Induction Curing of a Phase-Toughened Adhesive 

by Christian J. Yungwirth, Eric D. Wetzel, and James M. Sands 

ARL-TR-2999 June 2003 

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Army Research Laboratory 

Aberdeen Proving Ground, MD 21005-5069 

ARL-TR-2999 June 2003 

Induction Curing of a Phase-Toughened Adhesive 

Eric D. Wetzel and James M. Sands 

Weapons and Materials Research Directorate, ARL 

Christian J. Yungwirth 

Oak Ridge Institute for Science and Education 

Approved for public release; distribution is unlimited. 
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June 2003 

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December 2002–February 2003 

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4. TITLE AND SUBTITLE 

Induction Curing of a Phase-Toughened Adhesive 

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622618.H80 

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6. AUTHOR(S) 

Christian J. Yungwirth,* Eric D. Wetzel, and James M. Sands 

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U.S. Army Research Laboratory 

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Aberdeen Proving Ground, MD 21005-5069 

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*Christian is a research associate for the Oak Ridge Institute for Science and Technology, Oak Ridge, TN. 

14. ABSTRACT 

Phase-toughened epoxy/dicyandiamide adhesives were loaded with magnetic particle filler and then cured by induction 

processing. The effect of induction field magnitude and exposure time on bonding strength of the loaded adhesives was 

characterized. At low magnetic field amplitudes, bond strength increased significantly with exposure time, with the highest 

strength bonds occurring after 60-min exposures. At high magnetic field amplitudes, bond strength increased only slightly with

exposure time, so that significant bond strength was reached after 15 min of exposure. In general, the induction-cured adhesives 

exhibited lower bond strengths than comparable oven-cured adhesives. All of these strength trends were likely due to processinduced variations in the adhesive degree of cure, toughening phase development, or thermal degradation. 

15. SUBJECT TERMS

induction curing, phase-toughened adhesive, dicyandiamide, magnetic powders, epoxy, magnetic susceptor, DICY 

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19a. NAME OF RESPONSIBLE PERSON

Eric D. Wetzel 

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iii

Contents 

List of Figures v

List of Tables v

1. Introduction 1

1.1 Motivation .......................................................................................................................1 

1.2 Conventional Bonding Methods......................................................................................1 

1.3 Induction Heating............................................................................................................2 

1.4 Toughened Adhesives .....................................................................................................3 

2. Experimental 4

2.1 Materials and Equipment.................................................................................................4 

2.1.1 Adhesive..............................................................................................................4 

2.1.2 Magnetic Particles ...............................................................................................4 

2.1.3 Adherends............................................................................................................4 

2.1.4 Induction Unit......................................................................................................5 

2.1.5 Induction Coil......................................................................................................5 

2.1.6 Fiber-Optic Temperature Sensor .........................................................................6 

2.1.7 Cure Characteristics ............................................................................................7 

2.2 Sample Preparation..........................................................................................................7 

2.2.1 Surface Preparation .............................................................................................7 

2.2.2 Adhesive Mixing .................................................................................................7 

2.2.3 Geometry of Bond ...............................................................................................8 

2.3 Processing........................................................................................................................8 

2.3.1 Oven-Cured Samples...........................................................................................8 

2.3.2 Induction-Cured Samples ....................................................................................8 

2.3.3 Mechanical Testing Setup ...................................................................................9 

3. Results 9

3.1 Adhesive Kinetic Characterization..................................................................................9 

3.1.1 Particle Effect on Cure Kinetics..........................................................................9 

3.1.2 Cure Kinetics.......................................................................................................9 

3.1.3 Thermal Degradation Limits .............................................................................11 
iv

3.1.4 Thermal History During Induction Heating ......................................................12 

3.2 Mechanical Properties ...................................................................................................14 

4. Analysis 16

4.1 Particle Effects ..............................................................................................................16 

4.1.1 Particle Effect on Adhesive Cure Chemistry ....................................................16 

4.1.2 Particle Effect on Bond Mechanical Performance ............................................17 

4.2 Analysis of Strength Trends..........................................................................................17 

5. Conclusions 18

5.1 Magnetic Particle Susceptors for Induction Heating.....................................................18 

5.2 Rapid Curing of Adhesive Systems...............................................................................18 

6. References 20
v

List of Figures 

Figure 1. Photograph and dimensions of the three-turn solenoid induction coil............................5 

Figure 2. Location and position of the lap shear specimens during processing. ............................5 

Figure 3. Measurement zone of the fiber-optic temperature sensor. .............................................6 

Figure 4. Top and side views of the position of the fiber-optic temperature sensor within the 

adherend.....................................................................................................................................7 

Figure 5. Lap shear geometry. ........................................................................................................8 

Figure 6. Geometry for the lap shear test........................................................................................9 

Figure 7. Conversion vs. time from 180 oC isothermal DSC experiment on the D1 adhesive 

system with and without magnetic particles. ...........................................................................10 

Figure 8. Conversion vs. time from isothermal DSC experiments for the D1 adhesive system 

without magnetic particles. ......................................................................................................10 

Figure 9. Time for the D1 adhesive system to reach 95% cure as a function of temperature. .....11 

Figure 10. Heat flow as a function of temperature from constant heating rate DSC 

experiment on the D1 adhesive system without magnetic particles. .......................................12 

Figure 11. TGA measurement of weight loss as a function of temperature for the D1 

adhesive system. ......................................................................................................................13 

Figure 12. Heating history for the D1 adhesive system, with 50% weight magnetic particles, 

at a power setting of 1500 W. ..................................................................................................13 

Figure 13. Average lap shear strengths for all processing conditions. .........................................16 

List of Tables 

Table 1. Power and times processed for the induction-cured samples. ..........................................8 

Table 2. Time for D1 adhesive system to reach 95% cure at various temperatures.....................11 

Table 3. Measured lap shear strengths for oven-cured samples. ..................................................14 

Table 4. Measured lap shear strengths for induction-cured samples............................................15 
vi

INTENTIONALLY LEFT BLANK.
1

1. Introduction 

1.1 Motivation 

The U.S. Army has identified a need for lightening its forces in order to improve their 

deployability, survivability, and lethality. This lightening requires the integration of new 

materials, including polymer matrix composite materials. 

A significant challenge to implementation of these new materials is joining or bonding of 

composite structures (1, 2). During manufacturing, bonding methods are needed which are 

repeatable, rapid, and low cost. Joining is also critical for repair or replacement of damaged 

structures, a concern that is particularly relevant to Army structures. 

1.2 Conventional Bonding Methods 

There are two conventional approaches for joining polymer matrix composites—mechanical 

fasteners and surface bonding techniques. 

Mechanical fasteners are the most basic joining method. However, mechanical fasteners also 

introduce stress concentration points which limit structural performance (3). Additionally, the 

weight penalty associated with mechanical fasteners is a detriment to the construction of 

lightweight structures. 

Surface bonding techniques are preferred to mechanical fasteners primarily due to their superior 

load transfer characteristics. For high-performance engineering applications, surface bonding is 

typically achieved using elevated temperature-cure, thermosetting adhesives. These 

thermosetting adhesives usually require temperatures of 120–200 °C for 5–120 min to complete 

the bond (4). 

