Ex-4.44 Asset Sale & Purchase dated June 22, 2006



Table of Contents




Exhibit 4.44




Dated this 22nd of June 2006




Between




STATS CHIPPAC SHANGHAI CO., LTD

as vendor




And




STATS CHIPPAC LTD.

as guarantor for STATS ChipPAC Shanghai Co., Ltd.




And




WUXI CR MICRO-ASSEMB TECH. LTD.

as purchaser




And




CHINA RESOURCES LOGIC LIMITED

as guarantor for Wuxi CR Micro-Assemb Tech. Ltd.




 






ASSETS SALE AND PURCHASE AGREEMENT




 






 









 














TABLE OF CONTENTS




	 	 	 	 	 	 	 
	CLAUSE	 	 	 	 	 	 
	PAGE	 	HEADING	 	 	 	 
	 
	 	 	 	 	 	 
	1.
	 	DEFINITIONS	 	 	1	 
	 
	 	 	 	 	 	 
	2.
	 	AGREEMENT TO SELL THE ASSETS	 	 	4	 
	 
	 	 	 	 	 	 
	3.
	 	PURCHASE CONSIDERATION	 	 	4	 
	 
	 	 	 	 	 	 
	4.
	 	TRANSFERS OF ASSETS	 	 	5	 
	 
	 	 	 	 	 	 
	5.
	 	RESPONSIBILITIES AND OBLIGATIONS	 	 	6	 
	 
	 	 	 	 	 	 
	6.
	 	WARRANTIES	 	 	7	 
	 
	 	 	 	 	 	 
	7.
	 	NON-SOLICITATION	 	 	8	 
	 
	 	 	 	 	 	 
	8.
	 	CRL GUARANTEE	 	 	9	 
	 
	 	 	 	 	 	 
	9.
	 	SCL GUARANTEE	 	 	9	 
	 
	 	 	 	 	 	 
	10.
	 	ANNOUNCEMENTS	 	 	9	 
	 
	 	 	 	 	 	 
	11.
	 	STAMP DUTY	 	 	10	 
	 
	 	 	 	 	 	 
	12.
	 	COSTS AND EXPENSES	 	 	10	 
	 
	 	 	 	 	 	 
	13.
	 	CONFIDENTIALITY	 	 	10	 
	 
	 	 	 	 	 	 
	14.
	 	GENERAL	 	 	12	 
	 
	 	 	 	 	 	 
	15.
	 	ILLEGALITY	 	 	13	 
	 
	 	 	 	 	 	 
	16.
	 	NOTICES	 	 	13	 
	 
	 	 	 	 	 	 
	17.
	 	REMEDIES AND WAIVERS	 	 	15	 
	 
	 	 	 	 	 	 
	18.
	 	TIME OF ESSENCE	 	 	15	 
	 
	 	 	 	 	 	 
	19.
	 	FORCE MAJEURE	 	 	15	 
	 
	 	 	 	 	 	 
	20.
	 	COUNTERPARTS	 	 	15	 
	 
	 	 	 	 	 	 
	21.
	 	GOVERNING LAW AND ARBITRATION	 	 	15	 
	 
	 	 	 	 	 	 
	APPENDIX 1	 	 	 	 
	 
	 	 	 	 	 	 
	ASSETS	 	 	17	 
	 
	 	 	 	 	 	 
	APPENDIX 2	 	 	 	 
	 
	 	 	 	 	 	 
	TECHNICAL SPECIFICATIONS	 	 	18	 
	 
	 	 	 	 	 	 
	APPENDIX 3	 	 	 	 
	 
	 	 	 	 	 	 
	TRANSFER PLAN	 	 	19	 
	 
	 	 	 	 	 	 
	SCHEDULE	 	 	20	 










 









Table of Contents







THIS ASSETS SALE AND PURCHASE AGREEMENT is made on 22nd day of June 2006




BETWEEN:





	(1)	 	STATS CHIPPAC SHANGHAI CO., LTD., a company incorporated in the People’s Republic of China
and having its registered address at 188 Huaxu Road, Qingpu District 201702 Shanghai, People’s
Republic of China (“SCC”);
	 
	(2)	 	STATS CHIPPAC LTD. (Company Registration No. 199407932D) a company incorporated in Singapore
and having its corporate headquarters address at 10 Ang Mo Kio Street 65, Techpoint #05-17/20,
Singapore (“SCL”);
	 
	(3)	 	WUXI CR MICRO-ASSEMB TECH. LTD., a company incorporated in the People’s Republic of China and
having its registered address at New District Science & Technology Park Ximei Road, B-27, Wuxi
214112, Jiangsu, People’s Republic of China (“ANST”); and
	 
	(4)	 	CHINA RESOURCES LOGIC LIMITED (Company Registration No. 19963), a company incorporated in
Bermuda and having its principal business address at Rooms 4003-06, China Resources Building,
26 Harbour Road, Wanchai, Hong Kong (“CRL”),
	 
	 	 	(collectively, the “Parties” and each a “Party”).





WHEREAS:





	(A)	 	SCC has agreed to sell, and ANST has agreed to purchase, the Assets (as defined below) upon
the terms and subject to the conditions of this Agreement.
	 
	(B)	 	CRL has entered into this Agreement to guarantee to and covenant with SCC the due and
punctual performance by ANST of its payment obligations under this Agreement.
	 
	(C)	 	SCL has entered into this Agreement to guarantee to and covenant with CRL and ANST the due
and punctual performance by SCC of certain of its obligations under this Agreement.





IT IS AGREED as follows:









	1.	 	DEFINITIONS
	 
	1.1	 	In this Agreement, except to the extent that the context requires otherwise:
	 
	 	 	“Additional Incentive Amount” has the meaning ascribed to it in Clause 3.3;
	 
	 	 	“Assets” means the tools, equipment and spare parts agreed to be sold under this
Agreement as more particularly set out in Appendix 1 and shall where appropriate, include
the tools, equipment and spare parts to be delivered by SCC pursuant to Clause 4.3;
	 
	 	 	“Balance Purchase Consideration” has the meaning ascribed to it in Clause 3.1(ii);




1









Table of Contents






	 	 	“Business Day” means a day (other than a Saturday, Sunday or gazetted public
holiday) on which commercial banks are open for business in Hong Kong, Singapore, the BVI
and the PRC;
	 
	 	 	“BVI” means the British Virgin Islands;
	 
	 	 	“CIETAC” means China International Economic and Trade Arbitration Commission;
	 
	 	 	“CIETAC Rules” means the CIETAC Arbitration Rules in force at the date of this
Agreement;
	 
	 	 	“commercially reasonable efforts” for the purposes of the discharge of SCC’s
obligations under Clause 5.2, shall mean such steps to be taken by SCC as set out in the
Schedule;
	 
	 	 	“Confidential Information” means any information which is proprietary and
confidential to a Party including but not limited to the terms and conditions of this
Agreement, information concerning or relating in any way whatsoever to its distributorship,
franchise or other arrangements, principals, any of the trade secrets or confidential
operations, processes or inventions carried on or used by a Party, any information
concerning the organisation, business, finances, transactions or affairs of a Party,
dealings of a Party, secret or confidential information which relates to the business or
Party or any of its principals’, clients or customers’ transactions or affairs, any Party’s
technology, designs, documentation, manuals, budgets, financial statements or information,
accounts, dealers’ lists, customer lists, marketing studies, drawings, notes, memoranda and
the information contained therein, any information therein in respect of trade secrets,
technology and technical or other information relating to the development, manufacture,
clinical testing, analysis, marketing, sale or supply or proposed development, manufacture,
clinical testing, analysis, marketing, sale or supply of any products or services by a
Party, and plans for the development or marketing of such products or services and
information and material which is either marked confidential or is by its nature intended
to be exclusively for the knowledge of the recipient alone;
	 
	 	 	“Encumbrance” means any claim, mortgage, charge, pledge, lien, security interest or
encumbrance or any other agreement or arrangement having substantially the same legal
effect, including any retention of title arrangement;
	 
	 	 	“Inspection Dates” shall have the meaning ascribed to it in Clause 4.1;
	 
	 	 	“Joint Venture Agreement” shall have the meaning ascribed to it in the Subscription
Agreement;
	 
	 	 	“Manufacturer’s Representative Agreement” means that certain manufacturer’s
representative agreement entered or to be entered into between CRL, ANST, SCL and SCBL
pursuant to which SCBL is appointed as a non-exclusive manufacturer’s representative of
ANST;
	 
	 	 	“MAT” means Micro Assembly Technologies Limited, a company established in the BVI
with its registered office at Pasea Estate, Road Town, Tortola, British Virgin Islands;
	 
	 	 	“Purchase Consideration” shall have the meaning ascribed to it in Clause 3.1;
	 
	 	 	“PRC” means the People’s Republic of China;




2









Table of Contents







	 	 	“Related Corporation” means with reference to a corporation, a corporation which is
(a) the holding company of the first-mentioned corporation; (b) a subsidiary of the
first-mentioned corporation; or (c) a subsidiary of the holding company of the
first-mentioned corporation;
	 
	 	 	“RMB” means the lawful currency of the People’s Republic of China;
	 
	 	 	“SCBL” means STATS ChipPAC (BVI) Limited, a company established in the BVI with its
principal place of business at Craigmuir Chambers, Road Town, Tortola, the BVI;
	 
	 	 	“SCL Customers” means the existing and future customers of SCL and/or its
subsidiaries, including without limitation, fabless IC Companies, fabless ASIC Companies,
wafer foundries and test and assembly houses;
	 
	 	 	“Subscription Agreement” means the subscription agreement entered or to be entered
into between SCL, CRL, MAT and Wuxi China Resources Microelectronics (Holdings) Limited
pursuant to which, inter alia, SCL agrees to subscribe for a 25% stake in the enlarged
share capital of MAT;
	 
	 	 	“Technical Specifications” means detailed quality requirements, maintenance
specifications, related products’ process flow and specifications plus quality assurance
process flow and specification more particularly set out in Appendix 2;
	 
	 	 	“to de-install” means to unplug and unbolt and “de-installation” shall be
construed accordingly;
	 
	 	 	“Transfer” means the completion of the de-installation of a phase of Assets in
accordance with the Transfer Plan and the acceptance of the same by ANST (evidenced by the
delivery by ANST of an acceptance certificate by ANST to SCC for the Assets);
	 
	 	 	“Transfer Customers” means the SCL Customers to be referred and transferred to ANST
by SCL and/or its subsidiaries pursuant to Clause 5.2;
	 
	 	 	“Transfer Customer Confidential Information” means any Confidential Information of
or relating to any Transfer Customer;
	 
	 	 	“Transfer Plan” means the plan relating to the transfer of the Assets from SCC to
ANST set out in Appendix 3 (as may be amended and updated from time to time by mutual
agreement of SCC and ANST in writing);
	 
	 	 	“Transferred Revenues” in relation to a particular Year, means the aggregate
revenues of ANST for that Year for assembly and testing services provided by ANST arising
from orders received by ANST (including orders received through SCC) from the Transfer
Customers or any of them based on the aggregate amount invoiced by ANST to the Transfer
Customers for that Year for such services (excluding taxes and the value of wafers and
chips);
	 
	 	 	“US$” or “US Dollars” means the lawful currency of the United States of
America; and
	 
	 	 	“Year” means a calendar year commencing on 1 January and ending on 31





3









Table of Contents





		 	December.
	 
	1.2	 	Any reference in this Agreement, the Appendices or the Schedule to a statutory provision
shall include that provision and any regulations made in pursuance thereof as from time to
time modified or re-enacted.
	 
	1.3	 	The headings in this Agreement are inserted for convenience only and shall be ignored in
construing this Agreement. Unless the context otherwise requires, words (including
words defined in this Agreement) denoting the singular number only shall include the plural
and vice versa. The words “written” and “in writing”
include any means of visible reproduction and electronic mails. References to the
“Appendices”, “Schedule” and “Clauses” are to the appendices and
schedule to and clauses of this Agreement.
	 
	1.4	 	Any reference to “this Agreement” shall be deemed to be references to this Assets
Sale and Purchase Agreement.
	 
	1.5	 	The expression “subsidiary” shall mean any company in which a Party directly or
indirectly owns more than fifty percent (50%) of such company’s capital and voting rights of
such company.










	2.	 	AGREEMENT TO SELL THE ASSETS 
	 
	 	 	SCC shall sell as legal and beneficial owner and ANST shall purchase the Assets on an “as
is, where is” basis as at the Inspection Dates free from all Encumbrances as at the time of
Transfer at the Purchase Consideration and upon the terms and conditions hereinafter
contained.










	3.	 	PURCHASE CONSIDERATION
	 
	3.1	 	The aggregate consideration for the purchase of the Assets (the “Purchase
Consideration”) to be paid by ANST shall comprise the following:






	 	(i)	 	an amount of US$12,000,000 to be paid to SCC on the date of the execution of
this Agreement;
	 
	 	(ii)	 	an aggregate amount of US$23,000,000 (the “Balance Purchase
Consideration”) to be paid in installments from 2007 to 2010 on the last Business
Day of each Year from 2007 to 2010 (both Years inclusive) and the amount to be paid to
SCC each Year shall be calculated as follows:





	 	 	 	 	 	 	 	 	 	 	 	 	 
	 

	 	P
	 	=
	 	S
 

50,000,000
	 	×
	 	23,000,000
 

4
	 	 







Where:




P denotes the installment of the Balance Purchase Consideration payable for that
Year;



4









Table of Contents








S denotes the Transferred Revenues for the relevant Year; and




	 	(iii)	 	a balance amount equal to the difference between US$23,000,000 and the
aggregate amount paid under sub-paragraph (ii) (if such aggregate amount paid is
effectively less than US$23,000,000) to be paid to SCC on or before 31 December 2010.
For the avoidance of doubt, the aggregate of the amounts payable under Clauses 3.1(ii)
and 3.1(iii) shall not exceed US$23,000,000.






	3.2	 	Payments to be made by ANST to SCC in accordance with this Clause 3 shall be made in RMB in
the equivalent RMB amount (based on the US$ to RMB exchange
rate on the Business Day prior to the date of payment quoted by The Hongkong and Shanghai
Banking Corporation Limited, Singapore (or any successor entity thereof)) on the date of
payment by telegraphic transfer to a bank account in the PRC notified by SCC to ANST not
later than three (3) Business Days prior to the relevant payment date.
	 
	3.3	 	In the event that the cumulative Transferred Revenues for the Years 2007 to 2010 (both Years
inclusive) exceeds US$180,000,000, ANST shall pay the amount of US$5,000,000 to SCC on or
before 30 June 2011 (the “Additional Incentive Amount”), which amount is a goodwill
payment and does not form any part of the Purchase Consideration.










	4.	 	TRANSFERS OF ASSETS
	 
	4.1	 	The Parties agree and acknowledge that the representatives of ANST have on 16 and 17 April
2006 (“Inspection Dates”) inspected the Assets.
	 
	4.2	 	The Assets shall be transferred by SCC to ANST in such phases and in such manner as more
particularly set out in the Transfer Plan (as may be amended and updated from time to time by
mutual agreement of SCC and ANST in writing) and pursuant to each phase, the following shall
occur:






	 	(i)	 	ANST shall inspect the Assets to be transferred under such phase (the
“affected Assets”) on the date for the Transfer of such Assets for such phase
set out in the Transfer Plan (“Transfer Date”) for the sole purpose of
determining that the affected Assets are in the same condition as at the Inspection
Dates (ordinary wear and tear and deterioration through the effluxion of time
excepted);
	 
	 	(ii)	 	if such inspection by ANST confirms that the Assets are in the same condition
as at the Inspection Dates (ordinary wear and tear and deterioration through the
effluxion of time excepted), SCC shall de-install the affected Assets and upon
successful completion of the de-installation, ANST will deliver to SCC an acceptance
certificate confirming acceptance of the affected Assets under the Transfer
(“Acceptance Certificate”). For the avoidance of doubt, ANST shall not be
required to issue an Acceptance Certificate if the affected Assets are damaged in the
course of the de-installation;
	 
	 	(iii)	 	upon de-installation, the risks of the affected Assets under the Transfer
will pass to ANST;
	 
	 	(iv)	 	upon issuance of the Acceptance Certificate, the title to the affected Assets
under the Transfer will pass to ANST; and





5









Table of Contents








	 	(v)	 	ANST shall take all necessary steps to package, crate and transport the
affected Assets, as well as take out insurance coverage on the affected Assets.






	4.3	 	In the event of any non-delivery or shortfall of any of the Assets (“Undelivered
Assets”) in accordance with the Transfer Plan, SCC shall deliver to ANST such tools,
equipment and spare parts as are substantially similar to the Undelivered Assets within 45
days of the Transfer Date in relation to the Undelivered Assets or such other date as ANST and
SCC may mutually agree.
	 
	4.4	 	For the avoidance of doubt, SCC shall be entitled to utilise the Assets for their own benefit
and at their own risk up to and until the date on which the relevant Assets are to be
transferred to ANST under the Transfer Plan.










	5.	 	RESPONSIBILITIES AND OBLIGATIONS 
	 
	5.1	 	SCC shall:






	 	(i)	 	keep the Assets in reasonably good working condition, free from fire, free
from moisture and to secure the Assets before their Transfer;
	 
	 	(ii)	 	use commercially reasonable efforts to ensure that at the time of Transfer to
ANST, the condition of the Assets is substantially the same as the condition as at the
Inspection Dates (ordinary wear and tear and deterioration through the effluxion of
time excepted);
	 
	 	(iii)	 	for a period of 12 months commencing from the date of this Agreement, send
technical engineers to ANST to guide and help ANST install, test and commission the
Assets, at ANST’s sole cost and expense;
	 
	 	(iv)	 	for a period of 12 months commencing from the date of this Agreement, train
ANST engineers to use and maintain the Assets, at ANST’s sole cost and expense;
	 
	 	(v)	 	co-operate fully with ANST on implementing the Transfer Plan and the
de-commissioning, wipe-down, packaging, transport, reassembling, installing, testing,
facility quality guidelines, facility maintenance guidelines, related products process
flow and specifications plus quality assurance specifications and process flow of the
Assets; and
	 
	 	(vi)	 	for a period of 12 months commencing from the date of the completion of the
first Transfer, provide technical assistance to help bring the equipment up and
running and if necessary, to send its technical persons to ANST’s site to set up,
maintain and repair the Assets Transferred.






	5.2	 	SCC shall, and SCL shall procure that SCC shall, use commercially reasonable efforts (as if
SCC were in the position of ANST in receiving the benefits of having the SCL Customers), to
refer and transfer the Transfer Customers to ANST and to help the Transfer Customers qualify
ANST as soon as possible.
	 
	5.3	 	Subject to Clause 5.2 and the confidentiality agreements between SCC, SCL and/or its
subsidiaries with the respective Transfer Customers, SCC shall:






	 	(i)	 	for a period of 12 months commencing from the date of this Agreement, provide
to ANST such information and assistance as ANST may reasonably require




6









Table of Contents








	 	 	 	relating to the
Assets including, but not limited to, the Technical Specifications and all related
intellectual property for the Assets;
	 
	 	(ii)	 	for a period of 12 months commencing from the date of this Agreement, train
ANST engineers and staff members to assist in their familiarisation with the Technical
Specifications, at ANST’s sole cost and expense; and
	 
	 	(iii)	 	provide details of the name list, needs, business volume forecast and past
three (3) years business profiles of each Transfer Customer.






	5.4	 	ANST shall:






	 	(i)	 	work with SCC’s technical engineers on implementing the
Transfer Plan and the de-commissioning, wipe-down, packaging, transport, reassembling, installing,
testing, facility quality guidelines, facility maintenance guidelines, related
products process flow and specifications plus quality assurance specifications and
process flow of the Assets;
	 
	 	(ii)	 	use commercially reasonable efforts to promptly accept and confirm orders
from Transfer Customers and issue invoices to Transfer Customers for such orders;
	 
	 	(iii)	 	prepare and furnish to SCC within three (3) Business Days of the end of each
month, a monthly report setting out sufficient details of the aggregate Transferred
Revenues for that month, in form and substance satisfactory to SCC; and
	 
	 	(iv)	 	use commercially reasonable efforts to provide SCC and its officers,
employees, representatives and agents (collectively, the “Representatives”)
access to all its financial and operating data, books and records as SCC and/or its
Representatives may from time to time require, in connection with the verification of
the monthly reports referred to in sub-paragraph (iii) above.






	5.5	 	Each Party shall:






	 	(i)	 	at all times co-operate fully with the other Parties to improve, perfect,
execute and implement the Transfer Plan and to facilitate and expedite the Transfers;
and
	 
	 	(ii)	 	co-operate with the other Parties to obtain all local and national government
regulatory approvals, licenses and permits that are required for the consummation of
the transactions contemplated under this Agreement.






	5.6	 	The Parties shall agree on a plan for SCC to and SCC shall, in accordance with such plan,
send out technical engineers to ANST and use existing production lines in ANST to build skills
and processes, quality control and manufacturing process flow and specifications for the
Transfer Customers according to the requirements of SCC and the Transfer Customers.










	6.	 	WARRANTIES




7









Table of Contents








	6.1	 	Each Party hereby represents and warrants to and undertakes with the other Parties that:






	 	(i)	 	it has full power and capacity to enter into and perform this Agreement, and
this Agreement when executed will constitute valid and binding obligations,
enforceable in accordance with its terms; and
	 
	 	(ii)	 	the execution and delivery of, and the performance by it of its obligations
under, this Agreement will not:






	 	(a)	 	result in a breach of any provision of its memorandum or
articles of association or constitutional documents or any agreement to which
it is a party; or
	 
	 	(b)	 	result in a breach of any order, judgment or decree of any
court, governmental agency or regulatory body to which it is a party or by
which it is bound.






	6.2	 	Each of SCL and SCC hereby warrants to ANST that:






	 	(i)	 	SCC is the legal and beneficial owner of the Assets; and
	 
	 	(ii)	 	the Assets are or will at the time of the relevant Transfer or delivery
pursuant to Clause 4.3 (as the case may be) be free from all Encumbrances.






	6.3	 	Each of CRL and ANST agrees and acknowledges that the Assets are to be sold and purchased on
an “as is, where is” basis as at the Inspection Dates and that SCC has not given any
warranties, representations, covenants or undertakings in respect of the Assets, including
without limitation any relating to description performance, merchantability, fitness for any
use or purpose, value, condition, performance, maintenance, specification or design, of the
whole or any part of the Assets save for the warranties expressly set out in this Agreement.










	7.	 	NON-SOLICITATION 
	 
	7.1	 	Each of CRL and ANST jointly and severally covenants with and undertakes to SCC that it shall
not, and shall procure that none of the subsidiaries of CRL shall, without the prior written
consent of SCC, at any time induce or attempt to induce any person who is at the time of this
Agreement or who later becomes an employee of SCC or any of its Related Corporations in their
businesses to terminate his or her employment with SCC or its Related Corporations (as the
case may be).
	 
	7.2	 	SCC covenants with and undertakes to ANST that:






	 	(i)	 	it shall not solicit, entertain, discuss, negotiate or finalise any
arrangements with any third party with a view to or in connection with any acquisition
or purchase of all or part of the Assets; and
	 
	 	(ii)	 	it and its subsidiaries shall not directly or indirectly, solicit any offers
or proposals from any person relating to any sale or acquisition of all or part of the





8









Table of Contents







	 	 	 	Assets or enter into or continue any discussion or negotiation in respect of Clause
7.2(i).










	8.	 	CRL GUARANTEE
	 
	8.1	 	In consideration of SCC agreeing, at the request of CRL and ANST, to enter into this
Agreement, CRL hereby guarantees and undertakes to SCC the due and punctual payment to SCC
and/or its nominee(s) of the Balance Purchase Consideration and the Additional Incentive
Amount when due and payable under this Agreement (the “CRL Guarantee”) and
accordingly, in the event that ANST is unable to perform any of its payment obligations to pay
the Balance Purchase Consideration and/or the Additional Incentive Amount within 60 days after
the due date in relation to such payment obligation, CRL shall forthwith perform such
obligation to pay.
	 
	8.2	 	The CRL Guarantee is a continuing guarantee and shall remain in full force and effect until
(a) all the payment obligations of ANST in relation to the Balance Purchase Consideration and
the Additional Incentive Amount expressed or contemplated herein shall have been performed in
full or discharged or (b) until 61 days after 30 June 2011, whichever is earlier, and are in
addition to and not in substitution for any other rights which SCC may have under or by virtue
of this Agreement. CRL shall not be exonerated or discharged from liability under the CRL
Guarantee by time being given to ANST by SCC or by any other indulgence or concession to any
person granted by SCC and time given to ANST by SCC or any other indulgence or concession
granted by SCC to any person shall not be construed as a waiver of any of the rights of SCC
under this Agreement.










	9.	 	SCL GUARANTEE
	 
	9.1	 	In consideration of CRL agreeing, at the request of SCL and SCC, to enter into this
Agreement, SCL hereby guarantees and undertakes to ANST the due and punctual performance by
SCC of its obligations under Clauses 5.2, 5.3 and 6.2 (the “SCL Guarantee”) and accordingly,
in the event that SCC is unable to perform any of its obligations under Clauses 5.2, 5.3 or
6.2, SCL shall forthwith perform such obligation.
	 
	9.2	 	This SCL Guarantee is a continuing guarantee and shall remain in full force and effect until
all the obligations of SCC under Clauses 5.2, 5.3 and 6.2 shall have been performed in full or
until 30 June 2011, whichever is earlier.










	10.	 	ANNOUNCEMENTS
	 
	 	 	Save as may be required to be disclosed pursuant to any applicable laws or to any
requirement of any competent governmental or statutory authority or rules or regulations of
any relevant regulatory, administrative or supervisory body (including, without limitation,
any relevant stock exchange or securities council), none of the Parties shall make or
authorise the making of any announcement concerning the subject matter of this Agreement
unless the other Parties shall have given their written consent to such announcement (such
consent not to be unreasonably withheld).





9









Table of Contents














	11.	 	STAMP DUTY
	 
	 	 	All stamp duty payable (if any) on this Agreement or any other document executed or to be
executed pursuant to this Agreement shall be borne equally by the Parties.










	12.	 	COSTS AND EXPENSES
	 
	12.1	 	The applicable taxes payable in the PRC (including the value added taxes) on the sale of the
Assets and the cost and expenses of the de-installation of the Assets shall be borne by SCC.
The entire costs and expenses (including taxes and duties) arising from the packaging,
crating, transportation and all applicable insurance coverage on the Assets shall be borne by
ANST.
	 
	12.2	 	Save as otherwise provided in this Agreement, each Party shall bear its own legal,
professional and other costs and expenses incurred by it in connection with the negotiation,
preparation or completion of this Agreement.










	13.	 	CONFIDENTIALITY
	 
	13.1	 	The Parties shall (and shall procure that its agents and where applicable its officers and
employees shall) at all times use all reasonable endeavours to keep confidential any
Confidential Information which it may acquire in relation to any other Party or in relation to
the clients, business or affairs of any other Party and shall not use or disclose such
information to any other person except with the consent of that other party or in accordance
with the order of a court of competent jurisdiction or of any governmental or regulatory
authority (whether in Singapore or elsewhere).




10









Table of Contents








	13.2	 	Notwithstanding Clause 13.1, the confidentiality obligation shall not apply to:






	 	(a)	 	any information obtained from any Party which becomes generally known to the
public, other than by reason of any willful or negligent act or omission of any party
hereto or any of their agents, advisers, directors, officers, employees or
representatives;
	 
	 	(b)	 	any information which is required to be disclosed pursuant to any applicable
laws or to any competent governmental or statutory authority or pursuant to rules or
regulations of any relevant regulatory, administrative or supervisory body (including,
without limitation, any relevant stock exchange or securities council);
	 
	 	(c)	 	any information disclosed by any of the Parties to their respective bankers,
financial advisers, consultants and legal or other advisers for the purpose of this
Agreement;
	 
	 	(d)	 	any information disclosed by a Party to the directors, officers, employees,
agents, advisors or investors of that Party and/or subsidiaries of that Party; and
	 
	 	(e)	 	any information which is Transfer Customer Confidential Information which is
subject to confidentiality undertakings entered into between ANST and each such
Transfer Customer.






	13.3	 	Without prejudice to the generality of the foregoing, ANST shall, and CRL shall procure that
ANST shall, save where the Transfer Customer agrees otherwise:






	 	(a)	 	use Transfer Customer Confidential Information strictly for ANST’s businesses
and operations in outsource foundry assembly and testing; and
	 
	 	(b)	 	set up “firewalls” and implement other measures and processes to ensure that
no Transfer Customer Confidential Information will be leaked outside of ANST and such
measures shall include, without limitation, ensuring that the Transfer Customer
Confidential Information may only be disclosed to such of the directors, officers or
employees of ANST who are directly concerned with the business and operation of ANST
and whose knowledge of such information is required for such purpose and who (prior to
such disclosure) are bound by a confidentiality undertaking to the same extent as the
undertaking contained in this Clause 13.3.






Each of CRL and ANST further acknowledges that SCC shall be entitled to equitable relief,
including injunction, in the event of any breach or threatened breach of the provisions of
the undertaking contained in this Clause 13.3.




	13.4	 	Each of CRL and ANST shall jointly and severally hold harmless and indemnify SCC, its
directors, officers, employees and representatives for any costs, claims, demands losses or
liabilities of whatsoever nature arising directly or indirectly out of a breach of Clause
13.3. The aggregate liability of CRL and ANST for breaches of Clause 13.3 of this Agreement,
Clause 24.3 of the Joint Venture Agreement and Clause 14.3 of the Manufacturer’s
Representative’s Agreement (the “Confidentiality Obligations”) and all matters
relating to or arising in connection with the subject matter of the Confidentiality
Obligations, whether based on an action or claim in contract, tort or otherwise, shall not
exceed US$5,000,000.




11









Table of Contents






	13.5	 	While the restrictions contained in Clause 13.3 are considered by the Parties to be
reasonable in all circumstances, it is recognised that such restrictions may fail for
technical reasons unforeseen and accordingly, it is hereby agreed and declared that if any
such restrictions shall be adjudged to be void as going beyond what is reasonable in all the
circumstances for the protection of the interests of SCL and/or its Related Corporations but
would be valid if part of the wording thereof were deleted or the periods (if any) thereof
were reduced or the range of activities or areas dealt with thereby were reduced in scope, the
said restrictions shall apply with such modifications as may be necessary to make them valid
and effective.
	 
