# Patent

## Title
Laser processing method and laser processing apparatus

## Abstract

A laser processed hole is formed in a workpiece. The workpiece has a first member formed of a first material bonded to a second member formed of a second material. The laser processed hole extends through the first member to the second member. The wavelength of plasma light generated by applying a pulsed laser beam to the first member and the second member is detected. Application of the laser beam is continued at a first power until the plasma light intensity generated from only the first member is decreased to reach a predetermined value. The laser beam is applied at a second power which is lower than the first power so as to not generate cracks in the first member when the plasma light intensity has reached the predetermined value. Application of the plasma laser beam stops when plasma light generated from the second member is detected.

## Background
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a laser processing method and apparatus for forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material, the laser processed hole extending from the first member to the second member.
2. Description of the Related Art
In a semiconductor device fabrication process, a plurality of crossing division lines called streets are formed on the front side of a substantially disk-shaped semiconductor wafer to thereby partition a plurality of rectangular regions where devices such as ICs and LSIs are respectively formed. The semiconductor wafer is cut along the streets to thereby divide the regions where the devices are formed from each other, thus obtaining individual semiconductor chips. For the purposes of achieving smaller sizes and higher functionality of equipment, a module structure having the following configuration is in practical use. This module structure is such that a plurality of devices are stacked and bonding pads provided on each device are connected to each other. In this module structure, through holes (via holes) are formed in a semiconductor wafer at positions corresponding to the bonding pads, and a conductive material such as aluminum is embedded in each via hole so as to be connected to the corresponding bonding pad (see Japanese Patent Laid-open No. 2003-163323, for example).
Each via hole in the semiconductor wafer mentioned above is formed by using a drill. However, the diameter of each via hole in the semiconductor wafer is 90 to 300 μm, so that the formation of each via hole by using a drill causes a reduction in productivity. To solve this problem, there has been proposed a hole forming method for a wafer composed of a substrate and a plurality of devices formed on the front side of the substrate, a plurality of bonding pads being formed on each device, wherein a pulsed laser beam is applied to the substrate from the back side thereof to thereby efficiently form a plurality of via holes respectively reaching the plural bonding pads (see Japanese Patent Laid-open No. 2007-67082, for example).
Further, there has been proposed a laser processing apparatus for forming the via holes respectively reaching the bonding pads by applying a pulsed laser beam to the substrate from the back side thereof, wherein the pulsed laser beam is applied to a material to generate a plasma from the material, and a spectrum caused by this plasma and inherent in the material is detected to thereby determine whether or not the pulsed laser beam has reached each bonding pad formed of metal (see Japanese Patent Laid-open No. 2009-125756, for example).
SUMMARY OF THE INVENTION
However, in applying a pulsed laser beam to a substrate formed of silicon or lithium tantalate, for example, from the back side thereof to form a via hole reaching a bonding pad formed of metal, there is a problem such that when the pulsed laser beam approaches the front side of the substrate where the bonding pad is formed, cracks are generated near the front side of the substrate so as to extend radially from the via hole, causing a reduction in device quality.
It is therefore an object of the present invention to provide a laser processing method and apparatus for forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material, the laser processed hole extending from the first member to the second member, wherein no cracks are generated in the first member even when the pulsed laser beam approaches the surface of the first member where the second member is bonded.
In accordance with an aspect of the present invention, there is provided a laser processing method for forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material, the laser processed hole extending from the first member to the second member, the laser processing method including the steps of: detecting the wavelength of plasma light generated by applying a pulsed laser beam to the first member and the second member; continuing the application of the pulsed laser beam at a first power until the light intensity of the plasma light generated from only the first member and detected is decreased to reach a predetermined value; applying the pulsed laser beam at a second power which is lower than the first power and generates no cracks in the first member when the light intensity of the plasma light has reached the predetermined value; and stopping the application of the pulsed laser beam when the plasma light generated from the second member is detected.
Preferably, the first material forming the first member includes lithium tantalate; the first power of the pulsed laser beam is set so that the repetition frequency is 60 to 100 kHz and the energy per pulse is 40 μJ; and the second power of the pulsed laser beam is set so that the repetition frequency is 10 to 50 kHz and the energy per pulse is 40 μJ.
In accordance with another aspect of the present invention, there is provided a laser processing apparatus for forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material, the laser processed hole extending from the first member to the second member, the laser processing apparatus including: workpiece holding means for holding the workpiece; laser beam applying means for applying a pulsed laser beam to the workpiece held by the workpiece holding means, the laser beam applying means including pulsed laser beam oscillating means for oscillating a pulsed laser beam, power adjusting means for adjusting the power of the pulsed laser beam oscillated by the pulsed laser beam oscillating means, and focusing means for focusing the pulsed laser beam adjusted in power by the power adjusting means onto the workpiece held by the workpiece holding means; plasma detecting means for detecting the wavelength of plasma light generated by applying the pulsed laser beam from the laser beam applying means to the workpiece; and control means for controlling the laser beam applying means according to a detection signal from the plasma detecting means; the plasma detecting means including: a beam splitter for separating the plasma light into a first optical path and a second optical path; a first bandpass filter provided on the first optical path for passing only the wavelength of plasma light generated from the first material; a first photodetector for detecting the light passed through the first bandpass filter and outputting a light intensity signal to the control means; a second bandpass filter provided on the second optical path for passing only the wavelength of plasma light generated from the second material; and a second photodetector for detecting the light passed through the second bandpass filter and outputting a light intensity signal to the control means; the control means controlling the power adjusting means to continue the application of the pulsed laser beam according to the light intensity signals output from the first and second photodetectors so that when the laser beam applying means is operated to apply the pulsed laser beam to the workpiece to thereby form the laser processed hole extending from the first member to the second member, the power of the pulsed laser beam is set to a first power until the light intensity signal from only the first photodetector is decreased to reach a predetermined value, and the power of the pulsed laser beam is next set to a second power which is lower than the first power and generates no cracks in the first member when the light intensity signal from the first photodetector has reached the predetermined value; the control means further controlling the laser beam applying means so that when the light intensity signal from the second photodetector is detected, the application of the pulsed laser beam is stopped.
In the laser processing method according to the present invention, a laser processed hole is formed in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material so as to extend from the first member to the second member. This method includes the steps of detecting the wavelength of plasma light generated by applying a pulsed laser beam to the first member and the second member, continuing the application of the pulsed laser beam at a first power until the light intensity of the plasma light generated from only the first member and detected is decreased to reach a predetermined value, applying the pulsed laser beam at a second power which is lower than the first power and generates no cracks in the first member when the light intensity of the plasma light generated from the first member and detected has reached the predetermined value, and stopping the application of the pulsed laser beam when the plasma light generated from the second member is detected. Accordingly, even when the pulsed laser beam approaches the surface of the first member where the second member is bonded, no cracks are generated near the surface of the first member where the second member is bonded, but the laser processed hole reaching the second member can be properly formed through the first member.
The laser processing apparatus according to the present invention includes the plasma detecting means for detecting the wavelength of plasma light generated by applying the pulsed laser beam from the laser beam applying means to the workpiece and the control means for controlling the laser beam applying means according to a detection signal from the plasma detecting means. The plasma detecting means includes the beam splitter for separating the plasma light into the first optical path and the second optical path, the first bandpass filter provided on the first optical path for passing only the wavelength of plasma light generated from the first material, the first photodetector for detecting the light passed through the first bandpass filter and outputting a light intensity signal to the control means, the second bandpass filter provided on the second optical path for passing only the wavelength of plasma light generated from the second material, and the second photodetector for detecting the light passed through the second bandpass filter and outputting a light intensity signal to the control means. The control means controls the power adjusting means to continue the application of the pulsed laser beam according to the light intensity signals output from the first and second photodetectors so that when the laser beam applying means is operated to apply the pulsed laser beam to the workpiece to thereby form the laser processed hole extending from the first member to the second member, the power of the pulsed laser beam is set to a first power until the light intensity signal from only the first photodetector is decreased to reach a predetermined value, and the power of the pulsed laser beam is next set to a second power which is lower than the first power and generates no cracks in the first member when the light intensity signal from the first photodetector has reached the predetermined value. The control means further controls the laser beam applying means so that when the light intensity signal from the second photodetector is detected, the application of the pulsed laser beam is stopped. Accordingly, even when the pulsed laser beam approaches the surface of the first member where the second member is bonded, no cracks are generated near the surface of the first member where the second member is bonded, but the laser processed hole reaching the second member can be properly formed through the first member.
The above and other objects, features and advantages of the present invention and the manner of realizing them will become more apparent, and the invention itself will best be understood from a study of the following description and appended claim with reference to the attached drawings showing a preferred embodiment of the invention.



BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of a laser processing apparatus according to a preferred embodiment of the present invention;
FIG. 2 is a block diagram showing the configuration of laser beam applying means included in the laser processing apparatus shown in FIG. 1;
FIG. 3 is a block diagram showing the configuration of plasma detecting means included in the laser processing apparatus shown in FIG. 1;
FIG. 4 is a block diagram showing the configuration of control means included in the laser processing apparatus shown in FIG. 1;
FIG. 5 is a plan view of a wafer as a workpiece;
FIG. 6 is an enlarged plan view of an essential part of the wafer shown in FIG. 5;
FIG. 7 is a perspective view showing a condition where the wafer shown in FIG. 5 is attached to a protective tape supported to an annular frame;
FIG. 8 is a plan view showing the relation between the wafer shown in FIG. 5 and coordinates in the condition where the wafer is held at a predetermined position on a chuck table included in the laser processing apparatus shown in FIG. 1;
FIGS. 9A and 9B are partially cutaway sectional side views for illustrating a hole forming step to be performed by the laser processing apparatus shown in FIG. 1;
FIGS. 10A and 10B are views similar to FIGS. 9A and 9B, showing the step subsequent to the step shown in FIGS. 9A and 9B;
FIG. 11A is a graph showing an output voltage from a first photodetector for detecting the light intensity of plasma light generated by applying a pulsed laser beam to a lithium tantalate substrate; and
FIG. 11B is a graph showing an output voltage from a second photodetector for detecting the light intensity of plasma light generated by applying a pulsed laser beam to a bonding pad formed of copper.



DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
A preferred embodiment of the laser processing method and laser processing apparatus according to the present invention will now be described in detail with reference to the attached drawings. FIG. 1 is a perspective view of a laser processing apparatus 1 according to a preferred embodiment of the present invention. The laser processing apparatus 1 shown in FIG. 1 includes a stationary base 2, a chuck table mechanism 3 for holding a workpiece, the chuck table mechanism 3 being provided on the stationary base 2 so as to be movable in a feeding direction (X direction) shown by an arrow X, a laser beam applying unit supporting mechanism 4 provided on the stationary base 2 so as to be movable in an indexing direction (Y direction) shown by an arrow Y perpendicular to the X direction, and a laser beam applying unit 5 provided on the laser beam applying unit supporting mechanism 4 so as to be movable in a focal position adjusting direction (Z direction) shown by an arrow Z.
The chuck table mechanism 3 includes a pair of guide rails 31 provided on the stationary base 2 so as to extend parallel to each other in the X direction, a first slide block 32 provided on the guide rails 31 so as to be movable in the X direction, a second slide block 33 provided on the first slide block 32 so as to be movable in the Y direction, a cover table 35 supported by a cylindrical member 34 standing on the second slide block 33, and a chuck table 36 as workpiece holding means. The chuck table 36 has a vacuum chuck 361 formed of a porous material. A workpiece such as a disk-shaped semiconductor wafer is adapted to be held under suction on the vacuum chuck 361 by operating suction means (not shown). The chuck table 36 is rotatable by a pulse motor (not shown) provided in the cylindrical member 34. Further, the chuck table 36 is provided with clamps 362 for fixing an annular frame to be hereinafter described.
The lower surface of the first slide block 32 is formed with a pair of guided grooves 321 for slidably engaging the pair of guide rails 31 mentioned above. A pair of guide rails 322 are provided on the upper surface of the first slide block 32 so as to extend parallel to each other in the Y direction. Accordingly, the first slide block 32 is movable in the X direction along the guide rails 31 by the slidable engagement of the guided grooves 321 with the guide rails 31. The chuck table mechanism 3 further includes feeding means 37 (X direction moving means) for moving the first slide block 32 in the X direction along the guide rails 31. The feeding means 37 includes an externally threaded rod 371 extending parallel to the guide rails 31 so as to be interposed therebetween and a pulse motor 372 as a drive source for rotationally driving the externally threaded rod 371. The externally threaded rod 371 is rotatably supported at one end thereof to a bearing block 373 fixed to the stationary base 2 and is connected at the other end to the output shaft of the pulse motor 372 so as to receive the torque thereof. The externally threaded rod 371 is engaged with a tapped through hole formed in an internally threaded block (not shown) projecting from the lower surface of the first slide block 32 at a central portion thereof. Accordingly, the first slide block 32 is moved in the X direction along the guide rails 31 by operating the pulse motor 372 to normally or reversely rotate the externally threaded rod 371.
The laser processing apparatus 1 includes X position detecting means 374 for detecting the feed amount, or X position of the chuck table 36. The X position detecting means 374 includes a linear scale 374a extending along one of the guide rails 31 and a read head 374b provided on the first slide block 32 and movable along the linear scale 374a together with the first slide block 32. The read head 374b of the X position detecting means 374 transmits a pulse signal of one pulse every 1 μm in this preferred embodiment to control means which will be hereinafter described. This control means counts the number of pulses as the pulse signal input from the read head 374b to thereby detect the feed amount, or X position of the chuck table 36. In the case that the pulse motor 372 is used as the drive source for the feeding means 37 as in this preferred embodiment, the number of pulses as a drive signal output from the control means to the pulse motor 372 may be counted by the control means to thereby detect the feed amount, or X position of the chuck table 36. In the case that a servo motor is used as the drive source for the feeding means 37, a pulse signal output from a rotary encoder for detecting the rotational speed of the servo motor may be sent to the control means, and the number of pulses as the pulse signal input from the rotary encoder into the control means may be counted by the control means to thereby detect the feed amount, or X position of the chuck table 36.
The lower surface of the second slide block 33 is formed with a pair of guided grooves 331 for slidably engaging the pair of guide rails 322 provided on the upper surface of the first slide block 32 as mentioned above. Accordingly, the second slide block 33 is movable in the Y direction along the guide rails 322 by the slidable engagement of the guided grooves 331 with the guide rails 322. The chuck table mechanism 3 further includes first indexing means 38 (first Y direction moving means) for moving the second slide block 33 in the Y direction along the guide rails 322. The first indexing means 38 includes an externally threaded rod 381 extending parallel to the guide rails 322 so as to be interposed therebetween and a pulse motor 382 as a drive source for rotationally driving the externally threaded rod 381. The externally threaded rod 381 is rotatably supported at one end thereof to a bearing block 383 fixed to the upper surface of the first slide block 32 and is connected at the other end to the output shaft of the pulse motor 382 so as to receive the torque thereof. The externally threaded rod 381 is engaged with a tapped through hole formed in an internally threaded block (not shown) projecting from the lower surface of the second slide block 33 at a central portion thereof. Accordingly, the second slide block 33 is moved in the Y direction along the guide rails 322 by operating the pulse motor 382 to normally or reversely rotate the externally threaded rod 381.
The laser processing apparatus 1 includes Y position detecting means 384 for detecting the index amount, or Y position of the chuck table 36. The Y position detecting means 384 includes a linear scale 384a extending along one of the guide rails 322 and a read head 384b provided on the second slide block 33 and movable along the linear scale 384a together with the second slide block 33. The read head 384b of the Y position detecting means 384 transmits a pulse signal of one pulse every 1 μm in this preferred embodiment to the control means. This control means counts the number of pulses as the pulse signal input from the read head 384b to thereby detect the index amount, or Y position of the chuck table 36. In the case that the pulse motor 382 is used as the drive source for the first indexing means 38 as in this preferred embodiment, the number of pulses as a drive signal output from the control means to the pulse motor 382 may be counted by the control means to thereby detect the index amount, or Y position of the chuck table 36. In the case that a servo motor is used as the drive source for the first indexing means 38, a pulse signal output from a rotary encoder for detecting the rotational speed of the servo motor may be sent to the control means, and the number of pulses as the pulse signal input from the rotary encoder into the control means may be counted by the control means to thereby detect the index amount, or Y position of the chuck table 36.
