MP34DT01-M
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data

• VoIP• Speech recognition• A/V eLearning devices• Gaming and virtual reality input devices• Digital still and video cameras• Antitheft systems

Description
The MP34DT01-M is an ultra-compact, lowpower, omnidirectional, digital MEMS microphone
built with a capacitive sensing element and an ICinterface.

HCLGA (3 x 4 x 1.06 4LD)

Features

The sensing element, capable of detecting
acoustic waves, is manufactured using aspecialized silicon micromachining process
dedicated to produce audio sensors.

• Single supply voltage• Low power consumption• 120 dBSPL acoustic overload point

The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.

• 61 dB signal-to-noise ratio• Omnidirectional sensitivity• – 26 dBFS sensitivity• PDM output• HCLGA package– Top-port design– SMD-compliant– EMI-shielded– ECOPACK®, RoHS, and “Green” compliant

The MP34DT01-M has an acoustic overload pointof 120 dBSPL with a 61 dB signal-to-noise ratio
and –26 dBFS sensitivity.
The MP34DT01-M is available in a top-port, SMDcompliant, EMI-shielded package and isguaranteed to operate over an extended
temperature range from -40 °C to +85 °C.

Applications• Mobile terminals• Laptop and notebook computers• Portable media players
Order codes

Table 1. Device summary

Temperature range [°C]

Package-40 to +85

HCLGA (3 x 4 x 1.06) mm 4LD

MP34DT01-M

PackingTray

MP34DT01TR-M

September 2014
This is information on a product in full production.

Tape and reel

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Contents

MP34DT01-M

Contents1

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2

Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1

Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.2

Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.3Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.1L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128Carrier tape mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . 14

9Process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

10Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162/17DocID026514 Rev 3

MP34DT01-M

1

Pin description

Pin description
Figure 1. Pin connections*$066*/5&/.

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Pin #Pin name

Function

1Vdd

Power supply

2

LR

Left/Right channel selection

3

CLKSynchronization input clock

4

DOUT

Left/Right PDM data output

5 (ground ring)

GND

0 V supply

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Acoustic and electrical specifications

MP34DT01-M

2

Acoustic and electrical specifications

2.1

Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,T = 25 °C, unless otherwise noted.
Table 3. Acoustic and electrical characteristics
SymbolParameter

Test condition

Vdd

Supply voltage

Idd

Current consumption innormal mode

IddPdnCurrent consumption in
power-down mode (2)Min.

Typ. (1)

Max.

Unit

1.64

1.8

3.6V

Mean value

0.6mA

20µA

Scc

Short-circuit current

110AOP

Acoustic overload point

So

Sensitivity

SNR

Signal-to-noise ratio

A-weighted at 1 kHz,1 Pa61dB

PSR

Power supply rejectionGuaranteed bydesign-70

dBFS

Clock

Input clock frequency (3)Ton

Turn-on time (4)TopOperating temperature
range

VIOL

Low level logic
input/output voltage

VIOH

High level logic
input/output voltage

120-291-26

dBSPL-23

MHz

10

ms-40

+85°C

Iout = 1 mA

-0.3

0.35xVdd

VIout = 1 mA

0.65xVdd

Vdd+0.3V

1. Typical specifications are not guaranteed.
2. Input clock in static mode.
3. Duty cycle: min = 40% max = 60%.
4. Time from the first clock edge to valid output data.

Table 4. Distortion specifications

4/17dBFS

3.25

Guaranteed bydesign

2.4mA

Parameter

Test condition

Value

Distortion

100 dBSPL (1 kHz)

< 1% THD+N

Distortion

115 dBSPL (1 kHz)

< 2% THD+N

Distortion

120 dBSPL (1 kHz)

< 10% THD+N

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2.2

Acoustic and electrical specifications

Frequency response
Figure 2. Typical frequency response normalized at 1 kHz

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Acoustic and electrical specifications

2.3

MP34DT01-M

Timing characteristics
Table 5. Timing characteristics
Parameter

Description

fCLK

Clock frequency for normal modefPD

Clock frequency for power-down mode

TCLK

Clock period for normal mode
Data enabled on DATA line, L/R pin = 1TR,DIS

Data disabled on DATA line, L/R pin = 1

TL,DIS

Max.

Unit

13.25

MHz

0.23

MHz

1000

ns308

TR,EN

TL,EN

Min.

(1)

18ns
16(1)

(1)

Data enabled on DATA line, L/R pin = 018

nsns

16(1)

Data disabled on DATA line, L/R pin = 0ns

1. From design simulations

Figure 3. Timing waveforms
TCLK

CLKTL,DIS
TR,ENTR,DIS
High ZPDM RHigh ZTL,EN
PDM LHigh ZHigh Z
AM045165v1

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Application recommendations
Figure 4. MP34DT01-M electrical connections (Top view)
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Application recommendations

MP34DT01-M

Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed asnear as possible to pin 1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 5).

