ARL-TR-8298 ● FEB 2018

US Army Research Laboratory

Thermal Conductivities of Some Polymers and 

Composites

by William A Spurgeon

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ARL-TR-8298 ● FEB 2018

US Army Research Laboratory

Thermal Conductivities of Some Polymers and 

Composites

by William A Spurgeon

Weapons and Materials Research Directorate, ARL

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February 2018

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4. TITLE AND SUBTITLE

Thermal Conductivities of Some Polymers and Composites

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William A Spurgeon

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US Army Research Laboratory

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ARL-TR-8298

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14. ABSTRACT

This report presents results of measurements in the 20–100 oC temperature range of the thermal conductivities (Kt) of epoxies, 

polyurethanes, and hydrocarbons of interest to the Army. The study explores the effects of different curing agents, water 

absorption, glass transition temperature, and toughening. The study also explores E- and S2-glass composites of the epoxies, 

including effects of volume fraction of glass and fabric style. The experimental results are compared to modeled results for Kt 

in composites.

15. SUBJECT TERMS

thermal conductivity, plepoxies, polymers, composites, modeling

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William A Spurgeon

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Contents

List of Figures v

List of Tables vii

Acknowledgments viii

1. Introduction 1

2. Materials and Methods 2

2.1 Resins 2

2.2 Curing Agents 3

2.3 Fibers and Prepregs 5

2.4 Measurements 6

3. Results for Neat Resins 6

3.1 Calibration 6

3.2 SC15 Resin 8

3.2.1 Well-Conditioned Samples 8

3.2.2 Dry, Freshly Made Samples 10

3.2.3 Water-Soaked, Freshly Made Samples 11

4. SC15 Wet Samples after Redrying 13

4.1 SC11 Resin 13

4.2 EPON 826/30% V40 14

4.3 EPON 826-MTHPA 15

4.4 EPON 826/DDSA 17

4.5 EPON 815-MTHPA 18

4.6 EPON 826, 825, and 862, cured with Jeffamine D230 19

4.7 EPON 825, Jeffamine D400 20

4.8 EPON 825, Jeffamine D2000 21

4.9 EPON 826/EPIKURE W 21
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4.10 Simula Polyurethane 22

4.11 KRYSTALFLEX PE399 Thermoplastic Polyurethane Film 23

4.12 p-DCPD 24

4.13 p-ENB 24

5. Composites 25

5.1 Models for Kt 25

5.2 Results: Fine Fabric-Reinforced Composites 27

5.3 Results: 250-Yield Roving-Based Fabric-Reinforced Composites 30

6. IM7-CYTEC 381 EPOXY 32

7. Summary and Conclusions 32

8. References 34

List of Symbols, Abbreviations, and Acronyms 37

Distribution List 38
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v

List of Figures

Fig. 1 DGETAM ............................................................................................. 2

Fig. 2 a) p-DCPD and b) p-ENB..................................................................... 3

Fig. 3 a) DETDA, EPIKURE W, b) MTHPA, and c) DDSA. Note the long 

aliphatic “tail” on DDSA. ..................................................................... 4

Fig. 4 Jeffamine polyether aliphatic amine. X ≈ 2.5 for D230, 6.1 for D400, 

and 33.1 for D2000. .............................................................................. 5

Fig. 5 Chemical structure of VESPEL ............................................................ 6

Fig. 6 NIST thermal conductivity data for VESPEL. Legend: blue = low, 

orange = medium, and red = high. ........................................................ 7

Fig. 7 Measured thermal conductivity data for VESPEL (red, green, purple, 

and brown curves) and the NIST “low” and “high” results 

(black lines)........................................................................................... 8

Fig. 8 Measured Kt for samples 1 (blue), 2 (orange), and 3 (green)............... 8

Fig. 9 Data in Fig. 8 with an expanded vertical scale ..................................... 9

Fig. 10 Kt results for 4 measurements on sample 2. Blue, orange, green, and 

red curves are present............................................................................ 9

Fig. 11 Results of DMA scans on SC15: a) storage (blue curve) and loss 

modulus (orange curve) and b) loss tangent ....................................... 10

Fig. 12 Kt measurements on new, dry samples of SC15. Black = average. ... 11

Fig. 13 Kt for SC15 samples soaked for 48 hours at 60 °C ............................ 11

Fig. 14 Kt for the 3 samples after a 2-week soak in water at 60 oC................ 12

Fig. 15 Kt results for 3 determinations on sample SC15-WET–B-1 .............. 12

Fig. 16 Measured Kt of samples after redrying............................................... 13

Fig. 17 Results of 3 determinations of Kt for SC11. Legend: blue = run 1, 

orange = run 2, red = run 3, black = average ...................................... 14

Fig. 18 Results of 3 measurements of the thermal conductivity of EPON 826 

cured with V40. Legend: blue = run 1, orange = run 2, red= run 3, 

black = approximate trend line ........................................................... 15

Fig. 19 Results of DMA scan on EPON 826 cured with 30 weight percent 

V40: a) strength modulus (blue) and loss modulus (orange), and b) loss 

tangent................................................................................................. 15

Fig. 20 Results of 3 measurements of thermal conductivity of EPON 826 

cured with MTHPA. Legend: run 1 = blue, run 2 = orange, 

run 3 = red........................................................................................... 16

Fig. 21 DMA results for EPON 826 cured with MTHPA: a) strength (blue) 

and loss (orange) modulus, and b) tangent ......................................... 16
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vi

Fig. 22 Measured Kt for EPON 826-DDSA ................................................... 17

Fig. 23 DMA results for EPON 826 cured with MTHPA: a) strength (blue) 

and loss (orange) modulus, and b) loss tangent .................................. 18

Fig. 24 Kt results for EPON 815-MTHPA from 3 samples............................ 18

Fig. 25 Kt results for EPON 815 from 3 consecutive determinations on sample 

3........................................................................................................... 19

Fig. 26 Average Kt for EPON 826 (blue curve), 825 (orange curve), and 862 

(green curve) cured with Jeffamine D230 .......................................... 20

Fig. 27 Measured Kt for EPON 826 cured with Jeffamine D400 (2 

measurements) .................................................................................... 20

Fig. 28 Kt for EPON 825 cured with Jeffamine D2000 (3 determinations) ... 21

Fig. 29 Measured Kt for EPON 826 cured with EPIKURE W....................... 22

Fig. 30 Measured Kt for the Simula polyurethane .......................................... 23

Fig. 31 DMA results for Simula polyurethane. Legend: blue = storage 

modulus, orange = loss modulus......................................................... 23

Fig. 32 Measured Kt for p-DCPD. Results for 3 determinations are shown... 24

Fig. 33 Measured Kt for p-ENB. Results for 2 determinations are shown ..... 25

Fig. 34 Modeled through-the-thickness Kt VS % fiber for composites with Ktr

= 0.1 and Ktf = 13.23 The blue results were extended from 42.9 to 50% 

fiber by the author. Legend: blue = fabric, orange = unidirectional... 26

Fig. 35 Kt for composites with Ktf/Ktm = 6 as a function of Vf in the Pilling

(blue curve) and Clayton (orange curve) models................................ 27

Fig. 36 Measured thermal conductivity of a 48% by volume S2-glassreinforced SC15 epoxy composite ...................................................... 28

Fig. 37 Measured thermal conductivity of a 37% by volume S2-glassreinforced SC15 epoxy composite ...................................................... 28

Fig. 38 Fiber tow arrangements for model low (left) and high (right) Vf

composites........................................................................................... 29

Fig. 39 Measured Kt values for a 51 volume percent E-glass–SC15 composite. 

