ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
DESCRIPTION
The PS2501-1, PS2501-2 and PS2501-4 series of
optically coupled isolator consist of an infrared lightemitting diode and an NPN silicon photo transistor ina space efficient Dual In Line Plastic Package.

PS2501-1

FEATURES
••
•
•
•
•

AC Isolation Voltage 5300VRMS
CTR Selections Available
Wide Operating Temperature Range-30°C to +100°C
Lead Free and RoHS Compliant
UL File E91231 Package Code “EE”
VDE Approval Certificate No. 40028086

PS2501-2

PS2501-4

APPLICATIONS••••Computer Terminals
Industrial System Controllers
Measuring Instruments
Signal Transmission between Systems ofDifferent Potentials and Impedances

ABSOLUTE MAXIMUM RATINGS
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.

Input

ORDER INFORMATION••••

Add X after PN for VDE Approval
Add G after PN for 10mm lead spacing
Add SM after PN for Surface Mount
Add SMT&R after PN for Surface Mount
Tape & Reel
(Available for PS2501-1SM and PS2501-2SM)

Forward Current
Reverse Voltage
Power dissipation

50mA
6V
70mW

OutputCollector to Emitter Voltage BVCEO
Emitter to Collector Voltage BVECO
Collector Current
Power Dissipation

80V
6V
50mA
150mW

Total Package
Operating Temperature
Storage Temperature
Total Power Dissipation(derate linearly 2.67mW/°C at >25°C)
Lead Soldering Temperature (10s)

ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk

http://www.isocom.com

1 15/12/2016-30 to +100 °C-55 to +125 °C
200mW
260°C

ISOCOM COMPONENTS ASIA LTD
Hong Kong Office
Block A, 8/F, Wah Hing Industrial Mansion
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25°C unless otherwise specified)
INPUT
Parameter

SymbolTest Condition

MinTyp.

Max

Unit

Forward Voltage

VF

IF = 20mA1.2

1.4

V

Reverse Voltage

VR

IR = 10μA

Reverse Leakage

IR

VR = 4V

Terminal CapacitanceCt

V = 0V, f = 1KHz

Parameter

SymbolTest Condition

MinCollector—Emitter
Breakdown Voltage

BVCEO

IC = 1mA, IF = 0mA

80

V

Emitter—Collector
Breakdown Voltage

BVECO

IE = 100µA, IF = 0mA

6V

Collector-Emitter
Dark Current

ICEO

VCE = 20V, IF = 0mA

SymbolTest Condition

6.0

V
10µA

30250

pF

Typ.

Max

Unit

OUTPUT

100nA

Max

Unit%

COUPLED
Parameter
Current transfer ratio

CTR

Min

Typ.

IF = 5mA, VCE = 5V

80600

Optional CTR Grades
GRL (PS2501-1 only)

100
200

300
400

Collector—Emitter
Saturation Voltage

VCE(sat)

IF = 10mA, IC = 2mA

0.3V

Input to Output
Isolation Voltage

VISO

AC 1 minute, RH = 40 to 60%
Note 15300

VRMS

Input to Output
Isolation Resistance

RISO

VIO= 500V
Note 15x1010ΩOutput Rise Timetr

VCE = 2V, Ic = 2mA, RL = 100Ω

418µs

Output Fall Timetf

VCE = 2V, Ic = 2mA, RL = 100Ω

318µs

Note 1 : Measure with input leads shorted together and output leads shorted together.

2 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4

Fig 1 Forward Current vs TA

Fig 2 Collector Power Dissipation vs TA

Fig 3 Collector-emitter Saturation Voltage vsForward Current

Fig 4 Collector Current vsCollector-emitter Voltage

Fig 5 Current Transfer Ratio vs Forward Current

Fig 6 Forward Current vs Forward Voltage

3 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4

Fig 7 Relative CTR vs TA

Fig 8 Frequency Response

Fig 9 Response Time vs Load Resistance

Response Time Test Circuit

4 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
ORDER INFORMATION
PS2501-1 (UL Approval)
After PN

Description

PN

Packing quantity

None

PS2501-1, PS2501-1GR,
PS2501-1L

Standard DIP4

100 pcs per tube

G

PS2501-1G, PS2501-1GRG,
PS2501-1LG

10mm Lead Spacing

100 pcs per tube

SM

PS2501-1SM, PS2501-1GRSM,
PS2501-1LSM

Surface Mount

100 pcs per tube

SMT&R

PS2501-1SMT&R,
PS2501-1GRSMT&R,
PS2501-1LSMT&R

Surface Mount Tape & Reel

1000 pcs per reel

PS2501-2 (UL Approval)
After PN

Description

PN

Packing quantity

None

PS2501-2, PS2501-2GRStandard DIP850 pcs per tube

GPS2501-2G, PS2501-2GRG

10mm Lead Spacing

50 pcs per tube

SMPS2501-2SM, PS2501-2GRSM

Surface Mount

50 pcs per tube

SMT&R

PS2501-2SMT&R,
PS2501-2GRSMT&R,

Surface Mount Tape & Reel

1000 pcs per reel

PS2501-4 (UL Approval)
After PN

PN

Description

Packing quantity

None

PS2501-4, PS2501-4GR

Standard DIP16

25 pcs per tube

GPS2501-4G, PS2501-4GRG

10mm Lead Spacing

25 pcs per tube

SM

PS2501-4SM, PS2501-4GRSM

Surface Mount

25 pcs per tube

CTR grade “L” available only for PS2501-1.