	13.6	 	CRL and ANST acknowledge that no right or license is granted by SCC or SCL in relation to any
Transfer Customer Confidential Information.
	 
	13.7	 	The obligations contained in this Clause shall endure, notwithstanding the termination of
this Agreement, without limit in point of time except and until any confidential information
enters the public domain as set out above.










	14.	 	GENERAL
	 
	14.1	 	This Agreement shall be binding upon and enure for the benefit of the permitted successors of
the Parties.
	 
	14.2	 	Unless otherwise agreed in writing by the Parties, none of the Parties shall be entitled to
assign this Agreement or any of its rights and obligations hereunder except that CRL may
assign and transfer its rights and obligations under this Agreement in the manner set out in
Clause 14.3 below.
	 
	14.3	 	The Parties acknowledge that CRL may, but shall not be obliged to undertake an internal
corporate restructuring exercise involving CRL and its Related Corporations but not involving
any change of ultimate shareholding control of CRL (a “Restructuring Exercise”). The
Parties hereby agree that notwithstanding Clause 14.2, CRL may (but shall not be obliged to)
transfer or assign its rights and obligations under this Agreement to its successor entity
pursuant to the Restructuring Exercise (“CRL Successor Entity”) and no consent shall
be required from any Party in respect of such assignment or transfer of CRL’s rights and
obligations Provided that (i) such CRL Successor Entity’s net asset value (total assets minus
total liabilities (excluding shareholders’ equity)) at the time of such assignment or transfer
of CRL’s rights and obligations shall not be less than CRL’s net asset value (total assets
minus total liabilities (excluding shareholders’ equity)) as of the date of this Agreement,
based on CRL’s audited accounts for the financial year ended 31 December 2005; and (ii) not
less than one (1) month prior to any such assignment or transfer, CRL has permitted SCC’s
independent external auditors to, at the sole cost and expense of CRL, undertake a limited
review of the financial statements of CRL Successor Entity for the sole purpose of determining
its net asset value. The opinion of SCC’s independent external auditors shall be final,
conclusive and binding on CRL and SCC.




12









Table of Contents








	14.4	 	The provisions of this Agreement (insofar as the same shall not have been fully performed at
each Transfer) shall remain in full force and effect notwithstanding each Transfer. The
Transfers shall not prejudice any rights of any of the Parties which may have accrued
hereunder prior to each Transfer or payment of the Purchase Consideration or any part thereof.
	 
	14.5	 	The Parties shall do and execute or procure to be done and executed all such further acts,
deeds, things and documents as may be necessary to give effect to the terms of this Agreement.
	 
	14.6	 	This Agreement, and the documents referred to in it, constitute the entire agreement and
understanding between the Parties relating to the subject matter of this Agreement and none of
the Parties has entered into this Agreement in reliance upon any representation, warranty or
undertaking of any other Party which is not set out or referred to in this Agreement. The
Parties agree that no variations or modifications shall be made to this Agreement unless
agreed to by the Parties in writing. Nothing in this Clause 14.6 shall however operate to
limit or exclude liability for fraud.
	 
	14.7	 	Save as expressly provided herein, any right of termination conferred upon a Party shall be
in addition to and without prejudice to all other rights and remedies available to it and no
exercise or failure to exercise such a right of termination shall constitute a waiver of any
such other right or remedy.
	 
	14.8	 	As all Parties have participated in the drafting of this Agreement, the Parties agree that
any applicable rule requiring the construction of this Agreement or any provision hereof
against any Party drafting this Agreement shall not apply.










	15.	 	ILLEGALITY
	 
	 	 	The illegality, invalidity or unenforceability of any provision of this Agreement under the
law of any jurisdiction shall not affect its legality, validity or enforceability under the
law of any other jurisdiction nor the legality, validity or enforceability of any other
provision.










	16.	 	NOTICES
	 
	16.1	 	Any notice required to be given by a Party to the other Parties shall be deemed validly
served by hand delivery or by telefax or by prepaid registered letter or by a recognised
courier service sent to its address or facsimile number given herein or such other address or
facsimile number as may from time to time be notified for this purpose. The initial addresses
and telefax numbers of the Parties are:





13









Table of Contents











	 	 	 	 	 	 
	 	SCC

	 	:
	 	STATS ChipPAC Shanghai Co., Ltd.
	 	 
	 	 	 	 
	 	Fax Number

	 	:
	 	+65 6720 7829
	 	 
	 	 	 	 
	 	Address

	 	:
	 	10 Ang Mo Kio Street 65 Techpoint #05-17/20 Singapore 569059
	 	 
	 	 	 	 
	 	Attention

	 	:
	 	Mr. Choong, Chan Yong, Vice President, Corporate Strategy
	 	 
	 	 	 	 
	 	With a copy to

	 	:
	 	Ms. Taylor, Janet, General Counsel
	 	 
	 	 	 	 
	 	SCL

	 	:
	 	STATS ChipPAC Ltd.
	 	 
	 	 	 	 
	 	Fax Number

	 	:
	 	+65 6720 7829
	 	 
	 	 	 	 
	 	Address

	 	:
	 	10 Ang Mo Kio Street 65 Techpoint #05-17/20 Singapore 569059
	 	 
	 	 	 	 
	 	Attention

	 	:
	 	Mr. Choong, Chan Yong, Vice President, Corporate Strategy
	 	 
	 	 	 	 
	 	With a copy to

	 	:
	 	Ms. Taylor, Janet, General Counsel
	 	 
	 	 	 	 
	 	ANST

	 	:
	 	Wuxi CR Micro-Assemb Tech. Ltd.
	 	 
	 	 	 	 
	 	Fax Number

	 	:
	 	+86 510 5804647
	 	 
	 	 	 	 
	 	Address

	 	:
	 	14 LiangXi Road, Bin Hu District, Wuxi, Jiangsu Province, PRC
	 	 
	 	 	 	 
	 	Attention

	 	:
	 	Mr. Zhang Xiao Jian, Director
	 	 
	 	 	 	 
	 	CRL

	 	 	 	China Resources Logic Limited
	 	 
	 	 	 	 
	 	Fax Number

	 	:
	 	+852 2299 9311
	 	 
	 	 	 	 
	 	Address

	 	:
	 	Rooms 4003-6, 40/F., China Resources Building, 26
Harbour Road, Wanchai, Hong Kong
	 	 
	 	 	 	 
	 	Attention

	 	:
	 	Mr. Wang Guoping, Director and Chief Executive Officer







	16.2	 	Any such notice or communication shall be deemed to have been served:






	 	(a)	 	if delivered by hand, at the time of delivery; or
	 
	 	(b)	 	if posted by prepaid ordinary mail, at the expiration of three (3) days
after the envelope containing the same shall have been put into the post; or
	 
	 	(c)	 	if sent by facsimile, upon the receipt by the sender of the transmission
report indicating that the notice or communication has been sent in full to the
recipient’s facsimile machine, or such other similar medium of receipt; or
	 
	 	(d)	 	if sent by courier, at the expiration of two (2) days after the package
containing the same shall have been received by the relevant courier company.





14









Table of Contents









	16.3	   	In proving such service it shall be sufficient to prove that delivery by hand was made or
that the envelope containing such notice or document was properly addressed and posted as a
prepaid ordinary mail letter or that the facsimile confirmation note
indicates the transmission was successful, or, as the case may be, the package containing
such notice or document was properly addressed and sent to the relevant courier company.











	17.	 	REMEDIES AND WAIVERS
	 
	 	 	No failure on the part of any Party to exercise, and no delay on its part in exercising,
any right or remedy under this Agreement will operate as a waiver thereof, nor will any
single or partial exercise of any right or remedy preclude any other or further exercise
thereof or the exercise of any other right or remedy. The rights provided in this
Agreement are cumulative and not exclusive of any rights or remedies provided by law.










	18.	 	TIME OF ESSENCE
	 
	 	 	Any date, time or period mentioned in any provision of this Agreement may be extended by
mutual agreement among the Parties but as regards any time, date or period originally
fixed and not extended or any time, date or period so extended as aforesaid time shall be
of the essence.










	19.	 	FORCE MAJEURE
	 
	 	 	Save as is otherwise specifically provided in this Agreement, the Parties shall not be
liable for failures or delays in performing their obligations hereunder arising from any
cause beyond their control, including but not limited to acts of God, acts of civil or
military authority, fires, strikes, lockouts or labour disputes, epidemics, governmental
restrictions, wars, riots, earthquakes, storms, typhoons, floods and breakdowns in
electronic and computer information and communications systems and in the event of any
such delay the time for any Party’s performance shall be extended for a period equal to
the time lost by reason of the delay which shall be remedied with all due despatch in the
circumstances. Any Party who becomes aware of any event arising under this Clause shall
notify the other Parties in writing promptly.










	20.	 	COUNTERPARTS
	 
	 	 	This Agreement may be signed in any number of counterparts, all of which taken together
shall constitute one and the same instrument. Any Party may enter into this Agreement by
signing any such counterpart and each counterpart may be signed and executed by the
Parties and transmitted by facsimile transmission and shall be as valid and effectual as
if executed as an original.










	21.	   	GOVERNING LAW AND ARBITRATION
	 
	21.1	   	This Agreement shall be governed by, and construed in accordance with, the laws of the PRC.
This Agreement is made out in six (6) originals in Chinese and four (4)





15









Table of Contents











originals in English.
Both language versions shall have equal legal force provided that if there is a conflict
between them the English version shall take precedence.




	21.2	 	In case any dispute or difference shall arise between the Parties as to the construction of
this Agreement or as to any matter of whatsoever nature arising thereunder or in connection
therewith, including any question regarding its existence, validity or termination, such
dispute or difference shall be submitted to a single arbitrator to be appointed by the
Chairman for the time being of the CIETAC. Such submission shall be a submission to
arbitration in accordance with the CIETAC Rules by which the Parties agree to be so bound.
The place of arbitration shall be Shanghai and the arbitration shall be conducted wholly in
the English language. The prevailing Party in the arbitration shall be entitled to receive
reimbursement of its reasonable legal fees incurred in connection therewith.





16









Table of Contents









APPENDIX 1








ASSETS





17









Table of Contents






Transferred Assembly Equipment Summary




	 	 	 	 	 	 	 	 	 	 	 	 	 
	 	 	 	 	MOU	 	 	 	 	 	 	Haved added to Total by ANST
	Core equipment confirmation	 	 	List	 	 	Core	 	Total	 	request (SCC agreeed)
	BG	 	Disco 850
	 	 	0	 	 	1	 	1	 	 
	 	 	Wafer mount ATM 8100=1,
	 	 	1	 	 	1	 	1	 	 
	 	 	manual wafer mount=1
	 	 	1	 	 	1	 	1	 	 
	DS	 	DISCO 640=7, DISCO641=2, DISCO651=2
	 	 	11	 	 	8	 	11	 	 
	 	 	Manual wafer clean=3
	 	 	1	 	 	1	 	0	 	 
	 	 	CO2 bubbles
	 	 	3	 	 	3	 	4	 	1
	 	 	Diama flow
	 	 	2	 	 	2	 	2	 	 
	DA	 	ASM889=15, ESEC2007=38
	 	 	37	 	 	39	 	53	 	 
	 	 	Die Coat
	 	 	2	 	 	2	 	2	 	 
	Oven	 	DA cure
	 	 	5	 	 	5	 	7	 	 
	 	 	PMC
	 	 	6	 	 	6	 	8	 	 
	WB	 	KnS1488=47
	 	 	47	 	 	16	 	47	 	 
	 	 	Shikawa UTC200=53
	 	 	53	 	 	53	 	53	 	 
	 	 	Shikawa UTC250=191
	 	 	191	 	 	108	 	169	 	-22
	 	 	Kns 8028=12
	 	 	12	 	 	12	 	12	 	 
	3rd opt	 	3rd Inspection mc
	 	 	5	 	 	5	 	5	 	 
	 	 	Microvision for PDIP/SOIC150mil
	 	 	6	 	 	0	 	0	 	 
	 	 	Low power scope
	 	 	0	 	 	10	 	10	 	 
	 	 	High power scope
	 	 	0	 	 	1	 	2	 	1
	 	 	Ball shear/WP
	 	 	0	 	 	1	 	2	 	1
	MOLD	 	Manual press=22
	 	 	22	 	 	22	 	26	 	4
	 	 	Preheater=22
	 	 	22	 	 	22	 	26	 	4
	 	 	Auto mold system=15
	 	 	16	 	 	16	 	16	 	1 (Added in 19 May 06)
	 	 	Mold die
	 	 	79	 	 	78	 	134	 	 
	Marking	 	Laser marker
	 	 	 	 	 	Total	 	18	 	 
	 	 	Pad print marking
	 	 	26	 	 	marking	 	6	 	 
	 	 	Pad engraver
	 	 	 	 	 	26	 	1	 	 
	 	 	Laser deflash
	 	 	 	 	 	 	 	1	 	 
	 	 	X-ray for mold
	 	 	0	 	 	1	 	1	 	 
	 	 	Profile projector
	 	 	0	 	 	1	 	1	 	 
	Plating	 	plating mc pure tin=3, solder=1
	 	 	4	 	 	4	 	4	 	 
	Trim/form	 	 
	 	 	 	 	 	 	 	 	 	 
	 	 	Trim/form system (Manual+auto)
	 	 	42	 	 	40	 	59	 	 
	 	 	Trim.form die sets (manual+auto)
	 	 	101	 	 	80	 	90	 	 
	 	 	Lead scan (PDIP/SOIC150mils)
	 	 	2	 	 	0	 	1	 	 
	 	 	Lead straightener
	 	 	3	 	 	3	 	3	 	 
	 	 	C-SAM
	 	 	0	 	 	 	 	1	 	1
	 	 	 
	 	 	700	 	 	568	 	778	 	 
	 
	Same as number shown in the equipment list in MOU	 	 	Agreed number on Core mc needed	 	Total mc checked
	 	 	699	 	 	     567	787	 	 	4/17/2006
	 	 	699	 	 	     567	777	 	 	 
------>4-21 updated (Have added to Total by
ANST request (SCC agreeed))




 











Table of Contents










	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	1	 	CO2	 	CO2 BUBBLER M/C	 	RC2000ACDS	 	40000841	 	2000.08.20
	2	 	CO2	 	CO2 BUBBLER M/C	 	RC-2000 ACD	 	40000840	 	2000.08.20
	3	 	CO2	 	CO2 BUBBLER M/C	 	RC-2000 ACD	 	40003185	 	2004.09.15
	4	 	CO2	 	CO2 BUBBLER M/C	 	RC-2000 ACD	 	40002225	 	2002.09.16
	1	 	DIAMAFLOW	 	DP 037	 	ADS2-M	 	40003639	 	2006.02.25
	2	 	DIAMAFLOW	 	DP 038	 	ADS2-M	 	 	 	 
	1	 	DIE ATTACH	 	AD 889 HIGH SPEED AUTOMATIC DI	 	AD 889	 	40000829	 	2000.08.20
	2	 	DIE ATTACH	 	AD 889 HIGH SPEED AUTOMATIC DI	 	AD 889	 	40002967	 	2004.04.23
	3	 	DIE ATTACH	 	AD 889 HIGH SPEED AUTOMATIC DI	 	AD 889	 	40000828	 	2000.08.20
	4	 	DIE ATTACH	 	AD 889 HIGH SPEED AUTOMATIC DI	 	AD 889	 	40000638	 	2000.11.30
	5	 	DIE ATTACH	 	AD 889 HIGH SPEED AUTOMATIC DI	 	AD 889	 	40000636	 	2000.11.30
	6	 	DIE ATTACH	 	AD 889 HIGH SPEED AUTOMATIC DI	 	AD 889	 	40000633	 	2000.11.30
	7	 	DIE ATTACH	 	AD 889 HIGH SPEED AUTOMATIC DI	 	AD 889	 	40000634	 	2000.11.30
	8	 	DIE ATTACH	 	AD 889 HIGH SPEED AUTOMATIC DI	 	AD 889	 	40002966	 	2004.04.23
	9	 	DIE ATTACH	 	AD 889 HIGH SPEED AUTOMATIC DI	 	AD 889	 	40000635	 	2000.11.30
	10
	 	DIE ATTACH	 	AUTOMATIC DIE BONDER	 	AD889	 	40000646	 	2000.12.30
	11
	 	DIE ATTACH	 	AUTOMATIC DIE BONDER	 	AD889	 	40000645	 	2000.12.30
	12
	 	DIE ATTACH	 	ICT:DIE MOUNTER	 	AD889	 	40000637	 	2000.11.30
	13
	 	DIE ATTACH	 	ICT:DIE MOUNTER	 	AD889	 	40000643	 	2000.12.30
	14
	 	DIE ATTACH	 	ICT:DIE MOUNTER	 	AD889	 	40002969	 	2004.04.23
	15
	 	DIE ATTACH	 	ICT:DIE MOUNTER	 	AD889	 	40002968	 	2004.04.23
	16
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40000465	 	1997.12.31
	17
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40000466	 	1997.12.31
	18
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40000469	 	1997.12.31
	19
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40000384	 	1997.10.31
	20
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40000468	 	1997.12.31
	21
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40000470	 	1997.12.31
	22
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40000474	 	1997.12.31
	23
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40000473	 	1997.12.31
	24
	 	DIE ATTACH	 	ESEC2007 BGA DIE BONDER	 	ESEC 2007IC-8	 	40000472	 	1997.12.31
	25
	 	DIE ATTACH	 	ESEC2007 BGA DIE BONDER	 	ESEC 2007IC-8	 	40001596	 	2002.02.25
	26
	 	DIE ATTACH	 	ESEC2007 BGA DIE BONDER	 	ESEC 2007IC-8	 	40001749	 	2001.11.25
	27
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40001746	 	2001.11.25
	28
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40001747	 	2001.11.25
	29
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40001748	 	2001.11.25
	30
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40001750	 	2001.11.25
	31
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007BGA	 	40002590	 	2003.07.25
	32
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007BGA	 	40002591	 	2003.07.25
	33
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007BGA	 	40002592	 	2003.07.25
	34
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007IC-8	 	40002504	 	2003.04.26
	35
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007IC-8	 	40002503	 	2003.04.26
	36
	 	DIE ATTACH	 	ICT:DIE BONDER	 	ESEC 2007IC-8	 	40002501	 	2003.04.26
	37
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 IC-8	 	40002502	 	2003.04.26
	38
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000839	 	2000.08.20
	39
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000832	 	2000.08.20
	40
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000834	 	2000.08.20
	41
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000838	 	2000.08.20
	42
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000830	 	2000.08.20
	43
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000836	 	2000.08.20
	44
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000835	 	2000.08.20
	45
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000837	 	2000.08.20
	46
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000831	 	2000.08.20
	47
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40000833	 	2000.08.20
	48
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007 HS	 	40002094	 	2002.07.27
	49
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007IC-8	 	40002701	 	2003.10.25
	50
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007IC-8	 	40002770	 	2003.12.30
	51
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007IC-8	 	40002769	 	2003.12.30
	52
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007IC-8	 	40002919	 	2004.03.27
	53
	 	DIE ATTACH	 	AUTO DIE BONDER	 	ESEC 2007IC-8	 	40002983	 	2004.04.24
	1	 	DIE COAT	 	DIE COATING M/C	 	L1500	 	40000386	 	1997.10.31
	2	 	DIE COAT	 	DIE COATER	 	 	 	40001534	 	2001.11.26
	1	 	DIE SAW	 	DICING SAW SYSTEM	 	DFD640	 	40000454	 	1997.12.31
	2	 	DIE SAW	 	DICING SAW SYSTEM	 	DFD640	 	40000455	 	1997.12.31
	3	 	DIE SAW	 	DICING SAW SYSTEM	 	DFD640	 	40000459	 	1997.12.31
	4	 	DIE SAW	 	DICING SAW SYSTEM	 	DFD640	 	40000458	 	1997.12.31
	5	 	DIE SAW	 	DICING SAW SYSTEM	 	DFD640	 	40000460	 	1997.12.31
	6	 	DIE SAW	 	ICT:DICING SAW	 	DFD640	 	40002021	 	2002.05.25
	7	 	DIE SAW	 	ICT:DIE SAW	 	DFD640	 	40002981	 	2004.04.24
	8	 	DIE SAW	 	DP 067	 	DFD641	 	40000640	 	2000.11.30
	9	 	DIE SAW	 	DP 076	 	DFD641	 	40000639	 	2000.11.30
	10
	 	DIE SAW	 	DFD 641 FULLY AUTOMATIC DICING	 	DFD 651	 	40001517	 	2001.08.23
	11
	 	DIE SAW	 	DFD 641 FULLY AUTOMATIC DICING	 	DFD 651	 	40003035	 	2001.08.23
	1	 	INSPECTION	 	3RD INSPECTION M/C	 	PD24	 	40000558	 	1997.12.31
	2	 	INSPECTION	 	3RD INSPECTION M/C	 	PS28W	 	40000554	 	1997.12.31
	3	 	INSPECTION	 	3RD INSPECTION M/C	 	PD8/14/16	 	40000557	 	1997.12.31
	4	 	INSPECTION	 	3RD INSPECTION M/C	 	PD8/14/16	 	40000561	 	1997.12.31
	5	 	INSPECTION	 	3RD INSPECTION M/C	 	PD	 	40000556	 	1997.12.31
	1	 	LEAD SCAN	 	LEAD SCANNING FOR SOIC 150MIL	 	851	 	40000695	 	1999.06.30






 









Table of Contents







	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	1	 	LEAD STRAIGHTENER	 	AT-1045FP	 	SOIC150MIL	 	40000700	 	1999.08.31
	2	 	LEAD STRAIGHTENER	 	AT-300-RDS	 	PDIP300MIL	 	40000702	 	1999.08.31
	3	 	LEAD STRAIGHTENER	 	AT-600-RDS	 	PDIP600MIL	 	40000701	 	1999.08.31
	1	 	MARK	 	LASER M/K SYSTEM	 	SY95-02	 	40001341	 	1997.12.31
	2	 	MARK	 	AUTO YAG LASER M/K	 	DLM818SV	 	40001334	 	1997.07.31
	3	 	MARK	 	AUTO LASER M/K SYSTEM	 	DLM818SV	 	40001333	 	1997.07.31
	4	 	MARK	 	AUTO LASER M/K SYSTEM	 	DLM818SV	 	40000564	 	1998.05.31
	5	 	MARK	 	AUTO PAD MARKING M/C	 	DPM513HSV	 	40000598	 	1998.05.31
	6	 	MARK	 	AUTO PAD MARKING M/C	 	DPM513HSV	 	40000595	 	1998.05.31
	7	 	MARK	 	AUTO PAD M/K SYSTEM	 	PLCC 28LD	 	40000597	 	1998.05.31
	8	 	MARK	 	PAD MARKER	 	MARKEM 534	 	40000596	 	1998.05.31
	9	 	MARK	 	LASER MARKING M/C	 	SLD-402	 	40001691	 	2001.06.21
	10
	 	MARK	 	AUTO YAG M/K SYSTEM	 	PDIP/SOIC	 	40000145	 	1995.12.31
	11
	 	MARK	 	AUTO YAG M/K SYSTEM	 	PDIP/SOIC	 	40000683	 	1999.04.10
	12
	 	MARK	 	AUTO YAG M/K SYSTEM	 	PDIP/SOIC	 	40000682	 	1999.04.10
	13
	 	MARK	 	YAG LASER M/K SYS	 	DLM818SV	 	40000566	 	1998.05.31
	14
	 	MARK	 	YAG LASER M/K SYS	 	DLM818SV	 	40000565	 	1998.05.31
	15
	 	MARK	 	LASER MARKER AND PARTS	 	SLD402	 	40001690	 	2001.06.21
	16
	 	MARK	 	AUTO STRIP LASER MARKING M/C	 	AT1817	 	40000648	 	2000.12.30
	17
	 	MARK	 	AUTO STRIP LASER MARKING M/C	 	AT1818	 	40001689	 	2001.05.28
	18
	 	MARK	 	ICT:LASER MARKING SYSTEM(JIT)	 	LEADED PKG	 	40002023	 	2002.05.25
	19
	 	MARK	 	KOSES LASER DEFLASHER FOR EDP	 	KDM600	 	40002299	 	2002.10.25
	20
	 	MARK	 	SDL PLATE MARKE	 	MARKEM612	 	40000684	 	1999.04.10
	21
	 	MARK	 	LASER MARKING SYSTEM(STRIP MAR	 	SLD-402/100	 	40000623	 	1995.12.31
	22
	 	MARK	 	AUTO LASER MARK M/C	 	EO LASER(SY9502)	 	40003189	 	2004.09.16
	23
	 	MARK	 	AUTO LASER MARK M/C	 	EO LASER(SY9502)	 	40001332	 	1997.06.30
	24
	 	MARK	 	AUTO PAD MARK M/C	 	TECA	 	40001330	 	1997.04.30
	25
	 	MARK	 	AUTO PAD MARK M/C	 	TECA	 	40000699	 	1999.08.31
	26
	 	MARK	 	LASER MARKING SYSTEM	 	SLD-402/100	 	40001506	 	2000.08.20
	1	 	MOLD AUTO	 	TOWA AUTO MOLD	 	 Y-1  4F	 	40000588	 	1998.05.31
	2	 	MOLD AUTO	 	TOWA AUTO MOLD	 	 Y-1  4F	 	40000589	 	1998.05.31
	3	 	MOLD AUTO	 	TOWA AUTO MOLD	 	Y-1 8F	 	40000657	 	1999.03.31
	4	 	MOLD AUTO	 	TOWA AUTO MOLD	 	 Y-1 8F	 	40000772	 	2000.05.28
	5	 	MOLD AUTO	 	TOWA AUTO MOLD	 	Y-1 8F	 	40000771	 	2000.05.28
	6	 	MOLD AUTO	 	TOWA AUTO MOLD	 	 Y-1 4F	 	40000658	 	1999.03.31
	7	 	MOLD AUTO	 	ASM  AUTO MOLD	 	ES649 4F	 	40000665	 	1999.04.10
	8	 	MOLD AUTO	 	ASM  AUTO MOLD	 	 ES649 4F	 	40000664	 	1999.04.10
	9	 	MOLD AUTO	 	ASM  AUTO MOLD	 	EM649 4F	 	40000667	 	1999.04.10
	10
	 	MOLD AUTO	 	TOWA AUTO MOLD	 	 Y-1E 8F	 	40000647	 	2000.12.30
	11
	 	MOLD AUTO	 	TOWA AUTO MOLD	 	 Y-1 8F	 	40001778	 	2001.12.23
	12
	 	MOLD AUTO	 	TOWA AUTO MOLD	 	 Y-1 8F	 	40001779	 	2001.12.23
	13
	 	MOLD AUTO	 	TOWA AUTO MOLD	 	 Y-1 8F	 	40001906	 	2001.07.29
	14
	 	MOLD AUTO	 	TOWA AUTO MOLD	 	 Y-1 8F	 	40001777	 	2001.12.23
	15
	 	MOLD AUTO	 	TOWA AUTO MOLD	 	Y-1 8F	 	40001987	 	2002.03.26
	16
	 	MOLD AUTO	 	TOWA AUTO MOLD	 	UPS120NEL 4F	 	40001925	 	1995
	1	 	MOLD	 	MOLD DIE	 	PDIP8M	 	40003100	 	2004.07.23
	2	 	MOLD	 	MOLD DIE	 	PDIP8M	 	40003101	 	2004.07.23
	3	 	MOLD	 	MOLD DIE	 	PDIP8M	 	40002386	 	2002.12.28
	4	 	MOLD	 	MOLD DIE	 	PDIP8M	 	40002387	 	2002.12.28
	5	 	MOLD	 	MOLD DIE	 	PDIP8M	 	40003100	 	2004.07.23
	6	 	MOLD	 	MOLD DIE	 	PDIP8M	 	40003101	 	2004.07.23
	7	 	MOLD	 	MOLD DIE	 	PDIP8M	 	 	 	 
	8	 	MOLD	 	MOLD DIE	 	PDIP8M	 	 	 	 
	9	 	MOLD	 	MOLD DIE	 	PDIP8M	 	 	 	 
	10
	 	MOLD	 	MOLD DIE	 	PDIP8M	 	 	 	 
	11
	 	MOLD	 	MOLD DIE	 	PDIP8M	 	 	 	 
	12
	 	MOLD	 	MOLD DIE	 	PDIP8M	 	 	 	 
	13
	 	MOLD	 	MOLD DIE	 	PDIP8	 	40000591	 	2001.12.31
	14
	 	MOLD	 	MOLD DIE	 	PDIP14	 	40000160	 	1995.12.31
	15
	 	MOLD	 	MOLD DIE	 	PDIP14	 	40000161	 	1995.12.31
	16
	 	MOLD	 	MOLD DIE	 	PDIP14	 	40000237	 	1996.09.17
	17
	 	MOLD	 	MOLD DIE	 	PDIP14	 	40001556	 	2001.12.28
	18
	 	MOLD	 	MOLD DIE	 	PDIP14	 	40000170	 	1995.12.31
	19
	 	MOLD	 	MOLD DIE	 	PDIP16	 	40000171	 	1995.12.31
	20
	 	MOLD	 	MOLD DIE	 	PDIP16	 	40000590	 	1998.05.31
	21
	 	MOLD	 	MOLD DIE	 	PDIP16	 	40001553	 	2001.12.28
	22
	 	MOLD	 	MOLD DIE	 	PDIP16	 	40000034	 	1997.12.31
	23
	 	MOLD	 	MOLD DIE	 	PDIP16	 	40000849	 	2000.09.30
	24
	 	MOLD	 	MOLD DIE	 	PDIP18	 	40000256	 	2001.12.31
	25
	 	MOLD	 	MOLD DIE	 	PDIP20	 	40000255	 	2001.12.31
	26
	 	MOLD	 	MOLD DIE	 	PDIP20	 	40000163	 	1995.12.31
	27
	 	MOLD	 	MOLD DIE	 	PDIP24	 	40000164	 	1995.12.31
	28
	 	MOLD	 	MOLD DIE	 	PDIP24	 	40001554	 	2001.12.28
	29
	 	MOLD	 	MOLD DIE	 	PDIP24	 	40001555	 	2001.12.28
	30
	 	MOLD	 	MOLD DIE	 	PDIP24	 	40000493	 	2001.12.31
	31
	 	MOLD	 	MOLD DIE	 	PDIP28	 	40000494	 	2001.12.31
	32
	 	MOLD	 	MOLD DIE	 	PDIP28	 	40001896	 	2001.05.25
	33
	 	MOLD	 	MOLD DIE	 	PDIP28	 	40001608	 	1996.03.25
	34
	 	MOLD	 	MOLD DIE	 	PDIP28	 	40000166	 	2001.12.31






