MITSUBISHI ELECTRIC CORPORATIONPUBLIC RELATIONS DIVISION
7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo, 100-8310 JapanFOR IMMEDIATE RELEASE

No. 3016

Customer Inquiries

Media Inquiries

Power Device Overseas Marketing Dept.A and Dept.B
Mitsubishi Electric Corporation

Public Relations Division
Mitsubishi Electric Corporation
prd.gnews@nk.MitsubishiElectric.co.jp
www.MitsubishiElectric.com/news/

www.MitsubishiElectric.com/semiconductors/

Mitsubishi Electric to Expand Lineup ofIGBT Module T Series with 7th Generation IGBT
17 new models will better meet demand for low power loss, highly reliable industrial equipmentTOKYO, March 30, 2016 – Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it
would begin shipping samples of 17 new models of T series power semiconductor modules featuring
seventh-generation insulated-gate bipolar transistors (IGBTs). The new modules have a 1.7kV rating andrealize improved power loss and reliability for general-purpose inverters, uninterruptible power supplies(UPS), photovoltaic (PV), wind power-generation systems and other industrial equipment. Sample shipments
will begin September 30.

The modules will be exhibited at major trade shows including MOTORTECH JAPAN 2016 during
TECHNO-FRONTIER 2016 in Japan from April 20 to 22, Power Conversion Intelligent Motion (PCIM)
Europe 2016 in Nuremberg, Germany, from May 10 to 12, and PCIM Asia 2016 in Shanghai, China, from June
28 to 30.

NX-type Solder Pin Package

NX-type Press Fit Pin Package

Standard-type Package

Product Features
1) Expanded lineup of 17 models with 1.7kV rating provides for wide range of inverter capacity- The new models include 12 NX-types (six with solder pin package and six with press fit pinpackage) with current ratings ranging from 100A - 600A and five standard package models ranging
from 75A - 300A.
- Provides for AC690V / DC1000V PV system inverters and wide range of inverter capacity.
1/32) Reduced power loss thanks to seventh-generation IGBT and diode- 1.7kV rating seventh-generation CSTBTTM1 chip achieves low power loss and low EMI noise.
- Relaxed Field of Cathode (RFC) diode2 chip incorporating new backside diffusion process achieves
low power loss and suppression of recovery-voltage surge.
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Mitsubishi Electric’s original IGBT chip construction incorporating carrier-store effectP layer is added partially on cathode side and the hole is injected during recovery term to soften the recovery waveform

3) Latest package technology enhances reliability of de facto standard package- The internal structure is improved, keeping compatibility with de facto standard package.
- Integration of insulation and copper base in the substrate, along with improved internal electrodeconstruction, help to increase thermal cycle life3 and lower internal inductance, leading to morereliable equipment performance.
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The life proven in a stress test of relatively long-term temperature cycling between two case temperatures

Sample Shipments
Package
Voltage Rating
NX-type
Solder Pin Package
NX-type
1.7kV
Press Fit Pin Package
Standard-type
Package

Current Rating

Shipment

100, 150, 225, 300, 450, 600A
100, 150, 225, 300, 450, 600A

From September 30

75, 100, 150, 200, 300A

Sample Shipment Targets
The new modules’ high-efficiency energy use, long life, low power loss and high reliability will meet thedemand of companies producing general-purpose inverters, UPS, PV, wind power-generation systems,
servos, elevators and other industrial equipment.
Main SpecificationsPackage

NX-type
Soldering
Pin Package

NX-typePress Fit
PinPackage

Standard-type
Package

Model
CM100TX-34T
CM150TX-34T
CM225DX-34T
CM300DX-34T
CM450DX-34T
CM600DX-34T
CM100TXP-34T
CM150TXP-34T
CM225DXP-34T
CM300DXP-34T
CM450DXP-34T
CM600DXP-34T
CM75DY-34T
CM100DY-34T
CM150DY-34T
CM200DY-34T
CM300DY-34T

VoltageRatingCurrent Rating

1.7kV

100A
150A
225A
300A
450A
600A
100A
150A
225A
300A
450A
600A
75A
100A
150A
200A
300A

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Circuit

Package Size
W×D (mm)

6 in 162×1222 in 162×1526 in 162×1222 in 162×152

34×49
2 in 1

48×94
62×108

Package Details
NX type- Internal inductance has been reduced 30 percent compared with conventional modules4.
- Improved thermal cycle life and power cycle life5 realized with Solid Cover technology by combining
a resin-insulated metal baseplate and direct potting resin6.
- The press-fit-pin package model can be fixed onto equipment without soldering, simply by pressing thepins into the PCB board.
- The resin filling reduces siloxane7 and improves the gas barrier effect to meet market demands.
- Standard type- Internal inductance is reduced 30 percent compared with a conventional model8 thanks to improved
internal electrode construction.
- The Thick Metal Substrate technology removes the solder layer and increases the thermal cycle life.
- The package can be downsized9 by increasing the thickness of the copper pattern and improving thethermal conductivity.
4

Compared with Mitsubishi Electric’s sixth-generation IGBT module (CM450DX-24S)
The life proven in a stress test of relatively short-term temperature cycling between two junction temperatures
6
Specially controlled epoxy resin matched to the thermal expansion rate and featuring improved adhesion
7Low molecular chemical compound in the silicone resin
8Compared with Mitsubishi Electric’s sixth-generation IGBT module (CM600DY-24S)
9
Base plate area decreased by 24 percent (CM600DY-24S: From 80×110mm to 62×108mm)
5

Other Features
PC-TIM module (optional)- This module, which uses PC-TIM10 of optimized thickness, eliminates the need for thermal grease.
10Phase Change Thermal Interface Material: high thermal conductivity grease, which becomes solid at room temperature andthen softer as the temperature risesEnvironmental AwarenessThe products mentioned in this release are compliant with the Restriction of the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment (RoHS) directive 2011/65/EU.
###About Mitsubishi Electric Corporation
With over 90 years of experience in providing reliable, high-quality products, Mitsubishi Electric
Corporation (TOKYO: 6503) is a recognized world leader in the manufacture, marketing and sales ofelectrical and electronic equipment used in information processing and communications, space development
and satellite communications, consumer electronics, industrial technology, energy, transportation andbuilding equipment. Embracing the spirit of its corporate statement, Changes for the Better, and its
environmental statement, Eco Changes, Mitsubishi Electric endeavors to be a global, leading green company,enriching society with technology. The company recorded consolidated group sales of 4,323.0 billion yen(US$ 36.0 billion*) in the fiscal year ended March 31, 2015. For more information visit:
http://www.MitsubishiElectric.com*At an exchange rate of 120 yen to the US dollar, the rate given by the Tokyo Foreign Exchange Market onMarch 31, 2015

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