Front End and Wafer Handling Products Catalog販売元：ナガセテクノエンジニアリング株式会社Established in 1999 by a team of semiconductor industry veterans, ePAK is a full-service designer, manufacturer and supplier of precision engineered products and solutions for the automated transport and handling of semiconductor and electronic devices. Our product areas include front-end wafer handling, back-end IC transport, and end-system sub-assembly handling. Our products are sold globally to top tier global customers induding semiconductor companies, system OEMs, and IC assembly and test operations. Our large-scale manufacturing and design centers in Shenzhen & Wuhu China are centrally located to the semiconductor industry's back-end activities and supports a global network of JIT distribution centers.  ePAK's corporate headquarters is located in Austin, Texas and we maintain nine sales and applications engineering offices worldwide, Device protection and contamination control begins at the wafer fab and extends to the assembly site, ePAK never forgets that the most valuable product in the semiconductor and electronics industry is also the most fragile and susceptible to mishandling and contamination. Not all wafers are created equal…with back-grinding, unique material sets, and exotic semiconductor processes, one product does not fit all wafers. From ePAK's most advanced eLX wafer canisters to cost efficient wafer jars, ePAK tailor fits their products to meet your requirements. ● Expanding constantly to meet increasing demand • Semiconductor & electronics packaging market focused ● Customer driven product development •   Over 130 injection molding lines ●   Full range of materials available ● 12 cleaning lines for wafer products ●   4 class 100 clean rooms (over 4500 sq. meters)
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● Enhanced protection of wafer surfaces ● Minimizes lateral movement without applying compression to delicate wafer edges ● Advanced design minimizes particle generation ● Secure 4 latch system (with 2 latch option) ● Impact resistant design ● Large label areas ● Interfaces with industry robotic handling equipment ● Drop-in replacement for old industry designs ● Protective shipping OverPAKs available...see products Wafer canister part numbers and ordering information:
** FHRS & Standard Ring separator compatible canisters (Pg. 8) (PATENTS: US #6988620, PRC #ZL 03 2 07820 X, Singapore #106157, Taiwan # I299315, Japan #4383808 ) Note 2: Latches are outside enclosure
RETURN TO TABLE eFORM™ — Clean Adjustable Platform option to minimize vertical movement  (−x in P/N): Material code options: (−x in P/N):
● ● ● .
For high-security transit of wafers Designed for stacking Quick release snap-lock design for lid removal Recessed slots for easy loading and unloading Wafer loader machine compatible with most industry equipment Protective shipping OverPAKs available...see products Wafer canister part numbers and ordering information:
(** Patented “Double Ring” design)
Material code options: (−x in P/N):

A wide range of cushion disks and wafer separators are available RETURN TO TABLE OF CONTENTS Easy loading/unloading in automated or manual applications Impact resistant containers feature a snap-on lid for secure packing Available in both conductive PP and natural (non-conductive) PP materials A wide range of cushion disks, jar liners and wafer separators are available Overpaks available...see products
WAFER JAR LID FOAM SEPARATOR WAFER SEPARATOR FOAM LINER FOAM WAFER JAR RETURN TO TABLE OF CONTENTS and the  5"(eFL5-474-19-13-eM-04-H-PNK) Liner Note #2: Additional 5″x 38mm option for wafers utilize the 6″ (eJR-170-38-X) Jar, 6″ (eFL6-518-37-6- eM-04-H-PNK) Liner, and the  5"(eFL5-474-37-13-eM-04-H-PNK) Liner Note #3: Additional 5"x 76mm option for wafers utilize the 6" (eJR-167-76-X) Jar, 6" (eFL6-518-75-6- eM-04-H-PNK) Liner, and the  5"(eFL5-474-75-13-eM-04-H-PNK) Liner Note #4: Patented "Double Ring" design does not require a foam liner Note #5: Patented "eLX" style internal features reduce lateral movement and do not require a foam liner Material code options: (−x in P/N):
Wafer Separators – (Interleaf) for use between individual wafers Anti-static spun PO (Tyvek®):

Material code info:

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Copyright © 1999-2024 ePAK International, Inc.      All Rights Reserved

. Ring Separators are used when a surface contact is not preferred. Outer raised edge of the ring contacts only the wafer outer circumference on its active surface. Ring separators are only for use in "eLX" style canisters as they require lateral movement to be minimized. The eLX canisters, eWB0383 & (200mm) and eWB0516mWB0371 (300mm) are designed for 25 wafers when using Ring Separators. "Fixed Height Ring Separators" (FHRS) are designed to self-stack. They always have same # of rings per canister & the stacking feature removes weight of wafer stack from individual wafers.
FHRS (Fixed Height Ring Separators)**  -Uses outside stacking supports to provide separation and minimize stack pressure on wafers *Note #1- Fixed Height Ring Separator design. Only designed for use with eWB0435-4-x wafer canister. *Note #2- Fixed Height Ring Separator design. Only designed for use with eWB0516-4-x wafer canister. *Note #3- Fixed Height Ring Separator design. Only designed for use with eWB0371-4-x wafer canister.

