"“BMB Power Supliers
The BMB board shall have two isolated power converter circuits which one of the converter shall be conver the battery voltage to 3.3VDC +/- 5% and other converter shall be convert the battery voltage to 5VDC +/-5%. Also, the BMB board shall have a step-down converter circuit for the MCU supply that converts the isolated 3.3VDC +/- 5%to 1.2VDC +/-5%.
Isolated 3.3V converter circuit shall provide a minimum of 1A current while the battery is in active mode.
When the battery voltage drops below 6VDC +/- 5%, the isolated 3.3VDC and 5VDC converter circuits output shall be off, and when the battery voltage rises above 9V +/- 5%, its output shall be on.
The isolated 5V+/- 5% circuit shall provide a minimum of 100mA current when the battery is in active mode.
Hold-Up Circuit
The Hold-Up circuit shall be able to supply the BMB board for a maximum of 10 seconds when the battery voltage remains below 15V+/- 5% for a minimum of 500ms.
ARINC 429
BMB Board shall have an isolated symmetrical 5VDC +/-%5 supply circuit to supply the ARINC 429 line driver circuit.
MCU shall be transmit isolated input signals in the range of 0-3.3VDC to the ARINC 429 Line driver circuit. These input signals shall be converted into +/- 5VDC +/-2% signals and transferred to the communication connectors.
Analog SOC
The BMB board shall have an analog SOC circuit that scales the calculated 0-100% SOC information from the MCU linearly within the 0-5V +/-1% voltage range. This analog signal shall be transmited to the communication connector.
The analog SOC circuit shall be supplied by a converter that converted isolated 3.3VDC to 6VDC +/- 5%.
Data Log
The BMB board shall have a Flash ROM circuit with a capacity of 64Mb, supplied by isolated 3.3VDC , capable of recording log data sent from the MCU with SPI communication.
The BMB board shall have RTC circuit to generate real-time clock signals, interface with the MCU via SPI, and provide real-time recording of battery data. This circuit shall be supplied 3.3VDC+/-5%.
The RTC circuit shall be supplied by a 3.3VDC coin cell when there is no supply voltage.
Battery Status İndicator
The BMB Board shall have a Led Driver circuit that can communicate with the MCU via I2C and can be disabled by the MCU. This circuit shall have nine channel outputs and supplied by 3.3 VDC +/- 5%.
The LEDs on the Battery Status Indicator shall be controlled by the LED driver circuit based on data that consist of battery error, service, SOC, and status information received from the MCU.
When the battery SOC button is pressed, a 0VDC+/- 100mV signal shall be transmitted to the GPIO pin of the MCU; otherwise 3.3VDC+/- 5% signal shall be transmitted.
“While pressing the button less than 1 second, the battery shall be show SOC status.
While pressing the button longer than 1 second and less than 60 second, the battery shall be change modes either active mode to sleep mode or vice versa.
While pressing the button longer than 60 second, the battery shall be entering the programming mode.”
I2C Isolator
The BMB board shall have isolating I2C communication circuits, enabling isolated communication between the MCU and monitoring boards in each module.The isolated I2C signals shall be transmitted to the module communication connectors.
I2C Isolator circuits shall be supply both by 3.3VDC/- 5% generated on the monitor board in each module and the isolated 3.3V/- 5% generated on the BMB board.
Module Enable
The BMB board shall have module enable circuit for activating the power circuits of each module.
A minimum of 10ms analog 0VDC+/- 100mV signal shall be applied by the module enable circuit to the module to be controlled by the MCU. This signal shall be transmitted isolated to the monitor board of the relevant module.
Pack Monitoring
The battery shall have a pack monitoring circuit that can read the pack current and battery charging voltage. This circuit shall transmit the battery charge voltage and pack current value to the MCU via I2C. This circuit should be able to measure voltage with a maximum step size of +/- 5mV. Also, this circuit should be able to measure current with a maximum step size of +/- 10mA.
