# Patent

## Title
Compact rackmount storage server

## Abstract

A rackmount storage server has a printed circuit board (PCB) having connectors for connecting with a plurality of top-loading storage devices. A controller assembly having a PCI expansion slot, is arranged to operatively connect to the passive backplane from a rear side of the PCB. Further, the rackmount storage server has redundant cooling unit for facilitating air flow in an interior region of the rackmount storage server. Further, the rackmount storage server may have an integrated battery for saving power for use in case of, for example, a power failure.

## Background
BACKGROUND
As generally referred to in the art, a “server” is a computing device that is configured to perform operations for one or more other computing devices connected over a network. For an entity that requires computing infrastructure for handling relatively large amounts of network data, it is desirable to use servers that are designed to promote organizational/space efficiency and operational performance. In this regard, some servers are designed to be arranged in a “rack,” whereby the rack (or “cabinet”) houses numerous servers that are arranged, or “mounted,” vertically one on top of another (however, not necessarily in contact with one another). Such a server is generally referred to in the art as a “rackmount” server.
Rackmount servers are generally designed having a height corresponding to whole multiples of an industry standard rack mounting height dimension. For example, rackmount servers are generally referred to as “2 U,” “3 U,” “4 U,” etc. systems, where the “U” designation refers to one dimensional increment of 1.75 inches in height along the vertical members of an Electronics Industry Alliance (EIA) industry-standard computer racking/mounting structure. Thus, for example, a 2 U rackmount server is generally designed to be approximately 3.5 inches in height, less a small amount of clearance between vertically-adjacent rackmount servers in the rack (those skilled in the art will note that a standard rack is 19 inches wide; however, racks of other widths are available).
In view of size constraints and limitations of a rackmount server, it is important to combine and arrange components in the rackmount server in a manner that promotes operational performance and space efficiency.
SUMMARY
According to one aspect of one or more embodiments of the present invention, a server comprises: a printed circuit board (PCB) disposed along an inside surface of the server, where the PCB has a plurality of connectors adapted to be connected to a plurality of top-loading storage devices; and a controller assembly operatively connected to the PCB from a rear side of the PCB.
According to another aspect of one or more embodiments of the present invention, an apparatus comprises: a chassis; a PCB having a first connector connectable to a second connector integral with a hard disk insertable from a top portion of the chassis; and a controller assembly operatively connectable to a rear side of the PCB, the controller being accessible from a rear side of the chassis.
According to another aspect of one or more embodiments of the present invention, a rackmount storage server comprises: a passive backplane; top-loading hard disks each having a native connector pluggable into the passive backplane; and a controller operatively connected to the passive backplane from a rear side of the passive backplane.
Other aspects of the present invention will be apparent from the following description and the appended claims.



BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 shows a rackmount storage server in accordance with an embodiment of the present invention
FIG. 2 shows an exploded perspective view of a rackmount storage server in accordance with an embodiment of the present invention.
FIG. 3 shows a portion of a rackmount storage server in accordance with an embodiment of the present invention.
FIG. 4 shows an exploded perspective view of a portion of a rackmount storage server in accordance with an embodiment of the present invention.
FIG. 5 shows an exploded perspective view of a portion of a rackmount storage server in accordance with an embodiment of the present invention.
FIG. 6 shows a chassis mechanical drawing.
FIG. 7 shows two major components of an exemplary embodiment of a rackmount storage server.
FIG. 8 shows a block diagram of an exemplary embodiment of a rackmount storage server.
FIG. 9 shows two 144-circuit hi-speed dock connectors of an exemplary embodiment of a rackmount storage server.
FIG. 10 shows the face plate for the System Controller of an exemplary embodiment of a rackmount storage server.
FIG. 11 shows a USB connector.
FIG. 12 shows a Serial connector.
FIG. 13 shows a 10/100BaseT connector.
FIG. 14 shows a 10/100/1000BaseT connector.
FIG. 15 shows an S-ATA connector.
FIG. 16 shows a VGA connector.



