Data Sheet
Wireless Engine TWE-001

Version 1.0
External Document

TWD-PDS-TWE001-EN

External Documenti

Version Controlii

VersionDate

1.0

20th Aug 2012

Notes
First release

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Contents

1 Product specification ................................................................... 1
1.1

Overview ................................................................................................ 1

1.1.1

Product Name .................................................................................................... 1

1.1.2

Part Number ....................................................................................................... 1

1.1.3

Introduction ........................................................................................................ 1

1.1.4

Main characteristics ........................................................................................... 21.2

Specification ........................................................................................... 4

1.2.1

Chip Set ............................................................................................................. 4

1.2.2

Antenna .............................................................................................................. 4

1.2.3

Radio Standard Specification ............................................................................ 4

1.2.4

Micro Controller .................................................................................................. 4

1.2.5

Interface ............................................................................................................. 5

1.2.6

RF Transceiver ................................................................................................... 5

1.2.7

Certification ........................................................................................................ 5

1.3
1.4

Block Diagram ........................................................................................ 6
Module Size ........................................................................................... 6

1.5 Connector .............................................................................................. 7
1.6 Pin Configurations .................................................................................. 7
1.7 Maximum Ratings .................................................................................. 9
1.8 Electrical Characteristics ...................................................................... 10
1.9 Various Specifications ........................................................................... 11
1.10 Antenna.............................................................................................. 12
1.11 Internal Circuit .................................................................................... 13
1.12 Compatibility with the TWE-001 STRONG ......................................... 13
1.13 PCB Antenna Guidelines.................................................................... 14
1.14 Radiation Pattern of PCB antenna ..................................................... 15

2 Contact Details ........................................................................ 16

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1Product specification

1.1 Overview

TWE-001-PA

TWE-001-IP

1.1.1 Product NameTOCOS Wireless Engine TWE-001

1.1.2 Part Number
TWE-001S-PA/IP( PA : Pattern Antenna , IP : IPEX (uFL) Connector )1.1.3 Introduction
TOCOS Wireless Engine TWE-001 is 2.4GHz RF Module with 1mW output
power, which comprises a fast 32bit microcomputer, flash memory,high-performance radio of the IEEE802.15.4 conformity, an embedded
antenna (or external antenna through u.FL connector) in a small packagedmodule.
TWE-001 can be operated with dry cell batteries and has wide variety ofperipherals for connectivity of external components such as sensors, a
display, LEDs and memory devices.

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External Document11.1.4 Main characteristics
 Standard output power up to 2.73dBm.
 Global standard IEEE802.15.4/ZigBee®.
 Long range: 400m with embedded antenna, 1000m with external
2.0dbi dipole antenna.*1
 High speed mode: 500/667kbps *2
 Rich memory: RAM 128KB, Flash Memory 512KB.
 Small deep sleeping current: 1.3uA
 Variety of peripherals: 21 (max) Digital I/O, 2 UART, SPI, I2C, 4 ADC,2 DAC, 2 Comparators.
 128bit AES accelerator.
 Antenna selection: embedded antenna and external u.FL connector.
 Board to board connector AXT440124 (Panasonic) for power and I/Os.
 Free SDK based on GNU toolchains with Eclipse based IDE providedfor original firmware development.
 Runs TWE-Zero applications *3
 RoHS conformance.
*1: the maximum distance may vary depending on its environment.
*2: the RF physical part is different from IEEE802.15.4 standard, but
firmware can be written in the same API. (JenNet, ZigBee PRO is notsupported)*3: licensed TWE-001 module is required.

2

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Use of ZigBee®.
Those who use any intellectual property for business are required to join
ZigBee Alliance even TOCOS (a member of ZigBee Alliance) WirelessEngine is used.
Contact ZigBee Alliance for further information.