The black line is the average Kt.......................................................... 29

Fig. 40 Results of 4 determinations of Kt for an SC-11/6781 style S2 glass 

composite. Legend: blue = run 1, orange = run 2, red= run 3, green = 

run 4, black = average......................................................................... 30

Fig. 41 Kt for the SC15-2455 S2 glass composite .......................................... 30

Fig. 42 Kt for the biaxial E-glass/SC15 composite......................................... 31

Fig. 43 Kt for the 65% S2-glass/phenolic HJ1 composite .............................. 31

Fig. 44 Measured Kt for the IM7-381 epoxy composite. Three runs are shown 

distinguished by the blue, orange, and green curves. ......................... 32
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vii

List of Tables

Table 1 20 °C Kt for epoxies ............................................................................. 1
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viii

Acknowledgments 

The author would like to thank his colleagues for assistance or advice received 

during the completion of this project. These include Ian McAininch for help with 

the measurements, James Wolbert and his assistants for help with sample 

preparation, Daniel Knorr, Tyler Long, and Terence Taylor for sample preparation 

and technical discussions, Joshua Orlicki and James Sands for technical 

discussions, and Tiara Balduf for the Dynamic Mechanical Analyzer results. All of 

this help was greatly appreciated.
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1. Introduction

Thermoset polymers are good electrical insulators that are used in applications 

ranging from electronics to composite armor. They are rather poor thermal 

conductors, however. For encapsulation of electronic components and devices, 

there is a huge amount of literature on filled polymers, particularly epoxies. Burger 

et al.1provides a recent review of thermal conductivity (Kt) of filled polymers with 

emphasis on carbon nanotube loading. As an example of a low Kt polymer, Lu and 

Xu2cite a Kt of 0.3 watts per meter per degree kelvin (W/MK) for unfilled 

polyurethane from an unidentified source and higher values for filled resin. 

Weidenfeller et al.3reports measurements on particle-filled polypropylene with a 

neat resin Kt of 0.27 W/MK. These thermal conductivities are higher than those of 

most epoxies, and much lower than those of metals and crystalline ceramics. 

Several of the works cited in this report1,4–10 discuss Kt results for various filled 

diglycidyl ether of bisphenol-A or F (DGEBP-A or F) epoxies. The references for 

Kt of filled epoxies contain results at room temperature for the neat resin, but no 

other data on temperature dependence of Kt for the neat resin. Kline8is an exception 

and shows that Kt for the neat resin increases slightly with temperatures from 

0–60 °C. Table 1 presents a summary of 20 °C results from the references. All 

values are ±5%, a fairly standard accuracy for Kt measurements of polymeric 

materials. All of the articles are more concerned with the effects of fillers on Kt 

than with Kt for the base polymers. 

Table 1 20 °C Kt for epoxies

Reference Epoxy Curing agent Kt (W/MK)

1 DGEBP-A Amine 0.23

4 DGEBP-F Anhydride 0.2

5 Not Specified Not specified 0.19

6 DGEBP-F Amine 0.195-0.2

7 DGEBP-A Amine 0.2

8 DGEBP-A Amine 0.185

9 DGEBP-A Amine 0.2

14 DGEBP-A Amine ~0.16

Harada et al.9also discusses the synthesis of an epoxy, diglycidyl ether of

terephthalylidene-bis-(4-amino-3-methylphenol) (DGETAM) (Fig. 1). This epoxy 

exhibits partial liquid crystal (LC) behavior, which has a Kt of 0.35 W/MK in an 

isotropic phase, and 0.38 W/MK in a polydomain LC phase. Takezawa et al.11
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discusses other special epoxies with neat resin Kt values nearly as high as 1 W/MK. 

These are high-temperature epoxies. 

Fig. 1 DGETAM

Modeling the Kt of polymers would seem to be a nearly hopeless task, even with 

today’s modeling capabilities. However, Algaer12 was able to model the Kt of 

polystyrene and amorphous polyamide (nylon) 6-6 within a factor of 2. The results 

depend very strongly on the intermolecular potential assumed in the molecular 

dynamics calculations. In contrast, results for Kt of several liquids were much 

better, often within 10% of experimental values. 

This report presents results of thermal conductivity measurements of some 

polymers used in applications such as structural armor and filament winding and in 

basic studies of polymer networks in epoxies at the US Army Research Laboratory 

(ARL).

13,14 For epoxies, the effects of the glass transition temperature (TG), type 

of curing agent (amine, polyamide, or anhydride), toughening, and moisture were 

examined. Two polyurethanes, poly-dicyclopentadiene (p-DCPD) and polyethylidiene-norbornene (p-ENB) were also studied, as were composites of the 

epoxies with E- and S2-glass fibers in various woven fabrics. In addition, a uniaxial 

carbon fiber-epoxy composite and an S2-glass-phenolic composite were explored. 

2. Materials and Methods

2.1 Resins

Panels of the resins were prepared in various molds. The samples were sanded to a 

uniform thickness (2 to 7 millimeters) and flatness (typically ±25 microns) with a 

double-sided sander in the ARL wood shop as needed or were made uniformly thick 

and flat on a lathe. Two-inch circular disks were cut from the panels using a waterjet 

for Kt tests. A number of the samples were prepared many years ago and are wellconditioned to the environment in the laboratory. 

The resins and their vendors are as follows:

1. SC15 and SC11 from Applied Poleramic, Benecia, California: SC15 has 

been used by ARL in many composites for about 15 years. They are lowviscosity resins that are highly toughened by a rubbery component in the 
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resin. It has a dry TG of approximately 104 °C. SC11 is somewhat tougher 

with a lower dry TG (52 °C). It forms many nanovoids when cured, which 

will add to the number of scatterers for thermal excitations. Both resins 

suffer a loss of strength and a significant lowering of TG after exposure to 

hot/wet conditions.

2. EPON 826 is a common, low-viscosity commercial grade DGEBP-A resin, 

with an average molecular weight equivalent to about 1.2 repeat units. 

EPON 825 is a very pure version of DGEBP-A with a slightly lower 

molecular weight equivalent to about 1.1 repeat units. EPON 862 is a 

similar resin, but with bisphenol–F. EPON 815 (now EPON 815-C) is 

basically EPON 826 diluted with butyl-diglycidylether. The resins were 

obtained from Miller-Stephenson (Danbury, Connecticut). 

3. DCPD, ENB, and Grubbs-1 catalyst were also obtained from MillerStephenson. The 2 cyclic hydrocarbons were polymerized by a ring-opening 

metathesis reaction using the catalyst according to ARL proprietary 

formulas. Their chemical structures are shown in Fig. 2. Note that p-ENB 

is not cross linked. 

