EV GROUP® | Products//

Lithography

Mask Alignment Systems

www.EVGroup.com

EV GROUP® | Products//

Lithography//

Mask Alignment Systems

Introduction
EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, havepioneered and set industry standards in both top and double-sided lithography, aligned wafer
bonding and nanoimprint lithography.
EV Group contributes in these areas through continuous development of mask alignergenerations to augment the foremost lithography technology. Accommodating wafers andsubstrates up to 300 mm, varying in size, shape and thickness, EV Group’s mask alignmentambition is to simultaneously provide high-tech complex solutions for advanced applications
and full flexibility for research and development. EVG’s mask aligners and processcompetence are field-proven, installed and well integrated in the world-wide network, foundin numerous applications, including advanced packaging, compound semiconductors, powerdevices, LED, sensors and MEMS. Furthermore, EVG constantly looks out at future market
trends – such as optical 3D sensing and photonics – and develops and adapts its solutions
to meet the constantly evolving needs of our customers. This is proven by our continued
technology and market leadership, including EVG’s unsurpassed experience in using a variety
of non-standard resists that are optimized for distinctive requirements and parameters.
Understanding customer needs and efficient worldwide support are important steppingstones when it comes to our solutions’ priorities.

Mask Alignment Product Series
State-of-the-Art Engineering
Today’s main requirements for proximity aligners are defined by several key parameters.
Sub-micron alignment accuracy, controlled uniform proximity gap between mask and wafer,
as well as a clearly defined and easily controlled exposure spectrum corresponding to theresist sensitivity are among the most important criteria. In addition, high light intensity anduniformity across the full wafer surface are among many other crucial parameters taken into
account when designing and constantly enhancing EVG’s mask aligner product portfolio.
Innovation drives our daily business along with our philosophy, which enables us to thinkoutside the box.
Multi-purpose systems optimized to your needs
Our mask alignment systems are designed for quick and easy conversion from maskalignment to bond alignment. Furthermore, optional toolsets for imprint lithography, suchas UV-nanoimprint lithography, hot embossing or microcontact printing, are available. Allsystems support in-situ alignment verification software for increased alignment accuracy andrepeatability performance on manually operated systems. The EVG620 NT / EVG6200 NT
is field-upgradeable from manual to automated substrate handling. Furthermore, EVG’sproprietary NIL technology is supported on all mask aligners.

Research and Development
EVG has been working with research facilities for more than 35 years, giving us insight into theirunique requirements. Our dedicated R&D tools provide superior technology combined withmaximum flexibility, enabling universities, research institutions and technology development
partners to scale processes across multiple research projects and applications. What’s more,
the R&D equipment integrates seamlessly with EVG’s core technology platforms, whichspan the entire manufacturing chain from R&D all the way to small-scale and high-volumeproduction. Software and recipe compatibility between R&D and full-scale production
systems enables researchers to migrate their processes to volume-production environments.

High-Volume Mask Alignment Systems
For lithographic patterning in the single micrometer range, mask aligners are the most costefficient technology and provide cost savings of more than 30 percent per layer comparedto other solutions. EVG’s high-volume manufacturing systems are designed for optimal cost
efficiency combined with the highest technological standards, supported by an excellent
worldwide service infrastructure. Most importantly, large depth-of-focus exposure optics
perfectly matches for patterning thick resists, topography and non-flat substrates in highvolume production.

EVG®610 Mask Alignment System■■■

Stand-alone system for wafer sizes up to 100 mm / 150 mm / 200 mm

■
■
■
■

Soft-, hard-, vacuum contact and proximity exposure

Top-side / bottom-side alignment down to ± 0.5 µm / ± 2 µm
High-resolution top- and bottom-side splitfield microscopes
for double-side alignment
Automated wedge compensation
Bond Alignment and NIL option
Supports the latest UV-LED technology

EVG®620 NT / EVG®6200 NT
Mask Alignment System (semi-automated / automated)

■
■
■
■
■
■
■

Production system for wafer sizes up to 150 mm / 200 mm
Proximity wedge error compensation
Handling of multiple wafer sizes with quick changeover time of less than 5 min.
Up to 180 wph first print mode / 140 wph automatic alignment mode
Optional stand-alone version with anti-vibration granite table
Dynamic alignment function featuring real-time offset correction
Supports the latest UV-LED technology

