Reference Material 2 Icom Exempted Substance List ver.7.1.0
With respect to the exempted substances in the RoHS Directive, those relevant to parts andmaterials the Icom Group procures are included in the Icom Group Exempted Substance
List.
Icom Group exempted substances are listed below.
* Follow the texts of the RoHS Directive if they differ from those of each item .
No.

Exemption

Scope and dates of applicability

Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):
1Ⅰ(f)ⅡFor lamps designed to emit mainly light in5 mg

the ultraviolet spectrum: 5 mg

Expires on 24 February 2027.
5 mg

For special purposes

Expires on 24 February 2025.

Mercury in other fluorescent lamps not exceeding (per lamp):
(3)
(4)
Ⅰ
2(b)

(4)
Ⅱ

Non-linear tri-band phosphor lamps with10 mg

tube diameter > 17 mm (e.g. T9)

Expires on 24 February 2025.

Lamps for other general lighting and15 mg

special purposes (e.g. induction lamps)

Expires on TBD

Lamps emitting mainly light in the15 mg

ultraviolet spectrum

Expires on 24 February 2025.

(4)-15 mgEmergency lamps

Expires on 24 February 2025.

Ⅲ

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Icom Exempted Substance List ver.7.1.0

No.

Exemption

Scope and dates of applicability

Mercury in low pressure non-phosphor
coated discharge lamps, where the(a)-Ⅰ

application requires the main range of thelamp-spectral output to be in the15 mg
Expires on 24 February 2027.

ultraviolet spectrum: up to 15 mg mercury
may be used per lamp
Mercury in High Pressure Sodium(vapour) lamps for general lighting
purposes not exceeding (per burner) in(b)lamps with improved colour rendering

16 mg
Expires on 24 February 2027.

index Ra > 80: P ≤ 105 W: 16 mg may be
used per burner
Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes

4(c)not exceeding (per burner):(Ⅰ) P ≤ 155 W

20 mg Expires on 24 February 2027.

(Ⅱ) 155 W < P ≤ 405 W

25 mg Expires on 24 February 2027.

(Ⅲ) P > 405 W

25 mg Expires on 24 February 2027.

(e)

Mercury in metal halide lamps (MH)Expires on 24 February 2027.

Mercury in other discharge lamps forⅠExpires on TBD

special purposes not specificallymentionedin this Annex
Mercury in high pressure mercury vapour

ⅡExpires on 24 February 2027.

≥ 2000 lumen ANSI is required

(f)
ⅢⅣ

5

lamps used in projectors where an output

(a)
(b)

Mercury in high pressure sodium vapour
lamps used for horticulture lighting
Mercury in lamps emitting light in theultraviolet spectrum

Expires on 24 February 2027.

Expires on 24 February 2027.

Lead in glass of cathode ray tubes

Expires on 24 February 2024.

Lead in glass of fluorescent tubes not

0,2 % by weightexceeding 0,2 % by weight

Expires on 24 TBD2/12

Icom Exempted Substance List ver.7.1.0

No.

Exemption

Scope and dates of applicability

Lead as an alloying element in steel for(a)Ⅰmachining purposes containing up to 0,35% lead by weight and in batch hot dip(steel for machining)
0,35 % by weight(galvanised steel)galvanised steel components containing up 0,2 % by weight
Expires on TBD
to 0,2 % lead by weight
Lead as an alloying element in aluminium

6Ⅰ(b)containing up to 0,4 % lead by weight,0,4 % by weightprovided it stems from lead-bearing

Expires on TBD

aluminium scrap recycling
Lead as an alloying element inⅡ

aluminium for machining purposes with alead content up to 0,4 % by weight(c)0,4 % by weight
Expires on TBD

Copper alloy containing up to 4 % lead by

4 % by weightweightExpires on TBD

Lead in high melting temperature type(a)

solders

85 % by weight or more

(i.e. lead-based alloys containing 85 % by

Expires on TBD

weight or more lead)
Electrical and electronic components

7Ⅰ

containing lead in a glass or ceramic otherthan dielectric ceramic in capacitors, e.g.

Expires on TBD

piezoelectronic devices, or in a glass or(c)ceramic matrix compound
Lead in dielectric ceramic in capacitors forⅡa rated voltage of 125 V AC or 250 V DC

Expires on TBDor higher

3/12

Icom Exempted Substance List ver.7.1.0

No.