The MCU shall be able to determine the charging mode when the pack monitoring circuit reads a current above +500mA and the discharging mode when the current is below -500mA.
The pack monitoring circuit shall be able to measure the battery’s 12VDC to 32VDC battery charging voltage and 1A to 60A charging current.
When the battery charging voltage remains above 30.2VDC+/-5% for at least 1 second, the circuit shall produce a Pack Over Voltage Alert signal.This signal shall be transmitted to the monitoring card in each module by isolated .
Discrete Input and Output Signals
The BMB board shall have isolated discret input/output circuit.
These circuit shall have dicrete output signals called DISCRETE_FAULT, DISCRETE_SERVICE and DISCRETE_HEATING. These signals shall be isolated from the MCU and transmitted to the communication connector. When the discrete output signal data comes from the MCU shall be pull the pin voltage level to ground. When no coming discrete output signal data from the MCU, the discrete output pins shall be above 1Megohm impedance.
Isolated discret input/output circuit shall have discrete input signals called DISABLE_BATTERY and DISABLE_HEATER . These signals shall be isolated from the communication connector and transmitted to the MCU. When no coming discrete input signal data from the communication connector, the discrete input pins should be 5VDC+/-5% voltage level. When the discret input signal data comes from the communication connector shall be pull the pin voltage level to ground and detected this discrete input signal state by the MCU.
Heater Control
The control board in each module shall have heater control circuit. Heater control signal shall be able to set 0VDC+/-100mV or 12VDC+/-5% by the MCU via I2C communication. When heater control signal 12VDC+/-5%, the heater circuit shall be activated. When heater control signal 0VDC+/-100mV, the heater circuit shall be deactivated.
The heater control circuit in each control board shall allow a maximum current draw of 15A from the heaters in each module.
The heater control circuit in each control board shall be measure heater current minimum 0.5A with maximum 5mA step size and it transmit to the MCU via I2C communication .
The heater control circuit in each control board shall be measure heater tempereature with maximum 1°C temperature step size and it transmit to the MCU via I2C communication.
The heater control circuit in each control board shall be able to measure the heater temperature within -40°C +80°C.
Each module shall have a heater with a resistance of 5.5 ohms +/-5% and a power consumption of 128Watt +/-5% at the nominal voltage of the battery.
When there is no exist charging voltage of the battery and battery voltage greater than 20VDC the heaters in each module shall be able to increase the battery temperature by using self battery energy. When the charging voltage greater than battery voltage, the heater in each module shall be able to increase temperature of the battery using by external charge voltage.
Limiter
The control boards in each module shall have a limiter circuit that can limit the battery charging current and can be configured by the MCU.
The limiter circuit shall be able to limit the charging current from 0.1C(6A) to 8C(480A)
The control card in each module shall contain a current limiting circuit set at 3.34A +/-5%. When the MCU detects a charging current above the battery charging limiting current determined as 20A(6*3.34A) +/-5%, it shall activate the limiting circuits in each module and limit the charging current.
While the limiter circuit is active, the battery shall be able to transmit the limiter current to the MCU via I2C communication.
Switches
The control board in each module shall have a charge and discharge control circuit that operates on 12VDC +/-5% and can be controlled by the MCU via I2C communication.
When the battery is in charge mode, the CHG_Gate_Control signal of the charge control circuit shall be set to 12VDC +/-5%. When the battery is in discharge mode, the DSG_Gate_Control signal of the discharge control circuit shall be set to 12VDC +/-5%.
When the battery enters over current charge protection, the CHG Gate Control signal shall be set to 0VDC +/-200mV and cut off the charge current within maximum 2 seconds.
When the battery enters over current discharge protection, DSG_Gate_Control signal shall be set to 0VDC +/-200mV and cut off the discharge current within maximum 2 seconds.
