Datasheet SGP30
Indoor Air Quality Sensor for TVOC and CO2eq Measurements
 Multi-pixel gas sensor for indoor air quality applications
 Outstanding long-term stability
 I2C interface with TVOC and CO2eq output signals
 Very small 6-pin DFN package: 2.45 x 2.45 x 0.9 mm3
 Low power consumption: 48 mA at 1.8V
 Tape and reel packaged, reflow solderable

Product Summary
The SGP30 is a digital multi-pixel gas sensor designed foreasy integration into air purifier, demand-controlled
ventilation, and IoT applications. Sensirion’s CMOSens®
technology offers a complete sensor system on a single
chip featuring a digital I2C interface, a temperature
controlled micro hotplate, and two preprocessed indoor air
quality signals. As the first metal-oxide gas sensor
featuring multiple sensing elements on one chip, the
SGP30 provides more detailed information about the air
quality.

The sensing element features an unmatched robustness
against contaminating gases present in real-world
applications enabling a unique long-term stability and low
drift. The very small 2.45 x 2.45 x 0.9 mm3 DFN package
enables applications in limited spaces. Sensirion’s
state-of-the-art production process guarantees highreproducibility and reliability. Tape and reel packaging,
together with suitability for standard SMD assembly
processes make the SGP30 predestined for high-volume
applications.

Figure 1 Functional block diagram of the SGP30.

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1

Sensor Performance

1.1 Gas Sensing Performance
The values listed in Table 1 are valid at 25°C, 50% RH and typical VDD.
ParameterSignalValuesMeasurement
range1Ethanol signal

0 ppm2 to 1000 ppm

H2 signal

0 ppm to 1000 ppm

Ethanol signal

0.3 ppm to 30 ppm

H2 signal

0.5 ppm to 3 ppm

Ethanol signal

see Figure 2
typ.: 15% of meas. value

H2 signalsee Figure 3
typ.: 10% of meas. value

Ethanol signal

see Figure 4
typ.: 1.3% of meas. value

Specified range

Accuracy3Long-term
drift3,4H2 signal

Resolution
Sampling
frequency

Ethanol signal
H2 signal
Ethanol signal
H2 signalsee Figure 5
typ.: 1.3% of meas. value

Comments

The specifications below are defined for this measurement
range. The specified measurement range covers the gas
concentrations expected in indoor air quality applications.
Accuracy is defined asc - csetcsetwith c the measured concentration and cset cref = 0.4 ppm
the concentration set point.
The concentration c is determined bysref - soutc = cref ∙ exp (
)
512
with
sout: Ethanol/Hydrogen signal output
at concentration csref: Ethanol/Hydrogen signal output
at 0.5 ppm H2

cref = 0.5 ppm

Change of accuracy over time: Siloxane accelerated
lifetime test5

0.2 % of meas. value

Resolution of Ethanol and Hydrogen signal outputs inrelative change of the measured concentration

Max. 40 Hz

Compare with minimum measurement duration in Table 10

Table 1 Gas sensing performance. Specifications are at 25°C, 50% RH and typical VDD. The sensors have been operated for at least 24h
before the first characterization.

1 Exposure to ethanol and H2 concentrations up to 1000 ppm have been tested. For applications requiring the measurement of higher gas

concentrations please contact Sensirion.
2 ppm: parts per million. 1 ppm = 1000 ppb (parts per billion)
3 90% of the sensors will be within the typical accuracy tolerance, >99% are within the maximum tolerance.
4 The long-term drift is stated as change of accuracy per year of operation.
5 Test conditions: operation in 250 ppm Decamethylcyclopentasiloxane (D5) for 200h simulating 10 years of operation in an indoor
environment.
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Accuracy ethanol signal

Accuracy H2 signal

Figure 2 Typical and maximum accuracy tolerance in % of
measured value at 25°C, 50% RH and typical VDD. The sensors
have been operated for at least 24h before the characterization.

Figure 3 Typical and maximum accuracy tolerance in % of
measured value at 25°C, 50% RH and typical VDD. The sensors
have been operated for at least 60h before the characterization.

Long-term drift Ethanol signal

Long-term drift H2 signal

Figure 4 Typical and maximum long-term drift in % of measured
value at 25°C, 50% RH and typical VDD. The sensors have been
operated for at least 24h before the first characterization.

