Eco Products

Reducing the Environmental Impact of Products (Part 1)
We are introducing Life Cycle Assessment for all new products we develop,and designing products to minimize environmental impact.

TEL Stance on Eco Products

Organization in TEL

TEL has worked to incorporate suggestions from customers in

TEL is defining its actions and priorities in terms of reducing theits products, and has promoted reduction of environmental burden

environmental burden of its equipment, and is working to improve

during semiconductor production and elimination of hazardous sub-environmental performance.

stances from the materials used to make equipment. We respect theRegarding Eco Products, the Eco Design Working Group hascustomer’s needs to know about environmental impact of products

been established under the Product EHS Technical Committee (seethroughout the life cycle, and work as quickly as possible to collectpage 21) and is now functioning. This working group started fromdata relating to these impacts—from the manufacturing stage

creating an “EHS road map” for equipment, and is working to apply it

through to disposal. As a result, TEL has become an industry leader

to achieve energy and resource conservation. In addition, in eachin terms of accumulating product LCA data for use when designingbusiness unit, we are gathering LCA data on new equipment beingproducts.

developed and learning about the environmental impact, and are reflecting those findings in equipment improvements and next-genera-

Eco Product Concept

tion models.
Due to the need to consider the environmental impact of the raw

Life
Cycle
Assessment(LCA)
Lead-free
EcoProducts

materials we procure for equipment production, we established aGreen Procurement Working Group, which has clarified TEL procureResource
conservation

ment standards. This working group is investigating the environmental efforts of suppliers and contractors, and where necessary, supporting them by offering environmental education. We have also established a Lead-Free Task Team and aim to implement lead-freeGreenprocurement

Energyconservation

policies starting with products produced in 2006.

Major Efforts in Each Business Unit—A Sampling of Targets and Results
Business Unit

Results

Targets for FY 2004 and beyond

Etch Systems

Reduce power consumption

Reduced power consumption of chillers by 40%

Reduce equipment power consumption by 3%

Test SystemsReduce power consumption

300 mm equipment: 10% below 1999 levels

300 mm equipment: 50% below 1999 levels

Single Wafer Deposition

Reduce power consumption

300 mm equipment: 40% below 1999 levels

300 mm equipment: 50% below 1999 levels

FPD Systems

Reduce chemicals used

Developed equipment to
reduce liquid chemical consumption

Continue efforts

Reduce amount ofliquid chemicals used

UW equipment: 64.4% reduction

Continue efforts

Reduce amount ofpure water used

UW equipment: 28.2% reduction

Continue efforts

Reduce use of liquidchemicals (resist)

300 mm equipment: 35% below 1999 levels

Consider ways to reduce amounts ofother liquid chemicals used

Reduce power consumption

300 mm equipment: 5% below 1999 levels

300 mm equipment: 20% below 1999 levels

Conduct productassessments (preliminary)

After trials, start full operation

Continue operation, reduce environmental impact

Reduce equipment footprint

300 mm equipment: compared to existing ␣-301 model,
reduced by about 10% in ␣-303i

Implement when developing new models

Cleaning Systems

Clean Track

Thermal ProcessingSystems

11FY 2003 Target

TOKYO ELECTRON Environmental Sustainability Report 2003

with an existing model, the ␣-303i.

Life Cycle Assessment (LCA)TEL has launched efforts to conduct LCA as a way to objectively

As shown in the graph, we learned that for the existing model,

evaluate the environmental impact of equipment, using common cri-the consumable supplies accounted for the vast majority of the envir-

teria that we can share with our customers.

onmental burden incurred during operation of the equipment. Of this,To begin with, we started by establishing common methodolo-

the consumption associated with the quartz chamber and non-pro-gies for whole TEL and getting a general grasp of the environmental

duction wafers, known as “dummy wafers,” was considerable. In

impact of equipment, and then implementing an LCA for the major

comparison, the TELFORMULA has a completely revised quartz

models in each business unit. We compared new and old models us-chamber structure and cleaning methodology introduced in-situ dry

ing LCA methods and confirmed that the overall environmental im-cleaning that uses the latest technology to replace wet cleaning. As apact lower in new models. Now we are applying complete LCAs onresult, we were not only able to reduce the quanity of dummy wafers,

all newly-developed equipment, and making continuous improve-

but this also effected a large improvement in the life of the quartz

ments of environmental performance by feeding the findings of as-chamber. At the same time we improved equipment specs like thesessments back into new product development.

utilization rate and process performance, we were able to significantly reduce the environmental impact.