When the battery enters over temperature discharge protection, the DSG_Gate_Control signal shall be set to 0VDC +/-200mV and the discharge current shall be cut off within maximum 2 seconds. When the battery recover from over temperature discharge protection , DSG_Gate_Control signal shall be set to 12VDC +/-5% and shall be able to allow discharge current within maximum 1 second.
When the battery enters over temperature charge protection, the CHG_Gate_Control signal shall be set to 0VDC +/-200mV and the charging current shall be cut off within maximum 2 seconds. When the battery recover from over temperature charge protection, the CHG_Gate_Control signal shall be set to 12VDC +/-5% and shall be able to allow charging current within maximum 1 second.
When the battery enters under temperature charge protection, the CHG_Gate_Control signal shall be set to 0VDC +/-200mV and the charging current shall be cut off within maximum 2 seconds. When the battery recover from under temperature charge protection, the CHG_Gate_Control signal shall be set to 12VDC +/-5% and shall be able to allow charging current within maximum 1 second.
When the battery enters pack over voltage protection while in charging state, the CHG_Gate_Control signal shall be set to 0VDC +/-200mV and cut off the charging current within maximum 2 seconds, or if the CHG_Gate_Control signal is at 0V, it shall continue to keep it at 0VDC +/-200mV . When the battery recover from the pack over voltage charge protection, the CHG_Gate_Control signal shall be set to 12VDC +/-5% and allow charging current within maximum 1 second.
When the battery enters cell over voltage protection, the CHG_Gate_Control signal shall be set to 0VDC +/-200mV and the charging current shall be cut off within maximum 2 seconds. When the battery recover from cell over voltage protection, the CHG_Gate_Control signal shall be set to 12VDC +/-5% and allow charging current within maximum 1 second.
When the battery enters the cell under voltage protection, the DSG_Gate_Control signal shall be set to 0VDC +/-200mV and the discharge current shall be cut off within maximum 2 seconds. When the battery recover from cell under voltage protection, the DSG_Gate_Control signal shall be set to 12VDC +/-5% and allow discharge current within maximum 1 second.
When the battery enters short circuit discharge protection, the DSG_Gate_Control signal signal shall be set to 0VDC +/-200mV and the discharge current shall be cut off within maximum 200 ms. When the battery recover from short circuit discharge protection, DSG_Gate_Control signal shall be set to 12VDC +/-5% and allow discharge current within maximum 1 second.
Modul Monitor Power
The monitor board shall have DC/DC converter circuits that convert the battery pack voltage to 3.3VDC+/-5%, 5VDC+/-5%, 12VDC+/-5%.
The 3.3V DC/DC converter circuit shall be activated by the MCU via the I2C line and provide a minimum of 100mA output current.
The 5V DC/DC converter circuit shall be able to provide a minimum of 10mA output current and this circuit shall be active at all battery modes.
The 12V DC/DC converter circuit shall be activated by the MCU via the I2C line and provide a minimum of 100mA output current.
Cell Balancing
The monitor board in each module shall have a passive cell balancing circuit that can be activated by the MCU via the I2C communication. The cell balancing circuit shall be controlled by the module monitoring circuit.
When all cell voltages in each module exceed 3.4VDC+/-2%, the cell balancing function in the module monitoring circuit shall be activated by the MCU.
The cell balancing circuit shall be able to balance the cells to allow a maximum voltage difference between cells of 20mVDC when the cell balancing function is active and all module cells are above a voltage value of 3.4VDC+/-2%.
Analog Protections
The monitor board in each module shall have an analog protection circuit that provides analog COV, OTC, OTD and heater over temperature protection. This circuit shall provide fail tolerance for OTC, OTD,COV and Heater Over Temperature protections.
Analog protection circuit in the monitor board shall provide an analog over temperature protection. While the battery is in discharge state, when the temperature of the module remains above 85°C +/-5% for a maximum of 1 second, the logic control circuit shall set the SHIFTED_DSG_CONTROL signal to 0VDC+/-100mV and the module discharge current shall be cut off. The modules shall be enter analog OTD protection. While the battery is charging, when the temperature of the module remains above 85°C +/-5% for a maximum of 1 second, the logic control circuit shall set the SHIFTED_CHG_CONTROL signal to 0VDC+/-100mV and the module charging current shall be cut off.The modules shall be enter analog OTC protection.