Figure 5 Typical and maximum long-term drift in % of measured
value at 25°C, 50% RH and typical VDD. The sensors have been
operated for at least 60h before the first characterization.

1.2 Air Quality Signals
Air quality signals TVOC and CO2eq are calculated from Ethanol and H2 measurements using internal conversion and baseline
compensation algorithms (see Figure 6).
Baseline
compensation& Signal
conversion
Signal Processing

Figure 6 Simplified version of the functional block diagram (compare Figure 1) showing the signal
paths of the SGP30.

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Specifications of air quality signals are shown in Table 2.
Parameter
Output range

SignalValuesComments

TVOC signal

0 ppb to 60000 ppb

CO2eq signal

400 ppm to 60000 ppm
Range

Resolution

0 ppb - 2008 ppb

1 ppb

2008 ppb – 11110 ppb

6 ppb

11110 ppb – 60000 ppb

32 ppb400 ppm – 1479 ppm

1 ppm

1479 ppm – 5144 ppm

3 ppm

5144 ppm – 17597 ppm

9 ppm

17597 ppm – 60000 ppm

31 ppm

TVOC signal

CO2eq signal

TVOC signal

1 Hz

CO2eq signal

1 Hz

Maximum possible output range. The gas
sensing performance is specified for themeasurement range as defined in Table 1

The on-chip baseline compensation algorithm
has been optimized for this sampling rate. The
sensor shows best performance when usedwith this sampling rate.

Sampling rate

Table 2 Air quality signal specifications.

1.3 Recommended Operating and Storage Conditions
Gas Sensing Specifications as detailed in Table 1 are guaranteed only when the sensor is stored and operated under therecommended conditions. Prolonged exposure to conditions outside these conditions may accelerate aging.
The recommended temperature and humidity range for operating the SGP30 is 5–55 °C and 4–30 g m−3 absolute humidity,
respectively (see Figure 7 for the corresponding translation into relative humidity). It is recommended to store the sensor in atemperature range of 5–30 °C and below 30 g m−3 absolute humidity (see Figure 8 for the corresponding translation into relative
humidity). The sensor must not be exposed towards condensing conditions (i.e., >90 % relative humidity) at any time. To ensurea stable performance of the SGP30, conditions described in the document SGP Handling Instructions have to be met. Pleasealso refer to the Design-in Guide for optimal integration of the SGP30 into the final device.

Figure 7 Recommended relative humidity and temperature for
operating the SGP30.

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Figure 8 Recommended relative humidity and temperature forstoring the SGP30.

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2

Electrical Specifications

Parameter

Min.

Typ.

Max.

Unit

Comments

Supply voltage VDD

1.62

1.8

1.98

V

Minimal voltage must be guaranteed also for the
maximum supply current specified in this table.

Hotplate supply voltage VDDH

1.62

1.8

1.98

V

Supply current in measurement mode6

48.8

Sleep current

2mA

The measurement mode is activated by sending
an “sgp30_iaq_init” or “sgp30_measure_raw”
command. Specified at 25°C and typical VDD.

10μA

The sleep mode is activated after power-up or
after a soft reset. Specified at 25°C and typical
VDD.

LOW-level input voltage-0.5

0.3*VDDV

HIGH-level input voltage

0.7*VDD

VDD+0.5

V

Vhys hysteresis of Schmitt trigger inputs

0.05*VDD

V

LOW-level output voltage

0.2*VDDV

Communication(open-drain) at 2mA sink current

Digital 2-wire interface, I2C fast mode.

Table 3 Electrical specifications.

3Interface Specifications

The SGP30 comes in a 6-pin DFN package, see Table 4.
Pin

Name

Comments

1

VDD

Supply voltage

2

VSS

Ground1

3

SDA

Serial data, bidirectional

2

4

R

Connect to ground (no electrical function)

5

VDDH

Supply voltage, hotplate

6

SCL

Serial clock, bidirectional

3

S

GP

6
5

3
AX

0
4
89

Table 4 Pin assignment (transparent top view). Dashed lines are only visible from the bottom.

6 A 20% higher current is drawn during 5ms on VDDH after entering the measurement mode.

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Figure 9 Typical application circuit (for better clarity in the image, the positioning of the pins does notreflect the positions on the real sensor).

