1

Use Cases for the Management and 

Maintenance of Multi-Domain AP 210 

Component Models

Jamie Stori

SFM Technology, Inc. 

Urbana, Illinois 

Kevin Brady 

National Institute of Standards and Technology

Information Technology Laboratory

Thomas Thurman

Rockwell Collins, 

Cedar Rapids, Iowa 

NISTIR 7717
2

NISTIR 7717

Use Cases for the Management and 

Maintenance of Multi-Domain AP 210 

Component Models

Jamie Stori

SFM Technology, Inc. 

Urbana, Illinois 

Kevin Brady 

National Institute of Standards and Technology

Information Technology Laboratory

Thomas Thurman

Rockwell Collins, 

Cedar Rapids, Iowa 

U.S. Department of Commerce

Gary Locke, Secretary

National Institute of Standards and Technology 

Patrick D. Gallagher, Director

August 4, 2010
3

Contents

Use Cases for the Management and Maintenance of Multi-domain AP 210 Component Models. .............1

1. Introduction..........................................................................................................................................5

2. Scope ....................................................................................................................................................5

3. Domain Responsibilities for defining product data..............................................................................5

3.1 Electrical engineering responsibilities............................................................................ 6

3.2 Mechanical engineering.................................................................................................. 6

3.3 Materials and process engineering.................................................................................. 6

3.4 Component applications engineering.............................................................................. 6

4. Relevant AP 210 content......................................................................................................................7

4.1 AP 210 specific change management structures............................................................. 8

5. Use case scenarios................................................................................................................................9

5.1 Defining the schematic symbol..................................................................................... 11

5.2 Composing the part level model ................................................................................... 11

5.3 Defining the connector model...................................................................................... 16

5.4 Mapping the schematic symbol to part level model ..................................................... 16

5.5 Defining the physical shape model for mechanical design........................................... 17

5.6 Defining the mechanical engineering feature functions ............................................... 19

5.7 Defining the mechanical engineering package ............................................................. 20

5.8 Defining the material and process engineering footprint.............................................. 21

5.9 Defining the material and process engineering package............................................... 22

5.10 Component application engineering interaction ........................................................... 23

6. Future work ........................................................................................................................................24

7. Bibliography.......................................................................................................................................24
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List of figures

Figure 1 Component model elements.................................................................................3

Figure 2 Application Reference Model diagram from design management module showing the role of 

managed_design_object as the focal point for change tracking [Source: ISO/TS 10303-1661 Design 

management ......................................................................................................................................... 5

Figure 3 Component model interdependencies present challenging model management issues..............6

Figure 4 Schematic symbol association to functional model is accomplished through 

Presentation_set_assignment................................................................................................................ 7

Figure 5 A subset of the data in the AP 210 part level physical model ........................................................ 8

Figure 6 Illustration of typical structure needed for part-level multi-domain model.................................... 9

Figure 7 Decomposition of functional (netlist) model for part level model ............................................... 10

Figure 8 A subset of the data in the AP 210 connector model. Join terminals mate with some 

interconnecting materials in a design. [Source: ISO/TS 10303-1708 Packaged connector model]... 11

Figure 9 A subset of the data in the Package AO ....................................................................................... 12

Figure 10 Parametric properties of concern to materials and process engineers........................................ 13

Figure 11 Two material property classification assignments are applied to a Package_body. The class type 

indicates the domain and the class name attribute provides the conductivity value. ......................... 14

Figure 12 Assigning a material property classification to Package_terminal (#15) requires assignment to 

the terminal definition, a Package_terminal_template_definition (#84). This figure illustrates 

assignment of more than one conductivity property. ......................................................................... 15

Figure 13 Package model features of special interest to manufacturing and process engineers................. 16

Figure 14 Assigning material conductivity classification to a Package_terminal (#15) requires assignment 

to the terminal definition which is a Package_terminal_template_definition (#84). ......................... 17
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1. Introduction

This document provides use cases for the management and maintenance of multi-domain component 

models using ISO 10303-210:2010 (AP 210) as a computer-interpretable representation. The use cases are 

the result of conversations with stakeholders and potential end-users. This document identifies the 

concepts and relationships needed to support configuration control and dependency management among 

the core elements of the component model including the schematic symbol, functional (netlist) model, 

footprint, package and part-level models.

