EX-10.I.R



 









Exhibit 10(i)(R)







Qimonda AG

Confidential Materials Omitted and Filed Separately with the

Securities and Exchange Commission.

Confidential Portions denoted by [***].







TESSERA, INC.

Qimonda TCC
® License Agreement



This Agreement is entered into as of this First day of July, 2006 (“Effective Date”), between
TESSERA INC., a corporation organized under the laws of Delaware, having a principal place of
business at 3099 Orchard Drive, San Jose, CA, 95134, USA and the Tessera Affiliates (collectively
“Tessera”) and Qimonda AG, a corporation organized under the laws of Germany having a principal
place of business at Munich, Germany (or any successors or assigns of Qimonda AG due to any
entities resulting from the initial public offering of Qimonda AG), and the Licensee Affiliates
(collectively “Licensee”) with reference to the following facts:




Recitals



WHEREAS, Tessera owns certain patents related to semiconductor integrated circuit (“IC”) packaging
technology, and



WHEREAS, Licensee wishes to license the Tessera patents for certain semiconductor products in
accordance with the terms hereof.



The Parties Hereto Agree:




     I. Definitions. As used herein, the following terms shall have the following meaning:



     A. The term “Licensed Product” includes IC packages using (a) polyimide or glass-epoxy or
glass-laminate substrate; (b) one or more solder balls under the IC; (c) die attach adhesive
attaching the IC to the polyimide or glass-epoxy or glass-laminate substrate; and (d) solder ball
pitch less than or equal to 1.0mm. By way of clarification and not limitation, Licensed Products
include DRAM Licensed Products, Non-DRAM Licensed Products and Multiple Substrate Licensed
Products.



     B. The term “DRAM Device” means a Dynamic Random Access Memory (DRAM) IC device comprised
solely of an array of DRAM cells and the associated control and I/O circuitry that are necessary to
allow data to be written to, stored by, and read from the DRAM cells.



     C. The term “DRAM Licensed Product” means a Licensed Product that contains at least one IC
that is a DRAM Device and does not contain an IC that is not a DRAM Device.



     D. The term “Non-DRAM Licensed Product” means a Licensed Product that contains at least one IC
that is not a DRAM Device. If a Licensed Product contains both a DRAM Device and



 









 





an IC that is not
a DRAM Device, the Licensed Product shall be considered a Non-DRAM
Licensed Product.


     E. The term “Multiple Substrate Licensed Product” means a “Package Stack Unit” and a “Package
Stack,” defined respectively as follows:



          i. The term “Package Stack Unit” means a package substrate having electrically conductive
terminals and at least one IC device on the package substrate and electrically connected to at
least some of the terminals, and




          ii. The term “Package Stack” means an IC package including two or more Package Stack Units,
wherein said units are stacked one above the other so that at least some of the terminals on
mutually adjacent units in the stack are aligned with one another, mutually adjacent units being
electrically interconnected to one another by joining connectors formed at least in part from
material bonded to the aligned terminals of such units.




     F. The term “Batch Technology” as used herein means any method, process, technique or Tessera
Patent that covers any structures or processing methods for simultaneously forming, producing
and/or connecting a plurality of electrical connections between contacts on an IC device and
substrate terminals of the IC package, including: (i) any method or result of U.S. Patent Number
5,518,964 (and related Patents) for making flexible electrically conducting element(s), joining
said elements to electrical contact(s) on a substantially planar electrical element such as a
semiconductor integrated circuit, undiced IC wafer, or interconnect substrate, and forming said
element(s) away from the plane of said contacts in a predetermined fashion into the flexible
electrical lead(s) of an IC package; (ii) any method or result of U.S. Patent 5,455,390 (and
related Patents) for making and forming flexible conducting element(s) on a dielectric film and
then simultaneously joining said elements to electrical contacts on a substantially planar
electrical element such as a semiconductor integrated circuit, undiced IC wafer or interconnect
substrate to produce the flexible electrical leads of an IC package; and/or (iii) any method or
result of further invention or Patent made or acquired by Tessera during the term hereof covering
any batch processing method for simultaneously forming, producing and/or connecting a plurality of
flexible electrical leads of an IC package. Notwithstanding, the parties expressly agree that any
IC package made and/or connected individually on a semiconductor integrated circuit or undiced
wafer by traditional wire bonding methods and/or tape automated
bonding (“TAB”) gang bonding
methods, is not included in Batch Technology.



     G. The term “Patent” means letters patent, utility models, allowances and applications
therefor in all countries of the world, including re-issues, re-examinations, continuations,
continuations-in-part, divisionals, and all corresponding foreign patents.



     H. The term “Tessera Patent” means Patent(s) or claims within such Patent(s) for the design,
manufacture, and/or assembly of Licensed Products (excluding Batch Technology as defined herein)
owned by Tessera prior to expiration or termination of this Agreement. The term Tessera
Patent shall further include any third party patent for the design, manufacture, and/or
assembly of Licensed Products (excluding Batch Technology as defined herein) under which Tessera or
any successor thereof has the right to grant licenses of the scope granted herein, as of the



2









 







Effective Date or at any time during the term of this Agreement, without the payment of royalty or
other consideration to such third parties except for payment to third parties for inventions made
by said parties while employed by Tessera or any successor thereof. Tessera Patents, as defined
above, includes but is not limited to those Patents set forth in Attachment A as of the date stated
therein. Tessera has sole discretion in the prosecution of the Tessera patent applications
licensed hereunder, non-exclusively including filing continuations, continuations-in-part,
divisionals, filing corresponding foreign patents applications and/or abandoning one or more of
such patent applications.



     I. The term “Billable Pin” means any electrical connection to an IC electrical bond pad made
or contained in any Licensed Product.



     J. The term “Licensee Affiliate” means any company which agrees to be bound by the terms and
conditions of this Agreement and has more than fifty percent (50%) of the voting stock or equity
owned or controlled by Licensee. A company shall be considered a Licensee Affiliate only so long
as such majority ownership or control exists. Licensee shall be ultimately responsible for the
actions of the Licensee Affiliates pursuant to this Agreement.



     K. The term “Tessera Affiliate” means any company which agrees to be bound by the terms and
conditions of this Agreement and has more than fifty percent (50%) of the voting stock or equity
owned or controlled by Tessera. A company shall be considered a Tessera Affiliate only so long as
such majority ownership or control exists. Tessera shall be ultimately responsible for the actions
of the Tessera Affiliates pursuant to this Agreement.



     L. The term “Licensed Package Assembler” means a party licensed by Tessera to assemble, use
and sell Licensed Products for others. Tessera agrees to periodically provide Licensee a list of
such parties.



     II. Licensee Rights



     A. License Grant. Subject to the terms and conditions hereinafter set forth, Licensee’s
compliance with the provisions hereof including all Attachments hereto, and Licensee’s payment of
the fees and royalties stated herein in Paragraph III, Tessera hereby grants Licensee a world-wide,
non-exclusive, non-transferable, non-sublicensable, limited license to the Tessera Patents to make,
have made, use, sell, import, and offer for sale Licensed Products that are sold as Licensee’s own
products (i.e., the Licensed Products bear the Licensee’s commercial indicia).



          1.
Have Made Rights and Royalties. If Licensee exercises its
“have made” right hereunder, Licensee shall be responsible for the payment of all royalties due hereunder
directly to Tessera for such assembly of Licensed Products regardless of whether or not the
assembler of the Licensed Product is a Licensed Package Assembler. Nothing in this Paragraph
II.A.1 shall prevent Licensee from agreeing with a Licensed Package Assembler that the Licensed
Package Assembler shall report and pay royalties to Tessera under its license for all Licensed Products made for
Licensee provided, however, that if such Licensed Package Assembler fails to report and pay such
royalties, Licensee shall pay the unpaid royalties under this Agreement promptly upon notice by
Tessera. Licensee shall have no obligation to pay an additional royalty under this agreement for




3









 




products on which a Licensed Package Assembler has already paid a full royalty under its agreement
with Tessera. Any such agreement reached between Licensee and a Licensed Package Assembler shall
require such Licensed Package Assembler to clearly identify Licensed Products made for Licensee in
reports to Tessera, and Tessera shall be given notice of such agreement.




          2. Notice to Assemblers. When Licensee exercises this “have made” right at a Package
Assembler, it shall provide a written notice to such Licensed Package Assembler, with a copy to
Tessera, substantially in the form attached hereto as Attachment D.




     B. Batch Technology Excluded. Notwithstanding anything herein to the contrary, Batch
Technology is excluded from the scope of this Agreement, and Licensee’s rights herein expressly
exclude any right to package and/or assemble, or sell any product made using Batch Technology.
Accordingly, products made using Batch Technology are not Licensed Products under this
Agreement, and no royalties are due under this Agreement for products made using Batch Technology.



     C. No Implied License. Except for the licenses expressly granted in Paragraph II.A, no
license, express or implied, by estoppel or otherwise, to any of Tessera’s intellectual property
rights is granted or implied by this Agreement.



