DONG JOON KIM ET AL.: 'New Method to Prepare W-B-N Ternary Barrier to Cu Diffusion by Implanting BF2 Ions into W-N Thin Film', J.VAC.SCI.TECHNOL. B, vol. 17, no. 4, July 1999 (1999-07-01), pages 1598 - 1601, XP002247082