Analysis of InGaAs/InAlAs Optoelectronic Mixers for Fuze 

and LADAR

by Neal K. Bambha, Justin R. Bickford, 

Stephen Drew, and Nuri W. Emanetoglu

ARL-TR-5071 March 2010

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Army Research Laboratory

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ARL-TR-5071 March 2010

Analysis of InGaAs/InAlAs Optoelectronic Mixers for Fuze 

and LADAR

Neal K. Bambha, Justin R. Bickford, 

Stephen Drew, and Nuri W. Emanetoglu

Sensors and Electron Devices Directorate, ARL

Approved for public release; distribution unlimited. 
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Analysis of InGaAs/InAlAs Optoelectronic Mixers for Fuze and LADAR

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Neal K. Bambha, Justin R. Bickford, Stephen Drew, and Nuri W. Emanetgolua

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14. ABSTRACT

We are developing a symmetric gain optoelectronic mixer for chirped-FM laser detection and ranging systems (LADAR) 

operating in the 1.55 μm wavelength range. Signal processing of a chirped-FM LADAR system is simplified if the 

photodetector in the receiver is used as an optoelectronic mixer (OEM). Adding gain to the optoelectronic mixer allows a 

reduction of the following transimpedance amplifier’s gain, increasing bandwidth and improving the system’s noise 

performance. The symmetric gain optoelectronic mixer is based on a symmetric heterojunction phototransistor. The base layer 

is indium gallium arsenide (In0.53Ga0.47As), and the emitter/collector layer is In0.48Al0.52As. Two-dimensional simulations of the 

devices were carried out to analyze device performance. Two sample heterostructures were grown using molecular beam 

epitaxy. We are currently in the prototype development stage. Simulation results and preliminary results from the initial batch 

of devices are presented. These symmetric gain optoelectronic mixer devices can lead to a miniaturized LADAR-on-chip 

system. Such a system will have many military and civilian applications, such as range finding, terrain mapping, 

reconnaissance, and face recognition.

15. SUBJECT TERMS

LADAR, FUZE, photodetector

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Neal K. Bambha

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iii

Contents

List of Figures iv

List of Tables iv

Acknowledgments v

1. Introduction 1

2. Simulation Study and Device Design 3

3. Material Growth and Device Fabridcation 7

4. Experimental Results 8

5. Conclusions 9

6. References 10

Symbols, Abbreviations, and Acronyms 12

Distribution List 13
iv

List of Figures

Figure 1. Schematic structure of basic symmetric gain optoelectronic mixer................................2

Figure 2. DC responsivity of a sample OEM device, simulated with SimWindows.......................3

Figure 3. Predicted mixing responsivity vs. LO voltage for the device of figure 2.........................4

Figure 4. Vertical structure of the two samples selected for material growth and device 

fabrication. .................................................................................................................................4

Figure 5. Current density distribution in a device with the Sample 1 layer structure......................5

Figure 6. Simulated I-V characteristics of an SG-0EM device on sample 1, using TCADSentaurus....................................................................................................................................6

Figure 8. Comparison of I-V characteristics for an ‘ideal’ 1D SG-OEM device and an 

‘actual’ 2D device showing the effect of the bottom contact placements on SG-OEM 

device performance....................................................................................................................7

Figure 9. Top-view photograph of a prototype symmetric gain optoelectronic mixer....................7

Figure 10. I-V curves for top- (red) and back-side (blue) illumination devices with r = 9 μm. .....8

List of Tables

Table 1. Simulated device parameters.............................................................................................5
v

Acknowledgments

We acknowledge Paul H. Shen and Wayne Chang for discussions regarding device design and 

development, and Stefan Svenson for growing the heterostructure samples. This research was 

partially funded by the U.S. Army Research Office/Laboratory (ARL) through a Scientific and 

Technical Services Agreement issued by Battelle Chapel Hill Operations, TCN 07-058 under 

contract W911NF-07-D-0001. 
vi

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1

1. Introduction

The U.S. Army Research Laboratory (ARL) has been developing chirped-FM laser detection and 

ranging (LADAR) systems for applications such as reconnaissance, terrain mapping, force protection, 

facial recognition, robotic navigation, and weapons fuzing. Signal processing of a chirped-FM 

LADAR system is simplified if the photodetector in the receiver is used as an optoelectronic mixer 

(OEM) [Ruff, et al. 2000]. A symmetric I-V characteristic photodetector can be used as an OEM. This 

allows the OEM to be driven directly with the local oscillator (LO) signal, without a direct current 

(DC) bias. Sensitivity to background light is reduced, as the response from background light averages 

to zero. An additional 3 dB signal processing gain is also obtained. The OEM output is the low 

frequency difference signal—several orders of magnitude lower than the LO signal. Therefore, the gain 

of the transimpedance amplifier (TZA) following the photodetector can be increased, improving 

LADAR range. The metal-semiconductor-metal (MSM) Schottky detector is such a symmetric device. 