 









Table of Contents






	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	35
	 	MOLD	 	MOLD DIE	 	PDIP24N	 	40000238	 	2001.12.31
	36
	 	MOLD	 	MOLD DIE	 	PDIP28N	 	40001608	 	1996.03.25
	37
	 	MOLD	 	MOLD DIE	 	PDIP32	 	40002205	 	2002.07.28
	38
	 	MOLD	 	MOLD DIE	 	PDIP32	 	40002207	 	2002.07.28
	39
	 	MOLD	 	MOLD DIE	 	PDIP40	 	40000169	 	1995.12.31
	40
	 	MOLD	 	MOLD DIE	 	PDIP40	 	40002632	 	2001.04.29
	41
	 	MOLD	 	MOLD DIE	 	PDIP40	 	40000240	 	1996.09.17
	42
	 	MOLD	 	MOLD DIE	 	PDIP40	 	40000495	 	1997.12.31
	43
	 	MOLD	 	MOLD DIE	 	PDIP40	 	40002633	 	2001.04.29
	44
	 	MOLD	 	MOLD DIE	 	PLCC20	 	40000650	 	2000.12.30
	45
	 	MOLD	 	MOLD DIE	 	PLCC28	 	40000229	 	1996.07.30
	46
	 	MOLD	 	MOLD DIE	 	PLCC28	 	40003601	 	2006.01.28
	47
	 	MOLD	 	MOLD DIE	 	PLCC32	 	40001023	 	2001.01.24
	48
	 	MOLD	 	MOLD DIE	 	PLCC44	 	40002218	 	2002.08.25
	49
	 	MOLD	 	MOLD DIE	 	PLCC44	 	40000268	 	1997.01.31
	50
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40001991	 	2002.04.01
	51
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40001992	 	2002.04.01
	52
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40001993	 	2002.04.01
	53
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40001994	 	2002.04.01
	54
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40000794	 	2000.06.21
	55
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40000794	 	2000.06.21
	56
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40000794	 	2000.06.21
	57
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40000794	 	2000.06.21
	58
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40002304	 	2002.10.25
	59
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40002303	 	2002.10.25
	60
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40003199	 	2004.09.19
	61
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40003200	 	2004.09.19
	62
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40001991	 	2002.04.01
	63
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40001992	 	2002.04.01
	64
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40001993	 	2002.04.01
	65
	 	MOLD	 	MOLD DIE	 	SOIC8/SOEP8E	 	40001994	 	2002.04.01
	66
	 	MOLD	 	MOLD DIE	 	SOIC8W	 	40003199	 	2004.09.19
	67
	 	MOLD	 	MOLD DIE	 	SOIC8W	 	40003200	 	2004.09.19
	68
	 	MOLD	 	MOLD DIE	 	SOIC8W	 	40003245	 	2004.11.08
	69
	 	MOLD	 	MOLD DIE	 	SOIC8W	 	40003422	 	2005.08.19
	70
	 	MOLD	 	MOLD DIE	 	SOIC14N	 	40000496	 	1997.12.31
	71
	 	MOLD	 	MOLD DIE	 	SOIC14N	 	40000172	 	1995.12.31
	72
	 	MOLD	 	MOLD DIE	 	SOIC14N	 	40000848	 	2000.09.30
	73
	 	MOLD	 	MOLD DIE	 	SOIC14N	 	40002931	 	2004.04.01
	74
	 	MOLD	 	MOLD DIE	 	SOIC16N	 	40000316	 	1997.05.31
	75
	 	MOLD	 	MOLD DIE	 	SOIC16N	 	40003198	 	2004.09.19
	76
	 	MOLD	 	MOLD DIE	 	SOIC16N	 	40000173	 	1995.12.31
	77
	 	MOLD	 	MOLD DIE	 	SOIC16N	 	40001775	 	2001.12.23
	78
	 	MOLD	 	MOLD DIE	 	SOIC14M	 	40003442	 	2005.09.20
	79
	 	MOLD	 	MOLD DIE	 	SOIC14M	 	40003442	 	2005.09.20
	80
	 	MOLD	 	MOLD DIE	 	SOIC14M	 	40003442	 	2005.09.20
	81
	 	MOLD	 	MOLD DIE	 	SOIC14M	 	 	 	 
	82
	 	MOLD	 	MOLD DIE	 	SOIC16M	 	40003443	 	2005.09.20
	83
	 	MOLD	 	MOLD DIE	 	SOIC16M	 	40003443	 	2005.09.20
	84
	 	MOLD	 	MOLD DIE	 	SOIC16M	 	40003443	 	2005.09.20
	85
	 	MOLD	 	MOLD DIE	 	SOIC16M	 	 	 	 
	86
	 	MOLD	 	MOLD DIE	 	SOIC16W	 	40000174	 	1995.12.31
	87
	 	MOLD	 	MOLD DIE	 	SOIC16W	 	40001685	 	2001.04.29
	88
	 	MOLD	 	MOLD DIE	 	SOIC16WM	 	40003366	 	2005.05.16
	89
	 	MOLD	 	MOLD DIE	 	SOIC20	 	40000175	 	1995.12.31
	90
	 	MOLD	 	MOLD DIE	 	SOIC20	 	40000050	 	1998.12.31
	91
	 	MOLD	 	MOLD DIE	 	SOIC20M	 	 	 	 
	92
	 	MOLD	 	MOLD DIE	 	SOIC20M	 	 	 	 
	93
	 	MOLD	 	MOLD DIE	 	SOIC20M	 	 	 	 
	94
	 	MOLD	 	MOLD DIE	 	SOIC20M	 	 	 	 
	95
	 	MOLD	 	MOLD DIE	 	SOIC24	 	 	 	 
	96
	 	MOLD	 	MOLD DIE	 	SOIC24	 	40001677	 	2001.03.31
	97
	 	MOLD	 	MOLD DIE	 	SOIC24NM	 	40003397	 	2005.07.22
	98
	 	MOLD	 	MOLD DIE	 	SOIC28N	 	40000242	 	2001.12.31
	99
	 	MOLD	 	MOLD DIE	 	SOIC28N	 	40001679	 	2001.03.31
	100
	 	MOLD	 	MOLD DIE	 	SOIC28N	 	40001678	 	2001.03.31
	101
	 	MOLD	 	MOLD DIE	 	SOIC28NM	 	40003398	 	2005.07.22
	102
	 	MOLD	 	MOLD DIE	 	SOIC28NM	 	40003398	 	2005.07.22
	103
	 	MOLD	 	MOLD DIE	 	SOIC28NM	 	 	 	 
	104
	 	MOLD	 	MOLD DIE	 	SOIC28W	 	40003575	 	2006.01.25
	105
	 	MOLD	 	MOLD DIE	 	SOIC28W	 	40000243	 	2001.12.31
	106
	 	MOLD	 	MOLD DIE	 	SSOP48	 	40003268	 	2004.12.06
	107
	 	MOLD	 	MOLD DIE	 	SSOP48	 	40003269	 	2004.12.06
	108
	 	MOLD	 	MOLD DIE	 	SSOP48	 	40003270	 	2004.12.06
	109
	 	MOLD	 	MOLD DIE	 	SSOP48	 	40003271	 	2004.12.06
	110
	 	MOLD	 	MOLD DIE	 	SSOP48	 	40003272	 	2004.12.06
	111
	 	MOLD	 	MOLD DIE	 	SSOP48	 	40003273	 	2004.12.06
	112
	 	MOLD	 	MOLD DIE	 	SSOP56	 	40002051	 	2002.05.27
	113
	 	MOLD	 	MOLD DIE	 	SSOP56	 	40002051	 	2002.05.27






 









Table of Contents






	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	 	 	 	 	 	 	 	 	 	 	 
	114
	 	MOLD	 	MOLD DIE	 	SSOP56	 	40002051	 	2002.05.27
	115
	 	MOLD	 	MOLD DIE	 	SSOP56	 	40002051	 	2002.05.27
	116
	 	MOLD	 	MOLD DIE	 	SSOP56AMP	 	40003066	 	2004.06.26
	117
	 	MOLD	 	MOLD DIE	 	SSOP56AMP	 	40003066	 	2004.06.26
	118
	 	MOLD	 	MOLD DIE	 	TSSOP8	 	40001577	 	2002.02.19
	119
	 	MOLD	 	MOLD DIE	 	TSSOP8	 	40003419	 	2005.08.18
	120
	 	MOLD	 	MOLD DIE	 	TSSOP8	 	40003599	 	2006.01.28
	121
	 	MOLD	 	MOLD DIE	 	TSSOP14/16	 	40001579	 	2002.02.19
	122
	 	MOLD	 	MOLD DIE	 	TSSOP14/16	 	40003194	 	2004.09.16
	123
	 	MOLD	 	MOLD DIE	 	TSSOP14/16	 	40003099	 	2004.07.23
	124
	 	MOLD	 	MOLD DIE	 	TSSOP14/16	 	40003800	 	2006.04.28
	125
	 	MOLD	 	MOLD DIE	 	TSSOP20	 	 	 	 
	126
	 	MOLD	 	MOLD DIE	 	TSSOP20	 	40003567	 	2005.12.24
	127
	 	MOLD	 	MOLD DIE	 	TSSOP20	 	40003798	 	2006.04.28
	128
	 	MOLD	 	MOLD DIE	 	TSSOP24	 	 	 	 
	129
	 	MOLD	 	MOLD DIE	 	TSSOP28	 	40003239	 	2004.11.03
	130
	 	MOLD	 	MOLD DIE	 	TSSOP28	 	40001578	 	2002.02.19
	131
	 	MOLD	 	MOLD DIE	 	TSSOP28	 	40003566	 	2005.12.24
	132
	 	MOLD	 	MOLD DIE	 	MSOP8/10	 	40001575	 	2002.02.19
	133
	 	MOLD	 	MOLD DIE	 	MSOP8/10	 	40003038	 	2004.06.23
	134
	 	MOLD	 	MOLD DIE	 	PLCC84	 	40000036	 	1997.12.31
	1	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250TM32	 	40000364	 	1997.08.31
	2	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250	 	40000153	 	1995.12.31
	3	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250TM32	 	40000155	 	1995.12.31
	4	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250TM32	 	40000157	 	1995.12.31
	5	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250TM32	 	40000158	 	1995.12.31
	6	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-200-7TM	 	40000247	 	1996.09.30
	7	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250TM32	 	40000156	 	1995.12.31
	8	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250TM32	 	40000315	 	1997.05.31
	9	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250TM32	 	40000484	 	1997.04.30
	10
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000481	 	1997.12.31
	11
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000570	 	1998.05.31
	12
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000487	 	1997.12.31
	13
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000486	 	1997.12.31
	14
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000576	 	1998.05.31
	15
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000575	 	1998.05.31
	16
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000572	 	1998.05.31
	17
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000571	 	1998.05.31
	18
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000490	 	1997.12.31
	19
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000491	 	1997.12.31
	20
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000574	 	1998.05.31
	21
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000573	 	1998.05.31
	22
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000492	 	1997.12.31
	23
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000483	 	1997.12.31
	24
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTM250-7TAN32	 	40000569	 	1998.05.31
	25
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250TM32	 	40002329	 	2002.11.23
	26
	 	MOLD PRESS	 	MANUAL MOLD PRESS	 	FSTMP-250TM32	 	40002328	 	2002.11.23
	1	 	OVEN	 	DA OVEN	 	MP1506	 	40000121	 	1995.12.31
	2	 	OVEN	 	DA OVEN	 	MP1506	 	40000127	 	1995.12.31
	3	 	OVEN	 	DA OVEN	 	MP1506	 	40000128	 	1995.12.31
	4	 	OVEN	 	DA OVEN	 	MP1506	 	40000125	 	1995.12.31
	5	 	OVEN	 	DA OVEN	 	MP1506	 	40000126	 	1995.12.31
	6	 	OVEN	 	DA OVEN	 	MP1506	 	40000122	 	1995.12.31
	7	 	OVEN	 	DA OVEN	 	MP1506	 	40000124	 	1995.12.31
	8	 	OVEN	 	PMC OVEN	 	MP-1506FY-HP-WAS	 	40000190	 	1995.12.31
	9	 	OVEN	 	PMC OVEN	 	MP-1506FY-HP-WAS	 	40000191	 	1995.12.31
	10
	 	OVEN	 	PMC OVEN	 	MP-1506FY-HP-WAS	 	40000192	 	1995.12.31
	11
	 	OVEN	 	PMC OVEN	 	ASC-336F	 	40000194	 	1995.12.31
	12
	 	OVEN	 	PMC OVEN	 	MP-1506FY-HP-WAS	 	40000202	 	1995.12.31
	13
	 	OVEN	 	PMC OVEN	 	MP-1506FY-HP-WAS	 	40001306	 	1995.12.31
	14
	 	OVEN	 	PMC OVEN	 	MP-1506FY-HP-WAS	 	40001307	 	1995.12.31
	15
	 	OVEN	 	PMC OVEN	 	MP-1506FY-HP	 	40001308	 	1995.12.31
	1	 	PLATING	 	PLATING M/C	 	EDF-EPL 1800S	 	40000497	 	1997.12.31
	2	 	PLATING	 	PLATING M/C	 	EDF-EPL 1800S	 	40000498	 	1997.12.31
	3	 	PLATING	 	PLATING M/C	 	EDF-EPL 1800S	 	40001905	 	2001.07.29
	4	 	PLATING	 	PLATING M/C	 	EDF-EPL 1800S	 	40002108	 	2002.07.28
	1	 	MOLD	 	PREHEATER	 	SD523M	 	40000184	 	1995.12.31
	2	 	MOLD	 	PREHEATER	 	SD523M	 	40000179	 	1995.12.31
	3	 	MOLD	 	PREHEATER	 	SD523M	 	40000231	 	1996.07.30
	4	 	MOLD	 	PREHEATER	 	SD523M	 	40000185	 	1995.12.31
	5	 	MOLD	 	PREHEATER	 	SD523M	 	40000186	 	1995.12.31
	6	 	MOLD	 	PREHEATER	 	SD523M	 	40000181	 	1995.12.31
	7	 	MOLD	 	PREHEATER	 	SD523M	 	40000188	 	1995.12.31
	8	 	MOLD	 	PREHEATER	 	SD523M	 	40000178	 	1995.12.31
	9	 	MOLD	 	PREHEATER	 	SD723M	 	40000405	 	1997.11.30
	10
	 	MOLD	 	PREHEATER	 	SD723M	 	40000271	 	1997.01.31
	11
	 	MOLD	 	PREHEATER	 	SD723M	 	40000339	 	1997.07.31
	12
	 	MOLD	 	PREHEATER	 	SD723M	 	40000285	 	1997.04.30
	13
	 	MOLD	 	PREHEATER	 	SD723M	 	40000368	 	1997.08.31






 









Table of Contents







	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	 	 	 	 	 	 	 	 	 	 	 
	14
	 	MOLD	 	PREHEATER	 	SD723M	 	40000370	 	1997.08.31
	15
	 	MOLD	 	PREHEATER	 	SD723M	 	40000407	 	1997.11.30
	16
	 	MOLD	 	PREHEATER	 	SD723M	 	40000272	 	1997.01.31
	17
	 	MOLD	 	PREHEATER	 	SD723M	 	40000410	 	1997.11.30
	18
	 	MOLD	 	PREHEATER	 	SD723M	 	40000321	 	1997.06.30
	19
	 	MOLD	 	PREHEATER	 	SD723M	 	40000317	 	1997.05.31
	20
	 	MOLD	 	PREHEATER	 	SD723M	 	40000322	 	1997.06.30
	21
	 	MOLD	 	PREHEATER	 	SD723M	 	40000411	 	1997.11.30
	22
	 	MOLD	 	PREHEATER	 	SD723M	 	40000406	 	1997.11.30
	23
	 	MOLD	 	PREHEATER	 	SD723M	 	40000369	 	1997.08.31
	24
	 	MOLD	 	PREHEATER	 	SD723M	 	40000233	 	1996.07.30
	25
	 	MOLD	 	PREHEATER	 	SD723M	 	40000338	 	1997.07.31
	26
	 	MOLD	 	PREHEATER	 	SD723M	 	40000415	 	1997.11.30
	1	 	TNF	 	AP048	 	MATRIX PD8LD AUTO T/F/S(ROLLER)	 	40000704	 	1999.11.30
	2	 	TNF	 	AP048	 	MATRIX PD8LD AUTO T/F/S	 	40000704	 	1999.11.30
	3	 	TNF	 	AP049	 	MATRIX PD8LD AUTO T/F/S	 	40000703	 	1999.11.30
	4	 	TNF	 	AP049	 	MATRIX PD8LD AUTO T/F/S(ROLLER)	 	40000703	 	1999.11.30
	5	 	TNF	 	AP047	 	MATRIX SOIC8LD AUTO TRIM	 	40000451	 	1997.12.30
	6	 	TNF	 	AP066	 	MATRIX SOIC8LD F/S	 	40001593	 	2002.02.25
	7	 	TNF	 	AP065	 	MATRIX SOIC8LD TRIM	 	40001592	 	2002.02.25
	8	 	TNF	 	AP036	 	MATRX SOIC8LD AUTO FORM	 	40000668	 	1999.04.10
	9	 	TNF	 	AP131	 	MSOP08/10 FORM	 	40003190	 	2004.09.16
	10
	 	TNF	 	AP130	 	MSOP08 TRIM	 	40003191	 	2004.09.16
	11
	 	TNF	 	AP084	 	MSOP8/10 3RD REJECT CUT TOOL	 	40001962	 	2002.02.24
	12
	 	TNF	 	AP084	 	MSOP8/10LD AUTO FROM	 	40001962	 	2002.02.24
	13
	 	TNF	 	AP083	 	MSOP10LD AUTO TRIM	 	40001963	 	2002.02.24
	14
	 	TNF	 	AP020	 	PD14LD IDF AUTO T/F SHUTTLE(roller)	 	40000362	 	1997.08.31
	15
	 	TNF	 	AP021	 	PD16LD IDF AUTO T/F SHUTTLE(roller)	 	40000363	 	1997.08.31
	16
	 	TNF	 	AP002	 	PD16LD IDFAUTO T/F SHUTTLE(roller)	 	40000853	 	1997.11.30
	17
	 	TNF	 	BP018	 	PD18 FORM MANUAL DIE	 	40001392	 	2000.12.30
	18
	 	TNF	 	BP017	 	PD18 TRIM MANUAL DIE	 	 	 	 
	19
	 	TNF	 	AP051	 	PD20LD AUTO T/F/S SHUTTLE	 	40000681	 	1999.04.10
	20
	 	TNF	 	BP012	 	PD24(N) TRIM MANUAL DIE	 	40001392	 	2000.12.30
	21
	 	TNF	 	AP075	 	PD24(W)LD AUTO T/F SHUTTLE	 	40000656	 	2000.12.30
	22
	 	TNF	 	BP004	 	PD24N FORM MANUAL DIE	 	40003347	 	2005.03.16
	23
	 	TNF	 	BP004	 	PD28(N) FORM MANUAL DIE	 	40000928	 	1995.12.31
	24
	 	TNF	 	BP012	 	PD28(N) TRIM MANUAL DIE	 	40000989	 	1995.12.31
	25
	 	TNF	 	AP064	 	PD28(w)LD AUTO T/F	 	40001676	 	2001.03.31
	26
	 	TNF	 	AP078	 	PD40 AUTO T/F SHUTTLE	 	40000423	 	1997.11.30
	27
	 	TNF	 	AP008	 	PD8LD IDF AUTO T/F SHUTTLE	 	40000134	 	2001.12.31
	28
	 	TNF	 	AP045	 	PLCC 44LD AUTO FORM	 	40000674	 	1999.04.10
	29
	 	TNF	 	AP010	 	PLCC20LD AUTO TRIM	 	40000055	 	1996.10.31
	30
	 	TNF	 	AP010	 	PLCC20LD AUTO FORM	 	40000055	 	1996.10.31
	31
	 	TNF	 	AP070	 	PLCC28LD AUTO FORM	 	40000236	 	2001.12.31
	32
	 	TNF	 	AP067	 	PLCC28LD AUTO TRIM	 	40001512	 	2000.11.15
	33
	 	TNF	 	AP029	 	PLCC32LD FORM	 	40000235	 	1996.07.30
	34
	 	TNF	 	AP026	 	PLCC32LD TRIM	 	40000424	 	1997.11.30
	35
	 	TNF	 	AP050	 	PLCC44LD AUTO TRIM	 	40000675	 	1999.04.10
	36
	 	TNF	 	AP055	 	PLCC84LD AUTO FORM	 	40000678	 	2001.12.30
	37
	 	TNF	 	AP054	 	PLCC84LD AUTO TRIM	 	40000680	 	1999.04.10
	38
	 	TNF	 	AP018	 	SO16(w)/20LD AUTO T/F	 	40000331	 	1997.07.31
	39
	 	TNF	 	AP017	 	SO8/14/16LD AUTO T/F	 	40000257	 	1996.10.31
	40
	 	TNF	 	AP116	 	SOIC 14LDM AUTO FORM	 	40002692	 	2003.10.21
	41
	 	TNF	 	AP116	 	SOIC 16LDM AUTO FORM	 	40002692	 	2003.10.21
	42
	 	TNF	 	AP046	 	SOIC 8/14/16LD AUTO FORM	 	40000685	 	1999.04.10
	43
	 	TNF	 	AP128	 	SOIC08M FORM	 	40003209	 	2004.10.20
	44
	 	TNF	 	AP059	 	SOIC14M TRIM	 	40000843	 	2000.09.29
	45
	 	TNF	 	AP042	 	SOIC16(W)/20LD AUTO FORM	 	40000686	 	1999.04.10
	46
	 	TNF	 	AP041	 	SOIC16(W)/20LD AUTO TRIM	 	40000687	 	1999.04.10
	47
	 	TNF	 	AP080	 	SOIC16/20M AUTO FORM	 	40001711	 	2001.07.29
	48
	 	TNF	 	AP079	 	SOIC16/20M AUTO TRIM	 	40001710	 	2001.07.29
	49
	 	TNF	 	AP059	 	SOIC16M TRIM	 	40000843	 	2000.09.29
	50
	 	TNF	 	AP105	 	SOIC24/28 TRIM/FORM	 	40000606	 	1998.05.31
	51
	 	TNF	 	AP006	 	SOIC24/28LD AUTO TRIM	 	40000224	 	1996.06.30
	52
	 	TNF	 	AP006	 	SOIC24/28LD AUTO FORM	 	40000224	 	1996.06.30
	53
	 	TNF	 	AP076	 	SOIC24/28LD AUTO TRIM	 	40000676	 	1999.04.10
	54
	 	TNF	 	AP076	 	SOIC24/28LD AUTO FORM	 	40000676	 	1999.04.10
	55
	 	TNF	 	AP071	 	SOIC24M ATUO TRIM	 	40001751	 	2001.11.25
	56
	 	TNF	 	AP131	 	SOIC24M FORM	 	40003190	 	2004.09.16
	57
	 	TNF	 	AP007	 	SOIC28(w)LD AUTO TRIM	 	40000221	 	1996.05.31
	58
	 	TNF	 	AP007	 	SOIC28(w)LD AUTO FORM	 	40000221	 	1996.05.31
	59
	 	TNF	 	AP071	 	SOIC28M AUTO TRIM	 	40001751	 	2001.11.25
	60
	 	TNF	 	AP131	 	SOIC28M FORM	 	40003190	 	2004.09.16
	61
	 	TNF	 	AP032	 	SOIC8(w)LD AUTO FORM	 	40000605	 	1998.05.31
	62
	 	TNF	 	AP031	 	SOIC8(w)LD AUTO TRIM	 	40000604	 	1998.05.31
	63
	 	TNF	 	AP022	 	SOIC14/16LD AUTO FORM	 	40000452	 	1997.12.31
	64
	 	TNF	 	AP025	 	SOIC14/16LD AUTO FORM	 	40000477	 	1997.12.31
	65
	 	TNF	 	AP023	 	SOIC14/16LD AUTO TRIM	 	40000479	 	1997.12.31
	66
	 	TNF	 	AP024	 	SOIC14/16LD AUTO TRIM	 	40000478	 	1997.12.31






 









Table of Contents








	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	 	 	 	 	 	 	 	 	 	 	 
	67
	 	TNF	 	AP036	 	SOIC8M 3RD REJECT CUT TOOL	 	40000668	 	1999.04.10
	68
	 	TNF	 	AP032	 	SOIC8W 3RD REJECT CUT TOOL	 	40000605	 	1998.05.31
	69
	 	TNF	 	AP060	 	SSOP48(intel)LD AUTO F/S	 	40000844	 	2000.09.29
	70
	 	TNF	 	AP043	 	SSOP48LD AUTO FORM	 	40000666	 	1999.04.10
	71
	 	TNF	 	AP059	 	SSOP48LD AUTO TRIM	 	40000843	 	2000.09.29
	72
	 	TNF	 	AP074	 	SSOP56LD AUTO FORM(AMD)	 	40002636	 	2001.12.30
	73
	 	TNF	 	AP044	 	SSOP56LD AUTO TRIM	 	40000666	 	1999.04.10
	74
	 	TNF	 	AP073	 	SSOP56LD AUTO TRIM (AMD)	 	40001892	 	2001.12.30
	75
	 	TNF	 	AP084	 	TSSOP08LD AUTO FORM	 	40001962	 	2002.02.24
	76
	 	TNF	 	AP083	 	TSSOP08LD AUTO TRIM	 	40001963	 	2002.02.24
	77
	 	TNF	 	AP084	 	TSSOP14/16 3RD REJECT CUT TOOL	 	40001962	 	2002.02.24
	78
	 	TNF	 	AP129	 	TSSOP14/16 FORM	 	40003206	 	2004.10.14
	79
	 	TNF	 	AP084	 	TSSOP14/16LD AUTO FROM	 	40001962	 	2002.02.24
	80
	 	TNF	 	AP083	 	TSSOP14LD AUTO TRIM	 	40001963	 	2002.02.24
	81
	 	TNF	 	AP038	 	TSSOP20/24 3RD REJECT CUT TOOL	 	40000662	 	1999.03.31
	82
	 	TNF	 	AP038	 	TSSOP20 AUTO FORM/SINGULATION	 	40000662	 	1999.03.31
	83
	 	TNF	 	AP037	 	TSSOP20/24LD AUTO TRIM	 	40000660	 	1999.03.31
	84
	 	TNF	 	AP084	 	TSSOP28LD AUTO FROM	 	40001962	 	2002.02.24
	85
	 	TNF	 	AP083	 	TSSOP28LD AUTO TRIM	 	40001963	 	2002.02.24
	86
	 	TNF	 	AP037	 	TSSOP30LD AUTO TRIM	 	40000660	 	1999.03.31
	87
	 	TNF	 	AP128	 	SOIC08M FORM(EDP)	 	40003209	 	2004.10.20
	88
	 	TNF	 	AP020	 	PD14LD IDF AUTO T/F SHUTTLE(roller)	 	40000362	 	1997.08.31
	89
	 	TNF	 	AP038	 	TSSOP24/30LD AUTO FORM SINGULATION	 	40000662	 	1999.03.31
	90
	 	TNF	 	AP130	 	TSSOP16LD AUTO TRIM	 	40003191	 	2004.09.16
	1	 	TNF SYS	 	AUTO T/F SYSTEM	 	SO 24/28LD	 	40000224	 	1996.06.30
	2	 	TNF SYS	 	AUTO T/F SYSTEM(PD8LD)	 	J036-444	 	40000134	 	2001.12.31
	3	 	TNF SYS	 	AUTO T/F/S	 	SOIC 28LD	 	40000236	 	2001.12.31
	4	 	TNF SYS	 	AUTO T/F SYSTEM	 	SO-8/14/16L	 	40000685	 	1999.04.10
	5	 	TNF SYS	 	T/F SYSTEM-A	 	SO W16/20	 	40000331	 	1997.07.31
	6	 	TNF SYS	 	T/F SYSTEM-A	 	PD-14L/D	 	40000362	 	1997.08.31
	7	 	TNF SYS	 	T/F SYSTEM-A	 	PD-16L/D	 	40000363	 	1997.08.31
	8	 	TNF SYS	 	AUTO TRIM SYSTEM	 	PLCC 32LD	 	40000424	 	1997.11.30
	9	 	TNF SYS	 	AUTO FORM SYSTEM	 	SOIC 8/14/1	 	40000452	 	1997.12.31
	10
	 	TNF SYS	 	AUTO FORM SYSTEM	 	SOIC 8/14/1	 	40000477	 	1997.12.31
	11
	 	TNF SYS	 	AUTO TRIM SYSTEM	 	SOIC 8/14/1	 	40000479	 	1997.12.31
	12
	 	TNF SYS	 	AUTO TRIM SYSTEM	 	SOIC 8/14/1	 	40000478	 	1997.12.31
	13
	 	TNF SYS	 	AUTO TRIM SYSTEM	 	SOIC8LD	 	40000604	 	1998.05.31
	14
	 	TNF SYS	 	AUTO FORM SYSTEM	 	SOIC8LD	 	40000605	 	1998.05.31
	15
	 	TNF SYS	 	AUTO TRIM SYSTEM	 	TSSOP20/24L	 	40000660	 	1999.03.31
	16
	 	TNF SYS	 	AUTO FORM SYSTEM	 	TSSOP20/24L	 	40000662	 	1999.03.31
	17
	 	TNF SYS	 	TRIM FORM SYSTEM	 	M209 SOIC8L	 	40000668	 	1999.04.10
	18
	 	TNF SYS	 	AUTO FORM SYSTEM	 	PLCC44LD	 	40000674	 	1999.04.10
	19
	 	TNF SYS	 	AUTO TRIM SYSTEM	 	PLCC44LD	 	40000675	 	1999.04.10
	20
	 	TNF SYS	 	AUTO FORM SYSTEM	 	PLCC84LD	 	40000678	 	2001.12.30
	21
	 	TNF SYS	 	AUTO TRIM SYSTEM	 	PLCC84LD	 	40000680	 	1999.04.10
	22
	 	TNF SYS	 	AUTO T/F SYSTEM	 	PDIP20LD	 	40000681	 	1999.04.10
	23
	 	TNF SYS	 	TRIM FORM SYSTEM	 	SOIC8/14/16	 	40000257	 	1996.10.31
	24
	 	TNF SYS	 	AUTO FORM SYSTEM	 	SOICW16/20	 	40000686	 	1999.04.10
	25
	 	TNF SYS	 	AUTO TRIM SYSTEM	 	SOICW16/20	 	40000687	 	1999.04.10
	26
	 	TNF SYS	 	TRIM/FORM SYSTEM	 	PDIP08LD	 	40000704	 	1999.11.30
	27
	 	TNF SYS	 	TRIM/FORM SYSTEM	 	PDIP08LD	 	40000703	 	1999.11.30
	28
	 	TNF SYS	 	ICT:AUTO TRIM EQUIP	 	SOIC W16/20	 	40001710	 	2001.07.29
	29
	 	TNF SYS	 	ICT:AUTO FORM EQUIP	 	SOIC W16/20	 	40001711	 	2001.07.29
	30
	 	TNF SYS	 	FORM SYSTEM WITH PARTS (450000	 	SH01,SE34,S	 	40001962	 	2002.02.24
	31
	 	TNF SYS	 	TRIM SYSTEM WITH PARTS(4500003	 	SH01,SH02,S	 	40001963	 	2002.02.24
	32
	 	TNF SYS	 	MP209 FORM/SING'SYSTEM FOR SOI	 	SOIC 14/16L	 	40002692	 	2003.10.21
	33
	 	TNF SYS	 	TSSOP/MSOP FORM SYSTEM	 	AP131	 	40003190	 	2004.09.16
	34
	 	TNF SYS	 	TSSOP/MSOP TORM SYSTEM	 	AP130	 	40003191	 	2004.09.16
	35
	 	TNF SYS	 	MP209 FORM SYSTEM FOR SOIC 8LD	 	SOIC 8LD	 	40003209	 	2004.10.20
	36
	 	TNF SYS	 	T/F FOR PD24/28	 	AVA0045Z	 	40000656	 	2000.12.30
	37
	 	TNF SYS	 	A SET OF TRIM & MATRIX	 	SSOP48&56LD	 	40000666	 	1999.04.10
	38
	 	TNF SYS	 	TRIM MANUAL PRESS	 	 	 	40001395	 	2000.11.30
	39
	 	TNF SYS	 	FORM MANUAL PRESS	 	 	 	40001396	 	2000.11.30
	40
	 	TNF SYS	 	FORM/SIGULATION FOR PLCC28	 	 	 	40001511	 	2000.11.15
	41
	 	TNF SYS	 	TRIM FORM FOR PLCC 28	 	 	 	40001512	 	2000.11.15
	42
	 	TNF SYS	 	SOIC8 MATRIX TRIM(PO2362)	 	MECHANICAL	 	40001592	 	2002.02.25
	43
	 	TNF SYS	 	SOIC8 MATRIX FORM(PO2362)	 	MECHANICAL	 	40001593	 	2002.02.25
	44
	 	TNF SYS	 	ICT-PDIP24  AUTO  TRIM/FORM  E	 	D9Z850715	 	40000656	 	2000.12.30
	45
	 	TNF SYS	 	TRIM/FORM SYSTEM	 	PLCC20LD AUTO T/F	 	40000055	 	1996.10.31
	46
	 	TNF SYS	 	AUTO FORM SYSTEM	 	PLCC32LD FORM	 	40000048	 	1998.12.31
	47
	 	TNF SYS	 	TRIM/FORM SYSTEM	 	SOIC28(w)LD AUTO T/F	 	40000221	 	1996.05.31
	48
	 	TNF SYS	 	AUTO FORM SYSTEM	 	SSOP56LD AUTO FORM(AMD)	 	40002636	 	2001.12.30
	49
	 	TNF SYS	 	AUTO TRIM SYSTEM	 	SSOP56LD AUTO TRIM (AMD)	 	40001892	 	2001.12.30
	50
	 	TNF SYS	 	AUTO FORM SYSTEM	 	SSOP48(intel)LD AUTO F/S	 	40000844	 	2000.09.29
	51
	 	TNF SYS	 	AUTO FORM SYSTEM	 	SSOP48LD AUTO FORM	 	40000666	 	1999.04.10
	52
	 	TNF SYS	 	AUTO TRIM SYSTEM	 	SSOP48LD AUTO TRIM	 	40000843	 	2000.09.29
	53
	 	TNF SYS	 	TRIM/FORM SYSTEM	 	SO 24/28LD	 	40000606	 	1998.05.31
	54
	 	TNF SYS	 	SOIC8 MATRIX TRIM	 	MECHANICAL	 	40000451	 	1997.12.30
	55
	 	TNF SYS	 	TSSOP/MSOP FORM SYSTEM	 	AP129	 	40003206	 	2004.10.14