The most common ways of heating adhesive bondlines are convection ovens, thermal blankets, 

and radiant heaters. Convection ovens work by heating the surrounding air, which then transfers 

heat to the adherend. Thermal blankets heat the adherend by direct contact. Radiant heaters 

transfer their energy to the adherend via infrared radiation. All of these processes heat the outer 

surface of the adherend, and the heat is then conducted to the bondline. The extra time and 

energy associated with heating the adherends, rather than heating the bondline directly, reduces 

the overall process efficiency. Additionally, for composite materials, the cure temperature of 

certain adhesive systems may be near the degradation limits of the adherends. In this case, 

longer adhesive cure cycles increase the likelihood of adherend thermal degradation. 
2

1.3 Induction Heating 

Induction heating works by exposing a conductive or magnetic material to a high-frequency 

electromagnetic field, usually between 50 kHz and 100 MHz. Any material that heats up when 

exposed to an electromagnetic field is called a “susceptor” material. The electromagnetic field 

can induce heating through two mechanisms. If the susceptor material is conductive, then eddy 

currents are induced in the conductor, and the conductor will then heat due to resistive effects. If 

the material is magnetic, hysteresis losses from the magnetization-demagnetization process cause 

additional heating. This mechanism of heating is called hysteresis heating. 

Induction heating can be used for adhesive curing if a susceptor material is embedded in the 

bondline and the adherends are nonsusceptors. In this case, an incident induction field will 

penetrate through the adherends and directly heat the bondline, enabling adhesive cure. The 

primary advantage of this approach is that energy is directly coupled into the bondline, enabling 

rapid processing of embedded bondlines. 

Two general types of adhesive susceptors have been previously investigated. The first type is a 

metal screen located within the bondline (5). Once exposed to the electromagnetic field, the 

screen begins to heat due to resistive heating. The limitation of this approach is that the heating 

is unbounded and usually nonuniform. This lack of homogeneity may lead to regions of 

adhesive which are undercured or thermally degraded. Although these problems can sometimes 

be mitigated through the use of temperature sensors and active induction field control, the 

associated processing complexities can be prohibitive. 

The second type of adhesive susceptor is magnetic powder with Curie temperature-limited 

heating (6, 7). These materials use hysteresis heating and, if all other heating effects are 

dominated by the hysteresis heating, will not heat beyond their Curie temperature. The benefit 

of this approach is that magnetic powders can be chosen whose Curie temperature can be 

matched to the desired processing temperature of the adhesive system (8–10). If the 

electromagnetic field is powerful enough to maintain this hysteresis heating, then the adhesive 

will dwell at this temperature for as long as it is exposed to the field (11). This feature greatly 

improves bondline temperature control and uniformity, without the use of sensors or complex 

controls. 

In this report, we demonstrate the use of induction heating of magnetic powder susceptors for 

thermal curing of adhesive systems and investigate whether induction heating can reduce process 

times compared with traditional heating methods. 
3

1.4 Toughened Adhesives 

The strength of a thermosetting adhesive is determined by two different mechanisms—network 

formation and toughening effects. Network formation refers to the degree of completion of cure, 

with strength increasing continuously as the degree of cure approaches 100% conversion of 

reactive groups. In general, unmodified thermoset epoxies and acrylic-type adhesives are 

relatively brittle and fail under relatively low stress conditions. Therefore, various toughening 

modifications are commonly designed into thermosetting adhesives. 

A phase-toughened adhesive contains rubber particles, which improve the adhesive’s fracture 

toughness. Adhesive failure typically occurs due to crack formation and propagation. If a crack 

reaches a rubber particle, the low modulus of the rubber phase reduces the local stress 

concentration at the crack tip, slowing the growth rate. As particle size decreases (at a fixed 

volume fraction), the dispersion of particles throughout the adhesive matrix is improved, 

increasing their toughening effect. However, if the rubber particles are too small, their 

toughening effect is negligible. Therefore, there is an optimal particle size for achieving 

maximum adhesive toughness (12). 

There are two traditional approaches to incorporating secondary particles in an adhesive. The 

first approach, the one used in our study, is to formulate the adhesive to develop particles during 

the cure process through phase separation. Typically, the secondary phase is a modified rubber 

or thermoplastic that has a high compatibility with the uncured monomer of the adhesive. 

However, during cure, the adhesive network begins to cross-link, and the rubber groups coalesce 

and separate from the forming network due to decreases in favorable mixing (13). The particle 

size continuously grows during cure until molecular motion is limited by vitrification. Since the 

processes of monomer aggregation and network formation have independent kinetic 

characteristics, different processing histories result in different sizes and numbers of equilibrium 

particle domains. Additionally, very rapid processing can result in trapping of the secondary 

tougheners in the matrix and create decreased matrix performance characteristics both thermally 

and mechanically. 

The second toughening approach is adding preformed particles to the adhesive a priori. In this 

approach, the optimal size of the particles is selected prior to curing and is well controlled. The 

most significant drawback of this approach is that the adhesive viscosity dramatically increases, 

making handling difficult and often requiring a change in formulation to improve substrate 

wetting and bonding. Additionally, the preformed particles perform less efficiently than particles 

formed in situ (14). 
4

2. Experimental 

2.1 Materials and Equipment 

2.1.1 Adhesive 

The adhesive system chosen was a dicyandiamide (DICY)-cured epoxy that was epoxyterminated butadiene-acrylonitrile phase toughened. We will refer to this adhesive system as D1. 

This adhesive was chosen for its excellent mechanical properties, phase separation 

characteristics, and cure temperature, which is similar to the dwell temperatures of the magnetic 

particles. 

The adhesive formulation was environmentally stable for room temperature storage, providing a 

working life of at least 1 year. The cured adhesive possessed the generally desired 

characteristics of high thermal stability (250 °F), good solvent resistance, and low moisture 

uptake. 

2.1.2 Magnetic Particles 

The magnetic susceptor particles chosen were FP160 nickel zinc ferrite (PowderTech Corp., 

Valparaiso, IN), a magnetically soft ferrite. Although the particles did not have a sharp Curie 

temperature, the magnetization did diminish gradually with temperature. The saturation 

magnetization of the particles was ~0 (nonmagnetic) by 250 °C, producing a limiting condition 

on heating. 

As-received magnetic particles were ball milled for 3 hr prior to the addition of the D1 adhesive. 

This step reduced the particle size to ~10–100 μm in diameter. 

In order to minimize the impact of particle settling in the adhesive matrix during processing and 

storage, the milled FP160 was coated with a reactive surface modifier. The modifier selected 

was (3-glycidoxypropyl) trimethoxysilane, which was added to the dry FP160 through 1% water 

solvent casting. The treated particles were filtered and heat treated at 93 °C for 1 hr prior to 

mixing with the resin. The silane monomer added reactive functionality that chemically bound 

the particles to the matrix during the cure process. 

