东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

SK6812MINI-E

3.2x2.8x1.78 mm 0.2W Intelligent external
control surface mount SMD LED

ELECTROSTATICSENSITIVE DEVICES

Change History
Date

Rev. No.

Changes/Reason of changes

Signature

2017-08-04

01

Initial Document

KEVIN ZHU

2019-01-18

02

Revision of Specification Format

KEVIN ZHU

2019-10-29

03

Update packaging instructions and specifications

KEVIN ZHU

2019-12-30

04

Update PCB recommended pad size

KEVIN ZHU

* Before using our products, please search our official website to check theversion of specifications. The version of product specifications is updated.
We are sorry to fail to inform you in time. Please refer to the latest
information on the official website.
* The copyright and final interpretation of the product belong to Dongguan
Occidental Optoelectronics Technology Co., Ltd. If you have special
specifications, please contact our engineering staff;*Official website: https://www.opscoled.com
1 / 18Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

CONTENTS
1、 Product overview........................................................................3
2、 Main Application Field...............................................................3
3、 Description...................................................................................34、 Mechanical Dimensions...............................................................4
5、 PIN configuration.........................................................................4
6、 Recommended dimensions for PCB ...........................................4
7、General description of product naming........................................58、 Electrical parameters....................................................................59、 Electrical/Optical Characteristics.................................................510、 IC The electrical parameters......................................................6
11、 Switching characteristics............................................................612、 The data transmission time ........................................................7
13 、 Timing waveform.......................................................................714、 The method of data transmission................................................815、 The data structure of 24bit.......................................................... 916、 The typica l application circuit....................................................917、 Standard LED Performance Graph..............................................10
18、 Packaging Standard......................................................................11
19、 Reliability Test..............................................................................12
Appendix 1、 TOP SMD LED Application Notes...............................13~18

2 / 18Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

1. Product Overview :SK6812MINI-E is a smart LED control circuit and light emitting circuit in one controlled LED source,which has the shape of a 3528 LED chip. Each lighting element is a pixel, and the intensities of the
pixels are contained within the intelligent digital interface input. The output is driven by patented PWM
technology, which effectively guarantees high consistency of the color of the pixels. The control
circuit consists of a signal shaping amplification circuit, a built-in constant current circuit, and a highprecision RC oscillator.
The data protocol being used is unipolar RZ communication mode. The 24-bit data is transmitted
from the controller to DIN of the first element, and if it is accepted it is extracted pixel to pixel. After aninternal data latch, the remaining data is passed through the internal amplification circuit and sent out
on the DO port to the remaining pixels. The pixel is reset after the end of DIN. Using automatic
shaping forwarding technology makes the number of cascaded pixels without signal transmission only
limited by signal transmission speed.
The LED has a low driving voltage (which allows for environmental protection and energy saving),high brightness, scattering angle, good consistency, low power, and long life. The control circuit isintegrated in the LED above.

2. Main Application Field:● Full color LED string light, LED full color module, LED super hard and soft lights, LED guardrail tube,
LED appearance / scene lighting● LED point light, LED pixel screen, LED shaped screen, a variety of electronic products, electricalequipment etc..

3. Description:● Top SMD internal integrated high quality external control line serial cascade constant current IC;● control circuit and the RGB chip in SMD 3528 components, to form a complete control of pixel, color
mixing uniformity and consistency;●built-in data shaping circuit, a pixel signal is received after wave shaping and output waveform
distortion will not guarantee a line;●The built-in power on reset and reset circuit, the power does not work;●gray level adjusting circuit (256 level gray scale adjustable);● red drive special treatment, color balance;● line data transmission;● plastic forward strengthening technology, the transmission distance between two points over 10M;
●Using a typical data transmission frequency of 800 Kbps, when the refresh rate of 30 frames per sec