2. Scope

The domains considered in this document include electrical engineering, mechanical engineering, 

materials and process engineering, and component application engineering. Successful application of a 

component by a manufacturer requires effective communication among these domains. The relationship 

between component supplier and the manufacturer’s internal departments is important and is assumed for 

the purposes of this document to be coordinated by the component application engineering department. 

The traditional arrangement of component model elements is illustrated in Figure 1, with the inclusion of 

supplier and parametric data elements. This document will provide details of the additional relationships 

necessary to manage and maintain the system level integrity of the component model.

3. Domain Responsibilities for defining product data

Effective communication is defined to occur when and only when there are process guarantees in place to 

ensure that the detailed properties embodied in the different models that relate to the shared aspect of the 

real component are coherent. In many organizations the detail operational activities are carried out by 

technicians trained as CAD librarians, many of whom are fluent in script development and macro 

programming. The CAD librarian in a Printed Circuit Design (PCD) department will be representing both 

the electrical engineering discipline and the materials and process engineering discipline. If the PCD 

department is also responsible for assembly drawings, the CAD librarian will be responsible for a 2D 

symbol representing the component on the assembly drawing. Technicians in the Mechanical Design 

department will represent the mechanical engineering discipline. For the purposes of this document the 

following domain responsibilities will be assumed, recognizing that the assignment of responsibility for 

Figure 1. Component model elements
6

physical and part level models is arbitrary. Each domain is responsible for reviewing and approving 

proposed changes that impact their models.

3.1 Electrical engineering responsibilities

Electrical engineering is responsible for

• defining the functional (netlist) model,

• defining the functional connector model,

• defining the schematic symbol,

• defining the mapping of the schematic symbol onto the functional (netlist) model,

• defining the mapping of the schematic symbol onto the functional connector model,

• defining the mapping relating the functional (netlist) model to the part level model,

• defining the mapping relating the functional connector model to the part level model,

• defining the composition of the functional (netlist) model and physical models into the part level 

model,

• defining the mapping relating the schematic symbol to the part level model,

• validating the consistency of the multi-domain model with respect to signal coherency between 

the schematic symbol, functional (netlist) model, footprint, reference physical model, and part 

level model.

3.2 Mechanical engineering

Mechanical engineering is responsible for

• defining the physical model required for mechanical design,

• defining the reference physical model required for footprint definition,

• defining the mapping of critical characteristics between the physical model required for 

mechanical design and the reference physical model required for footprint definition,

• defining the critical characteristics of the part level model,

• defining the mapping between critical characteristics of the reference physical model and critical 

characteristics of the part level model.

3.3 Materials and process engineering

Materials and process engineering is responsible for

• defining the footprint,

• approving the mapping relating the footprint to the reference physical model provided by 

mechanical engineering,

• defining manufacturing features.

3.4 Component applications engineering 

Component applications engineering is responsible for 

• defining the parametric database entry for each component,

• defining the obsolescence status for each component,

• defining the superseded information for each obsolete component.

Example:

The connector pins in a shape model created for fit evaluation are geometrically congruent with a subset 

of the pins of the reference physical model for the footprint. Because of the congruency, replacement of 

the reference model with the fit evaluation model will not affect the accuracy of the mating properties of 

the assembly model.
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4. Relevant AP 210 content

Ensuring that the population of the detailed relationships between the several models in engineering 

libraries is valid is impossible without automation. A significant expense of automation is developing and 

maintaining a canonical model of the information stored in the libraries and of the required mappings 

between models. AP 210 provides such a canonical model upon which can be built a process model to 

ensure consistency across the domain models.

Figure 2. Application Reference Model diagram from design management module showing the role of 

managed_design_object as the focal point for change tracking [Source: ISO/TS 10303-1661 Design 

management]
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Clause 4.1.2.9 of AP 210 is a collection of conformance options1

• approval,

that provides comprehensive support for 

component application data. The subset of conformance options most relevant for this document include:

• component black box model,

• component footprint definition,

• component package model,

• component package model in a 2D context,

• component package model in a 3D context,

• part feature grouping,

• predefined part feature functional classification.

Not every Application Object (AO) in the conformance options listed is discussed in this document. The 

bibliography includes a list of the Application Modules (AM) required to support the AOs mentioned. 