     D. Exclusion from License. Licensee is licensed only for Licensed Products for which it pays
royalties hereunder. Tessera may, at any time during the term hereof, notify Licensee that Tessera
believes that a product made, used, sold, imported, or offered for sale by Licensee (“Notified
Product”) is a Licensed Product. During a sixty (60) day period after such notice, the parties
will engage in good faith negotiations to include the Notified Product hereunder as Licensed
Product, but neither party will commence any litigation or administrative proceedings relating to
the Notified Product until after the end of the sixty (60) day period. If the parties fail to
agree on including the Notified Product as a Licensed Product during such period, the Notified
Product will not be licensed hereunder and either party may commence litigation or administrative
proceedings upon the expiration of the sixty (60) day period.



     III. Royalty and Other Consideration



     A. Other Consideration. As partial consideration for the license under this Agreement,
Licensee shall pay to Tessera the sum of Forty Million US Dollars ($40,000,000) by August 18, 2006.



     B. Royalty. As further consideration Licensee shall pay running royalties for the license
granted under this Agreement four times annually (as set forth in Paragraph V) to Tessera during
the term of this Agreement, as follows:



          1. DRAM Licensed Products. For each DRAM Licensed Product sold by Licensee, Licensee shall
pay a royalty as set forth in Attachment B.




          2. Non-DRAM Licensed Products. For each Non-DRAM Licensed Product sold by Licensee, Licensee
shall pay a royalty as set forth in Attachment B.




4









 





          3. Multiple Substrate Licensed Products. In the case of a Multiple Substrate Licensed
Product, royalties due under this Paragraph III.B shall be calculated separately for each Package
Stack Unit of a Package Stack based on whether the Package Stack Unit solely contains DRAM or
includes other types of ICs. For example, the royalty due for a Package Stack Unit that contains
solely DRAM shall be determined according to Paragraph III.B.1 per Package Stack Unit, the royalty
due for a Package Stack Unit that contains an IC that is not DRAM shall be determined according to
Paragraph III.B.2 per Package Stack Unit, such that the total royalty due for a Multiple Substrate
Licensed Product shall be calculated by adding together the royalty determined for each Package
Stack Unit.




     C. Royalty Adjustments. In making the royalty payments due Tessera, Licensee may subtract
from such royalty payments any preceding royalty payments for royalty bearing Licensed Products
that are returned to Licensee from Licensee’s customers (“Royalty Adjustment”). However, if at any
time such returned Licensed Products are resold by Licensee, Licensee shall pay a royalty to
Tessera for such resold Licensed Products, as set forth in the Agreement. Before a Royalty
Adjustment can be so subtracted, Licensee must have originally paid a royalty on the particular
returned Licensed Product. All Royalty Adjustments must be specified with the information set
forth in Attachment C.



     IV. Taxes



     Any taxes due to the German government relating to payments made by Licensee to Tessera
pursuant to this Agreement shall be paid by Licensee and deducted from the amount payable from
Licensee to Tessera. Licensee shall obtain official tax receipts from the German government
indicating payment of such taxes and submit such receipts to Tessera to enable Tessera to obtain
applicable tax credits. Licensee shall cooperate reasonably with Tessera, and offer such
assistance as it reasonably can, in order to ensure that Tessera receives the most favorable tax
treatment with respect to the payments detailed herein.



5









 





     V. Licensee Reports and Payment



     A. Quarterly Royalty Reports & Payment. Beginning on the Effective Date of this Agreement,
royalties shall be calculated and paid in full in quarter annual payment periods ending March 31,
June 30, September 30 and December 31 of each year. Beginning with the first such royalty payment,
Licensee shall deliver a written report (as shown in Attachment C) describing (i) the basis upon
which and containing the information sufficient to determine the royalties due Tessera for the
applicable payment period and (ii) the purchases by Licensee of Licensed Products from other
Tessera licensees. All payments under this Paragraph shall be made in US Dollars by wire transfer
to Union Bank of California, 99 Almaden Blvd., San Jose, CA 95113, Account Name: Tessera, Account
No.: 6450148359, Routing No. 122000496, International Swift Code: BOFCUS33MPK, or such other bank
or account as Tessera may from time to time designate in writing. The payments of royalties and
submission of such reports from Licensee to Tessera under this Paragraph shall be made within
thirty (30) days from the end of each quarter annual payment period and shall be considered to be
made as of the day on which such payments are received in Tessera’s designated bank account.



     VI. Licensee Patents




     A. Limited Rights Under Licensee’s Patents. Licensee hereby grants to Tessera a world-wide,
royalty-free, non-exclusive, non-sublicensable, non-transferable,
right under Licensee'’s
Patents for the term of this Agreement to make, use and sell Licensed Products (subject to the
Batch Technology exclusion of Paragraph II.B) for the purposes of internal research and
development, customer funded research and development, and in support of Tessera’s engineering
services business. For the sake of clarity, the license granted to Tessera in this Section VI.A is
limited to the IC package and interconnect of the Licensed Product, alone or in combination with an
IC, and does not include, for example, the functional circuitry on the die or semiconductor process
technology used in the formation of the functional circuitry on the IC (hereafter “Qimonda License
Scope”). If Licensee elects to extend the term of this Agreement to obtain a paid-up license, then
the license set forth in this Paragraph VI.A shall also become a fully paid-up and perpetual.
Furthermore, to the extent that Licensee believes a third party is directly infringing Licensee’s
patents within the Qimonda License Scope, Licensee agrees to pursue its claims directly with such
third party and not with Tessera unless Tessera first asserts a Tessera Patent against Licensee
that would require an additional royalty for Licensed Products made under this Agreement.



     VII. This section intentionally left blank




     VIII. Term and Termination




     A. Term: This Agreement shall become effective on the Effective Date and, unless earlier
terminated as provided for elsewhere in this Agreement, shall remain in full force until it
automatically expires on May 22, 2012, unless Licensee notifies Tessera by November 22, 2011 that
Licensee elects to extend this Agreement by five (5) years until May 22, 2017, and continue to pay
royalties for Licensed Products during the five (5) year extension period at rates equal to fifty
percent (50%) of the amounts due under Paragraph III.B. herein. If Licensee elects to extend this



6









 







Agreement until May 22, 2017, upon expiration of the extended term, Licensee shall have a
fully paid-up and perpetual license on the terms set forth in Paragraphs II.A through II.D herein
to use the Tessera Patents to the same extent as Licensee was licensed to use and was using Tessera
Patents immediately prior to such expiration.



     B. Termination for Breach. Either party may terminate this Agreement due to the other party’s
breach of this Agreement, such as failure to perform its duties, obligations, or responsibilities
herein (including, without limitation, failure to pay fees and royalties and provide reports as set
forth herein). The parties agree that such breach will cause substantial damages to the party not
in breach. Therefore, the parties agree to work together to mitigate the effect of any such breach;
however, the non-breaching party may terminate this Agreement if such breach is not cured or
sufficiently mitigated (to the non-breaching party’s satisfaction) within sixty (60) days of notice
thereof.



     C. Termination for Assignment. In the event that (i) a party either sells or assigns
substantially all of its assets or business to a third party (“Selling Party”) or (ii) a third
party acquires more than fifty percent (50%) of the capital stock entitled to vote for directors of
such party (“Purchasing Party”), the Selling Party shall notify the other party hereto of such sale
or assignment of assets or the Purchasing Party’s acquisition. In any case of sale, assignment or
acquisition, the Selling Party shall provide to the other party a written confirmation from such
Purchasing Party stating that such Purchasing Party shall expressly undertakes all the terms and
conditions of this Agreement to be performed by Selling Party. In the event that Licensee is the
Selling Party and the Purchasing Party does not agree to fulfill such obligations under this
Agreement, Tessera shall reserve a right to terminate this Agreement. In the event Tessera is the
Selling Party, the Purchasing Party shall be bound to the terms and obligations of this Agreement.



     D. Termination for Bankruptcy. In the event that one party becomes insolvent or bankrupt,
permanently ceases doing business, makes an assignment for the benefit of its creditors, commits an
act of bankruptcy, commences any bankruptcy proceedings or other proceedings in the nature of
bankruptcy proceedings, or has commenced against it any bankruptcy proceedings or other proceedings
in the nature of bankruptcy proceedings that are not dismissed within sixty (60) days, then the
other party shall have the right to terminate this Agreement immediately upon its notice.



     E. Effect of Termination. Any termination of this Agreement pursuant to this Paragraph VIII
shall be deemed a termination of this Agreement in accordance with its terms (including termination
of any payments of unaccrued royalties to Tessera and any rights of Licensee to use any Tessera
Patent licensed hereunder).



     F. Survival Clause. Unless otherwise provided elsewhere in this Agreement, the following
provisions shall survive the termination or expiration of this Agreement:



          1. Licensee’s obligation to make payments to Tessera accrued under this Agreement on or prior
to expiration or termination.




7









 





          2. Licensee’s obligation to submit written reports stipulated in Paragraph V for periods
prior to termination, Licensee Reports and Payment, and to permit the inspection and audit of its
records stipulated in Paragraph IX, Reasonable Audit.




