Dell PowerEdge HS5620
Technical Guide

Regulatory Model: E88S
Regulatory Type: E88S001
February 2024
Rev. A02

Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2023 - 2024 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.

Contents
Chapter 1: System overview.......................................................................................................... 6
Key workloads...................................................................................................................................................................... 6
New technologies................................................................................................................................................................ 6
Chapter 2: System features and generational comparison............................................................. 8
Chapter 3: Chassis views and features.........................................................................................10
Chassis views......................................................................................................................................................................10
Front view of the system........................................................................................................................................... 10
Rear view of the system.............................................................................................................................................13
Inside the system ........................................................................................................................................................ 14
System diagnostics and indicator codes................................................................................................................ 15
Quick Resource Locator............................................................................................................................................. 17
Chapter 4: Processor................................................................................................................... 19
Processor features ........................................................................................................................................................... 19
Supported processors................................................................................................................................................. 19
Chipset.................................................................................................................................................................................20
Chipset features.......................................................................................................................................................... 20
Chapter 5: Memory subsystem.....................................................................................................21
Supported memory............................................................................................................................................................ 21
General memory module installation guidelines..........................................................................................................22
Chapter 6: Storage...................................................................................................................... 23
Storage controllers........................................................................................................................................................... 23
Storage controller feature matrix............................................................................................................................ 23
Server storage controllers User Guide...................................................................................................................25
RAID - Redundant Array of Independent Disks....................................................................................................25
Datasheets and PERC performance scaling decks............................................................................................. 25
Boot Optimized Storage Solution (BOSS)............................................................................................................ 25
Supported Drives...............................................................................................................................................................26
External Storage................................................................................................................................................................ 27
Chapter 7: Networking................................................................................................................ 28
Overview............................................................................................................................................................................. 28
OCP 3.0 support................................................................................................................................................................28
Supported OCP cards................................................................................................................................................ 28
OCP NIC 3.0 vs. rack Network Daughter Card comparisons........................................................................... 29
OCP form factors........................................................................................................................................................29
Chapter 8: Slot priority matrix..................................................................................................... 31
Expansion card installation guidelines........................................................................................................................... 31

Contents

3

Chapter 9: Power, thermal, and acoustics................................................................................... 38
Power................................................................................................................................................................................... 38
PSU specifications...................................................................................................................................................... 39
Thermal................................................................................................................................................................................ 40
Acoustics..............................................................................................................................................................................41
Acoustical configurations of HS5620......................................................................................................................41
Chapter 10: Rack, rails, and cable management........................................................................... 43
Rails information................................................................................................................................................................ 43
A11 Sliding Rails features summary..........................................................................................................................43
A8 Static Rails features summary........................................................................................................................... 44
Cable Management Arm.................................................................................................................................................. 45
Strain Relief Bar ............................................................................................................................................................... 46
Rack Installation.................................................................................................................................................................46
Chapter 11: Supported operating systems.................................................................................... 51
Chapter 12: Dell OpenManage Systems Management................................................................... 52
Integrated Dell Remote Access Controller (iDRAC)................................................................................................. 52
Systems Management software support matrix....................................................................................................... 53
Getting started with Dell Open Server Manager (OSM).........................................................................................54Open Server Manager (OSM) introduction.......................................................................................................... 54
What is OpenBMC? ...................................................................................................................................................55
Why Dell Open Server Manager? ...........................................................................................................................55
Why choose Dell Open Server Manager built on OpenBMC? .........................................................................55
Dell Open Server Manager Capabilities ................................................................................................................ 55
Chapter 13: Appendix A. Standards compliance........................................................................... 57
Chapter 14: Appendix B: Additional resources..............................................................................58
Customer kits..................................................................................................................................................................... 58
Dell Upgrades............................................................................................................................................................... 58
Upgrades portfolio...................................................................................................................................................... 58
Upgrades reference links...........................................................................................................................................60
Documentation...................................................................................................................................................................60
Chapter 15: Appendix C: Additional specifications........................................................................61
Chassis dimensions ...........................................................................................................................................................61
System weight................................................................................................................................................................... 62
Video specifications.......................................................................................................................................................... 62
USB ports specifications................................................................................................................................................. 62
Environmental specifications..........................................................................................................................................63
Thermal restriction matrix......................................................................................................................................... 64
Chapter 16: Appendix D: Services.................................................................................................71
Default service levels........................................................................................................................................................ 71
ProDeploy Infrastructure Suite....................................................................................................................................... 71
Supplemental Deployment Services..............................................................................................................................73

4

Contents

Unique Deployment Scenarios........................................................................................................................................74
DAY 2 - Automation Services with Ansible................................................................................................................. 76
ProSupport Infrastructure Suite.................................................................................................................................... 76
Specialty Support Services............................................................................................................................................. 77
Consulting Services.......................................................................................................................................................... 79
Resources............................................................................................................................................................................80

Contents5

1
System overview
The new Dell PowerEdge HS5620 is a 2U, two-socket rack server purpose-built for Cloud Service Providers’ most popular IT
applications. It is available to select Cloud Service Provider customers through the Hyperscale Next program.

Topics:••

Key workloads
New technologies

Key workloads
The target workloads for the PowerEdge HS5620 include Virtualization, Medium VM Density or VDI amd Software-Defined
Storage Node.

New technologies
Table 1. New technologies
Technology

Detailed Description

Up to 2 x 5th Gen Intel(R) Xeon(R) Scalable Processors(Emerald Rapids)

Core count: Up to 32 per processor
Up to 3.9 GHz
UPI speed: Up to 3x UPIs/Socket at 12.8 GT/s or 14.4 or 16
GT/s or 20 GT/s
Maximum number of PCIe lanes: Integrated 80 PCIe 5.0 lanes@ 32 GT/s PCIe Gen5
Maximum TDP: 250 W

Up to 2 x 4th Gen Intel(R) Xeon(R) Scalable Processors(Sapphire Rapids)

Core count: Up to 32 per processor
UPI speed: Up to 3x UPIs/Socket at 12.8 GT/s or 14.4 or 16
GT/sMaximum number of PCIe lanes: Integrated 80 PCIe 5.0 lanes@ 32 GT/s PCIe Gen5
Maximum TDP: 250 W

DDR5 ECC memory up to 5600 MT/s

Max 8 DIMMs per processor and 16 DIMMs per system
Supports DDR5 ECC RDIMM

GPUs

Max 2 x 75 W SW GPUs (NVIDIA A2)

Flex I/O

LOM: 2x1GbE with BCM5720 LAN controller
Rear I/O with:● 1x Dedicated iDRAC Ethernet port (1 GbE)
● 1 x USB 3.0● 1 x USB 2.0● 1 x VGA port
Serial Port option

6

System overview

Table 1. New technologies (continued)
Technology

Detailed Description
Optional OCP Mezz 3.0 (supported by x8 PCIe lanes)
Front I/O with:● 1 x USB 2.0● 1x iDRAC Direct (Micro-AB USB) port
● 1 x VGA port

CPLD 1-wireSupport payload data of Front PERC, Riser, BP and Rear IO to
BOSS-N1 and iDRAC

Dedicated PERC

Front Storage module PERC with Front PERC11 & PERC12

Software RAID

OS RAID / S160

Power Supplies

60 mm dimension is the new PSU form factor on 16G design● 700 W Titanium 200–240 VAC/240 VDC● 800 W Platinum 100–240 VAC/ 240 VDC● 1100 W DC/-48–(-60) V● 1100 W Titanium 100–240 VAC/ 240 VDC● 1400 W Platinum 100–240 VAC/ 240 VDC● 1400 W Titanium 277 VAC/ 336 VDC● 1800 W Titanium 200–240 VAC/ 240 VDC

System overview

7

2
System features and generational
comparison
The following table shows the comparison between the PowerEdge HS5620 with the PowerEdge R750xs.

Table 2. Features comparison
FeaturePowerEdge HS5620

PowerEdge R750xs

Processor● Up to 2 x 4th Gen Intel(R) Xeon(R) Scalable
Processors (Sapphire Rapids) with up to 32
cores● Up to 2 x 5th Gen Intel(R) Xeon(R) Scalable
Processors (Emerald Rapids) with up to 32
cores

Maximum two 3 rd Generation Intel ® Xeon ® Scalable
processors with maximum 32 cores per processor

Processor
Interconnect

Intel Ultra Path Interconnect (UPI) , up to 3 links
per CPUIntel Ultra Path Interconnect (UPI)

Memory16 DDR5 DIMM slots

16 DDR4 DIMM slots

Supports RDIMM 2 TB max

Supports RDIMM 1 TB max

Speed maximum 5600 MT/s for 5th generationand 4800 MT/s for 4th generation processors

Speed maximum 3200 MT/s

Supports registered ECC DDR5 DIMMs only
NVDIMM : No
Storage Drives

Storage Controllers

PCIe SSD

8

Supports registered ECC DDR4 DIMMs only
Apache Pass : No
NVDIMM : No

Front bays:● 0 drive bay● Maximum 8x 3.5-inch SAS/SATA (HDD/
SSD) max 160 TB● Maximum 12x 3.5-inch SAS/SATA (HDD/
SSD) max 240 TB● Maximum 8x 2.5-inch SAS/SATA or NVMe
(HDD/SSD) max 122.88 TB● Maximum 16x 2.5-inch (SAS/SATA) + 8x 2.5inch (NVMe) (HDD/SSD) max 244.48 TB

Front bays:● 0 drive bay● Maximum 8x 3.5-inch SAS/SATA (HDD/SSD)
max 128 TB● Maximum 12x 3.5-inch SAS/SATA (HDD/SSD)
maximum 192 TB● Maximum 8x 2.5-inch SAS/SATA/NVMe (HDD/
SSD) maximum 61.44 TB● Maximum 16x 2.5-inch SAS/SATA (HDD/SSD)
maximum 122.88 TB● Maximum 16x 2.5-inch (SAS/SATA) + 8x 2.5inch (NVMe) (HDD/SSD) maximum 184.32 TB

Rear bays:● Maximum 2x 2.5-inch SAS/SATA/NVMe(HDD/SSD) max 30.72 TB

Rear bays:● Maximum 2x 2.5-inch SAS/SATA/NVMe (HDD/
SSD) maximum 15.36 TB

Internal controllers: H755, H755N, H355,
HBA355iInternal controllers: PERC H345, PERC H355,
PERC H745, PERC H755, PERC H755N, HBA355i

Internal Boot: Boot Optimized Storage
Subsystem (BOSS N1): HWRAID 2x M.2 SSDs
and Internal USB

Internal Boot: Internal Dual SD Module or Boot
Optimized Storage Subsystem (BOSS S2): HWRAID
2x M.2 SSDs or Internal USB

External: HBA 355e

External PERC (RAID): PERC H840, HBA355e

Software RAID: S160

Software RAID: S150

Front: Maximum 8 x 2.5-inch (NVMe drives)

Maximum 8 x 2.5-inch (NVMe drives)

System features and generational comparison

Table 2. Features comparison (continued)
FeaturePowerEdge HS5620

PowerEdge R750xs

Rear: Up to 2 x 2.5-inch NVMe
PCIe Slots

Up to 6 PCIe slots (2 x Gen5, 4 x Gen4)

Up to 6 PCIe slots (5 x Gen4, 1 x Gen3)

Embedded NIC(LOM)

2x 1GbE LOM

2x 1GbE LOM

Networking Options(OCP 3.0)

Rear: 1 x OCP 3.0 (x8 PCIe lanes)

Maximum 1 OCP 3.0 (x16 PCIe lanes)GPU

Nvidia A2 (60 W, LP)

Not supported

I/O Ports

Front ports● 1x Dedicated iDRAC micro-USB● 1x USB 2.0● 1x VGA

Front ports● 1x Dedicated iDRAC micro-USB● 1x USB 2.0● 1x VGA

Rear ports:● 1 x Dedicated iDRAC Ethernet port
● 1x USB 2.0● 1x USB 3.0● 1x Serial (optional)● 1x VGA● 2x Ethernet

Rear ports:● 1 x Dedicated iDRAC Ethernet port
● 1x USB 2.0● 1x USB 3.0● 1x Serial (optional)● 1x VGA● 2x Ethernet

Internal port:● 1x USB 3.0 (optional)Internal port:● 1x USB 3.0 (optional)

Rack Height2U rack server

2U rack server

Power Supplies

●
●
●
●
●
●
●

1800 W Titanium 200–240 VAC/ 240 VDC
1400 W Platinum 100–240 VAC/ 240 VDC
1400 W Titanium 277 VAC/ 336 VDC
1100 W Titanium 100–240 VAC/ 240 VDC
1100 W DC/-48–(-60) V
800 W Platinum 100–240 VAC/ 240 VDC
700 W Titanium 200–240 VAC/240 VDC

●
●
●
●
●
●
●

1800 W Platinum 100–240 VAC/ 240 VDC
1400 W Platinum 100–240 VAC/ 240 VDC
1100 W Titanium 100–240 VAC/ 240 VDC
1100 W DC/-48–(-60) V
800 W Platinum 100–240 VAC/ 240 VDC
700 W Titanium 200–240 VAC/240 VDC
600 W Platinum 100–240 VAC/ 240 VDC

System Management

●
●
●
●
●
●
●

Lifecycle Controller 3.x
OpenManage
QuickSync 2.0
OpenManage Enterprise Power Manager
Digital License Key
iDRAC Direct (dedicated micro-USB port)
Easy Restore

●
●
●
●
●
●
●

Lifecycle Controller 3.x
OpenManage
QuickSync 2.0
OpenManage Enterprise Power Manager
Digital License Key
iDRAC Direct (dedicated micro-USB port)
Easy Restore

Availability

Hot-plug drives

Hot-plug drives

Hot-plug redundant cooling

Hot-plug redundant cooling

Hot-plug redundant power supplies

Hot-plug redundant power supplies

BOSS-N1IDSDMBOSS S2

System features and generational comparison

93
Chassis views and features
Topics:•Chassis views

Chassis views
Front view of the system

Figure 1. Front view of 16 x 2.5-inch SAS/SATA + 8 x 2.5-inch NVMe drive system

Figure 2. Front view of 8 x 2.5-inch SAS/SATA or NVMe drive system

Figure 3. Front view of 12 x 3.5-inch SAS/SATA drive system

Figure 4. Front view of 8 x 3.5-inch SAS/SATA drive system

10

Chassis views and features

Figure 5. Front view of no backplane configuration (0 drive system)

Left control panel view

Figure 6. Left control panel

Table 3. Left control panel
Item

Indicator, button, orconnector

Icon

Description

1

Status LED indicators

NA

Indicates the status of the system. For more information, see theStatus LED indicators section.

2

System health and system
ID

Indicates the system health. For more information, see the System
health and system ID indicator codes section.

Figure 7. Left control panel with optional iDRAC Quick Sync 2 indicator

Table 4. Left control panel with optional iDRAC Quick Sync 2 indicator
Item

Indicator, button, orconnector

Icon

Description

1

Status LED indicators

N/A

Indicates the status of the system. For more information, see theStatus LED indicators section.

Chassis views and features

11

Table 4. Left control panel with optional iDRAC Quick Sync 2 indicator (continued)
Item

Indicator, button, orconnector

Icon

Description

2

System health and system
ID indicator

Indicates the system health. For more information, see the
System health and system ID indicator codes section.