The laser beam applying unit supporting mechanism 4 includes a pair of guide rails 41 provided on the stationary base 2 so as to extend parallel to each other in the Y direction and a movable support base 42 provided on the guide rails 41 so as to be movable in the Y direction. The movable support base 42 is composed of a horizontal portion 421 slidably supported to the guide rails 41 and a vertical portion 422 extending vertically upward from the upper surface of the horizontal portion 421. Further, a pair of guide rails 423 are provided on one side surface of the vertical portion 422 so as to extend parallel to each other in the Z direction. The laser beam applying unit supporting mechanism 4 further includes second indexing means 43 (second Y direction moving means) for moving the movable support base 42 in the Y direction along the guide rails 41. The second indexing means 43 includes an externally threaded rod 431 extending parallel to the guide rails 41 so as to be interposed therebetween and a pulse motor 432 as a drive source for rotationally driving the externally threaded rod 431. The externally threaded rod 431 is rotatably supported at one end thereof to a bearing block (not shown) fixed to the stationary base 2 and is connected at the other end to the output shaft of the pulse motor 432 so as to receive the torque thereof. The externally threaded rod 431 is engaged with a tapped through hole formed in an internally threaded block (not shown) projecting from the lower surface of the horizontal portion 421 at a central portion thereof. Accordingly, the movable support base 42 is moved in the Y direction along the guide rails 41 by operating the pulse motor 432 to normally or reversely rotate the externally threaded rod 431.
The laser beam applying unit 5 includes a unit holder 51 and laser beam applying means 52 mounted to the unit holder 51. The unit holder 51 is formed with a pair of guided grooves 511 for slidably engaging the pair of guide rails 423 provided on the vertical portion 422 of the movable support base 42. Accordingly, the unit holder 51 is supported to the movable support base 42 so as to be movable in the Z direction by the slidable engagement of the guided grooves 511 with the guide rails 423.
The laser beam applying unit 5 further includes focal position adjusting means 53 (Z direction moving means) for moving the unit holder 51 along the guide rails 423 in the Z direction. The focal position adjusting means 53 includes an externally threaded rod (not shown) extending parallel to the guide rails 423 so as to be interposed therebetween and a pulse motor 532 as a drive source for rotationally driving this externally threaded rod. Accordingly, the unit holder 51 and the laser beam applying means 52 are moved in the Z direction along the guide rails 423 by operating the pulse motor 532 to normally or reversely rotate this externally threaded rod. In this preferred embodiment, when the pulse motor 532 is normally operated, the laser beam applying means 52 is moved upward, whereas when the pulse motor 532 is reversely operated, the laser beam applying means 52 is moved downward.
The laser beam applying means 52 includes a cylindrical casing 521 fixed to the unit holder 51 so as to extend in a substantially horizontal direction, pulsed laser beam oscillating means 6 (see FIG. 2) provided in the casing 521, acoustooptic deflecting means 7 (see FIG. 2) as light deflecting means for deflecting the beam axis of a pulsed laser beam oscillated by the pulsed laser beam oscillating means 6 in the feeding direction (X direction), and focusing means 8 (see FIGS. 1 and 2) for applying the pulsed laser beam passed through the acoustooptic deflecting means 7 to a workpiece held on the chuck table 36.
The pulsed laser beam oscillating means 6 is composed of a pulsed laser oscillator 61 such as a YAG laser oscillator or a YVO4 laser oscillator and repetition frequency setting means 62 connected to the pulsed laser oscillator 61. The pulsed laser oscillator 61 functions to oscillate a pulsed laser beam (LB) having a predetermined frequency set by the repetition frequency setting means 62. The repetition frequency setting means 62 functions to set the repetition frequency of the pulsed laser beam to be oscillated by the pulsed laser oscillator 61. The pulsed laser oscillator 61 and the repetition frequency setting means 62 of the pulsed laser beam oscillating means 6 are controlled by the control means to be hereinafter described.
The acoustooptic deflecting means 7 includes an acoustooptic device 71 for deflecting the beam axis of the pulsed laser beam (LB) oscillated by the pulsed laser beam oscillating means 6, an RF oscillator 72 for generating an RF (radio frequency) signal to be applied to the acoustooptic device 71, an RF amplifier 73 for amplifying the power of the RF signal generated by the RF oscillator 72 and applying the amplified RF signal to the acoustooptic device 71, deflection angle adjusting means 74 for adjusting the frequency of the RF signal to be generated by the RF oscillator 72, and power adjusting means 75 for adjusting the amplitude of the RF signal to be generated by the RF oscillator 72. The acoustooptic device 71 can adjust the angle of deflection of the pulsed laser beam according to the frequency of the RF signal applied and can also adjust the power of the pulsed laser beam according to the amplitude of the RF signal applied. The acoustooptic deflecting means 7 as the light deflecting means may be replaced by electrooptic deflecting means using an electrooptic device. The deflection angle adjusting means 74 and the power adjusting means 75 are controlled by the control means to be described later.
The laser beam applying means 52 further includes laser beam absorbing means 76 for absorbing the pulsed laser beam deflected by the acoustooptic device 71 as shown by a broken line in FIG. 2 in the case that an RF signal having a predetermined frequency is applied to the acoustooptic device 71.
The focusing means 8 is mounted at the front end of the casing 521 and it includes a direction changing mirror 81 for downwardly changing the traveling direction of the pulsed laser beam deflected by the acoustooptic deflecting means 7 and a focusing lens 82 provided by a telecentric lens for focusing the pulsed laser beam whose traveling direction has been changed by the direction changing mirror 81.
The operation of the laser beam applying means 52 will now be described with reference to FIG. 2. In the case that a voltage of 5 V, for example, is applied from the control means to the deflection angle adjusting means 74 of the acoustooptic deflecting means 7 and an RF signal having a frequency corresponding to 5 V is applied to the acoustooptic device 71, the pulsed laser beam oscillated by the pulsed laser beam oscillating means 6 is deflected in beam axis as shown by a single dot & dash line in FIG. 2 and focused at a focal point Pa. In the case that a voltage of 10 V, for example, is applied from the control means to the deflection angle adjusting means 74 and an RF signal having a frequency corresponding to 10 V is applied to the acoustooptic device 71, the pulsed laser beam oscillated by the pulsed laser beam oscillating means 6 is deflected in beam axis as shown by a solid line in FIG. 2 and focused at a focal point Pb displaced from the focal point Pa to the left as viewed in FIG. 2 in the X direction by a predetermined amount. In the case that a voltage of 15 V, for example, is applied from the control means to the deflection angle adjusting means 74 and an RF signal having a frequency corresponding to 15 V is applied to the acoustooptic device 71, the pulsed laser beam oscillated by the pulsed laser beam oscillating means 6 is deflected in beam axis as shown by a double dot & dash line in FIG. 2 and focused at a focal point Pc displaced from the focal point Pb to the left as viewed in FIG. 2 in the X direction by a predetermined amount. Further, in the case that a voltage of 0 V, for example, is applied from the control means to the deflection angle adjusting means 74 of the acoustooptic deflecting means 7 and an RF signal having a frequency corresponding to 0 V is applied to the acoustooptic device 71, the pulsed laser beam oscillated by the pulsed laser beam oscillating means 6 is led to the laser beam absorbing means 76 as shown by a broken line in FIG. 2. Thus, the pulsed laser beam oscillated by the pulsed laser beam oscillating means 6 is deflected to different positions in the X direction by the acoustooptic device 71 according to the voltage applied to the deflection angle adjusting means 74.