          3. Paragraph VIII, Term and Termination.




          4. Paragraph X, No Warranties




          5. Paragraph XI, Limitation on Damages




          6. Paragraph XII, Confidentiality of Agreement Terms




          7. Paragraph XIV, Miscellaneous




     IX. Reasonable Audit



     A. Financial Audit. Upon reasonable written prior notice, Tessera shall have the right to
examine and audit through an independent third party CPA firm, not more frequently than once per
year, relevant records of Licensee that may contain information bearing upon the amount of fees and
royalties payable under this Agreement; provided, that the said auditor shall have agreed in
advance in writing to maintain in confidence and not to disclose to Tessera or any third party any
Licensee proprietary information obtained during the course of such audit. Licensee shall permit
auditors to copy and retain audit relevant records in confidence. The results of any such audit
shall be final, and within thirty (30) days after receiving the auditor’s report, Licensee shall
make payment to Tessera of any amount which may be found to be payable, if any, and Tessera
shall make payment to Licensee of any amount which may be found to have been overpaid, if any.
Tessera shall bear the expenses of such audit examinations unless fees and royalties due and owing
to Tessera are determined by the auditor to be at least five percent (5%) greater than such
similar amounts as calculated and/or paid by Licensee, in which case Licensee shall bear such
expenses.



     X. No Warranties



     The Parties acknowledge and agree that the rights and licenses, Tessera Patents, Licensee
patents and standards granted or otherwise provided hereunder are provided “AS IS”, with no
warranty of any kind. NEITHER PARTY MAKES ANY WARRANTY, EXPRESS, IMPLIED, STATUTORY OR OTHERWISE,
CONCERNING THE SUBJECT MATTER OF THIS AGREEMENT, INCLUDING WITHOUT LIMITATION, WARRANTIES OF
FITNESS FOR A PARTICULAR PURPOSE, QUALITY, USEFULNESS, PATENT VALIDITY OR NONINFRINGEMENT. Neither
Party makes any warranty that the Tessera Patents or the Licensee patents will be sufficient to
yield any particular result.



     XI. Limitation on Damages



     IN NO EVENT SHALL EITHER PARTY BE LIABLE TO THE OTHER PARTY OR ANY OTHER PERSON OR ENTITY
(UNDER ANY CONTRACT, NEGLIGENCE, STRICT



8









 







LIABILITY OR OTHER THEORY) FOR SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF OR
RELATED TO THE SUBJECT MATTER OF THIS AGREEMENT, EVEN IF THE PARTY HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR LOSSES.



     XII. Confidentiality of Agreement Terms



     A. Confidential Terms. Tessera and Licensee shall keep the terms of this Agreement
(including all Attachments hereto) confidential except:




(1) to any court or governmental body or agency compelling such disclosure; however, any
disclosure shall be limited to that compelled by the governmental body or agency and the
disclosing party will take all reasonable actions to obtain a protective order protecting
the disclosure. With respect to any disclosure of this Agreement required by the United
States Securities and Exchange Commission or similar governmental agencies (it being
acknowledged and agreed that Licensee will file this Agreement as an exhibit to the
registration statement on form F-1 it has filed with respect to its initial public
offering), Licensee shall use reasonable efforts to secure confidential treatment of the
royalty terms set forth in Attachment B hereto, provided, however, that, if after making
such reasonable efforts Licensee is unable to secure such confidential treatment without
adversely effecting the timing of its planned initial public offering, then
Licensee need not secure such confidential treatment of the royalty terms;




(2) as may otherwise be required by law;




(3) disclosures to their respective attorneys, accountants, and financial advisors; or




(4) either party may disclose to third parties the existence of this Agreement to the extent
described in the Recitals section hereof.



     B. Order to Disclose. A party receiving a request, subpoena or order for the disclosure of
the terms or conditions of this Agreement shall notify the other party as soon as practicable and
if, at all possible, in sufficient time to allow the other party to oppose disclose or seek
appropriate protective orders. The party receiving such request, subpoena or order shall cooperate
to the extent reasonably possible with the other party in any effort to oppose disclosure or seek
protective orders.



     C. Breach of Confidentiality. If either party learns of a breach of this Paragraph XII, such
party shall immediately send a written notification to the other party describing the circumstances
of such breach.



     D. Employee Agreements. Licensee will disclose the terms of this Agreement solely to its
employees who have a need to know such information.



     E. Prior Confidentiality Terms. This Paragraph XII applies only to the matters described
herein and does not supersede any prior written agreements between the parties.



9









 





     XIII. This Section Intentionally Left Blank



     XIV. Miscellaneous



     The following additional terms shall apply to this Agreement:



     A. Governing Law. This Agreement shall be governed, interpreted and construed in accordance
with the laws of the State of California, irrespective of choice of laws provisions. Both parties
shall use reasonable efforts to resolve by mutual agreement any disputes, controversies, claims or
difference which may arise from, under, out of or in connection with this Agreement. If such
disputes, controversies, claims or differences cannot be settled between the parties, any dispute
resolution proceeding shall take place in the United States, but if either party files a claim in a
state or federal court, such claim shall be filed in the state or federal courts within the
geographic boundaries of the federal Eastern District of Texas. The parties hereby consent to
personal jurisdiction and venue in the state and federal courts of the federal Eastern District of
Texas. Nothing herein shall alter or affect any other rights either party may have to redress any
breach or act of the other party. Notwithstanding any provision herein, after the sixty (60) day
cure period set forth in Paragraph VIII.B and notice of termination of this Agreement by one of the
parties, either party may bring an action in the U.S. International Trade Commission.



     B. No Waiver. Any waiver, express or implied, by either of the parties hereto of any right
hereunder or default by the other party, shall not constitute or be deemed a continuing waiver or a
waiver of any other right or default. No failure or delay on the part of either party in the
exercise of any right or privilege hereunder shall operate as waiver thereof, nor shall any single
or partial exercise of such right or privilege preclude other or further exercise thereof or of any
other right or privilege.



     C. Equitable Relief. Nothing herein shall preclude either party from taking actions at any
time in the courts specified in Paragraph XIV.A that are necessary to prevent immediate,
irreparable harm to its interests. Otherwise, these procedures are exclusive and shall be fully
exhausted prior to the initiation of any litigation.



     D. Notices. All notices, required documentation, and correspondence in connection herewith
shall be in the English language, shall be provided in writing and shall be given by facsimile
transmission or by registered or certified letter to Tessera and Licensee at the addresses and
facsimile numbers set forth below:



	 	 	 	 	 
	 

	 	Tessera:
	 	Tessera, Inc.
	 

	 	 	 	3099 Orchard Dr.
	 

	 	 	 	San Jose, California 95134
	 

	 	 	 	Facsimile No.: 408-894-0190
	 

	 	 	 	Attn.: Chief Executive Officer
	 
	 	 	 	 
	 

	 	Licensee:
	 	Qimonda AG
	 

	 	 	 	Gustav-Heinemann-Ring 123,
	 

	 	 	 	81739 München,






10









 





	 	 	 	 	 
	 

	 	 	 	Germany
	 

	 	 	 	Facsimile No.:+49-89-234-9550409
	 

	 	 	 	Attn: General Counsel






     Either Party may change its address and/or facsimile number by giving the other party notice
of such new address and/or facsimile number. All notices if given or made by registered or
certified letter shall be deemed to have been received on the earlier of the date actually received
and the date three days after the same was posted and if given or made by facsimile transmission
shall be deemed to have been received at the time of dispatch, unless such date of receipt is not a
business day, in which case the date of deemed receipt shall be the next succeeding business day.



     E. Invalidity. If any provision of this Agreement is declared invalid or unenforceable by a
court having competent jurisdiction, it is mutually agreed that this Agreement shall endure except
for the part declared invalid or unenforceable by order of such court. The parties shall consult
and use their reasonable efforts to agree upon a valid and enforceable provision which shall be a
reasonable substitute for such invalid or unenforceable provision in light of the intent of this
Agreement.



     F. Assignment. With the exception of Paragraph VIII.C (Termination for Assignment), neither
party may assign this Agreement or any of its rights or obligations hereunder without the prior
written consent of the other party; provided, however, that Tessera may assign this Agreement to a
Tessera Affiliate, a parent company, or any company owned or controlled by such parent company.



     G. Export Regulations. Both parties shall comply with the laws and regulations of the
government of the United States and of any other country as relevant to each party hereto relating
to the export of goods and information.



     H. Paragraph Headings. The headings and captions used herein shall not be used to interpret
or construe this Agreement.



     I. Entire Understanding. This Agreement embodies the entire understanding between the parties
relating to the subject matter hereof, whether written or oral, and there are no prior
representations, warranties or agreements between the parties not contained in this Agreement. Any
amendment or modification of any provision of this Agreement must be in writing, dated and signed
by both parties hereto.