3

iDRAC Quick Sync
2 wireless indicator(optional)

Indicates if the iDRAC Quick Sync 2 wireless option is
activated. The Quick Sync 2 feature allows management of thesystem using mobile devices. This feature aggregates hardware/
firmware inventory and various system level diagnostic/error
information that can be used in troubleshooting the system. You
can access system inventory, Dell Lifecycle Controller logs orsystem logs, system health status, and also configure iDRAC,
BIOS, and networking parameters. You can also launch the virtual
Keyboard, Video, and Mouse (KVM) viewer and virtual Kernelbased Virtual Machine (KVM), on a supported mobile device.
For more information, see the Integrated Dell Remote AccessController User's Guide at www.dell.com/poweredgemanuals.

NOTE: For more information about the indicator codes, see the System diagnostics and indicator codes section.

Right control panel view

Figure 8. Right control panel

Table 5. Right control panel
Item

Indicator or button Icon

Description

1

Power button

Indicates if the system is powered on or off. Press the power button to
manually power on or off the system.
NOTE: Press the power button to gracefully shut down an ACPI-compliant
operating system.

2

USB 2.0 port

The USB port is 4-pin, 2.0-compliant. This port enables you to connect USB
devices to the system.

3

iDRAC Direct(Micro-AB USB)
port

The iDRAC Direct (Micro-AB USB) port enables you to access the iDRAC
direct Micro-AB USB features. For more information, see the Integrated Dell
Remote Access Controller User's Guide at www.dell.com/poweredgemanuals.
NOTE: You can configure iDRAC Direct by using a USB to micro USB (typeAB) cable, which you can connect to your laptop or tablet. Cable length

12Chassis views and features

Table 5. Right control panel (continued)
Item

Indicator or button Icon

Description
should not exceed 3 feet (0.91 meters). Performance could be affected bycable quality.

4

VGA port

Enables you to connect a display device to the system.

Rear view of the system
Figure 9. Rear view of the system

Figure 10. Rear view of the system with no riser and one CPU

Figure 11. Rear view of the system with no riser and two CPUs

Figure 12. Rear view of the system with Riser 1c

Chassis views and features

13

Figure 13. Rear view of the system with Riser 1d

Inside the system

Figure 14. Inside the system without rear drive and riser
1. Rear mounted front PERC
3. Memory module slots
5. Intrusion switch
7. PSU 1 and PSU 2
9. Processor heat sink
11. NVMe backplane

14

Chassis views and features

2. Cooling fan assembly
4. Power interposer board
6. OCP
8. System board
10. SAS/SATA backplane
12. Information tag

Figure 15. Inside the system with rear drive cage and riser
1. Rear mounted front PERC
3. Memory module slots
5. Intrusion switch
7. PSU 1 and PSU 2
9. System board
11. SAS/SATA backplane
13. Information tag

2. Cooling fan assembly
4. Power interposer board
6. Rear drive cage
8. Riser
10. Processor heat sink
12. NVMe backplane

System diagnostics and indicator codes
The diagnostic indicators on the system front panel display system status during system startup.

Status LED indicators
NOTE: The indicators display solid amber if any error occurs.

Chassis views and features

15

Figure 16. Status LED indicators

Table 6. Status LED indicators and descriptions
Icon

Description

Condition

Drive indicator● Check the System Event Log to determine if thedrive has an error.
● Run the appropriate Online Diagnostics test.
The indicator turns solid amber if
Restart the system and run embedded
there is a drive error.
diagnostics (ePSA).
● If the drives are configured in a RAID array,
restart the system, and enter the host adapter
configuration utility program.

Temperature
indicator

The indicator turns solid amber if
the system experiences a thermal
error (for example, the ambient
temperature is out of range orthere is a fan failure).

Electricalindicator

The indicator turns solid amber
if the system experiences anelectrical error (for example,
voltage out of range, or a failed
power supply unit (PSU) or
voltage regulator).

Corrective action

Ensure that none of the following conditions exist:● A cooling fan has been removed or has failed.
● System cover, air shrouds, or back filler bracket
has been removed.
● Ambient temperature is too high.
● External airflow is obstructed.
If the problem persists, see the Getting help section.
Check the System Event Log or system messages
for the specific issue. If it is due to a problem with
the PSU, check the LED on the PSU. Reseat thePSU.
If the problem persists, see theGetting help section.

Check the System Event Log or system messages
for the location of the failed memory. Reseat the
memory module.

Memory indicator

The indicator turns solid amber if amemory error occurs.
If the problem persists, see theGetting help section.

Restart the system. Update any required drivers for
the PCIe card. Reinstall the card.

PCIe indicator

16

The indicator turns solid amber if a
PCIe card experiences an error.

Chassis views and features

If the problem persists, see theGetting help section.
NOTE: For more information about the
supported PCIe cards, see the Expansion cards
and expansion card risers > Expansion card
installation guidelines section.

System health and system ID indicator codes
The system health and system ID indicator is located on the left control panel of the system.

Figure 17. System health and system ID indicator

Table 7. System health and system ID indicator codes
System health and system Condition
ID indicator code
Solid blue

Indicates that the system is powered on, is healthy, and system ID mode is not active. Press
the system health and system ID button to switch to system ID mode.

Blinking blue

Indicates that the system ID mode is active. Press the system health and system ID button toswitch to system health mode.

Solid amber

Indicates that the system is in fail-safe mode. If the problem persists, see the Getting help
section.

Blinking amber

Indicates that the system is experiencing a fault. Check the System Event Log for specificerror messages. For information about the event and error messages generated by thesystem firmware and agents that monitor system components, go to qrl.dell.com > Look
Up > Error Code, type the error code, and then click Look it up.

Quick Resource Locator
The QRL on everything (SILs, GSG, Owner's Manual except on the EST) is a generic QRL for HS5620 that leads to a webpage
for that product. That webpage has links for things like setup and service videos, iDRAC manual, and other things that apply tothe platform. The QRL on the EST is unique and specific to that service tag and will contain the Service Tag number and theiDRAC password. The label and the QRL code within it are printed on demand at the L10 factories. This QRL links to a webpage
that shows the exact configuration as built for that customer, and the specific warranty purchased. It is one click away from thesame content of generic information that applies to HS5620 that is available in the other QRLs.

Chassis views and features

17

Figure 18. Quick Resource Locator for PowerEdge HS5620 system

18

Chassis views and features

4
Processor
Topics:••Processor features
Chipset

Processor features
The Intel 4 th and 5 th Generation Xeon ® Scalable Processors stack is the next generation data center processor offering withsignificant performance increases, integrated acceleration, and next generation memory and I/O. Sapphire Rapids and Emerald
Rapids accelerate customer usage with unique workload optimizations.
The following lists the features and functions that are in the upcoming 4 th and 5 th Generation Intel ® Xeon Scalable Processor
offering:
●
●
●
●
●

Faster UPI with up to three Intel Ultra Path Interconnect (Intel UPI) at up to 20 GT/s, increasing multisocket bandwidth.
More, faster I/O with PCI Express 5 and up to 80 lanes (per CPU)
Enhanced Memory Performance with DDR5 support and memory speed up to 5600 MT/s in one DIMM per channel (1DPC).
New onboard accelerators for data analytics, networking, storage, crypto, and data compression
Enhanced security for virtualized environments with Intel Trust Domain Extensions (IntelR TDX) for confidential computing

Supported processors
The following table shows the Intel Sapphire Rapids and Emerald Rapids SKUs that are supported on the HS5620.

Table 8. Supported Processors for HS5620
Processor Clock Speed(GHz)

Cache (M)

UPI (GT/s) Cores

Turbo

MemoryTDP
Speed (MT/s)

6548N*

2.8

60

20

32

Turbo

5200

250 W

6548Y+ *

2.5

60

20

32

Turbo

5200

250 W

6542Y *

2.8

60

20

24

Turbo

5200

250 W

6534 *

3.9

22.5

20

8

Turbo

4800

195 W

6526Y *

2.8

37.5

20

16

Turbo

5200

195 W

5512U *

2.1

52.5

N/A

28

Turbo

4800

185 W

4514Y *

2.0

30

16

16

Turbo

4400

150 W

4510 *

2.4

30

16

12

Turbo

4400

150 W

4509Y *

2.6

23

16

8

Turbo

4400

125 W

6448Y

2 .2

60

16

32

Turbo

4800

225 W

6444Y

3.5

45

16

16

Turbo

4800

270 W

6442Y

2.6

45

16

24

Turbo

4800

225 W

6438Y+

2

60

16

32

Turbo

4800

205 W

6426Y

2.6

30

16

16

Turbo

4800

185 W

6414U

2

60

16

32

Turbo

4800

250 W

Processor

19

Table 8. Supported Processors for HS5620 (continued)
Processor Clock Speed(GHz)

Cache (M)

UPI (GT/s) Cores

Turbo

MemoryTDP
Speed (MT/s)

5420+

2

53

16

28

Turbo

4400

205 W

5418Y

2

45

16

24

Turbo

4400

185 W

5416S

2

30

16

16

Turbo

4400

150 W

5415+

2.9

15

16

8

Turbo

4400

150 W

5412U

2.1

45

16

24

Turbo

4400

185 W

4416+

2

38

16

20

Turbo

4000

165 W

4410Y

2

23

16

12

Turbo

4000

150 W

4410T

2.7

19

16

10

Turbo

4000

150 W

3408U

1.8

15

16

8

Turbo

4000

125 W

NOTE: The asterisk symbol next to the processor denotes they are Intel 5th Generation Xeon® Emerald Rapids Scalable
Processors .
NOTE: 6444Y does not operate at the standard 270W spec because of a 250W motherboard limit. However, this does not
result in a meaningful loss of core count or performance (1-2% of throughput in Dell Internal Testing). Users can also select225 W or 200 W in the BIOS set-up menu.

ChipsetThe system supports Intel ® C741 series chipset.
DMI - 3.0 speed (port width x8, x4)
USB ports - up to 10 superspeed (USB 3.1), 14 highspeed (USB 2.0)
SATA ports - up to 20 SATA port
PCIe Express - Up to 20 lanes, PCIe 3.0

Chipset features● PCI-E interfaces○ Integrated PCI Express Gen5 for improved bandwidth and connectivity○ Up to 80 lanes per processor○ Connect PCIe x1 to iDRAC- integrated VGA chip
● Integrated USB - maximum of 10 SuperSpeed (USB 3.1), 14 highspeed (USB 2.0)
○ One front port (USB 2.0 / Right front I/O)
○ Two rear ports (USB 2.0/3.0)

20

Processor

5Memory subsystem
Topics:••Supported memory
General memory module installation guidelines

Supported memory
Table 9. Memory technology comparison
FeaturePowerEdge HS5620 (DDR5)

DIMM type

RDIMM

Transfer speed

5600 MT/s, 4800 MT/s (1DPC)
NOTE: Maximum DIMM transfer speed support depends
on CPU SKU and DIMM population.

Voltage

1.1 V

Table 10. Supported memory matrix
DIMM type

RDIMM

Rank

1R

Capacity

16 GB

DIMM rated voltage
and speed

Operating Speed

DDR5 (1.1 V), 4800
MT/s

Up to 4800 MT/s

1 DIMM per channel(DPC)

Up to 5200 MT/s

DDR5 (1.1 V), 5600
MT/s
2R

32 GB, 64 GB, 96 GB

DDR5 (1.1 V), 4800
MT/s

Up to 4800 MT/s
Up to 5200 MT/s

DDR5 (1.1 V), 5600
MT/s
4R

128 GB

DDR5 (1.1 V), 4800
MT/s

Up to 4800 MT/s
Up to 5200 MT/s

DDR5 (1.1 V), 5600
MT/s
NOTE: 5600 MT/s RDIMMs are applicable for 5th Gen IntelR XeonR Scalable Processors.
NOTE: The processor may reduce the performance of the rated DIMM speed.

Memory subsystem

21

General memory module installation guidelines
To ensure optimal performance of your system, observe the following general guidelines when configuring your system memory.
If your system's memory configuration fails to observe these guidelines, your system might not boot, stop responding during
memory configuration, or operate with reduced memory.
The memory bus may operate at speeds of 5600 MT/s, 5200 MT/s, 4800 MT/s, 4400 MT/s or 4000 MT/s depending on thefollowing factors:● System profile selected (for example, Performance, Performance Per Watt Optimized (OS), or Custom [can be run at highspeed or lower])● Maximum supported DIMM speed of the processors● Maximum supported speed of the DIMMs
NOTE: MT/s indicates DIMM speed in MegaTransfers per second.
The system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset
architectural configuration. The following are the recommended guidelines for installing memory modules:●●●●

All DIMMs must be DDR5.
Memory mixing is not supported for different DIMM capacities.
If memory modules with different speeds are installed, they operate at the speed of the slowest installed memory module(s).
Populate memory module sockets only if a processor is installed.
○ For single-processor systems, sockets A1 to A8 are available.
○ For dual-processor systems, sockets A1 to A8 and sockets B1 to B8 are available.
○ A minimum of 1 DIMM must be populated for each installed processor.
● In Optimizer Mode, the DRAM controllers operate independently in the 64-bit mode and provide optimized memory
performance.

Table 11. Memory population rules

●
●
●
●

22

Processor

Configuration

Memory population

Memory population
information

Single processor

Optimizer (Independent
channel) population order

A{1}, A{2}, A{3}, A{4}, A{5}, A{6},
A{7}, A{8}1, 2, 4, 6, 8 DIMMs areallowed.

Dual processor (Start withprocessor1. Processor 1
and processor 2 population
should match)

Optimizer (Independent
channel) population order

A{1}, B{1}, A{2}, B{2}, A{3}, B{3}, 2, 4, 8, 12, 16 DIMMs are
A{4}, B{4}, A{5}, B{5}, A{6}, B{6}, supported per system .
A{7}, B{7} A{8}, B{8}NOTE: Optimizer
population order is not
traditional for 8 and 16
DIMMs installations fordual processor.

Always populate memory channels identically with equal DIMMs for best performance.
Supported RDIMM configurations are 1, 2, 4, 6, and 8 DIMMs per processor.
Supported 96 GB RDIMM configurations are 1, 6 and 8 DIMMs per processor.
Populate eight equal memory modules per processor (one DIMM per channel) at a time to maximize performance.
NOTE: Equal memory modules refer to DIMMs with identical electrical specification and capacity that may be fromdifferent vendors.

Memory subsystem

6
Storage
Topics:•••Storage controllers
Supported Drives
External Storage

Storage controllers
Dell RAID controller options offer performance improvements, including the fPERC solution. fPERC provides a base RAID HW
controller without consuming a PCIe slot by using a small form factor and high-density connector to the base planar.
16G PERC Controller offerings are a heavy leverage of 15G PERC family. The Value and Value Performance levels carry overto 16G from 15G. New to 16G is the Avenger-based Premium Performance tier offering. This high-end offering drives IOPs
performance and enhanced SSD performance.