3 / 18Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

4. Mechanical Dimensions:

1 VDD

4 DIN 4

1

2 DOUT

3 GND 32角Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1mm unless otherwise noted

5. PIN configuration
NO.

SymbolFunction description

1

VDD

Power supply LED

2

DOUT

Control data signal output

3

GND

Ground4

DIN

Control data signal input

6. Recommended dimensions for PCB

4 / 18

1 VDD

4 DIN

2 DOUT

3 GNDDocument No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

7. General description of product naming

SK 6812 MINI-E
①

③

②

①

②

③

SeriesIC series andcurrent code

packageoutline

The default is tointegrate the RGB
chip with the IC intheRefers to the 68 series
IC
5/12MA current
version

3.2x2.8x1.78mm
packageoutline

8. Electrical parameters （Ta=25℃,VSS=0V） :Parameter

Symbol

Range

Unit

Power supply voltage

VDD+3.7～+5.5

V

Logic input voltage

VIN-0.5～VDD+0.5

VWorking temperatureTopt-40~+85℃

Storage temperature

Tstg-40~+85℃

ESD pressure(HBM)

VESD

2K

V

ESD pressure(DM)

VESD

200

V

9. Electrical/Optical Characteristics:
SK6812MINI -E 12mA

5 / 18Color

Dominate
Wavelength(nm)

Luminance(mcd)

luminous
flux(lm)

RED620-625400-700

1.0-2.0

GREEN

520-530

1000-1500

3.0-4.0BLUE460-470

200-400

0.5-1.0

Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

10. The IC electrical parameters (unless otherwise specified, TA=-20 ~ +70 ℃, VDD=4.5 ~5.5V, VSS=0V):
Parmeter

Symb
ol

Min

Typic
al

Max

Unit

Test conditions

The chipsupply voltage

VDD

---

5.2

---

V

---

VIH

0.7*VDD

---

---

V

VIL

---

---

0.3*VDDV

The frequency
of PWM

FPWM

---

1.2

---

KHZ

---

Static power
consumption

IDD

---

1

---

mA

---

The signal
input flip
threshold

VDD=5.0V

11. Switching characteristics(VCC=5V Ta=25 ℃):
Parameter

SymbolMin

TypicalMax

Unit

Test conditions

The speed of datatransmission

fDIN

---

800

---

KHZ

The duty ratio of 67%(data 1)

DOUT transmission
delay

TPLH

---

---

500

ns

TPHL

---

---

500

ns

IOUT Rise/Drop
Time

Tr

---

100

---

ns

Tf

---

100

---

ns

6 / 18

DIN→DOUT
VDS=1.5
IOUT=5mA
IOUT=13mA

Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

12. The data transmission time :
Name

Min.

Standard
value

Max.

Unit

T

Code period

1.20

--

--

µs

T0H

0 code, high level time

0.2

0.32

0.4

µs

T0L

0 code, low level time

0.8

--

--

µs

T1H

1 code, high level time

0.58

0.64

1.0

µs

T1L

1 code, low level time

0.2

--

--

µs

Trst

Reset code，low level
time

>80

--

--

µs

1. The protocol uses a unipolar zeroing code. Each symbol must have a low level. Eachsymbol in this protocol starts with a high level. The high time width determines the "0" or"1" code. .
2. When writing programs, the minimum symbol period is 1.2μs.
3. The high time of “0” code and “1” code should be in accordance with thestipulated range in the above table. The low time requirement of “0” code and “1”code is less than 20μs.
13. Timing waveform:
Input code:

T

Symbol period

T0L

0 codeT0H
T1L

1 codeT1H

Reset code

Trst

Connection mode:D1

DIN DO

PIX1
7 /18

D2

DIN DO

PIX2

D3

D4
DIN DOPIX3
Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

14. The method of data transmission:

Note: the D1 sends data for MCU, D2, D3, D4 for data forwarding automatic shaping cascade circuit.

