NASA Technical Memorandum 4787

Thermal Conductivity Database of Various

Structural Carbon-Carbon Composite Materials

Craig W. Ohlhorst, Wallace L. Vaughn, Philip O. Ransone, and Hwa-Tsu Tsou

Langley Research Center • Hampton, Virginia

National Aeronautics and Space Administration

Langley Research Center • Hampton, Virginia 23681-2199

November 1997
The use of trademarks or names of manufacturers in this report is for

accurate reporting and does not constitute an official endorsement,

either expressed or implied, of such products or manufacturers by the

National Aeronautics and Space Administration.

Available electronically at the following URL address: http://techreports.larc.nasa.gov/ltrs/ltrs.html

Printed copies available from the following:

NASA Center for AeroSpace Information

800 Elkridge Landing Road

Linthicum Heights, MD 21090-2934

(301) 621-0390

National Technical Information Service (NTIS)

5285 Port Royal Road

Springfield, VA 22161-2171

(703) 487-4650
Contents

Abbreviations ..................................................................... v

Abstract .......................................................................... 1

Introduction ....................................................................... 1

Experimental Procedures ............................................................. l

Results ........................................................................... 3

Concluding Remarks ................................................................ 3

References ........................................................................ 3

Tables ........................................................................... 4

Figures .......................................................................... 33

.o.

III

Abbreviations

C-C

CCAT

CVD

CVI

Condit

FAW

fab

HSW

HT

ip

LaRC

LoPIC

Max

orth

PPC

t-t-t

temp

3-D

carbon-carbon composites

Carbon-Carbon Advanced Technologies

chemical vapor deposition

chemical vapor infiltration

conditioning

fabric areal weight

fabrication

harness satin weave

heat treatment

in-plane

Langley Research Center

Low-pressure Pitch Impregnation and Carbonization

maximum

orthogonal

preceramic polymer coating

through-the-thickness

temperature

three-dimensional

Abstract

Advanced thermal protection materials envisioned for use on future hypersonic

vehicles will likely be subjected to temperatures in excess of 1811 K (2800°F) and,

therefore, will require the rapid conduction of heat away from the stagnation regions

of wing leading edges, the nose cap area, and from engine inlet and exhaust areas.

Carbon-carbon composite materials are candidates for use in advanced thermal

protection systems. For design purposes, high temperature thermophysical property

data are required, but a search of the literature found little thermal conductivity data

for carbon-carbon materials above 1255 K (1800°F). Because a need was recognized

for in-plane and through-the-thickness thermal conductivity data for carbon-carbon

composite materials over a wide temperature range, Langley Research Center

(LaRC) embarked on an effort to compile a consistent set of thermal conductivity

values from room temperature to 1922 K (3000°F) for carbon-carbon composite

materials on hand at LaRC for which the precursor materials and thermal processing

history were known. This report documents the thermal conductivity data generated for these materials. In-plane thermal conductivity values range from 10

to 233 W/m-K, whereas through-the-thickness values range from 2 to 21 W/m-K.

Introduction

Advanced thermal protection systems envisioned for

use on future hypersonic vehicles will likely be subjected

to temperatures in excess of 1811 K and, therefore, will

require the rapid conduction of heat away from the stagnation regions of wing leading edges, the nose cap area,

and from engine inlet and exhaust areas. Carbon-carbon

(C-C) composite materials are lightweight, retain their

strength at high temperatures, and have high and tailorable thermal conductivity. These characteristics make

them attractive candidates as advanced thermal system

materials.

Carbon-carbon composites comprise a family of

materials having a carbon matrix reinforced with carbon

fibers. A large variety of both fibers and matrix precursor

materials is used. The choice of precursor materials and

the thermal processing used to fabricate the composites

are major factors which determine the thermophysical

properties of the materials. Availability of this information enables the user (designer or researcher) to better

utilize the thermophysical property data and allows for

more meaningful comparisons between data sets. A

search of the literature found little thermal conductivity

data for C-C materials above 1255 K. In some instances,

thermal conductivity data were reported, but an adequate

description of the precursor materials and the thermal

processing history was not reported.

Because a need was recognized for in-plane and

through-the-thickness thermal conductivity data for C-C

composite materials over a wide temperature range,

Langley Research Center (LaRC) embarked on an effort

to compile a consistent set of thermal conductivity values

from room temperature to 1922 K for C-C composite

materials on hand at LaRC for which the precursor materials and thermal processing history were known. This

report documents the thermal conductivity data generated for these materials.

Experimental Procedures

Table 1 gives a description of the 28 materials for

which thermal diffusivity measurements were made and

reported in this report. All the materials were derived

from previous studies aimed at improving mechanical

properties and/or oxidation resistance. Material specimens 1 through 10 and 16 through 18 were fabricated to

investigate the effects of different reinforcements and

different densification techniques on mechanical properties. Material specimens 11 through 15 were fabricated to

explore the benefits of candidate substrate oxidation

inhibitors and coating types. Material specimens 19

through 26 were fabricated to investigate the effects of

chemical vapor infiltration (CVI) processing parameters

on the thermal conductivity and mechanical properties of

carbon-carbon composites. Material specimens 27

and 28 were fabricated as candidate materials for a thermal shield on a proposed NASA Solar Probe Spacecraft.

The source of each material is in the second column

of table 1. The fiber type and tow size are in the third column. Most of the materials were made with Amoco

T-300 fiber. Two materials were made with Amoco T-50

fiber, four were made with Celanese Celion fiber, and

two were made with Mitsubishi Kasel DIALEAD K321

fiber. All specimens except the four that were made with

Celion fibers were constructed by using an 8 harness

satin weave (8HSW) fabric. The number of tows per inch

in both the warp and fill direction is given. Material specimens 16, 17, and 18 are stitched panels. A detailed

description of their construction is given in reference I.