While the battery is in charging state, when the analog protection circuit detects that the module temperature remains below 72°C for a maximum of 2 seconds, the logic control circuit shall set the SHIFTED_CHG_CONTROL signal to 12VDC+/-5% and allow the module to be charged.The modules shall be recover from analog OTC protection.
While the battery is in discharge state, when the analog protection circuit detects that the module temperature remains below 72°C for a maximum of 2 seconds, the logic control circuit shall set the SHIFTED_DSG_CONTROL signal to 12VDC+/-5% and allow the module to discharge.The modules shall be recover from analog OTD protection.
Analog protection circuit in the monitor board have an independent analog temperature sensor that can detect the temperature range of -40°C +150°C for the over temperature protection.
Analog protection circuit in the monitor board shall provide COV protection by setting an ANALOG_COV_ALERT signal of 3.3V+/-5% when any cell voltage in the module rises above 3.85V+/-2% for 4 seconds. When the ANALOG_COV_ALERT signal is at 3.3V+/-5% and all cell voltages fall below 3.55V+/-2%, the ANALOG_COV_ALERT signal shall set an error signal of 0V+/-1% and recovery from module COV protection.
Analog protection circuit in the monitor board shall provide protection to prevent the heater temperature from exceeding 25°C +/-5% using analog heater over-temperature protection on the monitor board.
When the analog protection circuit on the monitor board detects that the heater temperature drops below 25°C +/-5%, the module recover from heater over temperature protection.
The control board in each module shall have an analog protection circuit that provides analog SCD, OCC and OCD protection.
Analog protection circuit in the control board shall be able to detect the charging and discharging current of each module and transmit it to the MCU via I2C. This circuit shall be able to provide fault tolerance for OCC, OCD, SCD protections.The analog protection circuit shall be able to detect a maximum of 100A +/-10% discharge and 100A +/-10% charge current in maximum 5mA step size.
When the analog protection circuit in the control board detects a charging current of 5A+/-10% for 5 seconds, analog protection circuit shall be set the PRI_ALERT signal to 0VDc and the modules shall be enter analog OCC protection.
The PRI_ALERT signal, which is set to 0VDC +/-200mVDC by the analog protection circuit in the control board, shall be set to 3.3V +/-5% by the MCU every 2 seconds and the charging current shall be controlled by analog protection circuit. The module shall be recover from analog OCC protection when the charging current remains below 4A+/-5% for 3 seconds.
When the analog protection circuit in the control board detects a discharging current of 35A +/-10% for 5 seconds, the analog protection circuit shall be set the PRI_ALERT signal to 0VDc and the modules shall be enter analog OCD protection.
The PRI_ALERT signal, which is set to 0VDC +/-200mV by the analog protection circuit in the control board, shall be set to 3.3VDC +/-5% by the MCU every 2 seconds and the discharging current shall be controlled by the analog protection circuit. The module shall be recover from analog OCD protection when the discharging current remains below 30A+/-5% for 3 seconds
When a short circuit occurs in the battery pack outputs, the analog protection circuit in the control board for each module shall be set the PRI_ALERT signal to 0VDC +100mV within 100 ms. When the short circuit condition is removed, the PRI_ALERT signal shall be set to 3.3VDC +/-5% within 1 second and the module shall be recover from analog SCD protection.
Analog protection circuit in the control board shall be measure analog temperature signal, heater control circuit temperature, limiter control circuit temperature and charge/discharge control circuit temperature by maximum step size of 1°C and transmitted to the MCU via I2C communication.
EEPROM
Each module shall have a module data logging circuit capable of storing calibration data for module cells, error logs, and charge/discharge cycles of the module. This circuit shall be communicate with the MCU via I2C.
