AN11046
Recommendations for PCB assembly of DSN0603-2
Rev. 3 — 30 September 2016

Application note

Document information
Info

Content

Keywords

DSN0603, DSN0603-2, SOD962, 0603 package size, reflow soldering,
surface mount, solder paste, stencil aperture, Printed-Circuit Board (PCB),
Solder Mask Defined (SMD), footprint, landing pattern, pick and place,Chip-Scale Package (CSP)

Abstract

This application note provides guidelines for board assembly of theultra-small DSN0603-2 (0.6  0.3 mm2) chip-scale package. The main
focus is on recommendations for reflow soldering.
For general information about footprint design and reflow soldering, seeapplication note AN10365 (Surface mount reflow soldering description).
If not otherwise stated, all measurement units given in this document are
metric units. This means that also the package nomenclature (for example
the term "0603") refers to metric units.

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

Revision history
Rev

Date

Description

1

20120601

Initial version

2

20150923

Completely revised document3

20160930

Section 1: added comment on tilting and occupied area

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

2 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

1. Introduction
Due to the trend of reduced dimensions and increased density of functionality insmartphones and other mobile devices, there is an increasing request from the industry
for extremely small components. Nexperia supports this trend with the new DSN0603-2(SOD962) package. It is an ultra small surface-mount chip-scale diode package with asize of only 0.6 mm ×0.3 mm ×0.3 mm (0603 as metric; 0201 in inches).
Due to the very small size of the component, Nexperia investigated the board
assembly process intensively in order to offer board mounting recommendations.
This includes PCB mounting pads, stencil apertures, solder paste and board assembly
process parameters.
Using the recommended dimensions for pads and stencil as described in thisdocument helps to achieve:• optimum stand-up height• minimum tilt
• minimum rotation• good board assembly process performance
While this application note helps minimizing any unexpected failures, following the advice
in this document is not a guarantee for a perfect Surface-Mount Technology (SMT)
assembly result. The results may differ depending on the machine capability, ambientconditions, material, etc.
Deviations from this recommendation might result in non-optimal solder results, e.g.
increased tilting. Especially, the application of a larger amount of solder paste might leadto increased tilting and a larger occupied area on the PCB than described in the
SOD962 package document (http://www.nexperia.com/documents/outline_drawing/
SOD962-2.pdf).

2. DSN0603-2 (SOD962): package details
DSN0603-2 (SOD962) is a Discrete Silicon No-leads (DSN) package. It features either
electro-plated copper-tin (CuSn) contacts (CuSn pillars) or electroless plated
nickel-palladium-gold (NiPdAu) contacts (pads) under the package (bottom terminations)similar to Discrete Flat No-leads (DFN) style packages. The DSN-style package allows
100 % utilization of the package area for active silicon, offering a significant performanceadvantage per board area compared to products in plastic-molded packages.
Key Features:• Ultra small and flat package (0.6  0.3  0.3 mm3)
• 400 m pad pitch• Pad size 240  240 m2
The visual appearance of DSN0603-2 (SOD962) is shown in Figure 1 whereas Figure 2
shows the package dimensions.

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

3 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

Fig 1.

DSN0603-2 (SOD962): visual appearance
Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm

SOD962-2

L

1

2

b

e1

A
A1

E

D

(1)

0

0.5 mmscale

Dimensions (mm are the original dimensions)
Unit
mm

A

A1

b

D

E

e1

max 0.32
nom
min 0.28

0.03

0.25 0.325 0.625

L
0.15

0.4
0.23 0.275 0.575

0.13

Note
1. The marking bar indicates the cathode.
Outlineversionsod962-2_po

References
IEC

JEDEC

JEITA

Issue date
13-07-12
13-07-17

SOD962-2

Fig 2.

Europeanprojection

DSN0603-2 (SOD962): package dimensions

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

4 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

3. PCB solder pattern
3.1 Solder pad design: general options
There are two types of solder pad / solder resist designs:
Solder Mask Defined (SMD) and Non-Solder Mask Defined (NSMD).
SMD is a method of designing the solder resist to partially overlap the copper (Cu) landing
pattern on the PCB. NSMD designs have a gap between the solder resist and the Cu
landing pattern on the PCB. These two types are described in more detail in the next
chapter.

