RS1G14

RS1G14 Single Schmitt-Trigger Inverter
1 FEATURES

3 DESCRIPTIONSOperating Voltage Range:1.65V to 5.5V

Low Power Consumption:1µ A (Max)Operating Temperature Range:

The RS1G14 Single Schmitt-trigger inverter isdesigned for 1.65V to 5.5V VCC operation.
The RS1G14 device contains one inverter and̅ . The device
performs the Boolean function Y= A
functions as an independent inverter with Schmitttrigger inputs, so the device has different input
threshold levels for positive-going (VT+) and negativegoing (VT-) signals to provide hysteresis (ΔVT) whichmakes the device tolerant to slow or noisy input
signals.

-40°C to +125°C
Input Accept Voltage to 5.5V

High Output Drive: ±24mA at VCC=3.0V

Ioff Supports Partial-Power-Down ModeOperation

ESD Protection Exceeds JESD 22- 4000-V Human-Body Model

This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables theoutputs, preventing damaging current backflow
through the device when it is powered down.

- 200-V Machine Model (A115)- 1000-V Charged-Device Model (JS-002)
Micro SIZE PACKAGES: SOT23-5, SC70-5

The RS1G14 is available in Green SOT23-5 and SC705 packages. It operates over an ambient temperature
range of -40°C to +125°C.

2 APPLICATIONSAC Receiver and

Home TheatersBlu-ray Players and Home Theaters

Desktops or Notebook PCs

PART NUMBER



Digital Video Cameras (DVC)Mobile Phones

RS1G14Personal Navigation Device (GPS)Portable Media Player

Device Information (1)(1)

2

BODY SIZE (NOM)

SOT23-5

2.92mm×1.60mm

SC70-52.10mm×1.25mm

For all available packages, see the orderable addendum at theend of the data sheet.

4 FUNCTION TABLE

Functional Block Diagram
A

PACKAGE4Y

INPUTOUTPUTAYHLLH

Y=A
H=High Voltage Level
L=Low Voltage Level

REV A.3.1

1 / 14www.run-ic.com

RS1G14
Table of Contents
1 FEATURES ............................................................................................................................................................................... 1
2 APPLICATIONS ...................................................................................................................................................................... 1
3 DESCRIPTIONS ...................................................................................................................................................................... 1
4 FUNCTION TABLE ................................................................................................................................................................ 1
5 Revision History ..................................................................................................................................................................... 3
6 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 4
7 PIN CONFIGURATIONS ...................................................................................................................................................... 5
8 SPECIFICATIONS ................................................................................................................................................................... 6
8.1 Absolute Maximum Ratings .......................................................................................................................................... 6
8.2 ESD Ratings ...................................................................................................................................................................... 6
9 ELECTRICAL CHARACTERISTICS...................................................................................................................................... 79.1 Recommended Operating Conditions ......................................................................................................................... 7
9.2 DC Characteristics .......................................................................................................................................................... 8
9.3 AC Characteristics ........................................................................................................................................................... 910 Parameter Measurement Information .........................................................................................................................1011 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................1112 TAPE AND REEL INFORMATION .................................................................................................................................13

2 / 14www.run-ic.com

RS1G145 Revision History
Note: Page numbers for previous revisions may different from page numbers in the current version.
VersionChange Date

Change Item

A.1

2020/12/13

A.2

2021/12/20

A.3

2023/11/02

A.3.1

2024/02/28

Initial version completed
1. Added the TAPE AND REEL INFORMATION
2. Modify Parameter Measurement Information on page 8@A.1 Version
3. Update PACKAGE MARKING on Page 5@RevA.1
1. Update FEATURES on Page 1@RevA.2
2. Added Marking Information on Page 5@RevA.2
3. Update Package thermal impedance and ESD Ratings on Page 4@RevA.2
Modify packaging naming

3 / 14www.run-ic.com

RS1G14
6 PACKAGE/ORDERING INFORMATION (1)PRODUCT
RS1G14ORDERING
NUMBERTEMPERATURE
RANGE

PACKAGE LEAD

PACKAGEMARKING (2)MSL(3)

PACKAGE OPTION

RS1G14XF5-40°C ~+125°C

SOT23-5

1G14

MSL3

Tape and Reel,3000

RS1G14XC5-40°C ~+125°C

SC70-5 (4)1G14MSL3

Tape and Reel,3000

NOTE:(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.
(4) Equivalent to SOT353.

