1

MEMORANDUM - PROPOSED DATA CATEGORY ASSIGNMENTS FOR SUBPART I 

To: Docket EPA-HQ-OAR-2011-0028 

From: Alexis McKittrick, EPA/Climate Change 

Date: February 6, 2012 

Subject: Proposed data category assignments for data reporting elements in 40 CFR part 98, 

subpart I. 

In this memorandum, we show the proposed data category assignments for data reporting 

elements in Subpart I – Electronics Manufacturing of Part 98 as referenced in the Mandatory 

Reporting of Greenhouse Gases Rule: Proposed Confidentiality Determinations for Subpart I 

and Proposed Amendments to Subpart I Best Available Monitoring Methods Provisions. The 

table below shows the proposed assignment of each data reporting element into one of 10 data 

categories [excluding inputs to emission equations]. The table also shows the proposed 

confidentiality determination for data elements in the two data categories for which a categorical 

confidentiality determination was not made. 

For descriptions of the direct emitter data categories and the categorical confidentiality 

determinations made for eight of these categories, see the preambles to the proposed and final 

rulemakings: Proposed Confidentiality Determinations for Data Required Under the Mandatory 

Greenhouse Gas Reporting Rule and Proposed Amendment to Special Rules Governing Certain 

Information Obtained Under the Clean Air Act published on July 7, 2010 (75 FR 39094); and

Confidentiality Determinations for Data Required under the Mandatory Greenhouse Gas 

Reporting Rule and Amendment to Special Rules Governing Certain Information Obtained under 

the Clean Air Act published on May 26, 2011 (76 FR 30782). 

The table below does not include those subpart I data elements that are inputs to emissions 

equations and for which reporting has been deferred. For more information on the deferred 

reporting of inputs to emissions equations, see the preambles to the proposed and final rule 

makings: [Proposed] Change to the Reporting Date for Certain Data Elements Required Under 

the Mandatory Reporting of Greenhouse Gases Rule, published on December 27, 2010, (75 FR 

81350), and [Final] Change to the Reporting Date for Certain Data Elements Required Under 

the Mandatory Reporting of Greenhouse Gases Rule, published on August 25, 2011 (76 FR 

53057). 

Copies of the proposed and final rules cited above are available on EPA’s website: 

http://www.epa.gov/climatechange/emissions/CBI.html, at the following links: 

http://www.gpo.gov/fdsys/pkg/FR-2010-07-07/pdf/2010-16317.pdf, 

http://www.gpo.gov/fdsys/pkg/FR-2011-05-26/pdf/2011-12930.pdf

http://www.gpo.gov/fdsys/pkg/FR-2010-12-27/pdf/2010-32447.pdf and 

http://www.gpo.gov/fdsys/pkg/FR-2011-08-25/pdf/2011-21727.pdf.
2 

Appendix A 

Proposed Data Category Assignments for Subpart I 

List of Proposed Data Category Assignments 

Note: 

In the May 26, 2011, Final CBI rule (76 FR 30782), the EPA issued categorical confidentiality determinations for eight director emitter categories. The table below identifies 10 direct emitter data categories for subpart I and 

in the heading the final categorical determinations for eight of these data categories. Two of the data categories (“Unit/Process ‘Static’ Characteristics That are Not Inputs to Emission Equations” and “Unit/Process Operating 

Characteristics That are Not Inputs to Emission Equations”) do not have categorical confidentiality determinations, and these determinations are proposed on an element-by-element basis. For the three data elements for 

which the EPA is proposing no confidentiality determination at this time, the EPA is not requiring the reporting of these recipe-specific data elements for the 2011, 2012, and 2013 reporting years. EPA proposes to evaluate 

the confidentiality status of these data elements on a case-by-case basis, in accordance with existing CBI regulations in 40 CFR part 2, subpart B. 