5 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
ORDER INFORMATION
PS2501-1X (UL and VDE Approvals)
After PN

Description

PN

Packing quantity

None

PS2501-1X, PS2501-1XGR,
PS2501-1XL

Standard DIP4

100 pcs per tube

G

PS2501-1XG, PS2501-1XGRG,
PS2501-1XLG

10mm Lead Spacing

100 pcs per tube

SM

PS2501-1XSM,
PS2501-1XGRSM,
PS2501-1XLSM

Surface Mount

100 pcs per tube

SMT&R

PS2501-1XSMT&R,
PS2501-1XGRSMT&R,
PS2501-1XLSMT&R

Surface Mount Tape & Reel

1000 pcs per reel

PS2501-2X (UL and VDE Approvals)
After PN

Description

PN

Packing quantity

None

PS2501-2X, PS2501-2XGR

Standard DIP850 pcs per tube

GPS2501-2XG, PS2501-2XGRG

10mm Lead Spacing

50 pcs per tube

SMPS2501-2XSM,
PS2501-2XGRSM,

Surface Mount

50 pcs per tube

SMT&R

PS2501-2XSMT&R,
PS2501-2XGRSMT&R

Surface Mount Tape & Reel

1000 pcs per reel

PS2501-4X (UL and VDE Approvals)
After PN

PN

Description

Packing quantity

None

PS2501-4X, PS2501-4XGR,Standard DIP16

25 pcs per tube

GPS2501-4XG, PS2501-4XGRG

10mm Lead Spacing

25 pcs per tube

SM

PS2501-4XSM,
PS2501-4XGRSM

Surface Mount

25 pcs per tube

CTR grade “L” available only for PS2501-1.

6 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
PACKAGE DIMENSIONS in mm (inch)
DIP

PS2501-1

PS2501-2

PS2501-4

7 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
PACKAGE DIMENSIONS in mm (inch)
G Form

PS2501-1G

PS2501-2G

PS2501-4G

8 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
PACKAGE DIMENSIONS in mm (inch)
SMD

PS2501-1SM

PS2501-2SM

PS2501-4SM

9 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
RECOMMENDED PAD LAYOUT FOR SMD (mm)PS2501-1SM

PS2501-2SM

PS2501-4SM

10 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
TAPE AND REEL PACKAGING

PS2501-1SMT&R

PS2501-2SMT&R

11 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD(One Time Reflow Soldering is Recommended)

TP260°CTP - 5°C
Max Ramp Up Rate
3°C/s

TEMP (°C)

TL
TsmaxtP

Max Ramp Down Rate
6°C/s

217°C

TL

200°C

Tsmin 150°C
ts Preheat
60s – 120s

25°C
TIME (s)Time 25°C to Peak Temperature

Profile Details

Conditions

Preheat- Min Temperature (TSMIN)- Max Temperature (TSMAX)- Time TSMIN to TSMAX (ts)

150°C
200°C
60s - 120s

Soldering Zone
- Peak Temperature (TP)- Time at Peak Temperature- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP ̶ 5°C)
- Time maintained above TL (tL)- Ramp Up Rate (TL to TP)- Ramp Down Rate (TP to TL)

260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max

Average Ramp Up Rate (Tsmax to TP)

3°C/s maxTime 25°C to Peak Temperature

8 minutes max

12 15/12/2016

DD93204

ISOCOMCOMPONENTS

PS2501-1, PS2501-2, PS2501-4
NOTES :
- Isocom is continually improving the quality, reliability, function or design and Isocom reserves
the right to make changes without further notices.
- The products shown in this publication are designed for the general use in electronic
applications such as office automation equipment, communications devices, audio/visualequipment, electrical application and instrumentation.
- For equipment/application where high reliability or safety is required, such as space
applications, nuclear power control equipment, medical equipment, etc., please contact oursales representatives.
- When requiring a device for any ”specific” application, please contact our sales for advice.
- The contents described herein are subject to change without prior notice.
- Do not immerse device body in solder paste.

13 15/12/2016

DD93204

ISOCOMCOMPONENTSDISCLAIMER__ ISOCOM is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,when utilizing ISOCOM products, to comply with the standards of safety in making a safe
design for the entire system, and to avoid situations in which a malfunction or failure of such
ISOCOM products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that ISOCOM products are used within specified
operating ranges as set forth in the most recent ISOCOM products specifications.
__ The ISOCOM products listed in this document are intended for usage in generalelectronics applications (computer, personal equipment, office equipment, measuringequipment, industrial robotics, domestic appliances, etc.). These ISOCOM products areneither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodilyinjury (“Unintended Usage”). Unintended Usage include atomic energy control instruments,
airplane or spaceship instruments, transportation Instruments, traffic signal instruments,
combustion control instruments, medical Instruments, all types of safety devices, etc..
Unintended Usage of ISOCOM products listed in this document shall be made at thecustomer’s own risk.
__ Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals todissolve them. When disposing of the products, follow the appropriate regulations. Do notdispose of the products with other industrial waste or with domestic garbage.
__ The products described in this document are subject to the foreign exchange and foreign
trade laws.
__ The information contained herein is presented only as a guide for the applications of ourproducts. No responsibility is assumed by ISOCOM Components for any infringements ofintellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of
ISOCOM Components or others.
__ The information contained herein is subject to change without notice.

14 15/12/2016

DD93204