# Patent

## Title
Resonator balancing in wireless power transfer systems

## Abstract

The disclosure features systems for wireless power transfer that include a resonator featuring a coil with at least two windings and at least one inductor having an inductance value, where the at least one inductor is connected in series to at least one of the windings, and where the inductance value is selected so that when the coil carries a current during operation of the system, the at least one inductor maintains a distribution of current flows among the at least two windings such that for each of the at least two windings, an actual current flow in the winding differs from a target current flow for the winding by 10% or less.

## Background
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority to U.S. Provisional Patent Application No. 62/022,133, filed on Jul. 8, 2014, and to U.S. Provisional Patent Application No. 62/051,647, filed on Sep. 17, 2014, the entire contents of each of which are incorporated herein by reference.


TECHNICAL FIELD
This disclosure relates to wireless power transfer systems and methods.
BACKGROUND
Energy can be transferred from a power source to a receiving device using a variety of known techniques such as radiative (far-field) techniques. For example, radiative techniques using low-directionality antennas can transfer a small portion of the supplied radiated power, namely, that portion in the direction of, and overlapping with, the receiving device used for pick up. In this example, most of the energy is radiated away in directions other than the direction of the receiving device, and typically the transferred energy is insufficient to power or charge the receiving device. In another example of radiative techniques, directional antennas are used to confine and preferentially direct the radiated energy towards the receiving device. In this case, an uninterruptible line-of-sight and potentially complicated tracking and steering mechanisms are used.
Another approach is to use non-radiative (near-field) techniques. For example, techniques known as traditional induction schemes do not (intentionally) radiate power, but use an oscillating current passing through a primary coil, to generate an oscillating magnetic near-field that induces currents in a near-by receiving or secondary coil. Traditional induction schemes can transfer modest to large amounts of power over very short distances. In these schemes, the offset tolerances between the power source and the receiving device are very small. Electric transformers and proximity chargers use these traditional induction schemes.
SUMMARY
In general, in a first aspect, the disclosure features systems for wireless power transfer that include: a resonator including a coil with at least two windings, each of the at least two windings featuring a plurality of loops formed by a conductive material and extending in a plane, where corresponding portions of each of the at least two windings are oriented in parallel, where at least one of the windings has a length that differs from a length of another one of the windings, and where the at least two windings are electrically connected in parallel; and at least one inductor having an inductance value, where the at least one inductor is connected in series to at least one of the windings, and where the inductance value is selected so that when the coil carries a current during operation of the system, the at least one inductor maintains a distribution of current flows among the at least two windings such that for each of the at least two windings, an actual current flow in the winding differs from a target current flow for the winding by 10% or less.
Embodiments of the systems can include any one or more of the following features.
The at least one inductor can include an adjustable inductance value. Corresponding portions of each of the at least two windings can be oriented in parallel along at least 80% of a length of at least one of the windings. The loops of each winding can be interleaved. The loops of each winding can be concentric and form a spiral.
The systems can include an electronic processor coupled to the at least two windings and configured to control electrical currents in each of the windings based on the target current flows for the at least two windings. The electronic processor can be configured to control electrical currents in each of the windings by: determining a target inductance value for the at least one inductor based on a figure of merit related to the target current flows; and adjusting the inductance value of the at least one inductor to match the target inductance value. The electronic processor can be configured to determine the target inductance value by: (i) for each one of the windings, determining a self-inductance value of the one winding based on a measurement of inductance of the one winding when it is electrically disconnected from all other windings, and determining a plurality of cross-inductance values of the one winding, where each cross-inductance value is based on a measurement of inductance of the one winding when it is electrically disconnected from another one of the windings; (ii) determining the target current flows for each of the windings based on the self-inductance values and the cross-inductance values; and (iii) determining the target inductance value based on the target current flows for each of the windings. The electronic processor can be configured to determine the target current flows by: constructing an inductance matrix based on the self-inductance values and the cross-inductance values of each of the windings; calculating an adjusted inductance matrix by adding to the inductance matrix an inductance modification matrix comprising elements that correspond to changes in inductance of each of the windings due to the at least one inductor; calculating an inverse matrix of the adjusted inductance matrix; and determining the target current flows based on the inverse matrix. The inductance modification matrix can be a diagonal matrix, and diagonal elements of the inductance modification matrix can be inductance values of respective members of the at least one inductor connected to the windings.
In another aspect, the disclosure features methods that include: controlling electrical currents in each of at least two windings of a resonator coil for wireless power transfer, where each of the at least two windings includes a plurality of loops formed by a conductive material and extending in a plane, where corresponding portions of each of the at least two windings are oriented in parallel, where at least one of the windings has a length that differs from a length of another one of the windings, where the at least two windings are electrically connected in parallel, and where at least one inductor having an inductance value is connected in series to at least one of the windings; and maintaining a distribution of current flows among the at least two windings when the coil carries a current such that for each of the at least two windings, an actual current flow in the winding differs from a target current flow for the winding by 10% or less.
Embodiments of the methods can include any one or more of the following features.
Corresponding portions of each of the at least two windings can be oriented in parallel along at least 80% of a length of at least one of the windings. The loops of each winding can be interleaved. The loops of each winding can be concentric and form a spiral.
The methods can include controlling electrical currents in each of the windings to maintain the distribution of current flows by: determining a target inductance value for the at least one inductor based on a figure of merit related to the target current flows; and adjusting the inductance value of the at least one inductor to match the target inductance value. The methods can include determining the target inductance value by: (i) for each one of the windings, determining a self-inductance value of the one winding based on a measurement of inductance of the one winding when it is electrically disconnected from all other windings, and determining a plurality of cross-inductance values of the one winding, where each cross-inductance value is based on a measurement of inductance of the one winding when it is electrically disconnected from another one of the windings; (ii) determining the target current flows for each of the windings based on the self-inductance values and the cross-inductance values; and (iii) determining the target inductance value based on the target current flows for each of the windings.
The methods can include determining the target current flows by: constructing an inductance matrix based on the self-inductance values and the cross-inductance values of each of the windings; calculating an adjusted inductance matrix by adding to the inductance matrix an inductance modification matrix featuring elements that correspond to changes in inductance of each of the windings due to the at least one inductor; calculating an inverse matrix of the adjusted inductance matrix; and determining the target current flows based on the inverse matrix. The inductance modification matrix can be a diagonal matrix, and diagonal elements of the inductance modification matrix can be inductance values of respective members of the at least one inductor connected to the windings.
In a further aspect, the disclosure features resonator coils for wireless power transfer that include a member formed of magnetic material and at least two windings electrically connected in parallel, each of the at least two windings featuring a plurality of loops formed by a conductive material, where the loops of each of the at least two windings are interleaved so that corresponding portions of each of the at least two windings are oriented in parallel along at least 80% of a length of at least one of the windings, and where each one winding of the at least two windings spatially overlaps at least one other winding at one or more points along a length of the one winding.
Embodiments of the coils can include any one or more of the following features.
The loops of each winding can be oriented in a plane. The loops of all windings can be oriented in a common plane. The loops of each winding can be concentric and can form a spiral. The loops of all windings can form a concentric spiral of loops.
The coils can include at least one inductor having an adjustable inductance connected in series to at least one of the windings. The coils can include at least one inductor having an adjustable inductance connected in series to each of the at least two windings. Each one winding of the at least two windings can spatially overlap each of the other windings at one or more points along the length of the one winding. For each one winding, the points at which the one winding overlaps the at least some of the other windings can be equally spaced along a circumference of the one winding.
The at least two windings can include n windings, each one winding of the n windings can spatially overlap each of the other n−1 windings along the length of the one winding, and each one winding of the n windings can include n−1 points of overlap with the other windings, each one of the points corresponding to overlap of the one winding with a different one of the other windings. The quantity n can be greater than two (e.g., greater than three).
The at least two windings can include n windings, and at least one winding of the n windings can include more than n−1 points of overlap with the other windings so that the at least one winding spatially overlaps at least some of the other n−1 windings more than once. The at least two windings can include n windings, and at least one winding of the n windings can include fewer than n−1 points of overlap with the other windings so that the at least one winding does not spatially overlap all of the other n−1 windings.
Embodiments of the systems, methods, and coils can also include any of the other features disclosed herein, including features disclosed in connection with different embodiments, in any combination as appropriate.
Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. In ease of conflict with publications, patent applications, patents, and other references mentioned or incorporated herein by reference, the present disclosure, including definitions, will control. Any of the features described above may be used, alone or in combination, without departing from the scope of this disclosure. Other features, objects, and advantages of the systems and methods disclosed herein will be apparent from the following detailed description and figures.



DESCRIPTION OF DRAWINGS
FIG. 1A is a schematic diagram of an embodiment of a wireless power transfer system.
FIG. 1B is a schematic diagram of a resonator for wireless power transfer.
FIGS. 2A-2C are schematic diagrams of a wireless power transfer system integrated into a vehicle.
FIGS. 3A and 3B are schematic diagrams showing a source resonator coil in proximity to a magnetic material.
FIG. 4 is a schematic diagram of a source resonator.
FIGS. 5A and 5B are schematic diagrams of devices configured to wirelessly receiver power.
FIGS. 6A and 6B are plots showing measurements of coupling k between a source resonator and a receiver resonator as a function of relative displacement of the resonators.
FIGS. 7A and 7B are plots showing figure-of-merit as a function of relative displacement between source and receiver resonators.
FIGS. 8A and 8B are plots showing measurements of coupling k as a function of relative displacement between source and receiver resonators.
FIGS. 9A and 9B are plots showing figure-of-merit as a function of relative displacement between source and receiver resonators.
FIGS. 10A and 10B are plots showing measurements of coupling k between a source resonator and a receiver resonator as a function of relative displacement of the resonators.
FIGS. 11A and 11B are plots showing figure-of-merit as a function of relative displacement between source and receiver resonators.
FIGS. 12A and 12B are plots showing measurements of coupling k between a source resonator and a receiver resonator as a function of relative displacement of the resonators.
FIGS. 13A and 13B are plots showing figure-of-merit as a function of relative displacement between source and receiver resonators.
FIGS. 14A and 14B are plots showing measurements of coupling k between a source resonator and a receiver resonator as a function of relative displacement of the resonators.
FIGS. 15A and 15B are plots showing quality factor as a function of relative displacement between source and receiver resonators.
FIGS. 16A and 16B are plots showing figure-of-merit as a function of relative displacement between source and receiver resonators.
FIGS. 17A and 17B are schematic diagrams of impedance matching networks.
FIGS. 18A and 18B are plots of device-side load impedance as a function of output voltage.
FIGS. 19A and 19B are plots of amplifier-to-battery efficiency as a function of output voltage.
FIGS. 20A and 20B are plots of power dissipated in a source and a device as a function of output voltage.
FIGS. 21A and 21B are plots of voltage measured across one or more capacitors in an impedance matching network.
FIGS. 22A and 22B are plots of the magnetic field amplitude in a magnetic member of a source resonator.
FIG. 23 is a schematic circuit diagram of an embodiment of device electronics.
FIGS. 24A and 24B are plots of a DC-DC boost conversion ratio as a function of output voltage.
FIGS. 25A and 25B are plots of amplifier-to-converter efficiency as a function of output voltage.
FIGS. 26A and 26B are plots of power dissipated in a source as a function of output voltage.
FIGS. 27A and 27B are plots of measured voltages across one or more matching network capacitors in a source.
FIGS. 28A and 28B are plots of the magnetic field in a magnetic member attached to a source.
FIGS. 29A-29D are schematic diagrams showing embodiments of resonators for wireless power transfer.
FIG. 30A is a plot of coupling rate as a function of source resonator coil winding length.
FIG. 30B is a plot of figure-of-merit as a function of source resonator coil winding length.
FIGS. 31A-31D are schematic diagrams of resonator coils.
FIG. 32A is a plot of coupling rate as a function of resonator coil winding gap-to-edge distance and span.
FIG. 32B is a plot of figure-of-merit as a function of resonator coil winding gap-to-edge distance and span.
FIGS. 33A and 33B are plots of coupling between source and device resonators as a function of offset between the resonators.
FIGS. 34A and 34B are plots of figure-of-merit for a wireless power transfer system as a function of offset between source and device resonators.
FIGS. 35A and 35B are schematic diagrams of impedance matching networks.
FIG. 36 is a plot showing a minimum number of capacitors for different impedance matching networks.
FIG. 37 is a schematic diagram of an impedance matching network.
FIG. 38 is a plot of figure-of-merit as a function of output voltage in an impedance-matched device.
FIG. 39 is a plot of power dissipated in source and receiver resonators that are impedance-matched.
FIG. 40 is a plot of maximum magnetic field in source and device resonators as a function of output voltage.
FIG. 41 is a plot of voltage across one or more capacitors of an impedance matching network in source and receiver resonators.
FIG. 42 is a schematic diagram showing an embodiment of a magnetic member.
FIG. 43 is an image of an embodiment of a resonator.
FIG. 44 is an image of an embodiment of a source resonator coil affixed to a magnetic member.
FIG. 45A is a schematic diagram of an embodiment of a magnetic member.
FIG. 45B is an image of an embodiment of a magnetic member.
FIG. 46 is an image of an embodiment of a device receiver resonator coil.
FIG. 47A is a schematic diagram of an embodiment of a source resonator coil.
FIG. 47B is a schematic diagram of an embodiment of a device resonator coil.
FIGS. 48A and 48B are schematic diagrams of embodiments of source resonator coils affixed to magnetic members.
FIG. 49 is an image of an embodiment of a resonator coil with parallel windings.
FIG. 50 is a plot of the magnetic field in the magnetic member of a source resonator.
FIG. 51 is a plot of the magnetic field in the magnetic member of a source resonator.
FIG. 52 is a plot of the magnetic field in the magnetic member of a source resonator.
FIG. 53 is a plot of the magnetic field in the magnetic member of a device resonator.
FIGS. 54A and 54B are plots of the magnetic field above a source resonator.
FIG. 55 is a plot of the magnetic field of FIGS. 54A and 54B on a logarithmic scale.
FIG. 56 is an image of a coil with parallel windings.
FIGS. 57A and 57B are schematic diagrams showing inductors connected in series with parallel windings of a coil.
FIG. 57C is a schematic diagram of a single inductor connected in series with one of several parallel windings of a coil.
FIGS. 58A and 58B are images showing temperature measurements for parallel windings in a coil.
FIG. 59 is a plot showing the current carried in each of the parallel windings of a coil as a function of time.
FIGS. 60A and 60B are plots showing measurements of coupling k between a source resonator and a receiver resonator as a function of relative displacement of the resonators.
FIGS. 61A and 61B are plots showing measurements of coupling k between a source resonator and a receiver resonator as a function of relative displacement of the resonators.
FIG. 62 is a schematic diagram of a receiver resonator.
FIG. 63 is a plot of Q-factor for source and receiver resonators as a function of a side length of a shield.
FIGS. 64A and 64B are plots of peak current through the diodes of a rectifier in an impedance matching network.
FIGS. 65A and 65B are plots of peak current through the diodes of a rectifer in an impedance matching network.
FIGS. 66A and 66B are plots showing the number of capacitors in a device's impedance matching network as a function of device inductance.
FIG. 67 is a schematic diagram of an impedance matching network.
FIG. 68 is a plot of figure of merit as a function of output voltage for an impedance matching network.
FIG. 69 is a plot of power dissipation in various components of a source.
FIG. 70 is a plot of power dissipation in various components of a device.
FIG. 71 is a plot of the magnetic field in a magnetic member as a function of output voltage.
FIG. 72 is a plot of voltages across capacitors in an impedance matching network as a function of output voltage.
FIG. 73 is a plot of electrical current through the source and device resonator coils as a function of output voltage.
FIG. 74 is a flow chart that includes a series of steps for current partitioning and balancing among parallel windings of a coil.
FIG. 75 is a schematic diagram of an electronic controller.



