Internet Commerce for Manufacturing Data Staging

J. G. Nell

+1 301 975 5748, nell@nist.gov

Building 220/Room A131

Curtis Parks

+1 301 975 3517, cparks@nist.gov

Building 225/Room A55

National Institute of Standards and Technology

Gaithersburg MD, USA, 20899

Foreword

Goods and services traded over the Internet will reach a total value of $327 billion by 2002, according

to a recent report from Forrester Research in Cambridge, Mass. Today, most of this electronic

commerce (e-commerce) on the Internet is from business-to-consumer (B2C) retail sales rather than

from business-to-business (B2B) transactions among business-trading partners. In the future, however,

B2B is expected to become the major form of e-commerce on the

Web through the formation of virtual-trading-partner enterprises

because business efficiency will be improved. This goal can only be

realized if information can be exchanged and shared among business

enterprises and trading partners to enable business transactions to

occur reliably and safely. In particular, the manufacturing industry

requires a more coordinated exchange of both business and product

information across an extensive supply chain of trading partners that

span a product-ordering-, manufacturing-, and distribution-life cycle

measured in months, weeks, and, sometimes, days.

This B2B, e-commerce scenario is quite different and more demanding than a simple shopping-cart

scenario found in B2C retail sales. It involves a highly dynamic and variable set of business processes,

data exchanges, and sequence of operations, among trading partners that require industry to use

agreed-upon interfaces, protocols, and standards that can enable trading partners to exchange

information across enterprises. This, in turn, requires each of the enterprises to understand its business

processes and data flows, and to represent these in an electronic form to which other enterprises can

receive, understand, and respond.

This paper describes work done by the National Institute of Standards and Technology (NIST) under

the Internet Commerce for Manufacturing (ICM) project. A task of this project is to model selected

business processes and data flows within and across trading partners involved in the manufacturing of

electronic-printed-circuit boards and assemblies (See Figure 1). Appendix A of this paper contains

background information about the ICM project. Figure 2 depicts the plan for deriving the models

described in this paper.

Figure 1 Relationship of

trading partners
2

The ICM work toward developing message and data transfer in a printed-circuit-assembly-supply chain

requires accurate knowledge of the process events, when they occur, and the timing of messages about

those events between enterprises. We analyzed the process events to uncover the data and messages

flows among the processes. The process events build upon and specialize the information in the ICM

Activity Model [5] to form the Process-Flow Model. The Process-Flow Model can be linked back to

the elements of the ICM Activity Model.

Process-flow models are a common element in many of the projects in both the Manufacturing

Engineering Laboratory, and the Electronic Information Technologies Group of the Electronics and

Electrical Engineering Laboratory. To create the Process-Flow Model we have used common

software-flow-charting techniques that are easily interpreted and edited during the evolution of the ICM

test bed.

Figure 2 ICM Model Heritage

Executive Summary

This paper presents and describes a proposed process-flow-reference model for the Internet

Commerce for Manufacturing (ICM) project, part of the NIST National Advanced Manufacturing Test

Bed program.

ICM TEST BED

Industry Input

- Eccé Project [3]

- IPC 2519[4]

This document

Internet Commerce for

Manufacturing Activity

Model

NISTIR 6516 [5]

• Project Scope

• Activity decomposition

• Sequence & timing of functions

• Message senders & recipients

• Message content scope
3

The portion of the printed-circuit-assembly-supply chain from the time when the design is complete until

receiving the completed assembly comprises mostly a series of sequential messages and actions.

Planning for a supply-chain test bed for this product relies on an understanding of each of these

messages and actions, and when they occur. In turn, understanding the messages and actions in the

supply chain depends on the sequence of actions within each member of the supply chain. This paper

reports on work to model and analyze these messages.

The purpose of the work was to identify the nature of the messages so that the infrastructure and

standards required to effect the necessary interactions could be tested. Regarding industrial application

of the work, the authors believe that as more electronic assembly is subcontracted a more automated

set of electronic messages, use of pervasive infrastructure such as the World-Wide Web, and

application of open information-technology standards will prove productive in the commerce of making

printed-circuit assemblies.

The ICM project will use these models to identify those Internet-facilitated transactions that will be a

part of the ICM test bed. The model also may help to visualize the transactions developed by ICM.

Where deemed appropriate, the model may help us to evaluate the ICM business case, and may

suggest processes and infrastructure that will improve the flow of information in the supply chain. The

models presented herein do not include manufacturing-specific information flows (see conclusions

below).

The information flows presented are critical in the identification of stages where data are no longer

amenable to change. We note that a change to the identified data elements after passing such a stage

often results in scrapping of tooling or partially completed product, and further will usually require a

change to the contract or bid and purchase order. Changes to information sets could cause changes to

previously quoted printed-circuit-assembly price and delivery from the board-assembly or the bareboard contractors, and subsequent negotiations and product design could delay price and delivery

significantly. These stages are the focus of the ICM just-in-time-data delivery.

The model can be used to recommend extensions of the ICM architecture beyond the current industry

domain. The model is somewhat dynamic during the life of the ICM project. We expect to revise this

model as the ICM test bed evolves and incorporates new interactions. External partner-process

improvements will be adopted and modeled where appropriate.

Conclusions

Identifying and Grouping Product Data: The project conducted scenario workshops during the

early phase of the work. These workshops pointed out that frequently there is an unacceptable time

delay before manufacturers received sufficient information about the printed-circuit-assembly product to

complete the machine tooling and programming. Key data items, such as correlating the component

location on the circuit board with their reference designator, often required manual entry from a paper

top-assembly drawing. As a result, the data files needed for a prototype-printed-circuit assembly were

identified and indexed on a Web page. NISTIR 6320 Internet Commerce for Manufacturing

Product Data [1] documented the results of gathering the needed data files.
4

Grouping these data within the context of the sequence of their generation and subsequent use resulted

in being able to identify their critical just-in-time staging. Since data can be moved with very little time

loss, the two-day to two-week delays presently attributed to product information gathering and

correlation in the supply chain can be reduced considerably. The ICM Test Bed can be used to develop

the methods to move the data so as to realize much of the identified potential time saving.

