NASA CASE NO.

PRINT FIG. __1_

NOEICE

i

The invention disclosed in this document resulted from research in aeronautical and

space activities performed under programs of the National Aeronautics and Space

Administration. The invention is owned by NASA and is, therefore, available for

licensing in accordance with the NASA Patent Licensing Regulation (14 Code of

Federal Regulations 1245.2).

To encourage commercial utilization of NASA-owned inventions, it is NASA policy to

grant licenses to commercial concerns. Although NASA encourages nonexclusive

licensing to promote competition and achieve the widest possible utilization, NASA

will provide the necessary incentive to the licensee to achieve early practical

application of the invention.

Address inquiries and all applications for license for this invention to NASA Patent

Counsel, Langley Research Center, Code 143, Hampton, Virginia 23681-0001.

Serial No." 08/282,849

07/28/94 LaRC

(NASA-Case-LAR-14936-1)

ELECTRICALLY CONDUCTING POLYIMIOE

FILM CONTAINING TIN COMPLEXES

Patent Application (NASA. Langley

Research Center) 21 p

N95-14113

Unc|as

G3/27 0029858
AWARDS ABSTRACT 

ELECTRICALLY CONDUCTING POLYlMlDE FILM CONTAINING TIN COMPLEXES 

NASA Case No.: LAR 14936-1 

A need exists in the aerospace industry for flexible, electrically conductive polymeric 

films and coatings having electrical conductivity in the semi-conducting range for use on 

large space structures to provide for relief from space-charging, and on advanced 

aircraft to provide for lightening strike resistance, in addition to other applications. For 

successful use, these films and coatings should exhibit no significant loss of electrical 

or mechanical properties during exposure to elevated temperatures, as well as severe 

weather and other pertinent use conditions. 

By the present invention, a polyimide film was prepared by incorporating a soluble tin 

complex into a polyamic acid solution and subsequently fabricating this solution as a 

film under careful processing conditions. The film was found to have a semi-conductive 

surface due to a chemically formed layer of SnO,. The SnO, is formed from the tin 

complex that has been solvated in the precursor polyamic acid, which during the 

thermal curing process migrates to the surface of the film and is chemically converted 

to Sn0,and intimately bound to the polyimide film. By carefully controlling the 

processing conditions, film surface conductivities of about 1.0 x lo-' to 3.0 x 1 0-3 ohm" 

have been obtained. 

The novelty of the present invention resides in the formation of a thermally-stable SnO, 

surfaced polyimide film having an electrical conductivity ranging from about 1.0 x 10-~t0 

3.0 x 10" ohm-' . In addition, a novel method was developed for preparing this film from 

a solution containing a polyamic acid and SnCI,(DMSO),. In addition to having surface 

conductivities of 1.0 x 10.' to 3.0 x 1 0*3 ohm-', the films had excellent thermal stability. 

Inventors: Anne K. St. Clair Stephen A. Ezzell 

Address: 17 Roberts Landing 241 6 Queens Drive 

Poquoson, VA 23662 Woodbury, MN 551 25 

Employer: NASA LaRC VPI & SU 
Inventors: Larry T. Taylor Harold G. Boston 

Address: 2101 Walnut Drive 81 4 30th Street 

Blacksburg, VA 24060 

Employer: 

Initial Evaluator: Darrel R. Tenney 

Serial No.: 08/282,849 

Filed: July 28, 1994 
LAR 14936-1 -1- PATENT APPLICATION

ELECTRICALLY CONDUCTING POLYIMIDE FILM

CONTAINING TIN COMPLEXES

10

Ori,qin of the Invention

The invention described herein was jointly made by an employee of

the United States Government and contract employees during the

performance of work under NASA Contract NAS1-19000 and is subject to the

provisions of Section 305 of the National Aeronautics and Space Act of 1958,

as amended Public Law 85-568 (72 Stat. 435; 42 USC 2457), and during the

performance of work under NASA Grant NAG-I-343. In accordance with

35 USC 202, the grantee elected not to retain title.

15

Back,qround of the Invention

1. Field of the Invention

20

This invention relates generally to conductive polymers. It relates

particularly to semi-conductive tin dioxide-surfaced polyimide films with

conductivities in the range of 1.0 x 102to 3.0 x 10 .3 ohm-1 and to the process

for their preparation.