The electrical specifications of the SGP30 are shown in Table 3. The power supply pins must be decoupled with a 100 nF
capacitor that shall be placed as close as possible to pin VDD – see Figure 9. The required decoupling depends on the power
supply network connected to the sensor. We also recommend VDD and VDDH pins to be shorted7.
SCL is used to synchronize the communication between the microcontroller and the sensor. The SDA pin is used to transfer
data to and from the sensor. For safe communication, the timing specifications defined in the I 2C manual8 must be met. BothSCL and SDA lines are open-drain I/Os with diodes to VDD and VSS. They should be connected to external pull-up resistors.
To avoid signal contention, the microcontroller must only drive SDA and SCL low. The external pull-up resistors (e.g. Rp = 10 kΩ)are required to pull the signal high. For dimensioning resistor sizes please take bus capacity and communication frequency into
account (see for example Section 7.1 of NXPs I2C Manual for more details8). It should be noted that pull-up resistors may be
included in I/O circuits of microcontrollers.
The die pad or center pad is electrically connected to GND. Hence, electrical considerations do not impose constraints on thewiring of the die pad. However, for mechanical stability it is recommended to solder the center pad to the PCB.

4

Absolute Minimum and Maximum Ratings

Stress levels beyond those listed in Table 5 may cause permanent damage to the device. These are stress ratings for theelectrical components only and functional operation of the device at these conditions cannot be guaranteed. Exposure to theabsolute maximum rating conditions for extended periods may affect the reliability of the device.
Parameter

RatingSupply voltage VDD-0.3 V to +2.16 V

Supply voltage VDDH

-0.3 V to +2.16 V

Storage temperature range-40 to +125°C

Operating temperature range-40 to +85°C

Humidity Range

10% - 95% (non-condensing)

ESD HBM

2 kV

ESD CDM

500 V

Latch up, JESD78 Class II, 125°C

100 mA

Table 5 Absolute minimum and maximum ratings.

Please refer to Handling Instructions for Sensirion Gas Sensors on Sensirion webpage for full documentation.

7 If VDD and VDDH are not shorted, it is required that VDD is always powered when VDDH is powered. Otherwise, the sensor might bedamaged.
8 http://www.nxp.com/documents/user_manual/UM10204.pdf
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5

Timing Specifications

5.1 Sensor System Timings
The timings refer to the power up and reset of the ASIC part and do not reflect the usefulness of the readings.
Parameter

SymbolCondition

Min.

Typ.

Max.

Unit

Comments

Power-up timetPU

After hard reset, VDD ≥VPOR

-

0.4

0.6

ms

-

Soft reset timetSR

After soft reset

-

0.4

0.6

ms

-

Table 6 System timing specifications.

5.2 Communication Timings
Parameter

SymbolConditions

Min.

Typ.

Max.

Units

Comments

SCL clock frequency

fSCL

-

0

-

400

kHz

-

Hold time (repeated) START
condition

tHD;STA

After this period, thefirst clock pulse isgenerated

0.6

-

-

µs

-

LOW period of the SCL clock

tLOW

-

1.3

-

-

µs

-

HIGH period of the SCL clock

tHIGH

-

0.6

-

-

µs

-

Set-up time for a repeated START
condition

tSU;STA

-

0.6

-

-

µs

-

SDA hold time

tHD;DAT

-

0

-

-

ns

-

SDA set-up time

tSU;DAT

-

100

-

-

ns

-

SCL/SDA rise time

tR

-

-

-

300

ns

-

SCL/SDA fall time

tF

-

-

-

300

ns

-

SDA valid timetVD;DAT

-

-

-

0.9

µs

-

Set-up time for STOP conditiontSU;STO

-

0.6

-

-

µs

-

Capacitive load on bus line

CB

-

400

pF

-

Table 7 Communication timing specifications.
1/fSCL
tHIGH

tR

tLOW

tF
70%

SCL
tSU;DAT30%
tHD;DATDATA IN

70%

SDA

30%
tVD;DATDATA OUT

SDA

tF

tR
70%
30%

Figure 10 Timing diagram for digital input/output pads. SDA directions are seen from the sensor.
Bold SDA lines are controlled by the sensor; plain SDA lines are controlled by the micro-controller.
Note that SDA valid read time is triggered by falling edge of preceding toggle.