IQ Aligner® NT■
■
■
■
■
■
■

Zero assist bridge tool - dual substrate concept supporting flexibility ofproduction for 200 mm and 300 mm
Unmatched throughput (first print) up to 140 wph
Top-side / bottom-side alignment down to ± 250 nm / ± 500 nm
Proximity processing capability 100% contactless
Darkfield alignment capability / full clearfield mask movement (FCMM)
Precise run-out compensation for best overlay alignment
Smart process control and performance analysis framework software platform

HERCULES®

■■■
■
■
■

Fully automated lithography track system based on modular design for maskalignment and exposure with integrated pre- and post-processing
Wafer processing with high throughput
Up to 8 wet-processing modules plus up to 24 additional bake, chill and vapor
prime plates
Mask alignment and exposure based on EVG’s IQ Aligner® NT or EVG®6200 NTtechnology
Chemistry handling in separate cabinet
Supporting Continuous Mode of Operation (CMO)Options
Manual and Automated Handling
All of our automated systems also support manual substrate and mask loading capability
for process evaluation. In addition, the systems can be configured to handle bowed, warped,
thinned or non-SEMI-standard-shaped wafers and substrates. Various wafer chuck designs
bring maximum process flexibility and substrate handling without compromises. Our maskaligners are equipped with mechanical or non-contact optical pre-aligners in order tosecure the optimum process capability and throughput. The Load & Go option offers ultrafast process start on automated systems.
Alignment Enhancements
Fully motorized top- and bottom-side split field microscopes support live, large gap, wafer flator IR alignment, automatically positioning at preprogrammable positions. Optimum patterncontrast is ensured and recipe-controlled for brightfield as well as darkfield illumination.
Advanced pattern recognition algorithms, auto-origin function, synthetic alignment key
pattern import and training ensure highly reproducible alignment results.
Exposure Optics
Different configurations of exposure optics are available, designed to fulfill maximum
flexibility of any application. Mercury arc lamp exposure optics are optimized for 150, 200and 300 mm substrates and can be used with various filters for narrow-band exposure
requirements, such as i-, g-, and h-line filters or even deep ultra-violet setup.
EVG’s latest enhancement for exposure optics is an LED lamp setup. Low energy
consumption and long lifetime are among the UV-LED light source’s biggest advantages,
as no warm-up or cool-down phase is required. Exposure spectrum setup is easily andpractically done in the user software interface. In addition, LEDs need to be powered only
during the exposure, and the technology eliminates the need for additional facility (exhaust,cooling gases) and lamp changes, which are regularly needed for mercury arc lamps. This
ideal combination will not only minimize your running and maintenance costs but also add
value in regards to the operator safety and environmental friendliness.

Software and Support
The Windows-based, graphical user interface is designed with a strong focus on userfriendliness, and easily navigates the operator through each process step. Multi-language
support, individual user account settings and integrated error logging / reporting andrecovery can simplify the user’s daily operation. All EVG systems can also communicateremotely. Thus, our service includes field-proven, real-time remote diagnostics andtroubleshooting via secured connection, phone or email. EVG’s experienced processengineers are readyEVG
to support Process
you anytime thanks toour de-centralized worldwide support
Expertise
structure, including cleanroom space on three different continents:
Europe (HQ), Asia (Japan) andNorth America (USA).
...etc.
CVD,
LPCVD,
PVD,...

ResistCoatingSpin/Spray

Wafer &Template
Fabrication
Substrate
Cleaning
Substrate
Bondingfor SOI

Maskless
Exposure

RIE,
DRIE
Nanoimprint
Lithography

ResistDeveloping

Metallization

Wafer
DicingThinning,
CMP

Wafer
Bonding
Metrology

ResistLift-Off

PlasmaActivation

EVG Processes

Electroplating
Wet
Etching

Proximity
Lithography
Alignment
Verification

Bond
Alignment

Temporary
Bonding/
DebondingStressReliefEtching

Chip-toWafer
Bonding

Oxidation
Wafer
Bumping &Redistribution

www.EVGroup.com

EV GROUP® | Products//

Lithography//

Mask Alignment Systems

Process Results
EVG’s core competencies in lithographic technology lie in high-throughput proximity and contact exposure capabilities of its maskalignment systems (EVG6xx and IQ Aligner NT series) and in its highly integrated coating platform (EVG1xx series). All of EVG’slithography equipment platforms are 300-mm ready, can be fully integrated into its HERCULES lithography track systems and arecomplemented by its metrology tools for top-to-bottom side alignment verification.

