16th-18th April 2024 in Hamburg, Germany

CineMaxx Dammtor, Hamburg
April 16th - 18th, 2024

More information atsmartsystemsintegration.com &apcm-europe.eu

We thank our Sponsors!

Jointly organized by16th-18th April 2024 in Hamburg, Germany

Conference program – Tuesday, 16th April 2024
Pre-Programme
09:00 – 12:00

EPoSS Pre-Event
Meeting of the EPoSS Working groups

12:30 – 13:30

Registration open

Registration open
Opening Session
Chaired by Elisabeth Steimetz and Christian Irmscher

13:30 – 15:00
13:30

Opening & Welcome
Stefan Finkbeiner, Harald Kuhn, and Holger Kapels

13:50

Jari Kinaret, Executive Director, Chips Joint Undertaking
Chips JU: current and planned activities

14:15

Lars Reger, Executive Vice President and Chief Technology Officer NXP
Smart connected systems – Enabling a World that Anticipates and Automates

14:40

Q&A

15:00 – 15:45
15:45 – 16:30
16:45 – 17:30

Coffee break
Poster & Exhibitor Pitches & Awards 2023
Exhibitor pitches: Chaired by Antonio Lionetto and Thomas Hammer
Poster pitches: Chaired by Luis Fonseca and Jean-Philippe Polizzi

17:30 – 19:30

Poster Session

Exhibitor pitches
OrderCompany / Institution1Tohoku University, Micro System Integration Center

2Credo Technologies

3Plan Optik AG

4Verification Technology Germany GmbH

5Tyndall National Institute

6SQL-Projekt AG

7

Forschungsfabrik Mikroelektronik Deutschland (FMD)

8Fraunhofer ENAS

9Bilal Mahmood Computer Devices TR

Jointly organized by16th-18th April 2024 in Hamburg, Germany

Poster pitches
NrPresenter

Institution /Company

1

1KarmanFrances Raj
George Maria
SelvamFraunhofer ENAS

PRELIMINARY INVESTIGATION OF USINGPERMINEX RESIST FOR LOW
TEMPERATURE ADHESIVE BONDING

12GeorgBrunnhofer

AVL List GmbH

Proof-of-Concept of a combined Smart
Illuminance and Precipitation Sensor

13

Paddy French

TU Delft

14

Pierre Gasnier

Univ. Grenoble Alpes,
CEA-LETI

15Thomas Lisec

Fraunhofer ISIT

26Frank Henkel

IMST GmbH27

Eoin Ahern

Tyndall NationalInstitute28

StefanKaranovic

AVL List GmbH3

9Alper Şişman,Alperen Yücel

Delft University ofTechnology (TU Delft)/ Netherlands

Saw Based Biosensor for Cell Growth Analysis

310David Araújo

INL - International
Iberian Nanotechnology
Laboratory

A flexible and low-power IoT controller for agrifood field sensing applications

311Marieke StapfTU Bergakademie
Freiberg, Institute forElectronic and Sensor
Materials

Integration of Lignin Hydrogel on Suspended
Gate FET Structures for a New Type ofChemical Sensor

311Christopher
Bickmann

TechnischeUniversität Chemnitz

312

Alessandra
RinaldiTyndall National
Institute, University
College Cork

313

René
Gastmeier

Coderitter GmbH

314

Marc Rensing

Tyndall IE

315

Mike Hayes

edacentrum GmbH

316

Mathieu
Guerin

IM2NP

517

Stefan Bosse

Universität Bremen

518

Paul Fourcade

CEA LETI

519

YousefAlnaser

Fraunhofer ENAS

TrackTitle

A lamb wave based liquid sensor forbiomedical applications
Magnetoelectric Energy Harvester and its
Power Management Circuit to Regulate Indoor
Air Quality
Enabling Innovative Smart System
Components with Wafer-Level Integrated
PowderMEMS Micromagnets
Efficient System-aware Development Strategy
for Security-relevant Analog Communication
IPs in Smart Systems
Power Optimization of a Photovoltaic Energy
driven Inter-modal Dry Container tracking
system via a Simulation Tool
FLOW RATE MEASUREMENT SENSORSYSTEM ENABLED BY ADDITIVEMANUFACTURING OF MAGNETIC
MATERIALS