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6

Operation and Communication

The SGP30 supports I2C fast mode. For detailed information on the I2C protocol, refer to NXP I2C-bus specification8. All SGP30
commands and data are mapped to a 16-bit address space. Additionally, data and commands are protected with a CRC
checksum to increase the communication reliability. The 16-bit commands that are sent to the sensor already include a 3-bit
CRC checksum. Data sent from and received by the sensor is always succeeded by an 8-bit CRC.
In write direction it is mandatory to transmit the checksum, since the SGP30 only accepts data if it is followed by the correct
checksum. In read direction it is up to the master to decide if it wants to read and process the checksum.
SGP30

Hex. CodeI2C address

0x58

Table 8 I2C device address.

The typical communication sequence between the I2C master (e.g., a microcontroller in a host device) and the sensor isdescribed as follows:
1. The sensor is powered up, communication is initialized
2. The I2C master periodically requests measurement and reads data, in the following sequence:a. I2C master sends a measurement command
b. I2C master waits until the measurement is finished, either by waiting for the maximum execution time or by waiting
for the expected duration and then poll data until the read header is acknowledged by the sensor (expected
durations are listed in Table 10)
c. I2C master reads out the measurement result

6.1 Power-Up and Communication Start
The sensor starts powering-up after reaching the power-up threshold voltage VDD,Min specified in Table 3. After reaching thisthreshold voltage, the sensor needs the time tPU to enter the idle state. Once the idle state is entered it is ready to receive
commands from the master.
Each transmission sequence begins with a START condition (S) and ends with a STOP condition (P) as described in the I 2Cbus specification.

6.2 Measurement Communication Sequence
A measurement communication sequence consists of a START condition, the I2C write header (7-bit I2C device address plus 0
as the write bit) and a 16-bit measurement command. The proper reception of each byte is indicated by the sensor. It pulls the
SDA pin low (ACK bit) after the falling edge of the 8th SCL clock to indicate the reception. With the acknowledgement of themeasurement command, the SGP30 starts measuring.
When the measurement is in progress, no communication with the sensor is possible and the sensor aborts the communication
with a XCK condition.
After the sensor has completed the measurement, the master can read the measurement results by sending a START condition
followed by an I2C read header. The sensor will acknowledge the reception of the read header and responds with data. The
response data length is listed in Table 10 and is structured in data words, where one word consists of two bytes of data followed
by one byte CRC checksum. Each byte must be acknowledged by the microcontroller with an ACK condition for the sensor tocontinue sending data. If the sensor does not receive an ACK from the master after any byte of data, it will not continue sendingdata.
After receiving the checksum for the last word of data, an XCK and STOP condition have to be sent (see Figure 12).
The I2C master can abort the read transfer with a XCK followed by a STOP condition after any data byte if it is not interested insubsequent data, e.g. the CRC byte or following data bytes, in order to save time. Note that the data cannot be read more thanonce, and access to data beyond the specified amount will return a pattern of 1s.

6.3 Measurement Commands
The available measurement commands of the SGP30 are listed in Table 10.
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Air Quality Signals
SGP30 uses a dynamic baseline compensation algorithm and on-chip calibration parameters to provide two complementary air
quality signals. Based on the sensor signals a total VOC signal (TVOC) and a CO2 equivalent signal (CO2eq) are calculated.
Sending an “sgp30_iaq_init” command starts the air quality measurement. After the “sgp30_iaq_init” command, a“sgp30_measure_iaq” command has to be sent in regular intervals of 1s to ensure proper operation of the dynamic baseline
compensation algorithm. The sensor responds with 2 data bytes (MSB first) and 1 CRC byte for each of the two preprocessed
air quality signals in the order CO2eq (ppm) and TVOC (ppb). For the first 15s after the “sgp30_iaq_init” command the sensor isin an initialization phase during which a “sgp30_measure_iaq” command returns fixed values of 400 ppm CO2eq and 0 ppb
TVOC.
A new “sgp30_iaq_init” command has to be sent after every power-up or soft reset. The command sequence after start-up for
initializing and repeating measurements is illustrated in Figure 11.

Figure 11 Command sequence for starting and repeating measurements. An example implementation of a generic driver can befound in the document SGP30 driver integration guide on Sensirion webpage.

