RS75xx-1

150mA, Low Power Consumption,
High Voltage CMOS LDO Regulator
1 FEATURES
3 DESCRIPTIONS

Low Quiescent Current IQ：

The RS75xx-1 series is a set of low power highvoltage regulators implemented in CMOS technology.
Which can provide 150mA output current. The device
allows input voltage as high as 36V.It is very suitable
for multi-cell battery systems, bus voltage power
supply systems and other high DC voltage systems.
Wide input voltage can make it well withstand theimpact of surge voltage and ensure the stability ofoutput voltage.

2uA Typical at Light Loads


150mA Nominal Output Current

Low Dropout Voltage



Low Temperature CoefficientHigh Input Voltage (up to 36V)

Output Voltage Accuracy：±2%

Fixed 2.5V 、3.0V 、3.3V、3.6V and 5V

Over temperature protection

Short Circuit Protection

The RS75xx-1 series only 2uA (typical) current isconsumed by itself, which is especially important in
multi-battery power supply systems and can reduce
the standby power consumption of the whole system.

Micro SIZE PACKAGES: SOT23-3 andSOT89-3

The RS75xx-1 is available in Green SOT23-3 andSOT89-3 packages. The over temperature is 150 °C.

Output Voltage

Device Information (1)2 APPLICATIONS

Audio/Video Equipment

Communication Equipment

Battery-Powered Equipment

PART NUMBER
RS75xx-1

PACKAGEBODY SIZE (NOM)

SOT23-3

1.60mm×2.92mm

SOT89-3

2.45mm×4.50mm

Note: xx represents output voltage



Automotive Head Unit

Laptop, Palmtops, Notebook Computers

4 Typical Application Schematic
VIN

VIN
CIN
1uF

VOUT

RS75xx-1

VOUTCOUT
1~22uFGND

REV A.10.1

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RS75xx-1Table of Contents
1 FEATURES .......................................................................................................................................................12 APPLICATIONS ................................................................................................................................................13 DESCRIPTIONS ................................................................................................................................................14 Typical Application Schematic.......................................................................................................................15 Revision History ..............................................................................................................................................36 PACKAGE/ORDERING INFORMATION (1) ......................................................................................................47 Pin Configuration and Functions (Top View) ...............................................................................................58 Specifications ..................................................................................................................................................68.1 Absolute Maximum Ratings ........................................................................................................................68.2 ESD Ratings................................................................................................................................................68.3 Recommended Operating Conditions .........................................................................................................6
8.4 Thermal Information ....................................................................................................................................68.5 ELECTRICAL CHARACTERISTICS ...........................................................................................................7
8.6 TYPICAL CHARACTERISTICS ..................................................................................................................99 DETAILED DESCRIPTION ............................................................................................................................ 119.1 Overview .................................................................................................................................................. 11
9.2 Functional Block Diagram ........................................................................................................................ 11
9.3 Thermal Considerations ........................................................................................................................... 11
9.4 Applications Note: .................................................................................................................................... 11
10 PACKAGE OUTLINE DIMENSIONS ........................................................................................................... 1211 TAPE AND REEL INFORMATION .............................................................................................................. 142 / 15

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RS75xx-1
5 Revision History
Note: Page numbers for previous revisions may different from page numbers in the current version.
VERSION

Change Date

A.10

2023/05/08

A.10.12024/03/07

Change Item
1.Update Typical Application Schematic on Page 1 @A.9 Version.
2.Increase Power Dissipation and Junction Temperature Range on Page 4 @A.9 Version.
3.Increase RS7533-1YF3-G ORDERING NUMBER on Page 3 @A.9 Version.
Modify packaging naming

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RS75xx-1
6 PACKAGE/ORDERING INFORMATION (1)PRODUCT

ORDERING
NUMBER

VOUT(V)

