BRD8076/D
Rev. 11, Feb-2022

Custom Foundry
Solutions

Pushing innovation to create intelligent
power and sensing technologies that solve
the most challenging customer problems.

onsemi.com

SoC, SiP, and Custom Products
Custom Solution

System-onChip

System-inPackage

ASIC Technology

CustomImage
Sensors

Integrated
Passive
Devices

FPGA  ASIC

CustomFoundry
Services

ASIC  FPGA

onsemi is a leading supplier of System-on-Chip (SoC), Application Specific Integrated Circuit (ASIC), andother custom solutions, supporting a wide range of applications in the automotive, industrial, medical,
and aerospace & defense markets. onsemi has designed and manufactured more than 5,000 custom
integrated circuits over the last 50 years.

onsemi SoC, ASIC, and Custom Product Benefits
Advanced, integrated SoC and ASIC devices enable optimized performance and power efficiency, throughintegration. Hardware embedding may enhance the security of intellectual property. The elimination ofinter-package connections may reduce noise.
In addition, the reduction in the number of components may:
• Reduce required board space• Simplify board routing• Simplify board testing• Improve reliability• Lower BOM cost

Page 2

onsemi

Design and Manufacturing Expertise
System Architects at onsemi have detailed knowledge of fabrication process technologies and packaging
capabilities, and can advise on system architecture, refine design specifications, identify IP, and align tothe most appropriate technology.
onsemi has been granted Category 1A Trusted Design, Trusted Test, Trusted Foundry, and Trusted Broker
accreditation by the Defense Microelectronics Activity (DMEA).
onsemi owns and operates wafer fabs, assembly and test facilities. In-house capabilities include CMOS
and BCDMOS process technologies, with line widths of 65 nm to 0.5 µm, on wafer diameters of 200 and
300 mm. Third-party relationships augment the company’s internal manufacturing capability as required.

Responsive, Reliable World-Class Supply Chain and Quality Program
onsemi operates a flexible, reliable, responsive supply chain that supports complex manufacturing networks
and dynamic global market conditions, including multiple manufacturing and logistics sites located near
our customers to ensure supply continuity. The company shipped over 64 billion units through its global
logistics network during 2020, representing ~8 units per person on earth. onsemi sustains world-classquality performance, and is certified to multiple international quality standards and programs.

Certifications• IATF 16949 ISO 9001
• AS 9100 Rev. D• MIL-PRF-38535• Trusted Foundry, Design,
Test, and Broker Accreditation

Custom Foundry Solutions• ISO 9001
• ISO 14001• QML, CTPAT, STACK• ISO 26262

Page 3Mixed-Signal ASIC Solutions
Value Proposition• Experienced resources and assets to bring customers’ design objectives successfully to market• Ability to integrate customers’ IP into single-chip solution, thereby protecting the IP• Flexible cost models to reduce customers’ total cost

High Voltage (40 to 80 V)
Low Voltage (<3.3 V)
Low orHigh
VoltagePower/
Battery
Management

AnalogSignals
Filtering

Example:Sensor:• Magnetic Flux
• Temperature• Light• Sound• Pressure• Acceleration• Angular Rate

Amplification

Analog/DigitalConversion

Sensor Interface

Supporting
Logic
ASIC

• CAN, LIN• I2C-bus
• USB
• KNX
• M-BUS

Design Engineering• Approximately 200 expert mixedsignal designers with extensive
Low or
SoC and SiP experience
High
Wired
Wireless
Voltage• Robust custom development
Communications
Radio
process• Dedicated project managers track• Microcontroller• DSP& report development progress
SignalActuator
Processing• Flexible customer development
Example:engagement – from full turnkey to• Coil Driver
Mechanical or• Class-D Amp
Electrical System:
subcontractor production services• DAC• Stepper Motors• Display Driver• Transducers• Design expertise in:• MOSFETs & BJTs
• EEPROM• Relays• OTP• Sensor interface• Speakers
Memory• SRAM• Lamps• ROM• LCD/LED Displays• Medical imaging• Energy management• Building & home control• RF

