TOTAL ELECTRONICS INDUSTRY 

Emission Threshold (Mt CO2 Eq) 1,000 10,000 25,000 100,000 

Number of Facilities below 51 102 122 161 

Percent of Facilities below 23.6% 47.2% 56.5% 74.5% 

Total Emissions of Facilities below 22,372 171,262 361,893 1,246,840 

Percent of Emissions below 0.4% 2.9% 6.0% 20.8% 

Number of Facilities above 165 114 94 55 

Percent of Facilities above 76.4% 52.8% 43.5% 25.5% 

Total Emissions of Facilities above 5,962,091 5,813,200 5,622,570 4,737,622 

Percent of Emissions above 99.6% 97.1% 94.0% 79.2% 

Emissions Threshold 25,000 Mt CO2 Eq 

Sector Semiconductors MEMs LCD PV 

Emissions Threshold 

25,000 Mt CO2 

Eq. 

25,000 Mt CO2 

Eq. 

25,000 Mt 

CO2 Eq. 

25,000 Mt 

CO2 Eq. 

Total Number of Facilities in Sector 175 12 9 20 

Total Emissions of Sector (Mt CO2 Eq.) 5,741,676 146,115 23,632 73,039 

Number of Facilities above 91 2 0 1 

Percent of Facilities above 52% 16.7% 0.0% 5.0% 

Emission of Facilities above (Mt CO2 

Eq.) 5,492,066 96,164 0 34,340 

Percent of Emissions above 95.7% 65.8% 0.0% 47.0% 

 

Total number of Electronics Facilities 216 

Total Emissions From All Electronics (Mt CO2 

Eq) 5,984,463 

Total Semiconductor Emissions (Mt CO2 Eq) 5,741,676 

Total MEMs Emissions (Mt CO2 Eq) 146,115.41 

Total FPD Emissions (Mt CO2 Eq) 23,632 

Total PV Emissions (Mt CO2 Eq) 73,039 
Total Number of Semiconductor Facilities 175 

Comments: Semiconductor facilities include both full-scale and pilot/R&D facilities. 

 

 

Semiconductor Emission Threshold Summary: 

Emission Threshold (Mt CO2 Eq) 1,000 10,000 25,000 100,000 

Number of Facilities below 41 67 84 120 

Percent of Facilities below 23.4% 38.3% 48.0% 68.6% 

Total Emissions of Facilities below 20,187 98,467 249,610 1,004,054 

Percent of Emissions below 0.4% 1.7% 4.3% 17.5% 

Number of Facilities above 134 108 91 55 

Percent of Facilities above 76.6% 61.7% 52.0% 31.4% 

Total Emissions of Facilities above 5,721,490 5,643,209 5,492,066 4,737,622 

Percent of Emissions above 99.6% 98.3% 95.7% 82.5% 

Total Number of MEMs Facilities 12 

Comments: MEMs facilities are obtained from World Fab Watch 2007 database. However, this database does not appear to 

contain a complete list of MEMs fabrication facilities in the US.

 

 

MEMs Emission Threshold Summary: 

Emission Threshold (Mt CO2 Eq) 1,000 10,000 25,000 100,000 

Number of Facilities below 2 8 10 12 

Percent of Facilities below 16.7% 66.7% 83.3% 100.0% 

Total Emissions of Facilities below 801 25,377 49,952 146,115 

Percent of Emissions below 0.5% 17.4% 34.2% 100.0% 

Number of Facilities above 10 4 2 0 

Percent of Facilities above 83.3% 33.3% 16.7% 0.0% 

Total Emissions of Facilities above 145,314 120,739 96,164 0 

Percent of Emissions above 99.5% 82.6% 65.8% 0.0% 
Total Number of FPDs Facilities 9 

Comments: FPD facilities that are assumed to use PFCs include LCOS, a-Si TFT-LCDs, OLEDs (assuming active 

matrix), HTPS, TFT, Single Crystal AMLCD, LTPS.

 

 

FPDs Emission Threshold Summary: 

Emission Threshold (Mt CO2 Eq) 1,000 10,000 25,000 100,000 

Number of Facilities below 4 8 9 9 

Percent of Facilities below 44.4% 88.9% 100.0% 100.0% 

Total Emissions of Facilities below 811 8,720 23,632 23,632 

Percent of Emissions below 3.4% 36.9% 100.0% 100.0% 

Number of Facilities above 5 1 0 0 

Percent of Facilities above 55.6% 11.1% 0.0% 0.0% 

Total Emissions of Facilities above 22,821 14,912 0 0 

Percent of Emissions above 96.6% 63.1% 0.0% 0.0% 

Total Number of PV Facilities 20 

Comments: Facilities are estimated (see 'PV' tab for assumptions) and include only silicon based PV (both crystalline 

and amorphous). Due to time contraints of analysis, we could only rely on report by Burton, 2006 ( PV Emissions 

during Photovoltaic (PV) Cell Fabrication: A Scoping Report). PFC Emissions and PFC using PV plants are likely 

overestimates (Please see Note 8).

 

 

PV Emission Threshold Summary: 

Emission Threshold (Mt CO2 Eq) 1,000 10,000 25,000 100,000 

Number of Facilities below 4 19 19 20 

Percent of Facilities below 20.0% 95.0% 95.0% 100.0% 

Total Emissions of Facilities below 572 38,699 38,699 73,039 

Percent of Emissions below 0.8% 53.0% 53.0% 100.0% 

Number of Facilities above 16 1 1 0 

Percent of Facilities above 80.0% 5.0% 5.0% 0.0% 

Total Emissions of Facilities above 72,466 34,340 34,340 0 

Percent of Emissions above 99.2% 47.0% 47.0% 0.0% 
Electronics Tier 1 Default Emission Factors (mean) 

CF4 C2F6 CHF3 C3F8 NF3 SF6 C6F14 

Overall Emission Factor (Mt CO2 Eq) 

Semiconductors (kg/m2 Si) 0.90 1.00 0.04 0.05 0.04 0.20 0.30 Semiconductors (Mt CO2 Eq/m2 Si) 23.19 TFT-FPD (g/m2 TFT-FPD) 0.50 0.90 4.00 TFT-FPD (Mt CO2 Eq/m2 TFT-FPD) 0.11 PV-Cells (g/m2 PV-Cell) 5.00 0.20 PV-Cells (Mt CO2 Eq/m2 PV-Cell) 0.03 MEMs (kg/m2 Si) 1.02 MEMs (Mt CO2 Eq/m2 Si) 24.41 Source: IPCC, 2006 

Semiconductors (Mt CO2 Eq/m2 TMLA) 3.425 

Comment: The upper bound of the 95% confidence interval in this sector is not used, as the uncertainties vary between 0 and 200% for semiconductors and TFT-FPD. Additionally, no uncertainties are available for heat transfer fluids, MEMs, and PV.