DETAILED DESCRIPTION
Specific embodiments of the present invention will now be described in detail with reference to the accompanying figures. Like elements in the various figures are denoted by like reference numerals for consistency. Further, in the following detailed description of embodiments of the present invention, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. In other instances, well-known features have not been described in detail to avoid obscuring the description of embodiments of the present invention.
Generally, embodiments of the present invention relate to a rackmount storage server having a novel combination and/or arrangement of components. FIG. 1 shows an example of a rackmount storage server 10 in accordance with an embodiment of the present invention. A front side 12 of the rackmount storage server 10 is formed of a vented surface 14 arranged to allow for the passage of air between a region interior to the rackmount storage sever 10 and a region exterior to the rackmount storage server 10. A right side 16 of the rackmount server 10 (and a left side of the rackmount server 10, the left side not being visible in FIG. 1) is formed of an attachment mechanism 18 for mounting the rackmount server 10 to a rack (or cabinet) (not shown) arranged to hold the rackmount server 10. Further, a first top cover 20 and a second top cover 22 may be used to enclose the rackmount server 10 from a top side, where the top side is defined as the side of the rackmount storage server 10 facing up when the rackmount storage server 10 is mounted in the rack (or cabinet) (not shown).
FIG. 2 shows an exploded perspective view of a rackmount storage server 10 in accordance with an embodiment of the present invention. A chassis portion 30 of the rackmount storage server 10 is shown having left and right sides 35, 16 each having attachment mechanisms (shown, but not labeled) for mounting the rackmount storage server 10 to a rack (or cabinet) (not shown) arranged to hold the rackmount storage server 10. Further, a front side of the rackmount server 10 may be attached to a front member 34 as shown in FIG. 2.
A printed circuit board (PCB) 24, which may be a backplane (passive or active) or motherboard, is arranged to be fitted in the chassis portion 30. Particularly, the PCB 24 may be positioned along an inner bottom surface of the chassis portion 30. The PCB 24 has a plurality of connectors arranged to be connected to a plurality of storage devices (not shown), which may constitute hard disks, or other such devices that are used for the storage of data. Each of the plurality of storage devices (not shown) may have their own native connectors to connect with respective connectors disposed on the PCB 24.
As discernible in FIG. 2, the plurality of storage devices (not shown) may be loaded from a top side of the rackmount storage server 10. In other words, each of the plurality of storage devices (not shown) may be “plugged in” from the top of the rackmount storage server 10 to a connector on the PCB 24. Further, as shown in FIG. 2, a storage device housing (such as a disk carrier for enclosing hard disks) 26 is provided to individually and at least partially enclose/house each of the plurality of storage devices (not shown). In other words, the storage device housing 26 provides “slots” for inserting each of the plurality of storage devices (not shown).
In one or more embodiments of the present invention, one or more of the plurality of storage devices (not shown) may be serial ATA (SATA) disks. Further, in one or more embodiments of the present invention, one or more of the plurality of storage devices (not shown) may be serial attached SCSI (SAS) disks. Further, in one or more embodiments of the present invention, storage devices other than SATA and SAS disks may be used in the rackmount storage server 10.
Further, still referring to FIG. 2, those skilled in the art will note that, in one embodiment of the invention a total of 48 storage devices may be inserted in the rackmount storage server 10. The 48 storage devices may be arranged in 4 rows of 12 storage devices each as shown in FIG. 2. However, in one or more other embodiments of the present invention, a different number and/or different arrangement of storage devices may be used.
Along a front side of the rackmount storage server 10 are disposed a plurality of cooling devices 28. The cooling devices 28 in FIG. 2 are arranged as two rows of fans (further described below). The cooling devices 28 are arranged to provide redundant airflow through an overall region of the rackmount storage server 10. Those skilled in the art will note that in one or more embodiments of the present invention, a different number and/or different arrangement of cooling devices 28 (than that shown in FIG. 2) may be used.
Referring again to the PCB 24 shown in FIG. 2, the PCB 24 is arranged to be connected to an attachment means 32 for attaching the PCB 24 and the storage device housing 26.
Further, top cover 22 is arranged to at least partially enclose/house a controller assembly as further described now with reference to FIG. 3. In FIG. 3, a controller assembly 40 is arranged to connect to the PCB 24 from a rear side of the PCB 24 as shown in FIG. 2. As discernible from FIGS. 2 and 3, the controller assembly 40 is arranged to be positioned in the rackmount storage server 10 from a rear side of the rackmount storage server 10. In one or more embodiments of the present invention, the controller assembly 40 may be arranged having general purpose server architecture capable of running one or more general purpose applications.
Further, in one or more embodiments of the present invention, the controller assembly 40 may be arranged to support peripheral component interconnect (PCI) (e.g., PCI-X, PCI-Express) expansion slots. Accordingly, the controller assembly 40 may be provided with PCI I/O connectivity from a rear side of the rackmount storage server 10.
FIG. 4 shows an exploded perspective view of a controller assembly 40 in accordance with an embodiment of the present invention. The controller assembly 40 contains a bottom chassis portion 42 in which a connector card 44 is arranged to be positioned. The connector card 44 may be arranged to connect to the PCB 24 shown in FIG. 2. Further, a CPU board assembly 46 may be positioned on the connector card 44 as shown in FIG. 4. The CPU assembly 46 may include processors, memory devices or other such components. Either of the connector card 44 or the CPU board assembly 46 may have slots (or connectors) (shown, but not labeled) for various components (e.g., memory modules, PCI cards, application specific cards, network cards).
Referring back to FIG. 2, cooling devices 28 are positioned in the rackmount storage server 10 to provide and facilitate airflow in the rackmount storage server 10. FIG. 5 shows an exploded perspective view of a module 50 forming the cooling devices 28. The cooling device module 50 is formed of two separate fan units 52, 54. The two fan units 52, 54 are arranged to direct air into the rackmount storage server 10. In other words, the two fan units 52, 54 are arranged to direct cool air from a region exterior of the rackmount storage server 10 into an interior region of the rackmount storage server 10. However, in one or more embodiments of the present invention, one or both of the fan units 52, 54 may be arranged to direct air out from the rackmount storage server 10. In this case, hot air from within an interior region of the rackmount storage server 10 is directed to a region exterior of the rackmount storage server 10. In one or more embodiments of the invention, at least one fan directs air from a region exterior into the rackmount storage server 10, while another fan directs air from the interior of the rackmount storage server 10 to an exterior region.
Still referring to FIG. 5, the two fan units 52, 54 may be attached to a singular fan unit cover piece 56. The singular fan unit cover piece 56 may be arranged to filter out large particles from entering an interior region of the rackmount storage server 10. Further, in one or more embodiments of the present invention, the singular fan unit cover piece 56 may be arranged to attract smaller dust particles so as to prevent such particles from entering an interior region of the rackmount storage server 10. Further, a bracket piece 58 may be used for attaching the singular fan unit cover piece 56 (and accordingly, the two fan units 52, 54) to a front portion (not shown in FIG. 5, but discernible in FIG. 2) of the rackmount storage server 10.
Further, in one or more embodiments of the present invention, a built-in or integrated UPS battery may be incorporated in the rackmount storage server 10. The built-in UPS battery may be arranged to allow the rackmount storage server 10 to save data in a main memory to one or more of a plurality of hard disks in the rackmount storage server 10 in the case, for example, of a power failure.
Advantages of the present invention may include one or more of the following. In one or more embodiments of the present invention, a rackmount storage server has a combination of storage devices, a PCB, and a controller assembly that promotes operational performance and/or space and cooling efficiency.
In one or more embodiments of the present invention, one or more storage devices may be “plugged in” from a top side of a rackmount storage server thereby possibly easing the insertion and connection of the hard disks into the rackmount storage server. Further, the storage devices are hot-swappable.
In one or more embodiments of the present invention, a controller assembly of a rackmount storage server may be arranged with PCI card expansion slots for improved and/or desirable I/O.
In one or more embodiments of the present invention, a relatively large number of top-loading hard disks, e.g., 48 top-loading hard disks, may be used to provide data storage in a rackmount storage server.
In one or more embodiments of the present invention, a rackmount storage server may use a plurality of redundant cooling units to facilitate air flow in the rackmount storage server.
In one or more embodiments of the present invention, a rackmount storage server may use a plurality of redundant cooling unit to facilitate airflow throughout an interior region of the rackmount storage server.
In one or more embodiments of the present invention, a controller of a rackmount storage server may have general purpose architecture to run one or more general purpose applications.
In one or more embodiments of the present invention, an integrated battery in a rackmount storage server may be used to save data from volatile memory (e.g., main memory) to non-volatile memory (e.g., a hard disk) in case of a power failure.
A detailed example of a rackmount storage server in accordance with the present invention is presented below in the form of a product specification. This specification describes the functionality, major components and subsystems, external interfaces, and operation of a server known as the Sun Fire X4500 available from Sun Microsystems, Inc.
With 48 500 GB hard drives, the Sun Fire x4500 system has raw storage capacity of 24 terabytes in 4 U. The Sun Fire x4500 system has two (2) PCI-X expansion slots. Two 10GigE NICs are installed into the slots. There are four (4) 1000BaseT links. The disk array is controlled by a 2-socket (dual-core capable) MP AMD OpteronTM processor subsystem.
An overview of supported Sun Fire x4500 features is shown in Table 1.







TABLE 1







Sun Fire x4500 Feature Summary








Feature
Specification





Hard disks
48


supported


Hard disk type
Serial-ATA I


Processor
AMD64 Opteron (1 MByte L2 cache per CPU



chip) - dual core capable within power budget


Processor
Dual ONLY


Configurations


Memory Type
PC3200 400 MHz Registered DIMMs with ECC



PC2700 333 MHz Registered DIMMs with ECC


Memory Size
4 DDR-I DIMM slots per processor


Memory Capacities
512 MB, 1 GB, 2, or 4 GB per DIMM


Processor BIOS
STMicro 8 Mbit Flash with LPC Interface


Embedded Boot
Type-II Compact Flash slot (NOT hot-swappable)


Device


Service Processor
Motorola PowerPC 8248 @ 266 MHz


(SP)


SP Interface
10/100BaseT Ethernet port, I2C connection to



AMD8111,



Serial port [serial port is multiplexed with the main



serial port]


IO Ports
10/100/1000BaseT Ethernet (RJ45 Connector) × 4



10/100BaseT Ethernet (RJ45 Connector) [for SP]



RS-232 Serial Interface (RJ45 Connector)



Four (4) USB 2.0 Ports (Type A Connector) (2x in



front and 2x in rear)



Video Port (VGA Connector)









The Sun Fire x4500 includes an extensive set of RAS (Reliability, Availability, and Serviceability) Features, such as: hot-swappable and redundant fans and power supplies, remote lights-out server management, remote boot and remote software upgrades. The RAS feature also has Intelligent Systems Management including: SP (Service Processor), TPM (Trusted Platform Module), ECC Memory and Cache, and Predictive Failure Analysis, Hot-swap Fans, Hot-swap Power Supplies, Temperature and Voltage Monitoring, and KVM Redirection over Ethernet.
FIG. 6 illustrates the mechanical layout of the Sun Fire x4500, which is implemented in a custom 4 U rack-mountable chassis 60. The chassis 60 provides one controller FRU slot, one disk backplane, five fan trays 62, two power supplies in a 1+1 redundant configuration with an extra slot for a battery backup unit 64, and 48 disk slots 66. The five fan trays 62, each containing two individual fans, provide cooling for the system. In one embodiment, the fans can provide 300 CFM of airflow, from the front to the back of the chassis 60. The fan speed is variable, adjusting for the ambient conditions, the number of disks, and the system load. The system tolerates a single fan failure without compromising the cooling. Fan trays are hot-swappable. The power supplies may have additional fans to provide cooling during standby mode. Sun Fire x4500 provides module-level redundancy and hot-swappability for the power supplies and the hard drives. The Sun Fire x4500 provides the external interfaces described in Table 2.







