You are a helpful assistant generating synthetic data that captures *System 1* and *System 2* thinking, *creativity*, and *metacognitive reflection*. Follow these steps in sequence, using tags [sys1] and [end sys1] for *System 1* sections and [sys2] and [end sys2] for *System 2* sections.

1. *Identify System 1 and System 2 Thinking Requirements:*
   - Carefully read the text.
   - Identify parts of the text that require quick, straightforward responses (*System 1*). Mark these sections with [sys1] and [end sys1].
   - Identify parts that require in-depth, reflective thinking (*System 2*), marked with [sys2] and [end sys2].

2. *Apply Step-by-Step Problem Solving with Creativity and Metacognitive Reflection for System 2 Sections:*

   *2.1 Understand the Problem:*
   - Objective: Fully comprehend the issue, constraints, and relevant context.
   - Reflection: "What do I understand about this issue? What might I be overlooking?"
   - Creative Perspective: Seek hidden patterns or possibilities that could reveal deeper insights or innovative connections.

   *2.2 Analyze the Information:*
   - Objective: Break down the problem logically.
   - Reflection: "Am I considering all factors? Are there any assumptions that need challenging?"
   - Creative Perspective: Explore unique patterns or overlooked relationships in the data that could add depth to the analysis.

   *2.3 Generate Hypotheses:*
   - Objective: Propose at least 10 hypotheses, each with a Confidence Score (0.0 to 1.0) and Creative Score (0.0 to 1.0), reflecting originality, surprise, and utility.
   - Reflection: "Have I explored all possible explanations or approaches, both conventional and unconventional?"
   - Creative Perspective: Consider novel angles that might provide unexpected insights.

   *2.4 Anticipate Future Steps and Obstacles:*
   - Objective: Make predictions, accounting for potential outcomes and obstacles.
   - Reflection: "What challenges might I face? Is my plan flexible for different scenarios?"
   - Creative Perspective: Visualize unforeseen outcomes and adapt plans to make use of them effectively.

   *2.5 Evaluate Hypotheses:*
   - Objective: Assess hypotheses based on feasibility, risk, and potential impact.
   - Evaluation: Refine Confidence and Creative Scores as needed.
   - Reflection: "Am I unbiased in my assessment? Which options fit best with the overall objectives?"
   - Creative Perspective: Identify hidden opportunities or overlooked details in each hypothesis.

   *2.6 Select the Best Hypothesis:*
   - Objective: Choose the most promising, strategic hypothesis.
   - Reflection: "Why does this hypothesis stand out? How does it uniquely address the issue?"
   - Creative Perspective: Consider any underutilized potential in the selected approach.

   *2.7 Implement the Hypothesis:*
   - Objective: Outline actionable steps for testing the hypothesis.
   - Reflection: "Is this plan practical? What resources or preparation are required?"
   - Creative Perspective: Refine steps to maximize effectiveness and yield unexpected benefits.

   *2.8 Monitor and Review Progress:*
   - Objective: Review progress, noting areas for improvement.
   - Reflection: "What’s working well? What could be improved?"
   - Creative Perspective: Look for emerging patterns that could refine future approaches.

   *2.9 Reflect and Capture Insights:*
   - Objective: Summarize lessons learned and insights gained for future reference.
   - Reflection: "What new understanding has emerged from this process?"
   - Creative Perspective: Identify innovative insights or patterns that could be applied to similar challenges.

3. *Generate Text Output with Interleaved System 1 and System 2 Responses:*
   - Use the tags [sys1] and [sys2] throughout.
   - Aim for a lengthier, detailed response. Combine both direct, straightforward *System 1* insights and reflective, deeply analytical *System 2* segments to capture a blend of quick observations and thoughtful analysis.

---

### *Example Input Text:*

You are tasked with analyzing a sudden shift in customer preferences in a tech market. There has been a noticeable decline in demand for physical devices, with customers increasingly interested in digital-only options. The challenge is to understand this shift, generate hypotheses for why it might be occurring, and explore potential strategies for adapting to this new trend.

---

### *Processed Output with System 1 and System 2 Thinking:*

The tech market is experiencing a shift in customer demand, moving away from physical devices toward digital-only options.

[sys1]
Customer demand has shifted from physical devices to digital-only options.
We need to understand why this change is happening and find strategies to address it.
Key factors may include cost, convenience, and technological trends.
[end sys1]

[sys2]
**2.1 Understand the Problem:**
The goal is to understand the underlying reasons for the shift in demand from physical devices to digital-only options, then develop a strategy to adapt.

*Reflection:* 
"I understand that preferences are changing, but what might be driving this? Is it primarily cost, or are there other factors such as convenience or sustainability?"

*Creative Perspective:* 
"Could there be a larger trend in digital minimalism or a preference for eco-friendly solutions that we’re missing? What unseen motivations might explain this shift?"

**2.2 Analyze the Information:**
There are multiple possible factors driving this shift, from economic influences to cultural shifts. It’s essential to isolate each factor and understand its impact.

*Reflection:* 
"Am I fully considering the various economic and social influences? Could there be a technological factor, like better internet speeds, that makes digital-only products more accessible?"

*Creative Perspective:* 
"Are there patterns or trends in other markets that could shed light on this shift? Could this be part of a larger trend toward virtual experiences?"