Semiconductor Gas Usage Calculations 

CF4 C2F6 CHF3 C3F8 NF3 SF6 

Emission Factor (Tier 2a) 0.9 0.6 0.4 0.4 0.11 0.2 Gas Usage (kg/m2 Si) 1.0 1.7 0.1 0.1 0.4 1.0 Percent of Total Gas Usage 24% 39% 2% 3% 9% 24% Source: IPCC, 2006 
 

 Large Facilties Facility

Est Actual 

TMLA in 

MSI 

(Average 

for 2006)

Est Actual 

Area of Si 

(m2)

Emissions from 

etching/cleanin

g (MMTCE)

Emissions from 

etching/cleaning 

(Mt CO2 Eq)

Emissions 

from heat 

transfer 

fluids 

(MMTCE)

Emissions 

from heat 

transfer 

fluids (Mt 

CO2 Eq)

Total 

Emissions 

(Mt CO2 

Eq)

Cummulative 

Emissions (Mt 

CO2 Eq)

Facility 1 325.72 42,024 0.04 139,625.66 0.00 14,776.26 154,401.93 154,402 

Facility 2 289.53 37,355 0.03 124,111.70 0.00 13,134.46 137,246.16 291,648 

Facility 3 427.51 26,265 0.05 183,258.68 0.01 19,393.85 202,652.53 494,301 

Facility 4 309.60 21,888 0.04 132,717.10 0.00 14,045.15 146,762.25 641,063 

Facility 5 356.26 21,888 0.04 152,715.57 0.00 16,161.54 168,877.11 809,940 

Facility 6 407.15 21,012 0.05 174,532.08 0.01 18,470.33 193,002.41 1,002,942 

Facility 7 150.80 19,456 0.07 271,829.33 0.01 28,767.08 300,596.40 1,303,539 

Facility 8 144.76 18,677 0.02 62,055.85 0.00 6,567.23 68,623.08 1,372,162 

Facility 9 244.29 17,510 0.03 104,719.25 0.00 11,082.20 115,801.45 1,487,963 

Facility 10 132.70 17,121 0.02 56,884.53 0.00 6,019.96 62,904.49 1,550,868 

Facility 11 123.16 15,890 0.01 52,795.95 0.00 5,587.28 58,383.23 1,609,251 

Facility 12 183.37 14,786 0.02 78,604.08 0.00 8,318.49 86,922.57 1,696,174 

Facility 13 78.38 14,446 0.04 141,283.29 0.00 14,951.69 156,234.98 1,852,409 

Facility 14 171.00 14,008 0.08 308,254.45 0.01 32,621.86 340,876.32 2,193,285 

Facility 15 190.00 13,619 0.02 81,448.30 0.00 8,619.49 90,067.79 2,283,353 

Facility 16 159.24 12,841 0.02 68,261.44 0.00 7,223.95 75,485.39 2,358,838 

Facility 17 92.29 11,907 0.01 39,560.60 0.00 4,186.61 43,747.21 2,402,585 

Facility 18 18.16 11,712 0.01 32,728.25 0.00 3,463.56 36,191.81 2,438,777 

Facility 19 190.00 11,673 0.02 81,448.30 0.00 8,619.49 90,067.79 2,528,845 

Facility 20 81.43 11,673 0.01 34,906.42 0.00 3,694.07 38,600.48 2,567,445 

Facility 21 126.67 11,673 0.06 228,336.63 0.01 24,164.34 252,500.98 2,819,946 

Facility 22 126.67 11,673 0.01 54,298.87 0.00 5,746.33 60,045.19 2,879,992 

Facility 23 108.57 11,673 0.01 46,541.89 0.00 4,925.42 51,467.31 2,931,459 

Facility 24 183.67 11,284 0.02 78,733.36 0.00 8,332.17 87,065.53 3,018,524 

Facility 25 69.22 11,163 0.01 29,670.45 0.00 3,139.96 32,810.41 3,051,335 

Facility 26 128.25 10,506 0.01 54,977.61 0.00 5,818.15 60,795.76 3,112,131 

Facility 27 128.25 10,506 0.01 54,977.61 0.00 5,818.15 60,795.76 3,172,926 

Facility 28 146.57 10,506 0.02 62,831.55 0.00 6,649.32 69,480.87 3,242,407 

Facility 29 94.10 10,117 0.01 40,336.30 0.00 4,268.70 44,605.00 3,287,012 

Facility 30 101.34 9,339 0.01 43,439.10 0.00 4,597.06 48,036.16 3,335,048 

Facility 31 75.95 8,908 0.01 32,557.51 0.00 3,445.49 36,002.99 3,371,051 

Facility 32 142.50 8,755 0.02 61,086.23 0.00 6,464.62 67,550.84 3,438,602 

Facility 33 66.35 8,561 0.03 119,604.90 0.00 12,657.51 132,262.42 3,570,865 

Facility 34 87.88 8,098 0.01 37,669.84 0.00 3,986.51 41,656.35 3,612,521 

Facility 35 108.57 7,782 0.01 46,541.89 0.00 4,925.42 51,467.31 3,663,988 

Facility 36 108.57 7,782 0.05 195,717.11 0.01 20,712.29 216,429.41 3,880,418 

Facility 37 135.72 7,004 0.02 58,177.36 0.00 6,156.78 64,334.14 3,944,752 

Facility 38 97.72 7,004 0.01 41,887.70 0.00 4,432.88 46,320.58 3,991,072 

Facility 39 80.75 6,615 0.04 145,564.60 0.00 15,404.77 160,969.37 4,152,042 

Facility 40 9.42 6,080 0.00 16,989.33 0.00 1,797.94 18,787.28 4,170,829 

Facility 41 45.49 6,019 0.02 81,994.77 0.00 8,677.32 90,672.09 4,261,501 

Facility 42 81.43 5,837 0.01 34,906.42 0.00 3,694.07 38,600.48 4,300,102 

Facility 43 95.00 5,837 0.01 40,724.15 0.00 4,309.74 45,033.90 4,345,135 

Facility 44 48.52 5,691 0.01 20,798.41 0.00 2,201.05 22,999.45 4,368,135 

Facility 45 60.80 5,603 0.03 109,601.58 0.00 11,598.88 121,200.47 4,489,335 

Facility 46 47.52 5,574 0.01 20,371.24 0.00 2,155.84 22,527.08 4,511,862 

Facility 47 8.48 5,472 0.00 15,290.40 0.00 1,618.15 16,908.55 4,528,771 

Facility 48 8.48 5,472 0.00 3,636.08 0.00 384.80 4,020.88 4,532,792 

Facility 49 8.31 5,362 0.00 14,984.59 0.00 1,585.79 16,570.38 4,549,362 

Facility 50 48.86 5,253 0.02 88,072.70 0.00 9,320.53 97,393.23 4,646,756 

Facility 51 6.79 4,378 0.00 12,232.32 0.00 1,294.52 13,526.84 4,660,282 

Facility 52 20.36 4,378 0.00 8,726.60 0.00 923.52 9,650.12 4,669,932 

Facility 53 27.02 4,358 0.00 11,583.76 0.00 1,225.88 12,809.64 4,682,742 

Facility 54 33.59 4,334 0.00 14,398.90 0.00 1,523.80 15,922.70 4,698,665 

Facility 55 19.54 4,202 0.01 35,229.08 0.00 3,728.21 38,957.29 4,737,622 

Facility 56 64.53 3,918 0.01 27,661.52 0.00 2,927.36 30,588.87 4,768,211 

Facility 57 24.13 3,891 0.01 43,492.69 0.00 4,602.73 48,095.42 4,816,306 

Facility 58 31.67 3,891 0.02 57,084.16 0.00 6,041.09 63,125.24 4,879,432 

Facility 59 31.10 3,648 0.02 56,064.80 0.00 5,933.21 61,998.01 4,941,430 

Facility 60 21.71 3,502 0.00 9,308.38 0.00 985.08 10,293.46 4,951,723 

Facility 61 20.36 3,283 0.01 36,696.96 0.00 3,883.56 40,580.51 4,992,304 

Facility 62 20.36 3,283 0.00 8,726.60 0.00 923.52 9,650.12 5,001,954 

Facility 63 23.16 3,064 0.01 41,742.79 0.00 4,417.54 46,160.33 5,048,114 

Facility 64 26.46 2,845 0.01 47,706.05 0.00 5,048.62 52,754.67 5,100,869 

Facility 65 4.22 2,724 0.00 1,809.96 0.00 191.54 2,001.51 5,102,870 

Facility 66 12.21 2,627 0.01 22,018.18 0.00 2,330.13 24,348.31 5,127,219 

Facility 67 22.08 2,374 0.01 39,795.81 0.00 4,211.50 44,007.31 5,171,226 

Facility 68 3.62 2,335 0.00 6,523.90 0.00 690.41 7,214.31 5,178,440 

Facility 69 3.53 2,280 0.00 6,371.00 0.00 674.23 7,045.23 5,185,485 

Facility 70 30.96 2,189 0.02 55,809.96 0.00 5,906.24 61,716.20 5,247,202 
Facility

Est Actual 

TMLA in MSI 

(Average for 

2006)

Est Actual 

Area of Si 

(m2)

Emissions from 

etching/cleaning 

(MMTCE)

Emissions from 

etching/cleaning 

(Mt CO2 Eq)

Emissions 

from heat 

transfer fluids 

(MMTCE)

Emissions 

from heat 

transfer fluids 

(Mt CO2 Eq)

Total 

Emissions (Mt 

CO2 Eq)

Cummulative 

Emissions (Mt CO2 

Eq)

FLaacili rgtye71Facilties 20.36 2,189 0.00 8,726.60 0.00 923.52 9,650.12 5,256,852