TABLE 1







Sun Fire x4500 External Interfaces












Connector



Type
Qty
Type
Description





133 MHz PCI-X Slots
2
64-bit PCI-X



10/100/1000BaseT
4
RJ45


Ethernet


10/100BaseT Ethernet
1
RJ45
Management port for SP


RS-232 serial port
1
RJ45
Console port (multiplexed)


USB
4
USB Type A
2x in front, 2x in rear


Compact Flash
1
50-pin
Compact Flash for CPU file




Type-II CF
system


220 V AC input
3
Standard
AC input located on




IEC-320
power supply




connector









Sun Fire x4500 consists of two major components as shown in FIG. 7. The first major component is the Controller Assembly 70, which contains the network interfaces, the processors, and the disk controllers, along with all management functionality. A Service Processor connected to the I/O Card monitors the status of the system and can be queried regardless of the state of rest of the system as long as there is standby power from one of the main supplies. The second major component of the system is the disk backplane 71, which contains the power and data connections for all of the hard drives, as well as the connections to the main power supplies, the battery backup unit, and fans. All of the hard drives are Serial ATA hard drives and support hot-swapping. The fan controller/driver resides on the Controller Assembly 70, but the tachometer signals are monitored on the disk backplane.
A more detailed block diagram of the Sun Fire x4500 system is shown in FIG. 8. The Controller Assembly 70 includes an I/O-Board 80, a CPU-Board 81, a Graphics/SP-board 82, and a Service Processor 83. The I/O-board 80 contains the PCI-X Bridges, SouthBridge, S-ATA controllers and all I/O connectors. The CPU-board 81 contains the processors and the associated DDR DRAM memory. All of the control and datapath functionality, with the exception of the disks themselves, reside in the Controller Assembly 70. The Sun Fire x4500 includes two AMD OpteronTM processors, interconnected through AMD's HyperTransport technology. There are also HyperTransport links to PCI-X bridges and the AMD Southbridge, which connects to all standard I/O. All external connections, with the exception of power and the front USB ports, come into the Controller Assembly 70. In some cases, such as temperature, a separate interrupt immediately alerts the processors in case of a problem.
The Graphics/SP-board 82 plugs into a special slot on the I/O-board 80, and is connected to the Service Processor 83. The Service Processor (SP) 83 monitors the system and can report if there is a problem with the system, even if the main processors are not operating properly. The Service Processor 83 also monitors temperature and voltages, and has an RS-232 console port and an Ethernet management port for connectivity to the outside world. Service Processor 83 software detects fan failure, provides a front panel failure indication, generates a corresponding failure indication to the management system, and illuminates the individual fan failure LED indicator.
As discussed above, the disk backplane 71 contains the power and data connections for all of the hard drives, as well as the connections to the main power supplies, the battery backup unit and fans. All of the hard drives are Serial ATA hard drives and are hot-swappable. The individual power supplies connect to the disk backplane 71 through a power backplane 84. The I/O-board 80 connects to the disk backplane 71 through a combination of a Molex hi-speed dock connector and a PowerBlade connector. For all differential pairs, and for some of the single-ended control signals, two 144-circuit hi-speed dock connectors 90, 91 as shown in FIG. 9 are used. The fixed connector 90 is mounted on the disk backplane 71. The mating floating connector 91 is mounted on the I/O controller card 80. The I/O card 80 to disk backplane 71 connector pin-outs are set forth below in Tables 3 and 4.