Schematic symbols and schematic drawings are not yet included in the standard but will be discussed.

4.1 AP 210 specific change management structures

When specific AOs are to be tracked, the design management capability in AP 210 can be used to 

represent the explicit knowledge of a particular change. Figure 2 illustrates the structure that allows 

instances in the product data set to be referenced in a change set. The select type managed_design_object 

is an exhaustive list of types included in AP 210. It is assumed that the relevant instances from the 

previous model are available for reference. Design_object_management_relationship is an Activity that 

identifies the current and previous models. The subtypes support actions indicated by their names. Figure 

2 illustrates that the activity is directed by a Work_order (discussed in the pdm usage guide) and a 

 

1

Conformance options are identified subsets of the standard that an implementer can specify their 

implementation is compliant with.

Figure 3. Component model interdependencies present challenging model 

management issues
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member of 

Affected_item_assignment 

identifies the Part_version 

and Package instances that 

are affected by the change. 

The specific instance that is 

operated on by the relevant 

subtype (in this case 

Delete_design_object_man

agement_relationship) is 

not specified by the 

member of 

Affected_item_assignment. 

It is expected that a 

receiving application would 

seek further information 

about the change from the 

user since deletion of a 

Package_terminal should 

cause deletion of all 

properties that are 

dependent on the Package_terminal. Detailed recommendations for that user interaction are outside the 

scope of this document. Note that after the changes have been incorporated into the data set, the data set is 

still required to be compliant to AP 210, and validating the modified data set will provide structurally 

relevant information. All AOs identified in this document in the use case scenarios may be referenced by 

the Design_object_management_relationship AO (or its subtypes 

Change_design_object_management_relationship, Delete_design_object_management_relationship and 

Add_design_object_management_relationship) via the managed_design_object because 

managed_design_object is extensible and is extended in other parts of AP 210.

5. Use case scenarios

The fundamental model for configuration management recommended is publish/subscribe, that is, that all 

data are available for review and comment by any discipline. In some cases design systems will be able 

to support more specific change detection based on journaling technology (also known as history trees), 

and if that is available, it should be taken advantage of. For complex data manually examining a large 

data set is unproductive and a stored filter/query mechanism in application software is assumed. Deriving 

change sets from baseline AP 210 model data is one approach that may be satisfactory for component 

models as the AP 210 component models are heavily decomposed.

This document does not attempt to address the details of organizational behavior including best practices 

for product data management.

This document assumes there is in existence a base level product data management system capable of 

allowing users to establish baseline data sets, identify issues, request work, approve work, etc., and that 

operates at the part number and version level. There are numerous commercial and open source 

applications with the base level capability. The product data management and configuration management 

capability in STEP is focused on the core product model that consists of the following concepts: product, 

Figure 4. Schematic symbol association to functional model is 

accomplished through Presentation_set_assignment
10

product_version, and product_definition. The pdm usage guide release 4.3 2

Figure 3

should be consulted for 

details related to standard pdm recommendations.

illustrates specific dependencies between discipline models that were derived from review of the 

use cases and from the AP 210 model structure.3

Review of 

The part level functional (netlist) model binds the signal 

names of a component to the component pin identifiers. The part level model binds the component feature 

identifiers to the relevant physical model features. A separate functional model for connectors is provided 

because in electronic design automation tools, connectors are considered to be purely mechanical 

components.

Figure 3 indicates that the electrical domain needs to subscribe to the reference physical model 

for pin-out information changes; the material and process domain needs to subscribe to the reference 

physical model for feature identifier, feature shape and feature location changes. Omitted from Figure 3

for clarity is the dependency on part version identification. The detailed use cases provide 

recommendations for part version management. All domains need to subscribe to part level model 

revision activity.

Each use case scenario is derived from one or more of the domain responsibilities and includes discussion 

of the relevant AP 210 content and recommendations for management methods for the use case scenario. 

This document makes recommendations for communicating changes to model users based on 

structural/topological dependencies for cases where model incompatibilities would require updates. An 

 2 http://www.wikistep.org/index.php/PDM_Usage_Guide

3

The subclass symbol from UML is used in Figure 3. The arrowhead on the dashed lines indicates the more 

independent model. For example, the footprint is dependent on the reference physical model.

Figure 5. A subset of the data in the AP 210 part level physical model
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example of a structural or topological case is the quantity of terminals on a package. Specific AO 

recommendations will be noted in the detailed use case scenarios.