Table 12. PERC Series controller offerings
Performance Level

Controller and Description

Entry

S160

Value

H355, HBA355 (internal/external)

Value Performance

H755, H755N

Premium Performance

Avenger 1
Memory: 8GB DDR4 NV cache72-bit memory 2133 MHz
Low profile form factors
Dual A15 1.2 GHz CPU
X8PCIe 3.0, x8 12Gb SAS

NOTE: For more information about the features of the Dell PowerEdge RAID controllers (PERC), Software RAID
controllers, or BOSS card, and on deploying the cards, see the storage controller documentation at www.dell.com/
storagecontrollermanuals.
NOTE: From December 2021, H355 replaces H345 as the entry raid controller. H345 is deprecated in January 2022.

Storage controller feature matrix
Table 13. Storage controller feature matrix
Model &
Form
Factors

Interface Support

PCI
SAS
Suppo ConnectionrtCach Write Back
e
Cache
Mem
ory
Size

RAID
LevelsMax Drive
SupportRAID
SupportPowerEdge Server-Storage Controllers (PERC) Series 12

Storage23

Table 13. Storage controller feature matrix (continued)
Model &
Form
Factors

Interface Support

PCI
SAS
Suppo ConnectionrtCach Write Back
e
Cache
Mem
ory
Size

RAID
LevelsMax Drive
SupportRAID
Support

S160
SoftwareRAID

Gen4 (16 GT/s)
NVMe

PCIe
Gen 4

No
Cach
e

0,1,5,10

8

Software
RAID Windows
only

N/A

No CachePowerEdge Server-Storage Controllers (PERC & SAS HBA) Series 11
H755
Adapter

12Gb/s SAS

PCIe
Gen 4

16 ports- 2x8Internal

8GB
NV

Flash

0,1,5,6,10,50 16/,60controller

Hardware6Gb/s SAS/SATA

Backed3Gb/s SAS/SATACache

50 with SAS
ExpanderFlash

0,1,5,6,10,50 8/ controller Hardware,60

Gen3 (8 GT/s) NVMe
Gen4 (16 GT/s)
NVMe
H755N
Front
(NVMe
Only)

Gen3 (8 GT/s) NVMe PCIe
Gen 4
Gen4 (16 GT/s)
NVMe

16 ports- 2x8Internal

H755 Front( SAS/SATA only)

12Gb/s SAS

PCIe
Gen 4

16 ports- 2x8Internal

HBA355i
Adapter

8GB
NV

Backed
Cache
8GB
NV

Flash

6Gb/s SAS/SATA

Backed3Gb/s SAS/SATA

Cache

12Gb/s SAS

PCIe
Gen 4

16 ports- 2x8Internal

N/A

N/A

0,1,5,6,10,50 16/,60controller
50 with SAS
ExpanderN/A

6Gb/s SAS/SATA

12Gb/s SAS

PCIe
Gen 4

16 ports- 2x8Internal

N/A

N/A

N/A

6Gb/s SAS/SATA

12Gb/s SAS

N/A

16/
controller

N/A

50 with SAS
Expander3Gb/s SAS/SATA
HBA355e
Adapter

16/
controller
50 with SAS
Expander3Gb/s SAS/SATA
HBA355i
Front

Hardware

PCIe
Gen 4

16 ports- 4x4
external

N/A

N/A

N/A

240

N/A

PCIe
Gen 4

16 ports- 2x8Internal

No
Cach
e

No Cache

0,1, 10

Up to 32
RAID, or 32
Non- RAID

Hardware

PCIe
Gen 4

16 ports- 2x8Internal

No
Cach
e

No Cache

0,1, 10

Up to 32
RAID, or 32
Non- RAID

Hardware6Gb/s SAS/SATA
3Gb/s SAS/SATA
H355
Adapter

12Gb/s SAS
6Gb/s SAS/SATA

H355 Front

12Gb/s SAS
6Gb/s SAS/SATA

NOTE:
1. RAID 5/50 removed from entry RAID card
2. SWRAID support for Linus provides a pre-boot configuration utility to configure MDRAID and degraded boot capability.

24

Storage3. For information, post-RTS, see the Storage controller documentation at www.dell.com/stroagecontrollermanuals.
This document is updated as changes happen, so for the latest version be sure to bookmark it rather than downloading an
offline copy or refer to the Storage Controller Matrix on sales portal.

Server storage controllers User Guide● Server-Storage Controllers User's Guides, click here

RAID - Redundant Array of Independent Disks● Link to Help Me Choose: RAID Configuration here

Datasheets and PERC performance scaling decks● Resource Page for Server-Storage (Sales Portal) click here
● PERC & SAS HBA Datasheets (To be updated)

Boot Optimized Storage Solution (BOSS)
BOSS is a RAID solution that is designed to boot operating systems and segregate operating system boot drives from data on
server-internal storage.

BOSS feature matrix
Table 14. BOSS feature matrix
BOSS
card

Drive
Size

RAID
levelsStripesize

Virtualdisk
cachefunction

BOSSN1Monolithic

M.2
devicesarereadintensiv
e with480 GBor 960GB
capacit
y

RAID1
and
RAID0

Support Nonesdefault
64K
stripe
size
only

Maxim
um
numbe
r of
virtual
disks

Maxim
um
numbe
r of
drivessuppor
ted

Drive
types

PCIe
suppor
t

Disk
cache
policySupport for
NonRAID
disks

Crypto Hot
graphi Plugcdigitalsignature toverifyfirmwarepayloa
d

1

2

M.2
NVMe
SSDs

Gen3

Drive
default

No

Yes

Yes

BOSS-N1
BOSS-N1 is offered as a means of booting 16G servers to a full OS when the target OS is a full OS (not just a hypervisor), or theuser does not wish to trade off standard hot plug drive slots for OS install.

Storage

25

The HW RAID BOSS-N1 card is a RAID controller with a limited feature set that presents M.2 NVMe-only SSDs as either a
RAID0 disk or a single RAID1 volume with 2 disks. BOSS-N1 enables support for 480/960 GB Disks from Factory Install.
Hardware: BOSS-N1 Controller and Carrier (x2)
Reliability: Enterprise-Class M.2 NVMe SSDs
Supports dual 80 mm, Read Intensive (1DWPD), M.2 devices 480 GB/960 GB Standard - 1.92 TB QNS
Accessibility: Front Facing
Serviceability: Full Hot-Plug Support
Supports Hardware RAID1 and RAID0
Supports UEFI bootMarvell 88NR2241 NVMe RAID Controller
Controlled Firmware Upgrade through iDRAC

Figure 19. BOSS-N1 Controller

Datasheets● BOSS-N1 (to be updated)

BOSS User Guides● BOSS-N1

Supported Drives
The table shown below lists the internal drives supported by the HS5620. Refer to Agile for the latest SDL

Table 15. Supported Drives
Form Factor

Type

Speed

Rotational
Speed

Capacities

2.5 inches

vSAS

12 Gb

SSD

1.92 TB, 3.84 TB, 960 GB, 7.62 TB

2.5 inches

SAS

24 Gb

SSD

1.92 TB, 1.6 TB, 800 GB, 3.84 TB, 960 GB, 7.68 TB

2.5 inches

SATA

6 Gb

SSD

1.92 TB, 480 GB, 960 GB, 3.84 TB

2.5 inches

NVMe

Gen4

SSD

1.6 TB, 3.2 TB, 6.4 TB, 1.92 TB, 3.84 TB, 15.63 TB, 7.68 TB

2.5 inches

DC NVMe

Gen4

SSD

3.84 TB, 960 GB

2.5 inches

SAS

12 Gb

10 K

600 GB, 1.2 TB, 2.4 TB

3.5 inches

SATA

6 Gb

7.2 K

2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB

3.5 inches

SAS

12 Gb

7.2 K

2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB

26

StorageExternal Storage
The HS5620 support the external storage device types listed in the table below.

Table 16. Support External Storage Devices
Device Type

Description

External Tape

Supports connection to external USB tape products

NAS/IDM appliance software

Supports NAS software stack

JBOD

Supports connection to 12 Gb MD-series JBODs

Storage27

7
Networking
Topics:••Overview
OCP 3.0 support

Overview
PowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies arechosen, and systems management features are added by our partners to firmware to tie in with iDRAC. These adapters are
rigorously validated for worry-free, fully supported use in Dell servers.

OCP 3.0 support
Table 17. OCP 3.0 feature list
FeatureOCP 3.0

Form factor

SFF

PCIe Gen

Gen4

Max PCIe widthx8

Max no. of ports

4

Port type

BT/SFP/SFP+/SFP28

Max port speed

25 GbE

NC-SI

Yes

SNAPI

No

WoL

Yes

Power consumption

15 W–35 W

Supported OCP cards
Table 18. Supported OCP cards
Form factor Vendor

Port speed

Port typePort count

OCP 3.0

10 GbEBT

2

25 GbESFP28

2

25 GbE

SFP28

4

1 GbE

BT

4

10 GbE

BT

4

1 GbE

BT

4

Broadcom

Intel

28

Networking

Table 18. Supported OCP cards (continued)
Form factor Vendor

Port speed

Port typePort count

10 GbEBT

2

10 GbEBT

4

25 GbESFP28

2

25 GbESFP28

4OCP NIC 3.0 vs. rack Network Daughter Card comparisons
Table 19. OCP 3.0, 2.0, and rNDC NIC comparison
Form Factor

Dell rNDC

OCP 2.0 (LOM Mezz) OCP 3.0

Notes

PCIe Gen

Gen 3

Gen 3

Gen 4

Supported OCP3 are
SFF (small form factor)

Max PCIe Lanes

x8

Up to x16

Up to x8

See server slot priority
matrixShared LOM

Yes

Yes

Yes

This is iDRAC port
redirect

Aux Power

Yes

Yes

Yes

Used for Shared LOM

OCP form factors

Figure 20. OCP 3.0 Small Card Form Factor (LS)The process of installing the OCP card in HS5620 system:
1.
2.
3.
4.

Open the blue latch on the system board.
Slide the OCP card into the slot in the system.
Push until the OCP card is connected to the connector on the system board.
Close the latch to lock the OCP card to the system.

Networking

29

Figure 21. Installing the OCP Card in HS5620
The process of removing the OCP card in HS5620 system:
1. Open the blue latch to unlock the OCP card.
2. Push the OCP card towards the rear end of the system to disconnect from the connector on the system board.
3. Slide the OCP card out of the slot on the system.

Figure 22. Removing the OCP Card in HS5620

30

Networking

8Slot priority matrix
For add-in cards that can be mapped to the HS5620 and guidelines for installing expansion cards, see the HS5620 slot priority
matrix file on Sales Portal.
Link:https://www.delltechnologies.com/resources/en-us/auth/products/servers/category.htm

Topics:•Expansion card installation guidelines

Expansion card installation guidelines

Figure 23. Expansion card slot connectors
1. SL9_CPU2_PB5 (PCIe cable connector for Riser 1C and Riser 1D)
2. SL10_CPU2_PA5 (PCIe cable connector for Riser 1C and Riser 1D)
3. SIG_PWR_0 (Power connector for Riser 1C and Riser 1D)
4. SL11_CPU1_PA6 (PCIe cable connector for Riser 1D)
5. SL12_CPU1_PB6 (PCIe cable connector for Riser 1D)
The following table describes the expansion card riser configurations:

Slot priority matrix

31

Table 20. Expansion card riser configurations
Configuratio Expansion
nscard risers

PCIe Slots

Controlling
processor

HeightLengthSlot widthPower

Config 0-1.

No riser1, 2

Processor 1

Low profile

Half length

x16, x8

75 W

Config 0-2.

No riser1, 2

Processor 1

Low profile

Half length

x16, x8

75 W

5, 6

Processor 2

Low profile

Half length

x16, x16

75 W

1, 2, 3

Processor 1

Low profile

Half length

x16, x8, x16

75 W

4, 5, 6

Processor 2

Low profile

Half length

x16, x16, x16

75 W

1, 2, 3, 4

Processor 1

Low profile

Half length

x16, x8, x8,
x8

75 W

Config 1.

Config 2.

R1C

R1D

NOTE: Only one cable riser can be installed at a time in any given configuration.
NOTE: The slots 1, 2, 5 and 6 are Gen4 slots, slot 3 and 4 located on risers are Gen5 slots.

Figure 24. Riser 1C
1. Slot 3
2. Slot 4

32

Slot priority matrix

Figure 25. Riser 1D
1. Slot 3
2. Slot 4
NOTE: The expansion-card slots are not hot-swappable.
The following table provides guidelines for installing expansion cards to ensure proper cooling and mechanical fit. The expansion
cards with the highest priority should be installed first using the slot priority indicated. All the other expansion cards should beinstalled in the card priority and slot priority order.

Table 21. Configuration 0-1: No riser configuration
Card type

Slot priority

Maximum number of cards

Dell Serial port module (LP)

2

1

fPERC

Integrated slot

1

Internal PERC adapter

11Dell External Adapter

2, 1

2

Mellanox (NIC: 400Gb)

Not supported

NA

Mellanox (NIC: 200Gb)

Not supported

NA

Mellanox (NIC: 100Gb)

1

1

Mellanox HDR100 VPI

1

1

Mellanox HDR VPI

1

1

Broadcom (NIC: 100Gb)

1

1

Intel (NIC: 100Gb)

1

1

Broadcom (SFP: 25Gb)

2, 1

2

Intel (NIC: 25Gb)

2, 1

2

Qlogic (NIC: 25Gb)

Not supported

NA

Qlogic (NIC: 10Gb)

Not supported

NA

SolarFlare (NIC: 25Gb)

Not supported

NA

Broadcom (HBA: FC64)

2,1

2

Broadcom (HBA: FC32)

2, 1

2

Marvell (HBA: FC32)

2, 1

2

Slot priority matrix

33

Table 21. Configuration 0-1: No riser configuration (continued)
Card type

Slot priority

Maximum number of cards

Emulex (HBA: FC32)

Not supported

NA

Avago (HBA: FC16)

Not supported

NA

Qlogic (HBA: FC16)

Not supported

NA

Broadcom (NIC: 10Gb)

2, 1

2

Intel (NIC: 10Gb)

2, 1

2

Qlogic (NIC: 10Gb)

Not supported

NA

Broadcom (NIC: 1Gb)

2, 1

NA

Intel (NIC: 1Gb)

2, 1

2

Intel (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Marvell (OCP: 25Gb)

Not supported

NA

SolarFlare (OCP: 25Gb)

Not supported

NA

Broadcom (OCP: 10Gb)

Integrated slot

1

Marvell (OCP: 10Gb)

Not supported

NAIntel (OCP: 10Gb)

Not supported

NA

Broadcom (OCP: 1Gb)

Integrated slot

1Intel (OCP: 1Gb)

Not supported

NA

Dell BOSS N1 Module

Integrated slot

1

Table 22. Configuration 0-2: No riser configuration
Card type

Slot priority

Maximum number of cards

Dell Serial port module (LP)

2

1

fPERC

Integrated slot

1

Internal PERC adapter

11Dell External Adapter

6, 2, 1, 5

4Mellanox (NIC: 400Gb)

Not supported

NA

Mellanox (NIC: 200Gb)

Not supported

NA

Mellanox (NIC: 100Gb)

6, 1, 53

Mellanox HDR100 VPI

6, 1, 53

Mellanox HDR VPI

6, 1, 5

3

Broadcom (NIC: 100Gb)

6, 1, 5

3

Intel (NIC: 100Gb)

6, 1, 5

3

Broadcom (SFP: 25Gb)

6, 2, 1, 5

4Intel (NIC: 25Gb)

