ZEISS Xradia 630 Versa 3D X-ray Microscopy ZEISS Xradia 630 Versa 3D X-ray microscopy (XRM) is the ultimate non-destructive imaging solution in failure analysis and process development for semiconductor and electronic packages, components, and devices, including: ■ Heterogenous integration devices ■ 2.5D/3D packages with TSVs ◾ Fan-out wafer level packages with redistribution layers ■ High bandwidth memory and V-NAND ■ Flip chip C4 bumps and microbumps ■ Smartphones and components Figure 1 Non-destructive visualization and characterization of solder fatigue cracks in a thermal cycled smartphone SIP control board at 2.5 μm voxel resolution The next-generation Xradia 630 Versa extends the limits of submicron-resolution 3D imaging and analysis, enabling unprece- dented 450 nm spatial resolution. It delivers effortless data acquisition workflows for all users with a redesigned user interface and provides faster scan times across broader length scales with a flat panel detector. These advancements make Xradia 630 Versa ideal for construction analysis, packaging analysis, and failure analysis. Highest-resolution 3D X-ray Imaging ■ Visualize virtual cross-section images of fault locations and buried features without cutting the samples ■ Achieve industry-leading 450 nm spatial resolution, maintaining 500 nm spatial resolution even at the highest energy ■ Obtain unsurpassed performance for high-resolution while imaging at long working distances in packages, circuit boards and large electronic devices
Effortless Data Acquisition
■ A newly designed user interface NavX uses Human Centered Design (HCD) principles. It improves scan setup efficiency and reduces learning curves for all users. ■ Infographic mental models and guidance provide instant access to procedural suggestions and feedback, eliminating the need for costly training and reducing the learning curve ■ Integrated new workflows such as Projection Scout and Volume Scout, streamline user interactions during scan setting ■ NavX user interface enables high- productivity data acquisition and improves the success rate of root cause analyses
Superior Image Quality at
Improved Scan Speed
■ ZEISS’s unique Resolution at a Distance (RaaD) technology for high resolution even at large working distances ■ Improved resolution and contrast performance even at high energy range with optional 40X-Prime objective ■ Broader length scales of sample sizes and fields of view (FOV) with an included flat panel detector (FPX) ■ High-speed scans with FPX on large semiconductor packages and electronics products ■ Optional AI supercharger module (DeepRecon Pro + DeepScout) to improve scan speed ◾ Plan-view and cross-sectional images may be viewed with accurate isolation of the desired plane, in any direction ■ High Aspect Ratio Tomography (HART) for faster imaging of semiconductor packages and electronic samples ■ Optional Autoloader for continuous operation
Benefits
■ Highest resolution and contrast for a multitude of package applications: failure analysis, process development, construction analysis and production validation ■ Unprecedented 0.45 μm spatial resolution, 40 nm minimum voxel size ■ Uncomplicated scan operations with the intuitive NavX user interface and streamlined workflows ■ Integrated flat panel detector broadens the dynamic range of sample sizes and fields of view with faster scans ■ Flexible system configurations and upgradable path Figure 2  (Left) Package interconnects visualized in a 22×26 mm embedded multi-die interconnect bridge (EMIB) package. (Right) Virtual cross-section of 30 μm diameter microbumps of the EMIB package, acquired at 0.32 μm/ voxel with a new optional 40X-Prime objective lens.
Detector System ZEISS X-ray microscopes feature an innovative detector turret with multiple objectives at different magnifications
[b] RaaD working distance defined as clearance around axis or rotation. [c] Voxel is a geometric term that contributes to but does not determine resolution, and is provided here only for comparison. ZEISS specifies resolution via spatial resolution, the true overall measurement of instrument resolution. [d] 40X-Prime objective therapeutic use, treatment or medical diagnostic evidence. Not all products are available in every country. Contact you'l local ZEIS' representative for more information.
O1 microscopy@zeiss.com www.zeiss.com/semiconductor-microscopy