ARL has previously demonstrated chirped FM LADAR systems with gallium arsenide (GaAs) and 

indium gallium arsenide (InGaAs) MSM OEMs for operation at the 800 nm [Ruff, et al. 2000, Shen et 

al. 2002] and 1550 nm [Shen, et al. 2003, Shen et al. 2004] wavelengths.

A symmetric photodetector with gain would improve overall system performance, while preserving the 

advantages offered by MSM OEM devices. An OEM with gain would allow the gain of the following 

transimpedance amplifier to be reduced, increasing the TZA frequency bandwidth and improving 

overall system performance. Such a device can be based on the heterojunction phototransistor (HPT) 

or the modulated barrier diode (MBD), also known as a Camel diode.

The basic HPT is a two terminal device, with the emitter made of a semiconductor that has a wider 

bandgap than the base and collector regions. A number of modifications to the basic HPT structure 

have been investigated to improve performance. A base bias can be provided, either optically or by an 

electrical contact [Chandrasekhar, et al. 1991]. The base composition can be graded to establish an 

electric field, which enhances electron transport [Capasso, et al. 1983, Thuret, et al. 1999].

Improvements in material growth, device design, and fabrication techniques have increased the 

maximum bandwidth of HPTs to the tens of GHz range [Choi, et al. 2005, Polleux, et al. 2004]. HPT 

responsivity typically increases with increasing optical power. This has been attributed to 

recombination at the base-emitter heterojunction. It is desirable to have gain independent from the 

optical power, or have larger gain at lower optical power levels. One approach to improve the gain 

dependence on optical power is to adjust the doping profile of the emitter and base layers of indium 

phosphide (InP) emitter/InGaAs base HPTs [Lue, et al. 1991]. By reducing the emitter doping in a thin 

layer at the emitter-base junction, the quantum well trapping of the electrons at this interface was 

reduced. The recombination currents were thus reduced, and the ideality factor of the transistor

improved, leading to a flattening of the gain versus incident power characteristics. HPTs have been 

demonstrated for optoelectronic mixing applications, where the LO signal was provided electrically 

[Choi, et al. 2005, Liu, et al. 1997] or optically [Van de Casteele, et al., 1996].
2

The MBD, also known as the Camel diode, is a non-Schottky majority carrier diode in which the 

carrier transport is controlled by a potential barrier in the bulk of the semiconductor. The application of 

MBDs as photodetectors was first demonstrated by A.Y. Cho and co-workers [Chen, et al. 1981, Chen 

1981]. The gain of the MBD is due to the hole trapping at the heterostructure interface. As holes 

accumulate in this quantum well, the barrier height will be lowered, resulting in an increased electron 

current, thus providing gain. As a majority carrier device, the MBD has fast intrinsic response [Chen, 

et al. 1981, Bethea, et al. 1982]. In contrast with the HPT, the MBD device has higher responsivity at 

lower optical power levels. The MBD has been used in a front-end photoreceiver, integrated with an 

FET [Li and Bhattacharya, 1989], and a monolithically integrated phototransceiver, in which it was 

integrated with an LED [Qasaimeh, et al. 2000]. In the first case, the MBD and FET shared a common 

structure, and the circuit used the MBD’s gain and response speed. In the second case, the MBD’s 

increasing gain with lower optical power was used to improve optical transceiver performance.

A symmetric gain OEM (SG-OEM) is being investigated in this work, for chirped-AM LADAR 

applications. The device is based on a symmetric heterostructure, as shown in figure 1. The targeted 

operating wavelength is 1.55 μm. The emitter/collector is In0.52Al0.48As, and the base is In0.53Ga0.47As, 

both of which are lattice matched to the InP substrate. Through proper design, particularly of the 

In0.52Al0.48As E/C layers, the device can have larger gain at lower optical power levels. Initial 

simulation studies at ARL used the one-dimensional SimWindows program. Two- and threedimensional device simulations, using the Synopsis TCAD Sentaurus suite, are being carried out at the 

University of Maine to design OEM with suitable optical gain and frequency bandwidth. Two 

symmetric gain OEM heterostructures were grown at ARL using molecular beam epitaxy. Sample 1 

has a base width of 800 nm and sample 2’s width is 300 nm. Both samples nominally have the same 

base doping of 2.5x1016 cm–3. Prototype devices were fabricated at the University of Maine, in 

collaboration with ARL. Device diameters range from 18 μm to 30 μm. 