Fig. 2 a) p-DCPD and b) p-ENB

2.2 Curing Agents

SC15 and SC11 had their own cycloaliphatic amine-based curing agents. The 

EPON-based epoxies were cured with agents as follows:

1. V40 (now EPIKURE 3140), a low-viscosity reactive polyamide, high 

imidazoline, moderate molecular weight epoxy curing agent based on 

dimerized fatty acid and polyamines, mixed as 30% by weight. From MillerStephenson. 

2. EPIKURE W, DETDA (Diethyl-toluenediamine), an aromatic amine (Fig.

3a), selected as the most aromatic curing agent. From Miller-Stephenson. 
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3. MTHPA (Methyltetrahydrophthalic Anhydride), an aliphatic anhydride 

(Fig. 3b). From Hexion Chemical, Columbus, Ohio (formerly Shell 

Chemical).

4. DDSA (Dodecenylsuccinic Anhydride), an aliphatic anhydride (Fig. 3c).

From Dixie Chemical, Pasadena, Texas.

5. Jeffamine D-230, D400, and D2000, a polyoxypropylenediamine of 

different chain lengths (Fig. 4), from Huntsman Performance Products, 

O'Fallon, Missouri. When used to cure EPON 825 they produce epoxies 

with TGs of approximately 100, 47, and –10 °C, respectively.

.

A

 

`

 B C

Fig. 3 a) DETDA, EPIKURE W, b) MTHPA, and c) DDSA. Note the long aliphatic “tail” 

on DDSA.
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Fig. 4 Jeffamine polyether aliphatic amine. X ≈ 2.5 for D230, 6.1 for D400, and 33.1 for 

D2000. 

2.3 Fibers and Prepregs

Fiberglass-reinforced composites were fabricated using vacuum-assisted resin 

transfer molding, a technique that is now widely used throughout the composite 

materials industry. Type 6781 S2 glass fabrics, approximately 10 mils thick per ply 

with a 5-h satin weave and a proprietary amino-silane finish, were purchased from 

JPS Glass (Slater, South Carolina). S2 glass in 24-oz, 5×5 woven roving fabrics 

with type 463 epoxy compatible sizing, and approximately 25 mils thick per ply,

was purchased from Advanced Glassfiber Yarns (AGY) (Aiken, South Carolina). 

E-glass in type 7781, 8-h satin weave, 10 mil/ply fabric was obtained from Hexcel 

Corp. (Stamford, Connecticut), and 5×5 stitched cross ply fabric with type 2026 

sizing was obtained from PPG Industries (now Nippon Electric Glass, Shelby, 

North Carolina) through a cooperative agreement. Both E-glass sizings are 

proprietary to PPG Industries, and are epoxy-compatible sizings. The panels from 

which these samples were cut were at least a year old, and were well-conditioned. 

A panel was also prepared from a prepreg of IM7 uniaxial carbon fiber and CytecSandoz 381 epoxy resin (Cytec-Sandoz, Havre de Grace, Maryland). HJ1 is a 

phenolic resin matrix S2-glass-reinforced composite used in various armor 

applications and complies with the AGY-developed MIL-DTL-64154B 

specification. The resin content of the prepreg by weight is 18%, which will give a 

predicted laminate fiber volume of fraction (Vf) of 65%, but some resin bleed will 

occur during processing in the press and therefore the fiber Vf is typically slightly 

higher than this. The prepreg was obtained from Lewcott Composites (now Barrday 

composite solutions, Millbury, Massachusetts). Composite panels from the 

prepregs were prepared in a press. 
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2.4 Measurements

Measurements were made using a TA300 thermal conductivity apparatus (TA 

Instruments, New Castle, Delaware). This PC-controlled apparatus has heated top 

and cooled bottom platens with a guard ring. It was calibrated with a VESPEL 

sample with a thermal conductivity traceable to the National Institute of Standards 

and Technology (NIST). Wakefield 120 thermal joint compound (TJC, from 

Wakefield-Vette, Pelham, New Hampshire), a silicone grease loaded with ZnO 

with Kt = 0.734 W/MK, was applied to the top and bottom surface of the test 

samples to minimize contact resistance. Several works cited in this report9,10,15–17

discuss other measurement methods. The apparatus described in Putnam et al.16 has 

the potential to reduce the error in Kt measurements, but would be very slow. 

Sweeting and Liu17 describe an infrared method, and report an in-plane Kt that is

about 4× higher than the through-thickness Kt in a carbon-fiber-reinforced 

composite. All measurements reported in this article are through-thickness 

measurements.

3. Results for Neat Resins

3.1 Calibration

The thermal conductivity measurement apparatus had been previously calibrated in 

the 20–110 °C range using VESPEL, a very stable, semi-crystalline, nonthermoplastic material (Fig. 5). Figure 6 shows data traceable to NIST that was 

supplied by the manufacturer. The data sheet for that calibration lists low, medium, 

and high values for Kt for this material; these correspond to the blue, orange, and 

red lines respectively. The blue and red lines also represent the median value 

±4.8%, the estimated uncertainty in the results. The manufacturer-installed 

reference calibration data in the instrument is for a Kt of 0.38 W/MK across the 

20–110 °C range.

Fig. 5 Chemical structure of VESPEL
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Fig. 6 NIST thermal conductivity data for VESPEL. Legend: blue = low, orange = medium,

and red = high. 

Figure 7 shows the results of 4 measurements of the Kt of a VESPEL sample 

supplied by the manufacturer. The thick black lines at the bottom and top of the 

plot are the NIST low and NIST high values, respectively. The purple line 

represents data at 4 points, while the other curves are for data taken at 9 points. 

Why the 9-point results oscillate slightly as the temperature is increased is not clear, 

but according to the manufacturer this is acceptable behavior. The results can be 

highly reproducible, as indicated by the blue, orange, red, and green lines that 

overlap each other in the figure. These results were taken to be proof of acceptable 

calibration. 

The Wakefield 120 TJC is applied to the top and bottom of the test sample to ensure 

thermal contact with the platens. Some of this material inevitably gets applied to 

the sides as well, but is wiped off prior to the tests. A 0.01-inch uniform ring around 

the sample would cause a 5% error in the results for this sample. Residual 

compound on the sides was in the 0.001-inch-thick range, so this is not a factor in 

the results. A test run without the TJC established its necessity, even though the 

sample had been carefully machined. 

Care must be taken to ensure that the sample is centered on the platens; on several 

occasions an anomalously low Kt value was observed, for which close inspection 

revealed sample positioning to be the cause. 

0

0.1

0.2

0.3

0.4

0.5

0 20 40 60 80 100 120 140

Kt (W/MK)

TEMPERATURE (DEGREES C)

VESPEL, NIST DATA
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Fig. 7 Measured thermal conductivity data for VESPEL (red, green, purple, and brown 

curves) and the NIST “low” and “high” results (black lines)

3.2 SC15 Resin

3.2.1 Well-Conditioned Samples

Figure 8 shows the measured thermal conductivity for 3 samples of SC15. The 

average Kt is 0.203 ±0.005 W/MK. Figure 9 shows the same data on an expanded 

scale. Note that 2 of the samples gave results that were very close, and one was a 

little different. This type of result was found for many of the materials tested. 

