RS8761, RS8762, RS8764

250MHz, Rail-to-Rail Input/Output CMOS Operational
Amplifier
1 FEATURES

3 DESCRIPTIONS•

Unity-Gain Bandwidth: 250MHz

The RS876X families of voltage-feedback (VFB)•

Gain Bandwidth: 120MHz

products offer low voltage operation, rail to rail input•

High Slew Rate: 180V/μs

and output, as well as excellent speed/power•

Offset Voltage: 1mV typicalconsumption ratio, providing an excellent bandwidth•

Low Noise: 6nV/√Hz(250MHz) and slew rate of 180V/μs. The op-amps are•

Input Voltage Range: VDD-0.1V to VDD+0.1V
with Vs = 5V

unity gain stable and feature an ultra-low input bias
current.

•

High Output Current: >100mA•

Supply Range: +2.7V to +5.5V

These amplifiers set an industry-leading power-to-•Specified Up To +125°C

performance ratio for rail-to-rail amplifiers. The
RS876X families of operational amplifiers are

2 APPLICATIONS•

Audio ADC Input Buffers•

Photodiode Preamp•

High-Density Systems•

Portable Systems•

Driving A/D Converters•

Video Processing

specified at the full temperature range of -40°C to+125°C under single or dual power supplies of 2.7V
to 5.5V.

Device Information (1)PART
NUMBER
RS8761RS8762RS8764

SOT23-5

BODY
SIZE(NOM)
2.90mm×1.60mm

SOP8

4.90mm×3.90mm

MSOP8

3.00mm×3.00mm

TSSOP83.00mm×4.40mm

SOP14

8.65mm×3.90mm

TSSOP145.00mm×4.40mm

PACKAGE(1) For all available packages, see the orderable addendum at theend of the data sheet

REV A.1

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RS8761, RS8762, RS8764
Table of Contents
1 FEATURES ............................................................................................................................................................................... 1
2 APPLICATIONS ...................................................................................................................................................................... 1
3 DESCRIPTIONS ...................................................................................................................................................................... 1
4 REVISION HISTORY ............................................................................................................................................................. 3
5 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 4
6 PIN CONFIGURATION AND FUNCTIONS (TOP VIEW) ............................................................................................. 5
7 SPECIFICATIONS ................................................................................................................................................................... 7
7.1 Absolute Maximum Ratings .......................................................................................................................................... 7
7.2 ESD Ratings ...................................................................................................................................................................... 7
7.3 Recommended Operating Conditions ......................................................................................................................... 8
7.4 Electrical Characteristics ................................................................................................................................................ 9
7.5 Typical Characteristics .................................................................................................................................................11
8 DETAILED DESCRIPTION .................................................................................................................................................13
8.1 Overview .........................................................................................................................................................................13
8.2 Power On Requirement ...............................................................................................................................................13
8.3 Phase Reversal Protection ...........................................................................................................................................13
8.4 Gain Bandwidth Product..............................................................................................................................................13
8.5 Capacitive Load Driving Capability ............................................................................................................................14
8.6 Video Performance .......................................................................................................................................................14
8.7 Output Drive Capability ...............................................................................................................................................14
8.8 Input ESD Diode Protection .......................................................................................................................................14
8.9 Power Supply Bypassing and Printed Circuit Board Layout .................................................................................15
9 APPLICATION AND IMPLEMENTATION .....................................................................................................................16
9.1 Application Note ...........................................................................................................................................................16
9.2 Single Supply Video Line Driver .................................................................................................................................16
10 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................17
11 TAPE AND REEL INFORMATION .................................................................................................................................23

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RS8761, RS8762, RS8764
4 REVISION HISTORY
Note: Page numbers for previous revisions may different from page numbers in the current version.
VersionChange Date

Change Item

A.0

2023/04/03

Preliminary version completed

A.1

2024/05/17

Initial version completed

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RS8761, RS8762, RS8764
5 PACKAGE/ORDERING INFORMATION (1)Orderable
Device
RS8761PXF

Package Type

Pin

ChannelOp Temp(°C)