ZigBee Alliance
http://www.zigbee.org/
FAQ about the membership
http://www.zigbee.org/Join/MembershipFAQ.aspx（As of August 2010）
4. If my company uses a ZigBee module in my product, do I need tobe a member?
Yes.

Note: If firmware is designed without ZigBee (like 802.15.4 API), themanufacture does not need to join the alliance.

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1.2 Specification
1.2.1 Chip Set
NXP SEMICONDUCTORS Co., Ltd.

JN51481.2.2 Antenna-TWE-001-PA for board pattern antenna
TWE-001-IP for external antenna (u.FL connector)

1.2.3 Radio Standard Specification


802.15.4 IEEE conformity (2.4GHz)
Transmission rate: 250kbps(802.15.4 standard), 500/666kbps
Channel Number: 16 (11~26)
Modulation: DS-SS (direct diffusion method)
Frequency: 2405~2480MHz (center freq.)

1.2.4 Micro Controller 32 bits RISC processor
 Variable length op-code for optimal binary size Variable CPU clock (4/8/16/32MHz)
 JTAG debugging (supported 802.15.4 MAC API only) Watch dog timer
 Brown out detection
 5 domains of power control
 RAM 128kBytes
 ROM 128kBytes (802.15.4 MAC API, etc)
 Flash memory 512kBytes

4External Document

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1.2.5 Interface
Number Description
42
3
2
2
1
1
1
21

ADC
DACTimer
Pulse counter
UART
SPI bus
I2C bus
I2S
Digital Input / Output

12bit
12bit
5 modes including PWM output
Running also during sleep mode
5 selects master, slave
Master, slave
Four wire digital audio
Shared with other I/F

1.2.6 RF TransceiverOutput Power
Receive sensitivity
Rx current
Deep Sleep current
Receive sensitivity

Value

Description

2.7dBm
1.4dBm-95dBm
17.2mA
1.3μA-95dBm-93dBm25℃, 3V, max, PCB antenna
25℃, 3V, max, u.FL
25℃,3V,typ,PCB antenna
25℃,3V,typ, CPU at Doze mode
25℃,3V,typ,DeepSleep
25℃,3V,typ,PCB antenna
25℃,3V,typ,uFL

1.2.7 Certification
 RoHS compliance

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1.3 Block Diagram

1.4 Module Size

Module Size：
Weight：4.0g

620 x 40 x 3.5mmExternal Document

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1.5 Connector
The module side: AXT440124 (0.4mm, 2x20 headers, Panasonic)
Compatible socket: AXT340224

1.6 Pin Configurations
SignalNameSignal
TypeDescription

1VCC

VCC

Power supply

3

DIO0/SPISEL1CMOS

DIO0 / SPI Slave Select Output15

DIO1/SPISEL2/PC0

CMOS

DIO1 / SPI Slave Select Output 2 / Pulse Counter0 Input

7SSZCMOSSPI Slave Select Output 09GND

GND

Ground*1

11

DAC1Analog

DA converter 1 output

13C2PAnalog

comparator 2 + input

15C2MAnalog

comparator 2 - input

17

ADC4Analog

AD converter 4 input

19

ADC3Analog

AD converter 3 input

21

DIO7/RXD0/JTAG_TDICMOSDigital IO 7 / UART 0 RX / JTAG Data Input

23

DIO8/TIM0CK_GT/PC1CMOS

Digital IO 8 / Timer 0 clock gate input / pulse counter 1 input

25

ADC2Analog

AD converter 2 input

27

ADC1Analog

AD converter 1 input

29

DIO10/TIM0OUTCMOS

Digital IO 10 / Timer 0 PWM Output

31

DIO9/TIM0CAP

CMOS

Digital IO 9 / Timer 0 capture input

33

DIO16/IP_DICMOSDigital IO 16 / SPI Slave input

35

DIOO17/CTS1/IP_SEL

CMOS

Digital IO 17 / UART 1 Clear To Send Input / Intelligent Peripheral

DAI_SCK/JTAG_TCK37

DIO18/RTS1/IP_INTDevice Select Input / Digital Audio Clock / JTAG CLKCMOSDAI_SDOUT/JTAG_TMS
39

