Contact

SENJU METAL INDUSTRY CO., LTD.
HEADQUARTERS
Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan
Phone +81-3-3888-5151
URL www.senju.com/en

Attention to counterfeit products.
Counterfeit flux cored and other inauthentic SMIC solder products have been distributed abroad.
Please purchase genuine SMIC products from SMIC subsidiaries or authaorized distributors.

SMIC Lead-free Flux Cored Solder Product Catalogue© 2020 Senju Metal Industry Co., Ltd. All rights reserved.
933E-E042001K

SMIC is keenly aware of its social responsibility to help protect the global environment. We contributeto society by continuously offering products that create new values in our ECO SOLDER products.
In addition, we have declared “Conflict-Free Sourcing” and developed procurement satisfying CSR(Corporate Social Responsibility) through efforts such as checking the origins of smelters of tin ores.
Since 1955, when we introduced the first flux cored solder in Japan under the brand of “Sparkle
Solder,” we have continued to develop a number of flux cored solders with various alloys for a wide
range of applications. This has contributed significantly to progress in the electronic and automotive
markets as well as in other areas of the industry.
As the leading company in the industry, we continue to suggest “Smart Connection Realized by
Advanced Solder,” through the development of flux cored solder products that can accommodate
various requests in many markets that continue to evolve environmentally-friendly, high-reliability,
inexpensive and wearable products for the next generation.

Contents
SEN Series

3

EFC Series

13

GAO Series

5

ALS Series

15

CBF Series

7

RK Series Solder Alloys

17

MACROS Series

9

List of Lead-Free Solder Alloys

18

LEO Series

11

Please select from our product lineup according
to the applications or purposes of the nextgeneration products that continue to evolve.

SEN Series

Lead-free flux cored solder that
continues to take on further challenges and evolve
Workability-oriented (wettability, fume, odor countermeasure) JIS A Class

NEW

Complete suppress of splash of flux solder

GAO Series

E SC

ESC21

NEO

Reliability-oriented (high insulation of flux residue) JIS AA ClassR M A98

R MA 02

RMA 08FORTE

CBF Series

GAM M AZERO

MACROS Series

MA CROSCBF
Low temperature soldering JIS A Class

LEO

Optimal for harsh environments such as automotive
applications

01

S EN

Halogen-free flux (JIS AA Class equiv.)

Enables fine connection with halogen-free flux coredultra-thin wire on mobile devices, etc

Sn-Bi low melting temperature alloy as our L20 enables
low temperature soldering

LS C

Soft flux residue (migration countermeasure) JIS AA Class

Flux shows superb wettability that realizes high thermal
resistance and low fumes

LEO Series

GA O

2000

Performanceenhancement

2015
0% Ag alloys have been added to the product lineup

ECO SOLDER CORED CATALOGUE

02

Features
Non-splash of flux & solder through exclusive control• Splash control in a wide working temperature range.
• Non-splash soldering even in laser soldering with rapid heating.
• Splash control even in high-speed operation with various alloys.

Recommended Applications
Connecting through automation• Not dependent on soldering work conditions, and suitable for automation
using robotics.
• Suitable for laser soldering as well as solder iron operation.
• Suitable for sleeve soldering robotics supplying molten solder fromceramic sleeve, as it does not cause scorching in the ceramic sleeve part.

l Non-splash flux-cored solder SEN meeting new soldering requirements

Series NEW

M705

M705RK

M20RK

03

M705/M35/M20

LSC

Manual work

SEN

Splash-free, high insulation
product that is applicable to laser
soldering.
The electronics industry has advanced with higher
density and higher precision, and the environment
with splash of solder and flux is inducing malfunction.
In addition that, solder and flux splash may adhere
to the hands and body of workers and be burned
concern. The “SEN Series” is newly developed forcomplete the reduction of solder and flux splash.
Besides using at high temperature, the flux splash
was also suppressed for robotics and laser soldering.
In addition, flux and fumes, which are concerned
about adverse effects on the human body, were
suppressed and the achieved Eco-friendly work
environment. The “SEN Series” connects to the
future with automation. Rosin Mildly Activated typewith high insulation and no corrosion materials are
ideal for optical products such as automotive and OA
applications.

