ALUMINUM ELECTROLYTIC CAPACITORSRECOMMENDED SOLDERING CONDITIONS◆SURFACE MOUNT TYPE

AlchipTM MVE/MZT/MZS/MZL/MZR/MZJ/MZA/MVY/MZF/MZE/MZK/MLA/MLF/MLE/MLK/MVL/MVJ/MXB/MHS/MVH/MHL/MHB/MHJ/MHKThe following conditions are recommended for air convection and infrared reflow soldering on the SMD products onto a glass epoxy
circuit boards by cream solder. The dimensions of the glass epoxy boards with resist are 90×50×0.8mm for D55 to KG5 case code SMDcapacitors and 180×90×0.8mm for LH0 to MN0 case codes SMD capacitors.
The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals.
Reflow should be performed twice or less. (Only some products: 3 times)
Please ensure that the capacitor became cold enough to the room temperature (5 to 35℃) before the second reflow and the third reflow (Only some products).
Consult with us when performing reflow profile in IPC / JEDEC (J-STD-020)●Recommended soldering heat conditions (Except for Conductive Polymer Aluminum Solid Capacitors)
Peak temp.

PeakSeries230/240/245

Max. period of time over 230/240/245℃

Temp (℃)

217

Max. period of time over 217℃
PreheatTime (sec.)●Recommended Solder Land on PC Board

Size code

Voltage range(Vdc)
4 to 63V

PreheatTime maintained Time maintained
Peak temp. Reflow number
above 217℃
above 230℃

MVE, MZT, MZS
MZL, MZR, MZJ, D55 to F90 (Except 63V for MVH)
MZA, MVY, MZF,63V(MVH), 80V
150 to 180℃
MZE, MZK, MLA,
4 to 50V
MLF, MLE, MLK, H63 to JA0120sec. max.
63 to 100V
MVL, MVJ, MVH,MHL, MHB, MHJ, KE0 to MN0 6.3 to 50V
63 to 100V
MHK, MXB
SeriesSize codeMHS

HA0JA0Voltage range
Preheat(Vdc)

90sec. max

60sec. max.

260℃max. 2 times or less

60sec. max.
60sec. max.
30sec. max.
30sec. max.
20sec. max.

40sec. max.
30sec. max.
20sec. max.
20sec. max.
-250℃max.
245℃max.
240℃max.
240℃max.
230℃max.

2 times or less
2 times or less
2 times or less
2 times or less
2 times or lessTime maintained Time maintained Time maintained
Peak temp. Reflow number
above 217℃
above 240℃
above 245℃

16 to 80V 150 to 180℃ 90sec. max.
120sec. max.
KE0 to MN0 16 to 100V
70sec. max.

-40sec. max.

20sec. max.

-250℃max.

3 times or less
2 times or less

245℃max. 3 times or less[mm]

Size code

cbab: Solder land on PC board
Location of capacitor◆RADIAL LEAD AND SNAP-IN TYPE
● Recommended soldering heat conditions
Preheat : 150℃ 120 seconds max. (Radial lead type)
Flow: 260±5℃ max. 10±1 seconds max.
(Or 380±10℃ max. 3±0.5 seconds max.: hand soldering)◆PRECAUTIONS FOR USERS
Soldering method

The capacitors of Alchip-series have no capability to withstand such dip
or wave soldering as totally immerses components into a solder bath.

Reflow soldering

Reflow the capacitors within recommended reflow soldering conditions.
Verify there is no temperature stress to the capacitors because the following differences might degrade capacitors electrically and mechanically.
Please consult us if other reflow conditions are employed.
1.Location of components : Temperature increases at the edge of PCboard more than the center.
2.Population of PC board : The lower the component population is, themore temperature rises.
3.Material of PC board : A ceramic made board needs more heat than aglass epoxy made board. The heat increase may cause damage to thecapacitors.
4.Thickness of PC board : A thicker board needs more heat than a thinner board. The heat increase may damage the capacitors.
5.Size of PC board : A larger board needs more heat than a smallerboard. The heat increase may damage the capacitors.
6.Solder thickness
If very thin cream solder paste is to be used for SMD types, please
consult with us.
7.Location of infrared ray lamps : IR reflow as well as hot plate reflow
heats only on the reverse side of the PC board to lessen heat stress tothe capacitors.
8.Vaporsoldering
not used.
8.Pleasephaseconsult
us about(VPS)
vaporisphasesoldering (VPS).

D55, D60, D61, D73
E55, E60, E61, E73
F55, F60, F73, F90
F61, F80
H63
HA0
JA0
KE0, KG5, KN0
LH0, LN0
MH0, MN0

Terminal code : A

Terminal code : Ga
1.0
1.4
1.9
1.9
2.3
3.1
4.5
4.0
6.0
6.0

abc

1.9

3.5

3.3

3.1
4.5
3.4
4.7
4.7

4.2
4.4
6.3
7.8
8.8

3.5
3.5
9.3
9.6
9.6

b
2.6
3.0
3.5
3.5
4.5
4.2
4.4
5.7
6.9
7.9

c
1.6
1.6
1.6
1.6
1.6
2.2
2.2
2.5
2.5
2.5

Rework of soldering

Use a soldering iron for rework. Do not exceed an iron tip temperature of
380±10℃ and an exposure time of 3±0.5 seconds.

Mechanical stress

Do not use the capacitors for lifting the PC board and give stress to thecapacitor. Avoid bending the PC board. This may damage the capacitors.

Cleaning assembly board

Immediately after solvent cleaning, remove residual solvent with an air
knife for at least 10 minutes. If the solvent is insufficiently dry, the capacitors may corrode.

Coating on assembly board

1.Before curing coating material, remove the cleaning solvents from theassembly board.
2.Before conformal coating, a chloride free pre-coat material is recommended to decrease the stress on the capacitors.

Molding with resin

Internal chemical reaction gradually produces gas in the capacitor; then,increasing internal pressure. If the end seal of the capacitor is completelycoverd by resin the gas will be unable to escape causing a potentially
dangerous situation. The chlorine contained resin will penetrate into theend seal, reach the inside element, and cause damage of the capacitor.

OthersRefer to PRECAUTIONS AND GUIDELINES.

Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications.

CAT. No. E1001Y 2024