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Download PC Guard for Windows 7 Ultimate from Softonic: PC Guard for Windows 7 Ultimate Free Download PC Guard for Windows 7 Ultimate is a free program thatlets you protect your PC by disabling or delaying malicious apps,. PC Guard For Win32 V5.rar Jan 23, 2017 EXE Free Download Software PC Guard For Windows 7Ultimate.. From Softonic: Browse the entire Softonic collection. PC Guard for Windows 7 Ultimate. Exe.Get the latest version of PC Guard for Windows 10. PC Guard forWindows 10 is a free utility that lets you protect your PC by disabling or delaying malicious apps,.The present invention relates to a method for manufacturing asemiconductor device and the semiconductor device which have a backside contact. Generally, semiconductor devices are produced by fabrication processes which include
the steps of formation of a circuit forming a chip, formation of interlayer insulating film (formation of an interlayer insulating film) by forming an interlayer insulating film
on a semiconductor substrate, and formation of via holes in the interlayer insulating film. Further, formation of a conductive layer is carried out for an electrical connection
between the semiconductor substrate and the semiconductor circuit. This technique is disclosed in detail in Japanese Laid-Open Patent Publication Nos. 59-81652, 4-273429
and 2-287455. It is desirable that the via holes are formed penetrating through interlayer insulating film (insulating layer). However, the via holes formed penetrating throughinterlayer insulating film (insulating layer) have undesired portions which are referred to as xe2x80x9cemptyxe2x80x9d and xe2x80x9csweptxe2x80x9d portions. When thesemiconductor device is equipped with a conductive layer, the empty portion of the via hole becomes a crack at the time of shrinkage or the like of the conductive layer.
Then, the semiconductor device may be seriously broken. Further, at the time when a circuit pattern is formed over the interlayer insulating film by lithography, the positive
photo resist is removed by a developing solution by the flowed through the empty portions of the via holes. In this case, the pattern is undesirably de f678ea9f9e
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