M705

2010

l Splash when thesolder is directly put
on a soldering iron2015

l Splash in laserl Splash of various alloys

soldering

Product

Basic Specifications
Flux typeContaining halogen elements
Flux content
Halide content [mass%]
Copper corrosion test
Dryness test
Insulation Resistance (85°C/85% RH)
Humidity test under DC voltage
Spreadability

JIS AA Class RMA Type ROL1Yes
3 mass%, 4 mass%
0.1 mass% or less
Pass
Pass
1.0E + 09 Ω
No ion migration
75 % or higher

Supported wire diameters

φ 0.3 to 1.6 mm
M705, M705RK, M20RK
320 to 400 °C

Available Alloys
Recommended solder iron tip temperature

M705/M35/M24MT

Laser

Automated machine

Composition
Sn-3Ag-0.5Cu
Sn-0.3Ag-0.7Cu
Sn-Cu-Ni-P-Ge

M705
M35
M24MT

Solidus line - Liquidus line
217-220217-227228-230

M705

Sn-3.0Ag-0.5Cu

Conventional product

SEN• When the difference between thesolidus and the liquidus is large, thenumber of splash is more likely toincrease• When an alloy has a high melting
point, the number of splash is more
likely to increase

SEN

Conventional productM705

Sn-3.0Ag-0.5Cu

M35

M24MT

Sn-0.3Ag-0.7Cu

Sn-0.7Cu

Conventional product

SEN

Number of splash [pcs]SEN

Available Alloys

Amount of splash

RMA08

30
20
10
0

Flux

Solder ball

Flux

Solder ball

Flux

Solder ball

Flux

Solder ballECO SOLDER CORED CATALOGUE

04

Features
Worker-friendly solder that withstands high temperatures• The flux does not burn even under high temperatures.
• The reduction of fumes and odor.
• Equipped with workability and reliability, while realizing a comfortable
work environment.

Recommended Applications• Suitable for solder iron work as flux does not easily burn even under direct heating.
• Suitable for soldering of components with a large heat capacity.

Connecting healthy work environmentsl Comparison of fume amount at each temperature
320°C

380°C

Scorching occurs

450°C

Initial stage

Conventional
product

Series

M24AP

05

4 sec.

6 sec.

Conventional
product

GAO-ST

GAO-ST

GAO-LF

GAO-LF

M24MT
l Comparison of fume intensity
3.5

Fume intensity (M)3

GAO-LF

2.5
2l Comparison of scorching temperatures

Solder iron temperature: 320, 380, 450°C Solder feed rate: 20mm/s
Solder: M24AP φ0.8, GAO-ST M24AP φ0.8, GAO-LF M24AP φ0.8

Conventional product
GAO-ST
GAO-LF

1.5
1
0.5
0

320°C

GAO-ST

70

Time to scorching (sec.)

We pursued a comfortable
work environment and beautiful
appearance after soldering.
When performing soldering work, adverse healtheffects due to the flux fume is a concern. The “GAO
Series” was developed taking into consideration thehealth of workers. The “GAO Series” demonstrates
low fumes and odor even under high temperatures,
and achieves a beautiful appearance after soldering
as it does not cause scorching or air bubbles. It
facilitates appearance check, and is friendly to thehealth of workers. To be specific, it suppresses theflux fumes and odor to the extent possible to promise
a comfortable soldering environment. In addition,
scorching of the flux does not occur even at a highsolder iron tip temperature of 400°C or higher.
The “GAO Series,” which connects a healthy work
environment to the future, is perfect for customers
who use high solder iron tip temperatures for
soldering in a short amount of time.

2 sec.

Available Alloys

380°C

450°C

60
50
40
30

GAO-LF

GAO-ST

20
10

Conventional product

0
300

350

Solder iron tip temperature (°C)

400

450

Hot plate temperature (°C)

Basic Specifications
Flux typeContaining halogen elements
Flux content
Halide content [mass%]
Copper corrosion test
Dryness test
Insulation Resistance (85°C/85% RH)
Humidity test under DC voltage
Spreadability

JIS A Class, MIL RA, ROM1Yes
3 mass%0.1 to 0.5 mass%
Pass
Pass
1.0E + 08 Ω
No ion migration
75 % or higher