The weave construction for the materials made with the

Celion fiber were 3-D orthogonal. A detailed description

of the construction of these four material panels (material
specimens7 through10)is givenin reference2. The

layupforallmaterialsexceptthosemadewiththeCelion

fiberwas0/90°, andmostof themwere7- or 8-ply

laminates.

All thematerialswereinitially preparedby prepreggingthefabric/3-Dpreformswithaphenolicresin

andmoldingintocarbon-phenoliccomposites. Thephenolicresinwasthenconvertedintothecarbonmatrixby

inert-environment pyrolysis.A varietyof densification

methodswasusedtoincreasethedensitiesof thesecompositesto desiredlevels.Phenolicresinwasthematrix

for aboutone-thirdthematerials.CVI-depositedpyrolyticcarbonwasthematrixforanotherthird.TwoRohr,

Inc., densificationprocesses,designatedby themas

"Low-pressurePitchImpregnationandCarbonization

(LoPIC)"and"hybrid,"wereusedontheremainingthird

of thematerials.In theLoPICprocess,bothphenolic

resinandpitchareusedasmatrixmaterial.Thehybrid

processis a combinationof usingCVI and LoPIC

processes.

Thefiberheattreatmenttemperatureandmaximum

compositefabricationtemperaturearealsogivenin the

table.For materialspecimens1 through18,thefabric

hadheattreatmenttemperaturesof 2273K exceptthe

threemadeby theBoeingCompanyandRohrwhich

wereheattreatedat 2423K. Themaximumcomposite

fabricationtemperaturewaseither1173K or 1923K

exceptfor specimen15;thismaterialhadbeencoatedat

a temperatureof about2033K. In orderto geta more

directcomparisonofresultsbetweentheuncoatedmaterialsintheoriginalsetof 18,thedecisionwasmadethat

the finishedcompositematerials(1-10 and 16-18)

shouldall beconditionedtothesamefinaltemperature.

Thefinishedcompositeswereheatedto thefiberheat

treatmenttemperatureof 2273K. None of the commercial materials (11 through 15) were conditioned, since

the thermophysical property data would not be representative of off-the-shelve commercial material. The fiber

heat treatment temperature for material specimens 19

through 26 was 2623 K and the CVI densification was

done at 1323 K. The fibers in both material specimens 27

and 28 were heat treated to 2273 K. Material 27 had a

maximum composite fabrication temperature of 2373 K,

whereas material 28 had a maximum composite fabrication temperature of 2973 K.

The tenth column in table 1 indicates whether the

material contained inhibitors and/or had been coated.

The three Boeing/Rohr materials are the only ones to

have inhibitors. The nomenclature of 0.2 FAW designates 20 percent by fabric areal weight. Two of the

Boeing/Rohr materials (12 and 13) and material 15 are

the only three coated materials. The next to last column

lists the direction in which the thermophysical properties

were measured. Coated materials were only measured in

the through-the-thickness direction for reasons discussed

in the next paragraph. The last column gives additional

information on the construction of the 3-D and stitched

materials.

Material specimens were provided to D.P.H.

Hasselman at the Virginia Polytechnic Institute and State

University for thermal diffusivity characterization. The

thermal diffusivity was measured by the flash diffusivity

method, which basically consists of subjecting one side

of a sample to a single laser flash and then monitoring

the transient temperature response on the other side

(refs. 3 and 4). A round specimen, 0.45 inch in diameter,

was used for through-the-thickness direction measurements. For in-plane measurements, a square specimen

was used. This square specimen was fabricated by cutting rectangular pieces 0.118 inch wide by 0.340 inch

high and then stacking sufficient pieces together in the

thickness direction to make the stack approximately

0.340 inch thick. In-plane diffusivity measurements were

not made on the three coated materials because the stacking of the rectangular pieces required for the in-plane

specimen would have left columns of coating within the

stacked thickness and thus would have invalidated the

measurement. Data were taken in increments of approximately 373 K from room temperature to 1938 K for

material specimens 1 through 26 and to 2448 K for material specimens 27 and 28. The data reported by

Hasselman to LaRC were temperature and thermal

diffusivity.

The thermal conductivity k of a material is related to

its thermal diffusivity data by the following equation

(ref. 4):

k = pO_Cp

where p is the density; ¢t, the thermal diffusivity; and Cp,

the heat capacity (specific heat). Bulk density measurements at room temperature were obtained from mass and

volume measurements. Although the density of carboncarbon material does change slightly with temperature,

this change was neglected because only minimal error is

introduced. Carbon-carbon composites made with T-300

fibers have an in-plane coefficient of thermal expansion

(CTE) of 0.56 x 10-6/K and through-the-thickness CTE

of 2.04 x 10-6/K values from 811 K to 1366 K (ref. 5).

With the use of these CTE values, the volume of the

material would increase a maximum of about 1.5 percent

from room temperature to 1922 K. This volume change

was considered to be sufficiently small so that density

could be taken as a constant for the thermal conductivity

calculations reported in this paper.

Experimental values of the specific heat of graphitic

materials taken from figure 2B-1 of reference 6 are
plottedinfigure1.Thesedatawerecurvefittedwiththe

followingempiricalequation:

cp = -38.0528 + 0.041618T + 741.254/T

- 0.707584,4rT + 19.0915 logl0T J/g-K

where T is temperature in kelvins.

The values of specific heat reported in this report

and subsequently used to calculate thermal conductivity

were calculated by this equation. This equation cannot be

used to calculate the specific heat for coated materials

because it does not take into account the coating. Since

specific heat was not experimentally measured, there are

no heat capacity data for the three coated materials; thus,

thermal conductivity values are not reported for those

materials.