Digital Control
The monitor board in each module shall have a digital control circuit that shall be able to communicate with the MCU via I2C communication, receive a digital input signal and set a digital output signal.
The digital control circuit shall be able to set the output signals to 0VDC +/-100mV and 3.3VDC +/-5% voltage levels.
The digital control circuit shall be able to receive input signals at voltage levels of 0VDC +/-100mV and 3.3VDC +/-5%.
Protection Logics
The monitor board in each module shall have logic control circuits that shall be supply 3.3VDC. This circuit shall be able to detect 0VDC +/-100mV or 3.3VDC +/-5% input signals and set 0VDC +/-100mV or 12VDC +/-5% output signals.
Logic circuits shall be able to provide 0VDC +/-100mV or 12VDC/-5% input signals to the current limiting circuit, heater control circuit, charge control circuit and discharge control circuit.
Wake up
The module monitoring circuit on the monitor board in each module shall be awakened by the MCU by sending an isolated input signal at 0VDC +100mV.
Load Detect
The battery shall have a load detect circuit that allows each module to recover when the battery is in short circuit discharge protection or overcurrent discharge protection.
While the battery is in short circuit discharge or over discharge current protection, the load detect circuit shall be activated by the MCU with a isolated 0VDC+/-5% LOAD_DETECT_EN signal. While this circuit is active, an isolated 3.3VDC+/-5% LOAD_DETECTED signal shall be transmitted to the MCU.
When the battery is recovered from short circuit or overcurrent protection, the LOAD_DETECTED signal should be set to 0VDC+/- 5%.
Modul Monitoring
Each module shall have a module monitoring circuit that can detect series cell voltages, module cell temperatures and module current and transmit it to the MCU via the I2C line.
The module monitoring circuit shall be able to measure the voltage of each series cell up to a maximum of 5VDC +/-10% with a maximum step size of +/- 5mV.
The module monitoring circuit shall be able to detect the temperature range of -40 +150°C +/-2 % with a maximum 1°C temperature steps.
The module monitoring circuit shall be able to detect the charging current above min 100mA+/-5% and the discharge current below min 100mA+/-5% with a maximum 5mA step size.
When any series cell voltage in the module exceeds 3.65V +/-2% for 2 seconds during battery charging state the module shall be enter to COV protection. During COV protection, DCHG_ALERT signal shall be set a 0VDC+/-200mV , provide input signal to logic control circuit and cut off the module’s charge current. When all cell voltages drop below 3.55VDC +/-5%, the DCHG_ALERT signal at 0V +/-5% level shall be set to 3.3VDC +/-2% and recover from COV protection .
When any series cell voltage in the module remains below 2V +/-2% for 2 seconds during battery discharging state the module shall be enter to CUV protection. During CUV protection, DCHG_ALERT signal shall be set a 0VDC+/-200mV , provide input signal to logic control circuit and cut off the module’s discharge current. When all cell voltages rise above 2.45V+/-%5, the DCHG_ALERT signal at 0V +/-5% level shall be set to 3.3V +/-2% and recover from CUV protection
When modul monitoring circuit detects charge current above 5A +/-5% for a maximum of 5 seconds during battery charge state, the module shall be enter to OCC protection. During OCC protection, DCHG_ALERT signal shall be set a 0VDC +/-200mV and provide input signal to logic control circuit cut off the module’s charge current. While the DCHG_ALERT signal is at 0VDC +/-200mV when the module monitoring circuit detects a minimum of 100mA +/-5% discharge current for a maximum of 1 second, the DCHG_ALERT signal shall be set to 3.3VDC +/-2% and it recover from OCC protection.