Building the Test Bed: With knowledge of the data flows, the ICM project can construct the test bed

in a top-down manner. Each of the messages and actions identified in the model can be planned,

constructed, and executed. Events in the supply-chain sequence will have an entry point in the test bed

such that all follow-on development of agents, software, scripts, and business-to-business transactions

will be based upon messages that have an identified source and destination. With these needs in mind,

the project has paid careful attention to the identification and definition of all supply-chain transactions

within the scope of the test bed.

Intra-Enterprise Models: Data staging is manipulating the printed-circuit-assembly-product data to

produce partitioned subsets that supply information to specific functions of the manufacturing process.

Electronic messaging permits improvements in data staging so that the data preparation for

manufacturing can better approximate a just-in-time scenario. The intra-enterprise data are, in the

typical manufacturing process, extracted from the design data at one time, and processed for use later

during the manufacturing stages. We recognize that such a process may require modification to achieve

the desired just-in-time information delivery. The models, Charts 1-4, revealed sets of intra-enterprise

data that are stages in the development process of a printed-circuit assembly. We have identified these

data staging events in shaded columns on the left side of appropriate models. Examples are the artwork,

the solder-mask data, and silk-screen data. Each stage comprises an information milestone.

Compressing the time expended between data preparation and its utilization for building the product

allows the design function more time to prepare appropriate data, thereby raising product quality. Data

accuracy is a factor in reducing the number of costly changes that design changes necessitate.

Inter-Enterprise Models: The analysis has identified 23 key inter-enterprise transactions among the

major functions in the printed-circuit-production process: the original-equipment manufacturer, the

printed-circuit assembly assembler, the bare-board producer, the parts supplier, a parts-preparation

service, a test fixture supplier, and a stencil supplier. Knowing the nature of the transactions allows testbed designers to provide sufficient process and infrastructure capability to effect the transactions. Table

1 below presents the transactions and Appendix B to this paper presents more detail about them.

Through the use of the Internet, the ICM project will show that inter-enterprise message latency, or

data-float time, can be driven to zero-time. That is, when one partner creates and posts any of the 23

messages, it immediately becomes available to the other partner.

Process-Flow-Model Development

The ICM project has pursued a model-driven approach to identify business roles, the design and

manufacturing processes, and the data involved in producing printed-circuit boards and assemblies. The

ICM developed the Process-Flow Model according to the process evolution that the ICM Scenario

Workshops suggested. These workshops identified three significant processing entities.
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• Original-equipment manufacturer (OEM)—responsible for developing part or all of the design and

issuing the purchase order (Chart 1) for the printed-circuit assembly

• Electronics-manufacturing-service provider (EMS)—contracts to build the printed-circuit assembly

(Chart 2)

• Board-fabrication shop—produces photo tools and uses processes unique to printed-circuit

assemblies (Chart 3)

The authors added additional entities and an analysis of key entity interactions during development of the

process model.

• Parts-supply and parts-preparation functions prepare parts and kit them for insertion into the bare

board (Chart 4)

• Test fixture/adapter supplier prepares the fixture and adapter for use in the functional testing of the

assembled printed-circuit assembly

• Inter-enterprise transactions among OEM, EMS, bare-board producer, test fixture and adapter

supplier, parts supplier, parts-preparation service, and stencil manufacturer (Chart 5)

The modeling process focused first on the events that involve data used within each member of the

supply chain. Modeling these events revealed opportunities for data staging. The models were reviewed

during meetings of the ICM project, NEMI, and IPC. During model reviews, participants identified

variations within the manufacturing flows. These variations were attributed to differences in printedcircuit-assembly products and individual enterprise-planning sequencing. Prior to the second modeling

effort, the project analyzed these variations to determine the impact on the flow of information external

to the manufacturing operations. Since consistency remained in the external information flows, these

became the focus of the second modeling effort. The internal manufacturing-information flows and their

variations were then removed from Charts 1, 2, and 3, leaving the critical boundary-manufacturing

functions. These resultant models provide insight into printed-circuit-manufacturing activities, serve as a

basis for discussions with industry, and help guide ICM-test-bed implementations and demonstrations.

Charts 1 to 5, and supporting descriptive material, are in the Appendix B to this report.

ICM modeling activities include:

• Activity Model (NISTIR 6516) [5]: This model was developed in 1999 based on the IPC/Ecce

Activity Model [3]. It is an entity-relationship model (IDEF-0) [24] that describes the activities and

relationships that support the manufacture of printed-circuit assemblies.

• Data Staging: The Process-Flow Model, described in this report, uses information from the

Activity Model to develop the Data-Staging model presented later in this section of the paper. The

model shows 23 key business transactions and data exchanges occurring among trading partners

involved in the manufacturing of printed-circuit boards and assemblies. The trading partners include

the original-equipment manufacturer (OEM), electronic-manufacturing-service provider (EMS),

board fabricator, and various other suppliers.

The model identifies types of message transactions, senders and recipients, and message sequence

and content (data) being exchanged among trading partners. The model also describes major

activities occurring within an organization or enterprise to produce the sets of information needed
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among trading partners in the ordering and manufacturing of printed-circuit boards and assemblies.

By identifying the information sets, and when or where they are needed, the model enables data

staging for just-in-time information exchange, which can lead to improved accuracy and product

quality, and it can reduce information latency between enterprises to zero. This ICM Flow Model is

used to guide implementation and testing of prototype e-business communications among printedcircuit-manufacturing enterprises in the ICM test bed at NIST.

Using the Data-Staging model, ICM is mapping existing and emerging standards to these message

transactions to determine where and if these standards could be used to support integration among

printed-circuit-manufacturing, trading partners. This includes reviewing standards from the IPC [15],

the National Electronics Manufacturing Initiative (NEMI) [16], RosettaNet [17], Open Application

Group (OAG) [18], Object Management Group (OMG) [19], CommerceNet (CNet) [20],

Electronic Business XML (ebXML) [21], Silicon Graphics Initiative (Si2) [22], and other standards

groups.

Each processing flow was refined and documented primarily for use in analyzing the ICM-test bed-toscenario correlation. Each flow is diagramed to focus on the information inputs and the times when

various data are utilized. The ICM-test bed expects to develop just-in-time-information distribution, one

of the key areas for product-supply time and for delivery of quality products. The interactions identified

in Chart 5 are summarized in Table 1 below.

Process-Flow Model

The process-flow model is presented on Charts 1-4, which are located in the appendix to this report.