DIO19/TXD1/JTAG_TDO

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Digital IO 18 / UART 1 Request To Send Output / Peripheral
Interrupt Output / Digital Audio Data Output / JTAG Mode Select

CMOS

Digital IO 19 / UART 1 Transmit Data Output / JTAG Data Out

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7Signal
NameSignal
TypeDescription

2DIO2/SPISEL3CMOS

DIO2 / SPI Slave Select Output34DAC2Analog

DA Converter 2 output

6

DIO20/RXD1/JTAG_TDICMOSDigital IO 20 / UART1 RX/JTAG data input

8

DIO3/SPISEL4CMOS

DIO3 / SPI Slave Select Output410SWP

CMOS

Built-in flash memory WP.
When set SWP pin as Low, this affect write protection behavior
in M25P40. See the M25P40 datasheet for details.

12

SPIMISO

CMOS

SPI Master Input

14RESETN

CMOS

Reset input

16

SSM

CMOS

Built-in flash memory SPI Select18

DIO4/CTS0/JTAG_TCKCMOS

Digital IO 4 / UART 0 CTS / JTAG CLK

20

DIO5/RTS0/JTAG_TMS

CMOS

Digital IO 5 / UART 0 RTS / JTAG Mode Select22

DIO6/TXD0/JTAG_TDO

CMOS

Digital IO 6 / UART 0 TX / JTAG Data Output

24

DIO15/SIF_D/IP_DO

CMOS

Digital IO15 / Serial Interface Data / Intelligent Peripheral Data

(Lo: RESET, Hi:Active)
*1

Out
26

SPICLKCMOS

SPI Master Clock28

DIO14/SIF_CLK/IP_CLK

CMOS

DIO14 / Serial Interface Clock / Intelligent Peripheral Clock
Input

30

SPIMOSICMOS

SPI Master Output

32

DIO11/TIM1CK_GT/TIM2OUTCMOS

Digital IO11, Timer1 Clock / Gate Input / Timer2 PWM Output

34

DIO12/TIM1CAP

CMOS

Digital IO12 / Timer1 Capture Input / Digital Audio Word SelectCMOS

Digital IO13 / Timer1 PWM Output / Digital Audio Data Input

DAI_WS
DIO13/TIM1OUT

36

DAI_SDIN
38

C1PAnalog

Comparator 1+ inputs

40

C1M

AnalogComparator 1- inputs*18

SSZ and SSM should be wired in order to activate internal flash boot.

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1.7 Maximum Ratings
ParameterminMax

Device supply voltage (VCC)
Analog IO(ADC/DAC/COMP)
Digital IO
DIO0-8/DIO11-20/RESETNSPICLK/SPIMISO/SPIMOSI/SSZ
DIO9-10WP/SSM
Storage temperature

-0.3
-0.3
-0.3

3.6
VCC+0.3
Lower of(VCC+2)
and 5.5
VCC+0.3
VCC+0.3
85

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VVVV
V℃

91.8 Electrical Characteristics
Parameter
Device supply
voltage (VCC)
Cold Boot voltage
Operating Temp
Current

SymbolVCCTOPR
ICC

ConditionsminTypmaxFlash device require >2.3 V
Require flash accessNo dew condensation
Deep Sleep

2.02.7

3.6

2.3-40Tx (CPU doze),25℃,3V
Tx(CPU ON),25℃,3V
Rx (CPU doze) ,25℃,3VRx(CPU ON) ,25℃,3V

DIO Internal pull up
DIO Hi Input
DIO Lo Input
DIO Input Hysteresis
DIO Hi Output
DIO Lo Output
Internal DIO pull up
Resistors