 









Table of Contents







	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	 	 	 	 	 	 	 	 	 	 	 
	56
	 	TNF SYS	 	TRIM/FORM SYSTEM	 	PD40 TTT	 	40000140	 	1995.12.31
	57
	 	TNF SYS	 	AUTO TRIM/FORM SYS.	 	PLCC32LD	 	40002507 /40002508	 	2003.05.25
	58
	 	TNF SYS	 	AUTO TRIM FORM SYS	 	300MIL 20LD	 	40001599	 	1995.10.31
	59
	 	TNF SYS	 	AUTO T/F SYS	 	14LD IDF	 	40001909	 	2001.10.26
	1	 	WAFER MOUNT	 	WAFER MOUNTER	 	ATM8100	 	40000453	 	1997.12.31
	2	 	WAFER MOUNT	 	MANAUAL WAFER MOUNT SYSTEM	 	DT-MWM1230	 	40002053	 	2002.05.27
	1	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40002117	 	2002.07.28
	2	 	WIRE BOND	 	ICT:WIRE BONDER 1488(D9L970099	 	KnS 1488	 	40002122	 	2002.07.28
	3	 	WIRE BOND	 	ICT:WIRE BONDER 1488(D9L970313	 	KnS 1488	 	40002196	 	2002.07.28
	4	 	WIRE BOND	 	ICT:WIRE BONDER 1488(D9L970285	 	KnS 1488	 	40002171	 	2002.07.28
	5	 	WIRE BOND	 	ICT:WIRE BONDER 1488(D9L970299	 	KnS 1488	 	40002183	 	2002.07.28
	6	 	WIRE BOND	 	ICT:WIRE BONDER 1488(D9Y990059	 	KnS 1488	 	40002126	 	2002.07.28
	7	 	WIRE BOND	 	ICT:WIRE BONDER 1488(D9Y990105	 	KnS 1488	 	40002129	 	2002.07.28
	8	 	WIRE BOND	 	ICT:WIRE BONDER 1488(D9A970166	 	KnS 1488	 	40002295	 	2002.09.28
	9	 	WIRE BOND	 	ICT:WIRE BONDER 1488(D9A970173	 	KnS 1488	 	40002243	 	2002.09.28
	10
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002287	 	2002.09.28
	11
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002141	 	2002.07.28
	12
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002145	 	2002.07.28
	13
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002547	 	2001.05.25
	14
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002270	 	2002.09.28
	15
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002269	 	2002.09.28
	16
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002258	 	2002.09.28
	17
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002543	 	2001.05.25
	18
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002559	 	2001.05.25
	19
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002165	 	2002.07.28
	20
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002140	 	2002.07.28
	21
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002556	 	2001.05.25
	22
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002560	 	2001.05.25
	23
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40001795	 	2001.12.23
	24
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002144	 	2002.07.28
	25
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40001687	 	2001.05.25
	26
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40001788	 	2001.12.23
	27
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002149	 	2002.07.28
	28
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40001783	 	2001.12.23
	29
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40001792	 	2001.12.23
	30
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40001790	 	2001.12.23
	31
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002160	 	2002.07.28
	32
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002553	 	2001.05.25
	33
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002548	 	2001.05.25
	34
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002146	 	2002.07.28
	35
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002139	 	2002.07.28
	36
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40001787	 	2001.12.23
	37
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002191	 	2002.07.28
	38
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 1488	 	40002535	 	2001.05.25
	39
	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40001789	 	2001.12.23
	40
	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40002552	 	2001.05.25
	41
	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40002201	 	2002.07.28
	42
	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40001794	 	2001.12.23
	43
	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40002178	 	2002.07.28
	44
	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40002198	 	2002.07.28
	45
	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40002155	 	2002.07.28
	46
	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40002137	 	2002.07.28
	47
	 	WIRE BOND	 	ICT:WIRE BONDER K&S1488	 	KnS 1488	 	40002262	 	2002.09.28
	1	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-200	 	40000816	 	2000.06.30
	2	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-200	 	40000819	 	2000.06.30
	3	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-200	 	40000818	 	2000.06.30
	4	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000817	 	2000.06.30
	5	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000798	 	2000.06.30
	6	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000797	 	2000.06.30
	7	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000796	 	2000.06.30
	8	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000795	 	2000.06.30
	9	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40002476	 	2003.04.26
	10
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000800	 	2000.06.30
	11
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000799	 	2000.06.30
	12
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000807	 	2000.06.30
	13
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000805	 	2000.06.30
	14
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40002477	 	2003.04.26
	15
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000808	 	2000.06.30
	16
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40002478	 	2003.04.26
	17
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000803	 	2000.06.30
	18
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000806	 	2000.06.30
	19
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000804	 	2000.06.30
	20
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000812	 	2000.06.30
	21
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000801	 	2000.06.30
	22
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000810	 	2000.06.30
	23
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000802	 	2000.06.30
	24
	 	WIRE BOND	 	WIRE BONDER	 	UTC-200	 	40000811	 	2000.06.30
	25
	 	WIRE BOND	 	WIRE BONDER&&	 	UTC-200	 	40000813	 	2000.06.30
	26
	 	WIRE BOND	 	WIRE BONDER&&	 	UTC-200	 	40000814	 	2000.06.30






 









Table of Contents






	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	 	 	 	 	 	 	 	 	 	 	 
	27
	 	WIRE BOND	 	WIRE BONDER&&	 	UTC-200	 	40000815	 	2000.06.30
	28
	 	WIRE BOND	 	WIRE BONDER&&	 	UTC-200	 	40000809	 	2000.06.30
	29
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001605	 	1995.09.06
	30
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001606	 	1995.09.06
	31
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001607	 	1995.09.06
	32
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001604	 	1995.09.06
	33
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001624	 	1998.04.23
	34
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001615	 	1998.04.23
	35
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001616	 	1998.04.23
	36
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001618	 	1998.04.23
	37
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001622	 	1998.04.23
	38
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001621	 	1998.04.23
	39
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001620	 	1998.04.23
	40
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001619	 	1998.04.23
	41
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001630	 	1998.04.23
	42
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001631	 	1998.04.23
	43
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001617	 	1998.04.23
	44
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001625	 	1998.04.23
	45
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001623	 	1998.04.23
	46
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001627	 	1998.04.23
	47
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001611	 	1997.05.16
	48
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001626	 	1998.04.23
	49
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001629	 	1998.04.23
	50
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001614	 	1997.05.16
	51
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001613	 	1997.05.16
	52
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001628	 	1998.04.23
	53
	 	WIRE BOND	 	INT-UTC-200 BI WIRE BONDER	 	UTC-200BI	 	40001612	 	1997.05.16
	1	 	WIRE BOND	 	AUTO WIRE BONDER	 	UTC-250BI-S	 	40000534	 	1997.12.31
	2	 	WIRE BOND	 	AUTO WIRE BONDER	 	UTC-250BI-S	 	40000531	 	1997.12.31
	3	 	WIRE BOND	 	AUTO WIRE BONDER	 	UTC-250BI-S	 	40000532	 	1997.12.31
	4	 	WIRE BOND	 	AUTO WIRE BONDER	 	UTC-250BI-S	 	40000533	 	1997.12.31
	5	 	WIRE BOND	 	AUTO WIRE BONDER	 	UTC-250BI-S	 	40000535	 	1997.12.31
	6	 	WIRE BOND	 	AUTO WIRE BONDER	 	UTC-250BI-S	 	40000536	 	1997.12.31
	7	 	WIRE BOND	 	AUTO WIRE BONDER	 	UTC-250BI-S	 	40000540	 	1997.12.31
	8	 	WIRE BOND	 	AUTO WIRE BONDER	 	UTC-250BI-S	 	40000537	 	1997.12.31
	9	 	WIRE BOND	 	AUTO WIRE BONDER	 	UTC-250BI-S	 	40000538	 	1997.12.31
	10
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000501	 	1997.12.31
	11
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000502	 	1997.12.31
	12
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000503	 	1997.12.31
	13
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000504	 	1997.12.31
	14
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000505	 	1997.12.31
	15
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000506	 	1997.12.31
	16
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000507	 	1997.12.31
	17
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000508	 	1997.12.31
	18
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000509	 	1997.12.31
	19
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000510	 	1997.12.31
	20
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000511	 	1997.12.31
	21
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000512	 	1997.12.31
	22
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000513	 	1997.12.31
	23
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000514	 	1997.12.31
	24
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000515	 	1997.12.31
	25
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000517	 	1997.12.31
	26
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000518	 	1997.12.31
	27
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000516	 	1997.12.31
	28
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000519	 	1997.12.31
	29
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000520	 	1997.12.31
	30
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000521	 	1997.12.31
	31
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000522	 	1997.12.31
	32
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000523	 	1997.12.31
	33
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000524	 	1997.12.31
	34
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000525	 	1997.12.31
	35
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000526	 	1997.12.31
	36
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000527	 	1997.12.31
	37
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000528	 	1997.12.31
	38
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000529	 	1997.12.31
	39
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC250BI-SU	 	40000530	 	1997.12.31
	40
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI-S	 	40000539	 	1997.12.31
	41
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI-S	 	40000390	 	1997.10.31
	42
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI-S	 	40000391	 	1997.10.31
	43
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI-S	 	40000392	 	1997.10.31
	44
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI-S	 	40000393	 	1997.10.31
	45
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI-S	 	40000394	 	1997.10.31
	46
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI-S	 	40000395	 	1997.10.31
	47
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI-S	 	40000396	 	1997.10.31
	48
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000541	 	1997.12.31
	49
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000542	 	1997.12.31
	50
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000543	 	1997.12.31
	51
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000544	 	1997.12.31
	52
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000545	 	1997.12.31






 









Table of Contents






	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	 	 	 	 	 	 	 	 	 	 	 
	53
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000546	 	1997.12.31
	54
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000547	 	1997.12.31
	55
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000548	 	1997.12.31
	56
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000549	 	1997.12.31
	57
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000550	 	1997.12.31
	58
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40000551	 	1997.12.31
	59
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40001832	 	2001.12.23
	60
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40001862	 	2001.12.23
	61
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40002497	 	2003.04.26
	62
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000746	 	2000.01.30
	63
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000744	 	2000.01.30
	64
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000745	 	2000.01.30
	65
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000747	 	2000.01.30
	66
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40001855	 	2001.12.23
	67
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40002494	 	2003.04.26
	68
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000713	 	1999.11.30
	69
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000714	 	1999.11.30
	70
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000715	 	1999.11.30
	71
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000716	 	1999.11.30
	72
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000717	 	1999.11.30
	73
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000718	 	1999.11.30
	74
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000719	 	1999.11.30
	75
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000720	 	1999.11.30
	76
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000721	 	1999.12.30
	77
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000722	 	1999.12.30
	78
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000723	 	1999.12.30
	79
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000724	 	1999.12.30
	80
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000725	 	1999.12.30
	81
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000726	 	1999.12.30
	82
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40002481	 	2003.04.26
	83
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40002487	 	2003.04.26
	84
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40002480	 	2003.04.26
	85
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000727	 	1999.12.30
	86
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000728	 	1999.12.30
	87
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000729	 	1999.12.30
	88
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000730	 	2000.01.30
	89
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000731	 	2000.01.30
	90
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000732	 	2000.01.30
	91
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000733	 	2000.01.30
	92
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000734	 	2000.01.30
	93
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000735	 	2000.01.30
	94
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000736	 	2000.01.30
	95
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000737	 	2000.01.30
	96
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000738	 	2000.01.30
	97
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000739	 	2000.01.30
	98
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250	 	40000740	 	2000.01.30
	99
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250BI	 	40000552	 	1997.12.31
	100
	 	WIRE BOND	 	WIRE BONDER	 	UTC-250BI	 	40002820	 	2004.02.21
	101
	 	WIRE BOND	 	ICT:WIRE BONDER (D9Z96)	 	UTC-250	 	40002491	 	2003.04.26
	102
	 	WIRE BOND	 	ICT:WIRE BONDER (D9Z96)	 	UTC-250	 	40002488	 	2003.04.26
	103
	 	WIRE BOND	 	ICT:WIRE BONDER (D9Z96)	 	UTC-250	 	40002489	 	2003.04.26
	104
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000741	 	2000.01.30
	105
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000742	 	2000.01.30
	106
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000743	 	2000.01.30
	107
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000748	 	2000.01.30
	108
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000749	 	2000.01.30
	109
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000750	 	2000.01.30
	110
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000751	 	2000.01.30
	111
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000752	 	2000.01.30
	112
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000753	 	2000.01.30
	113
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001833	 	2001.12.23
	114
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001848	 	2001.12.23
	115
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001861	 	2001.12.23
	116
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001857	 	2001.12.23
	117
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001838	 	2001.12.23
	118
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001860	 	2001.12.23
	119
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001858	 	2001.12.23
	120
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001851	 	2001.12.23
	121
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001840	 	2001.12.23
	122
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001853	 	2001.12.23
	123
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40001846	 	2001.12.23
	124
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40002498	 	2003.04.26
	125
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40000754	 	2000.01.30
	126
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40002493	 	2003.04.26
	127
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40002479	 	2003.04.26
	128
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40002483	 	2003.04.26
	129
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40002496	 	2003.04.26
	130
	 	WIRE BOND	 	ICT:WIRE BONDER (D9A97)	 	UTC-250	 	40002495	 	2003.04.26
	131
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002482	 	2003.04.26






 









Table of Contents










	 	 	 	 	 	 	 	 	 	 	 
	 	 	Process	 	Equipment Name	 	Model Type	 	Asset No.	 	Capital date
	 	 	 	 	 	 	 	 	 	 	 
	132
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002500	 	2003.04.26
	133
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002486	 	2003.04.26
	134
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001845	 	2001.12.23
	135
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001841	 	2001.12.23
	136
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001826	 	2001.12.23
	137
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001823	 	2001.12.23
	138
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001844	 	2001.12.23
	139
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001825	 	2001.12.23
	140
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001842	 	2001.12.23
	141
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001828	 	2001.12.23
	142
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002499	 	2003.04.26
	143
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002484	 	2003.04.26
	144
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001839	 	2001.12.23
	145
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001829	 	2001.12.23
	146
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001830	 	2001.12.23
	147
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001837	 	2001.12.23
	148
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001850	 	2001.12.23
	149
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001827	 	2001.12.23
	150
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001824	 	2001.12.23
	151
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40001831	 	2001.12.23
	152
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002490	 	2003.04.26
	153
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002787	 	2004.01.19
	154
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002789	 	2004.01.19
	155
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002788	 	2004.01.19
	156
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002784	 	2004.01.19
	157
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002791	 	2004.01.19
	158
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002790	 	2004.01.19
	159
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002786	 	2004.01.19
	160
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250	 	40002785	 	2004.01.19
	161
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250BI	 	40002818	 	2004.02.21
	162
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250BI	 	40000781	 	2000.05.28
	163
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250BI	 	40000780	 	2000.05.28
	164
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250BI	 	40002821	 	2004.02.21
	165
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250BI	 	40002825	 	2004.02.21
	166
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250BI	 	40002824	 	2004.02.21
	167
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250BI	 	40002822	 	2004.02.21
	168
	 	WIRE BOND	 	ICT:WIRE BONDER	 	UTC-250BI	 	40002823	 	2004.02.21
	169
	 	WIRE BOND	 	WIRE BONDER-A	 	UTC-250BI	 	40002819	 	2004.02.21
	1	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40002900	 	2004.03.27
	2	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40002906	 	2004.03.27
	3	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40002904	 	2004.03.27
	4	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40002902	 	2004.03.27
	5	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40002905	 	2004.03.27
	6	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40003058	 	2004.06.27
	7	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40003061	 	2004.06.27
	8	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40003062	 	2004.06.27
	9	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40003057	 	2004.06.27
	10
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40003056	 	2004.06.27
	11
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40003141	 	2004.07.23
	12
	 	WIRE BOND	 	ICT:WIRE BONDER	 	KnS 8028	 	40003132	 	2004.07.23






 









Table of Contents






TRANSFERRED TEST EQUIPMENT SUMMARY




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	TYPE	 	PLATFORM	 	Out-Total	 	CORE	 	EXCESS	 	S/D
	 	 	 	 	 	 	 	 	 	 	 
	TESTER

	 	A360
	 	 	12	 	 	 	4	 	 	 	4	 	 	 	4	 
	TESTER

	 	A5XX
	 	 	5	 	 	 	3	 	 	 	2	 	 	 	0	 
	TESTER

	 	ASL1000
	 	 	4	 	 	 	3	 	 	 	1	 	 	 	0	 
	TESTER

	 	DUO
	 	 	2	 	 	 	2	 	 	 	0	 	 	 	0	 
	TESTER

	 	EPRO
	 	 	44	 	 	 	35	 	 	 	0	 	 	 	9	 
	TESTER

	 	ETS300
	 	 	2	 	 	 	1	 	 	 	1	 	 	 	0	 
	TESTER

	 	ETS300_TI
	 	 	3	 	 	 	0	 	 	 	2	 	 	 	1	 
	TESTER

	 	ETS364
	 	 	5	 	 	 	5	 	 	 	0	 	 	 	0	 
	TESTER

	 	HP94XX
	 	 	13	 	 	 	10	 	 	 	2	 	 	 	1	 
	TESTER

	 	J750
	 	 	3	 	 	 	3	 	 	 	0	 	 	 	0	 
	TESTER

	 	LTX77
	 	 	21	 	 	 	12	 	 	 	9	 	 	 	0	 
	TESTER

	 	M3650
	 	 	3	 	 	 	2	 	 	 	1	 	 	 	0	 
	TESTER

	 	MAGNUM
	 	 	1	 	 	 	1	 	 	 	0	 	 	 	0	 
	TESTER

	 	MAVERICK PT
	 	 	1	 	 	 	1	 	 	 	0	 	 	 	0	 
	TESTER

	 	Q2/62
	 	 	9	 	 	 	3	 	 	 	1	 	 	 	5	 
	TESTER

	 	SENTRY
	 	 	3	 	 	 	0	 	 	 	0	 	 	 	3	 
	TESTER

	 	VISTA
	 	 	6	 	 	 	3	 	 	 	2	 	 	 	1	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	TESTER TOTAL

	 	 	 	 	137	 	 	 	88	 	 	 	25	 	 	 	24	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	HANDLER

	 	AAT
	 	 	6	 	 	 	0	 	 	 	1	 	 	 	5	 
	HANDLER

	 	AET5050
	 	 	8	 	 	 	3	 	 	 	1	 	 	 	4	 
	HANDLER

	 	AET3300
	 	 	8	 	 	 	1	 	 	 	0	 	 	 	7	 
	HANDLER

	 	AESCO
	 	 	6	 	 	 	0	 	 	 	2	 	 	 	4	 
	HANDLER

	 	ASM
	 	 	3	 	 	 	3	 	 	 	0	 	 	 	0	 
	HANDLER

	 	KUWANO
	 	 	10	 	 	 	8	 	 	 	0	 	 	 	2	 
	HANDLER

	 	MCT
	 	 	43	 	 	 	18	 	 	 	11	 	 	 	14	 
	HANDLER

	 	SESSCO
	 	 	14	 	 	 	4	 	 	 	1	 	 	 	9	 
	HANDLER

	 	RASCO
	 	 	20	 	 	 	17	 	 	 	3	 	 	 	0	 
	HANDLER

	 	SYMTEK
	 	 	6	 	 	 	1	 	 	 	0	 	 	 	5	 
	HANDLER

	 	TESEC
	 	 	10	 	 	 	0	 	 	 	0	 	 	 	10	 
	HANDLER

	 	TB150
	 	 	1	 	 	 	0	 	 	 	0	 	 	 	1	 
	HANDLER

	 	MH802
	 	 	2	 	 	 	0	 	 	 	0	 	 	 	2	 
	HANDLER

	 	MT93XX
	 	 	24	 	 	 	20	 	 	 	4	 	 	 	0	 
	HANDLER

	 	MT8589
	 	 	2	 	 	 	2	 	 	 	0	 	 	 	0	 
	HANDLER

	 	MT8588
	 	 	3	 	 	 	0	 	 	 	2	 	 	 	1	 
	HANDLER

	 	MT99XX
	 	 	6	 	 	 	4	 	 	 	2	 	 	 	0	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	HANDLER TOTAL

	 	 	 	 	172	 	 	 	81	 	 	 	27	 	 	 	64	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	GRAND TOTAL

	 	 	 	 	309	 	 	 	169	 	 	 	52	 	 	 	88	 







 









Table of Contents





SCC Tester Review-Out




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO	 	Platform	 	Asset	 	Device	 	Arrived at SCC	 	Vendor	 	CORE	 	Excess	 	S/D
	1
	 	A360
	 	40001349
	 	ANALOG
	 	00.10.6
	 	TERADYNE
	 	 	 	EXCESS	 	 
	2
	 	A360
	 	40001350
	 	ANALOG
	 	00.10.6
	 	TERADYNE
	 	 	 	EXCESS	 	 
	3
	 	A360
	 	40001351
	 	ANALOG
	 	00.10.6
	 	TERADYNE
	 	 	 	 	 	S/D
	4
	 	A360
	 	40001352
	 	ANALOG
	 	00.10.6
	 	TERADYNE
	 	 	 	EXCESS	 	 
	5
	 	A360
	 	40001353
	 	ANALOG
	 	00.10.6
	 	TERADYNE
	 	CORE	 	 	 	 
	6
	 	A360
	 	40001348
	 	ANALOG
	 	03.04.11
	 	TERADYNE
	 	CORE	 	 	 	 
	7
	 	A360
	 	40002586
	 	ANALOG
	 	03.6.11
	 	TERADYNE
	 	CORE	 	 	 	 
	8
	 	A360
	 	40002587
	 	ANALOG
	 	03.6.11
	 	TERADYNE
	 	 	 	EXCESS	 	 
	9
	 	A360
	 	40002585
	 	ANALOG
	 	03.6.11
	 	TERADYNE
	 	CORE	 	 	 	 
	10
	 	A360
	 	40002772
	 	ANALOG
	 	03.11.27
	 	TERADYNE
	 	 	 	 	 	S/D
	11
	 	A360
	 	40002773
	 	ANALOG
	 	03.11.27
	 	TERADYNE
	 	 	 	 	 	S/D
	12
	 	A360
	 	 	 	ANALOG
	 	04.3.22
	 	TERADYNE
	 	 	 	 	 	S/D
	A360 Count
	 	12
	 	 	 	 	 	 	 	 	 	4
	 	4
	 	4
	13
	 	A5XX
	 	40002923
	 	ANALOG
	 	04.3.12
	 	TERADYNE
	 	 	 	EXCESS	 	 
	14
	 	A5XX
	 	40002924
	 	ANALOG
	 	04.3.25
	 	TERADYNE
	 	 	 	EXCESS	 	 
	15
	 	A5XX
	 	40002219
	 	ANALOG
	 	02.8.22
	 	TERADYNE
	 	CORE	 	 	 	 
	16
	 	A5XX
	 	40002220
	 	ANALOG
	 	02.8.22
	 	TERADYNE
	 	CORE	 	 	 	 
	17
	 	A5XX
	 	40002965
	 	ANALOG
	 	04.4.2
	 	TERADYNE
	 	CORE	 	 	 	 
	A5XX Count
	 	5
	 	 	 	 	 	 	 	 	 	3
	 	2
	 	0
	18
	 	ASL1000
	 	40000755
	 	ANALOG
	 	99.11.7
	 	CREDENCE
	 	CORE	 	 	 	 
	19
	 	ASL1000
	 	40000756
	 	ANALOG
	 	99.11.7
	 	CREDENCE
	 	CORE	 	 	 	 
	20
	 	ASL1000
	 	40002607
	 	ANALOG
	 	02.5.17
	 	CREDENCE
	 	CORE	 	 	 	 
	21
	 	ASL1000
	 	40002606
	 	ANALOG
	 	02.5.17
	 	CREDENCE
	 	 	 	EXCESS	 	 
	ASL1000 Count
	 	4
	 	 	 	 	 	 	 	 	 	3
	 	1
	 	0
	22
	 	DUO
	 	40002642
	 	ANALOG
	 	03.9.4
	 	CREDENCE
	 	CORE	 	 	 	 
	23
	 	DUO
	 	40003073
	 	ANALOG
	 	04.2.2
	 	CREDENCE
	 	CORE	 	 	 	 
	DUO Count
	 	2
	 	 	 	 	 	 	 	 	 	2
	 	0
	 	0
	24
	 	EPRO
	 	40000286
	 	MEMORY
	 	97.3.14
	 	CREDENCE
	 	CORE	 	 	 	 
	25
	 	EPRO
	 	40000287
	 	MEMORY
	 	97.3.14
	 	CREDENCE
	 	CORE	 	 	 	 
	26
	 	EPRO
	 	40000293
	 	MEMORY
	 	97.3.14
	 	CREDENCE
	 	CORE	 	 	 	 
	27
	 	EPRO
	 	40000294
	 	MEMORY
	 	97.3.14
	 	CREDENCE
	 	CORE	 	 	 	 
	28
	 	EPRO
	 	40000295
	 	MEMORY
	 	97.3.14
	 	CREDENCE
	 	CORE	 	 	 	 
	29
	 	EPRO
	 	40000291
	 	MEMORY
	 	97.3.21
	 	CREDENCE
	 	 	 	 	 	S/D
	30
	 	EPRO
	 	40000290
	 	MEMORY
	 	97.3.21
	 	CREDENCE
	 	CORE	 	 	 	 
	31
	 	EPRO
	 	40000289
	 	MEMORY
	 	97.11.4
	 	CREDENCE
	 	CORE	 	 	 	 
	32
	 	EPRO
	 	40000296
	 	MEMORY
	 	97.11.4
	 	CREDENCE
	 	CORE	 	 	 	 
	33
	 	EPRO
	 	40000288
	 	MEMORY
	 	97.11.4
	 	CREDENCE
	 	CORE	 	 	 	 
	34
	 	EPRO
	 	40001020
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	35
	 	EPRO
	 	40000416
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	36
	 	EPRO
	 	40000417
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	37
	 	EPRO
	 	40000418
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	38
	 	EPRO
	 	40000419
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	39
	 	EPRO
	 	40000420
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	40
	 	EPRO
	 	40000761
	 	MEMORY
	 	00.2.18
	 	CREDENCE
	 	CORE	 	 	 	 
	41
	 	EPRO
	 	40000762
	 	MEMORY
	 	00.2.18
	 	CREDENCE
	 	CORE	 	 	 	 
	42
	 	EPRO
	 	40000763
	 	MEMORY
	 	00.2.18
	 	CREDENCE
	 	CORE	 	 	 	 
	43
	 	EPRO
	 	40000764
	 	MEMORY
	 	00.2.18
	 	CREDENCE
	 	 	 	 	 	S/D
	44
	 	EPRO
	 	40000765
	 	MEMORY
	 	00.2.18
	 	CREDENCE
	 	 	 	 	 	S/D
	45
	 	EPRO
	 	40000766
	 	MEMORY
	 	00.2.18
	 	CREDENCE
	 	CORE	 	 	 	 
	46
	 	EPRO
	 	40000767
	 	MEMORY
	 	00.2.18
	 	CREDENCE
	 	 	 	 	 	S/D
	47
	 	EPRO
	 	40000768
	 	MEMORY
	 	00.2.18
	 	CREDENCE
	 	CORE	 	 	 	 
	48
	 	EPRO
	 	40001031
	 	MEMORY
	 	00.9.14
	 	CREDENCE
	 	 	 	 	 	S/D
	49
	 	EPRO
	 	40001034
	 	MEMORY
	 	00.9.14
	 	CREDENCE
	 	 	 	 	 	S/D
	50
	 	EPRO
	 	40001032
	 	MEMORY
	 	00.9.21
	 	CREDENCE
	 	CORE	 	 	 	 
	51
	 	EPRO
	 	40001033
	 	MEMORY
	 	00.9.21
	 	CREDENCE
	 	CORE	 	 	 	 
	52
	 	EPRO
	 	40001035
	 	MEMORY
	 	00.9.21
	 	CREDENCE
	 	CORE	 	 	 	 
	53
	 	EPRO
	 	40001037
	 	MEMORY
	 	00.9.21
	 	CREDENCE
	 	CORE	 	 	 	 
	54
	 	EPRO
	 	40001038
	 	MEMORY
	 	00.9.21
	 	CREDENCE
	 	CORE	 	 	 	 