There is a chart for each key participant in the supply chain.

• Chart 1: To, within, and from the original equipment manufacturer or OEM

• Chart 2: To, within, and from the EMS

• Chart 3: To, within, and from the bare-board supplier

• Chart 4: To, within, and from the discrete-parts supplier, the parts-preparation supplier, and the

test-fixture supplier

The process-flow model is a decomposition of events required to complete a function or activity. Most

of the benefits of this study should be realized by identifying the last step at which data must be frozen.

Essentially, this is identifying and characterizing just-in-time-information delivery for the supply-chain

partners.

The processes have not been decomposed further than deemed necessary to identify messages and data

needed within the context of the ICM-Test-Bed project. We have not rigorously developed the flows

within each partner, such as the assembly-line flows. We have included, primarily, flows of material

items, recognizing that these customarily accompany a message item, such as a production-item traveler,

or a shipper's tracking-identification bar code. These resultant flow models as presented represent an

approach similar to the design-workflow case study presented in [10].
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Actors: BA = board assembler, BB = bare-board shop, DS = discrete-parts supplier, OEM = original-equipment manufacturer,

PP = parts preparer, SS = stencil supplier, TF = test-fixture/adapter preparer

Data-Set Acronyms: AVL = approved vendor list, BOM = bill of material, PCB = printed-circuit board, PCA = printed-circuit

assembly, PDP = product-definition package, RFQ = request for quote

1. SHIP Panels (BB) ⇒ RECEIVE Panels (BA)

2. SHIP Boards (BB) ⇒ RECEIVE Boards (BA)

3. SHIP AVL (OEM) ⇒ RECEIVE AVL (BA)

4. SHIP Change request (BA) ⇒ RECEIVE Change request (OEM)

5. SHIP Panelization coordinates (BB) ⇒ RECEIVE Panelization coordinates (BA)

6. SHIP RFQ & bid PDP (OEM) ⇒ RECEIVE RFQ & bid PDP (BA)

7. SHIP PCA bid (BA) ⇒ RECEIVE PCA bid (OEM)

8. SHIP PCA (BA) ⇒ RECEIVE PCA (OEM)

9. SHIP Change request (BB) ⇒ RECEIVE Change request (BA)

10. SHIP PCA-parts order (BA) ⇒ RECEIVE PCA-parts order (DS)

11. SHIP PCB order & design file (BA) ⇒ RECEIVE PCB order & design file (BB)

a. SHIP Net list (BA) ⇒ RECEIVE Net list (BB)

b. SHIP Artwork (BA) ⇒ RECEIVE Artwork (BB)

12. SHIP Test results (BA) ⇒ RECEIVE Test results (OEM)

13. SHIP Manufacturability report (BB) ⇒ RECEIVE Manufacturability report (OEM)

14. SHIP Parts specification (OEM) ⇒ RECEIVE Parts specification (PP)

15. SHIP Order & Procuring PDP (OEM) ⇒ RECEIVE Order & Procuring PDP (BA). PDP includes:

a. SHIP BOM (OEM) ⇒ RECEIVE BOM (BA)

b. SHIP Net list (OEM) ⇒ RECEIVE Net list (BA)

c. SHIP Top-assembly drawing (OEM) ⇒ RECEIVE Top-assembly drawing (BA)

d. SHIP Design file (OEM) ⇒ RECEIVE Design file (BA)

16. SHIP Parts certification (PP) ⇒ RECEIVE parts certification (OEM)

17. SHIP Parts & invoice (DS) ⇒ RECEIVE Parts & invoice (BA or PP)

18. SHIP Fabrication capability & tradeoff data (BB) ⇒ RECEIVE Fabrication capability & tradeoff data (OEM)

19. SHIP Test fixture (TF) ⇒ RECEIVE Test fixture (BA)

20. SHIP Test fixture order (BA) ⇒ RECEIVE Test fixture order (TF)

21. SHIP Stencil Order (BA) ⇒ RECEIVE Stencil Order (SS)

22. SHIP Stencil (SS) ⇒ RECEIVE Stencil (BA)

23. SHIP As-built data (BA) ⇒ RECEIVE As-built data (OEM)

Table 1 Inter-Enterprise Transactions (Summary of Chart 5)

Note: The transaction numbers have no manufacturing significance. They were assigned to maintain tracking

consistency during the analysis.

Lines that indicate flow direction connect the sender and receiver of the messages. These connections

can be mapped to the ICM-activity model and to the RosettaNet Partner Interface Process (PIP) [17].

The flow model maps readily to the project-activity model that was prepared and documented earlier in

the project. The Defense Advanced Research Projects Agency developed that activity model for the

Ecce (Electronic Computer-Aided Design to Computer-Aided Manufacturing Exchange) project [3]. In

part, the Ecce model was selected because that project has the support of the IPC [15] and the

Electronic Industries Association [23]. Based on the Ecce work, the IPC is developing GenCAM

(generic computer-aided manufacturing), a CAD-to-CAM, data-transfer standard, also based on the

Ecce work. The EIA [23] is developing an extension to their Electronic Data Interchange Format
8

(EDIF), to be called CAM-IM, or intermediate format for computer-aided manufacturing of printedcircuit assemblies.

The material in Appendix B describes the functions and information flows within each of the primary

partners of the printed-circuit-assembly-supply chain, and finally the messaging between partners. Note

that part suppliers, parts-preparation services, test-fixture fabricators, and stencil suppliers

participate in the message exchanges. However, the authors have not modeled these internal flows since

they are not considered within the scope of the ICM project. Where the notion of control may be useful

to the ICM-Test-Bed project, we have identified the function with a note and defined who has control

of the information once the information is sent or received.

Transactions between Processes and between Enterprises

The process-flow models show the principal information-flow routes to procure, produce and test a

printed-circuit assembly. From this, the ICM project can achieve parts of two key deliverables, data

staging and inter-enterprise transactions.