Set and Get Baseline
The SGP30 also provides the possibility to read and write the baseline values of the baseline compensation algorithm. Thisfeature is used to save the baseline in regular intervals on an external non-volatile memory and restore it after a new power-up
or soft reset of the sensor. The command “sgp30_get_iaq_baseline” returns the baseline values for the two air quality signals.
The sensor responds with 2 data bytes (MSB first) and 1 CRC byte for each of the two values in the order CO 2eq and TVOC.
These two values should be stored on an external memory. After a power-up or soft reset, the baseline of the baseline
compensation algorithm can be restored by sending first an “sgp30_iaq_init” command followed by a “sgp30_set_iaq_baseline”
command with the two baseline values as parameters in the order as (TVOC, CO2eq). An example implementation of a genericdriver for the baseline algorithm can be found in the document SGP30 driver integration guide.

Inceptive Baseline for TVOC measurements9
The inceptive baseline offers an individually calibrated starting reference to the dynamic baseline compensation algorithm.
Thereby the feature yields a better TVOC concentration accuracy for the very first start-up under bad air condition. This results
in a better user experience especially when accuracy is required. Please note, that the application of this feature is solely limited
to the very first start-up period of an SGP sensor. Furthermore, it is limited to the TVOC signal output.
“sgp30_get_tvoc_inceptive_baseline” reads the precalibrated reference point from the sensor HW and“sgp30_set_tvoc_baseline” activates the inceptive baseline.
Only use “sgp30_set_tvoc_baseline” when activating the inceptive baseline.

9

The inceptive baseline feature is available for SGP30 sensors with feature set 34 and later.

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Sensor Raw Signals
The command “sgp30_measure_raw” is intended for part verification and testing purposes. It returns the sensor raw signals
which are used as inputs for the on-chip calibration and baseline compensation algorithms as shown in the functional block
diagram in section 1.2. The command performs a measurement to which the sensor responds with 2 data bytes (MSB first) and1 CRC byte (see Figure 12) for 2 sensor raw signals in the order H2 signal (sout_H2) and Ethanol signal (sout_EtOH). Both signals
can be used to calculate gas concentrations c relative to a reference concentration cref bysref - soutc = cref ∙ exp ()
512
with sout the sensor raw signal for H2: sout = sout_H2 or for Ethanol: sout = sout_EtOH, and sref the H2 raw signal or Ethanol raw signal
output at the corresponding reference concentration cref_H2 or cref_EtOh.

Humidity Compensation
The SGP30 features an on-chip humidity compensation for the air quality signals (CO 2eq and TVOC) and sensor raw signals(H2 signal and Ethanol signal). To use the on-chip humidity compensation an absolute humidity value from an external humidity
sensor like the SHTxx is required. Using the “sgp30_set_absolute_humidity” command, a new humidity value can be written to
the SGP30 by sending 2 data bytes (MSB first) and 1 CRC byte. The 2 data bytes represent humidity values as a fixed-point
8.8bit number with a minimum value of 0x0001 (=1/256 g/m3) and a maximum value of 0xFFFF (255 g/m3 + 255/256 g/m3). For
instance, sending a value of 0x0F80 corresponds to a humidity value of 15.50 g/m3 (15 g/m3 + 128/256 g/m3).
After setting a new humidity value, this value will be used by the on-chip humidity compensation algorithm until a new humidity
value is set using the “sgp30_set_absolute_humidity” command. Restarting the sensor (power-on or soft reset) or sending avalue of 0x0000 (= 0 g/m3) disables the humidity compensation until a new humidity value is sent.
Absolute humidity values dV in unit g/m3 can be calculated by the following formula:RH
17.62 ∙ T
∙ 6.112 ∙ exp ()
243.12 + T
100%
dv (T, RH) = 216.7 ∙ [],273.15+T
with temperature T and relative humidity RH.
Example: Inserting T = 25°C and RH = 50% in the formula above results in the absolute humidity dV = 11.8 g/m3.

Feature Set
The SGP30 features a versioning system for the available set of measurement commands and on-chip algorithms. This so calledfeature set version number can be read out by sending a “sgp30_get_feature_set” command. The sensor responds with 2 databytes (MSB first) and 1 CRC byte (see Table 9). This feature set version number is used to refer to a corresponding set ofavailable measurement commands as listed in Table 10.
Most significant byte (MSB)
Bit

1

2
3
4
Product type
SGP30: 0

5
6
7
Reserved for
future use

Least significant byte (LSB)
8

9

10

0

11

12

13

14

15

16

Product version

Table 9 Structure of the SGP feature set number. Please note that the last 5 bits of the product version (bits 12-16 of the LSB) are subject
to change. This is used to track new features added to the SGP multi-pixel platform.