**PATENT PENDING

Top/Bottom Cushion Disks – ESD sensitive cushioning material for use with Canisters and Jars
Material code options:
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this 5"(eFL5-474-19-13-eM-04-H-PNK) Liner Notes#2  This 5″ wafer configuration utilizes the  6″(eJR-167-38-X) Jar, 6″ (eFL6-518-37-6-eM-04-H-PNK) Liner, and this 5"(eFL5-474-37-13-eM-04-H-PNK) Liner Notes#3  This 5″ wafer configuration utilizes the  6″(eJR-167-76-X) Jar, 6″ (eFL6-518-75-6-eM-04-H-PNK) Liner, and this 5"(eFL5-474-75-13-eM-04-H-PNK) Liner Material code options:
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High performance alternative to foam-based solutions ● Made from proprietary, low-ionic, flexible, conductive polystyrene ● Ideal for both Cu and Al metallized wafers ● Best choice for both long and short term storage needs ● Available for 6", 8" and 12" wafer sizes (PATENTS:  US #7425362, Singapore #105587, Japan #4205540, Taiwan #I297662,  PRC#ZL 03 2 07819.6) RETURN TO TABLE OF CONTENTS
ePAD… Thermal Formed Wafer Cushion – Particle free, vacuum formed, cushioning material for wafer stack
ePAD… Wafer Platform – Provides the flat surface required for the proper function of the ePAD system
Material code options for all ePAD – Thermal Formed Wafer packing materials: (–× in P/N):
(PATENTS:  US #7425362, Singapore #105587, Japan #4205540, Taiwan #I297662,  PRC#ZL 03 2 07819.6) OF CONTENTS
• Designed to hold 25 wafers by the edge • Economical solution for small wafers • 2 piece design includes Lid and Base
Material code options: (–x in P/N)
• Designed to hold multiple wafers by the edge • 3-piece design includes Top, Cassette, and Base • Designed to interface with automated equipment • Clean Room plastic shipping bags available

Material code options:

. • . . Designed to hold 25 wafers by the edge Made from ultra—clean PP material 3 piece design includes Lid, Cassette, and Base Protective shipping OverPAKs available...see products
Product info:

Material code options:
Please contact ePAK or your local agent to discuss the many ePRO… options available to fit your requirements, RETURN TO TABLE OF CONTENTS (PATENTS: US 7967146, US D639154, Taiwan M356220, Singapore 150443) . ● ● . ● .
RETURN TO TABLE OF CONTENTS SEMI/FIMS compliant Automated operation minimizes potential contamination from human interaction Manual opening and closing Ultrapure, low outgassing materials protect wafers Robust wafer retention ensures reduced particle generation Cleanable without requiring disassembly of door
Copyright © 1999-2024 ePAK International, Inc.      All Rights Reserved
eFOSB300
There are very many option variations and combinations that can be configured to meet your specific requirements. Please contact ePAK or your local agent for more information. RETURN TO TABLE OF CONTENTS http://www.epak.com Confidential
Copyright © 1999-2024 ePAK International, Inc.      All Rights Reserved

● SEMI/FIMS compliant ●   Automated operation minimizes potential contamination from human interaction ●   Manual opening and closing •  Ultrapure, low outgassing, ESD materials protect wafers during processing ●  Robust wafer retention ensures reduced particle generation • Cleanable without requiring disassembly of door ● Diffuser Purge options RETURN TO TABLE OF CONTENTS
Copyright © 1999-2024 ePAK International, Inc.      All Rights Reserved

There are very many option variations and combinations that can be configured to meet your specific needs and requirements. Please contact ePAK or your local agent for more information. RETURN TO TABLE OF CONTENTS
For use with 200mm Wafers on 276mm Flat to Flat Flex Frames:
or use with 300mm Wafers on Flex Frames (coming soon Q3, 2024):
There are very many option variations and combinations that can be configured to meet your specific needs and requirements. Please contact ePAK or your local agent for more information. RETURN TO TABLE OF CONTENTS
Note 1:  Designed for 8" Cassette, but can potentially switch 6" Cassette later. Would need to exchange Cassette Retainer. Note 2』 Designed for 6" Cassette, but can potentially switch 8" Cassette later. Would need to exchange Cassette Retainer. OF CONTENTS ePB-2/50-25-x-y inside ePBX-2-ASSY-# ePB-3/76-25-x-y inside ePBX-3-ASSY-# ePB-4/100-25-x-y inside ePBX-4-ASSY-#