2, 1

2

Qlogic (NIC: 25Gb)

Not supported

NA

Qlogic (NIC: 10Gb)

Not supported

NA

SolarFlare (NIC: 25Gb)

Not supported

NA

34

Slot priority matrix

Table 22. Configuration 0-2: No riser configuration (continued)
Card type

Slot priority

Maximum number of cards

Broadcom (HBA: FC64)

6, 2, 1, 5

4

Broadcom (HBA: FC32)

6, 2, 1, 5

4

Marvell (HBA: FC32)

6, 2, 1, 5

4Emulex (HBA: FC32)

Not supported

NA

Avago (HBA: FC16)

Not supported

NA

Qlogic (HBA: FC16)

Not supported

NA

Broadcom (NIC: 10Gb)

6, 2, 1, 5

4Intel (NIC: 10Gb)

6, 2, 1, 5

4

Qlogic (NIC: 10Gb)

Not supported

NA

Broadcom (NIC: 1Gb)

6, 2, 1, 5

4Intel (NIC: 1Gb)

6, 2, 1, 5

4Intel (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Marvell (OCP: 25Gb)

Not supported

NA

SolarFlare (OCP: 25Gb)

Not supported

NA

Broadcom (OCP: 10Gb)

Integrated slot

1

Marvell (OCP: 10Gb)

Not supported

NAIntel (OCP: 10Gb)

Not supported

NA

Broadcom (OCP: 1Gb)

Integrated slot

1Intel (OCP: 1Gb)

Not supported

NA

Dell BOSS N1 Module

Integrated slot

1

Card type

Slot priority

Maximum number of cards

Dell Serial port module (LP)2

1Internal PERC adapter

11Dell external PERC adapter

6, 2, 1, 3, 5, 4

6

12Gbps SAS HBA

1

1Mellanox (NIC: 400Gb)

4, 3

2

Mellanox (NIC: 200Gb)

4, 3

2

Broadcom (NIC: 100Gb)

6, 1, 3, 5, 4

5Intel (NIC: 100Gb)

6, 1, 3, 5, 4

5Mellanox (NIC: 100Gb)

6, 1, 3, 5, 4

5Mellanox HDR100 VPI

6, 1, 3, 5, 4

5Mellanox HDR VPI

6, 1, 3, 5, 4

5Intel (NIC: 25Gb)

6, 2, 1, 3, 5, 4

6Mellanox (NIC: 25Gb)

6, 1, 3, 5, 4

5Table 23. Configuration 1: R1C

Slot priority matrix

35

Table 23. Configuration 1: R1C (continued)
Card type

Slot priority

Maximum number of cards

Qlogic (NIC: 25Gb)

Not Supported

NA

Broadcom (NIC: 10Gb)

6, 2, 1, 3, 5, 4

6

Broadcom (NIC: 25Gb)

6, 2, 1, 3, 5, 4

6

SolarFlare (NIC: 25Gb)

Not Supported

NA

Broadcom (HBA: FC64)

6, 2, 1, 3, 5, 4

6

Broadcom (HBA: FC32)

6, 2, 1, 3, 5, 4

6

QLogic (HBA: FC32)

6, 2, 1, 3, 5, 4

6

Marvell (HBA: FC32)

6, 2, 1, 3, 5, 4

6Emulex (HBA: FC32)

Not Supported

NA

Avago (HBA: FC16)

Not Supported

NA

QLogic (HBA: FC16)

Not Supported

NAIntel (NIC: 10Gb)

6, 2, 1, 3, 5, 4

6

Qlogic (NIC: 10Gb)

Not Supported

NAIntel (NIC: 1Gb)

6, 2, 1, 3, 5, 4

6Intel (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Marvell (OCP: 25Gb)

Not supported

NA

SolarFlare (OCP: 25Gb)

Not supported

NA

Broadcom (OCP: 10Gb)

Integrated slot

1

Marvell (OCP: 10Gb)

Not supported

NAIntel (OCP: 10Gb)

Not supported

NA

Broadcom (OCP: 1Gb)

Integrated slot

1Intel (OCP: 1Gb)

Not supported

NA

Dell BOSS N1 Module

Integrated slot

1

Card type

Slot priority

Maximum number of cards

Dell Serial port module (LP)2

1Internal PERC adapter

11Dell external PERC adapter

4, 3, 2, 1

4

12Gbps SAS HBA

1

1Mellanox (NIC: 400Gb)

Not supported

NA

Mellanox (NIC: 200Gb)

Not supported

NA

Broadcom (NIC: 100Gb)

1

1

Intel (NIC: 100Gb)

1

1

Mellanox (NIC: 100Gb)

1

1

Mellanox HDR100 VPI

1

1

Table 24. Configuration 2: R1D

36

Slot priority matrix

Table 24. Configuration 2: R1D (continued)
Card type

Slot priority

Maximum number of cards

Mellanox HDR VPI

1

1Intel (NIC: 25Gb)

4, 3, 2, 1

4Mellanox (NIC: 25Gb)

4, 3, 2, 1

4

Qlogic (NIC: 25Gb)

Not Supported

NA

Broadcom (NIC: 10Gb)

4, 3, 2, 1

4

Broadcom (NIC: 25Gb)

4, 3, 2, 1

4SolarFlare (NIC: 25Gb)

Not Supported

NA

Broadcom (HBA: FC64)

4, 3, 2, 1

4

Broadcom (HBA: FC32)

4, 3, 2, 1

4

QLogic (HBA: FC32)

4, 3, 2, 1

4

Marvell (HBA: FC32)

4, 3, 2, 1

4Emulex (HBA: FC32)

Not Supported

NA

Avago (HBA: FC16)

Not Supported

NA

QLogic (HBA: FC16)

Not Supported

NAIntel (NIC: 10Gb)

4, 3, 2, 1

4

Qlogic (NIC: 10Gb)

Not Supported

NAIntel (NIC: 1Gb)

4, 3, 2, 1

4Intel (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Marvell (OCP: 25Gb)

Not supported

NA

SolarFlare (OCP: 25Gb)

Not supported

NA

Broadcom (OCP: 10Gb)

Integrated slot

1

Marvell (OCP: 10Gb)

Not supported

NAIntel (OCP: 10Gb)

Not supported

NA

Broadcom (OCP: 1Gb)

Integrated slot

1Intel (OCP: 1Gb)

Not supported

NA

Dell BOSS N1 Module

Integrated slot

1

NOTE: The serial COM card is not a real PCIe add-in card and has a dedicated slot on the system board.

Slot priority matrix

379Power, thermal, and acoustics
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps to regulate
temperature by reducing server noise and power consumption. The table below lists the tools and technologies Dell offers tolower power consumption and increase energy efficiency.

Topics:
•
•
•

Power
ThermalAcoustics

Power
Table 25. Power tools and technologies
FeatureDescription

Power Supply Units(PSU)
portfolio

Dell's PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
maintaining availability and redundancy. Find additional information in the Power supply units
section.

Tools for right sizing

Enterprise Infrastructure Planning Tool (EIPT) is a tool that can help you determine the mostefficient configuration possible. With Dell's EIPT, you can calculate the power consumptionof your hardware, power infrastructure, and storage at a given workload. Learn more atwww.dell.com/calc.

Industry Compliance

Dell's servers are compliant with all relevant industry certifications and guide lines, including 80
PLUS, Climate Savers and ENERGY STAR.

Power monitoring accuracy

PSU power monitoring improvements include:● Dell's power monitoring accuracy is currently 1%, whereas the industry standard is 5%● More accurate reporting of power● Better performance under a power cap

Power capping

Use Dell's systems management to set the power cap limit for your systems to limit the output
of a PSU and reduce system power consumption. Dell is the first hardware vendor to leverageIntel Node Manager for circuit-breaker fast capping.

Systems Management

iDRAC Enterprise and Datacenter provides server-level management that monitors, reports andcontrols power consumption at the processor, memory and system level.
Dell OpenManage Power Center delivers group power management at the rack, row, and data
center level for servers, power distribution units, and uninterruptible power supplies.

Active power management

Intel Node Manager is an embedded technology that provides individual server-level power
reporting and power limiting functionality. Dell offers a complete power management solution
comprised of Intel Node Manager accessed through Dell iDRAC9 Datacenter and OpenManage
Power Center that allows policy-based management of power and thermal at the individual
server, rack, and data center level. Hot spare reduces power consumption of redundant power
supplies. Thermal control off a speed optimizes the thermal settings for your environment to
reduce fan consumption and lower system power consumption.
Idle power enables Dell servers to run as efficiently when idle as when at full workload.

Rack infrastructure

38

Dell offers some of the industry's highest-efficiency power infrastructure solutions, including:Power, thermal, and acoustics

Table 25. Power tools and technologies (continued)
FeatureDescription● Power distribution units (PDUs)● Uninterruptible power supplies (UPSs)● Energy Smart containment rack enclosures
Find additional information at: https://www.delltechnologies.com/en-us/servers/power-andcooling.htm.

PSU specifications
The PowerEdge HS5620 system supports up to two AC or DC power supply units (PSUs).

Table 26. HS5620 PSU specifications
PSU

Class

Heat
Frequ
dissipation ency
(maximum (Hz)) (BTU/hr)

AC Voltage

DC
Voltage-48 V DC

277 V AC and HVDC

Low Line High LineAC (100– AC (200–120 V)
240 V)

240 V DC

-40 V to-72 V DC

277 V AC
336 V (260(249 V AC– V DC–400
305 V AC)
V DC)

700 W
Titaniu
mixed mode m
HLAC

2625

N/A

700 W

700 W

N/A

N/A

N/A

800 W
Platinu
mixed mode m

3000

800 W

800 W

800 W

N/A

N/A

N/A

1100 W -48
V DC

4265

N/A

N/A

N/A

1100 W

N/A

N/A

1050 W

1100 W

1100 W

N/A

N/A

N/A

1050 W

1400 W

1400 W

N/A

N/A

N/A

N/A

N/A

N/A

N/A

1400 W

1400 W

N/A

1800 W

1800 W

N/A

N/A

N/A

N/A

1100 W
Titaniu
mixed mode m

4125

1400 W
Platinu
mixed mode m

5250

1400 W 277 Titaniu
V AC and
m
HVDC

5250

1800 W
Titaniu
mixed mode m
HLAC

6610

50/60

50/60
N/A
50/60
50/60

50/60
50/60

NOTE: Heat dissipation is calculated using the PSU wattage rating.
NOTE: HLAC stands for High-Line AC, with a range of 200 - 240V AC. HVDC stands for High-Voltage DC, with 336 V DC.
NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system
power consumption with the Enterprise Infrastructure Planning Tool available at Dell.com/calc.
NOTE: If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 Vac, and then the power rating per PSU isdegraded to 1050 W.

Figure 26. PSU power cords

Power, thermal, and acoustics

39

Figure 27. APP 2006G1 power cord

Figure 28. Lotes DC PSU connector

Table 27. PSU power cords
Form factor

OutputPower cord

Redundant 60 mm

700 W Mixed Mode HLAC

C13800 W Mixed Mode

C131100 W Mixed Mode

C131100 W -48 V DC

Lotes DC PSU connector

1400 W Mixed Mode

C13

1400 W 277 VAC and 336
VDC

APP 2006G1

1800 W Mixed Mode HLAC

C15

NOTE: C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

ThermalPowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption.

40

Power, thermal, and acoustics

Acoustics
Acoustical configurations of HS5620
Dell PowerEdge HS5620 is a rack server appropriate for attended data center environment. However, lower acoustical output isattainable with proper hardware or software configurations.

Configurations tested for acoustical experience
Table 28. Configurations tested for acoustical experience
Configuration

0 Drive

8 x 2.5-inch NVMe
configuration

16 x 2.5-inch SAS/SATA +8 x 2.5-inch
NVMe

12 x 3.5-inch withrear storage

CPU TDP

125 W

185 W

185 W

185 W

CPU Quantity

1

2

2

2

RDIMM Memory

16 GB DDR5

32 GB DDR5

16 GB DDR5

32 GB DDR5

Memory Quantity

2

16

16

16

Backplane TypeX

8 x 2.5-inch BP

8 x 2.5-inch + 8 x 2.5inch NVMe BP

12 x 3.5-inch + 2 x 2.5inch rear BP

HDD Type

X

NVMe 2.5-inch

SAS 2.5-inch + NVMe
2.5-inch

SATA 3.5-inch 12 TB +rear 2.5-inch U.2 NVMe

HDD Quantity

X

2

8+8

12+2

Flash Drives

X

X

X

X

Flash Quantity

X

X

X

X

PSU Type

600 W

800 W

800 W

1400 WPSU Quantity

1

2

2

2

OCP

1G

10/25 2-port

10/25 2-port

10/25 2-port

PCI 1

X

X

X

X

PCI 2

X

2-port 25Gb

2-port 25Gb

2-port 25Gb

PCI 3

X

X

X

X

PCI 4

X

X

A2

X

PCI 5

X

2-port 25 Gb

2-port 25 Gb

2-port 25 Gb

PCI 6

X

X

X

X

PERC

X

Front H755

Front H755

Rear H755

Table 29. Acoustical experience of HS5620 configurations
Configuration

0 Drive

8 x 2.5inch NVMe
configuration

16 x 2.5-inch
12 x 3.5-inch with
SAS/SATA +8 x rear storage
2.5-inch NVMe

Acoustical Performance: Idle/ Operating @ 25°C Ambient
L wA,m (B)K v (B)

Idle (4)

4.5

6.3

6.4

7.2

Operating/Customer usage
operating (5)(6)

4.5

6.3

6.4

7.2

Idle (4)

0.4

0.4

0.4

0.4

Power, thermal, and acoustics

41

Table 29. Acoustical experience of HS5620 configurations (continued)
Configuration

0 Drive

8 x 2.5inch NVMe
configuration

16 x 2.5-inch
12 x 3.5-inch with
SAS/SATA +8 x rear storage
2.5-inch NVMe

Operating/Customer usage
operating (5)(6)

0.4

0.4

0.4

0.4

Idle (4)

31

48

49

57

Operating/Customer usage
operating (5)(6)

31

49

50

58

Prominence
ratio ＜ECMA-74

Prominence ratio < 15 dB

L wA,m (1) (B)

4.8

6.6

6.6

7.4

K v (B)

0.4

0.4

0.4

0.4

33

52

52

58

L pA,m (dB)

Prominent discrete tones (3)Acoustical Performance: Idle @ 28°C Ambient

L pA,m(2) (dB)

Acoustical Performance: Max. loading @ 35°C Ambient
L wA,m (1) (B)

5.4

8.1

8.1

8.1

K v (B)

0.4

0.4

0.4

0.4

38

67

65

65

L pA,m(2) (dB)(1) LwA,m: The declared mean A-weighted sound power level (LwA) is calculated per section 5.2 of ISO 9296 with data collectedusing the methods described in ISO 7779 (2010). Engineering data presented here may not be fully compliant with ISO 7779
declaration requirements.
(2) LpA,m: The declared mean A-weighted emission sound pressure level is at the bystander position per section 5.3 of ISO 9296

and measured using methods described in ISO 7779. The system is placed in a 24U rack enclosure, 25cm above a reflective
floor. Engineering data presented here may not be fully compliant with ISO 7779 declaration requirements.
(3) Prominent tones: Criteria of Annex D of ECMA-74 & Prominence Ratio method of ECMA-418 are followed to determine if

discrete tones are prominent and to report them, if so.
(4) Idle mode: Idle mode is the steady-state condition in which the server is energized but not operating any intended function.
(5) Operating mode: Operating mode is represented by the maximum of the steady state acoustical output at 50% of CPU TDP

or active storage drives for the respective sections of Annex C of ECMA-74.
(6) Customer Usage Operating mode: The operating mode is represented by the maximum of the steady state acoustical output

at 10%~25% of CPU TDP and 0%~10% IOPs load as the components showed in the above configurations.