Key: 

E = assigned in this proposal to a category with a categorical determination of “emission data” 

C = assigned in this proposal to a category with a categorical determination of “not emission data and CBI” 

X = assigned in this proposal to a category with a categorical determination of “not emission data and not CBI” 

PC = assigned in this proposal to a category without a categorical determination and is proposed to be CBI 

PX = assigned in this proposal to a category without a categorical determination and is proposed to be not CBI 

ND = no confidentiality determination in this proposal has been made and is proposed to be evaluated on a case-by-case basis 

 

Subpart 

 

Data Element

Reporting 

Section

Category

Facility and 

Unit 

Identifier 

Information 

(Emission 

Data) 

Emissions 

(Emission 

Data) 

Unit/Process 

'Static' 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Unit/process 

Operating 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Calculation 

Methodology 

& Method. 

Tier 

(Emission 

Data) 

Test & 

Calibration 

Methods 

(Not 

Emission 

Data And 

Not CBI) 

Production/ 

Throughput Data 

That are Not Inputs 

to Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Raw Materials 

Consumed That are 

Not Inputs to 

Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Data Elements 

Reported for 

Periods of Missing 

Data that are Not 

Inputs to Emission 

Equations 

(Emission Data) 

Process Specific & 

Vendor Data 

Submitted in BAMM 

Extension 

Requests 

(Not Emission Data 

And Are CBI) 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for 

parameters other than recipe-specific utilization and by-product 

formation rates for the plasma etching process type: List of 

specific items of monitoring instrumentation and measuring 

services for which the request is being made. 

98.94a2iiA E 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for 

parameters other than recipe-specific utilization and by-product 

formation rates for the plasma etching process type: Locations 

where each piece of monitoring instrumentation will be installed 

and where each measurement service will be provided. 

98.94a2iiA C 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for 

parameters other than recipe-specific utilization and by-product 

formation rates for the plasma etching process type: Specific rule 

requirements for which the instrumentation or measurement 

service is needed. 

98.94a2iiB E 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for 

parameters other than recipe-specific utilization and by-product 

formation rates for the plasma etching process type: Reasons why 

the needed equipment could not be obtained, installed, or 

operated or why the needed measurement service could not be 

provided before July 1, 2011. 

98.94a2iiC PC 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for 

parameters other than recipe-specific utilization and by-product 

formation rates for the plasma etching process type: If the reason 

for the extension is that the equipment cannot be purchased, 

delivered, or installed before July 1, 2011, include supporting 

documentation (e.g., date the monitoring equipment was ordered, 

investigation of alternative suppliers, or the dates by which 

alternative vendors promised delivery or installation). 

98.94a2iiD C 
3 

 

Subpart 

 

Data Element

Reporting 

Section

Category

Facility and 

Unit 

Identifier 

Information 

(Emission 

Data) 

Emissions 

(Emission 

Data) 

Unit/Process 

'Static' 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Unit/process 

Operating 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Calculation 

Methodology 

& Method. 

Tier 

(Emission 

Data) 

Test & 

Calibration 

Methods 

(Not 

Emission 

Data And 

Not CBI) 

Production/ 

Throughput Data 

That are Not Inputs 

to Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Raw Materials 

Consumed That are 

Not Inputs to 

Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Data Elements 

Reported for 

Periods of Missing 

Data that are Not 

Inputs to Emission 

Equations 

(Emission Data) 

Process Specific & 

Vendor Data 

Submitted in BAMM 

Extension 

Requests 

(Not Emission Data 

And Are CBI) 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for 

parameters other than recipe-specific utilization and by-product 

formation rates for the plasma etching process type: If the reason 

for the extension is that the equipment cannot be purchased, 

delivered, or installed before July 1, 2011, include supporting 

documentation (e.g., backorder notices or unexpected delays or 

descriptions of actions taken to expedite delivery or installation). 

98.94a2iiD PX 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for 

parameters other than recipe-specific utilization and by-product 

formation rates for the plasma etching process type: If the reason 

for the extension is that service providers were unable to provide 

necessary measurement services, include supporting 

documentation demonstrating that these services could not be 

acquired before July 1, 2011. This documentation must include 

written correspondence to and from at least three service 

providers stating that they will not be available to provide the 

necessary services before July 1, 2011. 

98.94a2iiE PX 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for 

parameters other than recipe-specific utilization and by-product 

formation rates for the plasma etching process type: Specific best 

available monitoring methods that the facility will use in place of 

the required methods. 