PACKAGE LEAD

PACKAGEMARKING (2)PACKAGE OPTION

RS7525-1YF3

2.5

SOT23-37525-1

Tape and Reel,3000

RS7525-1YE3L

2.5

SOT89-3(L-Type)7525-1

Tape and Reel,1000

RS7530-1YF3

3.0

SOT23-3

7530-1

Tape and Reel,3000

RS7530-1YE3L

3.0

SOT89-3(L-Type)7530-1

Tape and Reel,1000

RS7533-1YF3

3.3

SOT23-37533-1

Tape and Reel,3000

RS7533-1YE3

3.3

SOT89-37533-E

Tape and Reel,1000

RS7533-1YE3L

3.3

SOT89-3(L-Type)7533-1

Tape and Reel,1000

RS7533-1YF3-G (3)3.3

SOT23-37533-1

Tape and Reel,3000

RS7536-1YF3

3.6

SOT23-37536-1

Tape and Reel,3000

RS7536-1YE3L

3.6

SOT89-3(L-Type)7536-1

Tape and Reel,1000

RS7550-1YF3

5.0

SOT23-3

7550-1

Tape and Reel,3000

RS7550-1YE3

5.0

SOT89-3

7550-E

Tape and Reel,1000

RS7550-1YE3L

5.0

SOT89-3(L-Type)

7550-1

Tape and Reel,1000

RS7525-1

RS7530-1

RS7533-1

RS7536-1

RS7550-1

NOTE:(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) -G represents MSL 1. MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.

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RS75xx-1
7 Pin Configuration and Functions (Top View)
VIN

VIN

GND

75XX-175XX-E

375XX-1xxxxxxxxxxxx

12GND

VOUT

SOT23-3XXXXXX

123123

GND

VIN

VOUT

VOUT

GND

VIN

SOT89-3(L-Type)SOT89-3

PIN DESCRIPTION
PIN
NAME

FUNCTION
SOT23-3

SOT89-3(L-Type)SOT89-3

GND

112

VIN

323

VOUT

231Ground.
Regulator Input. Up to 36V input voltage. At least 1uF
supply bypass capacitor is recommended.
Regulator Output. Recommended output capacitorrange: 1uF to 10uF.

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RS75xx-1
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MINMAX

UNIT

-0.3

40V

VIN

Input voltage

TJ

PN Junction temperature-40

150°CTstg

Storage temperature range

-65

150°C

(1)

(2)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the GND pin.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

V(ESD)

Electrostatic discharge

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±4000

VMachine model (MM)

±100

V

(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
MINMAXUNIT

VIN

Input supply voltage

2.536V

IOUT

Output current

0150mA

COUT

Capacitor of VOUT pin

122μFTJJunction Temperature Range (2)-40+85°CTAOperating temperature-40+85 (3)°C(1) All voltage is with respect to the GND pin.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambienttemperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB(3) The chip’s operating temperature is determined by the junction temperature (TJ), the relationship between TA and TJ, Please refer tothe application note as below.

8.4 Thermal Information
RS75xx-1
THERMAL METRICSOT89-3(L-Type)SOT89-3

SOT23-3

3 PINS

3 PINS

3 PINS

UNIT

RθJA

Junction-to-ambient thermal resistance

208.3

75

312.5°C/WPD

Power Dissipation (1)

0.6

1.7

0.4

W

(1) Internal thermal shutdown circuitry protects the device from permanent damage. The actual chip output current is subject to the inputoutput voltage difference, ambient temperature and PCB heat dissipation design.

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RS75xx-1
8.5 ELECTRICAL CHARACTERISTICS(VIN = VOUT + 2V, CIN = COUT = 1uF, VOUT = 3.3V, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwisenoted.)
PARAMETERTEMPMIN

