aware	

networking,	 wearable	 antenna,	 etc.,	 to	 provide	 a	 system	 capable	 of	 supporting	 in‐space	

EVA	as	well	as	surface	EVA/robotic	missions.	
25	

Low Power, High Rate RF to Support High‐rate Communications from NEN and

Deep Space Network (DSN) (Bridge Gap to Optical)

CT10:		Low	power/mass	transceivers	for	higher	carrier	frequencies	such	as		X‐band,	Ka‐

band	

To	bridge	 the	gap	 to	optical	communications	 from	deep	space	as	well	as	 to	provide	high‐

rate	communications	between	exploration	vehicles	(space–to‐space	or	space‐to‐surface),	a	

low‐power,	high‐rate	Ka‐band	system	with	higher	order	modulation,	coding,	etc.	reducing	

the	mass	and	power		required	is	needed.			Mass	and	power	reductions	come	with	coding,	

miniaturization,	advanced	semiconductor	technology,	etc.	

Low Voltage/Low Power Transceiver Module Energy Harvesting Technology

CT11:		Development	of	space‐qualified	low	power	V‐band	transceivers	for	vehicle/satellite	

internal	environments	

CT12:		RF	energy	harvesting	technologies	to	drive	V‐band	transceivers	

CT14:		Chip	antennas	for	integration	with	transmitter	or	transceiver	electronics	

V‐band	could	be	beneficial	for	space‐to‐space	(vacuum	environment)	at	very	high	data	rate	

links.	 Either	 vehicle	 to	 vehicle,	 or	 long	 haul.	 	 Hardware	 technology	 would	 include	 space	

qualified	antennas,	transceivers,	and	power	amplifiers.	V‐band	could	also	be	used	internal	

to	the	space	vehicle	for	sensor	data	transfer/high	data	rate	devices	such	as	High	Definition	

(HD)	video,	displays,	laptops,	and	biomedical	hardware.	

Sensors	with	integrated	transmitters	such	as	a	thermocouple	with	transmitter	all	run	off	of	

parasitic	energy	sources.		V‐band	could	be	used	internal	to	the	space	vehicle	for	sensor	data	

transfer/high	 data	 rate	 devices	 such	 as	 HD	 video,	 displays,	 laptops	 and	 biomedical	

hardware.	

Spectrum analysis tool for Low Earth Orbit (LEO), DSN, etc.

CT15:		Unified	trajectory	and	link	analysis	tool	for	LEO		

CT16:		Augmentation	for	deep	space	

CT17:		Augmentation	for	planetary	surfaces	

A	spectrum	analysis	tool	is	needed	that	will	assist	designers	in	predicting	communications	

performance	 for	 LEO	 and	 deep	 space	 applications	 that	 is	 aimed	 at	 providing	 analysis	

support	as	well	as	assistance	in	preparing	data	for	spectrum	applications.		This	tool	could	

be	 seen	 as	 a	 product	 that	 calls	 a	 commercial	 product	 such	 as	 Satellite	 Tool	 Kit	 for	

underlying	 computations	 for	 orbits	 and	 access.	 	 It	 would	 also	 provide	 supplementary	

computations	 needed	 for	 the	 analysis,	 such	 as	 DSN	 interference	 estimates,	 ITU	 surface	

power	constraint	estimates,	etc.	
26	

C&T Revolutionary Concepts

CT19:		Quantum	keying	

CT20:		Superconducting	Quantum	Interference	Filter	(SQIF)	

CT21:		X‐ray	communications	

CT22:		Quantum	communications	

From	OCT	 –	 TA05:	 	 Advancement	 of	 X‐ray	 navigation	 using	 X‐ray	 emitting	 pulsars	 could	

provide	the	ability	to	autonomously	determine	position	anywhere	in	the	solar	system	just	

as	 GPS	 does	 for	 Earth	 inhabitants.	 	 Successful	 development	 of	 SQIF	 technology	 would	

change	 the	paradigm	 for	RF	communication	 to	detecting	 the	magnetic	 field	instead	of	 the	

electric	field	and	provide	magnitudes	of	improvement	in	our	communication	systems.	
27	

Human Interface Technology

Human Interface

time in years

2020 2030

H1

H2

H4 H3

H5

H6

H7

H8

H9

H10

H11

H12

H13

2011

H14

H15

H16

H17 H18 H19

Figure 7. Human Interface Technology timeline.