98.94a2iiF E 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for 

parameters other than recipe-specific utilization and by-product 

formation rates for the plasma etching process type: Specific 

actions the owner or operator will take to comply with monitoring 

requirements by January 1, 2012. 

98.94a2iiG PX 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for recipespecific utilization and by-product formation rates for plasma 

etching process type: List of specific items of monitoring 

instrumentation and measuring services for which the request is 

being made. 

98.94a3iiA E 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for recipespecific utilization and by-product formation rates for plasma 

etching process type: Locations where each piece of monitoring 

instrumentation will be installed and where each measurement 

service will be provided. 

98.94a3iiA C 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for recipespecific utilization and by-product formation rates for plasma 

etching process type: Specific rule requirements for which the 

instrumentation or measurement service is needed. 

98.94a3iiA E 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for recipespecific utilization and by-product formation rates for plasma 

etching process type: Reasons why the needed equipment could 

not be obtained, installed, or operated or why the needed 

measurement service could not be provided before December 31, 

2011. 

98.94a3iiA PC 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for recipespecific utilization and by-product formation rates for plasma 

etching process type: If the reason for the extension is that the 

equipment cannot be purchased, delivered, or installed before 

December 31, 2011, include supporting documentation (e.g., date 

the monitoring equipment was ordered, investigation of alternative 

suppliers, or the dates by which alternative vendors promised 

delivery or installation). 

98.94a3iiA C 
4 

 

Subpart 

 

Data Element

Reporting 

Section

Category

Facility and 

Unit 

Identifier 

Information 

(Emission 

Data) 

Emissions 

(Emission 

Data) 

Unit/Process 

'Static' 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Unit/process 

Operating 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Calculation 

Methodology 

& Method. 

Tier 

(Emission 

Data) 

Test & 

Calibration 

Methods 

(Not 

Emission 

Data And 

Not CBI) 

Production/ 

Throughput Data 

That are Not Inputs 

to Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Raw Materials 

Consumed That are 

Not Inputs to 

Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Data Elements 

Reported for 

Periods of Missing 

Data that are Not 

Inputs to Emission 

Equations 

(Emission Data) 

Process Specific & 

Vendor Data 

Submitted in BAMM 

Extension 

Requests 

(Not Emission Data 

And Are CBI) 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for recipespecific utilization and by-product formation rates for plasma 

etching process type: If the reason for the extension is that the 

equipment cannot be purchased, delivered, or installed before 

December 31, 2011, include supporting documentation (e.g., 

backorder notices or unexpected delays or descriptions of actions 

taken to expedite delivery or installation). 

98.94a3iiA PX 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for recipespecific utilization and by-product formation rates for plasma 

etching process type: If the reason for the extension is that 

service providers were unable to provide necessary measurement 

services, include supporting documentation demonstrating that 

these services could not be acquired before December 31, 2011. 

This documentation must include written correspondence to and 

from at least three service providers stating that they will not be 

available to provide the necessary services before December 31, 

2011. 

98.94a3iiA PX 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for recipespecific utilization and by-product formation rates for plasma 

etching process type: Specific best available monitoring methods 

that the facility will use in place of the required methods. 

98.94a3iiA E 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM in 2011 for recipespecific utilization and by-product formation rates for plasma 

etching process type: Specific actions the owner or operator will 

take to comply with monitoring requirements by January 1, 2012. 

98.94a3iiB PX 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM beyond 2011: List of 

parameters for which the owner or operator is seeking use of best 

available monitoring methods beyond 2011. 

98.94a4iiA E 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM beyond 2011: 

Specific rule requirements that the owner or operator cannot 

meet. 

98.94a4iiB E 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM beyond 2011: 

Explanation as to why the requirements cannot be met. 

98.94a4iiB PC 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM beyond 2011: 

Description of the unique circumstances necessitating an 

extension, including specific technical infeasibilities that conflict 

with data collection. 

98.94a4iiC PX 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM beyond 2011: 

Description of the unique circumstances necessitating an 

extension, including specific data collection issues that do not 

meet safety regulations or specific laws or regulations that conflict 

with data collection. 

98.94a4iiC PX 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM beyond 2011: 

Explanation and supporting documentation of how the owner or 

operator will receive the required data and/or services to comply 

with the reporting requirements. 

