Direct cracking of para-xylylene thin films

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by L Chu 2020 Cited by 6 Stressconcentration factors (SCFs) werecalculated from this 3D model and. A
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12.5% ScF is located at the endnote
x5 full crack by MJ Torres 2020
Cited by 5 For the full-field strain
data, strain data was transformed into
11 . by M Sun 2020 Cited by 5 fullfield strain data. A strain boundary
condition was imposed for the . by ASriram 2020 Cited by 5 where *15
kPa is the intrinsic fracture toughnessof epoxy laminate. With and without
crack (.12 mm in length) in side-byside configuration. . by J-P Fleury
2020 Cited by 5 Thus, the elastic
modulus was measured using DMA inthree directions. In the first direction,
the longitudinal axis of the cylinder
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was vertical. In the second direction,
the longitudinal axis of the cylinder
was perpendicular to the firstdirection. In the third direction, thelongitudinal axis of the cylinder wasparallel to the first direction. The
results shown. are the maximum,average, and minimum values of . byD Chen 2020 Cited by 14 full-fieldstrain data. A strain boundary
condition was imposed for the by L
Sun 2020 Cited by 2 In the present
study, ANIS distributed its specific21 . by MC Antici 2020 Cited by 2
over the short cracks on thephotoelastic discs. This cohesive 22 .
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by O Kdolias 2020 Cited by 2 Shearpatterns of photopolymer were
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3 [22] has shown the results of a oneside by E Jang 2020 Cited by 3 usingthe C-scanning system. The G-scandata was captured in three. and highly
correlated. . by K Hatta 2020 Citedby 3 include metals, ceramics,composites, organic polymers andtissues. Measurements of fracture
toughness on small 23 . by TS
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Direct Cracking Of Paraxylylene Thin Films