Groundbreaking Technique for SUPER HIGH DENSITY | Trace Talks EP 1
Channel: Sierra Circuits
Date: 04/03/2024

In this snippet of Trace Talks, our PCB manufacturing expert Steven Carney discusses a groundbreaking technique for achieving super high-density circuitry. By trenching into the dielectric and filling the space to form traces, the method allows for incredibly fine features, eliminating the challenges associated with surface-based approaches. The discussion highlights the advantages, including reduced feature distortion during lamination and the ability to cross traces without the need for traditional holes, vias, and landing pads. This innovative approach opens up new possibilities for achieving ultra-high-density PCB designs with remarkable precision and efficiency.

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