Measure Test
The command “sgp30_measure_test” which is included for integration and production line testing runs an on-chip self-test. In
case of a successful self-test the sensor returns the fixed data pattern 0xD400 (with correct CRC).

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Feature Set

0x0022

Command

Hex. CodeParameter length
including CRC[bytes]Response length
including CRC[bytes]Measurement duration
[ms]
Typ.

Max.

sgp30_iaq_init

0x2003

-

-

2

10

sgp30_measure_iaq

0x2008

-

6

10

12

sgp30_get_iaq_baseline

0x2015

-

6

1

10

sgp30_set_iaq_baseline

0x201e

6

-

1

10

sgp30_set_absolute_humidity

0x2061

3

-

1

10

sgp30_measure_test10

0x2032

-

3

200

220

sgp30_get_feature_set

0x202f

-

3

1

10

sgp30_measure_raw

0x2050

-

6

20

25

sgp30_get_tvoc_inceptive_baseline

0x20b3

-

3

1

10

sgp30_set_tvoc_baseline

0x2077

3

-

1

10

Table 10 Measurement commands.

6.4 Soft Reset
A sensor reset can be generated using the “General Call” mode according to I2C-bus specification. It is important to understandthat a reset generated in this way is not device specific. All devices on the same I2C bus that support the General Call mode will
perform a reset. The appropriate command consists of two bytes and is shown in Table 11.
Hex. Code

Address byte

0x00

Second byte

0x06

Reset Command using the General Call address

0x0006
2

3

4

5

6

7

8

S General Call AddressstGeneral Call 1 byte

9

ACK

1

1

2

3

4

5

6

7

Reset Command

8

9

ACK

CommandGeneral Call 2nd byte

Table 11 Reset through the General Call address (Clear blocks are controlled by the microcontroller, grey blocks by the sensor.).

10 The « sgp30_measure_test » command is intended for production line testing and verification only. It should not be used after having

issued an “sgp30_iaq_init” command. For the duration of the « sgp30_measure_test » command, the sensor is operated in measurementmode with a supply current as specified in Table 3. After the command, the sensor is in sleep mode.
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6.5 Get Serial ID
The readout of the serial ID register can be used to identify the chip and verify the presence of the sensor. The appropriate
command structure is shown in Table 12. After issuing the measurement command and sending the ACK Bit the sensor needs
the time tIDLE = 0.5ms to respond to the I2C read header with an ACK Bit. Hence, it is recommended to wait tIDLE =0.5ms before
issuing the read header.
The get serial ID command returns 3 words, and every word is followed by an 8-bit CRC checksum. Together the 3 words
constitute a unique serial ID with a length of 48 bits.
The ID returned with this command are represented in the big endian (or MSB first) format.

Command

Hex. CodeGet Serial ID

0x3682
4

5

6

7

8

9

1

W

I2C write header

2

3

4

5

6

7

Command MSB

89

10 11 12 13 14 15 16 17 18

Command LSB

ACK

3

ACK

2

I2C Address

ACK

1

S

16-bit command

Table 12 Get serial ID command.

6.6 Checksum Calculation
The 8-bit CRC checksum transmitted after each data word is generated by a CRC algorithm. Its properties are displayed inTable 13. The CRC covers the contents of the two previously transmitted data bytes. To calculate the checksum only these two
previously transmitted data bytes are used.
Property

Value

Name

CRC-8

Width

8 bit

Protected Dataread and/or write data

Polynomial

0x31 (x8 + x5 + x4 + 1)

Initialization

0xFF

Reflect input

False

Reflect output

False

Final XOR

0x00

ExamplesCRC (0xBEEF) = 0x92

Table 13 I2C CRC properties.

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6.7 Communication Data Sequences

Figure 12 Communication sequence for starting a measurement and reading measurement results.

7

Quality

7.1 Environmental Stability
The qualification of the SGP30 was performed based on the JEDEC JESD47 qualification test method.