Fig. 8 Measured Kt for samples 1 (blue), 2 (orange), and 3 (green)

0.3

0.35

0.4

0.45

0.5

20 30 40 50 60 70 80 90 100 110

Kt (W/MK)

TEMPERATURE (DEGREES C)

VESPEL - DATA AND NIST HIGH/LOW

0

0.05

0.1

0.15

0.2

0.25

20 30 40 50 60 70 80 90 100 110

KT (W/MK)

TEMPERATURE (°C)

SC15 - TESTS 1, 2, & 3
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Fig. 9 Data in Fig. 8 with an expanded vertical scale

Tests 2, 4, 5, and 6 were all run on sample 2. The results of the first try are shown 

by the blue line in Fig. 10. The orange line is for the third try without moving the 

sample (the second try was accidentally not recorded). The green line is for the 

fourth try. The sample was not moved for this test, but the clamping pressure was 

released and reapplied. The TJC coating did not look very uniform after this test. 

The red line is for the fifth try, for which the sample was removed and reapplied. 

The TJC was also applied to the sides of the sample and wiped off. The median 

values of Kt are 0.200, 0.201, 0.197, and 0.202, respectively. This is satisfactory 

reproducibility. 

Fig. 10 Kt results for 4 measurements on sample 2. Blue, orange, green, and red curves are 

present. 

0.19

0.195

0.2

0.205

0.21

0.215

0.22

20 30 40 50 60 70 80 90 100 110

KT (W/MK)

TEMPERATURE (°C)

SC15- TESTS 1, 2, & 3

0

0.05

0.1

0.15

0.2

0.25

20 40 60 80 100 120

Kt (W/MK)

TEMPERATURE (°C)

SC15 - TESTS 2, 4 , 5, & 6
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Figure 11 shows the results of a Dynamic Mechanical Analyzer (DMA) scan of 

SC15. TG, as determined by the peak of the loss tangent (tan delta), is about 

107 °C. Note, however, that the strength modulus has dropped considerably by 

80 °C. This softening is not reflected in the Kt plots, however. The very broad 

transition is characteristic of toughened epoxies. 

 A B

Fig. 11 Results of DMA scans on SC15: a) storage (blue curve) and loss modulus (orange 

curve) and b) loss tangent 

3.2.2 Dry, Freshly Made Samples

Epoxies in humid environments absorb water over time. The well-conditioned 

samples were kept in an air-conditioned lab, but were over 15 years old, and had 

some opportunity to absorb water. Since this was the case, some freshly prepared 

samples that had been oven dried at 70 °C for 3 days and cooled and stored in a 

desiccator were examined. The results of the measurements, shown in Fig. 12, show 

that the difference from the well-conditioned sample results is within experimental 

error. 
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Fig. 12 Kt measurements on new, dry samples of SC15. Black = average.

3.2.3 Water-Soaked, Freshly Made Samples

The set of freshly made SC15 samples (SC15-WET-A) were then soaked in water 

at 60 °C for 2 days per ASTM D570.18 The average moisture absorption was 0.76% 

by weight, which is roughly half of the expected saturation value. Still, this did 

increase Kt by about 0.01 W/MK, as shown in Fig. 13. 

Fig. 13 Kt for SC15 samples soaked for 48 hours at 60 °C

0

0.05

0.1

0.15

0.2

0.25

20 30 40 50 60 70 80 90 100 110

Kt (W/MK)

TEMPERATURE (DEGREES C)

SC15, NEW AND DRY

0

0.05

0.1

0.15

0.2

0.25

20 30 40 50 60 70 80 90 100 110

Kt (W/MK)

TEMPERATURE (DEGREES C)

SC15-WET-A
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Since the saturation water content of this epoxy is known to be higher than 0.76%, 

the samples were cleaned of all TJC and soaked for an additional 2 weeks at 60 °C. 

The average water content increased to 1.64% by weight as expected. Comparison 

of Figs. 13 and 14 shows that the extra water made no difference in Kt within 

experimental error. One sample was run 3 times just to make sure heating to 

100 °C made no difference in the reproducibility in the Kt data. This is shown as 

the blue, orange, and green lines in Fig. 15; the average of these 3 determinations 

is shown as the blue line in Fig. 14. 

Fig. 14 Kt for the 3 samples after a 2-week soak in water at 60 oC

Fig. 15 Kt results for 3 determinations on sample SC15-WET–B-1

0

0.05

0.1

0.15

0.2

0.25

20 30 40 50 60 70 80 90 100 110

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TEMPERATURE (DEGREES C)

SC15-WET-B

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SC15-WET-B SAMPLE 1
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13

4. SC15 Wet Samples after Redrying

The Kt values for the water-soaked samples were remeasured after a 2-week bakeout at 70 °C. The results, shown in Fig. 16, are barely larger than the dry sample 

results; the 2 sets of results are essentially within experimental error of each other. 

The results are also within experimental error of the results for the samples after a 

2-day soak. The weight of the samples after drying increased by 0.067 ±0.12%. 

Fig. 16 Measured Kt of samples after redrying

4.1 SC11 Resin

As a tougher cousin of SC15 with many small voids, SC11 resin will have more 

scattering centers for heat-conducting molecular motions and will therefore have a 

lower thermal conductivity. It is less dense than SC15, with a density of 

approximately 1.12 g/cc rather than 1.18 g/cc, in part because of the voids. The 

results of 3 measurements on the neat resin are shown in Fig. 17. The average 

thermal conductivity is 0.186 W/MK. Any increase with temperature is well within 

the expected ±0.005 W/MK error in the measurements. The resin was cured 2 hours

at 65 °C and postcured for 2 hours at 121 °C. This resin and its composites show 

no apparent effect on the Kt from the 52 °C TG.

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SC15-REDRIED
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14

Fig. 17 Results of 3 determinations of Kt for SC11. Legend: blue = run 1, orange = run 2, 

red = run 3, black = average.

Kt is the product of the density (ρ), the heat capacity (Cp) and the thermal 

diffusivity (α). The number of mobile entities in a polymer above TG increases, so 

Cp will increase at TG. For Kt to remain constant, there would have to be a 

comparable decrease in α due to increased scattering of the thermal excitations. 

Such a decrease in α has been observed and reported for several polymers.19 A 

decreased density above TG could also help offset the increase in mobility, 

although this should be a small effect. That α will decrease above TG from 

increased scattering is reasonable. That the decrease in α (and ρ) would balance the 

increase in Cp is not obvious and may not always happen. The glass transition in 

polymers occurs over a range of temperatures, and a transition that is exceptionally 

broad with a small change in heat capacity would not show up well in a Kt 

measurement. 