42

Power, thermal, and acoustics

10
Rack, rails, and cable management
Topics:••••Rails information
Cable Management Arm
Strain Relief Bar
Rack Installation

Rails information
The rail offerings for the HS5620 consist of two general types: sliding and static. The cable management offerings consist of an
optional cable management arm (CMA) and an strain relief bar (SRB).
See the Dell Enterprise Systems Rail Sizing and Rack Compatibility Matrix available at rail-rack-matrix for information regarding:●●●●Specific details about rail types.
Rail adjustability ranges for various rack mounting flange types
Rail depth with and without cable management accessories
Rack types that are supported for various rack mounting flange types

Key factors governing proper rail selection include the following:● Identifying the type of rack in which they will be installed.
● The spacing between the front and rear mounting flanges of the rack.
● The type and location of any equipment mounted in the back of the rack such as power distribution units (PDUs), and theoverall depth of the rack
● Overall depth of the rack

A11 Sliding Rails features summary
The sliding rails allow the system to be fully extended out of the rack for service. The sliding rails have a Cable Management Arm(CMA) and a Strain Relief Bar (SRB) option.
There are one types of sliding rails available:● Stab-in/Drop-in sliding rails

A11 Stab-in/Drop-in sliding rails for 4-post racks● Supports Drop-in or Stab-in installation of the chassis to the rails● Supports tool-less installation in 19-inch EIA-310-E compliant square, unthreaded round hole racks including all generations ofDell racks.
Also supports tool-less installation in threaded round hole 4-post racks● Support for tool-less installation in Dell Titan or Titan-D racks● Supports full extension of the system out of the rack to allow serviceability of key internal components● Supports optional Cable Management Arm (CMA)NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled fromthe sliding rails. This reduces the overall length of the rails and eliminates the potential interferences with rear mounted
PDUs or the rear rack door.
● Supports optional Strain Relief Bar (SRB)

Rack, rails, and cable management

43

NOTE: Scan the QRL code for the documentation and troubleshooting information regarding the installation procedures for
Drop-in/Stab-in rail types.

Figure 29. Quick resource locator for combo rails

A8 Static Rails features summary
The static rails, shown in the figure below, support a wider variety of racks than the sliding rails, but do not support
serviceability in the rack. The static rails are not compatible with the CMA and SRB.
● Supports Stab-in installation of the chassis to the rails● Supports tool-less installation in 19-inch EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of Dell racks● Supports tooled installation in 19-inch EIA-310-E compliant threaded hole 4-post and 2-post racks● Supports tooled installation in Dell Titan or Titan-D rack
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types.
● Screw head diameter should be 10mm or less.

Figure 30. Static rails
2-Post racks installation
If installing to 2-Post (Telco) racks, the ReadyRails II static rails (A8) must be used. Sliding rails support mounting in 4-post
racks only.

44

Rack, rails, and cable management

Figure 31. Static rails in 2-post center mount configuration
Installation in the Dell Titan or Titan-D racks
For tool-less installation in Titan or Titan-D racks, the Stab-in/Drop-in sliding rails (A11) must be used. This rail collapses down
sufficiently to fit in the rack with mounting flanges that are spaced about 24 inches apart from front to back. The Stab-in/
Drop-in sliding rail allows bezels of the servers and storage systems to be aligned when installed in these racks. For tooled
installation, Stab-in Static rails (A8) must be used for bezel alignment with storage systems.

Cable Management Arm
The optional Cable Management Arm (CMA) for the system organizes and secures the cords and cables exiting the back of theserver and unfolds to allow the server to extend out of the rack without having to detach the cables.
Some key features of the CMA include:● Large U-shaped baskets to support dense cable loads● Open vent pattern for optimal airflow● Support for mounting on either side by swinging the spring-loaded brackets from one side to the other● Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable damage during cycling● Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position● Both the CMA and the tray mount without the use of tools through simple and intuitive snap-in designs
The CMA can be mounted to either side of the sliding rails without the use of tools or the need for conversion. For systems
with one power supply unit (PSU), it is recommended to mount on the side opposite to that of the power supply to allow easieraccess to it and the rear drives (if applicable) for service or replacement.

Rack, rails, and cable management

45Strain Relief Bar
The optional strain relief bar (SRB) for the HS5620 organizes and supports cable connections at the rear end of the server toavoid damage from bending.

Figure 32. Cabled strain relief bar
Sliding rails with optional SRB:● Support tool-less attachment to rails● Support two depth positions to accommodate various cable loads and rack depths● Support cable loads and controls stress on server connectors● Support cables can be segregated into discrete, purpose-specific bundles

Rack Installation
Drop-in design means that the system is installed vertically into the rails by inserting the standoffs on the sides of the system
into the J-slots in the inner rail members with the rails in the fully extended position. The recommended method of installation
is to first insert the rear standoffs on the system into the rear J-slots on the rails to free up a hand and then rotate the systemdown into the remaining J-slots while using the free hand to hold the rail against the side of the system.
Stab-in design means that the inner (chassis) rail members must first be attached to the sides of the system and then inserted
into the outer (cabinet) members installed in the rack.

Installing system into the rack (option A: Drop-In)
1. Pull the inner rails out of the rack until they lock into place.

46

Rack, rails, and cable management

Figure 33. Pull out inner rail
2. Locate the rear rail standoff on each side of the system and lower them into the rear J-slots on the slide assemblies.
3. Rotate the system downward until all the rail standoffs are seated in the J-slots.

Figure 34. Rail standoffs seated in J-slots
4. Push the system inward until the lock levers click into place.
5. Pull the blue side release lock tabs forward or backward on both rails and slide the system into the rack until the system is in
the rack.

Rack, rails, and cable management

47

Figure 35. Slide system into the rackInstalling the system into the rack (option B: Stab-In)
1. Pull the intermediate rails out of the rack until they lock into place.
2. Release the inner rail lock by pulling forward on the white tabs and sliding the inner rail out of the intermediate rails.

Figure 36. Pull out the intermediate rail

Table 30. Rail component label
NumberComponent

1

Intermediate rail

2

Inner rail

3. Attach the inner rails to the sides of the system by aligning the J-slots on the rail with the standoffs on the system andsliding forward on the system until they lock into place.

48

Rack, rails, and cable management

Figure 37. Attach the inner rails to the system
4. With the intermediate rails extended, install the system into the extended rails.

Figure 38. Install system into the extended rails
5. Pull blue slide release lock tabs forward or backward on both rails, and slide the system into the rack.

Rack, rails, and cable management

49

Figure 39. Slide system into the rack50

Rack, rails, and cable management

11
Supported operating systems
The PowerEdge HS5620 system supports the following operating systems:
●
●
●
●
●

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise LinuxSUSE Linux Enterprise Server
VMware vSAN/ESXi

For more information, go to www.dell.com/ossupport.

Supported operating systems

51

12Dell OpenManage Systems Management
Dell delivers management solutions that help IT administrators effectively deploy, update, monitor, and manage IT assets.
OpenManage solutions and tools enable you to quickly respond to problems by helping them to manage Dell servers efficiently;
in physical, virtual, local, and remote environments; all without the need to install an agent in the operating system.
The OpenManage portfolio includes:●●●●

Innovative embedded management tools - integrated Dell Remote Access Controller (iDRAC)
Consoles - OpenManage Enterprise
Extensible with plug-ins - OpenManage Power Manager
Update tools - Repository Manager

Dell has developed comprehensive systems management solutions that are based on open standards and has integrated withmanagement consoles from partners such as Microsoft and VMware, allowing advanced management of Dell servers. Dellmanagement capabilities extend to offerings from the industry's top systems management vendors and frameworks such as
Ansible, Splunk, and ServiceNow. OpenManage tools automate the full span of server life cycle management activities alongwith powerful RESTful APIs to script or integrate with your choice of frameworks.
For more information about the entire OpenManage portfolio, see:
● The latest Dell Systems Management Overview Guide.

Topics:•••Integrated Dell Remote Access Controller (iDRAC)
Systems Management software support matrix
Getting started with Dell Open Server Manager (OSM)

Integrated Dell Remote Access Controller (iDRAC)
iDRAC9 delivers advanced, agent-free, local and remote server administration. Embedded in every PowerEdge server, iDRAC9
provides a secure means to automate a multitude of common management tasks. Because iDRAC is embedded within every
PowerEdge server, there is no additional software to install; just plug in power and network cables, and iDRAC is ready to go.
Even before installing an operating system (operating system) or hypervisor, IT administrators have a complete set of server
management features at their fingertips.
With iDRAC9 in-place across the Dell PowerEdge portfolio, the same IT administration techniques and tools can be applied
throughout. This consistent management platform allows easy scaling of PowerEdge servers as an organization's infrastructure
grows. Customers can use the iDRAC RESTful API for the latest in scalable administration methods of PowerEdge servers. With
this API, iDRAC enables support for the Redfish standard and enhances it with Dell extensions to optimize at-scale managementof PowerEdge servers. By having iDRAC at the core, the entire OpenManage portfolio of Systems Management tools allows
every customer to tailor an effective, affordable solution for any size environment.
Zero Touch Provisioning (ZTP) is embedded in iDRAC. ZTP - Zero Touch Provisioning is Intelligent Automation Dell's agent-freemanagement puts IT administrators in control. Once a PowerEdge server is connected to power and networking, that system
can be monitored and fully managed, whether you're standing in front of the server or remotely over a network. In fact,with no need for software agents, an IT administrator can: • Monitor • Manage • Update • Troubleshoot and remediate Dell
servers With features like zero-touch deployment and provisioning, iDRAC Group Manager, and System Lockdown, iDRAC9 is
purpose-built to make server administration quick and easy. For those customers whose existing management platform utilizes
in-band management, Dell does provide iDRAC Service Module, a lightweight service that can interact with both iDRAC9 andthe host operating system to support legacy management platforms.
When ordered with DHCP enabled from the factory, PowerEdge servers can be automatically configured when they are
initially powered up and connected to your network. This process uses profile-based configurations that ensure each server isconfigured per your specifications. This feature requires an iDRAC Enterprise license.
iDRAC9 offers following license tiers:

52

Dell OpenManage Systems Management

Table 31. iDRAC9 license tiers
LicenseDescription

iDRAC9 Basic● Available only on 100-500 series rack/tower● Basic instrumentation with iDRAC web UI● For cost conscious customers that see limited value in management

iDRAC9
Express● Default on 600+ series rack/tower, modular, and XR series● Includes all features of Basic● Expanded remote management and server life-cycle features

iDRAC9Enterprise● Available as an upsell on all servers● Includes all features of Basic and Express. Includes key features such as virtual console, AD/LDAP
support, and more
● Remote presence features with advanced, Enterprise-class, management capabilities

iDRAC9
Datacenter● Available as an upsell on all servers● Includes all features of Basic, Express, and Enterprise. Includes key features such as telemetry streaming,
Thermal Manage, automated certificate management, and more
● Extended remote insight into server details, focused on high end server options, granular power, andthermal management

For a full list of iDRAC features by license tier, see Integrated Dell Remote Access Controller 9 User's Guide at Dell.com.
For more details on iDRAC9 including white papers and videos, see:● Support for Integrated Dell Remote Access Controller 9 (iDRAC9) on the Knowledge Base page at Dell.com

Systems Management software support matrix
Table 32. Systems Management software support matrix
Categories

Features

PE mainstream

Embedded Management and In-band
Services

iDRAC9 (Express, Enterprise, and Datacenter licenses)

Supported

OpenManage Mobile

SupportedOM Server Administrator (OMSA)

Supported

iDRAC Service Module (iSM)

Supported

Driver Pack

Supported

Update Tools (Repository Manager, DSU, Catalogs)

Supported

Server Update Utility

Supported

Lifecycle Controller Driver Pack

Supported

Bootable ISO

Supported

OpenManage Enterprise

Supported

Power Manager Plug-in

Supported

Update Manager Plug-in

Supported

SupportAssist Plug-in

Supported

CloudIQ

SupportedOM Integration with VMware Vcenter/vROps

SupportedOM Integration with Microsoft System Center (OMIMSC)

Supported

Integrations with Microsoft System Center and Windows
Admin Center (WAC)

Supported

Change Management

Console and Plug-ins

Integrations and connections

Dell OpenManage Systems Management

53

Table 32. Systems Management software support matrix (continued)
Categories

SecurityStandard operating system

Features

PE mainstream

ServiceNow

Supported

AnsibleSupported

Third-party Connectors (Nagios, Tivoli, Microfocus)

Supported

Secure Enterprise Key Management

Supported

Secure Component Verification

Supported

Red Hat Enterprise Linux, SUSE, Windows Server 2019 or
2022, Ubuntu, CentOS

Supported (Tier-1)

Getting started with Dell Open Server Manager(OSM)
Dell Open Server Manager is available on select PowerEdge configurations as a factory option. Choose the embedded systems
management option (iDRAC or Open Server Manager) at the time of purchase. Both options run on the same silicon with thesame hardware, and ship directly from the factory. It's your choice.
Contact your Dell account team to learn more about Dell's Open Server Manager built on OpenBMC™ available exclusively
through the Hyperscale Next program for select customers by invitation only. For more information and to find out customer
eligibility, please contact your Dell account team.

Open Server Manager (OSM) introduction
Cloud service and hosting providers managing large-scale datacenters face many challenges accelerating their infrastructure
and managing multiple systems across different vendors. Updating firmware can be challenging, even across many generationsof hardware from a single vendor. The simplicity of a single, open embedded system management stack allows for scalable
operations, and easier migration paths across different or newer infrastructure.
Introducing Dell Open Server Manager built on OpenBMC™ enabling open, embedded systems management on select Dell
PowerEdge cloud scale servers. Explicitly designed for Cloud Server Providers managing large-scale data centers, Dell Open
Server Manager is designed, tested, and validated to securely run on select Dell PowerEdge platforms and configurations. We
offer a cohesive migration path for our customers looking to adopt OpenBMC for their environments while optimizing operations
and minimizing management with choices you can count on.

54

Dell OpenManage Systems Management

What is OpenBMC?
OpenBMC is an open-source BMC firmware stack designed to run on various infrastructures. It is a Linux Foundation projectwith the backing of Intel®, IBM®, Microsoft®, and Google™. OpenBMC™ aims to run the same embedded management
software on all of your systems to bring consistent management across your environment. Dell Open Server Manager isDell's implementation of OpenBMC. More information on Open Server Manager (OSM) can be found at https://www.dell.com/
support/home/en-us/product-support/product/open-server-manager/docs.

