ISP281
DESCRIPTION
The ISP281 series optocoupler each consists of an
infrared emitting diode optically coupled to an NPN
silicon photo transistor.

1 AnodeThis device belongs to Isocom Compact Range ofOptocouplers.

2 Cathode

FEATURES

4 Collector

Half Pitch 1.27mm
CTR Selections Available
Wide Operating Temperature Range- 55°C to +110°C
High AC Isolation voltage 3750VRMS
Lead Free and RoHS Compliant
Safety Approvals Pending

APPLICATIONSSwitching Mode Power Supplies
Computer Terminals
Industrial System Controllers
Measuring Instruments
Signal Transmission between Systems ofDifferential Potentials and Impedances

ORDER INFORMATION

Available in Tape and Reel with 3000 pieces
per reel

3 Emitter

ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.

Input
Forward Current

50mA

Pulse Forward Current

1A

Reverse Voltage

6V

Power Dissipation

70mW

Junction Temperature

125°C

OutputCollector to Emitter Voltage VCEO

80V

Emitter to Collector Voltage VECO

7VCollector Current

50mA

Power Dissipation

150mW

Junction Temperature

125°C

Total Package

ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk

http://www.isocom.com

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Isolation Voltage

3750VRMS

Total Power Dissipation

200mW

Operating Temperature-55 to 110°C

Storage Temperature-55 to 150°C

Lead Soldering Temperature (10s)

260°C

ISOCOM COMPONENTS ASIA LTD
Hong Kong Office
Block A, 8/F, Wah Hing Industrial Mansions
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk

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ISP281
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified. Typical Values at TA = 25°C)
INPUT
Parameter

SymbolTest Condition

Forward Voltage

VF

Reverse Current
Terminal Capacitance

Min

Typ.

Max

Unit

IF = 20mA

1.4V

IR

VR = 4V

10µA

CIN

V = 0V, f = 1KHz

30250pF

SymbolTest Condition

MinTyp.

Max

Unit

Collector-Emitter
Breakdown VoltageVCEO

IC = 0.1mA, IF =0mA

80

V

Emitter-Collector
Breakdown Voltage

VECO

IE = 0.01mA, IF = 0mA

7VCollector Dark Current

ICEO

VCE = 20V, IF = 0mA

OUTPUT
Parameter

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100nA

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ISP281
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified. Typical Values at TA = 25°C)
COUPLED
Parameter

SymbolTest Condition

Current Transfer Ratio

CTR

IF = 5mA, VCE = 5V
ISP281A

80160

ISP281B

130260

ISP281C

200400

ISP281D

300600

ISP281E

100200

ISP281GR

100300

ISP281GB100600

Floating CapacitanceCf

V = 0V, f = 1MHz

Rise Time

trtON

Turn-Off TimetOFF

Storage TimetS

Turn-On TimetON

Turn-Off Time

tOFF

Unit%

600

IF = 8mA, IC = 2.4mA

Turn-On Time

Max50

VCE(sat)

tfTyp.

ISP281

Collector-Emitter
Saturation Voltage

Fall TimeMin

VCC = 10V,
IC = 2mA,
RL = 100Ω,
f = 100Hz

0.4V

0.6

1pF

218µs

3183325

VCC = 5V,
IF = 16mA,
RL = 1.9kΩ

240

Any grade of the ISP281 will satisfy the base ISP281 specification.
Grade B will satisfy the ISP281GR specification
Grade B / C / D / E will satisfy the ISP281GB specification
ISOLATION
Parameter

SymbolTest Condition

MinIsolation Voltage

VISO

R.H. = 40% to 60 %,t = 1 min3750

Input - Output
Resistance

RI-O

VI-O = 500VDC,
R.H. = 40% to 60 %5 x 1010

Typ.

Max

Unit
VRMS

1 x 1011

ΩDevice is considered a two terminal device : pins 1 and 2 are shorted together and pins 3 and 4 are shorted together.

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IF – Forward Current (mA)

6050403020100-250255075100125

PC – Collector Power Dissipation (mW)

ISP281160140120100806040200-250255075100125

TA – Ambient Temperature (oC)TA – Ambient Temperature (oC)Fig 1 Forward Current vs Ambient Temperature

Fig 2 Collector Power vs Ambient Temperature

Fig 3 Collector Current vsCollector-Emitter Voltage (1)Fig 4 Collector Current vsCollector-Emitter Voltage (2)Normalized Current Transfer Ratio

CTR – Current Transfer Ratio (%)

1000
10V
5V100
VCE = 0.4V

1010.1110100IF – Forward Current (mA)Fig 5 Current Transfer Ratio vs Forward Current

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10Normalized toIF = 5mA
VCE = 5V
TA = 25°C

10.1
0.1

110100IF – Forward Current (mA)Fig 6 Normalized Current Transfer Ratio vs
Forward Current

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ISP281

Fig 7 Normalized Current Transfer Ratio vsAmbient Temperature

Fig 8 Collector Current vs Ambient Temperature

Fig 9 Collector-Emitter Voltage vs
Forward Current

Fig 10 Collector-Emitter Saturation Voltage vsAmbient temperature

IFP – Pulsed Forward Current (mA)