IP & Fab Processes• Analog-focused CMOS/BCDMOS and SOI
technologies utilizing internal fabs and external
foundry partners• Low, medium, high voltages – ≤1 V to 160 V• Low current optimization – active & standby• Low noise design – “count the electrons”• High temperature – ≤200°C (profile, for selected
technologies)• Non-Volatile Memory (EEPROM, OTP), RAM & ROM• Embedded digital IP• Robust ESD protection• Extensive building blocks consisting of amplifiers,
references, DACs, ADCs, linear & switchingregulators, power management, etc.

Page 4

Category

Mixed Signal Intellectual Property (IP)

Serial Interfaces

USB 3.0/2.0/1.1, HDMI, MIPI, I2C, SPI, CAN, UART

Microprocessors

ARM, RCore DSP, R8051, AMBA/AHB/APB Peripherals

MemorySRAM, DPRAM, ROM, EEPROM, OTP, FLASH

Clocking

Oscillators, PLLs, DLLs

Encryption

ECC, AES, 3-DES, DES, RSA

Data Converters

DAC, ADC (8 - 20 bits, 1 KSPS – 120 MSPS)

Power Management

Efficient Switching Regulators, LDOs, Charge Pumps,
Thermal Protection

References

Precision Bandgaps, Current References, Temperature
Sensors

Analog and High Voltage
Interfaces

High-Voltage Drivers, Display and LCD Drivers, Class D
Amplifiers

Signal Conditioning

PGA, Instrumentation Amps, Digital and Analog Filters

onsemi

Digital ASIC Solutions
Proven Expertise
The comprehensive digital ASIC offering from onsemi includes multiple manufacturing locations with stateof-the-art and legacy technologies to support your design requirements. We provide complete solutions
from product development, manufacturing, test, and packaging, to quality engineering support and supply.
We offer early engagement with our product definers to assess the best overall technical solution enablinga solid partnership throughout each step of the project lifecycle, from concept to production. onsemi
supports reliable long-term manufacturing to meet the requirements of aerospace/defense, automotive,
industrial, communication and other markets. With over 50 years of IC experience, we guide our customers
to the best technical and most economical ASIC solution.

Digital solutions from 0.5 m to 22 nm• Flexible ASIC design interfaces including wholeor partial RTL, Netlist, and GDSII content• Robust FPGA proof-of-concept validation flow
when targeting an ASIC
• FPGA-to-ASIC, ASIC-to-ASIC, and multi-chipto-ASIC conversions• EOL support with ASIC-to-ASIC conversion
approach• Big D (Digital) / Small A (Analog) ASIC capability
to increase integration and simplify board
design• Up to 50 million gates and 50 Mb of memory• Product Definers to advise on the best overallsolution• Proven technologies to ensure long term,
continuous supply• Secure supply with domestic manufacturing• Support for long-life, small volume applications• High reliability, high temperature, special
packaging and handling• Complete solutions including productdevelopment, test, package engineering, quality
engineering, and failure analysis• Full ITAR handling available• QML Flow, Trusted Supplier• DO-254 compliance support• Custom packaging capability to match most
pin-outs and package types
Custom Foundry Solutions

RTL Hand-off

Specification Hand-off

RTL Checking
Logic Synthesis

RTL Development
RTL Checking
Logic Synthesis

Third-Party
Gate-Level Netlist
Hand-off

onsemiGate-Level Netlist
Hand-off

Gate-level Translation
Gate-level Checking

Gate-level
Checking

ASIC Design Flow
Memory Configuration
Memory BIST Insertion
IP Integration and Verification(Transceivers, μP, Analog,
Memory Interfaces)
IP, I/O, Clock Gen
Configuration, Insertion, Verification
Scan and JTAG Insertion
Automatic Test Pattern Generation
Static Timing and Power Analysis
LEC and Functional Simulation
Floor Planning
Automatic Place and Route
DRC, LVS, LEC, Extraction
Post Layout Simulation