Facility 72 3.39 2,189 0.00 6,116.16 0.00 647.26 6,763.42 5,263,615

Facility 73 3.39 2,189 0.00 1,454.43 0.00 153.92 1,608.35 5,265,224

Facility 74 18.66 2,189 0.01 33,638.88 0.00 3,559.93 37,198.80 5,302,422

Facility 75 9.05 1,946 0.00 16,309.76 0.00 1,726.02 18,035.78 5,320,458

Facility 76 9.05 1,946 0.00 16,309.76 0.00 1,726.02 18,035.78 5,338,494

Facility 77 3.02 1,946 0.00 5,436.59 0.00 575.34 6,011.93 5,344,506

Facility 78 7.96 1,868 0.00 14,352.59 0.00 1,518.90 15,871.49 5,360,377

Facility 79 15.86 1,860 0.00 6,799.48 0.00 719.57 7,519.05 5,367,896

Facility 80 8.14 1,751 0.00 14,678.78 0.00 1,553.42 16,232.21 5,384,129

Facility 81 14.93 1,751 0.01 26,911.10 0.00 2,847.94 29,759.04 5,413,888

Facility 82 2.71 1,751 0.00 4,892.93 0.00 517.81 5,410.74 5,419,298

Facility 83 2.52 1,626 0.00 4,544.65 0.00 480.95 5,025.60 5,424,324

Facility 84 2.41 1,557 0.00 4,351.42 0.00 460.50 4,811.92 5,429,136

Facility 85 12.67 1,556 0.01 22,833.66 0.00 2,416.43 25,250.10 5,454,386

Facility 86 2.12 1,368 0.00 3,822.60 0.00 404.54 4,227.14 5,458,613

Facility 87 10.26 1,204 0.01 18,501.38 0.00 1,957.96 20,459.34 5,479,072

Facility 88 5.43 1,167 0.00 2,327.09 0.00 246.27 2,573.37 5,481,646

Facility 89 1.81 1,167 0.00 3,261.95 0.00 345.20 3,607.16 5,485,253

Facility 90 7.24 1,167 0.00 3,102.79 0.00 328.36 3,431.15 5,488,684

Facility 91 1.70 1,094 0.00 3,058.08 0.00 323.63 3,381.71 5,492,066

Facility 92 1.62 1,046 0.00 2,922.17 0.00 309.25 3,231.41 5,495,297

Facility 93 1.51 973 0.00 2,718.29 0.00 287.67 3,005.96 5,498,303

Facility 94 4.15 973 0.00 7,475.31 0.00 791.09 8,266.40 5,506,570

Facility 95 1.49 963 0.00 639.95 0.00 67.72 707.68 5,507,277

Facility 96 1.36 876 0.00 2,446.46 0.00 258.90 2,705.37 5,509,983

Facility 97 3.57 837 0.00 6,428.76 0.00 680.34 7,109.10 5,517,092

Facility 98 5.04 788 0.00 9,082.50 0.00 961.18 10,043.68 5,527,135

Facility 99 3.62 778 0.00 6,523.90 0.00 690.41 7,214.31 5,534,350

Facility 100 8.31 766 0.00 14,984.59 0.00 1,585.79 16,570.38 5,550,920

Facility 101 1.13 730 0.00 2,038.72 0.00 215.75 2,254.47 5,553,175

Facility 102 2.90 623 0.00 5,219.12 0.00 552.33 5,771.45 5,558,946

Facility 103 4.59 608 0.00 8,282.30 0.00 876.50 9,158.80 5,568,105

Facility 104 0.85 547 0.00 1,529.04 0.00 161.81 1,690.85 5,569,796

Facility 105 0.75 486 0.00 1,359.15 0.00 143.84 1,502.98 5,571,299

Facility 106 0.75 486 0.00 1,359.15 0.00 143.84 1,502.98 5,572,802

Facility 107 0.71 460 0.00 1,284.39 0.00 135.92 1,420.32 5,574,222

Facility 108 34.61 420 0.02 62,384.83 0.00 6,602.04 68,986.87 5,643,209

Facility 109 3.62 389 0.00 6,523.90 0.00 690.41 7,214.31 5,650,423

Facility 110 35.29 350 0.00 15,126.11 0.00 1,600.76 16,726.88 5,667,150

Facility 111 2.99 350 0.00 5,382.22 0.00 569.59 5,951.81 5,673,102

Facility 112 0.50 323 0.00 902.47 0.00 95.51 997.98 5,674,100

Facility 113 0.34 219 0.00 611.62 0.00 64.73 676.34 5,674,776

Facility 114 0.34 219 0.00 611.62 0.00 64.73 676.34 5,675,453

Facility 115 1.58 195 0.00 2,854.21 0.00 302.05 3,156.26 5,678,609

Facility 116 0.90 195 0.00 1,630.98 0.00 172.60 1,803.58 5,680,412

Facility 117 1.36 175 0.00 2,446.46 0.00 258.90 2,705.37 5,683,118

Facility 118 0.24 153 0.00 428.13 0.00 45.31 473.44 5,683,591

Facility 119 0.23 146 0.00 407.74 0.00 43.15 450.89 5,684,042

Facility 120 0.19 125 0.00 350.66 0.00 37.11 387.77 5,684,430

Facility 121 0.17 109 0.00 305.81 0.00 32.36 338.17 5,684,768

Facility 122 0.17 109 0.00 305.81 0.00 32.36 338.17 5,685,106

Facility 123 9.10 90 0.00 3,902.54 0.00 413.00 4,315.53 5,689,422

Facility 124 7.31 89 0.00 3,131.88 0.00 331.44 3,463.32 5,692,885

Facility 125 0.14 88 0.00 244.65 0.00 25.89 270.54 5,693,156

Facility 126 0.12 78 0.00 217.46 0.00 23.01 240.48 5,693,396

Facility 127 7.54 78 0.00 3,232.08 0.00 342.04 3,574.12 5,696,970

Facility 128 6.35 63 0.00 2,722.70 0.00 288.14 3,010.84 5,699,981

Facility 129 5.13 62 0.00 9,242.20 0.00 978.08 10,220.28 5,710,201

Facility 130 0.39 50 0.00 695.88 0.00 73.64 769.53 5,710,971

Facility 131 0.08 49 0.00 135.91 0.00 14.38 150.30 5,711,121

Facility 132 0.07 46 0.00 127.37 0.00 13.48 140.85 5,711,262

Facility 133 2.48 34 0.00 4,478.26 0.00 473.92 4,952.18 5,716,214

Facility 134 0.97 31 0.00 1,739.71 0.00 184.11 1,923.82 5,718,138

Facility 135 0.72 31 0.00 1,304.78 0.00 138.08 1,442.86 5,719,581

Facility 136 0.92 26 0.00 1,651.36 0.00 174.76 1,826.12 5,721,407

Facility 137 2.65 26 0.00 4,770.60 0.00 504.86 5,275.47 5,726,682

Facility 138 0.03 22 0.00 61.16 0.00 6.47 67.63 5,726,750

Facility 139 1.43 18 0.00 2,568.79 0.00 271.85 2,840.64 5,729,591

Facility 140 1.76 18 0.00 756.31 0.00 80.04 836.34 5,730,427

Facility 141 0.36 16 0.00 652.39 0.00 69.04 721.43 5,731,148

Facility 142 0.33 14 0.00 587.15 0.00 62.14 649.29 5,731,798
Facility

Est Actual 

TMLA in MSI 

(Average for 

2006)

Est Actual 

Area of Si 

(m2)

Emissions from 

etching/cleaning 

(MMTCE)

Emissions from 

etching/cleaning 

(Mt CO2 Eq)

Emissions 

from heat 

transfer fluids 

(MMTCE)

Emissions 

from heat 

transfer fluids 

(Mt CO2 Eq)

Total 

Emissions (Mt 

CO2 Eq)

Cummulative 

Emissions (Mt CO2 

Eq)

