Infineon’s solution for
instrument cluster and digital cockpit
Towards a next in-vehicle user experience

www.infineon.com

Head unit & cockpit

Introduction
Instrument Cluster, Head Unit, and Cockpit Domain
Controller are the central-control and user-interface
systems that manage and deliver driving information andentertainment to the driver and passengers – all throughaudio and video interfaces, control elements such as touch
screen displays, button panels, voice commands, andmore. Telematics plays an important role in autonomous
driving and service-over-air updates for vehicle safety andsecurity.
Now and for the foreseeable future, in-car electronic
performance is a major decision of driver when purchasing
a new car. Vehicles have evolved from hardware-driven
machines to software-driven electronic devices. Throughthis trend, the importance of electronics and softwareis increasing. System complexity has become a major
challenge for automotive electronics designers; engineers
must continue to add new connectivity solutions, newcomfort applications, and advanced driver assistancesystems. The differentiation will focus more on the userinterface and experience elements powered by advancedelectronic devices and application software.
Intuitive Human-Machine Interface (HMI) sensing, seamlesswireless connection, secured data access, reliablehigh-performance computing and storage are all key
technologies provided by Infineon that can significantly
enhance the in-vehicle customer experience. Together
with the leading and full-spectrum portfolio of all power
technologies, Infineon’s products will provide reliable andhighly efficient solutions for your automotive infotainment
applications.
Below we dive deeper into Instrument Cluster, Head Unit, &Cockpit Applications and Solutions.

2Instrument cluster

Instrument cluster
application and solutions
The Instrument Cluster is a system to display importantvehicle operation information to the driver such as vehicle
speed, fuel level and the status of various other vehicularsystems.
With consumers’ increased use experience requirements,
instrument clusters are evolving from analog gauges tohigh-graphic resolution digital clusters. Infineon products
for instrument clusters address following major market
trends in:› Rich graphics, with cost-competitive scalable solutions

with respect to graphics performance, memory, peripherals, security and functional safety to enable all cluster
categories from 2D hybrid clusters to 3D reconfigurable
digital clusters with low system power consumption.
› Functional safety, with TRAVEO™ T2G microcontroller
families and SEMPER™ NOR Flash memory to achieve the“ASIL-B” safety level specified by ISO 26262.
› Security, with the integrated Hardware Security Module(HSM), TRAVEO™ T2G microcontroller families support onchip security compliant to the EVITA Full standard.
› Firmware update over-the-air (FOTA), with dual bankmemory split and integrated HSM, TRAVEO™ T2G microcontroller families support secure software image updatein the background without interruption of service.

3Instrument cluster

System benefits› Scalability: Full range of product offerings for instrument
clusters: MCU, memory and power products; TRAVEO™
T2G MCUs enable scalable instrument cluster solutions
with optimized system cost, from 2.3” to 3.5” dot matrix
instrument clusters (resolution 320 x 240), up to dual
display 8” to 12 “ virtual instrument clusters(resolution 1920 x 720).
› Functional Safety: Hardware (TRAVEO™ T2G graphic
MCU, SEMPER™ NOR Flash™) and software are both incompliance with ISO 26262 ASIL-B functional safety.

› Secured Updatability: Enhanced vehicle secure updat-ability with TRAVEO™ T2G MCU Hardware Security Module(Evita Full HSM) and embedded read-while-write memory,plus external SEMPER™ NOR Flash, which allows for theexecution of software (read) while programming (write)
for secured Firmware-Over-The-Air (FOTA) updates.

Suggested products
Product type

Description

Microcontroller

TRAVEO™ T2G CYT2Cx/3Dx/4Dx Cluster MCU Series
TRAVEO™ T2G CYT2Bx/3Bx/ CYT4Bx Body MCU Series

SEMPER™ NOR FlashSEMPER™ NOR Flash, HYPERBUS™ NOR Flash, Standard SPI NOR Flash Families

HYPERRAM™ 2.0

HYPRRAM™ 2.0 pseudostatic RAM

Power Supply IC

OPTIREG™ PMIC, Linear, Switcher and System Basis Chips (SBC)

In-vehicle-networking

OPTIREG™ System Basis Chip Family, CAN, LIN Transceivers

Software

AUTOSAR 4.2.2 SW (ASIL-B), Graphics software including Graphic Driver, JPEG Decoder Driver, Functional Safety Software.

