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Dated this 22nd of June 2006
  STATS CHIPPAC SHANGHAI CO., LTD
  STATS CHIPPAC LTD.
  WUXI CR MICRO-ASSEMB TECH. LTD.
  CHINA RESOURCES LOGIC LIMITED
 
 ASSETS SALE AND PURCHASE AGREEMENT




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TABLE OF CONTENTS
 CLAUSEPAGE
    
    HEADING1.
    
    DEFINITIONS
    
    
    12.
    
    AGREEMENT TO SELL THE ASSETS
    
    
    43.
    
    PURCHASE CONSIDERATION
    
    
    44.
    
    TRANSFERS OF ASSETS
    
    
    55.
    
    RESPONSIBILITIES AND OBLIGATIONS
    
    
    66.
    
    WARRANTIES
    
    
    77.
    
    NON-SOLICITATION
    
    
    88.
    
    CRL GUARANTEE
    
    
    99.
    
    SCL GUARANTEE
    
    
    910.
    
    ANNOUNCEMENTS
    
    
    911.
    
    STAMP DUTY
    
    
    1012.
    
    COSTS AND EXPENSES
    
    
    1013.
    
    CONFIDENTIALITY
    
    
    1014.
    
    GENERAL
    
    
    1215.
    
    ILLEGALITY
    
    
    1316.
    
    NOTICES
    
    
    1317.
    
    REMEDIES AND WAIVERS
    
    
    1518.
    
    TIME OF ESSENCE
    
    
    1519.
    
    FORCE MAJEURE
    
    
    1520.
    
    COUNTERPARTS
    
    
    1521.
    
    GOVERNING LAW AND ARBITRATION
    
    
    15APPENDIX 1ASSETS
    
    
    17APPENDIX 2TECHNICAL SPECIFICATIONS
    
    
    18APPENDIX 3TRANSFER PLAN
    
    
    19SCHEDULE
    
    
    20




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THIS ASSETS SALE AND PURCHASE AGREEMENT nd
 BETWEEN
 (1)
    
    STATS CHIPPAC SHANGHAI CO., LTD., a company incorporated in the Peoples Republic of China
and having its registered address at 188 Huaxu Road, Qingpu District 201702 Shanghai, Peoples
Republic of China (SCC);(2)
    
    STATS CHIPPAC LTD.(Company Registration No. 199407932D) a company incorporated in Singapore
and having its corporate headquarters address at 10 Ang Mo Kio Street 65, Techpoint #05-17/20,
Singapore (SCL);(3)
    
    WUXI CR MICRO-ASSEMB TECH. LTD., a company incorporated in the Peoples Republic of China and
having its registered address at New District Science & Technology Park Ximei Road, B-27, Wuxi
214112, Jiangsu, Peoples Republic of China (ANST); and(4)
    
    CHINA RESOURCES LOGIC LIMITED(Company Registration No. 19963), a company incorporated in
Bermuda and having its principal business address at Rooms 4003-06, China Resources Building,
26 Harbour Road, Wanchai, Hong Kong (CRL),(collectively, the Parties and each a Party).
 WHEREAS
 (A)
    
    SCC has agreed to sell, and ANST has agreed to purchase, the Assets (as defined below) upon
the terms and subject to the conditions of this Agreement.(B)
    
    CRL has entered into this Agreement to guarantee to and covenant with SCC the due and
punctual performance by ANST of its payment obligations under this Agreement.(C)
    
    SCL has entered into this Agreement to guarantee to and covenant with CRL and ANST the due
and punctual performance by SCC of certain of its obligations under this Agreement.
 IT IS AGREED
 
 1.
    
    DEFINITIONS1.1
    
    In this Agreement, except to the extent that the context requires otherwise:Additional Incentive Amount has the meaning ascribed to it in Clause 3.3;Assets means the tools, equipment and spare parts agreed to be sold under this
Agreement as more particularly set out in Appendix 1 and shall where appropriate, include
the tools, equipment and spare parts to be delivered by SCC pursuant to Clause 4.3;Balance Purchase Consideration has the meaning ascribed to it in Clause 3.1(ii);
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Business Day means a day (other than a Saturday, Sunday or gazetted public
holiday) on which commercial banks are open for business in Hong Kong, Singapore, the BVI
and the PRC;BVI means the British Virgin Islands;CIETAC means China International Economic and Trade Arbitration Commission;CIETAC Rules means the CIETAC Arbitration Rules in force at the date of this
Agreement;commercially reasonable efforts for the purposes of the discharge of SCCs
obligations under Clause 5.2, shall mean such steps to be taken by SCC as set out in the
Schedule;Confidential Information means any information which is proprietary and
confidential to a Party including but not limited to the terms and conditions of this
Agreement, information concerning or relating in any way whatsoever to its distributorship,
franchise or other arrangements, principals, any of the trade secrets or confidential
operations, processes or inventions carried on or used by a Party, any information
concerning the organisation, business, finances, transactions or affairs of a Party,
dealings of a Party, secret or confidential information which relates to the business or
Party or any of its principals, clients or customers transactions or affairs, any Partys
technology, designs, documentation, manuals, budgets, financial statements or information,
accounts, dealers lists, customer lists, marketing studies, drawings, notes, memoranda and
the information contained therein, any information therein in respect of trade secrets,
technology and technical or other information relating to the development, manufacture,
clinical testing, analysis, marketing, sale or supply or proposed development, manufacture,
clinical testing, analysis, marketing, sale or supply of any products or services by a
Party, and plans for the development or marketing of such products or services and
information and material which is either marked confidential or is by its nature intended
to be exclusively for the knowledge of the recipient alone;Encumbrance means any claim, mortgage, charge, pledge, lien, security interest or
encumbrance or any other agreement or arrangement having substantially the same legal
effect, including any retention of title arrangement;Inspection Dates shall have the meaning ascribed to it in Clause 4.1;Joint Venture Agreement shall have the meaning ascribed to it in the Subscription
Agreement;Manufacturers Representative Agreement means that certain manufacturers
representative agreement entered or to be entered into between CRL, ANST, SCL and SCBL
pursuant to which SCBL is appointed as a non-exclusive manufacturers representative of
ANST;MAT means Micro Assembly Technologies Limited, a company established in the BVI
with its registered office at Pasea Estate, Road Town, Tortola, British Virgin Islands;Purchase Consideration shall have the meaning ascribed to it in Clause 3.1;PRC means the Peoples Republic of China;
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Related Corporation means with reference to a corporation, a corporation which is
(a) the holding company of the first-mentioned corporation; (b) a subsidiary of the
first-mentioned corporation; or (c) a subsidiary of the holding company of the
first-mentioned corporation;RMB means the lawful currency of the Peoples Republic of China;SCBL means STATS ChipPAC (BVI) Limited, a company established in the BVI with its
principal place of business at Craigmuir Chambers, Road Town, Tortola, the BVI;SCL Customers means the existing and future customers of SCL and/or its
subsidiaries, including without limitation, fabless IC Companies, fabless ASIC Companies,
wafer foundries and test and assembly houses;Subscription Agreement means the subscription agreement entered or to be entered
into between SCL, CRL, MAT and Wuxi China Resources Microelectronics (Holdings) Limited
pursuant to which, inter alia, SCL agrees to subscribe for a 25% stake in the enlarged
share capital of MAT;Technical Specifications means detailed quality requirements, maintenance
specifications, related products process flow and specifications plus quality assurance
process flow and specification more particularly set out in Appendix 2;to de-install means to unplug and unbolt and de-installation shall be
construed accordingly;Transfer means the completion of the de-installation of a phase of Assets in
accordance with the Transfer Plan and the acceptance of the same by ANST (evidenced by the
delivery by ANST of an acceptance certificate by ANST to SCC for the Assets);Transfer Customers means the SCL Customers to be referred and transferred to ANST
by SCL and/or its subsidiaries pursuant to Clause 5.2;Transfer Customer Confidential Information means any Confidential Information of
or relating to any Transfer Customer;Transfer Plan means the plan relating to the transfer of the Assets from SCC to
ANST set out in Appendix 3 (as may be amended and updated from time to time by mutual
agreement of SCC and ANST in writing);Transferred Revenues in relation to a particular Year, means the aggregate
revenues of ANST for that Year for assembly and testing services provided by ANST arising
from orders received by ANST (including orders received through SCC) from the Transfer
Customers or any of them based on the aggregate amount invoiced by ANST to the Transfer
Customers for that Year for such services (excluding taxes and the value of wafers and
chips);US$ or US Dollars means the lawful currency of the United States of
America; andYear means a calendar year commencing on 1 January and ending on 31
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December.1.2
    
    Any reference in this Agreement, the Appendices or the Schedule to a statutory provision
shall include that provision and any regulations made in pursuance thereof as from time to
time modified or re-enacted.1.3
    
    The headings in this Agreement are inserted for convenience only and shall be ignored in
construing this Agreement. Unless the context otherwise requires, words (including
words defined in this Agreement) denoting the singular number only shall include the plural
and vice versa. The words written and in writing
include any means of visible reproduction and electronic mails. References to the
Appendices, Schedule and Clauses are to the appendices and
schedule to and clauses of this Agreement.1.4
    
    Any reference to this Agreement shall be deemed to be references to this Assets
Sale and Purchase Agreement.1.5
    
    The expression subsidiary shall mean any company in which a Party directly or
indirectly owns more than fifty percent (50%) of such companys capital and voting rights of
such company.
 
 2.
    
    AGREEMENT TO SELL THE ASSETSSCC shall sell as legal and beneficial owner and ANST shall purchase the Assets on an as
is, where is basis as at the Inspection Dates free from all Encumbrances as at the time of
Transfer at the Purchase Consideration and upon the terms and conditions hereinafter
contained.
 
 3.
    
    PURCHASE CONSIDERATION3.1
    
    The aggregate consideration for the purchase of the Assets (the Purchase
Consideration) to be paid by ANST shall comprise the following:
 (i)
    
    an amount of US$12,000,000 to be paid to SCC on the date of the execution of
this Agreement;(ii)
    
    an aggregate amount of US$23,000,000 (the Balance Purchase
Consideration) to be paid in installments from 2007 to 2010 on the last Business
Day of each Year from 2007 to 2010 (both Years inclusive) and the amount to be paid to
SCC each Year shall be calculated as follows:
 P
    
    =
    
    S

50,000,000
    
    ×
    
    23,000,000

4
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(iii)
    
    a balance amount equal to the difference between US$23,000,000 and the
aggregate amount paid under sub-paragraph (ii) (if such aggregate amount paid is
effectively less than US$23,000,000) to be paid to SCC on or before 31 December 2010.
For the avoidance of doubt, the aggregate of the amounts payable under Clauses 3.1(ii)
and 3.1(iii) shall not exceed US$23,000,000.
 3.2
    
    Payments to be made by ANST to SCC in accordance with this Clause 3 shall be made in RMB in
the equivalent RMB amount (based on the US$ to RMB exchange
rate on the Business Day prior to the date of payment quoted by The Hongkong and Shanghai
Banking Corporation Limited, Singapore (or any successor entity thereof)) on the date of
payment by telegraphic transfer to a bank account in the PRC notified by SCC to ANST not
later than three (3) Business Days prior to the relevant payment date.3.3
    
    In the event that the cumulative Transferred Revenues for the Years 2007 to 2010 (both Years
inclusive) exceeds US$180,000,000, ANST shall pay the amount of US$5,000,000 to SCC on or
before 30 June 2011 (the Additional Incentive Amount), which amount is a goodwill
payment and does not form any part of the Purchase Consideration.
 
 4.
    
    TRANSFERS OF ASSETS4.1
    
    The Parties agree and acknowledge that the representatives of ANST have on 16 and 17 April
2006 (Inspection Dates) inspected the Assets.4.2
    
    The Assets shall be transferred by SCC to ANST in such phases and in such manner as more
particularly set out in the Transfer Plan (as may be amended and updated from time to time by
mutual agreement of SCC and ANST in writing) and pursuant to each phase, the following shall
occur:
 (i)
    
    ANST shall inspect the Assets to be transferred under such phase (the
affected Assets) on the date for the Transfer of such Assets for such phase
set out in the Transfer Plan (Transfer Date) for the sole purpose of
determining that the affected Assets are in the same condition as at the Inspection
Dates (ordinary wear and tear and deterioration through the effluxion of time
excepted);(ii)
    
    if such inspection by ANST confirms that the Assets are in the same condition
as at the Inspection Dates (ordinary wear and tear and deterioration through the
effluxion of time excepted), SCC shall de-install the affected Assets and upon
successful completion of the de-installation, ANST will deliver to SCC an acceptance
certificate confirming acceptance of the affected Assets under the Transfer
(Acceptance Certificate). For the avoidance of doubt, ANST shall not be
required to issue an Acceptance Certificate if the affected Assets are damaged in the
course of the de-installation;(iii)
    
    upon de-installation, the risks of the affected Assets under the Transfer
will pass to ANST;(iv)
    
    upon issuance of the Acceptance Certificate, the title to the affected Assets
under the Transfer will pass to ANST; and
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(v)
    
    ANST shall take all necessary steps to package, crate and transport the
affected Assets, as well as take out insurance coverage on the affected Assets.
 4.3
    
    In the event of any non-delivery or shortfall of any of the Assets (Undelivered
Assets) in accordance with the Transfer Plan, SCC shall deliver to ANST such tools,
equipment and spare parts as are substantially similar to the Undelivered Assets within 45
days of the Transfer Date in relation to the Undelivered Assets or such other date as ANST and
SCC may mutually agree.4.4
    
    For the avoidance of doubt, SCC shall be entitled to utilise the Assets for their own benefit
and at their own risk up to and until the date on which the relevant Assets are to be
transferred to ANST under the Transfer Plan.
 
 5.
    
    RESPONSIBILITIES AND OBLIGATIONS5.1
    
    SCC shall:
 (i)
    
    keep the Assets in reasonably good working condition, free from fire, free
from moisture and to secure the Assets before their Transfer;(ii)
    
    use commercially reasonable efforts to ensure that at the time of Transfer to
ANST, the condition of the Assets is substantially the same as the condition as at the
Inspection Dates (ordinary wear and tear and deterioration through the effluxion of
time excepted);(iii)
    
    for a period of 12 months commencing from the date of this Agreement, send
technical engineers to ANST to guide and help ANST install, test and commission the
Assets, at ANSTs sole cost and expense;(iv)
    
    for a period of 12 months commencing from the date of this Agreement, train
ANST engineers to use and maintain the Assets, at ANSTs sole cost and expense;(v)
    
    co-operate fully with ANST on implementing the Transfer Plan and the
de-commissioning, wipe-down, packaging, transport, reassembling, installing, testing,
facility quality guidelines, facility maintenance guidelines, related products process
flow and specifications plus quality assurance specifications and process flow of the
Assets; and(vi)
    
    for a period of 12 months commencing from the date of the completion of the
first Transfer, provide technical assistance to help bring the equipment up and
running and if necessary, to send its technical persons to ANSTs site to set up,
maintain and repair the Assets Transferred.
 5.2
    
    SCC shall, and SCL shall procure that SCC shall, use commercially reasonable efforts (as if
SCC were in the position of ANST in receiving the benefits of having the SCL Customers), to
refer and transfer the Transfer Customers to ANST and to help the Transfer Customers qualify
ANST as soon as possible.5.3
    
    Subject to Clause 5.2 and the confidentiality agreements between SCC, SCL and/or its
subsidiaries with the respective Transfer Customers, SCC shall:
 (i)
    
    for a period of 12 months commencing from the date of this Agreement, provide
to ANST such information and assistance as ANST may reasonably require
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relating to the
Assets including, but not limited to, the Technical Specifications and all related
intellectual property for the Assets;(ii)
    
    for a period of 12 months commencing from the date of this Agreement, train
ANST engineers and staff members to assist in their familiarisation with the Technical
Specifications, at ANSTs sole cost and expense; and(iii)
    
    provide details of the name list, needs, business volume forecast and past
three (3) years business profiles of each Transfer Customer.
 5.4
    
    ANST shall:
 (i)
    
    work with SCCs technical engineers on implementing the
Transfer Plan and the de-commissioning, wipe-down, packaging, transport, reassembling, installing,
testing, facility quality guidelines, facility maintenance guidelines, related
products process flow and specifications plus quality assurance specifications and
process flow of the Assets;(ii)
    
    use commercially reasonable efforts to promptly accept and confirm orders
from Transfer Customers and issue invoices to Transfer Customers for such orders;(iii)
    
    prepare and furnish to SCC within three (3) Business Days of the end of each
month, a monthly report setting out sufficient details of the aggregate Transferred
Revenues for that month, in form and substance satisfactory to SCC; and(iv)
    
    use commercially reasonable efforts to provide SCC and its officers,
employees, representatives and agents (collectively, the Representatives)
access to all its financial and operating data, books and records as SCC and/or its
Representatives may from time to time require, in connection with the verification of
the monthly reports referred to in sub-paragraph (iii) above.
 5.5
    
    Each Party shall:
 (i)
    
    at all times co-operate fully with the other Parties to improve, perfect,
execute and implement the Transfer Plan and to facilitate and expedite the Transfers;
and(ii)
    
    co-operate with the other Parties to obtain all local and national government
regulatory approvals, licenses and permits that are required for the consummation of
the transactions contemplated under this Agreement.
 5.6
    
    The Parties shall agree on a plan for SCC to and SCC shall, in accordance with such plan,
send out technical engineers to ANST and use existing production lines in ANST to build skills
and processes, quality control and manufacturing process flow and specifications for the
Transfer Customers according to the requirements of SCC and the Transfer Customers.
 
 6.
    
    WARRANTIES
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6.1
    
    Each Party hereby represents and warrants to and undertakes with the other Parties that:
 (i)
    
    it has full power and capacity to enter into and perform this Agreement, and
this Agreement when executed will constitute valid and binding obligations,
enforceable in accordance with its terms; and(ii)
    
    the execution and delivery of, and the performance by it of its obligations
under, this Agreement will not:
 (a)
    
    result in a breach of any provision of its memorandum or
articles of association or constitutional documents or any agreement to which
it is a party; or(b)
    
    result in a breach of any order, judgment or decree of any
court, governmental agency or regulatory body to which it is a party or by
which it is bound.
 6.2
    
    Each of SCL and SCC hereby warrants to ANST that:
 (i)
    
    SCC is the legal and beneficial owner of the Assets; and(ii)
    
    the Assets are or will at the time of the relevant Transfer or delivery
pursuant to Clause 4.3 (as the case may be) be free from all Encumbrances.
 6.3
    
    Each of CRL and ANST agrees and acknowledges that the Assets are to be sold and purchased on
an as is, where is basis as at the Inspection Dates and that SCC has not given any
warranties, representations, covenants or undertakings in respect of the Assets, including
without limitation any relating to description performance, merchantability, fitness for any
use or purpose, value, condition, performance, maintenance, specification or design, of the
whole or any part of the Assets save for the warranties expressly set out in this Agreement.
 
 7.
    
    NON-SOLICITATION7.1
    
    Each of CRL and ANST jointly and severally covenants with and undertakes to SCC that it shall
not, and shall procure that none of the subsidiaries of CRL shall, without the prior written
consent of SCC, at any time induce or attempt to induce any person who is at the time of this
Agreement or who later becomes an employee of SCC or any of its Related Corporations in their
businesses to terminate his or her employment with SCC or its Related Corporations (as the
case may be).7.2
    
    SCC covenants with and undertakes to ANST that:
 (i)
    
    it shall not solicit, entertain, discuss, negotiate or finalise any
arrangements with any third party with a view to or in connection with any acquisition
or purchase of all or part of the Assets; and(ii)
    
    it and its subsidiaries shall not directly or indirectly, solicit any offers
or proposals from any person relating to any sale or acquisition of all or part of the
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Assets or enter into or continue any discussion or negotiation in respect of Clause
7.2(i).
 
 8.
    
    CRL GUARANTEE8.1
    
    In consideration of SCC agreeing, at the request of CRL and ANST, to enter into this
Agreement, CRL hereby guarantees and undertakes to SCC the due and punctual payment to SCC
and/or its nominee(s) of the Balance Purchase Consideration and the Additional Incentive
Amount when due and payable under this Agreement (the CRL Guarantee) and
accordingly, in the event that ANST is unable to perform any of its payment obligations to pay
the Balance Purchase Consideration and/or the Additional Incentive Amount within 60 days after
the due date in relation to such payment obligation, CRL shall forthwith perform such
obligation to pay.8.2
    
    The CRL Guarantee is a continuing guarantee and shall remain in full force and effect until
(a) all the payment obligations of ANST in relation to the Balance Purchase Consideration and
the Additional Incentive Amount expressed or contemplated herein shall have been performed in
full or discharged or (b) until 61 days after 30 June 2011, whichever is earlier, and are in
addition to and not in substitution for any other rights which SCC may have under or by virtue
of this Agreement. CRL shall not be exonerated or discharged from liability under the CRL
Guarantee by time being given to ANST by SCC or by any other indulgence or concession to any
person granted by SCC and time given to ANST by SCC or any other indulgence or concession
granted by SCC to any person shall not be construed as a waiver of any of the rights of SCC
under this Agreement.
 
 9.
    
    SCL GUARANTEE9.1
    
    In consideration of CRL agreeing, at the request of SCL and SCC, to enter into this
Agreement, SCL hereby guarantees and undertakes to ANST the due and punctual performance by
SCC of its obligations under Clauses 5.2, 5.3 and 6.2 (the SCL Guarantee) and accordingly,
in the event that SCC is unable to perform any of its obligations under Clauses 5.2, 5.3 or
6.2, SCL shall forthwith perform such obligation.9.2
    
    This SCL Guarantee is a continuing guarantee and shall remain in full force and effect until
all the obligations of SCC under Clauses 5.2, 5.3 and 6.2 shall have been performed in full or
until 30 June 2011, whichever is earlier.
 
 10.
    
    ANNOUNCEMENTSSave as may be required to be disclosed pursuant to any applicable laws or to any
requirement of any competent governmental or statutory authority or rules or regulations of
any relevant regulatory, administrative or supervisory body (including, without limitation,
any relevant stock exchange or securities council), none of the Parties shall make or
authorise the making of any announcement concerning the subject matter of this Agreement
unless the other Parties shall have given their written consent to such announcement (such
consent not to be unreasonably withheld).
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11.
    
    STAMP DUTYAll stamp duty payable (if any) on this Agreement or any other document executed or to be
executed pursuant to this Agreement shall be borne equally by the Parties.
 
 12.
    
    COSTS AND EXPENSES12.1
    
    The applicable taxes payable in the PRC (including the value added taxes) on the sale of the
Assets and the cost and expenses of the de-installation of the Assets shall be borne by SCC.
The entire costs and expenses (including taxes and duties) arising from the packaging,
crating, transportation and all applicable insurance coverage on the Assets shall be borne by
ANST.12.2
    
    Save as otherwise provided in this Agreement, each Party shall bear its own legal,
professional and other costs and expenses incurred by it in connection with the negotiation,
preparation or completion of this Agreement.
 
 13.
    
    CONFIDENTIALITY13.1
    
    The Parties shall (and shall procure that its agents and where applicable its officers and
employees shall) at all times use all reasonable endeavours to keep confidential any
Confidential Information which it may acquire in relation to any other Party or in relation to
the clients, business or affairs of any other Party and shall not use or disclose such
information to any other person except with the consent of that other party or in accordance
with the order of a court of competent jurisdiction or of any governmental or regulatory
authority (whether in Singapore or elsewhere).
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13.2
    
    Notwithstanding Clause 13.1, the confidentiality obligation shall not apply to:
 (a)
    
    any information obtained from any Party which becomes generally known to the
public, other than by reason of any willful or negligent act or omission of any party
hereto or any of their agents, advisers, directors, officers, employees or
representatives;(b)
    
    any information which is required to be disclosed pursuant to any applicable
laws or to any competent governmental or statutory authority or pursuant to rules or
regulations of any relevant regulatory, administrative or supervisory body (including,
without limitation, any relevant stock exchange or securities council);(c)
    
    any information disclosed by any of the Parties to their respective bankers,
financial advisers, consultants and legal or other advisers for the purpose of this
Agreement;(d)
    
    any information disclosed by a Party to the directors, officers, employees,
agents, advisors or investors of that Party and/or subsidiaries of that Party; and(e)
    
    any information which is Transfer Customer Confidential Information which is
subject to confidentiality undertakings entered into between ANST and each such
Transfer Customer.
 13.3
    
    Without prejudice to the generality of the foregoing, ANST shall, and CRL shall procure that
ANST shall, save where the Transfer Customer agrees otherwise:
 (a)
    
    use Transfer Customer Confidential Information strictly for ANSTs businesses
and operations in outsource foundry assembly and testing; and(b)
    
    set up firewalls and implement other measures and processes to ensure that
no Transfer Customer Confidential Information will be leaked outside of ANST and such
measures shall include, without limitation, ensuring that the Transfer Customer
Confidential Information may only be disclosed to such of the directors, officers or
employees of ANST who are directly concerned with the business and operation of ANST
and whose knowledge of such information is required for such purpose and who (prior to
such disclosure) are bound by a confidentiality undertaking to the same extent as the
undertaking contained in this Clause 13.3.
  13.4
    
    Each of CRL and ANST shall jointly and severally hold harmless and indemnify SCC, its
directors, officers, employees and representatives for any costs, claims, demands losses or
liabilities of whatsoever nature arising directly or indirectly out of a breach of Clause
13.3. The aggregate liability of CRL and ANST for breaches of Clause 13.3 of this Agreement,
Clause 24.3 of the Joint Venture Agreement and Clause 14.3 of the Manufacturers
Representatives Agreement (the Confidentiality Obligations) and all matters
relating to or arising in connection with the subject matter of the Confidentiality
Obligations, whether based on an action or claim in contract, tort or otherwise, shall not
exceed US$5,000,000.
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13.5
    
    While the restrictions contained in Clause 13.3 are considered by the Parties to be
reasonable in all circumstances, it is recognised that such restrictions may fail for
technical reasons unforeseen and accordingly, it is hereby agreed and declared that if any
such restrictions shall be adjudged to be void as going beyond what is reasonable in all the
circumstances for the protection of the interests of SCL and/or its Related Corporations but
would be valid if part of the wording thereof were deleted or the periods (if any) thereof
were reduced or the range of activities or areas dealt with thereby were reduced in scope, the
said restrictions shall apply with such modifications as may be necessary to make them valid
and effective.13.6
    
    CRL and ANST acknowledge that no right or license is granted by SCC or SCL in relation to any
Transfer Customer Confidential Information.13.7
    
    The obligations contained in this Clause shall endure, notwithstanding the termination of
this Agreement, without limit in point of time except and until any confidential information
enters the public domain as set out above.
 
 14.
    
