HYBRID IC

VLA542-11R
Hybrid IC for driving IGBT modules

DESCRIPTION
Dimensions : mm

OUTLINE DRAWINGVLA542 is a hybrid integrated circuit designed for drivingn-channel IGBT modules in any gate-amplifier application.
This device operates as an isolation amplifier for these modules

44 MAXand provides the required electrical isolation between
the input and output with an opto-coupler.

26MAX

Recommended IGBT modules:
VCES = 600V series up to 600A classFEATURES•Electrical isolation between input and output with opto-coupler

2.54(Viso = 2500Vrms for 1minute)

5.5MAX•Two supply driver topology+ 0.2

0.25 - 0.1

4.5+/-1.5

VCES = 1200V series up to 400A class

5.5 MAX+0.15

0.5 -0.1

5.5 MAX

3.0 MAX
8 MAX

141•Built-in short circuit protection circuit(With a pin for fault out)
•CMOS compatible input interface

APPLICATIONS
To drive IGBT modules for inverter or AC servo systems application

BLOCK DIAGRAM

LATCH
VI +DETECTCIRCUIT

144

VCC

2

CONTROL PIN
FOR ttrip

1DETECT

5VO

8FAULT OUTPUT

6VEE

TIMER &RESET CIRCUITINTERFACEOPTO-COUPLER
240 ohm
VI -GATE SHUTDOWN CIRCUIT

133,7,9,10 pin : Non connection

Oct. 2018

HYBRID IC

VLA542-11R
Hybrid IC for driving IGBT modules

MAXIMUM RATINGS (unless otherwise noted, Ta=25°C)
Symbol
VCC

Parameter

Conditions

Ratings

Unit

18

V-15

V

Supply voltage

DC

VI

Input signal voltage

Applied between; 13pin and 14pin
50% duty cycle, pulse width 1ms-1 ~ +7

V

VO

Output voltage

When the output voltage is “H”

VCC

V

Output peak current

Pulse width 2us

VisoIsolation voltage

Sine wave voltage 60Hz, for 1minuteTC

Case temperature

Topr

Operating temperature

VEEIOHP
IOLP--5A5A2500

Vrms

95°C

No condensation allowable-20 ~ +70°CTstg

Storage temperature

No condensation allowable-40 ~ +100 (*1)

°C

IFO

Fault output current

Applied 8pin

20mA

VR1Input voltage at 1pin

Applied 1pin

50V(*1) Differs from H/C condition

ELECTRICAL CHARACTERISTICS (unless otherwise noted, Ta=25°C, VCC = 15V, VEE = -10V, RG = 3.3 ohm)
SymbolParameterConditions

Min14-7Limits
Typ15-Max17-12Unit
VV

VCC
VEE

Supply voltage

Recommended range

VIN

Pull-up voltage on primary side

Recommended range

4.75

55.25

V

IIH

“H” input signal current

Recommended range

101316mAf

Switching frequency

Recommended range

--20

kHz

RG

Gate resistance

Recommended range

2--ohm

VIN = 5VIIH

“H” input signal current-13-mAVOH“H” output voltage-1314-VVOL“L” output voltage--8-9-VtPLH“L-H” propagation time

IIH=13mA

0.2

0.4

1µs

tr

“L-H” rise time

IIH=13mA

-

0.4

1µs

tPHL

“H-L” propagation time

IIH=13mA

0.2

0.4

1µstf

“H-L” fall time

IIH=13mA-0.3

1µsTimer

Between start and cancel(under input signal “OFF”)

1-2

msttimer
IFO

Fault output current

Applied 8pin, R = 4.7k ohm-5-mA

ttrip1

Pin1: 15V and more, Pin2:open
Pin1: 15V and more, Pin2-4:10pF(connective capacitance)-2.6-µs

ttrip2Controlled time detect short circuit 1
Controlled time detect short circuit 2(*2)

-3-µs

VSC

SC detect voltageCollector voltage of IGBT module

15--V(*2) Length of wiring of capacitor controlled time detect short-circuit is within 5cm from pin2 and pin4 coming and going.