The transaction occurrence model has to do with improving inter-enterprise transactions. Although all of

the information transactions are important, the ones in which the ICM project has the most interest are

those that cross enterprise boundaries. These are shown on the Transactions list of Table 1 and in the

Transactions-Occurrence Model, or Swim-Lanes model, Chart 5. To design a demonstration, and

eventually, an implementation, the project must analyze these transactions for the nature of the

information to be exchanged. For example, some of these transactions will be simple electronic-trading

transactions such as confirmations, and some will be more sophisticated e-business exchanges such as

product-design files. The capabilities should be available where needed to support exchange of the

required class of information, including STEP or GenCAM encoded as XML, Gerber files, and native

CAD formats. Any proposed solution should not preclude ensuing standards or a wider exploitation of

the currently foreseen mechanisms.

Recommendations for Further Research

The ICM project is similar in scope to some of the in-work initiatives in the National Electronics

Manufacturing Initiative (NEMI) organization. The ICM project expects that the model will contribute

to various modeling efforts within NEMI activities. As such, the model will likely increase in both quality

and visibility. The possible use of the model as a means of examining the emerging NEMI roadmap is

open to exploration.

The authors also plan to evaluate the completeness of the scope of the ICM project itself by exploring

the possible presentation methods using Web pages and links.

The authors expect that future ICM modeling will develop more detailed process or flow models and

data models. The current activities should identify the content and uses of elements of the remaining

project models.

Other research should involve analyzing the transactions of Chart 5 and assigning the most appropriate

standard, which, if used, will facilitate a successful transaction.
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References and Further Reading

1. C. Parks, Internet Commerce for Manufacturing Product Data, NISTIR 6320, April 14, 1999.

2. Internet supply chain Partner Interfaces: White Paper, http://www.rosettanet.org/press/white.html

RosettaNet Organization URL valid as of April 18, 2000.

3. D. Barton, Electronic CAD to CAM Exchange (Ecce) Project Activity Model,

http://www.averstar.com/ecce/ActivityModel/ developed by Averstar (formerly Intermetrics, Inc.).

URL valid as of April 18, 2000.

4. IPC-2519, A standard developed by IPC, 2215 Sanders Road, Northbrook, IL 60062-6135.

5. E. Barkmeyer, J. Nell, C. Parks, Internet Commerce for Manufacturing Activity Model, May 3,

2000, NISTIR 6516.

6. T. Costlow, Demo Proves Systems Go for RosettaNet, Electronic Engineering Times, March 13,

2000, page 87.

7. G. Bartuli, Principles of Configuration Management, Design Engineering, April 1999, page 28.

8. R. Nedbal, Zen and the Art of CAD-to-CAM Data Transfer, Printed Circuit Design, July 1999,

page 30.

9. D. Kieran and D. Reed, Practical Approaches to DFM, Printed Circuit Design, December 1998,

page 23.

10. G. Alexander and C Withers, Saving Time; a Workflow Management Success Story, Printed

circuit Design, September 1998, page 16.

11. J Gould, CAD & PDM Integration; Tearing Down the Walls, Design Engineering, September

1998, page 24.

12. Edward Barkmeyer, Neil Christopher, Shaw Feng, James Fowler, Simon Frechette, Albert Jones,

Kevin Jurrens, Charles McLean, Mike Pratt, Harry A. Scott, M. K. Senehi, Ram Sriram and Evan

Wallace: SIMA Reference Architecture Part I: Activity Models, NISTIR 5939, National Institute

of Standards and Technology, Gaithersburg, MD, 1997.

13. F. Bonifazi and J. Gould, Making Workflow Work, Desktop Engineering, April 1998, page 30.

14. J. Henderson, DFM/DFT 101, Basic Rules for Designing Printed Circuit Assemblies, Printed

Circuit Design, August 1998, page 12.

15. IPC, formerly Institute for Interconnecting and Packaging Printed Circuits, http://www.ipc.org/ , and

http://www.gencam.org .

16. National Electronics Manufacturing Initiative (NEMI), http://www.nemi.org

17. RosettaNet, http://www.rosettanet.org

18. Open Application Group (OAG), http://www.openapplications.org

19. Object Management Group (OMG), http://www.omg.org

20. CommerceNet (CNet), http://www.commerce.net/

21. Electronic Business XML (ebXML), http://www.ebxml.org/

22. Silicon Graphics Initiative (Si2), http://www.si2.org/ecix/

23. Electronic Industries Association (EIA), http://www.eia.org/

24. IDEF-0, Integrated-Computer-Aided Manufacturing Definition, Activity Model, Integration

Definition for Function Modeling, NIST FIPS pub 183, 31 December 1993. Also: Standard

Syntax and Semantics for the Integrated Computer Aided Manufacturing (ICAM) Definition

Language--Function Modeling (IDEFO), IEEE Standard P1320.1/D6.1 (C/SE), 24 June 1998.
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Appendix A

The Internet Commerce for Manufacturing Project

A goal of the ICM project at NIST is to model how the manufacturing industry, through open systems

and standards, might participate in this market growth and take advantage of the benefits of Internetbased commerce. In particular, ICM is focusing on the manufacturing of electronic printed circuit

boards and assemblies to create an environment where large and small manufacturers of mechanical and

electronic components may participate competitively in virtual enterprises that produce complex

manufactured systems. ICM collaborates with industry, universities, and standards organizations, to

identify and demonstrate solutions for some of the manufacturing information technology problems that

exist at the intersection of manufacturing and e-commerce systems.

The beneficiaries of this project are small and medium sized manufacturers of mechanical and electronic

components, the large manufacturers of complex systems that incorporate these suppliers into their

processes, and software vendors of manufacturing execution systems, enterprise requirements planning

systems, and electronic commerce software solutions.

ICM objectives include:

• Enable electronic exchange of build information and change notices for all supply-chain participants

to support rapid decision-making and collaboration in the manufacturing and assembly of electronicprinted-circuit boards and assemblies.

• Collaborate with industry and standards organizations to develop public specifications, technologies,

and tools for enabling PCB/PCA business and manufacturing operations over the Internet.

• Provide a flexible and neutral test-bed for industry and government to collaborate in testing and

evaluating standards-based tools and integration technologies that can reduce the risk of technology

adoption by evaluating emerging specifications against various manufacturing scenarios.

• Demonstrate integration of e-commerce business services with technical data interchange for

manufacturing processes.

• Disseminate guidance, results and test-bed tools to industry through published papers and the NIST

ICM Web site (ICM project: http://www.mel.nist.gov/namt/projects/icm/icm1.htm).

