AIC1563
Versatile DC/DC Converter

 FEATURES DESCRIPTION

The AIC1563 is a monolithic control circuit con-3V to 30V Input Voltage Operation.
 Internal 2A Peak Current Switch.
 1.5A Continuous Output Current.
 Bootstrapped Driver.
 High Side Current Sense Capability.
 High Efficiency (up to 90%).
taining the primary functions required for DC toDC converters and highside-sensed constant current source. The device consists of an internal
temperature compensated reference, comparator,
controlled duty cycle oscillator with an active cur-Internal ±2% Reference.
 Low Quiescent Current at 1.6mA.
 Frequency Operation from 100Hz to 100KHz.
rent sense circuit, bootstrapped driver, and highcurrent output switch. This device is specificallydesigned to construct a constant current sourcefor battery chargers with a minimum number of APPLICATIONS

external components. Bootstrapped driver can

Constant Current Source for Battery Chargers.
 Saver for Cellular phones.
 Step-Down DC-DC Converter Module.
drive the NPN output switch to saturation forhigher efficiency and less heat dissipation.

 TYPICAL APPLICATION CIRCUITD3*R1D2+

1N4148RS
0.22

8V~25V

C1100µF

300µH

BOOSTDCISDEVCC

CFFB

GND

76+

L11µF

8VIN

1N4148

C35

D11N5819

12345V/1A+C4470µF

R2390K
C21000pF

AIC1563

RB

RA
1K

3K

R3

* R1=1K, When VIN≥15V,
R1=470Ω, otherwise

2.2M

Line Regulation

VIN = 10V~20V @ IO=1A

40mV

Load Regulation

VIN = 15V, @ IO=100mA~1A

20mV

Short Circuit Current

VIN =15V, @ RL = 0.1Ω
Step-Down Converter

1.3A

Analog Integrations Corporation

Si-Soft Research Center
3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C.
TEL: 886-3-5772500

FAX: 886-3-5772510

www.analog.com.tw

DS-1563G-01 121808

1

AIC1563

AIC1563

 ORDERING INFORMATIONPIN CONFIGURATION

AIC1563-XXX XX
PACKING TYPE
TR: TAPE & REEL
TB: TUBE(DIP is not available inTR packing)
PACKAGING TYPE
N: DIP-8
S: SOP-8
SH: SOP-8 Exposed Pad

DIP-8
SOP-8(Exposed Pad)
TOP VIEW
DC 18 BOOST

DE 27 ISCF 36 VCC

GND 45 FB

C: COMMERCIAL
P: LEAD FREE COMMERCIAL
G: GREEN PACKAGE
Example: AIC1563CSTR
 in SOP-8 Package & Taping & Reel
Packing TypeAIC1563PSTR
 in SOP-8 Lead Free Package &Taping & Reel Packing Type ABSOLUTE MAXIMUM RATINGS
Supply Voltage..............................................................……………............................. 30V

Comparator Input Voltage Range............................................………….......... -0.3V~30V

Switch Collector Voltage....................................................……………......................... 30V

Switch Emitter Voltage......................................................……………......................... 30V

Switch Collector to Emitter Voltage
Driver Collector Voltage
Switch Current..................................…………............................. 30V....................................................…………….......................... 30V................................................………………......................................... 2A

Thermal Resistance Junction to Case

SOP840°C/W

SOP8 Exposed Pad*…..……………………16°C/W
DIP860°C/W

Thermal Resistance Junction to Ambient

SOP8(Assume no ambient airflow, no heatsink)

SOP8 Exposed Pad*…………………….60°C/W

Operating Junction Temperature

160°C/W

DIP8100°C/W.....................................................………............. 125°C

Operating Ambient Temperature Range .......................……………......................... -40~85°C
Storage Temperature Range...................................………….................... - 65°C ~ 150°C

Lead Temperature (Soldering 10 Sec.)…………………………………………………260°C

Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
* The package is place on a two layers PCB with 2 ounces copper and 2 square inch, connected by 8 vias.

2

AIC1563

AIC1563

 TEST CIRCUIT
D3
*R1

D2+

1N4148VIN

8V~25V

C1100µF

300µH

BOOSTDCISDEVCC

CFFB

GND

76+5AIC1563* R1=1K, When VIN≥15V,
R1=470Ω, otherwise

L11µF

8RS
0.22

1N4148C3

D1
1N5819

1234+

5V/1A
C4470µF

R2390K
C21000pF

RBRA
1K

3K

R32.2M

3AIC1563

AIC1563 ELECTRICAL CHARACTERISTICS (VCC= 5V, TA=25°°C, unless otherwise specified.)(Note1)PARAMETERTEST CONDITIONSSYMBOL

MIN.