Kalogiannakis et al.15 has Kt results for carbon and glass epoxy-based prepreg 

composites that the authors claim show TG effects. The epoxy in the composites

cures at 125 °C, and have TGs near 90 °C. The results were obtained by a 

temperature-modulated differential scanning calorimetry (DSC) method, and have 

error bars as large as the claimed effect. Their Kt values for their carbon fiber 

samples are comparable to those for similar samples reported here, while their 

results for the glass samples are slightly lower. 

4.2 EPON 826/30% V40

The results of 3 determinations of the thermal conductivity of EPON 826 epoxy 

cured with 30% by weight of V40 polyamide are shown in Fig. 18. The Kt for this 

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TEMPERATURE (DEGREES C)

SC11
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15

epoxy is a little higher than that for SC15; an average value for the data is 

0.216 W/MK. There is a small temperature dependence that is barely larger than 

the ±0.005 W/MK standard deviation of the measurements. The cure schedule was 

the same as that for SC11. Figure 19 shows the DMA results. As with SC15, the 

glass transition is very broad, TG is about 118 °C, and the strength loss is not 

evident in Kt. 

Fig. 18 Results of 3 measurements of the thermal conductivity of EPON 826 cured with V40. 

Legend: blue = run 1, orange = run 2, red= run 3, black = approximate trend line. 

A B

Fig. 19 Results of DMA scan on EPON 826 cured with 30 weight percent V40: a) strength 

modulus (blue) and loss modulus (orange), and b) loss tangent

4.3 EPON 826-MTHPA

EPON 826 cured with MTHPA has been used in filament-winding applications at 

ARL. The mix proportions are 100 parts resin to 80 parts MTHPA to 1 part 

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TEMPERATURE (DEGREES C)

EPON 826, 30 % V40 THERMAL 

CONDUCTIVITY
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16

benzyldimethylamine catalyst. The resin was cured at 121 °C (250 °F) for 2 hours

followed by a 2-hour postcure at 177 °C (350 °F). The average Kt (Fig. 20) was 

0.173 W/MK, with the low and high ends of the temperature sweep 0.005 W/MK 

(the standard deviation) below and above this value. The resin is more brittle than 

the toughened resins due to an inflexible backbone, which decreases the number of 

thermally excited motions and hence a lower Kt. TG as determined by DMA 

measurements (Fig. 21) was 123 °C. The transition is much sharper than for the 

toughened epoxies.

Fig. 20 Results of 3 measurements of thermal conductivity of EPON 826 cured with 

MTHPA. Legend: run 1 = blue, run 2 = orange, run 3 = red.

 A B

Fig. 21 DMA results for EPON 826 cured with MTHPA: a) strength (blue) and loss (orange) 

modulus, and b) tangent 

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THERMAL CONDUCTIVITY (W/MK)

TEMPERATURE (DEGREES C)

EPON 826-MTHPA
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17

4.4 EPON 826/DDSA

This is also a filament-winding formulation that was prepared the same way as the 

MTHPA cured samples. DDSA has a long aliphatic “tail” (Fig. 3c) and is even 

more aliphatic than MTHPA. This may be the reason for the slightly lower average 

Kt of 0.167 ±0.005 W/MK. The difference is basically within experimental error, 

however. Figure 22 shows the measured results. This too is brittle, and will have an 

inflexible backbone and hence a low Kt, as well as a relatively narrow glass 

transition (Fig. 23). TG, from the loss tangent peak, was about 104 °C. 

Fig. 22 Measured Kt for EPON 826-DDSA
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Fig. 23 DMA results for EPON 826 cured with MTHPA: a) strength (blue) and loss (orange) 

modulus, and b) loss tangent 

4.5 EPON 815-MTHPA

Adding butyl-diglycidylether to EPON 826 to make EPON 815 increases the 

aliphatic nature of the resin, and a lower Kt might be expected. The average Kt was 

0.165 ±0.005 W/MK. Any temperature dependence of Kt was within the 

experimental error. Figure 24 shows the results of 3 determinations of Kt. Figure 

25 shows the results of 3 consecutive determinations of Kt on sample 3. 

Fig. 24 Kt results for EPON 815-MTHPA from 3 samples
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Fig. 25 Kt results for EPON 815 from 3 consecutive determinations on sample 3

4.6 EPON 826, 825, and 862, cured with Jeffamine D230

EPON 826 and 825 are very similar DGEBP-A epoxies, differing only slightly in 

molecular weight. Their Kt plots should be essentially identical, and measurements 

on these 2 epoxies cured with Jeffamine bear this out as shown by the blue and 

orange curves in Fig. 26. DGEBP-F-based EPON 862 differs very slightly in 

molecular structure, and there is no evident reason why it should have a Kt different 

from EPON 825 or 826. The green curve in Fig. 26 is for EPON 862 cured with 

Jeffamine 230. The curve is clearly but barely lower than the other 2 curves, and is 

within any realistic experimental error. It would require a far more accurate 

apparatus to verify a real difference. Each curve represents the average of 3 

determinations of Kt for each material. 
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20

Fig. 26 Average Kt for EPON 826 (blue curve), 825 (orange curve), and 862 (green curve) 

cured with Jeffamine D230

4.7 EPON 825, Jeffamine D400

EPON 826 cured with Jeffamine D400 has a TG between 40 and 50 °C and a clear 

change in heat capacity as determined by DSC. A change in Kt in this temperature 

range was considered a definite possibility. A small bump in the Kt VS temperature 

plot is indeed observed in this range, but is indistinguishable from the instrumental 

bump noted in all of the other Kt results in this report. Again, the increase in Cp is 

offset by a decrease in α and ρ. The plot does suggest a small decrease in Kt with 

temperatures above 60 °C, although the experimental error is such that Kt could 

certainly be constant. Figure 27 shows the results. 

Fig. 27 Measured Kt for EPON 826 cured with Jeffamine D400 (2 measurements)
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21

4.8 EPON 825, Jeffamine D2000

EPON 825 cured with Jeffamine D2000 has a TG well below room temperature, 

and is actually flexible because of the highly reduced cross linking. It has a Kt that 

is shown in Fig. 28, which is about 7% lower than EPON 825 with the other 2 

Jeffamine curing agents.

Fig. 28 Kt for EPON 825 cured with Jeffamine D2000 (3 determinations)

4.9 EPON 826/EPIKURE W

EPIKURE W (Fig. 3a) was the most aromatic curing agent tried. This curing agent 

does increase the density of aromatic double bonds in the polymer, but they are not 

conjugated. The measured conductivity, Fig. 29, is a little higher than for aminecured EPON 826, but not much. Polymers, such as poly-acetylene, which have 

extensive conjugated double bonds, can actually show very large electronic 

contributions to their Kt.11

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EPON 825-D2000
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Fig. 29 Measured Kt for EPON 826 cured with EPIKURE W

4.10 Simula Polyurethane

Kt for a sample of a transparent, impact-resistant polyurethane from Simula 

(Phoenix, Arizona, now part of BAE) was also measured.20 Thisthermoset urethane 

exhibits good transparency, low haze, and good chemical resistance. It was seen as 

a potential replacement for polycarbonate in applications ranging from transparent 

armor to eyeglasses. Figure 30 shows the measured results for 3 determinations of 

Kt. There is a small downward trend with temperature that is comparable to the 

±5% error. Figure 31 shows the results of (DMA) measurements for this material. 

