GAU208P-15252

Universal Gate Drive Prototype Board

FEATURE>Built in 2 gate drive circuits>Low height, DIP structure>Built in isolated type DC-DC converter for gate drive.
>Output peak current is +/-8A(max)>Built in short circuit protection>Electrical isolation voltage is 2500Vrms (for 1 minute)>CMOS compatible input interface>Adjustable fall time on activity of short circuit protection.
Size : 73 x 110 x 23t

Image Photo

Gate Driver : VLA567-01R ( Built in DCDC converter )http://www.idc-com.co.jp

Block diagram
DETECTVIN

IN1FO1k ohm
240 ohm

C1LATCH

INTER
FACE

TIMER

GATE SHUT
DOWN
F.O.

G1
E1

UVL

VD
DC－AC
CONVERTER
UVL

GND

DETECT

1k ohm

IN2240 ohm

LATCH

INTER
FACE

TIMER

GATE SHUT
DOWN
F.O.

G2
E2

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MAXIMUM RATINGS (Unless otherwise noted, Ta=25deg C)
SymbolParameter

Conditions

Ratings

Unit

VD

Supply voltage

DC

16.5

V

VI

Input signal voltage

Applied between VI+ - IN1,2
50% Duty cycle , pulse width 1ms-1 ~ +7

V

Output peak current

Pulse width 2us-8

A8AVisoIsolation voltage between input
and output

Isolation voltage between input and output

2500

Vrms

Topr

Operating temperature

No condensation allowable-20 ~ 70

deg CTstg

Storage temperature

No condensation allowable(*1)-25 ~ 85

deg CIdrive

Gate drive current

Gate average current (Per one circuit)

100mA

IOHP
IOLP

(*1) Differs from heat cycle condition

ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta=25deg C, VD=15V)
SymbolParameter

Conditions

VD

Supply voltage

VIN

Limits

Unit

Min

TypMaxRecommended range

14.2

15

15.8

VPull-up voltage on input side

Recommended range

4.75

55.25

V

IIH

“H” input signal current(*2)

Recommended range

101316mAf

Switching frequency

Recommended range

--20

kHz

RG

Gate resistance

Recommended range

2--ohmVOH“H” output voltage (*2)

-

13.5

15.5

16.5

V

VOL

“L” output voltage (*2)

---8-

VtPLH

“L-H” propagation time (*2)

IIH = 13mA

0.2

0.4

1μs

tPHL

“H-L” propagation time (*2)

IIH = 13mA

0.2

0.4

1μs

VSCSC detect voltageCollector voltage of module

15--V(*2) When LED of PC is ON, Vo is high.

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INNER CIRCUIT

293123CN444VD
GND
NC
FO
IN1IN2VIN+

284PC2

PC15

RG3

RG2

RG4CN3C1
CN1
G1C1

E1C5

DZ1C724
HIC1

D3C22741

RG1+

4340

D1R22625PC1R130

D222191HIC1PC1,2
D1,2
D3,4
DZ1,2
RG
R1,2,3,4
CN1,2,3
CN4
C1,2,3,4
C5,6,7,8

VLA567-01R
ISAHAYATLP785 compatible
TOSHIBA
RP1H
SANKEN
M1FS6SHINDENGEN
Vz=30V, over than 500mW
Gate Resistor (*3)
4.7kΩ, 250mW
5273-02A
MOLEX
5045-07A
MOLEX
220uF,35V
Low impedanceRefer to (*4)

2342

20
1718

RG5

RG7

RG6

RG8+

D4C3E2+C4C6CN2
G2

DZ2C82115
14
16

R4R3PC2*3) Gate Resistor is not installed at the time of shipment.
Please solder the chosen resistor.
*4) C5,6,7,8 is not installed at the time of shipment.
Please solder the chosen condenser if needed. (50V,ceramic)

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APPLICATION EXAMPLE
GAU208P
2931235V
4.7k ohm

25CN4VD
GND

44RC filter~10us

Input Signal

PC2+28404
PC15HC04 etc.

RG1

RG3RG2

RG4CN3

CN1

C1C1

G1
E1C5DZ1C724
HIC1

D3C2

2741

D1+43

NC
FOIN1
IN2
VIN

P

R22615V

PC1R1

U or V or W

30

D2221912
34220
1718

RG5

RG7

RG6

RG8+

D4C3

G2
E2+

C4C6

DZ2N

C821151416

CN2R4R3PC2※When you confirm the gate
output without connecting IGBT,
please invalidate a short-circuit
protection.
If connect resistance of 4.7k ohm
between the C1(E1) and E1(E2), theshort circuit protection becomes
invalid.

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Part arrangement & Size

Gate Resistor(This part is not installed at the time of shipment)

73mm

Screw hole
4-3.5 φ

CONNECTOR

3.75mmCONNECTOR

Built in DC-DC converter type
Gate Driver VLA567-01R

3.75mm110mm

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FOR SAFETY USINGGreat detail and careful attention are given to the production activity of devices, such as the development, the quality of production,and in it’s reliability. However the reliability of devices depends not only on their own factors but also in their condition of usage.
When handle the devices, please note the following cautions.

CAUTIONS
Packing

The materials used in packing devices can only withstand normal external conditions.
When exposed to outside shocks, rain and certain environmental contaminators, the packing
materials will deteriorates. Please take care in handling.

Carrying

1)
2)
3)
4)
5)

Storage

When storing the devices, please observe the following notices or possible deterioration of theirelectricalcharacteristics, risk of solderability, and external damage may occur.
1)
Devices must be stored where fluctuation of temperature and humidity is minimal, and mustnot be exposed to direct sunlight. Store at the normal temperature of 5 to 30 degrees Celsius
with humidity at 40 to 60%.
1)
Avoid locations where corrosive gasses are generated or where much dust accumulates.
2)
Storage cases must be static proof.
3)
Avoid putting weight on boxes.

Extended storage

When extended storage is necessary, the devices must be kept non-processed. When using devices
whichhave been stored for more than one year or under severe conditions, be sure to check that theexterior is free from flaw and other damages.

Maximum ratings

To prevent any electrical damages, use devices within the maximum ratings. The temperature,
current, voltage, etc. must not exceed these conditions.

Polarity

To protect devices from destruction and deterioration due to wrong insertion, make sure of polarity ininserting leads into the board holes, conforming to the external view for the terminal arrangement.

Don’t stack boxes too high. Avoid placing heavy materials on boxes.
Boxes must be positioned correctly during transportation to avoid breakage.
Don't throw or drop boxes.
Keep boxes dry. Avoid rain or snow.
Minimal vibration and shock during transportation is desirable.

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Keep safety first in your circuit designs!
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but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal
injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, withappropriate measures such as (1)placement of substitutive, auxiliary circuits, (2)use of non-flammable material or(3)prevention against any malfunction or mishap.
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