prompt_front: Now, answer the following question based on the text below, only give me the answer and do not output any other words.

Question: How does the infall rate and gas density in the magnetized model compare to non-magnetized accretion?

Read the following text and answer briefly.

Context 1: \section{Introduction}
The averaged quantities can be obtained in two different ways in
magnetohydrodynamics  The first way is to solve 3D MHD equations
and then average the results  The second way is to solve some
system of equations on averages  Combination of numerical
simulations and averaged theory brings phenomenology that can
describe observations or experimental data 

The problem of spherically symmetric accretion takes its origin
from Bondi's work \citep{bondi}  He presented idealized
hydrodynamic solution with accretion rate $\dot{M}_B $ However,
magnetic field $\vec{B}$ always exists in the real systems  Even
small seed $\vec{B}$ amplifies in spherical infall and becomes
dynamically important \citep{schwa} 

Magnetic field inhibits accretion \citep{schwa}  None of many
theories has reasonably calculated the magnetic field evolution
and how it influences dynamics  These theories have some common
pitfalls  First of all, the direction of magnetic field is usually
defined  Secondly, the magnetic field strength is prescribed by
thermal equipartition assumption  In third, dynamical effect of
magnetic field is calculated with conventional magnetic energy and
pressure  All these inaccuracies can be eliminated 

In Section 2\ref{section_method} I develop a model that abandons
equipartition prescription, calculates the magnetic field
direction and strength and employs the correct equations of
magnetized fluid dynamics  In Section 3\ref{results} I show this
accretion pattern to be in qualitative agreement with Sgr A*
spectrum models  I discuss my assumptions in Section 4
\ref{discussion} 

\section{Analytical method}\label{section_method}
 Reasonable turbulence evolution model is the key difference of my
 method  I build an averaged turbulence theory that corresponds to
numerical simulations  I start with the model of isotropic
turbulence that is consistent with simulations of collisional MHD
in three regimes  Those regimes are decaying hydrodynamic
turbulence, decaying MHD turbulence and dynamo action  I introduce
effective isotropization of magnetic field in 3D model 
Isotropization is taken to have a timescale of the order of
dissipation timescale that is a fraction $\gamma\sim1$ of the
Alfven wave crossing time $\tau_{\rm diss}=\gamma r/v_A $

Common misconception exists about the dynamical influence of
magnetic field  Neither magnetic energy nor magnetic pressure can
represent $\vec{B}$ in dynamics  Correct averaged Euler and energy
equations were derived in \citep{scharlemann} for radial magnetic
field  Magnetic force $\vec{F}_M=[\vec{j}\times\vec{B}]$ can be
averaged over the solid angle with proper combination of
$\vec{\nabla}\cdot\vec{B}=0 $ I extend the derivation to random
magnetic field without preferred direction  Dynamical effect of
magnetic helicity \citep{biskamp03} is also investigated  I
neglect radiative and mechanical transport processes 

The derived set of equations requires some modifications and
boundary conditions to be applicable to the real astrophysical
systems  I add external energy input to turbulence to balance
dissipative processes in the outer flow  The outer turbulence is
taken to be isotropic and has magnetization $\sigma\sim1 $
Transonic smooth solution is chosen as possessing the highest
accretion rate as in \citep{bondi} 

\begin{figure}\label{fig1}
  \includegraphics[height= 5\textheight]{velocities}
  \caption{Normalized to Keplerian speed characteristic velocities of magnetized flow  Horizontal lines correspond to self-similar solution $v\sim r^{-1/2} $}
\end{figure}

\section{Results \& Application to Sgr A*}\label{results}

\begin{figure}\label{fig2}
  \includegraphics[height= 5\textheight]{magnetization}
  \caption{Plot of magnetization $\sigma=(E_M+E_K)/E_{Th}$ with radius }
\end{figure}
The results of my calculations confirm some known facts about
spherical magnetized accretion, agree with the results of
numerical simulations and have some previously unidentified
features 

Initially isotropic magnetic field exhibits strong anisotropy with
larger radial field $B_r $ Perpendicular magnetic field
$B_\perp\ll B_r$ is dynamically unimportant in the inner accretion
region Fig\ref{fig1}  Because magnetic field dissipates, infall
onto the black hole can proceed \citep{schwa} 

Turbulence is supported by external driving in the outer flow
regions, but internal driving due to freezing-in amplification
takes over in the inner flow Fig\ref{fig2}  Magnetization of the
flow increases in the inner region with decreasing radius
consistently with simulations \cite{igumen06}  Density profile
appears to be $\rho\sim r^{-1 25}$ that is different from
traditional ADAF scaling $\rho\sim r^{-1 5}$ \citep{narayan}  Thus
the idea of self-similar behavior is not supported 

Compared to non-magnetized accretion, infall rate is 2-5 times
smaller depending on outer magnetization  In turn, gas density is
2-5 times smaller in the region close to the black hole, where
synchrotron radiation emerges \citep{narayan}  Sgr A* produces
relatively weak synchrotron \citep{narayan}  So, either gas
density $n$ or electron temperature $T_e$ or magnetic field $B$
are small in the inner flow or combination of factors works  Thus
low gas density in magnetized model is in qualitative agreement
with the results of modelling the spectrum 

Flow is convectively stable on average in the model of moving
blobs, where dissipation heat is released homogeneously in volume 
Moving blobs are in radial and perpendicular pressure
equilibriums  They are governed by the same equations as the
medium 

