REPP'20: Reliability Challenges for the Aerospace Sector and the Use of COTS (Keynote talk)
Channel: Advanced Electronics Packaging
Date: 2020-12-02

Speaker: Prof. Christopher Bailey, University of Greenwich
   The use of electronic components in the high-reliability aerospace sector represents less than 1% of the total component market, where the majority of packaged components are designed to meet the requirements of sectors where components are subjected to less-harsh environments and whose reliability and lifetime requirements are much less than the aerospace sector. Hence chip and package design companies are mainly focused on these main market sectors which unfortunately for the aerospace industry means that packaged component designs may not meet their full requirements. This requires aerospace companies and their supply chains to implement additional processes to ruggedize these packages so that risks of issues such as tin-whiskers can be mitigated.
    This presentation will discuss these reliability challenges and demonstrate a combined modeling and test approach to address these issues at the early stages of design. For example, for leaded components and BGA components there is a requirement to ensure that the solder interconnects and surface finishes meet aerospace reliability standards, and this requires the use of refinishing processes such as hot solder dipping and solder re-balling. In addition to this, the assembly of these components onto circuit boards requires adoption of conformal coatings, edgebond materials, and other assembly materials to address the strict reliability requirements for aerospace electronics systems. The talk will discuss these additional processes for Leaded, QFN, and micro-BGA packages and demonstrate possible mitigation strategies that meet aerospace reliability requirements.
   This 40-minute lecture by Prof. Christopher Bailey, University of Greenwich, was presented at the IEEE's 2020 Symposium on Reliability for Electronics and Photonics Packaging, held (virtually) in Silicon Valley (https://attend.ieee.org/repp/), and featuring speakers from around the world.  See other videos presented at REPP'20 in the REPP'20 Playlist, or visit the website to view the program and access PDFs of slides and video links.
   Professor Chris Bailey is President of the IEEE Electronics Packaging Society. He is also the Director of the Computational Mechanics and Reliability Group at the University of Greenwich, UK. He has a PhD in Computational Modeling and an MBA in Technology Management, and has published over 300 papers on Design and Simulation of Electronics Packaging. He has also secured over £5M of external funding from UK-Government, EU-Horizon 2020, DoD, and industry, and successfully supervised 22 Ph.D. students. Chris has served on several external government committees, which includes the 2014 UK Research Excellence Framework, to assess research outputs and research impact across UK universities. He is a member of the EPSRC College (UK Equivalent to NSF in USA); and associate editor for the IEEE Transactions of Components, Packaging, and Manufacturing Technology. He is also co-chair for the Modeling and Simulation Technical Working Group (TWG) for the new Heterogeneous Integration Roadmap.