Why Dell Open Server Manager?
Dell Open Server Manager built on OpenBMC includes pure OpenBMC plus the security, manageability, and support that
customer's expect from PowerEdge servers:
Proven Security

Lifecycle Management

Global Services & Support

Dell-signed firmware with silicon root-of- BIOS configuration via Redfish™ API
trust (RoT)
Root shell access disabled by default

Standard Dell standard support andwarranties

Firmware update support via Dell Update Ability to convert to/from Open Server
Packages for BIOS, Backplane, PowerManager and iDRAC
Supply, Open Server Manager, andiDRAC

Improved User Experience

Why choose Dell Open Server Manager built on OpenBMC?
OpenBMC is designed to provide consistent systems management software across heterogeneous infrastructure. Based on
upstream OpenBMC 2.11, Dell Open Server Manager enables OpenBMC to run securely on select PowerEdge servers byleveraging the same BMC silicon that iDRAC uses. In doing so, this added silicon Root-of-Trust ensures that only the Dell version
of OpenBMC - thoroughly tested and validated - runs seamlessly on PowerEdge servers, giving our customers the security,
support, and manageability they expect. .
Ensuring malicious OpenBMC firmware doesn't make its way onto your servers, Dell lifecycle management is also enabled to
install Dell-signed firmware update packages from within Dell Open Server Manager for the BIOS, backplane, power supplies,
and iDRAC and Dell Open Server Manager.Additionally, the ability to export OpenBMC logs into a log package for SupportAssist
allows Dell to provide a full warranty and support.

Dell Open Server Manager Capabilities
Dell Open Server Manager provides many core systems management capabilities through multiple interfaces, including
Redfish™, IPMI, and a web-based user interface.
●
●
●
●
●
●
●

Get an overview of the system
View event and POST code logs
Observe hardware status and inventory, including channel firmware devices
Access the virtual KVM with virtual media capability
Update firmware
Perform server power operations and configure power consumption
Configure settings such as the date, time, network, users, sessions, and policies

Everything visible in the GUI - except for the virtual KVM and media - is accessible through Redfish.
Redfish allows you to manage the server through a RESTful API programmatically. This feature is vital for autonomous systems
management.

Configuring Dell Open Server Manager
Provisioning a new server consists of three activities● Configure the hardware

Dell OpenManage Systems Management55

● Install an operating system● Deploy applications and workloads
Firmware updates for other devices must be done through the operating system or with device-specific vendor tools. Dell Open
Server Manager accepts the same Dell firmware update packages used by iDRAC or for the operating system; and can be
downloaded from dell.com
An operating system can be installed using the virtual KVM and virtual media capability, or the server can be configured to PXEboot to deploy the operating system and applications over the network.

56

Dell OpenManage Systems Management

13
Appendix A. Standards compliance
The system conforms to the following industry standards.

Table 33. Industry standard documents
Standard

URL for information and specifications

ACPIAdvance Configuration and Power Interface
Specification, v6.4

https://uefi.org/specsandtesttools

Ethernet IEEE Std 802.3-2022

https://standards.ieee.org/

MSFT WHQL Microsoft Windows Hardware Quality Labs

microsoft.com/whdc/system/platform/pcdesign/desguide/serverdg.mspx

IPMI Intelligent Platform Management Interface, v2.0

intel.com/design/servers/ipmi

DDR5 Memory DDR5 SDRAM Specification

jedec.org/standards-documents/docs/jesd79-4.pdf

PCI Express PCI Express Base Specification, v5.0

pcisig.com/specifications/pciexpress

PMBus Power System Management Protocol Specification,
v1.2

http://pmbus.org/Assets/PDFS/Public/
PMBus_Specification_Part_I_Rev_1-1_20070205.pdf

SAS Serial Attached SCSI, 3 (SAS-3) (T10/INCITS 519)

http://www.t10.org/

SATA Serial ATA Rev. 3.3

sata-io.org

SMBIOS System Management BIOS Reference Specification,
v3.3.0DMTF SMBIOSTPM Trusted Platform Module Specification, v1.2 and v2.0

trustedcomputinggroup.org

UEFI Unified Extensible Firmware Interface Specification, v2.7 uefi.org/specifications
PI Platform Initialization Specification, v1.7
USB Universal Serial Bus v2.0 and SuperSpeed v3.0 (USB 3.1
Gen1)

USB Implementers Forum, Inc. https://usb.org/documents

NVMe Express Base Specification. Revision 2.0c

https://nvmexpress.org/specifications/

NVMe Command Set Specifications
1. NVM Express NVM Command Set Specification. Revision
1.1c
2. NVM Express Zoned Namespaces Command Set. Revision
1.0c
3. NVM Express® Key Value Command Set. Revision 1.0c
NVMe Transport Specifications
1. NVM Express over PCIe Transport. Revision 1.0c
2. NVM Express RDMA Transport Revision. 1.0b
3. NVM Express TCP Transport. Revision 1.0c
NVMe NVM Express Management Interface. Revision 1.2c
NVMe NVMe Boot Specification. Revision 1.0

Appendix A. Standards compliance57

14
Appendix B: Additional resources
Topics:••Customer kits
Documentation

Customer kits
Dell Upgrades
It is not always possible to plan for new applications, future workloads, and business needs. Unleash the full power of yourDell Technologies Infrastructure. When budget does not permit the purchase of new servers, Dell Upgrades is a cost-effective
method to repurpose and unleash the full power of existing server, storage, and networking infrastructure.
● Protect your mission-critical operations by using only genuine Dell OEM-validated Upgrades and the technical expertise ofDell ProSupport● Flex and scale existing infrastructure by upgrading, adding memory or storage drives to cost-effectively and quickly meet
new workloads and demands● Dell Upgrades are the same peripheral commodities that your customer may improve or maintain their server after the initialpoint of saleUpgrades portfolio
Table 34. Upgrade category
Dell Upgrade Category

Sample Picture

MemoryDell Upgrade Category Offerings
DDR5 5600 MT/s and 4800 MT/s

Memory upgrades are essential forkeeping your customers operating at
peak performance as their businessneeds grow and their workloads
increase. We tend to see strong demand
for server memory because it is theeasiest and most cost-effective way to
improve system performance.
Storage

HDD: SATA, SAS interface

Dell offers both solid-state drive andhard disk drive storage options forenterprise systems with SATA, SAS or
NVMe interfaces. SSDs excel in speed,
high-performance I/O requirements, andhigh reliability due to the lack of spinningdisks. Hard Disk Drives (HDDs) store
data on spinning disks and offer value forthe amount of data storage for the price.

SSD: SATA, SAS, PCI

Dell offers both solid-state drive andhard disk drive storage options forenterprise systems with SATA, SAS

58

Appendix B: Additional resources

NVMe interface Tape Drive or Media

Table 34. Upgrade category (continued)
Dell Upgrade Category

Sample Picture

Dell Upgrade Category Offerings

interfaces. SSDs excel in speed, highperformance I/O requirements, and highreliability due to the lack of spinningdisks. Hard Disk Drives (HDDs) store
data on spinning disks and offer value forthe amount of data storage for the price.
Processor

Processors (Intel)

Processor upgrades help customers
perform and accomplish more tasks
overall, saving them valuable time.
Our processor upgrades include Intel®
Xeon® Scalable processors to meetyour customers workload needs withincreased cores and improved security.

Heat sinks

Networking and Optics

Network cards

Our networking and optics components—network interface cards, transceivers,
optical cables, and more—are key intoday’s data center environment, helping
customers to improve bandwidth tobetter manage increase in workloads,
devices, users, and interconnected
systems.

Transceivers (Optics)

Accessories: Dell sells accessories like
power supplies, cables and power cables,
bezels, controller cards, GPU, PERC andother components to complete the Dell
Upgrades portfolio and redundancies.

Controller cards
Power supplies
CablesRail kits
BezelsPower cords
GPU
PERC
BOSS
Power cords
Cable Management Arm (CAM)
Fans
Serial board
Internal USB

Appendix B: Additional resources59

Upgrades reference links● Main Upgrades Page
● Customer Kit Selector● Dell Parts Finder Tool (Customer Facing Tool)

Documentation
This section provides information about the documentation resources for your system.

Table 35. Documentation resources
Document

Location

Factory Configuration Matrix

Sales Portal

SPM (Slot Priority Matrix)

Sales Portal

NDA Deck

Sales Portal

Installation and Service Manual (ISM)

https://www.dell.com/poweredgemanuals

Field Service Manual (FSM)

https://www.dell.com/poweredgemanuals > Sing inTechnical Guide

Dell.com > Product page > Product Details

Spec Sheet

Dell.com > Product page > Product Details

60

Appendix B: Additional resources

15
Appendix C: Additional specifications
Topics:•••••Chassis dimensions
System weight
Video specifications
USB ports specifications
Environmental specifications

Chassis dimensions

Figure 40. Chassis dimensions

Table 36. PowerEdge HS5620 chassis dimensions
Xa

Xb

Y

Za

Zb

Zc

482.0 mm (18.97 inches)

434.0 mm (17.08
inches)86.8 mm (3.41
inches)22.0 mm (0.86
inches) Without
bezel

677.44 mm (26.67
inches) Ear to L
bracket housing

685.78 mm(26.99 inches)
Ear to PSU
handle without
velcro strap

Appendix C: Additional specifications

61

Table 36. PowerEdge HS5620 chassis dimensions
Xa

Xb

Y

Za

Zb

Zc

35.84 mm (1.41
inches) With
bezel

650.24 mm (25.6
inches) Ear to PSU
surface

NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight
Table 37. PowerEdge HS5620 systemweight
System configuration

Maximum weight (with all drives/SSDs/bezel)

16+8 x 2.5-inch

25.92 kg (57.14 lb)

12 x 3.5-inch

28.82 kg (63.53 lb)

8 x 3.5-inch

25.84 kg (54.96 lb)

8 x 2.5-inch

21.56 kg (47.53 lb)

No backplane configuration

19.40 kg (42.76 lb)

Video specifications
The PowerEdge HS5620 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 38. Supported video resolution options for the system
Resolution

Refresh rate (Hz)Color depth (bits)

1024 x 768

60

8, 16, 32

1280 x 800

60

8, 16, 32

1280 x 1024

60

8, 16, 32

1360 x 768

60

8, 16, 32

1440 x 900

60

8, 16, 32

1600 x 900

60

8, 16, 32

1600 x 1200

60

8, 16, 32

1680 x 1050

60

8, 16, 32

1920 x 1080

60

8, 16, 32

1920 x 1200

60

8, 16, 32

USB ports specifications
Table 39. PowerEdge HS5620 USB specifications
Front
USB port type
USB 2.0compliant port

62

Rear
No. of ports

One

USB port type
USB 2.0compliant port

Appendix C: Additional specifications

Internal (Optional)
No. of ports

One

USB port typeInternal USB 3.0compliant port

No. of ports
One

Table 39. PowerEdge HS5620 USB specifications (continued)
Front
USB port typeRear
No. of ports

iDRAC Direct port One(Micro-AB USB
2.0- compliant
port)

USB port type
USB 3.0compliant port

Internal (Optional)
No. of ports

USB port typeNo. of ports

One

NOTE: The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE: The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load isdefined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port
in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE: The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An
external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

Environmental specifications
NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet locatedwith the Documentation on www.dell.com/support/home.

Table 40. Continuous Operation Specifications for ASHRAE A2
Temperature, humidity and, operational
altitude

Allowable continuous operations

Temperature range for altitudes <= 900 m (<=2953 ft)

10–35°C (50–95°F) with no direct sunlight on the equipment

Humidity percent range (non-condensing at all
times)

8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C
(69.8°F) maximum dew point

Operational altitude de-rating

Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900
m (2953 Ft)

Table 41. Continuous Operation Specifications for ASHRAE A3
Temperature, humidity and, operational
altitude

Allowable continuous operations

Temperature range for altitudes <= 900 m (<=2953 ft)

5–40°C (41–104°F) with no direct sunlight on the equipment

Humidity percent range (non-condensing at all
times)

8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C
(75.2°F) maximum dew point

Operational altitude de-rating

Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900
m (2953 Ft)

Table 42. Continuous Operation Specifications for ASHRAE A4
Temperature, humidity and, operational
altitude

Allowable continuous operations

Temperature range for altitudes <= 900 m (<=2953 ft)

5–45°C (41–113°F) with no direct sunlight on the equipment

Humidity percent range (non-condensing at all
times)

8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C
(75.2°F) maximum dew point

Operational altitude de-rating

Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900
m (2953 Ft)

Appendix C: Additional specifications

63

Table 43. Continuous Operation Specifications for Rugged Environment
Temperature, humidity and, operational
altitude

Allowable continuous operations

Temperature range for altitudes <= 900 m (<=2953 ft)

5–45°C (41–113°F) with no direct sunlight on the equipment

Humidity percent range (non-condensing at all
times)

8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C
(75.2°F) maximum dew point

Operational altitude de-rating

Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900
m (2953 Ft)

Table 44. Common Environmental Specifications for ASHRAE A2, A3, A4 and Rugged
Temperature, humidity and, operational
altitude

Allowable continuous operations

Maximum temperature gradient (applies to both
operation and non-operation)

20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15
minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.

Non-operational temperature limits-40 to 65°C (-104 to 149°F)

Non-operational humidity limits

5% to 95% RH with 27°C (80.6°F) maximum dew point

Maximum non-operational altitude

12,000 meters (39,370 feet)

Maximum operational altitude

3,048 meters (10,000 feet)

Table 45. Maximum vibration specifications
Maximum vibration

Specifications

Operating

0.21 G rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)

Storage

1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 46. Maximum shock pulse specifications
Maximum shock pulse

Specifications

Operating

Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms.

Storage

Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restriction matrix
Table 47. Processor and heat sink matrix
Heat sink

Processor TDP

STD HSK< 185 W CPU SKUs

HPR HSK

185 W-250 W CPU SKUs (12 x 3.5-inch drive configuration
not supported)
125W-250W CPU SKUs (12 x 3.5-inch drive configuration
supported)

Table 48. Label reference
Label

Description

STD

Standard

64

Appendix C: Additional specifications

Table 48. Label reference (continued)
Label

Description

HPR (Silver)High Performance Silver (HPR) fan

HPR (Gold)

High Performance Gold (VHP) fan

HSKHeat sink

NOTE: The ambient temperature of the configuration is determined by the critical component in that configuration. For
example, if the processor's supported ambient temperature is 35°C, the DIMM is 35°C, and the GPU is 30°C, thecombined configuration can only support 30°C.