    GENERAL14.1
    
    This Agreement shall be binding upon and enure for the benefit of the permitted successors of
the Parties.14.2
    
    Unless otherwise agreed in writing by the Parties, none of the Parties shall be entitled to
assign this Agreement or any of its rights and obligations hereunder except that CRL may
assign and transfer its rights and obligations under this Agreement in the manner set out in
Clause 14.3 below.14.3
    
    The Parties acknowledge that CRL may, but shall not be obliged to undertake an internal
corporate restructuring exercise involving CRL and its Related Corporations but not involving
any change of ultimate shareholding control of CRL (a Restructuring Exercise). The
Parties hereby agree that notwithstanding Clause 14.2, CRL may (but shall not be obliged to)
transfer or assign its rights and obligations under this Agreement to its successor entity
pursuant to the Restructuring Exercise (CRL Successor Entity) and no consent shall
be required from any Party in respect of such assignment or transfer of CRLs rights and
obligations Provided that (i) such CRL Successor Entitys net asset value (total assets minus
total liabilities (excluding shareholders equity)) at the time of such assignment or transfer
of CRLs rights and obligations shall not be less than CRLs net asset value (total assets
minus total liabilities (excluding shareholders equity)) as of the date of this Agreement,
based on CRLs audited accounts for the financial year ended 31 December 2005; and (ii) not
less than one (1) month prior to any such assignment or transfer, CRL has permitted SCCs
independent external auditors to, at the sole cost and expense of CRL, undertake a limited
review of the financial statements of CRL Successor Entity for the sole purpose of determining
its net asset value. The opinion of SCCs independent external auditors shall be final,
conclusive and binding on CRL and SCC.
 12




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##### Table of Contents



14.4
    
    The provisions of this Agreement (insofar as the same shall not have been fully performed at
each Transfer) shall remain in full force and effect notwithstanding each Transfer. The
Transfers shall not prejudice any rights of any of the Parties which may have accrued
hereunder prior to each Transfer or payment of the Purchase Consideration or any part thereof.14.5
    
    The Parties shall do and execute or procure to be done and executed all such further acts,
deeds, things and documents as may be necessary to give effect to the terms of this Agreement.14.6
    
    This Agreement, and the documents referred to in it, constitute the entire agreement and
understanding between the Parties relating to the subject matter of this Agreement and none of
the Parties has entered into this Agreement in reliance upon any representation, warranty or
undertaking of any other Party which is not set out or referred to in this Agreement. The
Parties agree that no variations or modifications shall be made to this Agreement unless
agreed to by the Parties in writing. Nothing in this Clause 14.6 shall however operate to
limit or exclude liability for fraud.14.7
    
    Save as expressly provided herein, any right of termination conferred upon a Party shall be
in addition to and without prejudice to all other rights and remedies available to it and no
exercise or failure to exercise such a right of termination shall constitute a waiver of any
such other right or remedy.14.8
    
    As all Parties have participated in the drafting of this Agreement, the Parties agree that
any applicable rule requiring the construction of this Agreement or any provision hereof
against any Party drafting this Agreement shall not apply.
 
 15.
    
    ILLEGALITYThe illegality, invalidity or unenforceability of any provision of this Agreement under the
law of any jurisdiction shall not affect its legality, validity or enforceability under the
law of any other jurisdiction nor the legality, validity or enforceability of any other
provision.
 
 16.
    
    NOTICES16.1
    
    Any notice required to be given by a Party to the other Parties shall be deemed validly
served by hand delivery or by telefax or by prepaid registered letter or by a recognised
courier service sent to its address or facsimile number given herein or such other address or
facsimile number as may from time to time be notified for this purpose. The initial addresses
and telefax numbers of the Parties are:
 13




---



##### Table of Contents



SCC

    
    :
    
    STATS ChipPAC Shanghai Co., Ltd.Fax Number

    
    :
    
    +65 6720 7829Address

    
    :
    
    10 Ang Mo Kio Street 65 Techpoint #05-17/20 Singapore 569059Attention

    
    :
    
    Mr. Choong, Chan Yong, Vice President, Corporate StrategyWith a copy to

    
    :
    
    Ms. Taylor, Janet, General CounselSCL

    
    :
    
    STATS ChipPAC Ltd.Fax Number

    
    :
    
    +65 6720 7829Address

    
    :
    
    10 Ang Mo Kio Street 65 Techpoint #05-17/20 Singapore 569059Attention

    
    :
    
    Mr. Choong, Chan Yong, Vice President, Corporate StrategyWith a copy to

    
    :
    
    Ms. Taylor, Janet, General CounselANST

    
    :
    
    Wuxi CR Micro-Assemb Tech. Ltd.Fax Number

    
    :
    
    +86 510 5804647Address

    
    :
    
    14 LiangXi Road, Bin Hu District, Wuxi, Jiangsu Province, PRCAttention

    
    :
    
    Mr. Zhang Xiao Jian, DirectorCRL

    
    
    
    China Resources Logic LimitedFax Number

    
    :
    
    +852 2299 9311Address

    
    :
    
    Rooms 4003-6, 40/F., China Resources Building, 26
Harbour Road, Wanchai, Hong KongAttention

    
    :
    
    Mr. Wang Guoping, Director and Chief Executive Officer
 16.2
    
    Any such notice or communication shall be deemed to have been served:
 (a)
    
    if delivered by hand, at the time of delivery; or(b)
    
    if posted by prepaid ordinary mail, at the expiration of three (3) days
after the envelope containing the same shall have been put into the post; or(c)
    
    if sent by facsimile, upon the receipt by the sender of the transmission
report indicating that the notice or communication has been sent in full to the
recipients facsimile machine, or such other similar medium of receipt; or(d)
    
    if sent by courier, at the expiration of two (2) days after the package
containing the same shall have been received by the relevant courier company.
 14




---



##### Table of Contents



16.3
    
    In proving such service it shall be sufficient to prove that delivery by hand was made or
that the envelope containing such notice or document was properly addressed and posted as a
prepaid ordinary mail letter or that the facsimile confirmation note
indicates the transmission was successful, or, as the case may be, the package containing
such notice or document was properly addressed and sent to the relevant courier company.
 
 17.
    
    REMEDIES AND WAIVERSNo failure on the part of any Party to exercise, and no delay on its part in exercising,
any right or remedy under this Agreement will operate as a waiver thereof, nor will any
single or partial exercise of any right or remedy preclude any other or further exercise
thereof or the exercise of any other right or remedy. The rights provided in this
Agreement are cumulative and not exclusive of any rights or remedies provided by law.
 
 18.
    
    TIME OF ESSENCEAny date, time or period mentioned in any provision of this Agreement may be extended by
mutual agreement among the Parties but as regards any time, date or period originally
fixed and not extended or any time, date or period so extended as aforesaid time shall be
of the essence.
 
 19.
    
    FORCE MAJEURESave as is otherwise specifically provided in this Agreement, the Parties shall not be
liable for failures or delays in performing their obligations hereunder arising from any
cause beyond their control, including but not limited to acts of God, acts of civil or
military authority, fires, strikes, lockouts or labour disputes, epidemics, governmental
restrictions, wars, riots, earthquakes, storms, typhoons, floods and breakdowns in
electronic and computer information and communications systems and in the event of any
such delay the time for any Partys performance shall be extended for a period equal to
the time lost by reason of the delay which shall be remedied with all due despatch in the
circumstances. Any Party who becomes aware of any event arising under this Clause shall
notify the other Parties in writing promptly.
 
 20.
    
    COUNTERPARTSThis Agreement may be signed in any number of counterparts, all of which taken together
shall constitute one and the same instrument. Any Party may enter into this Agreement by
signing any such counterpart and each counterpart may be signed and executed by the
Parties and transmitted by facsimile transmission and shall be as valid and effectual as
if executed as an original.
 
 21.
    
    GOVERNING LAW AND ARBITRATION21.1
    
    This Agreement shall be governed by, and construed in accordance with, the laws of the PRC.
This Agreement is made out in six (6) originals in Chinese and four (4)
 15




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##### Table of Contents



21.2
    
    In case any dispute or difference shall arise between the Parties as to the construction of
this Agreement or as to any matter of whatsoever nature arising thereunder or in connection
therewith, including any question regarding its existence, validity or termination, such
dispute or difference shall be submitted to a single arbitrator to be appointed by the
Chairman for the time being of the CIETAC. Such submission shall be a submission to
arbitration in accordance with the CIETAC Rules by which the Parties agree to be so bound.
The place of arbitration shall be Shanghai and the arbitration shall be conducted wholly in
the English language. The prevailing Party in the arbitration shall be entitled to receive
reimbursement of its reasonable legal fees incurred in connection therewith.
 16




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##### Table of Contents



APPENDIX 1
 
 ASSETS
 17




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##### Table of Contents



Transferred Assembly Equipment Summary
 MOU
    
    
    
    
    
    
    Haved added to Total by ANSTCore equipment confirmation
    
    
    List
    
    
    Core
    
    Total
    
    request (SCC agreeed)BG
    
    Disco 850
    
    
    0
    
    
    1
    
    1Wafer mount ATM 8100=1,
    
    
    1
    
    
    1
    
    1manual wafer mount=1
    
    
    1
    
    
    1
    
    1DS
    
    DISCO 640=7, DISCO641=2, DISCO651=2
    
    
    11
    
    
    8
    
    11Manual wafer clean=3
    
    
    1
    
    
    1
    
    0CO2 bubbles
    
    
    3
    
    
    3
    
    4
    
    1Diama flow
    
    
    2
    
    
    2
    
    2DA
    
    ASM889=15, ESEC2007=38
    
    
    37
    
    
    39
    
    53Die Coat
    
    
    2
    
    
    2
    
    2Oven
    
    DA cure
    
    
    5
    
    
    5
    
    7PMC
    
    
    6
    
    
    6
    
    8WB
    
    KnS1488=47
    
    
    47
    
    
    16
    
    47Shikawa UTC200=53
    
    
    53
    
    
    53
    
    53Shikawa UTC250=191
    
    
    191
    
    
    108
    
    169
    
    -22Kns 8028=12
    
    
    12
    
    
    12
    
    123rd opt
    
    3rd Inspection mc
    
    
    5
    
    
    5
    
    5Microvision for PDIP/SOIC150mil
    
    
    6
    
    
    0
    
    0Low power scope
    
    
    0
    
    
    10
    
    10High power scope
    
    
    0
    
    
    1
    
    2
    
    1Ball shear/WP
    
    
    0
    
    
    1
    
    2
    
    1MOLD
    
    Manual press=22
    
    
    22
    
    
    22
    
    26
    
    4Preheater=22
    
    
    22
    
    
    22
    
    26
    
    4Auto mold system=15
    
    
    16
    
    
    16
    
    16
    
    1 (Added in 19 May 06)Mold die
    
    
    79
    
    
    78
    
    134Marking
    
    Laser marker
    
    
    
    
    
    Total
    
    18Pad print marking
    
    
    26
    
    
    marking
    
    6Pad engraver
    
    
    
    
    
    26
    
    1Laser deflash
    
    
    
    
    
    
    
    1X-ray for mold
    
    
    0
    
    
    1
    
    1Profile projector
    
    
    0
    
    
    1
    
    1Plating
    
    plating mc pure tin=3, solder=1
    
    
    4
    
    
    4
    
    4Trim/formTrim/form system (Manual+auto)
    
    
    42
    
    
    40
    
    59Trim.form die sets (manual+auto)
    
    
    101
    
    
    80
    
    90Lead scan (PDIP/SOIC150mils)
    
    
    2
    
    
    0
    
    1Lead straightener
    
    
    3
    
    
    3
    
    3C-SAM
    
    
    0
    
    
    
    
    1
    
    1700
    
    
    568
    
    778Same as number shown in the equipment list in MOU
    
 
    Agreed number on Core mc needed
    
   Total mc checked699


567

787


4/17/2006699


567

777


 ------>4-21 updated (Have added to Total by
ANST request (SCC agreeed))




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##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    
    Capital date1
    
    CO2
    
    CO2 BUBBLER M/C
    
    RC2000ACDS
    
    40000841
    
    2000.08.202
    
    CO2
    
    CO2 BUBBLER M/C
    
    RC-2000 ACD
    
    40000840
    
    2000.08.203
    
    CO2
    
    CO2 BUBBLER M/C
    
    RC-2000 ACD
    
    40003185
    
    2004.09.154
    
    CO2
    
    CO2 BUBBLER M/C
    
    RC-2000 ACD
    
    40002225
    
    2002.09.161
    
    DIAMAFLOW
    
    DP 037
    
    ADS2-M
    
    40003639
    
    2006.02.252
    
    DIAMAFLOW
    
    DP 038
    
    ADS2-M1
    
    DIE ATTACH
    
    AD 889 HIGH SPEED AUTOMATIC DI
    
    AD 889
    
    40000829
    
    2000.08.202
    
    DIE ATTACH
    
    AD 889 HIGH SPEED AUTOMATIC DI
    
    AD 889
    
    40002967
    
    2004.04.233
    
    DIE ATTACH
    
    AD 889 HIGH SPEED AUTOMATIC DI
    
    AD 889
    
    40000828
    
    2000.08.204
    
    DIE ATTACH
    
    AD 889 HIGH SPEED AUTOMATIC DI
    
    AD 889
    
    40000638
    
    2000.11.305
    
    DIE ATTACH
    
    AD 889 HIGH SPEED AUTOMATIC DI
    
    AD 889
    
    40000636
    
    2000.11.306
    
    DIE ATTACH
    
    AD 889 HIGH SPEED AUTOMATIC DI
    
    AD 889
    
    40000633
    
    2000.11.307
    
    DIE ATTACH
    
    AD 889 HIGH SPEED AUTOMATIC DI
    
    AD 889
    
    40000634
    
    2000.11.308
    
    DIE ATTACH
    
    AD 889 HIGH SPEED AUTOMATIC DI
    
    AD 889
    
    40002966
    
    2004.04.239
    
    DIE ATTACH
    
    AD 889 HIGH SPEED AUTOMATIC DI
    
    AD 889
    
    40000635
    
    2000.11.3010
    
    DIE ATTACH
    
    AUTOMATIC DIE BONDER
    
    AD889
    
    40000646
    
    2000.12.3011
    
    DIE ATTACH
    
    AUTOMATIC DIE BONDER
    
    AD889
    
    40000645
    
    2000.12.3012
    
    DIE ATTACH
    
    ICT:DIE MOUNTER
    
    AD889
    
    40000637
    
    2000.11.3013
    
    DIE ATTACH
    
    ICT:DIE MOUNTER
    
    AD889
    
    40000643
    
    2000.12.3014
    
    DIE ATTACH
    
    ICT:DIE MOUNTER
    
    AD889
    
    40002969
    
    2004.04.2315
    
    DIE ATTACH
    
    ICT:DIE MOUNTER
    
    AD889
    
    40002968
    
    2004.04.2316
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40000465
    
    1997.12.3117
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40000466
    
    1997.12.3118
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40000469
    
    1997.12.3119
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40000384
    
    1997.10.3120
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40000468
    
    1997.12.3121
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40000470
    
    1997.12.3122
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40000474
    
    1997.12.3123
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40000473
    
    1997.12.3124
    
    DIE ATTACH
    
    ESEC2007 BGA DIE BONDER
    
    ESEC 2007IC-8
    
    40000472
    
    1997.12.3125
    
    DIE ATTACH
    
    ESEC2007 BGA DIE BONDER
    
    ESEC 2007IC-8
    
    40001596
    
    2002.02.2526
    
    DIE ATTACH
    
    ESEC2007 BGA DIE BONDER
    
    ESEC 2007IC-8
    
    40001749
    
    2001.11.2527
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40001746
    
    2001.11.2528
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40001747
    
    2001.11.2529
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40001748
    
    2001.11.2530
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40001750
    
    2001.11.2531
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007BGA
    
    40002590
    
    2003.07.2532
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007BGA
    
    40002591
    
    2003.07.2533
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007BGA
    
    40002592
    
    2003.07.2534
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007IC-8
    
    40002504
    
    2003.04.2635
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007IC-8
    
    40002503
    
    2003.04.2636
    
    DIE ATTACH
    
    ICT:DIE BONDER
    
    ESEC 2007IC-8
    
    40002501
    
    2003.04.2637
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 IC-8
    
    40002502
    
    2003.04.2638
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000839
    
    2000.08.2039
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000832
    
    2000.08.2040
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000834
    
    2000.08.2041
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000838
    
    2000.08.2042
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000830
    
    2000.08.2043
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000836
    
    2000.08.2044
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000835
    
    2000.08.2045
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000837
    
    2000.08.2046
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000831
    
    2000.08.2047
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40000833
    
    2000.08.2048
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007 HS
    
    40002094
    
    2002.07.2749
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007IC-8
    
    40002701
    
    2003.10.2550
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007IC-8
    
    40002770
    
    2003.12.3051
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007IC-8
    
    40002769
    
    2003.12.3052
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007IC-8
    
    40002919
    
    2004.03.2753
    
    DIE ATTACH
    
    AUTO DIE BONDER
    
    ESEC 2007IC-8
    
    40002983
    
    2004.04.241
    
    DIE COAT
    
    DIE COATING M/C
    
    L1500
    
    40000386
    
    1997.10.312
    
    DIE COAT
    
    DIE COATER
    
    
    
    40001534
    
    2001.11.261
    
    DIE SAW
    
    DICING SAW SYSTEM
    
    DFD640
    
    40000454
    
    1997.12.312
    
    DIE SAW
    
    DICING SAW SYSTEM
    
    DFD640
    
    40000455
    
    1997.12.313
    
    DIE SAW
    
    DICING SAW SYSTEM
    
    DFD640
    
    40000459
    
    1997.12.314
    
    DIE SAW
    
    DICING SAW SYSTEM
    
    DFD640
    
    40000458
    
    1997.12.315
    
    DIE SAW
    
    DICING SAW SYSTEM
    
    DFD640
    
    40000460
    
    1997.12.316
    
    DIE SAW
    
    ICT:DICING SAW
    
    DFD640
    
    40002021
    
    2002.05.257
    
    DIE SAW
    
    ICT:DIE SAW
    
    DFD640
    
    40002981
    
    2004.04.248
    
    DIE SAW
    
    DP 067
    
    DFD641
    
    40000640
    
    2000.11.309
    
    DIE SAW
    
    DP 076
    
    DFD641
    
    40000639
    
    2000.11.3010
    
    DIE SAW
    
    DFD 641 FULLY AUTOMATIC DICING
    
    DFD 651
    
    40001517
    
    2001.08.2311
    
    DIE SAW
    
    DFD 641 FULLY AUTOMATIC DICING
    
    DFD 651
    
    40003035
    
    2001.08.231
    
    INSPECTION
    
    3RD INSPECTION M/C
    
    PD24
    
    40000558
    
    1997.12.312
    
    INSPECTION
    
    3RD INSPECTION M/C
    
    PS28W
    
    40000554
    
    1997.12.313
    
    INSPECTION
    
    3RD INSPECTION M/C
    
    PD8/14/16
    
    40000557
    
    1997.12.314
    
    INSPECTION
    
    3RD INSPECTION M/C
    
    PD8/14/16
    
    40000561
    
    1997.12.315
    
    INSPECTION
    
    3RD INSPECTION M/C
    
    PD
    
    40000556
    
    1997.12.311
    
    LEAD SCAN
    
    LEAD SCANNING FOR SOIC 150MIL
    
    851
    
    40000695
    
    1999.06.30




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##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    

Capital date1
    
    LEAD STRAIGHTENER
    
    AT-1045FP
    
    SOIC150MIL
    
    40000700
    
    1999.08.312
    
    LEAD STRAIGHTENER
    
    AT-300-RDS
    
    PDIP300MIL
    
    40000702
    
    1999.08.313
    
    LEAD STRAIGHTENER
    
    AT-600-RDS
    
    PDIP600MIL
    
    40000701
    
    1999.08.311
    
    MARK
    
    LASER M/K SYSTEM
    
    SY95-02
    
    40001341
    
    1997.12.312
    
    MARK
    
    AUTO YAG LASER M/K
    
    DLM818SV
    
    40001334
    
    1997.07.313
    
    MARK
    
    AUTO LASER M/K SYSTEM
    
    DLM818SV
    
    40001333
    
    1997.07.314
    
    MARK
    
    AUTO LASER M/K SYSTEM
    
    DLM818SV
    
    40000564
    
    1998.05.315
    
    MARK
    
    AUTO PAD MARKING M/C
    
    DPM513HSV
    
    40000598
    
    1998.05.316
    
    MARK
    
    AUTO PAD MARKING M/C
    
    DPM513HSV
    
    40000595
    
    1998.05.317
    
    MARK
    
    AUTO PAD M/K SYSTEM
    
    PLCC 28LD
    
    40000597
    
    1998.05.318
    
    MARK
    
    PAD MARKER
    
    MARKEM 534
    
    40000596
    
    1998.05.319
    
    MARK
    
    LASER MARKING M/C
    
    SLD-402
    
    40001691
    
    2001.06.2110
    
    MARK
    
    AUTO YAG M/K SYSTEM
    
    PDIP/SOIC
    
    40000145
    
    1995.12.3111
    
    MARK
    
    AUTO YAG M/K SYSTEM
    
    PDIP/SOIC
    
    40000683
    
    1999.04.1012
    
    MARK
    
    AUTO YAG M/K SYSTEM
    
    PDIP/SOIC
    
    40000682
    
    1999.04.1013
    
    MARK
    
    YAG LASER M/K SYS
    
    DLM818SV
    
    40000566
    
    1998.05.3114
    
    MARK
    
    YAG LASER M/K SYS
    
    DLM818SV
    
    40000565
    
    1998.05.3115
    
    MARK
    
    LASER MARKER AND PARTS
    
    SLD402
    
    40001690
    
    2001.06.2116
    
    MARK
    
    AUTO STRIP LASER MARKING M/C
    
    AT1817
    
    40000648
    
    2000.12.3017
    
    MARK
    
    AUTO STRIP LASER MARKING M/C
    
    AT1818
    
    40001689
    
    2001.05.2818
    
    MARK
    
    ICT:LASER MARKING SYSTEM(JIT)
    
    LEADED PKG
    
    40002023
    
    2002.05.2519
    
    MARK
    
    KOSES LASER DEFLASHER FOR EDP
    
    KDM600
    
    40002299
    
    2002.10.2520
    
    MARK
    
    SDL PLATE MARKE
    
    MARKEM612
    
    40000684
    
    1999.04.1021
    
    MARK
    
    LASER MARKING SYSTEM(STRIP MAR
    
    SLD-402/100
    
    40000623
    
    1995.12.3122
    
    MARK
    
    AUTO LASER MARK M/C
    
    EO LASER(SY9502)
    
    40003189
    
    2004.09.1623
    
    MARK
    
    AUTO LASER MARK M/C
    
    EO LASER(SY9502)
    