Computer‐Human	Interface	is	an	interdisciplinary	field	which	is	focused	on	the	interaction	

between	 human	 users	 and	 computer	 systems	 including	 the	 user	 interface	 and	 the	

underlying	 processes	 which	 produce	 the	 interactions.	 	 From	 the	 human	 perspective,	

interaction	with	the	world	around	us	is	achieved	through	our	five	senses:	hearing	(auditory	

interfaces),	 touch	 (tactile	interfaces),	 sight	 (visual	interfaces),	 smell	 (olfactory	interfaces)	

and	taste	(gustation	interfaces).		Olfactory	and	gustation	interfaces	have	not	been	included	

in	this	roadmap	because	they	are	extremely	immature	technologies	and	it	is	unclear	which	

discipline	area	will	implement	these	types	of	interfaces	(electrical,	chemical,	etc).	

Auditory Interface Technologies

H1:		Miniaturized	space‐qualified	microphones	

H2:		Miniaturized	space‐qualified	speakers	

Several	 technologies	 are	 under	 development	 which	 will	 miniaturize	 microphones	 and	

speakers	and	allow	applications	in	new	contexts.		For	example,	development	of	distributed	

planar	array	microphones,	coupled	with	MEMS	technology,	will	 facilitate	ubiquitous	voice	

communications	without	use	of	crew‐worn	or	hand‐held	microphones.		Also,	customization	

of	 commercial	 bone	 conduction	 technology	 for	 use	with	 traditional	 dynamic	 and	 electret	

microphones	will	improve	voice	communications	and	speech	recognition.		As	for	speakers,	

implementation	of	edge	vibrated	and	distributed	mode	technology	will	produce	low	mass,	

low	power,	and	space	efficient	loud	speakers.	

H3:		Speech/voice	recognition	algorithms	

H4:		Speech‐to‐text/text‐to‐speech	algorithms	

Development	 of	 accurate	 speech	 recognition	 technology	 capable	 of	 adapting	 to	

physiological	effects	of	spaceflight	on	the	human	vocal	tract	is	required.	This	area	includes	

development	 of	 a	 redundant	 speech	 recognizer	 for	 reliable	 voice	 control	 of	 systems.	

Additionally,	 optimization	 of	 speech‐to‐text/text‐to‐speech	 technology	 is	 required	 to	

support	 low	 data	 rate/high	 latency	 communication	 links.	 This	 technology	 will	 improve	
28	

space‐to‐ground	communications	on	high	latency	links	by	providing	textual	conversion	of	

dialog	and	can	be	used	for	real‐time	dictation	in	flight.		This	will	include	computer	speech.	

Tactile Interface Technologies

H5:		Physiological	Computing	(PC)	

PC	 is	 a	 term	 used	 to	 describe	 any	 computing	 system	 which	 uses	 real‐time	 physiological	

data	 as	 an	 input	 stream	 to	 control	 the	 user	 interface.	 	 The	 most	 basic	 PC	 is	 one	 which	

records	a	signal	such	as	heart	rate	and	displays	it	to	the	viewer	via	a	screen.	Other	systems,	

such	 as	 brain‐computer	 interfaces	 or	 unvoiced	 speech	 recognition,	 take	 a	 stream	 of	

physiological	data	(electrical	activity	 from	 the	brain	or	muscles)	and	convert	it	into	input	

control	 at	 the	 interface,	 e.g.,	 to	 move	 a	 cursor	 or	 select	 a	 command.	 Other	 types	 of	 PC	

simply	 monitor	 physiology	 in	 order	 to	 assess	 psychological	 states	 and	 trigger	 real‐time	

adaptation.	For	example,	if	the	system	detects	high	blood	pressure,	it	may	assume	the	user	

is	experiencing	high	frustration	and	offer	help.	The	applications	for	PC	range	from	adaptive	

automation	 in	 an	 aircraft	 cockpit	 to	 computer	 games	 where	 electrical	 activity	 is	 used	 to	

initiate	particular	commands.	

H6:		Computer	haptics	

Haptics	is	a	highly	interdisciplinary	technology	area	which	aims	to	define	how	humans	and	

machines	 touch,	 explore,	 and	 manipulate	 objects	 in	 real,	 virtual,	 or	 teleoperated	 worlds.		

