Surface-mount technology | Wikipedia audio article
Channel: wikipedia tts
Date: 2019-01-13

This is an audio version of the Wikipedia Article:
https://en.wikipedia.org/wiki/Surface-mount_technology


00:01:10 1 History
00:03:50 2 Common abbreviations
00:04:08 3 Assembly techniques
00:09:48 4 Advantages
00:12:07 5 Disadvantages
00:15:18 6 Rework
00:16:43 6.1 Infrared
00:17:49 6.2 Hot gas
00:18:52 7 Packages
00:20:28 7.1 Two-terminal packages
00:20:37 7.1.1 Rectangular passive components
00:20:50 7.1.2 Tantalum capacitorssup&#91;22&#93;/supsup&#91;23&#93;/sup
00:20:58 7.1.3 Aluminum capacitorssup&#91;24&#93;/supsup&#91;25&#93;/supsup&#91;26&#93;/sup
00:21:06 7.1.4 Small outline diode (SOD)
00:21:16 7.1.5 Metal electrode leadless facesup&#91;36&#93;/sup (MELF)
00:21:35 7.1.6 DO-214
00:21:47 7.2 Three- and four-terminal packages
00:21:57 7.2.1 Small-outline transistor (SOT)
00:23:47 7.2.2 Other
00:24:28 7.3 Five- and six-terminal packages
00:24:37 7.3.1 Small-outline transistor (SOT)
00:27:16 7.4 Packages with more than six terminals
00:27:25 7.4.1 Dual-in-line
00:28:40 7.4.2 Quad-in-line
00:30:03 7.4.3 Grid arrays
00:31:35 7.4.4 Non-packaged devices
00:32:36 8 Identification
00:32:45 8.1 Resistors
00:33:52 8.2 Capacitors
00:34:09 8.3 Inductors
00:34:27 8.4 Discrete semiconductors
00:35:23 8.5 Integrated circuits
00:37:23 9 See also
00:37:38 10 References
00:38:07 Inductors
00:39:39 Discrete semiconductors
00:40:25 Integrated circuits
00:41:07 See also



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SUMMARY
=======
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
By employing SMT, the production process speeds up, but the risk of defects also increases due to component miniaturization and to the denser packing of boards. In those conditions, detection of failures has become critical for any SMT manufacturing process.
An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.