Exemption

Scope and dates of applicability

Cadmium and its compounds in electricalcontacts used in:—circuit breakers,—thermal sensing controls,—thermal motor protectors(excluding hermetic thermal motor
protectors),

8(b)

Ⅰ

—AC switches rated at:—6 A and more at 250 V AC andExpires on TBD

more, or— 12 A and more at 125 V AC andmore,—DC switches rated at 20 A and moreat 18 V DC and more, and—switches for use at voltage supply
frequency ≥ 200 Hz.
Up to 0,75% hexavalent chromium byweight, used as an anticorrosion agent in
the cooling solution of carbon steel coolingsystems of absorption refrigerators:

9(a)

Ⅱ

－designed to operate fully or partly withelectrical heater, having an average

Expires on TBD

utilised power input ≥ 75 W
at constant running conditions;－designed to fully operate withnon-electrical heater.
(a)
(Ⅰ)
13

Lead in white glasses used for opticalapplications
Lead in ion coloured optical filter glasstypes

Expires on TBD
Expires on TBD

Cadmium in striking optical filter glass(b)(Ⅱ) types; excluding applications falling under

Expires on TBD

point 39 of this Annex(Ⅲ)

Cadmium and lead in glazes used forreflectance standards

4/12

Expires on TBD

Icom Exempted Substance List ver.7.1.0

No.

Exemption

Scope and dates of applicability

Lead in solders to complete a viable
electrical connection between thesemiconductor die and carrier within
integrated circuit flip chip packages whereat least one of the following criteria
applies:15(a)—a semiconductor technology nodeof 90 nm or larger;

Expires on TBD—a single die of 300 mm2 or larger
in any semiconductor technology node;—stacked die packages with die of
300 mm2 or larger, or siliconinterposers of 300 mm2 or larger.
Lead halide as radiant agent in high17

intensity discharge (HID) lamps used for

Expires on 21 July 2027.

professional reprography applications
Lead as activator in the fluorescent powder18(b)(1 % lead by weight or less) of discharge
lamps when used as sun tanning lamps

1 % by weight or less Expires on TBD

containing phosphors such as BSP(BaSi2O5:Pb)
Lead in solders for the soldering to24

machined through hole discoidal andplanar array ceramic multilayer

Expires on TBD

capacitors
Lead oxide in surface conduction electron
25

emitter displays (SED) used in structuralelements, notably in the seal frit and frit

Expires on 21 July 2027.

ring
Lead bound in crystal glass as defined in29

Annex I (Categories 1, 2, 3 and 4) ofExpires on TBD

Council Directive 69/493/EEC ( 1 )Cadmium alloys as electrical/mechanicalsolder joints to electrical conductors
30

located directly on the voice coil intransducers used in high-powered

Expires on 21 July 2024.

loudspeakers with sound pressure levels of
100 dB (A) and more

5/12

Icom Exempted Substance List ver.7.1.0

No.

Exemption

Scope and dates of applicability

Lead in soldering materials in mercury free
31

flat fluorescent lamps (which e.g. are usedfor liquid crystal displays, design orExpires on 21 July 2024.

industrial lighting)Lead oxide in seal frit used for making
32

window assemblies for Argon andExpires on 21 July 2027.

Krypton laser tubes
Lead in solders for the soldering of thin33

copper wires of 100 μm diameter and less Expires on 21 July 2024.
in power transformers

34

Lead in cermet-based trimmer

Expires onTBD

potentiometer elements
Cadmium and cadmium oxide in thick film

38

pastes used on aluminium bonded

Expires on 21 July 2024.

beryllium oxide
Cadmium selenide in downshifting
39(a)cadmium-based semiconductor
nanocrystal quantum dots for use inExpires onTBD

display lighting applications (< 0,2 μg Cd
per mm2 of display screen area)

6/12

Icom Exempted Substance List ver.7.1.0

(dates of applicability expired )No.