.

m Description of the Related Art

25 A need exists in the aerospace industry for flexible, electrically

conductive polymeric films and coatings having electrical conductivities in the

semi-conducting range for use on large space structures to provide for relief

from space-charging, and on advanced aircraft to provide for lightning strike

resistance, and other applications. For successful use, these films and

30 coatings should exhibit no significant loss of electrical or mechanical
LAR 14936-1 -2- PATENT APPLICATION

properties during exposure to elevated temperatures, as well as severe

weather and other pertinent use conditions.

A procedure for making SnO2 coated polyimide films via incorporation

of tin compounds was reported (Taylor, L. T.; and St. Clair, A. K.: Polyimides,

5 vol. 2, edited by K. L. Mittal, Plenum Publishing Corp., New York, 1984, pp.

617-645. Ezzell, S. A.; and Taylor, L. T.: Macromolecules, vol. 17, 1984, pp.

1627-1632.). Synthesis of these materials involved preparation of a polyamic

acid from an aromatic diamine and dianhydride in a polar aprotic solvent,

addition of a soluble tin compound (Tin(ll) chloride dihydrate or dibutyltin

10 dichloride) to the polyamic acid, preparation of a film, and thermal curing to

300°C in air. This procedure produced materials with one conductive

surface, viz., the side facing up (air side) during thermal curing. These films

had an air-side surface conductivity of 4.5 x 10s ohm 1. Characterization of

these films revealed the conductive properties to be due to a layer of tin

15 dioxide formed on the surface of the film from migration and decomposition of

the tin compound during thermal treatment.

Other researchers in related work (Goldstein, R. D.; Brown, E. M.; and

Maldoon, L.C.: Trans. Nucl. Sci, NS-29, 1082, pp. 1621-1628) evaluated

polyimide film coated with sputtered indium tin oxide (ITO) for thermal control

20 coating applications. Electrical integrity of the ITO was monitored through

abrasion, adhesion, thermal cycling, flexure, and other relevant tests. Test

results varied depending on the thickness of the ITO layer, and its

subsequent conductivity. A sample measuring 6.04 x 10.3ohm-' exhibited

negligible conductivity change after abrasion and adhesion testing. However,

25 flexural testing of the film caused a 60% decrease in conductivity which

eliminated its usefulness. Thermal cycling determined the electrical

properties of the ITO coating to be stable to 125°C, above which large

decreases in electrical conductivity were observed.

It is a primary object of the present invention to produce polyimide

3 0 films having surface conductivities in the range of 1.0 x 10.2to 3.0 x 10.3
5

LAR 14936-1 -3- PATENT APPLICATION

ohm -1.

Another object of the present invention is to provide a controlled

process for the production of polyimide films having surface conductivities in

the range of 1.0 x 10-2to 3.0 x 10.3ohm 1.

Summary of the Invention

According to the present invention, the foregoing and additional

objects are attained by providing polyimide films made semi-conductive in a

10 desired conductivity range by incorporation of a soluble tin complex into a

polyamic acid solution and subsequent fabrication of this solution as a film

under careful processing conditions. This film has one semi-conductive

surface, due to a chemically formed layer of SnO2. The SnO2 is formed from

the tin complex that has been solvated in the precursor polyamic acid, which

15 during the thermal curing process migrates to the surface of the film and is

chemically converted to SnO 2 . This SnO2 layer is intimately bound to the

polyimide film and cannot be removed without destroying the semi-conductive

properties of the film. By careful control of processing conditions (solution

preparation, film preparation, thermal curing), film surface conductivities of

20 about 1.0 x 10.2to 3.0 x 10.3ohm _ have been obtained. See Table 1 below.

Film volume conductivities were not appreciably effected by tin complex

addition. The surface semi-conductive polyimide films according to the

present invention all possess excellent thermal stability, with polymer

decomposition temperatures greater than 500°C. See Table 2 below.

25 Incorporation of the tin complexes was therefore determined not to

substantially affect the excellent elevated temperature properties of the

polyimide.
Table 1. Conductivity values of PMDA/4,4'-ODA SnO2-surfaced films.

t-

.b,

£o

o3

ob

!