    40001332
    
    1997.06.3024
    
    MARK
    
    AUTO PAD MARK M/C
    
    TECA
    
    40001330
    
    1997.04.3025
    
    MARK
    
    AUTO PAD MARK M/C
    
    TECA
    
    40000699
    
    1999.08.3126
    
    MARK
    
    LASER MARKING SYSTEM
    
    SLD-402/100
    
    40001506
    
    2000.08.201
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1  4F
    
    40000588
    
    1998.05.312
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1  4F
    
    40000589
    
    1998.05.313
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1 8F
    
    40000657
    
    1999.03.314
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1 8F
    
    40000772
    
    2000.05.285
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1 8F
    
    40000771
    
    2000.05.286
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1 4F
    
    40000658
    
    1999.03.317
    
    MOLD AUTO
    
    ASM  AUTO MOLD
    
    ES649 4F
    
    40000665
    
    1999.04.108
    
    MOLD AUTO
    
    ASM  AUTO MOLD
    
    ES649 4F
    
    40000664
    
    1999.04.109
    
    MOLD AUTO
    
    ASM  AUTO MOLD
    
    EM649 4F
    
    40000667
    
    1999.04.1010
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1E 8F
    
    40000647
    
    2000.12.3011
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1 8F
    
    40001778
    
    2001.12.2312
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1 8F
    
    40001779
    
    2001.12.2313
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1 8F
    
    40001906
    
    2001.07.2914
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1 8F
    
    40001777
    
    2001.12.2315
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    Y-1 8F
    
    40001987
    
    2002.03.2616
    
    MOLD AUTO
    
    TOWA AUTO MOLD
    
    UPS120NEL 4F
    
    40001925
    
    19951
    
    MOLD
    
    MOLD DIE
    
    PDIP8M
    
    40003100
    
    2004.07.232
    
    MOLD
    
    MOLD DIE
    
    PDIP8M
    
    40003101
    
    2004.07.233
    
    MOLD
    
    MOLD DIE
    
    PDIP8M
    
    40002386
    
    2002.12.284
    
    MOLD
    
    MOLD DIE
    
    PDIP8M
    
    40002387
    
    2002.12.285
    
    MOLD
    
    MOLD DIE
    
    PDIP8M
    
    40003100
    
    2004.07.236
    
    MOLD
    
    MOLD DIE
    
    PDIP8M
    
    40003101
    
    2004.07.237
    
    MOLD
    
    MOLD DIE
    
    PDIP8M8
    
    MOLD
    
    MOLD DIE
    
    PDIP8M9
    
    MOLD
    
    MOLD DIE
    
    PDIP8M10
    
    MOLD
    
    MOLD DIE
    
    PDIP8M11
    
    MOLD
    
    MOLD DIE
    
    PDIP8M12
    
    MOLD
    
    MOLD DIE
    
    PDIP8M13
    
    MOLD
    
    MOLD DIE
    
    PDIP8
    
    40000591
    
    2001.12.3114
    
    MOLD
    
    MOLD DIE
    
    PDIP14
    
    40000160
    
    1995.12.3115
    
    MOLD
    
    MOLD DIE
    
    PDIP14
    
    40000161
    
    1995.12.3116
    
    MOLD
    
    MOLD DIE
    
    PDIP14
    
    40000237
    
    1996.09.1717
    
    MOLD
    
    MOLD DIE
    
    PDIP14
    
    40001556
    
    2001.12.2818
    
    MOLD
    
    MOLD DIE
    
    PDIP14
    
    40000170
    
    1995.12.3119
    
    MOLD
    
    MOLD DIE
    
    PDIP16
    
    40000171
    
    1995.12.3120
    
    MOLD
    
    MOLD DIE
    
    PDIP16
    
    40000590
    
    1998.05.3121
    
    MOLD
    
    MOLD DIE
    
    PDIP16
    
    40001553
    
    2001.12.2822
    
    MOLD
    
    MOLD DIE
    
    PDIP16
    
    40000034
    
    1997.12.3123
    
    MOLD
    
    MOLD DIE
    
    PDIP16
    
    40000849
    
    2000.09.3024
    
    MOLD
    
    MOLD DIE
    
    PDIP18
    
    40000256
    
    2001.12.3125
    
    MOLD
    
    MOLD DIE
    
    PDIP20
    
    40000255
    
    2001.12.3126
    
    MOLD
    
    MOLD DIE
    
    PDIP20
    
    40000163
    
    1995.12.3127
    
    MOLD
    
    MOLD DIE
    
    PDIP24
    
    40000164
    
    1995.12.3128
    
    MOLD
    
    MOLD DIE
    
    PDIP24
    
    40001554
    
    2001.12.2829
    
    MOLD
    
    MOLD DIE
    
    PDIP24
    
    40001555
    
    2001.12.2830
    
    MOLD
    
    MOLD DIE
    
    PDIP24
    
    40000493
    
    2001.12.3131
    
    MOLD
    
    MOLD DIE
    
    PDIP28
    
    40000494
    
    2001.12.3132
    
    MOLD
    
    MOLD DIE
    
    PDIP28
    
    40001896
    
    2001.05.2533
    
    MOLD
    
    MOLD DIE
    
    PDIP28
    
    40001608
    
    1996.03.2534
    
    MOLD
    
    MOLD DIE
    
    PDIP28
    
    40000166
    
    2001.12.31




---



##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    
    Capital date35
    
    MOLD
    
    MOLD DIE
    
    PDIP24N
    
    40000238
    
    2001.12.3136
    
    MOLD
    
    MOLD DIE
    
    PDIP28N
    
    40001608
    
    1996.03.2537
    
    MOLD
    
    MOLD DIE
    
    PDIP32
    
    40002205
    
    2002.07.2838
    
    MOLD
    
    MOLD DIE
    
    PDIP32
    
    40002207
    
    2002.07.2839
    
    MOLD
    
    MOLD DIE
    
    PDIP40
    
    40000169
    
    1995.12.3140
    
    MOLD
    
    MOLD DIE
    
    PDIP40
    
    40002632
    
    2001.04.2941
    
    MOLD
    
    MOLD DIE
    
    PDIP40
    
    40000240
    
    1996.09.1742
    
    MOLD
    
    MOLD DIE
    
    PDIP40
    
    40000495
    
    1997.12.3143
    
    MOLD
    
    MOLD DIE
    
    PDIP40
    
    40002633
    
    2001.04.2944
    
    MOLD
    
    MOLD DIE
    
    PLCC20
    
    40000650
    
    2000.12.3045
    
    MOLD
    
    MOLD DIE
    
    PLCC28
    
    40000229
    
    1996.07.3046
    
    MOLD
    
    MOLD DIE
    
    PLCC28
    
    40003601
    
    2006.01.2847
    
    MOLD
    
    MOLD DIE
    
    PLCC32
    
    40001023
    
    2001.01.2448
    
    MOLD
    
    MOLD DIE
    
    PLCC44
    
    40002218
    
    2002.08.2549
    
    MOLD
    
    MOLD DIE
    
    PLCC44
    
    40000268
    
    1997.01.3150
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40001991
    
    2002.04.0151
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40001992
    
    2002.04.0152
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40001993
    
    2002.04.0153
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40001994
    
    2002.04.0154
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40000794
    
    2000.06.2155
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40000794
    
    2000.06.2156
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40000794
    
    2000.06.2157
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40000794
    
    2000.06.2158
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40002304
    
    2002.10.2559
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40002303
    
    2002.10.2560
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40003199
    
    2004.09.1961
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40003200
    
    2004.09.1962
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40001991
    
    2002.04.0163
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40001992
    
    2002.04.0164
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40001993
    
    2002.04.0165
    
    MOLD
    
    MOLD DIE
    
    SOIC8/SOEP8E
    
    40001994
    
    2002.04.0166
    
    MOLD
    
    MOLD DIE
    
    SOIC8W
    
    40003199
    
    2004.09.1967
    
    MOLD
    
    MOLD DIE
    
    SOIC8W
    
    40003200
    
    2004.09.1968
    
    MOLD
    
    MOLD DIE
    
    SOIC8W
    
    40003245
    
    2004.11.0869
    
    MOLD
    
    MOLD DIE
    
    SOIC8W
    
    40003422
    
    2005.08.1970
    
    MOLD
    
    MOLD DIE
    
    SOIC14N
    
    40000496
    
    1997.12.3171
    
    MOLD
    
    MOLD DIE
    
    SOIC14N
    
    40000172
    
    1995.12.3172
    
    MOLD
    
    MOLD DIE
    
    SOIC14N
    
    40000848
    
    2000.09.3073
    
    MOLD
    
    MOLD DIE
    
    SOIC14N
    
    40002931
    
    2004.04.0174
    
    MOLD
    
    MOLD DIE
    
    SOIC16N
    
    40000316
    
    1997.05.3175
    
    MOLD
    
    MOLD DIE
    
    SOIC16N
    
    40003198
    
    2004.09.1976
    
    MOLD
    
    MOLD DIE
    
    SOIC16N
    
    40000173
    
    1995.12.3177
    
    MOLD
    
    MOLD DIE
    
    SOIC16N
    
    40001775
    
    2001.12.2378
    
    MOLD
    
    MOLD DIE
    
    SOIC14M
    
    40003442
    
    2005.09.2079
    
    MOLD
    
    MOLD DIE
    
    SOIC14M
    
    40003442
    
    2005.09.2080
    
    MOLD
    
    MOLD DIE
    
    SOIC14M
    
    40003442
    
    2005.09.2081
    
    MOLD
    
    MOLD DIE
    
    SOIC14M82
    
    MOLD
    
    MOLD DIE
    
    SOIC16M
    
    40003443
    
    2005.09.2083
    
    MOLD
    
    MOLD DIE
    
    SOIC16M
    
    40003443
    
    2005.09.2084
    
    MOLD
    
    MOLD DIE
    
    SOIC16M
    
    40003443
    
    2005.09.2085
    
    MOLD
    
    MOLD DIE
    
    SOIC16M86
    
    MOLD
    
    MOLD DIE
    
    SOIC16W
    
    40000174
    
    1995.12.3187
    
    MOLD
    
    MOLD DIE
    
    SOIC16W
    
    40001685
    
    2001.04.2988
    
    MOLD
    
    MOLD DIE
    
    SOIC16WM
    
    40003366
    
    2005.05.1689
    
    MOLD
    
    MOLD DIE
    
    SOIC20
    
    40000175
    
    1995.12.3190
    
    MOLD
    
    MOLD DIE
    
    SOIC20
    
    40000050
    
    1998.12.3191
    
    MOLD
    
    MOLD DIE
    
    SOIC20M92
    
    MOLD
    
    MOLD DIE
    
    SOIC20M93
    
    MOLD
    
    MOLD DIE
    
    SOIC20M94
    
    MOLD
    
    MOLD DIE
    
    SOIC20M95
    
    MOLD
    
    MOLD DIE
    
    SOIC2496
    
    MOLD
    
    MOLD DIE
    
    SOIC24
    
    40001677
    
    2001.03.3197
    
    MOLD
    
    MOLD DIE
    
    SOIC24NM
    
    40003397
    
    2005.07.2298
    
    MOLD
    
    MOLD DIE
    
    SOIC28N
    
    40000242
    
    2001.12.3199
    
    MOLD
    
    MOLD DIE
    
    SOIC28N
    
    40001679
    
    2001.03.31100
    
    MOLD
    
    MOLD DIE
    
    SOIC28N
    
    40001678
    
    2001.03.31101
    
    MOLD
    
    MOLD DIE
    
    SOIC28NM
    
    40003398
    
    2005.07.22102
    
    MOLD
    
    MOLD DIE
    
    SOIC28NM
    
    40003398
    
    2005.07.22103
    
    MOLD
    
    MOLD DIE
    
    SOIC28NM104
    
    MOLD
    
    MOLD DIE
    
    SOIC28W
    
    40003575
    
    2006.01.25105
    
    MOLD
    
    MOLD DIE
    
    SOIC28W
    
    40000243
    
    2001.12.31106
    
    MOLD
    
    MOLD DIE
    
    SSOP48
    
    40003268
    
    2004.12.06107
    
    MOLD
    
    MOLD DIE
    
    SSOP48
    
    40003269
    
    2004.12.06108
    
    MOLD
    
    MOLD DIE
    
    SSOP48
    
    40003270
    
    2004.12.06109
    
    MOLD
    
    MOLD DIE
    
    SSOP48
    
    40003271
    
    2004.12.06110
    
    MOLD
    
    MOLD DIE
    
    SSOP48
    
    40003272
    
    2004.12.06111
    
    MOLD
    
    MOLD DIE
    
    SSOP48
    
    40003273
    
    2004.12.06112
    
    MOLD
    
    MOLD DIE
    
    SSOP56
    
    40002051
    
    2002.05.27113
    
    MOLD
    
    MOLD DIE
    
    SSOP56
    
    40002051
    
    2002.05.27




---



##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    
    Capital date114
    
    MOLD
    
    MOLD DIE
    
    SSOP56
    
    40002051
    
    2002.05.27115
    
    MOLD
    
    MOLD DIE
    
    SSOP56
    
    40002051
    
    2002.05.27116
    
    MOLD
    
    MOLD DIE
    
    SSOP56AMP
    
    40003066
    
    2004.06.26117
    
    MOLD
    
    MOLD DIE
    
    SSOP56AMP
    
    40003066
    
    2004.06.26118
    
    MOLD
    
    MOLD DIE
    
    TSSOP8
    
    40001577
    
    2002.02.19119
    
    MOLD
    
    MOLD DIE
    
    TSSOP8
    
    40003419
    
    2005.08.18120
    
    MOLD
    
    MOLD DIE
    
    TSSOP8
    
    40003599
    
    2006.01.28121
    
    MOLD
    
    MOLD DIE
    
    TSSOP14/16
    
    40001579
    
    2002.02.19122
    
    MOLD
    
    MOLD DIE
    
    TSSOP14/16
    
    40003194
    
    2004.09.16123
    
    MOLD
    
    MOLD DIE
    
    TSSOP14/16
    
    40003099
    
    2004.07.23124
    
    MOLD
    
    MOLD DIE
    
    TSSOP14/16
    
    40003800
    
    2006.04.28125
    
    MOLD
    
    MOLD DIE
    
    TSSOP20126
    
    MOLD
    
    MOLD DIE
    
    TSSOP20
    
    40003567
    
    2005.12.24127
    
    MOLD
    
    MOLD DIE
    
    TSSOP20
    
    40003798
    
    2006.04.28128
    
    MOLD
    
    MOLD DIE
    
    TSSOP24129
    
    MOLD
    
    MOLD DIE
    
    TSSOP28
    
    40003239
    
    2004.11.03130
    
    MOLD
    
    MOLD DIE
    
    TSSOP28
    
    40001578
    
    2002.02.19131
    
    MOLD
    
    MOLD DIE
    
    TSSOP28
    
    40003566
    
    2005.12.24132
    
    MOLD
    
    MOLD DIE
    
    MSOP8/10
    
    40001575
    
    2002.02.19133
    
    MOLD
    
    MOLD DIE
    
    MSOP8/10
    
    40003038
    
    2004.06.23134
    
    MOLD
    
    MOLD DIE
    
    PLCC84
    
    40000036
    
    1997.12.311
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250TM32
    
    40000364
    
    1997.08.312
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250
    
    40000153
    
    1995.12.313
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250TM32
    
    40000155
    
    1995.12.314
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250TM32
    
    40000157
    
    1995.12.315
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250TM32
    
    40000158
    
    1995.12.316
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-200-7TM
    
    40000247
    
    1996.09.307
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250TM32
    
    40000156
    
    1995.12.318
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250TM32
    
    40000315
    
    1997.05.319
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250TM32
    
    40000484
    
    1997.04.3010
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000481
    
    1997.12.3111
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000570
    
    1998.05.3112
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000487
    
    1997.12.3113
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000486
    
    1997.12.3114
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000576
    
    1998.05.3115
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000575
    
    1998.05.3116
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000572
    
    1998.05.3117
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000571
    
    1998.05.3118
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000490
    
    1997.12.3119
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000491
    
    1997.12.3120
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000574
    
    1998.05.3121
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000573
    
    1998.05.3122
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000492
    
    1997.12.3123
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000483
    
    1997.12.3124
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTM250-7TAN32
    
    40000569
    
    1998.05.3125
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250TM32
    
    40002329
    
    2002.11.2326
    
    MOLD PRESS
    
    MANUAL MOLD PRESS
    
    FSTMP-250TM32
    
    40002328
    
    2002.11.231
    
    OVEN
    
    DA OVEN
    
    MP1506
    
    40000121
    
    1995.12.312
    
    OVEN
    
    DA OVEN
    
    MP1506
    
    40000127
    
    1995.12.313
    
    OVEN
    
    DA OVEN
    
    MP1506
    
    40000128
    
    1995.12.314
    
    OVEN
    
    DA OVEN
    
    MP1506
    
    40000125
    
    1995.12.315
    
    OVEN
    
    DA OVEN
    
    MP1506
    
    40000126
    
    1995.12.316
    
    OVEN
    
    DA OVEN
    
    MP1506
    
    40000122
    
    1995.12.317
    
    OVEN
    
    DA OVEN
    
    MP1506
    
    40000124
    
    1995.12.318
    
    OVEN
    
    PMC OVEN
    
    MP-1506FY-HP-WAS
    
    40000190
    
    1995.12.319
    
    OVEN
    
    PMC OVEN
    
    MP-1506FY-HP-WAS
    
    40000191
    
    1995.12.3110
    
    OVEN
    
    PMC OVEN
    
    MP-1506FY-HP-WAS
    
    40000192
    
    1995.12.3111
    
    OVEN
    
    PMC OVEN
    
    ASC-336F
    
    40000194
    
    1995.12.3112
    
    OVEN
    
    PMC OVEN
    
    MP-1506FY-HP-WAS
    
    40000202
    
    1995.12.3113
    
    OVEN
    
    PMC OVEN
    
    MP-1506FY-HP-WAS
    
    40001306
    
    1995.12.3114
    
    OVEN
    
    PMC OVEN
    
    MP-1506FY-HP-WAS
    
    40001307
    
    1995.12.3115
    
    OVEN
    
    PMC OVEN
    
    MP-1506FY-HP
    
    40001308
    
    1995.12.311
    
    PLATING
    
    PLATING M/C
    
    EDF-EPL 1800S
    
    40000497
    
    1997.12.312
    
    PLATING
    
    PLATING M/C
    
    EDF-EPL 1800S
    
    40000498
    
    1997.12.313
    
    PLATING
    
    PLATING M/C
    
    EDF-EPL 1800S
    
    40001905
    
    2001.07.294
    
    PLATING
    
    PLATING M/C
    
    EDF-EPL 1800S
    
    40002108
    
    2002.07.281
    
    MOLD
    
    PREHEATER
    
    SD523M
    
    40000184
    
    1995.12.312
    
    MOLD
    
    PREHEATER
    
    SD523M
    
    40000179
    
    1995.12.313
    
    MOLD
    
    PREHEATER
    
    SD523M
    
    40000231
    
    1996.07.304
    
    MOLD
    
    PREHEATER
    
    SD523M
    
    40000185
    
    1995.12.315
    
    MOLD
    
    PREHEATER
    
    SD523M
    
    40000186
    
    1995.12.316
    
    MOLD
    
    PREHEATER
    
    SD523M
    
    40000181
    
    1995.12.317
    
    MOLD
    
    PREHEATER
    
    SD523M
    
    40000188
    
    1995.12.318
    
    MOLD
    
    PREHEATER
    
    SD523M
    
    40000178
    
    1995.12.319
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000405
    
    1997.11.3010
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000271
    
    1997.01.3111
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000339
    
    1997.07.3112
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000285
    
    1997.04.3013
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000368
    
    1997.08.31




---



##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    
    Capital date14
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000370
    
    1997.08.3115
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000407
    
    1997.11.3016
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000272
    
    1997.01.3117
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000410
    
    1997.11.3018
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000321
    
    1997.06.3019
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000317
    
    1997.05.3120
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000322
    
    1997.06.3021
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000411
    
    1997.11.3022
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000406
    
    1997.11.3023
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000369
    
    1997.08.3124
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000233
    
    1996.07.3025
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000338
    
    1997.07.3126
    
    MOLD
    
    PREHEATER
    
    SD723M
    
    40000415
    
    1997.11.301
    
    TNF
    
    AP048
    
    MATRIX PD8LD AUTO T/F/S(ROLLER)
    
    40000704
    
    1999.11.302
    
    TNF
    
    AP048
    
    MATRIX PD8LD AUTO T/F/S
    
    40000704
    
    1999.11.303
    
    TNF
    
    AP049
    
    MATRIX PD8LD AUTO T/F/S
    
    40000703
    
    1999.11.304
    
    TNF
    
    AP049
    
    MATRIX PD8LD AUTO T/F/S(ROLLER)
    
    40000703
    
    1999.11.305
    
    TNF
    
    AP047
    
    MATRIX SOIC8LD AUTO TRIM
    
    40000451
    
    1997.12.306
    
    TNF
    
    AP066
    
    MATRIX SOIC8LD F/S
    
    40001593
    
    2002.02.257
    
    TNF
    
    AP065
    
    MATRIX SOIC8LD TRIM
    
    40001592
    
    2002.02.258
    
    TNF
    
    AP036
    
    MATRX SOIC8LD AUTO FORM
    
    40000668
    
    1999.04.109
    
    TNF
    
    AP131
    
    MSOP08/10 FORM
    
    40003190
    
    2004.09.1610
    
    TNF
    
    AP130
    
    MSOP08 TRIM
    
    40003191
    
    2004.09.1611
    
    TNF
    
    AP084
    
    MSOP8/10 3RD REJECT CUT TOOL
    
    40001962
    
    2002.02.2412
    
    TNF
    
    AP084
    
    MSOP8/10LD AUTO FROM
    
    40001962
    
    2002.02.2413
    
    TNF
    
    AP083
    
    MSOP10LD AUTO TRIM
    
    40001963
    
    2002.02.2414
    
    TNF
    
    AP020
    
    PD14LD IDF AUTO T/F SHUTTLE(roller)
    
    40000362
    
    1997.08.3115
    
    TNF
    
    AP021
    
    PD16LD IDF AUTO T/F SHUTTLE(roller)
    
    40000363
    
    1997.08.3116
    
    TNF
    
    AP002
    
    PD16LD IDFAUTO T/F SHUTTLE(roller)
    
    40000853
    
    1997.11.3017
    
    TNF
    
    BP018
    
    PD18 FORM MANUAL DIE
    
    40001392
    
    2000.12.3018
    
    TNF
    
    BP017
    
    PD18 TRIM MANUAL DIE19
    
    TNF
    
    AP051
    
    PD20LD AUTO T/F/S SHUTTLE
    
    40000681
    
    1999.04.1020
    
    TNF
    
    BP012
    
    PD24(N) TRIM MANUAL DIE
    
    40001392
    
    2000.12.3021
    
    TNF
    
    AP075
    
    PD24(W)LD AUTO T/F SHUTTLE
    
    40000656
    
    2000.12.3022
    
    TNF
    
    BP004
    
    PD24N FORM MANUAL DIE
    
    40003347
    
    2005.03.1623
    
    TNF
    
    BP004
    
    PD28(N) FORM MANUAL DIE
    
    40000928
    
    1995.12.3124
    
    TNF
    
    BP012
    
    PD28(N) TRIM MANUAL DIE
    
    40000989
    
    1995.12.3125
    
    TNF
    
    AP064
    
    PD28(w)LD AUTO T/F
    
    40001676
    
    2001.03.3126
    
    TNF
    
    AP078
    
    PD40 AUTO T/F SHUTTLE
    
    40000423
    
    1997.11.3027
    
    TNF
    
    AP008
    
    PD8LD IDF AUTO T/F SHUTTLE
    
    40000134
    
    2001.12.3128
    
    TNF
    
    AP045
    
    PLCC 44LD AUTO FORM
    
    40000674
    
    1999.04.1029
    
    TNF
    
    AP010
    
    PLCC20LD AUTO TRIM
    
    40000055
    
    1996.10.3130
    
    TNF
    
    AP010
    
    PLCC20LD AUTO FORM
    
    40000055
    
    1996.10.3131
    
    TNF
    
    AP070
    
    PLCC28LD AUTO FORM
    
    40000236
    
    2001.12.3132
    
    TNF
    
    AP067
    
    PLCC28LD AUTO TRIM
    
    40001512
    
    2000.11.1533
    
    TNF
    
    AP029
    
    PLCC32LD FORM
    
    40000235
    
    1996.07.3034
    
    TNF
    
    AP026
    
    PLCC32LD TRIM
    
    40000424
    
    1997.11.3035
    
    TNF
    
    AP050
    
    PLCC44LD AUTO TRIM
    
    40000675
    
    1999.04.1036
    
    TNF
    
    AP055
    
    PLCC84LD AUTO FORM
    
    40000678
    
    2001.12.3037
    
    TNF
    
    AP054
    
    PLCC84LD AUTO TRIM
    
    40000680
    
    1999.04.1038
    
    TNF
    
    AP018
    
    SO16(w)/20LD AUTO T/F
    
    40000331
    
    1997.07.3139
    
    TNF
    
    AP017
    
    SO8/14/16LD AUTO T/F
    
    40000257
    
    1996.10.3140
    
    TNF
    
    AP116
    
    SOIC 14LDM AUTO FORM
    
    40002692
    
    2003.10.2141
    
    TNF
    
    AP116
    
    SOIC 16LDM AUTO FORM
    
    40002692
    
    2003.10.2142
    
    TNF
    
    AP046
    
    SOIC 8/14/16LD AUTO FORM
    
    40000685
    
    1999.04.1043
    
    TNF
    
    AP128
    
    SOIC08M FORM
    
    40003209
    
    2004.10.2044
    
    TNF
    
    AP059
    
    SOIC14M TRIM
    
    40000843
    
    2000.09.2945
    
    TNF
    
    AP042
    
    SOIC16(W)/20LD AUTO FORM
    
    40000686
    
    1999.04.1046
    
    TNF
    
    AP041
    
    SOIC16(W)/20LD AUTO TRIM
    
    40000687
    
    1999.04.1047
    
    TNF
    
    AP080
    
    SOIC16/20M AUTO FORM
    
    40001711
    
    2001.07.2948
    
    TNF
    
    AP079
    
    SOIC16/20M AUTO TRIM
    
    40001710
    
    2001.07.2949
    
    TNF
    
    AP059
    
    SOIC16M TRIM
    
    40000843
    
    2000.09.2950
    
    TNF
    
    AP105
    
    SOIC24/28 TRIM/FORM
    
    40000606
    
    1998.05.3151
    
    TNF
    
    AP006
    
    SOIC24/28LD AUTO TRIM
    
    40000224
    
    1996.06.3052
    
    TNF
    
    AP006
    
    SOIC24/28LD AUTO FORM
    
    40000224
    
    1996.06.3053
    
    TNF
    
    AP076
    
    SOIC24/28LD AUTO TRIM
    
    40000676
    
    1999.04.1054
    
    TNF
    
    AP076
    
    SOIC24/28LD AUTO FORM
    
    40000676
    
    1999.04.1055
    
    TNF
    
    AP071
    
    SOIC24M ATUO TRIM
    
    40001751
    
    2001.11.2556
    
    TNF
    
    AP131
    
    SOIC24M FORM
    
    40003190
    
    2004.09.1657
    
    TNF
    
    AP007
    
    SOIC28(w)LD AUTO TRIM
    
    40000221
    
    1996.05.3158
    
    TNF
    
    AP007
    
    SOIC28(w)LD AUTO FORM
    
    40000221
    
    1996.05.3159
    
    TNF
    
    AP071
    
    SOIC28M AUTO TRIM
    
    40001751
    
    2001.11.2560
    
    TNF
    
    AP131
    
    SOIC28M FORM
    
    40003190
    
    2004.09.1661
    
    TNF
    
    AP032
    
    SOIC8(w)LD AUTO FORM
    
    40000605
    
    1998.05.3162
    
    TNF
    
    AP031
    
    SOIC8(w)LD AUTO TRIM
    
    40000604
    
    1998.05.3163
    
    TNF
    
    AP022
    
    SOIC14/16LD AUTO FORM
    
    40000452
    
    1997.12.3164
    
    TNF
    
    AP025
    
    SOIC14/16LD AUTO FORM
    
    40000477
    
    1997.12.3165
    
    TNF
    
    AP023
    
    SOIC14/16LD AUTO TRIM
    
    40000479
    
    1997.12.3166
    
    TNF
    
    AP024
    
    SOIC14/16LD AUTO TRIM
    
    40000478
    
    1997.12.31




---



##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    
    Capital date67
    
    TNF
    
    AP036
    
    SOIC8M 3RD REJECT CUT TOOL
    
    40000668
    
    1999.04.1068
    
    TNF
    
    AP032
    
    SOIC8W 3RD REJECT CUT TOOL
    
    40000605
    
    1998.05.3169
    
    TNF
    
    AP060
    
    SSOP48(intel)LD AUTO F/S
    
    40000844
    
    2000.09.2970
    
    TNF
    
    AP043
    
    SSOP48LD AUTO FORM
    
    40000666
    
    1999.04.1071
    
    TNF
    
    AP059
    
    SSOP48LD AUTO TRIM
    
    40000843
    
    2000.09.2972
    
    TNF
    
    AP074
    
    SSOP56LD AUTO FORM(AMD)
    
    40002636
    
    2001.12.3073
    
    TNF
    
    AP044
    
    SSOP56LD AUTO TRIM
    
    40000666
    
    1999.04.1074
    
    TNF
    
    AP073
    
    SSOP56LD AUTO TRIM (AMD)
    
    40001892
    
    2001.12.3075
    
    TNF
    
    AP084
    
    TSSOP08LD AUTO FORM
    
    40001962
    
    2002.02.2476
    
    TNF
    
    AP083
    
    TSSOP08LD AUTO TRIM
    
    40001963
    
    2002.02.2477
    
    TNF
    
    AP084
    
    TSSOP14/16 3RD REJECT CUT TOOL
    
    40001962
    
    2002.02.2478
    
    TNF
    
    AP129
    
    TSSOP14/16 FORM
    
    40003206
    
    2004.10.1479
    
    TNF
    
    AP084
    
    TSSOP14/16LD AUTO FROM
    
    40001962
    
    2002.02.2480
    
    TNF
    
    AP083
    
    TSSOP14LD AUTO TRIM
    
    40001963
    
    2002.02.2481
    
    TNF
    
    AP038
    
    TSSOP20/24 3RD REJECT CUT TOOL
    
    40000662
    
    1999.03.3182
    
    TNF
    
    AP038
    
    TSSOP20 AUTO FORM/SINGULATION
    
    40000662
    
    1999.03.3183
    
    TNF
    
    AP037
    
    TSSOP20/24LD AUTO TRIM
    
    40000660
    
    1999.03.3184
    
    TNF
    
    AP084
    
    TSSOP28LD AUTO FROM
    
    40001962
    
    2002.02.2485
    
    TNF
    
    AP083
    
    TSSOP28LD AUTO TRIM
    
    40001963
    
    2002.02.2486
    
    TNF
    
    AP037
    
    TSSOP30LD AUTO TRIM
    
    40000660
    
    1999.03.3187
    
    TNF
    
    AP128
    
    SOIC08M FORM(EDP)
    
    40003209
    
    2004.10.2088
    
    TNF
    
    AP020
    
    PD14LD IDF AUTO T/F SHUTTLE(roller)
    
    40000362
    
    1997.08.3189
    
    TNF
    
    AP038
    
    TSSOP24/30LD AUTO FORM SINGULATION
    
    40000662
    
    1999.03.3190
    
    TNF
    
    AP130
    
    TSSOP16LD AUTO TRIM
    
    40003191
    
    2004.09.161
    
    TNF SYS
    
    AUTO T/F SYSTEM
    
    SO 24/28LD
    
    40000224
    
    1996.06.302
    
    TNF SYS
    
    AUTO T/F SYSTEM(PD8LD)
    
    J036-444
    
    40000134
    
    2001.12.313
    
    TNF SYS
    
    AUTO T/F/S
    
    SOIC 28LD
    
    40000236
    
    2001.12.314
    
    TNF SYS
    
    AUTO T/F SYSTEM
    
    SO-8/14/16L
    
    40000685
    
    1999.04.105
    
    TNF SYS
    
    T/F SYSTEM-A
    
    SO W16/20
    
    40000331
    
    1997.07.316
    
    TNF SYS
    
    T/F SYSTEM-A
    
    PD-14L/D
    
    40000362
    
    1997.08.317
    
    TNF SYS
    
    T/F SYSTEM-A
    
    PD-16L/D
    
    40000363
    
    1997.08.318
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    PLCC 32LD
    
    40000424
    
    1997.11.309
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    SOIC 8/14/1
    
    40000452
    
    1997.12.3110
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    SOIC 8/14/1
    
    40000477
    
    1997.12.3111
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    SOIC 8/14/1
    
    40000479
    
    1997.12.3112
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    SOIC 8/14/1
    
    40000478
    
    1997.12.3113
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    SOIC8LD
    
    40000604
    
    1998.05.3114
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    SOIC8LD
    
    40000605
    
    1998.05.3115
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    TSSOP20/24L
    
    40000660
    
    1999.03.3116
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    TSSOP20/24L
    
    40000662
    
    1999.03.3117
    
    TNF SYS
    
    TRIM FORM SYSTEM
    
    M209 SOIC8L
    
    40000668
    
    1999.04.1018
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    PLCC44LD
    
    40000674
    
    1999.04.1019
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    PLCC44LD
    
    40000675
    
    1999.04.1020
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    PLCC84LD
    
    40000678
    
    2001.12.3021
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    PLCC84LD
    
    40000680
    
    1999.04.1022
    
    TNF SYS
    
    AUTO T/F SYSTEM
    
    PDIP20LD
    
    40000681
    
    1999.04.1023
    
    TNF SYS
    
    TRIM FORM SYSTEM
    
    SOIC8/14/16
    
    40000257
    
    1996.10.3124
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    SOICW16/20
    
    40000686
    
    1999.04.1025
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    SOICW16/20
    
    40000687
    
    1999.04.1026
    
    TNF SYS
    
    TRIM/FORM SYSTEM
    
    PDIP08LD
    
    40000704
    
    1999.11.3027
    
    TNF SYS
    
    TRIM/FORM SYSTEM
    
    PDIP08LD
    
    40000703
    
    1999.11.3028
    
    TNF SYS
    
    ICT:AUTO TRIM EQUIP
    
    SOIC W16/20
    
    40001710
    
    2001.07.2929
    
    TNF SYS
    
    ICT:AUTO FORM EQUIP
    
    SOIC W16/20
    
    40001711
    
    2001.07.2930
    
    TNF SYS
    
    FORM SYSTEM WITH PARTS (450000
    
    SH01,SE34,S
    
    40001962
    
    2002.02.2431
    
    TNF SYS
    
    TRIM SYSTEM WITH PARTS(4500003
    
    SH01,SH02,S
    
    40001963
    
    2002.02.2432
    
    TNF SYS
    
    MP209 FORM/SING'SYSTEM FOR SOI
    
    SOIC 14/16L
    
    40002692
    
    2003.10.2133
    
    TNF SYS
    
    TSSOP/MSOP FORM SYSTEM
    
    AP131
    
    40003190
    
    2004.09.1634
    
    TNF SYS
    
    TSSOP/MSOP TORM SYSTEM
    
    AP130
    
    40003191
    
    2004.09.1635
    
    TNF SYS
    
    MP209 FORM SYSTEM FOR SOIC 8LD
    
    SOIC 8LD
    
    40003209
    
    2004.10.2036
    
    TNF SYS
    
    T/F FOR PD24/28
    
    AVA0045Z
    
    40000656
    
    2000.12.3037
    
    TNF SYS
    
    A SET OF TRIM & MATRIX
    
    SSOP48&56LD
    
    40000666
    
    1999.04.1038
    
    TNF SYS
    
    TRIM MANUAL PRESS
    
    
    
    40001395
    
    2000.11.3039
    
    TNF SYS
    
    FORM MANUAL PRESS
    
    
    
    40001396
    
    2000.11.3040
    
    TNF SYS
    
    FORM/SIGULATION FOR PLCC28
    
    
    
    40001511
    
    2000.11.1541
    
    TNF SYS
    
    TRIM FORM FOR PLCC 28
    
    
    
    40001512
    
    2000.11.1542
    
    TNF SYS
    
    SOIC8 MATRIX TRIM(PO2362)
    
    MECHANICAL
    
    40001592
    
    2002.02.2543
    
    TNF SYS
    
    SOIC8 MATRIX FORM(PO2362)
    
    MECHANICAL
    
    40001593
    
    2002.02.2544
    
    TNF SYS
    
    ICT-PDIP24  AUTO  TRIM/FORM  E
    
    D9Z850715
    
    40000656
    
    2000.12.3045
    
    TNF SYS
    
    TRIM/FORM SYSTEM
    
    PLCC20LD AUTO T/F
    
    40000055
    
    1996.10.3146
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    PLCC32LD FORM
    
    40000048
    
    1998.12.3147
    
    TNF SYS
    
    TRIM/FORM SYSTEM
    
    SOIC28(w)LD AUTO T/F
    
    40000221
    
    1996.05.3148
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    SSOP56LD AUTO FORM(AMD)
    
    40002636
    
    2001.12.3049
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    SSOP56LD AUTO TRIM (AMD)
    
    40001892
    
    2001.12.3050
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    SSOP48(intel)LD AUTO F/S
    
    40000844
    
    2000.09.2951
    
    TNF SYS
    
    AUTO FORM SYSTEM
    
    SSOP48LD AUTO FORM
    
    40000666
    
    1999.04.1052
    
    TNF SYS
    
    AUTO TRIM SYSTEM
    
    SSOP48LD AUTO TRIM
    
    40000843
    
    2000.09.2953
    
    TNF SYS
    
    TRIM/FORM SYSTEM
    
    SO 24/28LD
    
    40000606
    
    1998.05.3154
    
    TNF SYS
    
    SOIC8 MATRIX TRIM
    
    MECHANICAL
    
    40000451
    
    1997.12.3055
    
    TNF SYS
    
    TSSOP/MSOP FORM SYSTEM
    
    AP129
    
    40003206
    
    2004.10.14




---



##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    
    Capital date56
    
    TNF SYS
    
    TRIM/FORM SYSTEM
    
    PD40 TTT
    
    40000140
    
    1995.12.3157
    
    TNF SYS
    
    AUTO TRIM/FORM SYS.
    