3.1.1 SMD solder pad versus NSMD solder pad
If the solder mask extends onto the solder lands, the remaining solderable area is Solder
Mask Defined (SMD). The effective solder pad is equal to the copper area that is notcovered by the solder mask. This situation is illustrated in Figure 3, left column. In case of
an SMD pad, the copper will normally extend 75 m down to 50 m underneath the solder
mask on all sides. In other words, the copper dimension is 0.1 mm to 0.15 mm larger than
the solder mask dimension. These values may vary depending on the class of PCBs
used. This allows tolerances in copper etching and solder mask placement during PCB
production.
If the solder mask layer starts outside of the solder lands, and does not cover the copper,
this is referred to as Non-Solder Mask Defined (NSMD). The effective solder pad is equal
to the copper area. In case of an NSMD, the solder mask should be at least 50 m awayfrom the solder land on all sides. In other words, the solder mask dimension is 100 mlarger than the copper dimension. These values may vary depending on the class of
PCBs used. The main requirement is that the solder mask is sufficiently far away from thecopper, such that - with the given tolerances in solder mask application - it does notextend onto the copper. An NSMD footprint is shown in Figure 3, right column.

001aac832

001aac831

a. SMD solder pad
Fig 3.

b. NSMD solder pad

Solder Mask Defined (SMD) versus Non-Solder Mask Defined (NSMD) solder pads

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

5 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

3.2 Solder pad design for DSN0603-2 packages (SOD962)
3.2.1 Recommended reflow solder footprint
Based on the small dimensions of 0603 (0201) devices and the given tolerances for PCB
manufacturing, it is recommended to use Non-Solder Mask Defined (NSMD) solder pads.
The DSN0603-2 (SOD962) solder footprint with dimensions and the solder footprint
together with the package outline are shown in Figure 4 and Figure 5.

0.28
mm

0.2 mm

0.2 mm

0.2 mmaaa-019352

Fig 4.

DSN0603-2 (SOD962): recommended reflow solder footprint
0.14 mm

0.24
mm

0.4 mmDeviceDevice pad
Cu pad on PCB

Fig 5.

AN11046

Application note

aaa-019353

DSN0603-2 (SOD962): recommended reflow solder footprint with package outline

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

6 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

3.2.2 Solder Mask Defined (SMD) footprint on PCB (not recommended)
In case that an SMD solder pad structure is absolutely needed, the recommended solder
footprints are given in Figure 6.
As mentioned above, due to the tolerances in the PCB manufacturing, an SMD solder pad
structure is not the recommended solution.

0.7 mm

0.28mm

0.2 mm

Fig 6.

AN11046

Application note

0.2 mm

0.2 mmDeviceCu lines on PCB

Device pad

Solder mask opening

aaa-019354

Solder Mask Defined (SMD) footprint on PCB

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

7 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

4. Solder stencil
4.1 Stencil recommendations
Due to small apertures and pad dimensions, use a high-quality stainless-steel stencil
manufactured by laser-cut and with electropolish or plasma coating.
The recommended stencil thickness is 100 µm or thinner for the DSN0603-2 package.
For the DSN0603-2 (SOD962) recommended Nexperia footprint (see Section 3.2.1,
Figure 4 and Figure 5), the optimum stencil aperture is shown in Figure 7.

0.256
mm

0.256 mm0.16 mm0.256 mmaaa-019355

Fig 7.

Recommended stencil aperture for DSN0603-2 (SOD962)

Figure 8 shows the stencil opening in combination with the recommended Nexperia
footprint and the device pad area. Figure 9 shows the stencil and solder mask opening incase of a Solder Mask Defined (SMD) PCB footprint which is not the recommended
footprint solution (see Section 3.2.2).

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

8 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

0.2 mm

0.2 mm

0.2 mm

0.28
mm

0.256
mm

0.256 mm0.16 mm0.256 mm

Device pad

Cu pad on PCB

Stencil openingFig 8.

AN11046

Application note

aaa-019356

Stencil opening in combination with Cu pads on PCB and the device pads

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

9 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

0.7 mm

0.28
mm

0.256
mm

0.2 mm

0.2 mmDevice pad

Cu lines on PCB

Stencil opening

Solder mask opening

0.2 mmaaa-019357

SMD footprint on PCB is not the recommended solution

Fig 9.

AN11046

Application note

Stencil and solder mask opening in case of an SMD footprint on PCB

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

10 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

4.2 Stencil aperture design
Area and aspect ratio are key design-guidelines for stencil apertures. Due to the small
size of DSN0603-2 (SOD962), the requirements on the area ratio are higher than forlarger form factors. Nexperia stencil recommendations give an area ratio of 0.64.
Smaller values are possible with adequate process control. The lower limit for the area
ratio depends on the manufacturing environment and other requirements of the
manufacturer.
The aspect ratio should be > 1.5 which is less critical to fulfill. Nexperia stencil
recommendations give an aspect ratio of 2.56.
For explanation of area and aspect ratio, refer to Figure 10.