8 / 18Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

15. The data structure of 24bit:

G7

G6

G5

G4

G3

G2

G1

G0

R7

R6

R5

R4

R3

R2

R1

R0

B7

B6

B5

B4

B3

B2

B1

B0

Note: high starting, in order to send data (G7 - G6 - ...... ..B0)

16. The typica l application circuit:

In the practical application circuit, the signal input and output pins of the IC signal input and output pins should be connectedto the signal input and output terminals. In addition, in order to make the IC chip is more stable, even the capacitance between
beads is essential back;Application: used for soft lamp strip or hard light, lamp beads transmission distance is short, suggested in signal in time theclock line input and output end of each connected in series protection resistors, R1 of about 500 ohms.
Application: for module or general special-shaped products, lamp beads transmission distance is long, because of different
wire and transmission distance, in the signal in time clock at both ends of the line on grounding protection resistance will beslightly different; to the actual use of fixed;

9 / 18Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

17. Standard LED Performance Graph:

Thermal Pad Temperature vs. Relative Light Output

Normalized Luminous Flux

120%

BLUE/GREEN
100%
80%

RED

60%
40%
20%
0.00
20

0

40

60

80

100

120

Thermal Pad Temperature (T=25°C)

Relative Emission Distribution

Wavelength Characteristics
100%
BLUE

GREEN
RED

80%
60%
40%
20%
0.00
400

450

500

550

600

650

700

750 800

Wavelength (nm)Typical Radiation Pattern 120°
0
30°

60°

90°
90 75 60 45 30 15 0 0.2 0.4 0.6 0.8 1.0
Radiation Angle

10 / 18

Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

18. Packaging Standard:

S K 6 8 1 2 M IN I-E
C A T H O D E ID E N T IF IC A T IO N

T A P E F E E D D IR E C T IO N

C A R R IE R T A P E
COVER TAPES M DR E E L (1 7 8 x 1 2 m m )(IN N E R 2 0 0 0 p c s L E D M A X )P R O D U C T N O .: S K 6 8 1 2 M IN I-E
Q U A N T IT Y .: 2 0 0 0 P C S
L o t N o .: L W 2 0 1 5 0 7 0 9 0 2 -1 0

ESD PO LYETHYLENE BAG

D A T E :2 0 1 6 -0 8 -2 3

L A B E L S K E T C H IN G

C A R D B O A R D (IN N E R 1 0 B A G M A X .)C A R D B O A R D (IN N E R 4 C A R D B O A R D M A X .)The reel pack is applied in SMD LED. The LEDs are packed in cardboard boxes after packaging in normal or antielectrostatic bags. cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. The
boxes are not water resistant and therefore must be kept away from water and moisture.
11 / 18

Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

19. Reliability Test :NO.

Test item

Test Conditions

Reference

Criterion

1

Thermal Shock

100 ± 5°C ~ -40°C ±
5°C
30min~30min 300 cycles

MIL-STD-202G

0/22

2

High Temperature
Storage

Ta= +100ºC 1000hrs

JEITA ED-4701
200 201

0/22

3

Low Temperature
Storage

Ta= -40ºC

1000hrs

JEITA ED-4701
200 2020/22

4High Temperature
High Humidity
Storage

RH=90% 1000hrs

JEITA ED-4701
100 103

0/22

JEITA ED-4701
100 105

0/22

Ta=60ºC

5

Temperature
Cycle-55ºC~25ºC~100ºC~25ºC
30min~5min~30min~5mi
n100 cycles

6

Resistance to
Soldering Heat

Tsld = 260°C, 10sec. 3
times

JEITA ED-4701
300 301

0/22

7

Room temp Life
Test

25°C, IF: Typicalcurrent , 1000hrs

JESD22-A
108D

0/22

Criteria for Judging the Damage:
Item

SymbolTest Condition

Luminous
Intensity

IV

DC=5V, Typicalcurrent

Resistance to
Soldering Heat---

DC=5V, Typicalcurrent

12 /18

Limit
Min

Max

Init. Value*0.7---

No dead lights or obvious
damageDocument No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

Appendix 1、 TOP SMD LED Application Notes
1. Features
The Purposes of making OPSCO’s customers and users to have a clear understanding on the ways how to
use the LED.