Referring back to FIG. 1, the laser processing apparatus 1 further includes plasma detecting means 9 mounted on the casing 521 of the laser beam applying means 52 constituting the laser beam applying unit 5 for detecting plasma light generated by applying the laser beam from the laser beam applying means 52 to the workpiece. As shown in FIG. 3, the plasma detecting means 9 includes plasma capturing means 91 for capturing plasma light generated by applying the laser beam from the focusing means 8 of the laser beam applying means 52 to the workpiece W held on the chuck table 36, a beam splitter 92 for separating the plasma light captured by the plasma capturing means 91 into a first optical path 92a and a second optical path 92b, a first bandpass filter 93 provided on the first optical path 92a for passing only the light having a first set wavelength (the wavelength to be generated from a first material forming a first member of the workpiece to be hereinafter described), a first photodetector 94 for detecting the light passed through the first bandpass filter 93 to output a light intensity signal, a direction changing mirror 95 provided on the second optical path 92b, a second bandpass filter 96 for passing only the light having a second set wavelength (the wavelength to be generated from a second material forming a second member of the workpiece to be hereinafter described) after the light (plasma light) being reflected on the direction changing mirror 95, and a second photodetector 97 for detecting the light passed through the second bandpass filter 96 to output a light intensity signal.
The plasma capturing means 91 is composed of a focusing lens 911 and a lens case 912 for accommodating the focusing lens 911. As shown in FIG. 1, the lens case 912 is mounted on the casing 521 of the laser beam applying means 52. Further, as shown in FIG. 1, the lens case 912 is provided with an angle adjusting knob 913 for adjusting the installation angle of the focusing lens 911. The first bandpass filter 93 is so configured as to pass the light having a wavelength range of 660 to 680 nm because only the wavelength (670 nm) of plasma light to be generated from lithium tantalate is to be passed. On the other hand, the second bandpass filter 96 is so configured as to pass the light having a wavelength range of 500 to 540 nm because only the wavelength (515 nm) of plasma light to be generated from copper is to be passed. The first photodetector 94 detects the light passed through the first bandpass filter 93 and outputs to the control means a voltage signal corresponding to the intensity of the light detected. Similarly, the second photodetector 97 detects the light passed through the second bandpass filter 96 and outputs to the control means a voltage signal corresponding to the intensity of the light detected.
Referring back to FIG. 1, the laser processing apparatus 1 further includes imaging means 11 provided at the front end portion of the casing 521 for imaging a subject area of the workpiece to be laser-processed by the laser beam applying means 52. The imaging means 11 includes an ordinary imaging device (CCD) for imaging the workpiece by using visible light, infrared light applying means for applying infrared light to the workpiece, an optical system for capturing the infrared light applied to the workpiece by the infrared light applying means, and an imaging device (infrared CCD) for outputting an electrical signal corresponding to the infrared light captured by the optical system. An image signal output from the imaging means 11 is transmitted to the control means 20 (see FIG. 4).
The laser processing apparatus 1 includes the control means 20 shown in FIG. 4. The control means 20 is configured by a computer, and it includes a central processing unit (CPU) 201 for performing operational processing according to a control program, a read only memory (ROM) 202 preliminarily storing the control program, a random access memory (RAM) 203 for storing a control map, data on design value for the workpiece, the results of computation, etc., a counter 204, an input interface 205, and an output interface 206. Detection signals from the X position detecting means 374, the Y position detecting means 384, the first and second photodetectors 94 and 97 of the plasma detecting means 9, and the imaging means 11 are input into the input interface 205 of the control means 20. On the other hand, control signals are output from the output interface 206 of the control means 20 to the pulse motor 372, the pulse motor 382, the pulse motor 432, the pulse motor 532, the pulsed laser oscillator 61 and the repetition frequency setting means 62 of the pulsed laser beam oscillating means 6 constituting the laser beam applying means 52, and the deflection angle adjusting means 74 and the power adjusting means 75 of the acoustooptic deflecting means 7 constituting the laser beam applying means 52. The random access memory (RAM) 203 includes a first memory area 203a for storing the relation between the material of the workpiece and the wavelength of plasma light, a second memory area 203b for storing data on design value for a wafer to be hereinafter described, and other memory areas.
The operation of the laser processing apparatus 1 configured above will now be described. FIG. 5 is a plan view of a wafer 30 as the workpiece to be laser-processed, showing the front side of the wafer 30. The wafer 30 is formed from a lithium tantalate substrate 300 (first member) having a thickness of 70 μm, for example. A plurality of crossing division lines 301 are formed on the front side 300a of the substrate 300, thereby partitioning a plurality of rectangular regions where a plurality of devices 302 are respectively formed. All of the devices 302 have the same configuration. As shown in FIG. 6, a plurality of bonding pads 303 (303a to 303j) (second member) are formed on the front side of each device 302. In this preferred embodiment, these bonding pads 303 (303a to 303j) are formed of copper. The bonding pads 303a and 303f have the same X position, the bonding pads 303b and 303g have the same X position, the bonding pads 303c and 303h have the same X position, the bonding pads 303d and 303i have the same X position, and the bonding pads 303e and 303j have the same X position. The wafer 30 is processed by the laser beam to form a laser processed hole (via hole) extending from the back side 300b of the substrate 300 to each bonding pad 303 (303a to 303j).