Cross -sectional view of a stencil
aaa-019083

of aperture opening
LW
Area ratio = area---------------------------------------------------------- = -------------------------------------area of aperture walls
2  L + W  T
Wwidth of the aperture
Aspect ratio = --------------------------------------------------------------- = -----  1 5
T
thickness of the stencil foil
Fig 10. Explanation of area and aspect ratio
Table 1.
Area and aspect ratio for stencil apertures as recommended
Stencil thickness T = 100 m
Nexperia recommended footprint Aperture size
DSN0603-2 (SOD962)

256 m2  /4

Area ratio
target > 0.62

Aspect ratio
target > 1.5

0.64

2.56

Table 1 shows the values for aspect and area ratio of the optimum stencil apertures with astencil thickness of 100 µm. It results in acceptable area ratios for the Nexperia footprint
recommendations.

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

11 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

5. Solder paste
Besides stencil aperture and thickness, the used solder paste has a significant impact on
the printing performance. As shown in Table 2, solder pastes are available in different
solder powder grain sizes.
Table 2.

Solder paste types

Type

Powder grain size in mLess than 0.5 %larger than

10 % max. between 80 % max between

10 % max. less
than

1

160

150-160

75-150

75

2

80

75-80

45-75

45

3

60

45-60

25-45

25

4

50

38-50

20-38

20

5

40

25-40

15-25

15

6

25

15-25

5-15

5

7

15

11-15

2-11

2

Use a solder paste type 4 and higher (smaller grain size) in combination with a stencil
aperture thickness of 100 m for the DSN0603-2 (SOD962) package. As solder paste issensitive to age, temperature, and humidity, follow the handling recommendations of thepaste manufacturer.

6. Soldering process
For soldering of DSN0603-2 package, following standard reflow processes and typicaltemperature profiles are suitable:• Convection reflow under nitrogen atmosphere is preferred to improve the solder
wetting.

• Convection reflow under air atmosphere also works, but solder joint surfaces arerough, flux residues often become darker and the soldering behavior may deteriorate.

• Vapor phase soldering is also possible.
A reflow solder profile for tin-silver-copper alloys, so-called SAC alloys (SnAg3.8Cu0.7)
based on the IPC/JEDEC joint industry standard J-STD-020D is recommended. Refer toFigure 11 and Table 3.

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

12 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

temperaturetp
critical zone
TL to Tp

Tp
ramp-up
TL

tL

Tsmax

Tsmin
ramp-downtspreheat

25 °C
time

T25 °C to peakaaa-019084

Fig 11. Reflow solder profile based on IPC/JEDEC J-STD-020D
Table 3.

Pb-free profile feature and specification based on IPC/JEDEC J-STD-020D

Profile feature

Values for Pb-free assembly

Average ramp-up rate (Tsmax to Tp)

3 C/s maximum

Preheat
Minimum temperature (Tsmin)

150 C

Maximum temperature (Tsmax)

200 CTime (ts) from Tsmin to Tsmax

60 s to 180 s

Liquidus temperature (TL)

217 CTime (tL) maintained above TL

60 s to 150 s

Peak/classification temperature (Tp)

260 CTime within 5 C of actual peak temperature (tp)

10 s to 30 s

Ramp-down rate

6 C/s maximum

Time 25 C to peak temperature (t25°C to peak)

8 minutes maximum

7. Handling recommendations
Besides the PCB and stencil design requirements, the ultra small size of the DSN0603
and as consequence the low weight of the component requires that some attention be
paid to the pick and place (P&P) process. Electrostatic charge may cause problems
during the pick and place (tape out) process. Nexperia has implemented preventive
measures such as using a conductive plastic carrier tape (embossed tape).
For rework, use equipment suitable for the ultra small package size and for handling baresilicon devices. Manual handling with tweezers (e.g. for repair) is not recommended.

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

13 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

8. Summary
8.1 Recommended solder footprint and stencil aperture
The recommended solder footprint including stencil aperture is shown in Figure 12 for
DSN0603-2 (SOD962).

0.2 mm

0.2 mm

0.2 mm

0.28
mm

0.256
mm

0.256 mm0.16 mm0.256 mmCu pad on PCB

Stencil opening

aaa-019916

Recommended stencil thickness: 100 m or thinnerFig 12. DSN0603-2 (SOD962): solder footprint and stencil aperture

8.2 Further recommendations
8.2.1 Stencil layout and solder paste• Stencil thickness of 100 m or thinner in combination with type 4 solder paste (refer toTable 2) is recommended.

• A stencil aperture dimension as shown in Figure 7 and Figure 12 is recommended for
DSN0603-2 (SOD962).

• To get best printing (and soldering) results, control the cleaning cycle of the stencil.
8.2.2 Solder pad design• Non-Solder Mask Defined (NSMD) pads with a gap between Cu pad and solder resistof 50 m are recommended.