     J. Contingency. This Agreement shall not become effective unless and until Tessera’s
Executive Committee (consisting of Tessera’s Chief Executive Officer, Chief Financial Officer and
General Counsel) confirms acceptance of this Agreement on
August 1, 2006, between 3:00 pm and 4:00
pm EDT. Tessera will use reasonable efforts to inform Licensee (by e-mail or facsimile) of acceptance
by Tessera’s Executive Committee within an hour of such
acceptance, provided, however, that Tessera shall not publish a press
release prior to the delivery of such information to Infineon.



     IN WITNESS WHEREOF, the parties hereto have executed and delivered this Agreement as of the
date first above written.



11









 





	 	 	 	 	 	 	 	 	 
	TESSERA, INC.	 	 	 	QIMONDA AG
	 
	 	 	 	 	 	 	 	 
	By:

	 	/s/ Christopher Pickett 

	 	 	 	By:
	 	/s/ Klaus Fleischmann 

	 

	 	 	 	 	 	 	 	 
	Print Name:

	 	Christopher Pickett 
	 	 	 	Print Name:	 	Klaus Fleischmann 

	 

	 	 	 	 	 	 	 	 
	Title:

	 	Executive Vice President &
General Counsel 

	 	 	 	Title:
	 	Vice President 

	 

	 	 	 	 	 	 	 	 
	Date:

	 	August 1, 2006 

	 	 	 	Date:
	 	August 1, 2006 

	 
	 
	 	 	 	 	 	 	By:
	 	/s/ Florian Bögel 

	 

	 	 	 	 	 	 	 	 
	 	 	 	 	 	 	Print Name:	 	Florian Bögel 

	 

	 	 	 	 	 	 	 	 
	 	 	 	 	 	 	Title:
	 	Corporate Legal Counsel 

	 

	 	 	 	 	 	 	 	 
	 	 	 	 	 	 	Date:
	 	August 1, 2006 







12









 





ATTACHMENT A (current through January 1, 2005)