The ICM project is part of the NIST National Advanced Manufacturing Test Bed (NAMT,

http://www.mel.nist.gov/namt/) program. ICM is supported by the NIST “Systems Integration for

Manufacturing Applications” (SIMA, http://www.mel.nist.gov/msid/sima/sima.htm) program, the

Advanced Technology Program (ATP, http://www.atp.nist.gov/atp/), and by participating NIST

laboratories (EEEL, MEL, ITL, and MEP).
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Appendix B

Flow-Diagrams and Transaction Definitions

On the following pages are Charts 1-5 that diagram the transactions that enter and leave the enterprise

during the procurement of printed-circuit assemblies. They are:

• Chart 1: To, within, and from the original equipment manufacturer or OEM

• Chart 2: To, within, and from the EMS

• Chart 3: To, within, and from the bare-board supplier

• Chart 4: To, within, and from the discrete-parts supplier, the parts-preparation supplier, and the

test-fixture supplier

• Chart 5: The swim-lane diagram has been created to show only the inter-enterprise transactions

among the above enterprises

A legend for Charts 1-5 is presented below.

Following are the descriptions of the key transactions among customers and suppliers during printedcircuit-assembly procurement. They are arranged alphabetically and grouped by the various enterprises

involved in the procurement.

Assembly Procurement and Electronic-Commerce Flow

Chart 1: To, within, and from the original equipment manufacturer or OEM

Approve for Update: The OEM reviews the draft engineering-change order for impact upon cost,

system performance, and schedule. The designer is notified regarding the changes to be made to the

design.

Archive Files: The product-data file is required later in the life cycle of the product, and the file is

maintained as an archive. The product-drawing number and version are identified with or are associated

with the archived file.

Assemble Buy Order: The procurement request identifies a product identification (including version

identification) that is used to obtain the appropriate bid PDP from the product-configuration function.

Data 

Stages

Internal

Functions

Decision Transactions End Start

Chart Legend
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Assemble ECO Was/Is and PDP Version: Similar to an order for a new printed-circuit assembly,

this consists of an authorization to proceed and a product-definition package (PDP) that contains such

items as the bill of material (BOM), the net list, the top-assembly drawing, and the printed-circuitassembly-design file.

Assemble Printed-Circuit-Assembly Order: The order consists of an authorization to proceed and a

product-definition package, PDP, that contains such items as the bill of material (BOM), the net list, the

top-assembly drawing, and the printed-circuit-assembly-design file. The order also specifies such things

as manufacturability report, as-built data, tests and test results, and the design-release file.

AVL: The approved vendor list (AVL) may be included with the Order to specify which vendors are

acceptable to the OEM for supplying parts and material for the order.

CAD File/Version*: During the design and layout of a printed-circuit assembly, and for each

subsequent change to it, a product-data file is developed on a computer aided design (CAD) system.

This file includes the product model defined as two or more conductive layers together with the

reference designator for each part, pin numbers, and its associated net name. The product-data file may

also include either the generic-part number or the order-part number of each component.

*Note: On completion of a product/version, control of the file is passed to the product-configuration function.

Design Requirements: The process of creating the design requirements is considered outside the

scope of the ICM Project. The information from design requirements is the primary input to the printedcircuit assembly designer.

Extract Bill of Materials (BOM)*: The BOM is usually the reference designator of each component

together with its assigned part number. The resulting list is often sorted by part number, to which the

number of occurrences of each part number is added. Redundant entries of the same part number are

then eliminated. A “find” number is assigned to each line in this sorted file.

*Note: On completion of the BOM, control of the BOM is passed to product configuration.

Extract Net List*: The net list consists of the name of each unique signal in the circuit, together with

each pin and the reference designator of the pin. For some net list uses, the X and Y location of the pin

is added into the list.

*Note: On completion of the net list, control of the net list is passed to the product-configuration function.

Output Top-Assembly Drawing*: The top-assembly drawing is primarily a visual used in estimating

the production, for tooling, for hand assembly, in troubleshooting, and for support and maintenance

documentation. The drawing usually comprises the silk-screen layer, the board outline, and a drawing

border.

*Note: On completion of the drawing, control of the drawing is passed to Product Configuration.

Procurement Request: The decision to procure a printed-circuit assembly authorizes a purchasing

department to originate a purchase or procurement request.
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Produce ECO: The engineering-change request is evaluated and, if warranted, an engineering-change

order (ECO) is originated.

Product Configuration: The product model and supporting documentation are assigned a product

identification, or drawing number. Upon review and approval, the identified product-definition package

(PDP) is released for acquisition. A make-or-buy review determines if a bid is to be originated. The

information needed for an EMS to bid is assembled from selected information (see “Ship Request for

Quote”) in the PDP. Upon award of an order, the OEM forwards the information needed to

manufacture the printed-circuit-assembly version to the EMS. Changes are released as a change order

and the “was/is” information is assembled from the PDP and identified by ECO number. When the

product-definition package changes the form, fit, or function of the product or part, the productdefinition package is identified as a new version.

See especially reference [1] for examples of acquisition and change-order PDPs that were developed

for the ICM Project and posted as Web pages.

Receive As-Built Data: The OEM receives the data from the EMS about what was actually installed

on the printed-circuit assembly.

Receive Change Request: During any stage of manufacture suppliers may identify different parts or

processes that can either save costs or that are necessary for completion of the manufacturing. Suppliers

forward desired changes to the OEM for evaluation by its engineering function.

Receive Fabrication Capability and Tradeoff Data: Should the OEM know the printed-circuitassembly shop at the time of design or re-design, the OEM can use fabrication capability and tradeoff

data from the printed-circuit-assembly shop to improve significantly printed-circuit-assembly fabrication

yield and production times. This results in lower product costs and higher reliability [8]. This capability

information is particularly important for designs operating at higher frequencies or in harsh environments.

Receive Manufacturability Report: The EMS distills information from its control processes, such as

statistical-process-control information and supplies it to the OEM. This information is often useful when

planning product or design enhancements and for product maintenance. This report also could contain

warranty-tracking data, and the as-built BOM.

Receive Part Certification: The parts supplier ships parts that have been qualified to, or modified

from, the part specification, together with specification-conformance documentation, to the OEM. The

OEM retains the certification as evidence that critical parts meet the specification.