TYP

MAXUNITSVOUT = 3.3V

+25°C--36VOutput Voltage Accuracy

IOUT = 10mA

+25°C

-202%

Ground Pin Current

No load

+25°C

-

23uA

+25°C

70100-mA

IOUT =100mA, △Vo=2%

+25°C

-526

800

mV

ΔVOUT
VIN = VOUT + 2V to 36V, IOUT = 1mA
ΔVIN × VOUT

+25°C

0.05

0.2%/V+25°C

2560mV

Input Voltage (1)SYMBOL
VIN

CONDITIONS

Maximum Output Current (2)Dropout Voltage (3)Line Regulation

VDROP

Load Regulation

ΔVOUT

VIN =VOUT+2V, IOUT = 1mA to 50mA

Power Supply Rejection
Ratio

PSRR

VOUT = 3.3V,
IOUT = 10mA

f = 217Hz
f = 1KHz

ΔVOUTOutput Voltage Temperature
IOUT = 1mA
Coefficient (4)ΔTA × VOUT

+25°C
FULL

5840dB

100ppm/°C

150°C

THERMAL PROTECTION
Thermal Shutdown
Temperature

TSHDN

NOTES:
1.VIN >= VOUT (NOMINAL), whichever is greater.
2. Maximum output current is affected by the PCB layout, size of metal trace, the thermal conduction path between metal layers, ambient
temperature and the other environment factors of system. Attention should be paid to the dropout voltage when VIN < VOUT + VDROP.
3. The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT (NOMINAL) + 2V.
4.Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.

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RS75xx-1
ELECTRICAL CHARACTERISTICS(VIN = VOUT + 2V, CIN = COUT = 1uF, VOUT = 5.0V, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwisenoted.)
PARAMETERTEMP

MIN TYPMAXUNITSVOUT = 5.0V

+25°C

--36V

Output Voltage Accuracy

IOUT = 10mA+25°C-202%

Ground Pin Current

No load+25°C

-

23uA

+25°C

100150-mA

IOUT = 100mA, △Vo = 2%+25°C-440700mV

ΔVOUT
VIN = VOUT + 2V to 36V, IOUT = 1mA
ΔVIN × VOUT

+25°C

0.05

0.2%/V+25°C

2560mV

Input Voltage (1)SYMBOL
VIN

CONDITIONSVIN = VOUT + 2V

Maximum Output Current(2)

Dropout Voltage (3)Line Regulation

VDROP

Load Regulation

ΔVOUT

VIN =VOUT+2V, IOUT = 1mA to 150mA

Power Supply Rejection
Ratio

PSRR

VOUT = 5.0V,
IOUT = 10mA

Output Voltage
Temperature Coefficient (4)f = 217Hz
f = 1KHz

ΔVOUT
IOUT = 1mA
ΔTA × VOUT

+25°C
FULL

5840dB100ppm/°C

150°C

THERMAL PROTECTION
Thermal Shutdown
Temperature

TSHDN

NOTES:
1.VIN >= VOUT (NOMINAL), whichever is greater.
2. Maximum output current is affected by the PCB layout, size of metal trace, the thermal conduction path between metal layers, ambient
temperature and the other environment factors of system. Attention should be paid to the dropout voltage when VIN < VOUT + VDROP.
3. The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT (NOMINAL) + 2V.
4.Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.

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RS75xx-1
8.6 TYPICAL CHARACTERISTICS
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VIN = 5.3V, VOUT = 3.0V, CIN = COUT = 1uF, TA = 25°C unless otherwise noted.

IOUT
=10mA
to 100mA
IOUT=10mA
to 100mA

to OUT
6.3V,
IOUT=50mA
IN=5.3V
VINV=5.3V
to 6.3V,I=50mA

VOUT

50mV/div

VOUT

100mV/div

1V/div

IOUT

100mA/div

VIN

Time(1ms/div)

Time(2ms/div)

Figure 2. Load-Transient Response

Figure 1. Line-Transient Response

VIN=0 to 3.4V,IOUT=50mA

2V/div

VOUT
2V/div

VIN

100mA/div

2V/div

VOUT

IOUT

VV
IN=0
to 5.3V,I=50mA
to OUT
5.3V,
IOUT=50mA
IN=0V

Time(1ms/div)

Time(2ms/div)

Figure 3. Power-Up/Power-Down Output
Waveform

Figure 4. Output Short Waveform

400

1000

Dropout Voltage(mV)

Dropout Voltage(mV)

IOUT=50mA

350

300

250

200

800
600
400
200

0-50-2502550
Temperature(℃)

75100

Figure 5. Dropout Voltage vs Temperature

0255075100 125
Output Current(mA)

150

Figure 6. Dropout Voltage vs Output Current

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RS75xx-1
TYPICAL CHARACTERISTICS
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
VIN = 5.3V, VOUT = 3.0V, CIN = COUT = 1uF, TA = 25°C unless otherwise noted.
3

Ground Pin Current(uA)