Results

Figures 2 and 3 summarize the thermal conductivity

results. Figure 2 shows the range of in-plane thermal

conductivity data for materials evaluated in this report,

and figure 3 shows the range of through-the-thickness

thermal conductivity data. The temperatures and corresponding thermophysical property data for the individual

materials are shown in tables 2 through 29. Thermal diffusivity as a function of temperature is plotted for all

materials (figs. 4 through 31). Values are given in both

square centimeters per second (cm2/s) and square feet

per hour (ft2/hr). Temperatures are shown in both kelvin

(K) and degrees Fahrenheit (°F). For uncoated materials,

both in-plane and through-the-thickness values are plotted. For coated materials, only through-the-thickness values are shown because that was the only direction in

which measurements were made. For both in-plane and

through-the-thickness directions, thermal diffusivity values are maximum at room temperature and decrease with

increasing temperature. Values are fairly fiat from 1200

to 1900 K.

Thermal conductivity values for each of the

uncoated materials are plotted in figures 32 through 56.

Thermal conductivity in units of both watts per meterkelvin (W/m-K) and British thermal units per hour-feetdegrees Fahrenheit (Btu/hr-ft-°F) are given as a function

of temperature in both kelvins and degrees Fahrenheit.

For the in-plane direction, maximum thermal conductivity values ranged from 20 to 68 W/m-K for all materials

except that of material 28, which had a maximum value

of 233 W/m-K. For the through-the-thickness direction,

maximum thermal conductivity values ranged from 3

to 12 W/m-K for all materials except that of material 28

which had a maximum value of 21 W/m-K. In general

maximum thermal conductvity occurred around 500 K.

As with the thermal diffusivity values, thermal conductivity values were fairly fiat from 1200 to 1900 K.

Concluding Remarks

Carbon-carbon composite materials are candidates

for use in advanced thermal protection systems. Because

a need was recognized for in-plane and through-thethickness thermal conductivity data for carbon-carbon

composite materials over a wide temperature range,

Langley Research Center (LaRC) embarked on an effort

to compile a consistent set of thermal conductivity values

from room temperature to 1922 K (3000°F) for carboncarbon composite materials on hand at LaRC for which

the precursor materials and thermal processing history

were known. This report documents the thermal conductivity data generated for these materials. In-plane thermal

conductivity values range from 10 to 233 W/m-K,

whereas through-the-thickness values range from 2

to 21 W/m-K.

NASA Langley Research Center

Hampton, VA 23681-2199

July 16, 1997

References

I.

2.

3.

4.

5.

Yamaki, Y. R.; Ransone, P. O.; and Maahs, Howard G.:

Investigation of Stitching as a Method of lnterlaminar

Reinforcement in Thin Carbon-Carbon Composites. The 16th

Conference on Metal Matrix, Carbon, and Ceramic Matrix

Composites, John D. Buckley, ed., NASA CP-3175, Part l,

1992, pp. 367-386.

6.

Ransone, Philip O.; Spivack, Bruce D.; and Maahs, Howard

G.: Mechanical Properties of Thin 3-D Reinforced CarbonCarbon Composites Densified With Different Matrices. The

16th Conference on Metal Matrix, Carbon, and Ceramic

Matrix Composites, John D. Buckley, ed., NASA CP-3175,

Part 1, 1992, pp. 347-366.

Tawil, H.; Bentsen, L. D.; Baskaran, S.; and Hasselman,

D. P. H.: Thermal Diffusivity of Chemically Vapour Deposited

Silicon Carbide Reinforced With Silicon Carbide or Carbon

Fibres. J. Mater. Sci., vol. 20, Sept. 1985, pp. 3201-3212.

Parker, W. J.; Jenkins, R. J.; Butler, C. P.; and Abbott, G. L.:

Flash Method of Determining Thermal Diffusivity, Heat

Capacity, and Thermal Conductivity. J. Appl. Phys., vol. 32,

no. 9, Sept. 1961, pp. 1679-1684.

Ohihorst, Craig W.; and Ransone, Philip O.: Effects of

Thermal Cycling on Thermal Expansion and lnterlaminar

Mechanical Properties of Advanced Carbon-Carbon

Composites. NASA TP-2734, 1987.

Touioukian, Y. S.; and Buyco, E. H.: Thermophysical

Properties of Manet Volume 5--Specific Heat, Nonmetallic

Solids. Y. S. Touloukian, ed., IFI/Plenum, 1970.

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Figure 1. Specific heat for carbon-graphite from TPRC (Thermophysical Properties Research Center) data (ref. 6).

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.4

.2

0 .... t .... I , , , , I , , , , I .... I .... I , , = t 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 4. Thermal diffusivity versus temperature for LaRC panel 7A, which is T-300 3k phenolic densified material.

36
Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '-

.

Specimen 2 1.0

.8

L'M

._z2

._>

.6 m

"1o

=E

Q)

.4 "¢: I--

.2

0 , , , , I .... I , , , J I i , J , I , , , , I , , , , I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 5. Thermal diffusivity versus temperature for LaRC panel 7B, which is T-300 3k LoPIC densified material.

37
-10

.30

.25

.20

(3

"-_ .15

_-- .10

.05

Temperature, °F

490 990 1490 1990 2490 2990

_ _ _ I ' _ _ _ 1 _ _ ' ' I _ _ _ _ I .... I _ ' _ ' I '-

Specimen 3 1.0

.8

c_

.6 "_

:3

=1=

no

LE

.4

.2

0 , , , , 1 , , , , I .... I , , , i I i i i = I i = i i I i i i i 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 6. Thermal diffusivity versus temperature for LaRC panel 6, which is T-300 3k hybrid densified material.

