"Scalable Power Delivery" for High-Performance ASICs, SoCs, and xPUs -- Infineon
Channel: EE Journal
Date: 02/03/2022

March 2, 2022 -- Today’s AI and networking applications are driving an exponential increase in compute power. When it comes to scaling power for these kinds of applications with next generation chipsets, we need to keep in mind package size constraints, dynamic current balancing, and output capacitance. In this episode of Chalk Talk, Mark Rodrigues from Infineon joins Amelia Dalton to discuss the system design challenges with increasing power density for next generation chipsets, the benefits that phase paralleling brings to the table, and why Infineon’s best in class transient performance with XDP architecture and Trans Inductor Voltage Regulator can help power your next high performance ASIC, SoC or xPU design.
More information about computing and data storage from Infineon: https://bit.ly/346I1TC