\section{Discussion \& Conclusion}\label{discussion}
The presented accretion study self-consistently treats turbulence
in the averaged model  This model introduces many weak assumptions
instead of few strong ones 

I take dissipation rate to be that of collisional MHD simulations 
But flow in question is rather in collisionless regime 
Observations of collisionless flares in solar corona
\citep{noglik} gives dissipation rate $20$ times smaller than in
collisional simulations \citep{biskamp03}  However, flares in
solar corona may represent a large-scale reconnection event rather
than developed turbulence  It is unclear which dissipation rate is
more realistic for accretion 

Magnetic field presents another caveat  Magnetic field lines
should close, or $\vec{\nabla}\cdot\vec{B}=0$ should hold  Radial
field is much larger than perpendicular in the inner region 
Therefore, characteristic radial scale of the flow is much larger
than perpendicular  If radial turbulence scale is larger than
radius, freezing-in condition does not hold anymore  Matter can
freely slip along radial field lines into the black hole  If
matter slips already at the sonic point, the accretion rate should
be higher than calculated 

Some other assumptions are more likely to be valid  Diffusion
should be weak because of high Mach number that approaches unity
at large radius  Magnetic helicity was found to play very small
dynamical role  Only when the initial turbulence is highly
helical, magnetic helicity conservation may lead to smaller
accretion rate  Neglect of radiative cooling is justified a
posteriori  Line cooling time is about $20$ times larger that
inflow time from outer boundary 

The study is the extension of basic theory, but realistic
analytical models should include more physics  The work is
underway 
\begin{theacknowledgments}
I thank my advisor Prof  Ramesh Narayan for fruitful discussions 
\end{theacknowledgments}