Haptics	have	been	used	to	allow	teleoperators	to	feel	what	a	robot	touches	and	to	increase	

realism	in	training	applications.		Flight	simulators	equipped	with	 force	 feedback	joysticks	

provide	 a	 convincing	 example	 for	 the	 importance	 of	 simulation	 technology	 and	 the	

significant	 role	 haptics	 play	 in	 training.	 Just	 as	 flight	 simulators	 are	 used	 to	 train	 pilots	

nowadays,	it	is,	for	example,	anticipated	surgical	simulators	will	be	used	to	train	physicians	

in	 the	 near	 future.	 Moreover,	 several	 studies	 in	 the	 past	 have	 shown	 the	 significance	 of	

haptics	in	teleoperation	tasks	in	real	and	virtual	worlds.	For	example,	artificial	force	fields	

not	only	enable	us	to	train	the	human	operator	in	virtual	environments,	but	also	help	him	

or	her	execute	the	teleoperated	task	better	and	faster	in	the	real	world.	

Significant	progress	has	been	made	in	haptics,	but	there	are	still	many	research	questions	

waiting	to	be	answered.		One	of	the	constant	challenges	in	integrating	haptics	into	virtual	

environments	 is	 the	 need	 for	 a	 variety	 of	 haptic	 devices	 with	 the	 requisite	 degrees	 of	

freedom,	 range,	 resolution,	 and	 frequency	 bandwidth,	 both	 in	 terms	 of	 forces	 and	

displacements.	 	 Another	 area	 of	 hardware	 design	 which	 requires	further	investigation	is	

multifingered	haptic	devices	and	 tactile	displays.	 It	has	been	demonstrated,	as	we	gather	

information	 about	 the	 shape	 and	 size	 of	 an	 object	 through	 touch,	 our	 fingers	 and	 hand	

move	 in	 an	 optimal	 manner.	 Moreover,	 robotics	 studies	 show	 at	 least	 three	 fingers	 are	

necessary	 for	 stable	 grasp.	 On	 the	 other	 hand,	 there	 are	 only	 a	 few	 multifingered	 haptic	

devices	which	are	commercially	available	today.	
29	

Visual Interface Technologies

H7:	Two‐Dimensional	(2D)	displays	

Traditional	 2D	 displays	 are	 constantly	 evolving.	 	 The	 next	 generation	 of	 these	 visual	

displays	appears	to	be	Organic	Light‐Emitting	Diode	(OLED)	technology	which	significantly	

reduces	size,	weight,	and	power	requirements	 for	visual	displays.		Also,	depending	on	the	

application,	 e‐Ink	 displays	 could	 have	 similar	 benefits.	 	 However,	 other	 technologies	 are	

emerging	which	could	have	impact	beyond	OLED,	such	as	quantum	dot,	bistable,	and	laser‐

phosphor	displays.	

H8:	Autostereoscopic	displays	

Autostereoscopic	 displays	 are	 able	 to	 provide	 binocular	 depth	 perception	 without	 the	

hindrance	 of	 specialized	 headgear	 or	 filter/shutter	 glasses.	 	 At	 its	 simplest,	 this	 is	 3‐D	

television	(3DTV).		However,	the	technology	is	also	progressing	toward	digital	holographic	

prints	and	video.		Some	of	the	various	technologies	which	are	competing	to	best	implement	

an	 autostereoscopic	 display	 are	 parallax	 barrier,	 lenticular,	 volumetric,	 electro‐

holographic,	and	light	field	displays.	

H9:	Transparent	and	deformable	displays	

Additional	 layers	 of	 capability	 which	 are	 being	 added	 to	 display	 technologies	 are	

transparency	 and	 deformation.	 	 These	 capabilities	 lead	 toward	 development	 of	 more	

useable	near‐to‐eye	displays,	as	well	as	new	ways	to	unobtrusively	integrate	displays	into	

the	 environment.	 	 These	 capabilities	 are	 being	 explored	 through	 traditional	 2D‐type	

displays,	as	well	as	through	projection	and	printable	displays.

H10:	Near‐to‐Eye	Display	(NED)	

NEDs	 have	 been	 classified	 into	 one	 of	 three	 categories	 based	 on	 the	 mode	 of	 image	

presentation.	Monocular	NEDs	usually	have	only	one	display;	in	binocular	 (stereo)	NEDs,	

two	disparate	images	are	presented	on	two	displays;	in	bi‐ocular	mode	the	same	image	is	

presented	on	two	displays.		Different	types	of	NED	are	beneficial	for	different	applications.	

Two	of	the	most	impactful	applications	of	NEDs	are	virtual	reality	(presenting	an	entirely	

virtual	world	 to	 the	user)	and	augmented	reality	(presenting	digital	information	onto	 the	

real	world).	