FLaacili rgtye143 Facilties 0.29 12 0.00 521.91 0.00 55.23 577.15 5,732,375

Facility 144 0.02 11 0.00 30.58 0.00 3.24 33.82 5,732,409

Facility 145 0.06 8 0.00 116.89 0.00 12.37 129.26 5,732,538

Facility 146 0.42 8 0.00 761.12 0.00 80.55 841.67 5,733,380

Facility 147 0.78 8 0.00 336.14 0.00 35.57 371.71 5,733,751

Facility 148 0.78 8 0.00 1,413.51 0.00 149.59 1,563.10 5,735,314

Facility 149 0.71 7 0.00 1,272.16 0.00 134.63 1,406.79 5,736,721

Facility 150 0.14 6 0.00 260.96 0.00 27.62 288.57 5,737,010

Facility 151 0.14 6 0.00 260.96 0.00 27.62 288.57 5,737,298

Facility 152 0.13 5 0.00 228.34 0.00 24.16 252.50 5,737,551

Facility 153 0.15 5 0.00 271.83 0.00 28.77 300.60 5,737,851

Facility 154 0.11 5 0.00 195.72 0.00 20.71 216.43 5,738,068

Facility 155 0.10 4 0.00 183.48 0.00 19.42 202.90 5,738,271

Facility 156 0.19 4 0.00 342.50 0.00 36.25 378.75 5,738,650

Facility 157 0.35 4 0.00 636.08 0.00 67.31 703.40 5,739,353

Facility 158 0.10 3 0.00 173.97 0.00 18.41 192.38 5,739,545

Facility 159 0.02 3 0.00 43.49 0.00 4.60 48.10 5,739,593

Facility 160 0.09 3 0.00 165.14 0.00 17.48 182.61 5,739,776

Facility 161 0.08 2 0.00 139.18 0.00 14.73 153.91 5,739,930

Facility 162 0.16 2 0.00 285.42 0.00 30.21 315.63 5,740,246

Facility 163 0.07 2 0.00 134.56 0.00 14.24 148.80 5,740,394

Facility 164 0.17 2 0.00 305.81 0.00 32.36 338.17 5,740,733

Facility 165 0.17 2 0.00 305.81 0.00 32.36 338.17 5,741,071

Facility 166 0.01 2 0.00 21.75 0.00 2.30 24.05 5,741,095

Facility 167 0.07 2 0.00 119.60 0.00 12.66 132.26 5,741,227

Facility 168 0.14 1 0.00 247.70 0.00 26.21 273.92 5,741,501

Facility 169 0.02 1 0.00 42.81 0.00 4.53 47.34 5,741,548

Facility 170 0.00 0 0.00 6.80 0.00 0.72 7.51 5,741,556

Facility 171 0.02 0 0.00 38.06 0.00 4.03 42.08 5,741,598

Facility 172 0.01 0 0.00 16.31 0.00 1.73 18.04 5,741,616

Facility 173 0.01 0 0.00 26.91 0.00 2.85 29.76 5,741,646

Facility 174 0.01 0 0.00 16.82 0.00 1.78 18.60 5,741,664

Facility 175 0.01 0 0.00 10.87 0.00 1.15 12.02 5,741,676

7,443 736,358 1.42 5,192,198 0.15 549,478 5,741,676 833,788,442
Facility

Facility 1

Facility 2

Facility 3

Facility 4

Facility 5

Facility 6

Facility 7

Facility 8

Facility 9

Facility 10

Facility 11

Facility 12

Facility 13

Facility 14

Facility 15

Facility 16

Facility 17

Facility 18

Facility 19

Facility 20

Facility 21

Facility 22

Facility 23

Facility 24

Facility 25

Facility 26

Facility 27

Facility 28

Facility 29

Facility 30

Facility 31

Facility 32

Facility 33

Facility 34

Facility 35

Facility 36

Facility 37

Facility 38

Facility 39

Facility 40

Facility 41

Facility 42

Facility 43

Facility 44

Facility 45

Facility 46

Facility 47

Facility 48

Facility 49

Facility 50

Facility 51

Facility 52

Facility 53

Facility 54

Facility 55

Facility 56

Facility 57

Facility 58

Facility 59

Facility 60

Facility 61

Facility 62

Facility 63

Facility 64

Facility 65

Facility 66

Facility 67

Facility 68

Facility 69

Facility 70

Emissions 

from 

etching/clea

ning 

(MMTCE)

Emissions 

from 

etching/clea

ning (Mt 

CO2 Eq)

Emissions 

from heat 

transfer 

fluids 

(MMTCE)

Emissions 

from heat 

transfer 

fluids (Mt 

CO2 Eq)

Total 

Emissions 

(Mt CO2 Eq)