Evaluation of Thin Pd Layers for a Sensor
System to Monitoring Anode-Side Hydrogen
Concentration in a Fuel Cell
Assessing Latency Cascades: Quantify Timeto-Respond Dynamics in Human-RobotCollaboration for Speed and Separation
Monitoring
Development and Testing of a Modular IoTDevice for Industrial Condition Monitoring
Applications
MICRO TRANSFER PRINTING IN SUPPORTOF CHIPLET OPEN ACCESS SERVICES
OFFERED THROUGH EUROPRACTICELONG LIFE POWER PLATFORMS FOR
INTERNET OF THINGSEMBEDDED NGD ALGORITHM FOR LOW
POWER REAL-TIME SIGNAL ANTICIPATION
Virtualization and Distributed Machine
Learning for Material-integrated Embedded
Sensor Networks: Mastering the Challenges
with a Holistic Principle
Autonomous, Connected and AI-embedded
Multi-Sensor System for Wildlife Monitoring
EFFICIENT IMPLEMENTATION OF
THRESHOLD-BASED VNG DEMOSAICINGWITH REDUCED CALCULATIONSJointly organized by16th-18th April 2024 in Hamburg, Germany

520Ahmed
Shaaban

521Marcus
Stiemer, Sven
Lange

522

Inessa Seifert

523

LU MINSHAN

524

Jinsheng Ji

Infineon Technologies
AG Munich

RESONATE-AND-FIRE SPIKING NEURONSFOR TARGET DETECTION AND HANDGESTURE RECOGNITION: A HYBRIDAPPROACH

Fraunhofer ENAS

Enhancing Information Extraction in EMC
Measurements through Artificial Intelligence

VDI-VDE IT,
EPoSS e.V.
Nanyang
TechnologicalUniversityNanyang
TechnologicalUniversity

Towards a roadmap for Edge AI
LIDAR-ASSISTED SELF-SUPERVISING
RADAR IMAGE ENHANCEMENT MODEL
Towards Robust Partial Discharge Detection
and Classification Under Low Signal-to-noise
Ratio Environment

Regular Posters
Track

Presenter

CompanyTitle

1

Mario Gschwandl

Ottronic E-Systems

1

Shaista Andleeb

Fraunhofer ENAS

1

Dominic Richter

Fraunhofer ENAS / TU
Chemnitz

1

Didier Floriot

united monolithic
semiconductors

2

Carsten Brockmann

Fraunhofer-IZM

2

Tobias Jäckel

Fraunhofer ENAS / TU
Chemnitz

2Piotr Kowalczewski

XTPL SA

3

Luca Bongiovanni

3

Brendan O'Flynn

Ideas and motion s.r.l.
Tyndall NationalInstitute, University
College Cork

3

Jorge Velasco

CIDAUT

3Giancarlo Degli
EspostiOrchestra srl

3Meghana
Vishwanatha

Fraunhofer ENAS

4Ganix Lasa

Mondragon GOI Eskola
Politeknikoa JMAS.Coop

5

Edgar Luhulima,
Filip Sabo

TU/e University ofTechnology Eindhoven

Towards Digitizing the Harsh Environment by a
Novel Robust and Reliable IIoT SensorPlatform
DESIGN AND MODELING OF MESOSCALE
POLYMER BASED ACOUSTIC LENSES FORMINIATURIZED ULTRASONICTRANSDUCERS
Plasma activated bonding of theheterogeneous material combinations
LiTaO3/Si and LiTaO3/SiO2
SMART3 – A FO-WLP platform for
Heterogeneous integration applied to mixed
RF Digital Front-End
HARDWARE-SOFTWARE-CODESIGNMETHODOLOGY FOR ENERGY EFFICIENT
IOT DEVICES
Investigations on low-temperaturethermocompression bonding of passivatedaluminum for enhanced wafer-level packaging
and heterogeneous integration
High-Resolution Additive Manufacturing for
Reliable and Sustainable Smart Systems
Smart city pilots
SAFETYBOT - SAFETY SYSTEMS FORCOLLABORATIVE ROBOTICS IN INDUSTRYVEHICLE DETECTION, CLASSIFICATION
AND TRACKING IN URBANENVIRONMENTS USING COMPUTERVISIONAI on the EDGE for real time monitoring ofperformance drifting in tool machines
Object detection using Capacitive
Micromachined UltrasonicTransducers(CMUTs)
Human-Centered Industry: Integrating Industry
5.0 Principles and Inclusive Design for
Sustainable Innovation
MULTIMODAL SENSOR AND IMAGE
PROCESSING WITH DIGITALOSCILLATORY NEURAL NETWORKS

