3D Universal Optical Microscopes
Profilometer Series

Surface Roughness, Step Height, 3D Topography
Cracks, Defects, Slope Measurement,
Film Thickness, Sub Surface FeatureImpressive and Quick
3D Surface Profilometer5 Imaging Modes in 1 MicroscopeInterferometry, Confocal, Dark Field, Bright Field, Variable Focus
The UP Series provides non-contact surface measurements from nano
to micro and combines five imaging modes in one head to characterize
all types of surfaces. One click causes the profilometer to switch between
the different imaging modes automatically.

Fast Scanning Speed
High pixel colored images

The profiler comes with the latest generation cameras that allow
scanning the surface with high speed. Our camera speed enables
coverage of large areas and rapid stitching.

Fully Automatic

Automatic reporting, no need to be an expert
The sample surface is scanned with one click of a button,
and an automatic test report in standard format is createdwith ease.

User-Friendly Platform

A cost-effective solution for your industry
The unique platform design comes with high-resolution
encoders and open platform architecture. In addition, thecross roller XY stage allows for high precision measurements.

Page 2

3D Profilometry Without Compromise
For All Applications
Precise surface analysis in industry and research is essential
to ensure optimal performance of materials and components

TransparentMaterials• Glasses• Wafers• Contact lenses• Optics elements

2D Materials• Film Thickness• Grain size
• Defects• Microstructure

Smooth and RoughCoatings••••

Hard coatings
Roughness
Scratch analysis
Porosity

Dark and Shiny
Surfaces• Mirror surface• 3D waviness• Step height• Crack analysis

Flat and Non-flat Surfaces• Tooling• Additivemanufacturing• Topography• Volumes
Page 3

Bright. Dark. 3D

Universal Profilometer Unlike Any Other

Bright Field
High speed andresolution

Dark Field
Magnifies cracks
and defects

Page 4

5 Imaging Modesin 1 Microscope
3D Optical Surface Metrology

1White Light Interferometer (WLI)

2

Confocal Microscopy Mode

3

Bright Field Mode

Highest Z resolution. A big plus for flat,nm height measurements.

Highest lateral resolution. A big plus fortransparent, translucent, steep slopes,
multi-layer or rough samples

45Dark Field Mode

Highest contrast imaging. Detects cracks,defects, and failures with high resolutions
not possible with any optical technique.

Focus Variation

Measures the shape and creates unifocus
images of large areas at rapid speed.

Colored 2D images at high speed

Page 5

Automatic Image Stitching
The UP Series acquires a real color image without
any sample movement.
Automatic image stitching is included in oursoftware package, ensuring the acquisition ofbigger images.
This mode offers the automated imaging oflarge surfaces at high magnifications.

Unlimitedin XY

1000 mm

Available inAll 5 Modes

Page 6

3D Microscope For Multiple Applications
The Most Powerful Package of Analysis On The MarketCoinVickers Hardness

Ink on paper

Z calibration sample

Wafer bumps

Micro fluid chip

Via and Features on Wafer

Turning surface

Page 7

Confocal
Fastest area scanning confocal technique in the market
Nipkow Confocal Microscopy (Lambda Head)
represents the best confocal technique.
Rather than a single pinhole, the Lambda head
has a thousand pinholes arranged on an opaquedisk. These several simultaneously present
pinholes that scan the sample and allow highspeed 3D image creation with nm resolution.
Our Lambda Confocal head offers the best inspeed and resolution than any other confocal
techniques such as point confocal to scansurface using XY stage or scanning XY mirrors
to move the pinhole or using the pseudo digitalconfocal method.
Key Features:•Our Confocal technique uses the highest
NA objectives and optically produces thehighest lateral resolution.

•Confocal microscopy can retrieve data fromsteep slopes, 72° vs. 44°, from interferometry.

•No limitation on surface roughness andsurface reflectivity•

Colored images•

Find features on tough samples
transparent samples very easily.

Page 8orInterferometryHighest Z Resolution In Non-Contact Profilometry
White light interferometry (WLI) is an opticalsurface topography measurement techniquethat uses scanning interferometry to generate
2D and 3D models of surface height.
Light reflects from the reference mirror, andthe sample is recombined at the beam splitterto create interferograms.
Key Features:•

One of the fastest cameras (250 FPS+) usedfor WLI in the market•

Highest Z resolution, sub-nanometer•

Z resolution independent of magnification•

User-selectable four-color LED lightsource(white,red-630nm,green530nm,
andblue-460nm)
improves
lateral resolution and optical coherence
length (blue light provides higher lateralresolution)•Page 9