ASIC Manufacturing
Wafer Fabrication
Package, Assembly, Test

Prototype ASIC Devices
Production Finished Goods

Page 5

Digital Standard Cell Product Families
Digital Standard Cell Product Families
Standard Cell Product Families
Core Voltage(V)

I/O Voltage
(V)

I/O
Types

SystemPerformance

SpecialFeatures5.0

5.0, 3.3

PCI, TTL, LVTTL, LVCMOS

75 MHzLong-Term 5 V Support, High Temp

3.3, 2.5

5.0, 3.3

PCI, GTL, HSTL, SSTL, LVTTL, LVCMOS, LVPECL

100 MHzEEPROM, High Temp

3.3, 1.8, 1.5,
5.0

3.3, 2.5, 1.8, 5.0

PCI33/66, DCI, HSTL, SSTL, LVTTL, LVCMOS, LVPECL, LVDS

266 MHz

NVM, OTP, High Vt, High Temp

1.2, 1.0

3.3, 2.5, 1.8,
1.5, 1.2

PCI33/66, DCI, HSTL, SSTL, LVTTL, LVCMOS, LVPECL, LVDS,
CML, PCIX

600 MHz

Extensive IP Portfolio

SP40
40 nm

1.1, 0.9

3.3, 2.5, 1.8,
1.5, 1.2

PCI33/66, DCI, HSTL, SSTL, LVTTL, LVCMOS, LVPECL, LVDS,
CML, PCIX

850 MHz

Extensive IP Portfolio

SP32/28
32 nm, 28 nm

0.85 ~ 1.05

3.3, 2.5, 1.8

PCI, DCI, HSTL, SSTL, LVCMOS, LVPECL, LVDS, CML

1000 MHz

Extensive IP Portfolio

GF22
FDX/FDSOI

0.88, 0.72,
0.40

3.3, 1.8, 1.5, 1.2

PCI, DCI, HSTL, SSTL, LVCMOS, LVPECL, LVDS, CML

1.8 GHz,
2.1 GHz w/BB

Body Bias, Ultra Low Power,
Extensive IP Portfolio

FamilySC5
0.5 mmSC30.35 mm
ONC18
180 nm
ONK65
SP65/55
65 nm, 55 nm

Page 6

onsemi

Digital Standard Cell Product Families
Comprehensive Intellectual Property Offering
onsemi offers a suite of system IP suitable for avariety of applications, including those requiring highspeed serial I/O (SerDes), external high-performance
memory interfaces, processors, and a variety of otherhard and soft IP. Combined with support for a diverse
family of I/O standards, our digital ASIC technologies
and IP provide optimal solutions for aerospace/defense, automotive, communications, industrial,consumer, computing, and medical applications.
onsemi is an Arm® microprocessor licensee andhas access to multiple Arm cores for integration into
silicon products.

Category

IP Cores

Hi-Speed SerDes

PCI Express Gen 1/2/3, XAUI, SATA I/II/II, EPON, Serial
Rapid I/O (SRIO), 1G Ethernet, 10G Ethernet

Serial Interfaces

USB 3.0/2.0/1.1, HDMI, I2C, CAN, UART

Application Layer Support

10/100 Ethernet, 1G Ethernet, 10G Ethernet,
PCI Express Gen 1/2/3, SATA I/II/III, SRIO, USB
3.0/2.0/1.1, DDRX Controllers, EMAC4, MII, RMII, SMII,XFI, HDMIBus Interfaces

PCI, AMBA/AHB, ARM7, PLB, PCMCIA

Microprocessors

Arm, ARC, PowerPC, R-Core, M8051, AMBA/AHB
Peripherals

Memory Interfaces

DDR, DDR2, DDR3, DDR4, QDR-II

Data Converters

ADC, DAC

MemorySRAM, DPRAM, Register File, ROM, OTP

Clocking

PLLs, DLLs, MSDLL

Error Correction, Encryption ECC, DES, 3DES, Reed-Solomon, RNG, PK Processor,& Anti-Tamper
Secure SRAMDSP Functions