38
-1(

30

25

.20

CM

E

0

.__

ffl

_ .15

"0

f_

r"

_- .10

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' ' ' ' I ' _ ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '-

Specimen 4

In-plane

0 , , , , I , , , , I , , _ , I .... I .... I .... I ....

250 500 750 1500 1750

10

1000 1250

Temperature, K

8

>

.6 cn

:E_

E

G)

4 5

.2

0

2000

Figure 7. Thermal diffusivity versus temperature for LaRC panel 7C, which is T-300 3k CVI densified material.

39
-10

.30

.25

.20

o,I

E

t3

._>

-, .15

"o

e.-

_- .10

.05

Temperature, °F

490 990 1490

' ' ' .' I ' ' ' ' I ' ' ' '

1990 2490 2990

I ' ' ' ' I ' ' ' ' I '-

Specimen 5 1.0

.8

.E

¢q

¢:

.>

.6 ¢n

"o

E

.4

.2

0 .... I , , , j I , , , , I , , , , I , , , , I , , , , I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 8. Thermal diffusivity versus temperature for LaRC panel 1P, which is T-50 3k phenolic densified material.

4O
-0

.30

.25

.20

"_ .15

E

t-

}- .10

.05

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '-

Specimen 6

1.0

.8

.E

°m

>

.6 "_

a_

.E

.4

.2

0 .... I .... I , , , i I _ , J , I i , , , I , , , , I , L , = 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 9. Thermal diffusivity versus temperature for LaRC panel 9H, which is T-50 3k hybrid densified material.

41
-10

.30

.25

"_= .15

#-- .io

.05

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' ' ' ' I ; ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '-

Specimen 7

f

1.0

.8

>

.6 _

.-I

=t=

-o

_)

.4

.2

0 .... I , , , , I _ = , , I , , , , I J , , , I .... I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 10. Thermal diffusivity versus temperature for LaRC panel 10-1, which is Celion 3k phenolic densified material.

42
-10

.30

.25

.20

Eo

'3 .15

.10

.05

0

250

Temperature, °F

490 990 1490 1990 2490 2990

i ' ' ' ' f _ ' ' _ I ' _ _ ' I ' ' ' ' I ' ' ' ' I _-

Specimen 8 1.0

.8

c_

>

.6 "_

It:

"o

t_

E

Q)

.4

.2

.... I .... I i i i i I i i i i I i i i i I i i i i I i J J t 0

500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 11. Thermal diffusivity versus temperature for LaRC panel 10-3, which is Celion 3k LoPIC densified material.

43
.30

.25

S

"_ .15

.10

.05

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' f _ _ I _ f ' _ 1 ' _ _ _ 1 ' ' ' ' I _ ' ' ' I '-

Specimen 9 1.0

.8

.6 "_

"1o

(D

.4

.2

0 _ _ _ _ I _ , i i I i J i = I , J i i I J i i i t = , , , I .... 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 12. Thermal diffusivity versus temperature for LaRC panel 9-1, which is Celion 3k/2k phenolic densified

material.

44
.30

.25

.20

O_

E

cJ

: .15

"0

¢-

_- .10

0

I I I I

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '-

Specimen 10

In-plane

0 J i t i I i , , , I .... I i i i i I A J i J I i L i i I , _ _ J

250 500 750 1500 1750

1.0

1000 1250

Temperature, K

.8

%

>

.6 "_

m

E

.4 #__.

.2

0

2000

Figure 13. Thermal diffusivity versus temperature for LaRC panel 9-3, which is Celion 3k/2k LoPIC densified material.

45
-10

.30

.25

.20

E

(.)

-, .15

e--

_- .10

.05

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' I ' ' ' ' I ' ' ' ' I ' ' _ ' I ' w , , I ' ' ' ' I '-

Specimen 11

In-plane

1.0

.8

z_.D

>

.6 "_

-I

"10

E

_)

.4

.2

0 I J I J I J I I I I I I I I I = I , , I .... I .... I , , i , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 14. Thermal diffusivity versus temperature for Boeing/Rohr T-300 lk hybrid densified material.

46
-ll

.30

.25

.20

E

o

2

-_ .15

"o

m

E

e.-

_- .10

.05

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '

Specimen 12

_ t-t-t

1.0

.8

2

.6 ca

"1o

E

G)

.4

.2

0 , , J = I , J , , I , J _ , I , , , , I , , i , I t , L , I J J , J 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 15. Thermal diffusivity versus temperature for CVD-coated Boeing/Rohr T-300 1k hybrid densified material.

47
.30

.25

.20

O4

E

°_

-, .15

¢..

_- .10

.O5

0

250

Temperature, °F

490 990 1490 1990 2490 2990

.... l ' ' ' ' I ' ' ' ' I .... I ' ' ' ' I ' ' _ ' I '-

Specimen 13

______-t-t

1.0

.8

poJ

>

.6 "_

=::

o_

"1o

(_

.4 .EI-

.2

.... I .... I , , , , I , , , , I , , , , I .... I , = i i 0

500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 16. Thermal diffusivity versus temperature for PPC-coated Boeing/Rohr T-300 l k hybrid densified material.

48
-10

.30

.25

.20

OJ

E

0

", .15

"0

E

0

e--

I- .10

.O5

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '

Specimen 14

In-plane

t-t-t

1.0

.8

OJ

.6 "_

-s

"0

E

.4 "¢: I-

.2

0 , , , , I , J , J I , , , , I , , , , I , , , , I , , , , I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure l 7. Thermal diffusivity versus temperature for CCAT T-300 3k phenolic densified material.

49
-10

.30

.25

.20

E

._>

03

= .15

:==

E

e-

_- .10

.05

Temperature, °F

490 990 1490 1990 2490 2990

.... I ' ' ' ' i ' ' ' ' I ' ' _ ' I ' ' ' ' I ' ' ' _ I '-

_ t-t-t

Specimen 15 1.0

.8

.>_

.6 (n

'10

E

.4

.2

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 18. Thermal diffusivity versus temperature for Type III coated CCAT T-300 3k phenolic densified material.