Table 49. Supported ambient temperature for processors for HS5620 with iDRAC
HS5620configuration

EMR
MCC
CPU

No
backplane

8 x 3.5inchSAS
configu
ration12 x
3.5inchSAS
configu
ration12 x
3.5inchconfigu
ration
with
rear
drive
module8 x 2.5inchSAS
configu
ration8 x 2.5inch
NVMe
configu
ration16 x
2.5inchSAS
configu
ration16 x
2.5inch + 8
x 2.5inch
NVMe
configu
ration

4514Y

150 W

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

5512U

185 W

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

6526Y/6534

195 W

35°C

35°C

35°C

35°C

35°C

35°C

35°C

35°C

6548+/250 W
6542Y/6548N

35°C

35°C

30°C

30°C

35°C

35°C

35°C

35°C

SPR
LCC
CPU

4509Y

125W

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

4510

150 W

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

SPR
MCC
CPU

3408U

125 W

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

4410Y/5415+

150 W

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

4416+

165 W

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

5418Y/
5412U/6426Y

185 W

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

6438M/
205 W
5420+/
6434/6438Y+

35°C

35°C

35°C

35°C

35°C

35°C

35°C

35°C

6448Y/6442Y 225 W

35°C

35°C

35°C

35°C

35°C

35°C

35°C

35°C

6414U/6444Y

250 W

35°C

35°C

30°C

30°C

35°C

35°C

35°C

35°C

128 GB
RDIMM 5200

9 W, 1DPC

35°C

35°C

30°C

30°C

35°C

35°C

35°C

35°C

96 GB
RDIMM 5200

8.1 W, 1DPC

35°C

35°C

30°C

30°C

35°C

35°C

35°C

35°C

64 GB
RDIMM 5200

7.7 W, 1DPC

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

32 GB
RDIMM 5200

5.1 W, 1DPC

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

128 GB
RDIMM 4800

14.2 W, 1DPC

35°C

35°C

30°C

30°C

35°C

35°C

35°C

35°C

11

MemoryAppendix C: Additional specifications

65

Table 49. Supported ambient temperature for processors for HS5620 with iDRAC (continued)
HS5620configuration

No
backplane

8 x 3.5inchSAS
configu
ration12 x
3.5inchSAS
configu
ration12 x
3.5inchconfigu
ration
with
rear
drive
module8 x 2.5inchSAS
configu
ration8 x 2.5inch
NVMe
configu
ration16 x
2.5inchSAS
configu
ration16 x
2.5inch + 8
x 2.5inch
NVMe
configu
ration64 GB
RDIMM 4800

12 W, 1DPC

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

32 GB
RDIMM 4800

10 W, 1DPC

45°C

40°C

35°C

35°C

40°C

40°C

40°C

40°C

PCIe

45°C

40°C

35°C 135°C 1

40°C

40°C

40°C

40°C

A2 GPU 6

35°C

30°C

Not
Not
35°C
supporte supporte
d
d

35°C

30°C

30°C

OCP

45°C

40°C

35°C 235°C 2

40°C

40°C

40°C

40°C

BOSS

35°C

35°C

35°C

35°C

35°C

35°C

35°C

35°C

NOTE:
1. Max supported thermal tier of PCIe card is Tier 5.
2. Max supported thermal tier of OCP is Tier 5.
3. HPR Sliver fan is required from fan zone 2 to fan zone 6 for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA + 8 x 2.5-inch
NVMe, 12 x 3.5-inch drives or GPU configurations.
4. Optional fan zone 1 has to be populated with HPR Gold fan is for BOSS, GPU or rear drive module populations.
5. PCIe slot priority of Nvidia A2 GPU is constrained on slot #3, #4, #6.
6. HPR heatsink is required for ≥ 185 W CPUs, 12 x 3.5-inch drives or 12 x 3.5-inch drives with rear storage module
configurations.
7. DIMM blank is required for 12 x 3.5-inch SAS/SATA with rear storage module.
8. Fan blank is required on fan zone 1 when no fan population.
9. OCP shroud is required for OCP card population without PCIe riser module installed.
10. CPU blank is required for single processor configuration.
11. Due to HW limitation, 6444Y is clamped to 250 W.
12. Rear drive module does not support Kioxia CM6 series, Samsung PM1735 series, Hynix PE8010/PE8110 ≥ 7.68 TB,
Samsung PM1733a > 1.92 TB, Samsung PM1735a > 1.6 TB and Redtail NVMe drive.
NOTE: The fan speed in the 3.5-inch chassis is limited to 90% due to the drive dynamic profile.

66

Appendix C: Additional specifications

Table 50. Supported ambient temperature for processors for HS5620 with Open Server Manager (OSM)
HS5620configuration

SPR
MCC
CPU

No
backplane

8 x 3.5inchSAS
configu
ration12 x
3.5inchSAS
configu
ration12 x
3.5inchconfigu
ration
with
rear
drive
module8 x 2.5inchSAS
configu
ration8 x 2.5inch
NVMe
configu
ration16 x
2.5inchSAS
configu
ration24 x
2.5inch (16x 2.5inch + 8
x 2.5inch
NVMe
configu
ration)

3408U

125 W

35°C

35°C

35°C

35°C

35°C

35°C

35°C

35°C

4410Y/5415+

150 W

35°C

35°C

35°C

35°C

35°C

35°C

35°C

35°C

4416+

165 W

35°C

35°C

Not
Supported

Not
Support
ed

35°C

35°C

35°C

35°C

5418Y/
5412U/6426Y

185 W

35°C

35°C

Not
Supported

Not
Support
ed

35°C

35°C

35°C

35°C

6438M/
205 W
5420+/
6434/6438Y+

35°C

Not
Supported

Not
Supported

Not
Support
ed

35°C

35°C

35°C

35°C

6448Y/6442Y 225 W

35°C

Not
Supported

Not
Supported

Not
Support
ed

35°C

35°C

Not
Supported

35°C

6414U /
6444Y 15

250 W

35°C

Not
Supported

Not
Supported

Not
Supported

Not
Support
ed

35°C

Not
Supported

Not
Supported

128 GB
RDIMM 4800

14.2 W, 1DPC

35°C

Not
Supported

Not
Supported

Not
Supported

Not
Support
ed

35°C

Not
Supported

Not
Supported

64 GB
RDIMM 4800

12 W, 1DPC

35°C

35°C

Not
Supported

Not
Support
ed

35°C

35°C

35°C

35°C

32 GB
RDIMM 4800

10 W, 1DPC

35°C

35°C

35°C

35°C

35°C

35°C

35°C

35°C

PCIe

35°C

35°C 235°C 135°C 135°C 235°C

35°C 235°C 2A2 GPU 6

35°C

Not
Supported

Not
Supported

Not
Support
ed

35°C

35°C

Not
Supported

Not
Support
ed

OCP

35°C

35°C 435°C 335°C 335°C 435°C

35°C 435°C 4

BOSS

35°C

35°C

35°C 335°C 3

35°C

35°C

35°C

35°C

MemoryNOTE:
1. Max supported thermal tier of PCIe card is Tier 3.
2. Max supported thermal tier of OCP is Tier 5.
3. Max supported thermal tier of OCP is Tier 2.
4. Max supported thermal tier of OCP is Tier 5.
5. ≥ 960 GB M.2 SSDs are not supported in 12 x 3.5-inch drive configuration.
6. Only support the optical transceiver with thermal spec. 85°C for network adapter and OCP card.
7. PERC adapter with BBU is not supported in 3.5-inch drive configurations.
8. Six fans population is required and fan zone 1 is dedicated to install HPR Gold fan.

Appendix C: Additional specifications67

9. HPR Silver fan on fan zone 2 to fan zone 6 is required for front NVMe drives population or 12 x 3.5-inch drive
configuration.
10. HPR Silver fan on fan zone 2 to fan zone 6 is required for GPU population and PCIe slot priority of Nvidia A2 GPU isconstrained on slot #3, #4, #6.
11. HPR heatsink is required for ≥ 185 W CPUs or 12 x 3.5-inch SAS/SATA or 12 x 3.5-inch SAS/SATA with rear storage
modules.
12. DIMM blank is required for 12 x 3.5-inch SAS/SATA and 12 x 3.5-inch SAS/SATA with rear storage modules.
13. OCP shroud is required for OCP card population without PCIe riser module installed.
14. CPU blank is required for single processor configuration.
15. Due to HW limitation, 6444Y is clamped to 250 W.
16. Rear drive module does not support Kioxia CM6 series, Samsung PM1735 series, Hynix PE8010/PE8110 ≥ 7.68 TB,
Samsung PM1733a > 1.92 TB, Samsung PM1735a > 1.6 TB and Redtail NVMe drive.

Table 51. Fan population rule for HS5620
configuration

No backplane

8 x 3.5-inchSAS

12 x 3.5-inchSAS

8 x 2.5-inchSAS

8 x 2.5-inch
NVMe

24 x 2.5-inch (16x 2.5-inch + 8 x
2.5-inch NVMe)

Default

Fan 2 to Fan 6with STD fan

Fan 2 to Fan 6with STD fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with STD fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fanRear Module

Not supported

Not supported

Fan 1 with HPRGold fan

Not supported

Not supported

Not supported

Optional HW

Fan 2 to Fan 6with HPR Silver
fan
BOSS N1

GPU

Fan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 2 to Fan 6with STD fan

Fan 2 to Fan 6with STD fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with STD fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fanTable 52. Fan population rule for HS5620 with Open Server Manager (OSM)
configuration

No backplane

8 x 3.5-inchSAS

12 x 3.5-inchSAS

8 x 2.5-inchSAS

8 x 2.5-inch
NVMe

24 x 2.5-inch (16x 2.5-inch + 8 x
2.5-inch NVMe)

Fan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 2 to Fan 6with STD fan

Fan 2 to Fan 6with STD fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with STD fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fan

Not supported

Not supported

Fan 1 with HPRGold fan

Not supported

Not supported

Not supported

Optional HW
Default

Rear Module

68

Appendix C: Additional specifications

Table 52. Fan population rule for HS5620 with Open Server Manager (OSM) (continued)
configuration

No backplane

Optional HW

8 x 3.5-inchSAS

12 x 3.5-inchSAS

8 x 2.5-inchSAS

8 x 2.5-inch
NVMe

24 x 2.5-inch (16x 2.5-inch + 8 x
2.5-inch NVMe)

Fan 2 to Fan 6with HPR Silver
fan
BOSS N1

GPU

Fan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fanFan 2 to Fan 6with STD fan

Fan 2 to Fan 6with STD fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with STD fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 1 with HPRGold fan

Not supported

Fan 1 with HPRGold fanFan 1 with HPRGold fanFan 1 with HPRGold fan

Not supported

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fan

Fan 2 to Fan 6with HPR Silver
fanThermal restrictions for PCIe adapter card and others with Open Server Manager
(OSM)
●
●
●
●
●

Cannot support PCIe adapter with the cooling requirement more than 200 LFM at 55C in a 3.5-inch drives configuration.
Cannot support PCIe adapter with the cooling requirement more than 300 LFM at 55C in a 2.5-inch drives configuration.
Cannot support OCP card with the cooling requirement more than 250 LFM at 55C in a 2.5-inch drives configuration.
Only support the optical transceiver with higher temperature spec (≥ 85°C) (M14MK / N8TDR).
The rear PERC adapter with BBU is not supported in 12 x 3.5-inch drive configuration.

Thermal Restrictions for PCIe adapter NIC and other network cards with iDRAC● Cannot support PCIe cards with the cooling requirement more than 300LFM at 55C in a 12 x 3.5-inch SAS/SATA
configuration.
● Solarflare Melrose DP 25 GBE SFP28 (TTKWY) not supported with 12 x 3.5-inch SAS/SATA configuration.
● 100 Gb network adapter or 100 Gb OCP is not supported in the 12 x 3.5-inch SAS/SATA configuration.
● Few 25 GB OCP cards with the cooling requirement more than 250LFM at 55C (3Y64D/4TRD3 / GGGDF/R1KTR / Y4VV5)
is not supported in 12x3.5" SAS/SATA configuration.
● The 12 x 3.5-inch SAS/SATA configuration requires the optical transceiver with higher temperature spec (≥ 85°C) tosupport (M14MK / N8TDR).
● Quad port OCP (3Y64D/Y4VV5) requires the optical transceiver with higher temperature spec (≥ 85°C) to support(M14MK).
● 100 Gb network adapter cannot support the transceivers as 14NV5 / 9JKK2 / QSFP56 (MFS1S00-VxxxE/HxxxE).
● The h965e is limited to populate in PCI slot 3 in a 12 x 3.5-inch SAS/SATA configuration.
● Mellanox CX7 NDR200 card has few limitations of PCI slot locations.

Table 53. Mellanox CX7 NDR200 slot location limitations
Storage configuration

Slots on 3.5-inch configuration

Slots on 2.5-inch configuration

Gen5 PCIe sloit support for CX7
NDR2003, 4

3, 4

Gen4 PCIe sloit support for CX7
NDR2006

5, 6

Appendix C: Additional specifications

69

Thermal restrictions for extended ambient support (ASHRAE A3/A4)
●
●
●
●
●
●
●
●

Two PSUs are required in redundant mode. Single PSU failure is not supported.
12 x 3.5-inch SAS/SATA configuration is not supported.
BOSS(M.2) module is not supported.
CPU TDP > 185 W is not supported.
PCIe card TDP > 25 W is not supported.
OCP cards with transmission rate higher than 25 GB is not supported.
OCP transceiver spec ≤ 75°C is not supported.
8 x 3.5-inch SAS/SATA, 8 x 2.5-inch SAS/SATA, 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA, 16 x 2.5-inch SAS/SATA + 8x
2.5-inch NVMe configurations are limited to support A3.
● .
● The rear drive is not supported.

70

Appendix C: Additional specifications

16
Appendix D: Services
Topics:
•
•
•
•
•
•
•
•
•

Default service levels
ProDeploy Infrastructure Suite
Supplemental Deployment Services
Unique Deployment Scenarios
DAY 2 - Automation Services with Ansible
ProSupport Infrastructure Suite
Specialty Support Services
Consulting Services
Resources

Default service levels
ProDeploy Infrastructure Suite
ProDeploy Infrastructure Suite provides a variety of deployment offerings to satisfy a customer's unique needs. It is made up of
five sub-offers: Configuration Services, Rack Integration, Basic Deployment, ProDeploy, and ProDeploy Plus.

Figure 41. ProDeploy Infrastructure Suite

Factory Based Services
Pre-configured systems or complete racks, customized prior to shipping to the customer's site.

Appendix D: Services

71

ProDeploy Factory Configuration
Ideal for customers buying servers in volume and seeking pre-configuration prior to shipping such as: custom image, systemsettings, and asset tagging so it arrives ready to use out of the box. Furthermore, servers are packaged and bundled to meet
specific shipping and distribution requirements for each customer location to facilitate the rollout process. Once the server isonsite , Dell can install and configure the server to the environment using any of the field-based deployment services outlined in
the next section.

ProDeploy Rack Integration
Ideal for customers seeking to build out fully integrated racks prior to shipping. These rack builds include hardware install,cabling, and full system configuration. You can also add-on a factory stress test and an optional on-site final rack configuration
to complete the rack installation.
● STANDARD SKUs for Rack Integration is available in the USA only and requires:○ 20 or more devices (R and C series servers, VxRail, and all Dell or non-Dell switches)○ Use Informational SKUs for Dell switches or 3rd party products.
○ Shipping to contiguous USA● USE CUSTOM QUOTE for Rack Integration scenarios that require:○ Shipment to any country or region outside USA or shipping outside contiguous USA○ Shipping to multiple locations○ Racks containing less than 20 servers○ Any rack that includes Storage

Figure 42. ProDeploy Infrastructure Suite - Factory services

Field-based Services
Put PowerEdge servers to work faster with Dell field-based deployment services. Whether we are deploying one server to one
thousand – we have you covered. Dell provides versatile delivery options to fit every budget and operating model.

