Army Research Laboratory 

Aberdeen Proving Ground, MD 21005-5069 

ARL-TR-2321 September 2000 

Interpenetrating Polymer 

Network (IPN) 

Electron Beam 

Adhesives for 

Cure 

James M. Sands, Steven H. M&night, 

and Bruce K. Fink 

Weapons and Materials Research Directorate, ARL 

Approved for public release, distribution is unlimited 
Abstract 

Electron beam (e&@-processed polymer adhesives have historically performed poorly 

compared to traditional adhesive technologies due to a lack of toughness engineered into these 

new types of adhesive materials. Consequently, sequential- and simultaneous-interpenetrating 

polymer networks (seq-IPN and SIN) were developed and characterized. Seq-IPN adhesive 

pastes demonstrated exceptional lap-shear strengths (approaching 41 MPa) with glass transition 

temperatures (T,) of 100-120” C. The sequential polymerization proceeds by first thermally 

curing the adhesive to the green-strength. The cure kinetics for the C-staged seq-IPNs have been 

investigated as a function of temperature and cure acceleration. SIN materials are being 

investigated to develop durable e-beam-curable film adhesives. The primary advantage of SIN 

Kim adhesives, compared to cationic e-beam systems, is insensitivity to surface contaminants 

(e.g., amine and water), which are lmown to hinder cure in cationic e-beam polymerization. 

Preliminary results have shown that the SIN e-beam adhesives have excellent properties. 

Lap-shear strengths exceeding 27.5 MPa with adhesive T, approaching 150” C have been 

demonstrated on primed aluminum substrates. Structural, kinetic, and adhesive performance data 

for both seq-IPN and SIN structural adhesives cured by e-beam irradiation are presented. 

. 

ii 
We gratefully acknowledge 

Acknowledgments 

the Shell Chemical Company and Air Products for providing 

material samples during the testing and formulation phase of this project. This work was 

supported in part by the Strategic Environmental Research and Development Program (SERDP) 

under projects for Pollution Prevention (PPllO9). 

. . . 

ill 
hTENTIONALLY LEFl-BLANK. 

iv 
Table of Contents 

1. Introduction . *. . . . .*. . . . . . . . . . ~~.~.*,.....*......*.,.....**..~...*.~.........*....~*.*......~.~~.~~~..**...~.* . . ...*.*..* 1 

2. Experimental . . ..*.~~.~~‘..~.~...*~~...~...~~..~........ . ..*........*.....,.~.*.......,,~...*....~*..............~.~.-... 3 

2.1 Synthesis of Seq-IPN and Toughened Seq-IPN Materials .................................. 3 

2.2 Kinetics of Cure for Seq-IPNs ............................................................................. 4 

2.3 Structure of Seq-IPN and Toughened Seq-IPN Materials ................................... 7 

2.4 Mechanical Performance of IPN-Based E-Beam Adhesives .............................. 9 

3. 

4. 

Acknowledgments,. . . . , _.. .*. ..**..I.*.*.*...................*.. . . . . ..~~.........*.........~............**..~..*.~ 111 

List of Figures I**.,..........‘,.,........*~.......f......~. ..~.,.~...*,*....,.*~.,.,...,,,....*......~~..*..~~.**.~... Vii 

List of Tables . ..~*.........~.~..*.*~..~~*,...~... . . . . ..I..................... . . . . . ..*.*.....~*..........~..*...*........ ix 

Conclusions . . ..*..~...**..~...**~.~.~.*......*..~...*.....~.*....~......~... . ..**.....r*.*...*~......*....*..~...~..~~..* 11 

References 13 , . . . . . . . . . *. . . . . ..**.........*...***...*...~.*...*. .~.......~.......~....~...~...~..*.~.~...~~.... . ...**.....*.. 

Distribution List ................................... ................................................................... 15 

Report Documentation Page . . . . ..*~.....**......*~.*.....*. . ..~*.~~.*.....~~........~.~.~........~..~.*....... 35 

V 
. 
List of Figures 

Figure pane 

1. 

2. 

3. 

4. 

5. 

6. 

7. 

Generic Product Formation in IPN Chemistry . . .._.............. *. *........~~...............*.....**. 4 

Phase Diagram for IPN Blends Cured to C-Stage at 50’ C for 24 hr . . . . . . . . . . . . . . . . *.* . . . . 5 

Reaction Progression as a Function of Cure Temperature for C-Stage Formation 

in IPN Monitored by FTIR . ..*.......*....~..f*....**.* . . . . ..**.........~...........*......*..**.............*~ 6 

Cure Profile Coruparison for IPN With Catalyst to 50” C and 80’ C Uncatalyzed 

Reaction .*,....*......*****.........***....*..~......**.....~...~.*.....~...*.**.. . . . . ..***..*.f........................ 6 

Microphase Structure in Unmodified Epoxy-Methacrylate IPN Materials as 

Revealed by AFM . . . . . . ..~....~~.....*....~..~~....f*.*. . . . . . . . . . . ..~~......*..........*......~..*.*....*......***. 8 

AFM Image Showing the Two-Phase Microstructure in CTBN-Modified 

Epoxy-Methacrylate IPNs . . . . . . . . . . . . . . . ..*...~*......*....*~....****...f ~.f...**...f.....*.**................~ 8 

SEM Image That Shows the Two-Phase Microstructure in CTBN-Modified 

IPNs *..**.....**.....*.......*....*.. . . ..**....*~......*.**...........*....*.......*...*......*..........**...~.........* 9 

Vii 
hTBNTIONALLY LJ3TBJANK. 

..* 

Vlll 
List of Tables 

Table 

1. Monomer Structures and Chemical Backbone of IF’N Formulations *...* .._..... . . . . .._.. 

2. LSS and T, Comparisons for Seq-IPN and Commercial Adhesives ..** .. . . . . . . . . , . ..-... 

@ 

3 

10 

ix 
IN’IENTIONALLYLEFTBLANK. 

X 
1. Introduction 

Electron beam (e-beam) curing of composite materials is a process technology that will 

expand performance potential and manufacturing capability for thermoset polymer composites 

[l] and adhesive bonding, However, the current state-of-the-art (SOA) materials for e-beam 

processing do not achieve certain resin-dominated properties when compared to autoclave-cured 

thermosets (21. A new group of adhesive materials that obtain excellent mechanical performance 

upon e-beam cure has been developed. These e-beam-cured resins are designed as 

interpenetrating polymer networks (IPN) [3 3. IPNs are polymers that are formed from the 

independent polymerization of two or more distinct networks, which results in unique molecular 

and physical microstructures [4]. The final properties of an IPN are very dependent on the 

composition of the two networks, as well as the polymerization mechanisms and kinetics of each 

network. Two routes to produce radiation-curable IPN materials are presented in this work. The 

sequentially cured interpenetrating networks (seq-IIW) presented here are fmt thermally 

processed to polymerize one of the networks and form a template matrix for the subsequent 

e-beam polymerization of the second network. The monomers for the e-beam cure are 

unaffected by thermal curing and result in a monomer swollen template. Simultaneous 

interpenetrating networks (SIN) are also studied in this work. The SINS are cured 

simultaneously during e-beam dose and do not undergo a thermal-staging operations. The 

monomers for the two networks react independently through noncompeting mechanisms, and the 

kinetics of each reaction determine the ultimate structure and properties of the fmal IPN 

adhesive. 