DETAILED DESCRIPTION
The wireless power transfer systems disclosed herein use one or more source resonators to generate oscillating magnetic fields. The oscillating magnetic fields are captured by, and induce electrical currents and voltages in, one or more receiving resonators. The receiving resonators can be coupled to loads, and the electrical currents and voltages can be used to drive the loads to do useful work. The receiving resonators can also act as relay resonators, further transmitting power wirelessly by generating additional oscillating magnetic fields.
Wireless power transfer systems can be integrated into a variety of devices and used for a wide range of power-demanding applications. For example, such systems can be integrated into electric vehicles and used to power and/or charge the vehicles. Such systems can also be used to power electronic devices, including fixed and portable devices, and can be integrated into a diverse range of structures including furniture (e.g., desks, tables) and structural features (e.g., floors, walls, columns, streets). The systems can provide power in quantities that range from very small amounts to significant quantities for high-power applications. For example, the systems disclosed herein may provide power greater than 1 kW, 3 kW, 5 kW, 10 kW, 20 kW, 50 kW, or more from one or more source resonators to one or more receiving resonators connected to electrical devices.
Introduction
FIG. 1A shows a schematic diagram of an embodiment of a wireless power transfer system 100 that includes a wireless power source 101 and device 107. Wireless power source 101 includes a source resonator 102 coupled to source electronics 104, which are connected to a power supply 106. Source electronics 104 can include a variety of components including an AC/DC converter, an amplifier, and an impedance matching network. Power supply 106 can include one or more of AC mains, solar panels, and one or more batteries. Not all of the components of power source 101 need to be present for operation, and in some embodiments, certain components shown in FIG. 1A can be integrated (source electronics 104 and power supply 106 can be integrated into a single component, for example).
Device 107 includes a device resonator 108 coupled to device electronics 110 to provide power to a load 112. Device electronics 110 can include a variety of components, such as a rectifier and/or an impedance matching network. Load 112 generally corresponds to any of a variety of power-dissipating electrical components, such as a battery and/or an electromechanical device. Not all of the components of device 107 need to be present for operation, and in some embodiments, certain components shown in FIG. 1A can be integrated (device electronics 110 and load 112 can be integrated into a single component, for example).
Source electronics 104 and device electronics 110 can each include one or more electronic processors (processors 105 and 111, respectively). Electronic processors 105 and 111 can perform a variety of monitoring, computation, and control functions. For example, as will be described in more detail subsequently, processors 105 and/or 111 can measure electrical parameters of various system components (by directing suitable control signals to various sensors), calculate various performance-related metrics and attributes based on measurement signals received from the sensors, and transmit control signals to various system components based on the calculated metrics and attributes. In general, processors 105 and 111 can be configured to perform any of the monitoring, computational, and control functions disclosed herein. In addition, or as an alternative, source electronics 104 and/or device electronics 111 can include dedicated electrical circuits (e.g., application-specific integrated circuits) and logic units (e.g., programmable logic arrays) that can be configured to perform any one or more of these functions.
Processors 105 and/or 111 can be coupled to one or more components of system 100 in various configurations. In some embodiments, processors 105 and/or 111 are coupled to system components via a direct electrical connection. In certain embodiments, processors 105 and/or 111 are coupled to system components via wireless communication (e.g., radio-frequency, Bluetooth communication). The coupling between the processors and the system components can be different for different system components. For example, processor 105 can be directly connected to power supply 106 and source resonator 102, and coupled wirelessly to device resonator 108 and/or device electronics 110.
Additional aspects and features of wireless power transfer systems are disclosed, for example, in the following, the entire contents of each of which are incorporated herein by reference: U.S. Patent Application Publication No. 2012/0119569; U.S. Patent Application Publication No. 2015/0051750; U.S. Pat. No. 8,772,973; U.S. Patent Application Publication No. 2010/0277121; and U.S. Pat. No. 8,598,743.
In some embodiments, processor 105 can direct power supply 106 to provide power to source resonator 102. For example, processor 105 can increase the power output of power supply 106, thereby increasing the power delivered to source resonator 102. The power output can be delivered at an operating frequency corresponding to a frequency of the oscillating magnetic field that is generated by source resonator 102.
In certain embodiments, processor 105 (and/or processor 111) can tune a resonant frequency of source resonator 102 and/or a resonant frequency of device resonator 108. By tuning resonant frequencies of the source and device resonators relative to the operating frequency of power supply 106, the efficiency of power transfer from power supply 106 to load 112 can be controlled. For example, processor 105 (and/or processor 111) can tune the resonant frequencies of source resonator 102 and/or device resonator 108 to be substantially the same (e.g., within 0.5%, within 1%, within 2%) to increase the efficiency of power transfer.
In some embodiments, processors 105 and/or 111 can tune the resonant frequencies by adjusting capacitance values of components in source resonator 102 and/or source electronics 104. Resonant frequencies can also be tuned by adjusting capacitance values of components in device resonator 108 and/or device electronics 110. For example, to tune the resonance frequency of source resonator 102, processor 105 can adjust a capacitance of a capacitor connected to a coil in source resonator 102. The adjustment can be based on a measurement of the resonance frequency by processor 105 and/or based on a communication signal transmitted from source resonator 102 and/or device resonator 108 to processor 105 (e.g., transmitted wirelessly). In certain embodiments, processor 105 can tune the resonant frequency of source resonator 102 to be substantially the same (e.g., within 0.5%, within 1%, within 2%) as the operating frequency of power supply 106. In some embodiments, processor 105 can tune the resonant frequency of source resonator 102 to be different from the operating frequency by 7% to 13% (e.g., 10% to 15%, 13% to 19%). Similar considerations apply to the tuning of the resonance frequency of device resonator 108 (e.g., by processor 111 and/or processor 105).
In some embodiments, processors 105 and/or 111 can control an impedance matching network in system 100 to adjust impedance matching conditions in the system, and thereby control the efficiency of power transfer. For example, processor 105 can tune the capacitance of capacitors or networks of capacitors in an impedance matching network connected between power supply 106 and source resonator 102 (e.g., as part of source electronics 104). Alternatively, or in addition, processor 105 can tune the inductance of inductors or networks of inductors in an impedance matching network. The optimum impedance conditions can be calculated by processor 105 and/or can be received from an external device.
Similarly, in certain embodiments, processor 111 can control impedance matching conditions by tuning the capacitance and/or inductance of capacitors and/or inductors, respectively, in an impedance matching network connected between device resonator 108 and load 112 (e.g., as part of device electronics 110). Additional aspects of frequency tuning and impedance matching networks are disclosed, for example, in U.S. Patent Application Publication No. 2015/0051750, the entire contents of which are incorporated herein by reference.
In this disclosure, “wireless energy transfer” from one coil (e.g., a resonator coil) to another coil (e.g., another resonator coil) refers to transferring energy to do useful work (e.g., electrical work, mechanical work, etc.) such as powering electronic devices, vehicles, lighting a light bulb or charging batteries. Similarly, “wireless power transfer” from one coil (e.g., resonator coil) to another resonator (e.g., another resonator coil) refers to transferring power to do useful work (e.g., electrical work, mechanical work, etc.) such as powering electronic devices, vehicles, lighting a light bulb or charging batteries. Both wireless energy transfer and wireless power transfer refer to the transfer (or equivalently, the transmission) of energy to provide operating power that would otherwise be provided through a wired connection to a power source, such as a connection to a main voltage source. With the above understanding, the expressions “wireless energy transfer” and “wireless power transfer” are used interchangeably in this disclosure. It should also be understood that, “wireless power transfer” and “wireless energy transfer” can be accompanied by the transfer of information; that is, information can be transferred via an electromagnetic signal along with the energy or power to do useful work.
FIG. 1B is a schematic diagram showing a portion of a resonator 150 used for wireless power transfer. Resonator 150 includes a coil 152, a magnetic member 154, and a shield 156. Coil 152 includes one or more loops and can be connected to one or more capacitors and/or inductors, as well as other electrical components (not shown). Coil 152 is formed of one or more conductive materials, such as copper, silver, gold, and Litz wire. As an example, Litz wire can be used for operation at frequencies of lower than 1 MHz (e.g., 85 kHz). In certain embodiments, the coil 210 can be formed of a solid core wire, or one or more conducting layers (e.g., copper layers) formed on a printed circuit board (PCB). For example, solid core wire or conducting layers can be used at operation frequencies of 1 MHz or higher.
Magnetic member 154 is positioned between coil 152 and shield 154. That is, in FIG. 1A, coil 152 is positioned on one side of magnetic member 154 and shield 156 is positioned on the opposite side of magnetic member 156. In general, magnetic member 154 guides magnetic flux induced by current flowing in the loops of coil 152. The presence of magnetic member 154 can lead to an increase in the magnetic flux density generated by coil 152 in a region adjacent to coil 152 (i.e., in a plane above or below the plane of coil 152) when oscillating electrical currents circulate in coil 152, relative to the flux density in the absence of magnetic member 154.
In some embodiments, magnetic member 154 can include one or more magnetic elements formed from magnetic materials such as manganese-zinc (MnZn) and/or nickel-zinc (NiZn) ferrites. When member 154 is formed from multiple magnetic elements, the gaps between elements (not shown in FIG. 1B) can be filled with a dielectric material such as an adhesive.
While magnetic materials are generally available in small sizes, some applications for wireless power transfer utilize magnetic members with a large areal size. For example, a car battery charging application may use magnetic members of large areal size (e.g., 30 cm×30 cm) to transfer high power of 1 kW or more (e.g., 2 kW or more, 3 kW or more, 5 kW or more, 6 kW or more). Magnetic members featuring a single monolithic piece of material can be utilized when such a piece of material is available. However, it can be difficult and/or expensive to manufacture a monolithic piece of magnetic material such as MnZn or NiZn ferrites with a large areal size (e.g., 30 cm×30 cm) for high power transfer. Moreover, MnZn and NiZn ferrites can be brittle, and accordingly, large-area pieces of these materials can be highly susceptible to breakage.
To overcome such difficulties, ferrite materials can be manufactured in pieces of small areal size (e.g., 5 cm×5cm), and several such pieces can be joined together to form a larger combined magnetic member. The smaller magnetic elements can behave functionally in a collective manner very similar to a larger magnetic member when they are joined. In certain embodiments, the multiple magnetic elements can be contained in a holder made from thermally conducting and electrically insulating materials (e.g., plastic, Teflon®, aluminum oxide, aluminum nitride, etc.)
Shield 156, which generally corresponds to a sheet of electrically conductive material, is typically positioned in proximity to coil 152. Shield 156 can be formed from one or more conductive materials, which can be the same as, or different from, the conductive materials used to form coil 152. For example, shield 156 can be formed from a sheet of a material such as copper, silver, gold, iron, steel, nickel and/or aluminum. Shield 156 acts to shield coil 152 from loss-inducing objects (e.g., metallic objects). Further, in some embodiments, shield 156 can increase coupling of resonator 150 to another resonator by guiding magnetic field lines in the vicinity of the resonator. For example, energy loss from aberrant coupling to loss-inducing objects can be reduced by using shield 156 to guide magnetic field lines away from the loss-inducing objects.
FIGS. 2A-2C are schematic diagrams showing a wireless power transfer system 204 integrated into a vehicle 202. FIG. 2A shows a side view of vehicle 202 in the X-Z coordinate plane, FIG. 2B shows a top view of vehicle 202 in the X-Y coordinate plane, and FIG. 2C shows a front view of vehicle 202 in the Y-Z coordinate plane. For purposes of the following discussion, the X-axis corresponds to the “front-to-back” direction of the vehicle, the Y-axis corresponds to the “side-to-side” direction of the vehicle, and the Z-axis corresponds to the “top-to-bottom” direction of the vehicle.
For wireless power transfer in vehicle applications, source and device resonators can be relatively large to accommodate significant power transfer between the resonators. In some embodiments, for example, the source resonator can have a maximum dimension in the X-Y plane of 30 cm or more (e.g., 40 cm or more, 50 cm or more, 60 cm or more, 70 cm or more, 80 cm or more, 90 cm or more, 100 cm or more). In certain embodiments, the device resonator can have a maximum dimension in the X-Y plane of 20 cm or more (e.g., 30 cm or more, 40 cm or more, 50 cm or more, 60 cm or more, 70 cm or more, 80 cm or more, 90 cm or more, 100 cm or more). In some embodiments, a maximum dimension of the source resonator can be smaller than a maximum dimension of the device resonator by 10 cm or more (e.g., by 15 cm or more, by 20 cm or more, by 30 cm or more).
The source and device resonator can each have a variety of different cross-sectional shapes, including square, rectangular, circular, elliptical, and more generally, regular polygonal. In certain embodiments, the resonators can have different shapes. For example, the source resonator can have a square cross-sectional shape, while the device resonator can have a rectangular cross-sectional shape.
The resonators (e.g., source resonators, receiving resonators, repeater resonators) used in the wireless power transfer systems disclosed herein can have a resonant frequency f=ω/2π, an intrinsic loss rate Γ, and a Q-factor Q=ω/(2Γ) (also referred as “intrinsic” Q-factor in this disclosure), where ω is the angular resonant frequency. The resonant frequency f of a source or receiver resonator is typically determined by the resonator's capacitance and inductance values.
In some embodiments, any one of a source, receiver, and/or repeater resonator can have a Q-factor that is a high Q-factor where Q>100 (e.g., Q>100, Q>200, Q>300, Q>500, Q>1000). For example, wireless power transfer systems can include a power source having one or more source resonators, and at least one of the source resonators can have a Q-factor of Q1>100 (e.g., Q1>100, Q1>200, Q1>300, Q1>500, Q1>1000). The wireless power transfer system can include a power receiver having one or more receiver resonators, and at least one of the receiver resonators can have a Q-factor of Q2>100 (e.g., Q2>100, Q2>200, Q2>300, Q2>500, Q2>1000). The system can include at least one repeater resonator having a Q-factor of Q3>100 (e.g., Q3>100, Q3>200, Q3>300, Q3>500, Q3>1000).
Utilizing high Q-factor resonators can lead to large energy coupling between some or all of the resonators in a wireless power transfer system. The high Q factors can lead to strong coupling between resonators such that the “coupling time” between the resonators is shorter than the “loss time” of the resonators. As a consequence, energy can be transferred efficiently between resonators at a faster rate than the energy loss rate due to losses (e.g., heating loss, radiative loss) of the resonators. In certain embodiments, a geometric mean, √{square root over (QiQj)} can be larger than 100 (e.g., √{square root over (QiQj)}>200, √{square root over (QiQj)}>300, √{square root over (QiQj)}>500, √{square root over (QiQj)}>1000) where i and j refer to a pair of source-receiver resonators, source-repeater resonators, or repeater-receiver resonators (e.g., i=1, j=2, or i=1, j=3, or i=2, j=3.) Additional aspects of high-Q resonators are described, for example, in U.S. Pat. No. 8,461,719, the entire contents of which are incorporated herein by reference.
Resonator Configurations
The extent of coupling and the efficiency of wireless power transfer between two resonators in a wireless power transfer system depends upon a wide variety of different structural features of the resonators. As such, different resonator configurations achieve different power transfer efficiencies and rates; and thus, different configurations are suitable for different types of power transfer applications. In the following sections, a number of different resonator configurations are shown, and the effect of different structural features on wireless power transfer performance will be discussed.
In some embodiments, a resonator coil can be offset from a conductive shield (e.g., an aluminum shield) to decrease losses and increase coupling to another resonator. FIGS. 3A-3B are schematic diagrams showing a source resonator coil 302 in proximity to a magnetic material 304, with a gap between magnetic material 304 and a conductive shield 306. In FIG. 3A, there is no gap between magnetic material 304 and shield 306. In FIG. 3B, there is a 40 mm gap 308 between magnetic material 304 and shield 306 (an aluminum shield). For a source resonator of dimensions 60 cm by 60 cm in the X-Y plane, and offset in the Z-direction from a device resonator of size 25 cm by 50 cm (not shown in FIGS. 3A-3B), with the offset from the device resonator defined by the set of coordinates (X,Y,Z)=(0,0,15) cm, a coupling rate k is measured to be approximately 0.077 for source resonator 302 shown in FIG. 3A, and approximately 0.083 for source resonator 302 shown in FIG. 3B.
In general, the thickness of magnetic material 304 in proximity to (or even attached to) a resonator can be varied to adjust the coupling k to another resonator. Table 1 summarizes measurements of coupling rate k for a wireless transfer system that includes a source resonator coil 402 of size 60 cm by 60 cm in the X-Y plane, as shown in FIG. 4, with an offset defined by the set of coordinates (X,Y,Z)=(10,10,150) cm from a device resonator coil 404 of size 25 cm by 50 cm in the X-Y plane. The source resonator coil and magnetic material are spaced from the aluminum shield by a gap of 40 mm, as in FIG. 3B discussed previously. Measurements of k are taken for a source resonator coil 402 having different thicknesses of magnetic material (e.g., “ferrite”), and under conditions when a vehicle chassis is present and not present.