Receive Printed-Circuit Assembly: The OEM receives the final printed-circuit-assembly product

from the shipper accompanied by the shipping tracker. The supply-chain process ends upon receipt of

the printed-circuit assembly and the invoice, which the OEM forwards to its accounts-payable function.

Receive Printed-Circuit-Assembly Bid: Cost, quantity, and schedule are key data used to evaluate a

potential EMS.
14

Receive Test Results: The EMS performs tests requested in the request for quote and sends results

to the OEM. The test results often facilitate system diagnostic evaluation to identify marginal

performance of printed-circuit assemblies.

Select Winning Bid: The OEM reviews quotes received against schedule, cost, and quality

requirements and selects a winning bid or several bids. The bid data are used to create a purchase

contract.

Ship Order and PDP: The OEM sends the order package to the EMS.

Ship Part Specification: A specification provided by the OEM documents the special process to be

applied to procured parts prior to installation on the board. This specification (sometimes called a

critical-item specification) details process such as forming, plating, testing, and burn-in.

Ship Request for Quote (RFQ): The OEM reviews procurement request and evaluates capability of

potential EMS contractors, and send the RFQ to appropriate EMSs. Alternatively, the OEM posts the

RFQ somewhere and notifies the EMSs. For an open bid the OEM publishes the RFQ in an

appropriate notification journal. The RFQ includes the “bid PDP” that consists of a top-assembly

drawing (or image) and the components to be assembled onto an identified version of the printed-circuit

assembly. The printed-circuit-assembly information supplied includes the non-detailed items noted in the

Conclusion section of [1], including board outline, overall dimensions, number of layers, solder mask

type, hole count, smallest hole size, minimum trace width and spacing, and finish plating.

Note: the printed-circuit-assembly CAD and the photo-plot data are not generally supplied to obtain the printedcircuit-assembly bid.

Board-Assembly Flow

Chart 2: To, within, and from the EMS.

Printed-Circuit Assembly: Complete all assembly and final preparation operations on the board.

Assemble Part-Buy Order: Accumulate the information required to procure the bare board and the

circuit components from the product-configuration function.

Extract Net List: The net list consists of the name of each unique signal in the circuits, together with

each pin and the pin-reference designator. For some net-list uses, the X and Y location of the pin is

added to the list.

Extract PCB: Data needed to process each layer of the board is extracted from the design file, or its

neutral representation, as required to create the layer tooling or photo masters.

Extract Printed-Circuit-Assembly Input/Output Signals: The OEM lists signals that are accessible

through edge connectors or test points together with the associated pin number and location. This list is

required for both the test adapter and the generation of the test program. To prepare for any functional

testing when called for in the purchase order, the EMS obtains the list of signals and the connector

pin(s) or test point(s) associated with each signal.
15

Extract Reference Designators and Locations: To complete either manufacturability analysis, the

EMS obtains a list of components, identified by their reference designators, and the component location

and orientation.

Extract Test-fixture Data: The information needed to support functional testing is extracted from the

CAD file. These data include the names and connector or test-point locations of signals that participate

in the testing. The complete data set, however, usually includes the initialization values of digital strings

for each signal, the test vectors for each input signal, and the output vectors or parameters for output

signals.

Functional Test: A functional test, when required by the OEM, simulates the actual behavior of the

printed-circuit assembly. Power is applied to the printed-circuit assembly, the simulated inputs are

applied, and the output responses are measured. Testing may involve signals which are analog, digital,

or both.

Kit Parts: The discrete parts from a storeroom must be kitted and formed by the EMS. A kit contains

all of the parts to be assembled with one bare board to produce the completed printed-circuit assembly.

A parts-preparation service may form and kit the parts in printed-circuit-assembly-sized lots. Exact

method of kitting depends upon parameters such as traceability requirements, the assembly equipment

present, and the number of assemblies being produced.

Printed-Circuit-Assembly CAD Data: The OEM develops the computer-aided design (CAD) file

and transmits a subset to the EMS on award of an order for a printed-circuit assembly. This subset file

includes the product model for the printed-circuit-assembly, the reference designators and locations, net

list, printed-circuit-assembly input/output signals, and functional-test requirements

Prepare Bid: The EMS prepares a response to the procurement request (RFQ) from the OEM.

Prepare to Ship: A process step in which the PCAs are packaged as required for shipment.

Produce Machine-Insertion Files: These are the robotic-instruction sets for placing parts into the

printed-circuit assembly.

Receive Board or Panel*: The EMS receives the bare boards already cut from panels or still in panel

form from the bare-board supplier. Also transmitted is some form of documentation that identifies the

contents, order and order number or contract number.

*Note: Control of the product shifts to the EMS, however the product may not be modified without permission of the

OEM.

Receive Change Request*: The EMS receives a change request from the bare-board supplier.

*Note: Control of the request remains with the supplier, however the EMS will forward the request information to the

OEM. Depending on the business arrangement, the request could go directly to the OEM or to both the EMS and the

OEM, but either way the information transmitted is similar.
16

Receive Order/Version: Receive Approved Vendor List (AVL)*: Some or all of the parts are

supplier-specified by the OEM. The AVL indicates those manufacturer/vendors approved by the OEM

to supply parts listed on the BOM.

*Note: Control of the AVL remains with the OEM, and upon issuing the purchase order the AVL may not be modified

without permission of the EMS.

Receive Order/Version: Receive Parts*: The EMS will receive parts from a discrete-parts supplier

or a parts-preparation service. The discrete parts will be in lots independent of the needs of the

assembly on order and must be kitted and formed by the EMS. The parts-preparation service may form

and kit the parts in large printed-circuit-assembly-sized lots.

*Note: Control of the parts shift to the EMS.

Receive Order/Version: Receive Product Data Package (PDP)*: The EMS receives the PDP,

which includes the top assembly drawing, the bill of materials (BOM), artwork information for all board

layers, and information needed for parts mounting/insertion. This list indicates, for each specified part,

the product identification (drawing number), the reference designator for the part, and the supplier

identification.

*Note: Control of the PDP remains with the OEM, and upon issuing the purchase order the PDP may not be modified

without permission of the EMS.

Receive Panelization Coordinates*: The EMS receives from the bare-board supplier the locations

of the assembly layouts on the standard-sized panels so that the EMS can plan the parts-placement

function.