Cationic homopolymerized epoxy-thermosets have been studied as potential e-beam-curable 

adhesives and composite matrix materials [5]. These systems are brittle [3] and have not 

produced adhesives that can approach the properties of thermally cured epoxy films or pastes. 

Various approaches have been evaluated for toughening the cationic systems with moderate 

success. Yet, adhesive properties are lacking. One issue that has not been thoroughly addressed 

is the toughening mechanisms for these systems. Traditional epoxy systems can be toughened 

by inclusion of secondary phase materials (rubbers, thermoplastics). These approaches are 

1 
limited in cationic systems due to the different cure mechanisms that limit phase separation and 

the inability to use nitrogen-containing modifiers. For example, the traditional use of 

carboxy-terminated-butadiene-nitrile (CTBN) rubbers in toughened epoxy formulations is not 

possible in cationic systems since the radical cation formed during e-beam processing is 

poisoned by the presence of lone-pair electrons [6]. 

An alternative method of introducing toughness into the e-beam resins includes creating an 

IPN [7]. Toughness can be improved by appropriate selection of network compositions and 

polymerization conditions. E-beam-curable seq-PN structures have been evaluated by 

Goodman [7]. These systems arc comprised of a thermally curable system (epoxy, urethane, 

etc.) that is polymerized in the presence of free-radical monomers/oligomers. After thermally 

staging the system, the free-radical species are cross-linked using e-beam irradiation. The 

epoxy-methacrylate seq-IPN materials have resulted in improved resin properties, including 

toughness; however, they still do meet adhesive performance requirements. 

In this work, these scq-IPNs are modified using CTBN and other elastomer modifiers, as well 

as chahr extenders, to increase the toughness of the materials, with the goal of obtaining useful 

adhesives for assembly and repair applications. Specifically, the synthesis and properties of 

elastomer-modified seq-IPN networks ti described for simple epoxy-amine (EA) and 

free-radical methacrylate (FRM) chemistries are described. The development of network 

structure during epoxy conversion is followed by Fourier-transform infrared spectroscopy 

(FTIR) for cure temperatures ranging from room temperature to 80” C. The structure of the 

seq-IPN and the elastomer-modified seq-IPN are examined using atomic force microscopy 

(AFMJ and scanning electron microscopy (SEMj. Toughened IPN materials are then formulated 

as two-part paste adhesives, and the performance of these adhesives is quantified for a number of 

adherends. Additionally, preliminary data on the performance of simultaneous IPN film 

adhesives cured by e-beam irradiation is reported. 

2 
2. Experimental 

2.1 Synthesis of Seq-IPN and Toughened Seq-IPN Materials. The materials selected for 

the IPNs are DGEBA epoxides and derivatives. The general chemical make-up of the IPNs is 

shown in Table 1. The seq-IPNs are cured in two stages -a thermal or room temperature cure to 

C-stage and an e-beam cur-while the SINS are cured by e-beam dose alone. In seq-IPNs, the 

epoxides are thermally cured with a diamine-curing agent (PACM) to form a template network 

of EA. The e-beam-cured network is composed of DGEBA-type and hydrocarbon 

dimethacrylates. E-beam irradiation induces a free-radical generation in the methacrylates, 

which propagate in the usual radical manner producing the second network (FRM). The cure 

pathways for these networks are unique and result in the formation of homogeneous EA and 

FRM networks. The typical reaction scheme for formation of EA by thermal cure and FRM by 

free radical on e-beam dose to produce seq-IPNs is sketched in Figure 1. 

Table 1. Monomer Structures and Chemical Backbone of IPN Formulations 

EA Network 1 Backbone / Structure 

DGEBA 

ETBN 

HO 

lo-DIAMINE ( H*N ~&~NH, 

3 

HDDMA 

- 
0 PH 

R-&l&H2 + R’NH2 * ) R-CHCHz-NH-R’ PH ; * [R_CHCH2]2N_R, 

R-&H2 

CH3 

CH2 4 

OR ’ ’ 

Figure 1. Generic Product Formation in IPN Chemistry. 

The SIN materials are composed of roughly equivalent monomers, with the exception of the 

CTBN. The catalyst for e-beam-induced epoxide curing is the diaryliodonium 

hexaflouroantimonate @PI-l) monomer. 

A bifunctional coupling additive was synthesized in house to promote bonding of the two 

independent networks of both types of IPN. The coupling monomer (B-DGEBA) was 

synthesized by partial methacrylation of diepoxide using methacrylic acid and a catalyst [8]. The 

degree of coupling between homopolymer networks in the IPNs can be controlled by varying the 

concentration of the bifunctional monomer in the blend. 

Turbidity measurements were used to construct a phase diagram for the elastomer-modified 

seq-IPN materials. For maximum toughness and minimum impact on modulus and Tg of the 

network, two-phase materials are desired [9]. Figure 2 shows the epoxy, methacrylate, and 

elastomer ternary-phase diagram and indicates a window in which phase separation occurs. 

Adhesive formulations were derived from those compositions that provided phase separation of 

the rubber domains. The phase separation of the elastomer is further discussed in a later section. 

2.2 Kinetics of Cure for Seq-IPNs. The cure kinetics for a down-selected seq-IPN system 

and a model system were characterized using FI’IR spectroscopy for real-time cure analysis 

4 
. 

l Phase 

0 Single 

Separated 2pt 

Phase 2pt 

ACRYIATE 

Figure 2. Phase Diagram for IPN Blends Cured to C-Stage at 50” C for 24 hr. 

during the C-stage development. Mixed-monomer IPNs can produce complex chemistries on 

curing. Thus, the cure mechanisms for the seq-IPN adhesive were evaluated using FT’IR to track 

cross reactions as a function of the cure temperature. The resulting conversion vs. time profiles 

for ADEpOl at various cure-temperatures for the C-stage resin is shown in Figure 3. 

In all cases, the conversion to C-stage of the epoxide monomers in the IPN blend is complete 

for all cure temperatures above the vitrification point (T, = 36O C) of the formed C-stage. The 

higher the temperature above the C-stage vitrification, the faster the cure rates. However, 

high-temperature cure can also result in increased occurrence of amine-methacrylate side 

reactions, which can diminish the network performance (thermally and mechanically). In our 

experiments, side reactions were not observed for cure tempeatures below 100” C. 

Consequently, the reaction scheme for seq-IPN formation is simple enough to facilitate the use 

of these materials for composite repair and field tests. 

Additionally, the IPN can be processed rapidly and at low temperatures by the addition of a 

catalyst. Figure 4 shows the impact of catalyst on the cure time for ADEPOl. A few parts per 

hundred of catalyst cm increase adhesive cure at 50” C to rates equivalent to SO” C cure 
0.8 

0.6 

s 

0.4 

0.2 

0 

0 50 100 150 200 250 300 

Time (min) 

Figure 3. Reaction Progression as a Function of Cure Temperature for C-Stage Formation 

in IPN Monitored by FTIR. 

