The 15th International
Heat Transfer Conference

Kyoto International Conference Center
August 10-15, 2014, Kyoto, Japan
http://www.ihtc-15.org/index.html
info@ihtc-15.org
Organized byThe Heat Transfer Society of Japan
Science Council of Japan

Thermal Science
Meeting Societal Challenges
We invite forward-looking scientists, engineers, andresearchers from all over the world to attend the FifteenthInternational Heat Transfer Conference (IHTC-15). In
addition to exploring the frontier of traditional researchareas, we ask an important question: how can we better
serve society when facing major difficult issues such assustainable development, healthy ageing, sufficient foodfor all, and economic growth? The primary answer is that
we must actively develop scientific and technologicalsolutions. To do this, we need to clarify and reshape ourgoals for the future, and start to formulate aninterdisciplinary framework for collaboration amongcolleagues active across a wider range of physical, life,and information sciences.
IHTC-15 will provide every participant with a unique
opportunity to exchange state-of-the-art knowledge andenjoy extensive discussions throughout the conference
period. We hope that IHTC-15 will magnify the scope ofcontributions made by the international community ofthermal science and engineering professionals for thebenefit and welfare of societies around the world.

Special Features of IHTC-15
 Oral presentations only
All contributed papers are to be presented in parallel oral
sessions.

 IHTC Digital Library (IDL)
Under the auspices of
The Assembly for International Heat Transfer
Conferences (AIHTC)

Supported byInternational Centre for Heat and Mass Transfer
The Japan Society of Mechanical Engineers
The Society of Chemical Engineers, Japan

The AIHTC and Begell House have agreed to establish
the IHTC Digital Library (IDL). The IDL is an online
archival library featuring an interactive web interface andadvanced search engine for the use of active researchersand engineers. It will preserve the past and future
Proceedings of the International Heat Transfer
Conferences under the auspices of the AIHTC. Thus, allpresented papers will be uploaded and included in the IDL
after IHTC-15.

 Awards
The following memorial awards/medals will be bestowed,
and memorial lectures will be presented:
The William Begell Medal
The Max Jakob Memorial Award
The Luikov Medal
The Nukiyama Memorial Award

 Invited plenary lecture“Science of Scientific Advice”
Hiroyuki Yoshikawa
Director, Center for Research andDevelopment Strategy, Japan Scienceand Technology Agency
Past President of the University of Tokyoand the International Council of Science Panel discussion“The Role of Thermal Science in Meeting SocietalChallenges”
Organizer: Nobuhide Kasagi

Kyoto
Since Kyoto was the capital of Japan for more than one
thousand years, from 794 to 1868, it is the most historicand attractive city in Japan. Seventeen World Cultural
Heritage Sites designated by UNESCO are Kyoto’s crownjewels, inspiring visitors and residents alike.

Paper Submission

Executive Committee

Abstract submission: Abstracts of papers for possible
presentation at IHTC-15 must be submitted online via theIHTC-15 web page. The deadline is August 31, 2013.
Notice of abstract acceptance will be sent by September
30, 2013.
After an abstract is accepted, the full-length manuscript
must be submitted by the specified due date. It will thenread by reviewers assigned by regional International
Scientific Committee (ISC) members. The copyrighttransfer form must be filled out when the full-length
manuscript is accepted, prior to submission of themanuscript in its final form.

H. Yoshida, Chairman, Kyoto UniversityT. Kunugi, Vice Chairman, Kyoto University
H. Iwai, Secretary General, Kyoto University
H. Asano, T. Chikahisa, Y. Fukuyama, Y. Hagiwara,
E. Hihara, M. Hirota, K. Hishida, K. Inaoka, M. Ishizuka,
Y. Itaya, T. Kawanami, S. Maruyama, M. Matsumoto,
R. Matsumoto, H. Minagawa, K. Nakabe, K. Nishida,
Y. Oda, T. Ohara, M. Saito, M. Shibahara, K. Suga,
H. Suzuki, M. Tagawa, H. Takamatsu, N. Takenaka,
K. Tatsumi, H. Umekawa, Y. Yamaguchi, T. Yokomine