    PLCC32LD
    
    40002507 /40002508
    
    2003.05.2558
    
    TNF SYS
    
    AUTO TRIM FORM SYS
    
    300MIL 20LD
    
    40001599
    
    1995.10.3159
    
    TNF SYS
    
    AUTO T/F SYS
    
    14LD IDF
    
    40001909
    
    2001.10.261
    
    WAFER MOUNT
    
    WAFER MOUNTER
    
    ATM8100
    
    40000453
    
    1997.12.312
    
    WAFER MOUNT
    
    MANAUAL WAFER MOUNT SYSTEM
    
    DT-MWM1230
    
    40002053
    
    2002.05.271
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40002117
    
    2002.07.282
    
    WIRE BOND
    
    ICT:WIRE BONDER 1488(D9L970099
    
    KnS 1488
    
    40002122
    
    2002.07.283
    
    WIRE BOND
    
    ICT:WIRE BONDER 1488(D9L970313
    
    KnS 1488
    
    40002196
    
    2002.07.284
    
    WIRE BOND
    
    ICT:WIRE BONDER 1488(D9L970285
    
    KnS 1488
    
    40002171
    
    2002.07.285
    
    WIRE BOND
    
    ICT:WIRE BONDER 1488(D9L970299
    
    KnS 1488
    
    40002183
    
    2002.07.286
    
    WIRE BOND
    
    ICT:WIRE BONDER 1488(D9Y990059
    
    KnS 1488
    
    40002126
    
    2002.07.287
    
    WIRE BOND
    
    ICT:WIRE BONDER 1488(D9Y990105
    
    KnS 1488
    
    40002129
    
    2002.07.288
    
    WIRE BOND
    
    ICT:WIRE BONDER 1488(D9A970166
    
    KnS 1488
    
    40002295
    
    2002.09.289
    
    WIRE BOND
    
    ICT:WIRE BONDER 1488(D9A970173
    
    KnS 1488
    
    40002243
    
    2002.09.2810
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002287
    
    2002.09.2811
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002141
    
    2002.07.2812
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002145
    
    2002.07.2813
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002547
    
    2001.05.2514
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002270
    
    2002.09.2815
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002269
    
    2002.09.2816
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002258
    
    2002.09.2817
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002543
    
    2001.05.2518
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002559
    
    2001.05.2519
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002165
    
    2002.07.2820
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002140
    
    2002.07.2821
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002556
    
    2001.05.2522
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002560
    
    2001.05.2523
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40001795
    
    2001.12.2324
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002144
    
    2002.07.2825
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40001687
    
    2001.05.2526
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40001788
    
    2001.12.2327
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002149
    
    2002.07.2828
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40001783
    
    2001.12.2329
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40001792
    
    2001.12.2330
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40001790
    
    2001.12.2331
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002160
    
    2002.07.2832
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002553
    
    2001.05.2533
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002548
    
    2001.05.2534
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002146
    
    2002.07.2835
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002139
    
    2002.07.2836
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40001787
    
    2001.12.2337
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002191
    
    2002.07.2838
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 1488
    
    40002535
    
    2001.05.2539
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40001789
    
    2001.12.2340
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40002552
    
    2001.05.2541
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40002201
    
    2002.07.2842
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40001794
    
    2001.12.2343
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40002178
    
    2002.07.2844
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40002198
    
    2002.07.2845
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40002155
    
    2002.07.2846
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40002137
    
    2002.07.2847
    
    WIRE BOND
    
    ICT:WIRE BONDER K&S1488
    
    KnS 1488
    
    40002262
    
    2002.09.281
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-200
    
    40000816
    
    2000.06.302
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-200
    
    40000819
    
    2000.06.303
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-200
    
    40000818
    
    2000.06.304
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000817
    
    2000.06.305
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000798
    
    2000.06.306
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000797
    
    2000.06.307
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000796
    
    2000.06.308
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000795
    
    2000.06.309
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40002476
    
    2003.04.2610
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000800
    
    2000.06.3011
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000799
    
    2000.06.3012
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000807
    
    2000.06.3013
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000805
    
    2000.06.3014
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40002477
    
    2003.04.2615
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000808
    
    2000.06.3016
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40002478
    
    2003.04.2617
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000803
    
    2000.06.3018
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000806
    
    2000.06.3019
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000804
    
    2000.06.3020
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000812
    
    2000.06.3021
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000801
    
    2000.06.3022
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000810
    
    2000.06.3023
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000802
    
    2000.06.3024
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-200
    
    40000811
    
    2000.06.3025
    
    WIRE BOND
    
    WIRE BONDER&&
    
    UTC-200
    
    40000813
    
    2000.06.3026
    
    WIRE BOND
    
    WIRE BONDER&&
    
    UTC-200
    
    40000814
    
    2000.06.30




---



##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    
    Capital date27
    
    WIRE BOND
    
    WIRE BONDER&&
    
    UTC-200
    
    40000815
    
    2000.06.3028
    
    WIRE BOND
    
    WIRE BONDER&&
    
    UTC-200
    
    40000809
    
    2000.06.3029
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001605
    
    1995.09.0630
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001606
    
    1995.09.0631
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001607
    
    1995.09.0632
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001604
    
    1995.09.0633
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001624
    
    1998.04.2334
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001615
    
    1998.04.2335
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001616
    
    1998.04.2336
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001618
    
    1998.04.2337
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001622
    
    1998.04.2338
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001621
    
    1998.04.2339
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001620
    
    1998.04.2340
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001619
    
    1998.04.2341
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001630
    
    1998.04.2342
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001631
    
    1998.04.2343
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001617
    
    1998.04.2344
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001625
    
    1998.04.2345
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001623
    
    1998.04.2346
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001627
    
    1998.04.2347
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001611
    
    1997.05.1648
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001626
    
    1998.04.2349
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001629
    
    1998.04.2350
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001614
    
    1997.05.1651
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001613
    
    1997.05.1652
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001628
    
    1998.04.2353
    
    WIRE BOND
    
    INT-UTC-200 BI WIRE BONDER
    
    UTC-200BI
    
    40001612
    
    1997.05.161
    
    WIRE BOND
    
    AUTO WIRE BONDER
    
    UTC-250BI-S
    
    40000534
    
    1997.12.312
    
    WIRE BOND
    
    AUTO WIRE BONDER
    
    UTC-250BI-S
    
    40000531
    
    1997.12.313
    
    WIRE BOND
    
    AUTO WIRE BONDER
    
    UTC-250BI-S
    
    40000532
    
    1997.12.314
    
    WIRE BOND
    
    AUTO WIRE BONDER
    
    UTC-250BI-S
    
    40000533
    
    1997.12.315
    
    WIRE BOND
    
    AUTO WIRE BONDER
    
    UTC-250BI-S
    
    40000535
    
    1997.12.316
    
    WIRE BOND
    
    AUTO WIRE BONDER
    
    UTC-250BI-S
    
    40000536
    
    1997.12.317
    
    WIRE BOND
    
    AUTO WIRE BONDER
    
    UTC-250BI-S
    
    40000540
    
    1997.12.318
    
    WIRE BOND
    
    AUTO WIRE BONDER
    
    UTC-250BI-S
    
    40000537
    
    1997.12.319
    
    WIRE BOND
    
    AUTO WIRE BONDER
    
    UTC-250BI-S
    
    40000538
    
    1997.12.3110
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000501
    
    1997.12.3111
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000502
    
    1997.12.3112
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000503
    
    1997.12.3113
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000504
    
    1997.12.3114
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000505
    
    1997.12.3115
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000506
    
    1997.12.3116
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000507
    
    1997.12.3117
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000508
    
    1997.12.3118
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000509
    
    1997.12.3119
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000510
    
    1997.12.3120
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000511
    
    1997.12.3121
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000512
    
    1997.12.3122
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000513
    
    1997.12.3123
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000514
    
    1997.12.3124
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000515
    
    1997.12.3125
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000517
    
    1997.12.3126
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000518
    
    1997.12.3127
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000516
    
    1997.12.3128
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000519
    
    1997.12.3129
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000520
    
    1997.12.3130
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000521
    
    1997.12.3131
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000522
    
    1997.12.3132
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000523
    
    1997.12.3133
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000524
    
    1997.12.3134
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000525
    
    1997.12.3135
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000526
    
    1997.12.3136
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000527
    
    1997.12.3137
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000528
    
    1997.12.3138
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000529
    
    1997.12.3139
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC250BI-SU
    
    40000530
    
    1997.12.3140
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI-S
    
    40000539
    
    1997.12.3141
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI-S
    
    40000390
    
    1997.10.3142
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI-S
    
    40000391
    
    1997.10.3143
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI-S
    
    40000392
    
    1997.10.3144
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI-S
    
    40000393
    
    1997.10.3145
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI-S
    
    40000394
    
    1997.10.3146
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI-S
    
    40000395
    
    1997.10.3147
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI-S
    
    40000396
    
    1997.10.3148
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000541
    
    1997.12.3149
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000542
    
    1997.12.3150
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000543
    
    1997.12.3151
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000544
    
    1997.12.3152
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000545
    
    1997.12.31




---



##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    
    Capital date53
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000546
    
    1997.12.3154
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000547
    
    1997.12.3155
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000548
    
    1997.12.3156
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000549
    
    1997.12.3157
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000550
    
    1997.12.3158
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40000551
    
    1997.12.3159
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40001832
    
    2001.12.2360
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40001862
    
    2001.12.2361
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40002497
    
    2003.04.2662
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000746
    
    2000.01.3063
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000744
    
    2000.01.3064
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000745
    
    2000.01.3065
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000747
    
    2000.01.3066
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40001855
    
    2001.12.2367
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40002494
    
    2003.04.2668
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000713
    
    1999.11.3069
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000714
    
    1999.11.3070
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000715
    
    1999.11.3071
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000716
    
    1999.11.3072
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000717
    
    1999.11.3073
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000718
    
    1999.11.3074
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000719
    
    1999.11.3075
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000720
    
    1999.11.3076
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000721
    
    1999.12.3077
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000722
    
    1999.12.3078
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000723
    
    1999.12.3079
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000724
    
    1999.12.3080
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000725
    
    1999.12.3081
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000726
    
    1999.12.3082
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40002481
    
    2003.04.2683
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40002487
    
    2003.04.2684
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40002480
    
    2003.04.2685
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000727
    
    1999.12.3086
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000728
    
    1999.12.3087
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000729
    
    1999.12.3088
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000730
    
    2000.01.3089
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000731
    
    2000.01.3090
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000732
    
    2000.01.3091
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000733
    
    2000.01.3092
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000734
    
    2000.01.3093
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000735
    
    2000.01.3094
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000736
    
    2000.01.3095
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000737
    
    2000.01.3096
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000738
    
    2000.01.3097
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000739
    
    2000.01.3098
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250
    
    40000740
    
    2000.01.3099
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250BI
    
    40000552
    
    1997.12.31100
    
    WIRE BOND
    
    WIRE BONDER
    
    UTC-250BI
    
    40002820
    
    2004.02.21101
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9Z96)
    
    UTC-250
    
    40002491
    
    2003.04.26102
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9Z96)
    
    UTC-250
    
    40002488
    
    2003.04.26103
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9Z96)
    
    UTC-250
    
    40002489
    
    2003.04.26104
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000741
    
    2000.01.30105
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000742
    
    2000.01.30106
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000743
    
    2000.01.30107
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000748
    
    2000.01.30108
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000749
    
    2000.01.30109
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000750
    
    2000.01.30110
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000751
    
    2000.01.30111
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000752
    
    2000.01.30112
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000753
    
    2000.01.30113
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001833
    
    2001.12.23114
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001848
    
    2001.12.23115
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001861
    
    2001.12.23116
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001857
    
    2001.12.23117
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001838
    
    2001.12.23118
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001860
    
    2001.12.23119
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001858
    
    2001.12.23120
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001851
    
    2001.12.23121
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001840
    
    2001.12.23122
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001853
    
    2001.12.23123
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40001846
    
    2001.12.23124
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40002498
    
    2003.04.26125
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40000754
    
    2000.01.30126
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40002493
    
    2003.04.26127
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40002479
    
    2003.04.26128
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40002483
    
    2003.04.26129
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40002496
    
    2003.04.26130
    
    WIRE BOND
    
    ICT:WIRE BONDER (D9A97)
    
    UTC-250
    
    40002495
    
    2003.04.26131
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002482
    
    2003.04.26




---



##### Table of Contents



Process
    
    Equipment Name
    
    Model Type
    
    Asset No.
    
    Capital date132
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002500
    
    2003.04.26133
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002486
    
    2003.04.26134
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001845
    
    2001.12.23135
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001841
    
    2001.12.23136
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001826
    
    2001.12.23137
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001823
    
    2001.12.23138
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001844
    
    2001.12.23139
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001825
    
    2001.12.23140
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001842
    
    2001.12.23141
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001828
    
    2001.12.23142
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002499
    
    2003.04.26143
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002484
    
    2003.04.26144
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001839
    
    2001.12.23145
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001829
    
    2001.12.23146
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001830
    
    2001.12.23147
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001837
    
    2001.12.23148
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001850
    
    2001.12.23149
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001827
    
    2001.12.23150
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001824
    
    2001.12.23151
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40001831
    
    2001.12.23152
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002490
    
    2003.04.26153
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002787
    
    2004.01.19154
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002789
    
    2004.01.19155
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002788
    
    2004.01.19156
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002784
    
    2004.01.19157
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002791
    
    2004.01.19158
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002790
    
    2004.01.19159
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002786
    
    2004.01.19160
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250
    
    40002785
    
    2004.01.19161
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250BI
    
    40002818
    
    2004.02.21162
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250BI
    
    40000781
    
    2000.05.28163
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250BI
    
    40000780
    
    2000.05.28164
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250BI
    
    40002821
    
    2004.02.21165
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250BI
    
    40002825
    
    2004.02.21166
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250BI
    
    40002824
    
    2004.02.21167
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250BI
    
    40002822
    
    2004.02.21168
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    UTC-250BI
    
    40002823
    
    2004.02.21169
    
    WIRE BOND
    
    WIRE BONDER-A
    
    UTC-250BI
    
    40002819
    
    2004.02.211
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40002900
    
    2004.03.272
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40002906
    
    2004.03.273
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40002904
    
    2004.03.274
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40002902
    
    2004.03.275
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40002905
    
    2004.03.276
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40003058
    
    2004.06.277
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40003061
    
    2004.06.278
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40003062
    
    2004.06.279
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40003057
    
    2004.06.2710
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40003056
    
    2004.06.2711
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40003141
    
    2004.07.2312
    
    WIRE BOND
    
    ICT:WIRE BONDER
    
    KnS 8028
    
    40003132
    
    2004.07.23




---



##### Table of Contents



TRANSFERRED TEST EQUIPMENT SUMMARY
 TYPE
    
    PLATFORM
    
    Out-Total
    
    CORE
    
    EXCESS
    
    S/DTESTER
    
    A360
    
    
    12
    
    
    
    4
    
    
    
    4
    
    
    
    4TESTER
    
    A5XX
    
    
    5
    
    
    
    3
    
    
    
    2
    
    
    
    0TESTER
    
    ASL1000
    
    
    4
    
    
    
    3
    
    
    
    1
    
    
    
    0TESTER
    
    DUO
    
    
    2
    
    
    
    2
    
    
    
    0
    
    
    
    0TESTER
    
    EPRO
    
    
    44
    
    
    
    35
    
    
    
    0
    
    
    
    9TESTER
    
    ETS300
    
    
    2
    
    
    
    1
    
    
    
    1
    
    
    
    0TESTER
    
    ETS300_TI
    
    
    3
    
    
    
    0
    
    
    
    2
    
    
    
    1TESTER
    
    ETS364
    
    
    5
    
    
    
    5
    
    
    
    0
    
    
    
    0TESTER
    
    HP94XX
    
    
    13
    
    
    
    10
    
    
    
    2
    
    
    
    1TESTER
    
    J750
    
    
    3
    
    
    
    3
    
    
    
    0
    
    
    
    0TESTER
    
    LTX77
    
    
    21
    
    
    
    12
    
    
    
    9
    
    
    
    0TESTER
    
    M3650
    
    
    3
    
    
    
    2
    
    
    
    1
    
    
    
    0TESTER
    
    MAGNUM
    
    
    1
    
    
    
    1
    
    
    
    0
    
    
    
    0TESTER
    
    MAVERICK PT
    
    
    1
    
    
    
    1
    
    
    
    0
    
    
    
    0TESTER
    
    Q2/62
    
    
    9
    
    
    
    3
    
    
    
    1
    
    
    
    5TESTER
    
    SENTRY
    
    
    3
    
    
    
    0
    
    
    
    0
    
    
    
    3TESTER
    
    VISTA
    
    
    6
    
    
    
    3
    
    
    
    2
    
    
    
    1TESTER TOTAL
    
    
    
    
    137
    
    
    
    88
    
    
    
    25
    
    
    
    24HANDLER
    
    AAT
    
    
    6
    
    
    
    0
    
    
    
    1
    
    
    
    5HANDLER
    
    AET5050
    
    
    8
    
    
    
    3
    
    
    
    1
    
    
    
    4HANDLER
    
    AET3300
    
    
    8
    
    
    
    1
    
    
    
    0
    
    
    
    7HANDLER
    
    AESCO
    
    
    6
    
    
    
    0
    
    
    
    2
    
    
    
    4HANDLER
    
    ASM
    
    
    3
    
    
    
    3
    
    
    
    0
    
    
    
    0HANDLER
    
    KUWANO
    
    
    10
    
    
    
    8
    
    
    
    0
    
    
    
    2HANDLER
    
    MCT
    
    
    43
    
    
    
    18
    
    
    
    11
    
    
    
    14HANDLER
    
    SESSCO
    
    
    14
    
    
    
    4
    
    
    
    1
    
    
    
    9HANDLER
    
    RASCO
    
    
    20
    
    
    
    17
    
    
    
    3
    
    
    
    0HANDLER
    
    SYMTEK
    
    
    6
    
    
    
    1
    
    
    
    0
    
    
    
    5HANDLER
    
    TESEC
    
    
    10
    
    
    
    0
    
    
    
    0
    
    
    
    10HANDLER
    
    TB150
    
    
    1
    
    
    
    0
    
    
    
    0
    
    
    
    1HANDLER
    
    MH802
    
    
    2
    
    
    
    0
    
    
    
    0
    
    
    
    2HANDLER
    
    MT93XX
    
    
    24
    
    
    
    20
    
    
    
    4
    
    
    
    0HANDLER
    
    MT8589
    
    
    2
    
    
    
    2
    
    
    
    0
    
    
    
    0HANDLER
    
    MT8588
    
    
    3
    
    
    
    0
    
    
    
    2
    
    
    
    1HANDLER
    
    MT99XX
    
    
    6
    
    
    
    4
    
    
    
    2
    
    
    
    0HANDLER TOTAL
    
    
    
    
    172
    
    
    
    81
    
    
    
    27
    
    
    
    64GRAND TOTAL
    
    
    
    
    309
    
    
    
    169
    
    
    
    52
    
    
    
    88




---



##### Table of Contents



SCC Tester Review-Out
 NO
    
    Platform
    
    Asset
    
    Device
    
    Arrived at SCC
    
    Vendor
    
    CORE
    
    Excess
    
    S/D1
    
    A360
    
    40001349
    
    ANALOG
    
    00.10.6
    
    TERADYNE
    
    
    
    EXCESS2
    
    A360
    
    40001350
    
    ANALOG
    
    00.10.6
    
    TERADYNE
    
    
    
    EXCESS3
    
    A360
    
    40001351
    
    ANALOG
    
    00.10.6
    
    TERADYNE
    
    
    
    
    
    S/D4
    
    A360
    
    40001352
    
    ANALOG
    
    00.10.6
    
    TERADYNE
    
    
    
    EXCESS5
    
    A360
    
    40001353
    
    ANALOG
    
    00.10.6
    
    TERADYNE
    
    CORE6
    
    A360
    
    40001348
    
    ANALOG
    
    03.04.11
    
    TERADYNE
    
    CORE7
    
    A360
    
    40002586
    
    ANALOG
    
    03.6.11
    
    TERADYNE
    
    CORE8
    
    A360
    
    40002587
    
    ANALOG
    
    03.6.11
    
    TERADYNE
    
    
    
    EXCESS9
    
    A360
    
    40002585
    
    ANALOG
    
    03.6.11
    
    TERADYNE
    
    CORE10
    
    A360
    
    40002772
    
    ANALOG
    
    03.11.27
    
    TERADYNE
    
    
    
    
    
    S/D11
    
    A360
    
    40002773
    
    ANALOG
    
    03.11.27
    
    TERADYNE
    
    
    
    
    
    S/D12
    
    A360
    
    
    
    ANALOG
    
    04.3.22
    
    TERADYNE
    
    
    
    
    
    S/DA360 Count
    
    12
    
    
    
    
    
    
    
    
    
    4
    
    4
    
    413
    
    A5XX
    
    40002923
    
    ANALOG
    
    04.3.12
    
    TERADYNE
    
    
    
    EXCESS14
    
    A5XX
    
    40002924
    
    ANALOG
    
    04.3.25
    
    TERADYNE
    
    
    
    EXCESS15
    
    A5XX
    
    40002219
    
    ANALOG
    
    02.8.22
    
    TERADYNE
    
    CORE16
    
    A5XX
    
    40002220
    
    ANALOG
    
    02.8.22
    
    TERADYNE
    
    CORE17
    
    A5XX
    
    40002965
    
    ANALOG
    
    04.4.2
    
    TERADYNE
    
    COREA5XX Count
    
    5
    
    
    
    
    
    
    
    
    
    3
    
    2
    
    018
    
    ASL1000
    
    40000755
    
    ANALOG
    
    99.11.7
    
    CREDENCE
    
    CORE19
    
    ASL1000
    
    40000756
    
    ANALOG
    
    99.11.7
    
    CREDENCE
    
    CORE20
    
    ASL1000
    
    40002607
    
    ANALOG
    
    02.5.17
    
    CREDENCE
    
    CORE21
    
    ASL1000
    
    40002606
    
    ANALOG
    
    02.5.17
    
    CREDENCE
    
    
    
    EXCESSASL1000 Count
    
    4
    
    
    
    
    
    
    
    
    
    3
    
    1
    
    022
    
    DUO
    
    40002642
    
    ANALOG
    
    03.9.4
    
    CREDENCE
    
    CORE23
    
    DUO
    
    40003073
    
    ANALOG
    
    04.2.2
    
    CREDENCE
    
    COREDUO Count
    
    2
    
    
    
    
    
    
    
    
    
    2
    
    0
    
    024
    
    EPRO
    
    40000286
    
    MEMORY
    
    97.3.14
    
    CREDENCE
    
    CORE25
    
    EPRO
    
    40000287
    
    MEMORY
    
    97.3.14
    
    CREDENCE
    
    CORE26
    
    EPRO
    
    40000293
    
    MEMORY
    
    97.3.14
    
    CREDENCE
    
    CORE27
    
    EPRO
    
    40000294
    
    MEMORY
    
    97.3.14
    
    CREDENCE
    
    CORE28
    
    EPRO
    
    40000295
    
    MEMORY
    
    97.3.14
    
    CREDENCE
    
    CORE29
    
    EPRO
    
    40000291
    
    MEMORY
    
    97.3.21
    
    CREDENCE
    
    
    
    
    
    S/D30
    
    EPRO
    
    40000290
    
    MEMORY
    
    97.3.21
    
    CREDENCE
    
    CORE31
    
    EPRO
    
    40000289
    
    MEMORY
    
    97.11.4
    
    CREDENCE
    
    CORE32
    
    EPRO
    
    40000296
    
    MEMORY
    
    97.11.4
    
    CREDENCE
    
    CORE33
    
    EPRO
    
    40000288
    
    MEMORY
    
    97.11.4
    
    CREDENCE
    
    CORE34
    
    EPRO
    
    40001020
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    CORE35
    
    EPRO
    
    40000416
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    CORE36
    
    EPRO
    
    40000417
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    CORE37
    
    EPRO
    
    40000418
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    CORE38
    
    EPRO
    
    40000419
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    CORE39
    
    EPRO
    
    40000420
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    CORE40
    
    EPRO
    
    40000761
    
    MEMORY
    
    00.2.18
    
    CREDENCE
    
    CORE41
    
    EPRO
    
    40000762
    
    MEMORY
    
    00.2.18
    
    CREDENCE
    
    CORE42
    
    EPRO
    
    40000763
    
    MEMORY
    
    00.2.18
    
    CREDENCE
    
    CORE43
    
    EPRO
    
    40000764
    
    MEMORY
    
    00.2.18
    
    CREDENCE
    
    
    