Marking Information(1) SOT23-5, SC70-5(Top View)
5Part Number

41G14
XYWWL
12

X: Internal Code
Y: Year,0-9
WW: Week: 01~52;52
represents 52 and 53 week
L: Lot Code3

4 / 14www.run-ic.com

RS1G14
7 PIN CONFIGURATIONSTOP VIEW

N.C.

1A

2

GND

3

5

VCC

4Y

SOT23-5/SC70-5

PIN DESCRIPTIONPINSOT23-5/SC70-5
1

NAME

I/O TYPE (1)FUNCTION

N.C.

-Not connected

2AI

Input

3

GND

PGround

4YO

Output

5VCCPPower Pin(1) I=input, O=output, P=power.

5 / 14www.run-ic.com

RS1G148 SPECIFICATIONS
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)

(1)

(2)
(3)
(4)
(5)

MIN

MAXUNIT

VCC

Supply voltage range

-0.5

6.5

VVI

Input voltage range (2)

-0.5

6.5

VVo

Voltage range applied to any output in the high-impedance or power-off state(2)

-0.5

6.5

VVo

Voltage range applied to any output in the high or low state (2)(3)-0.5

VCC+0.5VIIK

Input clamp current

VI<0-50mAIOK

Output clamp current

VO<0-50mAIO

Continuous output current±50mA

Continuous current through VCC or GND±100mA

SOT23-5208

SC70-5283

θJAPackage thermal impedance (4)TJ

Junction temperature (5)-65

150°CTstg

Storage temperature-65

150°C°C/W

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the Recommended Operating Conditions table.
The package thermal impedance is calculated in accordance with JESD-51.
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.

V(ESD)

Electrostatic discharge

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

V

Charged-device model (CDM)

±1000

V

Machine model (MM)

±200

V

(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

6 / 14www.run-ic.com

RS1G149 ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (Full=-40°C to +125°C, typical values are at TA = +25°C, unlessotherwise noted.) (1)9.1 Recommended Operating Conditions
PARAMETER
Supply voltage

SYMBOL
VCCMINMAXOperatingTEST CONDITIONS

1.65

5.5

Data retention only

1.5UNITV

Input voltage

VI05.5V

Output voltage

VO0VCCV

Operating temperature

TA-40+125°C

7 / 14www.run-ic.com

RS1G14
9.2 DC Characteristics
PARAMETER

VT+VT-ΔVTTEST CONDITIONS

Positive going
input
thresholdvoltage

1.25

1.55

1.5

2.1

4.5V

2.3

3.0

5.5V

2.8

3.4

1.65V

0.3

0.6

0.35

0.65

0.45

0.75

4.5V

0.7

1.0

Full

Full

5.5V

0.85

1.15

1.65V

0.35

0.6

2.3V

0.6

1.2

1.05

1.65

4.5V

1.6

2.0

5.5V

1.95
VCC0.11.22.25

IOH = -100μA

1.65V to 5.5V

IOH = -4mA

1.65V

IOH = -8mA

2.3V

Full

Full

1.9

3V

1.65V to 5.5V

0.1

IOL = 4mA

1.65V

0.45

IOL = 8mA

2.3V

0.3

Full

0.4

0V to 5.5V

Ioff

VI or VO=5.5V

0ICC

VI=5.5V or GND, IO=0

1.65V to 5.5V

ΔICC

One input at VCC-0.6V,
Other inputs at VCC or GND

3V to 5.5V

V

0.55

4.5V

VI=5.5V or GND

V

3.8

3V

A inputV

2.3

IOL = 100μA

IOL = 32mA

V

V

4.5V

IOL = 16mAUNIT

2.4

IOH = -32mA

IOL = 24mA

II

MAX(2)

2.3V

3V

IOH =- 24mATYP(3)

1.05

3V

IOH = -16mAMIN(2)
0.75

2.3V

Hysteresis(VT+-VT-)

VOL

TEMP

1.65V
3V

Negativegoing input
thresholdvoltage

VOH

VCC

0.55
+25C±0.1

Full+25C±5±0.1

Full+25C±1±1±100.1

1

Full10

Full500

µA
µA
µA
µA

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

8 / 14www.run-ic.com

RS1G14
9.3 AC Characteristics
PARAMETER

Propagation Delay

Input Capacitance

SYMBOLtpd

Ci

TEST CONDITIONS

Cpd

TYP(3)

VCC=1.8V±0.15V

CL=30pF, RL=500Ω

7.5

VCC=2.5V±0.2V

CL=30pF, RL=500Ω

3.6

VCC=3.3V±0.3V

CL=50pF, RL=500Ω

3.1

VCC=5V±0.5V

CL=50pF, RL=500Ω

2.7

VCC=3.3V

VI=VCC or GND

4

VCC=1.8V
Power dissipation
capacitanceMIN(2)

VCC=2.5V
VCC=3.3V

MAX(2)

UNIT

nspF

20
f=10MHz

VCC=5V

21
22pF

25

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
(2) This parameter is ensured by design and/or characterization and is not tested in production.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.