2.1.3 Adherends 

The adherends were constructed of 40 plies of Hexcel (Dublin, CA) unidirectional glass 

fiber/8551 epoxy prepreg. After fabrication, they were cut into lap shears 1.0 × 4.0 × 0.2 in, with 

the fiber direction aligned along the long axis of the adherends. 
5

2.1.4 Induction Unit 

An induction unit operates by sending an alternating current through a conductive coil, which 

then generates an alternating magnetic field. This study used an Ameritherm NovaStar 1M 

(Scottsville, NY) induction unit, which operated at frequencies between 10 and 15 MHz. The 

magnitude of the magnetic field was adjusted by the “load power” (LP) setting. Increasing LP 

increased the amount of current that entered the coil and thus increased the magnetic field 

amplitude. The LP setting ranged from 0 to 1500 W, although this value did not correspond to 

the amount of power being dissipated by the induction coil or susceptor material. The magnetic 

field strength was also not necessarily linearly proportional to the LP. 

2.1.5 Induction Coil 

The coil used on the induction unit had a unique geometry, a solenoid designed specifically to 

process five lap shear specimens simultaneously (Figure 1). The coil was a three-turn solenoid 

fabricated from 0.3175-cm-diameter copper tubing. The solenoid was ~16.51 cm wide, 5.08 cm 

high, and 3.81 cm long. This geometry allowed simultaneous processing of five lap shear 

specimens simultaneously, decreasing processing inconsistencies. The bond areas of the lap 

shear specimens were placed next to one another, as shown in Figure 2. 

 

Figure 1. Photograph and dimensions of the three-turn solenoid induction coil. 

Figure 2. Location and position of the lap shear 

specimens during processing. 

5.08 cm

16.51 cm

3.81 cm

bond area

induction 

coil

adherends
6

The operating frequency f of the induction unit was dependent upon the inductance of the coil 

and the capacitance within the circuit and is given approximately by 

( ) LC f 2π

1 = , (1) 

where L is the inductance of the coil and C is the capacitance within the circuit. The 

combination of system capacitance and inductance must be chosen to ensure that the operating 

frequency lies within the unit’s rated range of 10–15 MHz. 

Using an LCR meter, we measured the coil’s inductance to be 1.04 μH. The Ameritherm unit 

was then configured to an internal capacitance of 100 pF, which, according to equation 1, should 

produce a frequency of ~15.6 MHz. Using this configuration, a frequency of 14.4 MHz was 

reported by the Ameritherm unit during processing. 

2.1.6 Fiber-Optic Temperature Sensor 

A thermocouple could not be used as a temperature sensor since it consisted of metallic wires 

which heated inductively. Additionally, because thermocouples use a voltage difference to 

measure temperature, the voltages induced by the alternating magnetic field can corrupt 

measurements. In order to obtain accurate temperature data, we used a fiber-optic temperature 

sensor manufactured by FISO Corp. (Quebec, Canada). The measurement zone of the fiber-optic 

temperature sensor was located at the end of the sensor and was ~10 mm in length (Figure 3). 

Figure 3. Measurement zone of the 

fiber-optic temperature sensor. 

Figure 4 displays the geometry of the fiber-optic sensor in the lap shear bondline. The 

fiber-optic sensor’s entire measurement zone was embedded at the center of the bondline. A 

groove was made in one of the lap shear surfaces so that the fiber-optic sensor was in direct 
7

Figure 4. Top and side views of the position of the fiber-optic 

temperature sensor within the adherend. 

contact with the bonding surface. A layer of Kapton* film was placed between the fiber optic 

sensor and the adhesive so that the sensor could be removed from the bondline once the 

experiment was complete. A single heating experiment was performed with the fiber-optic 

temperature sensor, at an LP of 1500 W. 

2.1.7 Cure Characteristics 

Based on a series of isothermal experiments performed between 160° and 220 °C, a differential 

scanning calorimeter (DSC) was used to analyze the cure characteristics of the epoxy. For all 

experiments, the sample chamber with the reference was preheated to temperature prior to 

staging the sample. The crossover point (∆H = 0) was used as the initial cure time (t = 0) in the 

conversion analysis. A single fixed heating rate experiment (10 °C/min to 375 °C) was also 

performed to assess the thermal degradation characteristics of the adhesive system. 

2.2 Sample Preparation 

2.2.1 Surface Preparation 

Preparing the surface of the lap shears consisted of surface abrasion followed by cleaning. 

Surface abrasion was accomplished by grit blasting with 50-μm aluminum oxide grit at 80 psi. 

The bonding area was the only surface treated by abrasion. Once this was completed, the lap 

shears were cleaned with deionized water and allowed to dry. The dry adherends were then 

rinsed with acetone to remove any residual contaminants off the surface. 

2.2.2 Adhesive Mixing 

The magnetic particles were blended with the epoxy adhesive at a loading of 50% by weight 

(~20% by volume). The mixing was done by hand until particle wet-out was achieved, followed 

by dispersion in a high-speed mixer (7000 revs/s) for ~20 min. Care was taken to keep 

 *

 Kapton is a registered trademark of DuPont. 
8

temperatures below 70 °C during blending. After high-speed mixing, the mixture was placed in 

a vacuum chamber at full vacuum (25–28 mmHg) and 50 °C to degas for 16 hr. 

2.2.3 Geometry of Bond 

The adhesive was applied to the pretreated overlap area of both adhesives as an even coat 

~0.0254 cm thick. Finger pressure was used to ensure intimate contact between the lap shears. 

Kapton tape was then wrapped around the bond area to ensure that contact was maintained 

during cure. A small amount of adhesive flash remained on both sides of the lap shears. 

Figure 5 shows the geometry for the lap shear. 

Figure 5. Lap shear geometry. 

2.3 Processing 

2.3.1 Oven-Cured Samples 

To characterize baseline adhesive performance, two sets of five lap shears were oven cured at 

175 °C for 1 hr. The first set contained neat adhesive, without magnetic particles. The second 

set contained the particle-loaded adhesive described in section 2.2.2. 

2.3.2 Induction-Cured Samples 

The lap shears were placed within the coil, on top of four sheets of Kapton film, to prevent 

electrical arcing from the coil. All five of the lap shears were processed simultaneously for each 

set of experimental conditions. They were located in the center of the coil (but resting on the 

lower coil windings), directly adjacent to one another, as previously described in section 2.1.5. 

Table 1 displays the powers and times for each set of samples cured in the induction field. Due 

to electrical arcing, the shortest 1500-W experiment was limited to 13 min, rather than 15 min.

Table 1. Power and times processed for the induction-cured samples. 

Power Level 

(W) 

Processing Times 

(min) 

500 15 30 60 

1000 15 30 60 

1500 13 30 
9

2.3.3 Mechanical Testing Setup 

Lap shear strength measurements were performed using an Instron (Canton, MA) 4505 

mechanical tester, with a 10-kN load cell. Figure 6 illustrates the testing geometry. The grip 

spacing for all experiments was 11.43 cm. Shimming tabs were placed against the adherends in 

the grips to minimize bending loads during testing. 

Figure 6. Geometry for the lap 

shear test. 

3. Results 

3.1 Adhesive Kinetic Characterization 

3.1.1 Particle Effect on Cure Kinetics 

To determine whether the magnetic particles influenced the cure chemistry of the adhesive 

system, 180 °C isothermal DSC runs were performed on the uncured adhesive, both with and 

without magnetic particles. Figure 7 shows conversion as a function of time for the two systems, 

where full conversion is achieved when α = 1. The conversion histories for the two systems 

were nearly identical. Therefore, as expected, the addition of the magnetic particles did not 

appear to impact the cure chemistry of the adhesive. 