SOT23-551-40°C ~125°C

DeviceMarking (2)
8761P

SOP8

8

2

-40°C ~125°C

RS8762PXM

MSOP8

8

2

RS8762PXQTSSOP882RS8764PXP

SOP14

14

RS8764PXQTSSOP1414

RS8762PXK-G

MSL (3)

Package Qty

MSL3

Tape and Reel, 3000

RS8762PMSL1

Tape and Reel, 4000

-40°C ~125°C

RS8762PMSL3

Tape and Reel, 4000

-40°C ~125°C

RS8762PMSL3

Tape and Reel, 4000

4

-40°C ~125°C

RS8764P

MSL3

Tape and Reel, 4000

4

-40°C ~125°C

RS8764P

MSL3

Tape and Reel, 4000

NOTE:
(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.

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RS8761, RS8762, RS8764
6 PIN CONFIGURATION AND FUNCTIONS (TOP VIEW)
RS8761
OUT

1

V-

2

+IN

3

+

-

5

V+

4

-IN

SOT23-5

Pin Description
PIN
NAME

I/O (1)RS8761DESCRIPTION

SOT23-5-IN

4I

Negative (inverting) input

+IN

3

I

Positive (noninverting) input

OUT

1

O

OutputV-

2-

Negative (lowest) power supply

V+

5

-

Positive (highest) power supply(1) I = Input, O = Output.

RS8762
OUT A

1

-IN A

2

+IN A

3

V-

4

+

A

B+

8

V+

7

OUTB

6

-IN B

5

+IN B

SOP8/MSOP8/TSSOP8

Pin Description
NAME

PIN
SOP8/MSOP8/TSSOP8

I/O (1)DESCRIPTION

-INA

2

I

Inverting input, channel A

+INA

3

I

Noninverting input, channel A

-INB

6

I

Inverting input, channel B

+INB

5

I

Noninverting input, channel B

OUTA

1

O

Output, channel A

OUTB

7

O

Output, channel B

V-

4

-

Negative (lowest) power supply

V+

8

-

Positive (highest) power supply(1) I = Input, O = Output.

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RS8761, RS8762, RS8764
Pin Configuration and Functions (Top View)
RS8764
14

OUT D

13

-IN D

3

12

+IN D

V+

4

11

V-

+IN B

5

10

+IN C

-IN B

6

9

-IN C

OUT B

7

8

OUT C

OUT A

1

-IN A

2

+IN A

-

-

A

B

+

+

D
+ -

+ C

SOP14/TSSOP14

Pin Description
NAME

PIN
SOP14/TSSOP14

I/O (1)DESCRIPTION

-INA

2

I

Inverting input, channel A

+INA

3

I

Noninverting input, channel A

-INB

6

I

Inverting input, channel B

+INB

5

I

Noninverting input, channel B

-INC

9

I

Inverting input, channel C

+INC

10

I

Noninverting input, channel C

-IND

13

I

Inverting input, channel D

+IND

12

I

Noninverting input, channel D

OUTA

1

O

Output, channel A

OUTB

7

O

Output, channel B

OUTC

8

O

Output, channel C

OUTD

14

O

Output, channel D

V-

11

-

Negative (lowest) power supply

V+

4

-

Positive (highest) power supply(1) I = Input, O = Output.

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RS8761, RS8762, RS8764
7 SPECIFICATIONS
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
MIN

MAX

Supply, VS=(V+) - (V-)
Voltage

Current

7Signal input pin (2)(V-)-0.3(V+) +0.3

Signal output pin (3)(V-)-0.2(V+) +0.2

Signal input pin (2)

-10

10

mA

Signal output pin (3)

-50

50

mA

Output short-circuit (4)Package thermal impedance (5)θJAVContinuous
SOT23-5

230

SOP8

110

MSOP8

170

SOP14

105

TSSOP1490

TSSOP8Temperature

UNIT

240

Operating range, TA

-40

125

Junction, TJ (6)

-40

150

Storage, Tstg

-65

150

Lead temperature (Soldering, 10sec)