5.1 Defining the schematic symbol

A Schematic symbol presents the graphical image representing a functional model. A schematic symbol 

contains elements that are explicitly dependent on the functional model (i.e., an instance of a 

Scalar_terminal_definition in the functional model is represented by an instance of 

Schematic_symbol_callout). A schematic symbol in AP 210 will be shown on a Drawing_sheet. A

Drawing_sheet is controlled by a Drawing, which contains identification and revision information. As 

illustrated in Figure 4, the drawing identification information is located in the Drawing_definition AO. 

Figure 4 illustrates the top-level association of a Drawing_sheet to the functional model for configuration 

management traceability purposes through the Presentation_set_assignment AO. By populating the 

Presentation_set_assignment a pre-processor asserts that all the Schematic_symbol_callout included in 

the schematic symbol will be associated with the relevant Functional_unit_usage_view, simplifying 

change management.

There are no critical properties of the schematic symbol for multi-domain communication 

because the schematic symbol only exists in the electrical design flow.

5.2 Composing the part level model

Figure 6. Illustration of typical structure needed for part-level multi-domain model
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A graphical representation of the concepts present in the AP 210 component part-level model is 

Figure 7. Decomposition of functional (netlist) model for part level model
13

shown in

Figure 5.

4

The data required to populate a multi-domain part level model includes

• Functional_product,

• Functional_version,

• Functional_unit_usage_view,

• Scalar_terminal_definition,

• Part,

• Part_version,

 4

Figure 5 illustrates a lower level concept that is sometimes critical, a connection area or zone. The 

model in AP 210 permits the specification of e.g., an area on a feature that is the specific region for 

energy or material transport through the surface of the feature.
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• Packaged_part,

• Packaged_part_join_terminal,

• Functional_usage_view_to_part_terminal_assignment,

• Package,

• Package_terminal,

• Management related AOs (approval, date...).

Figure 6 illustrates the critical data relationships. Change management will be placed on all AOs in that 

diagram as each AO type and each attribute represented on the figure is critical for correct 

synchronization between the functional and physical models. Packaged_part.used_package specifies a set 

of Package but the Package of interest in this case is the base package.5

 5

Two-dimensional CAD library applications traditionally allow alternate symbols for the package. The 

support for that is provided by the aggregate used_package and the aggregate terminal_of_package. 

Detailed discussion of the application of alternate symbols is outside the scope of this document. The 

package that is the base package is the master model, which is the use case pertinent to this document.

 

Packaged_part_join_terminal.terminal_of_package specifies a set of Package_terminal but the 

Package_terminal of interest in this case is a Package_terminal for the Package that is the base package.

Figure 8. A subset of the data in the AP 210 connector model. Join terminals mate with some 

interconnecting materials in a design. [Source: ISO/TS 10303-1708 Packaged connector 

model]
15

When the functional (netlist) model includes decomposition, the following additional data is required

• Functional_unit_network_definition,

• Product_occurrence_definition_relationship,

• Functional_unit,

• Reference_composition_path,

• Reference_functional_unit_assignment_to_part.

Figure 7 illustrates the additional data relationships. The decomposition is via a member of 

Functional_unit_network_definition that references the Functional_unit_usage_view. This relationship is 

critical because it establishes the link between the details and the interface. The 

Functional_unit_network_definition may specify a different version than the Functional_unit_usage_view 

specifies but the Functional_product specified by the two versions shall be the same Functional_product. 

Although there is a direct reference to Packaged_part from the functional model via 

Reference_functional_unit_assignment_to_part, because there is already a strong binding of the 

Packaged_part to the Functional_unit_usage_view, it is not critical to monitor that additional data.

Figure 9. A subset of the data in the Package AO
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5.3 Defining the connector model

Connectors are included as a separate product type of component specification in order to identify their 

critical role in product interfacing and in order to assign related properties in support of that role.

A connector is modeled in AP 210 as a Packaged_connector, a subtype of Packaged_part. The AMs 

representing functional properties of connectors include Packaged_connector_model and 

Packaged_part_black_box_model. The critical additional properties over those of Package for multidomain communication include AOs:

• Packaged_part_interface_terminal,

• Packaged_part_join_terminal,

• Packaged_connector,

• Packaged_connector_terminal_relationship.