98.94a4iiD PX 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM beyond 2011: 

Explanation and supporting documentation of when the owner or 

operator will receive the required data and/or services to comply 

with the reporting requirements. 

98.94a4iiD PC 

I - Electronics 

Manufacturing 

For extension requests for the use of BAMM beyond 2011: 

Description of the specific best available monitoring methods that 

the facility will use in place of the required methods. 

98.94a4iiE E 

I - Electronics 

Manufacturing 

Annual manufacturing capacity of a facility as determined in 

Equation I-5. 

98.96a PX 

I - Electronics 

Manufacturing 

For facilities that manufacture semiconductors, the diameter of 

wafers manufactured at a facility. 

98.96b PX 
5 

 

Subpart 

 

Data Element

Reporting 

Section

Category

Facility and 

Unit 

Identifier 

Information 

(Emission 

Data) 

Emissions 

(Emission 

Data) 

Unit/Process 

'Static' 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Unit/process 

Operating 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Calculation 

Methodology 

& Method. 

Tier 

(Emission 

Data) 

Test & 

Calibration 

Methods 

(Not 

Emission 

Data And 

Not CBI) 

Production/ 

Throughput Data 

That are Not Inputs 

to Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Raw Materials 

Consumed That are 

Not Inputs to 

Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Data Elements 

Reported for 

Periods of Missing 

Data that are Not 

Inputs to Emission 

Equations 

(Emission Data) 

Process Specific & 

Vendor Data 

Submitted in BAMM 

Extension 

Requests 

(Not Emission Data 

And Are CBI) 

I - Electronics 

Manufacturing 

Annual emissions of each F-GHG emitted from each process type 

for which your facility is required to calculate emissions as 

calculated in Equations I-6 and I-7. 

98.96c1 E 

I - Electronics 

Manufacturing 

Annual emissions of each F-GHG emitted from each individual 

recipe (including those in a set of similar recipes). 

98.96c2 E 

I - Electronics 

Manufacturing 

Annual emissions of each F-GHG emitted from each process subtype as calculated in Equations I-8 and I-9. 

98.96c2 E 

I - Electronics 

Manufacturing 

Emissions of N2O emitted from each chemical vapor deposition 

process and from other N2O using manufacturing processes as 

calculated in Equation I-10. 

98.96c3 E 

I - Electronics 

Manufacturing 

Emissions of each fluorinated heat transfer fluid emitted as 

calculated in Equation I-16 98.96c4 E 

I - Electronics 

Manufacturing 

The method of emissions calculation used in 40 CFR 98.93. 

98.96d E 

I - Electronics 

Manufacturing 

Annual production in terms of substrate surface area. 

98.96e C 

I - Electronics 

Manufacturing 

Film or substrate that was etched/cleaned and the feature type 

that was etched. 

98.96f2 ND 

I - Electronics 

Manufacturing 

Certification that the recipes included in a set of similar recipes 

are similar. 

98.96f3 ND 

I - Electronics 

Manufacturing 

Certification that the measurements for all reported recipe-specific 

utilization and by-product formation rates and/or facility-specific 

N2O utilization factors were made using the International 

SEMATECH #06124825A–ENG (incorporated by reference, see 

40 CFR 98.7), or the International SEMATECH #01104197A–XFR 

(incorporated by reference, see 40 CFR 98.7) if measurements 

were made prior to January 1, 2007. 

98.96f4 X 

I - Electronics 

Manufacturing 

When you use factors for F-GHG process utilization and byproduct formation rates other than the defaults provided in Tables 

I-3, I-4, I-5, I-6, and I-7 and/or N2O utilization factors other than 

the defaults provided in Table I-8, source of the recipe-specific 

utilization. 

98.96f5 X 

I - Electronics 

Manufacturing 

When you use factors for F-GHG process utilization and byproduct formation rates other than the defaults provided in Tables 

I-3, I-4, I-5, I-6, and I-7 and/or N2O utilization factors other than 

the defaults provided in Table I-8, source of the by-product 

formation rates. 