Figure 4. 

1 

0.8 

0.6 

0.4 

0.2 

0 I I 1 , 

0 50 100 150 200 250 300 

Time (min) 

Cure Profile Comparison for IPN With Catalyst to 50’ C and SO0 C Uncatalyzed 

Reaction. 

6 
. 

reactions. The most significant limitation to catalyzed cure is the onset of the vitrification. 

Thus, accelerated cure was not evaluated at room temperature for this material. 

Due to the rapid cure rate of materials under e-beam processing, cure progression of the 

materials during e-beam processing is not monitored. Therefore, only fmal conversions for ebeam materials are presented. The FRM network is unaffected by thermal curing but reacts 

completely on e-beam processing. The extent of conversion of FRh4 during e-beam processing 

is 95% based on calibrated FITS analysis. 

2.3 Structure of Seq-IPN and Toughened Seq-IPN Materials. IPNs are frequently 

observed to phase- or microphase-separate during polymerization, which greatly influences 

material properties. The order of the reactions, their rate, and the miscibility of the two networks 

with one another lead to a number of interesting multiphase morphologies and properties. Upon 

complete reaction of the EA system, the methacrylates are polymerized using e-beam irradiation. 

The materials that were investigated exhibited excellent toughness without substantial 

modification using rubbers or CTBNs. The toughness of the epoxy-methacrylate IPN was nearly 

double the values exhibited for each network by itself [lo]. The increase of toughness can be 

attributed to the microphase morphology that was characterized using AFM. Figure 5 shows an 

AF’M image of the PN microstructure. The small domain size permits significant interactions 

between the two network structures and results in increased toughness with maintained 

thermomechanical properties. The toughness of these IPNs can be further increased by the 

incorporation of the CI’BN elastomers. Improved toughness of the virgin resins by 100% was 

accomplished by the addition of CI’BN toughening additives to the baseline IPN material. The 

phase-separated morphology that accompanies this strategy is shown in the AFM in Figure 6 and 

the SEM in Figure 7. The discontinuous particles are a CTBN-rich phase that has precipitated 

during the thermal cure process. No such phase separation is observed for compositions that 

reside outside the phase envelope shown in Figure 2. A complementary SEM micrograph of a 

toughened PN fracture surface is displayed in Figure 7. This picture reveals cavitation around 

each of the particles, which is consistent with a proposed toughening mechanism for 

elastomer-modified thermosets [ 111. 

7 
Figure 5. Microphase Structure in Unmodified Epoxy-Methacrylate IPN Materials as 

Revealed by AFM. 

Figure 6. AF’M Image Showing the Two-Phase Microstructure 

Epoxy-Methacrylate IPNs. 

in CTBN-Modified 
Figure 7. SEM Image That Shows the Two-Phase Microstructure in CTBN-Modified IPNs. 

2.4 Mechanical Performance of IPN-Based E-Beam Adhesives. The mechanical 

performance of the IPNs, formulated as an adhesive, was determined in initial testing by 

adhesive lap shear strength measurements (ASTM D1002) [ 121. The results from early testing of 

the adhesives in this report are shown in Table 2. 

The LSS results are reported for room-temperature tests on all the materials and from 

elevated temperature analysis for a toughened adhesive paste. The effect of toughening the IPN 

materials using typical epoxy-network toughness schemes is evident by comparison of LSS 

performance between ADEPOO, the untoughened IPN, and ADEPOl. The insertion of rubber 

particles into the matrix by process-induced phase separation of an epoxy-terminated rubber 

(ETBN) results in a two-fold increase in LSS, while thermal performance is equivalent to the 

nonmodified system. One can attribute the improved performance to the invocation of alternate 

energy absorbing modes introduced into the matrix, including shear banding and rubber 

cavitation [ 131. These modes are evident by observing the fracture surface of the adhesive by 

SEM shown in Figure 7. The results in Table 2 also demonstrate that the proper design of 

9 
Table 2. LSS and Tg Comparisons for SeqlIPN and Commercial Adhesives 

Surface Preparation 

977-3 25 NT 33.4 f 5 NT 38.1 f 2 NT 

rg(OC) Dry - 123 121 150 95 65 

Form - Paste Paste Unsupported Film Paste 

Film 

IPN adhesive materials for e-beam cure can result in high-performance adhesive properties. 

Although this study targets moderate thermal performances (T, > 1 loo C) pastes, the LSS of the 

ADEPOl is comparable to commercially available film adhesives such as Cytec’s FM73 on both 

composite and aluminum adherends. Based upon the performance of this model system, the 

ADEPOl paste chemistry was selected for additional testing and adhesive formulation 

modification by Scientific Research Laboratories (SRL) to explore the impact of filler additives 

on the adhesive performance. SRL reported the results of these filler studies [ 141. 

The SIN adhesives have just entered development. Initial formulation of SINS resulted in the 

JCATl adhesive for film applications. Formulation of JCATl includes the DPI-1 cationic 

initiator. Consequently, the JCATl series is subject to typical poisonings associated with 

cationic-cured materials. However, the JCATl bonding performance on BR127 primer, a 

common amine-based primer, was evaluated and achieved surprising results. The final SIN that 

was produced possessed a relatively high Tg material, with respectable room-temperature LSS 

performance. These results are also presented in Table 2. 

10 
Although SIN development is underway, it appears that SIN adhesives can dramatically 

improve the stability of the film adhesives and improve the resistance to catalyst poisoning 

associated with cationic systems presented previously. 

3, Conclusions 

The development of e-beam processible adhesives demands a novel approach to designing 

adhesive materials, including the development of new materials technologies for advanced 

applications. By pursuing e-beam materials developments for ground vehicle applications, the 

strict performance criteria associati with aerospace applications is avoided. The Army has 

demonstrated that e-beam processible adhesives can be developed, which provide excellent L!3S 

performance. These high-performance materials, which 

requirements for composite and adhesive specifications, 

which out-of-autoclave processing technology can proceed. 

will adequately meet many military 

provide a positive framework from 

11 
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12 
2, References 

1. 

2. 

3. 

4. 

5. 

6. 

7. 

8. 

9. 

10. 

11. Kinloch, A. J. “‘Relationships Between the Microstructure and Fracture Behavior of 

Beziers, D., and B. Capdepuy. ‘Electron Beam Curing of Composites.” SAMPE 

Symposium International, vol. 35, p. 438, 1990. 

Lopata, V. J., C. B. Saunders, A. Singh, C. J. Janke, G. E. Wrenn, and S. J. Havens. 

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Seidel, J. R. Radiation Curing of Polymers. D. R. Randell (editor), The Royal Society of 

Chemistry, London 1987. 