3.1.2 Cure Kinetics 

To quantify the complete cure kinetics for the D1 system, isothermal runs on the DSC were 

performed using unfilled adhesive. The unfilled system cure kinetics should also represent the 

filled system, since the results of section 3.1.1 showed that the magnetic particles did not affect 

adhesive cure chemistry. Figure 8 shows the measured conversion histories for each 

temperature. 
10

Figure 7. Conversion vs. time from 180 oC isothermal DSC 

experiment on the D1 adhesive system with and without 

magnetic particles. 

Figure 8. Conversion vs. time from isothermal DSC experiments for 

the D1 adhesive system without magnetic particles. 

Figure 8 shows that, as expected, cure time decreased as temperature increased. Table 2 lists the 

time to reach 95% conversion for each of the isothermal runs, a reasonable benchmark for 

effective cure. At 160 °C, full cure was approached in ~57 min, while only ~4 min were 

required at 220 °C. 

0

0.2

0.4

0.6

0.8

1

0 10 20 30 40 50

With FP160 (20% volume fraction)

Without FP160

Conversion, 

α

Time (min)

0

0.2

0.4

0.6

0.8

1

0 1000 2000 3000 4000 5000

160C

170C

180C

200C

220C

Conversion, 

α

Time (s)
11

Table 2. Time for D1 adhesive system to reach 95% cure at various 

temperatures. 

Temperature 

(°C)

Time to Reach 95% Cure 

(min)

160 57.1 

170 36.4 

180 23.1 

90a 14.6 

200 9.30 

210a 5.90 

220 3.74 a

The 190° and 210 °C isothermal cure times have been interpolated using equation 2. 

Figure 9 shows time to achieve 95% cure as a function of temperature. This data is well 

modeled by an Arrhenius equation as follows: 

RT T 4 1.29 10 ( ) 0.236 e− × α = ⋅ , (2) 

where α is conversion, T is temperature in kelvin, and R is the universal gas constant in 

joules/mole kelvin. This equation was used to interpolate the cure times for T = 190° and 

210 °C in Table 2. 

Figure 9. Time for the D1 adhesive system to reach 95% cure as a 

function of temperature. 

3.1.3 Thermal Degradation Limits 

In order to determine the thermal degradation limits of the adhesive system, a DSC run was 

performed on the unfilled adhesive (Figure 10). A heating rate of 10 °C/min was used up to 

375 °C. For cure characterization in sections 3.1.1 and 3.1.2, the degree of cure was calculated 

0

500

1000

1500

2000

2500

3000

3500

4000

150 160 170 180 190 200 210 220 230

Time to 95% cure (s)

Temperature (°C)
12

Figure 10. Heat flow as a function of temperature from 

constant heating rate DSC experiment on 

the D1 adhesive system without magnetic 

particles. 

based on the peak area between 100° and 220 °C. The additional heating generated above 

250 °C could be due to continued or secondary curing of the adhesive system. Above 280 °C, 

the sharp increase in heat flow indicated the occurrence of new reactions, which were likely 

associated with thermal degradation of the adhesive. Figure 11 depicts a thermal gravimetric 

analyzer (TGA) analysis of the unfilled adhesive system. The negligible weight loss beneath 

250 °C indicated thermal stability beneath that temperature. This conclusion was consistent with 

reports on the thermal stability of DICY-cured epoxies (15). 

3.1.4 Thermal History During Induction Heating 

A measurement of the temperatures reached within the adhesive was performed using a fiberoptic sensor embedded within the bondline of the two adherends. Figure 12 depicts the 

temperature reached within the bondline at 1500 W, with 50% weight fraction of magnetic 

particles. The bondline temperature reaches equilibrium in ~5 min, and asymptotically 

approached a value of ~210 °C. Once it reached this temperature, the adhesive dwelled at this 

temperature, regardless of time exposed to the induction field. This temperature was well below 

the expected adhesive thermal degradation temperature of 250 °C (section 3.1.3). 

-10

0

10

20

30

40

0 50 100 150 200 250 300 350 400

Heat Flow (W/g)

Temperature (°C)
13

Figure 11. TGA measurement of weight loss as a function of 

temperature for the D1 adhesive system. 

Figure 12. Heating history for the D1 adhesive system, with 

50% weight magnetic particles, at a power setting of 

1500 W. 

0

20

40

60

80

100

0 100 200 300 400 500 600

Weight (%)

Temperature (°C)

0

50

100

150

200

250

0 200 400 600 800 1000

Temperature (°C)

Time (s)
14

We were unable to directly measure temperature histories at power levels of 500 and 

1000 W because of equipment failure. However, previous experiments with a similar adhesive 

system with 50% weight FP160 magnetic particles achieved temperatures of 220°, 180°, and 

165 °C at 1500, 1000, and 500 W, respectively (11). The heating rate changed only slightly for 

various power levels, with the time to reach the dwell temperature ranging from 5 to 7 min. We 

expect similar general heating behavior for the adhesive system used in this study. 

3.2 Mechanical Properties 

Table 3 shows the lap shear strengths for the oven-cured samples. The average mechanical 

strength of the oven-cured adhesive without the addition of the magnetic particles was 30.3 MPa. 

The average mechanical strength with the addition of the magnetic particles was 28.3 MPa, or a 

6.5% decrease in mechanical strength. Therefore, the addition of the magnetic particles slightly 

diminished the mechanical strength of the adhesive system. 

Table 3. Measured lap shear strengths for oven-cured samples. 

Displacement 

at Failure 

(cm) 

Length 

(cm) 

Width 

(cm) 

Load at 

Failure 

(N) 

Lap Shear 

Strength 

(MPa) 

Average 

(MPa) 

Standard 

(MPa) 

Thermal Cure Without FP 160, 175 °C for 1 hr (No Bondline Controls) 

0.371 1.23 2.63 603 38.9 30.2 5.41 

0.296 1.42 2.65 378 24.4 — — 

0.327 1.37 2.64 424 27.3 — — 

0.356 1.44 2.55 473 30.5 — — 

0.306 1.36 2.62 468 30.2 — — 

Thermal Cure With FP 160, 175 °C for 1 hr 

0.317 1.37 2.60 419 27.0 28.2 1.38 

0.368 1.37 2.66 440 28.4 — — 

0.382 1.38 2.57 468 30.2 — — 

0.259 1.38 2.62 445 28.7 — — 

0.312 1.34 2.66 415 26.8 — — 

Table 4 depicts the lap shear strengths for the induction-cured samples. All of the lap shear 

specimens displayed a cohesive failure. There was no correlation between location in the 

induction coil and the mechanical strength of the individual lap joints. 
15

Table 4. Measured lap shear strengths for induction-cured samples. 