\bibliographystyle{aipproc}


Context 2: PROBLEM TO BE SOLVED: To provide a vacuum processor which can suppress the rise of manufacture cost while coping with the enlargement of diameter of a sample, and besides is excellent in maintainability  SOLUTION: This vacuum processor comprises an air loader 1 which is equipped with a plurality of juxtaposed cassette stands 2a and 2b and a carrier 13 for carrying a wafer 20 from or to the cassette stands, a vacuum loader 7 which is equipped with etching treatment chambers 11 and 11b for processing the wafer and a vacuum carriage chamber 16 connected to them through gate valves 15a and 15b, and a lock device 6 consisting of a load lock chamber 6b and an unload lock chamber 6b equipped with gate valves 12a, 12b, 12c, and 12d for connecting the said carrier 13 with the vacuum carriage chamber 16  For the etching treatment chambers, two are provided only on the opposite side of the vacuum carriage chamber symmetrically about the axis line A passing the center, and besides the arrangement positions of the two etching treatment chambers are at an acute angle on the opposite side of the vacuum carriage chamber 
エッチング，ＣＶＤ（化学的気相成長），スパッタリング，アッシング，リンサ（水洗）等の枚葉処理をするのに好適な真空処理装置とそれを用いて半導体デバイスを製造する半導体製造ラインに関するものである。 Those etching, CVD (chemical vapor deposition), sputtering, ashing, to rinser (water washing) suitable vacuum processing apparatus for single wafer processing, such as a semiconductor manufacturing line for manufacturing a semiconductor device using the same  
【従来の技術】試料を処理する真空処理装置は、大別すると、カセットブロックと真空処理ブロックから構成されており、カセットブロックは、半導体製造ラインのベイ通路に面して長手方向に伸びるフロントを有し、試料用のカセットや試料のオリエンテーションを合わせるアライメントユニットと、大気ロボットがある。 BACKGROUND OF THE INVENTION Vacuum processing apparatus for processing a sample, the roughly is constituted by a cassette block and a vacuum processing block, the cassette block, a front extending in the longitudinal direction facing the bay aisle of a semiconductor manufacturing line a, an alignment unit for aligning the cassette and sample orientation for sample, there is an atmospheric robot  真空処理ブロックには、ロード側ロードロック室，アンロード側ロードロック室，真空処理室，後真空処理室，真空ポンプ及び真空ロボット等が設けられている。 The vacuum processing block, the load-side load lock chamber, the unload side load lock chamber, the vacuum processing chamber, a rear vacuum processing chamber, a vacuum pump and a vacuum robot and the like 
【０００３】これらの真空処理装置では、カセットブロックのカセットから取り出された試料が、大気ロボットにより真空処理ブロックのロードロック室まで搬送される。  In these vacuum processing apparatus, a sample taken from the cassette in the cassette block is transported to the load lock chamber in the vacuum processing block by the atmospheric robot  ロードロック室から真空ロボットによりさらに処理室に搬送され、電極構造体上にセットされた試料は、プラズマエッチング等の処理がなされる。 Is conveyed from the load lock chamber to the further processing chamber by the vacuum robot, the sample is set on an electrode structure, processing such as plasma etching is performed  その後、必要に応じて後真空処理室に搬送，処理される。 Thereafter, the conveyance to the rear vacuum processing chamber as necessary and processed  処理済みの試料は、真空ロボット及び大気ロボットによりカセットブロックのカセットに搬送される。 Processed sample is conveyed to the cassette of the cassette block by the vacuum robot and the atmospheric robot 
【０００４】試料をプラズマエッチング処理する真空処理装置の例としては、例えば特公昭61−8153号公報，特開昭63−133532号公報，特公平6−30369号公報，特開平  Examples of the sample vacuum processing apparatus for plasma etching treatment, for example Japanese Patent Publication 61-8153, JP-Sho 63-133532 and JP Kokoku 6-30369, JP-A No 
6−314729号公報，特開平6−314730号公報，米国特許第 6-314729, JP-A No  6-314730, JP-U S  Patent No 
5,314,509号明細書および5,784,799号明細書に記載されたようなものがある。 There are such as described in Pat and 5,784,799 Pat 5,314,509 
509号明細書に記載された装置は、真空処理ブロックの中央付近に真空ロボット、その周囲に３個の処理室が同心状に配置され、真空ロボットとカセットブロックの間に、ロード側ロードロック室，アンロード側ロードロック室が設けられている。 Device described in 509 Pat are vacuum robot in the vicinity of the center of the vacuum processing block, three process chambers around it are arranged concentrically, between the vacuum robot and the cassette block, the load-side load-lock chamber , unload side load lock chamber is provided  これらの装置では、大気ロボットや真空ロボットの搬送アームの回転角度が大きく従って装置全体の必要床面積が大きいという問題がある。 In these devices, there is a problem that needs floor space for the entire rotation angle is large therefore device of the transfer arm of the atmospheric robot and the vacuum robot is large 
【０００６】一方、真空処理装置の真空処理ブロック内の処理室や真空ポンプその他各種の配管機器については、定期，不定期に点検修理等のメンテナンスを行うことが必要である。  On the other hand, the processing chamber and the vacuum pump and other various piping components of the vacuum processing block of the vacuum processing apparatus, periodically, it is necessary to perform maintenance such as inspection and repair irregularly  そのため、一般に、真空処理ブロックの周囲には、扉が設けられており、この扉を開けることにより、ロードロック室，アンロードロック室，処理室，真空ロボット及び各種の配管機器の点検修理ができるようになっている。 Therefore, in general, around the vacuum processing block, the door is provided by opening the door, load lock chambers, unload lock chambers, processing chambers, the servicing of the vacuum robot and various piping devices It has become way 
キャリアポッドが必要となるために、約３５０mm程度と大きくなり、複数のキャリアポッドを収納するカセットブロックの幅も大きくなる。 For carrier pod required, large as about 350 mm, the greater width of the cassette block for housing a plurality of carrier pods  この幅に合わせて真空処理ブロックの幅を決定すると、真空処理装置全体が大きなスペースを必要とすることになる。 When determining the width of the vacuum processing block in accordance with the this width, the entire vacuum processing apparatus requires a large space  一例として、４個のキャリアポッドを収納するカセットブロックについて考えると、試料の直径ｄが８インチから１２インチになった場合、カセットの幅は少なくとも約４０cm以上大きくならざるを得ない。 As an example, considering the cassette block for accommodating four carriers pods, if the diameter d of the sample was a 12-inch 8 inch wide cassette inevitably increases at least about 40cm or more 
