EXHIBIT 4.2
 
 Supplementary Agreement
  
 
  1.
    
    Party A confirms to continue to purchase silicon wafers from
Party B in the quantity of [****]*MW
for 2009 as set forth under the above contract. Party B agrees to supply goods to Party A in
the abovementioned quantity. Specific monthly supply plan is to be agreed by Party A and Party
B depending on their realities and annexed to this Agreement.2.
    
    According to the current situation of solar market, both parties agree that the prices of the
silicon wafers of various specifications supplied by Party B to Party A in the first half of
2009 are temporarily as below:
 125*125 monocrystalline wafer
    
    RMB[****]*/pc (tax inclusive),agreed calculated power, 2.35W/pc156*156 multicrystalline wafer
    
    RMB [****]*/pc (tax inclusive), or
USD [****]*/pc,agreed calculation power, 3.75W/pc
 3.
    
    Party A and Party B agree that the unperformed portion of the LDK08335 Contract between both
parties will not be performed again and in principle, the remaining portion of the payment for
goods already made by Party A to Party B (USD [****]*) is used as the down payment for the
purchase by Party A of not less than [****]*MW silicon wafers in the first half of 2009. Party B
agrees to, in principle, deduct USD 1 per piece from payment for goods payable by Party A when
Party A purchases silicon wafers from Party B in the first half of 2009 until the above down
payment is deducted up. For RMB contract, if Party A has made full payment, Party B shall
refund corresponding USD amount; for USD contract, direct deduction shall be made. Specific
deduction method is to be agreed according to the type of goods delivered and delivery plan
between both parties.
     *
    
    This portion of the Supplementary Agreement
To CSI-LDK071012 Contract has been omitted and filed separately with
the Securities and Exchange Commission, pursuant to Rule 24b-2. 1




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4.
    
    Party A and Party B agree that the RMB [****]* down payment already made by Party A
under the CSI-LDK071012 Contract in 2008 will be converted into Party As down payment for
2009. Party B will deduct it from the payment for goods payable by Party A in the last month
of the second half of 2009. Specific purchase price will be determined by both parties before
the end of June 2009.5.
    
    Party A and Party B agree that the supply for 2010 under the CSI-LDK071012 Contract will be
merged with the CSIS-LDK2008-6-3 Contract between both parties. Both parties will further
negotiate about supply price and other contract amendments based on the market conditions and
endeavor to ensure that they are determined in 2009.6.
    
    Upon signing of this Agreement, in case of any discrepancy between this Agreement and other
prior supplementary agreements to CSI-LDK071012 Contract, this Agreement shall prevail. After
the signing of this Agreement, Party A will pay the RMB amount for goods previously owed to
Party B and the amount of silicon materials already paid, in a total of RMB
[****]*, before the end
of February 2009.
 Party A: CSI Cells Co., Ltd.
    
    Party B: Jiangxi LDK Solar Hi-Tech Co., Ltd.Signature: /s/
    
    Signature: /s/(with common seal of CSI Cells Co., Ltd)
    
    (with common seal of Jiangxi LDK
Solar Hi-Tech Co., Ltd.)February 14, 2009
    
    February 14, 2009
     *
    
    This portion of the Supplementary Agreement
To CSI-LDK071012 Contract has been omitted and filed separately with
the Securities and Exchange Commission, pursuant to Rule 24b-2. 2




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Wafer Supply Agreement
  No.199 Lushan Road, Suzhou New District, Jiangsu Province
 Xinyu High-tech Development Zone, Jiangxi Province
   m m
  W W 3 m
  £ -18 3 £ -18 3
 m £ m
 £ m £ m
 £ £
  Wafer Supply
Agreement CSI-LDK071012
    
    Page 1 of 5




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Time/unit price
    
    Quantity (Million pieces\MW)1
    
    
    2008
    
    
    Q1
    
    Q2
    
    Q3
    
    Q43.38Mpcs\12.5MW
    
    3.38Mpcs\12.5MW
    
    3.38Mpcs\12.5MW
    
    3.38Mpcs\12.5MWPrice (RMB¥/pc)
    
    [****]*
    
    [****]*
    
    [****]*
    
    [****]*2
    
    
    2009
    
    
    [****]*
    
    [****]*
    
    [****]*
    
    [****]*Price (RMB¥/pc)
    
    [****]*
    
    [****]*
    
    [****]*
    
    [****]*2010
    
    
    [****]*
    
    [****]*
    
    [****]*
    
    [****]*3
    
    Price (RMB¥/pc)
    
    [****]*
    
    [****]*
    
    [****]*
    
    [****]*
  1.
    
