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CONFIDENTIAL
    
    Exhibit 4(i)(Z)
  
 Product Purchase And Capacity Reservation Addendum #9
   Semiconductor Manufacturing International Corporation
     Semiconductor Manufacturing International (Shanghai) Corporation
     Qimonda AG
   
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Preamble
 Know How Transfer
Agreement Agreement
    Article 1  Purpose of this Addendum
 Due to negative Margins Qimonda and SMIC agree to change the Transfer Prices for all 300mm
Wafer starts from October 13th 2007 onwards to the scheme described in Annex 5.
The Transfer Price per Annex 5 shall be applicable as long as such respective Transfer Price
per Annex 5 is lower than the respective Transfer Price for the same Wafer of a particular
Contract Product according to Annex 1. As soon as a Transfer Price according to Annex 1 is,
for Wafers of a particular Contract Product, for one calendar month in average lower than
the Transfer Price per Annex 5, the Parties shall use for such month and thereafter again
the Transfer Price according to Annex 1.Unless expressly set forth herein, the Agreement, including its Annexes, shall remain
unaltered and in full force and effect.
 Article 2  Definitions
 For the avoidance of doubt, definitions set forth in the Agreement which refer to the Know
How Transfer Agreement shall be understood as a reference to such Know How Transfer
Agreement as
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amended by its most current Addendum. Capitalized terms not defined herein shall have the
meanings assigned to them in the Agreement.
 Article 3  Disposition of Risk Starts
 The following Section shall replace Section 3.1.5 of the Agreement:Disposition of 80nm Risk Start Lots. SMIC shall start upon Qimondas request up to [***]
([***]) 80nm Wafers in total for the conversion from the 90nm to the 80nm Contract
Process or a higher number of Wafers to be mutually agreed between the Parties. The
Transfer Price (TP) for each such 80nm Wafer shall be calculated (1) as Non-Conforming
Products according to Annex 1, Section 9 based on the Transfer Price calculation
described in Annex 1, Section 11, but with a minimum cap of US$ to [***] per wafer or
(2) if the Transfer Price in Annex 5 is applicable due to Article 1 of this Addendum,
as Non-Conforming Products according to Annex 5, but with a minimum cap of US$ [***]
per wafer.
 Article 4  Changes to Annexes
 4.1
    
    Annex 5 of this Addendum shall be added to the Agreement.4.2
    
    The following sentence shall be added to Section 3 of Annex 2 of the Agreement:If an SQ for the 512M T80 is reached in [***] and if the following respective
target yields are reached, then SMIC shall convert for each month in which such
respective target yield is reached the following volumes from 90nm to 80nm.
 Feb
    
    Mar
    
    Apr
    
    May
    
    Jun
    
    (2008)FE-Yield
    
    
    [***]
    %
    
    
    [***]
    %
    
    
    [***]
    %
    
    
    [***]
    %
    
    
    [***]
    %BE-Yield
    
    
    [***]
    %
    
    
    [***]
    %
    
    
    [***]
    %
    
    
    [***]
    %
    
    
    [***]
    %Target yield
    
    
    [***]
    %
    
    
    [***]
    %
    
    
    [***]
    %
    
    
    [***]
    %
    
    
    [***]
    %Wafer starts
    
    
    2500
    
    
    
    3000
    
    
    
    3000
    
    
    
    6000
    
    
    
    10000
 4.3
    
    The following sentence shall be added as Section 4.5 to Annex 2 of the Agreement:As long as the Transfer Price according to Annex 5 is applicable, Qimonda has no right to
adjust the volume according to Section 4 of this Annex 2.Should during such pricing per Annex 5, the Transfer Price for Wafers of a particular
Contract Product drop to a level which does no longer cover SMICs variable manufacturing
cost for such Wafers, the Parties shall discuss in good faith a temporary reduction of
volume.
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Article 5  Term and Termination
 This Addendum shall enter into force upon signature by both Parties.
 Article 6  Miscellaneous
 6.1
    
    Public Announcement.No public announcement concerning the terms of this Addendum or
concerning the transactions described herein shall be made, either directly or indirectly,
without first obtaining the approval of the other Party and agreement upon the nature, text,
and timing of such announcement. The Party desiring to make any such public announcement shall
provide the other Party with a written copy of the proposed announcement in sufficient time
prior to public release to allow such other Party to determine whether they agree to such
announcement.6.2
    
    Annexes. Annexes 5, which is attached hereto, shall constitute an integral part hereof.6.3
    
    Counterparts. This Addendum may be executed in counterparts, each of which shall be deemed
to be an original.
  Semiconductor
Manufacturing International Corporation

    Qimonda AGBy:
    
    /s/ James Sung
    
    By:
    
    /s/ ppa Klaus FleischmannName:
    
    James Sung
    
    Name:
    
    Klaus FleischmannTitle:
    
    Sr. Vice President M&S
    
    Title:
    
    VP AlliancesDate:
    
    October 13, 2007
    
    Date:
    
    October 12, 2007By:
    
    /s/ Bembazzo Umberto
    
    By:
    
    /s/ Frank TillnerName:
    
    Bembazzo Umberto
    
    Name:
    
    Frank TillnerTitle:
    
    VP & GM SMIC Europe
    
    Title:
    
    SVP ProductionDate:
    
    October 12, 2007
    
    Date:
    
    October 12, 2007
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Semiconductor Manufacturing International
(Shanghai) Corporation
 By:
    
    /s/ James SungName:
    
    James SungTitle:
    
    Sr. Vice President M&SDate:
    
    October 13, 2007By:
    
    /s/ Bembazzo UmbertoName:
    
    Bembazzo UmbertoTitle:
    
    VP & GM SMIC EuropeDate:
    
    October 12, 2007
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ANNEX 5
  Transfer Price
  6