Layer MIL 0.6 1.8 3.9 1.2 45 1.2 3.9 1.8 material Metallization Copper 3313 Copper Core Copper 3313 Copper Single-End Trace Simulate Simulate Impedence differential pair Impedence (ohm) (ohm) TOP L2 L3 BOT Signal GND VCC Signal 6 50 5/10 100 6 50 5/10 100 58.8 成品板厚按1.5+/-0.15mm控制 成品板厚按1.5+/-0.15mm控制 1.5+/ Simulate Simulate Impedence differential pair Impedence (ohm) (ohm) Layer MIL 0.6 1.8 4.5 1.2 45 1.2 4.5 material Metallization Copper 2116 Copper Core Copper 2116 Single-End Trace TOP L2 L3 Signal GND VCC 7 50 5.5/9 100 BOT 1.8 Copper Signal 7 50 5.5/9 100 60 成品板厚按1.6+/-0.16mm控制 成品板厚按1.6+/-0.16mm控制 1.6+/ Layer MIL 0.6 1.8 5.6 1.2 60.5 1.2 5.6 1.8 material Metallization Copper 1080*2 Copper Core Copper 1080*2 Copper Single-End Trace Simulate Simulate Impedence differential pair Impedence (ohm) (ohm) TOP L2 L3 BOT Signal GND VCC Signal 9 50 7/8 100 9 50 7/8 100 77.7 成品板厚按2.0+/-0.2mm控制 成品板厚按2.0+/-0.2mm控制 2.0+/