TABLE 3







I/O Card to Disk Backplane Molex Hi-Speed Dock Connector Pin-out










Pin #
Pin Name







A1
FRONT_USB_P



A2
FRONT_USB_N



A3
5V_AUX



A4
PS2_BATT_L



A5
DISK36_TX_P



A6
DISK36_TX_N



A7
DISK24_RX_N



A8
DISK24_RX_P



A9
DISK36_ACT_LED_L



A10
DISK13_ACT_LED_L



A11
DISK0_TX_P



A12
DISK0_TX_N



A13
DISK1_TX_N



A14
DISK1_TX_P



A15
DISK25_RX_P



A16
DISK25_RX_N



A17
DISK37_TX_N



A18
DISK37_TX_P



A19
DISK25_ACT_LED_L



A20
DISK38_ACT_LED_L



A21
DISK14_RX_P



A22
DISK14_RX_N



A23
DISK26_TX_N



A24
DISK26_TX_P



A25
DISK3_RX_P



A26
DISK3_RX_N



A27
DISK15_TX_N



A28
DISK15_TX_P



A29
DISK3_ACT_LED_L



A30
DISK16_ACT_LED_L



A31
DISK39_RX_P



A32
DISK39_RX_N



A33
DISK4_TX_N



A34
DISK4_TX_P



A35
DISK28_RX_P



A36
DISK28_RX_N



A37
DISK40_TX_N



A38
DISK40_TX_P



A39
DISK28_ACT_LED_L



A40
DISK41_ACT_LED_L



A41
DISK17_RX_P



A42
DISK17_RX_N



A43
DISK29_TX_N



A44
DISK29_TX_P



A45
3_3AUX_IN



A46
GND



A47
3_3_AUX_SENSE_P



A48
3_3_AUX_SENSE_N



B1
SHORT_PIN1



B2
P3_3V



B3
5V_AUX



B4
GND



B5
DISK36_RX_N



B6
DISK36_RX_P



B7
DISK12_TX_P



B8
DISK12_TX_N



B9
DISK24_ACT_LED_L



B10
DISK1_ACT_LED_L



B11
DISK0_RX_N



B12
DISK0_RX_P



B13
DISK13_RX_P



B14
DISK13_RX_N



B15
DISK25_TX_N



B16
DISK25_TX_P



B17
DISK2_RX_P



B18
DISK2_RX_N



B19
DISK37_ACT_LED_L



B20
DISK26_ACT_LED_L



B21
DISK14_TX_N



B22
DISK14_TX_P



B23
DISK38_RX_P



B24
DISK38_RX_N



B25
DISK3_TX_N



B26
DISK3_TX_P



B27
DISK27_RX_P



B28
DISK27_RX_N



B29
DISK15_ACT_LED_L



B30
DISK4_ACT_LED_L



B31
DISK39_TX_N



B32
DISK39_TX_P



B33
DISK16_RX_P



B34
DISK16_RX_N



B35
DISK28_TX_N



B36
DISK28_TX_P



B37
DISK5_RX_P



B38
DISK5_RX_N



B39
DISK40_ACT_LED_L



B40
DISK29_ACT_LED_L



B41
DISK17_TX_N



B42
DISK17_TX_P



B43
DISK41_RX_P



B44
DISK41_RX_N



B45
3_3AUX_IN



B46
5V_DISK_SENSE_N



B47
5V_DISK_SENSE_P



B48
MAMMOTH_INT_L



C1
POWER_BUTTON_L



C2
LOCATE_BUTTON_L



C3
P5V



C4
GND



C5
DISK24_TX_P



C6
DISK24_TX_N



C7
DISK12_RX_N



C8
DISK12_RX_P



C9
DISK12_ACT_LED_L



C10
DISK0_ACT_LED_L



C11
DISK1_RX_P



C12
DISK1_RX_N



C13
DISK13_TX_N



C14
DISK13_TX_P



C15
DISK37_RX_P



C16
DISK37_RX_N



C17
DISK2_TX_N



C18
DISK2_TX_P



C19
DISK2_ACT_LED_L



C20
DISK14_ACT_LED_L



C21
DISK26_RX_P



C22
DISK26_RX_N



C23
DISK38_TX_N



C24
DISK38_TX_P



C25
DISK15_RX_P



C26
DISK15_RX_N



C27
DISK27_TX_N



C28
DISK27_TX_P



C29
DISK27_ACT_LED_L



C30
DISK39_ACT_LED_L



C31
DISK4_RX_P



C32
DISK4_RX_N



C33
DISK16_TX_N



C34
DISK16_TX_P



C35
DISK40_RX_P



C36
DISK40_RX_N



C37
DISK5_TX_N



C38
DISK5_TX_P



C39
DISK5_ACT_LED_L



C40
DISK17_ACT_LED_L



C41
DISK29_RX_P



C42
DISK29_RX_N



C43
DISK41_TX_N



C44
DISK41_TX_P



C45
3_3AUX_IN



C46
GND



C47
SP_I2C_CLK



C48
SP_I2C_DAT

















TABLE 4







I/O Card to Disk Backplane Molex Hi-Speed Dock Connector Pin-out










Pin #
Pin Name







A1
12V_SENSE_P



A2
12V_SENSE_N



A3
DISK6_RX_P



A4
DISK6_RX_N



A5
DISK18_TX_N



A6
DISK18_TX_P



A7
DISK6_ACT_LED_L



A8
DISK19_ACT_LED_L



A9
DISK42_RX_P



A10
DISK42_RX_N



A11
DISK7_TX_N



A12
DISK7_TX_P



A13
DISK31_RX_P



A14
DISK31_RX_N



A15
DISK43_TX_N



A16
DISK43_TX_P



A17
DISK31_ACT_LED_L



A18
DISK44_ACT_LED_L



A19
DISK20_RX_P



A20
DISK20_RX_N



A21
DISK32_TX_N



A22
DISK32_TX_P



A23
DISK9_RX_P



A24
DISK9_RX_N



A25
DISK21_TX_N



A26
DISK21_TX_P



A27
DISK9_ACT_LED_L



A28
DISK22_ACT_LED_L



A29
DISK45_RX_P



A30
DISK45_RX_N



A31
DISK10_TX_N



A32
DISK10_TX_P



A33
DISK34_RX_P



A34
DISK34_RX_N



A35
DISK46_TX_N



A36
DISK46_TX_P



A37
DISK34_ACT_LED_L



A38
DISK47_ACT_LED_L



A39
DISK23_RX_P



A40
DISK23_RX_N



A41
DISK35_TX_N



A42
DISK35_TX_P



A43
PS0_FAN_FAIL_L



A44
PS1_FAN_FAIL_L



A45
PS2_FAN_FAIL_L



A46
PS0_VIN_GOOD_L



A47
PS1_VIN_GOOD_L



A48
PS2_ENABLE_L



B1
3_3AUX_POWERGOOD



B2
PS1_ENABLE_L



B3
DISK6_TX_N



B4
DISK6_TX_P



B5
DISK30_RX_P



B6
DISK30_RX_N



B7
DISK18_ACT_LED_L



B8
DISK7_ACT_LED_L



B9
DISK42_TX_N



B10
DISK42_TX_P



B11
DISK19_RX_P



B12
DISK19_RX_N



B13
DISK31_TX_N



B14
DISK31_TX_P



B15
DISK8_RX_P



B16
DISK8_RX_N



B17
DISK43_ACT_LED_L



B18
DISK32_ACT_LED_L



B19
DISK20_TX_N



B20
DISK20_TX_P



B21
DISK44_RX_P



B22
DISK44_RX_N



B23
DISK9_TX_N



B24
DISK9_TX_P



B25
DISK33_RX_P



B26
DISK33_RX_N



B27
DISK21_ACT_LED_L



B28
DISK10_ACT_LED_L



B29
DISK45_TX_N



B30
DISK45_TX_P



B31
DISK22_RX_P



B32
DISK22_RX_N



B33
DISK34_TX_N



B34
DISK34_TX_P



B35
DISK11_RX_P



B36
DISK11_RX_N



B37
DISK46_ACT_LED_L



B38
DISK35_ACT_LED_L



B39
DISK23_TX_N



B40
DISK23_TX_P



B41
DISK47_RX_P



B42
DISK47_RX_N



B43
PS0_POWEROK



B44
PS0_PRESENT_L



B45
PS1_PRESENT_L



B46
PS2_PRESENT_L



B47
PS2_VIN_GOOD_L



B48
SHORT_PIN4



C1
VDD_RTC



C2
PS0_ENABLE_L



C3
DISK18_RX_P



C4
DISK18_RX_N



C5
DISK30_TX_N



C6
DISK30_TX_P



C7
DISK30_ACT_LED_L



C8
DISK42_ACT_LED_L



C9
DISK7_RX_P



C10
DISK7_RX_N



C11
DISK19_TX_N



C12
DISK19_TX_P



C13
DISK43_RX_P



C14
DISK43_RX_N



C15
DISK8_TX_N



C16
DISK8_TX_P



C17
DISK8_ACT_LED_L



C18
DISK20_ACT_LED_L



C19
DISK32_RX_P



C20
DISK32_RX_N



C21
DISK44_TX_N



C22
DISK44_TX_P



C23
DISK21_RX_P



C24
DISK21_RX_N



C25
DISK33_TX_N



C26
DISK33_TX_P



C27
DISK33_ACT_LED_L



C28
DISK45_ACT_LED_L



C29
DISK10_RX_P



C30
DISK10_RX_N



C31
DISK22_TX_N



C32
DISK22_TX_P



C33
DISK46_RX_P



C34
DISK46_RX_N



C35
DISK11_TX_N



C36
DISK11_TX_P



C37
DISK11_ACT_LED_L



C38
DISK23_ACT_LED_L



C39
DISK35_RX_P



C40
DISK35_RX_N



C41
DISK47_TX_N



C42
DISK47_TX_P



C43
PS1_POWEROK



C44
PS2_POWEROK



C45
PS0_FAIL



C46
PS1_FAIL



C47
PS2_FAIL



C48
INTRUSION_SW










The I/O Card to disk backplane PowerBlade connector pin-out is set forth below in Table 5. The connector has 10 blades with a 30 A limit per blade. There are 20 signals pins. Three blades are used for 12V, giving a 90 A capability. Two blades are used for 5V, resulting in a 60 A capability.







TABLE 5







I/O Card to Disk Backplane PowerBlade Connector Pin-out














Pin #
Pin Name
Pin #
Pin Name
Pin #
Pin Name
Pin #
Pin Name











Blade 1
5V_DISK


Blade 2
5V_DISK


Blade 3
GND


Blade 4
GND


Blade 5
GND














A1
FAN4_CTL0
B1
FAN4_CTL0
C1
FAN4_CTL1
D1
FAN4_CTL1


A2
FAN3_CTL0
B2
FAN3_CTL0
C2
FAN3_CTL1
D2
FAN3_CTL1


A3
FAN2_CTL0
B3
FAN2_CTL0
C3
FAN2_CTL1
D3
FAN2_CTL1


A4
FAN1_CTL0
B4
FAN1_CTL0
C4
FAN1_CTL1
D4
FAN1_CTL1


A5
FAN0_CTL0
B5
FAN0_CTL0
C5
FAN0_CTL1
D5
FAN0_CTL1








Blade 6
+12 V


Blade 7
GND


Blade 8
+12 V


Blade 9
GND


Blade 10
+12 V









The Mezzanine Connector Pin-outs are set forth below in Tables 6-9.