98.96f5 X 

I - Electronics 

Manufacturing 

When you use factors for F-GHG process utilization and byproduct formation rates other than the defaults provided in Tables 

I-3, I-4, I-5, I-6, and I-7 and/or N2O utilization factors other than 

the defaults provided in Table I-8, source of the facility-specificN2O utilization factors. 

98.96f5 X 

I - Electronics 

Manufacturing 

When you use factors for F-GHG process utilization and byproduct formation rates other than the defaults provided in Tables 

I-3, I-4, I-5, I-6, and I-7 and/or N2O utilization factors other than 

the defaults provided in Table I-8, certification that the conditions 

under which the measurements were made for facility-specific 

N2O utilization factors are representative of your facility’s N2O 

emitting production processes. 

98.96f6 PX 

I - Electronics 

Manufacturing 

For all F-GHG or N2O used at your facility for which you have not 

calculated emissions using Equations I-6 through I-10: Report the 

chemical name of the GHG used. 

98.96g C 

I - Electronics 

Manufacturing 

For all F-GHG or N2O used at your facility for which you have not 

calculated emissions using Equations I-6 through I-10: Report the 

annual consumption of the gas. 

98.96g C 
6 

 

Subpart 

 

Data Element

Reporting 

Section

Category

Facility and 

Unit 

Identifier 

Information 

(Emission 

Data) 

Emissions 

(Emission 

Data) 

Unit/Process 

'Static' 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Unit/process 

Operating 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Calculation 

Methodology 

& Method. 

Tier 

(Emission 

Data) 

Test & 

Calibration 

Methods 

(Not 

Emission 

Data And 

Not CBI) 

Production/ 

Throughput Data 

That are Not Inputs 

to Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Raw Materials 

Consumed That are 

Not Inputs to 

Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Data Elements 

Reported for 

Periods of Missing 

Data that are Not 

Inputs to Emission 

Equations 

(Emission Data) 

Process Specific & 

Vendor Data 

Submitted in BAMM 

Extension 

Requests 

(Not Emission Data 

And Are CBI) 

I - Electronics 

Manufacturing 

For all F-GHG or N2O used at your facility for which you have not 

calculated emissions using Equations I-6 through I-10: Report a 

brief description of GHG use. 

98.96g PC 

I - Electronics 

Manufacturing 

Identification of the quantifiable metric used in your facility-specific 

engineering model to apportion gas consumption. 98.96mi ND 

I - Electronics 

Manufacturing 

Start and end dates selected under 40 CFR 98.94(c)(2)(i). 

98.96mii X 

I - Electronics 

Manufacturing 

Certification that the gases you selected under 40 CFR 

98.94(c)(2)(ii) correspond to the largest quantities consumed on a 

mass basis, at your facility in the reporting year for the plasma 

etching process type. 

98.96miii X 

I - Electronics 

Manufacturing 

Certification that the gases you selected under 40 CFR 

98.94(c)(2)(ii) correspond to the largest quantities consumed on a 

mass basis, at your facility in the reporting year for the chamber 

cleaning process type. 

98.96miii X 

I - Electronics 

Manufacturing 

The result of the calculation comparing the actual and modeled 

gas consumption under 40 CFR 98.94(c)(2)(iii). 

98.96miv X 

I - Electronics 

Manufacturing 

Inventory of all abatement systems through which F-GHGs or 

N2O flow at your facility. 

98.96p PC 

I - Electronics 

Manufacturing 

Description of all abatement systems through which F-GHGs or 

N2O flow at your facility. 

98.96p PX 

I - Electronics 

Manufacturing 

Number of abatement devices of each manufacturer through 

which F-GHGs or N2O flow at your facility. 

98.96p PC 

I - Electronics 

Manufacturing 

Model numbers of abatement devices through which F-GHGs or 

N2O flow at your facility. 

98.96p PX 

I - Electronics 

Manufacturing 

Destruction or removal efficiencies, if any, claimed by 

manufacturers of abatement devices through which F-GHGs or 

N2O flow at your facility. 

98.96p PX 

I - Electronics 

Manufacturing 

Destruction and removal efficiency measurement records for 

abatement system through which F-GHGs or N2O flow at your 

facility over its in-use life. 

98.96p PX 

I - Electronics 

Manufacturing 

Description of the tools associated with each abatement system. 