7.2 Material Contents
The device is fully RoHS and WEEE compliant, e.g., free of Pb, Cd, and Hg.

8

Device Package

SGP30 sensors are provided in a DFN (dual flat no leads) package with an outline of 2.45 × 2.45 × 0.9 mm3 and a terminal pitchof 0.8 mm. The circular sensor opening of maximally 1.6 mm diameter is centered on the top side of the package. The sensor
chip is assembled on a Ni/Pd/Au plated copper lead frame. Sensor chip and lead frame are over-molded by a black, epoxybased mold compound. Please note that the side walls of the package are diced and therefore the lead frame sidewall surfaces
are not plated.

8.1 Moisture Sensitivity Level
The Moisture Sensitivity Level classification of the SGP30 is MSL1, according to IPC/JEDEC J-STD-020.

8.2 Traceability
All SGP30 sensors are laser marked for simple identification and traceability. The marking on the sensor consists of the productname and a 4-digit, alphanumeric tracking code. This code is used by Sensirion for batch-level tracking throughout production,
calibration, and testing. Detailed tracking data can be provided upon justified request. The pin-1 location is indicated by the
keyhole pattern in the light-colored central area. See Figure 13 for illustration.
S

GP

3
AX

0
89

Figure 13 Laser marking on SGP30. The pin-1 location is indicated by the keyhole pattern in the lightcolored central area. The bottom line contains a 4-digit alphanumeric tracking codewww.sensirion.com

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8.3 Package Outline
2.45

0.3x45o

0.9

0.35

1.7

2.45

0.8

0.2*

0.4

1.25

Figure 14 Package outlines drawing of the SGP30 with nominal values. Dimensions are given in
millimeters. The die pad shows a small recess in the bottom left part. * These dimensions are not welldefined and given as a reference only.

8.4 Landing PatternFigure 15 shows the PCB landing pattern. The landing pattern is understood to be the metal layer on the PCB, onto which the
DFN pads are soldered. The solder mask is understood to be the insulating layer on top of the PCB covering the copper traces.
It is recommended to design the solder mask as a Non-Solder Mask Defined (NSMD) type. For solder paste printing it isrecommended to use a laser-cut, stainless steel stencil with electro-polished trapezoidal walls and with 0.125 to 0.150 mm
stencil thickness. The length of the stencil apertures for the I/O pads should be the same as the PCB pads. However, the positionof the stencil apertures should have an offset of 0.1 mm away from the package center, as indicated in Figure 15. The die pad
aperture should cover 70 – 90 % of the die pad area, resulting in a size of about 1.05 mm x 1.5 mm.
For information on the soldering process and further recommendation on the assembly process please contact Sensirion.

Figure 15 Recommended landing pattern.

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8.5 Soldering Instructions
Standard reflow soldering ovens may be used for soldering. The sensors are designed to withstand a soldering profile
according to IPC/JEDEC J-STD-020. Peak temperatures of TP = 245 °C during up to tp = 30 seconds for Pb-free assembly in
IR/Convection reflow ovens (see Figure 16) are recommended. In addition, we also recommend a maximum ramp-down rateof < 4 °C/s.

Figure 16 Soldering profile according to JEDEC standard. Recommended conditions are TP =245
°C and tP ≤ 30 sec for Pb-free assembly, TL < 220 °C and tL < 150 s. Ramp-up rate < 3 °C/s andramp-down rate < 4 °C/s.

It is recommended not to use vapor phase soldering to avoid potential contamination of the sensor. Please refer to Handling
Instructions for Sensirion Gas Sensors on Sensirion webpage for full documentation.

9

Tape & Reel Package
Ø1.5 +.1 /-0.0
4.00
2.00 ±.05 SEE Note 20.30 ±.05

Ø1.00 MIN
1.75 ±.1

4.00 SEE Note 1
A

5.50 ±.05
SEE NOTE 2

R 0.2 MAX.
B0
B

12.0 +0.3/-0.1
A

R 0.25 TYP.

K0
A0

SECTION A - A

A0 = 2.75
B0 = 2.75
K0 = 1.20
TOLERANCES - UNLESSNOTED 1PL ±.2 2PL ±.10

NOTES:
1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ±0.2
2. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED
AS TRUE POSITION OF POCKET, NOT POCKET HOLE
3. A0 AND B0 ARE CALCULATED ON A PLANE AT A DISTANCE "R"ABOVE THE BOTTOM OF THE POCKETDETAIL B

Figure 17 Technical drawing of the packaging tape with sensor orientation in tape. Header tape is to
the right and trailer tape to the left on this drawing. Dimensions are given in millimeters.

