文章内容来源:《SMT introduce》《SMT基本常识系列文章》《表面贴装工程介绍》《SMT train》《SMT丝印是科学, 不是艺术》《焊膏的使用规范》《焊接工艺发展趋势》《助焊剂产品的基本知识》《怎样设定锡膏温度回流曲线》等13ComputerSESC13八,附录SMT常用名词表次要缺点MI DefectMinor Defect主要缺点MA DefectMajor Defect批退率LRRLot Reject Rate批量LOT国际标准组织ISOInternational Organization for Standardization集成电路ICIntegrated Circuit在线质量检验IPQC In-Process Quality Control工业工程IEIndustry Engineering电感LInductor来料检验IQCIncoming Quality Control功能测试FCTFunction test松香 Flux基准点 Fiducial静电防护ESDElectro State Discharge电解电容 Electrolytic Capacitor双重检查 Double Check二极体DDiode双列直插式封装技术DIPDual-in-line Package Technology陶瓷电容 Ceramic chip Capacitor电容CCapacitor材料清单BOMBill of Material球栅阵列BGABall Grid Array允收标准AQLAcceptable Quality Level排阻ARArray Resistor备注中文名称简写英文名称14ComputerSESC14J形引脚小外形封装SOJSmall Outline J-Lead小外形封装集成电路SOICSmall outlined integrated circuit小外形封装SOPSmall Outline Package小外形晶体管SOT/SOD Small outline transistor/small outline diode样本 Sample重工 Rework电阻RResistor拒收REJ.Reject回流焊 Reflow最终检验OQCOutgoing Quality Control品质管制QCQuality Control品质保证QAQuality Assurance直方封装集成电路QFPQuad Flat Package制程检验PQCProcess Quality Control制程工程PEProcess Engineering印刷机 Printer塑封引脚集成电路PLCCPlastic Leaded Chip Carrier跨距,脚距 Pitch品质计算单位PPMPercentage Per Million焊垫PADPad振荡器XOscillator原始配备生产OEMOriginal equipment Manufacturer原始设计生产ODMOriginal Developing Manufacturer排容 Multi-layer Capacitor Array贴片机 Mounter备注中文名称简写英文名称接上表15ComputerSESC15在制品WIPWork In Process三极管Q/TRTriode变压器 Transformer全面品质管制TQMTotal Quality Management穿孔技术THTThrough Hole Technology钽电容TA/TCTantalum Capacitor表面贴装技术SMTSurface Mounting Technology表面贴装零件SMC/SMDSurface Mount Components/Surface Mount Device统计制程管制SPCStatistical Process Control标准作业程序SOPStandard Operation Procedure挑选 Sorting防焊漆S/MSolder Mask锡膏 Solder备注中文名称简写英文名称接上表