Yebisu Garden Place Tower 22nd Floor
20-3, Ebisu 4-Chome, Shibuya-ku, Tokyo 150-6022, Japan
Phone: +81-3-3443-3717Fax: +81-3-3443-3263
URL: https://www.nikkiso.com

Press Information
October 3, 2022

Developed sintering equipment for power semiconductors
Uniformly joining SiC power semiconductors by three-dimensionalpressing using the special elastomer
NIKKISO CO., LTD. has developed the “3D sintering equipment”, a sintering equipment in the
manufacturing of power-semiconductor SiC modules.
The "3D sintering equipment" is a system that uses our unique 3D press method to sinter bond SiC
chips to substrates in the process of bonding SiC power semiconductors, which are rapidly beingadopted for use in EVs.
The three-dimensional press using the special elastomer enables uniform batch bonding of chips ofdifferent heights to substrates, thus enabling more efficient and higher quality module manufacturing
than the conventional metal press method that presses on a flat surface.

■Characteristics
１．
High-quality modules can be manufactured by three-dimensional pressurization
Conventional metal press methods pressurize only to the chip part, so the fillet part cannot bepressurized and fired. As a result, the fillet part became brittle, which could lead to chipping during themolding process, as well as problems with reliability and durability in the heat cycle.
3D sintering equipment prevents chipping and contributes to quality improvement by uniformly
pressurizing the fillet part with the special elastomer in a three-dimensional manner.

２．
Joining of various sizes in one batch
Conventional metal press methods require changing dies each time to accommodate chips andsubstrates of different sizes and heights, but this system can uniformly press multiple chips andsubstrates of different heights at once, thus contributing to improved productivity.
３．
Reduction of running costs
3D sintering equipment does not require the production and operation of expensive molds for each
substrate or chip type, thus significantly reducing running costs.
■Background of development
In power semiconductors, which will become increasingly popular in the future, the operating
environment will be high temperature. Therefore, the use of sintered bonding materials made of silver orcopper, instead of solder, which has been commonly used for bonding semiconductors in the past, hasbeen increasing.
We have been providing the " Warm Isostatic Laminator," which is widely used as the industry standard
machine in the pressure bonding process of MLCCs (multilayer ceramic capacitors) with athree-dimensional press that uses water pressure. By using the special elastomer based on thistechnology, we have developed a sintering equipment that matches the bonding characteristics ofpower semiconductors.

■Future Development
A demonstration unit will be installed at the Higashimurayama Plant in October 2022, and ademonstration room will be opened in Shanghai in January 2023, followed by the sequential launch ofsales. We will continue to develop new manufacturing equipment for electronic device production byapplying our technologies of uniform pressure and uniform heating.

<Product Overview>
Brand name: 3D Sinter DS Series
Sales date: October 3, 2022

＜About Nikkiso＞
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NIKKISO CO., LTD.
Yebisu Garden Place Tower 22nd Floor, 20-3, Ebisu 4-Chome,
Shibuya-ku, Tokyo 150-6022, Japan
December 26, 1953Toshihiko Kai
Nikkiso provides specialized pumps and systems in the Industrial
Business, CFRP (carbon fiber reinforced plastic) aircraft parts in theAerospace Business and hemodialysis, and healthcare related productsin the Medical Business.
https://www.nikkiso.com/

For inquires, please contact:
PR and IR Section, Corporate Planning Department,
Corporate Planning Division, NIKKISO CO., LTD.
E-mail: nikkiso-pr@nikkiso.co.jp