°C/W

°C

260

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thosespecified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current-limited to 10mA or less.
(3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.2V beyond the supply rails
should be current-limited to ±50mA or less.
(4) A heat sink may be required to keep the junction temperature below the absolute maximum. This depends on the power supply voltage
and how manyamplifiers are shorted. Thermal resistance varies with the amount of PC board metal connected to the package. The
specified values are for short tracesconnected to the leads.
(5) The package thermal impedance is calculated in accordance with JESD-51.
(6) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.
VALUE
V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±5000

Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1500

UNIT
V

(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

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RS8761, RS8762, RS8764
7.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)

Supply voltage, VS= (V+) - (V-)

MIN

MAX

Single-supply

2.7

5.5

Dual-supply

±1.35

±2.75

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UNIT
V

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RS8761, RS8762, RS8764
7.4 Electrical Characteristics
At TA = +25°C, Vs= ±2.5V, RF = 0Ω, Full (9) = -40°C to +125°C, unless otherwise noted. (1)PARAMETERCONDITIONSTA

RS876XMIN(2)

TYP(3)

MAX(2)UNIT

POWER SUPPLYVSOperating Voltage Range

Full
VS = 2.7V

IQ

5.5
6.3

Full

Quiescent Current per Amplifier

8.3

Full

Power-Supply Rejection Ratio

VS = 2.7V to 5.5V

Vos

Input Offset Voltage

VS = 5V, VCM = VS/2

Vos TcInput Offset Voltage Drift

V

8.5
11

25°C

VS = 5V
PSRR

2.7

25°C

10

mA

13

25°C

65

Full

55

25°C

-2

Full

-3

80

dB

INPUT

Full

±3
±300

VS = 5V

25°C

3

Differential Mode

25°C

3.5

Common ModeRLOAD = 2kΩ,VOUT = -2.4V to 2.4 V
RLOAD = 2kΩ,VOUT = -2.35V to 2.35 V

25°C

2.5

VS = 5V

IOS

Input Offset Current (4)CIN

Input Capacitance

AOL

Open-loop Voltage Gain
Common-Mode Voltage Range

VS=5.0V, VCM=0 to 3V
CMRR

±10

Full

Input Bias Current (4) (5)Common-Mode Rejection Ratio
VS=5.0V, VCM=0 to 5V

2
3

25°C

IB

VCM

±1

25°C

95

Full

80

Full

(V-)-0.1

25°C

60

mV
μV/°C
pA
pA
pF

105
dB

Full

55

25°C

60

Full

55

(V+)+0.1

V

80
dB

75

OUTPUT
VOH

Output Swing from Positive RailRLOAD = 100kΩ to VS/2

25C

7

20

mV

VOL

Output Swing from Negative RailRLOAD = 100kΩ to VS/2

25C

4

20

mV

ISC

Short-Circuit Current (6) (7)

ROUT

Closed-Loop Output Impedance (4)G = 1, f =1kHz, IOUT = 0

ROOpen-Loop Output Impedance (4)f = 1kHz, IOUT = 0

Source

25C

Sink

25C

200
250

mA

0.01

Ω

21

Ω

250

MHz

90

MHz

120

MHz

AC Specifications
f-3dB

Small-Signal Bandwidth (4)GBW

Gain-Bandwidth ProductSR

Slew Rate (8)G = +1, VO = 100mVPP
G = +2, VO = 100mVPP
G = +1025CVS = +5V, G=1,4V Step
VS = +5V, G=1,2V Step
VS = +3V, G=1,2V Step

9 / 24

200
25C

180

V/μs

140

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RS8761, RS8762, RS8764

tS

Settling Time, 0.1% (4)G = +1, VO = 200mVPP,
10% to 90%
G = +1, VO = 2VPP,
10% to 90%
G=1, 2V SteptOR

Overload Recovery TimeVIN * Gain = VS

25C

40

ns

PM

Phase Margin (4)

G=1

25C

60

deg

En

Input Voltage Noise

VS=5V, f=0.1Hz to 10Hz

25C

51

μVpp

en

Input Voltage Noise Density (4)f = 1MHz

25C

6nV/√HztF

Rise-and-Fall Time

25C

7

ns

25C

2.5

ns

25C

25

ns

NOISE

NOTE:
(1) Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.
(4) This parameter is ensured by design and/or characterization and is not tested in production.
(5) Positive current corresponds to current flowing into the device.
(6) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
(7) Short circuit test is a momentary test.
(8) Number specified is the slower of positive and negative slew rates.
(9) Specified by characterization only.

