Monday, September 26
13:00-17:30
Short Course A (201) : Scaling and monolithic vs. heterogeneous integration for advanced, future technology nodes
Short Course B (301) : Recent advances in ultra-wide-bandgap semiconductors

Tuesday, September 27
9:00-11:10 (Convention Hall) : Opening & Award Ceremony & Plenary Session 1
101

102

103

104

105

201

301

302

303

304

11:30 ~ 12:15

11:30 ~ 12:30

11:30 ~ 12:45

11:30 ~ 12:30

11:30 ~ 12:45

11:30 ~ 12:30

11:30 ~ 12:30

11:30 ~ 12:30[C-1] Energy Harvesting Devices[D-1] Micro/Nano Technologies forBiosensing and Interfaces[E-1] Emerging Thin Film Devices andTechnologies[F-1] Ferroelectric Memory Materials[G-1] Cryo-CMOS[H-1] Characterization I: Low
Dimensional Devices and Materials[J-1] Advanced Technologies for GaN
Devices[K-1] 3D Integration and Advanced
Packaging I

Lunch Break

14:00 ~ 15:30

14:00 ~ 15:45

14:00 ~ 15:30

14:00 ~ 15:45

14:00 ~ 16:00

14:00 ~ 15:30

14:00 ~ 16:00

14:00 ~ 15:45

14:00 ~ 15:30

14:00 ~ 15:15[A-2] New Materials and Platforms forPhotonics[B-2] Wide Bandgap Materials[C-2] Inorganic Semiconductor
Materials & Applications[D-2] Biosensor, Chips and Microfluidic
Devices for Cell Functions[E-2] Advanced Group IV Thin Film
Devices and Technologies[F-2] PCM, MRAM, and RRAM

[G-2] Modeling, Simulation andCharacterization[H-2] Novel Function Devices[J-2] GaN-based High-speed Devices[K-2] Advanced Sensor Systems

Break

16:15 ~ 18:00

16:15 ~ 18:00

16:15 ~ 18:00

16:15 ~ 18:00

16:15 ~ 18:00

16:15 ~ 17:45
Area1&2&9

16:15 ~ 18:00

16:15 ~ 17:45[B-3] Group IV Materials I[C-3] Perovskite Solar Cells[D-3] Advanced Technologies for Bioand Chemical Sensing[E-3] Oxide Semiconductor TFT[F-3] Ferroelectric Devices[G-3] Quantum Computing I
Focus Session 1[H-3] Characterization II: Low
Dimensional Devices and Materials[J-3] High-speed Devices

16:15 ~ 17:45
Area3&5&12[K-3] Design, Process, and Technology
for High-performance Chiplet I
Focus Session 3Break

18:30-20:30 (Convention Hall) : Complimentary Reception * On-site Event

Wednesday, September 28
101

102

103

104

105

09:00 ~ 10:15

09:00 ~ 11:15
Area1&10[C-4] Battery, Photocatalyst,
Photodetector[E-4] Oxide Semiconductors for Logicand Memory Applications
Joint Session

201

301

302

303

304

09:00 ~ 10:15

09:00 ~ 10:15
Area1&2&9

09:00 ~ 10:00

09:00 ~ 10:15

09:00 ~ 10:15[H-4] Device Application I: Low
Dimensional Devices and Materials[J-4] Ultrawide Bandgap Semiconductor
Devices[K-4] Design, Process, and Technology
for High-performance Chiplet II/3D
Integration and Advanced Packaging II[F-4] Emerging Memory Devices[G-4] Quantum Computing II
Focus Session 1

10:45 ~ 12:15

10:45 ~ 12:00

10:45 ~ 12:15

10:45 ~ 11:45

10:45 ~ 12:00

10:45 ~ 12:00[D-5] Transistor Technologies for
Biological and Electrochemical
Applications[F-5] 3D NAND Flash Memory[G-5] Image Sensor Technology[H-5] Device Application II: Low
Dimensional Devices and Materials[J-5] SiC Processes andCharacterizations[K-5] Advanced Neuron and AI Systems