DEFINITION OF CHARACTERISTICS(1) SWITCHING OPERATION(2) SHORT CIRCUIT PROTECTION
Input signal VI 0V

Input signal VI

trtf
Output VO

90%0V
-5V

50%
Output VO

ttrip1,2

ttimer10%10V
8pin output

tPLH

tPHL

20V

10V

HYBRID IC

VLA542-11R
Hybrid IC for driving IGBT modules

・PERFORMANCE CURVESPROPAGATION DELAY TIME "L-H" t PLH(μs)(μs)
PROPAGATION DELAY TIME "H-L" t PHL(μs)(μs)

PROPAGATION DELAY TIME "L-H" t PLH(μs)(μs)
PROPAGATION DELAY TIME "H-L" t PHL(μs)(μs)

tPLH,tPHL-Ta CHARACTERISTICS（TYPICAL）
1
VCC=15V
VEE=-10V
RG=3.3Ω
ΩVIN=5V
Load：CM400DY-24NF

0.8
0.6

tPLH

0.4
tPHL

0.20-20

020

4060

80

tPLH,tPHL-VI CHARACTERISTICS（TYPICAL）

1VCC=15V
VEE=-10VΩRG=3.3ΩTa=25℃
Load：CM400DY-24NF

0.80.6tPLH

0.4tPHL

0.203.5

AMBIENT TEMPERATURE Ta（℃）

VCC=15V
VEE=-10V

ttrip2：Ctrip=10pF

3ttrip1：Ctrip=025.561

VCC=15V
VEE=-10V
Ta=25℃

765432100-200204060080

20406080100

AMBIENT TEMPERATURE Ta（℃）

CONNECTIVE CAPACITANCE Ctrip(pF)(Pin : 2-4)

POWER DISSIPATION-AMBIENT TEMPERATURE
CHARACTERISTICS（MAXIMUM RATING）

DISSIPATION CURRENT-SUPPLY VOLTAGE (Pin : 4-6)
INPUT SIGNAL"L"（TYPICAL）

5ΩRG=2.0Ω
(INCLUDING THE POWERDISSIPATION OF RG）

4CONSUMPTION CURRENT (mA)

POWER DISSIPATION PD(W)

5ttrip-Ctrip CHARACTERISTICS（TYPICAL）

8CONTROLLED TIME DETECTSHORT CIRCUIT ttrip(μs)(μs)

CONTROLLED TIME DETECT(μs)
SHORT CIRCUIT ttrip1,ttrip2(μs)

644.5INPUT SIGNAL VOLTAGE VI(V)ttrip1,ttrip2-Ta CHARACTERISTICS（TYPICAL）

54321

Ta=25℃

2010000204060800100

1020304050

SUPPLY VOLTAGE （V） (Pin : 4-6)

AMBIENT TEMPERATURE Ta（℃）

3HYBRID IC

VLA542-11RHybrid IC for driving IGBT modules

OPERATION OF PROTECTION CIRCUIT(1)

APPLICATION CIRCUIT EXAMPLE

In case the gate voltage is “H” and the collector voltage is4.7k

high, this hybrid IC will recognize the circuit as shortcircuit and immediately reduce the gate voltage.
Besides, put out an error signal (”L”) which inform that8

D1

protection circuit is operating at the same time from pin8.
(2)

1

The protection circuit reset and resort to ordinary condition

DZ1

2

VIN (5V)

if input signal is “OFF” when the premised 1~2msec passed.

30v

Ctrip

( “OFF” period needs 10us or more )
(3)

Rg
14

When the output rises, the controlled time detect shortcircuit (Typ 2.6us) is set up so that on-time of IGBT can be
secured properly.

5VLA5424

It is possible to adjust that time by connecting the capacitor

HC04 etc.

(Ctrip) between pin2 and 4.

VCC

100uF

13100uF

VEE

6

VCC = 15V

VEE = 10V

Ctrip = 0 ~ 47pF (Rough guide ,OPERATION FLOW ON DETECTING SHORTCIRCUIT50V,ceramic)

D1: Fast recovery diode (trr ≤ 0.2us)RP1H (SanKen) etc.

PRECAUTION

START

(1)

Voltage compensate capacitors are expected to be located(1)

D1 requires approximately the same voltage of power modules.