10 µm

3 µm thick resist with 0.5 µm line/space exposed using
deep ultra-violet setup
Source: EVG

50 µm

1 µm thick resist with 2.6 µm resolution exposed onEVG®620 NT in 15 µm proximity
Source: EVG

1 µm thick resist with a resolution below 5 µm
with a large proximity gap of 30 µm exposed onEVG® IQ Aligner NT®,
Source: EVG

Advanced Packaging

10 µm

Bottom opening of a coated TSV combining Spray
Coated 90° deep VIA exposure on EVG® IQ Aligner NT®
Source: EVG

10 µm

Bumping results in a 40 µm thick resist performedon EVG® IQ Aligner NT®
Source: EVG

1 µm

Negative sidewall with a metal-compatible lift-off resist
coating; metal pad in the middle of the structure
Source: EVGMEMS100 µm

High aspect ratio structures for LIGA structures with a200 µm thick resist exposed on EVG®6200 NT
Source: EVG

10 µm

50 µm thick SU-8 exposed pillars, sidewall angle 90° +/- 0.5°utilizing optimized exposure & process methods
Source: EVG

100 µmMEMS Structures patterned in 20 µm thick resist.
Source: EVG

Photonics, special applications

100 µmHigh aspect ratio pillars for cell sorting & micro
fluidic applications, 100 µm thick resist patterning onEVG® IQ Aligner® NT Source: EVG

100 nmHigh depth of focus exposure on EVG®620 NTof KOH etched cavities with a depth of 150 µm
Source: EVG

250 µmMicrolenses
Source: EVG

www.EVGroup.com

Headquarters
EV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St. Florian am Inn
Austria+43 7712 5311 0
Sales@EVGroup.com
TechSupportEurope@EVGroup.com

EVG Subsidiaries
North America
EV Group Inc.
+1 480 305 2400
SalesNorthAmerica@EVGroup.com
TechSupportNorthAmerica@EVGroup.com

China
EV Group China Ltd.
+86 21 3899 4888
Sales@EVGroup.cn
TechSupportChina@EVGroup.com

Japan
EV Group Japan KK+81 45 348 0665
Sales@EVGroup.jp
TechSupportJapan@EVGroup.com

TaiwanEVG-JOINTECH CORP.
+886 3 516 3389
Sales@EVG-Jointech.com.tw
TechSupportTaiwan@EVGroup.com

Korea
EV Group Korea Ltd.
+82 2 3218 4400
Sales@EVGroup.co.kr
TechSupportKorea@EVGroup.com

Get in touch:Contact@EVGroup.com

www.EVGroup.com/products/lithography/mask-alignment-systems

The information contained in this document is provided “as is” and without warranty of any kind, express or implied. Any express or implied warranties including, but not limited to, any implied warranty ofmerchantability, fitness for a particular purpose, and patent infringement or other violation of any intellectual property rights are hereby expressly disclaimed.
EVG makes no representation that the use or implementation of the information contained in this document will not infringe or violate any copyright, patent, trademark, trade secret or other right.
In no event shall EVG be liable for any claim, damages or other liability, including any general, special, indirect, incidental, or consequential damages, whether in an action of contract, tort infringement,
misappropriation or otherwise, arising from, out of or relating to the use or inability to use the information.
Acceptance and/or any use of the information contained in this document shall be deemed consent to, and acceptance of, this disclaimer.
Data, design and specifications may not simultaneously apply; or may depend on individual equipment configuration, process conditions and materials and vary accordingly. EVG reserves the right to change data,
design and specifications without prior notice.
All logos, company names and acronyms or any combinations thereof, including, but not limited to, EV Group®, EVG® and the Triple i logo, equipment and technology names and acronyms such as GEMINI®,HERCULES®, BONDSCALE®, SmartView®, SmartNIL® and many others, as well as website addresses, are registered trademarks and/or the property of EV Group. For a complete list of EVG trademarks visit
www.EVGroup.com/Imprint. Other product and company names may be trademarks of their respective owners.
Printed on paper from sustainable sources© EV Group (EVG). All rights reserved. V22/01

www.EVGroup.com