	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	5,148,265

	 	SEMICONDUCTOR CHIP ASSEMBLIES

WITH FAN-IN LEADS
	 	9/24/2010
	 
	 	 	 	 
	5,148,266

	 	SEMICONDUCTOR CHIP ASSEMBLIES

HAVING INTERPOSER AND FLEXIBLE LEAD
	 	9/24/2010
	 
	 	 	 	 
	5,258,330

	 	SEMICONDUCTOR CHIP ASSEMBLIES

WITH FAN-IN LEADS
	 	11/2/2010
	 
	 	 	 	 
	5,346,861

	 	SEMICONDUCTOR CHIP ASSEMBLIES AND

METHODS OF MAKING SAME
	 	9/13/2011
	 
	 	 	 	 
	5,347,159

	 	SEMICONDUCTOR CHIP ASSEMBLIES

WITH FACE-UP MOUNTING AND REAR-SURFACE

CONNECTION TO SUBSTRATE
	 	9/13/2011
	 
	 	 	 	 
	5,390,844

	 	SEMICONDUCTOR INNER LEAD BONDING

TOOL
	 	7/23/2013
	 
	 	 	 	 
	5,398,863

	 	SHAPED LEAD STRUCTURE AND METHOD
	 	7/23/2013
	 
	 	 	 	 
	5,414,298

	 	SEMICONDUCTOR CHIP ASSEMBLIES AND

COMPONENTS WITH PRESSURE CONTACT
	 	3/26/2013
	 
	 	 	 	 
	5,477,611

	 	METHOD OF FORMING INTERFACE

BETWEEN DIE AND CHIP CARRIER
	 	9/20/2013
	 
	 	 	 	 
	5,489,749

	 	SEMICONDUCTOR CONNECTION

COMPONENTS AND METHODS WITH RELEASABLE

LEAD SUPPORT
	 	2/6/2013
	 
	 	 	 	 
	5,491,302

	 	MICROELECTRONIC BONDING WITH LEAD

MOTION
	 	9/19/2014
	 
	 	 	 	 
	5,525,545

	 	SEMICONDUCTOR CHIP ASSEMBLIES AND

COMPONENTS WITH PRESSURE CONTACT
	 	6/11/2013
	 
	 	 	 	 
	5,536,909

	 	SEMICONDUCTOR CONNECTION

COMPONENTS AND METHODS WITH RELEASABLE

LEAD SUPPORT
	 	7/16/2013
	 
	 	 	 	 
	5,548,091

	 	SEMICONDUCTOR CHIP CONNECTION

COMPONENTS WITH ADHESIVES AND METHODS

FOR BONDING TO THE CHIP
	 	10/26/2013






13









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	5,597,470

	 	METHOD OF MAKING A FLEXIBLE LEAD

FOR A MICROELECTRONIC DEVICE
	 	6/19/2015
	 
	 	 	 	 
	5,619,017

	 	MICROELECTRONIC BONDING WITH LEAD

MOTION
	 	9/19/2014
	 
	 	 	 	 
	5,629,239

	 	MANUFACTURE OF SEMICONDUCTOR

CONNECTION COMPONENTS WITH FRANGIBLE

LEAD SECTIONS
	 	3/21/2015
	 
	 	 	 	 
	5,659,952

	 	METHOD OF FABRICATING COMPLIANT

INTERFACE FOR A SEMICONDUCTOR CHIP
	 	9/20/2014
	 
	 	 	 	 
	5,663,106

	 	METHOD OF ENCAPSULATING DIE AND

CHIP CARRIER
	 	9/2/2014
	 
	 	 	 	 
	5,679,194

	 	FABRICATION OF LEADS ON

SEMICONDUCTOR CONNECTION COMPONENTS
	 	5/4/2015
	 
	 	 	 	 
	5,679,977

	 	SEMICONDUCTOR CHIP ASSEMBLIES,

METHODS OF MAKING SAME AND COMPONENTS

FOR SAME
	 	9/24/2010
	 
	 	 	 	 
	5,682,061

	 	COMPONENT FOR CONNECTING A

SEMICONDUCTOR CHIP TO A SUBSTRATE
	 	10/28/2014
	 
	 	 	 	 
	5,685,885

	 	WAFER-SCALE TECHNIQUES FOR

FABRICATION OF SEMICONDUCTOR CHIP

ASSEMBLIES
	 	9/13/2011
	 
	 	 	 	 
	5,706,174

	 	COMPLIANT MICROELECTRONIC

MOUNTING DEVICE
	 	7/7/2014
	 
	 	 	 	 
	5,766,987

	 	MICROELECTRONIC ENCAPSULATION

METHODS AND EQUIPMENT
	 	9/22/2015
	 
	 	 	 	 
	5,776,796

	 	METHOD OF ENCAPSULATING A

SEMICONDUCTOR PACKAGE
	 	5/19/2014
	 
	 	 	 	 
	5,777,379

	 	SEMICONDUCTOR ASSEMBLIES WITH

REINFORCED PERIPHERAL REGIONS
	 	8/18/2015
	 
	 	 	 	 
	5,787,581

	 	METHODS OF MAKING SEMICONDUCTOR

CONNECTION COMPONENTS WITH RELEASABLE

LOAD SUPPORT
	 	7/24/2012
	 
	 	 	 	 
	5,801,446

	 	MICROELECTRONIC CONNECTIONS WITH

SOLID CORE JOINING UNITS	 	9/1/2015






14









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	5,807,453

	 	FABRICATION OF LEADS ON

SEMICONDUCTOR CONNECTION COMPONENTS
	 	5/4/2015
	 
	 	 	 	 
	5,821,608

	 	LATERALLY SITUATED STRESS/STRAIN

RELIEVING LEAD FOR A SEMICONDUCTOR

CHIP PACKAGE
	 	9/6/2016
	 
	 	 	 	 
	5,821,609

	 	SEMICONDUCTOR CONNECTION

COMPONENT WITH FRANGIBLE LEAD SECTIONS
	 	3/21/2015
	 
	 	 	 	 
	5,834,339

	 	METHODS FOR PROVIDING VOID FREE

LAYERS FOR SEMICONDUCTOR ASSEMBLIES
	 	3/7/2016
	 
	 	 	 	 
	5,848,467

	 	METHODS OF MAKING SEMICONDUCTOR

CHIP ASSEMBLIES
	 	9/13/2011
	 
	 	 	 	 
	5,852,326

	 	FACE-UP SEMICONDUCTOR CHIP

ASSEMBLY
	 	9/24/2010
	 
	 	 	 	 
	5,861,666

	 	STACKED CHIP ASSEMBLY
	 	8/29/2016
	 
	 	 	 	 
	5,868,301

	 	SEMICONDUCTOR INNER LEAD BONDING

TOOL
	 	4/10/2016
	 
	 	 	 	 
	5,875,545

	 	METHOD OF MOUNTING A CONNECTION

COMPONENT ON A SEMICONDUCTOR CHIP WITH

ADHESIVES
	 	10/26/2013
	 
	 	 	 	 
	5,885,849

	 	MICROELECTRONIC CONNECTIONS WITH

SOLID CORE JOINING UNITS
	 	3/28/2015
	 
	 	 	 	 
	5,915,170

	 	MULTIPLE PART COMPLIANT INTERFACE

FOR PACKAGING OF A SEMICONDUCTOR CHIP

AND METHOD THEREFOR
	 	9/16/2017
	 
	 	 	 	 
	5,915,752

	 	METHOD OF MAKING CONNECTIONS TO A

SEMICONDUCTOR CHIP ASSEMBLY
	 	7/24/2012
	 
	 	 	 	 
	5,929,517

	 	COMPLIANT INTEGRATED CIRCUIT

PACKAGE AND METHOD OF FABRICATING THE

SAME
	 	7/27/2016
	 
	 	 	 	 
	5,932,254

	 	SYSTEM FOR ENCAPSULATING

MICROELECTRONIC DEVICES
	 	9/22/2015
	 
	 	 	 	 
	5,937,276

	 	BONDING LEAD STRUCTURE WITH

ENHANCED ENCAPSULATION
	 	10/8/2017






15









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	5,950,304

	 	METHODS OF MAKING SEMICONDUCTOR

CHIP ASSEMBLIES
	 	9/24/2010
	 
	 	 	 	 
	5,966,587

	 	METHODS OF MAKING SEMICONDUCTOR

ASSEMBLIES WITH REINFORCED PERIPHERAL

REGIONS
	 	8/18/2015
	 
	 	 	 	 
	5,966,592

	 	STRUCTURE AND METHOD FOR MAKING A

COMPLIANT LEAD FOR A MICROELECTRONIC

DEVICE
	 	11/21/2015
	 
	 	 	 	 
	5,977,618

	 	SEMICONDUCTOR CONNECTION

COMPONENTS AND METHODS WITH RELEASABLE

LEAD SUPPORT
	 	7/24/2012
	 
	 	 	 	 
	5,989,939

	 	PROCESS OF MANUFACTURING

COMPLIANT WIRE BOND PACKAGE
	 	12/12/2017
	 
	 	 	 	 
	5,994,222

	 	METHOD OF MAKING CHIP MOUNTINGS

AND ASSEMBLIES
	 	4/25/2017
	 
	 	 	 	 
	5,994,781

	 	SEMICONDUCTOR CHIP PACKAGE WITH

DUAL LAYER TERMINAL AND LEAD STRUCTURE
	 	5/29/2018
	 
	 	 	 	 
	6,002,168

	 	MICROELECTRONIC COMPONENT WITH

RIGID INTERPOSER
	 	11/25/2017
	 
	 	 	 	 
	6,012,224

	 	METHOD OF FORMING COMPLIANT

MICROELECTRONIC MOUNTING DEVICE
	 	7/7/2014
	 
	 	 	 	 
	6,030,856

	 	BONDABLE COMPLIANT PADS FOR

PACKAGING OF A SEMICONDUCTOR CHIP AND

METHOD THEREFOR
	 	6/10/2017
	 
	 	 	 	 
	6,045,655

	 	METHOD OF MOUNTING A CONNECTION

COMPONENT ON A SEMICONDUCTOR CHIP WITH

ADHESIVE
	 	10/26/2013
	 
	 	 	 	 
	6,046,076

	 	VACUUM DISPENSE METHOD FOR

DISPENSING AN ENCAPSULANT AND MACHINE

THEREFOR
	 	12/29/2014
	 
	 	 	 	 
	6,049,972

	 	UNIVERSAL STRIP/CARRIER FRAME

ASSEMBLY AND METHODS
	 	1/23/2018
	 
	 	 	 	 
	6,054,337

	 	METHODS OF MAKING A COMPLIANT

MULTICHIP PACKAGE
	 	12/12/2017
	 
	 	 	 	 
	6,054,756

	 	CONNECTION COMPONENTS WITH

FRANGIBLE LEADS AND BUS