    
    
    S/D44
    
    EPRO
    
    40000765
    
    MEMORY
    
    00.2.18
    
    CREDENCE
    
    
    
    
    
    S/D45
    
    EPRO
    
    40000766
    
    MEMORY
    
    00.2.18
    
    CREDENCE
    
    CORE46
    
    EPRO
    
    40000767
    
    MEMORY
    
    00.2.18
    
    CREDENCE
    
    
    
    
    
    S/D47
    
    EPRO
    
    40000768
    
    MEMORY
    
    00.2.18
    
    CREDENCE
    
    CORE48
    
    EPRO
    
    40001031
    
    MEMORY
    
    00.9.14
    
    CREDENCE
    
    
    
    
    
    S/D49
    
    EPRO
    
    40001034
    
    MEMORY
    
    00.9.14
    
    CREDENCE
    
    
    
    
    
    S/D50
    
    EPRO
    
    40001032
    
    MEMORY
    
    00.9.21
    
    CREDENCE
    
    CORE51
    
    EPRO
    
    40001033
    
    MEMORY
    
    00.9.21
    
    CREDENCE
    
    CORE52
    
    EPRO
    
    40001035
    
    MEMORY
    
    00.9.21
    
    CREDENCE
    
    CORE53
    
    EPRO
    
    40001037
    
    MEMORY
    
    00.9.21
    
    CREDENCE
    
    CORE54
    
    EPRO
    
    40001038
    
    MEMORY
    
    00.9.21
    
    CREDENCE
    
    CORE




---



##### Table of Contents



NO
    
    Platform
    
    Asset
    
    Device
    
    Arrived at SCC
    
    Vendor
    
    CORE
    
    Excess
    
    S/D55
    
    EPRO
    
    40000654
    
    MEMORY
    
    00.9.21
    
    CREDENCE
    
    CORE56
    
    EPRO
    
    40000655
    
    MEMORY
    
    00.9.21
    
    CREDENCE
    
    
    
    
    
    S/D57
    
    EPRO
    
    40001004
    
    MEMORY
    
    97.3.19
    
    CREDENCE
    
    CORE58
    
    EPRO
    
    40001005
    
    MEMORY
    
    97.3.19
    
    CREDENCE
    
    CORE59
    
    EPRO
    
    40001006
    
    MEMORY
    
    97.7.28
    
    CREDENCE
    
    
    
    
    
    S/D60
    
    EPRO
    
    40001007
    
    MEMORY
    
    97.12.4
    
    CREDENCE
    
    CORE61
    
    EPRO
    
    40001008
    
    MEMORY
    
    97.12.4
    
    CREDENCE
    
    CORE62
    
    EPRO
    
    40001014
    
    MEMORY
    
    98.2.27
    
    CREDENCE
    
    
    
    
    
    S/D63
    
    EPRO
    
    40001015
    
    MEMORY
    
    98.2.27
    
    CREDENCE
    
    CORE64
    
    EPRO
    
    40001016
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    CORE65
    
    EPRO
    
    40001017
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    CORE66
    
    EPRO
    
    40001018
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    CORE67
    
    EPRO
    
    40001019
    
    MEMORY
    
    98.9.25
    
    CREDENCE
    
    COREEPRO Count
    
    44
    
    
    
    
    
    
    
    
    
    35
    
    0
    
    968
    
    ETS300
    
    40002892
    
    ANALOG
    
    04.3.5
    
    EAGLE
    
    
    
    EXCESS69
    
    ETS300
    
    40003249
    
    ANALOG
    
    04.6.23
    
    EAGLE
    
    COREETS300 Count
    
    2
    
    
    
    
    
    
    
    
    
    1
    
    1
    
    070
    
    ETS300_TI
    
    40002810
    
    ANALOG
    
    03.12.4
    
    EAGLE
    
    
    
    
    
    S/D71
    
    ETS300_TI
    
    40003254
    
    ANALOG
    
    04.6.23
    
    EAGLE
    
    
    
    EXCESS72
    
    ETS300_TI
    
    40003148
    
    ANALOG
    
    04.7.22
    
    EAGLE
    
    
    
    EXCESSETS300_TI Count
    
    3
    
    
    
    
    
    
    
    
    
    0
    
    2
    
    173
    
    ETS364
    
    40002605
    
    ANALOG
    
    02.12.17
    
    EAGLE
    
    CORE74
    
    ETS364
    
    40002589
    
    ANALOG
    
    03.4.25
    
    EAGLE
    
    CORE75
    
    ETS364
    
    40002686
    
    ANALOG
    
    03.5.9
    
    EAGLE
    
    CORE76
    
    ETS364
    
    40002685
    
    ANALOG
    
    03.5.9
    
    EAGLE
    
    CORE77
    
    ETS364
    
    40002687
    
    ANALOG
    
    03.5.29
    
    EAGLE
    
    COREETS364 Count
    
    5
    
    
    
    
    
    
    
    
    
    5
    
    0
    
    078
    
    HP94XX
    
    40002735
    
    ANALOG
    
    03.8.28
    
    AGILENT
    
    
    
    EXCESS79
    
    HP94XX
    
    40002736
    
    ANALOG
    
    03.9.23
    
    AGILENT
    
    CORE80
    
    HP94XX
    
    40002737
    
    ANALOG
    
    03.9.23
    
    AGILENT
    
    CORE81
    
    HP94XX
    
    40002738
    
    ANALOG
    
    03.9.23
    
    AGILENT
    
    CORE82
    
    HP94XX
    
    40002734
    
    ANALOG
    
    03.11.25
    
    AGILENT
    
    CORE83
    
    HP94XX
    
    40002733
    
    ANALOG
    
    03.11.25
    
    AGILENT
    
    CORE84
    
    HP94XX
    
    40003075
    
    ANALOG
    
    04.2.2
    
    AGILENT
    
    
    
    
    
    S/D85
    
    HP94XX
    
    40003077
    
    ANALOG
    
    04.2.16
    
    AGILENT
    
    CORE86
    
    HP94XX
    
    40003076
    
    ANALOG
    
    04.2.16
    
    AGILENT
    
    CORE87
    
    HP94XX
    
    40003078
    
    ANALOG
    
    04.2.20
    
    AGILENT
    
    CORE88
    
    HP94XX
    
    40003222
    
    ANALOG
    
    04.7.29
    
    AGILENT
    
    CORE89
    
    HP94XX
    
    40003223
    
    ANALOG
    
    04.9.9
    
    AGILENT
    
    CORE90
    
    HP94XX
    
    40003221
    
    ANALOG
    
    04.11.2
    
    AGILENT
    
    
    
    EXCESSHP94XX Count
    
    13
    
    
    
    
    
    
    
    
    
    10
    
    2
    
    191
    
    J750
    
    40003210
    
    ANALOG
    
    04.7.12
    
    TERADYNE
    
    CORE92
    
    J750
    
    40003251
    
    ANALOG
    
    04.11.8
    
    TERADYNE
    
    CORE93
    
    J750
    
    40003353
    
    ANALOG
    
    05.3.15
    
    TERADYNE
    
    COREJ750 Count
    
    3
    
    
    
    
    
    
    
    
    
    3
    
    0
    
    094
    
    LTX77
    
    40001359
    
    ANALOG
    
    00.10.6
    
    LTX
    
    
    
    EXCESS95
    
    LTX77
    
    40001364
    
    ANALOG
    
    00.10.6
    
    LTX
    
    
    
    EXCESS96
    
    LTX77
    
    40001358
    
    ANALOG
    
    00.10.6
    
    LTX
    
    CORE97
    
    LTX77
    
    40001356
    
    ANALOG
    
    00.10.6
    
    LTX
    
    
    
    EXCESS98
    
    LTX77
    
    40001355
    
    ANALOG
    
    00.10.6
    
    LTX
    
    CORE99
    
    LTX77
    
    40001365
    
    ANALOG
    
    00.10.6
    
    LTX
    
    
    
    EXCESS100
    
    LTX77
    
    40001363
    
    ANALOG
    
    00.10.6
    
    LTX
    
    CORE101
    
    LTX77
    
    40001360
    
    ANALOG
    
    00.10.6
    
    LTX
    
    
    
    EXCESS102
    
    LTX77
    
    40001947
    
    ANALOG
    
    02.2.1
    
    LTX
    
    CORE103
    
    LTX77
    
    40001943
    
    ANALOG
    
    02.2.1
    
    LTX
    
    
    
    EXCESS104
    
    LTX77
    
    40001944
    
    ANALOG
    
    02.2.1
    
    LTX
    
    
    
    EXCESS105
    
    LTX77
    
    40001945
    
    ANALOG
    
    02.2.1
    
    LTX
    
    
    
    EXCESS106
    
    LTX77
    
    40001946
    
    ANALOG
    
    02.2.1
    
    LTX
    
    
    
    EXCESS107
    
    LTX77
    
    40002239
    
    ANALOG
    
    02.9.4
    
    LTX
    
    CORE108
    
    LTX77
    
    40002584
    
    ANALOG
    
    03.6.6
    
    LTX
    
    CORE




---



##### Table of Contents



NO
    
    Platform
    
    Asset
    
    Device
    
    Arrived at SCC
    
    Vendor
    
    CORE
    
    Excess
    
    S/D109
    
    LTX77
    
    40002582
    
    ANALOG
    
    03.6.6
    
    LTX
    
    CORE110
    
    LTX77
    
    40002973
    
    ANALOG
    
    04.4.28
    
    LTX
    
    CORE111
    
    LTX77
    
    40003119
    
    ANALOG
    
    04.7.8
    
    LTX
    
    CORE112
    
    LTX77
    
    40003170
    
    ANALOG
    
    04.8.23
    
    LTX
    
    CORE113
    
    LTX77
    
    40003171
    
    ANALOG
    
    04.8.23
    
    LTX
    
    CORE114
    
    LTX77
    
    40003211
    
    ANALOG
    
    04.11.12
    
    LTX
    
    CORELTX77 Count
    
    21
    
    
    
    
    
    
    
    
    
    12
    
    9
    
    0115
    
    M3650
    
    40003354
    
    MIX
    
    00.2.16
    
    CREDENCE
    
    
    
    EXCESS116
    
    M3650
    
    40001863
    
    MIX
    
    01.12.18
    
    CREDENCE
    
    CORE117
    
    M3650
    
    40003363
    
    MIX
    
    05.4.28
    
    CREDENCE
    
    COREM3650 Count
    
    3
    
    
    
    
    
    
    
    
    
    2
    
    1
    
    0118
    
    MAGNUM
    
    NA
    
    DIGITAL
    
    05.6.6
    
    NEXTEST
    
    COREMAGNUM Count
    
    1
    
    
    
    
    
    
    
    
    
    1
    
    0
    
    0119
    
    MAVERICK PT
    
    40003307
    
    DIGITAL
    
    04.6.8
    
    NEXTEST
    
    COREMAVERICK PT Count
    
    1
    
    
    
    
    
    
    
    
    
    1
    
    0
    
    0120
    
    Q2/62
    
    40001897
    
    LOGIC
    
    01.6.11
    
    MEGATEST
    
    
    
    EXCESS121
    
    Q2/62
    
    40002567
    
    LOGIC
    
    01.6.11
    
    MEGATEST
    
    CORE122
    
    Q2/62
    
    40001869
    
    LOGIC
    
    01.12.18
    
    MEGATEST
    
    
    
    
    
    S/D123
    
    Q2/62
    
    40001874
    
    LOGIC
    
    01.12.18
    
    MEGATEST
    
    
    
    
    
    S/D124
    
    Q2/62
    
    40001872
    
    LOGIC
    
    01.12.18
    
    MEGATEST
    
    
    
    
    
    S/D125
    
    Q2/62
    
    40001873
    
    LOGIC
    
    01.12.18
    
    MEGATEST
    
    
    
    
    
    S/D126
    
    Q2/62
    
    40001868
    
    LOGIC
    
    01.12.18
    
    MEGATEST
    
    CORE127
    
    Q2/62
    
    40001865
    
    LOGIC
    
    01.12.18
    
    MEGATEST
    
    
    
    
    
    S/D128
    
    Q2/62
    
    40001866
    
    LOGIC
    
    01.12.18
    
    MEGATEST
    
    COREQ2/62 Count
    
    9
    
    
    
    
    
    
    
    
    
    3
    
    1
    
    5129
    
    SENTRY
    
    40002238
    
    DIGITAL
    
    02.9.4
    
    SCHLUMBERGER
    
    
    
    
    
    S/D130
    
    SENTRY
    
    40001876
    
    DIGITAL
    
    01.12.18
    
    SCHLUMBERGER
    
    
    
    
    
    S/D131
    
    SENTRY
    
    40001877
    
    DIGITAL
    
    01.12.18
    
    SCHLUMBERGER
    
    
    
    
    
    S/DSENTRY Count
    
    3
    
    
    
    
    
    
    
    
    
    0
    
    0
    
    3132
    
    VISTA
    
    40002729
    
    DIGITAL
    
    03.8.6
    
    CREDENCE
    
    CORE133
    
    VISTA
    
    40002728
    
    DIGITAL
    
    03.8.14
    
    CREDENCE
    
    
    
    
    
    S/D134
    
    VISTA
    
    40002730
    
    DIGITAL
    
    03.9.23
    
    CREDENCE
    
    CORE135
    
    VISTA
    
    40002726
    
    DIGITAL
    
    03.9.23
    
    CREDENCE
    
    
    
    EXCESS136
    
    VISTA
    
    40002727
    
    DIGITAL
    
    03.11.25
    
    CREDENCE
    
    
    
    EXCESS137
    
    VISTA
    
    40003074
    
    DIGITAL
    
    04.2.16
    
    CREDENCE
    
    COREVISTA Count
    
    6
    
    
    
    
    
    
    
    
    
    3
    
    2
    
    1Grand Count
    
    137
    
    
    
    
    
    
    
    
    
    88
    
    25
    
    24




---



##### Table of Contents



SCC Handler Review -Out
 PlatformNO
    

(Sum)
    
    Module
    
    Asset
    
    Device
    
    Arrived at SCC
    
    Vendor
    
    CORE
    
    Excess
    
    S/D1
    
    AAT
    
    AAT
    
    40002092
    
    SOIC 150mil
    
    02.5.10
    
    AAT
    
    
    
    
    
    S/D2
    
    AAT
    
    AAT
    
    40003387
    
    SOIC 150mil
    
    05.9.24
    
    AAT
    
    
    
    Excess3
    
    AAT
    
    AAT
    
    40001516
    
    LGA 5*8
    
    01.6.16
    
    AAT
    
    
    
    
    
    S/D4
    
    AAT
    
    AAT
    
    40001581
    
    LGA 5*8
    
    01.10.25
    
    AAT
    
    
    
    
    
    S/D5
    
    AAT
    
    AAT
    
    40001582
    
    LGA 5*8
    
    01.12.6
    
    AAT
    
    
    
    
    
    S/D6
    
    AAT
    
    AAT
    
    40002347
    
    SOIC 150mil
    
    02.8.5
    
    AAT
    
    
    
    
    
    S/DAAT Count
    
    6
    
    
    
    
    
    
    
    
    
    
    
    0
    
    1
    
    57
    
    AET5050
    
    AETRIUM 5050T
    
    40002744
    
    SSOP 208mil
    
    03.9.3
    
    AETRIUM
    
    CORE8
    
    AET5050
    
    AETRIUM 5050T
    
    40003082
    
    SOIC 300mil
    
    03.9.18
    
    AETRIUM
    
    CORE9
    
    AET5050
    
    AETRIUM 5050T
    
    40002745
    
    SOIC 300mil
    
    03.11.25
    
    AETRIUM
    
    CORE10
    
    AET5050
    
    AETRIUM 5050T
    
    40002869
    
    SSOP 208mil
    
    04.4.14
    
    AETRIUM
    
    
    
    Excess11
    
    AET5050
    
    AETRIUM 5050T
    
    40003227
    
    SOIC 300mil
    
    04.10.6
    
    AETRIUM
    
    
    
    
    
    S/D12
    
    AET5050
    
    AETRIUM 5050T
    
    40002743
    
    SOIC 300mil
    
    04.2.3
    
    AETRIUM
    
    
    
    
    
    S/D13
    
    AET5050
    
    AETRIUM 5050T
    
    40002868
    
    SOIC 300mil
    
    04.2.9
    
    AETRIUM
    
    
    
    
    
    S/D14
    
    AET5050
    
    AETRIUM 5050T
    
    40003226
    
    SOIC 300mil
    
    04.11.2
    
    AETRIUM
    
    
    
    
    
    S/DAET5050 Count
    
    8
    
    
    
    
    
    
    
    
    
    
    
    3
    
    1
    
    415
    
    AET3300
    
    AETRIUM 3300
    
    40002741
    
    PLCC 44
    
    03.10.20
    
    AETRIUM
    
    CORE16
    
    AET3300
    
    AETRIUM 3300
    
    40002862
    
    PLCC 28
    
    04.2.16
    
    AETRIUM
    
    
    
    
    
    S/D17
    
    AET3300
    
    AETRIUM 3300
    
    40002866
    
    SOIC 300mil
    
    04.2.9
    
    AETRIUM
    
    
    
    
    
    S/D18
    
    AET3300
    
    AETRIUM 3300
    
    40002865
    
    PLCC 44
    
    04.2.16
    
    AETRIUM
    
    
    
    
    
    S/D19
    
    AET3300
    
    AETRIUM 3300
    
    40002977
    
    PLCC 68
    
    04.3.3
    
    AETRIUM
    
    
    
    
    
    S/D20
    
    AET3300
    
    AETRIUM 3300
    
    40002980
    
    PLCC 68
    
    04.3.3
    
    AETRIUM
    
    
    
    
    
    S/D21
    
    AET3300
    
    AETRIUM 3300
    
    40003225
    
    PLCC
    
    04.10.6
    
    AETRIUM
    
    
    
    
    
    S/D22
    
    AET3300
    
    AETRIUM 3300
    
    40002742
    
    SOIC 300mil
    
    03.10.20
    
    AETRIUM
    
    
    
    
    
    S/DAET3300 Count
    
    8
    
    
    
    
    
    
    
    
    
    
    
    1
    
    0
    
    723
    
    AESCO
    
    ASECO S-130
    
    40002399
    
    PLCC 28
    
    03.1.29
    
    ASECO
    
    
    
    
    
    S/D24
    
    AESCO
    
    ASECO S-130
    
    40002398
    
    PLCC 28
    
    03.1.29
    
    ASECO
    
    
    
    Excess25
    
    AESCO
    
    ASECO S-130
    
    40002400
    
    PLCC 28
    
    03.1.29
    
    ASECO
    
    
    
    Excess26
    
    AESCO
    
    S-130
    
    40001889
    
    PLCC20
    
    01.12.18
    
    ASECO
    
    
    
    
    
    S/D27
    
    AESCO
    
    S-130
    
    40001888
    
    PLCC 20
    
    01.12.18
    
    ASECO
    
    
    
    
    
    S/D28
    
    AESCO
    
    S-130
    
    40002397
    
    PLCC 28
    
    03.1.29
    
    ASECO
    
    
    
    
    
    S/DAESCO Count
    
    6
    
    
    
    
    
    
    
    
    
    
    
    0
    
    2
    
    429
    
    ASM
    
    ASM matrix
    
    40002725
    
    SOIC 8
    
    02.10.17
    
    ASM
    
    CORE30
    
    ASM
    
    ASM matrix
    
    40003357
    
    SOIC 8
    
    04.9.29
    
    ASM
    
    CORE31
    
    ASM
    
    ASM FT1000
    
    
    
    SOIC 8
    
    05.7.28
    
    ASM
    
    COREASM Count
    
    3
    
    
    
    
    
    
    
    
    
    
    
    3
    
    0
    
    032
    
    KUWANO
    
    LT-930-H222
    
    40001373
    
    SOIC 8-20
    
    00.10.6
    
    KUWANO
    
    CORE33
    
    KUWANO
    
    LT-930-H222
    
    40002774
    
    SOIC 8-20
    
    03.11.27
    
    KUWANO
    
    CORE34
    
    KUWANO
    
    LT-930-H222
    
    40002894
    
    SOIC 8-20
    
    04.3.12
    
    KUWANO
    
    CORE35
    
    KUWANO
    
    LT-930-H222
    
    40002895
    
    SOIC 8-20
    
    04.3.12
    
    KUWANO
    
    CORE36
    
    KUWANO
    
    LT-930-H222
    
    40002970
    
    SOIC 8-20
    
    04.4.21
    
    KUWANO
    
    CORE37
    
    KUWANO
    
    LT-930-H222
    
    40002971
    
    SOIC 8-20
    
    04.4.21
    
    KUWANO
    
    CORE38
    
    KUWANO
    
    LT-930-H222
    
    40002976
    
    SOIC 8-20
    
    04.4.28
    
    KUWANO
    
    CORE39
    
    KUWANO
    
    LT-930-H222
    
    40003087
    
    SOIC 8-20
    
    04.6.11
    
    KUWANO
    
    CORE40
    
    KUWANO
    
    LT-930-H222
    
    40001376
    
    SOIC 8-20
    
    00.10.6
    
    KUWANO
    
    
    
    
    
    S/D41
    
    KUWANO
    
    LT-930-H222
    
    40002070
    
    SOIC 8-20
    
    02.6.20
    
    KUWANO
    
    
    
    
    
    S/DKUWANO Count
    
    10
    
    
    
    
    
    
    
    
    
    
    
    8
    
    0
    
    242
    
    MCT
    
    MCT-3608 A3
    
    40001381
    
    PDIP 300mil
    
    00.10.6
    
    MCT
    
    CORE43
    
    MCT
    
    MCT-3608 AE
    
    40002454
    
    PDIP 300mil
    
    00.10.6
    
    MCT
    
    CORE44
    
    MCT
    
    MCT-3608 A3
    
    40001380
    
    PDIP 300mil
    
    00.10.6
    
    MCT
    
    CORE45
    
    MCT
    
    MCT-3608 A3
    
    40000628
    
    PDIP 300mil
    
    00.10.6
    
    MCT
    
    CORE46
    
    MCT
    
    MCT-3608 A3
    
    40001379
    
    PDIP 300mil
    
    00.10.6
    
    MCT
    
    CORE47
    
    MCT
    
    MCT-3608 A3
    
    40001377
    
    PDIP 300mil
    
    00.10.6
    
    MCT
    
    CORE48
    
    MCT
    
    MCT-3608 A3
    
    40001723
    
    PDIP 300mil
    
    01.10.16
    
    MCT
    
    CORE49
    
    MCT
    
    MCT-3608 A3
    
    40001727
    
    PDIP 300mil
    
    01.10.16
    
    MCT
    
    CORE50
    
    MCT
    
    MCT-3608 A3
    
    40001722
    
    PDIP 300mil
    
    01.10.16
    
    MCT
    
    CORE51
    
    MCT
    
    MCT-3608 A3
    
    40001724
    
    PDIP 300mil
    
    01.10.16
    
    MCT
    
    CORE52
    
    MCT
    
    MCT-3608 ES
    
    40002001
    
    PDIP 300mil
    
    02.3.14
    
    MCT
    
    CORE53
    
    MCT
    
    MCT-3608 ES
    
    40002002
    
    PDIP 300mil
    
    02.3.14
    
    MCT
    
    CORE54
    
    MCT
    
    MCT-3608 ES
    
    40001996
    
    PDIP 300mil
    
    02.3.14
    
    MCT
    
    
    
    
    
    S/D55
    
    MCT
    
    MCT-3608 ES
    
    40001999
    
    PDIP 300mil
    
    02.3.14
    
    MCT
    
    
    
    Excess56
    
    MCT
    
    MCT-3608 A
    
    40002234
    
    PDIP 300mil
    
    02.9.4
    
    MCT
    
    
    
    Excess57
    
    MCT
    
    MCT-3608 A
    
    40002237
    
    PDIP 300mil
    
    02.9.4
    
    MCT
    
    
    
    Excess58
    
    MCT
    
    MCT-3608 A
    
    40002235
    
    PDIP 300mil
    
    02.9.4
    
    MCT
    
    
    
    
    
    S/D59
    
    MCT
    
    MCT-3608 A
    
    40002236
    
    PDIP 300mil
    
    02.9.4
    
    MCT
    
    CORE60
    
    MCT
    
    MCT-3608 A
    
    40002452
    
    PDIP 300mil
    
    03.3.7
    
    MCT
    
    CORE61
    
    MCT
    
    MCT-3608 A
    
    40002450
    
    PDIP 300mil
    
    03.3.7
    
    MCT
    
    CORE62
    
    MCT
    
    MCT-3608 A
    
    40002453
    
    PDIP 300mil
    
    03.3.7
    
    MCT
    
    CORE63
    
    MCT
    
    MCT-3608 A3
    
    40002457
    
    PDIP 300mil
    
    03.4.3
    
    MCT
    
    
    
    Excess




---



##### Table of Contents



PlatformNO
    
    (Sum)
    
    Module
    
    Asset
    
    Device
    
    Arrived at SCC
    
    Vendor
    
    CORE
    
    Excess
    
    S/D64
    
    MCT
    
    MCT-3608 A3
    
    40002456
    
    PDIP 300mil
    
    03.4.3
    
    MCT
    
    
    
    Excess65
    
    MCT
    
    MCT-3608 A3
    
    40001806
    
    PDIP 300mil
    
    03.4.3
    
    MCT
    
    
    
    Excess66
    
    MCT
    
    MCT-3608 A3
    
    40001382
    
    PDIP 300mil
    
    03.4.3
    
    MCT
    
    
    
    Excess67
    
    MCT
    
    MCT-3608 E
    
    40002920
    
    PDIP 600mil
    
    04.3.5
    
    MCT
    
    CORE68
    
    MCT
    
    MCT-3608 A
    
    40002921
    
    PDIP 600mil
    
    04.3.5
    
    MCT
    
    CORE69
    
    MCT
    
    MCT-3608 E
    
    40002951
    
    PDIP 300mil
    
    04.3.17
    
    MCT
    
    
    
    Excess70
    
    MCT
    
    MCT-3608 E
    
    40002952
    
    PDIP 300mil
    
    04.3.17
    
    MCT
    
    
    
    Excess71
    
    MCT
    
    MCT-3608 E
    
    40002945
    
    PDIP 300mil
    
    04.3.17
    
    MCT
    
    
    
    Excess72
    
    MCT
    
    MCT-3608 E
    
    40002948
    
    PDIP 300mil
    
    04.3.17
    
    MCT
    
    
    
    Excess73
    
    MCT
    
    MCT-3608 E
    
    40000277
    
    PDIP 300mil
    
    97.3.14
    
    MCT
    
    
    
    
    
    S/D74
    
    MCT
    
    MCT-3608 E3
    
    40001707
    
    PDIP 300mil
    
    01.3.27
    
    MCT
    
    
    
    
    
    S/D75
    
    MCT
    
    MCT-3608 ES
    
    40002005
    
    PDIP 300mil
    
    02.3.14
    
    MCT
    
    
    
    
    
    S/D76
    
    MCT
    
    MCT-3608 ES
    
    40002004
    
    PDIP 300mil
    
    02.3.14
    
    MCT
    
    
    
    
    
    S/D77
    
    MCT
    
    MCT-3608 E
    
    40002953
    
    PDIP 300mil
    
    04.3.17
    
    MCT
    
    
    
    
    
    S/D78
    
    MCT
    
    MCT-3608 E
    
    40002944
    
    PDIP 300mil
    
    04.3.17
    
    MCT
    
    
    
    
    
    S/D79
    
    MCT
    
    MCT-3608 E
    
    40002946
    
    PDIP 300mil
    
    04.3.17
    
    MCT
    
    
    
    
    
    S/D80
    
    MCT
    
    MCT-3608 E
    
    40002947
    
    PDIP 300mil
    
    04.3.17
    
    MCT
    
    
    
    
    
    S/D81
    
    MCT
    
    MCT-3608
    
    
    