TABLE 1





Presence of Vehicle Chassis
Ferrite thickness
Coupling k







Chassis present
 5 mm
0.060


Chassis not present
 5 mm
0.075


Chassis not present
12 mm
0.083









In some embodiments, a device configured to receive power wirelessly can be house both a device resonator and device electronics an integrated manner. FIG. 5A is a schematic diagram showing an embodiment of a device configured to wirelessly receive power in which a device resonator coil 502, a magnetic material 504, and a conductive (e.g., aluminum) shield 506 are stacked onto one another. FIG. 5B shows a schematic diagram of another embodiment of a device configured to wirelessly receive power. The device of FIG. 5B has a “top-hat” configuration, in which a center portion of magnetic material 508 is stepped in the Z-direction to form an empty region between magnetic material 508 and shield 506. Device electronics 510 are positioned within the empty region and coil 502 is wound around the stepped edges of magnetic material 508. By enclosing device electronics 510 within the device resonator as shown in FIG. 5B, the compactness of the device can be significantly increased.
The coupling k between source and receiver resonators in a vehicle wireless power transfer system depends in part on the presence and nature of the vehicle chassis in proximity to the receiver resonator. FIGS. 6A and 6B are plots that show measurements of the coupling k between a source resonator and a receiver resonator 604 as a function of relative displacement between the centers of the resonators in both the X- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5A and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 6A shows measurements of the coupling k in the absence of a vehicle chassis, while the plot in FIG. 6B shows measurements in the presence of an aluminum vehicle chassis. It is evident from FIGS. 6A and 6B that the vehicle chassis reduces the value of the coupling k by approximately 20%.
FIGS. 7A and 7B are plots showing figure-of-merit (U0) measurements as a function of relative displacement between the centers of a source resonator 602 and receiver resonator 604, in the X- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5A and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 7A shows measurements of U0 in the absence of a vehicle chassis, while the plot in FIG. 7B shows measurements in the presence of an aluminum vehicle chassis. In FIG. 7A, the quality factor of the source resonator is approximately 1000 while the quality factor of the receiver resonator is approximately 380. In FIG. 7B, the quality factor of the source resonator is approximately 1000, while the quality factor of the receiver resonator is approximately 460.
FIGS. 8A and 8B are plots showing measurements of the coupling k as a function of relative displacement between the centers of a source resonator 602 and a receiver resonator 604 in the Y- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5A and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 8A shows measurements of k in the absence of a vehicle chassis, while the plot in FIG. 8B shows measurements in the presence of an aluminum vehicle chassis. It is evident that the vehicle chassis reduces the coupling k by approximately 20%.
FIGS. 9A and 9B are plots showing figure-of-merit (U0) measurements as a function of relative displacement between the centers of a source resonator 602 and a receiver resonator 604 in the Y- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5A and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 9A shows measurements of U0 in the absence of a vehicle chassis, while the plot in FIG. 9B shows measurements in the presence of an aluminum vehicle chassis.
FIGS. 10A and 10B are plots showing measurements of the coupling k as a function of relative displacement between centers of a source resonator 602 and receiver resonator 604 in the X- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5B (i.e., a “top hat” configuration) and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 10A shows measurements of k in the absence of a vehicle chassis, while the plot in FIG. 10B shows measurements in the presence of an aluminum vehicle chassis. The measured values of k in FIGS. 10A and 10B do not differ substantially from the measured values shown in the plots of FIGS. 6A and 6B, respectively.
FIGS. 11A and 11B are plots showing figure-of-merit (U0) measurements as a function of relative displacement between centers of a source resonator 602 and receiver resonator 604 in the X- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5B (i.e., a “top hat” configuration) and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 11A shows measurements of U0 in the absence of a vehicle chassis, while the plot in FIG. 11B shows measurements in the presence of an aluminum vehicle chassis. The quality factor Q for the source resonator is 1000 while the quality factor Q for the receiver resonator is 450.
FIGS. 12A and 12B are plots showing measurements of the coupling k as a function of relative displacement between centers of a source resonator 602 and receiver resonator 604 in the Y- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5B (i.e., a “top hat” configuration) and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 12A shows measurements of k in the absence of a vehicle chassis, while the plot in FIG. 12B shows measurements in the presence of an aluminum vehicle chassis.
FIGS. 13A and 13B are plots showing figure-of-merit (U0) measurements as a function of relative displacement between centers of a source resonator 602 and receiver resonator 604 in the Y- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5B (i.e., a “top hat” configuration) and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 13A shows measurements of U0 in the absence of a vehicle chassis, while the plot in FIG. 13B shows measurements in the presence of an aluminum vehicle chassis. The quality factor Q for the source resonator is 1000 while the quality factor Q for the receiver resonator is 450.
FIGS. 14A and 14B are plots showing measurements of the coupling k as a function of relative displacement between centers of a source resonator 602 and receiver resonator 604 in the X- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5B (i.e., a “top hat” configuration) and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 14A shows measurements of k in the presence of an aluminum vehicle chassis, while the plot in FIG. 14B shows measurements of k in the presence of a steel (e.g., ST1008 steel) vehicle chassis. It is evident from FIGS. 14A and 14B that replacing the aluminum chassis with a steel chassis does not have a significant effect on the coupling k.
FIGS. 15A and 15B are plots showing measurements of the quality factor Q0 as a function of relative displacement between centers of a source resonator 602 and a receiver resonator 604 in the X- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5B (i.e., a “top hat” configuration) and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 15A shows source resonator Q0,src measurements in the presence of a steel vehicle chassis. The plot in FIG. 15B shows receiver (“device”) resonator Q0,dev measurements in the presence of a steel vehicle chassis. Both source resonator Q0,src and receiver resonator Q0,dev are significantly reduced compared to measured values in the presence of an aluminum vehicle chassis or no vehicle chassis.
FIGS. 16A and 16B are plots showing figure-of-merit (U0) measurements as a function of relative displacement between centers of a source resonator 602 and a receiver resonator 604 in the X- and Z-directions. The receiver resonator is similar to the resonator shown in FIG. 5B (i.e., a “top hat” configuration) and the source resonator is similar to the resonator shown in FIG. 3B. The plot in FIG. 16A shows U0 measurements in the presence of an aluminum vehicle chassis, while the plot in FIG. 16B shows U0 measurements in the presence of a steel (“ST1008”) vehicle chassis.
As is evident from the foregoing discussion, the coupling k between source and device resonators can be significantly affected by the presence of a car chassis. FIGS. 60A and 60B are plots showing measured values of the coupling k between source and device resonators that are similar to those shown in FIGS. 44 and 46, respectively, as a function of relative displacements between the centers of the resonators in the X- and Y-directions. The source and device resonators are spaced from one another by 15 cm in the Z-direction. The plot in FIG. 60A shows measurements of k in the presence of a vehicle chassis, while the plot in FIG. 60B shows measurements of k with no vehicle chassis present. The presence of the vehicle chassis reduces the coupling k by between 10% and 15%. Allowing for maximum offsets of 10 cm in both the X- and Y-directions (so that the maximum offset between the resonators corresponds to the coordinate set (X,Y,Z)=(10,10,15) cm), the system should be well matched for a minimum coupling k=0.07.
FIGS. 61A and 61B are plots showing measured values of the coupling k between the same source and device resonators as in FIGS. 60A and 60B as a function of relative displacements between the centers of the resonators in the X- and Y-directions. The source and device resonators are spaced from one another by 10 cm in the Z-direction. The plot in FIG. 61A shows measurements of k in the presence of a vehicle chassis, while the plot in FIG. 61B shows measurements of k with no vehicle chassis present. The presence of the vehicle chassis reduces the coupling k by between 1% and 8%.
FIG. 62 shows a schematic diagram of a receiver resonator that includes a resonator coil 6202, a magnetic member 6204, a first conductive shield 6206, and a second conductive shield 6208. The receiver resonator is positioned in proximity to a vehicle chassis 6210 formed of steel (e.g., ST1008). Second conductive shield 6208 is formed of aluminum, and is square in shape with a side length 6212.
To investigate the effect of the size of second shield 6208 on the mitigation of coupling losses due to chassis 6210, the side length 6212 of second shield 6208 is varied from 50 cm to 150 cm, and values of the Q-factor for both source and receiver resonators in a wireless power transfer system are measured. The source and receiver resonators are similar to those shown in FIGS. 44 and 46, respectively. FIG. 63 is a plot showing measured Q-factor values for the source resonator (curve 6302) and receiver resonator (curve 6304) as a function of the side length 6212 of second shield 6208. The source and receiver resonators are displaced from one another by 10 cm in both the X- and Y-directions, and by 10 cm in the Z-direction, a relative offset at which the effect of the vehicle chassis on the source resonator is greatest. As is evident from FIG. 63, the side length 6212 of second shield 6208 is preferably 80 cm or larger to mitigate the lossy effect of the steel vehicle chassis 6210.
Impedance Matching Networks and Electronic Components
Various impedance matching networks and configurations can be used in the wireless power transfer systems disclosed herein to ensure that power is transferred efficiently between source and receiver resonators. Various features and aspects of impedance matching networks are discussed, for example, in U.S. Patent Application Publication No. 2012/0242225, the entire contents of which are incorporated herein by reference.
FIG. 17A is a schematic diagram showing an example of an impedance matching network for a source resonator that implements a “balanced LCL” matching scheme. FIG. 17B is a schematic diagram showing an example of an impedance matching network for a receiver resonator that implements a “balanced series” matching scheme. These impedance matching networks can be used, for example, at power levels greater than 3 kW, and even greater than 7 kW.
In some embodiments, a wireless power transfer system can include a source resonator with a quality factor Q0,src of approximately 1000 and a receiver resonator with a quality factor Q0,dev of approximately 450. The maximum coupling k value for this system can be approximately 0.12. In the X-Z plane, the minimum coupling k value for a source and receiver resonator of a wireless power transfer system (referring to FIGS. 6A-6B, 7A-7B, 10A-10B, 11A-11B, and 14A-14B) can be approximately 0.08. The minimum coupling k value for a source and receiver resonator of a wireless power transfer system in the Y-Z plane (referring to FIGS. 8A-8B, 9A-9B, 12A-12B, and 13A-13B) can be approximately 0.06.
In certain embodiments, the impedance matching point of the receiver resonator may be chosen such that the maximum power dissipated in the device, including the impedance matching network and diodes, is less than 300 W (e.g., less than 275 W, less than 250 W, less than 225 W, less than 200 W).
Impedance matching networks can generally include a variety of different electronic components. For example, certain impedance matching networks can include ceramic capacitors (for example, capacitors from 800 E series, available from American Technical Ceramics Corp., Huntington Station, N.Y.) rated for approximately 2000 V (peak voltage) and with quality factors of approximately Qcap=2500. In certain embodiments, the capacitor voltage rating can determine the target inductances of the resonator coils. For example, the above capacitor rating can correspond to a source resonator coil of inductance L=40 μH and capacitance values of C1a=C1b=C2=263 nF, and to a receiver resonator coil of inductance L=100 μH and capacitance values C1a=C1b=70.1 nF. Other types of less expensive capacitors can also be used in certain embodiments, including film capacitors for example.
FIGS. 18A and 18B are plots of measured device-side load impedance as a function of output voltage for a device with a receiver resonator as shown in FIG. 5B, in the presence of an aluminum vehicle chassis. FIG. 18A shows measured device-side load impedance for a power level of 3.7 kW, while FIG. 18B shows measured device-side load impedance for a power level of 7.4 kW.
FIGS. 19A and 19B are plots of amplifier-to-battery efficiency as a function of output voltage for a device with a receiver resonator as shown in FIG. 5B, in the presence of an aluminum vehicle chassis. FIG. 19A shows amplifier-to-battery efficiency for coupling k values of 0.12 (curve 1902), 0.08 (curve 1904), and 0.06 (curve 1906) for a power level of 3.7 kW. FIG. 19B shows amplifier-to-battery efficiency for coupling k values of 0.12 (curve 1908), 0.08 (curve 1910), and 0.06 (curve 1912) for a power level of 7.4 kW. In some embodiments, efficiency values at the lower of the coupling k values can be improved by matching to a lower figure-of-merit Ud.
