# OAR Box 1413 Prepped by Ollie Stewart



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Number: 

# 14 ) 11-1-1 4 Docket Number: 

# A-94-5 2

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# POLIC YSTATEMENTO N REDUCIN G AI R EMISSION S FRO M OPE N MOLDIN G COMPOSITE S FABRICATIO N
1
. Th e 199 0 Amendment s t o th e Clea n Ai rAc t (CAA ) mandat e substantia l reduction s i n th e emission s of VOC s an d hazardou s ai rpollutants , whil e minimizin g th e economi can d energ ycost s ofsuc h reductions
. Th e Composite s Fabricator s Associatio n an d it s ope n moldin g processin g member s acknowledg e thei r obligatio n t o achieve significan t reduction s an d inten d t o cooperat e wit h Federa l an d Stat e agencie s t o accomplis h thi s objective
. 2
. T o mee t thi s obligation , th e ope n molding , composite s industr yi s prepare d t o embrac e substantia l chang e fro m curren t practices
. Th e promotio n an d implementatio n o fsouree reductio n technologie s i s th e mos t feasibl e cours e ofaction
. Thes e change s mayinvolve materials , proces s an d equipmen t an d importan t modification s i n wor k practices
. Thes e change s are more desirabl e fro m bot h a n environmenta l an d a n economi cperspective tha n add-o n emission s controls , suc h a s therma l oxidatio n o rcarbo n adsorption
. 3
. Th e us e o fsourc e reduction , whic h minimize s th e releas e ofstyren e an d othe rVO C emissions , wil l resul t i n a ne t saving s fo rfabricators i n man ycases . I n contras t t o th e releas e o fpain t solvents , whic h i s a n inheren t part o fth e paintin g process , composite s fabricators see k t o captur e styren e monome ri n th e molde d product
. Th e EP

Ahas itsel frecognize d th e environmenta l superiorityo fachievin g clea n ai rthroug h sourc e reduction , rathe rtha n add-o n emission s treatmen t devices
. 4
. Aworkabl e ope n moldin g emission s reductio n strateg ywil l includ e modification s ofra wmaterials , proces s technologies , applicatio n techniques , an d wor k practices , usin g method s an d equipmen t tha t are currentl yavailabl e an d prove n i n advance d facilitie s i n thi s segmen t ofth e industry
. 5
. Emission s o fvolatil e solvent s suc h a s aceton e an d methylen e chlorid e shoul d b e reduce d t o th e lowest possibl e levels , a s mos t advance d fabricators have alread ydone
. Althoug h no t al l volatil e organi csolvent s are liste d a s CA

Ahazardou s ai rpollutants , reductio n i n us e i s sensibl e conservatio n an d wil l reduc e overal l VOC emission s as wel l a s worke ran d publi cexposure t o thes e materials
. 6
. Th e attache d char

t set s ou t a broa d rang e ofviabl e change s i n ra wmaterials , proces s technologie s an d wor k practice s tha t ca n serve a s th e basi s ofa n effective emission s sourc e reductio n contro l strateg yfo e th e ope n moldin g industry
. Man yofthes e change s paralle l th e requirements ofCalifomi a Rul e 50,**wnich wit h it s curren t exemption s i s a feasibl e an d viabl e emission s sourc e reauctio n contro l regulation
. Additiona l technologies , no t include d i n th e Californi a regulation , are identifie d i n thes e contro l plfi n options
. 7
. Add-o n emission s treatmen t device s are no t currentl yfeasibl e fo rth e compostt€{s inuustry , fo ra numbe r o freasons : a . Collectio n an d concentratio n o fai rcontaminate s i s a majo rengineerin g proble m i n ope n moldin g composite s productio n facilities
. Becaus e o fOSH Alimitation s o n worke r exposure t o styrene , hig h ai rflow s are necessar yt o dilut e irreducibl e styren e emissions
. b
. Therma l oxidatio n i s highl yundesirabl e becaus e i t is : i
. highl yinefficien t whe n applie d t o ai rcontainin g styren e concentration s a t o rnea rth e OSH APE L standards ; . ; . ; j j \;j