Baidak, A. A.,, J. M. Liegeois, and L. H. Sperling. “Simultaneous Interpenetrating Polymer 

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Mate&a, L., P. Chabanne, L. Tighzert, and J. P. Pascault. “Cationic Polymerization of 

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Crivello, J. V., and J. L. Lee. ‘“The Synthesis, Characterization, and Photoinitiated Cationic 

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Goodman, D. L., and G. R. Pahnese. “Method of Making Fiber Reinforced Composites and 

Coatings.” U.S. Patent No. 5,891,292, 1999. 

Doyle, T. E., F. Fekete, P. J. Kennan, and W. J. Plant. “Combination Catalyst-Inhibitor for 

Beta-Hydroxy Carboxyhc Esters.” U.S. Patent No. 3,317,465, 1967. 

Chan, L. C., J. K 

Cure, Transitions, 

C. K. Riew and J. 

1984. 

Gillham, A. J. Kinloch, and S. J. Shaw. “Rubber-Modified Epoxies: 

and Morphology.” Rubber-Modified Thermoset Resins, pp. 235, 

K. Gillham (editors), American Chemical Society, Washington, DC, 

Fink, B. K., S. H. M&night, J. M. Sands, G. R. Palmese, U. Dalal, N. Sisofo, and A. Yen. 

“Nonpolluting Composites Repair and Remanufacturing for Military Applications: 

Formulation of Electron Beam Curable Resins With Enhanced Toughening.” ARL-TR-087, 

in process December 1999. 

Rubber-Toughened Thermo&.ng Polymers.” In Rubber-Toughened 

C. K. Riew (editor), American Chemical Society, Washington, DC, 1989. 

Plastics, p. 67, 

13 
12. American Society for Testing and Materials. “Standard Test Method for Apparent Shear 

Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading 

(Metal-to-Metal) .” ASTM D 1002, electronic media, 1999. 

13. Huang, Y., D. L. Hunston, A. J. Kinloch, and C. K. Riew. “Mechanisms of Toughening 

Thermoset Resins.” Toughened Plastics Z, p. 1, C. R. Riew and A. J. Kinloch (editors), 

American Chemical Society, Washington, DC, 1993. 

14. Byrne, C. A., D. L. Goodman, G. R. Palmese, J. M. Sands, and S. H. M&night. ‘Electron 

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Proceedings of S.PE 2000, electronic media, 2000. 