The decrease in both the storage and loss moduli suggest that an important 

transition (possibly TG) occurs below room temperature. The storage modulus 

drops by more than a factor of 2 between 25 and 100 °C, but this clearly has little 

effect on Kt. 

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TEMPERATURE (DEGREES C)

EPON 826-EPIKURE W
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Fig. 30 Measured Kt for the Simula polyurethane

Fig. 31 DMA results for Simula polyurethane. Legend: blue = storage modulus, orange = 

loss modulus.

4.11 KRYSTALFLEX PE399 Thermoplastic Polyurethane Film

KRYSTALFLEX PE399 (Huntsman, Derry, New Hampshire) is a highperformance aliphatic polyether-type polyurethane film intended for processing by 

lamination with a range of glass and plastic components. It is used in aerospace, 

transportation, security, and architectural components where high transparency, 

low temperature flexibility, and good bonding to glass or plastics are needed. The 

material is suitable for use as an interlayer in transparent armor. 
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24

A thick stack of 0.050-inch-thick film sheets was prepared and cured at 121 °C 

(250 °F) under vacuum pressure for 30 min to make a thick enough sheet from 

which a sample suitable for Kt measurements could be cut. At 25 °C, its thermal 

conductivity was measured as 0.2 W/MK (±5%). Unfortunately, higher 

temperatures caused the material to flow outward under the pressure from the 

platens resulting in a badly distorted sample, and no reliable results could be 

obtained. 

4.12 p-DCPD

P-DCPD is currently of interest for composite armor applications because of its 

unusual ballistic properties and its high TG (approximately 150 °C in our 

formulations) that is not moisture sensitive.

21,22 It has a density of about 1.044 g/cc, 

which is considerably lighter than many other polymers, particularly epoxies, 

which are closer to 1.2 g/cc. This is in part due to the absence of oxygen and 

nitrogen in the chemical structure and partly due to its free volume content. Figure 

32 shows the measured thermal conductivity as a function of temperature. As 

expected, Kt for p-DCPD is somewhat lower than for amine and amide-cured 

epoxies. 

Fig. 32 Measured Kt for p-DCPD. Results for 3 determinations are shown.

4.13 p-ENB

P-ENB is similar to p-DCPD, but is not cross-linked (Fig. 2). Its measured Kt is 

shown in Fig. 33. The reason for the higher Kt is not clear. It is completely 

amorphous, so small-scale ordering cannot explain the higher Kt. P-ENB has a very 

low density (0.0971 g/cc), which indicates the presence of much free volume. This 
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25

would give the polymer chains room to move around more easily. The absence of 

cross linking may also make it easier to move a section of chain. P-ENB has a sharp 

TG, as does p-DCPD. 

Fig. 33 Measured Kt for p-ENB. Results for 2 determinations are shown.

5. Composites 

5.1 Models for Kt

An ideal unidirectional composite offers conduction paths through the straight 

fibers or through the resin for thermal conduction along the fiber direction. Ktc in 

the fiber direction for this ideal case is then Ktc = VfKtf + VrKtr, where Vx is the 

volume fraction of fiber or resin and Ktx is the Kt for the fiber, resin, or composite. 

Kt in the other directions is a lot more complicated. As a crude first approximation, 

the contributions of the thermal resistivities of the 2 phases would add like electrical 

resistors in parallel, and 

Ktc = 1/(Vf/Ktf )+Vr/Ktr). (1)

This sets an upper limit to Ktc of Ktr/Vr for a composite with a very conductive 

fiber. For a typical SC15 composite with 50 volume percent resin with Ktr of 

0.2 W/MK this limit is 0.4 W/MK, which is lower than the observed values for 

glass fibers or carbon fibers. The approximation does show that a composite with a 

highly conductive fiber will not have a through-the-thickness Kt that is much 
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26

different from a much less conductive glass fiber, and that Kt will increase as the 

fiber content is increased. Kt for E-glass is 1.15 and for S2 glass is 1.25,23 so the 

actual predictions for 50 volume percent composites are 0.340 for E-glass and 0.344 

for S2-glass. This also shows that a large difference between Kt for E- and S2-glass 

composites should not be expected. 

Li et al.

24 explored a finite element (FE) model for the thermal conductivity of glass 

fiber composites. Their results for a fabric-based composite as a function of volume 

fraction of fiber with a Kt of 13 and a matrix with a Kt of 0.10 W/MK are shown 

as the blue line in Fig. 34. This is a replot of the data from Table 2 from their paper. 

The extension from 42.9% to 50% fiber was done arbitrarily by the author of this 

report. The values Li et al. used for Kt for the matrix and glass fiber are strange; 

their Kt for the fiber is a factor of 10 high and the Kt for the matrix is half of that 

of a typical epoxy. No reasons for their choice of Kt for the fiber and resin were 

given. Their paper does not include any information on how the Kt for the 

composite would scale with changes in the Kt’s of the components. Assuming the 

results scale linearly with Kt of the matrix, and recalling that Kt for the fiber does 

not dominate in the simple model above, a reasonable upper bound for Kt for a 50 

volume percent glass composite would be around 0.5 W/MK, and a little higher for 

a carbon composite. A more realistic estimate of Kt for a 50 volume percent glass 

composite would be a little closer to 0.4 W/MK. 

Li et al. also worked out the Kt through the composite for a uniaxial composite. 

The results are shown as the orange line in Fig. 34, and differ significantly from 

that for a fabric-reinforced composite as the concentration of fiber approaches 50%. 

Fig. 34 Modeled through-the-thickness Kt VS % fiber for composites with Ktr = 0.1 and Ktf 

= 13.

23 The blue results were extended from 42.9 to 50% fiber by the author. Legend: blue = 

fabric, orange = unidirectional. 

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Kt (W/MK)

VOLUME %FIBER 

COMPOSITE Kt VS VOLUME % FIBER
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27

Pilling et al.25 and Clayton26 also proposed analytical models for Ktc. Their models 

are as follows: 

Ktc = Ktm * {(1-Vf) + (1+Vf)Ktf/Ktm}/{(1-Vf)Ktf/Ktm+(1-Vf)} Pilling model (2)

(Ktc/Ktm)

1/2 = 1/2{[(1-Vf )2

(Ktf/Ktm -1)2+ 4 Ktf/Ktm]

1/2

-(1-Vf )(Ktf/Ktm -1)} Clayton 

model (3) 

Figure 35 shows the calculated Ktc as a function of Vf for the 2 models for 

Ktf/Ktm = 6. The results differ mainly for high Vf composites. The rationale for 

these models is in the original literature.25,26 Yu et al.

27 also examined an FE model 

of Kt for a glass-reinforced composite. Their results differ little from the Clayton 

and Pilling models. 

All of the models assume perfect, resistance-free thermal contact between the fibers 

and the matrix, which is reasonable for well-sized fabrics. Any effects of voids are 

also neglected, which again is reasonable, since in a well-made composite there 

should be few voids. A delamination in a composite sample would probably be so 

compressed in the apparatus that all sides were in contact in the sample. 

