Events and Seminars
PR2020148

Socionext to Showcase Leading-Edge SoC Design Solutionsat DesignCon 2020
Featuring Data Center High-Performance ASIC, Advanced Packaging Technology, ADC for 5G
Wireless, and Computer Vision AI
Yokohama January 23, 2020 --- Socionext Inc., a world leading silicon supplier, will feature
its advanced SoC designs including 112G SerDes, 120+ GS/s ADC/DAC, PCIe Gen5, highperformance memory, multi-die package design solutions, and AI technology at the annual
DesignCon conference, Jan. 28 – 30, at the Santa Clara Convention Center, Booth 1234.
AI applications running on the cloud data center demand greater interconnect bandwidth,larger on-chip memory, and ultra-low latency. Socionext provides extended 2.5/3D HBM+,
multi-die packaging, and advanced process node solutions for meeting and exceeding theseemerging requirements.
At this year's DesignCon, Daniel Lambalot, Director of Engineering at Socionext, along withexperts from Micron and and Cadence Design Systems, will be addressing such design
complexity by delivering a presentation on "Designing Next Generation Memory Interfaces:
Modeling, Analysis, and Tips" on Wednesday, Jan 29, 2020 from 2:00-2:45 PM at Ballroom A.
See https://schedule.designcon.com/session/designing-next-generation-memory-interfacesmodeling-analysis-tips/868327 for more information.
Additionally, two members from Socionext will be presenting at the Ansys booth 745(https://www.ansys.com/other/designcon). On Thursday, Jan 30 at 3:00 PM, Daniel Lambalot
will explain challenges of designing 112Gbps channels via a presentation titled “Modelling andmeasurement correlation for a 112Gbps package + PCB using HFSS and SIWave with HFSS
regions”. On the same day at 4:30 PM, Takafumi Shimada, Electromagnetic Analysis Specialistat Socionext, will present “Automating the Multi-Physics Simulation Process for LSI-PackageBoard” and introduce Socionext’s latest simulation automation and parametrics verification
process of pre-design interconnects.

Socionext Inc.

https://www.socionext.com/en/contact/
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PR2020148

Sample of an FC-PBGA CPU Design for High-end Server

Socionext will showcase superior-quality, high-performance, multi-die package methodology
and designs. Offerings include FanOut Wafer Level Packaging (FOWLP), RF/mmWave
solutions, and multi-die chiplets supporting a wide range of process nodes, interconnect anddie-to-die (D2D) interface. Furthermore, Socionext offers Antenna-in-Package (AiP) which
addresses the needs of the IoT and 5G telecom markets requiring miniaturization and antenna
integration to the same package over the silicon. Socionext’s advanced packaging capabilities
help companies quickly and cost-effectively fullfull their complex packaging requirements.
Socionext offers a high-performance SerDes macro with up to 112Gbps per channel for up to400G networks. These capabilities are further extended by utilizing the company’s ultra-highspeed ADC & DAC technologies, a key component in coherent and direct detect optical
networking SoCs enabling Terabit (Tbps) datacenter interconnect (DCI) solutions for
hyperscale cloud operators.
Network providers need to quickly stay ahead of the growing, on-demand, content driven
environment with the emergence of 5G. With the need for super-fast AI computational speed
and performance, 400G adoption will drive the need for increased PCIe Express bandwidth
replacing 100G/200G based network infrastructure. Socionext offers PCIe Gen5 technology forbridging the IO gap between Server CPUs and the host bus adapters that create the 400G
network.
"With ASIC development on the rise, Hyperscale cloud service providers expect their vendor toprovide a complex SoC along with a full complement of drivers and firmware," said BobWheeler, Principal Analyst for Networking at The Linley Group. "ASIC vendors, such as
Socionext, now must provide SoC blocks including high-speed interfaces, CPU subsystems,
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In addition to offering cutting edge IP, Socionext is developing ASICs on the leading 7nm /6nm / 5nm process technology. In the mean time, the company is engaging with top
foundries to develop products on the next generation technology. Socionext continues to be at
the technology forefront in order to support its customers who are using leading edge process
nodes for applications in high performance data center and low power mobile devices.
The company will also demonstrate a video solution for analyzing live video streaming. The
computer vision system is powered by the Socionext SynQuacer SC2A11, a scalable, ARM®based multi-core processor, designed to support the most demanding edge computing andreal-time data processing applications. It enables real-time video input processing, andprovides an easy-to-use interface for managing multiple IP video streams.
Socionext will be raffling great prizes at DesignCon, so stop by booth#1234 to learn more!
For the DesignCon website and programs, visit http://www.designcon.com/
About Socionext Inc.
Socionext is a global, innovative enterprise that designs, develops and delivers System-on-Chip solutions tocustomers worldwide. The company is focused on technologies that drive today’s leading-edge applications inconsumer, automotive and industrial markets. Socionext combines world-class expertise, experience, and anextensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers.
Founded in 2015, Socionext is headquartered in Yokohama, and has offices in Japan, Asia, United States andEurope to lead its product development and sales activities. For more information, visit www.socionext.com.

About Socionext America Inc.
Socionext America Inc. (SNA) is the US branch of Socionext Inc. headquartered in Santa Clara, California. The
company is one of the world’s leading fabless ASIC suppliers, specializing in a wide range of standard andcustomizable SoC solutions for automotive, consumer, and industrial markets. Socionext provides customers
with quality semiconductor products based on extensive and differentiated IPs, proven design methodologies,and state-of-the-art implementation expertise, with full support.
For product information, visit our website, e-mail sna_inquiry@us.socionext.com or call 1-844-680-3453. Forcompany news and updates, connect with us on Twitter, Facebook and YouTube.

###Press Contacts
Sherry Chen

Dick Davies

Socionext America Inc.

IPRA

1-408-675-1945

1-415-652-7515

sna_pr@us.socionext.com

ipra@comcast.com

All company or product names mentioned herein are trademarks or registered trademarks of their respective
owners. Information provided in this press release is accurate at time of publication and is subject to change
without advance notice.

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