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Exhibit 4(i)(U)
 
 Product Purchase And Capacity Reservation Addendum #6
   Semiconductor Manufacturing International Corporation
     Semiconductor Manufacturing International (Shanghai) Corporation
     Qimonda AG
   1




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2




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Preamble
 Know How
Agreement Agreement
    Article 1  Purpose of this Addendum
  Article 2  Definitions
  3




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Article 3  Replacement of Annex 1 and Annex 2
  Article 4  Term and Termination
 4.1
    
    This Addendum shall enter into force retroactively as of June 1, 2006 (''Addendum Date'').
 Article 8  Miscellaneous
 8.1
    
    Public Announcement.No public announcement concerning the terms of this Addendum or
concerning the transactions described herein shall be made, either directly or indirectly,
without first obtaining the approval of the other Party and agreement upon the nature, text,
and timing of such announcement. The Party desiring to make any such public announcement shall
provide the other Party with a written copy of the proposed announcement in sufficient time
prior to public release to allow such other Party to determine whether they agree to such
announcement.8.2
    
    Annexes. Annexes 1 and 2, which are attached hereto, shall constitute an integral part
hereof.8.3
    
    Counterparts. This Addendum may be executed in counterparts, each of which shall be deemed
to be an original.
  4




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Semiconductor ManufacturingInternational Corporation
    
    Qimonda AGBy:
    
    /s/ James Sung
    
    By:
    
    /s/ Michael MajerusName:
    
    James Sung
    
    Name:
    
    Michael MajerusTitle:
    
    Senior Vice President
    
    Title:
    
    Chief Financial OfficerDate:
    
    August 10, 2006
    
    Date:
    
    August 18, 2006By:
    
    /s/ Marco Mora
    
    By:
    
    /s/ Klaus FleischmannName:
    
    Marco Mora
    
    Name:
    
    Klaus FleischmannTitle:
    
    Chief Operating Officer
    
    Title:
    
    Vice PresidentDate:
    
    August 10, 2006
    
    Date:
    
    August 18, 2006Semiconductor Manufacturing International
(Shanghai) CorporationBy:
    
    /s/ Marco MoraName:
    
    Marco MoraTitle:
    
    Chief Operating OfficerDate:
    
    August 10, 2006By:
    
    /s/ James SungName:
    
    James SungTitle:
    
    Senior Vice PresidentDate:
    
    August 11, 2006
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ANNEX 1
  Transfer Price
  6




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ANNEX 2
  Reserved Capacity
  7




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Product Purchase And Capacity Reservation Addendum #7
   Semiconductor Manufacturing International Corporation
     Semiconductor Manufacturing International (Shanghai) Corporation
     Qimonda AG
    1




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Preamble
 Know How
Agreement Agreement
    Article 1  Purpose of this Addendum
  Article 2  Definitions
  AENEON ASP
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Article 3  Price and Payment
 3.1
    
    Section 4.2. of the Agreement shall be replaced by the following:Fifteen (15) days before each Delivery Month but not later than four (4) days before
each Delivery Month, Qimonda and SMIC shall agree on the estimated Transfer Prices (based on
ninety-five percent (95%) of the Market Price of the month preceding the delivery month or
in case of the Transfer Price for Contract Products sold under Qimondas AENEON brand
ninety-five percent (95%) of Qimondas AENEON ASP of the preceding month) for the Contract
Product of such Delivery Month. Qimonda shall use such estimated Transfer Price when placing
the Purchase Order with SMIC for such Delivery Month.3.2
    
    Section 4.3. of the Agreement shall be replaced by the following:Qimonda shall calculate the actual Market Price for a specific Delivery Month and the
actual AENEON Average Sales Price for a specific Delivery Month as soon as possible and
inform SMIC, but in no case later than forty-five (45) days after the end of the respective
Sales Month.3.3
    
    Section 4.4 of the Agreement shall be replaced by the following:Using the actual Market Price and the actual AENEON ASP established according to
Section 4.3 above, SMIC shall calculate the actual Transfer Price for such specific Delivery
Month and compare this actual Transfer Price with the original invoiced Transfer Price. If
the original invoiced Transfer Price is higher than the actual Transfer Price, the
difference shall be credited to Infineon by SMIC. If the original invoiced Transfer Price is
lower than the actual Transfer Price, the difference shall be debited to Infineon by SMIC.
Such debits and credits shall be accumulated by SMIC over the span of a calendar quarter and
the balance shall be credited or debited to Infineon within fifteen (15) days after the end
of each such quarter.
 Article 3  Replacement of Annex 1 and Annex 2
  Article 4  Term and Termination
 4.1
    
    This Addendum shall enter into force upon signature by both Parties.
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Article 8  Miscellaneous
 8.1
    
    Public Announcement.No public announcement concerning the terms of this Addendum or
concerning the transactions described herein shall be made, either directly or indirectly,
without first obtaining the approval of the other Party and agreement upon the nature, text,
and timing of such announcement. The Party desiring to make any such public announcement shall
provide the other Party with a written copy of the proposed announcement in sufficient time
prior to public release to allow such other Party to determine whether they agree to such
announcement.8.2
    
    Annexes. Annexes 1 and 2, which are attached hereto, shall constitute an integral part hereof.8.3
    
    Counterparts. This Addendum may be executed in counterparts, each of which shall be deemed
to be an original.
  Semiconductor ManufacturingInternational Corporation
    
    Qimonda AGBy:
    
    /s/ James Sung
    
    By:
    