Product Life Cycle Assessment
Input

Life cycle

OutputResource use
Emissions to air

EnergyNaturalresources
Renewable
resources

Production ofraw materials

Emissions to water
Solid waste

Manufacturing ofproducts andcomponents

Recyclable
materials

Logistics,
transportation

Other emissions
to the environment

UseRecycling
Main areas of TEL
business activities

Recycling
DisposalReuse, recycling

LCA Case Study (Thermal Processing System)
As the silicon wafer size used in semiconductor production continues to grow, the production equipment itself also grows larger.
Also, as the market demands semiconductors with increasingly

␣-303i (existing model)

TELFORMULA (new model)

Comparison of Energy Consumption (CO2 Equivalent) during
Operation Using Same RUN* Coefficient(t-CO2)
2,500

␣-303i (existing model)
TELFORMULA (new model)
1,994.1

2,000

higher performance, the processes for production are also becoming
more complex, and various additional features are also demanded ofthe production equipment. In this context, if equipment is not designed with the environment in mind, there will be a general tendency for increasingly severe environmental impact. LCAs implemented to date have shown us that more than 90% of the environmental
burden during the entire life cycle of our equipment occurs during
operation of the equipment.

1,5001,217.4
1,000541.4

500 463.1

0259.5 215.6
96.9 43.5 72.2
Electricity

N2Coolantwater

36.5 8.7 33.4 1.6
2.3
Exhaust Consumables Dry air Process
gases

44.1 40.6

Total*RUN: Refers to the series of steps in one cycle of process implementation ofequipment, including heating, wafer input, processing, and wafer removal.

Below we introduce an example of LCA implementation by comparing the new model TELFORMULA (Thermal Processing System)TOKYO ELECTRON Environmental Sustainability Report 2003

12

Eco Products

Reducing the Environmental Impact of Products (Part 2)We are designing semiconductor production equipment to conserve resources and reduce hazardous
substances, and have ongoing efforts to minimize the environmental burden that arises during use.

Approach Lead-Free
Lead can cause nervous system disorders if it accumulates inthese directives, in order to be proactive in preventing pollution, TEL

the body. Under the normal conditions of equipment use, there is nois promoting its own voluntary and systematic efforts to go lead-free.

concern about injury arising from lead. However, the potential exists

TEL has begun to consider the introduction of lead-free solder

for impact on human health through the pollution of ecosystems if

for products manufactured by TEL Group companies. We are also in-acid rain falls on disposed equipment and waste and then seeps intovestigating the status of solder use by our suppliers and urging themthe environment. The European Union’s WEEE Directive*1 and RoHS

to cooperate in this initiative.

Directive*2 ban the use of hazardous substances such as mercury,*1WEEE : Waste Electrical and Electronic Equipment*2RoHS : Restriction of the use of Hazardous Substance in electrical andelectronic equipment

cadmium and lead in electrical equipment, starting in June 2006. Although semiconductor production equipment does not fall under
Lead-Free Implementation PlanFY 2004

Action Plan
Apr.

July

Oct.

FY 2005
Jan.

Apr.

July

Oct.

FY 2006
Jan.

Apr.

July

Oct.

Establish Lead-Free Task Team, start work
In-house awareness-raising
Supplier survey, technical cooperation, action plan
Consider technologies and materials used
Evaluate, summarize the potential for lead-free
Prepare for mass production
Trial production and evaluation of boards and assemblies(practical training about soldering)
Mass production

Starting January 2006

Developing Coating Methods
for reducing Photoresist
The developing process during semiconductor production uses an organic photosensitive chemical, known as photoresist, for coating the wafer surface. This photoresist accounts for a relatively large portion of the equipment runningcosts. For that reason, and also from the perspective of saving
resources, it would be valuable to reduce the amounts used.
TEL has developed a prewet coating method that reduces the amount of photoresist used to less than one-fourth ofwhat is conventionally used, by applying a solvent immediately before applying the photoresist, improving the bondwith the wafer. This method is being used in the major coater/developer line, the CLEAN TRACK ACT series. Today, ourcustomers around the world are using this process.
The rising performance of semiconductors requires larger
dies. In order to economically produce equal number of dies perwafer, wafer sizes increases. Because of this, TEL will continue
with its efforts to find ways to reduce the amount of photoresist
used and save resources in other ways.

13TOKYO ELECTRON Environmental Sustainability Report 2003Coater/Developer(CLEAN TRACK ACT 12)

Prewet Coating Method

Reducing the Use of CAR Photoresist*1
1.0
0.8
0.6
0.4
0.2
01.00
(Value of 1 represents conventional coating methods)
0.37
0.13
Conventional coating methods

RRC coating*2

Super RRC coating*1Chemically amplified photoresist for fine processing that has been popular in recent years.
*2Acronym for “Reduce Resist Consumption.”Jan.