Ground Pin Current(uA)

2.5
2

1.5
10.5

2.5

2
1.5
10.5
004

8

1216

20

2428

32036

Input Voltage(V)Figure 7. Ground Pin Current vs InputVoltage

255075100
Output Current(mA)

125150Figure 8. Ground Pin Current vs LoadCurrent

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RS75xx-1
9 DETAILED DESCRIPTION
9.1 Overview
The RS75xx-1 low-dropout regulators (LDO) consumes only 2µA of quiescent current at light load and delivers
excellent line and load transient performance. These characteristics, combined with low noise and good PSRR
with low dropout voltage, make this device ideal for portable consumer applications.

9.2 Functional Block Diagram

9.3 Thermal Considerations
When the junction temperature is too high, the thermal protection circuitry sends a signal to the control logic
that will shut down the IC. The IC will restart when the temperature has sufficiently cooled down. The maximum
power dissipation is dependent on the thermal resistance of the case and the circuit board, the temperature
difference between the die junction and the ambient air, and the rate of air flow. The GND pin must be connectedto the ground plane for proper dissipation.

9.4 Applications Note:1) The phase compensation circuit and ESR of the output capacitor are used inside the circuit tocompensate, so a capacitor larger than 1.0uF must be connected to the ground.
2) It is recommended to use 1uF polar capacitors for input and output, and to keep the capacitors as
close to the VIN and VOUT pins of LDO as possible.
3) Pay attention to the use conditions of input and output voltages and load currents to avoid the power
consumption (PD) inside the IC exceeding the maximum power consumption allowed by the package.
PD=(VIN-VOUT) × IOUT
TPN = PD×RθJA+TTPN is junction temperature
T is ambient temperature4) When the input voltage VIN is greater than 2.5V, if VIN is also higher than the output set value plus thedevice dropout voltage, VOUT is equal to the set value. Otherwise, VOUT is equal to VIN minus the dropout
voltage. If VIN lower than 2.5V, the VOUT is:
VOUT = VIN - VDropout

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RS75xx-1
10 PACKAGE OUTLINE DIMENSIONSSOT23-3
D1.90

b

2.59

E1

E
0.99
0.95

0.69
ee1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2

A A2cθ
L

A1

Dimensions In Millimeters

Dimensions In Inches

SymbolMinMaxMinMaxA

1.050

1.250

0.041

0.049

A1

0.000

0.100

0.000

0.004

A2

1.050

1.150

0.041

0.045

b0.300

0.500

0.012

0.020

c

0.100

0.200

0.004

0.008

D

2.820

3.020

0.111

0.119

E

1.500

1.700

0.059

0.067

E1

2.650

2.950

0.104

0.116

e0.950(BSC)

0.037(BSC)

e1

1.800

2.000

0.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°

8°

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RS75xx-1
SOT89-3

Dimensions In Millimeters

Dimensions In Inches

SymbolMinMaxMinMax

A

1.400

1.600

0.055

0.063

b0.320

0.520

0.013

0.020

b1

0.400

0.580

0.016

0.023

c0.350

0.440

0.014

0.017

D

4.400

4.600

0.173

0.181

D1

1.550 REF

0.061 REF

E

2.300

2.600

0.091

0.102

E1

3.940

4.250

0.155

0.167

e

1.500 BSC

0.060 BSC

e1

3.000 BSC

0.118 BSC

L

0.900

1.200

0.035

0.047

NOTE:
A. All linear dimension is in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
D. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
E. REF: Reference Dimension, usually without tolerance, for information purposes only.

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RS75xx-1
11 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

Reel
DiameterReel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SOT23-3

Reel
Diameter7’’

Reel
Width(mm)9.0

A0(mm)
3.20

B0(mm)
3.30

K0(mm)
1.30

P0(mm)
4.0

P1(mm)
4.0

P2(mm)
2.0

W(mm)
8.0

Pin1
Quadrant
Q3

SOT89-3

7’’

13.2

4.85

4.45

1.85

4.0

8.0

2.0

12.0

Q3

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS75xx-1
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warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for aspecific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security orother requirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not
be liable for the use of this product and the infringement of patents or third-party intellectual property rights due
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