A Packaged_connector_terminal_relationship specifies the functional short that exists between the 

interface and join terminals but is not critical.

5.4 Mapping the schematic symbol to part level model

When a part level schematic symbol is provided, each part level pin identifier string will be referenced by 

a schematic text variable to make the component pin identifier text available on the top-level schematic 

symbol. Members of Packaged_part_terminal are referenced by the schematic text variable for this 

Figure 10. Parametric properties of concern to materials and process engineers
17

purpose.6

5.5 Defining the physical shape model for mechanical design

Because the references to the part level pin identifiers are through variables, there are no critical 

items for other domains in the schematic symbol to part level model mapping.

 6

This approach results in redundant information paths between the schematic symbol and the part level 

model. One path is through the part level functional (netlist) model and the other is direct. The AOs 

involved in the path through the part level functional (netlist) model are 

Part_connected_terminals_definition and Functional_usage_view_to_part_terminal_assignment. Because 

the schematic symbol model is currently under development, the redundancy will be addressed as part of 

that development effort.

Figure 11. Two material property classification assignments are applied to a Package_body. The 

class type indicates the domain and the class name attribute provides the conductivity value.
18

The shape models in AP 210 are a complete shape of the product. They may be composed of 

other shapes or may be one shape, depending on the application details. Two-dimensional and 

three dimensional models are supported, with the added capability to specify the context for the 

model shape. The models recommended are 2D wireframe, 2D csg, and 3D advanced brep.

There are multiple purposes for shapes that are supported: 

• analysis input;

• analysis output;

Figure 12. Assigning a material property classification to Package_terminal (#15) requires assignment to the 

terminal definition, a Package_terminal_template_definition (#84). This figure illustrates assignment of more 

than one conductivity property.
19

• shock analysis input;

• shock analysis output;

• design;

• vibration analysis input;

• vibration analysis output;

• electromagnetic compatibility 

analysis input;

• electromagnetic compatibility 

analysis output;

• thermal analysis input;

• thermal analysis output. 

The GD&T defined material condition may 

be specified (i.e., least, nominal, maximum 

material condition).. The application 

environment for the shape may be specified 

(i.e., manufacturing environment, end-user). 

The detail level of the shape is up to the 

implementation but explicit support for 

terminals is provided to enable hierarchical 

extraction of continuity for validation. 

The class of 3D shape may be specified as:

• extrusion,

• manhattan_block,

• other,

• is_unknown.

A 3D shape extent property is provided for application to components targeted to be attached to layered 

interconnect: an overall shape including terminals with minimal details;

• a shape that includes only the body and not terminals;

• a shape that includes the shape of the mating lands;

• a shape that includes the lands and the associated breakout pattern.

A 3D shape approximation level is provided for classification of shape model fidelity to actual product 

shape (i.e., coarse, detailed or unknown may be indicated). This is primarily used when the centroid is 

provided. In the case where there are several shapes provided, one shape shall be designated as the master 

shape representation.

Critical capabilities supported include the ability to synchronize coordinate systems between 2D and 3D 

representations. The AO that provides this support is 

Coordinated_geometric_relationship_with_2d_3d_placement_transformation (found in AM Geometric 

model 2D 3D relationship).

One application example is that the contact areas on the part features match the relevant contact areas on 

the footprint. 

Another application example is that a two-dimensional assembly symbol in an ECAD library matches the 

outline of a three-dimensional reference model in a MCAD library.

5.6 Defining the mechanical engineering feature functions

The AOs of interest in the AM Part feature function are Part_mating_feature and Part_mounting_feature. 

Part_mating_feature identifies a feature on the part used for alignment when two parts are mated. 

Figure 13. Package model features of special 

interest to manufacturing and process engineers
20

Electrical functionality (e.g., pins) is specifically excluded from the domain of Part_mating_feature. 

Part_mounting_feature indicates a feature on a part that may be used to constrain an occurrence of the 

part in the context of another component in an assembly context (e.g., a plastic pin that mates with a 

hole). Neither of these AOs are critical with respect to other domains in the multi-domain model.