*Note: Control of the panel coordinates remains with the board supplier, however the coordinates may not be

modified without advising the EMS.

Receive RFQ*: The EMS receives the procurement request from the OEM.

*Note: Control of the request remains with the OEM, however the request may not be modified without permission of

the EMS.

Receive Test Fixture: The EMS receives the fixture for the printed-circuit assembly that is to be used

to connect the printed-circuit assembly (also known as unit under test) to a testing system during

functional testing.

Receive stencil: The EMS receives the stencil for the board notations from the stencil supplier.

Run Functional Test: Where required on the Order, the completed PWA is tested to verify that the

functionality requirements are met.

Run Manufacturability Analysis: This test verifies that the conductive patterns that will be produced

by the photo tool will correctly implement the net list. The test compares the photo-plotter, inputgeometry data with the net list. This test will identify, for example, nets shorted due to a logotype or part

identification rendered in metalization touching more than one active trace.

Ship As-Built Data: The EMS transmits the data about what was actually installed on the printedcircuit assembly to the OEM.
17

Ship Change Request: During any stage of manufacture suppliers may identify different parts or

processes that can either save costs or that are necessary for completion of the manufacturing. Suppliers

forward desired changes to the OEM for evaluation by its engineering function.

Ship Manufacturability Report: The EMS distills information from its control processes, such as

statistical-process control information and supplies it to the OEM. This information is often useful when

planning product or design enhancements and for product maintenance. This report also could contain

warranty-tracking data, and the as-built BOM.

Ship Parts Order: The EMS will order parts from a discrete-parts supplier or a parts-preparation

service. The discrete parts will be in lots independent of the needs of the assembly on order and must be

kitted and formed by the EMS. A kit contains all of the parts to be assembled with one bare board to

produce the completed printed-circuit assembly. There may also be an order to the parts-preparation

service to form and kit the parts in printed-circuit-assembly-sized lots.

Ship Printed-Circuit-Board Order/Version: The EMS sends the package that orders the printedcircuit-board to the bare-board supplier. The package contains that part of the product data necessary

to fabricate the board layers and test the boards such as the net list and the artwork-defining data.

Ship Printed-Circuit Assembly: The final printed-circuit-assembly product is forwarded to the

shipper, and is accompanied by the shipping tracker. An invoice accompanies the product or may, by

agreement, be forwarded independent of the product. When the OEM receives the printed-circuit

assembly, the invoice is forwarded to the accounts-payable function, and the supply-chain process is

ended.

Ship Printed-Circuit-Assembly Bid: The EMS transmits cost, quantity, schedule and other requested

information to the OEM.

Ship Stencil Order: The EMS orders the stencil for the board notations from the stencil supplier.

Ship Test-fixture Order: The EMS sends an order to the shop selected to fabricate the test fixtures(s)

for the printed-circuit assembly as required for any functional testing specified in the subject printedcircuit assembly order. Included with the test-fixture order are the data specifying the printed-circuitassembly signals subject to test, together with their access locations on the assembly. The characteristics

of these signals are also specified, such as input/output/bi-directional, digital/analog, and min/max

voltage or current.

Ship Test Results: The EMS performs tests requested in the request for quote and sends results to

the OEM. The test results often facilitate system diagnostic evaluation to identify marginal performance

of printed-circuit assemblies.

Surface-Mount Technology (SMT): Components that mount to the surface of a printed-circuit

assembly rather than into holes drilled (called through holes) through the board.
18

Board Procurement and ECO Flow

Chart 3: To, within, and from the bare-board supplier

Add coupon: A decision is made whether to add a test coupon to the panel. When required either for

internal quality control or for customer assurance as stated in the order or contract, the coupon can be

removed following panel processing to determine if all processes resulted in desired product quality.

Apply Solder Mask: A process step that covers areas of the board that will not be subsequently

solder-coated.

Artwork Data OK: The data needed to produce the photo tool for each layer is checked for errors

such as traces not entirely within the bounds of the board, and the existence of correct location of

tooling holes (fiducials).

Board-Fabrication Processes: These processes are internal to the fabrication of the bare board.

Included are: produce photo-tool data, apply photo-resist, expose and etch, assemble stack-up, press

and cure panel, drill panel, clean and plate panel, apply solder mask, solder-coat panel, silk-screen

panel, and rout the bare board--full, with tabs, or no.

Drill Panel: A process step in which all holes are drilled (or punched or laser-burned) in the board.

Extract Artwork by Layer: Photo plotter input data is extracted and formatted for the plotting system;

one data set for each copper layer to be processed for the complete board/panel.

Extract Drill Data: The location and size is extracted for each hole to be drilled in the processed

board/panel.

Extract Printed-Circuit-Assembly-Edge Data: The perimeter coordinates are extracted which will

be used to cut, or partially cut, the board from the panel in which it has been fabricated.

Extract Silk-Screen Data: Imaging data is extracted which is to be used to produce a screen which

allows ink to be deposited for lettering and other marking of the surface of the board/panel.

Extract Solder-Mask Data: Photo plotter input data is extracted and formatted for plotting the photo

tool used to produce a film on the board/panel covering areas where solder is not desired.

Layer X Phototool Data: The data required to produce the specified layer is passed into the boardfabrication process.

Panelize PCBs: Coordinates are defined for the location of one or more printed-circuit boards to be

created on a panel which is of a size specified by the fabricator or by his agreement with the contracting

EMS.

Receive B-Stage Material: The uncured or partially cured sheet material which is used to insulate

and bond two or more details (double sided processed boards) is received for processing into product.
19

Receive Printed-Circuit-Assembly Order*: The printed-circuit-assembly-purchase order, together

with the product-definition package (PDP), constitute the authorization to schedule production of the

product as defined by the PDP.

*Note: Control of the order remains with the OEM, however subsequent modifications to the order, or the PDP may

be the basis for a request to re-negotiate the order.

Receive Two-Sided-Board Stock: The copper clad material together with the material/lot

specification is received for processing into product.

Rout PWB (or PCA): As specified on the board order, the panel is either sent to be routed (cut from

the panel) or the process is skipped and may be accomplished by the EMS at a later stage in

completing the PCAs.

Ship Boards: Ship completed boards that have been cut from their standard panels.