N-InAlAs emitter/ collector

p-InGaAs base

N-InAlAs emitter/ collector

InP

n+-InGaAs contact layer

SI InP substrate

n+-InGaAs contact layer

Figure 1. Schematic structure of basic symmetric 

gain optoelectronic mixer.
3

2. Simulation Study and Device Design

The initial one-dimensional device simulation study was done using the program SimWindows 

(copyright: David W. Winston). Both symmetric HPTs and symmetric MBDs were investigated as 

candidates for the OEM. The effects of the layer thicknesses and doping densities were investigated for 

the two types of devices, including positional variation of the doping densities. The optimum for both 

types of devices converged to similar structures. The symmetric HPT based structure was chosen for 

the symmetric gain OEM. 

Two parameters need to be balanced in designing the SG-OEM. First, the responsivity needs to be 

highly symmetric, with as large a value as possible to make the device a practical alternative to the 

existing MSM-OEMs. Second, the device should turn on at low voltages to avoid large power 

dissipation. These two requirements place contradictory constraints on the device design, resulting in a 

trade off between gain and turn-on voltage, and need to be optimized for specific applications.

The SG-OEM can be designed with a very symmetric responsivity, and the “turn on” voltage can be 

reduced to below 0.1 V, significantly reducing the voltage swing range for the device. The symmetric 

OEM behaves similarly to a MBD, in that the gain increases with decreasing optical power. This 

behavior is shown in figure 2, which presents the simulated DC responsivity curves of a sample device 

for incident optical powers ranging from 1 μW/cm2 to 1 mW/cm2

. The device has a base thickness of 

0.2 μm and doping of 1017 cm–3

, while the InAlAs layer doping is 4x1016 cm–3.

Figure 2. DC responsivity of a sample OEM device, simulated 

with SimWindows.
4

Figure 3 presents the calculated mixing efficiency of this device as a function of the LO voltage for the 

same optical power levels as figure 2. The device would reach theoretical equivalence to the present 

InGaAs MSMs at LO voltage levels of 11–12 dBm. An order of magnitude improvement would be 

achieved for 15–16 dBm (1.6–2 V peak), and two orders of magnitude improvement would be 

obtained at LO voltage levels of 23–25 dBm (4.5–5.6 V peak).

Figure 3. Predicted mixing responsivity vs. LO voltage for 

the device of figure 2.

Two structures were selected for growth following the initial one-dimensional simulation study. The 

layer structures of the two samples, referred to as Sample 1 and Sample 2 here on, are shown in figure 

4. Detailed two-dimensional simulations were carried out to evaluate candidate device designs. 

Simulated I-V curves are presented later for the device design summarized in table 1.

300nm InAlAs buffer

InP substrate

(S-doped, conductive)

Sample 2

300nm InAlAs buffer

InP substrate

(Fe-doped, semi-insulating)

Sample 1

800nm p-InGaAs 2.5e16

390nm n-InAlAs 1e16

50nm n-InGaAs 1e19

50nm n-InAlAs 1e19

10nm n-InAlAs 5e18

10nm n-InAlAs 5e18

390nm n-InAlAs 1e16

50nm n-InAlAs 1e19

300nm n-InGaAs 1e19

300nm p-InGaAs 2.5e16

500nm n-InAlAs 4e16

50nm n-InAlAs 4e16

100nm n-InAlAs 5e17-1e18

300nm n-InAlAs 5e17-1e18

Figure 4. Vertical structure of the two samples selected for 

material growth and device fabrication.
5

Table 1. Simulated device parameters.

Size [μm]

Inner mesa

Outer mesa (bottom contact)

Top contact width

Top contact metal width

Bottom contact width 2

Bottom contact metal width 4

Bond pads 80 x 80

Two-dimensional simulations of the devices were carried out using the Synopsys TCAD Sentaurus 

software suite. The Sentaurus Structure editor was used to construct the two-dimensional device, and 

the simulations were performed using Sentaurus Device. 

Figure 5 shows the simulated current density profile in a two-dimensional cross section of a device on 

Sample 1. The insulation layers and metal stack are not shown for clarity. The active area diameter is 

16 μm, and the top contact diameter is 12 μm. The bottom contact is 2 μm wide.