150-mm Z-axis
with advanced encoder

UP module

Optional coating thickness
by spectral reflectance

Optional AFM

Tilt table
XY Stage

Page 5

Platforms
Profilometer Series

UP-5000

UP-3000

UP-2000

300 x 300 x 150mm

150 x 200 x 150mm

150 x 200 x 150
mm

Bright and Dark Field
Spinning Disk Confocal
White Light Interferometry
Variable Focus Imaging
3D Image Stitching
Spectral Reflectance Profilometry
AFM
Raman Microscope
XYZ Stage** more custom options are available

Page 11

3D Profilometry for
Inspection of Surfaces
Colored Images
Measuring the 3D surface topography has become increasingly important
in industrial automation, particularly in in-situ product inspection.
Our 3D optical profilers provide many benefits over other measurement
methods used for non-contact inspection. These benefits range fromrapid measurement speeds and custom analysis to completely automatedmeasurements and non-destructive inspection.

Software
A complete software package
is provided with all UP Series
instruments.
Imaging analysis• Roughness• 3D imaging• Volume of wear or holes• Step height• Additional FeaturesPage 13

Analysis Package and InternationalStandards
The UP modules series come with several test-specific standards for data traceability
and quick platform checkup. The instruments also come with standard test recipes toensure normalized testing.
•Real time imaging of 3D surface topography.

•

Overlay color and intensity images on 3D topography.

•

Data acquisition artifact processing - outliers, local defects.

•Roughness and surface texture - with the latest ISO and national standards.

•Extraction and analysis regions of interest (Page viewer for fast navigation.)•Modules for advanced surface texture analysis, contour analysis, grains, andparticles analysis, 3D Fourier analysis, image
co-localization, statistics, and more.

•Fast, automated, traceable surface analysis report creation•

Pass/fail criteria with green/red traffic lights can be specified for any parameter.

•Series of measurements can be analyzed automatically using templates and minidocs (common sequences of analysis steps).

•Comprehensive data export: PDF, RTF, screen andprint quality bitmaps, Excel compatible numericalresults for compatibility with quality
management and other systems.

•Integrates with Mountains Mapsoftware.

The UP instruments comply with manydifferent testing standards ISO 25178,EUR15178, ISO 16610, and ISO 4287.

Page 14

Specifications

Interferometry Objectives
2.5X

5X

10X

20X

50X

100X

Numerical Aperture (NA)

0.075

0.13

0.3

0.4

0.55

0.7

Working Distance (mm)

10.3

9.3

7.4

4.7

3.4

2.06910 x 5180

3460 x 2590

1730 x 1300

860 x 650

350 x 260

170 x 130

1.87

1.08

0.47

0.35

0.26

0.20

FOV (um)
Optical Resolution (L&S 460 nm) (um)Vertical Resolution

Better than 0.01nm

Vertical RMS repeatability RMS

0.01nm

Confocal, Bright Field, and Dark Field Objectives
Standard Working DistanceLong Working Distance

5X

10X

20X

50X

100X

150X

20X

50X

100X

Numerical Aperture (NA)

0.15

0.3

0.45

0.8

0.9

0.95

0.4

0.6

0.8

Working Distance (mm)

23.5

17.5

4.5

1.0

1.0

0.3

1911

4.5

860 x 650

350 x 260

170 x 130120 x 90

860 x 650

350 x 260

170 x 130

Field of view (um)3460 x 2590 1730 x 1300

Optical Resolution (L&S 460nm)(um)**

0.94

0.47

0.31

0.18

0.16

0.15

0.35

0.23

0.18

Vertical Resolution (nm)

72.0

18.0

8.0

2.5

2.0

1.8

10.1

4.5

2.5

Page 15

Rtec-Instruments Inc
Global headquarters
1810 Oakland Road, Ste B
San Jose, CA, 95131, USA +1 408 708 9226
info@rtec-instruments.com
Rtec-Instruments Office
Agent / distributor

Rtec-Instruments, CN
Asia-Pacific
2nd Floor, Building 3, 69 Olympic St
Jianye District, Nanjing, China, 210019
 +86 25 83210072, +86 18013892749
info@rtec-instruments.cn
Rtec-Instruments, JPJapanTokatsu Techno Plaza, Rm 409
5-4-6 Kashiwanoha, Kashiwa-shi, Chiba, Japan, 227-0882
 +81-50-5896-9916
info.jp@rtec-instruments.com

www.rtec-instruments.com

Profilometers-2022-A-01A-EN

2022 Rtec-Instruments Product Catalogue.
All rights reserved.
All specifications are typical and subject to change without notice.

Rtec-Instruments SA
Europe, Africa and Middle-East
Rue Galilée 6,
1400 Yverdon-les-Bains, Switzerland
 +41 24 552 02 60
info.eu@rtec-instruments.com