 









Table of Contents






	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO	 	Platform	 	Asset	 	Device	 	Arrived at SCC	 	Vendor	 	CORE	 	Excess	 	S/D
	55
	 	EPRO
	 	40000654
	 	MEMORY
	 	00.9.21
	 	CREDENCE
	 	CORE	 	 	 	 
	56
	 	EPRO
	 	40000655
	 	MEMORY
	 	00.9.21
	 	CREDENCE
	 	 	 	 
	 	S/D
	57
	 	EPRO
	 	40001004
	 	MEMORY
	 	97.3.19
	 	CREDENCE
	 	CORE	 	 	 	 
	58
	 	EPRO
	 	40001005
	 	MEMORY
	 	97.3.19
	 	CREDENCE
	 	CORE	 	 	 	 
	59
	 	EPRO
	 	40001006
	 	MEMORY
	 	97.7.28
	 	CREDENCE
	 	 	 	 	 	S/D
	60
	 	EPRO
	 	40001007
	 	MEMORY
	 	97.12.4
	 	CREDENCE
	 	CORE	 	 	 	 
	61
	 	EPRO
	 	40001008
	 	MEMORY
	 	97.12.4
	 	CREDENCE
	 	CORE	 	 	 	 
	62
	 	EPRO
	 	40001014
	 	MEMORY
	 	98.2.27
	 	CREDENCE
	 	 	 	 	 	S/D
	63
	 	EPRO
	 	40001015
	 	MEMORY
	 	98.2.27
	 	CREDENCE
	 	CORE	 	 	 	 
	64
	 	EPRO
	 	40001016
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	65
	 	EPRO
	 	40001017
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	66
	 	EPRO
	 	40001018
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	67
	 	EPRO
	 	40001019
	 	MEMORY
	 	98.9.25
	 	CREDENCE
	 	CORE	 	 	 	 
	EPRO Count
	 	44
	 	 	 	 	 	 	 	 	 	35
	 	0
	 	9
	68
	 	ETS300
	 	40002892
	 	ANALOG
	 	04.3.5
	 	EAGLE
	 	 	 	EXCESS	 	 
	69
	 	ETS300
	 	40003249
	 	ANALOG
	 	04.6.23
	 	EAGLE
	 	CORE	 	 	 	 
	ETS300 Count
	 	2
	 	 	 	 	 	 	 	 	 	1
	 	1
	 	0
	70
	 	ETS300_TI
	 	40002810
	 	ANALOG
	 	03.12.4
	 	EAGLE
	 	 	 	 	 	S/D
	71
	 	ETS300_TI
	 	40003254
	 	ANALOG
	 	04.6.23
	 	EAGLE
	 	 	 	EXCESS	 	 
	72
	 	ETS300_TI
	 	40003148
	 	ANALOG
	 	04.7.22
	 	EAGLE
	 	 	 	EXCESS	 	 
	ETS300_TI Count
	 	3
	 	 	 	 	 	 	 	 	 	0
	 	2
	 	1
	73
	 	ETS364
	 	40002605
	 	ANALOG
	 	02.12.17
	 	EAGLE
	 	CORE	 	 	 	 
	74
	 	ETS364
	 	40002589
	 	ANALOG
	 	03.4.25
	 	EAGLE
	 	CORE	 	 	 	 
	75
	 	ETS364
	 	40002686
	 	ANALOG
	 	03.5.9
	 	EAGLE
	 	CORE	 	 	 	 
	76
	 	ETS364
	 	40002685
	 	ANALOG
	 	03.5.9
	 	EAGLE
	 	CORE	 	 	 	 
	77
	 	ETS364
	 	40002687
	 	ANALOG
	 	03.5.29
	 	EAGLE
	 	CORE	 	 	 	 
	ETS364 Count
	 	5
	 	 	 	 	 	 	 	 	 	5
	 	0
	 	0
	78
	 	HP94XX
	 	40002735
	 	ANALOG
	 	03.8.28
	 	AGILENT
	 	 	 	EXCESS	 	 
	79
	 	HP94XX
	 	40002736
	 	ANALOG
	 	03.9.23
	 	AGILENT
	 	CORE	 	 	 	 
	80
	 	HP94XX
	 	40002737
	 	ANALOG
	 	03.9.23
	 	AGILENT
	 	CORE	 	 	 	 
	81
	 	HP94XX
	 	40002738
	 	ANALOG
	 	03.9.23
	 	AGILENT
	 	CORE	 	 	 	 
	82
	 	HP94XX
	 	40002734
	 	ANALOG
	 	03.11.25
	 	AGILENT
	 	CORE	 	 	 	 
	83
	 	HP94XX
	 	40002733
	 	ANALOG
	 	03.11.25
	 	AGILENT
	 	CORE	 	 	 	 
	84
	 	HP94XX
	 	40003075
	 	ANALOG
	 	04.2.2
	 	AGILENT
	 	 	 	 	 	S/D
	85
	 	HP94XX
	 	40003077
	 	ANALOG
	 	04.2.16
	 	AGILENT
	 	CORE	 	 	 	 
	86
	 	HP94XX
	 	40003076
	 	ANALOG
	 	04.2.16
	 	AGILENT
	 	CORE	 	 	 	 
	87
	 	HP94XX
	 	40003078
	 	ANALOG
	 	04.2.20
	 	AGILENT
	 	CORE	 	 	 	 
	88
	 	HP94XX
	 	40003222
	 	ANALOG
	 	04.7.29
	 	AGILENT
	 	CORE	 	 	 	 
	89
	 	HP94XX
	 	40003223
	 	ANALOG
	 	04.9.9
	 	AGILENT
	 	CORE	 	 	 	 
	90
	 	HP94XX
	 	40003221
	 	ANALOG
	 	04.11.2
	 	AGILENT
	 	 	 	EXCESS	 	 
	HP94XX Count
	 	13
	 	 	 	 	 	 	 	 	 	10
	 	2
	 	1
	91
	 	J750
	 	40003210
	 	ANALOG
	 	04.7.12
	 	TERADYNE
	 	CORE	 	 	 	 
	92
	 	J750
	 	40003251
	 	ANALOG
	 	04.11.8
	 	TERADYNE
	 	CORE	 	 	 	 
	93
	 	J750
	 	40003353
	 	ANALOG
	 	05.3.15
	 	TERADYNE
	 	CORE	 	 	 	 
	J750 Count
	 	3
	 	 	 	 	 	 	 	 	 	3
	 	0
	 	0
	94
	 	LTX77
	 	40001359
	 	ANALOG
	 	00.10.6
	 	LTX
	 	 	 	EXCESS	 	 
	95
	 	LTX77
	 	40001364
	 	ANALOG
	 	00.10.6
	 	LTX
	 	 	 	EXCESS	 	 
	96
	 	LTX77
	 	40001358
	 	ANALOG
	 	00.10.6
	 	LTX
	 	CORE	 	 	 	 
	97
	 	LTX77
	 	40001356
	 	ANALOG
	 	00.10.6
	 	LTX
	 	 	 	EXCESS	 	 
	98
	 	LTX77
	 	40001355
	 	ANALOG
	 	00.10.6
	 	LTX
	 	CORE	 	 	 	 
	99
	 	LTX77
	 	40001365
	 	ANALOG
	 	00.10.6
	 	LTX
	 	 	 	EXCESS	 	 
	100
	 	LTX77
	 	40001363
	 	ANALOG
	 	00.10.6
	 	LTX
	 	CORE	 	 	 	 
	101
	 	LTX77
	 	40001360
	 	ANALOG
	 	00.10.6
	 	LTX
	 	 	 	EXCESS	 	 
	102
	 	LTX77
	 	40001947
	 	ANALOG
	 	02.2.1
	 	LTX
	 	CORE	 	 	 	 
	103
	 	LTX77
	 	40001943
	 	ANALOG
	 	02.2.1
	 	LTX
	 	 	 	EXCESS	 	 
	104
	 	LTX77
	 	40001944
	 	ANALOG
	 	02.2.1
	 	LTX
	 	 	 	EXCESS	 	 
	105
	 	LTX77
	 	40001945
	 	ANALOG
	 	02.2.1
	 	LTX
	 	 	 	EXCESS	 	 
	106
	 	LTX77
	 	40001946
	 	ANALOG
	 	02.2.1
	 	LTX
	 	 	 	EXCESS	 	 
	107
	 	LTX77
	 	40002239
	 	ANALOG
	 	02.9.4
	 	LTX
	 	CORE	 	 	 	 
	108
	 	LTX77
	 	40002584
	 	ANALOG
	 	03.6.6
	 	LTX
	 	CORE	 	 	 	 






 









Table of Contents






	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO	 	Platform	 	Asset	 	Device	 	Arrived at SCC	 	Vendor	 	CORE	 	Excess	 	S/D
	109
	 	LTX77
	 	40002582
	 	ANALOG
	 	03.6.6
	 	LTX
	 	CORE	 	 	 	 
	110
	 	LTX77
	 	40002973
	 	ANALOG
	 	04.4.28
	 	LTX
	 	CORE	 	 	 	 
	111
	 	LTX77
	 	40003119
	 	ANALOG
	 	04.7.8
	 	LTX
	 	CORE	 	 	 	 
	112
	 	LTX77
	 	40003170
	 	ANALOG
	 	04.8.23
	 	LTX
	 	CORE	 	 	 	 
	113
	 	LTX77
	 	40003171
	 	ANALOG
	 	04.8.23
	 	LTX
	 	CORE	 	 	 	 
	114
	 	LTX77
	 	40003211
	 	ANALOG
	 	04.11.12
	 	LTX
	 	CORE	 	 	 	 
	LTX77 Count
	 	21
	 	 	 	 	 	 	 	 	 	12
	 	9
	 	0
	115
	 	M3650
	 	40003354
	 	MIX
	 	00.2.16
	 	CREDENCE
	 	 	 	EXCESS	 	 
	116
	 	M3650
	 	40001863
	 	MIX
	 	01.12.18
	 	CREDENCE
	 	CORE	 	 	 	 
	117
	 	M3650
	 	40003363
	 	MIX
	 	05.4.28
	 	CREDENCE
	 	CORE	 	 	 	 
	M3650 Count
	 	3
	 	 	 	 	 	 	 	 	 	2
	 	1
	 	0
	118
	 	MAGNUM
	 	NA
	 	DIGITAL
	 	05.6.6
	 	NEXTEST
	 	CORE	 	 	 	 
	MAGNUM Count
	 	1
	 	 	 	 	 	 	 	 	 	1
	 	0
	 	0
	119
	 	MAVERICK PT
	 	40003307
	 	DIGITAL
	 	04.6.8
	 	NEXTEST
	 	CORE	 	 	 	 
	MAVERICK PT Count
	 	1	 	 
	 	 
	 	 
	 	 
	 	1
	 	0
	 	0
	120
	 	Q2/62
	 	40001897
	 	LOGIC
	 	01.6.11
	 	MEGATEST
	 	 
	 	EXCESS
	 	 
	121
	 	Q2/62
	 	40002567
	 	LOGIC
	 	01.6.11
	 	MEGATEST
	 	CORE	 	 	 	 
	122
	 	Q2/62
	 	40001869
	 	LOGIC
	 	01.12.18
	 	MEGATEST
	 	 	 	 	 	S/D
	123
	 	Q2/62
	 	40001874
	 	LOGIC
	 	01.12.18
	 	MEGATEST
	 	 	 	 	 	S/D
	124
	 	Q2/62
	 	40001872
	 	LOGIC
	 	01.12.18
	 	MEGATEST
	 	 	 	 	 	S/D
	125
	 	Q2/62
	 	40001873
	 	LOGIC
	 	01.12.18
	 	MEGATEST
	 	 	 	 	 	S/D
	126
	 	Q2/62
	 	40001868
	 	LOGIC
	 	01.12.18
	 	MEGATEST
	 	CORE	 	 	 	 
	127
	 	Q2/62
	 	40001865
	 	LOGIC
	 	01.12.18
	 	MEGATEST
	 	 	 	 	 	S/D
	128
	 	Q2/62
	 	40001866
	 	LOGIC
	 	01.12.18
	 	MEGATEST
	 	CORE	 	 	 	 
	Q2/62 Count
	 	9
	 	 	 	 	 	 	 	 	 	3
	 	1
	 	5
	129
	 	SENTRY
	 	40002238
	 	DIGITAL
	 	02.9.4
	 	SCHLUMBERGER
	 	 	 	 	 	S/D
	130
	 	SENTRY
	 	40001876
	 	DIGITAL
	 	01.12.18
	 	SCHLUMBERGER
	 	 	 	 	 	S/D
	131
	 	SENTRY
	 	40001877
	 	DIGITAL
	 	01.12.18
	 	SCHLUMBERGER
	 	 	 	 	 	S/D
	SENTRY Count
	 	3
	 	 	 	 	 	 	 	 	 	0
	 	0
	 	3
	132
	 	VISTA
	 	40002729
	 	DIGITAL
	 	03.8.6
	 	CREDENCE
	 	CORE	 	 	 	 
	133
	 	VISTA
	 	40002728
	 	DIGITAL
	 	03.8.14
	 	CREDENCE
	 	 	 	 	 	S/D
	134
	 	VISTA
	 	40002730
	 	DIGITAL
	 	03.9.23
	 	CREDENCE
	 	CORE	 	 	 	 
	135
	 	VISTA
	 	40002726
	 	DIGITAL
	 	03.9.23
	 	CREDENCE
	 	 	 	EXCESS	 	 
	136
	 	VISTA
	 	40002727
	 	DIGITAL
	 	03.11.25
	 	CREDENCE
	 	 	 	EXCESS	 	 
	137
	 	VISTA
	 	40003074
	 	DIGITAL
	 	04.2.16
	 	CREDENCE
	 	CORE	 	 	 	 
	VISTA Count
	 	6
	 	 	 	 	 	 	 	 	 	3
	 	2
	 	1
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	Grand Count
	 	137
	 	 	 	 	 	 	 	 	 	88
	 	25
	 	24






 









Table of Contents











SCC Handler Review -Out




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 	 	Platform	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO	 	(Sum)	 	Module	 	Asset	 	Device	 	Arrived at SCC	 	Vendor	 	CORE	 	Excess	 	S/D
	1
	 	AAT
	 	AAT
	 	40002092
	 	SOIC 150mil
	 	02.5.10
	 	AAT
	 	 	 	 	 	S/D
	2
	 	AAT
	 	AAT
	 	40003387
	 	SOIC 150mil
	 	05.9.24
	 	AAT
	 	 	 	Excess	 	 
	3
	 	AAT
	 	AAT
	 	40001516
	 	LGA 5*8
	 	01.6.16
	 	AAT
	 	 	 	 	 	S/D
	4
	 	AAT
	 	AAT
	 	40001581
	 	LGA 5*8
	 	01.10.25
	 	AAT
	 	 	 	 	 	S/D
	5
	 	AAT
	 	AAT
	 	40001582
	 	LGA 5*8
	 	01.12.6
	 	AAT
	 	 	 	 	 	S/D
	6
	 	AAT
	 	AAT
	 	40002347
	 	SOIC 150mil
	 	02.8.5
	 	AAT
	 	 	 	 	 	S/D
	AAT Count
	 	6
	 	 	 	 	 	 	 	 	 	 	 	0
	 	1
	 	5
	7
	 	AET5050
	 	AETRIUM 5050T
	 	40002744
	 	SSOP 208mil
	 	03.9.3
	 	AETRIUM
	 	CORE	 	 	 	 
	8
	 	AET5050
	 	AETRIUM 5050T
	 	40003082
	 	SOIC 300mil
	 	03.9.18
	 	AETRIUM
	 	CORE	 	 	 	 
	9
	 	AET5050
	 	AETRIUM 5050T
	 	40002745
	 	SOIC 300mil
	 	03.11.25
	 	AETRIUM
	 	CORE	 	 	 	 
	10
	 	AET5050
	 	AETRIUM 5050T
	 	40002869
	 	SSOP 208mil
	 	04.4.14
	 	AETRIUM
	 	 	 	Excess	 	 
	11
	 	AET5050
	 	AETRIUM 5050T
	 	40003227
	 	SOIC 300mil
	 	04.10.6
	 	AETRIUM
	 	 	 	 	 	S/D
	12
	 	AET5050
	 	AETRIUM 5050T
	 	40002743
	 	SOIC 300mil
	 	04.2.3
	 	AETRIUM
	 	 	 	 	 	S/D
	13
	 	AET5050
	 	AETRIUM 5050T
	 	40002868
	 	SOIC 300mil
	 	04.2.9
	 	AETRIUM
	 	 	 	 	 	S/D
	14
	 	AET5050
	 	AETRIUM 5050T
	 	40003226
	 	SOIC 300mil
	 	04.11.2
	 	AETRIUM
	 	 	 	 	 	S/D
	AET5050 Count
	 	8
	 	 	 	 	 	 	 	 	 	 	 	3
	 	1
	 	4
	15
	 	AET3300
	 	AETRIUM 3300
	 	40002741
	 	PLCC 44
	 	03.10.20
	 	AETRIUM
	 	CORE	 	 	 	 
	16
	 	AET3300
	 	AETRIUM 3300
	 	40002862
	 	PLCC 28
	 	04.2.16
	 	AETRIUM
	 	 	 	 	 	S/D
	17
	 	AET3300
	 	AETRIUM 3300
	 	40002866
	 	SOIC 300mil
	 	04.2.9
	 	AETRIUM
	 	 	 	 	 	S/D
	18
	 	AET3300
	 	AETRIUM 3300
	 	40002865
	 	PLCC 44
	 	04.2.16
	 	AETRIUM
	 	 	 	 	 	S/D
	19
	 	AET3300
	 	AETRIUM 3300
	 	40002977
	 	PLCC 68
	 	04.3.3
	 	AETRIUM
	 	 	 	 	 	S/D
	20
	 	AET3300
	 	AETRIUM 3300
	 	40002980
	 	PLCC 68
	 	04.3.3
	 	AETRIUM
	 	 	 	 	 	S/D
	21
	 	AET3300
	 	AETRIUM 3300
	 	40003225
	 	PLCC
	 	04.10.6
	 	AETRIUM
	 	 	 	 	 	S/D
	22
	 	AET3300
	 	AETRIUM 3300
	 	40002742
	 	SOIC 300mil
	 	03.10.20
	 	AETRIUM
	 	 	 	 	 	S/D
	AET3300 Count
	 	8
	 	 	 	 	 	 	 	 	 	 	 	1
	 	0
	 	7
	23
	 	AESCO
	 	ASECO S-130
	 	40002399
	 	PLCC 28
	 	03.1.29
	 	ASECO
	 	 	 	 	 	S/D
	24
	 	AESCO
	 	ASECO S-130
	 	40002398
	 	PLCC 28
	 	03.1.29
	 	ASECO
	 	 	 	Excess	 	 
	25
	 	AESCO
	 	ASECO S-130
	 	40002400
	 	PLCC 28
	 	03.1.29
	 	ASECO
	 	 	 	Excess	 	 
	26
	 	AESCO
	 	S-130
	 	40001889
	 	PLCC20
	 	01.12.18
	 	ASECO
	 	 	 	 	 	S/D
	27
	 	AESCO
	 	S-130
	 	40001888
	 	PLCC 20
	 	01.12.18
	 	ASECO
	 	 	 	 	 	S/D
	28
	 	AESCO
	 	S-130
	 	40002397
	 	PLCC 28
	 	03.1.29
	 	ASECO
	 	 	 	 	 	S/D
	AESCO Count
	 	6
	 	 	 	 	 	 	 	 	 	 	 	0
	 	2
	 	4
	29
	 	ASM
	 	ASM matrix
	 	40002725
	 	SOIC 8
	 	02.10.17
	 	ASM
	 	CORE	 	 	 	 
	30
	 	ASM
	 	ASM matrix
	 	40003357
	 	SOIC 8
	 	04.9.29
	 	ASM
	 	CORE	 	 	 	 
	31
	 	ASM
	 	ASM FT1000
	 	 	 	SOIC 8
	 	05.7.28
	 	ASM
	 	CORE	 	 	 	 
	ASM Count
	 	3
	 	 	 	 	 	 	 	 	 	 	 	3
	 	0
	 	0
	32
	 	KUWANO
	 	LT-930-H222
	 	40001373
	 	SOIC 8-20
	 	00.10.6
	 	KUWANO
	 	CORE	 	 	 	 
	33
	 	KUWANO
	 	LT-930-H222
	 	40002774
	 	SOIC 8-20
	 	03.11.27
	 	KUWANO
	 	CORE	 	 	 	 
	34
	 	KUWANO
	 	LT-930-H222
	 	40002894
	 	SOIC 8-20
	 	04.3.12
	 	KUWANO
	 	CORE	 	 	 	 
	35
	 	KUWANO
	 	LT-930-H222
	 	40002895
	 	SOIC 8-20
	 	04.3.12
	 	KUWANO
	 	CORE	 	 	 	 
	36
	 	KUWANO
	 	LT-930-H222
	 	40002970
	 	SOIC 8-20
	 	04.4.21
	 	KUWANO
	 	CORE	 	 	 	 
	37
	 	KUWANO
	 	LT-930-H222
	 	40002971
	 	SOIC 8-20
	 	04.4.21
	 	KUWANO
	 	CORE	 	 	 	 
	38
	 	KUWANO
	 	LT-930-H222
	 	40002976
	 	SOIC 8-20
	 	04.4.28
	 	KUWANO
	 	CORE	 	 	 	 
	39
	 	KUWANO
	 	LT-930-H222
	 	40003087
	 	SOIC 8-20
	 	04.6.11
	 	KUWANO
	 	CORE	 	 	 	 
	40
	 	KUWANO
	 	LT-930-H222
	 	40001376
	 	SOIC 8-20
	 	00.10.6
	 	KUWANO
	 	 	 	 	 	S/D
	41
	 	KUWANO
	 	LT-930-H222
	 	40002070
	 	SOIC 8-20
	 	02.6.20
	 	KUWANO
	 	 	 	 	 	S/D
	KUWANO Count
	 	10
	 	 	 	 	 	 	 	 	 	 	 	8
	 	0
	 	2
	42
	 	MCT
	 	MCT-3608 A3
	 	40001381
	 	PDIP 300mil
	 	00.10.6
	 	MCT
	 	CORE	 	 	 	 
	43
	 	MCT
	 	MCT-3608 AE
	 	40002454
	 	PDIP 300mil
	 	00.10.6
	 	MCT
	 	CORE	 	 	 	 
	44
	 	MCT
	 	MCT-3608 A3
	 	40001380
	 	PDIP 300mil
	 	00.10.6
	 	MCT
	 	CORE	 	 	 	 
	45
	 	MCT
	 	MCT-3608 A3
	 	40000628
	 	PDIP 300mil
	 	00.10.6
	 	MCT
	 	CORE	 	 	 	 
	46
	 	MCT
	 	MCT-3608 A3
	 	40001379
	 	PDIP 300mil
	 	00.10.6
	 	MCT
	 	CORE	 	 	 	 
	47
	 	MCT
	 	MCT-3608 A3
	 	40001377
	 	PDIP 300mil
	 	00.10.6
	 	MCT
	 	CORE	 	 	 	 
	48
	 	MCT
	 	MCT-3608 A3
	 	40001723
	 	PDIP 300mil
	 	01.10.16
	 	MCT
	 	CORE	 	 	 	 
	49
	 	MCT
	 	MCT-3608 A3
	 	40001727
	 	PDIP 300mil
	 	01.10.16
	 	MCT
	 	CORE	 	 	 	 
	50
	 	MCT
	 	MCT-3608 A3
	 	40001722
	 	PDIP 300mil
	 	01.10.16
	 	MCT
	 	CORE	 	 	 	 
	51
	 	MCT
	 	MCT-3608 A3
	 	40001724
	 	PDIP 300mil
	 	01.10.16
	 	MCT
	 	CORE	 	 	 	 
	52
	 	MCT
	 	MCT-3608 ES
	 	40002001
	 	PDIP 300mil
	 	02.3.14
	 	MCT
	 	CORE	 	 	 	 
	53
	 	MCT
	 	MCT-3608 ES
	 	40002002
	 	PDIP 300mil
	 	02.3.14
	 	MCT
	 	CORE	 	 	 	 
	54
	 	MCT
	 	MCT-3608 ES
	 	40001996
	 	PDIP 300mil
	 	02.3.14
	 	MCT
	 	 	 	 	 	S/D
	55
	 	MCT
	 	MCT-3608 ES
	 	40001999
	 	PDIP 300mil
	 	02.3.14
	 	MCT
	 	 	 	Excess	 	 
	56
	 	MCT
	 	MCT-3608 A
	 	40002234
	 	PDIP 300mil
	 	02.9.4
	 	MCT
	 	 	 	Excess	 	 
	57
	 	MCT
	 	MCT-3608 A
	 	40002237
	 	PDIP 300mil
	 	02.9.4
	 	MCT
	 	 	 	Excess	 	 
	58
	 	MCT
	 	MCT-3608 A
	 	40002235
	 	PDIP 300mil
	 	02.9.4
	 	MCT
	 	 	 	 	 	S/D
	59
	 	MCT
	 	MCT-3608 A
	 	40002236
	 	PDIP 300mil
	 	02.9.4
	 	MCT
	 	CORE	 	 	 	 
	60
	 	MCT
	 	MCT-3608 A
	 	40002452
	 	PDIP 300mil
	 	03.3.7
	 	MCT
	 	CORE	 	 	 	 
	61
	 	MCT
	 	MCT-3608 A
	 	40002450
	 	PDIP 300mil
	 	03.3.7
	 	MCT
	 	CORE	 	 	 	 
	62
	 	MCT
	 	MCT-3608 A
	 	40002453
	 	PDIP 300mil
	 	03.3.7
	 	MCT
	 	CORE	 	 	 	 
	63
	 	MCT
	 	MCT-3608 A3
	 	40002457
	 	PDIP 300mil
	 	03.4.3
	 	MCT
	 	 	 	Excess	 	 






 