5O
-1(

.30

.25

.20

CM

E

o

"- .15

"o

e.-

_- .10

.05

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '-

Specimen 16

In-plane

1.0

.8

(M

.I

.6 _

:I=

"o

I

E

.4 #__.

.2

0 .... I , a , , I , i , , I , , i , I , , L , I , , , , I _ , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 19. Thermal diffusivity versus temperature for LaRC stitched panel 2, which is T-300 3k phenolic densified

material.

51
.30

.25

"_ .15

.10

.05

0

250

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '-

Specimen 17 1.0

.8

oJ

_c

.6 "_

"1o

E

.4 t- F-

.2

, , , , I , i J , I .... I .... I .... I .... I .... 0

500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 20. Thermal diffusivity versus temperature for LaRC stitched panel 5, which is T-300 3k phenolic densified

material.

52
-10

.30

.25

.20

L'%I

"_ .15

.10

.05

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '-

Specimen 18

o

1.0

.8

>

.6 "_

-i

E

.4

.2

0 _ J , _ I , , , , I , , , , I , , , _ I , , , , I , , , , I , , i J 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 21. Thermal diffusivity versus temperature for LaRC stitched panel 8, which is T-300 3k phenolic densified

material.

53
-10

.60

.50

.40

E

._-2

ffl

-, .30

°_

eI-- .20

.10

Temperature, °F

490 990 1490 1990 2490 2990

Specimen 19

"___/mplane

2.0

1.6

°m

1.2 _

=1=

"o

t_

al

.8

.4

t-t-t

0 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 22. Thermal diffusivity versus temperature for LaRC J1, which is T-300 3k CVI densified material.

54
-10

.60

.50

u_ .40

E

ol

-_ .30

"0

¢-

!- .20

.10

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '

Specimen 20

J

_ ,_ t-t-t

2.0

- .4

1.6

Od

z_

>

1.2 "_

'-'i

:t=

0 , , ; , I , = , , I L , J , I J = , , I J , , , I i , , , I , I , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 23. Thermal diffusivity versus temperature for LaRC J2, which is T-300 3k CVI densified material.

55
-10

.60

.50

o_ .40

c_J

E

o

z

o_

= .30

.e2_

"o

e-

.20

.10

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I

Specimen 21

_ _ t-t-t

0 , , , , I , , , , I , , , , I , , , , I , , , , I , , , , I , , , ,

250 500

1.6

o_

.>

1.2 (n

.=_

"1o

(1>

.8 e-- t---

.4

0

750 1000 1250 1500 1750 2000

Temperature, K

Figure 24. Thermal diffusivity versus temperature for LaRC J3, which is T-300 3k CVI densified material.

56
Temperature, °F

-11 490 990 1490 1990 2490 2990

.60 .... I .... I .... I .... I .... I .... I ' -

Specimen 22

.50

.10 - .4

_ t-t-t

0 .... I , , , i l , i , , I l , , i I , , , , I , , , , I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 25. Thermal diffusivity versus temperature for LaRC J4, which is T-300 3k CVI densified material.

,_ .40

t9

"_ .30

_- .20

2.0

1.6

O4

>

1.2 "_

-1

=:_

"0

.8 _

t--

57
-10

.60

.5O

.40

_ .30

P- .20

.10

0

250

Temperature, °F

490 990 1490 1990 2490 2990

Specimen 23

In-plane

_ t-t-t

2.0

1.6

¢:

1.2 "_

.4

.... t .... I , , , , I , , , , i , _ , , I , , , , I .... 0

500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 26. Thermal diffusivity versus temperature for LaRC J5, which is T-300 3k CVI densified material.

58
.60

.50

.40

oa

E

(..)

ffl

-, .30

°--

"0

e-

_- .20

.10

0

I I I I

_ t-t-t

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '-

In-plane

Specimen 24 2.0

1.6

oa

._>

1.2 (n

=E_

"10

I

.8 5

.4

0 , , , , I .... I , L J , I , , L , I , , , , I , , , , I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 27. Thermal diffusivity versus temperature for LaRC J6, which is T-300 3k CVI densified material.

59
-10

.60

.50

.40

_ .30

.20

.10

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' I I I ' ' I l I I I I I I ' I I I I I I ' ' I '-

Specimen 25 2.0

m

___ _ t't-t

500 750 1500 1750

1.6

o_1

,m

>

1.2 "_

-,I

.8 __

.4

0 0

250 1000 1250 2000

Temperature, K

Figure 28. Thermal diffusivity versus temperature for LaRC JT, which is T-300 3k CVI densified material.

6O
-10

.60

.5O

.40

E

(J

>

-, .30

c-

_- .20

.10

In-plane

__ t-t-t

1990 2490 2990

' I ' ' ' ' I ' ' ' ' I '-

Specimen 26 2.0

1.6

=>,

>

1.2 "_

"-,l

.8

.4

0 .... I , , , , I J , J i I , J , , I , , , , I .... I f I J = 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 29. Thermal diffusivity versus temperature for [.,aRC J8, which is T-300 3k CVI densified material.

61
.60

.5O

.40

E

Or)

-, .30

eI- .20

.10

0

250

Temperature, °F

990 1490 1990 2490 2990 3490 3990

ISpecimen 27 2.0

1.6

.4

0

1000 1250 1500 1750 2000 2250 2500

Temperature, K

m

__ _ t-t-t

.... I .... I,,,, I,, , , I , , , , I , _ J i I , , , , I , , , , I ....

500 750

Figure 30. Thermal diffusivity versus temperature for LaRC F1, which is K321 2k phenolic densified material.