Film Sample

1

2

3

4

5

6

7

Molar Ratio

Additive :Polyimide

0.75:4.00

0.75:4.00

0.75:4.00

0.75:4.00

0.50:4.00

1.00:4.00

control

Film

Thickness

mil

1.4

1.3

1.3

1.9

1.5

0.9

Initial a

1.07

1.02

1.11

0.50

0.04

0.31

Film Mean Conductivity, ohm -1 (x10 -2)

% After Tape After

Deviatio n Test FlexbTest

10.0

3.2

2.8

15.0

31.0

4.2

non-conducting

1.07

1.02

1.12

0.50

<0.04 to 0.69

<0.04 to 0.76

<0.04

<0.04 to 0.39

.&

I

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a) Film still attached to glass plate

b) Film removed from glass plate

O

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LAR 14936-1 -5- PATENT APPLICATION

Table 2. Thermal properties of PMDA/4,4'-ODA SnO2-surfaced films.

Film

Sample

1

2

3

4

5

6

7

Molar Ratio

Additive :Polyimide Tg,°C PDT,°C I Found % Tin Theoretical _

0.75 : 4.00 412 534 5.20 5.42

0.75 : 4.00 --- 550 5.08 5.42

0.75 : 4.00 --- 525 5.21 5.42

0.75 : 4.00 --- 525 5.03 5.42

0.50:4.00 365 555 3.37 3.71

1.00 : 4.00 320 520 6.31 7.05

control 405 580 ..........
LAR 14936-1

Brief Description of the Drawin,qs

-6- PATENT APPLICATION

For a more complete understanding of the present invention, including

its primary objects and attending benefits, reference should be made to the

5 Description of the Preferred Embodiments, which is set forth in detail below.

This Detailed Description should be read together with the attached

drawings, wherein:

FIG. 1 is an equation representing the reaction route for preparing a

polyimide which has been rendered semi-conductive according to the present

10 invention. This polyimide results from the reaction of pyromellitic dianhydride

(PMDA) and 4,4'-oxydianiline ((ODA).

FIG. 2 is an equation representing the reaction route for preparing a

polyimide which is employed as a top coat or protective coating for protecting

the semi-conducting film surface according to the present invention. This

15 polyimide results from the reaction of 2,2-bis(3,4-

dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2-bis[4-(4-

aminophenoxy)phenyl]hexafluoropropane (4-BDAF).

20

Description of the Preferred Embodiments

The process for producing a semi-conductive, SnO2-surfaced

polyimide film according to the present invention involves the following steps:

(1) provision of the tin complex SnCI4 (DMSO)2, which is soluble in the

25 solvent of choice for a polyamic acid to be processed into the desired

polyimide film; (2) preparation of the polyamic acid solution; (3) addition of

the soluble tin complex with mixing until the solution is homogeneous; (4)

spreading of the solution as a film on a rigid substrate; (5) thermal treatment

to imidize the polymer, induce migration of tin complex to the film surface,

30 and convert the tin complex to inert, semi-conductive SnO2. Steps (2) and (3)
LAR 14936-1 -7- PATENT APPLICATION

may be interchanged; i.e., the tin complex may be first dissolved and

polymerization conducted in the presence of the complex.

If the SnO2-surfacedpolyimide is to be used as a free-standing film

(i.e., released from its rigid substrate, it is necessary to topcoat the

5 semi-conductive layer with another layer of polyimide, deposited as a film

from solution directly onto the SnO2. This is necessary to protect the

electrical integrity of SnO2,which otherwise can be altered via mechanical

flexing. Although the SnO2layer is tightly bound to the polyimide substrate,

it can be fractured easily because of its inherent brittleness, causing

10 electrical discontinuities. The method of the present invention for topcoating

the SnO2-surfacedpolyimide film alleviates this problem.

Solvents used in the synthesis of polyamic acids are polar, aprotic

solvents such as N,N-dimethylacetamide, N-methylpyrrolidone, and

2-dimethoxyethylether. It was found that the tin complex employed in this

15 invention was soluble in these solvents (required solubility is about 0.1 g in 1

mE).

The tin complex used in the specific examples which follow is

SnCI4(DMSO)2,wherein DMSO is dimethylsulfoxide. This complex is readily

converted to SnO2under conditions of polyimide preparation, namely

20 hydrolysis and elevated temperature.

Although the polyimide system derived from the preparation of

4,4'-ODA with PMDA (FIG. 1) has been rendered semi-conductive in the

examples herein, other polyimide systems can also be used. The thermal

preparation conditions listed have been optimized for the specific polymer

25 system, percent solids concentration, and film thicknesses given as

examples. Other thermal preparation conditions may be required as these

parameters are varied.

