Microelectromechanical systems | Wikipedia audio article
Channel: wikipedia tts
Date: 2019-01-11

This is an audio version of the Wikipedia Article:
https://en.wikipedia.org/wiki/Microelectromechanical_systems


00:03:01 1 Materials for MEMS manufacturing
00:03:32 1.1 Silicon
00:04:42 1.2 Polymers
00:05:31 1.3 Metals
00:06:16 1.4 Ceramics
00:07:22 2 MEMS basic processes
00:07:33 2.1 Deposition processes
00:08:12 2.1.1 Physical deposition
00:09:00 2.1.2 Chemical deposition
00:09:56 2.2 Patterning
00:10:11 2.2.1 Lithography
00:11:39 2.2.2 Electron beam lithography
00:13:23 2.2.3 Ion beam lithography
00:13:58 2.2.4 Ion track technology
00:14:55 2.2.5 X-ray lithography
00:15:33 2.2.6 Diamond patterning
00:16:16 2.3 Etching processes
00:16:47 2.3.1 Wet etching
00:17:19 2.3.1.1 Isotropic etching
00:17:50 2.3.1.2 Anisotropic etching
00:18:37 2.3.1.3 HF etching
00:19:40 2.3.1.4 Electrochemical etching
00:20:38 2.3.2 Dry etching
00:20:46 2.3.2.1 Vapor etching
00:20:54 2.3.2.1.1 Xenon difluoride
00:22:04 2.3.2.2 Plasma etching
00:24:57 2.3.2.2.1 Sputtering
00:25:04 2.3.2.2.2 Reactive ion etching (RIE)
00:28:27 2.4 Die preparation
00:29:09 3 MEMS manufacturing technologies
00:29:21 3.1 Bulk micromachining
00:30:13 3.2 Surface micromachining
00:31:44 3.3 High aspect ratio (HAR) silicon micromachining
00:33:18 4 Applications
00:36:55 5 Industry structure
00:38:45 6 See also



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SUMMARY
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Microelectromechanical systems (MEMS, also written as micro-electro-mechanical,  MicroElectroMechanical or microelectronic and microelectromechanical systems and the related micromechatronics) is the technology of microscopic devices, particularly those with moving parts. It merges at the nano-scale into nanoelectromechanical systems (NEMS) and nanotechnology. MEMS are also referred to as micromachines in Japan, or micro systems technology (MST) in Europe.
MEMS are made up of components between 1 and 100 micrometers in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2. 
They usually consist of a central unit that processes data (the microprocessor) and several components that interact with the surroundings such as microsensors. Because of the large surface area to volume ratio of MEMS, forces produced by ambient electromagnetism (e.g., electrostatic charges and magnetic moments), and fluid dynamics (e.g., surface tension and viscosity) are more important design considerations than with larger scale mechanical devices. MEMS technology is distinguished from molecular nanotechnology or molecular electronics in that the latter must also consider surface chemistry.
The potential of very small machines was appreciated before the technology existed that could make them (see, for example, Richard Feynman's famous 1959 lecture There's Plenty of Room at the Bottom). MEMS became practical once they could be fabricated using modified semiconductor device fabrication technologies, normally used to make electronics. These include molding and plating, wet etching (KOH, TMAH) and dry etching (RIE and DRIE), electro discharge machining (EDM), and other technologies capable of manufacturing small devices. An early example of a MEMS device is the resonistor, an electromechanical monolithic resonator patented by Raymond J. Wilfinger,  and the resonant gate transistor developed by Harvey C. Nathanson.