Registration

S. Maruyama, Chairman, Tohoku University
Y. Takata, Vice Chairman, Kyushu University
A. Komiya, Secretary, Tohoku University
M. Kohno, Kyushu University
S. Momoki, Nagasaki University
Australia (+ New Zealand, Indonesia, Malaysia,
Singapore): S. Armfield, J. A. Reizes, Brazil (+ Other
South American countries NSE): L. F. Milanez, H. R. B.
Orlande, Canada: P. H. Oosthuizen, S. Coulombe,China: X. Zhang, C.-F. Ma, France (+ African countries
NSE): D. Maillet, S. Volz, Germany (+ Austria):
S. Kabelac, U. Gross, India (+ Other South Asiancountries NSE): R. B. Grover, S. S. Murthy, Israel:G. Hetsroni, N. Brauner, Italy (+ Spain): G. P. Celata,M. Cumo, Japan (+ Pakistan, Other East Asian countries
NSE): K. Hanamura, Y. Nagasaka, Korea: S. J. Kim, G.-C.
Park, Portugal: P. Coelho, V. A. F. Costa, Russia (+Ukraine, Republic of Belarus, Moldova, Georgia, Armenia,
Azerbaijan): A. I. Leontiev, L. A. Dombrovsky, South
Africa: C.G. du Toit, J. P. Meyer, Switzerland:
D. Poulikakos, J. R. Thome, The Netherlands (+ Benelux
countries and Scandinavia): T. H. van der Meer, A. A. Van
Steenhoven, UK (+ Ireland, Greece, Turkey, Egypt, OtherMiddle East countries NSE, Serbia, Croatia, Slovenia,
Bosnia and other Balkan countries, Estonia, Latvia andLithuania, Czech republic and Slovakia, Hungary,
Romania, Poland, Bulgaria and Albania): A. Briggs, G. F.
Hewitt, USA (+ Mexico, Other Central Americancountries): M. Jensen, M. S. El-Genk

There will be three registration categories:
Regular, Student, and Accompanying Person.
AdvanceOn or before
30 June, 2014

Standard/On-site
On or after
1 July, 2014

Regular70,000 JPY80,000 JPY

Student

30,000 JPY

40,000 JPY

Accompanying Person

10,000 JPY

10,000 JPY

 The Regular fee includes receptions, lunches, break
refreshments and banquet.
 At least one Regular registration is required for each paper.
 One Regular registration covers only one paper.

Important Dates
Abstract submission deadline: August 31, 2013
Notification of abstract acceptance: September 30, 2013
Full paper submission deadline: November 30, 2013
Notification of full paper acceptance: February 28, 2014
Submission of final manuscript: May 31, 2014

Organizing Committee
N. Kasagi, Chairman, Japan Sci. & Tech. Agency
H. Yoshida, Vice Chairman, Kyoto University
S. Maruyama, Vice Chairman, Tohoku University
K. Fujioka, Y. Hisazumi, M. Ishizuka, I. Kataoka,
M. Katsuta, M. Kawaji, T. Makino, T. Miyauchi,
M. Monde, H. Nakagome, A. Nakayama, K. Okazaki,
M. Ozawa, K. Takeishi, A. Takimoto, K. Tanishita,
T. Tsuji, Y. Utaka, Y. Yamada, S. Yokobori

International Scientific Committee

N.B. NSE = not specified elsewhere

Keywords
Classification and Keywords


Fundamentals

Thermodynamics
ThermochemistryNew materialsThermophysical properties

Methodology

Measurement and instrumentation
Numerical simulation and supercomputing
Computational methods
Nano/Micro-scale measurement and simulation
Microscopic measurement
Mass spectrometry

Heat Transfer Processes

Molecular transport
Conduction
Convection
Condensation
Porous media
Radiation
Combustion
MHD and plasma
Cryogenics
Optimization and Control

Inverse problems
Optimal theory
Optimal control


Heat transfer enhancement
Nonlinear thermal fluid phenomena

Energy Utilization

Cycle innovation
Energy efficiency
Renewable energy
Solar energy
Fuel cells
Gas turbines
IC engines
Photon, phonon, and electron transport
Turbulent transport
Two-phase/Multiphase flow
Boiling and evaporation
Spraying and atomization
Adsorption and desorption
Mass transfer and drying
Electrochemical transport

Energy conversion and storage
Hydrogen and energy carriers
Geothermal energy
Energy and environmental systems
Nuclear energy
Carbon emission mitigation

Equipment and Manufacturing

Heat exchangers
Heat pipes
Cogeneration
Thermal storage
Thermal insulation
NEMS/MEMS
Manufacturing

Thermoelectric devices
Air conditioning and refrigeration
Cryogenic equipment
Bio and medical applications
Electronic equipment cooling
Material and food processing
Thermal management