14 
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us ARMY ARDEC 

AMSTA AR CCH B 

P DONADIA 

F DONLON 

P VALENTI 

C KNUTSON 

G EUSTICE 

S PATEL 

G WAGNECZ 

R SAYER 

F CHANG 

PICATINNY ARSENAL NJ 

07806-5ooo 

2 COMMANDER 

US ARMY ARDEC 

AMSTA AR CCH C 

HCHANIN 

s CHICO 

PICATINNY ARSENAL NJ 

07806-5000 

6 COMMANDER 

US ARMY ARDEC 

AMSTA AR CCL 

F PTJZYCKI 

R MCHUGH 

D CONWAY 

E JAROSZEWSKI 

RSCHLENNER 

MCLUNE 

PICATINNY ARSENAL NJ 

07806-5000 

1 COMMANDER 

US ARMY ARDEC 

AMSTA AR QAC T 

D RIGOGLIOSO 

PICATINNY ARSENAL NJ 

07806-5000 

1 COMMANDER 

US ARMY ARDEC 

AMSTA AR SRE 

DYEE 

PICATINNY ARSENAL NJ 

07806-5000 

17 
NO. OF 

COPIES ORGANIZATION 

1 COMMANDER 

US ARMY ARDEC 

AMSTA AR WET 

T SACHAR 

BLDG 172 

PICATINNY ARSENAL NJ 

07806-5000 

1 COMMANDER 

US ARMY ARDEC 

AMSTA ASF 

PICATINNY ARSENAL NJ 

07806-5000 

1 US ARMY ARDEC 

INTELLIGENCE SPECIALIST 

AMSTA AR WEL F 

M GUERRJERE 

PICATINNY ARSENAL NJ 

07806-5000 

11 PM TMAS 

SFAE GSSC TMA 

RMORRJS 

CKJMKER 

D GUZOWICZ 

E KOPACZ 

R ROESER 

R DARCY 

R MCDANOLDS 

L D ULISSE 

C ROLLER 

J MCGREEN 

B PATTER 

PICATINNY ARSENAL NJ 

07806-5000 

2 PEO FIELD ARTILLERY SYS 

SFAE FAS PM 

H GOLDMAN 

T MCWJLLIAMS 

PICATINNY ARSENAL NJ 

07806-5000 

1 COMMANDER 

US ARMY TACOM 

PMABRAMS 

SFAE ASM AB 

6501 ELEVEN MILE RD 

WARREN MI 48397-5000 

NO. OF 

COPlES 

6 

ORGANIZATION 

PM SADARM 

SFAE GCSS SD 

COL B ELLIS 

M DEVJNE 

R KOWALSKI 

W DEMASSI 

J PRITCHARD 

SHROWNAK 

PICATINNY ARSENAL NJ 

07806-5000 

COMMANDER 

US ARMY ARDEC 

PRDCTION BASE 

MODERN ACTY 

AMSMC PBM K 

PICATJNNY ARSENAL NJ 

07806-5000 

COMMANDER 

US ARMY TACOM 

PM TACTICAL VEHICLES 

SFAE TVL 

SFAE TVM 

SFAE TVH 

6501 ELEVEN MILE RD 

WARREN MI 48397-5000 

COMMANDER 

US ARMY TACOM 

PM BFVS 

SFAE ASM BV 

6501 ELEVEN MILE RD 

WARREN MI 48397-5000 

COMMANDER 

US ARMY TACOM 

PM AFAS 

SFAE ASM AF 

6501 ELEVEN MILE RD 

WARREN MI 48397-5000 

COMMANDER 

US ARMY TACOM 

PM RDT&E 

SFAE GCSS W AB 

J GGDELL 

6501 ELEVEN MILE RD 

WARREN MI 48397-5000 

18 
NO. OF 

COPIES 

1 

1 

1 

1 

1 

1 

NO. OF 

COPJES ORGANIZATION 

COMMANDER 

US ARMY TACOM 

PM SURV SYS 

SFAE ASM SS 

T DEAN 

SFAE GCSS W GSI M 

D COCHRAN 

6501 ELEVEN MILE RD 

WARREN MI 48397-5000 

COMMANDER 

US ARMY TACOM 

PM SURVIVABLE SYSTEMS 

SFAE GCSS W GSI H 

M RYZYJ 

6501 ELEVEN MILE RD 

WARREN MI 48397-5000 

COMMANDER 

US ARMY TACOM 

PM BFV 

SFAB GCSS W BV 

S DAVIS 

6501 ELEVEN MILE RD 

WARREN MJ 483975000 

COMMANDER 

US ARMY TACOM 

PM LIGHT TACTICAL VHCLS 

AMSTA TR S 

AJMJLLSMS209 

6501 ELEVEN MILE RD 

WARREN MI 48397-5ooo 

COMMANDER 

US ARMY TACOM 

PM GROUND SYSTEMS 

INTEGRATION 

SFAE GCSS W GSI 

R LABATJLLE 

6501 ELEVEN MILE RD 

WARREN MI 483975000 

COMMANDER 

US ARMY TACOM 

C.wEFABRAMS TESTING 

SFAE GCSS W AB QT 

T KRASKIEWICZ 

6501 ELEVEN MILE RD 

WARREN Ml 48397-5000 

14 COMMANDER 

US ARMY TACOM 

AMSTA TR R 

J CHAPIN 

R MCCLELLAND 

D THOMAS 

J BENNETT 

D HANSEN 

AMSTA JSK 

S GOODMAN 

J FLORENCE 

K IYER 

J THOMSON 

AMSTA TR D 

D OSTBERG 

L HJNOJOSA 

BRAJU 

AMSTA CS SF 

H HUTCHINSON 

F SCHWARZ 

WARREN MI 48397-5000 

1 COMMANDER 

US ARMY TACOM 

AMSTA SF 

WARREN MI 48397-5000 

1 COMMANDER 

WATERVLIET ARSENAL 

SMCWV QAEQ 

B VANJNA 

BLDG 44 

WATERVLJET NY 12189-4050 

1 COMMANDER 

WATERVLIET ARSENAL 

SMCWV SPM 

T MCCLOSKEY 

BLDG 253 

WATERVLIET NY 121894050 

2 TSM ABRAMS 

AlZK TS 

S JABURG 

W MBINSHAUSEN 

fl KNOX KY 40121 

19 
NO. OF 

COPIES 

NO. OF 

COPIES ORGANIZ4TION 

10 BENET LABORATORIES 

AMSTA AR CCB 

R FISCELLA 

GDANDREA 

M SCAVULO 

G SPENCER 

P WHEELER 

K MINER 

J VASJLAKIS 

GFRIAR 

R HASENBEIN 

AMSTA CCB R 

s SOPOR 

WATERVLJET NY 12189-4050 

ARMOR SCHOOL 

ATZK TD 

R BAUBN 

J BERG 

APOMEY 

FTKNOXKY 40121 

HQ IOC TANK 

-ONTEAM 

AMSIO SMT 

RCRAWFORD 

WHARRIS 

ROCK ISLAND IL 61299-6000 

DIRECTOR 

US ARMY AMCOM 

SFAEAVRAMTV 

D CAIaDWELL 

BLDG 5300 

REDSTONE ARSENAL AL 

35898 

COMMANDER 

US ARMY AMCOM 

AVIATION APPLIED TECH DIR 

J SCHtJCK 

l?T EUSTIS VA 236065577 

us ARMY CRREL 

I’ DUTTA 

72 LYME RD 

HANOVER NH 03755 

4 DIRECTOR 

US ARMY CECOM 

NIGHT VISION & 

ELECTRONIC SENSORS DIR 

AMSEL RD NV CM CCD 

R ADAMS 

R MCLEAN 

A YINGST 

AMSEL RD NV VISP 

E JACOBS 

10221 BURBECK RD 

l?T BELVOIR VA 22060-5806 

usARMYcERL 

R LAMP0 

2902 NEWMARK DR 

CHAMPAIGN IL 61822 

US ARMY CORPS OF ENGINEERS 

CBRDC 

TLlU 

CEW ET 

TTAN 

20 MASS AVE NW 

WASHINGTON DC 203 14 

US ARMY COLD REGIONS 

RSCH & ENGRNG LAB 

P DU’ITA 

72LYMERD 

HANOVER NH 03755 

1 SYSTEM MANAGER ABRAMS 

Al-Z TS 

LTCJHNUNN 

BLDG 1002 RN 110 

FTKNOXKY 40121 

1 DIR OF CMBT DEVELOPMENT 

C KJORO 

320 ENGINEER LOOP Xl-E 141 

FT LEONARD WOOD MO 

65473-8929 

1 COMMANDANT 