【０００８】一方、試料に各種の処理を行いながら大量の処理を行うために、一般の半導体製造ラインでは、同じ処理を行う複数の真空処理装置を同じベイに集め、各ベイ間の搬送を自動またはマニュアルで行っている。 On the other hand, in order to perform a lot of processing while performing various processes in the sample, in a general semiconductor manufacturing lines, gathering a plurality of vacuum processing apparatus for performing the same processing in the same bay, automatic conveyance between the bays or it is carried out manually  このような半導体製造ラインは、高いクリーン度を必要とするため、半導体製造ライン全体が大きなクリーンルーム内に設置される。 Such a semiconductor manufacturing line, requires a high degree of cleanliness, the whole semiconductor manufacturing line is placed in a large clean room  試料の大口径化に伴う真空処理装置の大型化は、クリーンルーム占有面積の大型化を伴うが、これはもともと建設コストの高いクリーンルームの建設コストを一層増加させることになる。 Size of the vacuum processing apparatus due to the large diameter of the sample is accompanied by a large clean room area occupied, which will be further increased construction costs of the high construction cost clean room originally  もし、同じ面積のクリーンルームに占有面積の大きな真空処理装置を設置するとすれば、真空処理装置の全体の台数を減らすか、あるいは各真空処理装置間の間隔を狭くせざるを得ない。 If, if the clean room of the same area to install a large vacuum processing apparatus of the occupied area, reduce the overall number of the vacuum processing apparatus, or interval narrower forced between the vacuum processing apparatus  同じ面積のクリーンルームにおける真空処理装置の設置台数減少は、必然的に半導体の製造ラインの生産性の低下ひいては半導体の製造コストの上昇を伴う。 Installed base reduction in the vacuum processing apparatus in a clean room having the same area is accompanied inevitably rise of the semiconductor decrease and thus the semiconductor manufacturing cost of productivity of the production line  他方、各真空処理装置間の間隔を狭くすることは、点検修理のためのメンテナンススペースが不足し、真空処理装置のメンテナンス性を著しく阻害する。 On the other hand, to reduce the distance between each of the vacuum processing apparatus, the maintenance space for inspection and repair is insufficient to significantly inhibit the maintenance of the vacuum processing apparatus 
【０００９】本発明の目的は、試料の大口径化に対応しつつ、製造コストの上昇を抑えることのできる真空処理装置を提供することにある。 An object of the present invention, while corresponding to the large diameter of the sample, is to provide a vacuum processing apparatus capable of suppressing an increase in manufacturing cost 
【００１０】本発明の他の目的は、試料の大口径化に対応しつつ、メンテナンス性に優れた真空処理装置を提供することにある。 Another object of the present invention, while corresponding to the large diameter of the sample is to provide a vacuum processing apparatus having excellent maintainability 
【００１１】本発明の他の目的は、試料の大口径化に対応しつつ、真空処理装置の必要設置台数を確保して製造コストの上昇を抑え、かつ、メンテナンス性も損なわない半導体製造ラインを提供することにある。 Another object of the present invention, while corresponding to the large diameter of the sample, to ensure the necessary number of installed vacuum processing apparatus suppressing an increase in manufacturing cost, and a semiconductor manufacturing line is not impaired maintainability It is to provide 
【課題を解決するための手段】本発明は、並設した複数のカセット台およびカセット台から、あるいはカセット台へウエハを搬送するための搬送装置を備えた大気ローダと、ウエハを処理するための真空処理室およびこれにゲート弁を介して連接された真空搬送室を備えた真空ローダと、前記搬送装置と前記真空搬送室とを連接するためのゲート弁を備えたロードロック室およびアンロードロック室からなるロック装置とを含んで構成される真空処理装置において、ウエハを処理するための真空処理室は、有磁場ＵＨＦ帯電磁波放射放電方式リアクタ（以下、ＵＨＦ−ＥＣＲリアクタという。）によって形成される真空処理室であり、該真空処理室には、分解可能な側壁インナーユニットおよびアンテナが設けられ、該真空処理室は、真空搬 The present invention SUMMARY OF THE INVENTION from a plurality of cassette tables and cassette stand juxtaposed, or the atmosphere loader having a conveying device for conveying the wafer to the cassette table, for processing a wafer the load lock chamber and the unload lock having a gate valve for connecting the vacuum loader vacuum processing chamber and having a vacuum transfer chamber which is connected via a gate valve to the said vacuum transfer chamber and the conveying device in the vacuum processing apparatus configured to include a lock device comprising a chamber, a vacuum processing chamber for processing a wafer it is formed by a magnetic field UHF band electromagnetic wave radiation discharge type reactor (hereinafter  referred UHF-ECR reactor) that a vacuum processing chamber, the vacuum processing chamber, degradable sidewall inner unit and an antenna are provided, the vacuum processing chamber, a vacuum transportable 室およびロック装置の中央を通る軸線に対して対称にして、かつ真空搬送室を中心にしてロック装置の反対側のみに２つ設けられ、かつ真空搬送室に対して前記２つの真空処理室の配置位置は鋭角をなしている真空処理装置を提供する。 And symmetrically with respect to the axis passing through the center of the chamber and the locking device, and the opposite side only two provided for to lock device around the vacuum transfer chamber, and the two vacuum processing chamber to the vacuum transfer chamber position is to provide a vacuum processing apparatus which forms an acute angle 
ＣＲリアクタによって形成される真空処理室であり、該真空処理室は、真空搬送室およびロック装置の中央を通る軸線に対して対称にして、かつ真空搬送室を中心にしてロック装置の反対側のみに２つ設けられ、かつ真空搬送室に対して前記２つの真空処理室の配置位置は鋭角をなしており、ＵＨＦ−ＥＣＲのアンテナは、前記軸線に対して平行で、かつ前記真空搬送室とは反対側に開放される真空処理装置を提供する。 A vacuum processing chamber formed by a CR reactor, vacuum processing chamber, and symmetrically with respect to the axis passing through the center of the vacuum transfer chamber and the locking device, and the opposite side of the locking device around the vacuum transfer chamber only two provided, and positions of the two vacuum processing chamber to the vacuum transfer chamber is an acute angle, the UHF-ECR antennas, and parallel, and the vacuum transfer chamber with respect to said axis to provides a vacuum processing apparatus is opened to the opposite side 
かつ真空搬送室を中心にしてロック装置の反対側のみに２つ設けられ、かつ真空搬送室に対して前記２つの真空処理室の配置位置は鋭角をなしており、大気ローダ，真空ローダおよびロック装置はＴ字配置とされた真空処理方法を提供する。 And around the vacuum transfer chamber opposite only two provided a locking device, and positions of the two vacuum processing chamber to the vacuum transfer chamber is an acute angle, atmospheric loader, vacuum loader and locking apparatus to provide a vacuum processing method which is a T-arrangement 
【００１５】本発明は、並設した複数のカセット台およびカセット台から、あるいはカセット台へウエハを搬送するための搬送装置を備えた大気ローダと、ウエハを処理するための真空処理室およびこれにゲート弁を介して連接された真空搬送室を備えた真空ローダと、前記搬送装置と前記真空搬送室とを連接するためのゲート弁を備えたロードロック室およびアンロードロック室からなるロック装置とを含んで構成される真空処理装置が平行に複数台並設された真空処理システムにおいて、ウエハを処理するための真空処理室は、ＵＨＦ−ＥＣＲリアクタによって形成される真空処理室であり、該真空処理室は、真空搬送室およびロック装置の中央を通る軸線に対して対称にして、かつ真空搬送室を中心にしてロック装置の反対側のみに２ The present invention, a plurality of cassette tables and cassette stand juxtaposed, or the atmosphere loader having a conveying device for conveying the wafer to the cassette base, the vacuum processing chamber for processing the wafer and to a vacuum loader having a vacuum transfer chamber which is connected via a gate valve, the locking consisting of the conveying device and the load lock chamber and the unload lock chamber with gate valves for connecting the said vacuum transfer chamber apparatus and in the vacuum processing system vacuum processing apparatus is constituted with a plurality Tainami set in parallel include vacuum processing chamber for processing a wafer is vacuum processing chamber formed by the UHF-ECR reactor, vacuum processing chamber, and symmetrically with respect to the axis passing through the center of the vacuum transfer chamber and the locking device, and 2 only on the opposite side of the locking device around the vacuum transfer chamber 設けられ、かつ真空搬送室に対して前記２つの真空処理室の配置位置は鋭角をなしており、並設された複数の真空処理装置のすべての真空処理室に一直線上に配列される真空処理システムを提供する。 Provided, and positions of the two vacuum processing chamber to the vacuum transfer chamber is an acute angle, a vacuum process that is arranged in alignment with all of the vacuum processing chamber of a plurality of vacuum processing apparatus are arranged in parallel to provide a system 