Table of Contents





	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 	 	Platform	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO	 	(Sum)	 	Module	 	Asset	 	Device	 	Arrived at SCC	 	Vendor	 	CORE	 	Excess	 	S/D
	64
	 	MCT
	 	MCT-3608 A3
	 	40002456
	 	PDIP 300mil
	 	03.4.3
	 	MCT
	 	 	 	Excess	 	 
	65
	 	MCT
	 	MCT-3608 A3
	 	40001806
	 	PDIP 300mil
	 	03.4.3
	 	MCT
	 	 	 	Excess	 	 
	66
	 	MCT
	 	MCT-3608 A3
	 	40001382
	 	PDIP 300mil
	 	03.4.3
	 	MCT
	 	 	 	Excess	 	 
	67
	 	MCT
	 	MCT-3608 E
	 	40002920
	 	PDIP 600mil
	 	04.3.5
	 	MCT
	 	CORE	 	 	 	 
	68
	 	MCT
	 	MCT-3608 A
	 	40002921
	 	PDIP 600mil
	 	04.3.5
	 	MCT
	 	CORE	 	 	 	 
	69
	 	MCT
	 	MCT-3608 E
	 	40002951
	 	PDIP 300mil
	 	04.3.17
	 	MCT
	 	 	 	Excess	 	 
	70
	 	MCT
	 	MCT-3608 E
	 	40002952
	 	PDIP 300mil
	 	04.3.17
	 	MCT
	 	 	 	Excess	 	 
	71
	 	MCT
	 	MCT-3608 E
	 	40002945
	 	PDIP 300mil
	 	04.3.17
	 	MCT
	 	 	 	Excess	 	 
	72
	 	MCT
	 	MCT-3608 E
	 	40002948
	 	PDIP 300mil
	 	04.3.17
	 	MCT
	 	 	 	Excess	 	 
	73
	 	MCT
	 	MCT-3608 E
	 	40000277
	 	PDIP 300mil
	 	97.3.14
	 	MCT
	 	 	 	 	 	S/D
	74
	 	MCT
	 	MCT-3608 E3
	 	40001707
	 	PDIP 300mil
	 	01.3.27
	 	MCT
	 	 	 	 	 	S/D
	75
	 	MCT
	 	MCT-3608 ES
	 	40002005
	 	PDIP 300mil
	 	02.3.14
	 	MCT
	 	 	 	 	 	S/D
	76
	 	MCT
	 	MCT-3608 ES
	 	40002004
	 	PDIP 300mil
	 	02.3.14
	 	MCT
	 	 	 	 	 	S/D
	77
	 	MCT
	 	MCT-3608 E
	 	40002953
	 	PDIP 300mil
	 	04.3.17
	 	MCT
	 	 	 	 	 	S/D
	78
	 	MCT
	 	MCT-3608 E
	 	40002944
	 	PDIP 300mil
	 	04.3.17
	 	MCT
	 	 	 	 	 	S/D
	79
	 	MCT
	 	MCT-3608 E
	 	40002946
	 	PDIP 300mil
	 	04.3.17
	 	MCT
	 	 	 	 	 	S/D
	80
	 	MCT
	 	MCT-3608 E
	 	40002947
	 	PDIP 300mil
	 	04.3.17
	 	MCT
	 	 	 	 	 	S/D
	81
	 	MCT
	 	MCT-3608
	 	 	 	PDIP 300mil
	 	04.8.23
	 	MCT
	 	 	 	 	 	S/D
	82
	 	MCT
	 	MCT-3608
	 	 	 	PDIP 300mil
	 	04.8.23
	 	MCT
	 	 	 	 	 	S/D
	83
	 	MCT
	 	MCT-3608
	 	 	 	PDIP 300mil
	 	04.8.23
	 	MCT
	 	 	 	 	 	S/D
	84
	 	MCT
	 	MCT-3608
	 	 	 	PDIP 300mil
	 	04.8.23
	 	MCT
	 	 	 	 	 	S/D
	MCT Count
	 	43
	 	 	 	 	 	 	 	 	 	 	 	18
	 	11
	 	14
	85
	 	SESSCO
	 	SESSCO
	 	40002093
	 	SOIC 24
	 	02.6.12
	 	SESSCO
	 	 	 	Excess	 	 
	86
	 	SESSCO
	 	SESSCO
	 	40002796
	 	SOIC 150mil
	 	03.10.20
	 	SESSCO
	 	 	 	 	 	S/D
	87
	 	SESSCO
	 	SESSCO
	 	40002795
	 	SOIC 150mil
	 	03.10.20
	 	SESSCO
	 	 	 	 	 	S/D
	88
	 	SESSCO
	 	SESSCO
	 	40002802
	 	SOIC 150mil
	 	03.11.6
	 	SESSCO
	 	 	 	 	 	S/D
	89
	 	SESSCO
	 	SESSCO
	 	40002803
	 	SOIC 150mil
	 	03.11.6
	 	SESSCO
	 	 	 	 	 	S/D
	90
	 	SESSCO
	 	SESSCO
	 	40002804
	 	SOIC 150mil
	 	03.11.24
	 	SESSCO
	 	CORE	 	 	 	 
	91
	 	SESSCO
	 	SESSCO
	 	40002798
	 	SOIC 150mil
	 	03.11.24
	 	SESSCO
	 	CORE	 	 	 	 
	92
	 	SESSCO
	 	SESSCO
	 	40002801
	 	SOIC 150mil
	 	03.12.8
	 	SESSCO
	 	CORE	 	 	 	 
	93
	 	SESSCO
	 	SESSCO
	 	40002799
	 	SOIC 150mil
	 	03.12.23
	 	SESSCO
	 	 	 	 	 	S/D
	94
	 	SESSCO
	 	SESSCO
	 	40003010
	 	SOIC 150mil
	 	04.5.13
	 	SESSCO
	 	CORE	 	 	 	 
	95
	 	SESSCO
	 	SESSCO
	 	40002702
	 	SOIC 150mil
	 	03.8.9
	 	SESSCO
	 	 	 	 	 	S/D
	96
	 	SESSCO
	 	SESSCO
	 	40002797
	 	SOIC 150mil
	 	03.10.20
	 	SESSCO
	 	 	 	 	 	S/D
	97
	 	SESSCO
	 	SESSCO
	 	40002800
	 	SOIC 150mil
	 	03.12.8
	 	SESSCO
	 	 	 	 	 	S/D
	98
	 	SESSCO
	 	SESSCO
	 	40002652
	 	MSOP 8
	 	02.10.17
	 	SESSCO
	 	 	 	 	 	S/D
	SESSCO Count
	 	14
	 	 	 	 	 	 	 	 	 	 	 	4
	 	1
	 	9
	99
	 	RASCO
	 	SO 1000H
	 	40000776
	 	SOIC 8-28(150/208MIL)
	 	99.11.25
	 	RASCO
	 	CORE	 	 	 	 
	100
	 	RASCO
	 	SO 1000H
	 	40000777
	 	SOIC
8-28(150/208MIL)
	 	99.11.30
	 	RASCO
	 	CORE	 	 	 	 
	101
	 	RASCO
	 	SO 1000H
	 	40000783
	 	SOIC 8-20 (208MIL)
	 	00.2.19
	 	RASCO
	 	CORE	 	 	 	 
	102
	 	RASCO
	 	SO 1000H
	 	40000789
	 	SOIC 8-20
	 	00.4.20
	 	RASCO
	 	CORE	 	 	 	 
	103
	 	RASCO
	 	SO 1000AH
	 	40000790
	 	SOIC 8-20
	 	00.5.24
	 	RASCO
	 	CORE	 	 	 	 
	104
	 	RASCO
	 	SO 1000AH
	 	40000791
	 	SOIC 8-20
	 	00.6.8
	 	RASCO
	 	CORE	 	 	 	 
	105
	 	RASCO
	 	SO 1000AH
	 	40000792
	 	SOIC 8-20
	 	00.6.8
	 	RASCO
	 	CORE	 	 	 	 
	106
	 	RASCO
	 	SO 1000AH
	 	40001664
	 	SOIC 8-20(208MIL)
	 	00.12.22
	 	RASCO
	 	CORE	 	 	 	 
	107
	 	RASCO
	 	SO 1000AH
	 	40001721
	 	SOIC 150mil
	 	01.9.3
	 	RASCO
	 	CORE	 	 	 	 
	108
	 	RASCO
	 	SO 1000AH
	 	40001940
	 	SOIC 8-20(208MIL)
	 	01.10.4
	 	RASCO
	 	CORE	 	 	 	 
	109
	 	RASCO
	 	SO 1000T
	 	40001942
	 	SOIC 8-20(208MIL)
	 	01.12.14
	 	RASCO
	 	CORE	 	 	 	 
	110
	 	RASCO
	 	SO 1000T
	 	40001941
	 	SOIC 8-20
	 	01.12.14
	 	RASCO
	 	CORE	 	 	 	 
	111
	 	RASCO
	 	SO 1000T
	 	40001969
	 	SOIC 8-20(208MIL)
	 	02.1.27
	 	RASCO
	 	CORE	 	 	 	 
	112
	 	RASCO
	 	SO 1000AH
	 	40002076
	 	SOIC8-20
	 	02.5.16
	 	RASCO
	 	CORE	 	 	 	 
	113
	 	RASCO
	 	SO 1000AH
	 	40002080
	 	SOIC8-20
	 	02.5.22
	 	RASCO
	 	CORE	 	 	 	 
	114
	 	RASCO
	 	SO 1000AH
	 	40002079
	 	SOIC8-20
	 	02.5.22
	 	RASCO
	 	CORE	 	 	 	 
	115
	 	RASCO
	 	SO 1000AH
	 	40002608
	 	TSSOP
	 	03.2.14
	 	RASCO
	 	 	 	Excess	 	 
	116
	 	RASCO
	 	SO 1000AH
	 	40002515
	 	TSSOP
	 	03.2.17
	 	RASCO
	 	CORE	 	 	 	 
	117
	 	RASCO
	 	SO 1000AH
	 	40002989
	 	TSSOP 8
	 	04.4.2
	 	RASCO
	 	 	 	Excess	 	 
	118
	 	RASCO
	 	SO 2000
	 	40003037
	 	TSSOP
	 	04.5.24
	 	RASCO
	 	 	 	Excess	 	 
	RASCO Count
	 	20
	 	 	 	 	 	 	 	 	 	 	 	17
	 	3
	 	0
	119
	 	SYMTEK
	 	SYMTEK 300
	 	40002755
	 	P-DIP 14-28
	 	03.10.20
	 	SYM-TEK
	 	CORE	 	 	 	 
	120
	 	SYMTEK
	 	SYMTEK 300HC
	 	40001372
	 	P-DIP 14-28
	 	00.10.6
	 	SYM-TEK
	 	 	 	 	 	S/D
	121
	 	SYMTEK
	 	SYMTEK 300HC
	 	40001878
	 	P-DIP 14-28
	 	01.12.18
	 	SYM-TEK
	 	 	 	 	 	S/D
	122
	 	SYMTEK
	 	SYMTEK 300
	 	40002871
	 	P-DIP 14-32
	 	04.2.16
	 	SYM-TEK
	 	 	 	 	 	S/D
	123
	 	SYMTEK
	 	SYMTEK 300
	 	40002870
	 	P-DIP 14-32
	 	04.2.16
	 	SYM-TEK
	 	 	 	 	 	S/D
	124
	 	SYMTEK
	 	SYMTEK 300
	 	40002872
	 	P-DIP 14-32
	 	04.2.16
	 	SYM-TEK
	 	 	 	 	 	S/D
	SYMTEK Count
	 	6
	 	 	 	 	 	 	 	 	 	 	 	1
	 	0
	 	5
	125
	 	TESEC
	 	TESEC 9210
	 	40002776
	 	SOIC 150 8-16LD
	 	03.11.27
	 	TESEC
	 	 	 	 	 	S/D
	126
	 	TESEC
	 	TESEC 8710
	 	40003213
	 	SOIC 150 8-16LD
	 	04.7.27
	 	TESEC
	 	 	 	 	 	S/D
	127
	 	TESEC
	 	TESEC 9030
	 	40003172
	 	SOIC 14-16LD
	 	04.8.23
	 	TESEC
	 	 	 	 	 	S/D
	128
	 	TESEC
	 	TESEC 8710
	 	40002775
	 	SOIC 150 8-16LD
	 	03.11.27
	 	TESEC
	 	 	 	 	 	S/D
	129
	 	TESEC
	 	TESEC 9210
	 	40002777
	 	SOIC 150 8-16LD
	 	03.11.27
	 	TESEC
	 	 	 	 	 	S/D
	130
	 	TESEC
	 	TESEC 8710
	 	40003214
	 	SOIC 150 8-16LD
	 	04.7.27
	 	TESEC
	 	 	 	 	 	S/D
	131
	 	TESEC
	 	TESEC 8710
	 	40001745
	 	SIOC 24
	 	01.11.8
	 	TESEC
	 	 	 	 	 	S/D






 









Table of Contents






	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 	 	Platform	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO	 	(Sum)	 	Module	 	Asset	 	Device	 	Arrived at SCC	 	Vendor	 	CORE	 	Excess	 	S/D
	132
	 	TESEC
	 	TESEC 9030
	 	40002778
	 	SOIC 14-16LD
	 	03.11.27
	 	TESEC
	 	 	 	 	 	S/D
	133
	 	TESEC
	 	TESEC 9210
	 	40003212
	 	SOIC 150 8-16LD
	 	04.7.27
	 	TESEC
	 	 	 	 	 	S/D
	134
	 	TESEC
	 	TESEC 9030
	 	40003157
	 	SOIC 14-16LD
	 	04.8.23
	 	TESEC
	 	 	 	 	 	S/D
	TESEC Count
	 	10
	 	 	 	 	 	 	 	 	 	 	 	0
	 	0
	 	10
	135
	 	TB150
	 	TB-150DH
	 	40000389
	 	SOIC 150mil
	 	97.10.24
	 	SEC
	 	 	 	 	 	S/D
	TB150 Count
	 	1
	 	 	 	 	 	 	 	 	 	 	 	0
	 	0
	 	1
	136
	 	MH802
	 	MH802
	 	40000774
	 	SOIC 208mil
	 	99.7.6
	 	MICROHANDLING
	 	 	 	 	 	S/D
	137
	 	MH802
	 	MH802
	 	40000775
	 	SOIC 150mil
	 	99.8.10
	 	MICROHANDING
	 	 	 	 	 	S/D
	MH802 Count
	 	2
	 	 	 	 	 	 	 	 	 	 	 	0
	 	0
	 	2
	138
	 	MT93XX
	 	MT 9308
	 	40001708
	 	SOIC 330 28L
	 	01.4.28
	 	MULTITEST
	 	CORE	 	 	 	 
	139
	 	MT93XX
	 	MT 9308
	 	40001713
	 	SOIC 330 28L
	 	01.6.13
	 	MULTITEST
	 	CORE	 	 	 	 
	140
	 	MT93XX
	 	MT 9308
	 	40002688
	 	SOIC 300mil
	 	03.4.25
	 	MULTITEST
	 	CORE	 	 	 	 
	141
	 	MT93XX
	 	MT 9308
	 	40002689
	 	SOIC 300mil
	 	03.5.6
	 	MULTITEST
	 	CORE	 	 	 	 
	142
	 	MT93XX
	 	MT 9308
	 	40002690
	 	SOIC 300mil
	 	03.5.6
	 	MULTITEST
	 	CORE	 	 	 	 
	143
	 	MT93XX
	 	MT 9308
	 	40002672
	 	SOIC 150mil
	 	03.6.26
	 	MULTITEST
	 	CORE	 	 	 	 
	144
	 	MT93XX
	 	MT 9308
	 	40002746
	 	SOIC 300mil
	 	03.9.18
	 	MULTITEST
	 	CORE	 	 	 	 
	145
	 	MT93XX
	 	MT 9308
	 	40002893
	 	SOIC 150mil
	 	04.3.22
	 	MULTITEST
	 	CORE	 	 	 	 
	146
	 	MT93XX
	 	MT 9320
	 	40002813
	 	SOIC 150mil
	 	04.2.9
	 	MULTITEST
	 	CORE	 	 	 	 
	147
	 	MT93XX
	 	MT 9320
	 	40002349
	 	MSOP 118mil
	 	02.12.13
	 	MULTITEST
	 	 	 	Excess	 	 
	148
	 	MT93XX
	 	MT 9320
	 	40002748
	 	TSSOP173mil
	 	03.9.18
	 	MULTITEST
	 	 	 	Excess	 	 
	149
	 	MT93XX
	 	MT 9320
	 	40002836
	 	SOIC 208mil
	 	03.11.13
	 	MULTITEST
	 	 	 	Excess	 	 
	150
	 	MT93XX
	 	MT 9320
	 	40002978
	 	TSSOP173mil
	 	04.3.15
	 	MULTITEST
	 	 	 	Excess	 	 
	151
	 	MT93XX
	 	MT 9320
	 	40002747
	 	SOIC 150MIL PTB
	 	03.11.25
	 	MULTITEST
	 	CORE	 	 	 	 
	152
	 	MT93XX
	 	MT 9320
	 	 	 	SOIC 150mil
	 	04.5.26
	 	MULTITEST
	 	CORE	 	 	 	 
	153
	 	MT93XX
	 	MT 9320
	 	40002925
	 	SOIC 150mil
	 	04.3.25
	 	MULTITEST
	 	CORE	 	 	 	 
	154
	 	MT93XX
	 	MT 9320
	 	40002926
	 	SOIC 150mil
	 	04.3.25
	 	MULTITEST
	 	CORE	 	 	 	 
	155
	 	MT93XX
	 	MT 9320
	 	40003072
	 	MSOP118mil
	 	04.5.10
	 	MULTITEST
	 	CORE	 	 	 	 
	156
	 	MT93XX
	 	MT 9320
	 	 	 	SOIC 150mil
	 	04.6.28
	 	MULTITEST
	 	CORE	 	 	 	 
	157
	 	MT93XX
	 	MT 9320
	 	 	 	SOIC 150mil
	 	04.6.28
	 	MULTITEST
	 	CORE	 	 	 	 
	158
	 	MT93XX
	 	MT 9320
	 	40003306
	 	SOIC 150mil
	 	04.7.20
	 	MULTITEST
	 	CORE	 	 	 	 
	159
	 	MT93XX
	 	MT 9320
	 	40002837
	 	SSOP208mil
	 	03.11.27
	 	MULTITEST
	 	CORE	 	 	 	 
	160
	 	MT93XX
	 	MT 9320
	 	40003229
	 	TSSOP173mil
	 	04.10.6
	 	MULTITEST
	 	CORE	 	 	 	 
	161
	 	MT93XX
	 	MT 9320
	 	40003355
	 	SSOP 208mil
	 	04.12.22
	 	MULTITEST
	 	CORE	 	 	 	 
	MT93XX Count
	 	24
	 	 	 	 	 	 	 	 	 	 	 	20
	 	4
	 	0
	162
	 	MT8589
	 	MT 8589
	 	40002749
	 	PLCC 44
	 	03.8.6
	 	MULTITEST
	 	CORE	 	 	 	 
	163
	 	MT8589
	 	MT 8589
	 	40003230
	 	PLCC
	 	04.10.22
	 	MULTITEST
	 	CORE	 	 	 	 
	MT8589 Count
	 	2
	 	 	 	 	 	 	 	 	 	 	 	2
	 	0
	 	0
	164
	 	MT8588
	 	MT 8588
	 	 	 	 	 	05.11.18
	 	MULTITEST
	 	 	 	Excess	 	 
	165
	 	MT8588
	 	MT 8588
	 	 	 	 	 	05.11.18
	 	MULTITEST
	 	 	 	Excess	 	 
	166
	 	MT8588
	 	MT 8588
	 	 	 	 	 	05.11.18
	 	MULTITEST
	 	 	 	 	 	S/D
	MT8588 Count
	 	3
	 	 	 	 	 	 	 	 	 	 	 	0
	 	2
	 	1
	167
	 	MT99XX
	 	MT 9918
	 	40002839
	 	TSSOP
	 	03.12.23
	 	MULTITEST
	 	CORE	 	 	 	 
	168
	 	MT99XX
	 	MT 9918
	 	40003304
	 	SOIC 300mil
	 	04.5.14
	 	MULTITEST
	 	CORE	 	 	 	 
	169
	 	MT99XX
	 	MT 9918
	 	40003305
	 	SOIC 150mil
	 	04.7.20
	 	MULTITEST
	 	CORE	 	 	 	 
	170
	 	MT99XX
	 	MT 9918
	 	40003302
	 	MSOP 8
	 	04.8.3
	 	MULTITEST
	 	CORE	 	 	 	 
	171
	 	MT99XX
	 	MT 9918
	 	40003298
	 	TSSOP
	 	04.8.25
	 	MULTITEST
	 	 	 	Excess	 	 
	172
	 	MT99XX
	 	MT 9928
	 	 	 	TSSOP 173mil
	 	05.9.29
	 	MULTITEST
	 	 	 	Excess	 	 
	MT99XX Count
	 	6
	 	 	 	 	 	 	 	 	 	 	 	4
	 	2
	 	0
	 
	Grand Count
	 	172
	 	 	 	 	 	 	 	 	 	 	 	81
	 	27
	 	64






 









Table of Contents






Post Test Equipment Summary




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 	 	 	 	 	 	 	 	 	 	 
	Type 	 	Module 	 	Out - Total 	 	Core 	 	Excess 	 	S/D
	Tape & Reel
	 	TR18AS	 	 	6	 	 	 	4	 	 	 	1	 	 	 	1	 
	Tape & Reel
	 	AT28	 	 	11	 	 	 	11	 	 	 	0	 	 	 	0	 
	Tape & Reel
	 	AT128	 	 	7	 	 	 	6	 	 	 	0	 	 	 	1	 
	Tape & Reel
	 	G6	 	 	9	 	 	 	9	 	 	 	0	 	 	 	0	 
	Tape & Reel
	 	AT8005	 	 	1	 	 	 	1	 	 	 	0	 	 	 	0	 
	Tape & Reel
	 	MV85x	 	 	3	 	 	 	1	 	 	 	0	 	 	 	2	 
	Tape & Reel	 	Ismeca	 	 	2	 	 	Note: Brand new systems, model &
equipment details not available
currently and

	Lead Reconditioner
	 	AT4070	 	 	1	 	 	 	0	 	 	 	0	 	 	 	1	 
	Lead Reconditioner
	 	AT-1045	 	 	1	 	 	 	0	 	 	 	0	 	 	 	1	 
	Lead Reconditioner
	 	ATS-1245	 	 	2	 	 	 	0	 	 	 	0	 	 	 	2	 
	Part Counter
	 	PC-138	 	 	1	 	 	 	1	 	 	 	0	 	 	 	0	 
	Peel Tester
	 	GPD	 	 	1	 	 	 	1	 	 	 	0	 	 	 	0	 
	Dry Packing
	 	QUICK-7G	 	 	1	 	 	 	1	 	 	 	0	 	 	 	0	 
	Oven
	 	Blue M	 	 	3	 	 	 	3	 	 	 	0	 	 	 	0	 
	 
	 
	 	Total	 	 	49	 	 	 	 	 	 	 	 	 	 	 	 	 






 









Table of Contents






SCC TR &LIS Review




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO	 	Equ. Name	 	Module	 	Asset NO.	 	Device	 	Arrived at CPS	 	Vendor	 	Status
	1
	 	Tape Reel
	 	TR18AS
	 	40000778
	 	SOIC 8
	 	99.11.06
	 	STI
	 	Core
	2
	 	Tape Reel
	 	TR18AS
	 	40000825
	 	SOIC 8
	 	99.11.06
	 	STI
	 	Core
	3
	 	Tape Reel
	 	TR18AS
	 	40000779
	 	SOIC 8
	 	00.3.27
	 	STI
	 	Core
	4
	 	Tape Reel
	 	TR18AS
	 	40000824
	 	SOIC 8
	 	00.5.27
	 	STI
	 	Core
	5
	 	Tape Reel
	 	TR18AS
	 	40000826
	 	SOIC 8
	 	00.5.27
	 	STI
	 	Excess
	6
	 	Tape Reel
	 	TR18AS
	 	40000823
	 	SOIC 8
	 	00.6.2
	 	STI
	 	S/D
	7
	 	Tape Reel
	 	AT 28
	 	40002009
	 	MSOP
	 	01.5.3
	 	STI
	 	Core
	8
	 	Tape Reel
	 	AT 28
	 	40002010
	 	SOIC 300mil
	 	01.5.3
	 	STI
	 	Core
	9
	 	Tape Reel
	 	AT 28
	 	40002385
	 	SOIC 150mil
	 	02.2.27
	 	STI
	 	Core
	10
	 	Tape Reel
	 	AT 28
	 	40002411
	 	SOIC 150mil
	 	02.3.4
	 	STI
	 	Core
	11
	 	Tape Reel
	 	AT 28
	 	40002409
	 	TSSOP 173mil
	 	02.3.4
	 	STI
	 	Core
	12
	 	Tape Reel
	 	AT 28
	 	40002410
	 	TSSOP 173mil
	 	02.3.12
	 	STI
	 	Core
	13
	 	Tape Reel
	 	AT 28
	 	40002325
	 	MSOP
	 	02.6.10
	 	STI
	 	Core
	14
	 	Tape Reel
	 	AT 28
	 	40002960
	 	SOIC 330mil
	 	03.10.14
	 	STI
	 	Core
	15
	 	Tape Reel
	 	AT 28
	 	40002962
	 	SOIC 208mil
	 	03.11.03
	 	STI
	 	Core
	16
	 	Tape Reel
	 	AT 28
	 	40002961
	 	SOIC 150mil
	 	03.12.04
	 	STI
	 	Core
	17
	 	Tape Reel
	 	AT 28
	 	40003338
	 	TSSOP
	 	04.3.5
	 	STI
	 	Core
	18
	 	Tape Reel
	 	AT 128
	 	40002609
	 	SOIC 150 8L
	 	02.3.12
	 	STI
	 	Core
	19
	 	Tape Reel
	 	AT 128
	 	40002610
	 	SOIC 150 8L
	 	02.6.10
	 	STI
	 	Core
	20
	 	Tape Reel
	 	AT 128
	 	40003334
	 	SOIC 150 8L
	 	03.12.23
	 	STI
	 	Core
	21
	 	Tape Reel
	 	AT 128
	 	40003335
	 	SOIC 150 8L
	 	04.1.15
	 	STI
	 	Core
	22
	 	Tape Reel
	 	AT 128
	 	40003336
	 	SOIC 150 8L
	 	04.3.17
	 	STI
	 	Core
	23
	 	Tape Reel
	 	AT 128
	 	40003337
	 	SOIC 150 8L
	 	04.3.17
	 	STI
	 	Core
	24
	 	Tape Reel
	 	AT 128
	 	40003238
	 	 	 	04.11.2
	 	STI
	 	S/D
	25
	 	Tape Reel
	 	VisDynamics G6
	 	40002793
	 	SOIC 150mil
	 	03.11.24
	 	VisDynamics
	 	Core
	26
	 	Tape Reel
	 	VisDynamics G6
	 	40003154
	 	SOIC 150mil
	 	04.3.12
	 	VisDynamics
	 	Core
	27
	 	Tape Reel
	 	VisDynamics G6
	 	40003155
	 	SOIC 150mil
	 	04.4.6
	 	VisDynamics
	 	Core
	28
	 	Tape Reel
	 	VisDynamics G6
	 	40003156
	 	SOIC8/14/16
	 	04.4.17
	 	VisDynamics
	 	Core
	29
	 	Tape Reel
	 	VisDynamics G6
	 	40003286
	 	SOIC 150 MIL
	 	04.5.19
	 	VisDynamics
	 	Core
	30
	 	Tape Reel
	 	VisDynamics G6
	 	40003287
	 	SOIC 150 MIL
	 	04.5.24
	 	VisDynamics
	 	Core
	31
	 	Tape Reel
	 	VisDynamics G6
	 	40003277
	 	MSOP
	 	04.6.15
	 	VisDynamics
	 	Core
	32
	 	Tape Reel
	 	VisDynamics G6
	 	40003288
	 	SOIC 150mil
	 	04.6.21
	 	VisDynamics
	 	Core
	33
	 	Tape Reel
	 	VisDynamics G6
	 	40003278
	 	MSOP
	 	04.7.7
	 	VisDynamics
	 	Core






 









Table of Contents









	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO	 	Equ. Name	 	Module	 	Asset NO.	 	Device	 	Arrived at CPS	 	Vendor	 	Status
	34
	 	Tape Reel
	 	AT 8005
	 	40000820
	 	PLCC 44
	 	00.5.20
	 	STI
	 	Core
	35
	 	Tape Reel
	 	MICROVISION 852
	 	40001594
	 	SOIC 300mil
	 	01.6.1
	 	Microvision
	 	Core
	36
	 	Tape Reel
	 	MICROVISION 852
	 	40000649
	 	SOIC 8
	 	01.6.1
	 	Microvision
	 	S/D
	37
	 	LEADSCAN
	 	MICROVISION 851
	 	40000688
	 	SOIC 8
	 	99.11.12
	 	Microvision
	 	S/D
	38
	 	Lead Reconditioner
	 	AT 4070
	 	40002884
	 	Lead Repair
	 	04.2.3
	 	Curris Logic
	 	S/D
	39
	 	Lead Reconditioner
	 	AT-1045
	 	40003086
	 	Lead Repair
	 	04.5.17
	 	Cirrus Logic
	 	S/D
	40
	 	Lead Reconditioner
	 	ATS-1245
	 	40003237
	 	Lead Repair
	 	04.8.12
	 	Cirrus Logic
	 	S/D
	41
	 	Lead Reconditioner
	 	ATS-1245
	 	40003236
	 	Lead Repair
	 	04.8.12
	 	Cirrus Logic
	 	S/D
	42
	 	PART COUNTER
	 	PC-138
	 	40002223
	 	ALL
	 	02.3.14
	 	STI
	 	Core
	43
	 	PEEL TESTER
	 	GPD
	 	40002568
	 	ALL
	 	02.8.9
	 	GPD
	 	Core
	44
	 	DRY PACKING
	 	QUICK-7G
	 	40000770
	 	ALL
	 	00.3.8
	 	HAN SUNG
	 	Core
	45
	 	OVEN
	 	Blue M
	 	40000401
	 	ALL
	 	97.12.12
	 	BLUE M
	 	Core
	46
	 	OVEN
	 	Blue M
	 	40000399
	 	ALL
	 	98.3.20
	 	BLUE M
	 	Core
	47
	 	OVEN
	 	Blue M
	 	40000400
	 	ALL
	 	98.3.20
	 	BLUE M
	 	Core
	48	 	Tape Reel	 	Ismeca	 	Note: Brand New Systems — Details not available	 	 	 	 
	49	 	Tape Reel	 	Ismeca	 	Note: Brand New Systems — Details not available	 	 	 	 






 









Table of Contents










Appendix 2








Technical Specifications





18









Table of Contents






Appendix 2




Technical Specifications





 









Table of Contents







Technical Specifications — Assembly




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	Type	 	Document Number	 	Doc Title	 	Doc Rev	 	Doc Level (1/2/3/4)	 	DEPT
	Spec.