¢q

z;

1.2 "_

3

"0

.8

62
-I0

2.00 I ....

1.50

E

0

._>

__ 1.00

.=_

l--

F-

.50

Temperature, °F

1490 1990 2490

In-plane

5

4

3

2

0 0

250 500 750 1000 1250 1500 1750 2000 2250 2500

Temperature, K

Figure 31. Thermal diffusivity versus temperature for LaRC P1, which is K321 2k AR pitch densified material.

t-

(/)

.B

"O

t_

it"-

63
-10

45

4O

35

30

25

tO 20

0

,-- 15

10

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' 1 ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I

- 25

Specimen 1

lane

_j'_ t-t-t

20

15 m

10 °

eI--

5

0 , J , , I , , , , I .... I .... I .... 1 , , , I I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 32. Thermal conductivity versus temperature for LaRC panel 7A, which is T-300 3k phenolic densified material.

64
45

40

35

i

25

-I

tO 20

0

IDf- 15

I'--

10

0

i 1 i i

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '

- 25

Specimen 2

_ _ t-t-t

5 _

0 , , , , I .... I .... j _ , , , I , , , , I .... I ....

250 500 750 1500 1750

20

LL

o

¢.-

-1

15 m

.__

0

-1

tO

10 °

ID

l'-

I'--

1000 1250

Temperature, K

0

2000

Figure 33. Thermal conductivity versus temperature for LaRC panel 7B, which is T-300 3k LoPIC densified material.

65
45

4O

35

3O

._ 25

o=

lo

tO 20

o

._ 15

10

Temperature, °F

490 990 1490 1990 2490 2990

.... I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' 1 ' ' ' ' I '

- 25

Specimen 3

f

t-t-t

=..=...._.,

2O

LL

0

15 m

--,i

to

10 o

eI---

5

0 .... I .... I , , , , I , , , , I , , , , I , , , , I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 34. Thermal conductivity versus temperature for LaRC panel 6, which is T-300 3k hybrid densified material.

66
-10

45

4O

35

"_' 3O

25

"6

"I

"13

tO 20

_- 15

I---

10

Temperature, °F

490 990 1490 1990 2490 299(

I .... I .... I ' ' ' ' I ' ' ' ' I ' ' ' ' I

Specimen 4

0 , , , , I , , _ , I , , , , I , , j , I j , , , I , , , , I ....

250

i

- 25

2O

5

0

500 750 1000 1250 1500 1750 2000

Temperature, K

LL

o

=,L

¢..

15 m

.,..,

--I

e"

0

10 °

1-

Figure 35. Thermal conductivity versus temperature for LaRC panel 7C, which is T-300 3k CVI densified material.

67
-1(

45

40

35

I_F 25

'10

E

o 20

¢J

x: 15

i--

10

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' _ ' ' I ' ' ' ' I '

- 25

_ 20

Specimen 5

t-t-t

LL

oI

t15 m

"0

E

0

10 o

ID

t"-

k5

0 I = I i I , = I I I = = t = t .... I .... I .... 1 .... 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 36. Thermal conductivity versus temperature for LaRC panel 1P, which is T-50 3k phenolic densified material.

68
-11

45

40

35

,v,

_: 30

._> 25

"10

C

o 20

_- 15

t10

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' , I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '

- 25

In-plane

Specimen 6

5 _ t-t-t

0 i , i i I i i i L I i i , , l _ x , , I , , , , I .... I i i i J

250 500 750 1000 1250 1500 1750

Temperature, K

2O

0

2000

LL

oI

t'-

15

>

-Q

E

0

10 o

e.-

I--

Figure 37. Thermal conductivity versus temperature for LaRC panel 9H, which is T-50 3k hybrid densified material.

69
-10

45

40

35

i 30

20

(3

15

I--

10

5

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' ' ' ' I ' ' ' ' 1 ' ' ' ' I ' ' ' ' I ' ' ' ' I '

- 25

Specimen 7

In-plane

_ t-t-t

20

0 , , , , 1 , , , , I , , J t I , , , = I _ , , , I .... I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

ii

o

=,L

t-

¢-

IFigure 38. Thermal conductivity versus temperature for LaRC panel 10-l, which is Celion 3k phenolic densified

material.

7O
40

35

20

(.)

.c 15

10

I-

-0

45 ....

_ t-t-t

5

Temperature, °F

490 990 1490 1990 2490 2990

I .... I ' ' ' ' I .... I .... i .... I '

- 25

Specimen 8

20

0 , , i , I , , , , I .... I .... I , , , i I i , , , I .... 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

LL

o

t15 m

._>

-I

"0

tO

10 °

¢.-

Figure 39. Thermal conductivity versus temperature for LaRC panel 10-3, which is Celion 3k LoPIC densified material.

71
45

4O

35

30

20

(.,1

.= 15

t10

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '

- 25

Specimen 9

_ In-plane

t-t-t

2O

0 , J i , I , , , , I , , i i I , , i , I .... I .... I , i , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

LL

o

15 rn

o_

._>

"o

o

t..-

I---

Figure 40. Thermal conductivity versus temperature for LaRC panel 9-1, which is Celion 3k/2k phenolic densified

material.

72
-11

45

40

35

"_' 30

._ 25

o 20

0

E

_-- 15

t10

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I _ ' ' ' I ' w , , I ' ' ' ' I ' ' ' ' I '

- 25

Specimen 10

_ In-plane

,,

t-t-t _

5

0 L , , , I , , , , I .... I , , , , l _ , , , I , , , , I ....

250 500 750 1500 1750

20

1000 1250

Temperature, K

LIoI

15 m

-

g

10 o

5

t0

2000

Figure 41. Thermal conductivity versus temperature for LaRC panel 9-3, which is Celion 3k/2k LoPIC densified

material.