The AOs of interest in the AM Package are Interface_plane, Visual_orientation_feature and 

Polarity_indication_feature. While Interface_plane is critical for mating connectors in an assembly, it is 

not directly critical with respect to other domains in the multi-domain model. Visual_orientation_feature 

and Polarity_indication_feature are of primary concern to material and process engineers so should be 

included in the list of items available for multi-domain communication.

5.7 Defining the mechanical engineering package

Figure 14. Assigning material conductivity classification to a Package_terminal (#15) 

requires assignment to the terminal definition which is a 

Package_terminal_template_definition (#84).
21

The structure representing the physical shape model for a part is contained within the AM package. 

Because the package model formalizes domain knowledge related to automated assembly and to 

component placement onto interconnect substrates, the concept of seating plane was included. Because 

there are cases where there are only 2D shape models available, alternative structures are provided to 

define orientation and cross section shape.7

Mechanical engineering, component application engineering, and materials and process engineering 

collaborate closely to develop the model for a package. The following AOs, when provided, are 

considered relevant for multi-domain modeling for the package:

• Connection_zone_in_part_feature_template_definition,

• Package,

• Seating_plane,

• Interface_plane,

• Package_body,

• Package_body_surface,

• Package_body_bottom_surface,

• Package_body_top_surface,

• Package_terminal,

• Package_terminal_surface_constituent_relationship,

• Package_terminal_template_definition,

• Polarity_indication_feature,

• Primary_orientation_feature,

• Secondary_orientation_feature,

• Tertiary_orientation_feature.

Other AOs may be important for specific applications and the application recommendations applied to 

AOs in the list would apply. The following list of types are considered relevant for multi-domain 

modeling for the package in particular in collaboration between mechanical engineering, component 

application engineering, and materials and process engineering:

• mounting_technology_type,

• pa_material_item_select,

• predefined_lead_form,

• seating_plane_intersection_type.

5.8 Defining the material and process engineering footprint

AP 210 provides capability to exchange and share footprint definitions that are either generic or that are 

based on specific interconnect substrate technology. Breakout patterns are also supported. Experimental 

results may be captured. This capability extends the ability of organizations to relate their land patterns to 

substrate and assembly technology. AP 210 provides capability to exchange and share definition of land 

template parameters including the explicit geometry of the template, as well as what electrical and 

thermal requirements the land template satisfies.

The following AOs that support footprint definition are considered critical in this document:

• Footprint_definition,

• Footprint_definition_shape_model,

• Part_feature_based_template_location,

 7

Package_body_top_surface and Package_body_bottom_surface provide the ability to parameterize 

height data using the seating plane as a reference in a 2D shape representation.
22

• Part_template_shape_model (inherited from ISO/TS 10303-1720, Part template shape with 

parameters),

• Template_location_in_structured_template (inherited from ISO/TS 10303-1720, Layered 

interconnect complex template),

• Template_location_in_structured_template_transform (inherited from ISO/TS 10303-1720, 

Layered interconnect complex template),

• Geometric_template (inherited from ISO/TS 10303-1720, Part template shape with parameters),

• Template_version (inherited from ISO/TS 10303-1722, Part template),

• Template (inherited from ISO/TS 10303-1722,Part template),

• Thermal_isolation_removal_template (inherited from ISO/TS 10303-1720, Layered interconnect 

complex template),

• Electrical_isolation_removal_template (inherited from ISO/TS 10303-1718, Layered interconnect 

simple template),

• Package_footprint_relationship_definition.

5.9 Defining the material and process engineering package

The following examples of parametric properties of the physical model that are of concern to material and 

process engineers are included:

• lead pitch,

• maximum body height above seating plane,

• body clearance above seating plane,

• maximum lead length below seating plane.

Figure 10 illustrates the details of the property value assignment for those items. Note that in the case of 

body clearance the standard does not predefine a maximum or minimum value and leaves it up to the 

implementation based on the sending system’s capabilities.

Materials data support in AP 210 allows the exchange of several types of conductivity classification for a 

material:

• electrical conductivity,

• thermal conductivity,

• magnetic permeability,

• optical_insertion_loss,

• dielectric_permittivity.

The following enumerations of electrical and thermal conductivity are provided in the standard: 

'conductive', 'semi-conductive', 'resistive', 'non-conductive'. 

The following enumerations of relative permeability are provided in the standard: 'free space 

permeabilty', 'low permeability', 'medium permeability', 'highly permeable'.

