Unboxing the STEVAL BFA001V2B, a multi sensor development kit with IO-Link connectivity
Channel: STMicroelectronics
Date: 2020-10-13

Find out more information: http://bit.ly/STEVAL-BFA001V2B

The STEVAL-BFA001V2B is an industrial reference design kit for condition monitoring (CM) and predictive maintenance (PdM), in a layout that is designed to meet IEC61000-4-2/4 and EN60947 requirements for industrial applications.

The hardware consists of a highly compact (50 x 9 x 9 mm) industrial sensor board specifically designed for real industrial applications, and the necessary debugging tools, cables, plugs and adapters for an industrial communications scenario. The connection is managed using a standard multipolar cable with one wire used for IO-Link data.
The STSW-BFA001V2 firmware package (freely available on www.st.com) includes dedicated algorithms for advanced time and frequency domain signal processing and analysis of the high bandwidth 3D digital accelerometer for vibration monitoring. The package includes pressure, relative humidity and temperature sensor monitoring samples as well as audio algorithms for acoustic emission (AE).
The firmware runs on the high performance STM32F469AI, ARM® Cortex®-M4, 32-bit microcontroller. The sensor data analysis results can be displayed on a user PC terminal emulator via wired connectivity or the related IO-Link master board interface.
IO-Link device stack v1.1. (for evaluation purposes, with some limitations) is included in object library format with IO-Link Device Descriptor (IODD) for all measurements and with dedicated examples to demonstrate device interoperability with any master tool. It supports BLOB transfer for vibration and acoustic FFT data, event generator and parameter configuration.
The package includes a GUI to demonstrate the IO-Link device features when connected to the STEVAL-IDP004V2 multi-port master evaluation board.