【発明の実施の形態】以下、本発明にかかる一実施例を図面に基づいて説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, will be explained based on an embodiment according to the present invention with reference to the accompanying drawings 
１０Ｂ，１０Ｃで示す。 10B, shown by 10C 
【００１８】図１に示す真空処理システムを説明する前に、図２から図４に基づいて真空処理装置を説明する。  Before describing the vacuum processing system shown in FIG  1, illustrating a vacuum processing apparatus on the basis of FIGS  2-4 
５ｂを介して連接された真空搬送室１６を備えた真空ローダ７と、前記搬送装置と前記真空搬送室とを連接するためのゲート弁を備えたロードロック室６ａおよびアンロードロック室６ｂからなるロック装置６とを含んで構成される。 5b a vacuum loader 7 having a vacuum transfer chamber 16 which is connected via consist load lock chamber 6a and the unload lock chamber 6b has a gate valve for connecting and said vacuum transfer chamber and the conveying device configured to include a locking device 6 
平行形に配置され、その位置および姿勢を変えることなく、装置への導入／払出しが可能な位置、すなわち、カセット１ａないし１ｃを略水平の平面上で常に一定の位置に固定される。 Arranged parallel type, without changing its position and orientation, the introduction / dispensing of the locations of the device, i e , always fixed to a constant position to free the cassette 1a 1c on a substantially horizontal plane  カセット台２ａおよび２ｂは、平行に隣合わせて配置してある。 Cassette tables 2a and 2b, are arranged side by side in parallel  カセット台２ｃは、最右端に配置してある。 Cassette table 2c is, are arranged on the top right edge  カセット１ａおよび１ｂは、処理を行うための末処理ウエハを収納したり、処理済みのウエハを回収するためのもので、複数枚（通常２５枚）の被処理基板であるウエハ２０が収納可能となっている。 Cassettes 1a and 1b, or storing the processed wafers end for processing, for recovering the processed wafer, the wafer 20 is a substrate to be processed in a plurality (25 pieces Normal) can be stored going on  カセット１ｃは、この場合、プラズマを用いたドライクリーニング（以下、「プラズマクリーニング」という。）を行うためのダミーウエハを収納したり、プラズマクリーニング後のダミーウエハを回収するためのもので、複数枚（通常２５枚）のダミーウエハ３０が収納可能となっている。 Cassette 1c in this case, dry cleaning using plasma (hereinafter, "plasma cleaning" hereinafter ) Or housing a dummy wafer for performing, for recovering the dummy wafers after plasma cleaning, a plurality (usually dummy wafer 30 of 25 sheets) has become can be stored 
とカセット１ａ，１ｂとの間でウエハ２０を、そしてロードロック室６ａおよびアンロードロック室６ｂとカセット１ｃとの間でダミーウエハ３０を授受可能に動作する。 A cassette 1a, the wafer 20 with the 1b, and operates to allow exchanging dummy wafer 30 between the load lock chamber 6a and the unload lock chamber 6b and the cassette 1c 
ａ，１５ｂを介して真空処理室であるエッチング処理室１１ａ，１１ｂが設けてある。 a, etching chamber is a vacuum processing chamber through a 15b 11a, 11b are provided  以下、エッチング処理室を例に取って説明する。 Hereinafter will be described taking the etching chamber as an example  真空搬送室１６内には、ロードロック室６ａ，アンロード室６ｂおよびエッチング処理室１１ａ，１１ｂとの間でウエハ２０またはダミーウエハ３０を授受可能に動作する搬送装置１４が設けてある。 The vacuum transfer chamber 16, load lock chambers 6a, unload chamber 6b and etching chambers 11a, conveying device 14 is provided that operates to allow transferring the wafer 20 or dummy wafer 30 between 11b  真空搬送室１６は、独立に真空排気可能な真空排気装置１７を装備している。 Vacuum transfer chamber 16 is equipped with a vacuum evacuable vacuum evacuation device 17 independently 
【００２２】ＵＨＦ−ＥＣＲリアクタのエッチング処理室１１ａ，１１ｂは、この場合、同一の構成で対称配置とされてエッチング処理が行われるようになっている。 The UHF-ECR reactor etching chambers 11a, 11b is in this case are symmetrically arranged in the same configuration so that the etching process is performed 
エッチング処理室１１ａを例に説明する。 The etching chamber 11a will be described as an example  エッチング処理室１１ａは、ウエハ２０を配置するための試料台を有し、試料台８ａの上部に放電部７ａを形成するように放電室が設けてある。 Etching chamber 11a has a sample stage for placing the wafer 20, the discharge chamber so as to form a discharge portion 7a at the top of the sample table 8a is provided  エッチング処理室１１ａは、放電部７ａへの処理ガス供給のためのガス導入装置１０ａを有するとともに、エッチング処理室１１ａ内を所定圧力に減圧排気する真空排気装置９ａを有し、放電部７ａの処理ガスをプラズマ化するための、この場合、ＵＨＦ波と磁場の発生手段を有している。 The etching chambers 11a, which has a gas introduction device 10a for processing the gas supply to the discharge portion 7a, having a vacuum exhaust device 9a for evacuating the etching chamber 11a to a predetermined pressure, the process of the discharge portion 7a for plasma gas, in this case, it has a generating means of the UHF wave and magnetic field 
９は、センサ１８からの計測値を所定値と比較して、エッチング処理室内のクリーニング時期を判断する。 9, the measured value from the sensor 18 is compared with a predetermined value to determine the cleaning time of the etching chamber  また、制御装置１９は、真空搬送装置１３および１４を制御して、ダミーウエハ３０をカセット１ｃおよびエッチング処理室１１ａないし１１ｂの間で搬送制御する。 The control device 19 controls the vacuum transfer apparatus 13 and 14, to the dummy wafer 30 to the cassette 1c and the etching process chamber 11a carrying controlled between 11b 
いずれかの方法によりウエハ処理またはプラズマクリーニングを実行する。 It executes the wafer processing or plasma cleaning by any method 
によって、カセット１ａ内のウエハ２０を下から順にエッチング処理室１１ａ，１１ｂに搬入し、それぞれのウエハ２０をエッチング処理する。 Accordingly, the wafer 20 to an etching treatment chamber in order from the bottom 11a of the cassette 1a, and carried into 11b, and each of the wafer 20 is etched  処理されたそれぞれのウエハ２０は、真空搬送装置１４および搬送装置１３によって、カセット１ａ内の元の位置に収納する。 Each wafer 20 processed by vacuum transfer apparatus 14 and the carrier 13 is housed in its original position in the cassette 1a  この場合、運転開始から終了に至る間、カセットの位置および姿勢を変えることなく未処理のウエハを取り出し、そして処理済みのウエハを未処理のウエハが収納されていた元の位置に戻して収納する。 In this case, while leading to completion of the start of the operation, it takes out an unprocessed wafer without changing the position and posture of the cassettes, and the processed wafer unprocessed wafer is accommodated back into position which is housed   このようにすることで、生産ラインの自動化への対応が容易で、且つ、ゴミの発生によるウエハの汚染を低減でき、高い生産効率と高い製品歩留まりを実現できる。 In this way, it is easy to respond to automation of production lines, and can reduce the contamination of the wafer due to the generation of dust can achieve high production efficiency and high product yield 
の処理が全て終り次のカセットの内のウエハ処理に移る前でも良い。 Of the process is good, even before moving on to the wafer processing of all end next cassette 
【００２７】プラズマクリーニングの実施にあたっては、次の順序で行われる。 The practice of plasma cleaning is performed in the following order  この場合、カセット１ｃに収納されたダミーウエハ３０（この