US ARMY FIELD ARTILLERY 

CENTERATFTSILL 

ATFS CD 

LTC BUMGARNER 

FT SILL OK 73503-5600 

20 
NO. OF 

COPIES ORGANIZATION 

10 DIRECTOR 

US ARMY NATIONAL GROUND 

INTELLIGENCE CTR 

D LEITER 

S EITELMAN 

M HOLTUS 

M WOLFE 

S MJNGLEDORF 

H C ARDLEIGH 

J GASTON 

W GSTATTENBAUER 

R WARNER 

J CRIDER 

220 SEVENTH ST NE 

CHARLOlTESVILsLE VA 2209 1 

6 US ARMY SBCCOM 

SOLDIER SYSTEMS CENTER 

BALLISTICS TEAM 

JWARD 

MARINE CORPS TEAM 

J MACKIEW-ICZ 

BUS AREA ADVOCACY TEAM 

w HASKELL 

SSCNC WST 

W NYKVIST 

TMERRIU 

SBEAUDOIN 

KANSAS ST 

NATICK MA 01760-5019 

9 US ARMY RESEARCH OFC 

A CROWSON 

JCHANDRA 

H EVERETT 

J PRATER 

R SINGLETON 

G ANDERSON 

D STEPP 

D KISEROW 

J CHANG 

PO BOX 12211 

RESEARCH TRIANGLE PARK NC 

27709-2211 

1 

USAIC 

ATZB COM 

LTC T J CUMMINGS 

FT BENNING GA 31905-5800 

NO. OF 

COPIES 

1 

1 

1 

3 

1 

1 

2 

ORGANIZATION 

NAVAL AIR SYSTEMS CMD 

J THOMPSON 

48142 SHAW RD UNIT 5 

PATUXENT RIVER MD 20670 

NAVAL SURFACE WARFARE CTR 

DAHLGREN DIV CODE GO6 

DAHLGREN VA 22448 

NAVAL SURFACE WARFARE CTR 

TECH LIBRARY CODE 323 

17320 DAHLGREN RD 

DAHLGREN VA 22448 

NAVAL RESEARCH LAB 

I WOLOCK CODE 6383 

R BADAJ_JANCE CODE 6304 

L GAUSE 

WASHINGTON DC 20375 

NAVAL SURFACE WARFARE C-l-R 

CRANE DMSION 

M JOHNSON CODE 2OH4 

LOUISVILLE KY 402145245 

COMMANDER 

NAVAL SURFACE WARFARE CI’R 

CADEROCK DMSION 

R PETERSON CODE 2020 

M CRJTCHFIELD CODE 1730 

BETHESDA MD 20084 

NAVAL SURFACE WARFARE CTR 

U SORATHIA 

C WILLIAMS CD 655 1 

9500 MACARTHUR BLVD 

WEST BETHESDA MD 208 17 

DAVID TAYLOR RESEARCH CTR 

SHIP STRUCTURES 

& PROTECTION 

DEPT CODE 1702 

BETHESDA MD 20084 

DAVID TAYLOR RESEARCH CTR 

R ROCKWELL 

W PHYILLAJER 

BETHESDA MD 20054-5000 

21 
NO. OF 

amris 

1 

8 

1 

I 

ORGANJZATJON 

OFC OF NAVAL RESEARCH 

D SIEGEL CODE 35 1 

800 N QUINCY ST 

ARLINGTON VA 22217-5660 

NAVAL SURFACE WARFARE CTR 

J FRANCIS CODE G30 

D WLLSON CODE G32 

R D COOPER CODE G32 

J FRAYSSE CODE G33 

E ROWE CODE G33 

T DURAN CODE G33 

L DE SIMONE CODE G33 

R HUBBARD CODE G33 

DAJilLGREN VA 22448 

NAVAL SEA SYSTEMS CMD 

D LIESE 

253 1 JEFFERSON DAVIS HWY 

ARLINGTON VA 22242-S 160 

NAVAL, SURFACE WARFARE CTR 

M LACY CODE B02 

17320 DAHLGREN RD 

DAHLGREN VA 22448 

OFC OF NAVAL RES 

J KELLY 

800 NORTH QUJNCEY ST 

ARLINGTON VA 222 17-5000 

NAVAJ_, SURFACE WARFARE CTR 

CARDEROCK DIVISION 

R CRANE CODE 2802 

C WILLIAMS CODE 6553 

3A LEGGETT CIR 

BETHESDA MD 20054-5000 

NAVSEA OJRI 

PEO DD21 PMSSOO 

G CAMPONESCHI 

2351 JEFFERSON DAVIS HWY 

ARLINGTON VA 22242-5 165 

EXPEDITIONARY WARFARE DIV N85 

F SHOUF 

2000 NAVY PENTAGON 

WASFENGTON DC 20350-2000 

NO. OF 

mms 

1 

1 

2 

AFRL MLBC 

2941 P ST RM 136 

WRIGHT PATTERSON AFB OH 

45433-7750 

AFRL MLSS 

R THOMSON 

2179 12TH ST RM 122 

WRIGHT PATTERSON AFB OH 

45433-7718 

FABRAMS 

J BROWN 

BLDG 653 

2977 P ST STE 6 

WRIGHT PATTERSON AFB OH 

45433-7739 

AFRLMLSOL 

L COULTER 

7278 4TH ST 

BLDG 100 BAY D 

HILL AFB UT 84056-5205 

OSD 

JOINT CCD TEST FORCE 

OSD JCCD 

R WILLIAMS 

3909 HALLS FERRY RD 

VICKSBURG MS 29180-6199 

DEFENSE NUCLEAR AGENCY 

INNOVATIVE CONCEPTS DIV 

6801 TELEGRAPH RD 

ALEXANJXIA VA 223 lo-3398 

WATERWAYS EXPERIMENT 

D SCOTT 

3909 HALLS FERRY RD SC c 

VICKSBURG MS 39180 

DARPA 

M VANFOSSEN 

SWAX 

L CHRISTODOULOU 

3701 N FAIRFAX DR 

ARLINGTON VA 22203-1714 

22 
NO. OF 

COPIES ORGANJZATTON 

NO. OF 

COPIES ORGANIZATION 

2 SERDP PROGRAM OFC 

PM P2 

C PELLERJN 

B SMITH 

901 N STUART ST STE 303 

ARLINGTON VA 22203 

1 FAA 

MIL HDBK 17 CHAIR 

L JLCEWICZ 

1601 LIND AVE SW 

ANM 115N 

RENTON VA 98055 

2 FAA 

TECHCENTER 

D OPLINGER AAR 43 1 

P SHYPRYKEVJCH AAR 431 

ATLANTIC CITY NJ 08405 

1 US DEFT OF ENERGY 

OFC OF ENVJRONMENTAL 

MANAGEMENT 

P RJncovAN 

19901 GERMANT OWNRD 

GERMANTOWN MD 208761928 

1 DIRECTOR 

LLNL 

F ADDESSI MS B216 

PO BOX 1633 

LOS ALAMOS NM 87545 

5 DIRECTOR 

LLNL 

R CHRISTENSEN 

S DETERESA 

F MAGNESS 

MFJNGERMS313 

MMURPHYL282 

PO BOX 808 

LIVERMORE CA 94550 

1 OAK RlDGE NATIONAL 

LABORATORY 

R M DAVIS 

PO BOX 2008 

OAK RIDGE TN 37831-6195 

7 NIST 

R PARNAS 

J DUNKERS 

M VANLANDJNGHAM MS 8621 

J CHIN MS 8621 

D HUNSTON MS 8543 

J MARTIN MS 8621 

DDUTHINHMS 8611 

100 BUREAU DR 

GAITHERSBURG MD 20899 

1 OAK RIDGE NATIONAL 

LABORATORY 

C EBERLE MS 8048 

PO BOX 2009 

OAK RIDGE TN 3783 1 

1 OAK RIDGE NATIONAL 

LABORATORY 

C D WARREN MS 8039 

PO BOX 2009 

OAK RlDGE TN 37922 

1 LOCKHEED MARTIN MISSILES 

& FIRE CONTROL 

R TAYLOR 

PO BOX 65ooO3 M S WT 93 

DALLAS TX 75265-0003 

1 HYDROGEOLOGIC INC 

SERDP ESTCP SPT OFC 

S WALSH 

1155 HERNDON PKWY STE 900 

HERNDON VA 20170 

4 DIRECTOR 

SANDIA NATIONAL LABS 

APPLIED MECHANICS DEFT 

DIV 8241 

WKAWAHARA 

K PERANO 

D DAWSON 

PNJELAN 

PO BOX 969 