2. Description
Generally. The LED can be used the same way as other general purposed semiconductors. When using
OPSCO’s TOP SMD LED, the following precautions must be taken to protect the LED.

3. Cautions
3.1. Dust & CleaningThis emitter has a silicone surface, There are many benefits to the silicone surface in terms of opticalproperties and improved reliability. However, silicone is a softer material and prone to attract dust. While aminimal amount of dust and debris on the LED will not cause significant reduction in illumination, steps
should be taken to keep the emitter free of dust.
These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies inan enclosed area after installing the emitters.
Surface condition of this device may change when organic solvents such as trichloroethylene or acetone
were applied.
Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs.
When using other solvents, it should be confirmed beforehand whether the solvents will dissolve thepackage and the resin of not.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasoniccleaning on the LEDs depends on factors such as ultrasonic power. Baking time and assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.

3.2. Shipment and storage
TOP SMD LED is a humidity sensor, the LED packaging in the aluminum bag is to avoid the LED in thetransport and storage of moisture absorption, in the bag with a desiccant to absorb the moisture inside
the bag. If the LED absorbs water vapor, then in the LED over reflow, in the high temperature state, into
which the rapid expansion of gas vaporization and produce a greater internal stress, so that the materialcrack, layered or damaged bonding wire , Resulting in product failure.
TOP SMD LED with a moisture-proof anti-static aluminum foil bag packaging, handling should avoid theprocess of squeezing, piercing the case of bags, and do the necessary anti-static protective measures;promise products on the line before the leak or broken, Please stop the use of direct use of the product; ,Resulting in product failure;
Such as before the material has been found to prevent moisture-proof aluminum foil bags have been
opened, damaged, perforated can be returned to the original re-dehumidification, must not be on-line use;
The humidity level of this product is LEVEL5a.

13 / 18

Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

Appendix 1.TOP SMD LED Application Notes
1. Features
The Purposes of making OPSCO’s customers and users to have a clear understanding on the ways how to
use the LED.

2. Description
Generally. The LED can be used the same way as other general purposed semiconductors. When using
OPSCO’s TOP SMD LED, the following precautions must be taken to protect the LED.

3. Cautions
3.1. Dust & CleaningThis emitter has a silicone surface, There are many benefits to the silicone surface in terms of opticalproperties and improved reliability. However, silicone is a softer material and prone to attract dust. While aminimal amount of dust and debris on the LED will not cause significant reduction in illumination, steps
should be taken to keep the emitter free of dust.
These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies inan enclosed area after installing the emitters.
Surface condition of this device may change when organic solvents such as trichloroethylene or acetone
were applied.
Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs.
When using other solvents, it should be confirmed beforehand whether the solvents will dissolve thepackage and the resin of not.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasoniccleaning on the LEDs depends on factors such as ultrasonic power. Baking time and assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.

3.2. Shipment and storage
TOP SMD LED is a humidity sensor, the LED packaging in the aluminum bag is to avoid the LED in thetransport and storage of moisture absorption, in the bag with a desiccant to absorb the moisture inside
the bag. If the LED absorbs water vapor, then in the LED over reflow, in the high temperature state, into
which the rapid expansion of gas vaporization and produce a greater internal stress, so that the materialcrack, layered or damaged bonding wire , Resulting in product failure.
TOP SMD LED with a moisture-proof anti-static aluminum foil bag packaging, handling should avoid theprocess of squeezing, piercing the case of bags, and do the necessary anti-static protective measures;promise products on the line before the leak or broken, Please stop the use of direct use of the product; ,Resulting in product failure;
Such as before the material has been found to prevent moisture-proof aluminum foil bags have been
opened, damaged, perforated can be returned to the original re-dehumidification, must not be on-line use;
The humidity level of this product is LEVEL5a.