H11:	Panoramic	motion	imagery	acquisition	

Panoramic	image	 acquisition	is	 based	 on	mosaic	 approaches	 developed	in	 the	 context	 of	

still	imagery.		Mosaics	are	created	from	multiple	overlapping	sub‐images	pieced	together	to	

form	a	high‐resolution,	panoramic	or	wide	field‐of‐view	image.	While	still	imagery	mosaics	

and	 panoramas	 are	 common,	 high‐resolution	 real‐time	 panoramic	 video	 is	 an	 emerging	

area.		For	panoramic,	real‐time	HD	video,	an	array	of	video	cameras	view	the	scene,	while	a	

digital	 recording	and	 playback	 system	maintains	 precise	 frame	 synchronization,	allowing	

the	frames	to	be	stitched	together.		The	challenges	encountered	in	this	process	span	issues	
30	

in	camera	calibration,	image	processing,	compression,	networking,	computer	graphics,	and	

high‐performance	computing.	

H12:	Radiation‐tolerant	HD	imagers	

The	 image	 sensors	 used	 for	 spaceflight	 applications	 have	 historically	 been	 commercially	

available	sensors	which	are	vetted	through	radiation	testing	on	the	ground	and	flown	for	a	

limited	lifetime	until	they	degrade	to	a	predetermined	limit.		Then,	they	are	discarded	and	

replaced.	 	 For	 long‐duration	 missions	 beyond	 LEO,	 radiation‐tolerant	 high‐definition	

imagers	will	be	required.	

H13:	Efficient	HD	motion	imagery	compression	

Motion	imagery	 compression	 reduces	 the	amount	 of	 data	 used	 to	 represent	 digital	 video	

images,	 and	 combines	 spatial	 image	 compression	 and	 temporal	 motion	 compensation.		

Most	 video	 compression	is	lossy	—	it	 operates	 on	 the	 premise	much	 of	 the	 data	 present	

before	compression	is	not	necessary	for	achieving	good	perceptual	quality.		Some	forms	of	

data	compression	are	lossless.	This	means	the	data	is	decompressed,	resulting	in	a	bit‐for‐

bit	 perfect	 match	 with	 the	 original.	While	 lossless	 compression	 of	 video	 is	 possible,	 it	 is	

rarely	 used,	 since	 lossy	 compression	 results	 in	 far	 higher	 compression	 ratios	 at	 an	

acceptable	 level	 of	 quality.	 	 However,	 in	 spaceflight	 applications	 where	 very	 few	 or	 no	

humans	 are	 present,	 video	 is	 the	 primary	 method	 we	 have	 to	 experience	 the	 mission	

environment.	 	 Future	 NASA	 missions	 will	 require	 higher	 compression	 ratios	 without	

sacrificing	image	quality.		

H14:	Computer	vision	

Computer	vision	is	the	field	concerned	with	the	automated	processing	of	images	from	the	

real	world	 to	extract	and	interpret	information	 on	a	 real‐time	basis.	 It	is	 the	 science	and	

technology	 of	 machines	 which	 see.	 Here,	 “see”	 means	 the	 machine	 is	 able	 to	 extract	

information	from	an	image,	to	solve	some	task,	or	perhaps	understand	the	scene	in	either	a	

broad	 or	 limited	 sense.	 The	 field	 includes	 scene	 reconstruction,	 event	 detection,	 video	

tracking	 (3D	 human	 body	 tracking,	 including	 eye/gaze	 tracking,	 object	 recognition,	

learning,	indexing,	motion	estimation	and	image	restoration).	

H15:	Computer‐mediated	reality	

Computer‐mediated	reality	refers	to	the	ability	to	add	or	subtract	information	or	otherwise	

manipulate	 one's	 perception	 of	 reality	 through	 the	 use	 of	 a	wearable	 computer	 or	 hand‐

held	 device.	 	 Typically,	 it	 is	 the	 user's	 visual	 perception	 of	 the	 environment	 which	 is	

mediated.	This	is	done	through	the	use	of	some	kind	of	electronic	device	which	can	act	as	a	

visual	 filter	between	 the	 real	world	and	what	 the	user	perceives.		The	 field	 of	computer‐

mediated	reality	encompasses	augmented	reality	(adding	or	subtracting	digital	information	

to	the	real	world)	and	virtual	reality	(immersion	into	a	completely	digital	world).	
31	