1000

100

10Pulse Width ≦ 10 μs
Repetitive Frequency = 100Hz
TA = 25°C

10.5

11.5

22.5

3

VFP – Pulsed Forward Voltage (V)Fig 11 Forward Current vs Forward Voltage

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Fig 12 Pulsed Forward Current vsPulsed Forward Voltage

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ISP281
ΔVF/ΔTA – Forward Voltage
Temperature Coefficient (mV/°C)

-3.2
-2.8
-2.4
-2.0
-1.6
-1.2
-0.8
-0.4
0.1

110100IF – Forward Current (mA)

Fig 14 Forward Voltage Temperature Coefficient vsForward Current

Fig 15 Switching Time vs Load ResistanceFig 16 Switching Time vs Ambient temperature

ICEO – Collector Dark Current (µA)

Fig 13 Pulsed Forward Current vs Duty Ratio

1010.1
VCE = 48V

0.01

24V

10V

5V

0.001

0.0001-25-5153555

75

95

115

TA – Ambient Temperature (oC)Fig 17 Collector Dark Current vsAmbient Temperature

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Fig 18 Frequency Response

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ISP281

50%IFVO

90%
10%

tdtr
tON

ts

VCC

VCE

tf

tOFF

Switching Time Test Circuit and Waveform

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ISP281
ORDER INFORMATIONISP281After PN

PN

Description

Packing quantity

None

ISP281

Surface Mount Tape and Reel

3000 pcs per reel

Any CTR
Grades

ISP281A, ISP281B, ISP281C
ISP281D, ISP281E
ISP281GR, ISP281GB

Surface Mount Tape and Reel

3000 pcs per reel

NOTE : Multiple Grades may be supplied to meet the requested specification

DEVICE MARKING

HPT_I YWW

HPT_denotes Device Part Number where “_” denotes CTR GradeI

denotes Isocom

Ydenotes 1 digit Year code J = 2019, K = 2020 etc.

WWdenotes 2 digit Week code

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PACKAGE DIMENSIONS in mm

RECOMMENDED PAD LAYPUT FOR SMD (mm)9 03/06/2020

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ISP281
TAPE AND REEL PACKAGING (mm)+−P0P1P2±FW+−±±Description

SymbolDimension
mm (inch)

Tape WidthW

16.00 ± 0.30 (0.63)

Pitch of Sprocket Holes

P0

4.00 ± 0.10 (0.16)

F

7.50 ± 0.10 (0.30)

P2

2.00 ± 0.05 (0.079)

P1

4.00 ± 0.10 (0.16)

Distance of Compartment to Sprocket Holes
Distance of Compartment to Compartment

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ISP281
IR REFLOW SOLDERING TEMPERATURE PROFILE
One Time Reflow Soldering is Recommended.
Do not immerse device body in solder paste.

TP260°C

T P - 5°C

TEMP (°C)

Max Ramp Up Rate
3°C/s

TL

217°CT smax

200°C

tP

Max Ramp Down Rate
6°C/s

TL

T smin 150°C
ts Preheat
60s – 120s

25°C
TIME (s)Time 25°C to Peak Temperature

Profile Details

Conditions

Preheat- Min Temperature (TSMIN)- Max Temperature (TSMAX)- Time TSMIN to TSMAX (ts)

150°C
200°C
60s - 120s

Soldering Zone
- Peak Temperature (TP)- Time at Peak Temperature- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP ̶ 5°C)
- Time maintained above TL (tL)- Ramp Up Rate (TL to TP)- Ramp Down Rate (TP to TL)

260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max

Average Ramp Up Rate (Tsmax to TP)

3°C/s maxTime 25°C to Peak Temperature

8 minutes max

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DISCLAIMER
Isocom Components is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,when utilizing Isocom Components products, to comply with the standards of safety in making
a safe design for the entire system, and to avoid situations in which a malfunction or failure ofsuch Isocom Components products could cause loss of human life, bodily injury or damage toproperty.
In developing your designs, please ensure that Isocom Components products are used within
specified operating ranges as set forth in the most recent Isocom Components products
specifications.
The Isocom Components products listed in this document are intended for usage in generalelectronics applications (computer, personal equipment, office equipment, measuringequipment, industrial robotics, domestic appliances, etc.). These Isocom Components
products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause lossof human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation Instruments, traffic
signal instruments, combustion control instruments, medical Instruments, all types of safety
devices, etc... Unintended Usage of Isocom Components products listed in this document
shall be made at the customer’s own risk.
Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals todissolve them. When disposing of the products, follow the appropriate regulations. Do notdispose of the products with other industrial waste or with domestic garbage.
The products described in this document are subject to the foreign exchange and foreign tradelaws.
The information contained herein is presented only as a guide for the applications of ourproducts. No responsibility is assumed by Isocom Components for any infringements ofintellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of Isocom
Components or others.
The information contained herein is subject to change without notice.

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