4Instrument cluster

Hybrid cluster system – block diagram+12 V from battery

Linear supply
CAN bus
LIN bus

NOR flash

CAN transceiver

HyperRAM

LIN transceiver

DDR

Ethernet
PHY/switch

NAND flash

Ethernet

CXPI bus

PMIC

Microcontroller

MemoryCXPI transceiver
LCD & OLED drivers

ESD and surge
protection
I/O Expansion

LEDs

Display(main)

Display(HUD)

Camera3D digital cluster system – block diagram+12 V from battery

Linear supply
CAN bus
LIN busEthernet

PMIC

PMIC

CAN transceiver
LIN transceiver

Microcotroller(companion)

Ethernet
PHY/switch
NOR flashApplication
processor

HyperRAMCXPI bus

CXPI transceiver

DDR
NAND flash
MemoryESD and surge
protection
LEDs

LVDS
Display(main)

Display(HUD)

CameraTo know more on Instrument clusters click here:
https://www.infineon.com/cms/en/applications/automotive/infotainment/instrument-cluster/5

Head unit & cockpit

Head unit & cockpit
application and solutions
The Head Unit is an electronic control unit (ECU) in cabin,which provides driving information and entertainment todriver and passengers, from audio, touchscreen displays
to navigation, connectivity and cloud-based services. It
interacts with driver and passengers through various Human-Machine Interface (HMI) technologies, such as touch
screen, voice commands and gesture recognitions.
With the automotive E/E architecture is shifting to software-defined-vehicles, domain controllers or higher-performance computer integrate multiple functions. Such as theCockpit seamlessly integrated the functions of Head Unit,Cluster, Head Up display, rear seat entertainment and audio processing functions into one ECU, which interacts witha vehicle ethernet backbone. Especially the technologies
such as 5G, cloud computing, Internet of Things (IoT), andself-driving are appearing in cars, people expect higher-resolution displays and “full-time connected” when sitting
in cars, so the Cockpit is reimagined as a more social andconnected space to support better user experience.

Infineon, as the number one semiconductor supplier in theautomotive industry, continues to develop new technologies and products to enable customers’ innovation and success. Our extensive products help to develop modern Head
Unit and Cockpit systems to meet future trends.

› Computing: We offer a very comprehensive Automotive

MCU portfolio, from TRAVEO™ MCUs based on ARM Cortex
M cores, featuring up to 8MB of flash, supporting ASIL-B
that are designed for low power covering the low to midend systems to the well-known AURIX™ MCUs with theirpowerful Tricores, supporting functional safety up toASIL-D, 16 MB of flash, offering high performance andfulfilling requirements up to the very high end of MCUapplications.
› Touch & Capacitive Sensing: With cutting-edge touchsensing technologies, Infineon provides a wide range ofsensing products including the PSoC Automotive Multitouch touchscreen controller for high-resolution displays
and PSoC® 4 SoC for touch button or slider controller.

6

Head unit & cockpit› Audio Sensing: Infineon’s automotive qualified XENSIV™

System benefits› Scalability: Scalable family solutions with wide compatibilities on both hardware and software support designs
from low to high-end systems with less design efforts.
› Performance: Best-in-class performance of sensing
solutions (touchscreens, microphones, etc.), wirelesssolutions (Wi-Fi & Bluetooth) and fast-charging solutions(USB-C PD) improve customer experience significantly.
› Security: Secured MCU, secured memory and securedconnectivity support secured Firmware update Over-theair (FOTA), and safeguard the consumers from cyber-attacks.
› Safety: TRAVEO™ T2G cluster MCU solution provides
ASIL-B functional safety to cluster display via adding
safety overlays on 3D SoC display contents; REAL3™ ToF
3D image sensor supports vision based in-cabin-monitoring-system (ICMS) solution, and XENSIV™ 60 GHz radarbility and compliance with all kinds of mobile devices.
› Storage: Broad automotive qualified NOR-Flash, SRAM
and F-RAM portfolio provide safe, secure, and reliabledata storage.

