Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered wi... | RTCL.TV
Channel: STEM RTCL TV
Date: 2023-07-30

### Keywords ###
#soldering #Al2O3ceramic #Ni–SiCsubstrate #Bisolder #ultrasonicsoldering #RTCLTV

### Article Attribution ###
Title: Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi–Ag–Mg-Type Solder
Authors: Roman Kolenak, Tomas Melus, Jaromir Drapala, Peter Gogola ,and Matej Pasak
Publisher: MDPI AG
DOI: 10.3390/ma16082991
DOAJ URL: https://doaj.org/article/8ce3076260204a90a98f4ae73cc83420
Source URL: https://www.mdpi.com/1996-1944/16/8/2991



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### Video Timestamps ###
0:00:00 - Summary 
0:00:53 - Title 
0:01:00 - Outro 
0:01:04 - End