It should be noted that control polyimide films, i.e., PMDA/4,4'-ODA

containing no tin complex, were prepared and their thermal and electrical

30 properties evaluated. The polyimide films containing no tin complex are
5

LAR 14936-1 -8- PATENT APPLICATION

electrically nonconductive.

Although the system used as a top-coat in this invention was the

6FDA/4-BDAF polymer displayed in FIG. 2, any protective coating could be

used to protect the conducting film surface as long as it is flexible and has

good adhesion to the oxide surface layer.

SPECIFIC EXAMPLES

10

Example 1

Starting materials for the preparation of polyamic acid PMDA/4,4'-ODA

containing the tin complex SnCI4(DMSO)2 were as follows: 4,4'-oxydianiline

(ODA, FIG. 1) was obtained from commercial sources, recrystallized from an

ethanol and water mixture, and sublimed at 185°C with less than 1 torr

15 pressure. Pyromellitic dianhydride (PMDA, FIG. 1) was obtained from

commercial sources and sublimed at 215°C. SnCI4(DMSO)2 was prepared

from a procedure known to those of skill in the art. N,N-dimethylacetamide

(DMAc) was obtained from commercial sources in a greater than 99.5% pure

form and used as received.

2 0 Preparation of polyamic acid resin PMDA/4,4'-ODA containing the tin

complex SnCI4(DMSO)2 was performed at room temperature in a 300 mL

resin bottle, equipped with a mechanical stirrer, nitrogen (N2) inlet, and

bubbler. The resin kettle was first charged with 12.92 g (0.0645 moles)

4,4'-ODA and 100 mL DMAc, then stirred. After the ODA dissolved (about 30

25 minutes), 14.08 g (0.0645 moles) PMDA was added with 50 mL DMAC.

Stirring was maintained at 500 rpm, and a N2 atmosphere was maintained

throughout the reaction. Viscosity of the solution was noted to begin

increasing rapidly with the addition of PMDA. DMAc (41 mL) was added over

the next 30 minutes. The SnCI4(DMSO)2 (5.04 g, 0.0121 moles) was then

3 0 weighed into a pan, dissolved in DMAc, and added to the reactor with the
LAR 14936-1 -9- PATENT APPLICATION

remainder of the solvent; a total of 45 mL of DMAc was added at this time.

About 35 minutes later, the stirring speed was reduced to 250 rpm. Stirring of

the solution was allowed to continue overnight, for a total stirring time of

about sixteen hours. This example results in the preparation of a

5 PMDA/4,4'-ODA polyamic acid resin containing SnCI4(DMSO)2, which is

suitable for the preparation of polyimide films or coatings which possess a

semi-conductive surface according to the present invention. This resin

contains 10.9% solids in DMAc. A 0.75:4:00 stoichiometric ratio is present of

SnCI4(DMSO)2 to the polyamic acid repeating unit. Four preparations were

10 conducted under the previous conditions and produced solutions with

inherent viscosities of 1.75, 1.87, 1.65, and 1.42 dL/g. These variations were

ascribed to minute differences in monomer purity and reaction conditions

from batch to batch. All four preparations were useful for preparing

polyimides having a semi-conductive surface according to the present

15 invention.

Example 2

A PMDA/4,4'ODA polyamic acid resin prepared as described in

20 Example 1, having an inherent viscosity of 1.75 dL/g, was converted into a

film as follows: The resin was centrifuged for 30 minutes at 1200 rpm. A 16"

x 24" soda-lime glass plate was cleaned with scouring powder, rinsed

sequentially with water, cleaned with ethanolic potassium hydroxide, and

rinsed sequentially with water, acetone, ethanol, and finally allowed to dry.

25 The resin (52.6 g) was poured onto the glass plate. The solution was spread

as a film by pulling the plate under a 17" doctor blade which was set at a

blade gap of 28 mil. An electric motor was used to pull the plate at an even

speed. The film spreading procedure was performed in a chamber having a

relative humidity of 21%. Immediately after the film was spread, the plate

30 was removed from the chamber and placed in a forced air oven. The
LAR 14936-1 -10- PATENT APPLICATION

polyamic acid film was then cured to the polyimide by the following thermal

treatment:

20 minutes at 60°C

10 minutes at 80°C

5 60 minutes at 100°C

60 minutes at 200°C

60 minutes at 300°C

The film was left in the oven to cool to ambient temperature overnight.