• Conductor (Cu trace) between solder pads on PCB is not recommended.
• Do not connect solder pads by -via.
• Connection by Cu traces (lines) is preferred.

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

14 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

8.2.3 Soldering process• Convection reflow under nitrogen atmosphere is preferred.
• Convection reflow under air atmosphere also works, but:
– Using an unfavorable layout, products lean toward undefined tilting and rotationand solder joints tend to more voiding.
– Solder joint surfaces are rough, flux residues often become darker and thesoldering behavior may deteriorate.

• Vapor phase soldering is also possible.
8.2.4 Handling recommendations• Manual handling with tweezers (e.g. for repair) is not recommended.
• Keep control of thawing time of solder paste bundle to avoid too much humidity inpaste.

• To prevent drying of flux in solder paste, maintain the relative humidity of shop floor atsolder paste print until reflow to 40 % to 60 %.

• Relative humidity of shop floor at pick and place > 30 %.

AN11046

Application note

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

15 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

9. Legal information
9.1

Definitions

Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included
herein and shall have no liability for the consequences of use of suchinformation.

9.2

Disclaimers

Limited warranty and liability — Information in this document is believed tobe accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy orcompleteness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes no responsibility
for the content in this document if provided by an information source outsideof Nexperia.
In no event shall Nexperia be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Nexperia aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with theTerms and conditions of commercial sale of Nexperia.
Right to make changes — Nexperia reserves the right to make changes toinformation published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Nexperia products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-criticalsystems or equipment, nor in applications where failure or malfunction of an
Nexperia product can reasonably be expected to result in personal injury,
death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products insuch equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes norepresentation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability forany assistance with applications or customer product

AN11046

Application note

design. It is customer’s sole responsibility to determine whether the
Nexperia product is suitable and fit for the customer’s applications andproducts planned, as well as for the planned application and use ofcustomer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with theirapplications and products.
Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for thecustomer’s applications and products using Nexperia products in order toavoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Nexperia does not accept any
liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. Nexperia, its affiliates and their
suppliers expressly disclaim all warranties, whether express, implied or
statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of thisproduct remains with customer.
In no event shall Nexperia, its affiliates or their suppliers be liable tocustomer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business,business interruption, loss of use, loss of data or information, and the like)arising out the use of or inability to use the product, whether or not based on
tort(including negligence), strict liability, breach of contract, breach of warranty
or any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above andall direct or general damages), the entire liability of Nexperia, its affiliates
and their suppliers and customer’s exclusive remedy for all of the foregoingshall be limited to actual damages incurred by customer based onreasonable reliance up to the greater of the amount actually paid bycustomer for the product or five dollars (US$5.00). The foregoing limitations,exclusions and disclaimers shall apply to the maximum extent permitted byapplicable law, even if any remedy fails of its essential purpose.
Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.

9.3

Trademarks

Notice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 30 September 2016

© Nexperia B.V. 2016. All rights reserved.

16 of 17

AN11046

Nexperia

Recommendations for PCB assembly of DSN0603-2

10. Contents
1
2
3
3.1
3.1.1
3.2
3.2.1
3.2.2
4
4.1
4.2
5
6
7
8
8.1
8.2
8.2.1
8.2.2
8.2.3
8.2.4
9
9.1
9.2
9.3
10

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
DSN0603-2 (SOD962): package details . . . . . . 3
PCB solder pattern . . . . . . . . . . . . . . . . . . . . . . 5
Solder pad design: general options . . . . . . . . . 5
SMD solder pad versus NSMD solder pad . . . . 5
Solder pad design for DSN0603-2 packages(SOD962) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended reflow solder footprint . . . . . . . 6
Solder Mask Defined (SMD) footprint on PCB (notrecommended) . . . . . . . . . . . . . . . . . . . . . . . . . 7
Solder stencil . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Stencil recommendations . . . . . . . . . . . . . . . . . 8
Stencil aperture design . . . . . . . . . . . . . . . . . . 11
Solder paste . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Soldering process . . . . . . . . . . . . . . . . . . . . . . 12
Handling recommendations . . . . . . . . . . . . . . 13
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Recommended solder footprint and stencil
aperture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Further recommendations . . . . . . . . . . . . . . . 14
Stencil layout and solder paste . . . . . . . . . . . . 14
Solder pad design. . . . . . . . . . . . . . . . . . . . . . 14
Soldering process . . . . . . . . . . . . . . . . . . . . . . 15
Handling recommendations . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.

© Nexperia B.V. 2016.

All rights reserved.

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to:salesaddresses@nexperia.com
Date of release: 30 September 2016
Document identifier: AN11046