0.01 39,795.81 0.00 4,211.50 44,007.31

0.02 56,064.80 0.00 5,933.21 61,998.01

0.01 36,696.96 0.00 3,883.56 40,580.51

0.00 14,984.59 0.00 1,585.79 16,570.38

0.00 1,529.04 0.00 161.81 1,690.85

0.04 141,283.29 0.00 14,951.69 156,234.98

0.00 5,382.22 0.00 569.59 5,951.81

0.02 55,809.96 0.00 5,906.24 61,716.20

0.00 61.16 0.00 6.47 67.63

0.00 8,282.30 0.00 876.50 9,158.80

0.00 4,544.65 0.00 480.95 5,025.60

0.00 305.81 0.00 32.36 338.17

0.03 119,604.90 0.00 12,657.51 132,262.42

0.01 47,706.05 0.00 5,048.62 52,754.67

0.00 6,523.90 0.00 690.41 7,214.31

0.01 32,728.25 0.00 3,463.56 36,191.81

0.00 2,922.17 0.00 309.25 3,231.41

0.00 135.91 0.00 14.38 150.30

0.00 15,290.40 0.00 1,618.15 16,908.55

0.00 244.65 0.00 25.89 270.54

0.01 20,798.41 0.00 2,201.05 22,999.45

0.00 8,726.60 0.00 923.52 9,650.12

0.01 43,439.10 0.00 4,597.06 48,036.16

0.02 78,604.08 0.00 8,318.49 86,922.57

0.02 78,733.36 0.00 8,332.17 87,065.53

0.00 639.95 0.00 67.72 707.68

0.00 9,308.38 0.00 985.08 10,293.46

0.00 8,726.60 0.00 923.52 9,650.12

0.00 902.47 0.00 95.51 997.98

0.00 305.81 0.00 32.36 338.17

0.00 611.62 0.00 64.73 676.34

0.00 217.46 0.00 23.01 240.48

0.02 62,055.85 0.00 6,567.23 68,623.08

0.04 132,717.10 0.00 14,045.15 146,762.25

0.01 27,661.52 0.00 2,927.36 30,588.87

0.01 54,977.61 0.00 5,818.15 60,795.76

0.01 54,977.61 0.00 5,818.15 60,795.76

0.01 43,492.69 0.00 4,602.73 48,095.42

0.00 14,398.90 0.00 1,523.80 15,922.70

0.00 6,116.16 0.00 647.26 6,763.42

0.05 174,532.08 0.01 18,470.33 193,002.41

0.02 61,086.23 0.00 6,464.62 67,550.84

0.02 58,177.36 0.00 6,156.78 64,334.14

0.04 152,715.57 0.00 16,161.54 168,877.11

0.01 34,906.42 0.00 3,694.07 38,600.48

0.01 40,724.15 0.00 4,309.74 45,033.90

0.00 11,583.76 0.00 1,225.88 12,809.64

0.02 81,448.30 0.00 8,619.49 90,067.79

0.02 62,831.55 0.00 6,649.32 69,480.87

0.01 46,541.89 0.00 4,925.42 51,467.31

0.01 34,906.42 0.00 3,694.07 38,600.48

0.02 81,448.30 0.00 8,619.49 90,067.79

0.00 12,232.32 0.00 1,294.52 13,526.84

0.00 6,371.00 0.00 674.23 7,045.23

0.00 16,989.33 0.00 1,797.94 18,787.28

0.00 6,799.48 0.00 719.57 7,519.05

0.00 2,327.09 0.00 246.27 2,573.37

0.00 428.13 0.00 45.31 473.44

0.04 145,564.60 0.00 15,404.77 160,969.37

0.00 611.62 0.00 64.73 676.34

0.00 3,058.08 0.00 323.63 3,381.71

0.00 1,454.43 0.00 153.92 1,608.35

0.00 6,523.90 0.00 690.41 7,214.31

0.00 14,678.78 0.00 1,553.42 16,232.21

0.01 26,911.10 0.00 2,847.94 29,759.04

0.00 16,309.76 0.00 1,726.02 18,035.78

0.02 57,084.16 0.00 6,041.09 63,125.24

0.05 195,717.11 0.01 20,712.29 216,429.41

0.00 16,309.76 0.00 1,726.02 18,035.78

0.00 9,082.50 0.00 961.18 10,043.68
Facility

Facility 71

Facility 72

Facility 73

Facility 74

Facility 75

Facility 76

Facility 77

Facility 78

Facility 79

Facility 80

Facility 81

Facility 82

Facility 83

Facility 84

Facility 85

Facility 86

Facility 87

Facility 88

Facility 89

Facility 90

Facility 91

Facility 92

Facility 93

Facility 94

Facility 95

Facility 96

Facility 97

Facility 98

Facility 99

Facility 100

Facility 101

Facility 102

Facility 103

Facility 104

Facility 105

Facility 106

Facility 107

Facility 108

Facility 109

Facility 110

Facility 111

Facility 112

Facility 113

Facility 114

Facility 115

Facility 116

Facility 117

Facility 118

Facility 119

Facility 120

Facility 121

Facility 122

Facility 123

Facility 124

Facility 125

Facility 126

Facility 127

Facility 128

Facility 129

Facility 130

Facility 131

Facility 132

Facility 133

Facility 134

Facility 135

Facility 136

Facility 137

