* Z:\home\khalils\Downloads\files\data\raw_asc\LT3086.asc
* Generated by LTspice 26.0.1 for Windows.
V1 IN 0 6.5
Rmon N006 0 357
Rset N001 N004 92K
Rpwrgdr N001 N008 82.5K
R4 N001 N010 100K
Cout N001 0 10 Rser=5m Lser=1n
Rload Out Return 2.38
C2 N001 N004 300p
Lwire1 N001 N002 1
Rwire N002 Out 0.1
Lwire2 N005 0 1
Rwire2 Return N005 0.1
Rcdc N004 N007 54.9K
Rcdc2 N007 N008 54.9K
C3_Tant Out Return 47 Rser=0.1
XU1 0 N006 N006 N007 N008 N004 N001 MP_01 MP_02 IN MP_03 IN N009 N003 N010 LT3086 Rpkg=14 Tpkg=10 Rsink=7 Tsink=250 ;pnba GND)Ilim)Imon)CDC)Rpwrgd)SET)OUT)))IN))_SHDN)Temp)Track)PWRGD
* Rmon*Rset
* 3000*(Rwire+Rwire2)
* Rcdc =
* 5V 2.1A Regulator Driving Two-Wire Cable to Remote Load, With Cable Drop Compensation
* *Equivalent to 6ft #22 wire. Voltage drop across \nRwire & Rwire2 adds to minimum input voltage requirement. \nLTC recommends that voltage loss in the wires be < 20% of Vout.\n \n** Actual inductance will vary with cable construction\nbut other circuit values will normally remain the same.
* *
* *
* **
* **
.tran .1 startup
* Package Rpkg Tpkg Rsink Tsink\nFE on small board 14 10 12 250\nFE on larger board 14 10 7 350\nDHD on small board 14 10 12 250\nDHD on larger board 14 10 7 350\nR on small board 3 6 13 250\nR on larger board 3 6 10 350\nT7 No heat sink 3 6 37 250\nT7 Small heat sink 3 6 20 150\nT7 Large Heat sink 3 6 6 250
* The LT3086 model breaks new ground by simulating thermal conditions on the die. \nIt uses a two-stage thermal model to simulate both package & heat sink thermal conditions. \nThe default values are for an FE package on a moderate size board with thermal vias to internal planes, \ngiving an overall thermal resistance of 21C/W. Package resistance is modeled with Rpkg = 14C/W, \nand a time constant, Tpkg = 10s. Heat sink (PC board) is modeled with Rsink = 7C/W and Tsink = 250s. \nThese numbers can be edited by the user by right clicking on the 3086 symbol. \n \nThe included chart shows typical values for each package. Die temperature is accessed by clicking \non the 3086 Temp pin, which is scaled at 10mV/C, giving 500mV at 50C. Keep in mind that when \nyou do DC sweeps, die temperature is at t -> infinite, and that the model does not attempt to change \nparameters as a function of temperature. It is still the users responsibility to use datasheet \nspecifications as the final determiner of correct part usage.
* cable
* Library below included based on ModelFile attribute of instance XU1 (C:\users\khalils\AppData\Local\LTspice\lib\sym\PowerProducts\LT3086.asy)
.lib LT3086.sub
.backanno
.end

* LTspice schematic (.asc):
Version 4
SHEET 1 11676 1244
WIRE 0 -64 -96 -64
WIRE 176 -64 0 -64
WIRE -96 -48 -96 -64
WIRE 176 -48 176 -64
WIRE 0 16 0 -64
WIRE 16 16 0 16
WIRE 368 16 336 16
WIRE 496 16 368 16
WIRE 608 16 496 16
WIRE 672 16 608 16
WIRE 1008 16 672 16
WIRE 1152 16 1088 16
WIRE 1424 16 1232 16
WIRE 1552 16 1424 16
WIRE 368 32 368 16
WIRE 496 32 496 16
WIRE 672 32 672 16
WIRE -96 48 -96 32
WIRE 1424 48 1424 16
WIRE 1552 48 1552 16
WIRE 16 128 0 128
WIRE 368 128 368 112
WIRE 368 128 336 128
WIRE 496 128 496 96
WIRE 496 128 368 128
WIRE 672 128 672 96
WIRE 368 144 368 128
WIRE 1008 160 848 160
WIRE 1152 160 1088 160
WIRE 1424 160 1424 112
WIRE 1424 160 1232 160
WIRE 1552 160 1552 128
WIRE 1552 160 1424 160
WIRE 848 192 848 160
WIRE 0 240 -96 240
WIRE 16 240 0 240
WIRE 368 240 368 224
WIRE 368 240 336 240
WIRE -96 256 -96 240
WIRE 368 256 368 240
WIRE -96 352 -96 336
WIRE 0 352 0 240
WIRE 16 352 0 352
WIRE 368 352 368 336
WIRE 368 352 336 352
WIRE 480 352 368 352
WIRE 608 352 608 16
WIRE 608 352 560 352
WIRE 608 368 608 352
WIRE 16 464 0 464
WIRE 608 464 608 448
WIRE 608 464 336 464
WIRE 176 544 176 528
FLAG 176 544 0
FLAG -96 48 0
FLAG -96 352 0
FLAG 672 128 0
FLAG -96 -64 IN
FLAG 1552 16 Out
FLAG 1552 160 Return
FLAG 848 192 0
SYMBOL voltage -96 -64 R0
WINDOW 123 -31 181 Left 2
WINDOW 39 24 117 Left 2
WINDOW 3 30 107 Left 2
SYMATTR Value 6.5
SYMATTR InstName V1