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4Sensing element

Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transducers the soundpressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.

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Absolute maximum ratings

5MP34DT01-M

Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 6. Absolute maximum ratings
SymbolRatings

Maximum value

Unit-0.3 to 6V-0.3 to Vdd +0.3

VVdd

Supply voltage

VinInput voltage on any control pinTSTG

Storage temperature range-40 to +125°C

Electrostatic discharge protection

2 (HBM)kV±8kVESD

3 discharges at ± 8 kV direct contact to lid when unit
is grounded (IEC 61000-4-2) and 3 discharges at± 2 kV direct contact to I/O pins. (MIL 883E, Method3015.7)

This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.
This device is ESD-sensitive, improper handling can cause permanent damage to thepart.

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Functionality

6

Functionality

6.1L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 7. The
L/R pin must be connected to Vdd or GND.
Table 7. L/R channel selection
L/R

CLK low

CLK highGND

Data valid

High impedance

Vdd

High impedanceData valid

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Package mechanical data

7

MP34DT01-M

Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades ofECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

Soldering information
The HCLGA 3x4 4LD package is also compliant with the RoHS and “Green” standards andis qualified for soldering heat resistance according to JEDEC J-STD-020.
Landing pattern and soldering recommendations are available at www.st.com.
Figure 6. Recommended soldering profile limits
tp
TPCRITICAL ZONE

RAMP-UPTL to T P

TL
TEMPERATURE

TSMAX

tL

TSMIN
ts
PREHEAT

RAMP-DOWN

T25°C to PEAK
3060

90

120

150

180

TIME
210240270300330360390

AM045166v1Table 8. Recommended soldering profile limits
Description
Average ramp rate

ParameterPb free

TL to TP

3 °C/sec max

TSMIN
TSMAX
tS150 °C
200 °C
60 sec to 120 sec

Preheat
Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)TSMAX to TL

Ramp-up rate

12/17

Time maintained above liquidus temperature
Liquidus temperaturetL
TL

60 sec to 150 sec
217 °C

Peak temperature

TP260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 sec

Ramp-down rate

6 °C/sec max

Time 25 °C (t25 °C) to peak temperature

8 minutes max

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Package mechanical data
Figure 7. HCLGA (3 x 4 x 1.06 mm) 4-lead package outline

32$BB$Note:

The MEMS microphone metal cap can exhibit some level of variation in color when thedevice is subjected to thermal process.
Dimensions are in millimeter unless otherwise specified. General tolerance is ± 0.15 mm
unless otherwise specified.
Table 9. HCLGA (3 x 4 x 1.06 mm) mechanical data
Item

Dimension (mm)Tolerance (mm)Length [L]4± 0.1

Width [W]3± 0.1Height [H]

1.06

± 0.1

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Carrier tape mechanical specifications

8MP34DT01-M

Carrier tape mechanical specifications
Figure 8. Carrier tape without microphone-top view

Figure 9. Carrier tape with microphone-top view

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9Process recommendations

Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with following
recommendations:–The recommended pick-up area for the MP34DT01-M package must be definedusing the worst case (ie. no device alignment during picking process). This area
has been defined considering all the tolerances of the components involved (reel,package, sound inlet). Picker tolerance shall be considered as well.

–

To prevent damage to the MEMS membrane or incorrect pick-up and placement,
do not pick up the component on the inlet area–

For the package outline please refer to Figure 10. Nozzle shape, size, andplacement accuracy are the other key factors to consider when deciding on thecoordinates for the picking.

–Device alignment before picking is highly recommended.

–

A vacuum force greater than 7 psi must be avoided–

1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm–

All the recommended dimensions (device safe pick area) do not include the pickand place equipment tolerances–According to Figure 10, standard picker tool can be used to handle this device
Figure 10. Recommended picking area

0.58
0.23
0.285

Radius of package
corner (0.25 mm)

Pocket Positional Tolerance
Package Size Tolerance
1.49 1.99 2.27

Pocket Size ClearanceSound Port Positional Tolerance

Safe Pick Area

0.96
1.245

GAMS3107141420SG

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10MP34DT01-M

Revision history
Table 10. Document revision history
Date

RevisionChanges

19-Jun-2014

1

Initial release09-Jul-2014

2

Modified Min. and Max. values So parameter Table 3 on page 4
Added:03-Sep-2014

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3

– Table 4: Distortion specifications on page 4– Section 3: Application recommendations on page 7– Section 9: Process recommendations on page 15

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