Reference Voltage
ADC Resolution

25℃,3V
VIH
VIL
VOH
VOL
IOL

24
VCCx0.7
140
VCCx0.8

230

85

63
VCCx0.27
310

V℃
μA
mAkΩ
VmVV

0.4
VCC 2.7~3.6V

4

VCC 2.2~2.7V
VCC 2.0~2.2V

32.5
1.19
12±5

VREF

ADC Integral nonlinearity

ADC Differentialnonlinearity
ADC Offset error
ADC Gain error
ADC clock
ADC Input voltage
range

1025
1.3
14.6
18.8
17.2
23.0
40

V-1mA+2+10-20
5000.04

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VREF
2xVREF

VBits
LSB
LSBmVmVkHz
V

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1.9 Various Specifications
Parameter

Specifications

SPI (5 selects, master or slave)
Timer
Pulse Counters
UART interfaces
JTAG Debug Interface
Two-Wire Serial Interface (I2C SMBUS
compatible, master or slave)
Four-Wire Digital Audio(I2S compatible)
Random Number Generator
Security processor
Sample FIFO
Power supply management

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Max 16MHz
16MHz, 16bit Resolution
Max 100kHz, 16bit16550A compatible
IEEE1149.1 Conformity
Max 100kHz or 400kHz
7/10bit address mode
Max 8MHz, 16bit, 2ch
16bit
AES 128bit
Accessible to I2SDigital / Analog / RAM / Radio / CPUExternal Document

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1.10

Antenna

Manufacturer

WiesonTOCOS

Antenna
DipoleReverse-F

Model Name

GY111
PCB Antenna

Connector

IPEX
N/A

Note: Ask sales/distributor to get complete information of available antenna under radio
certification.

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1.11 Internal Circuit
The RESETN line has EMI filter as below.

※ C4EMI Filter (MURATA NFM18CC223R1C3D)

1.12 Compatibility with the TWE-001 STRONG
TWE-001 (regular) and TWE-001 STRONG has compatibility except items asbelow:
・ TWE-001 STRONG does not have DIO2/DIO3.
・ TWE-001 STRONG is larger than TWE-001 (regular)

TWE-001 (regular)

20 x 40 x 3.5mm(TWE-001-PA/IP)

TWE-001 STRONG

20 x 45.5 x 3.5mm(TWE-001S-PA)
20 x 42 x 3.5mm(TWE-001S-IP)

・ The amplifier activation API needs to be called for TWE-001 STRONG.

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1.13 PCB Antenna Guidelines
The following guideline should be followed to maximize the performance of PCB
antenna.
1. The metal object should not be placed around PCB antenna pattern. The
un-recommended items are, for example, surrounded by metal case; place a bigbattery near the antenna or putting a big ground plane below the antenna.
2. Plastic bolt/nut should be used for a screw hole at antenna side to mount amodule firmly.
3. The radiation pattern should be considered. Generally the performance ismaximized if the antenna is vertically stood.
4. The antenna should be kept apart from other antennas of same frequency band.

Antenna Part

2. non-metal bolt/nut
1. This area is very important for
emit radio wave, so therecommended design is a) notto place GND pattern on themother board, and minimize
wire as possible b) not to place
metal object 360 around thisare, like covered by metal acase, put a battery over theantenna area.

Mother Board
TWE-001
3. The best radiation performance is shown its 360
degree when the module is vertically stood.

4. The module should be placed away fromother antennas of 2.4GHz band.

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1.14 Radiation Pattern of PCB antenna

0900°

27090°

270°

180180°00°
9027090°

270°

180180°00°
9027090°

270°

180180°Note: One tick circle represents 10db difference.

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2Contact Details

Ginsei Corporation
5-4-1 Shinjuku, Shinjuku-ku,
Tokyo, 160-0022, Japan
Tel: +81 3 3356 5715
Fax: +81 3 3357 4723
Email: sales@ginsei-jp.com

http://www.ginsei-jp.com/tocos.html

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