FFT, Mult, Divide, Accumulate, Up/Down Converter, FIR

FPGA Conversion IP

Memory Wrappers, LUT RAM, I/O Standards, Hardware
DSP Functions, FIFOs, Clocking Emulation

onsemi is integrating 300 mm production capability through the recently announced acquisition of a
300 mm fab located in East Fishkill, New York. It includes agreements for technology transfer anddevelopment, and a technology license. onsemi has immediate access to advanced CMOS capability,
including 65 nm technology node. onsemi expects to assume complete operational control of the fab at
the end of 2022. onsemi also plans to include the East Fishkill fab and technologies within the portfolio ofTrusted, ITAR, and QML capable manufacturing technologies.

Custom Foundry Solutions

Page 7

ASIC Conversions: FPGA-to-ASIC, ASIC-to-ASIC
ASIC Conversions and EOL Solutions
onsemi provides long-term solutions to customers facing device or process obsolescence with theircurrent ASIC or FPGA vendor. We offer reliable second sourcing options and cost reduction solutions to
help you maintain your competitive edge. Conversion of an older technology to an optimized ASIC solution
can provide a mid-life enhancement and extended life cycle.

FPGA Conversions
onsemi is the industry leader specializing in converting FPGAs to ASICs. We provide significant costsavings, performance enhancement, and product assurance. Our customers have reduced system costs
considerably by successfully substituting their high-cost FPGAs with drop-in ASIC replacements inover 4,000 applications. Using ASICs can achieve higher performance, lower power, and better thermal
performance in most cases. onsemi offers a parallel development path for FPGA development, leveraging
the FPGA development benefits while accelerating the path to production with an ASIC.

FPGA to ASIC Conversion –The Best of Both Worlds
METRICFPGA

Development Cost
HW/SW Co-Design
ECO Turn-Around
Time to Market
System Performance
Power Consumption
Unit Cost
Security
Non-volatility (LAPU)
Life Cycle Support
Harsh Environments






ASIC









Single-chip solution
3-4x typical power reduction with ASIC solution
ASIC price 25 to 75% of the FPGA piece priceNo configuration boot-up vulnerabilities
Cold-start, hot-swap enabling
ASIC production stability
Radiation effects, flight-criticality, on-shore

FPGA
Conversion
Flow

Conversion Features and Benefits• Automatic design migration to a Standard Cell
ASIC
• Low NRE, low-cost drop-in replacements• Multiple-to-one conversions for a higher levelof integration• Original circuit functionality and performance
maintained• Optional performance enhancements for acompetitive edge
• ASIC IP optimized for FPGA migrations

Page 8• Single-chip, non-volatile solution results in
Live-at-Power-Up (LAPU); enhanced security;
immunity to configuration logic errors resulting
from SEE• Significant reduction in power usage• Improved cost through die size reduction• Directly owned and operated fabs, plus
access to industry-standard third-party
foundries• Long fabrication process life
• On-shore production paths for mosttechnologies
onsemiCustom Foundry Services Overview
onsemi has a broad portfolio of custom andstandard foundry offerings, including mixed-signal
processes.

Our technology is design-ready with excellent,easy-to-download design kits through the MyON
link on the www.onsemi.com Web site.

Our mixed-signal processes with high voltage andlow power options are ideally suited for products
in ROIC applications and in military, aerospace,automotive, medical and industrial markets.

Trusted Source
onsemi is a registered ITAR supplier and has also
been granted Category 1A Trusted Design, Trusted
Test, and Trusted Foundry accreditation for its onshore fabrication facilities in Idaho and Oregon.

Other offerings include custom process installation& modification, custom short-loop wafer processing,and back-end services, such as backside
metallization, wafer thinning, probe, packaging,
test, and logistics.

Company Certifications
IATF 16949, ISO 9001, AS 9100, ISO 14001, MILPRF-38535, OHSAS-18000, CTPAT, STACK, and
QML.