ground_truth: Infall rate is 2-5 times smaller and gas density is 2-5 times smaller.

prompt_front: Now, answer the following question based on the text below, only give me the answer and do not output any other words.

Question: How is the vacuum processing system configured in terms of the arrangement of the vacuum processing apparatus?

Read the following text and answer briefly.

Context 4: Paper Info

Title: Interpretable reduced-order modeling with time-scale separation Interpretable reduced-order modeling with time-scale separation
Publish Date: 7 March 2023
Author List: Sebastian Kaltenbach (from CSE-Lab, ETH Zurich, Harvard SEAS), Phaedon-Stelios Koutsourelakis (from CSE-Lab, ETH Zurich, Harvard SEAS), Petros Koumoutsakos (from CSE-Lab, ETH Zurich, Harvard SEAS), Harvard Seas (from CSE-Lab, ETH Zurich, Harvard SEAS)

Figure

FIG  5  Comparison between the phase-space of the reference solution (left) and the phase-space of the predictions
FIG  7  Comparison between predictions and reference solutions for a new initial condition fort = 1 25, 3 75, 7 5, 12 5, 20, 30  (from left to right and top to down) We note that with longer prediction time the uncertainty bounds increases Despite the chaotic nature of the KS equation, the predictive posterior mean is close to the reference solution for t ≤ 12 5

abstract

Partial Differential Equations (PDEs) with high dimensionality are commonly encountered in computational physics and engineering  However, finding solutions for these PDEs can be computationally expensive, making model-order reduction crucial  We propose such a data-driven scheme that automates the identification of the time-scales involved and, can produce stable predictions forward in time as well as under different initial conditions not included in the training data 
To this end, we combine a non-linear autoencoder architecture with a time-continuous model for the latent dynamics in the complex space  It readily allows for the inclusion of sparse and irregularly sampled training data  The learned, latent dynamics are interpretable and reveal the different temporal scales involved 
We show that this data-driven scheme can automatically learn the independent processes that decompose a system of linear ODEs along the eigenvectors of the system's matrix  Apart from this, we demonstrate the applicability of the proposed framework in a hidden Markov Model and the (discretized) Kuramoto-Shivashinsky (KS) equation 
Additionally, we propose a probabilistic version, which captures predictive uncertainties and further improves upon the results of the deterministic framework 