Exemption

Scope and dates of applicability

Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):
(a)
(b)
(c)
1(d)

For general lighting purposes < 30 W
For general lighting purposes

2.5 mg
3.5 mg≥ 30 W and < 50 W
For general lighting purposes

5 mg≥ 50 W and < 150 W
For general lighting purposes ≥ 150 W

15 mg

For general lighting purposes with circular(e)or square structural shape and tube

7 mg

diameter ≤ 17 mm(g)For general lighting purposes < 30 W

3.5 mgwith a lifetime equal or above 20000 h
Mercury in double-capped linear fluorescent lamps for general lighting
purposes not exceeding (per lamp):(1)

Tri-band phosphor with normal lifetime
and a tube diameter < 9 mm (e.g. T2)

4 mg

Tri-band phosphor with normal lifetime(2) and a tube diameter

3 mg≥ 9 mm and ≤ 17 mm (e.g. T5)(a)Tri-band phosphor with normal lifetime(3) and a tube diameter

3.5 mg> 17 mm and ≤ 28 mm (e.g. T8)

2

Tri-band phosphor with normal lifetime(4) and a tube diameter

3.5 mg> 28 mm (e.g. T12)
(5)

Tri-band phosphor with long lifetime(≥ 25000 h)

5 mg

Mercury in other fluorescent lamps not exceeding (per lamp):
(b)

(1)
(2)

Linear halophosphate lamps with tube
> 28 mm (e.g. T10 and T12)

10 mg
15 mg

Non-linear halophosphate lamps(all diameters)

Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps(CCFL and EEFL) for special purposes placed on the market by February 24,2022 (per3(a)(b)(C)lamp):

3.5 mgShort length (≤ 500 mm)
Medium length

5 mg(> 500 mm and ≤ 1500 mm)

13 mg

Long length (> 1500 mm)

7/12

Icom Exempted Substance List ver.7.1.0

(dates of applicability expired )No.

Exemption(a)

Scope and dates of applicability

Mercury in other low pressure discharge
lamps (per lamp)

15 mg

Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not(b)exceeding (per burner) in lamps with improved colour rendering index Ra > 60:
30 mg(Ⅰ) P ≤ 155 W(Ⅱ) 155 W < P ≤ 405 W

40 mg(Ⅲ) P > 405 W

40 mg

(d)

Mercury in High Pressure Mercury (vapour)lamps (HPMV)
Mercury in hand crafted luminous
discharge tubes used for signs,
decorative or architectural and specialist

4

lighting and light-artwork, where themercury content shall be limited asfollows:(a) 20 mg per electrode pair + 0,3 mg(g)

per tube length in cm, but not morethan 80 mg, for outdoor applications
and indoor applications exposed totemperatures below 20 °C;(b) 15 mg per electrode pair + 0,24 mg
per tube length in cm, but not morethan 80 mg, for all other indoor
applications.
Lead as an alloying element in steel

(a)
6(b)

for machining purposes and in

0,35 % by weightgalvanised steel containing up to0,35 % lead by weight
Lead as an alloying element in aluminium
containing up to 0,4 % lead by weight

8/12

0,4 % by weight

Icom Exempted Substance List ver.7.1.0

(dates of applicability expired )No.

Exemption

Scope and dates of applicability

Lead in solders for servers, storage andstorage array systems, network(b)infrastructure equipment for switching,signalling, transmission, and network
management for telecommunications
Lead in dielectric ceramic in capacitors for

7Ⅲ

a rated voltage of less than 125 V AC or250 V DC(c)

May be used in spare parts for EEE placedon the market before 1 January 2013

Lead in PZT based dielectric ceramicⅣ(a)8materials for capacitors which are part ofintegrated circuits or discrete
semiconductors
Cadmium and its compounds in one shot

May be used in spare parts for EEE placedpellet type thermal cut-offson the market before 1 January 2012

Cadmium and its compounds(b)in electrical contacts
Hexavalent chromium as an anticorrosion
agent of the carbon steel cooling system
in absorption refrigerators up to 0,75 %

0,75 % by weightby weight in the cooling solution
Up to 0,75% hexavalent chromiumby weight, used as an anticorrosion
agent in the cooling solution of(a)Ⅰcarbon steel cooling systems ofabsorption refrigerators (includingminibars) designed to operate fully or
partly with electrical heater, having an9

average utilised power input < 75 W
at constant running conditions
Lead in bearing shells and bushes forrefrigerant-containing compressors forheating, ventilation, air conditioning andrefrigeration (HVACR) applications
Lead in bearing shells and bushes for(b)refrigerant-containing hermetic scroll(Ⅰ)

compressors with a stated electrical
power input equal or below 9 kW for
heating, ventilation, air conditioningand refrigeration (HVACR) applications

9/12

Icom Exempted Substance List ver.7.1.0

(dates of applicability expired )No.