In each device 302, the bonding pads 303 (303a to 303j) are equally spaced at given intervals A in the X direction (horizontal direction as viewed in FIG. 6). More specifically, the spacing A between the bonding pads 303a and 303b is equal to the spacing between the bonding pads 303b and 303c, the spacing between the bonding pads 303c and 303d, the spacing between the bonding pads 303d and 303e, the spacing between the bonding pads 303f and 303g, the spacing between the bonding pads 303g and 303h, the spacing between the bonding pads 303h and 303i, and the spacing between the bonding pads 303i and 303j. Further, in the adjacent devices 302 opposed in the X direction with respect to the vertical division line 301, the adjacent bonding pads 303 are equally spaced at given intervals B in the X direction. More specifically, the spacing B between the bonding pads 303e and 303a in the adjacent devices 302 in the X direction is equal to the spacing between the bonding pads 303j and 303f in the adjacent devices 302 in the X direction.
Further, in each device 302, the bonding pads 303 (303a to 303j) are equally spaced at given intervals C in the Y direction (vertical direction as viewed in FIG. 6). More specifically, the spacing C between the bonding pads 303a and 303f is equal to the spacing between the bonding pads 303b and 303g, the spacing between the bonding pads 303c and 303h, the spacing between the bonding pads 303d and 303i, and the spacing between the bonding pads 303e and 303j. Further, in the adjacent devices 302 opposed in the Y direction with respect to the horizontal division line 301, the adjacent bonding pads 303 are equally spaced at given intervals D in the Y direction. More specifically, the spacing D between the bonding pads 303f and 303a in the adjacent devices 302 in the Y direction is equal to the spacing between the bonding pads 303g and 303b in the adjacent devices 302 in the Y direction, the spacing between the bonding pads 303h and 303c in the adjacent devices 302 in the Y direction, the spacing between the bonding pads 303i and 303d in the adjacent devices 302 in the Y direction, and the spacing between the bonding pads 303j and 303e in the adjacent devices 302 in the Y direction. Referring to FIG. 5, symbols E1 to En denote the rows of the devices 302 formed on the front side of the wafer 30, and symbols F1 to Fn denote the columns of the devices 302, where n is the integer greater than 1. The number of devices 302 in each of the rows E1 to En and the columns F1 to Fn, the values of the spacings A, B, C, and D mentioned above, and the X and Y coordinate values for all the devices 302 are stored in the second memory area 203b of the random access memory (RAM) 203.
There will now be described a laser processing operation of processing the wafer 30 by using the laser processing apparatus 1 to form a laser processed hole (via hole) extending from the back side 300b of the substrate 300 to each of the bonding pads 303 (303a to 303j) in each device 302. As shown in FIG. 7, the wafer 30 is supported through a protective tape 50 to an annular frame 40 in such a manner that the front side 300a of the substrate 300 constituting the wafer 30 is attached to the protective tape 50. The protective tape 50 is preliminarily supported at its outer circumferential portion to the annular frame 40. The protective tape 50 is formed from a synthetic resin sheet such as a polyolefin sheet. Accordingly, the back side 300b of the substrate 300 constituting the wafer 30 attached to the protective tape 50 is oriented upward. The wafer 30 supported through the protective tape 50 to the annular frame 40 is placed on the chuck table 36 of the laser processing apparatus 1 shown in FIG. 1 in the condition where the protective tape 50 comes into contact with the upper surface of the chuck table 36. Thereafter, the suction means not shown is operated to hold the wafer 30 through the protective tape 50 on the chuck table 36 under suction. Accordingly, the wafer 30 is held on the chuck table 36 in the condition where the back side 300b of the substrate 300 constituting the wafer 30 is oriented upward. Further, the annular frame 40 is fixed by the clamps 362.
Thereafter, the feeding means 37 is operated to move the chuck table 36 holding the wafer 30 to a position directly below the imaging means 11. In the condition where the chuck table 36 is positioned directly below the imaging means 11, the wafer 30 is set at the coordinate position shown in FIG. 8. In this condition, an alignment operation is performed to detect whether or not the crossing division lines 301 of the wafer 30 held on the chuck table 36 are parallel to the X direction and the Y direction. That is, the imaging means 11 is operated to image the wafer 30 held on the chuck table 36 and perform image processing such as pattern matching, thus performing the alignment operation. Although the front side 300a on which the division lines 301 of the wafer 30 are formed is oriented downward, the division lines 301 can be imaged from the back side 300b through the substrate 300 of the wafer 30 because the lithium tantalate substrate 300 constituting the wafer 30 is transparent.
Thereafter, the chuck table 36 is moved to position the leftmost device 302 on the uppermost row E1 as viewed in FIG. 8 directly below the imaging means 11. Further, the left upper bonding pad 303a of the bonding pads 303 (303a to 303j) in this leftmost device 302 as viewed in FIG. 8 is positioned directly below the imaging means 11. In this condition, the bonding pad 303a is detected by the imaging means 11 and the coordinate value (a1) for the bonding pad 303a is sent as a first feed start position coordinate value to the control means 20. The control means 20 stores this coordinate value (a1) as the first feed start position coordinate value into the random access memory (RAM) 203 (feed start position detecting step). The imaging means 11 and the focusing means 8 of the laser beam applying means 52 are spaced a predetermined distance in the X direction. Accordingly, the sum of the X coordinate value constituting the first feed start position coordinate value and the above predetermined distance between the imaging means 11 and the focusing means 8 is stored into the RAM 203.
After detecting the first feed start position coordinate value (a1) in the leftmost device 302 on the uppermost row E1 as viewed in FIG. 8, the chuck table 36 is moved in the Y direction by the pitch of the division lines 301 and also moved in the X direction to position the leftmost device 302 on the second uppermost row E2 as viewed in FIG. 8 directly below the imaging means 11. Further, the left upper bonding pad 303a of the bonding pads 303 (303a to 303j) in this leftmost device 302 as viewed in FIG. 8 is positioned directly below the imaging means 11. In this condition, the bonding pad 303a is detected by the imaging means 11 and the coordinate value (a2) for the bonding pad 303a is sent as a second feed start position coordinate value to the control means 20. The control means 20 stores this coordinate value (a2) as the second feed start position coordinate value into the random access memory (RAM) 203. As mentioned above, the imaging means 11 and the focusing means 8 are spaced a predetermined distance in the X direction. Accordingly, the sum of the X coordinate value constituting the second feed start position coordinate value and the above distance between the imaging means 11 and the focusing means 8 is stored into the RAM 203. Thereafter, the control means 20 repeatedly performs the indexing operation (stepwise movement in the Y direction) and the feed start position detecting step mentioned above until the lowermost row En as viewed in FIG. 8 to detect the feed start position coordinate values (a3 to an) for the leftmost devices 302 on the other rows (E3 to En) and store these coordinate values into the random access memory (RAM) 203. Of all the devices 302 formed on the wafer 30, the leftmost device 302 on the lowermost row En as viewed in FIG. 8 is set as a measurement device, and the feed start position coordinate value (an) for this measurement device 302 is stored as a measurement position coordinate value (an) into the random access memory (RAM) 203.