TABLE 6







I/O Card to Processor Card Mezzanine Connector Pin-out








Pin #
Pin Name











1
PROC0_PCIX0_HTDATA0_P


2
PROC0_PCIX0_HTDATA8_P


3
PROC0_PCIX0_HTDATA0_N


4
PROC0_PCIX0_HTDATA8_N


5
GND


6
GND


7
PROC0_PCIX0_HTDATA1_P


8
PROC0_PCIX0_HTDATA9_P


9
PROC0_PCIX0_HTDATA1_N


10
PROC0_PCIX0_HTDATA9_N


11
GND


12
GND


13
PROC0_PCIX0_HTDATA2_P


14
PROC0_PCIX0_HTDATA10_P


15
PROC0_PCIX0_HTDATA2_N


16
PROC0_PCIX0_HTDATA10_N


17
GND


18
GND


19
PROC0_PCIX0_HTDATA3_P


20
PROC0_PCIX0_HTDATA11_P


21
PROC0_PCIX0_HTDATA3_N


22
PROC0_PCIX0_HTDATA11_N


23
GND


24
GND


25
PROC0_PCIX0_HTCLK0_P


26
PROC0_PCIX0_HTCLK1_P


27
PROC0_PCIX0_HTCLK0_N


28
PROC0_PCIX0_HTCLK1_N


29
GND


30
GND


31
PROC0_PCIX0_HTDATA4_P


32
PROC0_PCIX0_HTDATA12_P


33
PROC0_PCIX0_HTDATA4_N


34
PROC0_PCIX0_HTDATA12_N


35
GND


36
GND


37
PROC0_PCIX0_HTDATA5_P


38
PROC0_PCIX0_HTDATA13_P


39
PROC0_PCIX0_HTDATA5_N


40
PROC0_PCIX0_HTDATA13_N


41
GND


42
GND


43
PROC0_PCIX0_HTDATA6_P


44
PROC0_PCIX0_HTDATA14_P


45
PROC0_PCIX0_HTDATA6_N


46
PROC0_PCIX0_HTDATA14_N


47
GND


48
GND


49
PROC0_PCIX0_HTDATA7_P


50
PROC0_PCIX0_HTDATA15_P


51
PROC0_PCIX0_HTDATA7_N


52
PROC0_PCIX0_HTDATA15_N


53
GND


54
GND


55
PROC0_PCIX0_HTCTL_P


56
NO CONNECT


57
PROC0_PCIX0_HTCTL_N


58
NO CONNECT


59
GND


60
GND


61
PCIX0_PROC0_HTCTL_P


62
NO CONNECT


63
PCIX0_PROC0_HTCTL_N


64
NO CONNECT


65
GND


66
GND


67
PCIX0_PROC0_HTDATA7_P


68
PCIX0_PROC0_HTDATA15_P


69
PCIX0_PROC0_HTDATA7_N


70
PCIX0_PROC0_HTDATA15_N


71
GND


72
GND


73
PCIX0_PROC0_HTDATA6_P


74
PCIX0_PROC0_HTDATA14_P


75
PCIX0_PROC0_HTDATA6_N


76
PCIX0_PROC0_HTDATA14_N


77
GND


78
GND


79
PCIX0_PROC0_HTDATA5_P


80
PCIX0_PROC0_HTDATA13_P


81
PCIX0_PROC0_HTDATA5_N


82
PCIX0_PROC0_HTDATA13_N


83
GND


84
GND


85
PCIX0_PROC0_HTDATA4_P


86
PCIX0_PROC0_HTDATA12_P


87
PCIX0_PROC0_HTDATA4_N


88
PCIX0_PROC0_HTDATA12_N


89
GND


90
GND


91
PCIX0_PROC0_HTCLK0_P


92
PCIX0_PROC0_HTCLK1_P


93
PCIX0_PROC0_HTCLK0_N


94
PCIX0_PROC0_HTCLK1_N


95
GND


96
GND


97
PCIX0_PROC0_HTDATA3_P


98
PCIX0_PROC0_HTDATA11_P


99
PCIX0_PROC0_HTDATA3_N


100
PCIX0_PROC0_HTDATA11_N


101
GND


102
GND


103
PCIX0_PROC0_HTDATA2_P


104
PCIX0_PROC0_HTDATA10_P


105
PCIX0_PROC0_HTDATA2_N


106
PCIX0_PROC0_HTDATA10_N


107
GND


108
GND


109
PCIX0_PROC0_HTDATA1_P


110
PCIX0_PROC0_HTDATA9_P


111
PCIX0_PROC0_HTDATA1_N


112
PCIX0_PROC0_HTDATA9_N


113
GND


114
GND


115
PCIX0_PROC0_HTDATA0_P


116
PCIX0_PROC0_HTDATA8_P


117
PCIX0_PROC0_HTDATA0_N


118
PCIX0_PROC0_HTDATA8_N


119
GND


120
GND
















TABLE 7







I/O Card to Processor Card Mezzanine Connector Pin-out








Pin #
Pin Name











1
PROC0_PCIX2_HTCTL_N


2
NO CONNECT


3
PROC0_PCIX2_HTCTL_P


4
NO CONNECT


5
GND


6
GND


7
PROC0_PCIX2_HTDATA7_N


8
PROC0_PCIX2_HTDATA15_N


9
PROC0_PCIX2_HTDATA7_P


10
PROC0_PCIX2_HTDATA15_P


11
GND


12
GND


13
PROC0_PCIX2_HTDATA6_N


14
PROC0_PCIX2_HTDATA14_N


15
PROC0_PCIX2_HTDATA6_P


16
PROC0_PCIX2_HTDATA14_P


17
GND


18
GND


19
PROC0_PCIX2_HTDATA5_N


20
PROC0_PCIX2_HTDATA13_N


21
PROC0_PCIX2_HTDATA5_P


22
PROC0_PCIX2_HTDATA13_P


23
GND


24
GND


25
PROC0_PCIX2_HTDATA4_N


26
PROC0_PCIX2_HTDATA12_N


27
PROC0_PCIX2_HTDATA4_P


28
PROC0_PCIX2_HTDATA12_P


29
GND


30
GND


31
PROC0_PCIX2_HTCLK0_N


32
PROC0_PCIX2_HTCLK1_N


33
PROC0_PCIX2_HTCLK0_P


34
PROC0_PCIX2_HTCLK1_P


35
GND


36
GND


37
PROC0_PCIX2_HTDATA3_N


38
PROC0_PCIX2_HTDATA11_N


39
PROC0_PCIX2_HTDATA3_P


40
PROC0_PCIX2_HTDATA11_P


41
GND


42
GND


43
PROC0_PCIX2_HTDATA2_N


44
PROC0_PCIX2_HTDATA10_N


45
PROC0_PCIX2_HTDATA2_P


46
PROC0_PCIX2_HTDATA10_P


47
GND


48
GND


49
PROC0_PCIX2_HTDATA1_N


50
PROC0_PCIX2_HTDATA9_N


51
PROC0_PCIX2_HTDATA1_P


52
PROC0_PCIX2_HTDATA9_P


53
GND


54
GND


55
PROC0_PCIX2_HTDATA0_N


56
PROC0_PCIX2_HTDATA8_P


57
PROC0_PCIX2_HTDATA0_P


58
PROC0_PCIX2_HTDATA8_N


59
GND


60
GND


61
PCIX2_PROC0_HTDATA0_N


62
PCIX2_PROC0_HTDATA8_N


63
PCIX2_PROC0_HTDATA0_P


64
PCIX2_PROC0_HTDATA8_P


65
GND


66
GND


67
PCIX2_PROC0_HTDATA1_N


68
PCIX2_PROC0_HTDATA9_N


69
PCIX2_PROC0_HTDATA1_P


70
PCIX2_PROC0_HTDATA9_P


71
GND


72
GND


73
PCIX2_PROC0_HTDATA2_N


74
PCIX2_PROC0_HTDATA10_N


75
PCIX2_PROC0_HTDATA2_P


76
PCIX2_PROC0_HTDATA10_P


77
GND


78
GND


79
PCIX2_PROC0_HTDATA3_N


80
PCIX2_PROC0_HTDATA11_N


81
PCIX2_PROC0_HTDATA3_P


82
PCIX2_PROC0_HTDATA11_P


83
GND


84
GND


85
PCIX2_PROC0_HTCLK0_N


86
PCIX2_PROC0_HTCLK1_N


87
PCIX2_PROC0_HTCLK0_P


88
PCIX2_PROC0_HTCLK1_P


89
GND


90
GND


91
PCIX2_PROC0_HTDATA4_N


92
PCIX2_PROC0_HTDATA12_N


93
PCIX2_PROC0_HTDATA4_P


94
PCIX2_PROC0_HTDATA12_P


95
GND


96
GND


97
PCIX2_PROC0_HTDATA5_N


98
PCIX2_RROC0_HTDATA13_N


99
PCIX2_PROC0_HTDATA5_P


100
PCIX2_PROC0_HTDATA13_P


101
GND


102
GND


103
PCIX2_PROC0_HTDATA6_N


104
PCIX2_PROC0_HTDATA14_N


105
PCIX2_PROC0_HTDATA6_P


106
PCIX2_PROC0_HTDATA14_P


107
GND


108
GND


109
PCIX2_PROC0_HTDATA7_N


110
PCIX2_PROC0_HTDATA15_N


111
PCIX2_PROC0_HTDATA7_N


112
PCIX2_PROC0_HTDATA15_P


113
GND


114
GND


115
PCIX2_PROC0_HTCTL_N


116
NO CONNECT


117
PCIX2_PROC0_HTCTL_P


118
NO CONNECT


119
GND


120
GND


121
P12 V


122
P12 V


123
P12 V


124
P12 V


125
P12 V


126
P12 V


127
P12 V


128
P12 V


129
P12 V


130
P12 V


131
P12 V


132
P12 V


133
P12 V


134
P12 V


135
P12 V


136
P12 V


137
P12 V


138
P12 V


139
P12 V


140
P12 V


141
P12 V


142
P12 V


143
P12 V


144
P12 V


145
P12 V


146
P1_2 V


147
P12 V


148
P1_2 V


149
P12 V


150
P1_2 V


151
P12 V


152
P1_2 V


153
P12 V


154
P1_2 V


155
P12 V


156
P1_2 V


157
P12 V


158
P1_2 V


159
P12 V


160
P1_2 V


161
P12 V


162
P1_2 V