    PDIP 300mil
    
    04.8.23
    
    MCT
    
    
    
    
    
    S/D82
    
    MCT
    
    MCT-3608
    
    
    
    PDIP 300mil
    
    04.8.23
    
    MCT
    
    
    
    
    
    S/D83
    
    MCT
    
    MCT-3608
    
    
    
    PDIP 300mil
    
    04.8.23
    
    MCT
    
    
    
    
    
    S/D84
    
    MCT
    
    MCT-3608
    
    
    
    PDIP 300mil
    
    04.8.23
    
    MCT
    
    
    
    
    
    S/DMCT Count
    
    43
    
    
    
    
    
    
    
    
    
    
    
    18
    
    11
    
    1485
    
    SESSCO
    
    SESSCO
    
    40002093
    
    SOIC 24
    
    02.6.12
    
    SESSCO
    
    
    
    Excess86
    
    SESSCO
    
    SESSCO
    
    40002796
    
    SOIC 150mil
    
    03.10.20
    
    SESSCO
    
    
    
    
    
    S/D87
    
    SESSCO
    
    SESSCO
    
    40002795
    
    SOIC 150mil
    
    03.10.20
    
    SESSCO
    
    
    
    
    
    S/D88
    
    SESSCO
    
    SESSCO
    
    40002802
    
    SOIC 150mil
    
    03.11.6
    
    SESSCO
    
    
    
    
    
    S/D89
    
    SESSCO
    
    SESSCO
    
    40002803
    
    SOIC 150mil
    
    03.11.6
    
    SESSCO
    
    
    
    
    
    S/D90
    
    SESSCO
    
    SESSCO
    
    40002804
    
    SOIC 150mil
    
    03.11.24
    
    SESSCO
    
    CORE91
    
    SESSCO
    
    SESSCO
    
    40002798
    
    SOIC 150mil
    
    03.11.24
    
    SESSCO
    
    CORE92
    
    SESSCO
    
    SESSCO
    
    40002801
    
    SOIC 150mil
    
    03.12.8
    
    SESSCO
    
    CORE93
    
    SESSCO
    
    SESSCO
    
    40002799
    
    SOIC 150mil
    
    03.12.23
    
    SESSCO
    
    
    
    
    
    S/D94
    
    SESSCO
    
    SESSCO
    
    40003010
    
    SOIC 150mil
    
    04.5.13
    
    SESSCO
    
    CORE95
    
    SESSCO
    
    SESSCO
    
    40002702
    
    SOIC 150mil
    
    03.8.9
    
    SESSCO
    
    
    
    
    
    S/D96
    
    SESSCO
    
    SESSCO
    
    40002797
    
    SOIC 150mil
    
    03.10.20
    
    SESSCO
    
    
    
    
    
    S/D97
    
    SESSCO
    
    SESSCO
    
    40002800
    
    SOIC 150mil
    
    03.12.8
    
    SESSCO
    
    
    
    
    
    S/D98
    
    SESSCO
    
    SESSCO
    
    40002652
    
    MSOP 8
    
    02.10.17
    
    SESSCO
    
    
    
    
    
    S/DSESSCO Count
    
    14
    
    
    
    
    
    
    
    
    
    
    
    4
    
    1
    
    999
    
    RASCO
    
    SO 1000H
    
    40000776
    
    SOIC 8-28(150/208MIL)
    
    99.11.25
    
    RASCO
    
    CORE100
    
    RASCO
    
    SO 1000H
    
    40000777
    
    SOIC
8-28(150/208MIL)
    
    99.11.30
    
    RASCO
    
    CORE101
    
    RASCO
    
    SO 1000H
    
    40000783
    
    SOIC 8-20 (208MIL)
    
    00.2.19
    
    RASCO
    
    CORE102
    
    RASCO
    
    SO 1000H
    
    40000789
    
    SOIC 8-20
    
    00.4.20
    
    RASCO
    
    CORE103
    
    RASCO
    
    SO 1000AH
    
    40000790
    
    SOIC 8-20
    
    00.5.24
    
    RASCO
    
    CORE104
    
    RASCO
    
    SO 1000AH
    
    40000791
    
    SOIC 8-20
    
    00.6.8
    
    RASCO
    
    CORE105
    
    RASCO
    
    SO 1000AH
    
    40000792
    
    SOIC 8-20
    
    00.6.8
    
    RASCO
    
    CORE106
    
    RASCO
    
    SO 1000AH
    
    40001664
    
    SOIC 8-20(208MIL)
    
    00.12.22
    
    RASCO
    
    CORE107
    
    RASCO
    
    SO 1000AH
    
    40001721
    
    SOIC 150mil
    
    01.9.3
    
    RASCO
    
    CORE108
    
    RASCO
    
    SO 1000AH
    
    40001940
    
    SOIC 8-20(208MIL)
    
    01.10.4
    
    RASCO
    
    CORE109
    
    RASCO
    
    SO 1000T
    
    40001942
    
    SOIC 8-20(208MIL)
    
    01.12.14
    
    RASCO
    
    CORE110
    
    RASCO
    
    SO 1000T
    
    40001941
    
    SOIC 8-20
    
    01.12.14
    
    RASCO
    
    CORE111
    
    RASCO
    
    SO 1000T
    
    40001969
    
    SOIC 8-20(208MIL)
    
    02.1.27
    
    RASCO
    
    CORE112
    
    RASCO
    
    SO 1000AH
    
    40002076
    
    SOIC8-20
    
    02.5.16
    
    RASCO
    
    CORE113
    
    RASCO
    
    SO 1000AH
    
    40002080
    
    SOIC8-20
    
    02.5.22
    
    RASCO
    
    CORE114
    
    RASCO
    
    SO 1000AH
    
    40002079
    
    SOIC8-20
    
    02.5.22
    
    RASCO
    
    CORE115
    
    RASCO
    
    SO 1000AH
    
    40002608
    
    TSSOP
    
    03.2.14
    
    RASCO
    
    
    
    Excess116
    
    RASCO
    
    SO 1000AH
    
    40002515
    
    TSSOP
    
    03.2.17
    
    RASCO
    
    CORE117
    
    RASCO
    
    SO 1000AH
    
    40002989
    
    TSSOP 8
    
    04.4.2
    
    RASCO
    
    
    
    Excess118
    
    RASCO
    
    SO 2000
    
    40003037
    
    TSSOP
    
    04.5.24
    
    RASCO
    
    
    
    ExcessRASCO Count
    
    20
    
    
    
    
    
    
    
    
    
    
    
    17
    
    3
    
    0119
    
    SYMTEK
    
    SYMTEK 300
    
    40002755
    
    P-DIP 14-28
    
    03.10.20
    
    SYM-TEK
    
    CORE120
    
    SYMTEK
    
    SYMTEK 300HC
    
    40001372
    
    P-DIP 14-28
    
    00.10.6
    
    SYM-TEK
    
    
    
    
    
    S/D121
    
    SYMTEK
    
    SYMTEK 300HC
    
    40001878
    
    P-DIP 14-28
    
    01.12.18
    
    SYM-TEK
    
    
    
    
    
    S/D122
    
    SYMTEK
    
    SYMTEK 300
    
    40002871
    
    P-DIP 14-32
    
    04.2.16
    
    SYM-TEK
    
    
    
    
    
    S/D123
    
    SYMTEK
    
    SYMTEK 300
    
    40002870
    
    P-DIP 14-32
    
    04.2.16
    
    SYM-TEK
    
    
    
    
    
    S/D124
    
    SYMTEK
    
    SYMTEK 300
    
    40002872
    
    P-DIP 14-32
    
    04.2.16
    
    SYM-TEK
    
    
    
    
    
    S/DSYMTEK Count
    
    6
    
    
    
    
    
    
    
    
    
    
    
    1
    
    0
    
    5125
    
    TESEC
    
    TESEC 9210
    
    40002776
    
    SOIC 150 8-16LD
    
    03.11.27
    
    TESEC
    
    
    
    
    
    S/D126
    
    TESEC
    
    TESEC 8710
    
    40003213
    
    SOIC 150 8-16LD
    
    04.7.27
    
    TESEC
    
    
    
    
    
    S/D127
    
    TESEC
    
    TESEC 9030
    
    40003172
    
    SOIC 14-16LD
    
    04.8.23
    
    TESEC
    
    
    
    
    
    S/D128
    
    TESEC
    
    TESEC 8710
    
    40002775
    
    SOIC 150 8-16LD
    
    03.11.27
    
    TESEC
    
    
    
    
    
    S/D129
    
    TESEC
    
    TESEC 9210
    
    40002777
    
    SOIC 150 8-16LD
    
    03.11.27
    
    TESEC
    
    
    
    
    
    S/D130
    
    TESEC
    
    TESEC 8710
    
    40003214
    
    SOIC 150 8-16LD
    
    04.7.27
    
    TESEC
    
    
    
    
    
    S/D131
    
    TESEC
    
    TESEC 8710
    
    40001745
    
    SIOC 24
    
    01.11.8
    
    TESEC
    
    
    
    
    
    S/D




---



##### Table of Contents



PlatformNO
    
    (Sum)
    
    Module
    
    Asset
    
    Device
    
    Arrived at SCC
    
    Vendor
    
    CORE
    
    Excess
    
    S/D132
    
    TESEC
    
    TESEC 9030
    
    40002778
    
    SOIC 14-16LD
    
    03.11.27
    
    TESEC
    
    
    
    
    
    S/D133
    
    TESEC
    
    TESEC 9210
    
    40003212
    
    SOIC 150 8-16LD
    
    04.7.27
    
    TESEC
    
    
    
    
    
    S/D134
    
    TESEC
    
    TESEC 9030
    
    40003157
    
    SOIC 14-16LD
    
    04.8.23
    
    TESEC
    
    
    
    
    
    S/DTESEC Count
    
    10
    
    
    
    
    
    
    
    
    
    
    
    0
    
    0
    
    10135
    
    TB150
    
    TB-150DH
    
    40000389
    
    SOIC 150mil
    
    97.10.24
    
    SEC
    
    
    
    
    
    S/DTB150 Count
    
    1
    
    
    
    
    
    
    
    
    
    
    
    0
    
    0
    
    1136
    
    MH802
    
    MH802
    
    40000774
    
    SOIC 208mil
    
    99.7.6
    
    MICROHANDLING
    
    
    
    
    
    S/D137
    
    MH802
    
    MH802
    
    40000775
    
    SOIC 150mil
    
    99.8.10
    
    MICROHANDING
    
    
    
    
    
    S/DMH802 Count
    
    2
    
    
    
    
    
    
    
    
    
    
    
    0
    
    0
    
    2138
    
    MT93XX
    
    MT 9308
    
    40001708
    
    SOIC 330 28L
    
    01.4.28
    
    MULTITEST
    
    CORE139
    
    MT93XX
    
    MT 9308
    
    40001713
    
    SOIC 330 28L
    
    01.6.13
    
    MULTITEST
    
    CORE140
    
    MT93XX
    
    MT 9308
    
    40002688
    
    SOIC 300mil
    
    03.4.25
    
    MULTITEST
    
    CORE141
    
    MT93XX
    
    MT 9308
    
    40002689
    
    SOIC 300mil
    
    03.5.6
    
    MULTITEST
    
    CORE142
    
    MT93XX
    
    MT 9308
    
    40002690
    
    SOIC 300mil
    
    03.5.6
    
    MULTITEST
    
    CORE143
    
    MT93XX
    
    MT 9308
    
    40002672
    
    SOIC 150mil
    
    03.6.26
    
    MULTITEST
    
    CORE144
    
    MT93XX
    
    MT 9308
    
    40002746
    
    SOIC 300mil
    
    03.9.18
    
    MULTITEST
    
    CORE145
    
    MT93XX
    
    MT 9308
    
    40002893
    
    SOIC 150mil
    
    04.3.22
    
    MULTITEST
    
    CORE146
    
    MT93XX
    
    MT 9320
    
    40002813
    
    SOIC 150mil
    
    04.2.9
    
    MULTITEST
    
    CORE147
    
    MT93XX
    
    MT 9320
    
    40002349
    
    MSOP 118mil
    
    02.12.13
    
    MULTITEST
    
    
    
    Excess148
    
    MT93XX
    
    MT 9320
    
    40002748
    
    TSSOP173mil
    
    03.9.18
    
    MULTITEST
    
    
    
    Excess149
    
    MT93XX
    
    MT 9320
    
    40002836
    
    SOIC 208mil
    
    03.11.13
    
    MULTITEST
    
    
    
    Excess150
    
    MT93XX
    
    MT 9320
    
    40002978
    
    TSSOP173mil
    
    04.3.15
    
    MULTITEST
    
    
    
    Excess151
    
    MT93XX
    
    MT 9320
    
    40002747
    
    SOIC 150MIL PTB
    
    03.11.25
    
    MULTITEST
    
    CORE152
    
    MT93XX
    
    MT 9320
    
    
    
    SOIC 150mil
    
    04.5.26
    
    MULTITEST
    
    CORE153
    
    MT93XX
    
    MT 9320
    
    40002925
    
    SOIC 150mil
    
    04.3.25
    
    MULTITEST
    
    CORE154
    
    MT93XX
    
    MT 9320
    
    40002926
    
    SOIC 150mil
    
    04.3.25
    
    MULTITEST
    
    CORE155
    
    MT93XX
    
    MT 9320
    
    40003072
    
    MSOP118mil
    
    04.5.10
    
    MULTITEST
    
    CORE156
    
    MT93XX
    
    MT 9320
    
    
    
    SOIC 150mil
    
    04.6.28
    
    MULTITEST
    
    CORE157
    
    MT93XX
    
    MT 9320
    
    
    
    SOIC 150mil
    
    04.6.28
    
    MULTITEST
    
    CORE158
    
    MT93XX
    
    MT 9320
    
    40003306
    
    SOIC 150mil
    
    04.7.20
    
    MULTITEST
    
    CORE159
    
    MT93XX
    
    MT 9320
    
    40002837
    
    SSOP208mil
    
    03.11.27
    
    MULTITEST
    
    CORE160
    
    MT93XX
    
    MT 9320
    
    40003229
    
    TSSOP173mil
    
    04.10.6
    
    MULTITEST
    
    CORE161
    
    MT93XX
    
    MT 9320
    
    40003355
    
    SSOP 208mil
    
    04.12.22
    
    MULTITEST
    
    COREMT93XX Count
    
    24
    
    
    
    
    
    
    
    
    
    
    
    20
    
    4
    
    0162
    
    MT8589
    
    MT 8589
    
    40002749
    
    PLCC 44
    
    03.8.6
    
    MULTITEST
    
    CORE163
    
    MT8589
    
    MT 8589
    
    40003230
    
    PLCC
    
    04.10.22
    
    MULTITEST
    
    COREMT8589 Count
    
    2
    
    
    
    
    
    
    
    
    
    
    
    2
    
    0
    
    0164
    
    MT8588
    
    MT 8588
    
    
    
    
    
    05.11.18
    
    MULTITEST
    
    
    
    Excess165
    
    MT8588
    
    MT 8588
    
    
    
    
    
    05.11.18
    
    MULTITEST
    
    
    
    Excess166
    
    MT8588
    
    MT 8588
    
    
    
    
    
    05.11.18
    
    MULTITEST
    
    
    
    
    
    S/DMT8588 Count
    
    3
    
    
    
    
    
    
    
    
    
    
    
    0
    
    2
    
    1167
    
    MT99XX
    
    MT 9918
    
    40002839
    
    TSSOP
    
    03.12.23
    
    MULTITEST
    
    CORE168
    
    MT99XX
    
    MT 9918
    
    40003304
    
    SOIC 300mil
    
    04.5.14
    
    MULTITEST
    
    CORE169
    
    MT99XX
    
    MT 9918
    
    40003305
    
    SOIC 150mil
    
    04.7.20
    
    MULTITEST
    
    CORE170
    
    MT99XX
    
    MT 9918
    
    40003302
    
    MSOP 8
    
    04.8.3
    
    MULTITEST
    
    CORE171
    
    MT99XX
    
    MT 9918
    
    40003298
    
    TSSOP
    
    04.8.25
    
    MULTITEST
    
    
    
    Excess172
    
    MT99XX
    
    MT 9928
    
    
    
    TSSOP 173mil
    
    05.9.29
    
    MULTITEST
    
    
    
    ExcessMT99XX Count
    
    6
    
    
    
    
    
    
    
    
    
    
    
    4
    
    2
    
    0Grand Count
    
    172
    
    
    
    
    
    
    
    
    
    
    
    81
    
    27
    
    64




---



##### Table of Contents



Post Test Equipment Summary
 Type
    
    Module
    

Out - Total
    
    Core
    
    Excess
    
    S/DTape & Reel
    
    TR18AS
    
    
    6
    
    
    
    4
    
    
    
    1
    
    
    
    1Tape & Reel
    
    AT28
    
    
    11
    
    
    
    11
    
    
    
    0
    
    
    
    0Tape & Reel
    
    AT128
    
    
    7
    
    
    
    6
    
    
    
    0
    
    
    
    1Tape & Reel
    
    G6
    
    
    9
    
    
    
    9
    
    
    
    0
    
    
    
    0Tape & Reel
    
    AT8005
    
    
    1
    
    
    
    1
    
    
    
    0
    
    
    
    0Tape & Reel
    
    MV85x
    
    
    3
    
    
    
    1
    
    
    
    0
    
    
    
    2Tape & Reel
    
    Ismeca
    
    
    2
    
    
    Note: Brand new systems, model &
equipment details not available
currently andLead Reconditioner
    
    AT4070
    
    
    1
    
    
    
    0
    
    
    
    0
    
    
    
    1Lead Reconditioner
    
    AT-1045
    
    
    1
    
    
    
    0
    
    
    
    0
    
    
    
    1Lead Reconditioner
    
    ATS-1245
    
    
    2
    
    
    
    0
    
    
    
    0
    
    
    
    2Part Counter
    
    PC-138
    
    
    1
    
    
    
    1
    
    
    
    0
    
    
    
    0Peel Tester
    
    GPD
    
    
    1
    
    
    
    1
    
    
    
    0
    
    
    
    0Dry Packing
    
    QUICK-7G
    
    
    1
    
    
    
    1
    
    
    
    0
    
    
    
    0Oven
    
    Blue M
    
    
    3
    
    
    
    3
    
    
    
    0
    
    
    
    0Total
    
    
    49




---



##### Table of Contents



SCC TR &LIS Review
 NO
    
    Equ. Name
    
    Module
    
    Asset NO.
    
    Device
    
    Arrived at CPS
    
    Vendor
    
    Status1
    
    Tape Reel
    
    TR18AS
    
    40000778
    
    SOIC 8
    
    99.11.06
    
    STI
    
    Core2
    
    Tape Reel
    
    TR18AS
    
    40000825
    
    SOIC 8
    
    99.11.06
    
    STI
    
    Core3
    
    Tape Reel
    
    TR18AS
    
    40000779
    
    SOIC 8
    
    00.3.27
    
    STI
    
    Core4
    
    Tape Reel
    
    TR18AS
    
    40000824
    
    SOIC 8
    
    00.5.27
    
    STI
    
    Core5
    
    Tape Reel
    
    TR18AS
    
    40000826
    
    SOIC 8
    
    00.5.27
    
    STI
    
    Excess6
    
    Tape Reel
    
    TR18AS
    
    40000823
    
    SOIC 8
    
    00.6.2
    
    STI
    
    S/D7
    
    Tape Reel
    
    AT 28
    
    40002009
    
    MSOP
    
    01.5.3
    
    STI
    
    Core8
    
    Tape Reel
    
    AT 28
    
    40002010
    
    SOIC 300mil
    
    01.5.3
    
    STI
    
    Core9
    
    Tape Reel
    
    AT 28
    
    40002385
    
    SOIC 150mil
    
    02.2.27
    
    STI
    
    Core10
    
    Tape Reel
    
    AT 28
    
    40002411
    
    SOIC 150mil
    
    02.3.4
    
    STI
    
    Core11
    
    Tape Reel
    
    AT 28
    
    40002409
    
    TSSOP 173mil
    
    02.3.4
    
    STI
    
    Core12
    
    Tape Reel
    
    AT 28
    
    40002410
    
    TSSOP 173mil
    
    02.3.12
    
    STI
    
    Core13
    
    Tape Reel
    
    AT 28
    
    40002325
    
    MSOP
    
    02.6.10
    
    STI
    
    Core14
    
    Tape Reel
    
    AT 28
    
    40002960
    
    SOIC 330mil
    
    03.10.14
    
    STI
    
    Core15
    
    Tape Reel
    
    AT 28
    
    40002962
    
    SOIC 208mil
    
    03.11.03
    
    STI
    
    Core16
    
    Tape Reel
    
    AT 28
    
    40002961
    
    SOIC 150mil
    
    03.12.04
    
    STI
    
    Core17
    
    Tape Reel
    
    AT 28
    
    40003338
    
    TSSOP
    
    04.3.5
    
    STI
    
    Core18
    
    Tape Reel
    
    AT 128
    
    40002609
    
    SOIC 150 8L
    
    02.3.12
    
    STI
    
    Core19
    
    Tape Reel
    
    AT 128
    
    40002610
    
    SOIC 150 8L
    
    02.6.10
    
    STI
    
    Core20
    
    Tape Reel
    
    AT 128
    
    40003334
    
    SOIC 150 8L
    
    03.12.23
    
    STI
    
    Core21
    
    Tape Reel
    
    AT 128
    
    40003335
    
    SOIC 150 8L
    
    04.1.15
    
    STI
    
    Core22
    
    Tape Reel
    
    AT 128
    
    40003336
    
    SOIC 150 8L
    
    04.3.17
    
    STI
    
    Core23
    
    Tape Reel
    
    AT 128
    
    40003337
    
    SOIC 150 8L
    
    04.3.17
    
    STI
    
    Core24
    
    Tape Reel
    
    AT 128
    
    40003238
    
    
    
    04.11.2
    
    STI
    
    S/D25
    
    Tape Reel
    
    VisDynamics G6
    
    40002793
    
    SOIC 150mil
    
    03.11.24
    
    VisDynamics
    
    Core26
    
    Tape Reel
    
    VisDynamics G6
    
    40003154
    
    SOIC 150mil
    
    04.3.12
    
    VisDynamics
    
    Core27
    
    Tape Reel
    
    VisDynamics G6
    
    40003155
    
    SOIC 150mil
    
    04.4.6
    
    VisDynamics
    
    Core28
    
    Tape Reel
    
    VisDynamics G6
    
    40003156
    
    SOIC8/14/16
    
    04.4.17
    
    VisDynamics
    
    Core29
    
    Tape Reel
    
    VisDynamics G6
    
    40003286
    
    SOIC 150 MIL
    
    04.5.19
    
    VisDynamics
    
    Core30
    
    Tape Reel
    
    VisDynamics G6
    
    40003287
    
    SOIC 150 MIL
    
    04.5.24
    
    VisDynamics
    
    Core31
    
    Tape Reel
    
    VisDynamics G6
    
    40003277
    
    MSOP
    
    04.6.15
    
    VisDynamics
    
    Core32
    
    Tape Reel
    
    VisDynamics G6
    
    40003288
    
    SOIC 150mil
    
    04.6.21
    
    VisDynamics
    
    Core33
    
    Tape Reel
    
    VisDynamics G6
    
    40003278
    
    MSOP
    
    04.7.7
    
    VisDynamics
    
    Core




---



##### Table of Contents



NO
    
    Equ. Name
    
    Module
    
    Asset NO.
    
    Device
    
    Arrived at CPS
    
    Vendor
    
    Status34
    
    Tape Reel
    
    AT 8005
    
    40000820
    
    PLCC 44
    
    00.5.20
    
    STI
    
    Core35
    
    Tape Reel
    
    MICROVISION 852
    
    40001594
    
    SOIC 300mil
    
    01.6.1
    
    Microvision
    
    Core36
    
    Tape Reel
    
    MICROVISION 852
    
    40000649
    
    SOIC 8
    
    01.6.1
    
    Microvision
    
    S/D37
    
    LEADSCAN
    
    MICROVISION 851
    
    40000688
    
    SOIC 8
    
    99.11.12
    
    Microvision
    
    S/D38
    
    Lead Reconditioner
    
    AT 4070
    
    40002884
    
    Lead Repair
    
    04.2.3
    
    Curris Logic
    
    S/D39
    
    Lead Reconditioner
    
    AT-1045
    
    40003086
    
    Lead Repair
    
    04.5.17
    
    Cirrus Logic
    
    S/D40
    
    Lead Reconditioner
    
    ATS-1245
    
    40003237
    
    Lead Repair
    
    04.8.12
    
    Cirrus Logic
    
    S/D41
    
    Lead Reconditioner
    
    ATS-1245
    
    40003236
    
    Lead Repair
    
    04.8.12
    
    Cirrus Logic
    
    S/D42
    
    PART COUNTER
    
    PC-138
    
    40002223
    
    ALL
    
    02.3.14
    
    STI
    
    Core43
    
    PEEL TESTER
    
    GPD
    
    40002568
    
    ALL
    
    02.8.9
    
    GPD
    
    Core44
    
    DRY PACKING
    
    QUICK-7G
    
    40000770
    
    ALL
    
    00.3.8
    
    HAN SUNG
    
    Core45
    
    OVEN
    
    Blue M
    
    40000401
    
    ALL
    
    97.12.12
    
    BLUE M
    
    Core46
    
    OVEN
    
    Blue M
    
    40000399
    
    ALL
    
    98.3.20
    
    BLUE M
    
    Core47
    
    OVEN
    
    Blue M
    
    40000400
    
    ALL
    
    98.3.20
    
    BLUE M
    
    Core48
    
    Tape Reel
    
    Ismeca
    
    Note: Brand New Systems  Details not available49
    
    Tape Reel
    
    Ismeca
    
    Note: Brand New Systems  Details not available




---



##### Table of Contents



Appendix 2
 
 Technical Specifications
 18




---



##### Table of Contents



Appendix 2
 Technical Specifications




---



##### Table of Contents



Technical Specifications  Assembly
 Type
    
    Document Number
    
    Doc Title
    
    Doc Rev
    
    Doc Level (1/2/3/4)
    
    DEPTSpec.
    
    CS711-0002
    
    LEAD FRAME
    
    
    10
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS711-0007
    
    TUBE AND PIN/PLUG
    
    
    11
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS711-0008
    
    MARKING INK
    
    
    8
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS711-0014
    
    SAW BLADE
    
    
    5
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS711-0019
    
    PLASTIC PKG. HEAT SPREADER/SLUG
    
    
    1
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS712-0105
    
    MATERIAL FOR METAL FINISH
    
    
    14
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CMC720-0001
    
    WAFER MAPPING HANGLING SPECIFICATION FOR INKLESS WAFER
    
    
    5
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CMC720-0004
    
    LASER DEFLASH
    
    
    3
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0005
    
    EPOXY DIE ATTACH
    
    
    24
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0006
    
    DIE ATTACH POST CURE
    
    
    15
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0007
    
    THERMOSONIC WIRE BONDING
    
    
    19
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0009
    
    LDP MOLD HANDLING PROCEDURE
    
    
    20
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0010
    
    POST MOLD CURE
    
    
    12
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0014
    
    TRIM / FORM FOR P-DIP
    
    
    11
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0017
    
    TOP & BOTTOME SIDE MARKING
    
    
    23
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0022
    
    SCC LDP MOLDING REJECT CRITERIA
    
    
    12
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0023
    
    LEAD FINISH
    
    
    21
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0026
    
    EXTERNAL VISUAL INSPECTION FOR PLCC PACKAGE
    
    
    9
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0028
    
    WAFER MOUNT PROCESS SPEC FOR ASSY
    
    
    21
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0032
    
    FORM/SINGULATION FOR SMD
    
    
    14
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0033
    
    DEDAMBER/DEJUNK FOR SMD
    
    
    8
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0037
    
    DIE COATING
    
    
    12
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0038
    
    EXTERNAL VISUAL INSPECTION FOR PACKAGE
    
    
    11
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0051
    
    2ND OPTICAL INSPECTION
    
    
    12
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0052
    
    3RD OPTICAL INSPECTION FOR PLASTIC PACKAGE
    
    
    20
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0053
    
    EXTERNAL VISUAL INSPECTION FOR P-DIP
    
    
    13
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0055
    
    DZ-600 VACUUM PACKING MACHINE OPERATION PROCEDURE SPECIFICATION
    
    
    1
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS720-0901
    
    LDP PACKING PROCEDURE
    
    
    10
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS724-0001
    
    EXTERNAL VISION INSPECTION FOR TSOP,TSSOP, SSOP & MSOP PACKAGES
    
    
    12
    
    
    
    3
    
    
    LDP ENGSpec.
    
