Intel Core i3 是「Core i品牌」四個子系列之一。

從Sandy Bridge微架構開始，Intel把微架構和代號改成相同名字。

桌上型處理器

Westmere微架構

"Clarkdale" (32 nm)

Sandy Bridge微架構

"Sandy Bridge" (32 nm)

Ivy Bridge微架構

"Ivy Bridge" (22 nm)

Haswell微架構

"Haswell-DT" (22 nm)

Skylake微架構

"Skylake-S" (14 nm)

Kaby Lake微架構

"Kaby Lake-S" (14 nm)

Coffee Lake微架構

"Coffee Lake-S" (14 nm)

"Coffee Lake-H" (14 nm)

Comet Lake微架構

移動型處理器

Westmere微架構（第一代）

"Arrandale" (MCP, 32 nm) 

所有型號支援: MMX,SSE,SSE2, SSE3,SSSE3,SSE4.1, SSE4.2, EIST, Intel 64, XD bit, Intel VT-x,超執行緒,Smart Cache.
 整合Intel HD Graphics

Sandy Bridge microarchitecture (2nd generation)

"Sandy Bridge" (32 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache, Intel Insider.
 Core i3-2310E, Core i3-2340UE have support for ECC memory.
 Core i3-2310E, Core i3-2330E and Core i3-2340UE do not have support for Intel Insider
 Transistors: 624 million
 Die size: 149 mm²

Ivy Bridge microarchitecture (3rd generation)

"Ivy Bridge" (22 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache, Intel Insider.
 Core i3-3120ME, i3-3217UE have support for ECC memory.
 Core i3-3120ME, i3-3217UE do not have support for Intel Insider.
 Core i3-3229Y supports AES-NI.
 Die size: 94 mm²

Haswell microarchitecture (4th generation)

"Haswell-MB" (22 nm) 
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache.

"Haswell-ULT" (SiP, 22 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, AES-NI, Smart Cache.
 Core i3-4010U and higher also support Intel VT-d
 Transistors: 1.3 billion
 Die size: 181 mm²

"Haswell-ULX" (SiP, 22 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, AES-NI, Smart Cache.
 Transistors: 1.3 billion
 Die size: 181 mm²

"Haswell-H" (22 nm) 

 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Smart Cache.
 Transistors: 1.3 billion
 Die size: 181 mm²
 Embedded models support ECC memory

Broadwell microarchitecture (5th generation)

"Broadwell-U" (14 nm) 
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) down

Skylake microarchitecture (6th generation)

"Skylake-H" (14 nm) 
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache.
 Transistors: TBD
 Die size: TBD
 Embedded models support ECC memory

"Skylake-U" (14 nm) 
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) down (except 6006U)

Kaby Lake microarchitecture (7th generation)

"Kaby Lake-H" (14 nm) 
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache.
 Transistors: TBD
 Die size: TBD
 Embedded models support ECC memory

"Kaby Lake-U" (14 nm) 
 全系列支援指令: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, AES-NI, Smart Cache, and configurable TDP (cTDP) down.

Ice Lake microarchitecture (10th generation)

Comet Lake microarchitecture (10th generation)

"Comet Lake-U" (dual-core, 14 nm)

"Comet Lake-Y" (dual-core, 14 nm)

Ice Lake微架构

"Ice Lake-U" (dual-core, 10 nm) 
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4, AVX, AVX指令集, , FMA指令集, 英特尔软件防护扩展, SpeedStep (SST), X86-64, XD bit (an NX位元 implementation), Intel VT-x, X86虚拟化, Intel睿频加速, 超執行緒, AES指令集, CPU缓存, 深度学习, and 热设计功耗 (cTDP).

"Ice Lake-Y" (dual-core, 10 nm) 
 All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4, AVX, AVX指令集, , FMA指令集, 英特尔软件防护扩展, SpeedStep (SST), X86-64, XD bit (an NX位元 implementation), Intel VT-x, X86虚拟化, Intel睿频加速, 超執行緒, AES指令集, CPU缓存, 深度学习, and 热设计功耗 (cTDP) (except 1000NG4).

Willow Cove microarchitecture (11th generation)

"Tiger Lake-UP3" (10 nm SuperFin) 
 All models support: SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6 (except SRK08), TB4, and configurable TDP (cTDP).
 -RE models support ECC memory.

"Tiger Lake-UP4" (10 nm SuperFin) 
 All models support: SSE4.1, SSE4.2, AVX2, AVX-512, FMA3, Speed Shift Technology (SST), Intel 64, Intel VT-x, Intel VT-d, Turbo Boost, Hyper-threading, AES-NI, Smart Cache, DL Boost, Optane memory, GNA 2.0, IPU6, TB4, and configurable TDP (cTDP).

外部連結 
 Intel 產品規格資料庫

Intel x86處理器
英特爾處理器列表