9 / 14www.run-ic.com

RS1G14
10 Parameter Measurement Information
RL

From Output
Under Test

VLOAD

S1Open
GND

CL

RL

TEST

S1

tPLH/tPHL

Open

tPLZ/tPZL

VLOAD

tPHZ/tPZH

GND

INPUTS

VCC

VM

VLOAD

CLRL

VΔ

≤2ns

VCC/22 x VCC

30pF

500Ω

0.15V

≤2ns

VCC/22 x VCC

30pF

500Ω

0.15V

3V

≤2.5ns

1.5V

6V

50pF

500Ω

0.3V

VCC≤2.5ns

VCC/22 x VCC

50pF

500Ω

0.3V

VI

tr/tf

1.8V±0.15V

VCC

2.5V±0.2V

VCC

3.3V±0.3V
5V±0.5V

VI
Timing Input

VM0Vtsu

twVI
Input

VM

VI

Data Input

VM

0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES

0V

VI
VM
tPLH

tPHL
VOH
VM

tPHL

VM
tPLH

VM

OutputWaveform 1
S1 at V LOA D(see Note B)

VOL

VOH
OutputOutputControl

VM
0V

OutputVM

VM

VOLTAGE WAVEFORMSPULSE DURATIONInputthVM
VOL

VOLTAGE WAVEFORMS PROPAGATION DELAY
TIMES INVERTION AND NON INVERTING OUTPUTS

OutputWaveform 2
S1 at GND
(see Note B)

VM

VIVM

0V
tPZL

tPLZ
VM

tPZH

VLOA D/2
VOL + V

VOL

tPHZ
VM

VOH – V

VOH
0V

VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESLOW-AN D HIGH-LEVEL ENABLINGNOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
1. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms
10 / 14www.run-ic.com

RS1G14
11 PACKAGE OUTLINE DIMENSIONSSOT23-5 (3)D1.90b2.59

E1E

0.99
0.95

0.69

ee1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2
A A2cθ
L

A1

SymbolDimensions In Millimeters

Dimensions In Inches

MinMaxMinMax

A (1)

1.050

1.250

0.041

0.049

A1

0.000

0.100

0.000

0.004

A2

1.050

1.150

0.041

0.045

b0.300

0.500

0.012

0.020

c0.100

0.200

0.004

0.008

D (1)

2.820

3.020

0.111

0.119

E (1)

1.500

1.700

0.059

0.067

E12.650

2.950

0.104

0.116

0.950(BSC) (2)e0.037(BSC) (2)

e1

1.800

2.0000.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

11 / 14www.run-ic.com

RS1G14
SC70-5 (3)
D

1.30

b

1.9

E

E1

0.75
Pin1
Index Area

0.65

0.4ee1RECOMMENDED LAND PATTERN (Unit: mm)

0.2

A A2cθ
LA1

L1

Dimensions In Millimeters

Dimensions In Inches

MinMaxMinMaxA (1)0.900

1.100

0.035

0.043

A10.000

0.100

0.000

0.004

A2

0.900

1.000

0.035

0.039

b0.150

0.350

0.006

0.014

c0.080

0.150

0.003

0.006

D (1)

2.000

2.200

0.079

0.087

E (1)

1.150

1.350

0.045

0.053

E1

2.150

2.450

0.085

Symbol

0.096

e0.650(BSC) (2)0.026(BSC) (2)e11.300(BSC) (2)0.051(BSC) (2)

L

0.260

L1θ

0.460

0.010

0.525
0°

0.018
0.021

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

12 / 14www.run-ic.com

RS1G14
12 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

Reel
DiameterReel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SC70-5

Reel
Diameter7’’

Reel
Width(mm)9.5

A0(mm)
2.25

B0(mm)
2.55

K0(mm)
1.20

P0(mm)
4.0

P1(mm)
4.0

P2(mm)
2.0W(mm)8.0

Pin1
Quadrant
Q3

SOT23-5

7’’

9.5

3.20

3.20

1.40

4.0

4.0

2.0

8.0

Q3

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

13 / 14www.run-ic.com

RS1G14IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (includingdata sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for aspecific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

14 / 14www.run-ic.com