Facility 138

Facility 139

Facility 140

Facility 141

Facility 142

Emissions 

from 

etching/clea

ning 

(MMTCE)

Emissions 

from 

etching/clea

ning (Mt 

CO2 Eq)

Emissions 

from heat 

transfer 

fluids 

(MMTCE)

Emissions 

from heat 

transfer 

fluids (Mt 

CO2 Eq)

Total 

Emissions 

(Mt CO2 Eq)

0.00 1,284.39 0.00 135.92 1,420.32

0.02 88,072.70 0.00 9,320.53 97,393.23

0.03 109,601.58 0.00 11,598.88 121,200.47

0.06 228,336.63 0.01 24,164.34 252,500.98

0.04 139,625.66 0.00 14,776.26 154,401.93

0.03 124,111.70 0.00 13,134.46 137,246.16

0.00 1,809.96 0.00 191.54 2,001.51

0.00 1,359.15 0.00 143.84 1,502.98

0.00 4,351.42 0.00 460.50 4,811.92

0.00 350.66 0.00 37.11 387.77

0.00 127.37 0.00 13.48 140.85

0.00 30.58 0.00 3.24 33.82

0.01 33,638.88 0.00 3,559.93 37,198.80

0.02 68,261.44 0.00 7,223.95 75,485.39

0.01 32,557.51 0.00 3,445.49 36,002.99

0.01 37,669.84 0.00 3,986.51 41,656.35

0.01 54,298.87 0.00 5,746.33 60,045.19

0.01 41,887.70 0.00 4,432.88 46,320.58

0.00 3,636.08 0.00 384.80 4,020.88

0.00 2,446.46 0.00 258.90 2,705.37

0.01 22,833.66 0.00 2,416.43 25,250.10

0.01 41,742.79 0.00 4,417.54 46,160.33

0.00 2,718.29 0.00 287.67 3,005.96

0.00 6,428.76 0.00 680.34 7,109.10

0.01 52,795.95 0.00 5,587.28 58,383.23

0.02 56,884.53 0.00 6,019.96 62,904.49

0.07 271,829.33 0.01 28,767.08 300,596.40

0.00 2,854.21 0.00 302.05 3,156.26

0.00 3,261.95 0.00 345.20 3,607.16

0.00 1,359.15 0.00 143.84 1,502.98

0.00 407.74 0.00 43.15 450.89

0.00 4,892.93 0.00 517.81 5,410.74

0.01 39,560.60 0.00 4,186.61 43,747.21

0.01 22,018.18 0.00 2,330.13 24,348.31

0.00 14,352.59 0.00 1,518.90 15,871.49

0.01 40,336.30 0.00 4,268.70 44,605.00

0.00 8,726.60 0.00 923.52 9,650.12

0.01 18,501.38 0.00 1,957.96 20,459.34

0.00 3,822.60 0.00 404.54 4,227.14

0.05 183,258.68 0.01 19,393.85 202,652.53

0.01 46,541.89 0.00 4,925.42 51,467.31

0.03 104,719.25 0.00 11,082.20 115,801.45

0.01 29,670.45 0.00 3,139.96 32,810.41

0.01 20,371.24 0.00 2,155.84 22,527.08

0.00 3,102.79 0.00 328.36 3,431.15

0.00 1,630.98 0.00 172.60 1,803.58

0.00 5,436.59 0.00 575.34 6,011.93

0.00 5,219.12 0.00 552.33 5,771.45

0.00 7,475.31 0.00 791.09 8,266.40

0.00 14,984.59 0.00 1,585.79 16,570.38

0.00 6,523.90 0.00 690.41 7,214.31

0.08 308,254.45 0.01 32,621.86 340,876.32

0.00 2,038.72 0.00 215.75 2,254.47

0.02 81,994.77 0.00 8,677.32 90,672.09

0.00 761.12 0.00 80.55 841.67

0.00 2,568.79 0.00 271.85 2,840.64

0.02 62,384.83 0.00 6,602.04 68,986.87

0.00 6.80 0.00 0.72 7.51

0.00 116.89 0.00 12.37 129.26

0.00 587.15 0.00 62.14 649.29

0.00 228.34 0.00 24.16 252.50

0.00 165.14 0.00 17.48 182.61

0.00 139.18 0.00 14.73 153.91

0.00 260.96 0.00 27.62 288.57

0.00 4,478.26 0.00 473.92 4,952.18

0.00 21.75 0.00 2.30 24.05

0.00 26.91 0.00 2.85 29.76

0.00 42.81 0.00 4.53 47.34

0.00 2,722.70 0.00 288.14 3,010.84

0.00 336.14 0.00 35.57 371.71

0.00 756.31 0.00 80.04 836.34

0.00 15,126.11 0.00 1,600.76 16,726.88
Facility

Facility 143

Facility 144

Facility 145

Facility 146

Facility 147

Facility 148

Facility 149

Facility 150

Facility 151

Facility 152

Facility 153

Facility 154

Facility 155

Facility 156

Facility 157

Facility 158

Facility 159

Facility 160

Facility 161

Facility 162

Facility 163

Facility 164

Facility 165

Facility 166

Facility 167

Facility 168

Facility 169

Facility 170

Facility 171

Facility 172

Facility 173

Facility 174

Facility 175

Emissions 

from 

etching/clea

ning 

(MMTCE)

Emissions 

from 

etching/clea

ning (Mt 

CO2 Eq)

Emissions 

from heat 

transfer 

fluids 

(MMTCE)