(2)

If reverse recovery time of D1 is long, pin1 is applied high voltage.

as close as possible from the hybrid IC.
DETECTION OF
SHORT CIRCUITIn that case, counterplan for protection which insert a zener
diode between pin 1 and 6 is necessary like above diagram.
(3)

In case pin 2 is operating, the Ctrip is expected to be wired
as close as possible from pin 2 and pin 4.
(Less than 5cm coming and going)

GATE SHUTDOWNTIMER STARTOUTPUT ALARM

1 ~ 2ms

APPLICATION EXAMPLE OF SINGLE
POWER SUPPLYEND OF TIMER

4.7k

NoYes

8D11INPUT SIGNAL IS
OFF

DZ12

VIN (5V)

No30v

Ctrip

Rg

Yes

14

CLEAR ALARM

5VLA542

13ENABLE OUTPUT

4100uF

R

VCC

100uF
DZ26(*) Output voltage with protection circuit operating is about -lVEEl+2V
VCC = 24V
R : 2.7k ~3.3kohm

4DZ2 : 8.2V , 1/2W

HYBRID IC

VLA542-11R
Hybrid IC for driving IGBT modules

POWER SUPPLY FOR IGBT DRIVER
For IGBT driving,isolated power supply(+15V and around -10V) is necessary to every IGBT driver.
IGBT module+15V

Isolated power supply

IoPVEE-7V ~ -10V
+15VVcc

IGBT driverIo-7V ~ -10VVcc

U or V or W
IGBT driver

NVEE

Gate charge characteristic of IGBT

When you choose the gate power supply, please choose the productthat can supply the current capacity provided by the next calculation.

VGE

Io = ( Idrive + Icc )x ( 1 + Margin )Io: Output current of gate power supply
Idrive : Gate average current
Icc: Stable bias current of IGBT driver( Read from dissipation current – supply voltage characteristic of this data sheet )Margin : over than 0.3
Idrive = (Q1＋lQ2l ) X f
Q1: Gate charge on plus bias (Read from data sheet of IGBT)
Q2: Gate charge on minus bias (Read from data sheet of IGBT)f: Switching frequency of IGBT+15VGate chargeminus bias voltage
Q2

Q1TIMING CHART

Input signal
VISoft shut down5pin output
VoVCE of IGBT
Occurrence of short circuit

VSC(SC detection point)

IC of IGBT
Mask time(ttrip)

t timer

Fault output
on 8pinProtection operation
is cleared5

HYBRID IC

VLA542-11R
Hybrid IC for driving IGBT modules

FOR SAFETY USINGGreat detail and careful attention are given to the production activity of Hics, such as the development, the quality of production, and in
it’s reliability. However the reliability of Hics depends not only on their own factors but also in their condition of usage. When handlingHics, please note the following cautions.
CAUTIONS

Packing

The materials used in packing Hics can only withstand normal external conditions.
When exposed to outside shocks, rain and certain environmental contaminators, the packing materials
will deteriorates. Please take care in handling.

CarryingStorage

1)

Don’t stack boxes too high. Avoid placing heavy materials on boxes.

2)

Boxes must be positioned correctly during transportation to avoid breakage.

3)

Don't throw or drop boxes.

4)

Keep boxes dry. Avoid rain or snow.

5)

Minimal vibration and shock during transportation is desirable.

When storing Hics, please observe the following notices or possible deterioration of their electricalcharacteristics, risk of solder ability, and external damage may occur.
1)

Devices must be stored where fluctuation of temperature and humidity is minimal, and must not
be exposed to direct sunlight. Store at the normal temperature of 5 to 30 degrees Celsius withhumidity at 40 to 60%.

2)

Extended storage

Avoid locations where corrosive gasses are generated or where much dust accumulates.

3)

Storage cases must be static proof.

4)

Avoid putting weight on boxes.

When extended storage is necessary, Hics must be kept non-processed. When using Hics which havebeen stored for more than one year or under severe conditions, be sure to check that the exterior is freefrom flaw and other damages.

Maximum ratings

To prevent any electrical damages, use Hics within the maximum ratings. The temperature, current,voltage, etc. must not exceed these conditions.

Polarity

To protect Hics from destruction and deterioration due to wrong insertion, make sure of polarity ininserting leads into the board holes, conforming to the external view for the terminal arrangement.

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HYBRID IC

VLA542-11R
Hybrid IC for driving IGBT modules

Keep safety first in your circuit designs!
·ISAHAYA Electronics Corporation puts the maximum effort into making semiconductor products better and more reliable, butthere is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire orproperty damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures
such as (1) placement of substitutive, auxiliary, (2) use of non-farmable material or (3) prevention against any malfunction ormishap.
Notes regarding these materials·These materials are intended as a reference to our customers in the selection of the ISAHAYA products best suited to thecustomer’s application; they don't convey any license under any intellectual property rights, or any other rights, belonging
ISAHAYA or third party.
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at the time of publication of these materials, and are subject to change by ISAHAYA Electronics Corporation without notice
due to product improvements or other reasons. It is therefore recommended that customers contact ISAHAYA Electronics
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