H262-Z61

High Density Server - DP 2U 4 Nodes ServerFeatures• 2U - 4 nodes rear access server system• Dual AMD EPYC™ 7003 Series processors• 8-Channel RDIMM/LRDIMM DDR4 per processor, 64 x DIMMs• 8 x 1Gb/s LAN ports (Intel® I350-AM2)• 4 x Dedicated management ports• 1 x CMC global management port
• 24 x 2.5" SATA/SAS hot-swappable HDD/SSD bays
• 8 x M.2 with PCIe Gen3 x4 interface• 8 x Low profile PCIe Gen4 x16 expansion slots• 4 x OCP 2.0 Gen3 x16 mezzanine slots• Aspeed® AST2500 remote management controller• 2+0 2200W (240V) 80 PLUS Platinum power supply

Specification
Dimensions

2U 4 Nodes - Rear access (W440 x H87.5 x D840 mm)

Motherboard

MZ62-HD0 Rev. 3.0

CPU

AMD EPYC™ 7003 Series processors
Dual processors, 7nm technology, cTDP up to 240W
Up to 64-core, 128 threads per processor
Total 8 x Socket SP3, TDP up to 200W
Compatible with AMD EPYC™ 7002 Series processors

Chipset

System on Chip

Memory8-Channel DDR4 memory, total 64 x DIMM slots
RDIMM/LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHzLAN

8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 CMC global management port

VideoIntegrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Storage

24 x 2.5" SATA/SAS hot-swappable HDD/SSD bays
SAS card is required for SAS devices supportExpansion
Slots

8 x Low profile half-length slots with PCIe x16 (Gen4 x16)
4 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth
8 x M.2 slots (PCIe Gen3 x4, M-key)

Internal I/O

Per node:
2 x M.2 slots, 1 x COM header, 1 x TPM header,
1 x BMC SGPIO header, 1 x JTAG BMC header,
1 x PLD header, 1 x Clear CMOS jumper, 1 x IPMB connector

Front I/O

-Rear I/O

Total: 8 x USB 3.0, 4 x VGA, 8 x RJ45, 4 x MLAN, 1 x CMC LAN

Backplane I/O

24 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s per port

TPM

1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010

Power Supply

2+0 2200W (240V) 80 PLUS Platinum power supply

SystemManagementAspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X)

OSCompatibility

Windows Server 2016 / 2019
RHEL 8.3 ( x64) or later
SLES 12 SP5 ( x64) / 15 SP2 ( x64) or later
Ubuntu 18.04.5 LTS (x64) / 20.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 / 7.0 Update1 or later
Citrix Hypervisor 8.2.0 or later

Weight

Net Weight: 28 kg / Gross Weight: 50 kg

System Fans8 x 80x80x38mm (16,300rpm)

OperatingProperties

Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

PackagingContent

1 x H262-Z61, 8 x CPU heatsinks, 1 x Rail kit

ReferenceNumbers

Barebone package: 6NH262Z61MR-00 Rev. A00- Motherboard: 9MZ62HD0NR-00 Rev. 3.0- Rail kit: 25HB2-AN6103-K0R- CPU heatsink: 25ST1-44320H-A0R/25ST1-44320I-A0R- Back plane board: 9CBPH0O4NR-00- NVMe M.2 extension card for Slot_R: 9CMTP04RNR-00 (optional)- Power Supply: 25EP0-222003-D0S- C19 type power cord 125V/15A (US): 25CP1-018000-Q0R (optional)- C19 type power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)- C19 type power cord 250V/15A (US): 25CP1-018300-Q0R (optional)- Ring topology kit: 6NH262Z65SR-00-100 (optional extra)* All specifications are subject to change without notice. Please visit our website for the latest information.
* AMD, the AMD Arrow logo, EPYC, and combinations thereof are trademarks of Advanced Micro Devices, Inc.

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