Supported wire diameters

φ 0.3 to 1.6 mm
M24AP, M24MT
350 to 450 °C

Available Alloys
Recommended solder iron tip temperaturel Comparison of the weight of fume adhered to local
exhaust filters
5Adhered fume weight (g)GAOl Comparison of scorching degree at 450 °C

l Comparison of remaining air bubble amounts

Soldering temperature: 380°C
Feed rate: 20mm/sec, Solder amount 500g

Air bubbles

4
3
2
1
0

Conventional product

GAO-ST

GAO-LF

Conventional product

GAO-ST

ECO SOLDER CORED CATALOGUE

06

Features
Excellent wettability despite being halogen-free flux
Connecting high-density packaging• Contains amounts of chlorine and bromine that satisfy the halogen-free standard.
• Improves wettability and suppresses bridge generation in drag soldering.
• Suitable for processes in which heat is applied for a long periodwith low splash and high thermal resistance.

Recommended Applications• Suitable for solder iron work and CBF series is also suitable for laser soldering.
• The CBF Series is suitable for drag soldering or fine-pitch soldering due to its exceptional fluidity.
• The ZERO Series features a superb insulation characteristic of flux and is suitable for products
requiring high reliability.

l Excellent wettability despite being halogen-free flux
0.8sec1.2secl CBF series does not cause bridge even in drag soldering
0.6sec1.6sec0.8secConventional
product

Conventional
product
Solder iron tip temperature; 350°C
Wire diameter; φ0.8mm

ZERO

CBF

2.54 mm pitch

Land dimensions
CBF: Contain chlorine and bromine of 900 ppm or less
ZERO: Contain no halides

CBF

φ2.0mm
φ1.0mminsulation characteristic

M705

M24MT

Optimal for high-density printed
circuit boards, with a productlineup including ultra-fine wires
with halogen free flux.
Halogen is a collective name for the group ofelements such as fluorine, chlorine, bromine, andiodine ( group 17 of the periodic table ). Some materials
containing these halogen elements generate dioxins
when burned. Generally, a slight amount of halogen
is added as an activator of flux. SMIC, however,offers various halogen-free flux products. The “CBF
Series” consists of halogen-free flux cored solder
products that satisfy the industry standard. Having
excellent wettability and being a halogen-free flux,
it is suitable for laser soldering or drag soldering forfine pitch leads. The “CBF Series” is optimal for the
production of environmentally friendly products, andconnects high-density packaging to the future.

120
Conventional productwith halogen

1.0E+13

ZERO
CBF

1.0E+11Blank
Humidity:
85%RH
Temperature:
85°C
Application mode:
DC
Applied voltage:
50[V]Measured voltage:
100[V]
Measurement interval: 0.16[h]1.0E+09
1.0E+07
1.0E+05
0

200

400

600

800

1000

Time (h)ZERO

Basic Specifications
Flux typeContaining halogen elements
Flux content
Halide content [mass%]
Copper corrosion test
Dryness test
Insulation Resistance (85°C/85% RH)
Humidity test under DC voltage
Spreadability
Supported wire diameters
Available Alloys
Recommended solder iron tip temperature

07

Splash test result

1.0E+15

M35

Drag soldering
30mm/sec
256mm
2.5mm/sec
380 °C
φ 0.6mmand excellent thermal resistance

JIS AA Class equiv.,
MIL RMA equiv., ROL1
Free (Halogen content:
compliant with the industry
standard)
3 mass%
0.1 mass% or less
Pass
Pass
1.0E + 09 Ω
No ion migration
70 % or higher

Basic Specifications

φ 0.15 to 1.6 mm
M705, M35, M24MT
320 to 380 °C

Supported wire diameters

Flux typeContaining halogen elements
Flux content
Halide content [mass%]
Copper corrosion test
Dryness test
Insulation Resistance
Humidity test under DC voltage
Spreadability
Available Alloys
Recommended solder iron tip temperature

100

Splash countSeries

Item
Solder feed rate
Solder feed amount
Solder iron moving speed
Solder iron temperature
Solder wire diameterl Flux used in CBF series features low splash

Humidity test under DC voltage

Resistance (Ω)

CBF

l Flux used in ZERO series features excellent
Available Alloys

1.0sec80

Conventional
product

60

CBF

40
20
0

300

350

400

Solder iron tip temperature (°C)

SeriesJIS AA Class equiv.,
MIL RMA equiv. ROL0
No (100% halogen-free)
3 mass%, 4 mass%
0.02 mass% or less
Pass
Pass
1.0E+09 Ω
No ion migration
70 % or higher
φ0.3 mm to φ1.6 mm
M705
320 to 360 °C

Available Alloys

M705
With 0% halogen content in the flux, agroundbreaking product focusing on
its insulation characteristic“ZERO Series” is lead-free solder and a “completely
halogen-free flux product” that does not contain any halides
in the flux. Since flux contain ZERO halogen, it exhibits an
extremely high insulation resistance value, which leads toexcellent reliability of the flux residue after soldering. In
addition, since it uses a clear flux, its residue has a clear
appearance that is easy for appearance check, etc. It is
optimal for all types of environmentally-friendly products.

