Working Group Meeting 2: 2021 IEEE Heterogeneous Integration Roadmap
Channel: Paul Wesling
Date: 2021-03-08

(1:23) Short presentations on current status and 2021 plans from 22 Technical Working Groups (TWGs); informational exchange between the assembled Chapter participants to identify additions/changes that should be made for 2021; and recording of the specific cross-Chapter harmonization that should be considered for the major 2021 rewrite of the Roadmap.
HIR Panel Session 2, Included these TWGs:
00:00 — Automotive;
09:04 — MEMS & Sensors Integration; 
19:00 — SiP & Module Technology; 
30:28 — Supply Chain; 
39:15 — Integrated Power Packaging;
49:15 -- Discussion, Questions and Answers
Refer to https://ieee-region6.org/scv-eps/?p=2455 for additional links.