The following enumerations of relative optical_insertion_loss are provided in the standard: 'vacuum', 

'very low loss', 'low loss', 'medium loss', 'high loss'.

The following enumerations of relative dielectric_permitivity are provided in the standard: 'vacuum 

permittivity', 'low permittivity', 'medium permittivity', 'high permittivity'.

Material conductivity properties of the package body that are of concern to material and process engineers 

are illustrated in 
23

Figure 11. Examples of material properties of concern to material and process engineers that are 

illustrated in Figure 12 include terminal surface and core material conductivity properties.

Manufacturing specific feature classes of concern to material and process engineers are illustrated in 

Figure 13 that are included include Visual_orientation_feature and Polarity_indication_feature.

When other engineering domains populate the items, the material and process engineers will at 

least maintain subscription access to the data.

5.10 Component application engineering interaction

Interaction with component application engineering is assumed to be on a request-response basis either 

from the internal perspective or from the external perspective. From the internal perspective, requests for 

new components arise from electrical engineering domain. Component application engineering 

determines suitable suppliers, populates parametric datasets and supports access to supplier component 

application engineering data, either in model form or in graphic, e.g., PDF. Examples of application data 

include material properties of package bodies, package terminals. From the external perspective, 

component application engineering receives updates regarding material obsolescence and works with 

suppliers and design engineering to qualify replacement components. Component application engineering 

then updates the internal component database for part obsolescence and superseded information. From a 

modeling perspective, the component application engineering domain will generate a work request for 
24

design engineering upon determination that design engineering needs to become involved in a component 

issue.

6. Future work

Simulation models and requirements are obvious examples of extensions, as are investigations into the 

material stackup models provided by interconnect fabrication suppliers, and a truly behavioral model of 

the footprint.

7. Bibliography

ISO/TS 10303-1010 Product data representation and exchange: Application module: Date time

ISO/TS 10303-1011 Product data representation and exchange: Application module: Person organization

ISO/TS 10303-1012 Product data representation and exchange: Application module: Approval

ISO/TS 10303-1013 Product data representation and exchange: Application module: Person organization 

assignment

ISO/TS 10303-1014 Product data representation and exchange: Application module: Date time 

assignment

ISO/TS 10303-1022 Product data representation and exchange: Application module: Part and version 

identification

ISO/TS 10303-1042 Product data representation and exchange: Application module: Work request

ISO/TS 10303-1043 Product data representation and exchange: Application module: Work order

ISO/TS 10303-1404 Product data representation and exchange: Application module: Geometric model 2D 

3D relationship

ISO/TS 10303-1646 Product data representation and exchange: Application module: Footprint definition

ISO/TS 10303-1661 Product data representation and exchange: Application module: Design management

ISO/TS 10303-1674 Product data representation and exchange: Application module: Functional 

assignment to part

ISO/TS 10303-1756 Product data representation and exchange: Application module: Conductivity 

material aspects

ISO/TS 10303-1760 Product data representation and exchange: Application module: Pre defined product 

data management specializations

ISO/TS 10303-1704 Product data representation and exchange: Application module: Network functional 

design view

ISO/TS 10303-1705 Product data representation and exchange: Application module: Functional usage 

view

ISO/TS 10303-1707 Product data representation and exchange: Application module: Package

ISO/TS 10303-1708 Packaged connector model

ISO/TS 10303-1710 Product data representation and exchange: Application module: Packaged part black 

box model

ISO/TS 10303-1712 Product data representation and exchange: Application module: Part feature function
25

ISO/TS 10303-1726 Product data representation and exchange: Application module: Physical unit 2D 

shape

ISO/TS 10303-1727 Product data representation and exchange: Application module: Physical unit 3D 

shape

ISO/TS 10303-1732 Product data representation and exchange: Application module: Physical unit usage 

view

ISO/TS 10303-1738 Product data representation and exchange: Application module: Product 

identification extension

PDM usage guide release 4.3.Available from the World Wide 

Web:<http://www.wikistep.org/index.php/PDM_Usage_Guide>

BRADY, K. G., STORI, J., and THURMAN, T. AP210 Edition 2 Concept of Operations. NISTIR 7677, 

National Institute of Standards and Technology, 2010-03-29. Available from the World Wide Web: 

<http://www.itl.nist.gov/publications/view_pub.cgi?pub_id=905123>