14 / 18

Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

Chart 1:Definition of material’s MSL prescribed by IPC/JEDECJ-STD-020E
Workshop lifespan after open the packaging

Moisture proofTime

condition

LEVEL1

unlimited≦30℃/85 % RH

LEVEL2

1 year≦30℃/60 % RH

LEVEL2a4

Weeks≦30℃/60 % RH

LEVEL3168 Hours≦30℃/60 % RH

LEVEL472 Hours≦30℃/60 % RH

LEVEL548 Hours≦30℃/60 % RH

LEVEL5a24 Hours≦30℃/60 % RH

LEVEL6

Take off and use immediately≦30℃/60 % RH

3.3. Storage before unsealing
In order to avoid the moisture barrier caused by the reliability of the failure problem, need to do LED products SMT prestorage and moisture-proof measures;
If the moisture-proof bag is not open, the TOP SMD element will be stored for less than 2 months at <30 ° C / 60% RH;(Note: The label date is the same and the packing is not leaked. Discoloration under the premise of use; for different
moisture-proof grade materials or packaging to save the time there is a certain difference, the specific preservation timeto the specification book or packaging tips prevail); recommended in the unassembled do not open the moisture before
the bag;

3.4. Control after the packing bag is opened
After opening the moisture-proof bag, please read the moisture-proof bag inside the humidity indicator card in the
moisture-proof beads into pink to confirm moisture in the moisture bag is too much, according to the color of the ball todetermine whether the bag material on-line operation; And the material after opening the package should be strictly
controlled in the table 1 as specified by the maximum temperature and humidity and operating time allowed, as long as
the material exposed in the environment described in Table 1, the need to accumulate its use in the workshop time.
Open the bag and paste the material on the PCB board, should be completed within 0.5H welding work, do notrecommend the material attached to the PCB, a long time stay in the workshop does not carry out SMT work; Causedby adverse water within the lead;

3.5. Definition of humidity card
Open the package after the TOP SMD LED bag inside the humidity card color instructions are as follows:
A. If the moisture card 10% of the moisture-proof beads into pink, other files for the blue, this situation, LED can be useddirectly;
B. If the humidity card moisture-proof beads 10%, 20% at all become pink, in fact, the file is blue, this situation, the needfor low-temperature components dehumidification;
C. If the humidity card moisture-proof beads 10%, 20%, 30% more than three are turned pink, in this case, the customer
needs to return the material to our company for high humidity dehumidification, re-packaging before use;

15 / 18

Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

Humidity indicator DO not change color

Humidity indicator tums pink in 10% 20%

Humidity indicator tums pink in 10% 20% 30%

3.6. Unwanted material moisture-proof storage and moisture-proof control of finished material
If a roll of SMDs is not used at once and the plant temperature and humidity are within the defined conditions (<30 ° C /60% RH), the exposure time of the element in the air does not exceed 2H, the remaining material should be carriedout together with the desiccant Vacuum sealed, otherwise, the material must be low-wet baking dehumidification;
dehumidified material can be re-packaged to re-start the calculation time;
Perform moisture control on SMDs components that have been assembled
A. After the components have been assembled to the PCB board no longer need to go through the high temperatureprocess or reflow process, it will not be special treatment;
B. Do not need to do the necessary dehumidification work before making the appropriate protection process, bake in 70℃ ± 5 ℃ oven baking for less than 48 hours, To remove the product in the detection and aging process exposed tomoisture in the air to avoid the product in the protective treatment, the package in the material surface of the moisture
will slowly invade the product, will cause product failure (Specific desiccant baking parameters refer to 3.6.2 items);
C. For products that require secondary SMT process or high temperature, they should be subjected to the necessary
moisture treatment before secondary welding, after exposure to (<30 ° C / 60% RH) , The maximum length of not morethan 4H, Connaught second high temperature process separated by a long time, then a welding material must benecessary dehumidification work (70 ℃ ± 5 ℃ oven baking no less than 48 hours), and then pumping Vacuum storage;or the first product stored in the oven or with a desiccant container, the second high-temperature process before doing
dehumidification work (70 ℃ ± 5 ℃ in the oven baking no less than 48 hours) , To ensure that products in the hightemperature before the process is not damp (Specific desiccant baking parameters refer to 3.6.2 items);
Low-temperature baking conditions: 70 ° C ± 5 ° C baking not less than 48 hours high temperature baking conditions:
130 ° C ± 5 ° C baking not less than 6 hours (lamp beads must be split into particles)
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Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