    CS760-0006
    
    REWORK PROCEDURE FOR LEADED PLASTIC PKG
    
    
    9
    
    
    
    3
    
    
    LDP ENGSpec.-test
    
    CMT141-0014
    
    MU851 IC LEAD/MARK INSPECTOR OPERATION SPECIFICATION
    
    
    2
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT141-0045
    
    SP-6E SEMI-AUTOMATIC POLYPROPYLENE STRAPPING MACHINE OPERATION
PROCEDURE SPECIFICATION
    
    
    1
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0026
    
    TR18ASII TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE
SPECIFICATION
    
    
    6
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0028
    
    DT-338 DETAPING MACHINE PM PROCEDURE SPECIFICATION
    
    
    2
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0030
    
    QUICK-7G DRY PACKING MACHINE PM PROCEDURE SPECIFICATION
    
    
    3
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0031
    
    MV851 IC MARK/LEADINSPECTION PM&CAL PROCEDURE SPECIFICATION
    
    
    3
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0034
    
    PBFT-856VS PEEL BACK FORCE TESTER PM & CALIBRATION PROCEDURE
SPECIFICATION
    
    
    2
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0035
    
    AT8005 LEAD/MARK INSPECTION SYSTEM PM SPECIFICATION
    
    
    2
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0042
    
    PC-138 PART COUNTER MACHINE PM PROCEDURE SPECIFICATION
    
    
    2
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0056
    
    AT-28 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE
    
    
    3
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0063
    
    RVSI LS-3900 LEAD AND GRID SCANNING INSPECTION SYSTEM PM &
CALIBRATION PROCEDURE SPECIFICATION
    
    
    3
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0064
    
    RVSI LS-7700 TATAL PACKAGE INSPECTION SYSTEM PM & CALIBRATION
PROCEDURE SPECIFICATION
    
    
    2
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0085
    
    AT-128 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE
SPECIFICATION
    
    
    1
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT143-0091
    
    ICOS CI-9450 COMPONENT INSPECTION SYSTEM PREVENTIVE
MAINTENANCE SPECIFICATION
    
    
    1
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT144-0002
    
    FINAL VISUAL INSPECTION PROCEDURE
    
    
    10
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT144-0003
    
    TEST INNER PACKING PROCEDURE
    
    
    12
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT144-0010
    
    PACKING IN TAPE AND REEL PROCEDURE SPEC.
    
    
    24
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT144-0015
    
    LEAD SCANNING PROCEDURE SPEC
    
    
    6
    
    
    
    3
    
    
    LDP TESTSpec.-test
    
    CMT145-0006
    
    PACKING MATERIAL SPEC
    
    
    6
    
    
    
    3
    
    
    LDP TESTSpec.-LMT
    
    ES782-0014
    
    PROCESS SPECIFICATION FOR SUBSTRATE PRE-BAKE
    
    
    8
    
    
    
    3
    
    
    LDP ENGC/P
    
    CP-CPS-ALL-001
    
    SCC STANDARD CONTROL PLAN FOR LEADED PACKAGE
    
    
    36
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-MS-008-001
    
    MSOP 8/10LD
    
    
    5
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-MS-008-002
    
    MSOP 08/10LD EDP
    
    
    0
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-008-001
    
    PD008 DAUL
    
    
    7
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-008M-001
    
    PDIP 8LD M
    
    
    13
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-014-001
    
    PD014&016LD
    
    
    12
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-014-002
    
    PD014&016LD
    
    
    5
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-018-001
    
    PD018LD
    
    
    7
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-020-001
    
    PD020LD
    
    
    11
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-024N-001
    
    PDIP 24LD N
    
    
    10
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-024W-001
    
    PDIP 24LD W
    
    
    9
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-028-001
    
    PDIP 28LD
    
    
    8
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-028-002
    
    PDIP 28LD
    
    
    4
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-028N-001
    
    PD028LDN
    
    
    8
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-032-001
    
    PD032LD
    
    
    7
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PD-040-001
    
    PD040/42LD
    
    
    9
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PL-020-001
    
    PLCC 20LD
    
    
    7
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PL-028-001
    
    PLCC 28LD
    
    
    8
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PL-032-001
    
    PLCC 32LD
    
    
    10
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PL-032-002
    
    PLCC032LD
    
    
    0
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PL-044-001
    
    PLCC 44LD
    
    
    11
    
    
    
    3
    
    
    LDP ENG




---



##### Table of Contents



Type
    
    Document Number
    
    Doc Title
    
    Doc Rev
    
    Doc Level (1/2/3/4)
    
    DEPTMI-LDP
    
    MI-PL-068-001
    
    PLCC 68LD
    
    
    7
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PL-084-001
    
    PLCC 84LD
    
    
    8
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-008M-001
    
    SOIC 8LD M
    
    
    13
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-008M-002
    
    SOIC 8LD M
    
    
    9
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-008M-003
    
    SOIC 8LD M
    
    
    6
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-008M-004
    
    SOIC 8LD (M) EDP
    
    
    9
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-008M-006
    
    SOIC 8LD M EDP
    
    
    2
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-008M-007
    
    SOIC008LDM
    
    
    3
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-008M-008
    
    SOIC008LDM
    
    
    1
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-008W-001
    
    SOIC 8LD W
    
    
    11
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-014-001
    
    SOIC 14LD
    
    
    13
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-014-002
    
    SOIC 14LD
    
    
    9
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-016N-001
    
    SOIC 16LD N
    
    
    12
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-016N-002
    
    SOIC 16LD N
    
    
    9
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-016W-001
    
    SOIC 16LD W
    
    
    8
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-016W-002
    
    SOIC 016W MATRIX
    
    
    0
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-020-001
    
    SOIC 20LD
    
    
    8
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-020M-001
    
    SOIC 20LD MATRIX
    
    
    8
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-024-001
    
    SOIC 24LD
    
    
    9
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-028N-001
    
    SOIC 28LD N
    
    
    9
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-028W-001
    
    SOIC 28LD W
    
    
    10
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-PS-032-001
    
    SOIC 32LD
    
    
    5
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-SP-036-001
    
    SSOP 36LD
    
    
    2
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-SP-048-001
    
    SSOP 48LD/56LD
    
    
    5
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-SP-048-002
    
    SSOP 48LD
    
    
    3
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-SP-056-001
    
    SSOP 56LD
    
    
    12
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-008-001
    
    TSSOP 8LD
    
    
    5
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-014-001
    
    TSSOP 14/16LD
    
    
    9
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-014-002
    
    TSSOP 014/016LD
    
    
    0
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-020-001
    
    TSSOP 20/24LD
    
    
    8
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-020-002
    
    TSSOP 20/24LD
    
    
    3
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-024-001
    
    TSSOP 24LD
    
    
    4
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-028-001
    
    TSSOP 28LD
    
    
    8
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-028ep-001
    
    TSSOP028-EDP
    
    
    3
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-030-001
    
    TSSOP 30LD
    
    
    5
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-TP-048-001
    
    TSSOP 48LD
    
    
    3
    
    
    
    3
    
    
    LDP ENGMI-LDP
    
    MI-Iquad-120-001
    
    IQUAD 28x28 (120LD)
    
    
    1
    
    
    
    3
    
    
    LDP ENGPM
    
    PM-0021
    
    MANUAL MOLD PRESS
    
    
    12
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0024
    
    AUTO PAD MARK M/C (I.R.)
    
    
    9
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0025
    
    AUTO LASER MARK M/C
    
    
    12
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0079
    
    PREHEATER
    
    
    5
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0082
    
    MANUAL MOLD DIE
    
    
    10
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0084
    
    MAINTENANCE/BACK END
    
    
    12
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0087
    
    MANUAL FRIM/FORM MACHINE
    
    
    6
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0090
    
    PLATE MAKER 612
    
    
    5
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0094
    
    AUTO LOADER
    
    
    4
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0129
    
    TOWA AUTO MOLD SYSTEM
    
    
    11
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0131
    
    ASM AUTO MOLD SYSTEM
    
    
    6
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0132
    
    ASM AUTO MOLD SYSTEM
    
    
    7
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0135
    
    BOND TOOLING
    
    
    5
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0148
    
    MAINTENANCE/BACK END
    
    
    4
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0150
    
    TRIM DIE
    
    
    6
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0151
    
    FORM DIE
    
    
    3
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0158
    
    TOWA AUTO MOLDING SYSTEM
    
    
    3
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0159
    
    SEMI-AUTO L/F LOADER
    
    
    2
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0164
    
    AUTO LASER DEFLASH M/C
    
    
    2
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0166
    
    TUBE CHANGE SEESAW
    
    
    2
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0197
    
    FICO AUTO MOLD SYSTEM
    
    
    2
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0213
    
    GO-NO-GO JIG
    
    
    1
    
    
    
    3
    
    
    LDP MAINTPM
    
    PM-0222
    
    PMC OVEN
    
    
    1
    
    
    
    3
    
    
    LDP MAINTVisual Aid
    
    VPA4-00001-1
    
    TUBE TYPE FOR FK PDIP 300MIL
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB3-00008-8
    
    ATTENTION AT OVEN CURE PROCESS
    
    
    8
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB3-00009-27
    
    SUMMARY OF DICING SAW CONTROL
    
    
    27
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB3-00018-8
    
    WAFER MOUNT BAKING
    
    
    8
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB3-00021-30
    
    OPERATOR, MAINTENANCE, QA USE REFERENCE TABLE AT W/B PROCESS
    
    
    30
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB3-00022-16
    
    SUMMARY OF DIE ATTACH PROCESS CONTROL
    
    
    16
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB3-00024-1
    
    EPOXY STORAGE CONDITION AND LIFE TIME
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB3-00025-5
    
    ATTENTION AT 2ND OPTICAL INSPECTION
    
    
    5
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB4-00001-6
    
    B-CODE PROCEDURE
    
    
    6
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB4-00005-1
    
    WAFER MAPPING FILE DOWNLOAD
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB5-00001-1
    
    DIE ATTACH CV ON HOLD CRITERIA
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB5-00002-0
    
    3 RD OPTICAL LOW YIELD ON HOLD CRITERIA
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPB5-00003-9
    
    SUMMARY OF STACK DIE PRODUCT FOL CONTROL
    
    
    9
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00004-1
    
    DIFFERENT FORM DIE SET FOR MSOP8/10 TSSOP8/14/16/28 TSSOP20/24
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00010-2
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN WAFER MOUNT PROCESS
    
    
    2
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00011-6
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN DICING SAW PROCESS
    
    
    6
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00012-5
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN DIE ATTACH PROCESS
    
    
    5
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00013-4
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN WIRE BOND PROCESS
    
    
    4
    
    
    
    3
    
    
    LDP ENG




---



##### Table of Contents



Type
    
    Document Number
    
    Doc Title
    
    Doc Rev
    
    Doc Level (1/2/3/4)
    
    DEPTVisual Aid
    
    VPD4-00014-1
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN MOLD PROCESS
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00015-0
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN PMC PROCESS
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00016-1
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN TRIM PROCESS
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00017-1
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN TIN PLATING PROCESS
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00018-1
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN MARKING PROCESS
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00019-1
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN TRIM&FORM PROCESS
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00020-1
    
    CUSTOMERS WITH SPECIAL REQUIREMENT IN EVI PROCESS
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD4-00022-0
    
    ProblemSoure OCAP flowchart
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD5-00008-0
    
    D/A WAFER MAPPING BUY-OFF REPORT
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD5-00014-1
    
    TYPE OF THE TRAY
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD5-00027-0
    
    IN-LINE FOL LOW YIELD CONTROL
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD5-00029-1
    
    SUMMARY OF 3RD PROCESS CONTROL
    
    
    1
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD5-00040-0
    
    VISUAL AID FOR DAMBAR ISSUE IN EVI PROCESS
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD5-00051-0
    
    VISUAL AIDS FOR EVI MAJOR DEFECT SPSEC
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD5-00053-0
    
    EVI CHECKING METHOD FOR UNITS IN TUBE
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD6-00003-0
    
    TRAINING MATERIAL FOR FUJITSU WRONG TRAY LSSUE
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPD6-00005-0
    
    ORIENTATION VISUAL AID FOR TRAY LOADING IN MACHINE AND UNIT IN
TAPE (TRAY TO REEL PRODUCTS)
    
    
    0
    
    
    
    3
    
    
    LDP TESTVisual Aid
    
    VPD6-00013-0
    
    VISUAL AID FOR EOL PACKAGE F/M
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPC4-00002-0
    
    BARCODE LABEL FOR LDP ASSY ONLY PRODUCTS
    
    
    0
    
    
    
    3
    
    
    LDP ENGVisual Aid
    
    VPE5-00002-0
    
    DIE SET POLISH REQUIREMENT FOR PB FREE PRODUCTS
    
    
    0
    
    
    
    3
    
    
    LDP ENGTCM
    
    TCMLDPMK
    
    MARKING TOTAL CONTROL METHODOLOGY
    
    
    12
    
    
    
    3
    
    
    LDP ENGTCM
    
    TCMLDPPL
    
    LEAD FINISH TOTAL CONTROL METHODOLOGY
    
    
    12
    
    
    
    3
    
    
    LDP ENGTCM
    
    TCMLDPMD
    
    MOLD TOTAL CONTROL METHODOLOGY
    
    
    12
    
    
    
    3
    
    
    LDP ENGTCM
    
    TCMLDPTF
    
    TRIM/FORM TOTAL CONTROL METHODOLOGY
    
    
    19
    
    
    
    3
    
    
    LDP ENGTCM
    
    TCMLDPDP
    
    DIE PREPARATION TOTAL CONTROL METHODOLGY
    
    
    23
    
    
    
    3
    
    
    LDP ENGTCM
    
    TCMLDPDA
    
    DIE ATTACH TOTAL CONTROL METHODOLOGY
    
    
    26
    
    
    
    3
    
    
    LDP MAINTTCM
    
    TCMLDPWB
    
    WIRE BONDING TOTAL CONTROL METHODOLGY
    
    
    25
    
    
    
    3
    
    
    LDP MAINTTCM
    
    TCMLDPPK
    
    PACKING TOTAL CONTROL METHODOLOGY
    
    
    7
    
    
    
    3
    
    
    LDP ENGTCM
    
    TCMLDPEVI
    
    EVI TOTAL CONTROL METHODOLOGY
    
    
    7
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPDP-001
    
    DIE PREPARATION FAILURE MODE AND EFFECTS ANALYSIS
    
    
    0
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPPL-001
    
    PROCESS FMEA FOR TIN/LEAD LEAD FINISH
    
    
    0
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPPL-002
    
    PROCESS FMEA FOR PURE TIN LEAD FINISH
    
    
    0
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPTF-001
    
    SMD TRIM PROCESS FAILURE MODE AND EFFECTS ANALYSIS
    
    
    0
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPTF-002
    
    SMD FORM PROCESS FAILURE MODE AND EFFECTS ANALYSIS
    
    
    1
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPTF-003
    
    PDIP TRIM/FORM PROCESS FAILURE MODE AND EFFECTS ANALYSIS
    
    
    0
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPWB-001
    
    WIRE BONDING PROCESS FMEA
    
    
    1
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPMK-001
    
    FMEA FOR LDP MARKING PROCESS
    
    
    0
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPDA-001
    
    DIE ATTACH FAILURE MODE AND EFFECTS ANALYSIS
    
    
    1
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPMD-001
    
    PROCESS FMEA FOR MOLD & PMC
    
    
    1
    
    
    
    3
    
    
    LDP ENGFMEA
    
    FMEA-LDPEVI-001
    
    LDP EVI FAIL URE MODE AND EFFECTS ANALYSIS
    
    
    0
    
    
    
    3
    
    
    LDP ENGProcedure
    
    CPS-M-05
    
    IN PROCESS MATERIAL AND PRODUCT STORAGE AND HANDLING PROCEDURE
    
    
    6
    
    
    
    2
    
    
    LDP ENGProcedure
    
    CPS-P-05
    
    PROCESS CONTROL PROCEDURE
    
    
    8
    
    
    
    2
    
    
    LDP ENGProcedure
    
    CPS-P-14
    
    TOOL MANAGEMENT PROCEDURE STANDARD
    
    
    7
    
    
    
    2
    
    
    LDP MAINTProcedure
    
    CPS-P-49
    
    LDP W/B PROCESS RTI PROCEDURE
    
    
    0
    
    
    
    2
    
    
    LDP ENGProcedure
    
    CPS-R-08
    
    BASELINE SPECIFICATION PREPARATION PROCEDURE
    
    
    9
    
    
    
    2
    
    
    LDP ENGCal
    
    PI-046
    
    MANUAL MOLD PRESS
    
    
    6
    
    
    
    3
    
    
    LDP MAINTCal
    
    PI-047
    
    MANUAL PRESS
    
    
    4
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-100
    
    MECO AUTO SOLDER PLATING EDF-EPL 1800S
    
    
    7
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-109
    
    ASM AUTO MOLDING SYSTEM
    
    
    5
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-111
    
    AUTOMATIC WIRE BONDER(UTC-200/250,KNS 1488, KNS 8028)
    
    
    5
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-121
    
    TOWA AUTO MOLD (Y-SERIES)
    
    
    3
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-162
    
    FICO AUTO MOLD TEMP SYSTEM
    
    
    2
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-163
    
    TOWA AUTO MOLD TEMP SYSTEM(UPS80)
    
    
    3
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-164
    
    TOWA AUTOMOLD TEMP SYSTEM(UPS120)
    
    
    3
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-185
    
    WAFER BAKING TIMER CALIBRATION
    
    
    1
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-193
    
    BLUE-M-OVEN
    
    
    0
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-195
    
    BLUE-M-OVEN
    
    
    0
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-198
    
    HOT PLATE
    
    
    0
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-199
    
    FREEZER
    
    
    0
    
    
    
    3
    
    
    LDP MAINTCal
    
    CAL-206
    
    GO NO GO GAUGE CALIBRATION SPEC FOR FORM PROCESS
    
    
    0
    
    
    
    3
    
    
    LDP ENGCal
    
    CAL-210
    
    4-CHAMBER CURE OVEN
    
    
    0
    
    
    
    3
    
    
    LDP MAINTCal-LMT
    
    ECAL-0013
    
    TAPE REMOVE
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-021
    
    STANDARD QUALITY PROCEDURE FOR NEW LEADFRAME AND EXPIRED
LEADFRAME
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-046
    
    MARKING FILE SELECTION AND BUY OFF
    
    
    13
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-049
    
    3RD OPTICAL INSPECTION M/C MENU
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-062
    
    FOL MAGAZINE CLEANING
    
    
    3
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-066
    
    PROCESS OF MATERIAL-LOT TRAVELLER
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-084
    
    DESIGN OF EXPERIMENT FOR GOLD WIRE BONDING OPTIMIZATION IN
MANUFACTURING
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-085
    
    WAFER SAWING OPERATION METHOD
    
    
    5
    
    
    
    3
    
    
    LDP ENG




---



##### Table of Contents



Type
    
    Document Number
    
    Doc Title
    
    Doc Rev
    
    Doc Level (1/2/3/4)
    
    DEPTWI
    
    WI-ENG-102
    
    COUNT VARIANCE CONTROL
    
    
    11
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-103
    
    WORK INSTRUCTION FOR TRIM& FORM PROCESS
    
    
    6
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-114
    
    DIE ATTACH SET BUY-OFF SYSTEM
    
    
    7
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-121
    
    OPERATION MANUAL FOR LS-3900 SCANNER INSPECTION SYSTEM
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-142
    
    PMC CLAMPING METHOD FOR THIN PACKAGE
    
    
    5
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-150
    
    WAFER MOUNT OPERATION METHOD
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-153
    
    OPERATION STANDARD TO PREVENT DAMAGED LEAD IN PLATING LINE
    
    
    3
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-154
    
    CHEMICAL ACCIDENT PREVENTIVE & EMERGENCY ACTION IN M/D,B/E,
M/F LINE
    
    
    4
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-157
    
    OPERATION MANUAL OF MARKING MACHINE
    
    
    6
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-163
    
    HOW TO PREVENT DISCOLOR
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-164
    
    DIE BONDER OPERATION MENU
    
    
    4
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-186
    
    MARKING SPECIAL CONTROL
    
    
    9
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-199
    
    LEAD FINISH LINE WATER FLOW MONITOR
    
    
    2
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-ENG-202
    
    BULK PACKING METHOD FOR MONOLITHIC POWER SYSTEMS(MPS)
    
    
    14
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-219
    
    FOL & MOLD MATERIAL TRANSPORTATION PROCEDURE
    
    
    3
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-227
    
    MARKING FILE SET UP AND CHECK
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-233
    
    SPECIAL PROCESS CONTROL FOR WAFER THICKNESS OUT OF REQUIREMENT
PROCEDURE
    
    
    3
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-250
    
    ENGINEER LOT LOADING PROCEDURE
    
    
    4
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-254
    
    MOLDING L/F LOCATION
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-256
    
    PACKING METHOD FOR WU/WUX
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-258
    
    RADAR SYSTEM
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-262
    
    LEADED FINISH RECIPE CONTROL
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-263
    
    LEAD FINISH PLATING MATERIAL CONTROL IN LINE CHEMICAL STORAGE
ROOM
    
    
    1
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-ENG-264
    
    SPECIAL PROCESS CONTROL FOR DIE PREPARE PROCESS
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-271
    
    EPOXY THICKNESS CONTROL CRITRIA IN LDP FOL
    
    
    3
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-276
    
    REJECT MARKING METHOD FOR FOL & MOLD, AND FOL RTI PROCEDURE
    
    
    3
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-ENG-277
    
    3RD OPTICAL INSPECTION MACHINE SET-UP AND BUY-OFF PROCEDURE
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-280
    
    WAFER MAPPING WORKING INSTRUCTION
    
    
    2
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-283
    
    MOLD CLEANING
    
    
    3
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-284
    
    OPERATING REQUIREMENT OF AUTOMOLD SYSTEM
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-285
    
    WIRE BONDER OPERATION MANUAL
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-286
    
    MANUAL MOLD SEMI-AUTO FRAME LOADING HANDLING PROCEDURE
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-288
    
    LDP D/A STANDARD OPERATION PROCEDURE
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-289
    
    OVEN CURE PROCEDURE
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-291
    
    VISUAL AID FOR ALL EOL DEFECT
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-292
    
    TIN FLAKE MONITOR PROCEDURE
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-294
    
    SPECIAL REQUIREMENT FOR IL PRODUCTS
    
    
    3
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-297
    
    CHEMICAL MAKE-UP AND CONTROL METHOD IN LEAD FINISH
    
    
    3
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-299
    
    TRIM & FORM RTI MONITOR CONTROL
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-301
    
    NEW DEVICE SET UP BUY OFF ON LASER MARKING MACHINE
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-305
    
    WAFFLE PACK ASSEMBLY
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-306
    
    HP WATER JET DEFLASH
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-307
    
    SPECIAL REQUIREMENT FOR ISL PRODUCTS
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-308
    
    LDP W/B PROCESS RTI
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-314
    
    HOW TO USE GO&NO-GO GAUGE
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-316
    
    CONSUMABLE TOOLING QUALIFICATION PROCEDURE
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-ENG-319
    
    LDAD FINISH SOLDERABILITY TEST
    
    
    0
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-MTN-001
    
    WIRE BONDER AIR FLOW METER SETTING
    
    
    8
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-002
    
    W/B MACHINE SET-UP PROCEDURE FOR PRODUCT TYPE CONVERSION
    
    
    11
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-003
    
    HEATER BLOCK & WINDOW CLAMP CONTROL
    
    
    5
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-004
    
    PROCEDURES FOR PM CHECKING OF D/P MACHINE
    
    
    3
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-005
    
    AUTOMATIC WIRE BONDER OVER-HAUL
    
    
    5
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-006
    
    MANUFACTURING EQUIPMENT SOFTWARE CONTROL
    
    
    3
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-007
    
    TAPE CHANGE METHOD
    
    
    2
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-010
    
    AUTOMATIC DIE BONDER OVEN-HAUL
    
    
    1
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-011
    
    D/A MACHINE SET-UP PROCEDURE FOR PRODUCT TYPE CONVERSION
    
    
    3
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-MTN-013
    
    EOL TRAINING MANUAL FOR MAINTENANCE
    
    
    0
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-014
    
    LDP EQUIPMENT SHUT DOWN & START-UP WORK INSTRUCTION
    
    
    0
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-MTN-015
    
    FOL TRAINING MANUAL FOR MAINTENANCE
    
    
    0
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-PRD-010
    
    HANDLING OF SKELETON WAFER
    
    
    8
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-PRD-011
    
    DO,DON`T DO AT MARKING AND TRIM&FROM PROCESS
    
    
    14
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-013
    
    RETURN LOT SYSTEM
    
    
    2
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-016
    
    HOUSEKEEPING PROCEDURE
    
    
    4
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-018
    
    MOLD COMPOUND CONTROL
    
    
    3
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-021
    
    L/F MATERIAL HANDLE CONTROL PRODURE
    
    
    2
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-022
    
    DO & DOT DO FOR FOL OPERATOR
    
    
    4
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-027
    
    PREVENTIVE ACTION FOR POTENTIAL HUMAN INDUCED DEFECT
    
    
    8
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-028
    
    GOLD WIRE CONTROL PROCEDURE
    
    
    2
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-030
    
    HOW TO THE INDICATOR DATA
    
    
    1
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-032
    
    LDP LINE TOOLING MANAGEMENT
    
    
    5
    
    
    
    3
    
    
    LDP MAINTWI
    
    WI-PRD-038
    
    LDP M/H STANDARD OPERATION PROCEDURE
    
    
    1
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-041
    
    D/A TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-PRD-042
    
    D/A DO & DONT DO VISUAL AID
    
    
    2
    
    
    
    3
    
    
    LDP PROD




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##### Table of Contents



Type
    
    Document Number
    
    Doc Title
    
    Doc Rev
    
    Doc Level (1/2/3/4)
    
    DEPTWI
    
    WI-PRD-043
    
    D/P TRAINING MANUAL FOR OPERATOR AND INSPECTOR
    
    
    1
    
    
    
    3
    
    
    LDP ENGWI
    
    WI-PRD-044
    
    EVI TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-045
    
    MOLD & PMC TRAINING MANUAL FOR OPERATOR & INSPECTOR
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-046
    
    M/D DO & DONT VISUAL AID
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-047
    
    M/F TRAINING MANUAL OPERATOR AND QA INSPECTOR
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-048
    
    M/F DO & DONT VISUAL AID
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-049
    
    M/K TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-050
    
    MK DO & DONT VISUAL AID
    
    
    1
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-051
    
    T/F TRAINING MANUAL FOR OPERATOR AND QA INSPECTOR
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-052
    
    TF DO & DONT VISUAL AID
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-053
    
    W/B TRAINING MANUAL FOR OPERATOR AND INSPECTOR
    
    
    1
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-055
    
    PROCEDURE FOR DUMMY L/F SAVING
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-057
    
    MESPLUS LOT MOVEMENT OPERATION MANUAL
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-PRD-058
    
    LDP LINE MARK DEFINE
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-TST-013
    
    BARCODE PRINTER OPERATION GUIDELINE
    
    
    2
    
    
    
    3
    
    
    LDP TESTWI
    
    WI-TST-039
    
    LATTICE TUBE PACKING METHOD
    
    
    5
    
    
    
    3
    
    
    LDP TESTWI
    
    WI-QA-108
    
    CETS Packing Trainning Manual For Operator
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-QA-147
    
    D/P DO & DONT DO VISUAL AID
    
    
    2
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-QA-148
    
    EVI DO & DONT DO VISUAL AID
    
    
    0
    
    
    
    3
    
    
    LDP PRODWI
    
    WI-QA-161
    
    WB DO & DONT DO VISUAL AID
    
    
    2
    
    
    
    3
    
    
    LDP PROD




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##### Table of Contents



Technical Specifications  Test




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##### Table of Contents



DOCUMENT RECEIVING LIST
 NO.
    
