Part 15 - Etch outer layers
Channel: Eurocircuits
Date: 08/05/2014

We have now plated the panel with 25 microns of copper through the hole and an additional 25 -- 30 microns on the tracks and pads.  The copper is covered with a thin layer of tin as an etch resist.  Now we will remove the unwanted copper foil from the surface.

We do this on a single continuous process line.  The first step is to dissolve and wash off the resist which covers the unwanted copper.

http://www.eurocircuits.com/index.php/making-a-pcb-eductional-movies/45-etch-outer-layers