No Enclosure PCB Potting, Silicon Mold Casting Method, MAX MCR High-Performance Epoxy Potting System
Channel: The Epoxy Experts
Date: 2022-01-18

Reduce Unit Cost By Eliminating Potting Enclosure. Cast And Embedd In One Simple Step.
Upon cure, MAX MCR can withstand extreme outdoor conditions (-25°C to 110°C), continuous deepwater immersion, or up to 100 feet buried underground. MAX MCR has been used and proven as a durable potting compound for bio-gas sensors in anaerobic digesting landfills, where methane and heat are produced.

PRODUCT DESCRIPTION
MAX MCR A/B is an epoxy-based, medium working time, low viscosity potting compound resin system used to pot or encapsulate printed circuit boards (PCB), mechanical relays, induction coils, and other electronic or electrical circuitry.

MAX MCR A/B is low in viscosity and self-levels as it cures at room temperature. Upon cure, it is non-electrically conductive, seals and waterproofs open circuitry, and provides permanent masking for custom and proprietary circuitry and electronic components.

MAX MCR A/B is mixed 2:1 by weight or by volume ratio. The mixed consistency is easily poured or injected in place. It cures hard opaque black compounds suitable for small to medium potting applications without excessive exothermic heat generation of up to 300 ml confined volume.
MAX MCR A/B bonds to PVC, PP, ABS, Plastisol, aluminum, steel, copper, brass, and other materials typically used in electrical circuits and circuit boards. 

Available in several kit sizes at;
https://theepoxyexperts.com/product-category/electrical/max-mcr-black-ab/

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Polymer Composites, Inc 
The Epoxy Experts