# Patent

## Title
Recording material containing a layer of polymer particles and a

## Abstract

Step 3 is to partially harden the wanted photopolymer on the photomask. The partially polymerized photopolymer does not readily extrude from conductor traces and also improves the tenting of photopolymer over selected holes in the PWB. A two-minute exposure with the Colight "DMVL-HP" is used. Step 4; place the photomask over the coated or uncoated PWB off-contact and in register. Step 5; mate the wet photopolymer surface to the PWB substrate with the resilient blade. Step 6; expose the mated composite to partially harden on the PWB. Step 7; remove the photomask. Step 8; wash out the unhardened photopolymer with developer. Step 9; final cure.

## Background
## Claims

1. In the method of producing intermediate products used in printing on a substrate surface an insulation pattern formed by a polymer coating, the steps of disposing on an image bearing photographic film transparency a layer of liquid photopolymer with its outer surface exposed to air, exposing the layer with that amount of curing radiation passed through the film to partially expose the layer through its thickness and harden portions in a pattern corresponding to the image on the film and leaving the layer surface exposed to air in liquid polymer uncured state for contact with said substrate surface as an intermediate liquid polymer layer between the outercured polymer layer and the substrate.

2. The method defined in claim 1 including the step of adhering the uncured liquid polymer surface to the substrate.

3. The method defined in claim 2 including the step of adhering the uncured liquid polymer surface over a substrate surface in an air bubble free surface contact.

4. The method defined in claim 3 wherein the substrate surface is a printed wiring board with raised conductors formed thereon in a pattern.

5. A process of applying to a substrate and exposing a photohardenable material to obtain discrete areas of photohardened material on the substrate comprising the steps of: deformable and which is not present as a solid with said material applied in the amount necessary to form a layer in step (c); through the photomask whereby the surface of the photohardenable material which faces away from the photomask remains deformable; substrate to form a layer whereby the surface of photohardenable material which remains deformable faces the substrate by applying pressure to the flexible photomask and advancing the pressure between the photomask and substrate to form a registered preimaged laminate; and radiation through the photomask whereby bonded discrete areas of photohardened material are obtained on the substrate.

6. A process according to claim 5 wherein a low viscosity 100% reactive photohardenable liquid is applied to the substrate before step (c).

7. A process according to claim 5 wherein the substrate surface contains raised portions.

8. A process according to claim 5 wherein after step (d), the photomask is removed from the surface of the exposed photohardenable material and developer is applied to the surface of the photohardened material whereby unexposed unhardened discrete areas are removed.