    Party A shall make an annual down payment to Party B at 5% of the total contract amount of
next year. Party B agrees that for Party As down payment for 2008, 50% is to be paid before
December 31, 2007 and 50% is to be paid before the end of March 2008. Later on, down payment
shall be fully paid before the end of December of each year. The down payments for three years
are: 2008: RMB [****]*; 2009: RMB [****]*; 2010: RMB [****]*.
 2.
    
    Within the term of this Agreement, annual down payment is automatically transferred to next
year per annum. Party A shall make up the deficit in the payable year. Annual down payment
will offset the payment for goods in the last delivery month prior to the expiry of this
Agreement. Within the term of this Agreement, if Party A breaches this Agreement by means of
stopping to demand the goods, down payment will not be refunded; if Party B breaches this
Agreement by means of stopping to supply the goods, Party B shall compensate Party A in a
amount twice the down payment.
 3.
    
    Within the term of this Agreement, the pricing for the above respective years is based on the
USD/RMB exchange rate of not lower than 6.89. If the USD/RMB exchange
rate is lower than 6.89 and the
duration continues for more than one month, Party A and Party B shall re-negotiate about
product price and reference exchange rate.
     *
    
    This portion of the Wafer Supply Agreement
has been omitted and filed separately with the Securities and
Exchange Commission, pursuant to Rule 24b-2.  Wafer Supply
Agreement CSI-LDK071012
    
    Page 2 of 5




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4.
    
    Party B may provide the silicon wafers in a thickness of less
than 220μm. If Party A accepts
the change of ordering specification, Party B agrees to grant an appropriate downward
adjustment on the basis of the price specified herein.
  1.
    
    Party B shall deliver the supply list for next month to Party A between the 15th
day and the 20th day of each month, indicating quantity of delivery, quality,
specifications and delivery period. Within one week after receiving Party Bs notice, Party A
shall prepay to Party B the full amount of goods to be supplied next month.
 2.
    
    Within 3 working days after receiving the supply list from Party B, Party A shall give a
written confirmation. The order finally determined by both parties in writing shall serve as
the final basis for product supply of the current period. Upon confirmation, neither party may
change it. Otherwise, the party who makes the changes shall bear the corresponding defaulting
liability.
 3.
    
    If Party B delivers goods across quarters, Party A shall, in addition to the right to make
settlement at the price of the quarter of actual delivery, be entitled to impose a fine on
Party B at 1% of the amount of delayed goods. If Party A fails to demand goods on time, Party
B shall, in addition to the right to collect payment at the original price, be entitled to
impose a fine on Party A at 1% of the amount of delayed goods.
 4.
    
    Method of supply: goods are delivered to the place designated by Party A (limited to: Suzhou,
Changshu, Shanghai, Xinyu).
    Wafer Supply
Agreement CSI-LDK071012
    
    Page 3 of 5




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1)
    
    Party B fails to supply goods complying with quality requirements on time;
 2)
    
    Party B suspends production for a long period of time (more than 3 months), becomes bankrupt
or has any of other material incidents;
 3)
    
    there are material changes to Party Bs equity structure or the equity structure of Party Bs
principal shareholder, causing this Agreement unable to be performed (note: Party B bears the
obligation to serve notices);
 4)
    
    Party B fails to perform its obligations pursuant to the provisions of this Agreement.
   1.
    
    The formation, validity, interpretation and performance of this Agreement and dispute
resolution shall be governed by the laws of the mainland of the Peoples Republic of China
(note: mainland excludes Hong Kong, Macao and Taiwan).
 2.
    
    Any dispute arising out of or from the performance of or in connection with this Agreement
shall be resolved by both parties by amicable consultation. In the event that no resolution
can be reached by consultation, either party may refer such dispute to the China International
Economic and Trade Arbitration Commission Shanghai Sub-commission (CIETAC) for arbitration
in accordance with the CIETACs arbitration rules and the arbitration rules at the time of
applying for arbitration. The arbitral award shall be final and binding upon both parties.
     *
    
    This portion of the Wafer Supply Agreement has been omitted and
filed separately with the Securities and Exchange Commission,
pursuant to Rule 24b-2.  Wafer Supply
Agreement CSI-LDK071012
    
    Page 4 of 5




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Party A: CSI Cells Co., Ltd.
Legal representative or authorized representative:
  Party
B: Jiangxi LDK Solar Hi-Tech Co., Ltd.
Legal representative or authorized representative:
   Wafer Supply
Agreement CSI-LDK071012
    
    Page 5 of 5