Fig. 35 Kt for composites with Ktf/Ktm = 6 as a function of Vf in the Pilling (blue curve) and 

Clayton (orange curve) models

5.2 Results: Fine Fabric-Reinforced Composites

Figure 36 shows the measured Kt results for an SC15 matrix composite with about 

48 volume percent S2 glass in a 5-h satin weave fabric (style 6781). The formulas 

discussed above indicate that the 25 °C Kt should be a little higher, around 4.0 to 
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28

4.2 W/MK, rather than the observed 3.8 W/MK. In view of the assumptions in the 

formulas and the ±5% uncertainty in the measurements, this has to be considered 

acceptable agreement. 

Figure 37 shows the measured Kt results for a similar composite with 37 volume 

percent S2 glass. The theory predicts a Kt of about 3.4 W/MK at room temperature,

which is definitely higher than the measured values. This is probably a problem 

with the modeling; the models show a low volume percent composite as in Fig. 38, 

rather than as layers of resin and fabric that are loosely compressed. The fabric 

models in the calculations were for a plain weave fabric rather than the biaxial 

arrangement in Fig. 38. 

Fig. 36 Measured thermal conductivity of a 48% by volume S2-glass-reinforced SC15 epoxy 

composite

Fig. 37 Measured thermal conductivity of a 37% by volume S2-glass-reinforced SC15 epoxy 

composite 

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(W/MK)

TEMPERATURE (DEGREES C)

SC15-6781 S2 GLASS

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Kt (W/MK)

TEMPERATURE (DEGREES C)

SC15-37% 6781 S2 GLASS
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29

Fig. 38 Fiber tow arrangements for model low (left) and high (right) Vf composites

Figure 39 shows the measured Kt values for a 51 volume percent E-glass–SC15 

composite. The glass fabric is style 7781 8-h satin weave. The results are again a 

little below the predicted values, but reasonably close.

Fig. 39 Measured Kt values for a 51 volume percent E-glass–SC15 composite. The black line 

is the average Kt.

Figure 40 shows the measured Kt for a 46 volume percent S2-glass–SC11 

composite. Kt is lower than expected, and there is no apparent increase with 

temperature. 

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TEMPERATURE (DEGREES C)

SC15-7781 E-GLASS
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30

Fig. 40 Results of 4 determinations of Kt for an SC-11/6781 style S2 glass composite. 

Legend: blue = run 1, orange = run 2, red= run 3, green = run 4, black = average.

5.3 Results: 250-Yield Roving-Based Fabric-Reinforced 

Composites 

Figure 41 shows the measured Kt for an SC15 matrix composite reinforced with a 

typical 51 volume percent S2 glass in the form of a 24-oz per square yard 5×5 

(2455) plain weave woven roving. The Kt, approximately 0.42 W/MK at room 

temperature, is in good agreement with the model results. 

Fig. 41 Kt for the SC15-2455 S2 glass composite

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TEMPERATURE (DEGREES CENTIGRADE)

SC11 - 6781 S2 GLASS

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Kt (W/MK)

TEMPERATURE (DEGREES C)

SC15-2455 S2 GLASS
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31

Figure 42 shows the measured Kt for an SC15 matrix composite reinforced with 

approximately 60 volume percent E-glass reinforcement in a stitched biaxial 

“fabric”, which had approximately the same areal density as the 2455 woven 

roving. The models predict that Kt for this composite should be about 10% higher. 

The difference could be a result of the fabric architecture or as a result of a poorer 

sizing.

Fig. 42 Kt for the biaxial E-glass/SC15 composite

Figure 43 shows the measured Kt for the HJ1 composite. This composite is about 

65% S2 glass by volume, so the thermal conductivity should be 2.75 to 3 times that 

of the matrix phenolic resin. This is expected to be close to 0.2 W/MK, so the 

agreement with the models is fairly good. The samples had a tendency to slip out 

of the center of the measurement apparatus, which accounts for some of the 

observed scatter in the results. 

Fig. 43 Kt for the 65% S2-glass/phenolic HJ1 composite

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TEMPERATURE (DEGREES C)

SC15-BIAXIAL E-GLASS, 2026 SIZING

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Kt (W/MK)

TEMPERATURE (DEGREES C)

HJ1
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32

6. IM7-CYTEC 381 EPOXY

A plate was prepared from a unidirectional IM7 carbon fiber prepreg from which 

2-inch diameter samples were cut. The through-the-thickness Kt for this material is 

shown in Fig. 44. Care was taken to ensure that the sample was centered in the 

apparatus since it had a tendency to slip around. The thermal conductivity of the 

carbon fiber is dominated by that of the electrons, making it appreciably higher than 

that of the epoxy. The simple formula for the composite Kt suggests that it should 

be somewhat higher than that of the glass composites, but not greatly higher, which 

is what is observed. The results are in good agreement with those in Putnam et al.16

for the through-the-thickness Kt of a carbon-fabric-reinforced epoxy. They are also 

consistent with the results in Long et al.22 for a unidirectional fabric, assuming Kt

is a linear function of Kt for the matrix resin. 

Fig. 44 Measured Kt for the IM7-381 epoxy composite. Three runs are shown distinguished 

by the blue, orange, and green curves. 

7. Summary and Conclusions

The results of thermal conductivity measurements between 20 and 100 °C for some 

neat polymers and their fiberglass composites have been presented. Some findings 

for the neat polymers are noteworthy:

1. TG is not seen in the measurements. The increase in heat capacity is 

countered by a decrease in the thermal diffusivity and the density. 

2. The differences in Kt for the epoxies correlate with differences in the 

chemical structure of the polymers. 

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Kt (W/MK)

TEMPERATURE (DEGREES C)

IM7-381 EPOXY
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33

3. Curing with the most aromatic curing agent (EPIKURE W), which does 

have extended chains of conjugated double bonds, had a minimal effect on 

Kt. Polymers with long chains of conjugated double bonds, such as polyacetylene, will have high Kt’s as a consequence of the electronic 

conductivity. 

4. Polymers that are ordered (more crystal like) will have higher thermal 

conductivities due to decreased scattering of thermal excitations, as a 

comparison of the results for VESPEL and the other materials shows.

5. The temperature dependence of Kt is generally small. The Kt results can be 

extrapolated to temperatures perhaps 50 °C lower. 

The composites studied with Vf greater than approximately 45% have Kt values 

that run slightly (approximately 10%) lower than the theoretical models examined. 

This is fairly good agreement in view of the many assumptions in the models and 

non-uniformity in the composite samples. For lower fiber concentrations, the 

models cease to correspond to the actual samples. The temperature dependence of 

the Kt’s of the composites is larger than that of neat polymers because of the 

increase in Kt of the glass, but is still not very large. The Kt values could be 

reasonably extrapolated to lower or higher temperatures. These results would be 

usable for thermal modeling efforts. 
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34

8. References

1. Burger N, Laachachi A, Ferriol M, Lutz M, Toniazzo V, Ruch D. Review of 

thermal conductivity in composites: mechanisms, parameters and theory. Prog 

Polym Sci. 2016;61:1–28.