ECO SOLDER CORED CATALOGUE

08

Features
Connecting automotives

Prevents flux residue cracking, and is optimal for automotive applications• Features flux residue that does not crack even under mechanical bending or thermal stress.
• Flux exhibits high adhesive force to PCB and high water repellency,
as well as anti-corrosion effect and high insulation resistance.
• Suppresses flux splashing inherent to laser soldering.

Recommended Applications• Optimal for laser soldering due to low splashing of flux even under
rapid heating.
• Optimal for automotive applications that require high reliability.
• Suitable for drag soldering due to its exceptional fluidity.

l If flux residue cracks, it will become the cause of ion migration
Flux residue

CracksWater passage in cracks or breakage

Temperature
cycle

Condensation

SolderingFormation of water passage
in cracks or breakage

Short circuit due toion migration

Flux residue does not crack and ion migration due to condensation does not occur

SeriesEven under “Stress” caused by thermal shock

Available Alloys

Even under mechanical “Bending”-30°C/+110°C, Retained for 30 min, After 1000 cycles

M705

Flux residueof general-purpose product

MACROS with soft flux residue

Flux residueof general-purpose product

MACROS with soft flux residuel Flux residue with high water repellency and adhesion force exhibits high insulation characteristic,
preventing corrosion or ion migration
H2O

09

Occurrence of crack
or breakagel MACROS series features flux residue that does not crack even under mechanical bending or thermal stress

Soft residue of flux is optimal for
automotive applications with ahigh condensation risk.
Flux cored solder may experience cracking in theflux residue under harsh environments such as inautomotive applications. In automotive applications,where the temperature difference between the daytime
and nighttime is large, condensed water enters into
these cracks, which easily cause ion migration when
applying current. The “MACROS Series” is soft flux
residue type products featuring flux residue that
does not crack even under mechanical bending or
thermal stress, thus preventing ion migration due
to condensation. In addition, it is suitable for laser
soldering due to low splashing even under rapid
heating, and the flux exhibits high water repellency
and insulation resistance that lead to high reliability.
The “MACROS Series” is optimal for automotive
applications that require high reliability, safety andsecurity and connects the future of automotive.

Ion migration

Water

Solder

MACROS

Ion migration

Current
application

H2O

H2O

H2O

1.00E+12
H2O

H2O

1.00E+11

Test conditions

1.00E+10
H2O

General-purpose product

MACROS

By water entry or being absorbed into flux residue, deterioration of insulation resistanceor ion migration occurs

Basic Specifications
Flux typeContaining halogen elements
Flux content
Halide content [mass%]
Copper corrosion test
Dryness test
Insulation Resistance (85°C/85% RH)
Humidity test under DC voltage
Spreadability

1.00E+09

H2O

JIS AA Class, MIL RMA, ROL1
Yes
3.5 mass%
0.1 mass% or less
Pass
Pass
1.0E+09 Ω
No ion migration
75 % or higher

φ 0.5 to 1.6 mm
Available Alloys
M705
Recommended solder iron tip temperature 320 to 380 °C

l Suppresses flux splashing inherent to laser soldering
Conventional product

General-purpose
product

1.00E+08
1.00E+07

MACROS
Blank
0

200

400

600

800

Item
Temperature [°C]
Humidity [%]Constant voltage [V]Measured voltage [V]Measurement interval [h]Condition
85
85
50
100
0.4 (24min)

1000

l Promises excellent soldering workwith outstanding fluidity

MACROS

Supported wire diameters

Splashing occurring during laser soldering

ECO SOLDER CORED CATALOGUE

10Features
Enabled low-temperature soldering, which is leading the industry,
through proprietary processing technologies

Connecting future packaging• Low melting point alloy has been successfully turned into a product, realizing
low-temperature soldering.
• Splashing is suppressed due to low temperature soldering.
• Energy consumption and solder iron tip wear can be reduced, which contributes tocost reduction.