11Exemption

(a)
(b)

12(a)

Scope and dates of applicability

Lead used in C-press compliant pinMay be used in spare parts for EEE placed

connector systems

on the market before 24 September 2010

pin connector systems

on the market before 1 January 2013

Lead used in other than C-press compliant May be used in spare parts for EEE placed
Lead as a coating material for the thermal

May be used in spare parts for EEE placed

conduction module C-ringon the market before 24 September 2010

Lead in white glasses used for opticalapplications
Cadmium and lead in filter glasses andglasses used for reflectance standards

(Ⅰ)

13(b)

Lead in ion coloured optical filter glasstypes
Cadmium in striking optical filter glass(Ⅱ) types; excluding applications falling underpoint 39 of this Annex(Ⅲ)

Cadmium and lead in glazes used forreflectance standards
Lead in solders consisting of more than
two elements for the connection between

14

the pins and the package of
microprocessors with a lead content ofMay be used in spare parts for EEE placedon the market before 1 January 2011

more than 80 % and less than 85 % byweight
Lead in solders to complete a viable
1516electrical connection between
semiconductor die and carrier within
integrated circuit flip chip packages
Lead in linear incandescent lamps withsilicate coated tubes
Lead halide as radiant agent in high17

intensity discharge (HID) lamps used
for professional reprography applications
Lead as activator in the fluorescentpowder (1 % lead by weight or less) ofdischarge lamps when used as speciality

18(a)lamps for diazoprinting reprography,lithography, insect traps, photochemical
and curing processes containing
phosphors such as
SMS ((Sr,Ba)2MgSi2O7:Pb)

10/12

Icom Exempted Substance List ver.7.1.0

(dates of applicability expired )No.

ExemptionScope and dates of applicability

Lead with PbBiSn-Hg and PbInSn-Hg in
specific compositions as main amalgam

19

and with PbSn-Hg as auxiliary amalgam
in very compact energy saving lamps(ESL)
Lead oxide in glass used for bonding
front and rear substrates of flat

20

fluorescent lamps used for Liquid Crystal
Displays (LCDs)
Lead and cadmium in printing inks
for the application of enamels
on glasses, such as borosilicate andsoda lime glasses
Cadmium when used in colour printed(a)glass to provide filtering functions,used as a component in lightingExcept applications coveredby entry 21(b) or entry 39.

applications installed in displays and21

control panels of EEE
Cadmium in printing inks for the(b)application of enamels on glasses,
such as borosilicate andExcept applications coveredby entry 21(a) or 39.

soda lime glasses
Lead in printing inks for the application(c)of enamels on other than borosilicate
glasses23

26

Lead in finishes of fine pitch components

May be used in spare parts for EEE

other than connectors with a pitch ofplaced on the market before

0,65 mm and less

24 September 2010

Lead oxide in the glass envelope of
black light blue lamps
Lead alloys as solder for transducers

27

used in high-powered (designated tooperate for several hours at acoustic
power levels of 125 dB SPL and above)
loudspeakers

11/12

Icom Exempted Substance List ver.7.1.0

(dates of applicability expired )No.

Exemption

Scope and dates of applicability

Cadmium alloys as electrical/mechanicalsolder joints to electrical conductors
30

located directly on the voice coil intransducers used in high-powered
loudspeakers with sound pressurelevels of 100 dB (A) and more
Lead in soldering materials in mercury

31

free flat fluorescent lamps (which,e.g. are used for liquid crystal displays,
design or industrial lighting)Lead in the plating layer of high voltage

37

diodes on the basis of a zinc borate glass
body
Mercury used as a cathode sputtering

36

inhibitor in DC plasma displays witha content up to 30 mg per display
Cadmium in colour converting II-VI LEDs

39(< 10 μg Cd per mm 2 of light-emittingarea) for use in solid state illumination
or display systems
Cadmium in photoresistors for analogue

40

optocouplers applied in professional
audio equipment
Lead in solders and termination finishesof electrical and electronic components
and finishes of printed circuit boards
used in ignition modules and otherelectrical and electronic engine control

41

systems, which for technical reasonsmust be mounted directly on or in thecrankcase or cylinder of hand-held
combustion engines(classes SH:1, SH:2, SH:3 of
Directive 97/68/EC of the European
Parliament and of the Council ( 2 ))12/12

Icom Exempted Substance List ver.7.1.0