Double Density Cool Edge Next Generation Card Edge Interconnect -- Amphenol ICC and Mouser
Channel: EE Journal
Date: 2022-01-12

January 12, 2022 -- Nowhere is the need for the reduction of board space more important than in the realm of high-performance servers. One way we can reduce complexity and reduce overall board space in our server designs can be found in the connector solutions we choose. In this episode of Chalk Talk, David Einhorn from Amphenol joins Amelia Dalton to discuss how Amphenol double-density cool edge interconnects can not only reduce space but also lessen complexity and give us greater flexibility.
More information about Amphenol FCI Double Density Cool Edge 0.80mm Connectors: https://bit.ly/3I1iQQE