	 	CS711-0002
	 	LEAD FRAME
	 	 	10	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS711-0007
	 	TUBE AND PIN/PLUG
	 	 	11	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS711-0008
	 	MARKING INK
	 	 	8	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS711-0014
	 	SAW BLADE
	 	 	5	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS711-0019
	 	PLASTIC PKG. HEAT SPREADER/SLUG
	 	 	1	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS712-0105
	 	MATERIAL FOR METAL FINISH
	 	 	14	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CMC720-0001
	 	WAFER MAPPING HANGLING SPECIFICATION FOR INKLESS WAFER
	 	 	5	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CMC720-0004
	 	LASER DEFLASH
	 	 	3	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0005
	 	EPOXY DIE ATTACH
	 	 	24	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0006
	 	DIE ATTACH POST CURE
	 	 	15	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0007
	 	THERMOSONIC WIRE BONDING
	 	 	19	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0009
	 	LDP MOLD HANDLING PROCEDURE
	 	 	20	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0010
	 	POST MOLD CURE
	 	 	12	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0014
	 	TRIM / FORM FOR P-DIP
	 	 	11	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0017
	 	TOP & BOTTOME SIDE MARKING
	 	 	23	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0022
	 	SCC LDP MOLDING REJECT CRITERIA
	 	 	12	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0023
	 	LEAD FINISH
	 	 	21	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0026
	 	EXTERNAL VISUAL INSPECTION FOR PLCC PACKAGE
	 	 	9	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0028
	 	WAFER MOUNT PROCESS SPEC FOR ASS’Y
	 	 	21	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0032
	 	FORM/SINGULATION FOR SMD
	 	 	14	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0033
	 	DEDAMBER/DEJUNK FOR SMD
	 	 	8	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0037
	 	DIE COATING
	 	 	12	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0038
	 	EXTERNAL VISUAL INSPECTION FOR PACKAGE
	 	 	11	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0051
	 	2ND OPTICAL INSPECTION
	 	 	12	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0052
	 	3RD OPTICAL INSPECTION FOR PLASTIC PACKAGE
	 	 	20	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0053
	 	EXTERNAL VISUAL INSPECTION FOR P-DIP
	 	 	13	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0055
	 	DZ-600 VACUUM PACKING MACHINE OPERATION PROCEDURE SPECIFICATION
	 	 	1	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS720-0901
	 	LDP PACKING PROCEDURE
	 	 	10	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS724-0001
	 	EXTERNAL VISION INSPECTION FOR TSOP,TSSOP, SSOP & MSOP PACKAGES
	 	 	12	 	 	 	3	 	 	LDP ENG
	Spec.

	 	CS760-0006
	 	REWORK PROCEDURE FOR LEADED PLASTIC PKG
	 	 	9	 	 	 	3	 	 	LDP ENG
	Spec.-test

	 	CMT141-0014
	 	MU851 IC LEAD/MARK INSPECTOR OPERATION SPECIFICATION
	 	 	2	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT141-0045
	 	SP-6E SEMI-AUTOMATIC POLYPROPYLENE STRAPPING MACHINE OPERATION
PROCEDURE SPECIFICATION
	 	 	1	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0026
	 	TR18ASII TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE
SPECIFICATION
	 	 	6	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0028
	 	DT-338 DETAPING MACHINE PM PROCEDURE SPECIFICATION
	 	 	2	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0030
	 	QUICK-7G DRY PACKING MACHINE PM PROCEDURE SPECIFICATION
	 	 	3	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0031
	 	MV851 IC MARK/LEADINSPECTION PM&CAL PROCEDURE SPECIFICATION
	 	 	3	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0034
	 	PBFT-856VS PEEL BACK FORCE TESTER PM & CALIBRATION PROCEDURE
SPECIFICATION
	 	 	2	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0035
	 	AT8005 LEAD/MARK INSPECTION SYSTEM PM SPECIFICATION
	 	 	2	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0042
	 	PC-138 PART COUNTER MACHINE PM PROCEDURE SPECIFICATION
	 	 	2	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0056
	 	AT-28 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE
	 	 	3	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0063
	 	RVSI LS-3900 LEAD AND GRID SCANNING INSPECTION SYSTEM PM &
CALIBRATION PROCEDURE SPECIFICATION
	 	 	3	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0064
	 	RVSI LS-7700 TATAL PACKAGE INSPECTION SYSTEM PM & CALIBRATION
PROCEDURE SPECIFICATION
	 	 	2	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0085
	 	AT-128 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE
SPECIFICATION
	 	 	1	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT143-0091
	 	ICOS CI-9450 COMPONENT INSPECTION SYSTEM PREVENTIVE
MAINTENANCE SPECIFICATION
	 	 	1	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT144-0002
	 	FINAL VISUAL INSPECTION PROCEDURE
	 	 	10	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT144-0003
	 	TEST INNER PACKING PROCEDURE
	 	 	12	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT144-0010
	 	PACKING IN TAPE AND REEL PROCEDURE SPEC.
	 	 	24	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT144-0015
	 	LEAD SCANNING PROCEDURE SPEC
	 	 	6	 	 	 	3	 	 	LDP TEST
	Spec.-test

	 	CMT145-0006
	 	PACKING MATERIAL SPEC
	 	 	6	 	 	 	3	 	 	LDP TEST
	Spec.-LMT

	 	ES782-0014
	 	PROCESS SPECIFICATION FOR SUBSTRATE PRE-BAKE
	 	 	8	 	 	 	3	 	 	LDP ENG
	C/P

	 	CP-CPS-ALL-001
	 	SCC STANDARD CONTROL PLAN FOR LEADED PACKAGE
	 	 	36	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-MS-008-001
	 	MSOP 8/10LD
	 	 	5	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-MS-008-002
	 	MSOP 08/10LD EDP
	 	 	0	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-008-001
	 	PD008 DAUL
	 	 	7	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-008M-001
	 	PDIP 8LD M
	 	 	13	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-014-001
	 	PD014&016LD
	 	 	12	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-014-002
	 	PD014&016LD
	 	 	5	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-018-001
	 	PD018LD
	 	 	7	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-020-001
	 	PD020LD
	 	 	11	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-024N-001
	 	PDIP 24LD N
	 	 	10	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-024W-001
	 	PDIP 24LD W
	 	 	9	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-028-001
	 	PDIP 28LD
	 	 	8	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-028-002
	 	PDIP 28LD
	 	 	4	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-028N-001
	 	PD028LDN
	 	 	8	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-032-001
	 	PD032LD
	 	 	7	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PD-040-001
	 	PD040/42LD
	 	 	9	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PL-020-001
	 	PLCC 20LD
	 	 	7	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PL-028-001
	 	PLCC 28LD
	 	 	8	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PL-032-001
	 	PLCC 32LD
	 	 	10	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PL-032-002
	 	PLCC032LD
	 	 	0	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PL-044-001
	 	PLCC 44LD
	 	 	11	 	 	 	3	 	 	LDP ENG






 









Table of Contents








	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	Type	 	Document Number	 	Doc Title	 	Doc Rev	 	Doc Level (1/2/3/4)	 	DEPT
	MI-LDP

	 	MI-PL-068-001
	 	PLCC 68LD
	 	 	7	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PL-084-001
	 	PLCC 84LD
	 	 	8	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-008M-001
	 	SOIC 8LD M
	 	 	13	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-008M-002
	 	SOIC 8LD M
	 	 	9	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-008M-003
	 	SOIC 8LD M
	 	 	6	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-008M-004
	 	SOIC 8LD (M) EDP
	 	 	9	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-008M-006
	 	SOIC 8LD M EDP
	 	 	2	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-008M-007
	 	SOIC008LDM
	 	 	3	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-008M-008
	 	SOIC008LDM
	 	 	1	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-008W-001
	 	SOIC 8LD W
	 	 	11	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-014-001
	 	SOIC 14LD
	 	 	13	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-014-002
	 	SOIC 14LD
	 	 	9	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-016N-001
	 	SOIC 16LD N
	 	 	12	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-016N-002
	 	SOIC 16LD N
	 	 	9	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-016W-001
	 	SOIC 16LD W
	 	 	8	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-016W-002
	 	SOIC 016W MATRIX
	 	 	0	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-020-001
	 	SOIC 20LD
	 	 	8	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-020M-001
	 	SOIC 20LD MATRIX
	 	 	8	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-024-001
	 	SOIC 24LD
	 	 	9	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-028N-001
	 	SOIC 28LD N
	 	 	9	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-028W-001
	 	SOIC 28LD W
	 	 	10	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-PS-032-001
	 	SOIC 32LD
	 	 	5	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-SP-036-001
	 	SSOP 36LD
	 	 	2	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-SP-048-001
	 	SSOP 48LD/56LD
	 	 	5	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-SP-048-002
	 	SSOP 48LD
	 	 	3	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-SP-056-001
	 	SSOP 56LD
	 	 	12	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-008-001
	 	TSSOP 8LD
	 	 	5	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-014-001
	 	TSSOP 14/16LD
	 	 	9	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-014-002
	 	TSSOP 014/016LD
	 	 	0	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-020-001
	 	TSSOP 20/24LD
	 	 	8	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-020-002
	 	TSSOP 20/24LD
	 	 	3	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-024-001
	 	TSSOP 24LD
	 	 	4	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-028-001
	 	TSSOP 28LD
	 	 	8	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-028ep-001
	 	TSSOP028-EDP
	 	 	3	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-030-001
	 	TSSOP 30LD
	 	 	5	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-TP-048-001
	 	TSSOP 48LD
	 	 	3	 	 	 	3	 	 	LDP ENG
	MI-LDP

	 	MI-Iquad-120-001
	 	IQUAD 28x28 (120LD)
	 	 	1	 	 	 	3	 	 	LDP ENG
	PM

	 	PM-0021
	 	MANUAL MOLD PRESS
	 	 	12	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0024
	 	AUTO PAD MARK M/C (I.R.)
	 	 	9	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0025
	 	AUTO LASER MARK M/C
	 	 	12	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0079
	 	PREHEATER
	 	 	5	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0082
	 	MANUAL MOLD DIE
	 	 	10	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0084
	 	MAINTENANCE/BACK END
	 	 	12	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0087
	 	MANUAL FRIM/FORM MACHINE
	 	 	6	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0090
	 	PLATE MAKER 612
	 	 	5	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0094
	 	AUTO LOADER
	 	 	4	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0129
	 	TOWA AUTO MOLD SYSTEM
	 	 	11	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0131
	 	ASM AUTO MOLD SYSTEM
	 	 	6	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0132
	 	ASM AUTO MOLD SYSTEM
	 	 	7	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0135
	 	BOND TOOLING
	 	 	5	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0148
	 	MAINTENANCE/BACK END
	 	 	4	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0150
	 	TRIM DIE
	 	 	6	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0151
	 	FORM DIE
	 	 	3	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0158
	 	TOWA AUTO MOLDING SYSTEM
	 	 	3	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0159
	 	SEMI-AUTO L/F LOADER
	 	 	2	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0164
	 	AUTO LASER DEFLASH M/C
	 	 	2	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0166
	 	TUBE CHANGE SEESAW
	 	 	2	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0197
	 	FICO AUTO MOLD SYSTEM
	 	 	2	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0213
	 	GO-NO-GO JIG
	 	 	1	 	 	 	3	 	 	LDP MAINT
	PM

	 	PM-0222
	 	PMC OVEN
	 	 	1	 	 	 	3	 	 	LDP MAINT
	Visual Aid

	 	VPA4-00001-1
	 	TUBE TYPE FOR FK PDIP 300MIL
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB3-00008-8
	 	ATTENTION AT OVEN CURE PROCESS
	 	 	8	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB3-00009-27
	 	SUMMARY OF DICING SAW CONTROL
	 	 	27	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB3-00018-8
	 	WAFER MOUNT BAKING
	 	 	8	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB3-00021-30
	 	OPERATOR, MAINTENANCE, QA USE REFERENCE TABLE AT W/B PROCESS
	 	 	30	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB3-00022-16
	 	SUMMARY OF DIE ATTACH PROCESS CONTROL
	 	 	16	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB3-00024-1
	 	EPOXY STORAGE CONDITION AND LIFE TIME
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB3-00025-5
	 	ATTENTION AT 2ND OPTICAL INSPECTION
	 	 	5	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB4-00001-6
	 	B-CODE PROCEDURE
	 	 	6	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB4-00005-1
	 	WAFER MAPPING FILE DOWNLOAD
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB5-00001-1
	 	DIE ATTACH CV ON HOLD CRITERIA
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB5-00002-0
	 	3 RD OPTICAL LOW YIELD ON HOLD CRITERIA
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPB5-00003-9
	 	SUMMARY OF STACK DIE PRODUCT FOL CONTROL
	 	 	9	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00004-1
	 	DIFFERENT FORM DIE SET FOR MSOP8/10 TSSOP8/14/16/28 TSSOP20/24
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00010-2
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN WAFER MOUNT PROCESS
	 	 	2	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00011-6
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN DICING SAW PROCESS
	 	 	6	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00012-5
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN DIE ATTACH PROCESS
	 	 	5	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00013-4
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN WIRE BOND PROCESS
	 	 	4	 	 	 	3	 	 	LDP ENG






 









Table of Contents






	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	Type	 	Document Number	 	Doc Title	 	Doc Rev	 	Doc Level (1/2/3/4)	 	DEPT
	Visual Aid

	 	VPD4-00014-1
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN MOLD PROCESS
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00015-0
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN PMC PROCESS
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00016-1
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN TRIM PROCESS
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00017-1
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN TIN PLATING PROCESS
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00018-1
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN MARKING PROCESS
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00019-1
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN TRIM&FORM PROCESS
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00020-1
	 	CUSTOMERS WITH SPECIAL REQUIREMENT IN EVI PROCESS
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD4-00022-0
	 	ProblemSoure OCAP flowchart
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD5-00008-0
	 	D/A WAFER MAPPING BUY-OFF REPORT
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD5-00014-1
	 	TYPE OF THE TRAY
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD5-00027-0
	 	IN-LINE FOL LOW YIELD CONTROL
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD5-00029-1
	 	SUMMARY OF 3RD PROCESS CONTROL
	 	 	1	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD5-00040-0
	 	VISUAL AID FOR DAMBAR ISSUE IN EVI PROCESS
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD5-00051-0
	 	VISUAL AIDS FOR EVI MAJOR DEFECT SPSEC
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD5-00053-0
	 	EVI CHECKING METHOD FOR UNITS IN TUBE
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD6-00003-0
	 	TRAINING MATERIAL FOR FUJITSU WRONG TRAY LSSUE
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPD6-00005-0
	 	ORIENTATION VISUAL AID FOR TRAY LOADING IN MACHINE AND UNIT IN
TAPE (TRAY TO REEL PRODUCTS)
	 	 	0	 	 	 	3	 	 	LDP TEST
	Visual Aid

	 	VPD6-00013-0
	 	VISUAL AID FOR EOL PACKAGE F/M
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPC4-00002-0
	 	BARCODE LABEL FOR LDP ASS’Y ONLY PRODUCTS
	 	 	0	 	 	 	3	 	 	LDP ENG
	Visual Aid

	 	VPE5-00002-0
	 	DIE SET POLISH REQUIREMENT FOR PB FREE PRODUCTS
	 	 	0	 	 	 	3	 	 	LDP ENG
	TCM

	 	TCMLDPMK
	 	MARKING TOTAL CONTROL METHODOLOGY
	 	 	12	 	 	 	3	 	 	LDP ENG
	TCM

	 	TCMLDPPL
	 	LEAD FINISH TOTAL CONTROL METHODOLOGY
	 	 	12	 	 	 	3	 	 	LDP ENG
	TCM

	 	TCMLDPMD
	 	MOLD TOTAL CONTROL METHODOLOGY
	 	 	12	 	 	 	3	 	 	LDP ENG
	TCM

	 	TCMLDPTF
	 	TRIM/FORM TOTAL CONTROL METHODOLOGY
	 	 	19	 	 	 	3	 	 	LDP ENG
	TCM

	 	TCMLDPDP
	 	DIE PREPARATION TOTAL CONTROL METHODOLGY
	 	 	23	 	 	 	3	 	 	LDP ENG
	TCM

	 	TCMLDPDA
	 	DIE ATTACH TOTAL CONTROL METHODOLOGY
	 	 	26	 	 	 	3	 	 	LDP MAINT
	TCM

	 	TCMLDPWB
	 	WIRE BONDING TOTAL CONTROL METHODOLGY
	 	 	25	 	 	 	3	 	 	LDP MAINT
	TCM

	 	TCMLDPPK
	 	PACKING TOTAL CONTROL METHODOLOGY
	 	 	7	 	 	 	3	 	 	LDP ENG
	TCM

	 	TCMLDPEVI
	 	EVI TOTAL CONTROL METHODOLOGY
	 	 	7	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPDP-001
	 	DIE PREPARATION FAILURE MODE AND EFFECTS ANALYSIS
	 	 	0	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPPL-001
	 	PROCESS FMEA FOR TIN/LEAD LEAD FINISH
	 	 	0	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPPL-002
	 	PROCESS FMEA FOR PURE TIN LEAD FINISH
	 	 	0	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPTF-001
	 	SMD TRIM PROCESS FAILURE MODE AND EFFECTS ANALYSIS
	 	 	0	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPTF-002
	 	SMD FORM PROCESS FAILURE MODE AND EFFECTS ANALYSIS
	 	 	1	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPTF-003
	 	PDIP TRIM/FORM PROCESS FAILURE MODE AND EFFECTS ANALYSIS
	 	 	0	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPWB-001
	 	WIRE BONDING PROCESS FMEA
	 	 	1	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPMK-001
	 	FMEA FOR LDP MARKING PROCESS
	 	 	0	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPDA-001
	 	DIE ATTACH FAILURE MODE AND EFFECTS ANALYSIS
	 	 	1	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPMD-001
	 	PROCESS FMEA FOR MOLD & PMC
	 	 	1	 	 	 	3	 	 	LDP ENG
	FMEA

	 	FMEA-LDPEVI-001
	 	LDP EVI FAIL URE MODE AND EFFECTS ANALYSIS
	 	 	0	 	 	 	3	 	 	LDP ENG
	Procedure

	 	CPS-M-05
	 	IN PROCESS MATERIAL AND PRODUCT STORAGE AND HANDLING PROCEDURE
	 	 	6	 	 	 	2	 	 	LDP ENG
	Procedure

	 	CPS-P-05
	 	PROCESS CONTROL PROCEDURE
	 	 	8	 	 	 	2	 	 	LDP ENG
	Procedure

	 	CPS-P-14
	 	TOOL MANAGEMENT PROCEDURE STANDARD
	 	 	7	 	 	 	2	 	 	LDP MAINT
	Procedure

	 	CPS-P-49
	 	LDP W/B PROCESS RTI PROCEDURE
	 	 	0	 	 	 	2	 	 	LDP ENG
	Procedure

	 	CPS-R-08
	 	BASELINE SPECIFICATION PREPARATION PROCEDURE
	 	 	9	 	 	 	2	 	 	LDP ENG
	Cal

	 	PI-046
	 	MANUAL MOLD PRESS
	 	 	6	 	 	 	3	 	 	LDP MAINT
	Cal

	 	PI-047
	 	MANUAL PRESS
	 	 	4	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-100
	 	MECO AUTO SOLDER PLATING EDF-EPL 1800S
	 	 	7	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-109
	 	ASM AUTO MOLDING SYSTEM
	 	 	5	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-111
	 	AUTOMATIC WIRE BONDER(UTC-200/250,KNS 1488, KNS 8028)
	 	 	5	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-121
	 	TOWA AUTO MOLD (Y-SERIES)
	 	 	3	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-162
	 	FICO AUTO MOLD TEMP’ SYSTEM
	 	 	2	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-163
	 	TOWA AUTO MOLD TEMP’ SYSTEM(UPS80)
	 	 	3	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-164
	 	TOWA AUTOMOLD TEMP’ SYSTEM(UPS120)
	 	 	3	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-185
	 	WAFER BAKING TIMER CALIBRATION
	 	 	1	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-193
	 	BLUE-M-OVEN
	 	 	0	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-195
	 	BLUE-M-OVEN
	 	 	0	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-198
	 	HOT PLATE
	 	 	0	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-199
	 	FREEZER
	 	 	0	 	 	 	3	 	 	LDP MAINT
	Cal

	 	CAL-206
	 	GO NO GO GAUGE CALIBRATION SPEC FOR FORM PROCESS
	 	 	0	 	 	 	3	 	 	LDP ENG
	Cal

	 	CAL-210
	 	4-CHAMBER CURE OVEN
	 	 	0	 	 	 	3	 	 	LDP MAINT
	Cal-LMT

	 	ECAL-0013
	 	TAPE REMOVE
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-021
	 	STANDARD QUALITY PROCEDURE FOR NEW LEADFRAME AND EXPIRED
LEADFRAME
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-046
	 	MARKING FILE SELECTION AND BUY OFF
	 	 	13	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-049
	 	3RD OPTICAL INSPECTION M/C MENU
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-062
	 	FOL MAGAZINE CLEANING
	 	 	3	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-066
	 	PROCESS OF MATERIAL-LOT TRAVELLER
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-084
	 	DESIGN OF EXPERIMENT FOR GOLD WIRE BONDING OPTIMIZATION IN
MANUFACTURING
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-085
	 	WAFER SAWING OPERATION METHOD
	 	 	5	 	 	 	3	 	 	LDP ENG






 









Table of Contents








	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	Type	 	Document Number	 	Doc Title	 	Doc Rev	 	Doc Level (1/2/3/4)	 	DEPT
	WI

	 	WI-ENG-102
	 	COUNT VARIANCE CONTROL
	 	 	11	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-103
	 	WORK INSTRUCTION FOR TRIM& FORM PROCESS
	 	 	6	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-114
	 	DIE ATTACH SET BUY-OFF SYSTEM
	 	 	7	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-121
	 	OPERATION MANUAL FOR LS-3900 SCANNER INSPECTION SYSTEM
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-142
	 	PMC CLAMPING METHOD FOR THIN PACKAGE
	 	 	5	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-150
	 	WAFER MOUNT OPERATION METHOD
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-153
	 	OPERATION STANDARD TO PREVENT DAMAGED LEAD IN PLATING LINE
	 	 	3	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-154
	 	CHEMICAL ACCIDENT PREVENTIVE & EMERGENCY ACTION IN M/D,B/E,
M/F LINE
	 	 	4	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-157
	 	OPERATION MANUAL OF MARKING MACHINE
	 	 	6	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-163
	 	HOW TO PREVENT DISCOLOR
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-164
	 	DIE BONDER OPERATION MENU
	 	 	4	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-186
	 	MARKING SPECIAL CONTROL
	 	 	9	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-199
	 	LEAD FINISH LINE WATER FLOW MONITOR
	 	 	2	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-ENG-202
	 	BULK PACKING METHOD FOR MONOLITHIC POWER SYSTEMS(MPS)
	 	 	14	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-219
	 	FOL & MOLD MATERIAL TRANSPORTATION PROCEDURE
	 	 	3	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-227
	 	MARKING FILE SET UP AND CHECK
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-233
	 	SPECIAL PROCESS CONTROL FOR WAFER THICKNESS OUT OF REQUIREMENT
PROCEDURE
	 	 	3	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-250
	 	ENGINEER LOT LOADING PROCEDURE
	 	 	4	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-254
	 	MOLDING L/F LOCATION
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-256
	 	PACKING METHOD FOR WU/WUX
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-258
	 	RADAR SYSTEM
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-262
	 	LEADED FINISH RECIPE CONTROL
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-263
	 	LEAD FINISH PLATING MATERIAL CONTROL IN LINE CHEMICAL STORAGE
ROOM
	 	 	1	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-ENG-264
	 	SPECIAL PROCESS CONTROL FOR DIE PREPARE PROCESS
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-271
	 	EPOXY THICKNESS CONTROL CRITRIA IN LDP FOL
	 	 	3	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-276
	 	REJECT MARKING METHOD FOR FOL & MOLD, AND FOL RTI PROCEDURE
	 	 	3	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-ENG-277
	 	3RD OPTICAL INSPECTION MACHINE SET-UP AND BUY-OFF PROCEDURE
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-280
	 	WAFER MAPPING WORKING INSTRUCTION
	 	 	2	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-283
	 	MOLD CLEANING
	 	 	3	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-284
	 	OPERATING REQUIREMENT OF AUTOMOLD SYSTEM
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-285
	 	WIRE BONDER OPERATION MANUAL
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-286
	 	MANUAL MOLD SEMI-AUTO FRAME LOADING HANDLING PROCEDURE
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-288
	 	LDP D/A STANDARD OPERATION PROCEDURE
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-289
	 	OVEN CURE PROCEDURE
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-291
	 	VISUAL AID FOR ALL EOL DEFECT
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-292
	 	TIN FLAKE MONITOR PROCEDURE
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-294
	 	SPECIAL REQUIREMENT FOR IL PRODUCTS
	 	 	3	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-297
	 	CHEMICAL MAKE-UP AND CONTROL METHOD IN LEAD FINISH
	 	 	3	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-299
	 	TRIM & FORM RTI MONITOR CONTROL
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-301
	 	NEW DEVICE SET UP BUY OFF ON LASER MARKING MACHINE
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-305
	 	WAFFLE PACK ASSEMBLY
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-306
	 	HP WATER JET DEFLASH
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-307
	 	SPECIAL REQUIREMENT FOR ISL PRODUCTS
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-308
	 	LDP W/B PROCESS RTI
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-314
	 	HOW TO USE GO&NO-GO GAUGE
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-316
	 	CONSUMABLE TOOLING QUALIFICATION PROCEDURE
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-ENG-319
	 	LDAD FINISH SOLDERABILITY TEST
	 	 	0	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-MTN-001
	 	WIRE BONDER AIR FLOW METER SETTING
	 	 	8	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-002
	 	W/B MACHINE SET-UP PROCEDURE FOR PRODUCT TYPE CONVERSION
	 	 	11	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-003
	 	HEATER BLOCK & WINDOW CLAMP CONTROL
	 	 	5	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-004
	 	PROCEDURES FOR PM CHECKING OF D/P MACHINE
	 	 	3	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-005
	 	AUTOMATIC WIRE BONDER OVER-HAUL
	 	 	5	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-006
	 	MANUFACTURING EQUIPMENT SOFTWARE CONTROL
	 	 	3	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-007
	 	TAPE CHANGE METHOD
	 	 	2	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-010
	 	AUTOMATIC DIE BONDER OVEN-HAUL
	 	 	1	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-011
	 	D/A MACHINE SET-UP PROCEDURE FOR PRODUCT TYPE CONVERSION
	 	 	3	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-MTN-013
	 	EOL TRAINING MANUAL FOR MAINTENANCE
	 	 	0	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-014
	 	LDP EQUIPMENT SHUT DOWN & START-UP WORK INSTRUCTION
	 	 	0	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-MTN-015
	 	FOL TRAINING MANUAL FOR MAINTENANCE
	 	 	0	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-PRD-010
	 	HANDLING OF SKELETON WAFER
	 	 	8	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-PRD-011
	 	DO,DON`T DO AT MARKING AND TRIM&FROM PROCESS
	 	 	14	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-013
	 	RETURN LOT SYSTEM
	 	 	2	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-016
	 	HOUSEKEEPING PROCEDURE
	 	 	4	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-018
	 	MOLD COMPOUND CONTROL
	 	 	3	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-021
	 	L/F MATERIAL HANDLE CONTROL PRODURE
	 	 	2	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-022
	 	DO & DO’T DO FOR FOL OPERATOR
	 	 	4	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-027
	 	PREVENTIVE ACTION FOR POTENTIAL HUMAN INDUCED DEFECT
	 	 	8	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-028
	 	GOLD WIRE CONTROL PROCEDURE
	 	 	2	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-030
	 	HOW TO THE INDICATOR DATA
	 	 	1	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-032
	 	LDP LINE TOOLING MANAGEMENT
	 	 	5	 	 	 	3	 	 	LDP MAINT
	WI

	 	WI-PRD-038
	 	LDP M/H STANDARD OPERATION PROCEDURE
	 	 	1	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-041
	 	D/A TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-PRD-042
	 	D/A DO & DON’T DO VISUAL AID
	 	 	2	 	 	 	3	 	 	LDP PROD






 









Table of Contents








	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	Type	 	Document Number	 	Doc Title	 	Doc Rev	 	Doc Level (1/2/3/4)	 	DEPT
	WI

	 	WI-PRD-043
	 	D/P TRAINING MANUAL FOR OPERATOR AND INSPECTOR
	 	 	1	 	 	 	3	 	 	LDP ENG
	WI

	 	WI-PRD-044
	 	EVI TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-045
	 	MOLD & PMC TRAINING MANUAL FOR OPERATOR & INSPECTOR
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-046
	 	M/D DO & DON’T VISUAL AID
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-047
	 	M/F TRAINING MANUAL OPERATOR AND QA INSPECTOR
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-048
	 	M/F DO & DON’T VISUAL AID
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-049
	 	M/K TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-050
	 	MK DO & DON’T VISUAL AID
	 	 	1	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-051
	 	T/F TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-052
	 	TF DO & DON’T VISUAL AID
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-053
	 	W/B TRAINING MANUAL FOR OPERATOR AND INSPECTOR
	 	 	1	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-055
	 	PROCEDURE FOR DUMMY L/F SAVING
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-057
	 	MESPLUS LOT MOVEMENT OPERATION MANUAL
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-PRD-058
	 	LDP LINE MARK DEFINE
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-TST-013
	 	BARCODE PRINTER OPERATION GUIDELINE
	 	 	2	 	 	 	3	 	 	LDP TEST
	WI

	 	WI-TST-039
	 	LATTICE TUBE PACKING METHOD
	 	 	5	 	 	 	3	 	 	LDP TEST
	WI

	 	WI-QA-108
	 	CETS Packing Trainning Manual For Operator
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-QA-147
	 	D/P DO & DON’T DO VISUAL AID
	 	 	2	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-QA-148
	 	EVI DO & DON’T DO VISUAL AID
	 	 	0	 	 	 	3	 	 	LDP PROD
	WI

	 	WI-QA-161
	 	WB DO & DON’T DO VISUAL AID
	 	 	2	 	 	 	3	 	 	LDP PROD






 









Table of Contents






Technical Specifications — Test




 