(+ AURIX™ MCU) provides total solution for radar basedICMS.
› Total cost of ownership: Broad portfolio provides onestop-shop on both commercial and technical whichsignificantly reduce purchase cost as well as the systemdesign efforts.

silicon microphone enables distortion-free audio capturing for all speech-related applications, improving speech
intelligibility for voice recognition algorithms.
› In-cabin Sensing: Infineon’s REAL3™ ToF sensors andhighly integrated mmWave XENSIV™ 60 GHz radar sensor
brings innovative, intuitive and robust depth sensing
capabilities to many in-cabin sensing applications suchas DMS (Driver Monitor System), ICMS (In-Cabin-Monitor-System) and OMS (Occupant-Monitor-System)› Connectivity & Communication: Broad Wi-Fi & Bluetooth
portfolio supports various in-cabin wireless connections;
CAN, LIN transceivers and System Basis Chips (SBC) families connect head unit to in-vehicle-networking.
› Power supply: OPTIREG™ PMIC, Linear, Switcher and support reliable power supply; USB-C PD controllers support
fast charging (up to 100 W) with best-in-Class interopera-

Suggested products
Product type

Description

Microcontroller

TRAVEO™ T2G CYT2Bx/3Bx/4Bx Body MCU Series
TRAVEO™ T2G CYT2Bx/3Bx/ CYT4Bx Body MCU Series

Microcontroller

AURIX™ TC2xx/TC3xx Family

Touch screen/buttonPSoC Automotive Multitouch, PSoC® 4 Programmable embedded System-on-Chip

Wi-Fi & bluetoothCYW89570, CYW89570XR, CYW89459, CYW89373, CYW89072, CYW89820

Power Supply IC

OPTIREG™ PMIC, Linear, Switcher and System Basis Chips (SBC)

In-vehicle-networking

OPTIREG™ System Basis Chip (SBC) Family, CAN, LIN Transceivers

Memories

SEMPER™ NOR Flash, HYPERRAM™ 2.0

USB-C PD controller

EZ-PD™ CCG7D, EZ-PD™ CCG7S

MEMS microphoneXENSIV™ MEMS microphone, IM67D120A, IM67D130A

Image sensor & 60 GHz radar

REAL3™ ToF image sensor, XENSIVTM 60 GHz radar sensors

Security controller

SLI37CMXXX family

Safety cluster

TRAVEO™ T2G CYT2Cx/3Dx/4Dx Cluster MCU Series

Software

AUTOSAR MCAL/FEE, Safety software for AURIX™ to support up to ASIL-D7

Head unit & cockpit

Head unit system – block diagram+12 V from battery

Power supply
Linear supply
CAN bus
LIN busEthernet

Antenna supplies

Multi-stage power supply
PMIC

PMIC

CAN transceiver

TPM 2.0

LIN transceiver

Secure element
Security controller

Ethernet PHY/switch
Communication
Automotive
MOSFET

LED driver

F-RAM
Audio processor
HyperRAM

Peripheral

MemoryTouchscreencontroller
Control buttonHallswitches

Angle

3D
imageSlider

Buttons

Gesturecontrol

RFtransistor

Wirelesscontrol

Wireless communication

USB

ESD andsurge protection

Antennatuner

Wi-Fi IEEE 802.11 ac/ax
2.4 GHz 5 GHz

Automotive wirelesscombo (Wi-Fi, BT)GPU
NOR flash

5G/LTELNA

2nd Bluetooth

NAND flash

Gate driver

GNSS
LNA

Antenna module
Application
processor

DDR-RAM
Microcontroller

RFswitch

GNSS(GPS, Galileo,Beidou)