When modul monitoring circuit detects charge current above 35A +/-5% for a maximum of 10 seconds during battery discharge state, the module shall be enter to OCD protection. During OCD protection, DDSG_ALERT signal shall be set a 0VDC +/-200mV to provide input signal to logic control circuit and cut off the module’s discharge current. While the DDSG_ALERT signal is at 0VDC +/-200mV when the module monitoring circuit detects a minimum of 100mA +/-5% charge current for a maximum of 1 second, the DDSG_ALERT signal shall be set to 3.3VDC +/-2% and it recover from OCD protection.
When modul monitoring circuit detects discharge current above 200A+/-%5 for a maximum of 100ms during battery active state module shall be enter to SCD protection. During SCD protection, DDSG_ALERT signal shall be set a 0VDC+/-200mV , provide input signal to logic control circuit and cut off the module’s discharge current. The module shall be able to recovery from SCD protection by the MCU via I2C communication or shall be recover by dedecting minimum 100mA +/-5% charge current.
When modul monitoring circuit detects cell temperature above 70°C +/-5% for a maximum of 5 seconds during battery charge state module shall be enter to OTC protection. During OTC protection, DCHG_ALERT signal shall be set a 0VDC+/-200mV , provide input signal to logic control circuit and cut off the module’s charge current. While the DCHG_ALERT signal is at 0V+/-200mV when the module monitoring circuit detects a module cell temperature drops below 65°C +5%, the DCHG_ALERT signal shall be set the at 3.3V+/-2% and recover from OTC protection.
When modul monitoring circuit detects cell temperature above 85°C +/-5% for a maximum of 10 seconds during battery discharge module shall be enter to OTD protection. During OTD protection, DDSG_ALERT signal shall be set a 0VDC+/-200mV , provide input signal to logic control circuit and cut off the module’s discharge current. While the DDSG_ALERT signal is at 0V+/-200mV when the module monitoring circuit detects a module cell temperature drops below 72°C +5%, the DDSG_ALERT signal shall be set the at 3.3VDC +/-2% and recover from OTD protection.
When modul monitoring circuit detects cell temperature below 0°C for a maximum of 5 seconds during battery charge module shall be enter to UTC protection. During UTC protection, DCHG_ALERT signal shall be set a 0VDC+/-200mV , provide input signal to logic control circuit and cut off the module’s discharge current. While the DCHG_ALERT signal is at 0V+/-5%, when the module monitoring circuit detects a cell temperature above 5°C +/-5%, the DCHG_ALERT signal shall be set the at 3.3VDC +/-2% and recover from UTC protection.
MCU
The BMB board shall have a single-precision Floating-Point Unit (FPU) MCU with I2C, SPI, and UART communication capabilities, along with ADC and GPIO pins. It should have at least 1MB flash memory and can programmable via JTAG.
The MCU shall be able to communicate with the monitor and control board in each module via an isolated I2C line.
The MCU shall be able to provide an isolated output signal to the communication connector.
The MCU shall be able to detect an isolated discrete input signal from the communication connector.
The MCU shall be able to transmit the health status of the battery, error conditions, service status and battery mode (active or sleep) to the LED driver circuit via the I2C line.
The MCU shall be able to transfer battery configuration and calibration parameters and battery error conditions to the Flash Rom via SPI communication.
The MCU shall be able to detect recent date and time data from the RTC circuit via SPI communication.
The MCU shall be able to provide input or output signals from GPIO pins to each module and control card.
” Yukarıda örenk bir gereksinim çalışması yapılmıştır. Bu gerwksinimlerin kart seviyesinde test edilebirliğini kontrol et.Kart seviyesinde high level ve low level gereksinim yazmak istiyorum . Bu gereksiinmler Sistem gereksinimleri ile izlenebilir, olmalı. gereksinimlşer test edilebir olmalı. Gereksinimler tutarlı açık ve anlaşılır olmalı. Board seviyesinde high level ve low level gereksinimleri nasıl yazabirim. Nasıl test edebirim. izlemem gereken yöntem nasıl olmalı. seviyesinden ekipman seviyesine , ekipman seviyesinden high level ve low level gereksinmilere kadar izlebeilir gerksinim örneği yaz