INTRODUCTION

High-fidelity simulations of critical phenomena such as ocean dynamics and epidemics have become essential for decision-making  They are based on physically-motivated PDEs expressing system dynamics that span multiple spatiotemporal scales and which necessitate cumbersome computations   In recent years there is increased attention to the development of data-driven models that can accelerate the solution of these PDEs as well as reveal salient, lower-dimensional features that control the long-term evolution 
In most cases, data-driven reduced-order models are not interpretable  In particular, models based on neural networks despite good predictive capabilities , they offer a black-box description of the system dynamics  A possible remedy is applying a symbolic regression to the learned neural network representation , but this adds additional computational cost due to the two-step procedure 
A number of frameworks such as SINDy allows to learn interpretable dynamics but it relies on the a-priori availability of lower-dimensional descriptors and of time-derivatives which can be very noisy for both simulation and experimental data  Other frameworks are tailored to specific problems such as molecular dynamics  
Here, we present a framework that only needs the value of the observables, and not their derivatives, as training data and is capable of identifying interpretable latent dynamics  The deployment of interpretable latent dynamics ensures that conservation of important properties of that are reflected in the reduced-order model  
The present method is related to approaches based on the Koopman-operator extended Dynamic Mode Decomposition (eDMD) but uses continuous complex-valued latent space dynamics and only requires one scalar variable per latent dimension to describe the latent space dynamics  Therefore we do not have to enforce any parametrizations on the Koopman matrix  
The time-continuous formulation moreover allows to incorporate sparse and irregularly sampled training data and fast generation of predictions after the training phase  By using a complex-valued latent space we can also incorporate harmonic effects and reduce the number of latent variables needed  Linear and non-linear autoencoders are used to map the observed, high-dimensional time-series to the lower-dimensional, latent representation and we identify simultaneously the autoencoder as well as the latent dynamics by optimizing a combined loss function 
Hence the to tasks of dimensionality reduction and discovery of the reduced dynamics are unified while other frameworks treat the two parts separately   Apart from using an architecture based on autoencoders to identify the latent space, projection-based methods could also be employed   We are also proposing a probabilistic version of our algorithm ) that makes use of probabilistic Slow Feature Analysis  
This allows for a latent representation that arart from being time-continuous, can quantify the predictive uncertainty and hierarchically decompose the dynamics into their pertinent scales while promoting the discovery of slow processes that control the system's evolution over long time horizons  The rest of the paper is structured as follows: We introduce the methodological framework as well as algorithmic details in section II 
Particular focus is paid on the interpretability of the inferred lower-dimensional dynamics  In section III we present three numerical illustrations, i e  a system of linear ODEs, a hidden Markov Model and the discretized KS-equation  We then present in section IV the probabilistic extension of the framework and apply it to the KS-equation 
We conclude with a summary and a short discussion about possible next steps  We introduce the autoencoders deployed in this work, followed by the interpretable latent space dynamic and discuss the training process  We consider data from high-dimensional time series x n ∈ R f with n = 1,    , T   We remark that the intervals between the different states do not need to be uniformly spaced 

Autoencoder

A core assumption of the method is that each high-dimensional state x n can be compressed to a lower-dimensional representation z n ∈ C c with c << f   We identify this lower-dimensional representation by an autoencoder consisiting of a parameterized encoder and decoder  The encoder maps the high-dimensional representation to the latent space as:
The latent space is complex-valued  The decoder reconstructs the high-dimensional representation based on the latent variables as: We denote the parameters of the encoder as well as the decoder by θ  As discussed later in Section II C, both set of parameters are optimized simultaneously during training and therefore there is no need for differentiating them 

Interpretable Latent Space Dynamics

We employ a propagator in the latent space to capture the reduced-order dynamics of the system  In contrast to other time-extended variational autoencoder frameworks, our representation uses complex valued latent variables  In addition the latent variables are treated independently  The latter feature enables us to have an interpretable latent dynamics as well as a model that is especially suitable for being trained in the Small Data regime due to the small number of required parameters 
This is in contrast to temporal propagators such as LSTMs   For each dimension i of the latent variable z we are using the following continuous ODE in the complex plane: By solving this ODE, we can define the operator: Interpretable reduced-order modeling with time-scale separation Here, λ is a vector containing all the individual λ's and ∆t n indicates the time-step between the latent states 
The symbol is used to indicate a component-wise multiplication  We remark that the latent variables and the parameter governing the temporal evolution are complex numbers and their role in describing the system dynamics is similar to that of an eigenvalue  The real part is associated with growth and decay whereas the imaginary part is representing the periodic component 
This approach has similarities with the Koopman-operator based methods and the extended dynamic mode decomposition   In contrast to the methods mentioned before we are using a continuous formulation in the latent space that allows us to incorporate scarce and irregularly sampled training data and directly rely on complex numbers in the latent space 

Training and Predictions

We optimize a loss function that combines both a reconstruction loss as well as a loss associated with the error of our learned propagator in the latent space: (5) We note that we could directly incorporate mini-batch training by only taking the summation over a subset of the N available training data 
For new predictions of unseen states, we use the encoder to generate a latent representations which is then advanced in time by the learned propagator  At a designated time step we are using the decoder to reconstruct the high-dimensional solution  We applied our algorithm to three systems  First, we show that the algorithm is capable of exactly reproducing the solution of a linear ODE and to identify its eigenvalues 
Afterwards we are applying the framework to a high-dimensional process generated by a complex latent dynamics, which is correctly identified  As a final test case, we are applying the algorithm to a Kuramoto Shivashinski (KS) equation  Interpretable reduced-order modeling with time-scale separation

Linear ODE

We are considering a two-dimensional ODE system for x = y 1 y 2 : Based on the obtained training data we run our algorithm using a linear encoder and decoder structure as well as two latent variables z



ground_truth: Multiple vacuum processing apparatuses are arranged in parallel.

prompt_front: Now, answer the following question based on the text below, only give me the answer and do not output any other words.