163
P12 V


164
P1_2 V


165
P12 V


166
P1_2 V


167
P12 V


168
P1_2 V


169
P12 V


170
P3_3V


171
P12 V


172
P3_3V


173
P12 V


174
3_3 AUX


175
P12 V


176
3_3 AUX


177
P12 V


178
3_3 AUX


179
P12 V


180
3_3 AUX
















TABLE 8







I/O Card to Processor Card Mezzanine Connector Pin-out








Pin #
Pin Name











1
PCIX3_PROC1_HTDATA0_P


2
PCIX3_PROC1_HTDATA8_P


3
PCIX3_PROC1_HTDATA0_N


4
PCIX3_PROC1_HTDATA8_N


5
GND


6
GND


7
PCIX3_PROC1_HTDATA1_P


8
PCIX3_PROC1_HTDATA9_P


9
PCIX3_PROC1_HTDATA1_N


10
PCIX3_PROC1_HTDATA9_N


11
GND


12
GND


13
PCIX3_PROC1_HTDATA2_P


14
PCIX3_PROC1_HTDATA10_P


15
PCIX3_PROC1_HTDATA2_N


16
PCIX3_PROC1_HTDATA10_N


17
GND


18
GND


19
PCIX3_PROC1_HTDATA3_P


20
PCIX3_PROC1_HTDATA11_P


21
PCIX3_PROC1_HTDATA3_N


22
PCIX3_PROC1_HTDATA11_N


23
GND


24
GND


25
PCIX3_PROC1_HTCLK0_P


26
PCIX3_PROC1_HTCLK1_P


27
PCIX3_PROC1_HTCLK0_N


28
PCIX3_PROC1_HTCLK1_N


29
GND


30
GND


31
PCIX3_PROC1_HTDATA4_P


32
PCIX3_PROC1_HTDATA12_P


33
PCIX3_PROC1_HTDATA4_N


34
PCIX3_PROC1_HTDATA12_N


35
GND


36
GND


37
PCIX3_PROC1_HTDATA5_P


38
PCIX3_PROC1_HTDATA13_P


39
PCIX3_PROC1_HTDATA5_N


40
PCIX3_PROC1_HTDATA13_N


41
GND


42
GND


43
PCIX3_PROC1_HTDATA6_P


44
PCIX3_PROC1_HTDATA14_P


45
PCIX3_PROC1_HTDATA6_N


46
PCIX3_PROC1_HTDATA14_N


47
GND


48
GND


49
PCIX3_PROC1_HTDATA7_P


50
PCIX3_PROC1_HTDATA15_P


51
PCIX3_PROC1_HTDATA7_N


52
PCIX3_PROC1_HTDATA15_N


53
GND


54
GND


55
PCIX3_PROC1_HTCTL_P


56
NO CONNECT


57
PCIX3_PROC1_HTCTL_N


58
NO CONNECT


59
GND


60
GND


61
PROC1_PCIX3_HTCTL_P


62
NO CONNECT


63
PROC1_PCIX3_HTCTL_N


64
NO CONNECT


65
GND


66
GND


67
PROC1_PCIX3_HTDATA7_P


68
PROC1_PCIX3_HTDATA15_P


69
PROC1_PCIX3_HTDATA7_N


70
PROC1_PCIX3_HTDATA15_N


71
GND


72
GND


73
PROC1_PCIX3_HTDATA6_P


74
PROC1_PCIX3_HTDATA14_P


75
PROC1_PCIX3_HTDATA6_N


76
PROC1_PCIX3_HTDATA14_N


77
GND


78
GND


79
PROC1_PCIX3_HTDATA5_P


80
PROC1_PCIX3_HTDATA13_P


81
PROC1_PCIX3_HTDATA5_N


82
PROC1_PCIX3_HTDATA13_N


83
GND


84
GND


85
PROC1_PCIX3_HTDATA4_P


86
PROC1_PCIX3_HTDATA12_P


87
PROC1_PCIX3_HTDATA4_N


88
PROC1_PCIX3_HTDATA12_N


89
GND


90
GND


91
PROC1_PCIX3_HTCLK0_P


92
PROC1_PCIX3_HTCLK1_P


93
PROC1_PCIX3_HTCLK0_N


94
PROC1_PCIX3_HTCLK1_N


95
GND


96
GND


97
PROC1_PCIX3_HTDATA3_P


98
PROC1_PCIX3_HTDATA11_P


99
PROC1_PCIX3_HTDATA3_N


100
PROC1_PCIX3_HTDATA11_N


101
GND


102
GND


103
PROC1_PCIX3_HTDATA2_P


104
PROC1_PCIX3_HTDATA10_P


105
PROC1_PCIX3_HTDATA2_N


106
PROC1_PCIX3_HTDATA10_N


107
GND


108
GND


109
PROC1_PCIX3_HTDATA1_P


110
PROC1_PCIX3_HTDATA9_P


111
PROC1_PCIX3_HTDATA1_N


112
PROC1_PCIX3_HTDATA9_N


113
GND


114
GND


115
PROC1_PCIX3_HTDATA0_P


116
PROC1_PCIX3_HTDATA8_P


117
PROC1_PCIX3_HTDATA0_N


118
PROC1_PCIX3_HTDATA8_N


119
GND


120
GND
















TABLE 9







I/O Card to Processor Card Mezzanine Connector Pin-out








Pin #
Pin Name











1
PCIX1_PROC1_HTCTL_N


2
NO CONNECT


3
PCIX1_PROC1_HTCTL_P


4
NO CONNECT


5
GND


6
GND


7
PCIX1_PROC1_HTDATA7_N


8
PCIX1_PROC1_HTDATA15_N


9
PCIX1_PROC1_HTDATA7_P


10
PCIX1_PROC1_HTDATA15_P


11
GND


12
GND


13
PCIX1_PROC1_HTDATA6_N


14
PCIX1_PROC1_HTDATA14_N


15
PCIX1_PROC1_HTDATA6_P


16
PCIX1_PROC1_HTDATA14_P


17
GND


18
GND


19
PCIX1_PROC1_HTDATA5_N


20
PCIX1_PROC1_HTDATA13_N


21
PCIX1_PROC1_HTDATA5_P


22
PCIX1_PROC1_HTDATA13_P


23
GND


24
GND


25
PCIX1_PROC1_HTDATA4_N


26
PCIX1_PROC1_HTDATA12_N


27
PCIX1_PROC1_HTDATA4_P


28
PCIX1_PROC1_HTDATA12_P


29
GND


30
GND


31
PCIX1_PROC1_HTCLK0_N


32
PCIX1_PROC1_HTCLK1_N


33
PCIX1_PROC1_HTCLK0_P


34
PCIX1_PROC1_HTCLK1_P


35
GND


36
GND


37
PCIX1_PROC1_HTDATA3_N


38
PCIX1_PROC1_HTDATA11_N


39
PCIX1_PROC1_HTDATA3_P


40
PCIX1_PROC1_HTDATA11_P


41
GND


42
GND


43
PCIX1_PROC1_HTDATA2_N


44
PCIX1_PROC1_HTDATA10_N


45
PCIX1_PROC1_HTDATA2_P


46
PCIX1_PROC1_HTDATA10_P


47
GND


48
GND


49
PCIX1_PROC1_HTDATA1_N


50
PCIX1_PROC1_HTDATA9_N


51
PCIX1_PROC1_HTDATA1_P


52
PCIX1_PROC1_HTDATA9_P


53
GND


54
GND


55
PCIX1_PROC1_HTDATA0_N


56
PCIX1_PROC1_HTDATA8_N


57
PCIX1_PROC1_HTDATA0_P


58
PCIX1_PROC1_HTDATA8_P


59
GND


60
GND


61
PROC1_PCIX1_HTDATA0_N


62
PROC1_PCIX1_HTDATA8_N


63
PROC1_PCIX1_HTDATA0_P


64
PROC1_PCIX1_HTDATA8_P


65
GND


66
GND


67
PROC1_PCIX1_HTDATA1_N


68
PROC1_PCIX1_HTDATA9_N


69
PROC1_PCIX1_HTDATA1_P


70
PROC1_PCIX1_HTDATA9_P


71
GND


72
GND


73
PROC1_PCIX1_HTDATA2_N


74
PROC1_PCIX1_HTDATA10_N


75
PROC1_PCIX1_HTDATA2_P


76
PROC1_PCIX1_HTDATA10_P


77
GND


78
GND


79
PROC1_PCIX1_HTDATA3_N


80
PROC1_PCIX1_HTDATA11_N


81
PROC1_PCIX1_HTDATA3_P


82
PROC1_PCIX1_HTDATA11_P


83
GND


84
GND


85
PROC1_PCIX1_HTCLK0_N


86
PROC1_PCIX1_HTCLK1_N


87
PROC1_PCIX1_HTCLK0_P


88
PROC1_PCIX1_HTCLK1_P


89
GND


90
GND


91
PROC1_PCIX1_HTDATA4_N


92
PROC1_PCIX1_HTDATA12_N


93
PROC1_PCIX1_HTDATA4_P


94
PROC1_PCIX1_HTDATA12_P


95
GND


96
GND


97
PROC1_PCIX1_HTDATA5_N


98
PROC1_PCIX1_HTDATA13_N


99
PROC1_PCIX1_HTDATA5_P


100
PROC1_PCIX1_HTDATA13_P


101
GND


102
GND


103
PROC1_PCIX1_HTDATA6_N


104
PROC1_PCIX1_HTDATA14_N


105
PROC1_PCIX1_HTDATA6_P


106
PROC1_PCIX1_HTDATA14_P


107
GND


108
GND


109
PROC1_PCIX1_HTDATA7_N


110
PROC1_PCIX1_HTDATA15_N


111
PROC1_PCIX1_HTDATA7_P


112
PROC1_PCIX1_HTDATA15_P


113
GND


114
GND


115
PROC1_PCIX1_HTCTL_N


116
NO CONNECT


117
PROC1_PCIX1_HTCTL_P


118
NO CONNECT


119
GND


120
GND


121
PROC0_I2C_CLK


122
THERM_L


123
PROC0_I2C_DAT


124
SYSMON_INT_L


125
GND


126
GND


127
PROC1_I2C_CLK


128
P0_CORE_POWERGOOD


129
PROC1_I2C_DAT


130
P1_CORE_POWERGOOD


131
GND


132
GND


133
SP_I2C_CLK


134
THERMTRIP_L


135
SP_I2C_DAT


136