TP. 3



### ii . beyon d th e capita l expenditure capabilityofa vas t majorit yo fope n moldin g composite s fabricators . Di . highl yenerg yintensiv e an d i n th e lon g ru n contrar yt o U.S . energ y conservatio n an d relate d environmenta l policies ; iv . a sourc e o

fNO x

### an d CO 2 

### emission s tha t wil l interfere wit h th e attainmen t o

fEPA' s ai rqualityobjectives . c . Loca l oppositio n t o "hazardou s wast e incineration " coul d entai l year s ofdela yi n installin g therma l oxidatio n equipmen t a s a resul t o flega l proceeding s o rrequire d plan t relocation s befor e implementation . d . Carbo n adsorptio n technolog yha s not bee n full yprove n t o trea t ope n moldin g fabricatio n emissions , whic h ofte n include s peroxid e catalyst . Th e treatmen t ofspen t carbo n require s eithe rtherma l incineratio n o rsoli d wast e landfilling . Thes e treatmen t method s ru n contrar

yt o th e goa l o

fpollutio n reduction . 8 . Ope n moldin g composite s fabricators , thei rrepresentative trad e associations , rawmaterial s supplier s an d proces s equipmen t suppliers wil l continu e t o pursu e additiona l reduction s i n styren e an d othe rVO C emission s by : a . Encouragingresearc h o n lo wcost , effectiv

e wast e strea m treatmen t methods , suc h a s ton g wav e I R oxiaauo n an d ozon e injectio n technology . b . Activel yconductin g industr ytrainin g program s promotin g wit h sourc e reductio n methodologies . c . Encouragin g developmen t o flo wemissio n resin s an d resi n systems , i n additio n t o alternative monome ro radvance d polyme rresearc h b yresi n manufacturers . d . Encouragin g al l ope n moldin g composite s fabricator s t o make ful l us e o fcurrent! / availabl e lowstyren e an d styren e suppresse d resi n technolog yi n orde rt o promot e a market drive n deman d fo rimprove d sourc e reductio n technologies .

Composite s Fabricator s Associatio n Septembe r199 3

# OPEN MOLDIN GSOURC E REDUCTIO

N CONTRO L TECHNOLOGY Han d lay-u p /

Spray-u p /

Ge l Coa t Processin g Composite s Fabricator s Ass n Polyester/Vlnyleste rStyrenate d Resi n Applicatio n ecFA.AuguM.ie n PROCES S STE P POTENTIA L EMISSIO N POIN T MATERIAL S CONTRO L TECHNOLOG Y PROCES S CONTRO L TECHNOLOG Y WOR KPRACTIC E CONTRO L TECHNOLOG Y
MATERIA L HANDLIN G Storage *
Containers

Transferrin g (pouring ) materia l Mixin g operation s Additive blendin g operation s
FLUI D HANDLIN G EQUIPMEN T Inaerbn g pum p auctio n tub e i n dru m Pum p line s an d fittings Cleanin g fatsre an d screen s Purgin g rsei n line s

Relievin g hig h pressure One s Ope n to p container s o rpoorl y seale d lid s Duratio n betwee n openin g an d use . Residua l resi n o n dru m top . Drip s o n drum . Ope n to p containers , an d drips . Ope n top containers . Spill s an d drips . Ope n top containers . Spill s an d drips .

Ope n top container . Spate an d drips . Leak s Spill s en d drip * SpHIs . drip s an d overspray
Sp fIs . drip s an d overspray £;&* }

Us e pump s o rpou rspout s 

## 12 1 Us e mixers wit h close d top s (2 1 Us e mixers wit h dose d tope 12 1

Us e close d top wit h suctio n tub e access . [1 ]

Kee p proces s a s continuou s a s possibl e to avoi d purging . Us e purpos e mad e containe r to avoi d overspray . (3 ) Us e by-pas s hos e bec k Int o resi n container . ( 1 j Kee p wel l seale d lid s o n container s whil e i n storag e 

## I U Ope n drum s immediatel y befor e use . Avoi d spills . Clea n u p immediately . [1 ] Avoi d spill s [1 ]
Avoi d ope n tops an d spill s [1 1 Avoi d ope n tope an d spill s [1 ]

Avoi d ope n tops an d spills . (1 1 Mftlntaf n fitUngs sn d pum p packing s to avoi d leaks . [1 ] Avoi d leaks , spBI s an d drip s outsid e approve d container s 

## ( U Purg e gu n an d line e Int o a n approve d container . Avoi d •pit s an d drip s [1 ] Re-circulat e bac k

to resi n container . (1 1PROCES S STE P

GE L COA TAPPUCATIO N Spra yapplicatio n

Fa n patter n overspray

Curin g proces s

Postcurin g proces s

HAN D LAY-U P •BATC H MI X APPUCATIO N Contains rbansfe roperatio n

Resi n mbdn g operatio n

We t resi n applicatio n

Laminatin g operation s POTENTIA L EMISSIO N POIN T
Atomizin g ge l coa t int o spray pattern . Sprayin g of

fmol d edges . Sprayin g fro m lon g distances . Hig h ai rvelocitytransportin g atomize d ge l coa l Surfac e are a evaporation .

Residua l styren e evaporation .