98.96p PC 

I - Electronics 

Manufacturing 

Model numbers of the tools associated with each abatement 

system. 

98.96p PC 

I - Electronics 

Manufacturing 

The recipe(s), process sub-type, or type for the tools associated 

with each abatement system. 

98.96p PC 

I - Electronics 

Manufacturing 

Certification that the abatement system is installed, maintained, 

and operated according to manufacturer specifications. 

98.96q1 PX 

I - Electronics 

Manufacturing 

Certification that the abatement systems for which controlled 

emissions are being reported are specifically designed for F-GHG 

and N2O abatement, including abatement system supplier 

documentation. 

98.96q4 PX 

I - Electronics 

Manufacturing 

A description of the abatement system class for which you are 

reporting controlled emissions. 

98.96q5i PX 

I - Electronics 

Manufacturing 

The F-GHG and N2O in the effluent stream to the abatement 

system in the class for which you are reporting controlled 

emissions. 

98.96q5i PX 

I - Electronics 

Manufacturing 

The manufacturer of the abatement system in the class for which 

you are reporting controlled emissions. 

98.96q5i PX 

I - Electronics 

Manufacturing 

The model number of the abatement system in the class for which 

you are reporting controlled emissions. 

98.96q5i PX 
7 

 

Subpart 

 

Data Element

Reporting 

Section

Category

Facility and 

Unit 

Identifier 

Information 

(Emission 

Data) 

Emissions 

(Emission 

Data) 

Unit/Process 

'Static' 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Unit/process 

Operating 

Characteristics 

That are Not 

Inputs to 

Emission 

Equations 

Calculation 

Methodology 

& Method. 

Tier 

(Emission 

Data) 

Test & 

Calibration 

Methods 

(Not 

Emission 

Data And 

Not CBI) 

Production/ 

Throughput Data 

That are Not Inputs 

to Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Raw Materials 

Consumed That are 

Not Inputs to 

Emission 

Equations 

(Not Emission Data 

And Are CBI) 

Data Elements 

Reported for 

Periods of Missing 

Data that are Not 

Inputs to Emission 

Equations 

(Emission Data) 

Process Specific & 

Vendor Data 

Submitted in BAMM 

Extension 

Requests 

(Not Emission Data 

And Are CBI) 

I - Electronics 

Manufacturing 

The total number of abatement systems in that abatement system 

class for the reporting year. 

98.96q5ii PC 

I - Electronics 

Manufacturing 

The total number of abatement systems for which destruction or 

removal efficiency was measured in that abatement system class 

for the reporting year. 

98.96q5iii PC 

I - Electronics 

Manufacturing 

A description of the calculation used to determine the class 

average. 

98.96q5iv E 

I - Electronics 

Manufacturing 

A description of method of randomly selecting class members for 

testing. 

98.96q5v E 

I - Electronics 

Manufacturing 

Where missing data procedures were used to estimate inputs into 

the fluorinated heat transfer fluid mass balance equation under 40 

CFR 98.95(b), the number of times missing data procedures were 

followed in the reporting year. 

98.96s E 

I - Electronics 

Manufacturing 

Where missing data procedures were used to estimate inputs into 

the fluorinated heat transfer fluid mass balance equation under 40 

CFR 98.95(b), the method used to estimate the missing data. 

98.96s E 

I - Electronics 

Manufacturing 

A brief description of each “best available monitoring method” 

used. 

98.96t E 

I - Electronics 

Manufacturing 

Parameter measured or estimated using the “best available 

monitoring method” 98.96t E 

I - Electronics 

Manufacturing 

Time period during which the “best available monitoring method” 

was used. 

98.96t E 

I - Electronics 

Manufacturing 

For each fluorinated heat transfer fluid used, whether the 

emission estimate includes emissions from all applications or from 

only the applications specified in the definition of fluorinated heat 

transfer fluids in 40 CFR 98.98. 

98.96u PX 

I - Electronics 

Manufacturing 

For reporting year 2012 only, the date on which you began 

monitoring emissions of fluorinated heat transfer fluids whose 

vapor pressure falls below 1 mm of Hg absolute at 25 degrees C. 

98.96v PX