LIVERMORE CA 94550-0096 

23 
NO. OF 

COEIES 

3 

1 

1 

1 

ORGANCZATION 

NASA LANGLEY RSCH CTR 

AMSRL vs 

W ELBER MS 266 

F BARTLETT JR MS 266 

G FAEtLEY MS 266 

HAMPTON VA 23681-0001 

NASA LANGLEY RSCH C-JR 

T GATES MS 188E 

HAMPTON VA 23661-3400 

USDOT FEDERAL RAILRD 

MFATEHRDV31 

WASHINGTON DC 20590 

DOT FHWA 

J SCALZI 

400 SEVENTH ST SW 

3203 HNG 32 

WASHINGTON DC 20590 

FHWA 

EMUNLEY 

6300 GEORGETOWN PIKE 

MCLEAN VA 22101 

CENT’&% INTLLGNC AGNCY 

OTI WDAG GT 

WLWALTMAN 

PO BOX 1925 

WASHINGTON DC 20505 

MARINE CORPS INTLLGNC ACTV’TY 

D KOSITZKE 

3300 RUSSELL RD STE 250 

QUANTICO VA 22134-5011 

DIRECTOR 

NATJONAJ., GRND INTLLGNC CTR 

IANGTMT 

220 SEVENTH ST NE 

CHARLOTTESVILLE VA 

22902-5396 

DIRECTOR 

DEFENSE JN’I’LLGNC AGNCY 

TA5 

K CRELLING 

WASHINGTON DC 203 10 

NO. OF 

COPIES 

1 

1 

1 

1 

1 

2 

4 

2 

1 

24 

ORGANTZATION 

GRAPHITE MASTERS INC 

J WILLIS 

3815 MEDFORD ST 

LOS ANGELES CA 90063- 1900 

ADVANCED GLASS FIBER YARNS 

T COLLINS 

281 SPRING RUN LANE STE A 

DOWNINGTON PA 19335 

COMPOSlTE MATERIALS INC 

D SHORT-T 

19105 63 AVE NE 

PO BOX 25 

ARLINGTON WA 98223 

coMPoslTE MATERIALS INC 

R HOLLAND 

11 JEWELCT 

ORJNDA CA 94563 

COMPOSITE MATERIALS INC 

CRILEY 

14530 S ANSON AVE 

SANTA FE SPRINGS CA 90670 

coMPosIx 

D BLAKE 

L DIXON 

12OONBILLDR 

HEBRUN OHIO 43025 

CYTEC FIBERITE 

RDUNNE 

D KOHL1 

M GILL10 

R MAYHEW 

1300 REVOLUTION ST 

HAVREDEGRACEMD21078 

SIMULA 

J COLTMAN 

RHUYETT 

10016 S 51ST ST 

PHOENIX AZ 85044 

SIOUX MFG 

BKRIEL 

PO BOX 400 

FT TOT-TEN ND 58335 
NO. OF 

COPIES 

2 

> 

l 3 

1 

2 

1 

1 

2 

1 

ORGANIZATION 

PROTECTION MATERIALS JNC 

M MILLER 

F CRILLEY 

14oooNW58CT 

MIAMI LAKES FL 33014 

FOSTER MILLER 

J J GASSNER 

M ROYLANCE 

WZUKAS 

195 BEAR HILL RD 

WALTHAM MA 02354-l 196 

ROM DEVELOPMENT CORF 

ROMEARA 

136 SWINEBURNE ROW 

BRICK MARKET PLACE 

NEWPORT RI 02840 

TEXTRON SYSTEMS 

T FOLTZ 

MTREASURE 

201 LOWELL ST 

WILMINGTON MA 08870-2941 

JPS GLASS 

L CARTER 

PO BOX 260 

SLATER RD 

SLATER SC 29683 

0 GARA HESS 8 EISENHARDT 

M GILLESPIE 

9113 LESATNTDR 

FAIRFIELD OH 45014 

MILLIKEN RSCH CORF 

HKUHN 

MMACLEOD 

PO BOX 1926 

SPARTANBURG SC 29303 

CONNEAUGHT INDUSTRIES INC 

J SANTOS 

PO BOX 1425 

COVENTRY RI 02816 

25 

NO. OF 

COPJES 

1 

2 

1 

2 

2 

2 

ORGANIZATION 

B ATTELLE 

C R HARGREAVES 

505 KING AVE 

COLUMBUS OH 43201-268 1 

BATTELLE NATICK OPNS 

J CONNORS 

B HAJaPJN 

209 W CENTRAL ST STE 302 

NATJCK MA 01760 

BATTELLE NW DOE PNNL 

THALLMSK231 

BATTELLE BLVD 

RICHLAND WA 99352 

PACJFIC NORTHWEST LAB 

MSMITH 

G VAN ARSDALE 

R SHJPPELL 

PO BOX 999 

RICHLAND WA 99352 

ARMTEC DEFENSE PRODUCTS 

S DYER 

85 901 AVE 53 

PO BOX 848 

COACHELLA CA 92236 

ADVANCED COMPOSITE 

MATERIALS CORF 

P HOOD 

J RHODES 

1525 S BUNCOMBE RD 

GREER SC 2965 l-9208 

GLCC JNC 

JR4Y 

M Bk4DLEY 

103 TRADE ZONE DR STE 26C 

WEST COLUMBIA SC 29170 

AMOCO PERFORMANCE 

PRODUCTS 

MMJCHNOJR 

J BANISAUKAS 

4500 MCGINNIS FERRY RD 

ALPHARE-ITA GA 30202-3944 
NO. OF 

COPlE$ 

1 

1 

1 

1 

1 

12 

3 

SAIC 

M PALMER 

2109AIRPARKRDSE 

ALBUQUERQUE NM 87 106 

SAIC 

G CHRYSSOMALLIS 

3800 W 8OTH ST STE 1090 

BLOOMINGTON MN 5543 1 

AAI CORPORATION 

T G STASTNY 

PO BOX 126 

HUNT VALLEY MD 21030-0126 

JOHN HEBERT 

PO BOX 1072 

HUNT VALLEY MD 21030-0126 

APPLIED COMPOSITES 

W GRISCH 

333 NORTH SIXTH ST 

ST CHARLES IL 60174 

ALLIANT TECHSYSTEMS INC 

CCANDLAND 

CfuKHUS 

R BECKER 

BSEE 

NVLAHAKUS 

R DOHRN 

S HAGLUND 

D FISHER 

WWORRELL 

R COPENHAFER 

M HISSONG 

DKAMDAR 

600 SECOND ST NE 

HOPKINS MN 55343-8367 

ALLIANT TECHSYSTEMS INC 

J CONDON 

E LYNAM 

JGERHARD 

WV01 16 STATE RT 956 

PO BOX 210 

ROCKETCENTERWV 

26726-0210 

NO. OF 

CopIEs 

1 

1 

2 

5 

3 

1 

PROJECTILE TECHNOLOGY JNC 

515 GILES ST 

HAVRE DE GRACE MD 21078 

CUSTOM ANALYTICAL 

ENG SYS INC 

A ALEXANDER 5 

13000 TENSOR LANE NE 

FLINTSTONE MD 21530 

LORAL VOUGHT SYSTEMS 

G JACKSON 

K COOK 

1701 W MARSHALL DR 

GRAND PRAIRJE TX 7505 1 

AEROJET GEN CORF 

D PILLASCH 

T COULTER 

CFLYNN 

D RUBAREZUL 

M GREINER 

1100 WEST HOLLYVALE ST 

AZUSA CA 9 17020296 

HEXCEL JNC 

R BOE 

F PQLICELLI 

J POESCH 

PG BOX 98 

MAGNA UT 84044 

HERCULES INC 

HERCULES PLAZA 

WILMINGTON DE 19894 

BRIGS COMPANY 

J BACKOFEN 

2668 PETERBOROUGH ST 

HERNDON VA 2207 l-2443 

ZERNOW TECHNICAL SERVICES 

LZERNOW 

425 W BONITA AVE STE 208 

SAN DIMAS CA 91773 

26 
NO. OF 

COPIES 

2 

NO. OF 

ORGANIZATION COPIES ORGANIZATION 

OLIN CORPORATION 

FLINCHBAUGH DIV 

E sTErNER 

B STEWART 

PO BOX 127 

RED LION PA 17356 

BOEING 

R BOHLMANN 

PO BOX 516 MC 5021322 

ST LOUIS MO 63 166-05 16 

1 

BOEING DFNSE & SPACE GP 

w HAMMOND 

J RUSSELL S 4X55 

PO BOX 3707 

SEATTLE WA 981242207 

2 