Figure 5. Current density distribution in a device with the 

Sample 1 layer structure. 

Figures 6 and 7 compare the forward and reverse bias currents for devices on Sample 1 and 2, with the 

dimensions listed in table 1. There is a slight asymmetry in the I-V curves due to the asymmetry of the 

two structures, more pronounced in Sample 2. 
6

Figure 6. Simulated I-V characteristics of an SG-OEM device 

on sample 1, using TCAD-Sentaurus.

Figure 7. Simulated I-V characteristics of an SG-OEM 

device on sample 2, using TCAD-Sentaurus.

It should be noted that the two-dimensional simulations predict slightly different I-V characteristics for 

the devices in comparison with the original one-dimensional simulations. This is due to the series 

contact resistance between the bottom contact and the active region of the device. Figure 8 compares 

the results of a two-dimensional simulation (“actual device”) with the one-dimensional simulation 

(“ideal device”). The results indicate the actual device will have a lower current.
7

Figure 8. Comparison of I-V characteristics for an ‘ideal’ 1D 

SG-OEM device and an ‘actual’ 2D device showing 

the effect of the bottom contact placements on SG-OEM 

device performance

3. Material Growth and Device Fabrication

Mask design was done using Tanner L-Edit Pro 11. The die area is 1mm x 1mm. Each die has 32 

devices of six basic designs, including square and circular devices. There are two types of circular 

devices, with ring contacts for top illumination and with circular contacts for bottom illumination 

through the substrate. The active area ranges from 18 μm to 30 μm for the circular devices, and from 

10 μm to 16 μm for the square devices. Figure 9 shows a sample fabricated device, with a ring contact 

for top illumination.

Figure 9. Top-view photograph of a prototype symmetric 

gain optoelectronic mixer.
8

The two samples were grown at ARL using molecular beam epitaxy. The two mesa etches (top contact 

and device isolation) were done with an RIE-ICP etcher, using a chlorine/borontri-chloride (Cl2/BCl3)

gas mixture. A 190 nm silicon nitride (Si3N4) anti-reflection coating was deposited for the topillumination devices. This layer also served as an insulation layer for the bond pads. An ohmic contact 

metallization scheme of 50Å nickel (Ni) / 400Å germanium (Ge) / 1500Å gold (Au) was used.

4. Experimental Results

Current-voltage curves for two devices on sample 2 with r = 9 μm are shown in figure 10. ‘Dark’ 

refers to the dark current of the devices, while ‘light’ refers to the microscope light on the probe station 

being turned on during measurement. The voltage was applied to the top contact, and the bottom 

contact was grounded. There is a slight asymmetry in the I-V curves, due to the asymmetry in the 

structure of Sample 2 (figure 4).

Figure 10. I-V curves for top- (red) and back-side (blue) illumination 

devices with r = 9 μm.

Full characterization of the prototype devices is in progress at the time of the print. The full 

characterization will include DC responsivity, frequency response (AC responsivity), and mixing 

efficiency (mixing responsivity).
9

5. Conclusions

Symmetric gain optoelectronic mixers are promising for chirped-FM LADAR developed at ARL. 

Signal processing of a chirped-FM LADAR system is simplified if the photodetector in the receiver is 

used as an OEM. Adding gain to the OEM allows a reduction of the following transimpedance 

amplifier’s gain, increasing bandwidth, and improving the system’s noise performance. These 

symmetric gain OEM devices can lead to miniaturized LADAR-on-chip system. Such a system will 

have many military and civilian applications, such as range finding, terrain mapping, reconnaissance, 

and face recognition.
10

6. References

Ruff, W.; Bruno, J.; Kennerly, S.; Ritter, K.; Shen, P.; Stann, B.; Stead, M.; Sztankay, G.; Tobin, M. 

Self-mixing Detector Candidates for an FM/cw Ladar Architecture. Laser Radar Technology and 

Applications V, Proc. SPIE 2000, 4035, 152–62.

Shen, H.; Aliberti, K. Theoretical Snalysis of an Snisotropic Metal-semiconductor-metal 

Optoelectronic Mixer. J. Appl. Phys. 2002, 91 (6), 3880–90.

Shen, H.; Aliberti, K.; Stann, B.; Newman, P.; Mehandri, R.; Ren, F. Mixing Characteristics of InGaAs 

Metal-semiconductor-metal Photodetectors with Schottky Enhancement Layers. Appl. Phys. Lett.

June 2003, 82 (22), 3814–6.