The resulting material was a clear brownish film about 48 square

10 inches, with a thickness of 1.4 mil. The surface of the film was

semi-conductive, with a measured conductivity of 1.07 x 10.2ohm1. This

value is the average from 15 measurements taken across the surface of the

film. The under side of the film was nonconductive. The bulk of this film was

also determined to be nonconductive. Elemental analysis revealed that this

15 film contained 5.20% tin. Thermal analysis of this material determined its

softening temperature (Tg) to be 321°C. Its polymer decomposition

temperature (PDT) was determined to be 534°C (2.5°C/minute, heating in

air), indicating excellent thermal stability.

The film preparation method of this Example, when performed with a

20 solution prepared as described in Example 1, yields a brown polyimide film

which has one semi-conductive surface. The semi-conductive surface is the

side of the film which was exposed to air during thermal curing ("air side").

The surface conductivity of this semi-conductive surface was unaffected by

either the standard tape test (attaching and removing a piece of tape) or mild

25 abrasion. This indicated good adhesion of the surface conductive material to

the polyimide substrate.
LAR 14936-1

Example 3

-11- PATENT APPLICATION

The resin described in Example 1 was also used in this preparation.

First, the resin (which had been stored in a freezer) was allowed to warm for

5 30 minutes at room temperature. It was then centrifuged for 30 minutes at

1200 rpm. A film was then prepared from this resin, following the procedure

described in Example 2.

The resulting brown film had a light blue haze on its air side and was

about 48 square inches, with a film thickness of 1.3 mil. The air-side surface

10 conductivity of this material was 1.0 2 x 102 ohm 1 (averaged from

measurements of 15 areas). Surface conductivity was unaffected by the tape

test. The film was determined to contain 5.08% tin.

15

Example 4

A resin prepared as in Example 1 having an inherent viscosity of 1.87

dL/g was used for film preparation in this example. The resin was allowed to

warm to room temperature for one hour, then centrifuged for 30 minutes at

1200 rpm. The resin (35.9 g) was used to make a film closely following the

20 procedure of Example 2.

The resulting brown film was about 36 square inches in size and 1.3

mil thick. The air side conductivity was measured to be 1.11 x 10.2ohm 1

(averaged from 11 areas). Surface conductivity was unaffected by the tape

test, demonstrating good adhesion of the semi-conductive surface to the

25 polyimide film. The film contained 5.21% tin.

Example 5

3o A resin prepared as in Example 1 having an inherent viscosity of 1.42
LAR 14936-1 -12- PATENT APPLICATION

dL/g was used for film preparation in this Example. The resin was allowed to

warm at room temperature 1.2 hours then centrifuged for 30 minutes at 1200

rpm. The resin (45.9 g) was used to make a film under the conditions

described in Example 2.

5 The film produced was brown with a blue haze on part of the surface.

This material was about 25 square inches in size, and had a thickness of 1.9

mil. Air side surface conductivity was measured to be 4.97 x 10 -3 ohm 1

(averaged from 10 areas). In this particular preparation it was discovered

after-the-fact that a glass plate with uneven surface was used, causing

10 variances in film thickness, and correspondingly, somewhat larger relative

deviation in surface conductivity. This example indicated that some control of

surface conductivity is possible, by alteration of film thickness. Increasing

thickness in this Example (compared to Examples 3 and 4) allowed a material

of lower conductivity to be prepared. As in previous Examples, the glass side

15 and bulk of this film were determined to be nonconductive. This film

contained 5.03% tin.

Example 6

2 0 A PMDA/4,4'-ODA polyamic acid resin containing SnCI,(DMSO)2 was

prepared as in Example 1 except that 3.36 g SnCI4(DMSO)2 (0.0081 moles)

was used, yielding a preparation having a tin complex to polyamic acid

repeating unit of 0.50:4.00. This solution was prepared to demonstrate the

effect of tin complex concentration in the polyamic acid resin upon surface

25 conductivity of the subsequent SnO2-surfaced polyimide film.

Example 7

30

A PMDA/4,4'-ODA polyamic acid containing SnCI4(DMSO)2 was

prepared as in Example 1 except that 7.72 g of SnCI4(DMSO)2 (0.0161 moles)
LAR 14936-1 -13- PATENT APPLICATION

was used, yielding a preparation having a tin complex to polyamic acid repeat

unit of 1.00:4.00. This solution as prepared for the same reasons as

Example 6.