    REC. DATE
    
    DOC. NO.
    
    DOC. TITLE
    
    REV.1
    
    
    2004.12.17
    
    
    WI-ENG-059
    
    WORKMANSHIP OF WRIST STRAP
    
    B2
    
    
    2005.10.13
    
    
    WI-TST-006
    
    STRAY UNITS HANDLING GUIDELINE
    
    B3
    
    
    2004.12.22
    
    
    WI-TST-010
    
    TEST EQUIPMENT CLEANING POLICY
    
    A4
    
    
    2000.12.15
    
    
    WI-TST-026
    
    T-CARD AND TEST SUMMARY CHECK PROCEDURE
    
    B5
    
    
    2005.06.07
    
    
    WI-TST-044
    
    REJECT HANDLING PROCEDURE OF TEST OPERATION
    
    E6
    
    
    2004.12.14
    
    
    WI-TST-084
    
    LTX MODULE/BOARD REPLACEMENT INSTRUCTION
    
    A7
    
    
    2003.09.22
    
    
    WI-TST-085
    
    ETS364 DOCKING WORK INSTRUCTION
    
    O8
    
    
    2004.11.15
    
    
    WI-TST-095
    
    INTERSIL BIN CART LABELING WORK INSTRUCTION
    
    A9
    
    
    2004.12.17
    
    
    WI-TST-099
    
    YAMAOICHI TEST CONTACTORS CLEANING PROCEDURE
    
    A10
    
    
    2004.11.15
    
    
    WI-TST-112
    
    PRODUCTION INTERRUPTION
    
    A11
    
    
    2004.11.15
    
    
    WI-TST-119
    
    TEST PRODUCT IDENTIFICATION
    
    A12
    
    
    2004.10.12
    
    
    WI-TST-143
    
    FT POSITROL LOG FILLING METHOD
    
    O13
    
    
    2005.09.20
    
    
    WI-TST-194
    
    LOCATION INDICATE OF TEST BANK SHELF
    
    O14
    
    
    2005.11.15
    
    
    WI-TST-198
    
    TEST OPERATION MATERIAL RECYCLE PROCEDURE
    
    O15
    
    
    2005.11.15
    
    
    WI-TST-210
    
    TOTE BOX COV ER PURPOSE AND PROCEDURE
    
    O




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##### Table of Contents



DOCUMENT RECEIVING LIST
 NO.
    
    REC. DATE
    
    DOC. NO.
    
    DOC. TITLE
    
    REV.1
    
    2004.12.22
    
    CMT143-0004
    
    MCT-5100 HANDLER JAM CLEAR SPECIFICATION
    
    B2
    
    2004.12.22
    
    CMT143-0006
    
    MCT-3608/3616 HANDLER JAM CLEAR SPECIFICATION
    
    C3
    
    2005.08.02
    
    CMT143-0009
    
    BAKE OVEN OPERATION SPEC.
    
    E4
    
    2004.12.22
    
    CMT143-0013
    
    NEW EQUIPMENT SETUP PROCEDURE
    
    C5
    
    2004.12.22
    
    CMT143-0014
    
    MACHINE QUALIFICATION FOR ELECTRICAL TEST
    
    B6
    
    2004.12.20
    
    CMT143-0016
    
    TEST LOAD BOARD & ADAPTOR P.M SPECIFICATAION
    
    B7
    
    2005.06.07
    
    CMT143-0020
    
    TEST EQUIPMENT JAM CLEAR PROCEDURE
    
    F8
    
    
    
    CMT143-0036
    
    LOAD BOARD  CONTROL SPECIFICATION
    
    613
    
    2004.12.20
    
    CMT143-0071
    
    SPARE PARTS CONTROL PROCEDURE
    
    A15
    
    2005.01.05
    
    CMT143-0079
    
    TEST EQUIPMENT CONTROL SPECIFICATION
    
    A17
    
    2004.12.15
    
    CMT143-0101
    
    SPARE PARTS VERIFICATION PROCEDURE SPECIFICATION
    
    O18
    
    2005.05.20
    
    CMT143-0102
    
    TEST EQUIPMENT BUY-OFF/QUALIFICATION PROCEDURE-TEST
    
    B19
    
    2005.04.28
    
    CMT143-0104
    
    PROCEDURE USED FOR ELECTRICAL TEST SET-UP BUY-OFF
    
    A20
    
    2004.12.14
    
    CMT143-0105
    
    MTT 9918 HANDLER JAM CLEAR SPECIFICATION-TEST
    
    O21
    
    2004.12.14
    
    CMT143-0107
    
    RASCO HANDLER JAM CLEAR SPECIFICATION-TEST
    
    O22
    
    2004.12.15
    
    CMT143-0108
    
    MTT93XX HANDLER JAM CLEAR SPECIFICATION-TEST
    
    O23
    
    2004.12.14
    
    CMT143-0109
    
    KUWANO HANDLER JAM CLEAR SPECIFICATION-TEST
    
    O24
    
    2004.12.15
    
    CMT143-0110
    
    MTT-85XX HANDLER JAM CLEAR SPECIFICATION-TEST
    
    O25
    
    2004.12.14
    
    CMT143-0111
    
    AET5050X HANDLER JAM CLEAR SPECIFICATION-TEST
    
    O




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##### Table of Contents



DOCUMENT RECEIVING LIST
 NO.
    
    REC. DATE
    
    DOC. NO.
    
    DOC. TITLE
    
    REV.1
    
    
    2005.10.10
    
    
    CMT140-0044
    
    STANDARD SCC FINAL TEST BASELINE SPECS
    
    O2
    
    
    
    
    
    
    
    All other customer baseline can only be transferred once customer approved.




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##### Table of Contents



DOCUMENT RECEIVING LIST
 NO.
    
    REC. DATE
    
    DOC. NO.
    
    DOC. TITLE
    
    REV.1
    
    
    2004.12.22
    
    
    CMT141-0002
    
    MCT 5100 HANDLER OPERATING SPEC.
    
    C2
    
    
    2004.12.22
    
    
    CMT141-0003
    
    MCT3608/3616 HANDLER OPERATING SPEC
    
    D3
    
    
    2005.06.17
    
    
    CMT141-0006
    
    MH802 HANDLER OPERATION SPECIFICATION
    
    C4
    
    
    2004.12.22
    
    
    CMT141-0008
    
    SO1000 H HANDLER OPERATION SPECIFICATION
    
    B5
    
    
    2004.12.22
    
    
    CMT141-0023
    
    SYMTEK300 HANDLER OPERATION SPECIFICATION
    
    A6
    
    
    2005.06.13
    
    
    CMT141-0035
    
    ASECO S-130 HANDLER OPERATION SPECIFICATION
    
    B7
    
    
    2004.12.22
    
    
    CMT141-0044
    
    MULTITEST MT9308 HANDLER OPERATING SPEC
    
    A8
    
    
    2005.06.17
    
    
    CMT141-0047
    
    MULTITEST9918 HANDLER OPERATION SPECIFICATION
    
    O9
    
    
    2005.06.17
    
    
    CMT141-0049
    
    KUWANO HANDLER OPERATION SPECIFICATION
    
    O10
    
    
    2005.06.17
    
    
    CMT141-0050
    
    ASM HANDLER OPERATION SPECIFICATION
    
    O11
    
    
    2004.11.08
    
    
    CMT141-0061
    
    MULTITEST 85XX OPERATION SPECTIFICATION
    
    A12
    
    
    2004.11.08
    
    
    CMT141-0062
    
    MULTITEST 85XX OPERATION SPECTIFICATION
    
    A13
    
    
    2005.04.20
    
    
    CMT141-0073
    
    AET5050X HANDLER OPERATION SPECIFICATION
    
    O14
    
    
    2005.06.13
    
    
    CMT141-0074
    
    MULTITEST-8704 HANDLER OPERATION SPECIFICATION
    
    O15
    
    
    2005.06.13
    
    
    CMT141-0075
    
    AETRIUM3300 HANDLER OPERAION SPECIFICATION
    
    O16
    
    
    2005.04.29
    
    
    CMT144-0001
    
    ELECTRICAL TEST PROCEDURE SPECIFICATION
    
    H17
    
    
    2005.09.08
    
    
    CMT144-0012
    
    MASTER DEVICE CONTROL PROCEDURE
    
    D18
    
    
    2005.08.11
    
    
    CMT144-0016
    
    TEST LOT RECEIVING AND DISPATCHING PROCEDURE
    
    B19
    
    
    2005.07.07
    
    
    CMT144-0033
    
    SET-UP VERIFICATION PROCEDURE
    
    O20
    
    
    2004.12.17
    
    
    CMT145-0001
    
    GENERAL WORKMANSHIP STANAARD SPEC. FOR TEST FLOOR
    
    D21
    
    
    2004.12.20
    
    
    CMT145-0004
    
    TEST CONTROL CENTER CONTROL SPECIFICATION
    
    A22
    
    
    
    
    
    CMT145-0007
    
    OPERATION PROCEDURE OF TEST ONLY PRODUCT
    
    D23
    
    
    2005.05.20
    
    
    CMT152-0001
    
    QA ELECTRICAL TEST PROCEDURE
    
    C24
    
    
    2004.12.15
    
    
    CMT152-0002
    
    DATA RETENTION QA PROCEDURE
    
    B




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##### Table of Contents



DOCUMENT RECEIVING LIST
 NO.
    
    REC. DATE
    
    DOC. NO.
    
    DOC. TITLE
    
    REV.1
    
    
    2005.01.14
    
    
    FMEA-04-010
    
    FMEA FOR RECYLCE TUBE
    
    
    O2
    
    
    2005.11.08
    
    
    TCMGENQC
    
    IN-PROCESS QC TOTAL CONTROL METHODOLOGY
    
    
    Q3
    
    
    2005.08.02
    
    
    TCMTSTET
    
    TOTAL CONTROL METHODLOGY FOR CPS FINAL TEST
    
    
    F4
    
    
    2005.11.24
    
    
    FMEA-TSTET-001
    
    FINAL TEST PROCESS FMEA
    
    
    O5
    
    
    2006.02.07
    
    
    CP-CPS-TST-001
    
    SCC STANDARD TEST CONTROL PLAN
    
    
    14




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##### Table of Contents



DOCUMENT RECEIVING LIST
 NO.
    
    REC. DATE
    
    DOC. NO.
    
    DOC. TITLE
    
    REV.1
    
    
    2004.12.15
    
    
    PM-0167
    
    CREDENCE TESTER
    
    
    A2
    
    
    2004.12.13
    
    
    PM-0168
    
    EPRO142AX
    
    
    A3
    
    
    2004.12.15
    
    
    PM-0169
    
    EAGLE TESTER
    
    
    B4
    
    
    2004.12.15
    
    
    PM-0170
    
    Q2/62
    
    
    
    A5
    
    
    2005.04.29
    
    
    PM-0172
    
    AAT100&AAT200
    
    
    B6
    
    
    2006.3.13
    
    
    PM-0173
    
    ASECO130/150
    
    
    57
    
    
    2006.3.15
    
    
    PM-0175
    
    36XX/SESS
    
    
    58
    
    
    2005.4.12
    
    
    PM-0178
    
    MH-802
    
    
    B9
    
    
    2006.3.15
    
    
    PM-0180
    
    85XX
    
    
    510
    
    
    2006.3.15
    
    
    PM-0181
    
    93XX
    
    
    611
    
    
    2006.3.15
    
    
    PM-0182
    
    SOX000
    
    
    612
    
    
    2005.11.2
    
    
    PM-0183
    
    SYMTEK
    
    
    C13
    
    
    2005.10.25
    
    
    PM-0186
    
    LTX77
    
    
    B14
    
    
    2005.10.25
    
    
    PM-0187
    
    A360
    
    
    B15
    
    
    2005.10.25
    
    
    PM-0188
    
    A580
    
    
    B16
    
    
    2004.12.17
    
    
    PM-0190
    
    MAVERICK PT/VT/GT
    
    
    A17
    
    
    2004.12.15
    
    
    PM-0191
    
    ASL1000
    
    
    A18
    
    
    2004.12.15
    
    
    PM-0192
    
    TSA
    
    
    A19
    
    
    2004.12.17
    
    
    PM-0193
    
    SZ M3650 TESTER PM INSTRUCTION
    
    
    A20
    
    
    2006.3.14
    
    
    PM-0194
    
    AETR-5050S
    
    
    721
    
    
    2005.11.2
    
    
    PM-0195
    
    KUWANO/LT-930-H222
    
    
    E22
    
    
    2004.12.15
    
    
    PM-0196
    
    HP949X
    
    
    A23
    
    
    2005.11.2
    
    
    PM-0202
    
    9918
    
    
    C24
    
    
    2005.11.2
    
    
    PM-0204
    
    AETRIUM 3300
    
    
    C25
    
    
    2004.12.06
    
    
    PM-0212
    
    BLUE-M
    
    
    A26
    
    
    2004.12.06
    
    
    PM-0230
    
    FT1000
    
    
    O27
    
    
    2005.11.2
    
    
    PM-0231
    
    8704
    
    
    C28
    
    
    
    
    
    PM-0234
    
    TERADYNE TESTER J750
    
    
    A29
    
    
    2005.03.08
    
    
    PM-0235
    
    INTERFACE CABLE BETWEEN TESTER AND HANDLER
    
    
    O30
    
    
    2005.07.08
    
    
    PM-0239
    
    SZM3670 TESTER
    
    
    O




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##### Table of Contents



DOCUMENT RECEIVING LIST
 NO.
    
    REC. DATE
    
    DOC. NO.
    
    DOC. TITLE
    
    REV.1
    
    
    2005.10.28
    
    
    CAL-124
    
    VISTA/DUO/QUARTET TESTER SYSTEM CAL
    
    B2
    
    
    2005.10.28
    
    
    CAL-125
    
    EPRO-142AX SYSTEM CALIBRATION INSTRUCTION
    
    B3
    
    
    2005.10.28
    
    
    CAL-126
    
    ETS364 SYSTEM CALIBRATION INSTRUCTION
    
    C4
    
    
    2005.10.28
    
    
    CAL-127
    
    Q2 TESTER SYSTEM CAL SPECIFICATION
    
    B5
    
    
    2005.10.5
    
    
    CAL-129
    
    ASECO130/150 TEMP CALIBRATION INSTRUCTION
    
    D6
    
    
    2005.6.17
    
    
    CAL-130
    
    ASM CALIBRATION INSTRUCTION
    
    B7
    
    
    2005.10.5
    
    
    CAL-132
    
    MCT-36** HANDLER CALIBRATION INSTRUCTION
    
    D8
    
    
    2004.12.20
    
    
    CAL-134
    
    MH-802 HANDLER CALIBRATION INSTRUCTION
    
    C9
    
    
    2005.10.5
    
    
    CAL-136
    
    MT-85XX CALIBRATION SPECIFICATION
    
    E10
    
    
    2005.10.5
    
    
    CAL-137
    
    MULTITEST-93XX HANDLER CALIBRATION INSTRUCTION
    
    G11
    
    
    2005.10.5
    
    
    CAL-138
    
    SO1000A/AH/H HANDLER CALIBRATION INSTRUCTION
    
    D12
    
    
    2005.10.5
    
    
    CAL-139
    
    SYMTRK TEMP CALIBRATION INSTRUCTION
    
    E13
    
    
    2005.10.25
    
    
    CAL-142
    
    A360 TEST SYSTEM CALIBRATION INSTRUCTION
    
    B14
    
    
    2005.10.26
    
    
    CAL-143
    
    A580 TEST SYSTEM CALIBRATION INSTRUCTION
    
    B15
    
    
    2005.10.28
    
    
    CAL-145
    
    ASL 1000 TESTER CALIBRATION SPECIFICATION
    
    B16
    
    
    2005.10.28
    
    
    CAL-146
    
    MAVERICK PT/VT/GT TESTER CALIBRATION INSTRUCTION
    
    B17
    
    
    2004.12.17
    
    
    CAL-148
    
    SZ M3650 TEST CALIBRATION INSTRUCTION
    
    A18
    
    
    2005.10.25
    
    
    CAL-149
    
    LTX77 SYSTEM CALIBRATION INSTRUCTION
    
    H19
    
    
    2005.10.5
    
    
    CAL-151
    
    KUWANO TEMP CALIBRATION INSTRUCTION
    
    D20
    
    
    2005.10.28
    
    
    CAL-159
    
    HP 949X TESTER CALIBTRTION INSTRUCTION
    
    B21
    
    
    2005.10.5
    
    
    CAL-168
    
    MULTITEST-9918 HANDLER CALIBRATION INSTRUCTION-TEST
    
    C22
    
    
    2005.01.18
    
    
    CAL-173
    
    LTX CALIBRATOR CALIBRATION INSTRUCTION
    
    B23
    
    
    2005.03.22
    
    
    CAL-184
    
    BLUE-M-OVEN CALIBRATION INSTRUCTION-TEST
    
    B24
    
    
    2005.10.5
    
    
    CAL-188
    
    MHZ2655 CALIBRATION INSTRUCTION
    
    A25
    
    
    2005.10.25
    
    
    CAL-192
    
    TERADYNE J750 TEST SYSTEM CALIBRATION
    
    A26
    
    
    2005.10.5
    
    
    CAL-200
    
    AETRIUM5050X HANDLER CALIBRATION INSTRUCTION-TEST
    
    A27
    
    
    2005.10.5
    
    
    CAL-201
    
    MULTITEST-8704 HANDLER CALIBRATION INSTRUCTION-TEST
    
    A28
    
    
    2005.7.8
    
    
    CAL-205
    
    SZ M3670 TESTER CALIBRATION INSTRUCTION
    
    O29
    
    
    2005.09.28
    
    
    CAL-207
    
    A312 TEST SYSTEM CALIBRATION INSTRUCTION
    
    O




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##### Table of Contents



FVI SPEC LIST
 NO.
    
    REC.DATE
    
    DOC.NO.
    
    PROC.TITLE
    
    REV.1
    
    
    2005.7.25
    
    
    CPS-E-08
    
    ESD Control Procedure
    
    
    152
    
    
    2004.11.26
    
    
    WI-TST-021
    
    SCC tested product standard packing method
    
    
    C3
    
    
    2004.11.26
    
    
    WI-TST-034
    
    T-CARD PACKING METHOD FOR SCC TEST
    
    
    B4
    
    
    2004.11.18
    
    
    WI-TST-035
    
    DISPOSITION FOR T&R REJECTS
    
    
    C5
    
    
    2004.11.18
    
    
    WI-TST-037
    
    Product rework procdedure
    
    
    B6
    
    
    2006.2.8
    
    
    WI-TST-226
    
    Rework procedure for Post Test
    
    
    07
    
    
    2006.2.2
    
    
    FMEA-TETFVI-001
    
    FMEA for FVI
    
    
    08
    
    
    2005.5.25
    
    
    VPD5-00009-0
    
    Visual Aid for Tube Product
    
    
    09
    
    
    2005.10.31
    
    
    CMT140-0019
    
    Tube/Tray/Plug/Plastic Bag/ToteBox Recycle Procedure
    
    
    G10
    
    
    2004.12.1
    
    
    CMT141-0072
    
    ATM AT&ATS LEAD STRAIGHTENER OPERATION PROCEDURE SPECIFICATION
    
    
    O11
    
    
    2005.11.1
    
    
    CMT144-0002
    
    FINAL VISUAL INSPECTION PROCEDURE
    
    
    J12
    
    
    2004.12.17
    
    
    CMT144-0015
    
    LEAD SCANNING PROCEDURE SPEC
    
    
    F13
    
    
    2005.11.25
    
    
    CMT145-0006
    
    Packing material spec
    
    
    F




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##### Table of Contents



IPK SPEC LIST
 NO.
    
    REC.DATE
    
    DOC.NO.
    
    PROC.TITLE
    
    REV.60
    
    
    2006.2.7
    
    
    CP-CPS-TST-0001
    
    SCC STANDARD TEST CONTROL PLAN
    
    
    1461
    
    
    2005.7.22
    
    
    FMEA-04-009
    
    FMEA for IPK
    
    
    B




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##### Table of Contents



TnR SPEC LIST
 NO.
    
    REC.DATE
    
    DOC.NO.
    
    PROC.TITLE
    
    REV.1
    
    
    2006.2.7
    
    
    FMEA-TSTTR-001
    
    FMEA for Lead Scan/Tape and Reel
    
    
    O2
    
    
    2005.4.1
    
    
    VPD3-00001-6
    
    VISUAL AID for T&R
    
    
    63
    
    
    2005.6.6
    
    
    VPD4-00001-3
    
    TnR System Critical Sensor Check
    
    
    34
    
    
    2005.2.4
    
    
    VPD5-00003-0
    
    Proper mark teaching done by opetators
    
    
    O6
    
    
    2005.11.24
    
    
    CAL-161
    
    GENERAL CALIBRATION PROCEDURE FOR T/R MACHINE
    
    
    B7
    
    
    2004.11.18
    
    
    CMT141-0010
    
    TR18ASII TAPE & REEL MACHINE OPERATION PROCEDURE SPECIFICATION
    
    
    C9
    
    
    2004.12.30
    
    
    CMT141-0014
    
    MV851 IC LEAD/MARK INSPECTOR OPERATING SPECIFITION
    
    
    B10
    
    
    2004.11.15
    
    
    CMT141-0017
    
    PBFT-856VS PEEL BACK FORCE TESTER OPERATION PROCEDURE SPECIFICATION
    
    
    B11
    
    
    2004.11.15
    
    
    CMT141-0018
    
    AT8005 LEAD/MARK INSPECTION SYSTEM WITH TAPE & REEL OPERATION PROCEDURE SPECIFICATION
    
    
    B12
    
    
    2004.11.1
    
    
    CMT141-0038
    
    AT28 TAPE & REEL MACHINE OPERATION PROCEDURE SPECIFICATION
    
    
    B13
    
    
    2005.6.3
    
    
    CMT141-0055
    
    G6 Tape & Reel Machine Operation Specification
    
    
    O14
    
    
    2004.11.15
    
    
    CMT141-0056
    
    AT128 TAPE & REEL MACHINE OPERATION PROCEDURE SPECIFICATION
    
    
    O15
    
    
    2004.11.15
    
    
    CMT141-0063
    
    TAPE & REEL MACHINE RELEASE TO PRODUCTION SPECIFICATION
    
    
    A16
    
    
    2004.12.1
    
    
    CMT141-0072
    
    ATM AT & ATS LEAD STRAIGHTENER OPERATION PROCEDURE SPECIFICATION
    
    
    O17
    
    
    2004.11.1
    
    
    CMT143-0026
    
    TR18ASII TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION
    
    
    F18
    
    
    2004.11.1
    
    
    CMT143-0031
    
    MV851 IC MARK/LEAD INSPECTOR PM & CALIBRATION PROCEDURE SPECIFICATION
    
    
    C19
    
    
    2004.11.8
    
    
    CMT143-0034
    
    PBFT-856VS PEEL BACK FORCE TESTER PM & CALIBRATION PROCEDURE SPECIFICATION
    
    
    B20
    
    
    2004.12.29
    
    
    CMT143-0035
    
    AT8005 LEAD/MARK INSPECTION SYSTEM PM SPECIFICATION
    
    
    B21
    
    
    2004.11.3
    
    
    CMT143-0056
    
    AT-28 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION
    
    
    C22
    
    
    2004.11.15
    
    
    CMT143-0085
    
    AT-128 TAPE & REEL MACHINE PM & CALIBRATION PROCEDUIRE SPECIFICATION
    
    
    A23
    
    
    2004.11.15
    
    
    CMT143-0097
    
    G6 TAPE & REEL MACHINE PM & CALIBRATION PROCEDURE SPECIFICATION
    
    
    A24
    
    
    2006.2.7
    
    
    CMT144-0010
    
    Lead Scan and Tape & Reel procedure spec
    
    
    2425
    
    
    2004.12.17
    
    
    CMT144-0015
    
    LEAD SCANNING PROCEDURE SPEC
    
    
    F26
    
    
    2005.11.25
    
    
    CMT145-0006
    
    Packing material spec
    
    
    F27
    
    
    2005.11.30
    
    
    CMT145-0007
    
    OPERATION PROCEDURE of TEST ONLY PRODUCT
    
    
    D




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##### Table of Contents



APPENDIX 3
  
 TRANSFER PLAN
   May06

    Jun

    Jul

    Aug

    Sep

    Oct

    Nov
   
    Dec

    Jan
    
    Feb
    
    Mar
    

    Apr
    

    MayPDIP
    >
    
    
    
    
    Rest of PDIPSOIC
    
    
    
    
    >
    
    
    
   
    SOICPLCC
    
    
    
    
    
    

    >
    

    
    PLCCTSSOP
    
    
    
    
    
    
    
    
    >
    

    
    
    
    TSSOPMSOP
    
    
    
    
    
    
    
    
    
    
    >
    

    
    
    
    MSOPSSOP
    
    
    
    
    
    
    
    
    
    
    
    
    >
    
    
    
    
    SSOP
 
 Comments:1.
    
    PDIC + PLCC + SOIC = 80% of total revenue2.
    
       quals by end Jan.3.
    
    Review forecast to focus on high volume SOIC packages4.
    
    MOU discussions  1 year total transfer period5.
    
    Current transfer plan  ramp up 80% of volume in 8 mths.6.
    
    PDIP determines rate of trf. Speed-up (best case)  by 2 mths. 19




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##### Table of Contents



SCHEDULE
 DEFINITION OF COMMERCIALLY REASONABLE EFFORTS BY SCC FOR THE
PURPOSES OF CLAUSE 5.2 OF THIS AGREEMENT
 1.
    
    Letter from CEO of SCC to the active SCL Customers2.
    
    Presentation to the SCL Customers to introduce ANST3.
    
    Organise one (1) meeting for each active SCL Customer4.
    
    Technical interface through first qualification build5.
    
    Sending its engineers and operators to the premises of ANST and provide 3000 man hours
on-site operational support to ANST (at ANSTs cost)6.
    
    Devote adequate time and effort of executive management, including 100 man hours by the
Managing Director or Plant Manager of SCC and 250 man hours each by two (2) directors of SCC7.
    
    Provide Customer Service Support to ANST and the Transfer Customers, including to prepare
customer interface and reports8.
    
    Provide cross training to the engineers and maintenance personnel of ANST at the premises of
SCC9.
    
    Transfer information and details of process know-how (including control plans and process
specifications), Recipe and Best Practices, Build of material and Source of Supply10.
    
    Conduct quality assurance audits on ANST and provide quality management training
 20




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##### Table of Contents



IN WITNESS WHEREOF
 SCC
 SIGNED by
    
    
    )Tan Lay Koon
    
    
    )for and on behalf of
    
    
    )STAT ChipPAC Shanghai Co., Ltd.
    
    
    )in the presence of:
    
    
    )
    
    
    /s/ Tan Lay KoonName: Tan Lay KoonTitle: President & CEOName:Title:SCLSIGNED by
    
    
    )Tan Lay Koon
    
    
    )for and on behalf of
    
    
    )STAT ChipPAC Ltd.
    
    
    )in the presence of:
    
    
    )
    
    
    /s/ Tan Lay KoonName: Tan Lay KoonTitle: President & CEOName:Title:ANSTSIGNED by
    
    
    )Wang Guoping
    
    
    )for and on behalf of
    
    
    )Wuxi CR Micro-Assemb Tech. Ltd.
    
    
    )in the presence of:
    
    
    )
    
    
    /s/ Wang GuopingName: Wang GuopingTitle: Director and Chief Executive OfficerName:Title:CRLSIGNED by
    
    
    )Wang Guoping
    
    
    )for and on behalf of
    
    
    )China Resources Logic Limited
    
    
    )in the presence of:
    
    
    )
    
    
    /s/ Wang GuopingName: Wang GuopingTitle: Director and Chief Executive OfficerName:Title:
 21