Bond Scanner

The fastest, easiest, most accurate solution for
the inspection of adhesively bonded joints

Innovation starts here.

Bond Scanner Portfolio
Flex Bond Scanner

In modern car designs, bondlines can total hundreds ofmeters or yards. As adhesives
continue to grow in importancein the automotive and otherindustries, manufacturers
and operators recognize thatadhesive applications aren’t
always reliable and require
specific inspection.

This innovative scanner allows for easy inspection of complex
geometries that are increasingly found in modern car designs.
The convexly pre-bent array design of the LA-10, 32-element flex
scanner can be adapted to both concave and convex curvatures,with a bending radius of approximately 80 mm or 3.2” and the ability
to inspect the A side-edge bond lines up to 32 mm or 1.3” wide.

Adjustable Bond ScannerThis flexibility examines many different bond seam geometries with justone probe. It can be adapted to inspect adhesive bonds with widths
varying from 8 to 20 mm or 0.315” to 0.787” of the A and B side-edges.
Note: Flat coupling surfaces are necessary to ensure proper coupling of
the probe to the near-edge surface under inspection.

Advanced Bond Scanner
Knowing if your parts are adequately bonded increases productivity and ensures that product safety and quality
standards are met every time.
Waygate Technologies’ innovative Bond Scanner, in combination with the Krautkrämer Mentor UT Phased Array flaw
detector, provides a fast, easy-to-interpret, and accurate image of bond conditions. This solution allows the inspector
to evaluate the bond seams’ overall width and identify misaligned bond lines or areas that lack adhesive.
The Bond Scanner can be used in all industry sectors where bond lines must be assessed.

How Bond Scanner Works
The device is simply clamped onto two body panels joinedby a bond seam and enables one-handed scanning.
Ultrasound is reflected at interfaces between materials ofdifferent acoustical impedances, with the magnitude ofreflection determined by these differences in the adjoining
parts. In this way, the reflection at the back side of the Bond
Scanner’s top plate will vary, depending on whether adhesive is present.
The difference in the reflected ultrasound is thenpositionally recorded and evaluated, and the quality of thebond line can be assessed over its complete length.

The spring-loaded encoder wheel is located on the otherside of the plate combination, ensuring the array’s position
remains stable.
This way bond lines of typical width can be viewed, andgood spatial resolution is obtained. The amplitude of thereflected ultrasound is then color-coded and mapped, firstover the array and then over the scanned area to form aC-scan – which is essentially an easy to interpret colorcoded map detailing the presence of adhesive in a fastand accurate way.

When even higher resolution is required, the Advanced Bond Scanner isthe perfect solution. With 64 elements and 0.5 mm / 20 mil pitch, it provides
the detail that any next-level quality standard might require.

Pair Bond Scannerwith Krautkrämer Mentor UT
For consistency across the inspection process, Bond Scanners are ideallypaired with the Krautkrämer Mentor UT flaw detector. The user-defined
workflows walk the inspector through every step of instrument setup —from probe selection and calibration to reporting. With the Mentor PC Livesoftware, the instrument is connected to a PC through Wifi or ethernet
which is especially helpful when the operator is at a different location.
Mentor PC Live performs the instrument’s functions from the PC, withthe bonus that setup and data files are saved directly on the PC.

Fast Results & Accurate
Analysis
Wherever any adhesive is missing on the back side of the
top plate being scanned, the ultrasound is reflected almost
completely. These high-amplitude areas are shown in red,
while areas in which less sound is reflected are shown ingreen. Because the adhesive is applied in such an amountthat it forms a predetermined bond seam, the width of thisbond seam is also of interest.
Additionally, isolated red areas can be identified in theC-scan, representing meander-shaped areas that lackadhesive.

Bond Scanner is also available separately.

Technical Details and Accessories
Part
NumberFrequency

Elements

Connector
Type

Inspected PartFlex Bond Scanner

0600325

10MHz

321 mm / 39 mil

Tyco

A side-edge

Adjustable Bond Scanner

060056710MHz

32

0.62mm / 24 mil

Tyco

A/B side-edge

Advanced Bond Scanner

060018110MHz

640.5 mm / 20 mil

Tyco

A side-edgePitch

Waygate Technologies offers special probes on request for different types of the bond seam inspection.
BondScanner

Mentor UT
Base Kit

Spare Foil

Calibration Block

PA Connector
AdapterPresentation
ModulePackage A
Flex Bond Scanner

0600325

100N3883

06001990600329

Mentor-UTADP32-T

118M1844

Package B
Adjustable Bond Scanner

0600567

100N3883

06006020600329

Mentor-UTADP32-T

118M1844

Package C
Advanced Bond Scanner

0600181

100N3883

06001990600329

Mentor-UTMUX-T–All packages include the Krautkrämer Mentor UT instrument with Bond Scanner probe for the inspection of contoured parts.
All related accessories such as a calibration block and spare foil are also included, for a successful inspection straight out ofthe box.

Accessories
MUX-Module: Mentor-UT-MUX-T
Compatible with up to 128 el. Arrayswith Tyco connector. Also includes extra
hot swappable battery, HDMI, andethernet ports.
Mentor-UT-ADP32-T
Compatible with 32 element arrayswith standard Tyco connector

Presentation Module: 118M1844
Allows connection of an externalmonitor via HDMI. In addition it provides
encoder-, ethernet- & USB-connection.

For more detailed information, please visit our website or contact us.

waygate-tech.com

Copyright 2021 Baker Hughes Company. All rights reserved.
BHHK38505 (03/2021)

The Splitter Box allows to connect
multiple Bond Scanner probes tothe Mentor UT. This flexible solution
allows the operation with different
probes at the same time without
disconnection and connectionof probes during the inspection.
The Splitter Box consists of a “Base Box” that isconnected do the Mentor UT device.
To connect the two Bond Scanner probes LA-1032 Flex and LA-10 32 8-20, two 32 Element Channel
Boxes are attached to the Base Box (MUX-Modulerequired).
Part numbers:
UA600638 Base Box   
UA600496 32 Channels Box
UA600497 64 Channels Box