Processing 

Power 

(W) 

Processing 

Duration 

(min) 

Displacement 

at Failure 

(cm) 

Length 

(cm) 

Width 

(cm) 

Load at 

Failure

(N) 

Lap Shear 

Strength 

(MPa) 

Average 

(MPa) 

Standard 

(MPa) 

500 15 0.066 1.39 2.59 123 7.93 4.88 2.78 

— — 0.034 1.33 2.64 48.0 3.09 — —

— — 0.061 1.37 2.64 101 6.49 — —

— — 0.027 1.37 2.60 31.2 2.01 — —

500 30 0.332 1.24 2.63 317 20.4 18.8 2.29 

— — 0.434 1.41 2.61 320 20.7 — —

— — 0.302 1.38 2.64 315 20.3 — —

— — 0.234 1.48 2.71 265 17.1 — —

— — 0.258 1.41 2.57 244 15.7 — —

500 60 0.329 1.35 2.64 383 24.7 23.7 1.02 

— — 0.300 1.37 2.61 368 23.7 — —

— — 0.330 1.25 2.60 365 23.5 — —

— — 0.288 1.36 2.62 379 24.5 — —

— — 0.318 1.38 2.59 343 22.1 — —

1000 15 0.244 1.37 2.64 301 19.4 18.7 1.89 

— — 0.316 1.32 2.64 321 20.7 — —

— — 0.229 1.39 2.58 277 17.9 — —

— — 0.346 1.49 2.64 245 15.8 — —

— — 0.275 1.32 2.62 302 19.5 — —

1000 30 0.240 1.34 2.67 259 16.7 19.5 1.72 

— — 0.350 1.30 2.63 305 19.7 — —

— — 0.269 1.36 2.59 303 19.5 — —

— — 0.362 1.36 2.67 326 21.0 — —

— — 0.439 1.27 2.63 322 20.8 — —

1000 60 0.333 1.50 2.65 342 22.1 19.4 2.12 

— — 0.307 1.38 2.60 257 16.6 — —

— — 0.290 1.36 2.61 296 19.1 — —

— — 0.271 1.27 2.59 323 20.9 — —

— — 0.368 1.35 2.62 287 18.5 — —

1500 13 0.331 1.30 2.73 269 17.3 17.7 1.60 

— — 0.244 1.26 2.62 309 20.0 — —

— — 0.245 1.35 2.62 251 16.2 — —

— — 0.220 1.34 2.64 269 17.4 — —

1500 30 0.244 1.37 2.61 313 20.2 17.7 2.45 

— — 0.202 1.38 2.62 290 18.7 — —

— — 0.154 1.41 2.63 213 13.7 — —

— — 0.189 1.33 2.58 266 17.2 — —

— — 0.207 1.35 2.63 290 18.7 — —
16

Figure 13 shows the average lap shear strength and standard deviation for each of the processing 

conditions. The maximum strength achieved by induction processing occurred at 500 W for 

60 min. At 500 W for 15 min, the adhesive still possessed liquid-like properties (the flash was 

wet to the touch) and did not provide significant mechanical strength. At 1000 W, there was a 

slight improvement in mechanical strength between processing for 15 and 60 min. The same 

trend occurred for processing at 1500 W, where strength only increased marginally with 

increased processing time. This showed that at high power levels, further exposure to the 

induction field would not greatly enhance mechanical strength. All of the induction-cured 

specimens exhibited lower strength than the oven-cured specimens, with the 500 W for 60-min 

case reaching 84% of the strength of the filled, oven-cured samples. 

Figure 13. Average lap shear strengths for all processing conditions. 

4. Analysis 

4.1 Particle Effects 

4.1.1 Particle Effect on Adhesive Cure Chemistry 

The DSC measurements from section 3.1.1 demonstrate that the magnetic particles do not 

interact chemically with the D1 adhesive. This result is not surprising since they are stable oxide 

particles that do not give off any gases or interact with the organic chemistry of the adhesive. 

0

5

10

15

20

25

30

35

40

0 2 4 6 8 10

Lap Shear Strength (MPa)

Power & Time

500W

30 min 60 min 15 min 30 min 60 min 13 min

1000W 1500W

15 min 30 min

Oven

With

Filler

No

Filler

Oven

500W 500W 1000W 1000W 1500W
17

4.1.2 Particle Effect on Bond Mechanical Performance 

Under comparable oven-cured conditions, the presence of magnetic particles resulted in a slight 

decrease in adhesive mechanical properties, as compared with the unfilled system. However, the 

relatively large scatter in the data for the unfilled system makes it difficult to draw conclusions 

with high confidence. Note that if the specimen with the highest lap shear strength in the 

unfilled sample is discounted, the average load at failure between the filled and unfilled D1 

adhesive is equivalent within statistical error. To reduce scatter in future efforts, more emphasis 

needs to be placed on maintaining constant bondline thickness and adherend thickness. 

4.2 Analysis of Strength Trends 

Obviously, thermal histories play a crucial role in the curing of the adhesive. In general, 

induction processing causes the adhesive to heat rapidly and then dwell at some relatively stable 

temperature (refer to Figure 12). The heating ramp rate only alters slightly between various 

power settings but, in all cases, approaches its dwell temperature within 5–7 min. Therefore, the 

only effect of time at a constant power, after the initial 5-min ramping period, is further time 

spent at the dwell temperature. The major effect of the power is the determination of the final 

dwell temperature, with higher power levels producing higher dwell temperatures. 

Based on the DSC run from section 3.1.3 and temperature histories from section 3.1.4, we can 

assume that thermal degradation is probably not occurring within the adhesive. According to the 

DSC run, the onset of degradation begins around 280 °C, while the force integration staff officer 

(FISO) data indicates a maximum temperature of 210 °C in the adhesive during induction 

processing. Also, the 1000- and 1500-W cases show no decrease in mechanical strength with 

longer exposure to the induction field. These two observations imply that thermal degradation of 

the adhesive is not occurring. 

Figure 13 shows that at 500 W, increasing induction exposure time leads to increasing 

mechanical properties. After processing at 500 W for 15 min, the adhesive appears to be liquidlike, corresponding to an incomplete degree of cure. This observation likely indicates that the 

increase in strength noted with increasing exposure time at 500 W is due to increasing degree of 

cure. In contrast, the 1000- and 1500-W samples show only minor improvements in strength for 

process times greater than 15 min. Therefore, it is likely that the adhesive was mostly cured after 

15 min at those higher power levels. Postprocess DSC analysis needs to be performed to verify 

all of these hypotheses. 

The maximum strength achieved for each power level appears to decrease with increasing power, 

although the trend is not striking. These results could indicate that the difference in cure kinetics 

or toughening kinetics at higher temperatures directly leads to decreasing adhesive performance. 

Further analysis and experimentation are needed to confirm this hypothesis. 
18

The best adhesive bond performance is achieved at a power level of 500 W and an exposure time 

of 60 min. Under these conditions, the lap shear strength of the induction-processed sample 

reaches 84% of the filled, oven-cured system lap shear strength. 

5. Conclusions 

5.1 Magnetic Particle Susceptors for Induction Heating 

We have shown that induction heating can achieve thermal powers necessary for thermal curing 

of adhesives, enabling both rapid heating and high dwell temperatures. This achievement is not 

trivial and has been made possible only through recent advancements in induction processing 

equipment. Specifically, the commercial availability of high-frequency (greater than 10 MHz), 

self-tuning induction power supplies has allowed for efficient energy transfer to magnetic 

susceptor particles. 

The main advantage of induction heating arises from utilization of the Curie temperature of the 

magnetic susceptor particles. With a well-defined Curie temperature, a magnetic powder-loaded 

adhesive system will be thermally self-regulating. Curie limiting is only partially utilized in our 

study. The magnetic particles in our study do not possess a well-defined Curie temperature, so 

that dwell temperature is highly dependent on induction field strength. Furthermore, the dwell 

temperature is not a true dwell, as temperatures slowly but continuously increase during dwell. 