SP HDT_ENABLE_L


137
GND


138
GND


139
PROC0_PRESENT


140
DDR_A_POWERGOOD_L


141
PROC1_PRESENT


142
DDR_B_POWERGOOD_L


143
HDT_LDTRST_L


144
GND


145
PROC0_LDTRST_L


146
PROC1_LDTRST_L


147
PROC0_LDTSTOP_L


148
PROC1_LDTSTOP_L


149
GND


150
GND


151
PROC_PWROK


152
PROC0_CORE_ENABLE


153
SP_HDT_TRST_L


154
PROC1_CORE_ENABLE


155
GND


156
GND


157
SP_HDT_TCK


158
DDR_A_ENABLE


159
SP_HDT_TMS


160
DDR_B_ENABLE


161
GND


162
GND


163
SP_HDT_TDI


164
P0_VRM_PRESENT_L


165
PROC0_PROC1_TDX


166
P1_VRM_PRESENT_L


167
GND


168
GND


169
SP_PROC0_DBREQ_L


170
PROC0_DBREQ_P


171
PROC0_DBRDY


172
PROC0_CLK_N


173
GND


174
GND


175
V_RTC_BATT


176
PROC1_CLK_P


177
MEZZ_SENSE_L


178
PROC1_CLK_N


179
GND


180
GND









FIG. 10 shows the face plate 100 for the Controller Assembly. Three printed circuit boards (PCBs) are included in this assembly and all of the other assemblies/field replaceable units plug into these PCBs. The three PCBs are the disk backplane, the power backplane, and the indicator board. The disk backplane connects to the System Controller Assembly, the hard drives, and the fan trays. The disk backplane also includes the front USB ports. The power backplane connects to the three power supplies which provide power to the disk backplane. The disk backplane serves as the central point for the chassis. All field replaceable units plug into the disk backplane.
The Power Backplane-to-Disk Backplane Connector Pin-out is set forth below in Table 10. The connector has 10 blades with a 30 A limit per blade. There are 24 signals pins. Five blades are used for 12V, giving a 150 A capability.







TABLE 10







Power Backplane to Disk Backplane Connector Pin-out











Signal Name
Signal Type
Pin Count







+12 V
Power
5 blades



I2C (SCL, SDA)
Bi-directional
2




data



Intrusion Detection
Input
1



Enable
Input
4 (1 reserved)



Fail
Output
4 (1 reserved)



Presence Detect
Input
4 (1 reserved)



Front Panel LEDs
Input
4



Spare

4



Ground
Ground
5 blades










The Power Supply Connector Pin-out is set forth below in Table 11.







TABLE 11







Power Supply Output Connector Pin-out











Pin #
Pin Name
Description







P1
12 V
12 V Power Output (Blade)



P2
12 V
12 V Power Output (Blade)



A1
SCL
EEPROM Serial Clock Input



B1
SDA
EEPROM Serial Data I/O



C1
A0
EEPROM LSB Address Input



D1
12VRS
12 V Remote Sense



A2
A1
EEPROM Address Bit 1 Input



B2
CS
12 V Current Share



C2
PF
Power Fail



D2
12VT
12 V Test



A3
NC
No Connect



B3
NC
No Connect



C3
NC
No Connect



D3
NC
No Connect



A4
NC
No Connect



B4
NC
No Connect



C4
NC
No Connect



D4
NC
No Connect



A5
NC
No Connect



B5
ID0
Power Supply ID Bit 0



C5
ID1
Power Supply ID Bit 1



D5
ID2
Power Supply ID Bit 2



A6
NC
No Connect



B6
NC
No Connect



C6
PCTL
Power Control (short pin - 0.170′′)



D6
12VRRS
12 V Return Remote Sense



7
12VR
Main Power Return (Blade)



8
12VR
Main Power Return (Blade)










The Controller Assembly includes an Inter-IC Communication bus (I2C), which is a 2-pin serial bus used to control some of the basic system management features. The I/O Board and Service Processor include EEPROMs, fan controllers, power supply monitors, etc., which are used to monitor the health and status of the system. In some cases, such as temperature, a separate interrupt immediately alerts the processors in case of a problem.
The CPLD, located on the I/O Board, handles Battery Backup failover. This is done to enable the quickest transition to battery power upon loss of AC power. The CPLD detects the type of unit in each power bay. Power bays 0 and 1 are power supplies. Power bay 2 can either be a power supply or a battery backup unit. The battery backup unit may be, as an example, an uninterruptible power supply (UPS) unit. A battery backup unit is indicated by assertion of the PS2_BATT_L signal (driven low). This signal is connected to Pin D4 of the power supply connectors and is grounded inside the battery backup unit.
When power-on sequence is initiated, the power supplies are enabled and the battery is not enabled. When all power supplies indicate failure, the CPLD will assert the ENABLE signal to the battery. The ENABLE signals going to the power supplies remain asserted. The Service Processor detects the switch to battery power and signals the operating system (OS) to power down after a given interval. During that interval, the CPLD will monitor the PS signals. If a power supply recovers and reasserts its POWEROK signal—either AC power is restored or a new power supply is installed—the CPLD disables the battery.
The Service Processor detects the failover to battery power and notifies the OS. The SP detects the failover to battery power by observing the POWEROK signal of the battery. If this is ever asserted, that means the system has switched to battery power. The SP waits for a given interval to determine whether AC power is restored or if a new power supply is inserted. If the time on battery power exceeds the given interval, the SP signals the OS to start a rapid shutdown.
Also, the SP logs the event. Thus, if too many power failure events occur, the SP can flag a problem. The SP also tracks the amount of time that the battery is powering the system, so that the battery can be replaced at the appropriate time. This information is stored in the EEPROM of the BBU. The OS has a rapid shutdown routine triggered by the SP notification. This shuts the system down within 4 minutes.
Connector pin-outs for various SunFire x4500 system connectors are set forth below. The USB connector is shown in FIG. 16 and the pin-outs are shown below in table 12.







