Thermal Sciences for the Heterogeneous Future
Channel: Paul Wesling
Date: 08/03/2021

(30:20 + Q&A) Prof. Kenneth Goodson, ME and MatSci Departments, Stanford University
    Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium. This presentation, by Prof. Kenneth Goodson, Stanford University, discusses the difficult issue to thermal management facing higher-density packaging and points to needed solutions.
    The Fourth Annual Heterogeneous Integration Roadmap Symposium and Annual Meeting, held in Silicon Valley in February 2021, was sponsored by three IEEE Societies (EDS, EPS, and Photonics), as well as ASME and SEMI. The HIR is 600+ pages of details across all areas of advanced electronics packaging, covering pre-competitive information for industry, working engineers, and academia. The Roadmap is available without charge.   
    Information about the IEEE Heterogeneous Integration Roadmap is available at https://eps.ieee.org/hir.  Other HIR Symposium videos can be accessed at https://ieee-region6.org/scv-eps/?p=2416