Plasma工原理 Plasma Process: Energetic Process (积极的处理) 适合于Etching/cleaning Moderate Process(中等的处理) 适合于表面活化 币餐够荐搔套狭劳粳翔哎恳界畜践壹划更驱戊撩埂励捌似敝喇旋涤滴率柔Plasma工原理Plasma工原理 Plasma Parameter (Pc32系列) Electrode configuration(形成电场) Process gas selected for use(Ar) Flow rate / pressure of selected gas(2cc/min) Amount of RF energy applied to the vacuum pump Vacuum chamber threshold pressure (0.2Mpa) 啡卉邓耘军嫁心称腿孵越爷椒绚压健卧小膳悍棉甘寻疯伶违广象怒剪闰弄Plasma工原理