Recommended Applications• Recommended for use in solder iron soldering.
• Optimal for soldering of low heat-resistant components due to the low melting point.
• Suitable for repairs, due to its characteristic that the melting point drops when mixed in
the SAC305 products.

l Succeeded in the development of Sn-Bi flux cored solder,l Enable soldering at substrate temperature at 200 °C

which is leading the industry

2.4sec2.2sec

2.6sec2.5sec160°C

Lands patternused for test

Completion time (sec)

240°C

Series

L20

soldering that features improved wettability
and suppresses splashing at low temperature

Enable soldering at 200°C,
which leads the industry.

200

220

240

260

280

Substrate temperature (°C)

Test conditions (in reference to JIS3197)■Test sample: 25% flux/IPA solution ■Test piece: 30×5×0.3mm ■Immersion rate: 20mm/s■Immersion depth: 2mm ■Immersion time: 10sec ■Pulling-up speed 20mm/s ■Measurement range: 50mN

Total splash count

Zero cross time of Sn-Bi solder “L20”

40
30
20

0.40

0
200

0.00
170

250

275

300

325

350

Good wettability
rangeBest wettability
range

190

210

230

250

270

Good wettability
range

75

Poor wettability
range

70
65
170

Area where
soldering is difficult

190

even in low-temperature soldering by the LEO Series

250

270

290

even in low-temperature soldering by the LEO Series
Humidity test under DC voltage

1.00E+13

After heating for 5 sec at 200 °C

φ 0.8 mm, φ 1.0 mm
Available Alloys
L20
Recommended solder iron tip temperature 200 to 300 °C

230

l Good insulation characteristic of flux can be achieved

Copper plate corrosion test

Supported wire diameters

210

Temperature (°C)

Solder bath temperature (°C)

l Good corrosion resistance of flux can be achieved

Before test

Best wettability
range

Poor wettability
range
80

0.60

0.20
225

85

0.80

10

Test conditions (in reference to JIS3197)■Solder amount: 0.3g
■Copper plate: 30×5×0.3mm■Heating time: 30s

90

1.00

Resistance (Ω)

JIS A Class equiv., MIL RA, ROM1Yes
2 mass%0.1 to 0.5 mass%
Pass
Pass
1.0E+08 Ω
No ion migration
75 % or higher

1.20

50

Solder iron tip temperature (°C)

Basic Specifications
Flux typeContaining halogen elements
Flux content
Halide content [mass%]
Copper corrosion test
Dryness test
Insulation Resistance (85°C/85% RH)
Humidity test under DC voltage
Spreadability

Splashing and solder iron tip temperature

1.00E+12
1.00E+11
1.00E+10

200℃

1.00E+09

250℃

1.00E+08

350℃

1.00E+07
Reference to JIS3197

11

180

Sample; LEO F2 M20 φ0.8mm
Pre-heating;
1.0secSolder feed amount; 6mm
Solder feed rate;
10mm/s280°C

of 210 °C

Test conditions (in reference to JIS3197)■Solder amount: 500mm ■Feed rate: 20mm/sec

60

Conventionally, Sn-Bi (tin-bismuth) solder alloys
could not be used in flux cored solder products,
since its hardness and low ductility. SMIC has
succeeded in developing The “LEO Series” of Sn-Bi
low-temperature flux cored solder, which leads theindustry, by fully utilizing our propitiatory processing
technologies. The series uses an alloy with a low
melting point, which enables soldering at 200°C,
and also makes it possible to reduce energy use or
solder iron tip wear, as well as to use inexpensive
materials; as a result, material and production costs
can be reduced. Moreover, the rework materials
will accelerate low-temperature soldering using Sn-Bi
solder in reflow oven. The “LEO Series,” which connects
future of packaging, is optimal for packaging of low
heat-resistant components or substrates.