Ope n top containers . Spill s an d drips . Ope n to p an d drips . Spill s

Wette d surfac e are a expose d to atmosphere .
Wette d surfoc e to atmosphere . are a expose d MATERIAL S CONTRO L TECHNOLOG Y
Us e lo wviscosit

yge l cos t (3 ]

Us e lowviscosit

yge l coa t (3 ]

Us e fas t ge l tim e ge l coa t (2 ]

Us e lowge l tim e ge l coa t [2 ]

Us e lo wstyren e o r styren e suppressed resi n wher e applicable . [3 ] Us e fille d syste m wher e applicable . |3 ]

Us e lo wstyren e o r styren e suppressed resi n wher e applicable . [3 ] Us e filed syste m wtwr a spptic&bls . [3 ] 

### PROCES S CONTRO L TECHNOLOGY
Us e lo wpressure o r ai r containmen t spra yequi p • 

# I D Us e fa n patte m wit h com » patabl e wit h par t siz e an d shape . Avoi d hig h velocityai r flo wi n sprayarea , [1 ] Maintai n adequat e minimu m sho p an d mol d temperatures to expedit e curing . Maintai n catalys t level s to expedit e curing . [2 ] Contai n pos t cur e area . Us e I R heatin g devices . (3 ]

Us e transfe rpump s o r pou r spouts . Us e pressure fed rolle rapplicator s to eliminat e thi s operation . [3 ] Mi xan d replac e H

d unt t use . Us e pressure fe d rolle r applicator s to eliminat e thi s operation . [3 ] Us e close d moldin g method . Desig n laminat e to reduce resi n usage . (4 ]

Kee p ai rflo wwHhl n ventilatio n limits . (2 ] Kee p ambien t temperature e withi n Hmits . [3 ] Us e doee d moldin g method . (4 ] WOR KPRACTIC E CONTRO L TECHNOLOG Y
Operat e spra yequipmen t a t lowes t poaswl s pressure . Spra ya s doe s to mol d a s practical . (1 ] Contai n spra ypatter n wHhl n mol d perimeter . Spra ya s dos s to mol d a s practical . Operat e spra yequipmen t a t lowest possibl e preeeure . 1*1 1 Calibrat e spra yequipmen t o n a regula rbasis . Appl y recommende d ge l coa t m l thickness . (1 ] 

### Monito rpos t cur s ternperatur

e an d dwel l time . 

# U l

Avoi d ope n top containers an d spills . [1 ]
Avoi d ope n top containers an d spills . [1 ]

T JPROCES S STE P

Reei n i n mi xcontainer s

laminat e curin g

Edg e Trimmin g operatio n

Post curin g proces s 

### HAN D LAV-U P - RESI N SPRA YAPPUCATIO N Sprayapplicatio n

Fa n patte m overspray

Laminatin g operation a

Laminate curin g POTENTIA L EMISSIO N POIN T Residua l resi n i n containers . Surfac e are a expose d to atmosphere . Surfac e are a evaporation .

Semi-cure d trim-of

fexpose d to atmosphere .
Residua l styren e evaporation .

Atomizin g resi n int o spray pattern .
Sprayin g of

fmol d edges . Sprayin g fro m lon g distance . Hig h ai rvelocit

ytransportin g atomize d resin .

Wette d surfac e are a expose d to atmosphere .
Surfac e are a evaporation . MATERIAL S CONTRO L TECHNOLOG Y Us e lo wstyren e o rstyren e suppresse d resi n wher e applicable . [3 ] Us s fille d syste m wher e applicabl e (3 ] Us e lo wstyren e o rstyren e suppresse d resi n wher e applicable . [3 ] Us e fille d syste m wher e applicable . [3 ]
Us e lowstyren e o rstyren e suppressed resi n wher e applicable . |3 ] us e fille d syste m wher e applicable . [3 ] Us e lowstyren e o rstyren e suppressed resi n wher e applicable . [3 ] Us e fille d syste m wher e applicable . (3 ]

Us e lowstyren e o rstyren e suppressed resi n wher e applicable . [3 ] Us e fille d syste m wher e applicable . [3 ] Ua e lowstyren e o rstyren e suppressed resi n wher e applicable . [3 ] Us s fille d syste m wher e applicable . [3 ]

Us e lowstyren e o rstyren e suppresse d resi n wher e applicable . (3 ] Us e fille d syste m wher e applicable . [3 ] Us e lowstyren e o rstyren e suppresse d resi n wher e applicable . [3 ] Us e fille d syste m wher e applicable . (3 ] PROCES S CONTRO L TECHNOLOG Y Us e measure d batc h mixes . 

### (2 1
Maintai n adequat e minimu m sho p an d mol d temperatures. Maintai n catalys t level s to expedite curing . [2 ] Us e minimu m velocit

yai rflow i laminate (3 ] Plac e trim-of

fi n dose d containe ro rsubmsrg s i n wate rbath . [2 ] Contai n pos t cur e are a if possibls . Us s I R heatin g devices . [3 ]

Eliminat e sprayin g wit h pressur s fe d rolle r applicators . [2 ] Ua e low pressur e o rai rcontainmen t sprayequipmen t (1 ] Eliminat e sprayin g wit h pressur e fe d rolle r applicators . (2 ] Us e lo w pressur e o rai rcontainmen t sprayequipmen t (1 ] Avoi d hig h velocit

yai rflo wi n apra y area . (1 1 Kee p ai rflo wwithi n ventilatio n limits . [2J Kee p ambien t temperatures withi n linuts (3 ] Us e deee d moldin g metiiod . 