3.6.2 The relationship between ambient humidity and dehumidification time for low temperature/high temperature dehumidification:
Ambient
humidityOventemperature

baking time

Baking method

40%

70℃

24H

50%

70℃

48H

Remove from the static bag
and bake with the reel todehumidify.

>60%

70℃

Ineffective dehumidification baking

40%

130℃

6H

50%

130℃

12H

Lamp beads must be
dismantled into granules tobake and dehumidify

3.7. Reflow Soldering Characteristics
In testing, OPSCO has found S50 LEDs to be compatible with JEDEC J-STD-020E,using the parameters listed below. As ageneral guideline OPSCO recommends that users follow the recommended soldering profile provided by the manufacturerof solder paste used.
Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs andConfigurations of reflow soldering equipment.

C ritical Zone T L to T P
amp-upL

Temperature (°C)

L

s max

MIN

Ramp downts(Preheat)

T 25°C to PeakTimes

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Document No.: SPC / SK6812MINI-E Rev. No.: 04东莞市欧思科光电科技有限公司
DONGGUAN OPSCO OPTOELECTRONICS CO., LTD
Factory : Lianxing industrial park, xiajie village, Qishi Town, Dongguan City. guangdong province, China
Dongguan Tel: (769)82632725

Dongguan Fax: (769)82632735

Profile Feature

Lead-Based Solder

Lead-Free Solder

Average Ramp-Up Rate (Ts max to Tp )3℃/second max.

3℃/second max.

Preheat: Temperature Min (Ts min)

100℃

150℃

Preheat: Temperature Min (Ts max)

150℃

200℃

Preheat: Time ( ts min to ts max )60-120 seconds

60-180 seconds

Time Maintained Above: Temperature (TL)

183 ℃

217 ℃

Time Maintained Above: Time (t L)

60-150 seconds

60-150 seconds

Peak/Classification Temperature (T P)

215 ℃

240 ℃

Time Within 5℃ of Actual Peak Temperature ( tp)<10 seconds<10 seconds

Ramp-Down Rate

6℃/second max.

6℃/second max.

Time 25 ℃ to Peak Temperature<6 minutes max.

<6 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

3.8 Heat Generation:
Thermal design of the end product is of paramount importance. Please consider the heat generation of the
LED when making the system design. The coefficient of temperature increase per input electric power isaffected by the thermal resistance of the circuit board and density of LED placement on the board, as well ascomponents. It is necessary to avoid in tense heat generation and operate within the maximum rating given inthis specification. The operating current should be decided after considering the ambient maximum
temperature of LEDs
The maximum working temperature of the product is not easy to exceed 60 ° C ( ≤ 60 ° C, refers to the productpin at the operating temperature)

3.9 Electrostatic Discharge & Surge Current :Electrostatic discharge (ESD) or surge current (EOS) may damage LED.
Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling ofLED.
IC device signal input and output ports must be connected in series protection resistor to prevent surge or
static shock port caused by product failure;
All devices, equipment and machinery must be properly grounded.
It is recommended to perform electrical test to screen out ESD failures at final inspection.
It is important to eliminate the possibility of surge current during circuitry design.

4.0 Moisture Proof Package
Cannot take any responsibility for any trouble that are caused by using the LEDs at conditions exceeding
our specifications.
The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking
directly at the LEDs with unaided eyes for more than a few seconds.
The formal specification must be exchanged and signed by both parties before large volume purchase begins.
The appearance and specifications of the product may be modified for improvement without notice.
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Document No.: SPC / SK6812MINI-E Rev. No.: 04