Jointly organized by16th-18th April 2024 in Hamburg, Germany

Conference program – Wednesday, 17th April 2024
09:00 – 10:00
09:00
09:30
10:00 – 10:3010:30 – 12:15

10:30

10:45
11:05

11:20

11:35

11:50
12:20 – 13:20
13:20 – 15:00

13:20

13:35

13:50

14:05
14:20

14:35
15:00 – 15:30

Opening session
Chaired by Harald Kuhn and Wolfgang Dettmann
Holger Kapels, Institute Director Fraunhofer ISIT (Keynote)
Broad silicon based smart sensor systems towards new materials

Klaus Beetz, CEO EIT Manufacturing (Keynote)
Driving manufacturing industry towards sustainability
Coffee break
Session 1
Track 4: International collaboration for smart
systems integration: today and tomorrow!
Chaired by Elisabeth Steimetz and Luis
FonsecaWerner Steinhögl, European Commission,
Head of Sector (invited)

Terence Gan, Executive Director at
Institute of Microelectronics, Singapore(invited)
Paul Carey, Director MEMS and Sensors
Industry Group (MSIG) SEMI, USA (invited)
Market Development in the World of MEMS
and Sensors
Dr. Jörg Frömel, Micro System Integration
Center of the Tohoku University
Concept and results of hand-on access fab asenabler for commercialization of
micro and nano devices
Francis Balestra, Director Sinano InstituteHorizon Europe ICOS CSA objective & first
results: EU strengths, weaknesses,
dependences and impact of international
collaborationPanel discussion
International collaboration for smart systems
integration: today and tomorrow!

Session 2
Track 1: MEMS and Micro fluidics
Chaired by Han Shao and Matthias Kuehnel
Ole Behrmann, Fraunhofer ISIT
Organic-free hydrophobic porous protection
caps for wafer-level packaging of MEMS
environmental sensors
10:50 James Rohan, Tyndall National Institute &University College Cork
Micro Energy Storage for the Internet of Things
Paddy French, TU Delft
11:10
A Love-Mode Surface Acoustic Wave Based
Sensor for Biosensing Applications in LiquidSamples
Emre Can Durmaz IHP GmbH, Leibniz11:30
Institut für innovative Mikroelektronik
Advancements in the Cu Pillar based PCB
Microfluidic System Integration with SiGe
BiCMOS Technology

10:30

11:50

Tom Enderlein (Best Paper 2023),
Center for Microtechnologies Chemnitz
Hollow microneedle fabrication andcharacterization for interstitial fluid extraction inminimally invasive sensors

Lunch break
Session 3
13:20Session 4
Track 4: Smart systems for virtual & augmented 15:00
Track 3: Medical, health and automotive
reality: state of the art technologies and futureapplication of smart systems
needs.
Chaired by Matthias Kuehnel and Harald Pötter
Chaired by Elisabeth Steimetz and Paddy(tbc.)
FrenchAnne Bajart, DG CNECT (invited)
Marco Ottella, Xtremion Technology
13:20“Virtual worlds” partnership
Towards a made-in-Europe ecosystem for
multisport training, healthy lifestyle and remotepatient monitoring based on cloud-edge
continuum of AI-featured body sensors
Peter Ostertag, Director Optics Business,
Sajina Tinku, Fraunhofer EMFT
13:40
Bosch Sensortec (invited)High density traces on several meters long film
Micro-Optics enabling all-day wearable smartstripes by roll-to-roll digital lithography forglasses
medical applicationsUwe Vogel, Fraunhofer IPMS (invited)Franz Selbmann, Fraunhofer ENAS
14.00
Microdisplays for AR/VR/MR:
Investigation of the Biocompatibility ofRequirements and Features
Parylene-based Encapsulations for MedicalImplants
Ward van der Tempel, CTO Voxelsensors
Shanshan Gu-Stoppel,
14:20(invited)
Fraunhofer-ISIT MEMS based smart LIDAR
Low-Power, Low-Latency Perception for XR
system for human-machine cooperation
Peter Schelkens, Department of Electronics 14:40
Maurizio Tranchero, Ideas and motion
and Informatics (ETRO), VUB (invited)
Design of a Smart Actuation for a Fully
Optics and Photonics Technologies Serving
Electrified Suspension System
Virtual Worlds
Panel discussion„Virtual worlds enabled by smart systems“Coffee break