Shen, H.; Aliberti, K.; Stann, B.; Newman, P. G.; Mehandru, R.; Ren, F. Analysis of InGaAs MetalSemiconductor-metal OE Mixers. Physics and Simulation of Optoelectronic Devices XII, Proc. 

SPIE 2004, 5349, 197–205.

Chandrasekhar, S.; Hoppe, M. K.; Dentai, A. G.; Joyner, C. H.; Qua, G. J. Demonstration of Enhanced 

Performance of an InP/InGaAs Heterojunction Phototransistor With a Base Terminal. IEEE Elec. 

Dev. Lett. October 1991, 12 (12), 550–552.

Capasso, F.; Tsang, W. T.; Bethea, C. G.; Hutchinson, A. L.; Levine, B. F. New Graded Band-gap 

Picosecond Phototransistor. Appl. Phys. Lett. January 1983, 42 (1), 93–95.

Thuret, J.; Gonzales, C.; Benchimol, J. L.; Riet, M.; Berdaguer, P. High-speed InP/InGaAs 

Heterojunction Phototransistor for Millimeter-wave Fibre Radio Communications. Proc. 11th Int. 

Conference on Indium Phosphide and Related Materials, 389–392 (1999) 

Choi, C. S.; Seo, J. H.; Choi, W. Y.; Kamitsuna, H.; Ida, M.; Kurishima, K. 60-GHz Bidirectional 

Radio-on-Fiber Links Based on InP–InGaAs HPT Optoelectronic Mixers. IEEE Photon. Tech. 

Lett. December 2005, 17 (12), 2721–3.

Polleux, J. L.; Paszkiewicz, L.; Billabert, A. L.; Salset, J.; Rumelhard, C. Optimization of InP–InGaAs 

HPT Gain: Design of an Opto-Microwave Monolithic Amplifier. IEEE Trans. Microwave Theory 

Tech. March 2004, 52 (3), 871–81.

Leu, L. Y.; Gardner, J. T.; Forrest, S. R. A High-gain High-bandwidth In0.53Ga0.47As/InP 

Heterojunction Phototransistor for Optical Communications. J. Applied Physics January 1991, 69

(2), 1052.

Liu, C. P.; Seeds, A. J.; Wake, D. Two-terminal Ridge-coupled InP/InGaAs Heterojunction 

Phototransistor Optoelectronic Mixer. IEEE Microwave and Guided Wave Lett. March 1997, 7

(3), 72–74.
11

Van de Casteele, J.; Vilcot, J. P.; Gouy, J. P.; Mollot, F.; Decoster, D. Electro-optical Mixing in an 

Edge-coupled GaInAs/InP Heterojunction Phototransistor. Elec. Lett. May 1996, 32 (11), 1030–2.

Chen, C. Y.; Cho, A. Y.; Garbinski, P. A.; Bethea, C. G.; Levine, B. F. Modulated Barrier Photodiode: 

A New Majority-carrier Photodetector. Appl. Phys. Lett. August 1991, 39 (4), 340-2.

Chen, C. Y. Theory of a Modulated Barrier Photodiode. Appl. Phys. Lett. December 1981, 39 (12), 

79–81.

Bethea, C. G.; Chen, C. Y.; Cho, A. Y.; Garbinski, P. A. Opto-electronic Picosecond Sampling System 

Utilizing a Modulated Barrier Photodiode. Appl. Phys. Lett. April 1982, 40 (7), 591–4.

Li, W. Q.; Bhattacharya, P. K. Integration of a Modulated Barrier Photodiode with a Doped-channel 

Quasi-MISFET. IEEE Elec. Dev. Lett. September 1989, 10 (9), 415–6.

Qasaimeh, O.; Zhou, W. D.; Bhattacharya, P.; Huffaker, D.; Deppe, D. G. Monolithically Integrated 

Low-Power Phototransceiver Incorporating InGaAs/GaAs Quantum-dot Microcavity LED and 

Modulated Barrier Photodiode. Electronics Lett. November 2000, 36 (23), 1955–7.
12

List of Symbols, Abbreviations, and Acronyms

ARL U.S. Army Research Laboratory

Au gold

Cl2/BCl3 chlorine/borontri-chloride

DC direct current

GaAs gallium arsenide

Ge germanium

HPT heterojunction phototransister

InGaAs indium gallium arsenide

InP indium phosphide

LADAR laser detection and ranging

LO local oscillator

MBD modulated barrier diode

MSM metal-semiconductor-metal

Ni nickel

OEM optoelectronic mixer

SG-OEM symmetric gain OEM

Si3N4 silicon nitride

TZA transimpedance ampelifier
13

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