TYP.

MAX.

UNIT

Oscillator
Charging Current

5.0V≤VCC≤30V

ICHG

102540µA

Discharge Current

5.0V≤VCC≤30V

IDISCHG

100

150200µA

Voltage Swing

PIN 3VOSC

0.6

Discharge to Charge Current Ratio

VIS =VCC

IDISCHG / ICHG

6.0Current Limit Sense Voltage

ICHG=IDISCHG

VCC – VIS

Saturation Voltage, Emitter
Follower Connection

IDE=1.0A;
VBOOST =VDC = VCC

Saturation Voltage

250V

300

350mV

VCE(SAT)

1.5

1.8

V

IDC=1.0A; IBOOST=50mA, (Forced β≅20)

VCE (SAT)

0.4

0.7

V

DC Current Gain

ISC =1.0A; VCE=5.0V

hFE

Collector Off-State Current

VCE=30V

IC(OFF)

Output Switch

35120
10nA

Comparactor
Threshold Voltage

TA=25°C0°C ≤ TA ≤ 70°C

Threshold Voltage LineRegulation

3.0V≤VCC≤30V

Input Bias Current

Supply Current

VFB

1.225
1.21

1.25

1.275

V

1.29

V

REGLINE

0.1

0.3

mV/V

VIN=0V

IIB

0.4

1µA

VIS =VCC, pin 5>VFB
5.0V≤ VCC ≤30V
CT=1nFPIN 2=GND
Remaining pins open

ICC

1.63mA

Note 1: Specifications are production tested at TA=25°C. Specifications over the -40℃ to 85℃ operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls(SQC).

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AIC1563

AIC1563

 TYPICAL PERFORMANCE CHARACTERISTICS
ICC, Supply Current (mA)

1000

100

ON -TIME

10OFF-TIME

1.6

CT = 1nF
VIS = VCCPIN 2 =GND

1.2

0.8

0.4

1tON-OFF, Output Switch ON-OFF Time (µS)

2VCC=5V
VIS =VCCPIN 5=GND

10.1

100100CT, Oscillator Timing Capacitor (nF)
Fig. 1 Output Switch ON-OFF Time vs. Oscillator
Timing Capacitor

01015252030

VCC, Supply Voltage (V)Fig. 2 Standby Supply Current vs. Supply Voltage

350

1.3

VFB, Threshold Voltage (V)VCC-VIS Threshold Voltage (mV)

VCC = 5V,
CT = 1nF,PIN 2 = GND

1.28

1.26

1.241.221.201020304050607080340330320310290280270260
250
00.8

VCE(SAT), Saturation Voltage (V)1.8

VCC = 5V
PIN 1, 7, 8 = VCC
PIN 3, 5 = GND

1.6

1.5
1.4

1.3

1.2
00.5

11020304050607080

Temperature (°C)
Fig. 4 IS Threshold Voltage vs. Temperature

Fig. 3 VFB, Threshold Voltage vs. Temperature

1.7

VCC = 5V,
CT = 1nF,PIN 2 = GND

300

Temperature (°C)

VCE(SAT), Saturation Voltage (V)51.50.6

VCC = 5V
PIN 7 = VCC
PIN 2, 3, 5 = GND

0.4

Forced Beta = 20

0.2

000.5

1

1.5

IE, Emitter Current (A)IC, Collector Current (A)Fig. 5 Emmiter Follower Configuration Output Switch
Saturation Voltage vs. Emmiter Current

Fig. 6 Common Emitter Configuration Output Switch
Saturation Voltage vs. Collector Current

5AIC1563

AIC1563 BLOCK DIAGRAM
1DC8Q2
Q1

BOOST

QS
R

802DE7

ISIs
CT
Oscillator
CF63

VCC

Comparator
1.25V
ReferenceVoltage
GND+54FB PIN DESCRIPTIONSPIN 1: DC- The switch collector is 2A.

PIN 5: FB

PIN 2: DE- Darlington switch emitter.

PIN 6: VCC - Power supply input.

PIN 3: CF- Oscillator timing capacitor.

PIN 7: IS

PIN 4: GND - Power ground.

- Feedback comparator inverting input.

- Highside current sense input.
VCC - VIS=300mV.

PIN 8: BOOST -Bootstrapped driver collector.