FIGS. 20A and 20B are plots of power dissipated in a source (with a resonator corresponding to the source resonator shown in FIG. 3B) and a device (with a receiver resonator corresponding to the receiver resonator shown in FIG. 5B) as a function of output voltage, in the presence of an aluminum vehicle chassis. FIG. 20A shows power dissipated in the source for coupling k values of 0.12 (curve 2002), 0.08 (curve 2004), 0.06 (curve 2006), and in the device (curve 2008) at a power level of 3.7 kW. FIG. 20B shows power dissipated in the source for coupling k values of 0.12 (curve 2010), 0.08 (curve 2012), 0.06 (curve 2014) and in the device (curve 2016) at a power level of 7.4 kW.
FIGS. 21A and 21B are plots of the voltage (Vrms) measured across one or more capacitors in an impedance matching network for a system that includes a source (with a resonator corresponding to the source resonator shown in FIG. 3B) and a device (with a receiver resonator corresponding to the receiver resonator shown in FIG. 5B) as a function of output voltage, in the presence of an aluminum vehicle chassis. Voltages in FIGS. 21A and 21B are measured across capacitors C1a and C1b shown in FIGS. 17A and 17B. FIG. 21A shows the RMS voltage across capacitor C1 for a source with coupling k values of 0.12 (curve 2104), 0.08 (curve 2106), and 0.06 (curve 2108), and for a device (curve 2102) at a power level of 3.7 kW. FIG. 21B shows the RMS voltage across capacitor C1 for a source with coupling k values of 0.12 (curve 2112), 0.08 (curve 2114), and 0.06 (curve 2116), and for a device (curve 2110) at a power level of 7.4 kW.
FIGS. 22A and 22B are plots of the magnetic field (mT) measured in the magnetic member attached to the resonators in a wireless power transfer system (i.e., attached to a source resonator such as the resonator shown in FIG. 3B and attached to a receiver resonator as shown in FIG. 5B), as a function of output voltage, in the presence of an aluminum vehicle chassis. For measurements shown in FIGS. 22A and 22B, the magnetic member is formed from 5 mm ferrite pieces. FIG. 22A shows the magnetic field in the magnetic member of a source resonator for coupling k values of 0.12 (curve 2204), 0.08 (curve 2206), and 0.06 (curve 2208), and in a receiver resonator (curve 2202) at a power level of 3.7 kW. FIG. 22BB shows the magnetic field in the magnetic member of a source resonator for coupling k values of 0.12 (curve 2212), 0.08 (curve 2214), and 0.06 (curve 2216), and in a receiver resonator (curve 2210) at a power level of 7.4 kW.
FIG. 23 shows a schematic circuit diagram of an embodiment of device electronics 110. The device electronics include a device resonator coil 2302 with series tuning, represented by series capacitors 2304 and 2306. The device electronics can include a half-wave or full-wave rectification stage 2310, one or more filters 2312, and/or a DC-to-DC converter 2314. The DC-DC converter can be used to tune the load impedance that the device sees to achieve an improved and/or optimal impedance matching value. Load 112 can correspond to a variety of electronic devices such as, for example, a battery 2316. In some embodiments, DC-DC converter 2314 can be a boost converter to minimize the voltage across capacitors C1a, and C1b. In certain embodiments, DC-DC converter 2314 can be a buck converter to reduce losses in the rectification diodes.
FIGS. 24A and 24B are plots showing the DC-DC boost conversion ratio for a device with a receiver resonator (such as the receiver resonator shown in FIG. 5B) as a function of output voltage, in the presence of an aluminum vehicle chassis. FIG. 24A shows the DC-DC conversion ratio for a device with a receiver resonator having coupling k values of 0.12 (curve 2402), 0.08 (curve 2404), and 0.06 (curve 2406) at a power level of 3.7 kW. FIG. 24B shows the DC-DC conversion ratio for a device with a receiver resonator having coupling k values of 0.12 (curve 2402), 0.08 (curve 2404), and 0.06 (curve 2406) at a power level of 7.4 kW. In some embodiments, a DC-DC boost conversion ratio of approximately 4:1 can be optimal for operation at both 3.7 kW and 7.4 kW for various positional offsets between the source and device resonators as well as output voltages.
FIGS. 25A and 25B are plots showing the amplifier-to-converter efficiency for a device with a receiver resonator (such as the receiver resonator shown in FIG. 5B) as a function of output voltage, in the presence of an aluminum vehicle chassis. FIG. 25A shows the efficiency for a device with a receiver resonator having coupling k values of 0.12 (curve 2502), 0.08 (curve 2504), and 0.06 (curve 2506) at a power level of 3.7 kW. FIG. 25B shows the efficiency for a device with a receiver resonator having coupling k values of 0.12 (curve 2502), 0.08 (curve 2504), and 0.06 (curve 2506) at a power level of 7.4 kW.
FIGS. 26A and 26B are plots showing power dissipated in a source that includes a source resonator (such as the source resonator shown in. FIG. 3B) and in a device that includes a receiver resonator (such as the receiver resonator shown in FIG. 5B) as a function of output voltage in the presence of an aluminum vehicle chassis. FIG. 26A shows the power dissipated in a source for coupling k values of 0.12 (curve 2602), 0.08 (curve 2604), and 0.06 (curve 2606), and in a device for coupling k values of 0.12 (curve 2608), 0.08 (curve 2610), and 0.06 (curve 2612) at a power level of 3.7 kW. FIG. 26B shows the power dissipated in a source for coupling k values of 0.12 (curve 2614), 0.08 (curve 2616), and 0.06 (curve 2618), and in a device for coupling k values of 0.12 (curve 2620), 0.08 (curve 2622), and 0.06 (curve 2624) at a power level of 7.4 kW.
FIGS. 27A and 27B are plots showing measured voltages across one or more matching network capacitors in a source that includes a source resonator (such as the source resonator shown in FIG. 3B) and in a device that includes a receiver resonator (such as the receiver resonator shown in FIG. 5B) as a function of output voltage in the presence of an aluminum vehicle chassis. FIG. 27A shows the voltage across one or more matching network capacitors in a source for coupling k values of 0.12 (curve 2702), 0.08 (curve 2704), and 0.06 (curve 2706), and across one or more matching network capacitors in a device for coupling k values of 0.12 (curve 2708), 0.08 (curve 2710), and 0.06 (curve 2712) at a power level of 3.7 kW. FIG. 27B shows the voltage across one or more matching network capacitors in a source for coupling k values of 0.12 (curve 2714), 0.08 (curve 2716), and 0.06 (curve 2718), and across one or more matching network capacitors in a device for coupling k values of 0.12 (curve 2720), 0.08 (curve 2722), and 0.06 (curve 2724) at a power level of 7.4 kW.
FIGS. 28A and 28B are plots of the magnetic field (mT) measured in a magnetic member attached to the source and receiver resonators in a wireless power transfer system, where the source resonator is similar to the resonator shown in FIG. 3B and the receiver resonator is similar to the resonator shown in FIG. 5B, as a function of output voltage, in the presence of an aluminum vehicle chassis. FIG. 28A shows the magnetic field measured in the magnetic member of the source for coupling k values of 0.12 (curve 2802), 0.08 (curve 2804), and 0.06 (curve 2806), and in the magnetic member of the device for coupling k values of 0.12 (curve 2808), 0.08 (curve 2810), and 0.06 (curve 2812) at a power level of 3.7 kW. FIG. 28B shows the magnetic field measured in the magnetic member of the source for coupling k values of 0.12 (curve 2814), 0.08 (curve 2816), and 0.06 (curve 2818), and in the magnetic member of the device for coupling k values of 0.12 (curve 2820), 0.08 (curve 2822), and 0.06 (curve 2824) at a power level of 7.4 kW.
In some embodiments, wireless power transfer systems can include a switchable, multi-tapped transformer to variably tune the impedance of source and/or receiver resonators. In some embodiments, wireless power transfer systems can include a DC-DC converter to modulate the output impedance.
Resonator Configurations
A wide variety of different resonator configurations can be used in wireless power transfer systems. In this section, examples of such configurations and certain performance characteristics of the configurations will be discussed.
FIGS. 29A-29D are schematic diagrams showing exemplary embodiments of resonator coils for wireless power transfer systems. In each of FIGS. 29A-29D, the resonator winding length 2914 and span 2916 varies. In each of FIGS. 29A-29D, the size of magnetic member 2904 is 50 cm×50 cm×5 mm, and the size of shield 2902 is 60 cm×60 cm. Magnetic member 2904 is formed from ferrite, and shield 2902 is formed from aluminum. FIG. 29A shows a resonator coil 2906 with a minimum length of 400 mm and minimum span of 50 mm. FIG. 29B shows a resonator coil 2908 with a maximum length of 500 mm and minimum span of 50 mm. FIG. 29C shows a resonator coil 2910 with a minimum length of 400 mm and maximum span of 175 mm. FIG. 29D shows a resonator coil 2912 with a maximum length of 500 mm and maximum span of 175 mm The resonators shown in FIGS. 29A-29D can be used as source resonators (such as the source resonator shown in FIG. 3B).
FIG. 30A is a plot of coupling rate k as a function of source resonator coil winding length and span, measured at an approximate offset of (X,Y,Z)=(10,10,15) cm relative to a receiver resonator coil, where Z-offset is measured from coil surface to surface. The receiver resonator dimensions are 25 mm by 50 mm. In FIG. 30A, the dark region 3002 with greater coupling k indicates that a winding length of 500 mm and winding span of 130 mm result in higher coupling for certain source resonator coil dimensions. FIG. 30B is a plot of figure-of-merit U0 as a function of source resonator coil winding length and span, measured at an approximate offset of (X,Y,Z)=(10,10,15) cm relative to a receiver resonator coil, where Z-offset is measured from coil surface to surface, for the same source and receiver resonators as in FIG. 30A.
FIGS. 31A-31D are schematic diagrams showing exemplary embodiments of resonator coils for wireless power transfer systems. In each of FIGS. 31A-31D, the winding gap-to-edge distance 3114 and span 3116 vary. In FIGS. 31A-31D, the size of magnetic member 3104 is 20 cm×45 cm×5 mm, and the size of shield 3102 is 25 cm×50 cm. Magnetic member 3104 is formed from ferrite, and shield 3102 is formed from aluminum. FIG. 31A shows a resonator coil 3106 with a minimum gap-to-edge distance of 0 mm and a minimum span of 25 mm. FIG. 31B shows a resonator coil 3108 with a maximum gap-to-edge distance of 20 mm and a minimum span of 25 mm. FIG. 31C shows a resonator coil 3110 with a minimum gap-to-edge distance of 0 mm and a maximum span of 50 mm. FIG. 31D shows a resonator coil 3112 with a maximum gap-to-edge distance of 20 mm and a maximum span of 50 mm. The resonators shown in FIGS. 31A-31D can be used as receiver resonators in devices, for example.
FIG. 32A is a plot of coupling k as a function of resonator coil winding gap-to-edge distance and span for the resonators of FIGS. 31A-31D. Highest coupling is achieved for resonator coils with a winding gap-to-edge distance of 0 mm and a span of 50 mm. FIG. 32B is a plot of figure-of-merit U0 as a function of resonator coil winding gap-to-edge distance and span for the resonators of FIGS. 31A-31D.
FIGS. 33A and 33B are plots of the coupling k between a source resonator of the type shown in FIGS. 29A-29D and a device resonator of the type shown in FIGS. 31A-31D, as a function of relative offset between the resonators in the X- and Y-directions. FIG. 33A shows the coupling k for a relative offset between the resonators in the Z-direction of 10 cm, and FIG. 33B shows the coupling k for a relative offset between the resonators in the Z-direction of 15 cm.
FIGS. 34A and 34B are plots of the figure-of-merit U0 for a wireless power transfer system that includes a source resonator of the type shown in FIGS. 29A-29D, and a device resonator of the type shown in FIGS. 31A-31D, as a function of relative offset between the resonators in the X- and Y-directions. FIG. 34A shows the figure-of-merit U0 for a relative offset between the resonators in the Z-direction of 10 cm, and FIG. 34B shows the figure-of-merit U0 for a relative offset between the resonators in the Z-direction of 15 cm.
Additional Impedance Matching Network Topologies
In addition to the impedance matching networks discussed above, additional impedance matching network topologies can also be used in the wireless power systems disclosed herein. FIGS. 35A and 35B are schematic diagrams of matching networks for use in device electronics 110. FIG. 35A shows a delta capacitor matching network 3502 and FIG. 35B shows a wye capacitor matching network 3504. The two capacitor networks are equivalent to each other through a “delta-wye” transformation. Delta and wye networks that match a device to an effective impedance that stays relatively flat as a battery voltage and output power vary can be desirable. Accordingly, wireless power transfer systems can include a matching network of either topology. In some embodiments, the implementation of either a delta or wye matching network is guided by the network that uses the fewest capacitors of a given voltage rating, making that network the cheaper of the two to implement.
FIG. 36 is a plot of the total minimum number of capacitors for delta (3602) and wye (3604) impedance matching networks in a device. The device matching point Ud can affect the overall efficiency and determine how the power dissipated is distributed between the source and the device. A higher Ud value means less power is dissipated in the device and more power is dissipated in the source. Delta and/or wye matching networks can be used to match to Ud=50 such that approximately equal power is dissipated in the source and the device at maximum relative offset between the resonators. In some embodiments, point 3606 (Ld=37.5 μH) can be chosen on the delta network 3602 to minimize the number of capacitors and inductance. A lower inductance may reduce the voltage across the winding.