OLIN CORPORATION 

L WHITMORE 

10101 NINTH ST NORTH 

ST PETERSBURG FL 33702 

1 

2 BOEING ROTORCRAFT 

P MINGURT 

P HANDEL 

800 B PUTNAM BLVD 

WALLINGFORD PA 19086 

5 SIKORSKY AIRCRAFT 

G JACARUSO 

T CARSTENSAN 

BKAY 

S GARBO MS S330A 

JADELMANN 

6900 MAIN ST 

PO BOX 9729 

STRATFORD CT 06497-9729 

1 BOEING 

DOUGLAS PRODUCTS DJV 

LJHARTSMITH 

3855 LAKEWOOD BLVD 

D800-0019 

1 GKN AEROSPACE LONG BEACH CA 908460001 

D OLDS 

15 STERLING DR 

WALLINGFORD CT 06492 

LOCKHEED MARTIN 

SREEVE 

8650 COBB DR 

D 73 62 IdZ 0648 

MARIETTA GA 30063-0648 

1 

PRATT&WHITNEY 

D HAMBRICK 

4OOMAINSTMS 11437 

EAST HARTFORD CT 06108 

1 

LOCKHEED MARTIN 

SKUNK WORKS 

D FORTNEY 

1011 LOCKHEED WAY 

PALMDALE CA 93599-2502 

1 AEROSPACE CORP 

G HAWKINS M4 945 

2350 E EL SEGUNDO BLVD 

EL SEGUNDO CA 90245 

LOCKHEED MARTIN 

R FIELDS 

1195 IRWIN CT 

WINTER SPRINGS FL 32708 

CYTECFIBERlTE 

MLIN 

WWEB 

1440 N KRAEMER BLVD 

ANAHEIM CA 92806 

2 

MATERIALS SCIENCES CORP 

B W ROSEN 

500 OFC CENTER DR STE 250 

FT WASHINGTON PA 19034 

HEXCEL 

T BITZER 

11711 DUBLINBLVD 

DUBLIN CA 94568 

27 
NO, OF 

ccazus 

1 

2 

3 

3 

NORTHRUP GRTJMMAN CORP 

ELECTRONIC SENSORS 

& SYSTEMS DIV 

E SCHOCH MS V 16 

1745A W NURSERY RD 

LINTHICUM MD 21090 

NORTHROP GRUMMAN 

ENVIRONMENTAL PROGRAMS 

R OSTERMAN 

AYEN 

8900 E WASHINGTON BLVD 

PICO RIVERA CA 90660 

UDLP 

D MARTIN 

PO BOX 359 

SANTA CLARA CA 95052 

UDLP 

GTHOMAS 

PO BOX 58123 

SANTA CLARA CA 95052 

UDLP 

R BARRETT MAIL DROP M53 

V HORVATICH MAIL DROP M53 

328 W BROKAW RD 

SANTA CLARA CA 95052-0359 

UDLP 

GROTJND SYSTEMS DIVISION 

M PEDRAZZI MAIL DROP NO9 

ALEEMAJLDROPNll 

M MACLEAN MAIL DROP NO6 

1205 COLEMAN AVE 

SANTA CLARA CA 95052 

UDLP 

R BRYNSVOLD 

P JANKE MS 170 

T GIOVANETTI MS 236 

BVANWYKMS389 

4800 EAST RIVER RD 

MmNEAP0L1$ MN 55421-1498 

NO. OF 

COPIES 

2 

1 

5 

2 

ORGANIZATION 

GDLS 

D REES 

M PASM 

PO BOX 2074 

WARREN MI 48090-2074 

GDLS DIVISION 

D BARTLE 

PO BOX 1901 

WARREN MI 48090 

GDLS 

MUSKEGON OPERATIONS 

W SOMMERS JR 

76 GETTY ST 

MUSKEGON Ml 49442 

GENERAL DYNAMICS 

AMPHIBIOUS SYS 

sURVIVABJLITYLEAD 

G WALKER 

991 ANNAPOLIS WAY 

WOODBRJDGE VA 22191 

INST FOR ADVANCED 

TECH 

TKIEHNE 

HFAIR 

P SULLIVAN 

WREINECKE 

I MCNAB 

40302WBRAKERLN 

AUSTIN TX 78759 

CIVIL ENGR RSCH FOUNDATION 

PRESIDENT 

H BERNSTEIN 

RBELLE 

1015 15TH ST NW STE 600 

WASHINGTON DC 20005 

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34 
Interpenetrating Polymer Network (IPN) Adhesives for Electron Beam Cure 

James M. Sands, Steven H. M&night, and Bruce K. Fink 

Aberdeen Proving Ground, MD 210055069 ARL-TR-2321 

AGENCY REPORT NUMBER 

Strategic Environmental Research and Development Program 

XI1 North Stuart Street, Suite 303 

Arlington, VA 22203 

12a. DISTRIBUTIONIAVAILAB~U~-Y STATEMENT 12b. DlSTRlBUTlON CODE 

4pproved for public release; distribution is unlimited. 

13. ABSTRAcT(Max/mum 200 WO&J) 

Electron beam (e-bean&processed polymer adhesives have historically performed poorly compared to 

traditional adhesive technologies due to a lack of toughness engineered into these new types of adhesive materials. 

Consequently, sequential- and simultaneous-interpenetrating polymer networks (seq-IPN and SIN) were developed 

and characterized. Seq-IPN adhesive pastes demonstrated exceptional lap-shear strengths (approaching 41 MPa) 

with glass transition temperatures (Ta) of lW120” C. The sequential polymerization proceeds by first thermally 

curing the adhesive to the green-strength. The cure kinetics for the C-staged seq-JPNs have been investigated as a 

function of temFratum and cure acceleration. SIN materials are being investigated to develop durable 

e-beam-curable film adhesives. The primary advantage of SIN film adhesives, compared to cationic e-beam 

systems, is insensitivity to surface contaminan ts (e.g., amine and water), which are known to hinder cure in cationic 

e-beam polymerization. Preliminary results have shown that the SIN e-beam adhesives have excellent properties. 

Lap-shear strengths exceeding 27.5 MPa with adhesive T, approaching 150’ C have been demonstrated on primed 

aluminum substrates. Structural, kinetic, and adhesive performance data for both seq-LPN and SIN sn-ucturaJ 

adhesives cured by e-beam irradiation are presented. 

14. SUBJECT TERMS 15. NUMBER OF PAGES 

adhesives, epoxy resin, e-beam-curing network polymers 30 

16. PRICE CODE 

17. SECURITY CLASSlFlCATlON 18. SECURITY CLASSIFICATION 

OF REPORT 

1% SECURITY ClASSlACAflON 20. LIMITATION OF ABSTRACT 

OF THIS PAGE OF ABSTRACT 

UNCLASSIFIED UNCLASSIFIED UNCLASSIFIED UL 

4SN 75401-230-5500 

35 Standard Form 298 (Rev. 2-W) 

Prescrihd by ANSI Std. 239-18 298102 
~NTIONALLY LEFT BLANK. 

36 
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