Multi‐Sense Interface Technologies

H16:	Electronic	Textiles	(e‐Textiles)	

E‐textiles	 are	 fabrics	 which	 have	 electronics	 and	 interconnections	 woven	 into	 them	

offering	 physical	 flexibility	 and	 size	 which	 cannot	 be	 achieved	 with	 existing	 electronic	

manufacturing	 techniques.	 	 Components	 and	 interconnections	 are	 intrinsic	 to	 the	 fabric	

and	 thus	 are	 less	 visible	 and	 not	 susceptible	 to	 becoming	 tangled	 or	 snagged	 by	 the	

surroundings.	 	An	e‐textile	 can	 be	worn	in	everyday	 situations	where	 currently	available	

wearable	 computers	 would	 hinder	 the	 user.	 	 E‐textiles	 can	 also	 more	 easily	 adapt	 to	

changes	in	the	computational	and	sensing	requirements	of	an	application,	a	useful	feature	

for	power	management	and	context	awareness.	

H17:	Virtual	window	

A	 virtual	 window	 utilizes	 digital	 technology	 to	 simulate	 an	 optical	 window	including	 the	

changes	 in	 perspective	 due	 to	 the	 movements	 of	 the	 observer.	 	 The	 ultimate	

implementation	 would	 include	 autostereoscopic	 video/displays,	 panoramic	 motion	

imagery	 acquisition,	 ambiance	 audio,	 pan/tilt/zoom	 for	 situational	 awareness,	 and	

radiation	tolerant	video	and	graphics.	

H18:	Telepresence	

Telepresence	refers	to	a	set	of	technologies	which	allow	a	person	to	feel	as	if	he	or	she	were	

present,	 to	give	 the	appearance	of	being	present,	or	 to	have	an	effect	via	 telerobotics	at	a	

place	 other	 than	 his	 or	 her	 true	 location.	 	 Telepresence	 requires	 the	 user’s	 senses	 be	

provided	 with	 stimuli	 to	 give	 the	 feeling	 of	 being	 in	 the	 other	 location.	 Additionally,	 the	

user	may	be	given	the	ability	to	affect	the	remote	location.	In	this	case,	the	user's	position,	

movements,	actions,	voice,	etc.,	may	be	sensed,	 transmitted,	and	duplicated	in	the	remote	

location	 to	 bring	 about	 this	 effect.	 Therefore,	 information	 may	 be	 traveling	 in	 both	

directions	between	the	user	and	the	remote	location.	

H19:	Immersive	environment	

An	 immersive	 digital	 environment	 is	 an	 artificial,	 interactive,	 computer‐created	 scene	 or	

world	within	which	a	user	can	immerse	one’s	self.	Immersive	digital	environments	could	be	

synonymous	with	virtual	reality	without	 the	implication	actual	reality	is	being	simulated.		

An	 immersive	 digital	 environment	 could	 be	 a	 model	 of	 reality	 but	 it	 could	 also	 be	 a	

complete	 fantasy	 user	 interface	 or	 abstraction	 as	 long	 as	 the	 user	 of	 the	 environment	is	

immersed	within	it.	The	definition	of	immersion	is	wide	and	variable	but	here	it	is	assumed	

to	simply	mean	the	user	feels	like	he	or	she	is	part	of	the	simulated	universe.	The	success	

with	which	an	immersive	digital	environment	can	actually	immerse	the	user	is	dependent	

on	many	factors	such	as	believable	3D	computer	graphics,	surround	sound,	interactive	user	

input,	and	 other	 factors	 such	as	 simplicity,	 functionality,	and	 potential	 for	enjoyment.	 To	

create	 a	 sense	 of	 full	 immersion,	 the	 five	 senses	 (sight,	 sound,	 touch,	 smell,	 taste)	 must	
32	

perceive	 the	 digital	 environment	 to	 be	 physically	 real.	 Immersive	 technology	 can	

perceptually	fool	the	senses	through:	

 Panoramic	3D	or	holographic	displays	(visual)	

 Surround	sound	acoustics	(auditory)	

 Haptics	and	force	feedback	(tactile)	

 Smell	replication	(olfactory)	

 Taste	replication	(gustation)	

Some	 potential	 applications	 for	 an	 immersive	 environment	 include	 crew	 recreation,	

training,	and	troubleshooting.	