    /s/ Klaus FleischmannName:
    
    James Sung
    
    Name:
    
    Klaus FleischmannTitle:
    
    Senior Vice President
    
    Title:
    
    Vice PresidentDate:
    
    November 14, 2006
    
    Date:
    
    November 14, 2006By:
    
    
    
    By:
    
    /s/ Marc LohoffName:
    
    
    
    Name:
    
    Marc LohoffTitle:
    
    
    
    Title:
    
    Senior Director Manufacturing
CooperationsDate:
    
    
    
    Date:
    
    November 14, 2006
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Semiconductor Manufacturing International(Shanghai) CorporationBy:
    
    /s/ James SungName:
    
    James SungTitle:
    
    Senior Vice PresidentDate:
    
    November 16, 2006By:Name:Title:Date:
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ANNEX 1
  Transfer Price
   6




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ANNEX 2
  Reserved Capacity
 2003
    
    
    2004
    
    
    2005
    
    
    2006
    
    
    2007
    
    
    2008
    
    
    2009200mm
    
    
    5.000
    
    
    
    15.000
    
    
    
    20.000
    
    
    
    20.000
    
    
    
    20.000
    
    
    
    
    
    
    
    300mm
    
    
    
    
    
    As below
    
    
    15.000
    
    
    
    15.000
    
    
    
    15.000
    
    
    
    15.000
    
    
    
    15.000
 1.
    
    2004 Capacity IncreaseFigures in the above table refer to calendar years and to the average wafer start per month
(wspm) during the respective calendar year, excluding Engineering Lots and Wafer Risk Starts.
However, the Reserved Capacity in 300mm Wafer size shall be increased in the calendar year
2004 as follows:
 June
    
    July
    
    Aug.
    
    Sept.
    
    Oct.
    
    Nov.
    
    Dec.100
    
    500
    
    1.000
    
    2.000
    
    4.000
    
    6.000
    
    8.000
 Subject to the foregoing, throughout a calendar year, the Reserved Capacity shall be
allocated linearly on a monthly basis with respect to wafer output, with an allowable
deviation of +[***]% /- [***]% per month. During the ramp up phases, the allowable deviation
shall be in accordance with the respective ramp up plan.2.
    
    140nm to 110nm Conversion on 200mmThe Reserved Capacity in 200mm Wafer size shall be converted from the 140nm Contract Process
to the 110nm Contract Process pursuant to Section 2.1 of the Agreement. In any event, by the
end of the calendar year 2004, the Reserved Capacity of 20.000 wspm in 200mm Wafer size shall
be available using the 110nm Contract Process.In 2007 at least [***] wspm in 200mm Wafer size are used for the [***] Contract Product,
whereas in Q1 of 2007 according to the commercially reasonable ramp of such product this
capacity may still partly be used for the [***] with a minimum of [***] wspm.At least [***] wspm out of the Reserved Capacity in 200 mm Wafer size shall be used for the
[***] Contract Product sold under Qimondas AENEON brand. The exact amount of Wafers
requested by Qimonda for such business will be reflected in the monthly forecast. Each Party
may terminate this obligation with two (2) months prior written notice.
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3.
    
    100nm to 90nm Conversion on 300mmThe Reserved Capacity in 300mm Wafer size shall be provided using the 110nm Contract Process
and the 90nm Contract Process and the conversion from 110nm to 90nm shall be made pursuant to
Section 2.1c of the Agreement.4.
    
    Volume Adjustment4.1
    
    When the Margin according to any of the models referred to in Annex 1 of the Agreement is
negative, then each Party shall have the right to adjust the wspm volume set forth on this
Annex 2 of the respective negative Margin bearing Contract Product; provided that the Parties
shall resume their obligations under the full Reserved Capacity as soon as the Margin becomes
positive.4.2
    
    On a monthly basis, the Parties will discuss in good faith the extent and timing of a
reduction in volume in accordance with Section 3.2.2 of the Agreement and taking into
consideration Infineons then outstanding delivery obligations for Contract Products to its
customers. Further, in no event shall the Reserved Capacity for 300mm Wafers be reduced below
[***] wspm.4.3
    
    In addition, in order to prevent SMIC from requesting a wspm volume reduction, Infineon shall
have the right to compensate SMIC for the lacking US Dollar amount which causes the Margin to
become negative, in which case the then current wspm volume shall not be reduced.4.4
    
    The Parties acknowledge that the ongoing ramp up of the Reserved Capacity for 200mm Wafers,
as of January 2004, has reached a volume of [***] wspm. SMIC agrees to increase the number of
actual Wafer starts to said [***] Wafers from February 2004 on ([***] Wafer In). Only after
[***] Wafer In have been reached, the wspm volume may again become subject to adjustment
pursuant to this Section 4.5.
    
    Cycle TimeSMIC shall use best efforts to achieve an actual cycle time for processing a Wafer of equal
or less than [***] times the physical cycle time for processing such Wafer (i.e. flow factor
[***]). During the ramp up phase of a new Contract Process, typical longer actual cycle times
resulting from use of multiple one of a kind tools shall not result in a breach of this
provision.6.
    
    Capacity used under the Disclosure and License AgreementThe Disclosure and License Agreement may allow SMIC to use certain portions of the Reserved
Capacity for the manufacture of products to certain third parties, subject to the terms and
conditions of said Disclosure and License Agreement, in which case the number of Contract
Products Infineon shall purchase under the Reserved Capacity shall be reduced by the number
of Contract Products
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9