SYMBOL res -112 240 R0
SYMATTR InstName Rmon
SYMATTR Value 357
SYMBOL res 352 16 R0
SYMATTR InstName Rset
SYMATTR Value 92K
SYMBOL res 576 336 R90
WINDOW 0 0 56 VBottom 2
WINDOW 3 32 56 VTop 2
SYMATTR InstName Rpwrgdr
SYMATTR Value 82.5K
SYMBOL res 592 352 R0
WINDOW 0 51 38 Left 2
WINDOW 3 39 65 Left 2
SYMATTR InstName R4
SYMATTR Value 100K
SYMBOL cap 656 32 R0
WINDOW 39 24 84 Left 2
SYMATTR SpiceLine Rser=5m Lser=1n
SYMATTR InstName Cout
SYMATTR Value 10
SYMBOL res 1536 32 R0
SYMATTR InstName Rload
SYMATTR Value 2.38
SYMBOL cap 480 32 R0
SYMATTR InstName C2
SYMATTR Value 300p
SYMBOL ind 992 32 R270
WINDOW 0 32 56 VTop 2
WINDOW 3 5 56 VBottom 2
SYMATTR InstName Lwire1
SYMATTR Value 1
SYMBOL res 1136 32 R270
WINDOW 0 32 56 VTop 2
WINDOW 3 0 56 VBottom 2
SYMATTR InstName Rwire
SYMATTR Value 0.1
SYMBOL ind 1104 176 M270
WINDOW 0 32 56 VTop 2
WINDOW 3 5 56 VBottom 2
SYMATTR InstName Lwire2
SYMATTR Value 1
SYMBOL res 1248 176 M270
WINDOW 0 32 56 VTop 2
WINDOW 3 0 56 VBottom 2
SYMATTR InstName Rwire2
SYMATTR Value 0.1
SYMBOL res 352 128 R0
SYMATTR InstName Rcdc
SYMATTR Value 54.9K
SYMBOL res 352 240 R0
SYMATTR InstName Rcdc2
SYMATTR Value 54.9K
SYMBOL cap 1408 48 R0
WINDOW 39 24 84 Left 2
SYMATTR SpiceLine Rser=0.1
SYMATTR InstName C3_Tant
SYMATTR Value 47
SYMBOL LT3086 176 240 R0
SYMATTR InstName U1
TEXT 584 -48 Left 2 ;Rmon*Rset
TEXT 552 -8 Left 2 ;3000*(Rwire+Rwire2)
TEXT 440 -32 Left 2 ;Rcdc =
TEXT -8 -120 Left 3 ;5V 2.1A Regulator Driving Two-Wire Cable to Remote Load, With Cable Drop Compensation
TEXT 776 280 Left 2 ;*Equivalent to 6ft #22 wire.  Voltage drop across \nRwire & Rwire2 adds to minimum input voltage requirement.  \nLTC recommends that voltage loss in the wires be < 20% of Vout.\n \n** Actual inductance will vary with cable construction\nbut other circuit values will normally remain the same.
TEXT 1216 48 Left 3 ;*
TEXT 1224 184 Left 3 ;*
TEXT 1080 48 Left 3 ;**
TEXT 1072 184 Left 3 ;**
TEXT 1152 488 Left 2 !.tran .1 startup
TEXT -80 944 Left 2 ;Package                        Rpkg    Tpkg       Rsink      Tsink\nFE on small board           14        10          12         250\nFE on larger board          14        10           7          350\nDHD on small board        14        10          12         250\nDHD on larger board       14        10           7          350\nR on small board              3          6           13         250\nR on larger board             3          6           10         350\nT7    No heat sink            3          6           37         250\nT7    Small heat sink         3          6           20         150\nT7  Large Heat sink          3          6            6          250
TEXT -120 592 Left 2 ;The LT3086 model breaks new ground by simulating thermal conditions on the die.  \nIt uses a two-stage thermal model to simulate both package & heat sink thermal conditions.  \nThe default values are for an FE package on a moderate size board with thermal vias to internal planes, \ngiving an overall thermal resistance of 21C/W.  Package resistance is modeled with Rpkg = 14C/W, \nand a time constant, Tpkg = 10s.  Heat sink (PC board) is modeled with Rsink = 7C/W and Tsink = 250s.   \nThese numbers can be edited by the user by right clicking on the 3086 symbol.  \n \nThe included chart shows typical values for each package.  Die temperature is accessed by clicking \non the 3086 Temp pin, which is scaled at 10mV/C, giving 500mV at 50C.  Keep in mind that when \nyou do DC sweeps, die temperature is at t -> infinite, and that the model does not attempt to change \nparameters as a function of temperature.  It is still the users responsibility to use datasheet \nspecifications as the final determiner of correct part usage.
TEXT 1120 96 Center 2 ;cable
LINE Normal 524 -28 784 -28
LINE Normal 928 -44 1316 -44
LINE Normal 928 -44 932 -44 2
LINE Normal 928 212 1316 212
CIRCLE Normal 1280 -44 1352 212
ARC Normal 968 -44 900 212 936 212 932 -44 2
ARC Normal 896 -44 964 212 932 -44 928 212