BT5.x

USB-C
power delivery
controller
Class-Daudio amplifier
MEMS microphone

A2B

Audio
LVDS line driver
timing controller

HMI

To know more on Head-unit solutions click here:
https://www.infineon.com/cms/en/applications/automotive/infotainment/head-unit/
8Head unit & cockpit

Cockpit system – block diagram+12 V from battery

Power supply
Linear supply

CAN bus
LIN busEthernet

Antenna supplies
Multi-stage power supply
PMIC

PMIC

CAN transceiver

TPM 2.0

LIN transceiver

Secure element
Security controller

Ethernet PHY/switch
Communication
Automotive
MOSFET

LED driver

F-RAMUSB
Audio processor
ESD andsurge protection

HyperRAMMemory

Peripheral

Touchscreen
controller

Antennatuner

RFtransistor

Wirelesscontrol
Wi-Fi IEEE 802.11 ac/ax
2.4 GHz 5 GHzAutomotive wirelesscombo (Wi-Fi, BT)

Wireless communicationGPU

NOR flash

5G/LTELNA

2nd Bluetooth

NAND flash

Gate driver

GNSSLNA

Antenna module
Application
processor

DDR-RAM
Microcontroller

RFswitch

GNSS(GPS, Galileo,Beidou)

BT5.x

USB-C
power delivery
controller
Class-Daudio amplifier
MEMS microphone

A2B

Audio

Audio bus

Safety/security island

SliderHallswitches

ButtonsAngle

3D image

60 GHzradar

Instrument
cluster
Head-updisplay
Electronic
mirrorGesturecontrol

3D
image

Drivermonitoring

Occupant
monitoring

ADAS frontcamera

MEMS mirror
MEMS driver

Control button

Center stackdisplay
LVDS line driver
timing controller
Passenger andrear set
entertainment

HMITo know more on Cockpit solutions click here:
https://www.infineon.com/cms/en/applications/automotive/infotainment/cockpit/
9

Infineon Automotive
We make cars clean, safe and smart.
The ATV division is shaping the future of mobility byenabling clean, safe, and smart cars. Its product andsolution offering is powering the transition to hybrid
and all-electric vehicles. It is supporting the nextstages of automated driving as well as higher levels ofconnectivity, digitalization, and security in today’s cars.
ATV drives safety, digital cockpit, infotainment, comfort,and lighting innovations. Its portfolio integrates sensors,microcontrollers, high-performance memories for specificapplications, power semiconductors based on silicon (Si)and silicon carbide (SiC), as well as components for humanmachine interaction and vehicle connectivity. Infineon is
the world leader in automotive semiconductors

To know more visit our Automotive solutions page:https://www.infineon.com/automotive

The automotive industry is currently undergoing extreme
transformation. More changes are expected in the next
five years than in the past 20 combined. Semiconductor
suppliers like Infineon are essential to enabling these mega
trends a reality. Our goal is to make the car of the futurea reality: all-electric and autonomous, fully connected,
always online and cybersecure.
Infineon’s automotive product portfolio is the industry’s
broadest – ranging from sensors, microcontrollers andhigh-performance memory for specific applications all
the way to power semiconductors and devices for humanmachine interaction and vehicle connectivity.

Where to buy
Infineon distribution partners and sales offices:
www.infineon.com/WhereToBuy

Service hotline
Infineon offers its toll-free 0800/4001 service hotline as one central number,available 24/7 in English, Mandarin and German.

› Germany ................. 0800 951 951 951 (German/English)› China, mainland ...... 4001 200 951 (Mandarin/English)› India ........................ 000 800 4402 951 (English)› USA . ....................... 1-866 951 9519 (English/German)› Other countries ....... 00* 800 951 951 951 (English/German)› Direct access .......... +49 89 234-0 (interconnection fee, German/English)* Please note: Some countries may require you to dial a code other than “00” to access this international number.
Please visit www.infineon.com/service for your country!

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Published byInfineon Technologies AGAm Campeon 1-15, 85579 Neubiberg
Germany© 2022 Infineon Technologies AG
All rights reserved.

Date: 07 / 2022

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