2.0mm

3
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2
160

l Flux developed exclusively for low temperature l Enables good soldering work even with a solder iron tip temperature

Time (sec)LEO

Available Alloys

It was difficult to turn Sn-Bi alloys into flux cored solder products due to their hardness and low
ductility. However, SMIC has successfully made Sn-Bi alloy into a flux cored solder product throughthe utilization of our proprietary processing technologies and has become the first in the industry torealize low-temperature soldering

Thermocouple
position

4.0mm 0.9mm

200°C

300℃
Blank

0

200

400

600

Time (h)800

Test conditions（JIS Z 3197）■Humidity:
85%RH■Temperature:
85°C■Application mode:
DC■Applied voltage:
50[V]■Measured voltage:
100[V]■Measurement interval: 4[hr]1000

ECO SOLDER CORED CATALOGUE

12

Features
Realizes fine-pitch soldering with ultra-thin wires• Advanced wire drawing technology has resolved issues peculiar to ultrathin wires, including strength.
• Low splashing has been realized through the development of flux designed
for ultra-thin wires.
• Bridge formation is suppressed through the development of flux designed
for ultra-thin wires.

Recommended Applications• Features high insulation resistance flux and is optimal for soldering narrow-pitch,
multi-pin structures.
• Optimal for soldering micro or fine pitch components since it is ultra-fine wire.
• Optimal for soldering micro or fine pitch components due to low splashing.

Connecting narrow pitchesl Fewer disconnections and constrictions during wire drawing and high-quality extra-fine lines made possible
with our own wire drawing technology

Flux is accurately
positioned in the center

SeriesM705

13

l Ultra-fine connections achieved with lower splashing,l Flux exhibits high insulation resistancegood wettability, and good solder fluidity
Splashing
test result

Flux cored solder for micro-fineconnections realizes fine-pitchsoldering.
In electronic devices that are becoming increasingly
sophisticated and multifunctional, such as wearable
devices and smartphones, the demand for size reduction
and integration of components is constantly growing.
Therefore, there is a strong demand for high-density
packaging with a fine pitch. The “EFC Series” is flux coredsolder exclusively for ultra-fine connections developed
through the utilization of our proprietary elongate wiredrawing technology; in which flux is contained in the middle ofultra-fine wire with a diameter of 80 μm. The series features
low splashing, good wettability, and good solder fluidity,
and realizes ultra-fine connections with narrow pitches.
In addition, the series comes in packaging designed so
as to prevent oxidation, which causes deterioration of
wettability. The “EFC Series,” which connects the futureof fine pitch packaging, is optimal for soldering of fine
pitch or micro-pattern soldering using solder irons.

φ 0.1mm flux cored solder

Wettability

Solder fluidity

Humidity test under DC voltage
1.00E+12
1.00E+11

Conventional
product

Resistance (Ω)

EFC

Available Alloys

1.00E+10
1.00E+09

Blank

1.00E+07

EFC

1.00E+06

Basic Specifications

0

200

400

600

800

1000

Time (h)Flux typeContaining halogen elements
Flux content
Halide content [mass%]
Copper corrosion test
Dryness test
Insulation Resistance (85°C/85% RH)
Humidity test under DC voltage
Spreadability

JIS AA Class, MIL RMA, ROL1Yes
3 mass%
0.1 mass% or less
Pass
Pass
1.0E+09 Ω
No ion migration
75 % or higher

Supported wire diameters

φ 0.08 mm to 0.2 mm
M705
320 to 380 °C

Available Alloys
Recommended solder iron tip temperature

EFC

1.00E+08

l Narrow-pitch soldering in reflow oven using the ultra-fine flux cored solder “FLAT CORE”
Flux cored solder“FLAT CORE”
Flux cored solder

Pulse heater
Pressure

Solder alloy
Heat
Flux
Processing M705 with a
0.25 mm diameter

Narrow pitchelectrode
Easily moves dueto the roundcross-section

Does not moveeasily due to the oval
shaped cross-section

FPC
Electrode
Substrate

Ultra-fine flux
cored solder

FPC
Electrode
Substrate

ECO SOLDER CORED CATALOGUE

14

FeaturesHigh-quality solder material that suppresses electrolytic corrosion• Electrolytic corrosion has been suppressed through the development of Sn-Zn material.
• Flux is not required for ultrasonic soldering.
• Aluminum corrosion has been significantly suppressed.

Recommended Applications• ALS series is exclusively for aluminum, and ultrasonic soldering is
recommended for this series.
• GLS series is exclusively for glass, and ultrasonic soldering is
recommended for this series.