Ship Change Request: During any stage of manufacture, different parts or processes may be identified

that can either save costs or are necessary for completion of the manufacturing. When identified, and

when determined to necessitate a change to the design version, the changes are forwarded to the

engineering function for evaluation. In this case the request information flows from the bare-board

supplier to the EMS for consideration.

Ship Fabrication Capability/Tradeoff Data: When the printed-circuit-assembly fabricator is known

by the OEM at the time of design or re-design, the OEM benefits from learning the assembly

fabricator’s capability tradeoffs and their cost deltas. The shipping of this information becomes more

critical as the printed-circuit-assembly-production run becomes longer and the fabrication rules become

tighter. The information may include tolerance capabilities for particular trace shapes that function as

passive electronic components (i.e., resistors, capacitors, and inductors).

Ship Panelization Coordinates: The bare-board supplier transmits to the EMS the locations of the

board layouts on the standard-sized panels so that the parts-placement function can be planned.

Ship Panels: Ship completed boards that have not been cut from their panels.

Silk Screen Panel: Ink is applied to the panel using a silk screen prepared as a mask, resulting in the

labels identifying parts, part number, test points, and other information.

Parts-Supply, Preparation, Stencil, and Test-Fixture Flow

Chart 4: To, within, and from the discrete-parts supplier, the parts-preparation supplier, and the

test-fixture supplier
20

Note: Some or all of this function may be performed within the EMS activity. We have flow modeled the completely

out-sourced case as a means of identifying messages which could occur formally in the out-sourced situation and

would otherwise likely occur in some form. Additional parts-related functions occur within the EMS such as “Place in

Inventory” or “Deliver to Production Line” but which may not influence the supply-chain messages.

Burn-in: A part preparation process in which the parts are subjected to specified operating conditions

and assures that early-failure parts are eliminated.

Electrical Test: Verify that electrical preparations have been successfully completed.

Extract Electrical Preparation: Extract from the part-specification requirements for making electrical

modifications to the parts.

Extract Mechanical Preparation: The part supplier extracts requirements for making mechanical

modifications to the parts from the part-specification.

Fit Test: The part supplier mechanically checks part size when required by the part specification.

Laser Trimming: Generally applicable to deposited resistors, material is eroded away until the value

matches the part-specification requirement.

Lead Form: Part leads are bent to customer specifications.

Mechanical Inspection: Usually a visual check, the part is given a non-functional inspection.

Package to Customer Specifications: This could be for mounting into a robot-feed system or into

assembly-lot kits.

Plating: The parts preparer plates or coats part leads, as needed, for soldering into the printed-circuit

assembly.

Presetting: The parts preparer sets the parts that are adjustable, to comply with the parts-specification

requirements.

Program ROM: The parts preparer programs read-only-memory devices to tables of values given in

the part specification.

Receive Parts: This item applies if the parts-preparation enterprise is a different enterprise from the

EMS.

Receive Parts Order: The part supplier receives the order transmitted by the EMS.

Receive Part Specification: Often called a “Critical-Item Specification,” this specification both details

the preparation of procured parts and, when required, specifies the new part number for part reidentification.
21

Receive Stencil Order: The stencil supplier receives the order for the stencil for the board notations

from the EMS.

Receive Test-Fixture Order: The shop selected to fabricate the test fixtures(s) for the printed-circuit

assembly receives an order from the EMS for test fixtures required for any functional testing specified in

the subject printed-circuit assembly. Included with the test-fixture order are the data specifying the

printed-circuit assembly signals subject to test, together with their access locations on the board. The

characteristics of these signals are also specified, such as input/output/bi-directional, digital/analog, and

min/max voltage or current.

Re-Identify: The parts specification may require the parts to receive a new identifier after the

preparation phase is complete.

Ship Parts and Invoice: This item applies if this enterprise is the parts-supply enterprise to the EMS.

Parts may or may not be electrically or mechanically prepared before shipment.

Ship Parts Certification: When required by the part specification, the part supplier prepares a

certification is for the part that is shipped to the OEM. Among the items usually required are materialsquality statements, reliability, country of origin, EMF hardness.

Ship Stencil: The stencil supplier ships the stencil to the EMS.

Ship Test Fixture: The test-fixture supplier ships the stencil to the EMS.

Track Identification: The number assigned to a prepared part is associated with the part traveler.

Trimming: The parts preparer cuts the leads to length for mounting.
22
23
24
25
26

Change order New PCA

3. Receive AVL

OEM PCA assembler (BA) Bare-board supplier (BB)

6. Ship RFQ & bid PDP 6. Receive RFQ & bid PDP*

Develop ECO 7. Receive PCA bid 7. Ship PCA bid

11. Receive PCB order--

 design file**

11. Ship PCB order--

 design file*

13. Receive manufacturability report 13. Ship manufacturability report

12. Receive test results 12. Ship test results

8. Receive PCA 8. Ship PCA

S:jnell\icm\swimlanes.ppt 18-Oct-00

* Note: 15. Procuring PDP =

•BOM

•Net list

•Top-assembly drawing

•Design file

2. Receive boards 2. Ship boards

1. Receive panels 1. Ship panels

Discrete-parts supplier (DS), 

Parts-preparation supplier (PP), 

Test-fixture supplier (TA), or Stencil 

supplier (SS) 

5. Receive panelization coord . 5. Ship panelization coord.

4. Receive change request 4. Ship change request 9. Receive change request 9. Ship change request

15. Ship order & Procuring PDP* 15. Receive order & Procuring PDP*

Start

End

* Note: 11. PCB design file =

•Net list

•Artwork

3. Ship AVL

10. Receive parts order

14. Receive parts specification

16. Ship parts certification

17. Ship parts & invoice

19. Receive test-fixture order

20. Ship test fixture

21. Receive stencil order

22. Ship Stencil

17. Receive parts & invoice

14. Ship parts specification

16. Receive parts certification

18. Receive fabrication capability & tradeoff data 18. Ship fabrication capability & tradeoff data

Chart 5: Transaction-Occurrence Model

20. Receive text-fixture

10. Ship parts order

21.Ship stencil order 

19. Ship test fixture order

22.Receive stencil

23. Receive as-built data 23. Ship as-built data

* Note: 6. Bid PDP =

•Parts count

•Overall dimensions

•Board type and details summary