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10 Ordering Information
Use the part names and product numbers shown in the following table when ordering the SGP30 multi-pixel gas sensor. For
the latest product information and local distributors, visit www.sensirion.com.
Part Name

Tape & Reel Size

Product Number

SGP30, TAPE ON REEL, 2500 PCS

2500

1-101646-01

Table 14 SGP30 ordering options

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Revision History
Date
May, 2020www.sensirion.com

Version
1.0

Page(s)–Changes–

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Important Notices
Warning, Personal Injury
Do not use this product as safety or emergency stop devices or in any other application where failure of the product could result in personal
injury. Do not use this product for applications other than its intended and authorized use. Before installing, handling, using or servicing thisproduct, please consult the data sheet and application notes. Failure to comply with these instructions could result in death or serious injury.
If the Buyer shall purchase or use SENSIRION products for any unintended or unauthorized application, Buyer shall defend, indemnify and hold harmless
SENSIRION and its officers, employees, subsidiaries, affiliates and distributors against all claims, costs, damages and expenses, and reasonable attorneyfees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if SENSIRION shallbe allegedly negligent with respect to the design or the manufacture of the product.

ESD Precautions
The inherent design of this component causes it to be sensitive to electrostatic discharge (ESD). To prevent ESD-induced damage and/or degradation, takecustomary and statutory ESD precautions when handling this product.
See application note “ESD, Latchup and EMC” for more information.

Warranty
SENSIRION warrants solely to the original purchaser of this product for a period of 12 months (one year) from the date of delivery that this product shall beof the quality, material and workmanship defined in SENSIRION’s published specifications of the product. Within such period, if proven to be defective,
SENSIRION shall repair and/or replace this product, in SENSIRION’s discretion, free of charge to the Buyer, provided that:
notice in writing describing the defects shall be given to SENSIRION within fourteen (14) days after their appearance;such defects shall be found, to SENSIRION’s reasonable satisfaction, to have arisen from SENSIRION’s faulty design, material, or workmanship;
the defective product shall be returned to SENSIRION’s factory at the Buyer’s expense; andthe warranty period for any repaired or replaced product shall be limited to the unexpired portion of the original period.
This warranty does not apply to any equipment which has not been installed and used within the specifications recommended by SENSIRION for the intended
and proper use of the equipment. EXCEPT FOR THE WARRANTIES EXPRESSLY SET FORTH HEREIN, SENSIRION MAKES NO WARRANTIES, EITHER
EXPRESS OR IMPLIED, WITH RESPECT TO THE PRODUCT. ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION, WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE EXPRESSLY EXCLUDED AND DECLINED.
SENSIRION is only liable for defects of this product arising under the conditions of operation provided for in the data sheet and proper use of the goods.
SENSIRION explicitly disclaims all warranties, express or implied, for any period during which the goods are operated or stored not in accordance with thetechnical specifications.
SENSIRION does not assume any liability arising out of any application or use of any product or circuit and specifically disclaims any and all liability, including
without limitation consequential or incidental damages. All operating parameters, including without limitation recommended parameters, must be validated
for each customer’s applications by customer’s technical experts. Recommended parameters can and do vary in different applications.
SENSIRION reserves the right, without further notice, (i) to change the product specifications and/or the information in this document and (ii) to improvereliability, functions and design of this product.
Copyright© 2020 by SENSIRION.
CMOSens® is a trademark of Sensirion
All rights reserved

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Headquarters and Subsidiaries
Sensirion AG
Laubisruetistr. 50
CH-8712 Staefa ZH
Switzerland

Sensirion Inc., USA
phone: +1 312 690 5858
info-us@sensirion.com
www.sensirion.com

Sensirion Korea Co. Ltd.
phone: +82 31 337 7700~3
info-kr@sensirion.com
www.sensirion.com/kr

phone: +41 44 306 40 00
fax:+41 44 306 40 30
info@sensirion.com
www.sensirion.com

Sensirion Japan Co. Ltd.
phone: +81 3 3444 4940
info-jp@sensirion.com
www.sensirion.com/jp

Sensirion China Co. Ltd.
phone: +86 755 8252 1501
info-cn@sensirion.com
www.sensirion.com/cn

Sensirion Taiwan Co. Ltd
phone: +886 3 5506701
info@sensirion.com
www.sensirion.com

To find your local representative, please visit www.sensirion.com/distributors

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