FIG. 37 is a schematic diagram showing an embodiment of an impedance matching network topology for use in device electronics 110. As one example, in FIG. 37, the various circuit component positions can have the following values: L3a=L3b=25 μH; Ca−24.8 nF; Cb1=Cb2 =39 nF; and Cc−71.8 nF. This topology provides additional degrees of freedom in the impedance matching of the device as compared to topologies with fewer component positions. Note that components in positions Cb1 and Cb2 provide a balancing of the impedance matching network shown in FIG. 35A. Additional aspects of the impedance matching network topology shown in FIG. 37 are disclosed, for example, in U.S. Pat. No. 8,461,719, the entire contents of which are incorporated herein by reference.
FIG. 38 is a plot of the figure-of-merit U as function of output voltage in a device that includes a receiving resonator with a delta-type impedance matching network (as shown in FIG. 35A). Curve 3802 shows the figure-of-merit UdR which is the resistive component of the device matching impedance for power output of 7.0 kW. Curve 3804 shows the figure of merit UdR which is the resistive component of the device matching impedance for power output of 3.5 kW. Curve 3806 shows the figure-of-merit UdX which is the reactive component of the device matching impedance for power output of 7.0 kW. Curve 3808 shows the figure of merit UdX which is the reactive component of the device matching impedance for power output of 3.5 kW. The reactive component of the device matching impedance is generally smaller than the resistive component, and thus the device resonator is not significantly detuned off resonance. Furthermore, in these conditions, current in the source does not increase excessively to drive an off-resonance device resonator.
FIG. 39 is a plot showing the power dissipated in source and receiver resonators that are matched using a delta-type impedance matching network, as a function of output voltage. The system of source and receiver resonators has a coupling k of 0.08. Curve 3902 shows the power dissipated in the source resonator coil and one or more capacitors of the matching network at a power output of 7.0 kW. Curve 3904 shows the power dissipated in the source resonator coil and one or more capacitors of the matching network at a power output of 3.5 kW. Curve 3906 shows the power dissipated in the receiver resonator coil and one or more source-side capacitors of the matching network at a power output of 7.0 kW. Curve 3908 shows the power dissipated in the receiver resonator coil and one or more device-side capacitors of the matching network at a power output of 3.5 kW.
FIG. 40 is a plot showing the maximum magnetic field in the source and device resonators as a function of output voltage for a wireless power transfer system that includes source and device resonators with a coupling k of 0.08. Curve 4002 shows the maximum magnetic field in the source resonator at a power output of 7.0 kW. Curve 4004 shows the maximum magnetic field in the source resonator at a power output of 3.5 kW. Curve 4006 shows the maximum magnetic field in the device resonator at a power output of 7.0 kW. Curve 4008 shows the maximum magnetic field in the device resonator at a power output of 3.5 kW.
FIG. 41 is a plot showing the voltage across one or more capacitors of a delta-matching network in a receiver resonator of a device (curves 4102-4112) and in a source resonator (curves 4114-4116) as function of output voltage. Curve 4102 shows the voltage across capacitor Ca in FIG. 37 at a power output of 7.0 kW. Curve 4104 shows the voltage across capacitor Ca in FIG. 37 at a power output of 3.5 kW. Curve 4106 shows the voltage across capacitor Cb in FIG. 37 at a power output of 7.0 kW. Curve 4108 shows the voltage across capacitor Cb in FIG. 37 at a power output of 3.5 kW. Curve 4110 shows the voltage across capacitor Cc in FIG. 37 at a power output of 7.0 kW. Curve 4112 shows the voltage across capacitor Cc in FIG. 37 at a power output of 3.5 kW. Curve 4114 shows the voltage across a source capacitor at a power output of 7.0 kW. Curve 4116 shows the voltage across a source capacitor at a power output of 3.5 kW.
Optimizing impedance matching networks for particular resonator configurations and power delivery specifications involves selecting electronic components for the network. For example, with reference to the delta-matching network shown in FIG. 35A, one component that is selected is the inductance value L3. If L3 is too small, the diodes in the rectifier may conduct for only a fraction of an oscillation period, so to transfer a fixed amount of power, the peak current through the diodes would have to be higher, leading to more power dissipation in the diodes. In addition, the electrical current through L3 would also peak higher and have more harmonic content, leading to losses in the inductor. Conversely, large values of L3 can add too much ESR to the impedance matching network. As such, the value of L3 is chosen to balance these competing effects.
FIGS. 64A and 64B are plots showing the peak current through the diodes and inductor L3 for delivery of 6.6 kW to a load of Vdc=420 V. For a capacitor with L3=20 μH (FIG. 64A), the peak current is 34.5 A. For a capacitor with L3=50 μH (FIG. 64B), the peak current is 26.7 A.
FIGS. 65A and 65B are plots showing the peak current through the diodes and inductor L3 for delivery of 3.3 kW to a load of Vdc=420 V. For a capacitor with L3=20 μH (FIG. 65A), the peak current is 19.9 A. For a capacitor with L3=50 μH (FIG. 65B), the peak current is 15.3 A.
As discussed above, once the configuration of the impedance matching network has been determined, the network configuration can be optimized. In general, the device matching point Ud affects the overall efficiency of wireless power transfer and how power is dissipated between the source and the device. Higher values of Ud mean that more power is dissipated in the source and less is dissipated in the device. Impedance matching networks can be optimized to satisfy the condition Ud=50 (i.e., equal power dissipation in the source and device) at the maximum offset between the source and device resonators (i.e., where k=0.07). The optimum configuration for an impedance matching network is generally the configuration that uses the smallest number of capacitors, while satisfying the optimization condition to within an acceptable tolerance.
FIGS. 66A and 66B are plots showing the number of capacitors in a device's impedance matching network as a function of the inductance of the device's receiving resonator coil inductance, for 800 E series capacitors (American Technical Ceramics Corp.) (FIG. 66A) and film capacitors (available from EPCOS, Munich, Germany). Each plot shows results for both delta- and wye-matching networks. FIG. 66A corresponds to capacitors at 2000 V peak voltage and 6.6 kW, with a target Ud of 50. FIG. 66B corresponds to capacitors at 600 V RMS voltage and 6.6 kW, with a target Ud of 50.
After choosing the type of capacitors to use (i.e., 800 E series capacitors) and the inductance of the receiver resonator coil (43.5 μH, which can be achieved with 8 loops of conductive material), the number and capacitance values of the different capacitors in the impedance matching network are selected, subject to the impedance matching condition (Ud=50), and further subject to the constraint that the number of capacitors used to achieve the impedance matching condition should be as small as possible.
FIG. 67 is a schematic diagram of an optimized device impedance matching network. In the optimized network, L3a=L3b=25 μH, Ca−28.6 nF (achieved with 5×5.1 nF+1×3.0 nF 800 E capacitors), Cb1=Cb2=36.8 nF (achieved with 7×5.1 nF+1×1.0 nF 800 E series capacitors), and C3=51.0 nF (achieved with 10×5.1 nF 800 E series capacitors). The total number of capacitors used in the optimized network is 32. The optimized network is sufficiently small geometrically that it fits within the empty volume of the “top hat” resonator shown in FIG. 5B.
FIG. 68 is a plot showing the figure of merit Ud as a function of output voltage for an optimized impedance matching network, at a coupling k value of 0.07. The target Ud=50 is achieved between 300 V and 400 V (and specifically, at approximately 350 V) for the resistive component of Ud at 3.3 kW output (curve 6802) and 6.6 kW output (curve 6804), but not for the reactive component of Ud at either 6.6 kW output (curve 6806) or 3.3 kW output (curve 6808).
FIG. 69 is a plot showing the amount of power dissipated in various components of the source for a wireless power transfer system with an optimized device impedance matching network having a coupling value k=0.07 between source and receiver resonators. Curves 6902, 6904, 6906, and 6908 show the power dissipated in the source's resonator coil windings, shield, ferrite magnetic member, and capacitors at 7.0 kW output power. Curves 6910, 6912, 6914, and 6916 show the power dissipated in the source's resonator coil windings, shield, ferrite magnetic member, and capacitors at 3.5 kW output power.
FIG. 70 is a plot showing the amount of power dissipated in various components of the device for a wireless power transfer system with an optimized device impedance matching network having a coupling value k=0.07 between source and receiver resonators. Curves 7002, 7004, 7006, and 7008 show the power dissipated in the device's receiver coil windings, shield, ferrite magnetic member, and capacitors at 7.0 kW output power. Curves 7010, 7012, 7014, and 7016 show the power dissipated in the device's receiver coil windings, shield, ferrite magnetic member, and capacitors at 3.5 kW output power.
FIG. 71 is a plot showing the magnetic field in the ferrite magnetic member as a function of output voltage for a wireless power transfer system with an optimized device impedance matching network having a coupling value k=0.07 between source and receiver resonators. Curves 7102 and 7104 show the magnetic field in the magnetic member of the source resonator at 6.6 kW and 3.3 kW power output, respectively. Curves 7106 and 7108 show the magnetic field in the magnetic member of the device's receiver resonator at 6.6 kW and 3.3 kW power output, respectively.
FIG. 72 is a plot showing voltages across the capacitors as a function of output voltage for a wireless power transfer system with an optimized device impedance matching network having a coupling value k=0.07 between source and receiver resonators. Curves 7202 and 7204 show the voltages across Ca at 6.6 kW and 3.3 kW output power, respectively. Curves 7206 and 7208 show the voltages across Cb at 6.6 kW and 3.3 kW output power, respectively. Curves 7210 and 7212 show the voltages across Cc at 6.6 kW and 3.3 kW output power, respectively.
FIG. 73 is a plot showing the electrical current through the source resonator coil and the device's receiver resonator coil as a function of output voltage for a wireless power transfer system with an optimized device impedance matching network having a coupling value k=0.07 between source and receiver resonators. Curves 7302 and 7304 show the current through the source resonator coil at 6.6 kW and 3.3 kW output power, respectively. Curves 7306 and 7308 show the current through the device's receiver resonator coil at 6.6 kW and 3.3 kW output power, respectively.
Additional Resonator Configurations
FIG. 42 is a schematic diagram showing an embodiment of a magnetic member formed from an array of tiles 4202 of magnetic material (e.g., ferrite). In some embodiments, the ferrite tiles 4202 can have dimensions of about 150 mm by 100 mm, and a thickness of about 5 mm or 8 mm or greater. In certain embodiments, the ferrite tiles 4202 can be arranged such that there are equal gaps of about 0.4 mm between adjacent tiles. In some embodiments, the maximum dimensions of the magnetic member can be approximately 500 mm by 500 mm.
In general, the central region of the magnetic member can be left empty (as in FIG. 42) or filled with additional magnetic material. In some embodiments, the magnetic member can be spaced from an aluminum shield 4302 by about 40 mm in a resonator, as shown in FIG. 43. The magnetic member shown in FIGS. 42 and 43 is typically used in a source resonator.
FIG. 44 shows an image of an embodiment of a source resonator coil 4402 affixed to a magnetic member 4202 positioned over, and spaced from, an aluminum shield 4302. In FIG. 44, the source resonator coil has similar outer dimensions to those of the magnetic member (i.e., about 500 mm×500 mm), the resonator coil windings span 4404 is approximately 130 mm, and the coil windings have an inner dimension 406 of approximately 240 mm square.
In general, higher resonator Q values can be achieved by winding multiple resonator coils in parallel within a resonator. In FIG. 44, three coils are wound in parallel with a minimum of 5 loops in each coil to achieve a targeted inductance value.
FIGS. 45A and 45B are a schematic diagram and an image, respectively, that show an embodiment of a magnetic member formed from an array of ferrite tiles 4502. In some embodiments, the ferrite tiles 4502 can have dimensions of about 150 mm by 100 mm, with a thickness of about 5 mm or 8 mm or greater. In certain embodiments, the ferrite tiles 4502 can be arranged such that there are equal gaps of about 0.4 mm between the tiles. In some embodiments, the maximum dimensions of the magnetic member can be approximately 200 mm by 450 mm. The magnetic member shown in FIGS. 45A and 45B is typically used in a device's receiver resonator.
FIG. 46 is an image of an embodiment of a device receiver resonator coil 4602 affixed to a magnetic member 4502. In FIG. 46, the device receiver resonator coil has similar outer dimensions to the magnetic member shown in FIG. 42 (i.e., about 200 mm by 450 mm). The receiver resonator coil in FIG. 42 includes a single wire that forms seven loops on the surface of the magnetic member of FIG. 45. The inductance of the receiver resonator coil 4602 is approximately 33.1 μH and its quality factor is approximately 591.