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AIC1563

AIC1563

 APPLICATION INFORMATIONDESIGN FORMULA TABLE

CALCULATIONt ONt OFF(tON + tOFF) MAX

STEP-DOWN

STEP-UPVOUT + VF
VIN(MIN) - VSAT - VOUT

VOUT + VF - VIN(MIN)
VIN(MIN) - VSAT

11FMIN

FMIN-5CT

4x10 tONIC (SWITCH)

2IOUT(MAX)
0.9 × VCURRENT SENSE(min.)RS

IC(SWITCH)

L(MIN)(=225mV
IC(SWITCH)

VIN(MIN) - VSAT - VOUT)tON(MAX)
IC(SWITCH)VSAT = Saturation voltage of the output switch.
VF= Forward voltage of the ringback rectifier
The following power supply characteristics must bechosen:
VIN- Nominal input voltage.

VOUT- Desired output voltage,
VOUT = 1.25 (1 + RB/RA)

2IOUT(MAX) (IC ( SWITCH) (t ON + t OFF )8V RIPPLE (P - P )CoIOUT-5

4 x 10 tON

t ON + t OFF)t OFF

0.9 × VCURRENT SENSE(min.)
IC(SWITCH)(=225mV
IC(SWITCH)

VIN(MIN) - VSAT)tON(MAX)
IC(SWITCH)

IOUT tON
VRIPPLE(P - P)

FMIN

- Minimum desired switching frequency at
selected values for VIN and IOUT.

VRIPPLE (P-P) - Desired peak-to-peak output ripple voltage. In practice, the calculated value willneed to be increased due to the capacitor
equivalent series resistance and board
layout. The ripple voltage should be kept
to a low value since it will directly affectthe line and load regulation.

- Desired output current.
LAYOUT GUIDANCE FOR EP THERMAL PATH

The AIC1563 uses a thermally-enhanced SOP8package that has an exposed thermal pad at thebottom side of the package. The layout should
connect as mush as possible to copper on the exposed pad. Typically the component layer is more
effective in dissipating heat. The thermal imped-ance can be further reduced by using other layersof copper connecting to the exposed pad through athermal via array. Each thermal via is recommended to have 0.3mm diameter and 1mm distance from other thermal vias.

7AIC1563

AIC1563

APPLICATION EXAMPLES
D1R21K

D2L1IN4148

C4220µF

4.7µF

GND

FB

470P

C70.1µF

47nF

Q1MPS2222A

3LED2DIS

680

4LED1VTS

GND

VCC

C3220µF

AIC1563

C10ICONVBT

R156BAT1RX

R7THERMISTOR+

291K

VCC

5DSW

RY

R14200K+

C11

C60.1µF

7100µF

R6C8850K

0.1µF

ADJ

SEL1SEL3SEL2TMR

MODE

GREEN

RED

R16R17680

680

161514131211109AIC1781

R11100K

U3VIN
11~15V

VOUT

VIN+

C12R13470K

78L05
Q2
MMBT2222A+

GND

1µF

C1310µF**3~5 NiMH/NiCd cells.
Note: Charge Current=0.3/RS Ampere
Safety Timer: 80min

Fig. 7 Battery Charge Circuit for Fluctuating Charging Current Applications

R1

R2120

D21K

220µH

C31µF

L
D1
1N5821D3
1N5819(%)
*RS

VIN

220µF

220µF

V IN= 16V, V O= 8V
80

VCC

CFCT

C59010µF

ISDE

C1470pF+CO

BOOST

DC100V IN = 16V, V O= 12V++1N4148

IO

GND

AIC1563

RBFBRA
5.6K

33K

700

*IO=300mV/RS

0.51

LED3

R12100K

U25RS 0.3/1W

6CF4C1ISC9R91N5819

IN41487DE31PEAK+**BATTERY

2390K

BOOST

YELLOW

0.1µF

D4

D38DC

PB SW

R10100K

R8300K

C5U11

LED220/5W

IN5819+1µF
R5 120/0.5W

R4270
LED1220µH

C2

SW1R3

R11.52Io (A )