Emissions 

from heat 

transfer 

fluids (Mt 

CO2 Eq)

Total 

Emissions 

(Mt CO2 Eq)

0.00 2,446.46 0.00 258.90 2,705.37

0.00 173.97 0.00 18.41 192.38

0.00 271.83 0.00 28.77 300.60

0.00 695.88 0.00 73.64 769.53

0.00 3,131.88 0.00 331.44 3,463.32

0.00 134.56 0.00 14.24 148.80

0.00 305.81 0.00 32.36 338.17

0.00 305.81 0.00 32.36 338.17

0.00 16.82 0.00 1.78 18.60

0.00 183.48 0.00 19.42 202.90

0.00 1,739.71 0.00 184.11 1,923.82

0.00 1,304.78 0.00 138.08 1,442.86

0.00 260.96 0.00 27.62 288.57

0.00 521.91 0.00 55.23 577.15

0.00 1,651.36 0.00 174.76 1,826.12

0.00 119.60 0.00 12.66 132.26

0.00 342.50 0.00 36.25 378.75

0.00 195.72 0.00 20.71 216.43

0.00 10.87 0.00 1.15 12.02

0.00 43.49 0.00 4.60 48.10

0.00 9,242.20 0.00 978.08 10,220.28

0.00 652.39 0.00 69.04 721.43

0.00 3,902.54 0.00 413.00 4,315.53

0.00 38.06 0.00 4.03 42.08

0.00 3,232.08 0.00 342.04 3,574.12

0.00 247.70 0.00 26.21 273.92

0.00 16.31 0.00 1.73 18.04

0.00 1,413.51 0.00 149.59 1,563.10

0.00 1,272.16 0.00 134.63 1,406.79

0.00 636.08 0.00 67.31 703.40

0.00 4,770.60 0.00 504.86 5,275.47

0.00 285.42 0.00 30.21 315.63

0.01 35,229.08 0.00 3,728.21 38,957.29
Factors and Assumptions

175 Number of Semiconductor facilities

5,987 Total TMLA of Partner Facilities

7443 Total TMLA All Facilities

0.70 2006 Semiconductor Partner reported emissions (MMTCE)

0.07 2006 Semiconductor Partner estimated heat transfer fluid emissions (MMTCE)

3.66 2006 US Uncontrolled Semiconductor Emissions (MMTCE). PEVM v4.0.0701.0701

0.39 2006 US estimated heat transfer fluid emissions (MMTCE)

12.02 Total US Emissions Mt CO2 Eq (Partner reported + Non-Partner uncontrolled, scaled-up to include heat transfer fluids)
MEMs

Facility

Substrate Processed 

(m2 Si)

Emissions 

(Mt CO2 Eq)

Facility 1 547.19 13,356.07

Facility 2 21.89 534.24

Facility 3 218.88 5,342.43

Facility 4 2,188.76 53,424.28

Facility 5 153.21 3,739.70

Facility 6 218.88 5,342.43

Facility 7 459.64 11,219.10

Facility 8 10.94 267.12

Facility 9 87.55 2,136.97

Facility 10 218.88 5,342.43

Facility 11 109.44 2,671.21

Facility 12 1,751.01 42,739.43

Total 5,986.27 146,115.41
FPD

Facility

Substrate Area 

(m2)

Emissions 

(Mt CO2 Eq)

Facility 1 24760.13224 2625.812024

Facility 2 12000 1272.6

Facility 3 848.2300165 89.95479325

Facility 4 2120.575041 224.8869831

Facility 5 1178.097245 124.9372128

Facility 6 24760.13224 2625.812024

Facility 7 3502.023346 371.3895759

Facility 8 13056 1384.5888

Facility 9 140616 14912.3268

Total 222841.1901 23632.30821
Conversions

Conversion Type Conversion Factor Units Comments

SF6 SAR GWP 23,900 CO2 Eq

NF3 GWP 8,000 CO2 Eq 17,200 is AR4 GWP. 10, 800 is TAR GWP.

CF4 SAR GWP 6,500 CO2 Eq

C2F6 SAR GWP 9,200 CO2 Eq

C3F6 SAR GWP

C3F8 SAR GWP 7,000 CO2 Eq

C4F6 SAR GWP

C4F8O SAR GWP 12,100 CO2 Eq

This is GWP published by manufacturer, and therefore, is not used in this report. Source: 

http://www.future-fab.com/documents.asp?d_ID=1653

c-C4F8 SAR GWP 8,700 CO2 Eq

C5F8 SAR GWP

CHF3 SAR GWP 11,700 CO2 Eq

C6F14 SAR GWP 7,400 CO2 Eq

Kg to Mt 0.001 Mt/Kg

C to CO2 3.67 CO2/C

units in one million units 1,000,000 NA

Units in one thousand units 1,000 NA

Square inches to square feet 0.006944 ft2/in2

Square feet to square meters 0.092900 m2/ft2

Electronics Avg Capacity Utilization 100% percent We assumed that all fabs run close to 100% utilization in electronics industry. 

heat transfer fluid emissions factor 11% percent

We assumed that 9.57% of total semiconductor emissions are from heat transfer fluids (HTFs). 

Based on proportion of heat transfer fluid emissions using 2006 IPCC tier 1 default values, we find 

that 2.22 Mt CO2 Eq/square meters of silicon out of 23.19 Mt CO2 Eq/square meters of silicon are 

from HTFs. Therefore, to find the HTF emissions we multiply etching/cleaning emissions by 11% 

(or 9.57%/90.43%).

mm2 to m2 1.E-06 m2/mm2

value

PEVM Emission Factor 0.000602601 MMTCE/MSI of TMLA

PEVM Emission Factor 0.002209538 Mt CO2 Eq/square inches of TMLA

PEVM Emission Factor 3.425122636 Mt CoO2 Eq/m2 of TMLA

PEVM Emission Factor (w/Heat transfer fluids) 0.000602601 MMTCE/MSI of TMLA

Capacity Utilization for R&D and Pilot Facilities 20% percent
Notes

5. Assumed that only MEMs fabs that use PFCs (as opposed to liquid etchants) are those that manufacture wafers of at least 6 inches in 

diameter.

3. Assumed that all full-scale semiconductor facilities operate at 100% of design capacity and all pilot/R&D facilities operate at 

20% of design capacity.

2. Assumed that pilot/R&D semiconductor fabrication facilities manufacture logic devices (when product class was not specified).

Abbreviations: LCD = Liquid Crystal Display, OLED = Organic Light Emitting Diode, HTPS = High Temperature Polysilicon, AMLCD = Active Matrix Liquid Crystal Display, LTPS 

1. No SAR GWP value exists for NF3. We have used NF3 GWP of 8,000 for this analysis (source: Molina et al, Geophysical Research Letters, Vol. 