	 	7/24/2012






16









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	6,080,605

	 	METHOD OF ENCAPSULATING A

SEMICONDUCTOR CHIP USING A SETTABLE

ENCAPSULANT
	 	10/6/2018
	 
	 	 	 	 
	6,080,932

	 	SEMICONDUCTOR PACKAGE ASSEMBLIES

WITH MOISTURE VENTS
	 	4/14/2018
	 
	 	 	 	 
	6,081,035

	 	MICROELECTRONIC BOND RIBBON DESIGN
	 	10/24/2016
	 
	 	 	 	 
	6,083,837

	 	FABRICATION OF COMPONENTS BY

COINING
	 	12/12/2017
	 
	 	 	 	 
	6,107,123

	 	METHODS FOR PROVIDING VOID-FREE

LAYERS FOR SEMICONDUCTOR ASSEMBLIES
	 	3/7/2016
	 
	 	 	 	 
	6,107,682

	 	COMPLIANT WIRE BOND PACKAGES

HAVING WIRE LOOP
	 	12/12/2017
	 
	 	 	 	 
	6,121,676

	 	STACKED MICROELECTRONIC ASSEMBLY

AND METHOD THEREFOR
	 	12/11/2017
	 
	 	 	 	 
	6,126,428

	 	VACUUM DISPENSE APPARATUS FOR

DISPENSING AN ENCAPSULANT
	 	12/29/2014
	 
	 	 	 	 
	6,127,724

	 	PACKAGED MICROELECTRONIC ELEMENTS

WITH ENHANCED THERMAL CONDUCTION
	 	10/31/2017
	 
	 	 	 	 
	6,130,116

	 	METHOD OF ENCAPSULATING A

MICROELECTRONIC ASSEMBLY UTILIZING A

BARRIER
	 	12/4/2017
	 
	 	 	 	 
	6,133,627

	 	SEMICONDUCTOR CHIP PACKAGE WITH

CENTER CONTACTS
	 	9/24/2010
	 
	 	 	 	 
	6,133,639

	 	COMPLIANT INTERFACE FOR A

SEMICONDUCTOR CHIP AND METHOD THEREFOR
	 	9/20/2014
	 
	 	 	 	 
	6,147,401

	 	COMPLIANT MULTICHIP PACKAGE
	 	12/12/2017
	 
	 	 	 	 
	6,157,075

	 	SEMICONDUCTOR ASSEMBLIES WITH

REINFORCED PERIPHERAL REGIONS
	 	8/18/2015
	 
	 	 	 	 
	6,162,661

	 	SPACER PLATE SOLDER BALL

PLACEMENT FIXTURE AND METHODS THEREFOR
	 	5/29/2018
	 
	 	 	 	 
	6,169,328

	 	SEMICONDUCTOR CHIP ASSEMBLY
	 	9/20/2014
	 
	 	 	 	 
	6,170,151

	 	UNIVERSAL UNIT STRIP/CARRIER

FRAME ASSEMBLY AND METHODS
	 	1/23/2018






17









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	6,182,546

	 	APPARATUS AND METHODS FOR

SEPARATING MICROELECTRONIC PACKAGES

FROM A COMMON SUBSTRATE
	 	3/4/2018
	 
	 	 	 	 
	6,184,140

	 	METHODS OF MAKING MICROELECTRONIC

PACKAGES UTILIZING COINING
	 	12/12/2017
	 
	 	 	 	 
	6,191,473

	 	BONDING LEAD STRUCTURE WITH

ENHANCED ENCAPSULATION
	 	10/8/2017
	 
	 	 	 	 
	6,196,042

	 	COINING TOOL AND PROCESS OF

MANUFACTURING SAME FOR MAKING

CONNECTION COMPONENTS
	 	3/31/2019
	 
	 	 	 	 
	6,197,665

	 	LAMINATION MACHINE AND METHOD TO

LAMINATE A COVERLAY TO A

MICROELECTRONIC PACKAGE
	 	4/15/2019
	 
	 	 	 	 
	6,202,299

	 	SEMICONDUCTOR CHIP CONNECTION

COMPONENTS WITH ADHESIVES AND METHOD

OF MAKING SAME
	 	10/26/2013
	 
	 	 	 	 
	6,204,091

	 	METHOD OF ASSEMBLING A

SEMICONDUCTOR CHIP PACKAGE
	 	12/4/2017
	 
	 	 	 	 
	6,208,025

	 	MICROELECTRONIC COMPONENT WITH

RIGID INTERPOSER
	 	11/25/2017
	 
	 	 	 	 
	6,214,640

	 	METHOD OF MANUFACTURING A

PLURALITY OF SEMICONDUCTOR PACKAGES
	 	8/3/2019
	 
	 	 	 	 
	6,215,191

	 	COMPLIANT LEAD STRUCTURES FOR

MICROELECTRONIC DEVICES
	 	11/21/2015
	 
	 	 	 	 
	6,218,213

	 	MICROELECTRONIC COMPONENTS WITH

FRANGIBLE LEAD SECTIONS
	 	6/3/2019
	 
	 	 	 	 
	6,218,215

	 	METHODS OF ENCAPSULATING A

SEMICONDUCTOR CHIP USING A SETTABLE

ENCAPSULANT
	 	10/6/2018
	 
	 	 	 	 
	6,225,688

	 	STACKED MICROELECTRONIC ASSEMBLY

AND METHOD THEREFOR
	 	12/11/2017
	 
	 	 	 	 
	6,232,152

	 	METHOD OF MANUFACTURING A

PLURALITY OF SEMICONDUCTOR PACKAGES

AND THE RESULTING SEMICONDUCTOR

PACKAGE STRUCTURES
	 	5/19/2014






18









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	6,248,656

	 	METAL-JACKETED LEAD MANUFACTURING

PROCESS USING RESIST LAYERS
	 	8/13/2019
	 
	 	 	 	 
	6,253,992

	 	SOLDER BALL PLACEMENT FIXTURES

AND METHODS
	 	3/17/2019
	 
	 	 	 	 
	6,255,723

	 	LAYERED LEAD STRUCTURES
	 	10/27/2018
	 
	 	 	 	 
	6,255,738

	 	ENCAPSULANT FOR MICROELECTRONIC

DEVICES
	 	9/30/2017
	 
	 	 	 	 
	6,261,863

	 	COMPONENTS WITH RELEASABLE LEADS

AND METHODS OF MAKING RELEASABLE LEADS
	 	10/24/2015
	 
	 	 	 	 
	6,265,759

	 	LATERALLY SITUATED STRESS/STRAIN

RELIEVING LEAD FOR A SEMICONDUCTOR

CHIP PACKAGE
	 	9/6/2016
	 
	 	 	 	 
	6,266,872

	 	METHOD FOR MAKING A CONNECTION

COMPONENT FOR A SEMICONDUCTOR CHIP

PACKAGE
	 	12/9/2017
	 
	 	 	 	 
	6,272,744

	 	SEMICONDUCTOR CONNECTION

COMPONENTS AND METHODS WITH RELEASABLE

LEAD SUPPORT
	 	7/24/2012
	 
	 	 	 	 
	6,274,822

	 	MANUFACTURE OF SEMICONDUCTOR

CONNECTION COMPONENTS WITH FRANGIBLE

LEAD SECTIONS
	 	7/2/2018
	 
	 	 	 	 
	6,294,040

	 	TRANSFERABLE RESILIENT ELEMENT

FOR PACKAGING OF A SEMICONDUCTOR CHIP

AND METHOD THEREFOR
	 	6/20/2017
	 
	 	 	 	 
	6,300,231

	 	METHOD FOR CREATING A DIE SHRINK

INSENSITIVE SEMICONDUCTOR PACKAGE AND

COMPONENT THEREFOR
	 	5/28/2019
	 
	 	 	 	 
	6,300,254

	 	METHODS OF MAKING COMPLIANT

INTERFACES AND MICROELECTRONIC

PACKAGES USING SAME
	 	4/16/2019
	 
	 	 	 	 
	6,306,752

	 	CONNECTION COMPONENT AND METHOD

OF MAKING SAME
	 	9/15/2019
	 
	 	 	 	 
	6,309,910

	 	MICROELECTRONIC COMPONENTS WITH

FRANGIBLE LEAD SECTIONS
	 	5/18/2019






19









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	6,309,915

	 	SEMICONDUCTOR CHIP PACKAGE WITH

EXPANDER RING AND METHOD OF MAKING

SAME
	 	2/5/2019
	 
	 	 	 	 
	6,313,528

	 	COMPLIANT MULTICHIP PACKAGE
	 	12/12/2017
	 
	 	 	 	 
	6,324,754

	 	METHOD FOR FABRICATING

MICROELECTRONIC ASSEMBLIES
	 	3/25/2018
	 
	 	 	 	 
	6,329,224

	 	ENCAPSULATION OF MICROELECTRONIC

ASSEMBLIES
	 	4/28/2018
	 
	 	 	 	 
	6,334,942

	 	SELECTIVE REMOVAL OF DIELECTRIC

MATERIALS AND PLATING PROCESS USING

SAME
	 	2/9/2019
	 
	 	 	 	 
	6,358,780

	 	SEMICONDUCTOR PACKAGE ASSEMBLIES

WITH MOISTURE VENTS AND METHODS OF

MAKING SAME
	 	4/14/2018
	 
	 	 	 	 
	6,359,236

	 	MOUNTING COMPONENT WITH LEADS

HAVING POLYMERIC STRIPS
	 	7/24/2012
	 
	 	 	 	 
	6,359,335

	 	METHOD OF MANUFACTURING A

PLURALITY OF SEMICONDUCTOR PACKAGES

AND THE RESULTING SEMICONDUCTOR

PACKAGE STRUCTURES
	 	5/19/2014
	 
	 	 	 	 
	6,370,032

	 	COMPLIANT MICROELECTRONIC

MOUNTING DEVICE
	 	7/7/2014
	 
	 	 	 	 
	6,373,128

	 	SEMICONDUCTOR ASSEMBLIES WITH

REINFORCED PERIPHERAL REGIONS
	 	8/18/2015
	 
	 	 	 	 
	6,373,141

	 	BONDABLE COMPLIANT PADS FOR

PACKAGING OF A SEMICONDUCTOR CHIP AND

METHOD THEREFOR
	 	6/10/2017
	 
	 	 	 	 
	6,380,060

	 	OFF-CENTER SOLDER BALL ATTACH AND

METHODS THEREFOR
	 	8/31/2020
	 
	 	 	 	 
	6,388,340

	 	COMPLIANT SEMICONDUCTOR CHIP

PACKAGE WITH FAN-OUT LEADS AND METHOD

