37th International Conference on Microelectronic Test Structures
March 24 - 27, 2025, San Antonio, TX, USA
Looking for the best opportunity to present and discuss your ideas and results about test structures,measurements, and characterization? This is your chance! Join the 37th ICMTS conference.
This conference is co-sponsored by the IEEE Electron Devices Society. All presented papers will be submittedfor potential inclusion in IEEE Xplore®. Original papers presenting new developments in topics relevant toICMTS, include but not limited to test structures, measurements, and results, as outlined below. This one-tracktechnical program will award a Best Paper that will be voted on by the Technical Program Committee. Inaddition, Tutorial Short Course will precede the main conference while several of the best measurement,
equipment design, and manufacturing experts, will participate in the equipment exhibition and presentations.
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Designo Methodologies, verificationo Within-die circuits for process characterization/monitoringo Design enablement – Characterization and validation of digital and analog libraries.
Measurement techniqueso DC, AC and RF measurements: setup, test and analysis
o Reliability test - including thermal stability, failure analysis, ESD/LUP, EM. Wafer Level (WLR), etc.
o Statistical analysis, variability, throughput increase, smart test strategies, compact modelingo Use of machine learning and AI in analysis of data sets - parameter extraction etc.
o Wafer probing, within-die measurements, in-line metrology.
o Throughput, testing strategies, yield enhancement and process control tests, TCAD.
Applicationso Emerging memory technologies (single cell, arrays, and application in neural networks)
o Emerging transistor technologies for digital/analog/power applications
o Photonic devices - silicon integration, new displays (OLED, µ-displays)o Flexible electronics and sensors (organic and inorganic materials)o M(N)EMS, actuators, sensors, PV cells and other emerging devices

The author’s abstract submission consists of up to four pages in PDF format (font-embedded). The first pageshould include a title, a 50-word summary, author name(s), full address, contact number, and e-mail of thelead author, and any preference for oral or poster session presentation. The body of the abstract should consistof one page of text (800 to 1000 words) and up to two pages of major figures and tables.
The selection process will be based on the technical merit and will be highly weighted in favor of abstracts withhigh test structure content (including illustration) along with measurements and data analysis.
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The abstract submission deadline will be October 25 , 2024.
Abstracts can be submitted via the ICMTS website http://www.icmts.net using the “Submit Abstract” link on
the front page.
Notice of paper acceptance will be sent to the selected authors the week of January 13th, with instructions forthe expanded manuscript preparation for the conference proceedings. The deadline for submission of the final
paper will be March 6th, 2025.
Please join the ICMTS group at www.linkedin.com/groups/3804498, if you have in interest all things test
structure related.
Details of the venue, hotel, registration, etc. will be posted at the ICMTS official web site.
For further technical information, please contact the technical program chair:Dennis Pretti, Micron Technology, Inc. djpretti@micron.com

General Chair:
Chadwin Young
University of Texas, Dallaschadwin.young@utdallas.edu
Technical Program Chair:Dennis Pretti
Micron Technology, Incdjpretti@micron.com
Tutorial Chair:
Kejun Xia
TSMC
Kejun.Xia@gmail.com
Equipment Exhibition Chair:
Ben Morris
Advantest Corporation
ben.morris@advantest.com
Local Arrangements:
Chadwin Young
University of Texas, Dallaschadwin.young@utdallas.edu

ICMTS Steering Committee:
Asian Representative:
Yoshio Mita
The University of Tokyo
mita@ee.t.u-tokyo.ac.jp
European Representative:
Carlo Cagli
STMicroelectronics
carlo.cagli@st.com
USA Representative:
Larg Weiland
PDF Solutions, Inc
larg.weiland@pdf.com