ProDeploy Plus
Elevate Infrastructure deployments with our most complete service from planning through onsite hardware installation andsoftware configuration including the implementation of cybersecurity best practices. ProDeploy Plus provides the skill and scale

72

Appendix D: Servicesneeded to successfully execute demanding deployments in today's complex IT . The deployment starts with a site readiness
review and implementation plan. Certified deployment experts perform the software configuration to include set up of leading
operating systems and hypervisors. Dell will also configure PowerEdge software tools to include iDRAC and OpenManage
system utilities as well as support AIOps platforms: MenvironmentsyService360, TechDirect, and CloudIQ. Unique to ProDeploy
Plus, the cybersecurity implementation helps customers understand potential security risks and make recommendations for
reducing product attack surfaces. The system is tested, validated prior to completion. The customer will also receive full project
documentation and knowledge transfer to complete the process.

ProDeploy
ProDeploy provides remote software configuration and choice of hardware installation (onsite or guided). ProDeploy is great forcustomers who are price sensitive or willing to participate in some portion of the deployment to include providing remote accessto their network. The ProDeploy remote software implementation includes everything mentioned in ProDeploy Plus except it
does not include the added value, cybersecurity implementation and best practices.

Basic Deployment
Basic Deployment delivers worry-free professional installation by experienced technicians. This service is often sold toCompetency Enabled Partners who will have Dell do the hardware installation while they complete the software configuration.
Furthermore, Basic Deployment tends to be purchased by large enterprises who have smart technical staff. These companies
just need Dell to install the hardware and they will perform the software configuration. The last use case for Basic Deployment
is when paired with Factory Configuration services. The servers are pre-configured in the factory and the basic deployment
service will install the system into the rack to finalize the deployment.

Figure 43. ProDeploy Infrastructure Suite - Field services

Supplemental Deployment Services
Additional ways to expand scope or deploy for unique scenarios.

Table 54. Expand scope and transition
Expand scope and transition

Unique deployment scenarios

Two Host Adder (requires PD/PDP)"Custom" Service Engagement

Appendix D: Services

73

Table 54. Expand scope and transition (continued)
Expand scope and transition

Unique deployment scenarios

Additional Deployment Time (ADT) (Sold with or without PD/
PDP)

ProDeploy Add-on for HPC

Data Migration

ProDeploy Plus for Direct Liquid Cooling (DLC 3000)

Residency Services (onsite or remote)

ProDeploy for TELCO-ProDeploy FLEXTwo Host Adder (requires PD/PDP)
Deploying new storage, compute, or networking devices may require interconnection to other servers (also called hosts). The
Dell delivery team will set up four hosts per device as part of every ProDeploy service. For example, if the customer is buying
two storage arrays the ProDeploy service will automatically include connectivity of four hosts each (4x2=8 total hosts per
project since there are two devices). This supplemental “Two Host Adder” service provides for the configuration of additional
hosts above what is already provided as part of the ProDeploy service. In many cases, customers can work with us while we
set up the included hosts, so they may understand how to do the rest themselves. Always ask the customer how many hosts
are being connected and sell the host adder depending on the customer’s technology skillset. Note this service applies to theconnectivity of Dell devices not 3rd party devices.

Additional Deployment Services (ADT) - sold with or without PD/PDP
You can expand the scope of a ProDeploy engagement leveraging Additional Deployment Time (ADT). ADT will cover additionaltasks above the normal deliverables of the ProDeploy offers. ADT can also be used as a standalone service without ProDeploy.
SKUs are available for both Project Management and Technical Resource Expertise. SKUs are sold as blocks of four hours
remote or eight hours onsite. The delivery team can assist in scoping the number of hours required for additional tasks.

Data Migration Services
Migrating data sets is no easy task. Our experts use proven tools and process to streamline data migrations and avoid
compromising data. A customer project manager works with our experienced team of experts to create a migration plan. Data
migration is part of every technology upgrade, platform change, and shift to the cloud. You can rely on Dell data migration
services to perform a seamless transition.

Residency Services
Certified technical professionals act like an extension of your IT staff to enhance internal capabilities and resources andhelp you realize faster adoption and maximized ROI of new technology. Residency Services help customers transition to newcapabilities quickly by leveraging specific technology skill sets. Residency experts can provide post implementation management
and knowledge transfer that is related to a new technology acquisition or day-to-day operational management of the IT
infrastructure.
● Global experts available to serve in-person (onsite) or virtual (remote)● Engagements starting at 2 weeks with flexibility to adjust

Unique Deployment Scenarios
Custom Deployment Services
When a deployment is beyond the scope of the ProDeploy Infrastructure Suite, you can turn to the custom deployment services
team to address complex implementation scenarios and unique customer requirements. The Dell custom deployment team isstaffed with solution architects who assist with customer scoping calls to define the project and develop the statement ofwork. Custom services can handle a wide range of deployments that can be performed in the factory or onsite. All custom
engagement services are requested through SFDC.

74

Appendix D: Services

ProDeploy FLEXProDeploy Flex is a new service and a powerful tool for you to attach more services and improve revenue and margins. The
ProDeploy Flex modular offer allows sales teams to build and better tailor services by mixing factory and field delivery options.
You can also select special deployment scenarios without going to the custom order desk. FLEX is ideal for unique deployments
where ProDeploy or ProDeploy Plus are not an adequate answer to the customer needs.

Key features of ProDeploy FLEX●●●●Build deployment quotes using modular, selectable features for both hardware and software.
The system automatically scales pricing based on volume.
Ideal for customers who require NativeEdge Orchestrator or edge deployments
Ability to add deployment services to third-party networking devices

Deployment of HPC
High-Performance Computing (HPC) implementations require specialists that understand advanced feature sets. Dell deploys
the world's fastest systems and understands the nuances that make them perform. HPC deployments are most often scoped ascustom service engagements, however we can do smaller HPC clusters under 300 nodes using a standard ProDeploy SKU. Anystandard SKU for HPC deployment will be sold as one base SKU per cluster (ProDeploy for HPC Base) along with one ProDeploy
for HPC Add-on for each device in the cluster (server nodes and switches).
● Scope of ProDeploy for HPC: *Available as standard SKUs in the US and Canada. Custom Service would be required for allother regions.

Figure 44. Standard deliverables of ProDeploy for HPC

Appendix D: Services

75

Figure 45. Visual view of HPC deployment options to include hardware and software

DAY 2 - Automation Services with Ansible
Dell solutions are built as "automation ready" with integrated APIs (Application Programming Interfaces) to allow customers
to programmatically call actions on the product through code. Although Dell has published Anisble automation use cases,
some customers need additional assistance with GitOps. By the end of the service, the customer will have the foundational
components required to accelerate automation and understand how the programming works together: Day 1 and Day 2 use caseautomation scripts (ansible modules), CI/CD tool (Jenkins), and Version control (Git).

ProSupport Infrastructure Suite
ProSupport Infrastructure Suite is a set of support services that enable customers to build the solution that is right for
their organization. They choose support models that are based on how they use technology and where they want to allocate
resources. From the desktop to the data center, customers can address everyday IT challenges, such as unplanned downtime,
mission-critical needs, data and asset protection, support planning, resource allocation, software application management andmore. Optimize customer IT resources by choosing the right support model.

ProSupport Plus for Infrastructure
Service that caters to customers who require proactive, predictive, and personalized support for systems that manage
critical business applications and workloads. When customers purchase PowerEdge server, we recommend ProSupport Plus,
our proactive and preventative support service for business-critical systems. ProSupport Plus provides all the benefits of
ProSupport, including the following "Top five reasons to buy PSP".
1. Priority access to specialized support experts - immediate, advanced troubleshooting from an engineer that understands Dellinfrastructure solutions.
2. Mission Critical Support – when critical (Severity 1) support issues happen, the customer is assured that we will do all we
can to get them back up and running as quickly as possible.
3. Service Account Manager – a customer’s #1 support advocate, ensuring they get the best possible proactive and predictive
support experience.
4. Systems maintenance – on a semi-annual basis, we will keep a customer’s ProSupport Plus system(s) up to date by installing
the latest firmware, BIOS, and driver updates to improve performance and availability.
5. 3rd party software support – Dell is a customer’s single point of accountability for any eligible 3rd party software installed on
their ProSupport Plus system, whether they purchased the software from us or not.

76

Appendix D: Services

ProSupport for Infrastructure
Comprehensive 24x7 support for hardware and software - best for production, but not critical, workloads and applications. The
ProSupport service offers highly trained experts around the clock and around the globe to address IT needs. We help minimize
disruptions and maximize availability of PowerEdge server workloads with:
●
●
●
●
●
●
●
●
●
●
●

24x7 support through phone, chat and online
A central point of accountability for all hardware and software issues
Hypervisor, operating system and application support
Dell security advisories
Onsite response service levels 4 hour or Next Business Day options
Proactive issue detection with automated case creation
Predictive hardware anomaly detection
Incident Manager assigned for Severity 1 cases
Collaborative third-party support
Access to AIOps Platforms - (MyService360, TechDirect, and CloudIQ)
Consistent experience regardless of where customers are located or what language they speak.

Basic Hardware Support
Provides reactive hardware support during normal business hours, excluding local national holidays. No software support orsoftware related guidance. For improved levels of support choose ProSupport or ProSupport Plus.

Figure 46. ProSupport Enterprise Suite

Specialty Support Services
Optional specialty support services complement the ProSupport Infrastructure Suite to provide additional proficiencies that are
critical for modern data center operations.

Appendix D: Services

77

Hardware coverage add-ons to ProSupport● Keep Your Hard Drive (KYHD) and Keep Your Component (KYC): Normally if a device fails under warranty, Dell replaces
it using a one-for-one exchange process. KYHD / KYC gives you the option to retain your device. It provides full control
of sensitive data and minimizes security risk by letting you retain possession of failed drives / components when receiving
replacement parts without incurring additional cost.
● Onsite Diagnosis Service: Ideal for sites with non-technical staff. Dell field technician performs initial troubleshooting
diagnosis onsite and transfers to Dell remote engineers to resolve the issue.
● ProSupport Add-on for HPC: Sold as an add-on to a ProSupport service contract, the ProSupport Add-on for HPC
provides solution-aware support to cover the additional requirements that are required to maintain an HPC environment suchas:
○ Access to senior HPC experts○ Advanced HPC cluster assistance: performance, interoperability, and configuration○ Enhanced HPC solution level end-to-end support○ Remote pre-support engagement with HPC Specialists during ProDeploy implementation● ProSupport Add-on for Telco (Respond & Restore): An add-on service designed for the top 31 TELCO customers
globally, Respond & Restore provides direct access to Dell solution experts who specialize in TELCO carrier-grade support.
This add-on also provides a hardware uptime guarantee, meaning if a system fails, Dell will have it installed and operational
within 4 hours for Severity 1 issues. Dell incurs penalties and fees if SLAs are not met.

Supplemental Site-wide Expertise● Multivendor Support Service: Support your 3rd party devices as one service plan for servers, storage and networking(includes coverage for: Broadcom, Cisco, Fujitsu, HPE, Hitachi, Huawei, IBM, Lenovo, NetApp, Oracle, Quanta, SuperMicro &others).
● Technical Account Manager: Designated technology lead who monitors and manages performance and configuration of
specific technology sets.
● Designated Remote Support: Personalized support expert who manages all troubleshooting and resolution of IT assets

Services for large enterprises● ProSupport One for Data Center: ProSupport One for Data Center offers flexible site-wide support for large anddistributed data centers with more than 1,000 assets (combined total of server, storage, networking, etc.). This offering
is built on standard ProSupport features that leverage our global scale and are tailored to specific customer needs. While
not for everyone, this service option offers a truly unique solution for our largest customers with the most complex
environments.
○ Team of assigned Services Account Managers with remote or onsite options○ Assigned technical and field engineers who are trained on the customer’s environment and configurations○ On-demand reporting and recommendations enabled by ProSupport AIOps tools (MyService360, TechDirect & CloudIQ)○ Flexible onsite support and parts options that fit their operational model○ A tailored support plan and training for their operations staff● Logistics Online Inventory Solution (LOIS):Ideal for large organizations that have their own staff to support theirdata center. Dell offers a service called Logistics Online Inventory Solution which is an onsite parts locker that provides
self-maintainers with a local inventory of common replacement components. Having access to these parts lockers allows
the self-maintainer to replace a failed component immediately without delay. Each replacement part would automaticallyinitiate a replenishment of the parts inventory that is shipped next day or delivered onsite by Dell during a regular scheduledvisit (called Scheduled Onsite Service). As part of the LOIS system, customers can integrate their systems directly to Dell
TechDirect using APIs to help streamline the support management process.

End-of-Life Services● Post Standard Support (PSS): Extend service life beyond the initial seven years of ProSupport, adding up to five more
additional years of hardware coverage● Data Sanitization & Data Destruction: Renders data unrecoverable on repurposed or retired products, ensuring securityof sensitive data and enabling compliance and provides NIST compliant certification.
● Asset Recovery Services:Recycle, resale, and disposal of hardware. Helps you securely and responsibly retire IT assetsthat are no longer needed while protecting both your business and the planet.

78

Appendix D: Services

Consulting Services
Our expert consultants help customers transform faster, and quickly achieve business outcomes for the high value
workloads Dell PowerEdge systems can handle. From strategy to full-scale implementation, Dell Technologies Consulting canhelp determine how to perform IT, workforce, or application transformation. We use prescriptive approaches and provenmethodologies that are combined with portfolio and partner ecosystem of Dell Technologies to help achieve real businessoutcomes. We are here to help guide your next transformation that could address multi-cloud environments, businessapplications, DevOps, business resiliency, data center modernization, analytics, workforce collaboration, and user experiences.

Managed Services
Some customers prefer Dell to manage the complexity and risk of daily IT operations. Dell Managed Services utilizes proactive,
artificial intelligence to improve operations and modern automation. This helps customers realize desired business outcomesfrom their infrastructure investments. With these technologies, our experts run, update, and fine-tune customer environments.
You decide the service level requirements and we provide oversight of the environment. There are two types of managed
service offers. First the outsourcing model, or CAPEX model, where Dell manages customer owned assets using our people andtools. The second is the "as-a-Service" model, or OPEX model, which we call APEX. In this service, Dell owns all technology
and all the management of it. Many customers will have a blend of the two management types depending on the goals of theorganization.

Figure 47. Dell Managed Services● Managed Detection and Response (MDR): Dell Technologies Managed Detection and Response (MDR) is powered by
Secureworks Taegis XDR software platform. MDR is a managed service that secures the customer’s IT environment against
malicious actors and provides remediation if and when a threat is identified. When a customer purchases MDR, they will
receive the following features from our team:○ Dell badge resources○ Agent rollout assistance to help deploy the Secureworks Endpoint Agent.
○ 24x7 threat detection and investigation○ Up to 40 hrs per quarter of response and active remediation activities○ If the customer experiences a breach, we will provide up to 40 hrs per year of Cyber incident response initiation.
○ Quarterly reviews with the customer to review the data

Education Services
Build the IT skills required to influence the transformational outcomes of the business. Enable talent and empower teams withthe right skills to lead and perform transformational strategy that drives competitive advantage. Leverage the training andcertification required for real transformation.

Appendix D: Services

79Dell Technologies Education Services offers PowerEdge server training and certifications that are designed to help customers
achieve more from their hardware investment. The curriculum delivers the information and the practical, firsthand skills that
their team must confidently install, configure, manage, and troubleshoot Dell servers.
To learn more or register for a class today, see Education.Dell.com

Resources
Services for PowerEdge.

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Appendix D: Services