Thermosonic bonding | Wikipedia audio article
Channel: wikipedia tts
Date: 05/06/2019

This is an audio version of the Wikipedia Article:
https://en.wikipedia.org/wiki/Thermosonic_bonding


00:00:46 1 Description
00:03:12 2 Background
00:05:46 3 Applications
00:07:38 4 See also



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SUMMARY
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Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father Of Thermosonic Bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics. Owing to the well proven reliability of thermosonic bonds, it is extensively used to connect the central processing units (CPUs), which are encapsulated silicon integrated circuits that serve as the "brains" of today's computers.