2. Lu X, Xu G. Thermally conductive polymer composites for electronic 

packaging. J Appl Polym Sci. 1997:65(13):2733–2738.

3. Weidenfeller B, Höfer M, Schilling FR. Thermal conductivity, thermal 

diffusivity, and specific heat capacity of particle filled polypropylene.

Composites Part A. 2004;35(4):423–429. 

4. Bujard P, Kiihnlein G, InoS, Shiobara T. Thermal conductivity of molding 

compounds for plastic packaging. Proceedings of the 44th Electronic 

Components and Technology Conference; 1994. IEEE Conference Proceeding 

Publications. p. 159–163. 

5. Ngo IL, Jeon S, Byon C. Thermal conductivity of transparent and flexible 

polymers containing fillers: a literature review. Int J Heat Mass Transfer.

2016;98:219–226. 

6. Ganguli S, Roya AK, Anderson DP. Improved thermal conductivity for 

chemically functionalized exfoliated graphite/epoxy composites. Carbon.

2008;46(5):806–817. 

7. Mamunya Ye P, Davydenko VV, Pissis P, and Lebedev EV. Electrical and 

thermal conductivity of polymers filled with metal powders. Eur Polym J.

2002;38(9):1887–1897. 

8. Kline DE. Thermal conductivity studies of polymers. J Polym Sci. 

1961;50(154):441–450. 

9. Harada M, Hamaura N, Ochi M, Agari Y. Thermal conductivity of liquid 

crystalline epoxy/BN filler composites having ordered network structure.

Composites Part B. 2013;55:306–313.

10. Anderson DR. Thermal conductivity of polymers. Chem Rev.

1966;66(6):677–690.

11. Takezawa Y, Akatsuka M, Farren C. High thermal conductive epoxy resins 

with controlled high order structure. Proceedings of the 7th International 

Conference on Properties and Applications of Dielectric Materials; 2003. 

IEEE. DOI: 10.1109/ICPADM.2003.1218626. p. 1146–1149.
Approved for public release; distribution is unlimited.

35

12. Algaer E. Thermal conductivity of polymer materials – reverse nonequilibrium 

molecular dynamics simulation. Thesis, Technische Universität, Darmstadt, 

2010.

13. Knorr Jr DB, Yu JH, Richardson AD, Hindenlang MD, McAninch IM, La 

Scala JJ. Glass transition dependence of ultrahigh strain rate response in amine 

cured epoxy resins. Polym. 2012;53(25):5917–5923.

14. Bain ED, Knorr Jr DB, Richardson AD, Masser KA, Yu J, Lenhart JL. Failure 

processes governing high-rate impact resistance of epoxy-resins filled with 

core–shell rubber nanoparticles. J Mater Sci. 2016;51(5):2347–2370. DOI:

10.1007/s10853-015-9544-5.

15. Kalogiannakis D, Hemelrijck Van, Assche G. Van. Measurements of thermal 

properties of carbon/epoxy and glass/epoxy using modulated temperature 

differential scanning calorimetry. J Compos Mater. 2004;38:163–175.

16. Putnam SA, Cahill DG, Ash BJ, Schadler LS. High-precision thermal 

conductivity measurements as a probe of polymer/nanoparticle interfaces. J 

App Phys. 2003;94(10):6785–8.

17. Sweeting RD, Liu XL. Measurement of thermal conductivity for fiberreinforced composites. Composites Part A. 2004;35:933–938. 

18. ASTM D570-98(2010)e1, Standard Test Method for Water Absorption of 

Plastics. West Conshohocken (PA): ASTM International; 2010 [accessed 2018 

Feb 7]. www.astm.org.

19. Morikawa J, Tan J, Hashimoto T. Study of change in thermal diffusivity in 

amorphous polymers during glass transition. Polym. 1995;36(23):4439–4443. 

20. Slegel EC. A family of new and novel transparent and impact resistant 

urethane polymers. Proceedings of the Polyurethanes Expo99; 1999 Sep 12–

15; Orlando, FL. p. 535. 

21. Knorr Jr DB, Masser KA, Elder RM, Sirk TW Hindenlang MD, Yu JH, 

Richardson AD, Boyd SE, Spurgeon WA, Lenhart JL. Overcoming the 

structural versus energy dissipation trade-off in highly crosslinked polymer 

networks: Ultrahigh strain rate response in polydicyclopentadiene. Compos 

Sci Technol. 2015;114:17–25.

22. Long TR, Knorr Jr DB, Masser KA, Elder RM, Sirk TW, Yu JH, Andzelm JW, 

Lenhart JL. Ballistic response of polydicyclopentadiene and poly-5-

ethylidene-2-norbornene, and effects of crosslinking. SEM XIII International 

Congress; 2016 June 6; Lake Buena Vista, FL.
Approved for public release; distribution is unlimited.

36

23. AGY 2017 Technical Product Guide. AGY; 2017 [accessed 2018 Feb 7].

www.agy.com. 

24. Li H, Li Y, Wang S. Prediction of the effective thermal conductivities of 

woven fabric composites using unit cells at multiple length scales. J Mater Res. 

2011;26(3):384–394. 

25. Pilling MW, Yates B, Black MA, Tattersall P. The thermal conductivity of 

carbon fibre-reinforced composites. J Mater Sci. 1979;14(6):1326–1338.

26. Clayton W. Constituent and composite thermal conductivities of phenoliccarbon and phenolic-graphite ablators. Proceedings of the 12th Structures, 

Structural Dynamics, and Materials Conference; 1971; Anaheim, CA. p. 1–17. 

27. Yu H, Heider D, Advani S. Prediction of the effective through-thickness 

thermal conductivity of woven fabric reinforced composites with embedded 

particles. Compos Struct. 2015;127:132–140. 
Approved for public release; distribution is unlimited.

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List of Symbols, Abbreviations, and Acronyms

AGY Advanced Glassfiber Yarns

ARL US Army Research Laboratory

DDSA Dodecenylsuccinic Anhydride

DGEBP-A diglycidyl ether of bisphenol-A

DGEBP-F diglycidyl ether of bisphenol-F

DGETAM diglycidyl ether of terephthalylidene-bis-(4-amino-3-methylphenol)

DMA Dynamic Mechanical Analyzer

DSC differential scanning calorimetry

FE finite element

Kt thermal conductivity

LC liquid crystal

TG glass transition temperature

TJC thermal joint compound

MTHPA Methyltetrahydrophthalic Anhydride

NIST National Institute of Standards and Technology

PC personal computer

p-DCPD poly-dicyclopentadiene

p-ENB poly-ethylidiene-norbornene

Vf volume of fraction

W/MK watts per meter per degree kelvin
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1 DEFENSE TECHNICAL

(PDF) INFORMATION CTR

DTIC OCA

2 DIR ARL

(PDF) IMAL HRA 

RECORDS MGMT

RDRL DCL

TECH LIB

1 GOVT PRINTG OFC

(PDF) A MALHOTRA

1 ARL

(PDF) RDRL WMM A

W SPURGEON