CONDUCTIVE POLYMER ALUMINUM SOLID CAPACITORSRECOMMENDED SOLDERING CONDITIONS FOR NPCAPTM◆SURFACE MOUNT TYPE
The following conditions are recommended for air or infrared reflow soldering PXN/PXT/PXJ/PXG/PXK/PXS/PXF/PXE/PXA/PXD/PXH
series onto a glass epoxy circuit board of 90×50×0.8mm (with resist) by cream solder. The temperatures shown are the surface temperature
values on the top of the can and tem per a ture of capacitor terminal.
Reflow should be performed twice or less.
Please ensure that the capacitor became cold enough to the room temperature (5 to 35℃) before the second reflow.
Temperature on the top of capacitor (℃)
andTemperature of capacitor terminal (℃)● Recommended soldering heat conditions

Peak temp.

Peak230

SeriesMax. period of time over 230℃

217

Max. period of time over 217℃
PreheatVoltage
range(Vdc)

PreheatTime maintained Time maintained
Peak temp. Reflow number
above 217℃
above 230℃

PXN/PXT
50 sec. max.
PXJ/PXG 2.5 to 16V
150 to 180℃
PXK/PXSPXF/PXE
120 sec. max. 50 sec. max.
PXA/PXD 20 to 25V
40 sec. max.
PXH

40 sec. max.
40 sec. max.
30 sec. max.

260℃max.

1-cycle only

250℃max. 2-cycles allowed
250℃max.

1-cycle only
2-cycles allowed

Time (sec.)● Recommended Solder Land on PC Board
Size code
E40, E46, E61
F46, F61, F80, FA0
H70, H80, HA0, HC0
J80, JA0, JC0

cbab

Location of capacitor

a1.4
1.9
3.1
4.5

b
3.0
3.5
4.2
4.4

[mm]c1.6
1.6
2.2
2.2

Solder land on PC board◆RADIAL LEAD TYPE
● Recommended soldering heat conditions
Preheat ：150℃ 120 seconds max.
Flow soldering ：260+5℃ max. 10+1 seconds max. (Or 380±10°C max. 3±0.5 seconds max.: hand soldering)◆PRECAUTIONS FOR USERS
Soldering method

SMD (Chip type) have no capability to with stand such dip or flow soldering
as totally immersing components into a solder bath.

Reflow soldering
Reflow the capacitors within Recommended Reflow Soldering Conditions.
Verify there is no temperature stress to the capacitors because the following differences might degrade capacitors electrically and mechanically.
Please consult with us if other reflow conditions are employed.
1.Location of components : Temperature increases at the edge of PC
board more than the center.
2.Population of PC board : The lower the component population is, themore temperature rises.
3.Material of PC board : A ceramic-made board needs more heat than aglass epoxy-made board. The heat increase may cause damage to thecapacitors.
4.Thickness of PC board : A thicker board needs more heat than a thinnerboard. The heat may damage the capacitors.
5.Size of PC board : A larger board needs more heat than a smaller board.
The heat may damage the capacitors.
6.Solder thickness
If very thin cream solder paste is to be used for SMD types, please
consult with us.
7.Location of infrared ray lamps : IR reflow as well as hot plate reflow
heats only on the reverse side of the PC board to lessen heat stress tothe capacitors.
8.Case leakage current will increase (～mA) after the reflow process, theleakage current which rose gradually decreases when voltage is applied.
9.Please consult us about vapor phase soldering (VPS).

Rework of soldering
Use a soldering iron for rework. Do not exceed an iron tip temperature of
380±10°C and an exposure time of 3±0.5 seconds.

Mechanical stress

Do not grab the capacitors to lift the PC board and give stress to thecapacitor. Avoid bending the PC board. This may damage the capacitors.

Cleaning assembly board

Immediately after solvent cleaning, remove residual solvent with an air
knife for at least 10 minutes. If the solvent is insufficiently dry, the capacitors may corrode.

Coating on assembly board

1.Before curing coating material, remove the cleaning solvents from theassembly board.
2.Before conformal coating, a chloride free pre-coat material is recommended
to decrease the stress on the capacitors.

Molding with resin

Internal chemical reaction gradually produces gas in the capacitor;
increasing internal pressure. If the end seal of the capacitor is completelycoverd by resin the gas will be unable to escape causing a potentially
dangerous situation. The chlorine in resin will penetrate the end seal, reachthe element, and damage of the capacitor.

GlueThe followings are requirements for glue.
1.A low curing temperature over a short period of time
2.Strong adhension and heat resistance after curing
3.Long shelf life
4.No corrosion

OthersRefer to PRECAUTIONS AND GUIDELINES(Conductive Polymer).

Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications.

CAT. No. E1001Y 2024