OF MAKING SAME
	 	2/5/2019
	 
	 	 	 	 
	6,423,907

	 	COMPONENTS WITH RELEASABLE LEADS
	 	2/9/2018
	 
	 	 	 	 
	6,433,419

	 	FACE-UP SEMICONDUCTOR CHIP

ASSEMBLIES
	 	9/24/2010






20









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	6,458,628

	 	METHODS OF ENCAPSULATING A

SEMICONDUCTOR CHIP USING A SETTABLE

ENCAPSULANT
	 	10/6/2018
	 
	 	 	 	 
	6,458,681

	 	METHODS FOR PROVIDING VOID-FREE

LAYERS FOR SEMICONDUCTOR ASSEMBLIES
	 	3/7/2016
	 
	 	 	 	 
	6,460,245

	 	METHOD OF FABRICATING

SEMICONDUCTOR CHIP ASSEMBLIES
	 	10/26/2013
	 
	 	 	 	 
	6,465,744

	 	GRADED METALLIC LEADS CONNECTION

TO MICROELECTRONIC ELEMENTS
	 	3/26/2019
	 
	 	 	 	 
	6,465,747

	 	MICROELECTRONIC ASSEMBLIES HAVING

SOLDER-WETTABLE PADS AND CONDUCTIVE

ELEMENTS
	 	3/25/2018
	 
	 	 	 	 
	6,465,893

	 	STACKED CHIP ASSEMBLY
	 	9/24/2010
	 
	 	 	 	 
	6,468,830

	 	COMPLIANT SEMICONDUCTOR PACKAGE

WITH ANISOTROPIC CONDUCTIVE MATERIAL

INTERCONNECTS AND METHODS
	 	1/25/2019
	 
	 	 	 	 
	6,468,836

	 	LATERALLY SITUATED STRESS/STRAIN

RELIEVING LEAD FOR A SEMICONDUCTOR

CHIP PACKAGE
	 	9/6/2016
	 
	 	 	 	 
	6,486,003

	 	EXPANDABLE INTERPOSER FOR A

MICROELECTRONIC PACKAGE AND METHOD

THEREFOR
	 	12/10/2017
	 
	 	 	 	 
	6,489,674

	 	METHOD FOR CREATING A DIE SHRINK

INSENSITIVE SEMICONDUCTOR PACKAGE AND

COMPONENT THEREFOR
	 	5/28/2019
	 
	 	 	 	 
	6,492,201

	 	FORMING MICROELECTRONIC

COMPONENTS BY ELECTROPHORETIC

DEPOSITION
	 	7/10/2018
	 
	 	 	 	 
	6,518,662

	 	METHOD OF ASSEMBLING A

SEMICONDUCTOR CHIP PACKAGE
	 	8/13/2018
	 
	 	 	 	 
	6,521,480

	 	A METHOD FOR MAKING A

SEMICONDUCTOR CHIP PACKAGE
	 	7/25/2015
	 
	 	 	 	 
	6,525,429

	 	METHODS OF MAKING MICROELECTRONIC

ASSEMBLIES INCLUDING COMPLIANT

INTERFACES
	 	9/20/2014
	 
	 	 	 	 
	6,527,163

	 	METHODS OF MAKING BONDABLE

CONTACTS AND A TOOL FOR MAKING SUCH

CONTACTS
	 	11/21/2020






21









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	6,534,392

	 	METHODS OF MAKING MICROELECTRONIC

ASSEMBLIES USING BONDING STAGE AND

BONDING STAGE THEREFOR
	 	9/14/2021
	 
	 	 	 	 
	6,541,845

	 	COMPONENTS WITH RELEASABLE LEADS

AND METHODS OF MAKING RELEASABLE LEADS
	 	10/24/2015
	 
	 	 	 	 
	6,541,874

	 	ENCAPSULATION OF MICROELECTRONIC

ASSEMBLIES
	 	4/28/2018
	 
	 	 	 	 
	6,572,781

	 	MICROELECTRONIC PACKAGING METHODS

AND COMPONENTS
	 	5/16/2021
	 
	 	 	 	 
	6,573,459

	 	GRADED METALLIC LEADS FOR

CONNECTION TO MICROELECTRONIC ELEMENTS
	 	3/26/2019
	 
	 	 	 	 
	6,602,740

	 	ENCAPSULATION OF MICROELECTRONIC

ASSEMBLIES
	 	11/22/2020
	 
	 	 	 	 
	6,603,209

	 	COMPLIANT INTEGRATED CIRCUIT

PACKAGE
	 	12/29/2014
	 
	 	 	 	 
	6,653,172

	 	METHODS FOR PROVIDING VOID-FREE

LAYERS FOR SEMICONDUCTOR ASSEMBLIES
	 	3/7/2016
	 
	 	 	 	 
	6,664,484

	 	COMPONENTS WITH RELEASABLE LEADS
	 	5/1/2018
	 
	 	 	 	 
	6,686,015

	 	TRANSFERABLE RESILIENT ELEMENT

FOR PACKAGING OF A SEMICONDUCTOR CHIP

AND METHODTHEREFOR
	 	6/30/2017
	 
	 	 	 	 
	6,687,980

	 	APPARATUS FOR PROCESSING FLEXIBLE

TAPE FOR MICROELECTRONIC ASSEMBLIES
	 	12/14/2018
	 
	 	 	 	 
	6,699,730

	 	STACKED MICROELECTRONIC ASSEMBLY

AND METHOD THEREFOR
	 	4/15/2018
	 
	 	 	 	 
	6,707,149

	 	LOW COST AND COMPLIANT

MICROELECTRONIC PACKAGES FOR HIGH I/O

AND FINE PITCH
	 	10/11/2021
	 
	 	 	 	 
	6,709,469

	 	SPACER PLATE SOLDER BALL

REPLACEMENT FIXTURE AND METHODS

THEREFOR
	 	5/29/2018
	 
	 	 	 	 
	6,709,895

	 	PACKAGED MICROELECTRONIC ELEMENTS

WITH ENHANCED THERMAL CONDUCTION
	 	10/31/2017
	 
	 	 	 	 
	6,716,671

	 	METHODS OF MAMING MICROELECTRONIC

ASSEMBLIES USING COMPRESSED RESILIENT

LAYER
	 	3/19/2021






22









 






	 	 	 	 	 
	US PATENT NO.	 	TITLE	 	EXPIRATION
	 
	6,723,584

	 	METHODS OF MAKING MICROELECTRONIC

ASSEMBLIES INCLUDING COMPLIANT

INTERFACES
	 	9/20/2014
	 
	 	 	 	 
	6,763,579

	 	METHODS OF MAKING COMPONENTS WITH

RELEASABLE LEADS
	 	2/9/2018
	 
	 	 	 	 
	6,765,288

	 	MICROELECTRONIC ADAPTORS,

ASSEMBLIES AND METHODS
	 	9/6/2022
	 
	 	 	 	 
	6,774,317

	 	CONNECTION COMPONENTS WITH POSTS
	 	12/29/2014
	 
	 	 	 	 
	6,780,747

	 	METHODS FOR PROVIDING VOID-FREE

LAYERS FOR SEMICONDUCTOR ASSEMBLIES
	 	3/7/2016
	 
	 	 	 	 
	6,791,169

	 	COMPLIANT SEMICONDUCTOR PACKAGE

WITH ANISOTROPIC CONDUCTIVE MATERIAL

INTERCONNECTS AND METHODS THEREFOR
	 	1/25/2018
	 
	 	 	 	 
	6,821,815

	 	METHODS OF ASSEMBLING A

SEMICONDUCTOR CHIP PACKAGE
	 	12/4/2017
	 
	 	 	 	 
	6,822,320

	 	MICROELECTRONIC CONNECTION

COMPONENTS UTILIZING CONDUCTIVE CORES

AND POLYMERIC COATINGS
	 	7/10/2018
	 
	 	 	 	 
	6,828,668

	 	FLEXIBLE LEAD STRUCTURES AND

METHODS OF MAKING SAME
	 	7/7/2014






23









 





	 	 	 	 	 
	US APPLICATION	 	 	 	ESTIMATED
	SERIAL NO.	 	TITLE	 	EXPIRATION DATE
	 
	09/534,939

	 	CONNECTION COMPONENTS WITH

FRANGIBLE LEADS AND BUS
	 	7/24/2012
	 
	 	 	 	 
	09/656,690

	 	FACE-UP SEMICONDUCTOR CHIP

ASSEMBLIES
	 	9/24/2010
	 
	 	 	 	 
	09/766,814

	 	MICROELECTRONIC PACKAGES

HAVING DEFORMED BONDED AND

METHODS THEREFOR
	 	7/7/2014
	 
	 	 	 	 
	09/827,840

	 	MICROELECTRONIC ASSEMBLY

HAVING ENCAPSULATED WIRE BONDING

LEADS
	 	9/24/2010
	 
	 	 	 	 
	09/942,386

	 	COMPONENTS WITH CONDUCTIVE

SOLDER MASK LAYERS
	 	3/26/2019
	 
	 	 	 	 
	10/044,121

	 	STACKED MICROELECTRONIC

ASSEMBLIES AND METHODS OF MAKING

SAME
	 	1/11/2022
	 
	 	 	 	 
	10/077,145

	 	OFF-CENTER SOLDER BALL

ATTACH ASSEMBLY
	 	8/31/2020
	 
	 	 	 	 
	10/077,388

	 	ASSEMBLIES HAVING STACKED

SEMICONDUCTOR CHIPS AND METHODS

OF MAKING SAME
	 	2/15/2022
	 
	 	 	 	 
	10/095,561

	 	METHOD OF MANUFACTURING A

PLURALITY OF SEMICONDUCTOR

PACKAGES AND THE RESULTING

SEMICONDUCTOR PACKAGE
	 	5/19/2014
	 
	 	 	 	 
	10/123,547

	 	METHODS OF MAKING

MICROELECTRONIC ASSEMBLIES

INCLUDING COMPLIANT INTERFACES
	 	9/20/2014
	 
	 	 	 	 
	10/162,957

	 	CONNECTION COMPONENTS WITH

FRANGIBLE LEADS AND BUS
	 	7/24/2012
	 
	 	 	 	 
	10/164,116

	 	SEMICONDUCTOR CHIP

ASSEMBLIES, METHODS OF MAKING

SAME AND COMPONENTS FOR SAME
	 	9/24/2010
	 
	 	 	 	 
	10/210,160

	 	HIGH-FREQUENCY CHIP PACKAGES
	 	8/1/2022
	 
	 	 	 	 
	10/210,811

	 	METHOD OF FABRICATING

SEMICONDUCTOR CHIP ASSEMBLIES
	 	3/7/2016
	 
	 	 	 	 
	10/235,102

	 	MICROELECTRONIC ASSEMBLY

FORMATION WITH RELEASABLE LEADS
	 	9/5/2022






24









 






