How to Achieve a Robust PCB Design Workflow for Signal Integrity by Tim Wang Lee | Sierra Circuits
Channel: Sierra Circuits
Date: 2024-01-20

In this webinar, Tim Wang Lee introduces a robust PCB design workflow that facilitates efficient signal integrity analysis and troubleshooting. A comprehensive walk-through from design to fabrication includes the use of:

• Simple rule-of-thumb estimations
• 2D cross-section transmission line solver 
• 3D EM extraction tool

The example board design will be analyzed with:

• Mixed-mode S-parameters
• Eye diagram metrics
• Time domain reflectometry (TDR)
• Single pulse response (SPR)

You will learn the mechanisms affecting signal integrity to give you practical tips for evaluating link designs and troubleshooting issues. 
If you are new to signal integrity, this webinar will give you a head start on your signal integrity journey, giving you a new perspective on a robust design workflow that integrates troubleshooting in the design. For experienced SI engineers, the talk is an excellent refresher on the fundamental SI analyses and concepts. A complimentary signal integrity Analysis kit is included for continuing your learning after the webinar. 

New signal integrity engineers will learn the basic SI concepts and SI analyses and experienced SI engineers will have a good refresher on their SI basics. 

Presenter:
Tim Wang Lee, Signal Integrity Application Scientist at Keysight Technologies

Tim Wang Lee is a Signal Integrity Application Scientist in the EEsof EDA Group of Keysight Technologies. Wang Lee is currently a Ph.D candidate concentrating on signal integrity research at the University of Colorado. He received his BSEE degrees from University of Illinois at Urbana Champaign and MSEE from University of Colorado at Boulder. In the past years, he has presented papers in DesignCon focusing on understanding high-speed channels and improving simulation and measurement correlation. 

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