13:30 ~ 15:15
Area1&2

13:30 ~ 15:00

13:30 ~ 15:45

13:30 ~ 15:30[H-6] Growth and Synthesis: Low
Dimensional Devices and Materials[J-6] Interface Technologies[K-6] MEMS and Advanced
Metallization I302

303

304

Break

10:45 ~ 12:15

10:45 ~ 12:00[A-5] UV Sources and Detectors[B-5] Advanced Materials,
Nanofabrication and Thin Films I

10:45 ~ 12:00
Area1&2&9[C-5] Quantum Computing III
Focus Session 1

Lunch Break

13:30 ~ 15:45

13:30 ~ 15:15[A-6] III-V Light Sources[B-6] Advanced Materials,
Nanofabrication and Thin Films II

13:30 ~ 15:30
Area1&2&9[C-6] Quantum Computing IV
Focus Session 1

13:30 ~ 15:30

13:30 ~ 15:30

13:30 ~ 15:00[D-6] Functional Devices andApplication[E-6] Advanced Oxide Sensors[F-6] Charge-Based Memory Devices
for AI Applications[G-6] Ferroelectric Devices
Joint Session

Break

16:00-17:30 (Convention Hall) : Plenary Session 2
Break

18:00-20:00 (Convention Hall) : Rump Session * On-site Event

Thursday, September 29
101102

103

104

105

201

301

9:00 ~ 10:45

09:00 ~ 10:15

09:00 ~ 10:15

09:00 ~ 10:15[F-7] In-Memory and Unconventional
Computing[G-7] Advanced CMOS: Device
Technology[K-7] Advanced Systems with
Innovative Devices[E-7] MEMS and Advanced
Metallization II

Break

10:45 ~ 12:00

10:45 ~ 12:00

10:45 ~ 12:00

10:45 ~ 12:00

10:45 ~ 11:45

10:45 ~ 12:00

10:45 ~ 12:00

10:45 ~ 12:00
Area1&12[B-8] Group IV Materials II[C-8] Spintronics I[D-8] Optoelectronics andThermoelectronic Devices[F-8] Memory Devices for NewApplications[G-8] Ferroelectric Material and Process[H-8] Device Application III: Low
Dimensional Devices and Materials[J-8] Si and SiC Power Devices[K-8] Innovative Devices and Systems
for Advanced Imaging and Sensing
Joint Session

Lunch Break

13:30 ~ 15:15

13:30 ~ 15:30

13:30 ~ 15:15
Area1&2&8

13:30 ~ 15:00

13:30 ~ 15:15[A-9] Imaging Sensors and Detectors[C-9] Thermoelectric Devices[F-9] CMOS and Memory Applicationsof Low Dimensional Materials I
Focus Session 2[J-9] GaN Power Devices[K-9] Advanced Device-based Circuits
and Power Management Systems

Break16:00 ~ 18:00[A-10] Integrated Photonic Devices

Area Scope

16:00 ~ 17:30

16:00 ~ 17:45
Area1&2&8[C-10] Spintronics II[F-10] CMOS and Memory Applicationsof Low Dimensional Materials II
Focus Session 2

Area 1: Advanced CMOS: Material Science / Process Engineering / Device Technology

Area Scope

16:00 ~ 18:00

16:00 ~ 17:45[G-10] Advanced CMOS: Device,Process and Material[J-10] DRAM, SRAM, and 3D NAND

Area 7: Organic / Molecular / Bio‐electronics

Area 2: Advanced and Emerging Memories / New Applications

Area 8: Low Dimensional Devices and Materials

Area 3: Interconnect / 3D Integrations / MEMS

Area 9: Novel Functional / Quantum / Spintronic Devices and Materials

Area 4: Power / High‐speed Devices and Materials

Area 10: Thin Film Electronics: Oxide / Non‐single Crystalline / Novel Process

Area 5: Photonics: Devices / Integration / Related Technology

Area 11: Advanced Materials: Synthesis / Crystal Growth / Characterization

Area 6: Photovoltaics / Energy Harvesting / Battery‐related Technology

Area 12: Advanced Circuits / Systems Interacting with Innovative Devices and Materials