5 Example 8

10

The resin described in Example 6 was used to prepare a tin-containing

film following the procedure of Example 2. The resulting brown polyimide film

had an air side surface conductivity of 4.12 x 12 .4 ohm 1 (averaged from 12

areas). As in previous examples, this film exhibited no glass side or volume

conductivity. This example demonstrated alteration of surface conductivity of

the polyimide film is possible by lowering the concentration of SnCI,(DMSO)2.

15

20

25

Example 9

The resin described in Example 7 was used to prepare a tin-containing

film following the procedure of Example 2. The resulting brown film had a

non-homogeneous multicolored surface which could be wiped off fairly easily,

unlike films prepared in the previous examples. Surface conductivity of this

material (air side) was measured to be 3.10 x 10 -3 ohm 1 (averaged from 10

areas). This conductivity could be greatly effected by light rubbing or by the

tape test, unlike films of previous examples, indicating, in this instance, poor

adhesion of the SnO2 layer to the polyimide film substrate. This Example

indicates an optimum concentration of SnCI4(DMSO)2 is necessary to

produce an SnO2 surface on polyimide with good adhesion properties, and

conductivities in the ranges desired. The concentration of SnCI4(DMSO)2 in

this example was too high for good adhesion properties.

30
LAR 14936-1

Example 10

-14- PATENT APPLICATION

5

A PMDA/4,4'-ODA polyamic acid resin was prepared as described in

example 1, except in this preparation no SnCI4(DMSO)2 was added. This

resin was used to prepare a PMDA/4,4'-ODA polyimide film for reasons of

comparison.

Example 11

lo

15

Using the procedure of Example 2, a PMDA/4,4'-ODA polyimide film

was prepared from the resin of Example 10. This film contained no tin, and

was prepared for comparison. This clear yellow film exhibits a softening

temperature of 405°C, and a polymer decomposition temperature of 580°C.

The air side, glass side, and bulk of the film were all nonconductive.

Example 12

This example describes a method for protecting the SnO2 surface of

the polyimide films prepared according to the present invention. This method

20 is provided to preserve the semi-conductive properties of the SnO2 surface.

For example, after removing the polyimide film of Example 2 from the glass

plate, its surface conductivity was remeasured and found to have varied

between <4.5 x 10 .4 and 8.19 x 10 .3 ohm 1. This significant alteration in

surface conductivity is attributed to cracking of the brittle SnO2 surface layer

25 upon flexure of the polyimide film. Electrical discontinuity of the SnO2 surface

layer results, leading to higher measured conductivities for the film surface.

Coating of the SnO2 surface was performed to protect the integrity of

the SnO2 surface as follows: A film was prepared following the general

procedure of Example 2 and measured to have a surface conductivity of 6.75

30 x 10 -3 ohm 4. While this film remained on the glass plate, it was coated with a
LAR 14936-1 -15- PATENT APPLICATION

solution of a soluble polyimide (2,2-bis(3,4-dicarboxyphenyl)hexafluoropane

dianhydride/2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 8% w/w)

in chloroform (CHCI3) with a doctor blade at a 24 mil blade gap. After

top-coating, the film was left at ambient temperature for 45 minutes, then

5 heated at 100°C for one hour, to evaporate the CHCI3.

The resulting material was removed from the glass plate and its

conductivity measured. Removal of the film from the glass plate was seen to

have no effect on the conductivity of this coated film. The coated film was

then flexed at 180 ° several times in an effort to disrupt the continuity of the

10 SnO2 layer. The conductivity was essentially unchanged. Therefore it is

evident that coating the SnO2 surface with a polyimide layer as described in

this Example provides a more electrically stable and durable material, making

it more valuable for certain applications.

The present invention has been described in detail with respect to

15 certain preferred embodiments thereof. As is understood by those of skill in

the art, variations and modifications in this detail may be made without any

departure from the spirit and scope of the present invention, as defined in the

hereto-appended claims.
LAR 14936-1 PATENT APPLICATION

ELECTRICALLY CONDUCTING POLYIMIDE FILM

CONTAINING TIN COMPLEXES

Abstract of the Disclosure

5

Disclosed is a thermally-stable SnO2-surfaced polyimide film wherein

the electrical conductivity of the SnO2 surface is within the range of about

3.0 x 10 s to about 1 x 10 -2 ohmsl,. Also disclosed is a method of preparing

this film from a solution containing a polyamic acid and SnCI4 (DMSO)2.
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