	 	 	 	 	 
	US APPLICATION	 	 	 	ESTIMATED
	SERIAL NO.	 	TITLE	 	EXPIRATION DATE
	 
	10/267,450

	 	STACKED PACKAGES
	 	10/9/2022
	 
	 	 	 	 
	10/281,550

	 	METHODS OF MAKING

MICROELECTRONIC ASSEMBLIES

INCLUDING FOLDED SUBSTRATES
	 	12/11/2017
	 
	 	 	 	 
	10/301,188

	 	MICROELECTRONIC COMPONENT

AND ASSEMBLY HAVING LEADS WITH

OFFSET PORTIONS
	 	9/24/2010
	 
	 	 	 	 
	10/487,482

	 	STACKED CHIP ASSEMBLY WITH

STIFFENING LAYER
	 	12/31/2011
	 
	 	 	 	 
	10/488,210

	 	HIGH-FREQUENCY CHIP PACKAGES
	 	7/31/2022
	 
	 	 	 	 
	10/771,252

	 	METHOD FOR MAKING A

MICROELECTRONIC PACKAGE USING

PRE-PATTERNED, REUSABLE MOLD AND

METHOD FOR MAKING THE MOLD
	 	2/3/2024
	 
	 	 	 	 
	10/783,314

	 	HIGH-FREQUENCY CHIP PACKAGES
	 	8/1/2022
	 
	 	 	 	 
	10/786,819

	 	BALL GRID ARRAY WITH BUMPS
	 	2/25/2024
	 
	 	 	 	 
	10/834,342

	 	STACKED PACKAGES
	 	10/9/2022
	 
	 	 	 	 
	10/858,167

	 	METHOD OF MAKING

COMPONENTS WITH RELEASABLE LEADS

CROSS-REFERENCE TO RELATED

APPLICATIONS
	 	2/9/2018
	 
	 	 	 	 
	10/872,105

	 	CONNECTION COMPONENTS WITH

FRANGIBLE LEADS AND BUS
	 	5/8/2015
	 
	 	 	 	 
	10/959,465

	 	FORMATION OF CIRCUITRY WITH

MODIFICATION OF FEATURE HEIGHT
	 	10/6/2024
	 
	 	 	 	 
	10/969,527

	 	FOLDOVER PACKAGES AND

MANUFACTURING AND TEST METHODS

THEREFOR
	 	10/20/2024
	 
	 	 	 	 
	10/981,067

	 	STACKED PACKAGES AND

SYSTEMS INCORPORATING THE SAME
	 	11/4/2024
	 
	 	 	 	 
	10/985,119

	 	MICRO PIN GRID ARRAY WITH

PIN MOTION ISOLATION
	 	11/10/2024
	 
	 	 	 	 
	10/985,126

	 	MICRO PIN GRID ARRAY WITH

WIPING ACTION
	 	11/10/2024
	 
	 	 	 	 
	10/988,160

	 	STACKED MICROELECTRONIC

ASSEMBLIES WITH CENTRAL CONTACTS
	 	11/12/2024
	 
	 	 	 	 
	10/994,695

	 	CONNECTION COMPONENTS WITH

ANISOTROPIC CONDUCTIVE MATERIAL

INTERCONNECTION
	 	5/9/2021
	 
	 	 	 	 
	11/014,439

	 	MICROELECTRONIC PACKAGES AND

METHODS THEREFOR
	 	12/16/2024






25









 





	 	 	 	 	 
	FOREIGN PATENT NO.	 	TITLE	 	EXPIRATION DATE
	 
	EP0551382 (Euro)

	 	SEMICONDUCTOR CHIP

ASSEMBLIES AND METHODS

OF MAKING SAME AND

COMPONENTS FOR SAME
	 	9/24/2011
	 
	 	 	 	 
	121621

(Korea)

	 	SEMICONDUCTOR CHIP

ASSEMBLIES AND METHODS

OF MAKING SAME AND

COMPONENTS FOR SAME
	 	9/24/2011
	 
	 	 	 	 
	209457

(Korea)

	 	SEMICONDUCTOR

CONNECTION COMPONENTS

AND METHODS WITH

RELEASABLE LEAD SUPPORT
	 	7/23/2013
	 
	 	 	 	 
	0322289

(Korea)

	 	METHOD OF FORMING

INTERFACE BETWEEN DIE

AND CHIP CARRIER
	 	8/5/2014
	 
	 	 	 	 
	0334990

(Korea)

	 	MICROELECTRONIC

BONDING WITH LEAD MOTION
	 	9/19/2015
	 
	 	 	 	 
	2924923

(Japan)

	 	SEMICONDUCTOR CHIP

ASSEMBLIES AND METHODS

OF MAKING SAME AND

COMPONENTS FOR SAME
	 	9/24/2011
	 
	 	 	 	 
	3151219

(Japan)

	 	SEMICONDUCTOR

CONNECTION COMPONENTS

AND METHODS WITH

RELEASABLE LEAD SUPPORT
	 	7/23/2013
	 
	 	 	 	 
	2,091,438 (Canada)

	 	SEMICONDUCTOR CHIP

ASSEMBLIES AND METHODS

OF MAKING SAME AND

COMPONENTS FOR SAME
	 	9/24/2011
	 
	 	 	 	 
	NI-142874 (Taiwan)

	 	ENCAPSULATION OF

MICROELECTRONIC

ASSEMBLIES
	 	4/25/2019
	 
	 	 	 	 
	0384255 (Korea)

	 	COMPLIANT INTERFACE

FOR A SEMICONDUCTOR CHIP
	 	9/20/2015
	 
	 	 	 	 
	800753 (Germany)

	 	MICROELECTRONIC

BONDING WITH LEAD MOTION
	 	9/19/2015
	 
	 	 	 	 
	800753 (FRANCE)

	 	MICROELECTRONIC

BONDING WITH LEAD MOTION
	 	9/19/2015
	 
	 	 	 	 
	800753 (GR.BRIT)

	 	MICROELECTRONIC

BONDING WITH LEAD MOTION
	 	9/19/2015
	 
	 	 	 	 
	EP0800754 (Euro)

	 	COMPLIANT INTERFACE

FOR A SEMICONDUCTOR CHIP
	 	9/20/2015






26









 





	 	 	 	 	 
	FOREIGN	 	 	 	 
	APPLICATION	 	 	 	ESTIMATED
	SERIAL NO.	 	TITLE	 	EXPIRATION DATE
	 
	94924580.7 (Euro)

	 	METHOD OF FORMING INTERFACE

BETWEEN DIE AND CHIP CARRIER
	 	8/5/2014*
	 
	 	 	 	 
	1200301.8
(Euro)

	 	SEMICONDUCTOR CHIP ASSEMBLIES
	 	9/24/2011
	 
	 	 	 	 
	7-505309

(Japan)

	 	SHAPED LEAD STRUCTURE AND METHOD
	 	7/21/2014
	 
	 	 	 	 
	8-511028
(Japan)

	 	MICROELECTRONIC BONDING WITH

LEAD MOTION
	 	9/19/2015
	 
	 	 	 	 
	8-511045
(Japan)

	 	COMPLIANT INTERFACE FOR A

SEMICONDUCTOR CHIP
	 	9/20/2015
	 
	 	 	 	 
	8-533523

(Japan)

	 	FABRICATION OF LEADS ON

SEMICONDUCTOR CONNECTION COMPONENTS
	 	5/3/2016
	 
	 	 	 	 
	546394/2000
Japan)

	 	ENCAPSULATION OF

MICROELECTRONIC ASSEMBLIES
	 	4/26/2019
	 
	 	 	 	 
	10-2000-7012035

(Korea)

	 	ENCAPSULATION OF

MICROELECTRONIC ASSEMBLIES
	 	4/26/2019






27









 




Attachment B



DRAM Licensed Products. For each DRAM Licensed Product sold by Licensee, Licensee shall pay a
royalty of US$[***] per DRAM Licensed Product.



Non-DRAM Licensed Products. For each Non-DRAM Licensed Product sold by Licensee, Licensee shall
pay a royalty of [***] (US$[***]) per Billable Pin. Notwithstanding the
foregoing, the maximum number of payable Billable Pins per Non-DRAM Licensed Product for any
royalties due hereunder shall be capped at [***].




28









 





Attachment C




Reporting Period: From                                          through                       
                 




ROYALTY REPORT UNDER TESSERA TCC LICENSE AGREEMENT




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	PARTY	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	ASSEMBLING	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	LICENSED	 	 	 	 	 	 	 	 	 	NUMBER	 	 	 	 	 	 	 	 	 	 
	PRODUCT	 	 	 	 	 	 	 	 	 	OF	 	 	NUMBER OF	 	 	 	 	 	 	 
	(Licensee or	 	PART	 	 	TYPE OF IC	 	 	LICENSED	 	 	BILLABLE	 	 	ROYALTY	 	 	ROYALTY	 
	Subcontractor)	 	NUMBER	 	 	DEVICE	 	 	PRODUCTS	 	 	PINS	 	 	RATE	 	 	(US$)	 
	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 





TOTAL ROYALTY REMITTED:          US$                                        




PURCHASES OF LICENSED PRODUCTS FROM OTHERS




	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	NUMBER OF	 
	SUPPLIER OF	 	TYPE OF	 	 	 	 	 	 	NUMBER OF	 	 	BILLABLE PINS	 
	LICENSED	 	LICENSED	 	 	TYPE OF IC	 	 	LICENSED	 	 	PER LICENSED	 
	PRODUCT	 	PRODUCT	 	 	DEVICE	 	 	PRODUCTS	 	 	PRODUCT	 
	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 
	 
	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 	 





29









 





Attachment D











Name

Title

Subcontracting Company

Address




Dear                ,



Qimonda has entered into a license agreement with Tessera, Inc. (“Tessera”) under certain Tessera
patents (including but not limited to U.S. Patent Nos. 5,679,977; 5,852,326; 6,133,627; 6,433,419
and 6,465,893) to make, use and sell BGA packages. We have determined that certain BGA packages
made by you for Qimonda are covered by our license agreement with Tessera, and Qimonda will pay
royalties for such BGA packages made by you going forward. If you have a license with Tessera to
make such BGA packages, you do not have to pay a royalty to Tessera in addition to what Qimonda
pays. However, you should understand that our payment of royalties for such BGA packages does not,
in any way, affect your obligations to pay royalties to Tessera for similar BGA packages made for
other customers.



A list of the packages made by you for which Qimonda is paying royalties under its license with
Tessera is attached hereto. We will update the attached list from time-to-time.



If you have any questions regarding the subject matter of this letter, please feel free to contact
me directly.




Sincerely,




	 	 	 
	 
	 	 
	 
	 	 
	 
 


	 	 
	Appropriate Qimonda signature





Copy sent to: Christopher Pickett, Executive Vice President, Licensing Business, Tessera, Inc.
3099 Orchard Drive, San Jose, CA 95134 USA; FAX +1-408-894-0190




















30