### W Maintai n adequat e minimu m sho p an d mol d temperatures . Maintai n catalys t level s to expedit e curing . [2 ] Us e minimu m velocit

yai rflo w 

## P I WOR K PRACTIC E CONTRO L TECHNOLOG Y Avoi d ope n tops . Us e al l resin 

### (2 1 . +

Wor k wit h area s tha t allo w fastest reasonabl e ge l (2 ]

Plac e trim-of

fi n containe r immediatel yafte rremova l fro m par t (1 ) Monito rpos t cur s temperature an d dwel l time . (1 1
Operat e spra yequipmen t a t lowest possibl s pressure . ( 1 ]

Contai n fa n patte m md d perimeter . Spra ya s dos s to mol d a s practical . Operat e spra yequipmen t a t lowes t possibl e pressure . (1 ]

T JPROCES S STE P

EOQ #trimmin Q operatio n

SPRAY-U P APPUCATIO N Sprayapplicatio n

Fa n patter n overspray

Laminatin g operation s

Laminate curin g

Edg s trimmin g operatio n

Poe t curin g proces s POTENTIA L EMISSIO N POIN T Osffl i cuis d trim-of

fsxpoee d to strnoephere .
Residua l styren e evaporation .

Atomizin g pattem . reein int o apra y

Sprayin g of

fmd d sdges . Sprayin g fro m lon g distance . Hig h ai rvelocit

ytransportin g

Wette d surfac e are a expose d to atmosphere .

Surfac e are a evaporation .

Sem i cure d trim-of

fexpose d to atmosphere .
Residua l styren e evaporation . MATERIAL S CONTRO L TECHNOLOG Y Ue e lowstyren e o rstyren e suppresse d resi n wher e applicable . (3 ] Ua e fille d syste m wher e applicable . [3 ] Us e lowstyren e o rstyren e suppresse d resi n wher e applicable . (3 ) Us e fille d syste m wher e applicable . [3 ]

Us e lowstyren e o rstyren e suppresse d resi n wher e applicable . [3 ] Us e fille d syste m wher e applicable . [3 ] Us s lowstyren e o rstyren e suppresse d resi n wher e applicable . (3 ] Us e fille d syste m wher e applicable . [3 ]

Us e lo wstyren e o rstyren e suppresse d resi n wher e applicable . [3 ] Us e fille d syste m wher e applicable . [3 ] Us e lowstyren e o rstyren e suppresse d resi n wher e applicable . (3 ] Us e fille d syste m wher e applicable . [3 ]

Us e lowstyren e o rstyren e suppresse d resi n wher e applicable . [3 ] Us e filled syste m wher e applicable . [3 ] Ue e lo wg d time resin. (1 ] PROCES S CONTRO L TECHNOLOG Y Plac e trim-of

fi n doee d containe ro rsubmsrg s i n wate rbath . [2 ] Contai n pos t cur e are a i f possible . Us s I R heatin g devices . [3 ]

Us e lowpressure o rai r containmsn t sprayequipmen t 

### [1 1
Us e lowpressure o rai r containmen t spra y equipmen t (1 ] Avoi d hig h velocit yai rflo wi n aprayarea . 

# I U
Kee p ai rflo wwithi n ventilatio n limits . [2 ] Kee p ambien t temperatures withi n limits (3 ] Us s doee d moldin g metho d 

# w Maintai n adequat e minimu m sho p an d md d tempsraturss. Maintai n catalys t level s to expedit e curing . [2 ] Us s minimu m velocityai rflo w acros s laminate . [3 ] Plac e trim-of

fi n dose d containe ro rsubmsrg s i n wate rbath . [2 1 Contai n pos t cur e are a I f possible . Us s I R devices . [3J WOR KPRACTIC E CONTRO L TECHNOLOG Y Ptao s trim-of

fI n conteins r immediatel yAfte rramovsl from par t [1 ] Monito rpos t temperature sn d 

### dwell . (1 ]

Operat e apra yequipmen t a t lowes t possibl s pressure . (1 ]

Contai n ta n patte m withi n mol d perimeter . Spra ya a dos e to md d a s practical . Operat e spra yequipmen t a t lowes t possibl e pressure . (1 ]

Plac s trim-of

f Immediatel y fro m part . (1 ) afte rremova l
Monito rpos t cur s temperature an d dwell . (1 |

T J