73
45

40

35

30

to 20

ID

_- 15

I10

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' 1 ' ' ' ' I ' ' ' ' I '

- 25

,_ In-plane

s_.t-t-t

Specimen 11

20

0 I , , i I , , , , I I , i i I i ' ' ' I .... I , , , , I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

LL

o

..C

--_

15

.__

tO

10 °

E

elFigure 42. Thermal conductivity versus temperature for Boeing/Rohr T-300 lk hybrid densified material.

74
-10

45

4O

35

i 30

o 20

¢3

_ 15

10

/--t-t-t 5 _-

0 i i i , I I = + , I i i , i I J , i i I i l j i J , , , , I ....

250

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' , I ' ' ' ' I .... I ' ' ' ' I ' ' ' , I

- 25

Specimen 14

In-plane 20

5

0

500 750 1000 1250 1500 1750 2000

Temperature, K

LL

° I

=,

t-

:3

15

>

E

O

10 _

e--

F--

Figure 43. Thermal conductivity versus temperature for CCAT T-300 3k phenolic densified material.

75
45

40

35

30

20

m

E

_-- 15

I--

10

5

Temperature, °F

490 990 1490 1990 2490 2990

' ' _ ' I ' ' ' ' I ' ' ' ' I ' ' ' _ I _ ' ' ' I ' ' _ _ I '

- 25

Specimen 16

20

0 , i i , I , i , i l , , , , I .... I .... I , , , , I ' ' ' ' 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

LI.

0

t-

.,.=,

15 m

z

e--

0

10 _

e'-

kFigure 44. Thermal conductivity versus temperature for LaRC stitched panel 2, which is T-300 3k phenolic densified

material.

76
-1(

45

40

35

i 30

20

u

E

(- 15

I--

10

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' l ' ' ' ' I '

-- 25

Specimen 17

_ t-t-t

0 , , , , I .... I , , , , I , , , _ I , , , , I , , , , I , , , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

20

ii

o

t15 m

._>

"o

t,-

o

10 o

-

rI5

Figure 45. Thermal conductivity versus temperature for LaRC stitched panel 5, which is T-300 3k phenolic densified

material.

77
45

40

35

"5 25

ow

tO

-1

"0

C

o 20

tO

x: 15

I---

10

5

0

250

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I '

- 25

Specimen 18

ln-plane

t-t-t

20

, , , i I .... I , , l , I , , i , I , , , , I , , , , I , , , , 0

500 750 1000 1250 1500 1750 2000

Temperature, K

LL

o

15 m

>

o_

tO

"0

¢-

0

10 tO

¢-

Figure 46. Thermal conductivity versus temperature for LaRC stitched panel 8, which is T-300 3k phenolic densified

material.

78
-10

7O

60

50

._ 40

._.2

"El

E

0

o 30

e1-

20

10

Temperature, °F

490 990 1490 1990 2490 2990

I .... I .... I .... I .... I .... I '- 40

Specimen 19

In-plane

35

S t-t-t

0 , J J , I , , , , I .... 1 i , , , I , , J , I , , , J I , i , , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

J

10

5

30

LL

o

25 _E

nn

>

20 "_

E

O

¢J

15 N

tI---

Figure 47. Thermal conductivity versus temperature for LaRC J1, which is T-300 3k CVI densified material.

79
-11

70

60

50

.__ 40

"10

cO

o 30

et20

10

Temperature, °F

490 990 1490 1990 2490 2990

.... I .... 1 .... I .... I .... I ' ' ' ' I "- 40

Specimen 20

___ In-plane _ _

35

30

LL

O|

=,

>

20 .=

0

"0

tO

0

15

e--

I---

10

5

0 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 48. Thermal conductivity versus temperature for LaRC J2, which is T-300 3k CVI densified material.

80
70

60

50

•_" 40

>

"O

E

O

_ 30

20

10

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I _- 40

Specimen 21

_--

0 t i i i I i i L i I i , , , I , , , , I , i L i I i , J , I , , , ,

250 500 750 1000 1250 1500 1750

Temperature, K

35

30

IJ0

25

<.,,

>

20 _

-'1

"O

E

O

15 N

(ID

r.-

10

5

0

2000

Figure 49. Thermal conductivity versus temperature for LaRC J3, which is T-300 3k CVI densified material.

81
-10

7O

60

50

_' 40

.D

>

_6

"0

C

0

o 30

e-

)-

20

10

Temperature, °F

490 990 1490 1990 2490 2990

' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' 40

Specimen 22

f I

35

t-t-t

500 750 1500 1750

3O

LL

O|

25 _

nn

20 _

no

to

o

15 _

et10

5

0 0

250 1000 1250 2000

Temperature, K

Figure 50. Thermal conductivity versus temperature for LaRC J4, which is T-300 3k CVI densified material.

82
-10

7O

60

50

_" 40

._>

"6

"o

to

o 30

¢-

t20

i i , i

Temperature, °F

490 990 1490 1990 2490 2990

I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I ' ' ' ' I _- 40

Specimen 23

10 _ t-t-t

0 .... l , , i , I , ( i , I , , , , I .... I , , , , I , i i i

250 500 750 1000 1250 1500 1750

Temperature, K

35

5

0

2000

30

LL

o

25

20 ,5

"o

to

15 "_

e.-

I---

10

Figure 51. Thermal conductivity versus temperature for LaRC J5, which is T-300 3k CVI densified material.

83
-10 490 990

7O

6O

5O

V"

.__ 40

.>

"0

tO

30

e--

20

10

Temperature, °F

1490 1990 2490

__,_,_ t-t-t

2990

40

35

30

U.

o

,.L

25

g3

20 _

f.-

0

15 "_

ek10

5

0 I I I I I J I I I I I I I I I I I I J I a = I I I I J I I I .... 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 52. Thermal conductivity versus temperature for LaRC J6, which is T-300 3k CVI densified material.