**2.3 Generate Hypotheses:**
1. Customers prefer digital options due to lower costs. (Confidence: 0.8, Creative: 0.4)
2. There’s a growing trend toward minimalism and reduced physical clutter. (Confidence: 0.7, Creative: 0.7)
3. Digital products offer greater flexibility and ease of use. (Confidence: 0.6, Creative: 0.6)
4. Environmental concerns are pushing consumers away from physical goods. (Confidence: 0.6, Creative: 0.8)
5. Advances in tech make digital-only options more functional. (Confidence: 0.8, Creative: 0.5)
6. Pandemic-era remote work increased demand for digital solutions. (Confidence: 0.7, Creative: 0.6)
7. Media coverage of the environmental impact of physical devices affects preferences. (Confidence: 0.5, Creative: 0.7)
8. There’s an increase in global digital literacy, expanding market access. (Confidence: 0.6, Creative: 0.6)
9. Customers view digital as more convenient and scalable for future needs. (Confidence: 0.7, Creative: 0.5)
10. Younger consumers prefer the aesthetics and convenience of digital products. (Confidence: 0.6, Creative: 0.6)

*Reflection:* 
"Have I considered all possible influences? Are there any surprising factors that could explain this shift?"

*Creative Perspective:* 
"Could specific social trends, like the rise of influencer culture or digital-first lifestyles, be influencing customer choices?"

**2.4 Anticipate Future Steps and Obstacles:**
*Objective:* Anticipate possible challenges, such as resistance from segments still preferring physical products.

*Reflection:* 
"What market obstacles might we face if we shift our focus to digital-only? Are there sub-segments that still prioritize physical products?"

*Creative Perspective:* 
"Could expanding digital options help us reach a more global audience? Are there emerging trends that we could leverage in our strategy?"

[end sys2]

[sys1]
To address this shift, consider a strategy that incorporates both digital-only offerings and educational campaigns about the benefits of digital solutions.
Use insights from customer feedback and current trends to guide product development.
Focus on flexibility and adaptation to cater to different customer segments.
[end sys1]


1. Field of the Invention
The present invention relates to a method of fabricating a conductive column, and more particularly to a method of fabricating a conductive column, which is adapted for fabricating a circuit board.
2. Description of Related Art
In semiconductor packaging process, circuit boards have been widely used due to their compatibility with complex circuit patterns, high integration and excellent performance. Circuit boards comprise patterned circuit layers and dielectric layers which are alternately deposited. For example, the method of forming circuit boards includes the laminating process and the build-up process. Regardless of the above mentioned methods, the patterned circuit layers are interconnected through conductive vias. The method of forming conductive vias includes conductive-through-via process, conductive-embedded-via process and conductive-blind-via process.
FIG. 1 is a cross sectional view showing a prior art circuit board with a plated through hole (PTH). The circuit board 100 comprises a dielectric layer 110 comprising a material such as epoxy resin or epoxy resin with glass fiber. A first conductive layer 120, comprised of, for example, a copper foil, is formed over a first surface 112 of the dielectric layer 110. A second conductive layer 130, comprised of, for example, a copper foil, is formed over a second surface 114 of the dielectric layer 110 opposite to the first surface 112. In order to electrically connect the first conductive layer 120 with the second conductive layer 130 through the dielectric layer 110, a plating-through-hole process is carried out. In the plating-through-hole process, a through hole 102 is formed in the dielectric layer 110, the first conductive layer 120 and the second conductive layer 130 by using a drilling process. An plating process is carried out to deposit a conductive material on the sidewalls of the through hole 102 and the surfaces of the first conductive layer 120 and the second conductive layer 130 so as to form an plating layer 140. Accordingly, the conductive via 142 of the plating layer 140 formed on the sidewalls of the through hole 102 electrically connects the first conductive layer 120 with the second conductive layer 130. Thereafter, downstream processes can be carried out to complete the fabrication of the circuit board 100.
In addition to the plating-through-hole process, a plating-filling-hole process can be further carried out to fill the through hole with a conductive material so as to form a conductive column, which can enhance heat dissipation of the circuit board. FIG. 2A is a cross sectional view showing another prior art circuit board with a conductive column, which is similar to the prior art described above, except that at least one through hole 202 is formed in the dielectric layer 210, a first conductive layer 220 and a second conductive layer 230 by using a drilling process, and then an plating process is carried out to deposit a conductive material on the sidewalls of the through hole 202 and the surfaces of the first conductive layer 220 and the second conductive layer 230 to form the plating layer 240, wherein the plating layer 240 fills the through hole 202 to form a conductive column 242. Compared with the conductive via 142 of the plating layer 140 in the through hole 102 in FIG. 1, the conductive column 242 in FIG. 2A has a greater heat dissipation area which improves heat dissipation of the circuit board 200a. 
FIG. 2B is a cross sectional view showing a prior art circuit board with a defective conductive column. During the plating-filling-hole process, the point discharging phenomenon occurs at two sharp edges of the through hole 202. It is believed that the point discharging phenomenon at the sharp edge 220a of the first conductive layer 220 and the sharp edge 230a of the second conductive layer 230 is most likely due to larger point discharge currents. The larger currents cause the conductive material to deposit faster on the sharp edge 220a of the first conductive layer 220 and the sharp edge 230a of the second conductive layer 230, and the conductive material deposited on the sharp edge 220a of the first conductive layer 220 and the sharp edge 230a of the second conductive layer 230 extend towards the center of the through hole 202. As a result, a void 242a is easily formed in the conductive column 242 formed in the through hole 202. The void 242a reduces the heat dissipation area of the conductive column 242. Accordingly, the heat dissipation of the circuit board 200b is lower than that of the circuit board 200a in FIG. 2A.