GLS solder for glass #6084 #9087

l Zn solder with small standard potential difference from that of aluminum suppresses electrolytic corrosion
Sn-Zn solder

Connecting aluminum

Zn
AlStandard electrodepotential difference

0.913[V]

SnAg 25h

Sn-Ag solder

Sn
Al

Currently, heavy and expensive copper wires aremainly used for electric wires used in coils or motors.
However, use of light and inexpensive aluminum isconsidered for applications that require weight
reduction, such as electric vehicles. If soldering
is performed on aluminum by using conventionalsoldering materials, however, a phenomenon called“galvanic corrosion” occurs and causes joint failure.
The “ALS Series” solder is mainly composed ofzinc, which has standard potential close to that ofaluminum, and therefore suppresses electrolytic
corrosion and exhibits high reliability. In order tosuppress aluminum corrosion, Al was added to SnZn solder. The “ALS Series” is optimal for soldering ofcomponents using light and inexpensive aluminum forenergy conservation or price lowering, and connects
aluminum to the future.

15

9

200

No corrosion was observed

ALS A151

150
100

Sn-Ag

50
0

5

10

15

GLS

12

15

Zn content (%)

Observe corrosion

ALS A091

20

25Time of immersion in 3 % NaCl solution (hr)l 15%Zn (A151)

6

250

0

A091: Sn-9Zn-Al-Ti-Ni

3

Evaluation result after being left
at 40 °C/90 % RH for 63 hours

Corrosion test of each material
300

0.913[V]1.538[V]0low corrosiveness350

Joint strength (N)Next-generation solder productsthat enable soldering of light andinexpensive aluminum.

0l Flux for ALS series features

resistance

Solder wire for aluminum

After 25 hours
100

Aluminum test piece

Aluminum test piece

Highly active flux

Flux for ALS

Series

Products that allow for direct soldering
on insulators including glass.
The “ GLS Series” makes it possible to directly form electrodes
using solder material by ultrasonic soldering on insulators
including glass, without metalizing them. It is electrodeformation material rather than soldering material, which allows
for the formation of flat electrodes without becoming rounded
due to surface tension. It is used for antennas of rear windowsof automotives or electrode formation for photovoltaic cells,
and its application is expanding.

l Prevents aluminum corrosion
Time to disconnection (sec)l Exhibits good corrosion

Series200

1.538[V]Natural peeling occurs after
25 hours in case of Sn-Ag solder

ALS

Initial stage
300

Standard electrodepotential difference

Natural peelingStandard electrode potential
at each substance (V)Zn content and joint strength

400

Joint strength (N)Sn-Ag initial

Dip in molten solder at 400 °C
70

AL200
A151

60
50
40
30
20
10
0

0.2

0.25

0.3

0.35

0.4

Wire diameter (mm)Solder for glass

Application is expanded forflat displays, etc.
• Joint strength can be enhanced by ultrasonic soldering• Exhibits high electrical conductivity due to metal joint• Enables soldering on ITO (Indium Tin Oxide) films

ECO SOLDER CORED CATALOGUE

16

List of Lead-Free Solder Alloys

RK Series Solder Alloys
Alloy composition (wt%)

ECO SOLDER

RK Series solder alloys reduce erosion
and contamination at solder iron chipl Iron tip erosion(SAC305)

Conventional product

M705RK(SAC305+α)(SAC305+Fe)

InitialReached the heater
component in 20,000 shots

No reach to heater
component even after
60,000 shots

No reach to heater
component even after
60,000 shots

l Iron tip contamination after 5000 shots
M705(SAC305)

Peak temp.

Product Form

Liquidus line

BAR

CORE

BALL

PASTE

PREFORM

●

●

●

●

M-series: Melting temperature 200 °C to 250 °C

RK Series suppresses contamination of solder iron chip to improve
productivity. Also, lowered erosion at iron chip induces reduction of
production cost. 3Ag type M705RK and Ag-free M20RK are lineuped
and best for automatic soldering process.

