Working Group Meeting 3: 2021 IEEE Heterogeneous Integration Roadmap
Channel: Paul Wesling
Date: 2021-03-08

(1:20) Short presentations on current status and 2021 plans from 22 Technical Working Groups (TWGs); informational exchange between the assembled Chapter participants to identify additions/changes that should be made for 2021; and recording of the specific cross-Chapter harmonization that should be considered for the major 2021 rewrite of the Roadmap.
HIR Panel Session 3, Included these TWGs:
00:00 — 5G, RF and Analog Mixed Signal; 
09:02 — Mobile; 
18:38 — Aerospace & Defense; 
27:32 — Wafer-Level Packaging; 
34:38 — Materials & Emerging Research Materials; 
42:29 — Internet of Things (IoT);
50:36 -- Discussion, Questions and Answers
Refer to https://ieee-region6.org/scv-eps/?p=2455​ for additional links.