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RS8761, RS8762, RS8764
7.5 Typical Characteristics
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VS = 5V, G = +1, RF = 0Ω, RL = 1KΩ, and connected to VS/2, unless otherwise specified
5

5

RF=620Ω

Normalized Gain (dB)Normalized Gain (dB)

G=1, RF=24Ω0
G=2, RF=620Ω
-5G=5, RF=620Ω
-10

0

G=-1

-5

G=-2

-10

G=-5

-15

G=-10

G=10, RF=620Ω
-15
100K

1M

10M

100M

-20
100K

1000M

Frequency(Hz)

10M

100M

1000M

Frequency(Hz)Figure 1. Noninverting Small Signal Frequency
Response

Figure 2. Inverting Small Signal Frequency
Response

105CL=5.6pF

Normalized Gain (dB)5Normalized Gain (dB)

1M

0
-5

CL=47pF-10-15

CL=100pF

RL=10kΩ0-5

RL=1kΩ

RL=50Ω

-10

RL=100Ω

-20

-15
1M

10M

100M

1000M

10M

Frequency(Hz)

100M

1000M

Frequency(Hz)Figure 3. Frequency Response for Various CL

Figure 4. Frequency Response for Various RL

Figure 5. Small Signal Step Response

Figure 6. Large Signal Step Response

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RS8761, RS8762, RS8764
Typical Characteristics
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VS = 5V, G = +1, RF = 0Ω, RL = 1KΩ, and connected to VS/2, unless otherwise specified
25

20
16

Quiescent Current (mA)

Quiescent Current (mA)

18
14
12
10
8
6
4
2

VS=±2.5V

201510

VS=±1.35V

5

0
-2

0
2.5

3

3.5

4

4.5

5

5.5

-40 -25 -10 5

Supply Voltage(V)Figure 8. Quiescent Current vs Temperature

Figure 7. Quiescent Current vs Supply Voltage
2

-40°C
25°C
85°C
125°C

1.5
1

VOS (mV)

20 35 50 65 80 95 110 125

Temperature(℃)

0.5
0
-0.5
-1
-1.5
0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

VCM(V)

Figure 9. Input Offset Voltage vs Common Mode
Voltage

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Figure 10. 0.1Hz to 10Hz Noisewww.run-ic.com

RS8761, RS8762, RS8764
8 DETAILED DESCRIPTION
8.1 Overview
The RS876X devices are unity-gain stable, dual and qual-channel op amps with low noise and distortion. The
device consists of a low noise input stage with a folded cascade and a rail-to-rail output stage. This topology
exhibits superior noise and distortion performance across a wide range of supply voltages that are not deliveredby legacy commodity audio operational amplifiers.

8.2 Power On Requirement
For the high-speed amplifier, in order to avoid the bandwidth limit of the input transistors parasitic capacitance,
it is generally not large enough, so the offset voltage is larger than the general amplifier. RS876X uses internal
calibration circuits to calibrate the offset voltage under high and low common mode conditions, so the typicalvalue of the offset voltage can be 1 mV. The performance is better than most high-speed amplifiers. To ensure
the normal calibration function. When using the amplifier, users should pay attention to the high and low VCM
switching points, generally near VDD-1.5V. To guarantee the calibration block works properly, good power onof the amplifier power supply is recommended:• Fast power on time to produce the power on reset signal of calibration block. The maximum value of poweron time is 1ms.
• Avoid the voltage glitch reaching in 0.4V to 1V range on power supply. For example, power supply drop to
0.5V then recovery to 5V may cause error of calibration block.
If the power on signal is not good, the amplifier has probability to enter an unexpected status.