TABLE 12







USB connector pin-out









Pin #
Pin Name
Description





1
+5 V
+5 V Supply


2
Data−
Negative side of differential pair for data


3
Data+
Positive side of differential pair for data


4
Gnd
Ground









The Serial connector is shown in FIG. 17 and the pin-outs are shown below in table 13.







TABLE 13







Serial connector pin-out









Pin #
Pin Name
Description





1
RTS
Ready To Send


2
DTR
Data Terminal Ready


3
TXD
Transmit Data


4
GND
Ground


5
GND
Ground


6
RXD
Receive Data


7
DSR
Data Set Ready


8
CTS
Clear To Send









The 10/100BaseT connector is shown in FIG. 18 and the pin-outs are shown below in table 14.







TABLE 14







1/100BaseT Connector pin-out









Pin #
Pin Name
Description





1
TX+
Positive Side of Transmit Data


2
TX−
Negative Side of Transmit Data


3
RX+
Positive Side of Receive Data


4
NC
No Connect


5
NC
No Connect


6
RX−
Negative Side of Receive Data


7
NC
No Connect


8
NC
No Connect









The 10/100/1000BaseT connector is shown in FIG. 19 and the pin-outs are shown below in table 15.







TABLE 15







10/100/1000BaseT Connector pin-out









Pin #
Pin Name
Description





1
TP0+
Positive Side of Data Pair 0


2
TP0−
Negative Side of Data Pair 0


3
TP1+
Positive Side of Data Pair 1


4
TP2+
Positive Side of Data Pair 2


5
TP2−
Negative Side of Data Pair 2


6
TP1−
Negative Side of Data Pair 1


7
TP3+
Positive Side of Data Pair 3


8
TP3−
Negative Side of Data Pair 3









The S-ATA connector is shown in FIG. 20 and the pin-outs are shown below in table 16.







TABLE 16





S-ATA connector pin-out


Pin-out Table







Signal Segment Key












Signal
S1
Gnd
2nd mate



Segment
S2
TX+
Transmit from PHY to




S3
TX−
hard drive




S4
Gnd
2nd mate




S5
RX−
Receive from hard




S6
RX+
drive to PHY




S7
Gnd
2nd mate







Signal Segment “L”


Central Connector Polarizer


Power Segment “L”












Power
P1
 3.3 V
Not Supported



Segment
P2
 3.3 V
Not Supported




P3
 3.3 V
Not Supported




P4
Gnd
1st mate




P5
Gnd
2nd mate




P6
Gnd
2nd mate




P7
 5.0 V
Pre-charge, 2nd mate




P8
 5.0 V




P9
 5.0 V




P10
Gnd
2nd mate




P11
Reserved
No connect




P12
Gnd
1st mate




P13
12.0 V
Pre-charge, 2nd mate




P14
12.0 V




P15
12.0 V







Power Segment Key









The VGA connector is shown in FIG. 21 and the pin-outs are shown below in table 17.







TABLE 17







VGA connector pin-out









Pin #
Pin Name
Description












1
RED
Red Video


2
GRN
Green Video


3
BLU
Blue Video


4
NC
No Connect


5
GND
Ground


6
R_GND
Red Video Return (Ground)


7
G_GND
Green Video Return (Ground)


8
B_GND
Blue Video Return (Ground)


9
KEY
No Pin


10
S_GND
Sync Return (Ground)


11
NC
No Connect


12
ID1
Monitor ID1


13
HSYNC
Horizontal Sync


14
VSYNC
Vertical Sync


15
ID2
Monitor ID2









While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that other embodiments can be devised which do not depart from the scope of the invention as disclosed herein. Accordingly, the scope of the invention should be limited only by the attached claims.

## Claims

1. A server, comprising:
a printed circuit board (PCB) disposed along an inside surface of the server, the PCB having a plurality of connectors adapted to be connected to a plurality of top-loading storage devices;
a controller assembly operatively connected to the PCB;
a plurality of redundant cooling units disposed along a first side portion of the server; and
an integrated battery arranged to store power for saving data in a main memory to at least one of the plurality of top-loading storage devices,
wherein the controller assembly includes at least one PCI expansion slot,
wherein the controller assembly is configured to detect failure of any one of the plurality of redundant cooling units, generate a corresponding failure indication, and illuminate a cooling unit failure LED, and
wherein the controller assembly is configured to generate an alert if more than a predetermined number of power failure events occur and track an amount of time that the integrated battery is powering the server.

2. The server of claim 1, wherein the controller assembly is operatively connected to the PCB from a rear side of the PCB.

3. The server of claim 1, wherein the PCB is a backplane.

4. The server of claim 3, wherein the backplane is disposed along an inside bottom surface of the server.

5. The server of claim 1, wherein the plurality of top-loading storage devices comprises 48 hard disks.

6. The server of claim 5, wherein the 48 hard disks are disposable in a 12×4 arrangement.

7. The server of claim 1, wherein the controller assembly comprises a general purpose architecture capable of running at least one general purpose application.

8. The server of claim 1, wherein the at least one PCI expansion slot is one of a PCI-X expansion slot and a PCI-Express expansion slot.

9. The server of claim 1, wherein at least one of the plurality of redundant cooling units is arranged to direct air into the server.

10. The server of claim 1, wherein the plurality of redundant cooling units comprises two rows of fans.

11. An apparatus, comprising:
a chassis;
a printed circuit board (PCB) having a first connector connectable to a second connector integral with a storage device insertable from a top portion of the chassis;
a controller assembly operatively connectable to a rear side of the PCB, the controller assembly being accessible from a rear side of the chassis;
a plurality of rows of cooling units disposed along a front portion of the chassis;
a disk carrier arranged to at least partially house the storage device; and
a battery backup unit operatively connected in an interior region of the chassis,
wherein the controller assembly includes at least one PCI expansion slot,
wherein the controller assembly is configured to detect failure of any one of the plurality of redundant cooling units, generate a corresponding failure indication, and illuminate a cooling unit failure LED, and
wherein the controller assembly is configured to generate an alert if more than a predetermined number of power failure events occur and track an amount of time that the integrated battery is powering the server.

12. The apparatus of claim 11, wherein the PCB is operatively connectable to 48 storage devices.

13. The apparatus of claim 12, wherein the 48 storage devices are operatively connectable to the PCB in a 12×4 configuration.

14. The apparatus of claim 11, wherein the controller assembly comprises a general purpose architecture capable of running at least one general purpose application.

15. The apparatus of claim 11, wherein the at least one PCI expansion slot is one of a PCI-X expansion slot and a PCI-Express expansion slot.

16. The apparatus of claim 11, wherein the controller assembly includes a CPU board assembly.

17. The apparatus of claim 11, wherein at least one of the plurality of rows of cooling units is arranged to direct air into the chassis.

18. The apparatus of claim 11, wherein the storage device is one of a SATA disk and a SAS disk.

19. The apparatus of claim 11, wherein the battery backup unit is an uninterruptible power supply.

20. A rackmount storage server, comprising:
a backplane;
top-loading hard disks each having a native connector pluggable into the backplane;
a controller assembly operatively connected to the backplane from a rear side of the backplane;
redundant fan units disposed along a front portion of the rackmount storage server and arranged to direct air into the rackmount storage server; and
an integrated UPS battery arranged to store power for saving data from a main memory to at least one of the top-loading hard disks,
wherein the controller assembly includes one of a PCI-X expansion slot and a PCI-Express expansion slot,
wherein the controller assembly is configured to detect failure of any one of the plurality of redundant cooling units, generate a corresponding failure indication, and illuminate a cooling unit failure LED, and
wherein the controller assembly is configured to generate an alert if more than a predetermined number of power failure events occur and track an amount of time that the integrated battery is powering the server.

21. The rackmount storage server of claim 20, wherein the backplane is a passive backplane.

22. The rackmount storage server of claim 20, wherein the top-loading hard disks are arranged in the rackmount storage server in 4 rows of 12 disks each.

23. The rackmount storage server of claim 20, wherein the controller assembly comprises a general purpose server architecture arranged to run at least one general purpose application.

24. The rackmount storage server of claim 20, wherein at least one of the top-loading hard disks comprises one of a SATA disk and a SAS disk.