FIG. 47A is a schematic diagram of an embodiment of a source resonator coil 4706 affixed to a magnetic member 4704. In some embodiments, for example, magnetic member 4704 can have dimensions of about 50 cm by 50 cm, and a thickness of about 5 mm, about 8 mm, or greater. Coil 4706 and magnetic member 4704 are positioned over, and spaced from, a shield 4702. In certain embodiments, for example, shield 4702 is formed from a conductive material such as aluminum, and has dimensions of about 60 cm by 60 cm). In some embodiments, gap 4708 between magnetic member 4704 and shield 4702 can be about 50 mm. In certain embodiments, the inductance of coil 4706 can be about 19.9 μH and its quality factor can be about 1150. In certain embodiments, coil 4706 can include at least three sets of coil windings wound in parallel, each formed from a different wire or conductive material. The windings can be connected in parallel to yield a high-Q resonator coil. As an example, each coil winding can include at least five loops to achieve the target inductance.
FIG. 47B is a schematic diagram showing an embodiment of a device receiver resonator coil 4716 affixed to magnetic member 4712. In some embodiments, magnetic member 4712 can have dimensions of about 45 cm by 20 cm, and a thickness of about 5 mm, about 8 mm, or greater. In certain embodiments, a central region of magnetic member 4712 can be stepped such that it protrudes into the region internal to coil 4716, as shown in FIG. 5B. In some embodiments, the thickness of the magnetic material in the center of the resonator coil can be less than the thickness of the magnetic material elsewhere.
Coil 4716 and magnetic member 4712 are affixed to a shield 4710 formed of conductive material (e.g., aluminum) and having dimensions of, for example, about 50 cm by 25 cm. In some embodiments, the inductance of coil 4716 can be 33.3 μH and its quality factor can be about 443.
For the source and device resonators shown in FIGS. 47A and 47B, coupling k values for a maximum relative offset of (X,Y,Z)=(10,10,15) between the coils can be: for a source resonator affixed to magnetic member of 5 mm thickness, k=0.0707; and for a source resonator affixed to magnetic member of 8 mm thickness, k=0.0710.
FIG. 48A is a schematic diagram showing an embodiment of a source resonator affixed to a magnetic member 4802 formed from ferrite tiles with dimensions of about 10 cm by 10 cm in each corner, and tiles with dimensions of about 15 cm by 10 cm outside the corners. The quality factor of this resonator is approximately 1220.
FIG. 48B is a schematic diagram showing an embodiment of a source resonator affixed to a magnetic member 4804 formed from ferrite tiles with dimensions of about 15 cm by 10 cm. The quality factor of this resonator is approximately 1050.
Resonator Coils with Parallel Windings
FIG. 49 is an image showing an embodiment of a source resonator 4902 that includes three parallel windings 4904, 4906, and 4908 that are wound in a coil shape and electrically connected in parallel over a magnetic member. In embodiments, windings may be electrically connected in parallel instead of series in order to reduce the overall voltage that can occur across the coil. While three windings are shown in FIG. 49, more generally any number of windings can wound in parallel to form a coil and electrically connected in parallel. The windings can have the same or different wire diameters, and the overall shape of the coil formed by the parallel windings can be any of the different shapes disclosed herein. For purposes of this disclosure, two sets of loops—each corresponding to a coil winding—are physically “parallel” if the sets of loops have complementary and corresponding shapes, and the distance between the conductive material forming one set of loops and the conductive material forming the other set of loops is the same between corresponding portions of the sets of loops along 80% or more of the lengths of the conductive materials. Two windings may be considered to be physically parallel if the magnetic coupling between the loops of the two windings is greater than 90%. In some embodiments, sets of parallel loops are frequently interleaved such that corresponding portions of the conductors that form the loops are parallel to one another.
In some embodiments, where a coil includes multiple parallel sets of loops (e.g., windings), excess current can flow in the innermost coil winding. This can occur, for example, because the innermost winding typically has a shorter overall length within the coil than middle and outer windings. This is due to the geometry of the windings within the coil—the innermost winding, because it typically has a smaller average loop diameter than the other windings, has a shorter total length, and therefore a smaller total resistance and inductance than the other windings. As a result, excess current can flow in the innermost coil winding relative to the other windings. More generally, because each winding is typically of a different length, the currents that flow in each of the windings are different, and some (or even all) of these may exceed design specifications and/or safety guidelines.
In general, excess current in any one coil winding may result in decreased efficiency during wireless power transfer due to greater heat dissipation in the winding with excess current. Typically, heat dissipation increases proportionally with the square of current flow in each parallelized coil winding. In this section, various methods for balancing currents in multiple parallel windings are disclosed. The general objective underlying these methods is to control current flow in multiple coil windings so that the actual currents that flow in the windings are equal to a predetermined or selected distribution of currents, within an acceptable tolerance range. Typically, the predetermined distribution of currents is expressed as a percentage of total current flow through the windings that make up the coil. For example, for a coil that includes three parallel windings, the predetermined distribution of current can correspond to 33.3% (i.e., one third) of the total current carried by the coil flowing through each winding.
In some embodiments, the predetermined current distribution corresponds to an equal partitioning of the total current among the windings. Thus, for a coil with four parallel windings for example, the predetermined current distribution corresponds to a partitioning of 25% of the total coil current carried by each of the four windings.
In certain embodiments, the predetermined distribution does not correspond to an equal partitioning of currents among the windings. To achieve certain functionality, for example, it can be advantageous to partition the total coil current unequally among the coil's parallel windings. The methods and systems disclosed herein can be used flexibly to achieve both equal and non-equal predetermined current distributions among parallel windings of a coil.
In some embodiments, to balance (i.e., nominally equalize) the currents in each coil winding, coil windings may be twisted “crossed-over” with one another. FIG. 49 shows three such twists at locations 4910, 4912, and 4914. The coil windings are crossed in the following manner: at location 4910, winding 4908 is crossed with winding 4906; at location 4912, winding 4908 is crossed with winding 4904; and at location 4914, winding 4906 is crossed with winding 4904. In some embodiments, three such twists may be sufficient to approximately balance currents throughout the coil. More generally, however, the windings of the three coils may be crossed or twisted throughout the coil (e.g., include any number of crossings or twists) to further balance the current in the windings as well as to ensure that each wire is of similar length. In some embodiments, for a coil with three coil windings, such as 4904, 4906, and 4908 in FIG. 49, the twists in the windings may each be separated by a 1⁄3 of the distance around the coil. More generally, for a coil with n coil windings, the windings can be spaced by 1/n of the total length of a single winding loop, measured along the loop.
Typically, the crossings between the windings are used to approximately equalize the lengths of the windings. By equalizing the winding lengths, each winding has a similar resistance and inductance value, and therefore, an approximately equal portion of the total coil current flows through each of the windings.
FIG. 50 is a plot showing the magnetic field in the magnetic member of a source resonator (such as the source resonator shown in FIG. 47A). In FIG. 50, the magnetic member is formed of ferrite of 5 mm thickness. The maximum magnetic field is 170 mT at 198 A of current.
FIG. 51 is a plot showing the magnetic field in the magnetic member of a source resonator (such as the source resonator shown in FIG. 47A). In FIG. 51, the magnetic member is formed of ferrite of 8 mm thickness. The maximum magnetic field is 107 mT at 198 A of current.
FIG. 52 is a plot showing the magnetic field in the magnetic member of a source resonator (such as the source resonator shown in FIG. 47A). In FIG. 52, the magnetic member is formed from ferrite tiles of dimension 15 cm by 10 cm by 8 mm. The maximum magnetic field is 101 mT at 198 A of current.
FIG. 53 is a plot showing the magnetic field in the magnetic member of a device resonator (such as the device resonator shown in FIG. 47B). In FIG. 53, the magnetic member is formed of ferrite of thickness 8 mm.
FIGS. 54A and 54B are plots showing the magnetic field at a distance of 1 cm above a source resonator having the configuration shown in FIG. 47A. FIG. 55 is a plot showing the magnetic field at a distance of 1 cm above a source resonator having the configuration shown in FIG. 47A, plotted on a logarithmic scale.
As discussed above, in some embodiments, currents in parallel windings that form a resonator coil can be balanced by crossing the windings (e.g., using twists) at points along the length of the windings. Other methods can also be used to balance currents in multiple parallel coil windings. In particular, referring to FIG. 56 for example, the currents in each of the parallel windings 5602, 5604, 5606 can be balanced using one or more inductors. FIGS. 57A and 57B show schematic circuit diagrams of a set of inductors 5702, 5704, 5706 connected in series and used to balance currents in a resonator coil with parallel windings 5602, 5604, and 5606. In some embodiments, as shown in FIG. 57B, one or more (or even all) of inductors 5702, 5704, 5706 can be tunable. In general, the series connected inductors add inductance to the respective windings to which they are connected. By adding suitable amounts of inductance to some or all of the windings, the effective inductance of each winding can be adjusted to achieve a predetermined or target current distribution among the various windings of a coil.
To balance currents in the parallel windings 5602, 5604, and 5606 (henceforth referred to as windings 1, 2 and 3, respectively, or as the innermost, middle, and outermost windings, respectively), the inductances of each of the parallel windings can be measured, and inductors 5702, 5704, and 5706 can be adjusted based on the measured inductances to balance currents in the parallel windings. Inductors 5702, 5704, are 5706 may be referred to as L1Δ, L2Δ and L3Δ, respectively, in the following discussion. In general, a variety of adjustable inductors can be used for inductors 5702, 5704, and 5706. Suitable adjustable inductors are disclosed, for example, in U.S. Patent Application Publication No. 2015/0051750, the entire contents of which are incorporated herein by reference.
The methods discussed below can be performed during the manufacturing phase of a resonator, so that inductors with suitable inductance values can be included in a resonator at time of fabrication. That is, the methods can be performed with the goal of selecting and/or adjusting inductors connected in series with parallel coil windings so that when manufacturing of the resonator is complete, the inductances of the coil windings have been adjusted to achieve a particular predetermined partitioning of the total coil current among the windings. As discussed above, the partitioning can correspond to a nominally equal distribution of current among the windings, but can also correspond to an unequal distribution of current.
The methods can also be performed post-manufacture by an electronic processor that is part of, or connected to, the resonator. The electronic processor can be configured to determine suitable inductance values of adjustable inductors once in a single optimization sequence. Alternatively, the processor can be configured to repeat the steps discussed below multiple times (e.g., at predetermined time intervals and/or in response to a user signal) for purposes such as calibration and re-calibration, in response to changes in the operating environment and/or parameters of a resonator. The discussion below describes various steps that an electronic processor can perform. It should be appreciated that these steps can be performed pre- and/or post-fabrication of a resonator coil, and also that certain steps can be performed during the design phase by a human.
In wireless power transfer systems, current balancing steps and methods can be performed by one or more electronic processors (e.g., processor 105 and/or 111) during operation of the system. FIG. 74 is a flow chart 7400 that includes a series of steps for balancing currents in parallel windings of a resonator coil. In the discussion of FIG. 74 that follows, the three parallel windings 1, 2, and 3 above are referenced. More generally, however, it should be understood that the methods disclosed herein can be used to balance currents in any number of parallel windings that form a resonator coil.
In a first step 7402, the electronic processor determines the inductance matrix L of the three connected windings, represented by inductance values L1, L2 and L3. In some embodiments, L1<L2<L3 to accommodate parallel windings in which L1 is the innermost winding, L2 is the middle winding, and L3 is the outermost winding. The components of the inductance matrix L can be obtained directly by measuring the coupling between the windings (e.g., using an inductance sensor connected to the electronic processor, not shown in FIG. 56). The electronic processor is configured to receive coupling (i.e., inductance) measurements from the sensor, and to determine values of the diagonal elements in matrix L based on the measurements. Specifically, the diagonal elements in L correspond to each winding's inductance measured when the other windings are open-circuited by the electronic processor. The other elements Li,j=Lj,i are obtained by measuring the inductance Ii,j of a connected winding i while short-circuiting connected winding j, since