Better heating performance and control could be achieved by using magnetic materials 

developed specifically for Curie temperature-controlled processing applications (7). 

5.2 Rapid Curing of Adhesive Systems 

The choice of an adhesive system is critical for effective utilization of induction heating. The 

epoxy adhesive system used in this study is based on a commercial formulation designed to cure 

thermally in ~1 hr. Thus, it is sensitive to time-temperature profiles, which affect network 

formation and rubber phase development. The adhesive system evaluated is not designed to cure 

inside of 15 or 30 min. Induction heating would serve as an optimum type of curing for an 

adhesive system without a dependency on the heating rate (e.g., free radical initiated). These 

types of adhesive systems would best utilize the advantages of induction heating over other types 

of thermal curing. 

To fully demonstrate induction heating as method for rapid adhesive processing, a 

comprehensive analysis must be undertaken of a heating rate insensitive adhesive system. We 
19

are preparing to do this with additional formulations of adhesive systems, which have the 

preformed rubber particles added a priori. Eliminating the phase separation issue from the 

performance will allow us to address issues associated with rapidly formed thermoset network 

structures independently. 
20

6. References 

1. Hahn, G. L.; Bergstron, L. K.; Border, J. N.; McIlroy, B. E. Induction Heating Repair of 

Structures. F33657-88-C-0087; McDonnell Douglas Corporation: St. Louis, MO, 

October 1991. 

2. Tay, T. E.; Fink, B. K.; McKnight, S.; Yarlagadda, H. S.; Gillespie, J. W., Jr. Accelerated 

Curing of Adhesives in Bonded Joints by Induction Heating. Journal of Composite 

Materials 1999, 33 (17), 1643–1664. 

3. Consenza, F. Mechanical Fasteners for Composites. Materials Engineering 1987, 104 (8), 

33–37. 

4. Marinelli, J. M.; Lambing, C. L. T. Study of Surface Treatments for Adhesive Bonding of 

Composite Materials. Advanced Materials: Performance Through Technology Insertion 

International SAMPE Symposium and Exhibition (Proceedings), Covina, CA, 1993, 38, 

1196–1210. 

5. Fink, B. K.; McKnight, S. H.; Gillespie, J. W., Jr.; Yarlagadda, S. Nano-Particulate and 

Conductive Mesh Susceptors for Induction-Based Repair of Composite Materials. 

Proceedings of the 21st Army Science Conference, Norfolk, VA, 15–17 June 1998. 

6. Wetzel, E. D.; Fink, B. K. Feasibility of Magnetic Particle Films for Curie TemperatureControlled Processing of Composite Materials; ARL-TR-2431; U.S. Army Research 

Laboratory: Aberdeen Proving Ground, MD, March 2001. 

7. Wetzel, E. D.; Fink, B. K.; Li, Y. F.; Xiao, J. Q. Advanced Magnetic Materials for Curie 

Temperature Controlled Bonding. Proceedings of the 22nd Army Science Conference, 

Baltimore, MD, 11–13 December 2000. 

8. McKnight, S. H.; Fink, B. K.; Wells, S.; Yarlagadda, S.; Gillespie, J. W., Jr. Accelerated 

Curing of Epoxy Paste Adhesives for Repair of Composites Using Induction Heating. 

Proceedings of SPE ANTEC 1998, Atlanta, GA, 26–30 April 1998. 

9. Eagle, G. Induction Heat Curing of Adhesives. Proceedings of the SPE ANTEC, Detroit, 

MI, 1987. 

10. Stefanides, E. J. Epoxy Cured by Induction Heating Gives Strong Sheet Metal Joint. Design

News 1987, 43 (12), 102–103. 
21

11. Sands, J. M.; Wetzel, E. D.; Yungwirth, C. J. Induction Processed Adhesives for Military 

Applications. 33rd International SAMPE Technical Conference, Seattle, WA, 5–8 

November 2001. 

12. Sands, J. M.; McKnight, S. H.; Fink, B. K. Formulation of Toughened Paste Adhesives for 

Reduced-Pollutant Electron Beam Repair and Assembly of Composite Structure; ARL-TR2270; U.S. Army Research Laboratory: Aberdeen Proving Ground, MD, September 2000. 

13. Kit, K.; Sands, J. M.; McKnight, S. H. Design and Control of Network Architecture in 

Radiation Curable Toughened Semi-Interpenetrating Network Resin Systems; ARL-TR2693; U.S. Army Research Laboratory: Aberdeen Proving Ground, MD, March 2002. 

14. Huang, Y.; Hunston, D. L.; Kinloch, A. J.; Riew, C. K. Mechanisms of Toughening 

Thermoset Resins; Toughened Plastics I, Riew, C. K., Kinloch, A. J., Eds; American 

Chemical Society: Washington, DC, 1993; Chapter 1, p 1. 

15. Barton, J. M.; Harberton, I.; Howlin, B. J.; Jones, J. R.; Liu, S. Studies of Cure Schedule 

and Final Property Relationships of a Commercial Epoxy Resin Using Modified Imidazole 