Jointly organized by16th-18th April 2024 in Hamburg, Germany

Conference program – Wednesday, 17th April 2024 (continued)
Session 5Session 6

Track 2: Reliability and test of smart systems
15:30 – 17:10
Chaired by Sven Rzepka and Wolfgang Dettmann

15:30

15:50

16:10

16:30

16:50

Régis Hamelin, Blumorpho(Pack4EU CSA)
Jakko Nieuwenkamp Reden B.V.
Remaining useful lifetime estimation of electricalcomponentMarkus Reiter, AVL List GmbH
Advancing fuel cell and battery development withfiber optical sensor solutions
Dominik Schröder, Fraunhofer ENAS
High precision magnetic field measurement ofwafer-level integrated micromagnets using an
automated near-field scanner
Alexander May, Michael P. M. Jank,Fraunhofer IISB
A 4H-SIC CMOS technology enabling smart
sensor integration and circuit operation above 500°C

Track 3: Smart for Green – energy management
and energy harvesting in application spaces
Chaired by Thomas Hammer and Han ShaoPeter Spies, Fraunhofer IIS
Green ICT for Green: Energy harvesting powered
IoT-sensors
Kari Mäki, VTT Technical Research Centre ofFinland
Analysis of economic benefits from load shifting
services in energy communities
Nahas Hassan Annacot, Infineon Dresden
Supporting Energy Management using Artificial
Intelligence
Alex Rodriguez-Iglesias, Consejo Superior deInvestigaciones Científicas (CSIC)
Packaged all-silicon based micro-thermoelectric
generator
Pierre Gasnier, CEA LETI
Batteryless piezoelectric sensor system forenhanced ski experience

17:10 – 18:00

Spare time

18:00

Bus shuttles from CinemaxX Dammtor to Überseebrücke
Conference dinner @ MS Louisiana StarGrand harbour tour, networking, buffet and drinks

18:20
20:45 - 21.45

Bus shuttles from Überseebrücke to CinemaxX Dammtor

Jointly organized by16th-18th April 2024 in Hamburg, Germany

Conference program – Thursday, 18th April 2024
09:00 – 10:00
09:00

Opening session
Chaired by Wolfgang Dettmann and Paddy French
Torsten Grawunder, swissbit Germany AG (Keynote)
Towards chiplets in harsh environments: challenges from an advanced packaging point of viewThomas Gessner Award

09:30
10:00 – 10:30
10:30 – 12:00
10:30
11:00
11:25

Announced during the conferenceCoffee break
Session 7
Track 5: AI of smart systems
Chaired by Harald Kuhn and Christoph KoeglerFrank Schönefeld, Telekom MMS (Keynote)Technologies in Generative AI and the Future of Coding
Prof. Harald Mathis, Fraunhofer application center on AI applications (invited)
Event-triggered AI
Round table discussion with
Inessa Seifert, Frank Schönefeld, Harald Mathis and Marcus Stiemer

12:00 – 13:15
13:15 – 14:45

13:15

13:35

13:55

14:15

14:45-15:00

Lunch break
Session 8
Track 2: System and hetero integration
Chaired by Jean-Philippe Polizzi and tba.
Marko E. Leinonen, University of Oulu,
Finland
Antenna lens integration challenges with 6G
sub-THZ radios
Alexander Kaufmann, Infineon
Technologies Dresden GmbH & co. KG
Monolithically integrated wireless multisensor
solution
Sebastian Wicht X-FAB MEMS FoundryGmbH
Micro-Transfer-Printing: A Technology for
Wafer-Level Packaging in a Foundry
Environment(retracted)

Session 9
Track 5: Methodological challenges and novelcomponents for AI in smart systems
Chaired by Christoph Koegler andChristian Hedayat
Marcus Stiemer, Helmut-Schmidt-University /University of the Federal Armed Forces
Hamburg
Mitigation of AI-Inherent Risks in AI-SupportedIndustrial Development and Scientific Research
Diing Shenp Ang, Nanyang TechnologicalUniversity
Silicon FET Reservoir for Dynamic Edge Vision
Sarah Seifi, Infineon Technologies AG(Best poster 2023)
Bridging the Gap: From Post-Hoc Explanations toIntrinsic Interpretability in Sensor Applications
Using Rule-Based Systems
Danilo Pau, Technical Director, IEEE and ST
Fellow, STMicroelectronics
Ultra Tiny Neural Networks for Increased Accuracyof Pressure Sensors under Multiple ThermalStresses

Closing session: Best poster and best Paper 2024!
Chaired by Kuhn, Harald
End of conference

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