CALL FOR PAPERS62ndECTC

ELECTRONICCOMPONENTSANDTECHNOLOGYCONFERENCE

May 29 – June 1, 2012

San Diego, California

OPTOELECTRONICS
Papers are solicited on all topics pertaining to the design, development, and technology of packaging
active/passive, hybrid, integrated and nanoscale photonic components, devices, circuitry and systems
Topics of interest include:
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Optical Components for Computer-Com: Dense low-cost parallel optical transceivers; co-packaging of parallel opticalmodules with conventional ICs on MCMs; low-cost parallel fiber and waveguide optical coupling; massively parallel opticalinterconnects; board-level waveguides; optical backplanes; glass/polymer low cost optics/waveguides; active optical cables
Silicon Nano-Photonics Devices: Active and passive optical devices in silicon (such as, modulators, detectors, waveguides,switches, couplers); photonic circuits; hybrid lasers; monolithic and hybrid integration techniques; high-speed performance;energy efficiency; micro-nano optical interconnects; assembly, processing, testing, characterization, reliability, thermalmanagement.
Nano-Optics: Optical and physical properties, nano- and meta-materials, integration of nano- and conventional materials; highefficiency lasers; advanced packaging, assembly, test and reliability
High-Efficiency LEDs and High Power Lasers: Package and optical design, assembly methods and automation, thermal
management, reliability and aging effects, color temperature control, phosphors, volume manufacturing, high-power laser diodes,
bars / stacks, fiber coupled modules, high-power VCSELs and fiber lasers packaging technologies including-pump diodes, beamcombining, coupling, wavelength control.
Integrated Optical Sensors: On-chip and packaged biological, chemical, pressure, temperature, humidity sensors, integrated
spectrometer, MEMS sensors, sensor assembly utilizing optical fibers, waveguides, and free-space micro-optics.
Micro-optical System Integration and Photonic System-in-Package Technologies: Integrated optics and heterogeneous
integration, silicon and glass based interposer, optical vias; fiber optic connectors and hybrid integration, nano-photonics
packaging; novel interconnection technology and coupling.
Photonic Package Manufacturing Technologies: Low cost designs and cost reduction techniques, novel micro-optics,
assembly methodology, precision assembly of optical components and automation technology; Substrates and housing;advanced thermal management

You are invited to submit a 750-word abstract via the ECTC Website http://www.ectc.net
Abstract On-Line Submission opened 25 August 2011

(PLEASE SELECT OPTOELECTRONICS AS YOUR PRIMARY COMMITTEE FOR SUBMISSION)(You may also submit directly to the committee chairs below – please include mailing address, telephone number, FAX number and e-mail):
Chairman
Andrew Shapiro
Co-Chairman
Henning Schroeder
Co-Chair, Japan Shogo Ura
Co-Chair, Europe Michael Leers

JPLFraunhofer IZM
Kyoto Institute of Tech.
Fraunhofer ILT

aashapiro@aol.com
henning.schroeder@izm.fraunhofer.de
ura@kit.ac.jp
Michael.Leers@ilt.fraunhofer.de

Tel +1-818-393-7311
Tel + 49 30 46403 277
Tel: +81-75-724-7424
Tel: +49 241 8906 343

OPTOELECTRONICS TECHNICAL PROGRAM COMMITTEE
Yi-Jen Chan
ITRI, Taiwan
Soon Jang
Ficontec USA

Gee-Kung Chang
Georgia Tech
Harry G. Kellzi
Teledyne
Hiren Thacker
OracleFuad DoanyIBM Research
Masanobu Okayasu
OpnextPing Zhou
LDX Optronics, Inc.

Z. Rena HuangRensselaer Polytech.Inst.
Kannan Raj
OracleAbstracts Due: October 10, 2011

Masataka Ito
Ibiden USA R&D.
Stefan Weiss
Oclaro