84
-I0

7O

6O

50

4o

o 30

e--

I---

20

10

Temperature, °F

490 990 1490 1990 2490 2990

I .... I .... I .... I .... I .... I " 40

Specimen 25 35

/_ t-t-t

0 .... I I J , , I I , , A I = , , , I , , , , I , , , , I .... 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

30

LL

o!

2s

20

"o

to

o

15 "_

ID

e--

10

Figure 53. Thermal conductivity versus temperature for LaRC JT, which is T-300 3k CVI densified material.

85
-11

70

6O

5O

.__ 40

._>

"I

"10

tO

o 30

el"

20

10

Temperature, °F

490 990 1490 1990 2490 2990

.... I .... I ' ' ' ' I .... I .... I .... I = 40

Specimen 26

t-t-t

35

3O

2O '_

"10

E

0

0

15 "_

E

e.-

10

5

0 J , _ , I , J , , I , , I I I i , , , I , , , , I , , , , I _ , l , 0

250 500 750 1000 1250 1500 1750 2000

Temperature, K

Figure 54. Thermal conductivity versus temperature for LaRC J8, which is T-300 3k CVI densified material.

86
-10

70

60

50

v

40

.>

"5

"t3

tO

o 30

l.-

I.--

20

10

Temperature, °F

490 990 1490 1990 2490 2990 3490 3990

'''' I''' ' I'''' I'''' I'''' I'''' I'' _' I''' ' "1- 40

Specimen 27

_-' _ t-t-t

0 ,, ,, I t _,, I _,,, I,,,, I,, ,, I, _ j _ I _,,, I ,,, _ I,, , t

250 500

35

5

0

750 1000 1250 1500 1750 2000 2250 2500

Temperature, K

3O

i1

o

..E

25 "_

m

._

20 _

tO

0

15 "_

e--

I---

10

Figure 55. Thermal conductivity versus temperature for LaRC FI, which is K321 2k phenolic densified material.

87
-10

250

200

150

._>

o

"13

E

o

(J

100

eI---

50

Specimen 28

In-plane

l_,t-t,-t, t , ,

0

250 500 750 1000

3990

I

- 140

120

2O

= I _ , , , I .... I .... I .... I , , , , 0

1250 1500 1750 2000 2250 2500

Temperature, K

ii

100 o

¢n

8o

.>_

3

"D

60 g

o

E

t40 _-

Figure 56. Thermal conductivity versus temperature for LaRC PI, which is K321 2k AR pitch densified material.

88

Form Approved

REPORT DOCUMENTATION PAGE OMBNo.0704-0188

Pubtic reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources,

gathering and maintaining the date needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect Of this

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1. AGENCY USE ONLY (Leave blank) 2. REPORT DATE 3. REPORT TYPE AND BATES COVERED

November 1997 Technical Memorandum

4. TITLE AND SUBTITLE 15. FUNDING NUMBERS

Thermal Conductivity Database of Various Structural Carbon-Carbon

Composite Materials WU 632-20-2 i -13

6. AUTHOR(S)

Craig W. Ohlhorst, Wallace L. Vaughn, Philip O. Ransone, and

Hwa-Tsu Tsou

7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES)

NASA Langley Research Center

Hampton, VA 23681-2199

9. SPONSORING/MONITORINGAENCYNAME(S)ANDADDRESS(ES)

National Aeronautics and Space Administration

Washington, DC 20546-0001

!8. PERFORMING ORGANIZATION

REPORT NUMBER

L-17620

10. SPONSORING/MONITORING

AGENCY REPORT NUMBER

NASA TM-4787

11. SUPPLEMENTARY NO'rES

Ohlhorst, Vaughn, and Ransone: Langley Research Center, Hampton, VA; Tsou: NRC/NASA Resident Research

Associate at Langley Research Center, Hampton, VA.

12a. DISTRIBUTION/AVAILABILITY STATEMENT

Unclassified-Unlimited

Subject Category 24

Availability: NASA CASI (301) 621-0390

12b. DISTRIBUTION CODE

13. ABSTRACT (Maximum 200 words)

Advanced thermal protection materials envisioned for use on future hypersonic vehicles will likely be subjected to

temperatures in excess of ! 811 K (2800°F) and, therefore, will require the rapid conduction of heat away from the

stagnation regions of wing leading edges, the nose cap area, and from engine inlet and exhaust areas. Carboncarbon composite materials are candidates for use in advanced thermal protection systems. For design purposes,

high temperature thermophysical property data are required, but a search of the literature found little thermal conductivity data for carbon-carbon materials above 1255 K (1800°F). Because a need was recognized for in-plane and

through-the-thickness thermal conductivity data for carbon-carbon composite materials over a wide temperature

range, Langley Research Center (LaRC) embarked on an effort to compile a consistent set of thermal conductivity

values from room temperature to 1922 K (3000°F) for carbon-carbon composite materials on hand at LaRC for

which the precursor materials and thermal processing history were known. This report documents the thermal conductivity data generated for these materials. In-plane thermal conductivity values range from 10 to 233 W/m-K,

whereas through-the-thickness values range from 2 to 21 W/m-K.

14. SUBJECTTERMS

Carbon-carbon composites; Thermal conductivity

17. SECURITY CLASSIFICATION

OF REPORT

Unclassified

NSN 7540-01-280-5600

18. SECURITY CLASSIFICATION

OF THIS PAGE

Unclassified

19. SECURITY CLASSIFICATION

OF ABSTRACT

Unclassified

16. NUMBER OF PAGES

94

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A05

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OF ABSTRACT

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