8.3 Phase Reversal Protection
The RS876X family has internal phase-reversal protection. Many op amps exhibit phase reversal when the input
is driven beyond the linear common-mode range. This condition is most often encountered in noninverting
circuits when the input is driven beyond the specified common-mode voltage range, causing the output toreverse into the opposite rail. The input of the RS876X prevents phase reversal with excessive common-mode
voltage. Instead, the appropriate rail limits the output voltage. This performance is shown in figure 11.
3

Voltage (V)

2
1

0
-1
-2
-3

VIN
VOUT
Time (125us/div)

Figure 11. Output Waveform Devoid of Phase Reversal during an Input Overdrive Condition
C004

8.4 Gain Bandwidth ProductFor applications that require a gain of +1, no feedback resistor is required. Just short the output pin to theinverting input pin. For gains greater than +1, the feedback resistor forms a pole with the parasitic capacitanceat the inverting input. As this pole becomes smaller, the amplifier’s phase margin is reduced. This causes ringing
in the time domain and peaking in the frequency domain. Therefore, R F has some maximum value that should
not be exceeded for optimum performance. If a large value of RF must be used, a small capacitor in the few Pico
farad range in parallel with RF can help to reduce the ringing and peaking at the expense of reducing the
bandwidth. As far as the output stage of the amplifier is concerned, the output stage is also a gain stage with theload. RF and RG appear in parallel with RL for gains other than +1. As this combination gets smaller, the bandwidth
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RS8761, RS8762, RS8764
falls off. Consequently, RF also has a minimum value that should not be exceeded for optimum performance. For
gain of +1, RF=0 is optimum. For the gains other than +1, optimum response is obtained with R F between 300Ω
to 1KΩ, The RS876X have again bandwidth product of 120MHz. For gains ≥5, its bandwidth can be predictedby the following equation:

Gain × BW=120MHz

8.5 Capacitive Load Driving Capability
RS876X has large output current driving ability and good stability. When the drive output load resistance is 1KΩ
and the output capacitor is 40 pF, the frequency response curve peak is less than 5dB. If less peaking is desiredin applications, a small series resistor (usually 50Ω) can be placed in series with the output to eliminate mostpeaking. However, this will reduce the gain slightly. If the gain setting is greater than 1, the gain resistor RG canthen be chosen to make up for any gain loss which may be created by the additional series resistor at the output.
When used as a cable driver, double termination is always recommended for reflection-free performance. For
those applications, a back-termination series resistor at the amplifier’s output will isolate the amplifier from thecable and allow extensive capacitive drive. However, other applications may have high capacitive loads withouta back-termination resistor. Again, a small series resistor at the output can help to reduce peaking.

8.6 Video Performance
For good video performance, an amplifier is required to maintain the same output impedance and the same
frequency response as DC levels are changed at the output. This is especially difficult when driving a standard
video load of 150Ω, because the change in output current with DC level. Special circuitry has been incorporated
in the RS876X to reduce the variation of the output impedance with the current output. This results in Dg and
Dp specifications of 0.03% and 0.3°, while driving 150Ω at a gain of 2. Driving high impedance loads would givea similar or better Dg and Dp performance.

8.7 Output Drive Capability
The RS8761, RS8762 and RS8764 output stage can supply a continuous output current of ±100mA and still
provide approximately 2.7V of output swing on a 5V supply. For maximum reliability, it is not recommended torun a continuous DC current in excess of ±100mA. Refer to the typical characteristic curve Output Voltage Swingvs Output Current. For supplying continuous output currents greater than ±100mA, the RS876X may be
operated in parallel. The RS876X will provide peak currents up to 200mA, which corresponds to the typical shortcircuit current.

8.8 Input ESD Diode Protection
The RS876X uses internal electrostatic discharge (ESD) protection circuits on all pins. In the case of input andoutput pins, this protection primarily consists of current-steering diodes connected between the input andpower-supply pins. The following figure shows the schematic diagram of the ESD structure.
VDD