22, 1873-6 (1995)). This value is lower than both the TAR (10,800) and FAR (17,200) GWPs for NF3. The 8,000 GWP value was used in the US 

Inventory for GHG Emissions and Sinks for the semiconductor sector (EPA, 2008).

4. No IPCC Tier 1 default emission factor for MEMs. Assumed that MEMs emission factor is equal to 1.2 x (1/.24) x IPCC Tier 1 SF6 

emission factor for semiconductor devices. We made this assumption because anisotropic etches are desired for MEMs, which means 

Bosch process is desired (which uses SF6/C4F8 process recipe). C4F8 has a high utilization, whereas, SF6 has low utilization. Therefore, 

we have assumed emission rate of MEMs is equal to that of SF6 etching in semiconductors. However, SF6 usage (in Kgs of gas) in 

semiconductor manufacturing accounts for only 24% of total PFC gas usage (whereas we assume it accounts for 100% of usage in MEMs 

manufacturing). Therefore, the semiconductor SF6 emission factor is scaled-up by 1/.24. Additionally, another factor of 1.2 is used to 

scale-up the semiconductor emission factor to account for the fact that during MEMs production fast etching is needed (therefore, more 

SF6 gas is used--thereby decreasing utilization) to ensure that the fabrication facility remains profitable.

6. WFW, 2007 appears to not contain a complete listing of U.S. MEMs fabs in the U.S. 

7. FPD substrate area is multiplied by 2 as the IPCC 2006 default emission factor is in terms of total FPD area (including both the TFT 

substrate area and the color filter substrate area, even though only the TFT substrate area utilizes PFCs). 
Notes

12. We assumed that 9.57% of total semiconductor emissions are from heat transfer fluids (HTFs). Based on proportion of heat transfer 

fluid emissions using 2006 IPCC tier 1 default values, we find that 2.22 Mt CO2 Eq/square meter of silicon out of 23.19 Mt CO2 Eq/square 

meter of silicon are from HTFs. Therefore, to find the HTF emissions we multiplied etching/cleaning emissions by 11% (or 9.57%/90.43%).

9. Due to lack of data of crystalline PV plants, we have assumed that all plants have a capacity of approximately 10MW (Expert 

Judgment). We have determined the total number of facilities in the US by dividing our estimate for total crystalline PV production capacity 

in the US by 10MW. Further analysis/purchasing of research reports could clarify the distribution of crystalline PV facilities in the US.

11. The upper bound of the 95% confidence interval in this sector is not used to determine alternative threshold capacities, as no exact 

uncertainty for 2006 IPCC default factors exist for semiconductors and TFT-FPD (only information available is that uncertainties vary 

between 0 and 200% for semiconductors and TFT-FPD). Additionally, no uncertainties are available for heat transfer fluids, mems, and pv.

8. Due to time contraints of analysis, we could only rely on report by Burton, 2006 ( PV Emissions during Photovoltaic (PV) Cell 

Fabrication: A Scoping Report). At that time there were very little thin film PV devices made. Since that time thin film we haven't learned 

any more about the use of PFCs in cystalline silicon (and the 2006 report itself had little information on use of PFCs in cystalline silicon). 

On the thin film side, although we don't know much about PFC use, we know that thin film production has greatly increased in the form of 

amorphous si- CIGS, and CdTe. For later two types of technology, PFCs are not used. For amorphous Silcon, PFCs are only used if the 

silicon is deposited in PECVD chambers and the chambers are cleaned with PFCs during PECVD. Some companies may have developed 

processes that desosit the amorphous silicon with methods other than PECVD, and of those that use PECVD, unpublished reports indicate 

that they may be cleaning their chambers without using PFCs. 

10. We have assumed 100% utilization efficiency for all electronics sectors due to insufficient data to determine exact capacity utilization.
Methodology To Conduct Electronics Thresholds Analysis: 

1. Estimate emissions (from etch and clean processes) from Semiconductor facilities based on Total 

Manufactured Layer Area and emissions from Partners and Non- Partners. The TMLA of each 

Partner facility was divided by total Partner TMLA and the TMLA of each Non-Partner facility was 

divided by total Non-Partner TMLA to obtain a proportion of each facility to total. The proportion of 

each Partner facility was multiplied by the total emissions for Partners and the proportion of each 

Non-Partner facility was multiplied by the total emissions for Non-Partners in order to estimate 

emissions from each facility. The emissions reported by Partners were accepted as the quantity 

emitted from the share of the industry represented by those Partners. Remaining emissions, those 

from non-Partners, were estimated using EPA's PFC Emissions Vintage Model (PEVM). PEVM is 

based on the recognition that PFC emissions from semiconductor manufacturing vary with (1) the 

number of layers that comprise different kinds of semiconductor devices, including both silicon 

wafer and metal interconnect layers, and (2) silicon consumption (i.e., the area of 

semiconductors produced) for each kind of device. The product of these two quantities, Total 

Manufactured Layer Area (TMLA), constitutes the activity data for semiconductor manufacturing. 

PEVM also incorporates an emission factor that expresses emissions per unit of layer-area. 

Emissions are estimated by multiplying TMLA by this emission factor. For more details please see 

US Inventory of Greenhouse Gas Emissions and Sinks: 1990-2006 (US EPA, 2008) and EPA's 

PFC Emissions Vintage Model (PEVM) v.2.14: Description and Documentation (Burton and 

Beizaie, 2001). 

2. Estimate emissions from HTF. It was assumed that 9.57% of total semiconductor emissions are 

from heat transfer fluids (HTFs). Based on proportion of heat transfer fluid emissions using 2006 

IPCC tier 1 default values, it is determined that 2.22 Mt CO2 Eq/square meters of silicon out of 

23.19 Mt CO2 Eq/square meters of silicon are from HTFs. Therefore, to find the HTF emissions, 

emissions from etching and cleaning are multiplied by 11% (or 9.57%/90.43%). 

3. Estimate emissions for MEMs facilities using capacity data and a derived emission factor. Assumed 

that MEMs emission factor is equal to 1.2 x (1/.24) x IPCC Tier 1 SF6 emission factor for 

semiconductor devices. See "Notes" tab for additional detail regarding assumptions on 

development of MEMs emission factor. 

4. Estimate emissions for FPD and PV facilities using capacity data and IPCC 2006 Tier I default 

emission factors (IPCC 2006). 

5. Find the number/percent of utilities that fall above/below each emissions threshold (e.g., 1 000, 10 

000, 25 000, and 100 000 Mt CO2). 

6. Find the total emissions/percent of total emissions from the group of facilities that fall above/below 

each emissions threshold.