After performing the feed start position detecting step mentioned above, a hole forming step is performed to form a laser processed hole (via hole) through the substrate 300 of the wafer 30 at each of the bonding pads 303 (303a to 303j) formed in each device 302. In this hole forming step, the feeding means 37 is first operated to move the chuck table 36 so that the bonding pad 303a corresponding to the first feed start position coordinate value (a1) stored in the random access memory (RAM) 203 is positioned directly below the focusing means 8 of the laser beam applying means 52. FIG. 9A shows this condition where the bonding pad 303a corresponding to the first feed start position coordinate value (a1) is positioned directly below the focusing means 8. Then, the feeding means 37 is controlled by the control means 20 to feed the chuck table 36 at a predetermined feed speed in the direction shown by an arrow X1 in FIG. 9A. At the same time, the laser beam applying means 52 is controlled by the control means 20 to apply a pulsed laser beam from the focusing means 8 to the wafer 30. The focal point P of the pulsed laser beam to be applied from the focusing means 8 is set near the back side 300b (upper surface as viewed in FIG. 9A) of the substrate 300 of the wafer 30. At this time, the control means 20 outputs a control signal for controlling the deflection angle adjusting means 74 and the power adjusting means 75 of the acoustooptic deflecting means 7 according to a detection signal from the read head 374b of the X position detecting means 374.
On the other hand, the RF oscillator 72 outputs an RF signal corresponding to the control signal from the deflection angle adjusting means 74 and the power adjusting means 75. The power of the RF signal output from the RF oscillator 72 is amplified by the RF amplifier 73, and the amplified RF signal is applied to the acoustooptic device 71. As a result, the acoustooptic device 71 deflects the beam axis of the pulsed laser beam oscillated by the pulsed laser beam oscillating means 6 in the range from the position shown by the single dot & dash line in FIG. 2 to the position shown by the double dot & dash line in FIG. 2 in synchronism with the feed speed of the chuck table 36. As a result, the pulsed laser beam having a predetermined power can be applied to the wafer 30 at the position of the bonding pad 303a corresponding to the first feed start position coordinate value (a1).
In performing the hole forming step, the control means 20 operates the counter 204 to count the number of shots of the pulsed laser beam oscillated by the pulsed laser beam oscillating means 6 and also operates the plasma detecting means 9 to input a light intensity signal from the first photodetector 94. The light intensity signal to be output from the first photodetector 94 will now be described. When the pulsed laser beam is applied to the lithium tantalate substrate 300 constituting the wafer 30, plasma light having a wavelength of 670 nm is generated from the substrate 300. This plasma light having a wavelength of 670 nm is focused by the focusing lens 911 of the plasma capturing means 91 constituting the plasma detecting means 9 and then passed through the first bandpass filter 93 to reach the first photodetector 94.
FIG. 11A shows an output voltage from the first photodetector 94 for detecting the light intensity of plasma light generated by applying the pulsed laser beam to the lithium tantalate substrate 300. In FIG. 11A, the horizontal axis represents the number of shots of the pulsed laser beam, and the vertical axis represents voltage (V). In the preferred embodiment shown in FIG. 11A, the output voltage from the first photodetector 94 is substantially constant at about 2.5 V until the number of shots of the pulsed laser beam becomes about 80 to 85. When the number of shots of the pulsed laser beam exceeds 85, the output voltage is rapidly decreased. When the number of shots of the pulsed laser beam reaches about 150, the output voltage becomes about 1.5 V.
FIG. 11B shows an output voltage from the second photodetector 97 for detecting the light intensity of plasma light generated by applying the pulsed laser beam to the bonding pad 303a formed of copper. In FIG. 11B, the horizontal axis represents the number of shots of the pulsed laser beam, and the vertical axis represents voltage (V). In the preferred embodiment shown in FIG. 11B, the output voltage from the second photodetector 97 starts to increase at the time the number of shots of the pulsed laser beam has become 170 to 175. When the number of shots of the pulsed laser beam becomes about 200, the output voltage reaches about 0.2 V. The result that the output voltage from the second photodetector 97 starts to increase means that a through hole has been formed in the lithium tantalate substrate 300 and the pulsed laser beam starts to be applied to the bonding pad 303a. 
As described above, the control means 20 controls the power of the pulsed laser beam according to the output voltages from the first photodetector 94 and the second photodetector 97 in the following manner. The control means 20 controls the power adjusting means 75 to continue the application of the pulsed laser beam so that the power of the pulsed laser beam is set to a first power (e.g., average power: 4 W, repetition frequency: 100 kHz, and energy per pulse: 40 μJ) until the output voltage (light intensity signal) from only the first photodetector 94 is decreased to reach a predetermined value (e.g., 1.5 V), and the power of the pulsed laser beam is next set to a second power (e.g., average power: 2 W, repetition frequency: 50 kHz, and energy per pulse: 40 μJ) which is lower than the first power and generates no cracks in the lithium tantalate substrate 300 when the output voltage (light intensity signal) from the first photodetector 94 has reached the above predetermined value. Thereafter, the control means 20 controls the laser beam applying means 52 so that when the output voltage (light intensity signal) from the second photodetector 97 is detected (e.g., 0.2 V), the application of the pulsed laser beam is stopped.
In this manner, the control means 20 controls the power adjusting means 75 so that the power of the pulsed laser beam is set to a first power (e.g., average power: 4 V, repetition frequency: 100 kHz, and energy per pulse: 40 μJ) until the output voltage (light intensity signal) from only the first photodetector 94 is decreased to reach a predetermined value (e.g., 1.5 V), and then continues to apply the pulsed laser beam at the first power. The control means 20 further controls the power adjusting means 75 so that the power of the pulsed laser beam is next set to a second power (e.g., average power: 2 W, repetition frequency: 50 kHz, and energy per pulse: 40 μJ) which is lower than the first power and generates no cracks in the lithium tantalate substrate 300 when the output voltage (light intensity signal) from the first photodetector 94 has reached the above predetermined value, and then continues to apply the pulsed laser beam at the second power. Accordingly, even when the pulsed laser beam approaches the front side 300a of the lithium tantalate substrate 300 where the bonding pad 303a is formed, no cracks are generated near the front side 300a of the lithium tantalate substrate 300 where the bonding pad 303a is formed, but a laser processed hole reaching the bonding pad 303a can be properly formed through the lithium tantalate substrate 300.
For example, the hole forming step is performed under the following two-stage processing conditions.
(First Processing Conditions: First Power)