   
33	

Acronyms

2D	 	 Two‐Dimensional	

3‐D		 	 Three‐Dimensional		

ASC		 	 Avionics	Steering	Committee	

ASIC		 	 Application‐Specific	Integrated	Circuit	

C	 	 Celsius	

C&DH	 	 Command	and	Data	Handling	

CMOS			 Complementary	Metal‐Oxide	Semiconductor		

COMSEC	 Communications	Security	

DARPA	 Defense	Advanced	Research	Projects	Agency	

DDR		 	 Double	Data	Rate	

DRM		 	 Design	Reference	Mission	

DS	 	 Deep	Space	

DSN	 	 Deep	Space	Network	

DTN	 	 Delay‐Tolerant	Network	

DTRA	 	 Defense	Threat	Reduction	Agency	

EVA	 	 Extravehicular	Activity	

FeRAM	 Ferroelectric	Random‐Access	Memory	

FPGA				 Field	Programmable	Gate	Array			

GaN	 	 Gallium	Nitride	

Gb/s		 	 Gigabits	Per	Second	

GPS	 	 Global	Positioning	System	

HD	 	 High	Definition	

I/O	 	 Input/Output	

ISHM	 	 Integrated	System	Health	Management	

ISS	 	 International	Space	Station	

IVHM	 	 Integrated	Vehicle	Health	Management	

krad	 	 Kilorad	
34	

LEO	 	 Low	Earth	Orbit	

Mb/s	 	 Megabit	Per	Second	

MEM		 	 Microelectromechanical	

MIT		 	 Massachusetts	Institute	of	Technology	

MPCV			 Multi‐Purpose	Crew	Vehicle	

MRAM		 Magnetoresistive	Random	Access	Memory	

NEA		 	 Near	Earth	Asteroid	

NED		 	 Near‐to‐Eye	Display	

nm	 	 Nanometer	

NRO		 	 National	Reconnaissance	Office	

OCT	 	 Office	of	the	Chief	Technologist	

OLED		 	 Organic	Light‐Emitting	Diode	

phy	 	 Physical	

PC		 	 Physiological	Computing	

PCRAM	 Phase‐Change	Random‐Access	Memory	

RAM	 	 Random	Access	Memory	

QML	 	 	

RF	 	 Radio	Frequency	

RFID	 	 Radio	Frequency	Identificaiton	

RH	 	 Radiation	Hardened	

RHBD			 Radiation	Hardening	By	Design		

SAW	 	 Surface	Acoustic	Wave	

SBC		 	 Single	Board	Computer	

SDRAM		 Synchronous	Dynamic	Random	Access	Memory	

SiGe	 	 Silicon‐Germanium	

SiC	 	 Silicon	Carbide	

SIMD				 Single	Instruction	Multiple	Data		

SLS	 	 Space	Launch	System		

SOC		 	 System	On	Chip	

SOI		 	 Silicon‐On‐Insulator	
35	

SONOS	 Silicon‐Oxide‐Nitride‐Oxide	Silicon	

SQIF	 	 Superconducting	Quantum	Interference	Filter	

SRAM	 	 Static	Random	Access	Memory	

THz	 	 Terahertz	

TRL		 	 Technology	Readiness	Level	

TSV	 	 Through	Silicon	Via	

μm	 	 Micrometer	
REPORT DOCUMENTATION PAGE Form Approved

OMB No. 0704-0188

2. REPORT TYPE 

Technical Memorandum

 4. TITLE AND SUBTITLE

Flight Avionics Hardware Roadmap 

5a. CONTRACT NUMBER

 6. AUTHOR(S)

Hodson, Robert F.; McCabe, Mary; Paulick, Paul; Ruffner, Tim; Some, 

Rafi; Chen, Yuan; Vitalpur, Sharada; Hughes, Mark; Ling, Kuok; Redifer, 

Matt; Wallace, Shawn

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NASA Langley Research Center

Hampton, VA 23681-2199

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As part of NASA’s Avionics Steering Committee’s stated goal “to advance the avionics discipline ahead of program and 

project needs,” the committee initiated a multi-Center technology roadmapping activity to create a comprehensive avionics 

roadmap. The roadmap is intended to strategically guide avionics technology development to effectively meet future NASA 

missions’ needs. The scope of the roadmap aligns with the twelve avionics elements defined in the ASC charter, but is 

subdivided into the following five areas: Foundational Technology (including devices and components), Command and Data 

Handling, Spaceflight Instrumentation, Communication and Tracking, and Human Interfaces. 

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Avionics; Hardware; Roadmap

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