Efficiency vs Output Current
Fig. 8 Battery Charge Circuit

8AIC1563

AIC1563

 APPLICATION EXAMPLES (Continued)
C3

D15V

L1+

1N5819300µH

1µF8RS
0.22

VIN

BOOST

DC

ISDEVCCCF

7616V~25V +5C1100µF

GND

FB

D1
1N5819112V/1A+C4470µF

234RB

C2470pF

RA
1K

AIC1563

13K

Fig. 9 Step-Down Converter with External 5V Bootstrap

D1200µH

VOUT

L1

1N5819

R1150

RS
0.22
VIN

8~16V
C1+100µF

28V/200mA+8 BOOST

DC 17 ISDE 26 VCC

CF 35 FBGND 4220µF

CT

C0680pF

AIC1563
RARB

2K247K

Line Regulation

VIN = 8V~16V @ IO=200mA

100mV

Load Regulation

VIN = 12V, @ IO=80mA~200mA

40mV

Fig. 10 Step-Up Converter

9AIC1563

AIC1563

 APPLICATION EXAMPLES (Continued)
D1L

R1+87RS
VIN

6+BOOST

DC 1IS

DE 2

VCC

CF 35 FBC1VOUT

C0Q1
R2

GND 4CT

AIC1563

RA

RB

Fig. 11 Step-Up Converter with External NPN Switch

12
L1CT
560pF

1N5819VOUT-12V/100mA

BOOST

DEIS

CFVCC

3100µH

D1DC

87645GNDFB
AIC1563+

C00.26

RS

953
RB

VIN
4.5V~6V+100µF

C1RA

8.2K

470µF

Line Regulation

VIN = 4.5V~6V @ IO=100mA

20mV

Load Regulation

VIN = 5V, @ IO=10mA~100mA

100mV

Fig. 12 Inverting Converter

10AIC1563

AIC1563

 APPLICATION EXAMPLES (Continued)
Q1
IRF9530N
C1

L15Vout/3A

47uH
10nF
D1
LL4148D2
LL4148

U18BOOST

7R10.1

6C61uF

51DCIS

DE

VCC

CFFB

GND

R2

2470

3

C8470uF/6.3V

D31N5820

R61k

C91uF

4C3470pF

AIC1563

12Vin+Q2
MPSA56+ C2
1000uF/16V

R43k

R51k

C5R34.7nF

560k

Fig. 13 Step-down Converter with External N-MOS Switch

Q2GF4435

R10.112Vin+ C1470uF

DCISDE6VCC

CF35FB
AIC1563

GND

47Q1
MMBT2222A

1BOOST

D21N5819

D1LL4148

2C2360pF

5Vout47uH

R22.2K

U18L1R51k+ C3470uF R33k

C41000PF

R41k

Fig. 14 Step-down Converter with External P-MOS Switch

11AIC1563

AIC1563

 PHYSICAL DIMENSIONS (unit: mm)
SOP-8DE H

eA°54XhA

SEE VIEW BAB

1A

WITH PLATING

52.0LVIEW BCBASE METALSECTION A-AGAUGE PLANESEATING PLANE

θ

Note: 1. Refer to JEDEC MS-012AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.

SOP-8SY
M
BO
L

MIN.

MAX.

A

1.35

1.75

A1

0.10

0.25

B

0.33

0.51

MILLIMETERS

C

0.19

0.25

D

4.80

5.00

E

3.80

4.00

e

1.27 BSCH

5.80

6.20

h

0.25

0.50

L

0.40

1.27

θ

0°8°12

AIC1563

AIC1563



SOP-8 (Exposed Pad)

DD1

EXPOSED THERMAL PAD(Heat Sink)(BOTTOM CENTER OF PACKAGE)

E1e

A

E H°54XhA

SEE VIEW B

AB

1A

WITH PLATING

52.0

BASE METALSECTION A-AθNote : 1. Refer to JEDEC MS-012E.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.

SOP-8 Exposed Pad(Heat Sink)

SY
M
B
O
LMIN.

MAX.

A

1.35

1.75

GAUGE PLANESEATING PLANE

L

VIEW BCMILLIMETERS

A1

0.00

0.15

B

0.31

0.51

C

0.17

0.25

D

4.80

5.00

E

3.80

4.00

e

1.27 BSC

H

5.80

h

6.20

0.25

0.50

L

0.40

1.27

q

0°

8°

D1
E1

1.5
1.0

3.5
2.55

13

AIC1563

AIC1563

DIP-8E

DGAUGE PLANE

1E8
3.
0eA
eB
2AAb

WITH PLATING
D1A
b2

Ae

1
A

L

BASE METALc

SECTION A-A

Note: 1. Refer to JEDEC MS-001BA
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 10 mil per side .
3. Dimension "D1"and "E1" do not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.

SYM
BO
L

DIP-8
MILLIMETERS
MIN.

MAX.

A

5.33

A1

0.38

A2

2.92

4.95

b0.36

0.56

b21.14

1.78

c

0.20

0.35

D

9.01

10.16

D1

0.13

E

7.62

8.26

E1

6.10

7.11

e

2.54 BSC

eA

7.62 BSCeB
L

10.92
2.92

3.81

Note:Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of anycircuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices
or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, andwhose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.

14