    
    
        Light source: LD pumped Q-switched Nd:YVO4 pulsed laser
        Wavelength: 532 nm
        Average power: 2.4 to 4 W
        Repetition frequency: 60 to 100 kHz
        Pulse energy: 40 μJ
        Pulse width: 10 ps
        Focused spot diameter: φ15 μm
        Number of shots: 150 (hole depth: 55 μm)

(Second Processing Conditions: Second Power)

        Light source: LD pumped Q-switched Nd:YVO4 pulsed laser
        Wavelength: 532 nm
        Average power: 0.4 to 2 W
        Repetition frequency: 10 to 50 kHz
        Pulse energy: 40 μJ
        Pulse width: 10 ps
        Focused spot diameter: φ15 μm
        Number of shots: 50 (hole depth: 15 μm)
    
    


In the case that the average power is 4 W and the repetition frequency 100 kHz in the first processing conditions: first power, a laser processed hole having a depth of 55 μm is formed in the lithium tantalate substrate 300 by applying 150 shots of the pulsed laser beam. Further, in the case that the average power is 2 W and the repetition frequency is 50 kHz in the second processing conditions; second power, a laser processed hole having a depth of 15 μm is formed in the lithium tantalate substrate 300 by applying 50 shots of the pulsed laser beam to reach the bonding pad 303a. 
Regarding the repetition frequency in the first power, the present inventor conducted a test to find that when the repetition frequency is higher than 60 kHz, cracks are generated to allow efficient processing, whereas when the repetition frequency exceeds 100 kHz, the processing becomes excessive and a proper laser processed hole cannot be formed. Accordingly, the first power is preferably set so that the repetition frequency is 60 to 100 kHz and the energy per pulse is 40 μJ.
Further, regarding the repetition frequency in the second power, the present inventor also conducted a test to find that when the repetition frequency is less than or equal to 50 kHz, no cracks are generated, whereas when the repetition frequency is less than 10 kHz, a proper laser processed hole cannot be formed. Accordingly, the second power is preferably set so that the repetition frequency is 10 to 50 kHz and the energy per pulse is 40 μJ. Further, it was also found that when the energy per pulse is less than 40 μJ, a lithium tantalate substrate cannot be properly processed.
The control means 20 inputs a detection signal from the read head 374b of the X position detecting means 374 and counts this detection signal through the counter 204. When the count value by the counter 204 reaches the coordinate value for the next bonding pad 303b in the X direction, the control means 20 controls the laser beam applying means 52 to similarly perform the hole forming step. Thereafter, every time the count value by the counter 204 reaches the coordinate value for each bonding pad 303 (303c to 303e), the control means 20 operates the laser beam applying means 52 to similarly perform the hole forming step. When the hole forming step is performed at the position of the rightmost bonding pad 303e in the rightmost device 302 on the uppermost row E1 as shown in FIG. 9B, the operation of the feeding means 37 is stopped to stop the movement of the chuck table 36. As a result, a plurality of laser processed holes 304 respectively reaching the bonding pads 303a to 303e in each device 302 on the uppermost row E1 are formed through the lithium tantalate substrate 300 of the wafer 30 as shown in FIG. 9B.
Thereafter, the control means 20 controls the first indexing means 38 to index the focusing means 8 of the laser beam applying means 52 in the direction perpendicular to the sheet plane of FIG. 9B, i.e., in the Y direction. On the other hand, the control means 20 inputs a detection signal from the read head 384b of the Y position detecting means 384 and counts this detection signal through the counter 204. When the count value by the counter 204 reaches a value corresponding to the spacing C of the bonding pads 303 in the Y direction shown in FIG. 6, the operation of the first indexing means 38 is stopped to stop the indexing of the focusing means 8. As a result, the focusing means 8 is positioned directly above the bonding pad 303j (see FIG. 6) opposed to the bonding pad 303e in the Y direction. FIG. 10A shows this condition where the focusing means 8 is positioned directly above the bonding pad 303j in the rightmost device 302 on the uppermost row E1.
Thereafter, the control means 20 controls the feeding means 37 to feed the chuck table 36 in the direction shown by an arrow X2 in FIG. 10A at a predetermined feed speed. At the same time, the control means 20 operates the laser beam applying means 52 to perform the hole forming step. As described above, the control means 20 inputs a detection signal from the read head 374b of the X position detecting means 374 and counts this detection signal through the counter 204. Every time the count value by the counter 204 reaches the coordinate value for each bonding pad 303 (303j to 303f), the control means 20 operates the laser beam applying means 52 to similarly perform the hole forming step. When the hole forming step is performed at the position of the leftmost bonding pad 303f in the leftmost device 302 on the uppermost row E1 as shown in FIG. 10B, the operation of the feeding means 37 is stopped to stop the movement of the chuck table 36. As a result, a plurality of laser processed holes 304 respectively reaching the bonding pads 303j to 303f in each device 302 on the uppermost row E1 are formed through the lithium tantalate substrate 300 of the wafer 30 as shown in FIG. 10B.
Thus, the laser processed holes 304 are formed through the substrate 300 of the wafer 30 at the positions corresponding to the bonding pads 303 in each device 302 on the uppermost row E1 as described above. Thereafter, the control means 20 operates the feeding means 37 and the first indexing means 38 to position the bonding pad 303a corresponding to the second feed start position coordinate value (a2) directly below the focusing means 8 of the laser beam applying means 52, wherein the bonding pad 303a corresponding to the second feed start position coordinate value (a2) is formed in the leftmost device 302 on the second uppermost row E2 and the second feed start position coordinate value (a2) is stored in the random access memory (RAM) 203. Thereafter, the control means 20 controls the laser beam applying means 52, the feeding means 37, and the first indexing means 38 to perform the hole forming step at the positions corresponding to the bonding pads 303 in the other devices 302 on the second uppermost row E2. Thereafter, the hole forming step is similarly performed at the positions corresponding to the bonding pads 303 in all the devices 302 on the other rows E3 to En. As a result, a plurality of laser processed holes 304 respectively reaching the bonding pads 303 in all the devices 302 on the other rows E3 to En are formed through the lithium tantalate substrate 300 of the wafer 30.
In the hole forming step mentioned above, the pulsed laser beam is not applied to the areas of the wafer 30 corresponding to the spacing A and the spacing B in the X direction shown in FIG. 6 and the areas of the wafer 30 corresponding to the spacing C and the spacing D in the Y direction shown in FIG. 6. To avoid the application of the pulsed laser beam to these areas corresponding to the spacings A, B, C, and D in the wafer 30, the control means 20 applies a voltage of 0 V to the deflection angle adjusting means 74 of the acoustooptic deflecting means 7. As a result, an RF signal having a frequency corresponding to 0 V is applied to the acoustooptic device 71, so that the pulsed laser beam (LB) oscillated by the pulsed laser beam oscillating means 6 is led to the laser beam absorbing means 76 as shown by the broken line in FIG. 2, thereby avoiding the application of the pulsed laser beam to the wafer 30.
While a specific preferred embodiment of the present invention has been described, it should be noted that the present invention is not limited to the above preferred embodiment, but various modifications may be made within the scope of the present invention. For example, in the above preferred embodiment, the plural laser processed holes are formed in the wafer including the substrate (first member), the plural devices formed on the front side of the substrate (first member), and the plural bonding pads (second member) provided on each device, wherein the plural laser processed holes respectively extend from the back side of the substrate (first member) to the plural bonding pads (second member). However, the present invention is widely applicable to the case of forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material, wherein the laser processed hole extends from the first member to the second member.
The present invention is not limited to the details of the above described preferred embodiment. The scope of the invention is defined by the appended claim and all changes and modifications as fall within the equivalence of the scope of the claim are therefore to be embraced by the invention.

## Claims

1. A laser processing method for forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material, said laser processed hole extending from said first member to said second member, said laser processing method comprising the steps of:
detecting the wavelength of plasma light generated by applying a pulsed laser beam to said first member and said second member;
continuing the application of said pulsed laser beam at a first power until the light intensity of said plasma light generated from only said first member and detected is decreased to reach a predetermined value;
applying said pulsed laser beam at a second power which is lower than said first power and generates no cracks in said first member when the light intensity of said plasma light has reached said predetermined value; and
stopping the application of said pulsed laser beam when said plasma light generated from said second member is detected.

2. The laser processing method according to claim 1,
wherein said first material forming said first member includes lithium tantalate;
said first power of said pulsed laser beam is set so that the repetition frequency is 60 to 100 kHz and the energy per pulse is 40 μJ; and
said second power of said pulsed laser beam is set so that the repetition frequency is 10 to 50 kHz and the energy per pulse is 40 μJ.

3. A laser processing apparatus for forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material, said laser processed hole extending from said first member to said second member, said laser processing apparatus comprising:
workpiece holding means for holding said workpiece;
laser beam applying means for applying a pulsed laser beam to said workpiece held by said workpiece holding means, said laser beam applying means including pulsed laser beam oscillating means for oscillating a pulsed laser beam, power adjusting means for adjusting the power of said pulsed laser beam oscillated by said pulsed laser beam oscillating means, and focusing means for focusing said pulsed laser beam adjusted in power by said power adjusting means onto said workpiece held by said workpiece holding means;
plasma detecting means for detecting the wavelength of plasma light generated by applying said pulsed laser beam from said laser beam applying means to said workpiece; and
control means for controlling said laser beam applying means according to a detection signal from said plasma detecting means;
said plasma detecting means including:
a beam splitter for separating said plasma light into a first optical path and a second optical path;
a first bandpass filter provided on said first optical path for passing only the wavelength of plasma light generated from said first material;
a first photodetector for detecting the light passed through said first bandpass filter and outputting a light intensity signal to said control means;
a second bandpass filter provided on said second optical path for passing only the wavelength of plasma light generated from said second material; and
a second photodetector for detecting the light passed through said second bandpass filter and outputting a light intensity signal to said control means;

said control means controlling said power adjusting means to continue the application of said pulsed laser beam according to the light intensity signals output from said first and second photodetectors so that when said laser beam applying means is operated to apply said pulsed laser beam to said workpiece to thereby form said laser processed hole extending from said first member to said second member, the power of said pulsed laser beam is set to a first power until the light intensity signal from only said first photodetector is decreased to reach a predetermined value, and the power of said pulsed laser beam is next set to a second power which is lower than said first power and generates no cracks in said first member when the light intensity signal from said first photodetector has reached said predetermined value;
said control means further controlling said laser beam applying means so that when the light intensity signal from said second photodetector is detected, the application of said pulsed laser beam is stopped.