M705

Melting temp. (°C)
Solidus line

Conventional product(SAC305+Fe)

M705RK(SAC305+α)M705

Sn-3.0Ag-0.5Cu

217

219

220

M705RK

Sn-3.0Ag-0.5Cu-x

219

221

221

●

M30

Sn-3.5Ag

221

223

223

●

●

●

●

●

M31

Sn-3.5Ag-0.75Cu

217

219

219

●

●

●

●

●

M714

Sn-3.8Ag-0.7Cu

217

219

220

●

●

●

●

●

M715

Sn-3.9Ag-0.6Cu

217

219

226

●

●

●

●

●

M710

Sn-4.0Ag-0.5Cu

217

219

229

●

●

●

●

●

M770

Sn-2.0Ag-0.75Cu-Ni

218

220

224

●

●

●

●

●

M34

Sn-1.0Ag-0.5Cu

217

219

227

●

●

●

●

●

M771

Sn-1.0Ag-0.7Cu

217

219

224

●

●

●

●

●

M40

Sn-1.0Ag-0.7Cu-Bi-In

211

222

222

●

●

●

●

M35

Sn-0.3Ag-0.7Cu

217

219

227

●

●

●

●

M35RK

Sn-0.3Ag-0.7Cu-x

217

219

227

M47

Sn-0.3Ag-0.7Cu-0.5Bi-Ni

216

228

228

●

●

●

●

●

M20

Sn-0.75Cu

227

229

229

●

●

●

●

●

M20RK

Sn-0.75Cu-x

227

229

229

M24MT

Sn-0.7Cu-Ni-P-Ge

228

230

230

●

●

●

●

●

M24AP

Sn-0.6Cu-Ni-P-Ge

227

228

228

●

●

●

●

●

M805E

Sn-0.3Bi-0.7Cu-P

225

229

229

●

●

●

●

●

M725

Sn-0.7Cu-Ni-P

228

230

230

●

●

●

●

●

M823

Sn-0.75Cu-1.5Bi-Ni-x

224

229

229

M773

Sn-0.7Cu-0.5Bi-Ni

225

229

229

M794

Sn-3.4Ag-0.7Cu-Bi-Sb-Ni-x

210

221

221

M731

Sn-3.9Ag-0.6Cu-3.0Sb

221

224

226

M716

Sn-3.5Ag-0.5Bi-8.0In

196

208

214

●

M758

Sn-3.0Ag-0.8Cu-Bi-Ni

205

215

215

●

M806

Sn-3.5Ag-0.8Cu-Bi-Ni

203

214

214

M807

Sn-3.5Ag-0.8Cu-Bi-Ni

214

219

219

M709

Sn-0.5Ag- 6.0Cu

217

226

378

●

M760HT

Sn-5.0Cu-0.15Ni-x

228

229

365

●

M711

Sn-0.5Ag-4.0Cu

217

226

344

●

M10

Sn-5.0Sb

240

243

243

M14

Sn-10Sb

245

248

266

●

●

●

●

●
●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

●

L-series: Melting temperature: 200 °C or lower
L20

Sn-58Bi

139

141

141

L29

Sn-58Bi-Sb-Ni

140

145

145

●

●

Peak temp.: Max. endothermic reaction point on DSC curve
Some alloy compositions may not be available in certain forms with special product sizes and grades.
For alloy compositions not listed above, please contact our sales representative or contact us via e-mail (web@senju.com).

Features of the main flux cored solder products★★★★★ Excellent ★★★★ Very Good ★★★ Good ★★ Fair
Workability

Carbides are increased

17

Carbides are reduced

M705RK

Conventional
product

M705

Anti-erosion

◯

◯

×

Anti-carbonization

◯

△

◯

Equipment Maintenance

◯

△

◯

Flux heat
resistance

Suppressionof flux
scattering

Insulation
Suppressionof fumes/odor characteristic

Lasercompatibility
soldering

Robot
compatibility
soldering

Fine pitch
connectivity

SEN

★★★★

★★★

★★★★★

★★★★

★★★★★

★★★★★

★★★★★

★★★★

GAO-ST

★★★★★

★★★★★

★★★

★★★★★

★★★

★★★

★★★★★

★★★

GAO-LF

★★★★★

★★★★

★★★★

★★★★★

★★★

★★★

★★★★★

★★★

CBF

★★★

★★★

★★★

★★★

★★★★★

★★★★

★★★★

★★★★★

MACROS

★★★

★★★

★★★★★

★★★★

★★★★★

★★★★★

★★★

★★

LEO

★★★★

★★★★

★★★

★★★

★★★

★★

★★

Suppressionof flux residue
cracking

Lowtemperaturesoldering

★★★★★
★★★★★

ECO SOLDER CORED CATALOGUE

18