  
    l
    
      
        i
        ,
        j
      
      ⁢
      
        
      
    
  
  =
  
    
      
        
          L
          i
        
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            L
            
              i
              ,
              j
            
            2
          
          
            L
            j
          
        
      
      ->
      
        L
        
          i
          ,
          j
        
      
    
    =
    
      
        
          
            L
            j
          
          ⁡
          
            (
            
              
                L
                i
              
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                l
                
                  i
                  ,
                  j
                
              
            
            )
          
        
      
      .
    
  




When a sinusoidal voltage of amplitude V, oscillating at the angular frequency ω, is applied to the windings connected in parallel, the amplitude of the currents flowing in the three windings is determined by:




  
    [
    
      
        
          
            I
            1
          
        
        
          
            I
            2
          
        
        
          
            I
            3
          
        
      
    
    ]
  
  =
  
    
      
        L
        
          -
          1
        
      
      ω
    
    ⁡
    
      [
      
        
          
            V
          
        
        
          
            V
          
        
        
          
            V
          
        
      
      ]
    
  




For example, for L1=21.9 μH, L2=23.0 μH, L3=23.7 μH, I1,2=5.24 μH, I1,3=6.35 μH and I2,3=5.61 μH. In this example, the inductance measurements received by the electronic processor are used by the processor to determine the following inductance matrix:




  L
  =
  
    
      (
      
        
          
            21.9
          
          
            19.6
          
          
            19.2
          
        
        
          
            19.6
          
          
            23.0
          
          
            20.3
          
        
        
          
            19.2
          
          
            20.3
          
          
            23.7
          
        
      
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    ⁢
    
      μH
      .
    
  




The corresponding current repartition in the presence of a shared voltage V across windings 1, 2, and 3 connected in parallel is:




  
    [
    
      
        
          
            I
            1
          
        
        
          
            I
            1
          
        
        
          
            I
            
              3
              ⁢
              
                
              
            
          
        
      
    
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  =
  
    
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    ⁢
    
      
        
          10
          4
        
        ⁢
        V
      
      ω
    
  




This current repartition corresponds to the following relative repartition of the total current among the three windings: (48.45%, 25.36%, 26.19%). Thus, without balancing currents in such a coil, current I1 is nearly twice as large as I2 or I3.
In step 7404, the electronic processor determines the desired or target current repartition among the windings. The target current repartition can be a set of stored values retrieved from a memory or data storage unit, a set of values supplied by a user, or a hard-coded or fixed implementation in circuitry. The target current repartition represents the performance condition that the electronic processor attempts to achieve by adjusting individual inductances coupled to the coil windings. As discussed above, in some embodiments the target repartition corresponds to an equal division of the total current among the windings. This example will be discussed in more detail below. More generally, however, the methods and systems disclosed herein can achieve any target repartition of the total current among the windings.
The electronic processor then determines, in step 7406, the correcting inductances L1Δ and L2Δ to be added in series with respectively L1 and L2 to achieve, e.g., an evenly split current repartition (i.e. I1=I2=I3) with the minimum amount of added inductance, before the process ends at step 7408. L1Δ and L2Δ are given by:

L1Δ=L3−L1+L2,3−L1,2 

L2Δ=L3−L2+L1,3−L1,2 

In the previous example, this yields L1Δ=2.5 μH and L2Δ=0.3 μH, and the corrected current repartition becomes:




  
    [
    
      
        
          
            I
            1
            Δ
          
        
        
          
            I
            2
            Δ
          
        
        
          
            I
            3
            Δ
          
        
      
    
    ]
  
  =
  
    
      
        
          
            1
            ω
          
          ⁡
          
            [
            
              L
              +
              
                [
                
                  
                    
                      
                        L
                        1
                        Δ
                      
                    
                    
                      0
                    
                    
                      0
                    
                  
                  
                    
                      0
                    
                    
                      
                        L
                        2
                        Δ
                      
                    
                    
                      0
                    
                  
                  
                    
                      0
                    
                    
                      0
                    
                    
                      0
                    
                  
                
                ]
              
            
            ]
          
        
        
          -
          1
        
      
      ⁡
      
        [
        
          
            
              V
            
          
          
            
              V
            
          
          
            
              V
            
          
        
        ]
      
    
    =
    
      
        (
        
          1.58
          ,
          1.58
          ,
          1.58
        
        )
      
      ⁢
      
        
          
            10
            4
          
          ⁢
          V
        
        ω
      
    
  




As explained previously, the foregoing discussion of flow chart 7400 involved three windings 1, 2, and 3 and an even current repartition by way of example. More generally, however, the methods for current balancing shown in flow chart 7400 can be applied to coils with any number n of parallel windings, and to target a desired current repartition between these windings. Thus, for a coil with n parallel windings electrically connected in parallel, the following steps can be performed by the electronic processor to balance currents in each of the windings.
First, in step 7402, the electronic processor determines the inductance matrix L of the n windings. The components of L can be obtained directly by measuring the coupling (i.e., inductances) between the windings. The diagonal elements in matrix L are each connected winding's inductance measured when the other windings are open-circuited. The off-diagonal matrix elements Li,j=Lj,i are determined by the electronic processor by measuring the inductance Ii,j of each winding i while short-circuiting winding j, since




  
    L
    
      i
      ,
      j
    
  
  =
  
    
      
        
          L
          i
        
        -
        
          
            L
            
              i
              ,
              j
            
            2
          
          
            L
            j
          
        
      
      ->
      
        L
        
          i
          ,
          j
        
      
    
    =
    
      
        
          
            L
            j
          
          ⁡
          
            (
            
              
                L
                i
              
              -
              
                l
                
                  i
                  ,
                  j
                
              
            
            )
          
        
      
      .
    
  




Then, in step 7404, the electronic processor determines the desired or target repartition of the total current among the coil windings. Next, in step 7406, the electronic processor determines appropriate inductance values of the inductors to effect the target current repartition in the n windings from any combination of LiΔ, . . . LnΔ (i−1 to n) added in series with respect to winding 1 through n. The added inductances LiΔ can be implemented so that they do not couple magnetically with any of the n windings nor with one another. Because there is no cross-coupling, the inductances LiΔ are added along the diagonal of the L matrix, leaving the other elements of L unchanged. The repartition is determined by the electronic processor by computing the inverse matrix:




  
    M
    Δ
  
  =
  
    
      [
      
        L
        +
        
          [
          
            
              
                
                  L
                  1
                  Δ
                
              
              
                ...
              
              
                0
              
            
            
              
                ⋮
              
              
                ⋱
              
              
                ⋮
              
            
            
              
                0
              
              
                ...
              
              
                
                  L
                  n
                  Δ
                
              
            
          
          ]
        
      
      ]
    
    
      -
      1
    
  




which yields the corresponding current amplitude IiΔ repartition:





  
    [
    
      
        
          
            I
            1
            Δ
          
        
        
          ...
        
        
          
            I
            n
            Δ
          
        
      
    
    ]
  
  =
  
    
      
        M
        Δ
      
      ω
    
    ⁡
    
      [
      
        
          
            V
          
        
        
          
            ⋮
          
        
        
          
            V
          
        
      
      ]
    
  




where V is the shared voltage across the windings connected in parallel.

The electronic processor determines the combination of inductances L1Δ, . . . , LnΔ that minimizes the figure of merit:




  
    ∑
    
      i
      =
      1
    
    n
  
  ⁢
  
    
      (
      
        
          
            I
            i
            Δ
          
          
            ∑
            I
          
        
        -
        
          1
          n
        
      
      )
    
    2
  




where ΣI=IiΔ for i=1 to n and where n equals the number of connected coils.

In some embodiments, combinations of inductances LiΔ, . . . , LnΔ that yield approximately equal current repartition in the n windings may be more easily found with the addition of large inductor values. In the absence of other constraints, some large values of LiΔ, . . . , LnΔ may naturally minimize the figure of merit:




  
    ∑
    
      i
      =
      1
    
    n
  
  ⁢
  
    
      
        (
        
          
            
              I
              i
              Δ
            
            
              ∑
              I
            
          
          -
          
            1
            n
          
        
        )
      
      2
    
    .
  




For example, in certain embodiments, the added inductances L1Δ, . . . , LnΔ can be much larger than the inductances of the windings. As an example, L1Δ= . . . =LnΔ=∞ would yield an ideal current repartition among the windings. Similarly, if the added inductances L1Δ, . . . , LnΔ are much larger than the most inductive winding, a near-perfect current splitting can result. However, this may not be useful from a practical standpoint. For practical reasons, considerations such as space constraints, limiting additional losses, limiting the additional amount of magnetic material, limiting unwanted additional overall inductance, and limiting additional complexity in wireless power transfer systems can be taken into account by the electronic processor during the optimization. For example, the number of windings n may be limited due to the space constraints placed on the overall size of the source resonator coil. In some embodiments, the range of values for L1Δ, . . . , LnΔ may be constrained to be less than or equal to the scaled inductance of the windings:

LiΔ≦αLi 

where α is a scalar between zero and the difference between the maximum inductance of a winding and the minimum inductance of a winding.

In certain embodiments, the number of windings m to which additional inductance is added can be determined by the electronic processor. The number of windings to which additional inductance is added may be limited to be less than or equal to the total number of windings n. In some embodiments, the number of windings m to which additional inductance is added can be determined before optimizing the current distribution over the n windings. In certain embodiments, different combinations of the number of windings m to which additional inductance is added can be iteratively selected during the current distribution optimization.
In some embodiments, if m=n−1, the one winding where no inductor is added is the one that has the largest inductance. Conversely, if m<n−1, inductors can be added to the winding that have the lowest inductance and leave the n−m windings with the largest inductance without additional inductors for current balancing. In certain embodiments, an electronic processor can control the adding of inductors based on changes to the order of inductance of the windings depending on external factors (presence of a device, presence of lossy materials, etc.).
For example, for n=3 windings and m=1, three different optimizations can be performed by the electronic processor, in each optimization setting two of the three inductance values of the additional inductors to zero, as follows:

L2Δ=L3Δ=0   (optimization 1)

L1Δ=L3Δ=0   (optimization 2)

L1Δ=L2Δ=0   (optimization 3)

The electronic processor can optimize the combination of additional inductances (L1Δ, L2Δ, L3Δ) that minimizes:




  
    
      (
      
        
          
            I
            1
            Δ
          
          
            ∑
            I
          
        
        -
        
          1
          3
        
      
      )
    
    2
  
  +
  
    
      (
      
        
          
            I
            2
            Δ
          
          
            ∑
            I
          
        
        -
        
          1
          3
        
      
      )
    
    2
  
  +
  
    
      (
      
        
          
            I
            3
            Δ
          
          
            ∑
            I
          
        
        -
        
          1
          3
        
      
      )
    
    2
  




where ΣI=I1Δ+I2Δ+I3Δ. This yields three optimized configurations and corresponding current distributions in the three windings. The electronic processor can then compare the three configurations to determine which additional inductor, L1Δ, L2Δ, or L3Δ, yields the best results in terms of current distribution (or another metric).