VV+

+

A

OUT

GND

Figure 12. Input ESD Diode14 / 24www.run-ic.com

RS8761, RS8762, RS8764
8.9 Power Supply Bypassing and Printed Circuit Board Layout
As with any high frequency device, a good printed circuit board layout is necessary for optimum performance.
Lead lengths should be as sort as possible. The power supply pin must be well bypassed to reduce the risk ofoscillation. For normal single supply operation, where the V S- pin is connected to the ground plane, a single 4.7mF
tantalum capacitor in parallel with a 0.1mF ceramic capacitor from VS+ to GND will suffice. This same capacitor
combination should be placed at each supply pin to ground if split supplies are to be used. In this case, the V Spin becomes the negative supply rail. For good AC performance, parasitic capacitance should be kept to aminimum. Use of wire wound resistors should be avoided because of their additional series inductance. Use ofsockets should also be avoided if possible. Sockets add parasitic inductance and capacitance that can result incompromised performance. Minimizing parasitic capacitance at the amplifier’s inverting input pin is very
important. The feedback resistor should be placed very close to the inverting input pin. Strip line design
techniques are recommended for the signal traces.

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RS8761, RS8762, RS8764
9 APPLICATION AND IMPLEMENTATION
Information in the following applications sections is not part of the RUNIC component specification, and RUNIC
does not warrant its accuracy or completeness. RUNIC’s customers are responsible for determining suitability ofcomponents for their purposes. Customers should validate and test their design implementation to confirm
system functionality.

9.1 Application Note
The RS8761, RS8762, RS8764 are high precision, rail-to-rail operational amplifiers that can be run from a singlesupply voltage 2.7V to 5.5V (±1.35V to ±2.75V). Supply voltages higher than 7V (absolute maximum) canpermanently damage the amplifier. Rail-to-rail output swing significantly increases dynamic range, especially in
low-supply applications. Good layout practice mandates use of a 0.1μF capacitor place closely across the supply
pins.

9.2 Single Supply Video Line Driver
The RS8761, RS8762, RS8764 are wide band rail-to-rail output op amplifiers with large output current, excellent
Dg, Dp, and low distortion that allow them to drive video signals in low supply applications. Figure below is the
single supply non-inverting video line driver configuration and inverting video ling driver configuration. The signal
is AC coupled by C1. R1 and R2 are used to level shift the input and output to provide the largest output swing.
RF and RG set the AC gain. C2 isolates the virtual ground potential. RT and R3 are the termination resistors forthe line. C1, C2 and C3 are selected big enough to minimize the drop of the luminance signal.

Figure 13. 5V Single Supply Non-Inverting and Inverting Video Line Driver
16 / 24www.run-ic.com

RS8761, RS8762, RS8764
10 PACKAGE OUTLINE DIMENSIONSSOT23-5 (3)
D

1.90

b

2.59

E1

E
0.99
0.69

0.95

e
e1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2
A A2

c

θ
L

A1

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.050

1.250

0.041

0.049

A1

0.000

0.100

0.000

0.004

A2

1.050

1.150

0.041

0.045

b

0.300

0.500

0.012

0.020

c

0.100

0.200

0.004

0.008

D (1)

2.820

3.020

0.111

0.119

E (1)

1.500

1.700

0.059

0.067

E1

2.650

2.950

0.104

0.116

Symbol0.950(BSC) (2)e0.037(BSC) (2)

e1

1.800

2.000

0.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

17 / 24www.run-ic.com

RS8761, RS8762, RS8764
MSOP8 (3)
b

e

E

E1

4.8

1.02
D

0.65

0.41

RECOMMENDED LAND PATTERN (Unit: mm)

A2

c

A
A1

L

θ

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

0.820

1.100

0.032

0.043

A1

0.020

0.150

0.001

0.006

A2

0.750

0.950

0.030

0.037

b

0.250

0.380

0.010

0.015

c

0.090

0.230

0.004

0.009

D (1)

2.900

3.100

0.114

0.122

Symbol

0.650(BSC) (2)e0.026(BSC) (2)

E (1)

2.900

3.100

0.114

0.122

E1

4.750

5.050

0.187

0.199

L

0.400

0.800

0.016

0.031

θ

0°

6°

0°

6°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

18 / 24www.run-ic.com

RS8761, RS8762, RS8764
TSSOP14 (3)
e

b

5.6

E1 E

1.78
D

0.65

0.42

RECOMMENDED LAND PATTERN (Unit: mm)

A2

H

C

A
A1

θ

L

SymbolDimensions In Millimeters

Dimensions In Inches

Min

Min

Max

A (1)