Curing Agents. Polymer 1998, 39 (10), 1929–1937.
22

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 B SMITH 

 901 N STUART ST STE 303 

 ARLINGTON VA 22203 

 1 OAK RIDGE NATIONAL 

 LABORATORY 

 R M DAVIS 

 PO BOX 2008 

 OAK RIDGE TN 37831-6195 
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8

 1 OAK RIDGE NATIONAL 

 LABORATORY 

 C EBERLE MS 8048 

 PO BOX 2008 

 OAK RIDGE TN 37831 

 3 DIRECTOR 

 SANDIA NATIONAL LABS 

 APPLIED MECHANICS DEPT 

 MS 9042 

 J HANDROCK 

 Y R KAN 

 J LAUFFER 

 PO BOX 969 

 LIVERMORE CA 94551-0969 

 1 OAK RIDGE NATIONAL 

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 C D WARREN MS 8039 

 PO BOX 2008 

 OAK RIDGE TN 37831 

 4 NIST 

 M VANLANDINGHAM MS 8621 

 J CHIN MS 8621 

 J MARTIN MS 8621 

 D DUTHINH MS 8611 

 100 BUREAU DR 

 GAITHERSBURG MD 20899 

 1 HYDROGEOLOGIC INC 

 SERDP ESTCP SPT OFC 

 S WALSH 

 1155 HERNDON PKWY STE 900 

 HERNDON VA 20170 

 3 NASA LANGLEY RSCH CTR 

 AMSRL VS 

 W ELBER MS 266 

 F BARTLETT JR MS 266 

 G FARLEY MS 266 

 HAMPTON VA 23681-0001 

 1 NASA LANGLEY RSCH CTR 

 T GATES MS 188E 

 HAMPTON VA 23661-3400 

 1 FHWA 

 E MUNLEY 

 6300 GEORGETOWN PIKE 

 MCLEAN VA 22101 

 1 USDOT FEDERAL RAILRD 

 M FATEH RDV 31 

 WASHINGTON DC 20590 

 3 CYTEC FIBERITE 

 R DUNNE 

 D KOHLI 

 R MAYHEW 

 1300 REVOLUTION ST 

 HAVRE DE GRACE MD 21078 

 1 DIRECTOR 

 NATIONAL GRND INTLLGNC CTR 

 IANG TMT 

 2055 BOULDERS RD 

 CHARLOTTESVILLE VA 

 22911-8318 

 1 SIOUX MFG 

 B KRIEL 

 PO BOX 400 

 FT TOTTEN ND 58335 

 2 3TEX CORPORATION 

 A BOGDANOVICH 

 J SINGLETARY 

 109 MACKENAN DR 

 CARY NC 27511 

 1 3M CORPORATION 

 J SKILDUM 

 3M CENTER BLDG 60 IN 01 

 ST PAUL MN 55144-1000 

 1 DIRECTOR 

 DEFENSE INTLLGNC AGNCY 

 TA 5 

 K CRELLING 

 WASHINGTON DC 20310 

 1 ADVANCED GLASS FIBER YARNS 

 T COLLINS 

 281 SPRING RUN LANE STE A 

 DOWNINGTON PA 19335 

 1 COMPOSITE MATERIALS INC 

 D SHORTT 

 19105 63 AVE NE 

 PO BOX 25 

 ARLINGTON WA 98223 
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 1 JPS GLASS 

 L CARTER 

 PO BOX 260 

 SLATER RD 

 SLATER SC 29683 

 1 COMPOSITE MATERIALS INC 

 R HOLLAND 

 11 JEWEL CT 

 ORINDA CA 94563 

 1 COMPOSITE MATERIALS INC 

 C RILEY 

 14530 S ANSON AVE 

 SANTA FE SPRINGS CA 90670 

 2 SIMULA 

 J COLTMAN 

 R HUYETT 

 10016 S 51ST ST 

 PHOENIX AZ 85044 

 2 PROTECTION MATERIALS INC 

 M MILLER 

 F CRILLEY 

 14000 NW 58 CT 

 MIAMI LAKES FL 33014 

 2 FOSTER MILLER 

 M ROYLANCE 

 W ZUKAS 

 195 BEAR HILL RD 

 WALTHAM MA 02354-1196 

 1 ROM DEVELOPMENT CORP 

 R O MEARA 

 136 SWINEBURNE ROW 

 BRICK MARKET PLACE 

 NEWPORT RI 02840 

 2 TEXTRON SYSTEMS 

 T FOLTZ 

 M TREASURE 

 1449 MIDDLESEX ST 

 LOWELL MA 01851 

 1 O GARA HESS & EISENHARDT 

 M GILLESPIE 

 9113 LESAINT DR 

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 2 MILLIKEN RSCH CORP 

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 SPARTANBURG SC 29303 

 1 CONNEAUGHT INDUSTRIES INC 

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 COVENTRY RI 02816 

 1 ARMTEC DEFENSE PRODUCTS 

 S DYER 

 85 901 AVE 53 

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 COACHELLA CA 92236 

 1 NATIONAL COMPOSITE CENTER 

 T CORDELL 

 2000 COMPOSITE DR 

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 3 PACIFIC NORTHWEST LAB 

 M SMITH 

 G VAN ARSDALE 

 R SHIPPELL 

 PO BOX 999 

 RICHLAND WA 99352 

 8 ALLIANT TECHSYSTEMS INC 

 C CANDLAND MN11 2830 

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 B SEE MN11 2439 

 N VLAHAKUS MN11 2145 

 R DOHRN MN11 2830 

 S HAGLUND MN11 2439 

 M HISSONG MN11 2830 

 D KAMDAR MN11 2830 

 600 SECOND ST NE 

 HOPKINS MN 55343-8367 

 

 1 SAIC 

 M PALMER 

 1410 SPRING HILL RD STE 400 

 MS SH4 5 

 MCLEAN VA 22102 

 1 R FIELDS 

 4680 OAKCREEK ST 

 APT 206 

 ORLANDO FL 32835 
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10

 1 APPLIED COMPOSITES 

 W GRISCH 

 333 NORTH SIXTH ST 

 ST CHARLES IL 60174 

 1 CUSTOM ANALYTICAL 

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 A ALEXANDER 

 13000 TENSOR LANE NE 

 FLINTSTONE MD 21530 

 1 AAI CORPORATION 

 DR N B MCNELLIS 

 PO BOX 126 

 HUNT VALLEY MD 21030-0126 

 1 OFC DEPUTY UNDER SEC DEFNS 

 J THOMPSON 

 1745 JEFFERSON DAVIS HWY 

 CRYSTAL SQ 4 STE 501 

 ARLINGTON VA 22202 

 3 ALLIANT TECHSYSTEMS INC 

 J CONDON 

 E LYNAM 

 J GERHARD 

 WV01 16 STATE RT 956 

 PO BOX 210 

 ROCKET CENTER WV 26726-0210 

 1 PROJECTILE TECHNOLOGY INC 

 515 GILES ST 

 HAVRE DE GRACE MD 21078 

 1 HEXCEL INC 

 R BOE 

 PO BOX 18748 

 SALT LAKE CITY UT 84118 

 5 AEROJET GEN CORP 

 D PILLASCH 

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 C FLYNN 

 D RUBAREZUL 

 M GREINER 

 1100 WEST HOLLYVALE ST 

 AZUSA CA 91702-0296 

 1 HERCULES INC 

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 1 BRIGS COMPANY 

 J BACKOFEN 

 2668 PETERBOROUGH ST 

 HERNDON VA 22071-2443 

 1 ZERNOW TECHNICAL SERVICES 

 L ZERNOW 

 425 W BONITA AVE STE 208 

 SAN DIMAS CA 91773 

 1 GENERAL DYNAMICS OTS 

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 10101 NINTH ST NORTH 

 ST PETERSBURG FL 33702 

 2 GENERAL DYNAMICS OTS 

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 450 MURDOCK AVE 

 MERIDEN CT 06450-8324 

 5 SIKORSKY AIRCRAFT 

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 T CARSTENSAN 

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 S GARBO MS S330A 

 J ADELMANN 

 6900 MAIN ST 

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 STRATFORD CT 06497-9729 

 1 PRATT & WHITNEY 

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 400 MAIN ST MS 114 37 

 EAST HARTFORD CT 06108 

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 G HAWKINS M4 945 

 2350 E EL SEGUNDO BLVD 

 EL SEGUNDO CA 90245 

 2 CYTEC FIBERITE 

 M LIN 

 W WEB 

 1440 N KRAEMER BLVD 

 ANAHEIM CA 92806 
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 2 UDLP 

 G THOMAS 

 M MACLEAN 

 PO BOX 58123 

 SANTA CLARA CA 95052 

 1 UDLP WARREN OFC 

 A LEE 

 31201 CHICAGO RD SOUTH 

 SUITE B102 

 WARREN MI 48093 

 2 UDLP 

 R BRYNSVOLD 

 P JANKE MS 170 

 4800 EAST RIVER RD 

 MINNEAPOLIS MN 55421-1498 

 2 BOEING ROTORCRAFT 

 P MINGURT 

 P HANDEL 

 800 B PUTNAM BLVD 

 WALLINGFORD PA 19086 

 1 LOCKHEED MARTIN 

 SKUNK WORKS 

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 1011 LOCKHEED WAY 

 PALMDALE CA 93599-2502 

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 R FIELDS 

 5537 PGA BLVD 

 SUITE 4516 

 ORLANDO FL 32839 

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 & SYSTEMS DIV 

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 1745A W NURSERY RD 

 LINTHICUM MD 21090 

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 D BARTLE 

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 1 GDLS 

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 76 GETTY ST 

 MUSKEGON MI 49442 

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 G WALKER 

 991 ANNAPOLIS WAY 

 WOODBRIDGE VA 22191 

 6 INST FOR ADVANCED 

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 H FAIR 

 I MCNAB 

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 S BLESS 

 W REINECKE 

 C PERSAD 

 3925 W BRAKER LN STE 400 

 AUSTIN TX 78759-5316 

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 1233 SHELBURNE RD STE D8 

 SOUTH BURLINGTON VT 

 05403-7700 
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 1 R EICHELBERGER 