In some embodiments, as shown in FIG. 57C, a single inductor 5702 can be used to yield approximately equal current repartition among multiple parallel coil windings. For example, a single inductor L1Δ=2.18 μH (i.e. L2Δ=L3Δ=0) connected to winding 5602 (the innermost winding) can significantly improve current repartition, with an approximately 33.5%-34.6%-31.9% predicted distribution. These results are within 5% of a target of approximately equal current distribution (e.g., 33.3%) in each winding. In some embodiments, the optimization can be performed iteratively by the electronic processor until the current distribution in each of the windings is within 20% (e.g., within 15%, within 10%, within 5%) of a target current distribution, which can be (but need not be) an equal current distribution among the windings. The process shown in flow chart 7400 then ends at step 7408.
In certain embodiments, a slightly reduced current in outermost winding 5606 (winding 3) can be advantageous, since the longer length of winding 5606 yields a resistance that can be about 8% higher than the resistance of the other windings. In some embodiments, a specific current distribution may be desired and the electronic processor can minimize a more general figure-of-merit




  
    ∑
    
      i
      =
      1
    
    n
  
  ⁢
  
    
      (
      
        
          
            I
            i
            Δ
          
          
            ∑
            I
          
        
        -
        
          s
          i
        
      
      )
    
    2
  




where si is the targeted fraction of the total current flowing in winding i (thus Σi=1nsi=1). For example, one of the windings may be less effectively cooled compared to other windings and thus, current repartition may be changed accordingly. In another example, some windings may have a different than expected resistance or inductance at the time of manufacture and an electronic processor may be able to compensate for these differences.

In some embodiments, inductor L1Δ can include a pair of cores formed from magnetic material. For example, an inductor with a planar E-core formed of ferrite can be used. For an inductor with a 2 mm gap and 4 turns of 4200/44 Litz wire, the inductor L1Δ can dissipate approximately 3.2 W at a source current value Is=140 ARMS. Inductor L1Δ can be wound with the same Litz wire as the innermost winding (winding 5602) and can therefore simplify the connection. In certain embodiments, with the addition of inductor L1Δ, the overall inductance measurements yield:




  L
  =
  
    
      (
      
        
          
            24.2
          
          
            19.6
          
          
            19.2
          
        
        
          
            19.6
          
          
            23.0
          
          
            20.3
          
        
        
          
            19.2
          
          
            20.3
          
          
            23.7
          
        
      
      )
    
    ⁢
    
      μH
      .
    
  




When a voltage V is applied across the three windings connected in parallel, the following relationship is the result:




  
    (
    
      
        I
        1
      
      ,
      
        I
        2
      
      ,
      
        I
        3
      
    
    )
  
  =
  
    
      (
      
        1.56
        ,
        1.68
        ,
        1.52
      
      )
    
    ⁢
    
      
        
          
            10
            4
          
          ⁢
          V
        
        ω
      
      .
    
  




The current repartition among the windings can be calculated by summing the elements in the above vector (1.56+1.68+1.52=4.76) and dividing each element by the sum. This shows that the innermost winding can carry 32.8% of the current, while the middle winding carries 35.2% of the current and the outermost winding carries 32.0% of the current. For example, for a wireless power transfer system that is tested at 2.5 kW output with 27.8 ARMS total current in the source coil (with three parallel windings), the following current repartition is achieved:

innermost winding: 8.4 ARMS (30.2%),

middle winding: 9.9 ARMS (35.7%),

outermost winding: 9.5 ARMS (34.1%).

This current repartition is close to the expected current repartition based on low-power measurements.

In current embodiments, windings that carry larger currents can reach higher operating temperatures and/or dissipate the most power. FIGS. 58A and 58B are images showing temperature measurements for windings in a coil carrying a total of 10 A of current during operation. The middle winding 5604 heats up to a temperature that is slightly larger (see FIG. 58A, measurement at location 5802) than the temperature of innermost winding 5602 and outermost winding 5606 (see FIG. 58B, measurement at location 5804), consistent with the predictions above. FIG. 59 is a plot showing the current carried in each of windings 5602 (curve 5902), 5604 (curve 5904), and 5606 (curve 5906) as a function of time. As shown in the figure, the current carried in the middle winding (winding 5604) is larger than the currents carried in the innermost and outermost windings, accounting for the greater heating of the middle winding.
Hardware and Software Implementation
FIG. 75 shows an example of an electronic controller 7503, which may be used with the systems and methods described herein. As mentioned earlier, the electronic controller (and more specifically, an electronic processor thereof such as processor 105 and/or 111) can be used to perform any of the control and/or computation functions disclosed herein, including controlling power transfer of a wireless power transfer system, for example, by changing power output of a power source, adjusting operation and/or resonant frequencies and adjusting impedance matching networks. The electronic controller 7503 can be used to control the current directions, magnitudes and phases of different coils relative to other coils. In some embodiments, the electronic controller 7503 can be directly connected to, or wirelessly communicate with, various elements of the system.
Electronic controller 7503 can include a processor 7502 (e.g., corresponding to processor 105 and/or 111), memory 7504, a storage device 7506 and interfaces 7508 for interconnection. The processor 7502 can process instructions for execution within the electronic controller 7503, including instructions stored in the memory 7504 or on the storage device 7506. For example, the instructions can instruct the processor 7502 to determine parameters of the system such as efficiency of power transfer, operating frequency, resonant frequencies of resonators and impedance matching conditions. The electronic controller 7503 can determine type, size and alignment of a power receiving apparatus based on detection signals from one or more sensors. In certain embodiments, the processor 7502 is configured to send out control signals to various elements (e.g., power source, power transmitting apparatus, power receiving apparatus, power repeating apparatus, impedance matching networks) to adjust the determined parameters. For example, control signals can be used to tune capacitance values of capacitors in an impedance matching network. In certain embodiments, control signals can be used to adjust operation frequency of a power source. Control signals can change capacitance value of a capacitor in a resonator to tune its resonant frequency, and/or change inductance values of tunable inductors to repartition currents among parallel windings in a resonator coil.
The memory 7504 can store information about optimized parameters of the system. For example, the information can include optimized impedance matching conditions for various levels of power output from the power source. In certain embodiments, the memory 7504 can store information such as resonant frequencies of resonator and magnetic properties (e.g., magnetic permeability depending on power levels) of magnetic components in the system, which can be used by the processor 7502 for determining signals to be sent out to control various elements in the system. The memory can also store a set of values corresponding to a target current repartition.
The storage device 7506 can be a computer-readable medium, such as a floppy disk device, a hard disk device, an optical disk device, or a tape device, a flash memory or other similar solid state memory device, or an array of devices, including devices in a storage area network or other configurations. The storage device 7506 can store instructions that can be executed by processor 7502 described above. In certain embodiments, the storage device 7506 can store information described in relation to memory 7504.
In some embodiments, electronic controller 7503 can include a graphics processing unit to display graphical information (e.g., using a GUI or text interface) on an external input/output device, such as display 7516. The graphical information can be displayed by a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information. A user can use input devices (e.g., keyboard, pointing device, touch screen, speech recognition device) to provide input to the electronic controller 7503. In some embodiments, the user can monitor the display 7516 to analyze the power transfer conditions of the system. For example, when the power transfer is not in optimum condition, the user can adjust parameters (e.g., power transfer level, capacitor values in impedance matching networks, operation frequency of power source, resonant frequencies of resonators) by inputting information through the input devices. Based on the receive input, the electronic controller 7503 can control the system as described above.
In some embodiments, the electronic controller 7503 can monitor hazardous conditions of the system. For example, the electronic controller 7503 can detect over-heating in the system and provide an alert (e.g., visual and/or audible alert) to the user through its graphical display or audio device.
In certain embodiments, electronic controller 7503 can be used to control magnitudes and phases of currents flowing in one or more coils of the wireless power transfer system. For example, processor 7502 can calculate and determine the magnitudes and phase of currents to be supplied to coils in a power transmitting apparatus. The determination can be based on the monitored power transfer efficiency and information stored in memory 7504 or storage unit 7506.
A feedback signal can be received and processed by the electronic controller 7503. For example, the electronic controller 7503 can include a wireless communication device (e.g., radio-frequency, Bluetooth receiver) to receive information from either or both of a power transmitting apparatus and a power receiving apparatus (which can have its own wireless communication device). In some embodiments, the received information can be processed by processor 7502, which can further send out control signals to adjust parameters of the system as described above. For example, the control signals can be used to adjust the magnitudes and phases of currents flowing in one or more coils of resonators in the system to increase the power transfer efficiency.
Various embodiments of the systems and techniques described here can be realized by one or more computer programs that are executable and/or interpretable on the electronic controller 7503. These computer programs (also known as programs, software, software applications or code) include machine instructions for a programmable processor, and can be implemented in a high-level procedural and/or object-oriented programming language, and/or in assembly/machine language. For example, computer programs can contain the instructions that can be stored in memory 7504 and storage unit 7506 and executed by processor 7502 as described above. As used herein, the terms “computer-readable medium” refers to any computer program product, apparatus and/or device (e.g., magnetic discs, optical disks, memory, Programmable Logic Devices (PLDs)) used to provide machine instructions and/or data to a programmable processor, including a machine-readable medium that receives machine instructions.
Generally, electronic controller 7503 can be implemented in a computing system to implement the operations described above. For example, the computing system can include a back end component (e.g., as a data server), or a middleware component (e.g., an application server), or a front end component (e.g., a client computer having a graphical user-interface), or any combination therefor, to allow a user to utilized the operations of the electronic controller 7503.
The electronic controller 7503 or one or more of its elements can be integrated in a vehicle. The electronic controller 7503 can be utilized to control and/or monitor wireless power charging of a battery installed in the vehicle. In some embodiments, the display 7516 can be installed adjacent to the driving wheel of the vehicle so that a user may monitor conditions of the power charging and/or control parameters of the power charging as described in relation to FIG. 75. The display 7516 can also visualize information traffic information and road maps based on Global Positioning System (GPS) information. Any of the elements such as the processor 7502, memory 7504 and storage device 7506 can be installed in the space behind the display 7516, which can visualize the data process by those elements.
Other Embodiments
While this disclosure contains many specific implementation details, these should not be construed as limitations on the scope of the disclosure, but rather as descriptions of features in connection with embodiments. Features that are described in the context of separate embodiments can also generally be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable sub-combination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can generally be excised from the combination, and the claimed combination may be directed to a sub-combination or variation of a sub-combination.
In addition to the embodiments expressly disclosed herein, other embodiments are within the scope of the disclosure.

## Claims

1. A system for wireless power transfer, comprising:
a resonator comprising a coil with at least two windings, each of the at least two windings comprising a plurality of loops formed by a conductive material and extending in a plane, wherein corresponding portions of each of the at least two windings are oriented in parallel, wherein at least one of the windings has a length that differs from a length of another one of the windings, and wherein the at least two windings are electrically connected in parallel; and
at least one inductor having an inductance value, wherein the at least one inductor is connected in series to at least one of the windings,
wherein the inductance value is selected so that when the coil carries a current during operation of the system, the at least one inductor maintains a distribution of current flows among the at least two windings such that for each of the at least two windings, an actual current flow in the winding differs from a target current flow for the winding by 10% or less.

2. The system of claim 1, wherein the at least one inductor comprises an adjustable inductance value.

3. The system of claim 1, wherein corresponding portions of each of the at least two windings are oriented in parallel along at least 80% of a length of at least one of the windings.

4. The system of claim 1, wherein the loops of each winding are interleaved.

5. The system of claim 1, wherein the loops of each winding are concentric and form a spiral.

6. The system of claim 1, further comprising an electronic processor coupled to the at least two windings and configured to control electrical currents in each of the windings based on the target current flows for the at least two windings.

7. The system of claim 6, wherein the electronic processor is configured to control electrical currents in each of the windings by:
determining a target inductance value for the at least one inductor based on a figure of merit related to the target current flows; and
adjusting the inductance value of the at least one inductor to match the target inductance value.

8. The system of claim 7, wherein the electronic processor is configured to determine the target inductance value by:
(i) for each one of the windings:
determining a self-inductance value of the one winding based on a measurement of inductance of the one winding when it is electrically disconnected from all other windings; and
determining a plurality of cross-inductance values of the one winding, wherein each cross-inductance value is based on a measurement of inductance of the one winding when it is electrically disconnected from another one of the windings;

(ii) determining the target current flows for each of the windings based on the self-inductance values and the cross-inductance values; and
(iii) determining the target inductance value based on the target current flows for each of the windings.

9. The system of claim 8, wherein the electronic processor is configured to determine the target current flows by:
constructing an inductance matrix based on the self-inductance values and the cross-inductance values of each of the windings;
calculating an adjusted inductance matrix by adding to the inductance matrix an inductance modification matrix comprising elements that correspond to changes in inductance of each of the windings due to the at least one inductor;
calculating an inverse matrix of the adjusted inductance matrix; and
determining the target current flows based on the inverse matrix.

10. The system of claim 9, wherein the inductance modification matrix is a diagonal matrix, and wherein diagonal elements of the inductance modification matrix are inductance values of respective members of the at least one inductor connected to the windings.