Max

1.200

0.047

A1

0.050

0.150

0.002

0.006

A2

0.800

1.050

0.031

0.041

b

0.190

0.300

0.007

0.012

c

0.090

0.200

0.004

0.008

D (1)

4.860

5.100

0.191

0.201

E (1)

4.300

4.500

0.169

0.177

E1

6.250

6.550

0.246

0.650(BSC) (2)

e
L

0.500

H
θ

0.700

0.020

0.25(TYP)
1°

0.258
0.026(BSC) (2)0.028
0.01(TYP)

7°

1°

7°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

19 / 24www.run-ic.com

RS8761, RS8762, RS8764
TSSOP8 (3)
e

b

5.6

E1 E

1.78
D

0.65

0.42

RECOMMENDED LAND PATTERN (Unit: mm)

A2

H

C

A
A1

θ

L

SymbolDimensions In Millimeters

Dimensions In Inches

Min

Min

Max

A (1)

Max

1.200

0.047

A1

0.050

0.150

0.002

0.006

A2

0.800

1.050

0.031

0.041

b

0.190

0.300

0.007

0.012

c

0.090

0.200

0.004

0.008

D (1)

2.900

3.100

0.114

0.122

E (1)

4.300

4.500

0.169

0.177

E1

6.250

6.550

0.246

0.650(BSC) (2)

e
L

0.500

H
θ

0.700

0.020

0.25(TYP)
1°

0.258
0.026(BSC) (2)0.028
0.01(TYP)

7°

1°

7°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

20 / 24www.run-ic.com

RS8761, RS8762, RS8764
SOP8 (3)
b

e

5.2
E

E1

2.2

D

1.27

0.6

RECOMMENDED LAND PATTERN (Unit: mm)

A2

c

A

A1

L

θ

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.350

1.750

0.053

0.069

A1

0.100

0.250

0.004

0.010

A2

1.350

1.550

0.053

0.061

b

0.330

0.510

0.013

0.020

c

0.170

0.250

0.007

0.010

D (1)

4.800

5.000

0.189

0.197

Symbol1.270(BSC) (2)e0.050(BSC) (2)

E

5.800

6.200

0.228

0.244

E1 (1)

3.800

4.000

0.150

0.157

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

21 / 24www.run-ic.com

RS8761, RS8762, RS8764
SOP14 (3)
e

E

b

5.2

E1

1.27

0.6

D
1.27

RECOMMENDED LAND PATTERN (Unit: mm)

A2

c

A

θ

A1
L

SymbolDimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.350

1.750

0.053

0.069

A1

0.100

0.250

0.004

0.010

A2

1.350

1.550

0.053

0.061

b

0.310

0.510

0.012

0.020

c

0.100

0.250

0.004

0.010

D (1)

8.450

8.850

0.333

0.348

1.270(BSC) (2)e0.050(BSC) (2)

E

5.800

6.200

0.228

0.244

E1 (1)

3.800

4.000

0.150

0.157

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

22 / 24www.run-ic.com

RS8761, RS8762, RS8764
11 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

Reel
DiameterReel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SOT23-5

Reel
Diameter
7’’

Reel Width
(mm)
9.5

A0
(mm)
3.20

B0
(mm)
3.20

K0
(mm)
1.40

P0
(mm)
4.0

P1
(mm)
4.0

P2
(mm)
2.0

W
(mm)
8.0

Pin1
Quadrant
Q3

Package Type
MSOP8

13’’

12.4

5.20

3.30

1.50

4.0

8.0

2.0

12.0

Q1

TSSOP14

13’’

12.4

6.95

5.60

1.20

4.0

8.0

2.0

12.0

Q1

SOP8

13’’

12.4

6.40

5.40

2.10

4.0

8.0

2.0

12.0

Q1

SOP14

13’’

16.4

6.60

9.30

2.10

4.0

8.0

2.0

16.0

Q1

TSSOP8

13’’

12.4

6.90

3.45

1.65

4.0

8.0

2.0

12.0

Q1

NOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

23 / 24www.run-ic.com

RS8761, RS8762, RS8764
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (including
data sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for a
specific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

24 / 24www.run-ic.com