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 409 W CATHERINE ST 

 BEL AIR MD 21014-3613 

 1 SAIC 

 G CHRYSSOMALLIS 

 8500 NORMANDALE LAKE BLVD 

 SUITE 1610 

 BLOOMINGTON MN 55437-3828 

 1 UCLA MANE DEPT ENGR IV 

 H T HAHN 

 LOS ANGELES CA 90024-1597 

 2 UNIV OF DAYTON 

 RESEARCH INST 

 R Y KIM 

 A K ROY 

 300 COLLEGE PARK AVE 

 DAYTON OH 45469-0168 

 1 UMASS LOWELL 

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 N SCHOTT 

 1 UNIVERSITY AVE 

 LOWELL MA 01854 

 1 IIT RESEARCH CENTER 

 D ROSE 

 201 MILL ST 

 ROME NY 13440-6916 

 1 GA TECH RSCH INST 

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 P FRIEDERICH 

 ATLANTA GA 30392 

 1 MICHIGAN ST UNIV 

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 3515 EB 

 EAST LANSING MI 48824-1226 

 1 UNIV OF WYOMING 

 D ADAMS 

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 LARAMIE WY 82071 

 2 PENN STATE UNIV 

 R MCNITT 

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 212 EARTH ENGR 

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 1 PENN STATE UNIV 

 R S ENGEL 

 245 HAMMOND BLDG 

 UNIVERSITY PARK PA 16801 

 1 PURDUE UNIV 

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 C T SUN 

 W LAFAYETTE IN 47907-1282 

 1 STANFORD UNIV 

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 & AEROBALLISTICS 

 S TSAI 

 DURANT BLDG 

 STANFORD CA 94305 

 1 UNIV OF MAINE 

 ADV STR & COMP LAB 

 R LOPEZ ANIDO 

 5793 AEWC BLDG 

 ORONO ME 04469-5793 

 1 JOHNS HOPKINS UNIV 

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 P WIENHOLD 

 11100 JOHNS HOPKINS RD 

 LAUREL MD 20723-6099 

 1 UNIV OF DAYTON 

 J M WHITNEY 

 COLLEGE PARK AVE 

 DAYTON OH 45469-0240 

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 W RASDORF 

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 RALEIGH NC 27696-7908 
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 5 UNIV OF DELAWARE 

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 J GILLESPIE 

 M SANTARE 

 S YARLAGADDA 

 S ADVANI 

 D HEIDER 

 201 SPENCER LABORATORY 

 NEWARK DE 19716 

 1 DEPT OF MATERIALS 

 SCIENCE & ENGINEERING 

 UNIVERSITY OF ILLINOIS 

 AT URBANA CHAMPAIGN 

 J ECONOMY 

 1304 WEST GREEN ST 115B 

 URBANA IL 61801 

 1 UNIV OF MARYLAND 

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 A J VIZZINI 

 COLLEGE PARK MD 20742 

 1 DREXEL UNIV 

 A S D WANG 

 32ND & CHESTNUT ST 

 PHILADELPHIA PA 19104 

 3 UNIV OF TEXAS AT AUSTIN 

 CTR FOR ELECTROMECHANICS 

 J PRICE 

 A WALLS 

 J KITZMILLER 

 10100 BURNET RD 

 AUSTIN TX 78758-4497 

 3 VA POLYTECHNICAL 

 INST & STATE UNIV 

 DEPT OF ESM 

 M W HYER 

 K REIFSNIDER 

 R JONES 

 BLACKSBURG VA 24061-0219 

 1 SOUTHWEST RSCH INST 

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 J RIEGEL 

 6220 CULEBRA RD 

 PO DRAWER 28510 

 SAN ANTONIO TX 78228-0510 

1 BATELLE NATICK OPERATIONS 

 B HALPIN 

 313 SPEEN ST 

 NATICK MA 01760 

ABERDEEN PROVING GROUND

 1 US ARMY MATERIEL 

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 P DIETZ 

 392 HOPKINS RD 

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 1 US ARMY ATC 

 W C FRAZER 

 CSTE DTC AT AC I 

 400 COLLERAN RD 

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 1 DIRECTOR 

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 AMSRL OP AP L 

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 84 DIR USARL 

 AMSRL CI 

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 A MARK 

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 M ADAMSON 

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 R HENRY 

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 A HORST 

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 S WILKERSON 

 A ZIELINSKI 
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ABERDEEN PROVING GROUND (CONT)

 AMSRL WM BD 

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 B RICE 

 AMSRL WM BE 

 C LEVERITT 

 AMSRL WM BF 

 J LACETERA 

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 C SHOEMAKER 

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 AMSRL WM M 

 D VIECHNICKI 

 G HAGNAUER 

 J MCCAULEY 

 AMSRL WM MA 

 L GHIORSE 

 S MCKNIGHT 

 AMSRL WM MB 

 B FINK 

 J BENDER 

 T BOGETTI 

 R BOSSOLI 

 L BURTON 

 K BOYD 

 S CORNELISON 

 P DEHMER 

 R DOOLEY 

 W DRYSDALE 

 G GAZONAS 

 S GHIORSE 

 D GRANVILLE 

 D HOPKINS 

 C HOPPEL 

 D HENRY 

 R KASTE 

 M KLUSEWITZ 

 M LEADORE 

 R LIEB 

 E RIGAS 

 J SANDS 

 D SPAGNUOLO 

 W SPURGEON 

 J TZENG 

 E WETZEL 

ABERDEEN PROVING GROUND (CONT)

 AMRSL WM MC 

 J BEATTY 

 E CHIN 

 J MONTGOMERY 

 A WERECZCAK 

 J LASALVIA 

 AMSRL WM MD 

 W ROY 

 S WALSH 

 AMSRL WM T 

 B BURNS 

 M ZOLTOSKI 

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 W GILLICH 

 T HAVEL 

 J RUNYEON 

 M BURKINS 

 E HORWATH 

 B GOOCH 

 W BRUCHEY 

 M NORMANDIA 

 AMRSL WM TB 

 D KOOKER 

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 A DAS GUPTA 

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 F GREGORY 

 M RAFTENBERG 

 M BOTELER 

 T WEERASOORIYA 

 D DANDEKAR 

 AMSRL WM TE 

 A NIILER 

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 1 LTD 

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 316 ROUTE DE BAYONNE 

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 1 SWISS FEDERAL ARMAMENTS 

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 1 TNO DEFENSE RESEARCH 

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 S 172 90 STOCKHOLM 

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