Question: When did the club win the Armenian Premier League for the first time?

Read the following text and answer briefly.

Context 3: Football Club Urartu (, translated Futbolayin Akumb Urartu), commonly known as Urartu, is an Armenian professional football team based in the capital Yerevan that currently plays in the Armenian Premier League  The club won the Armenian Cup three times, in 1992, 2007 and 2016  In 2013–2014, they won the Armenian Premier League for the first time in their history 

In early 2016, the Russia-based Armenian businessman Dzhevan Cheloyants became a co-owner of the club after purchasing the major part of the club shares  The club was known as FC Banants until 1 August 2019, when it was officially renamed FC Urartu 

History

Kotayk
Urartu FC were founded as FC Banants by Sarkis Israelyan on 21 January 1992 in the village of Kotayk, representing the Kotayk Province  He named the club after his native village of Banants (currently known as Bayan)  Between 1992 and 1995, the club was commonly referred to as Banants Kotayk  During the 1992 season, the club won the first Armenian Cup  At the end of the 1995 transitional season, Banants suffered a financial crisis  The club owners decided that it was better to merge the club with FC Kotayk of Abovyan, rather than disband it  In 2001, Banants demerged from FC Kotayk, and was moved from Abovyan to the capital Yerevan 

Yerevan

FC Banants was relocated to Yerevan in 2001  At the beginning of 2003, Banants merged with FC Spartak Yerevan, but was able to limit the name of the new merger to FC Banants  Spartak became Banants's youth academy and later changed the name to Banants-2  Because of the merger, Banants acquired many players from Spartak Yerevan, including Samvel Melkonyan  After the merger, Banants took a more serious approach and have finished highly in the league table ever since  The club managed to lift the Armenian Cup in 2007 
Experience is making way for youth for the 2008 and 2009 seasons  The departures of most of the experienced players have left the club's future to the youth  Along with two Ukrainian players, Ugandan international, Noah Kasule, has been signed 

The club headquarters are located on Jivani Street 2 of the Malatia-Sebastia District, Yerevan 

Domestic

European

Stadium

The construction of the Banants Stadium was launched in 2006 in the Malatia-Sebastia District of Yerevan, with the assistance of the FIFA goal programme  It was officially opened in 2008 with a capacity of 3,600 seats  Further developments were implemented later in 2011, when the playing pitch was modernized and the capacity of the stadium was increased up to 4,860 seats (2,760 at the northern stand, 1,500 at the southern stand and 600 at the western stand) 

Training centre/academy
Banants Training Centre is the club's academy base located in the Malatia-Sebastia District of Yerevan  In addition to the main stadium, the centre houses 3 full-size training pitches, mini football pitches as well as an indoor facility  The current technical director of the academy is the former Russian footballer Ilshat Faizulin 

Fans
The most active group of fans is the South West Ultras fan club, mainly composed of residents from several neighbourhoods within the Malatia-Sebastia District of Yerevan, since the club is a de facto representer of the district  Members of the fan club benefit from events organized by the club and many facilities of the Banants training centre, such as the mini football pitch, the club store and other entertainments 

Achievements
 Armenian Premier League
 Winner (1): 2013–14 
 Runner-up (5): 2003, 2006, 2007, 2010, 2018 

 Armenian Cup
 Winner (3): 1992, 2007, 2016 
 Runner-up (6): 2003, 2004, 2008, 2009, 2010, 2021–22

 Armenian Supercup
 Winner (1): 2014 
 Runner-up (5): 2004, 2007, 2009, 2010, 2016 

Current squad

Out on loan

Personnel

Technical staff

Management

Urartu-2

FC Banants' reserve squad play as FC Banants-2 in the Armenian First League  They play their home games at the training field with artificial turf of the Urartu Training Centre 

Managerial history
 Varuzhan Sukiasyan (1992–94)
 Poghos Galstyan (July 1, 1996 – June 30, 1998)
 Oganes Zanazanyan (2001–05)
 Ashot Barseghyan (2005–06)
 Nikolay Kiselyov (2006–07)
 Jan Poštulka (2007)
 Nikolay Kostov (July 1, 2007 – April 8, 2008)
 Nedelcho Matushev (April 8, 2008 – June 30, 2008)
 Kim Splidsboel (2008)
 Armen Gyulbudaghyants (Jan 1, 2009 – Dec 1, 2009)
 Ashot Barseghyan (interim) (2009)
 Stevica Kuzmanovski (Jan 1, 2010 – Dec 31, 2010)
 Rafael Nazaryan (Jan 1, 2011 – Jan 15, 2012)
 Volodymyr Pyatenko (Jan 17, 2013 – June 30, 2013)
 Zsolt Hornyák (July 1, 2013 – May 30, 2015)
 Aram Voskanyan (July 1, 2015 – Oct 11, 2015)
 Tito Ramallo (Oct 12, 2015 – Oct 3, 2016)
 Artur Voskanyan (Oct 3, 2016 – Aug 11, 2018)
 Ilshat Faizulin (Aug 12, 2018 –Nov 24, 2019)
 Aleksandr Grigoryan (Nov 25, 2019 –Mar 10, 2021)
 Robert Arzumanyan (10 March 2021–24 June 2022)
 Dmitri Gunko (27 June 2022–)

References

External links
 Official website 
 Banants at Weltfussball de  

 
Urartu
Urartu
Urartu
Urartu



ground_truth: In the 2013-2014 season.