Table of Contents








DOCUMENT RECEIVING LIST




	 	 	 	 	 	 	 	 	 	 	 
	NO.	 	REC. DATE	 	DOC. NO.	 	DOC. TITLE	 	REV.
	1

	 	 	2004.12.17	 	 	WI-ENG-059
	 	WORKMANSHIP OF WRIST STRAP
	 	B
	2

	 	 	2005.10.13	 	 	WI-TST-006
	 	STRAY UNITS HANDLING GUIDELINE
	 	B
	3

	 	 	2004.12.22	 	 	WI-TST-010
	 	TEST EQUIPMENT CLEANING POLICY
	 	A
	4

	 	 	2000.12.15	 	 	WI-TST-026
	 	T-CARD AND TEST SUMMARY CHECK PROCEDURE
	 	B
	5

	 	 	2005.06.07	 	 	WI-TST-044
	 	REJECT HANDLING PROCEDURE OF TEST OPERATION
	 	E
	6

	 	 	2004.12.14	 	 	WI-TST-084
	 	LTX MODULE/BOARD REPLACEMENT INSTRUCTION
	 	A
	7

	 	 	2003.09.22	 	 	WI-TST-085
	 	ETS364 DOCKING WORK INSTRUCTION
	 	O
	8

	 	 	2004.11.15	 	 	WI-TST-095
	 	INTERSIL BIN CART LABELING WORK INSTRUCTION
	 	A
	9

	 	 	2004.12.17	 	 	WI-TST-099
	 	YAMAOICHI TEST CONTACTORS CLEANING PROCEDURE
	 	A
	10

	 	 	2004.11.15	 	 	WI-TST-112
	 	PRODUCTION INTERRUPTION
	 	A
	11

	 	 	2004.11.15	 	 	WI-TST-119
	 	TEST PRODUCT IDENTIFICATION
	 	A
	12

	 	 	2004.10.12	 	 	WI-TST-143
	 	FT POSITROL LOG FILLING METHOD
	 	O
	13

	 	 	2005.09.20	 	 	WI-TST-194
	 	LOCATION INDICATE OF TEST BANK SHELF
	 	O
	14

	 	 	2005.11.15	 	 	WI-TST-198
	 	TEST OPERATION MATERIAL RECYCLE PROCEDURE
	 	O
	15

	 	 	2005.11.15	 	 	WI-TST-210
	 	TOTE BOX COV ER PURPOSE AND PROCEDURE
	 	O






 









Table of Contents






DOCUMENT RECEIVING LIST




	 	 	 	 	 	 	 	 	 
	NO.	 	REC. DATE	 	DOC. NO.	 	DOC. TITLE	 	REV.
	1
	 	2004.12.22	 	CMT143-0004	 	MCT-5100 HANDLER JAM CLEAR SPECIFICATION	 	B
	2
	 	2004.12.22	 	CMT143-0006	 	MCT-3608/3616 HANDLER JAM CLEAR SPECIFICATION	 	C
	3
	 	2005.08.02	 	CMT143-0009	 	BAKE OVEN OPERATION SPEC.	 	E
	4
	 	2004.12.22	 	CMT143-0013	 	NEW EQUIPMENT SETUP PROCEDURE	 	C
	5
	 	2004.12.22	 	CMT143-0014	 	MACHINE QUALIFICATION FOR ELECTRICAL TEST	 	B
	6
	 	2004.12.20	 	CMT143-0016	 	TEST LOAD BOARD & ADAPTOR P.M SPECIFICATAION	 	B
	7
	 	2005.06.07	 	CMT143-0020	 	TEST EQUIPMENT JAM CLEAR PROCEDURE	 	F
	8
	 	 	 	CMT143-0036	 	LOAD BOARD  CONTROL SPECIFICATION	 	6
	13
	 	2004.12.20	 	CMT143-0071	 	SPARE PARTS CONTROL PROCEDURE	 	A
	15
	 	2005.01.05	 	CMT143-0079	 	TEST EQUIPMENT CONTROL SPECIFICATION	 	A
	17
	 	2004.12.15	 	CMT143-0101	 	SPARE PARTS VERIFICATION PROCEDURE SPECIFICATION	 	O
	18
	 	2005.05.20	 	CMT143-0102	 	TEST EQUIPMENT BUY-OFF/QUALIFICATION PROCEDURE-TEST	 	B
	19
	 	2005.04.28	 	CMT143-0104	 	PROCEDURE USED FOR ELECTRICAL TEST SET-UP BUY-OFF	 	A
	20
	 	2004.12.14	 	CMT143-0105	 	MTT 9918 HANDLER JAM CLEAR SPECIFICATION-TEST	 	O
	21
	 	2004.12.14	 	CMT143-0107	 	RASCO HANDLER JAM CLEAR SPECIFICATION-TEST	 	O
	22
	 	2004.12.15	 	CMT143-0108	 	MTT93XX HANDLER JAM CLEAR SPECIFICATION-TEST	 	O
	23
	 	2004.12.14	 	CMT143-0109	 	KUWANO HANDLER JAM CLEAR SPECIFICATION-TEST	 	O
	24
	 	2004.12.15	 	CMT143-0110	 	MTT-85XX HANDLER JAM CLEAR SPECIFICATION-TEST	 	O
	25
	 	2004.12.14	 	CMT143-0111	 	AET5050X HANDLER JAM CLEAR SPECIFICATION-TEST	 	O






 









Table of Contents






DOCUMENT RECEIVING LIST




	 	 	 	 	 	 	 	 	 	 	 
	NO.	 	REC. DATE	 	DOC. NO.	 	DOC. TITLE	 	REV.
	1

	 	 	2005.10.10	 	 	CMT140-0044
	 	STANDARD SCC FINAL TEST BASELINE SPECS
	 	O
	2

	 	 	 	 	 	 	 	All other customer baseline can only be transferred once customer approved.	 	 






 









Table of Contents






DOCUMENT RECEIVING LIST




	 	 	 	 	 	 	 	 	 	 	 
	NO.	 	REC. DATE	 	DOC. NO.	 	DOC. TITLE	 	REV.
	1

	 	 	2004.12.22	 	 	CMT141-0002
	 	MCT 5100 HANDLER OPERATING SPEC.
	 	C
	2

	 	 	2004.12.22	 	 	CMT141-0003
	 	MCT3608/3616 HANDLER OPERATING SPEC
	 	D
	3

	 	 	2005.06.17	 	 	CMT141-0006
	 	MH802 HANDLER OPERATION SPECIFICATION
	 	C
	4

	 	 	2004.12.22	 	 	CMT141-0008
	 	SO1000 H HANDLER OPERATION SPECIFICATION
	 	B
	5

	 	 	2004.12.22	 	 	CMT141-0023
	 	SYMTEK300 HANDLER OPERATION SPECIFICATION
	 	A
	6

	 	 	2005.06.13	 	 	CMT141-0035
	 	ASECO S-130 HANDLER OPERATION SPECIFICATION
	 	B
	7

	 	 	2004.12.22	 	 	CMT141-0044
	 	MULTITEST MT9308 HANDLER OPERATING SPEC
	 	A
	8

	 	 	2005.06.17	 	 	CMT141-0047
	 	MULTITEST9918 HANDLER OPERATION SPECIFICATION
	 	O
	9

	 	 	2005.06.17	 	 	CMT141-0049
	 	KUWANO HANDLER OPERATION SPECIFICATION
	 	O
	10

	 	 	2005.06.17	 	 	CMT141-0050
	 	ASM HANDLER OPERATION SPECIFICATION
	 	O
	11

	 	 	2004.11.08	 	 	CMT141-0061
	 	MULTITEST 85XX OPERATION SPECTIFICATION
	 	A
	12

	 	 	2004.11.08	 	 	CMT141-0062
	 	MULTITEST 85XX OPERATION SPECTIFICATION
	 	A
	13

	 	 	2005.04.20	 	 	CMT141-0073
	 	AET5050X HANDLER OPERATION SPECIFICATION
	 	O
	14

	 	 	2005.06.13	 	 	CMT141-0074
	 	MULTITEST-8704 HANDLER OPERATION SPECIFICATION
	 	O
	15

	 	 	2005.06.13	 	 	CMT141-0075
	 	AETRIUM3300 HANDLER OPERAION SPECIFICATION
	 	O
	16

	 	 	2005.04.29	 	 	CMT144-0001
	 	ELECTRICAL TEST PROCEDURE SPECIFICATION
	 	H
	17

	 	 	2005.09.08	 	 	CMT144-0012
	 	MASTER DEVICE CONTROL PROCEDURE
	 	D
	18

	 	 	2005.08.11	 	 	CMT144-0016
	 	TEST LOT RECEIVING AND DISPATCHING PROCEDURE
	 	B
	19

	 	 	2005.07.07	 	 	CMT144-0033
	 	SET-UP VERIFICATION PROCEDURE
	 	O
	20

	 	 	2004.12.17	 	 	CMT145-0001
	 	GENERAL WORKMANSHIP STANAARD SPEC. FOR TEST FLOOR
	 	D
	21

	 	 	2004.12.20	 	 	CMT145-0004
	 	TEST CONTROL CENTER CONTROL SPECIFICATION
	 	A
	22

	 	 	 	 	 	CMT145-0007
	 	OPERATION PROCEDURE OF TEST ONLY PRODUCT
	 	D
	23

	 	 	2005.05.20	 	 	CMT152-0001
	 	QA ELECTRICAL TEST PROCEDURE
	 	C
	24

	 	 	2004.12.15	 	 	CMT152-0002
	 	DATA RETENTION QA PROCEDURE
	 	B






 









Table of Contents






DOCUMENT RECEIVING LIST




	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO.	 	REC. DATE	 	DOC. NO.	 	DOC. TITLE	 	REV.
	1

	 	 	2005.01.14	 	 	FMEA-04-010
	 	FMEA FOR RECYLCE TUBE
	 	 	O	 
	2

	 	 	2005.11.08	 	 	TCMGENQC
	 	IN-PROCESS QC TOTAL CONTROL METHODOLOGY
	 	 	Q	 
	3

	 	 	2005.08.02	 	 	TCMTSTET
	 	TOTAL CONTROL METHODLOGY FOR CPS FINAL TEST
	 	 	F	 
	4

	 	 	2005.11.24	 	 	FMEA-TSTET-001
	 	FINAL TEST PROCESS FMEA
	 	 	O	 
	5

	 	 	2006.02.07	 	 	CP-CPS-TST-001
	 	SCC STANDARD TEST CONTROL PLAN
	 	 	14	 






 









Table of Contents








DOCUMENT RECEIVING LIST




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO.	 	REC. DATE	 	DOC. NO.	 	DOC. TITLE	 	REV.
	1

	 	 	2004.12.15	 	 	PM-0167
	 	CREDENCE TESTER
	 	 	A	 
	2

	 	 	2004.12.13	 	 	PM-0168
	 	EPRO142AX
	 	 	A	 
	3

	 	 	2004.12.15	 	 	PM-0169
	 	EAGLE TESTER
	 	 	B	 
	4

	 	 	2004.12.15	 	 	PM-0170
	 	Q2/62	 	 	 	A	 
	5

	 	 	2005.04.29	 	 	PM-0172
	 	AAT100&AAT200
	 	 	B	 
	6

	 	 	2006.3.13	 	 	PM-0173
	 	ASECO130/150
	 	 	5	 
	7

	 	 	2006.3.15	 	 	PM-0175
	 	36XX/SESS
	 	 	5	 
	8

	 	 	2005.4.12	 	 	PM-0178
	 	MH-802
	 	 	B	 
	9

	 	 	2006.3.15	 	 	PM-0180
	 	85XX
	 	 	5	 
	10

	 	 	2006.3.15	 	 	PM-0181
	 	93XX
	 	 	6	 
	11

	 	 	2006.3.15	 	 	PM-0182
	 	SOX000
	 	 	6	 
	12

	 	 	2005.11.2	 	 	PM-0183
	 	SYMTEK
	 	 	C	 
	13

	 	 	2005.10.25	 	 	PM-0186
	 	LTX77
	 	 	B	 
	14

	 	 	2005.10.25	 	 	PM-0187
	 	A360	 	 	B	 
	15

	 	 	2005.10.25	 	 	PM-0188
	 	A580	 	 	B	 
	16

	 	 	2004.12.17	 	 	PM-0190
	 	MAVERICK PT/VT/GT
	 	 	A	 
	17

	 	 	2004.12.15	 	 	PM-0191
	 	ASL1000
	 	 	A	 
	18

	 	 	2004.12.15	 	 	PM-0192
	 	TSA
	 	 	A	 
	19

	 	 	2004.12.17	 	 	PM-0193
	 	SZ M3650 TESTER PM INSTRUCTION
	 	 	A	 
	20

	 	 	2006.3.14	 	 	PM-0194
	 	AETR-5050S
	 	 	7	 
	21

	 	 	2005.11.2	 	 	PM-0195
	 	KUWANO/LT-930-H222
	 	 	E	 
	22

	 	 	2004.12.15	 	 	PM-0196
	 	HP949X
	 	 	A	 
	23

	 	 	2005.11.2	 	 	PM-0202
	 	9918	 	 	C	 
	24

	 	 	2005.11.2	 	 	PM-0204
	 	AETRIUM 3300
	 	 	C	 
	25

	 	 	2004.12.06	 	 	PM-0212
	 	BLUE-M
	 	 	A	 
	26

	 	 	2004.12.06	 	 	PM-0230
	 	FT1000
	 	 	O	 
	27

	 	 	2005.11.2	 	 	PM-0231
	 	8704	 	 	C	 
	28

	 	 	 	 	 	PM-0234
	 	TERADYNE TESTER J750
	 	 	A	 
	29

	 	 	2005.03.08	 	 	PM-0235
	 	INTERFACE CABLE BETWEEN TESTER AND HANDLER
	 	 	O	 
	30

	 	 	2005.07.08	 	 	PM-0239
	 	SZM3670 TESTER
	 	 	O	 






 









Table of Contents







DOCUMENT RECEIVING LIST




	 	 	 	 	 	 	 	 	 	 	 
	NO.	 	REC. DATE	 	DOC. NO.	 	DOC. TITLE	 	REV.
	1

	 	 	2005.10.28	 	 	CAL-124
	 	VISTA/DUO/QUARTET TESTER SYSTEM CAL
	 	B
	2

	 	 	2005.10.28	 	 	CAL-125
	 	EPRO-142AX SYSTEM CALIBRATION INSTRUCTION
	 	B
	3

	 	 	2005.10.28	 	 	CAL-126
	 	ETS364 SYSTEM CALIBRATION INSTRUCTION
	 	C
	4

	 	 	2005.10.28	 	 	CAL-127
	 	Q2 TESTER SYSTEM CAL SPECIFICATION
	 	B
	5

	 	 	2005.10.5	 	 	CAL-129
	 	ASECO130/150 TEMP CALIBRATION INSTRUCTION
	 	D
	6

	 	 	2005.6.17	 	 	CAL-130
	 	ASM CALIBRATION INSTRUCTION
	 	B
	7

	 	 	2005.10.5	 	 	CAL-132
	 	MCT-36** HANDLER CALIBRATION INSTRUCTION
	 	D
	8

	 	 	2004.12.20	 	 	CAL-134
	 	MH-802 HANDLER CALIBRATION INSTRUCTION
	 	C
	9

	 	 	2005.10.5	 	 	CAL-136
	 	MT-85XX CALIBRATION SPECIFICATION
	 	E
	10

	 	 	2005.10.5	 	 	CAL-137
	 	MULTITEST-93XX HANDLER CALIBRATION INSTRUCTION
	 	G
	11

	 	 	2005.10.5	 	 	CAL-138
	 	SO1000A/AH/H HANDLER CALIBRATION INSTRUCTION
	 	D
	12

	 	 	2005.10.5	 	 	CAL-139
	 	SYMTRK TEMP CALIBRATION INSTRUCTION
	 	E
	13

	 	 	2005.10.25	 	 	CAL-142
	 	A360 TEST SYSTEM CALIBRATION INSTRUCTION
	 	B
	14

	 	 	2005.10.26	 	 	CAL-143
	 	A580 TEST SYSTEM CALIBRATION INSTRUCTION
	 	B
	15

	 	 	2005.10.28	 	 	CAL-145
	 	ASL 1000 TESTER CALIBRATION SPECIFICATION
	 	B
	16

	 	 	2005.10.28	 	 	CAL-146
	 	MAVERICK PT/VT/GT TESTER CALIBRATION INSTRUCTION
	 	B
	17

	 	 	2004.12.17	 	 	CAL-148
	 	SZ M3650 TEST CALIBRATION INSTRUCTION
	 	A
	18

	 	 	2005.10.25	 	 	CAL-149
	 	LTX77 SYSTEM CALIBRATION INSTRUCTION
	 	H
	19

	 	 	2005.10.5	 	 	CAL-151
	 	KUWANO TEMP CALIBRATION INSTRUCTION
	 	D
	20

	 	 	2005.10.28	 	 	CAL-159
	 	HP 949X TESTER CALIBTRTION INSTRUCTION
	 	B
	21

	 	 	2005.10.5	 	 	CAL-168
	 	MULTITEST-9918 HANDLER CALIBRATION INSTRUCTION-TEST
	 	C
	22

	 	 	2005.01.18	 	 	CAL-173
	 	LTX CALIBRATOR CALIBRATION INSTRUCTION
	 	B
	23

	 	 	2005.03.22	 	 	CAL-184
	 	BLUE-M-OVEN CALIBRATION INSTRUCTION-TEST
	 	B
	24

	 	 	2005.10.5	 	 	CAL-188
	 	MHZ2655 CALIBRATION INSTRUCTION
	 	A
	25

	 	 	2005.10.25	 	 	CAL-192
	 	TERADYNE J750 TEST SYSTEM CALIBRATION
	 	A
	26

	 	 	2005.10.5	 	 	CAL-200
	 	AETRIUM5050X HANDLER CALIBRATION INSTRUCTION-TEST
	 	A
	27

	 	 	2005.10.5	 	 	CAL-201
	 	MULTITEST-8704 HANDLER CALIBRATION INSTRUCTION-TEST
	 	A
	28

	 	 	2005.7.8	 	 	CAL-205
	 	SZ M3670 TESTER CALIBRATION INSTRUCTION
	 	O
	29

	 	 	2005.09.28	 	 	CAL-207
	 	A312 TEST SYSTEM CALIBRATION INSTRUCTION
	 	O






 









Table of Contents








FVI SPEC LIST




	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO.	 	REC.DATE	 	DOC.NO.	 	PROC.TITLE	 	REV.
	1

	 	 	2005.7.25	 	 	CPS-E-08
	 	ESD Control Procedure
	 	 	15	 
	2

	 	 	2004.11.26	 	 	WI-TST-021
	 	SCC tested product standard packing method
	 	 	C	 
	3

	 	 	2004.11.26	 	 	WI-TST-034
	 	T-CARD PACKING METHOD FOR SCC TEST
	 	 	B	 
	4

	 	 	2004.11.18	 	 	WI-TST-035
	 	DISPOSITION FOR T&R REJECTS
	 	 	C	 
	5

	 	 	2004.11.18	 	 	WI-TST-037
	 	Product rework procdedure
	 	 	B	 
	6

	 	 	2006.2.8	 	 	WI-TST-226
	 	Rework procedure for Post Test
	 	 	0	 
	7

	 	 	2006.2.2	 	 	FMEA-TETFVI-001
	 	FMEA for FVI
	 	 	0	 
	8

	 	 	2005.5.25	 	 	VPD5-00009-0
	 	Visual Aid for Tube Product
	 	 	0	 
	9

	 	 	2005.10.31	 	 	CMT140-0019
	 	Tube/Tray/Plug/Plastic Bag/ToteBox Recycle Procedure
	 	 	G	 
	10

	 	 	2004.12.1	 	 	CMT141-0072
	 	ATM AT&ATS LEAD STRAIGHTENER OPERATION PROCEDURE SPECIFICATION
	 	 	O	 
	11

	 	 	2005.11.1	 	 	CMT144-0002
	 	FINAL VISUAL INSPECTION PROCEDURE
	 	 	J	 
	12

	 	 	2004.12.17	 	 	CMT144-0015
	 	LEAD SCANNING PROCEDURE SPEC
	 	 	F	 
	13

	 	 	2005.11.25	 	 	CMT145-0006
	 	Packing material spec
	 	 	F	 






 









Table of Contents








IPK SPEC LIST




	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO.	 	REC.DATE	 	DOC.NO.	 	PROC.TITLE	 	REV.
	60

	 	 	2006.2.7	 	 	CP-CPS-TST-0001
	 	SCC STANDARD TEST CONTROL PLAN
	 	 	14	 
	61

	 	 	2005.7.22	 	 	FMEA-04-009
	 	FMEA for IPK
	 	 	B	 






 









Table of Contents








TnR SPEC LIST




	 	 	 	 	 	 	 	 	 	 	 	 	 
	NO.	 	REC.DATE	 	DOC.NO.	 	PROC.TITLE	 	REV.
	1

	 	 	2006.2.7	 	 	FMEA-TSTTR-001
	 	FMEA for Lead Scan/Tape and Reel
	 	 	O	 
	2

	 	 	2005.4.1	 	 	VPD3-00001-6
	 	VISUAL AID for T&R
	 	 	6	 
	3

	 	 	2005.6.6	 	 	VPD4-00001-3
	 	TnR System Critical Sensor Check
	 	 	3	 
	4

	 	 	2005.2.4	 	 	VPD5-00003-0
	 	Proper mark teaching done by opetators
	 	 	O	 
	6

	 	 	2005.11.24	 	 	CAL-161
	 	GENERAL CALIBRATION PROCEDURE FOR T/R MACHINE
	 	 	B	 
	7

	 	 	2004.11.18	 	 	CMT141-0010
	 	TR18ASII TAPE & REEL MACHINE OPERATION PROCEDURE SPECIFICATION
	 	 	C	 
	9

	 	 	2004.12.30	 	 	CMT141-0014
	 	MV851 IC LEAD/MARK INSPECTOR OPERATING SPECIFITION
	 	 	B	 
	10

	 	 	2004.11.15	 	 	CMT141-0017
	 	PBFT-856VS PEEL BACK FORCE TESTER OPERATION PROCEDURE SPECIFICATION
	 	 	B	 
	11

	 	 	2004.11.15	 	 	CMT141-0018
	 	AT8005 LEAD/MARK INSPECTION SYSTEM WITH TAPE & REEL OPERATION PROCEDURE SPECIFICATION
	 	 	B	 
	12

	 	 	2004.11.1	 	 	CMT141-0038
	 	AT28 TAPE & REEL MACHINE OPERATION PROCEDURE SPECIFICATION
	 	 	B	 
	13

	 	 	2005.6.3	 	 	CMT141-0055
	 	G6 Tape & Reel Machine Operation Specification
	 	 	O	 
	14

	 	 	2004.11.15	 	 	CMT141-0056
	 	AT128 TAPE & REEL MACHINE OPERATION PROCEDURE SPECIFICATION
	 	 	O	 
	15

	 	 	2004.11.15	 	 	CMT141-0063
	 	TAPE & REEL MACHINE RELEASE TO PRODUCTION SPECIFICATION
	 	 	A	 
	16

	 	 	2004.12.1	 	 	CMT141-0072
	 	ATM AT & ATS LEAD STRAIGHTENER OPERATION PROCEDURE SPECIFICATION
	 	 	O	 
	17

	 	 	2004.11.1	 	 	CMT143-0026
	 	TR18ASII TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION
	 	 	F	 
	18

	 	 	2004.11.1	 	 	CMT143-0031
	 	MV851 IC MARK/LEAD INSPECTOR PM & CALIBRATION PROCEDURE SPECIFICATION
	 	 	C	 
	19

	 	 	2004.11.8	 	 	CMT143-0034
	 	PBFT-856VS PEEL BACK FORCE TESTER PM & CALIBRATION PROCEDURE SPECIFICATION
	 	 	B	 
	20

	 	 	2004.12.29	 	 	CMT143-0035
	 	AT8005 LEAD/MARK INSPECTION SYSTEM PM SPECIFICATION
	 	 	B	 
	21

	 	 	2004.11.3	 	 	CMT143-0056
	 	AT-28 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION
	 	 	C	 
	22

	 	 	2004.11.15	 	 	CMT143-0085
	 	AT-128 TAPE & REEL MACHINE PM & CALIBRATION PROCEDUIRE SPECIFICATION
	 	 	A	 
	23

	 	 	2004.11.15	 	 	CMT143-0097
	 	G6 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION
	 	 	A	 
	24

	 	 	2006.2.7	 	 	CMT144-0010
	 	Lead Scan and Tape & Reel procedure spec
	 	 	24	 
	25

	 	 	2004.12.17	 	 	CMT144-0015
	 	LEAD SCANNING PROCEDURE SPEC
	 	 	F	 
	26

	 	 	2005.11.25	 	 	CMT145-0006
	 	Packing material spec
	 	 	F	 
	27

	 	 	2005.11.30	 	 	CMT145-0007
	 	OPERATION PROCEDURE of TEST ONLY PRODUCT
	 	 	D	 







 









Table of Contents













APPENDIX 3














TRANSFER PLAN



The Transfer Plan may be amended and updated from time to time by mutual agreement of SCC and ANST
in writing






Transfer Plan (Macro view)




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 	May’06	Jun	Jul	Aug	Sep	Oct	Nov	 	Dec	Jan	 	Feb	 	Mar	 	Apr	 	May
	PDIP	>	 
	 	 	 	Rest of PDIP	 	 	 	 	 	 	 	 	 	 	 	 	 
	SOIC	 	 	 	 	>	 
	 	 	 	SOIC	 	 	 	 	 	 	 	 	 	 
	PLCC

	 	 	 	 	 	 	>	 
	 	PLCC	 	 	 	 	 	 	 	 	 	 
	TSSOP

	 	 	 	 	 	 	 	 	>	 
	 	 	 	TSSOP	 	 	 	 	 	 
	MSOP

	 	 	 	 	 	 	 	 	 	 	>	 
	 	 	 	MSOP	 	 	 	 
	SSOP

	 	 	 	 	 	 	 	 	 	 	 	 	> 	 
	 	 	 	SSOP	 	 








 




			
	Comments:
	 
	1.	 	PDIC + PLCC + SOIC = 80% of total revenue
	 
	2.	 	—— “ —— quals by end Jan.
	 
	3.	 	Review forecast to focus on high volume SOIC packages
	 
	4.	 	MOU discussions — 1 year total transfer period
	 
	5.	 	Current transfer plan — ramp up 80% of volume in 8 mths.
	 
	6.	 	PDIP determines rate of trf. Speed-up (best case) — by 2 mths.






19









Table of Contents











SCHEDULE




DEFINITION OF “COMMERCIALLY REASONABLE EFFORTS” BY SCC FOR THE

PURPOSES OF CLAUSE 5.2 OF THIS AGREEMENT 





	1.	 	Letter from CEO of SCC to the active SCL Customers
	 
	2.	 	Presentation to the SCL Customers to introduce ANST
	 
	3.	 	Organise one (1) meeting for each active SCL Customer
	 
	4.	 	Technical interface through first qualification build
	 
	5.	 	Sending its engineers and operators to the premises of ANST and provide 3000 man hours
on-site operational support to ANST (at ANST’s cost)
	 
	6.	 	Devote adequate time and effort of executive management, including 100 man hours by the
Managing Director or Plant Manager of SCC and 250 man hours each by two (2) directors of SCC
	 
	7.	 	Provide Customer Service Support to ANST and the Transfer Customers, including to prepare
customer interface and reports
	 
	8.	 	Provide cross training to the engineers and maintenance personnel of ANST at the premises of
SCC
	 
	9.	 	Transfer information and details of process know-how (including control plans and process
specifications), Recipe and Best Practices, Build of material and Source of Supply
	 
	10.	 	Conduct quality assurance audits on ANST and provide quality management training





20









Table of Contents





IN WITNESS WHEREOF the Parties have hereunto set their hands.




SCC




	 	 	 	 	 	 	 	 	 
	SIGNED by

	 	 	)	 	 	 	 	 
	Tan Lay Koon

	 	 	)	 	 	 	 	 
	for and on behalf of

	 	 	)	 	 	 	 	 
	STAT ChipPAC Shanghai Co., Ltd.

	 	 	)	 	 	 	 	 
	in the presence of:

	 	 	)	 	 	/s/ Tan Lay Koon
 

	 	 
	 

	 	 	 	 	 	Name: Tan Lay Koon	 	 
	 

	 	 	 	 	 	Title: President & CEO	 	 
	 


	 	 	 	 	 	 	 	 
	Name:
	 	 	 	 	 	 	 	 
	Title:
	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 
	SCL
	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 
	SIGNED by

	 	 	)	 	 	 	 	 
	Tan Lay Koon

	 	 	)	 	 	 	 	 
	for and on behalf of

	 	 	)	 	 	 	 	 
	STAT ChipPAC Ltd.

	 	 	)	 	 	 	 	 
	in the presence of:

	 	 	)	 	 	/s/ Tan Lay Koon
 

	 	 
	 

	 	 	 	 	 	Name: Tan Lay Koon	 	 
	 

	 	 	 	 	 	Title: President & CEO	 	 
	 


	 	 	 	 	 	 	 	 
	Name:
	 	 	 	 	 	 	 	 
	Title:
	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 
	ANST
	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 
	SIGNED by

	 	 	)	 	 	 	 	 
	Wang Guoping

	 	 	)	 	 	 	 	 
	for and on behalf of

	 	 	)	 	 	 	 	 
	Wuxi CR Micro-Assemb Tech. Ltd.

	 	 	)	 	 	 	 	 
	in the presence of:

	 	 	)	 	 	/s/ Wang Guoping	 	 
	 

	 	 	 	 	 	 	 	 
	 

	 	 	 	 	 	Name: Wang Guoping	 	 
	 

	 	 	 	 	 	Title: Director and Chief Executive Officer	 	 
	 


	 	 	 	 	 	 	 	 
	Name:
	 	 	 	 	 	 	 	 
	Title:
	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 
	CRL
	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 
	SIGNED by

	 	 	)	 	 	 	 	 
	Wang Guoping

	 	 	)	 	 	 	 	 
	for and on behalf of

	 	 	)	 	 	 	 	 
	China Resources Logic Limited

	 	 	)	 	 	 	 	 
	in the presence of:

	 	 	)	 	 	/s/ Wang Guoping	 	 
	 

	 	 	 	 	 	 	 	 
	 

	 	 	 	 	 	Name: Wang Guoping	 	 
	 

	 	 	 	 	 	Title: Director and Chief Executive Officer	 	 
	 


	 	 	 	 	 	 	 	 
	Name:
	 	 	 	 	 	 	 	 
	Title:
	 	 	 	 	 	 	 	 






21