Material code info:

Color code info BLU = Blue GRN = Green RED = Red YLW = Yellow RETURN TO TABLE OF CONTENTS
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(For ordering information, see product details on Pages 24-26) ePB-6/150-25-x-y ePB-6/150-25-R.1-x-y ePB-6/150-25-R.2-eM-47-BLK ePB-6/150-25-R.4-eM-56 ePB-6/150-25-R.6-x-y ePB-6/150-25-R-9-x-y ePB-6/150-12-x-y ePB-6/150-15-x-y ePB-6/150-18-x-y ePB-6/150-18-R.1-eM-47-BLK ePBX-6/150-ASSY-# ePBX-6/150-R.1-ASSY-# ePBX-6/150-R.3-ASSY-# ePBX-6/150-R。5-ASSY-# ePBX-6/150-R.10-ASSY-# ePBX-6/150-2-ASSY-# RETURN TO TABLE OF CONTENTS
(For ordering information, see product details on Pages 25 - 27) RETURN TO TABLE OF CONTENTS
ePB-2/50-25-R.1-eM-39-NAT ePB-3/76-25-R.6-eM-39-NAT ePB-4/100-25-R.9-eM-39-NAT ePB-6/150-25-R.8-eM-39-NAT ePB-8/200-25-R.6-eM-39-NAT ePB-8/200-25-R.10-eM-39-NAT RETURN TO TABLE OF CONTENTS http://www.epak.com
Copyright © 1999-2024 ePAK International, Inc.      All Rights Reserved

8″ Process Boats:
12″ Process Boats: 12" eWB0519-ASSY-X ePB-12/300-25-ASSY-X eM-175-CLR/eM-123-NAT RFID option 300mm 25
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● Storage Boxes are Stackable ● Available in many material options: eM-01-BLK is equivalent to Entegris® Stat-Pro® 100 (PP + CP) material* eM-08-NAT is natural PP material with many color options eM-46-BLK is equivalent to Entegris®  Stat-Pro® 175 (PP + CF) material* *(PP = Polypropylene, CF=Carbon Fiber, CP=Carbon Powder, PTFE= Polytetrafluoroethylen Product info:
Material code info:
Color code info
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• ● Storage Boxes are Stackable ● Available in many material options: eM-01-BLK is equivalent to Entegris® Stat-Pro® 100 (PP + CP) material* eM-08-NAT is natural PP material with many color options eM-46-BLK is equivalent to Entegris® Stat-Pro® 175 (PP + CF) material* *(PP = Polypropylene, CF=Carbon Fiber, CP=Carbon Powder, PTFE= Polytetrafluoroethylene)
NAT = Natural BLU = Blue GRN = Green RED = Red YLW = Yellow RETURN TO TABLE OF CONTENTS http://www.epak.com
• Envelopes are manufactured using dear PVC ● Snaps are manufactured using white Nylon (eM-64) Envelopes info:

Material code options:

BADGE HOLDER Welded to Storage box CARD HOLDER Attached to mWB0070
& eV8-78x25-Carrier-x Attached to 4” Process Boat
mOP0370 (Attached to Box Lid) Color code (-y in P/N) NAT = Natural BLU = Blue GRN = Green RED = Red YLW = Yellow RETURN TO TABLE OF CONTENTS eOP0179 eOP0202-8-ASSY-2 OP0202-8-ASSY-3
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(1) Positive Locking Lid (2) Positive Locking Lid, Larger Label Area (3) Designed for Thin / Fragile wafers Material code options:
(*PATENT PENDING) RETURN TO TABLE OF CONTENTS
External packaging solution for our popular 2, 3, 4, and 6 inch Coin Style Single Wafer Shippers Product Information: . 5 pcs per layer/15 pcs per box For the 2" Coin Style Shippers: . For the 3" Coin Style Shippers: 3 pcs per layer/ 9 pcs per box 2 pcs per layer/ 6 pcs per box For the 4" Coin Style Shippers: . For the 6" Coin Style Shippers: 3 pcs per layer/ 9 pcs per box . Each MASTERPAK™ contains: 1 pcs - cardboard outer box . 3 pcs - Antistatic PE foam with cavities for shippers . 4 pcs - Antistatic PE foam cushion layer-Solid
Ordering Information:

Minimum Order Quantity: 20 Masterpaks™ SHOWING: MASTERPAK-2 SOLID 13 MM FOAM 5 CAVITY 13 MM FOAM SOLID 13 MM FOAM 5 CAVITY 13 MM FOAM SOLID 13 MM FOAM 5 CAVITY 13 MM FOAM SOLID 13 MM FOAM OUTER BOX Copyright © 2003 ePAK International, In RETURN TO TABLE OF CONTENTS
(INJECTION MOLDED)
Clamshell Style Shippers - Hinged Single wafer shippers

Material code options

(INJECTION M 300mm Coinstack Style Shippers — single wafer shippers (Base with separate cover)
Material code options:
Vacuum Formed Shippers — Single wafer shippers

Material code options: (−x in P/N):

Wafer Stiffener – Support system for ultra-thin, brittle wafers Proprietary, ultra-pure material Adds rigidity to sensitive ultra-thin wafers .
LID Material code info (–x in P/N):
(*PATENT PENDING) RETURN TO TABLE OF CONTENTS http://www.epak.com Confidential
Designed for 100, 125, 150, 200 and 300 mm wafers Low cost alternative to metal flex frames Designed to be used one time and then discarded Of special interest to those who ship wafers to customers on flex frames . No need to bear freight cost to return heavy metal frame No need for cleaning metal frame before reuse • Call for further details Plastic Flex Frames — For shipping wafers mounted on tape

Material code info:

. 410 SS / 420 SS . . . . 6 Inch and 8 Inch packed in carton quantities of 50 12 Inch packed in carton quantity of 25 Other surface finishes available upon request Custom sizes and shapes available upon request Metal Flex Frames ー For shipping wafers mounted on tape
Designed for 100, 125, 150, 200 & 300mm wafers Available in uncoated, anti-static coated or conductive PS materials Call for further details. Plastic Flex Frame Shippers: For shipping flex frames with mounted wafers
Material code options: (−x in P/N):
Stacked Trays ( "T" Style ) RETURN TO TABLE
150mm 200mm 300mm RETURN TO TABLE OF CONTENTS
Material code options:

Protective shipping OverPAKS™ available…see products Plastic Flex Frame Canisters — For horizontal/coinstack shipping of multiple Flex Frames with mounted wafers
* "eLX" Style with reduced movement features. Material code options:
◾ A range of cushion disks and separators are available. Please see next page. ▪ Protective shipping OverPAKS™ available...see products RETURN TO TABLE OF CONTENTS
Material code options:
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Separators:  For use between wafers on frames

Moisture Barrier Bags:

Material code info:
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Hoop Rings:  (X) is material code, (Y) is color code
NOTE: The word "UP" printed is ePAK Standard style. For printing the word "RADIUS" please add "-R" to end of the ePAK Order Code Material code info: (−X in P/N):
Color code info: (-Y in P/N) B = Blue G = Green Colors: GY = Grey Y = Yellow RETURN TO TABLE OF CONTENTS
Hoop Rings:  (X) is material code, (Y) is color code
For 12 Inch/300mm:
NOTE: The word "UP" printed is ePAK Standard style. For printing the word "RADIUS" please add "-R" to end of the ePAK Order Code Material code info: (−X in P/N):
Color code info: (-Y in P/N)
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eV10-HRS-170/186-x
X RETURN TO TABLE OF CONTENTS Hoop Ring Shippers — Designed to hold multiple Hoop Ring assemblies with wafer and tape
Round Glass:
Material Code info for adapter plates ONLY: (−x in P/N):

Rectangular Glass:

Material Code info: (—x in P/N):

** PVDF Material option is for Cassette only.
Flexible packing system . Fast tooling cycle time . Standardized outline and full set of accessories including caps, clips and cover tray . Convenient carrier for sample die, finished IC or other small components . Contact ePAK today to discuss your custom chip tray solution .
Open Tooling:
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′ X 2″ TRAYS (continued)
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2" X 2" TRAYS (continued)
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2″ X 2″ TRAYS (continued)
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4″ X 4″ TRAYS
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1 Piece Clip 2 Piece Clip Spring Box Material code options: (−x in P/N):
Chip Tray Covers:
Custom Laser Markings now available on most ePAK Wafer Products. Serialized Alpha Numeric Codes ● ● Part numbers ● Serial numbers QR codes � RETURN TO TABLE OF CONTENTS
Front snap lock mechanism for easy box closure . Integrated hinge set for easy operator opening .
Reticle Box:

Material code info: (−x in P/N):