Service-Oriented

Process Longevity

onsemi understands customer needs and isdedicated to meeting them, from unsorted wafers
to tested and packaged units. Customers are
paired with a single contact for all business andtechnical issues for consistent support from initial
engagement to production.

onsemi’s philosophy for process longevity means
we keep needed processes around to accommodate
your long-term needs. We are committed tosupporting long-life products and are dedicated tobuilding long-term relationships. Supporting this is
the company’s financial strength and commitment
to the effective use of resources. As a result, ourcustomers have the confidence to make long-term
product decisions without the concern of process
obsolescence.

With high-quality manufacturing facilities in the
U.S., Europe and Asia, onsemi delivers prompt,
cost-effective solutions to electronic manufacturers
worldwide.
Node
(mm)
0.065

0.18

0.25

0.35

0.5

ProcessName
ONK65BCD*
ONK65
I4T + I4Te +I4Te SOI
ONC18 18v18v
ONC18 5v30v
ONC18 G/MS
ONBCD25
ONC25
C3
I3T80
I3T50
I3T25
C5

No.
Metal
Layers

Wafer
Size
(mm)

Operating
Voltage(Vgs )

HV
Devices
(Vds)

5–8
5–8
4–6

300
300
200

1.2, 1.8, 2.5, 3.3
1.2, 1.8, 2.5, 3.3
1.8, 3.3

4–6
4–6
4–6
2–5
2–5
3–5
3–5
3–5
3–5
2–3

200
200
200
200
200
200
200
200
200
200

5, 18
1.8, 5
1.8, 3.3
1.8, 3.3
2.5, 3.3, 5
3.3, 5
3.3
3.3
3.3, 125, 12

24, 45
3.3
45, 60, 70,
120, 160
18
30
15
40
5
5
70
40
18
20

Memories

N-Ch
DMOS

P-Ch
DMOS

Yes
No
Yes

Yes
No
Yes

Yes
Yes
No

Yes
Yes
Yes
Yes
No
No
Yes
Yes
Yes
Yes

Yes
Yes
Yes
Yes
No
No
Yes
Yes
Yes
Yes

No
No
No
No
Yes
No
Yes
Yes
Yes
No

Bi-Polars Linear Cap

RAM

ROM

OTP

EEPROM

MIM
MIM
MIM

Y
Y
Y

Y
Y
Y

Y
Y
Y

Y
N
Y

MIM
MIM
MIM
MIM
MIM
PIP
MIM
MIM
MIM
PIP

Y
Y
Y
N
N
Y
Y
Y
Y
Y

Y
Y
Y
N
N
Y
Y
Y
Y
Y

Y
Y
Y
Y
Y
N
Y
Y
Y
N

Y
Y
Y
N
N
Y
Y
Y
N
Y

* In development.

Custom Foundry Solutions

Page 9Flexible Manufacturing
I4Te SOI

I4Te 70

I3T80

ONK65BCD

Voltage (Vds)• Wide variety of standard CMOS,
160 V
BCD DTI
BCD and high voltage process
120 V
BCD
offerings
CMOS
80 V
Roadmap• Flexible manufacturing available
65 V(process modifications, lot splits,
40 V
etc.)
20 V
• Multiple fab strategy to enable
dual sourcing
12 V
C5• Specialty services such as
5Vadvanced die stitching• Shuttle services & MLR for low
1V
volume prototyping
0.6 μm• DMEA Accredited Trusted Foundry
and Broker• Low volume strategic engagements• Partial fab processing, assembly & test services

I3T50

ONBCD25

I4T45

I3T25
C3

ONC25

ONC18

ONK65

0.35 μm0.25 μm
Technology Node0.18 μm

65 μm

Our commitment to long-term technology support and a wide range of process offerings enable ourcustomers to provide the highest quality end products at the most cost-effective rate.

Full-Service Custom Foundry

HIGHPERFORMANCEMIXED SIGNALTECHNOLOGIESAERO/DEFENSE &AUTOMOTIVEQUALITY
STANDARDS

FOUNDRY
PLUSSM

Capability• Design Kits for 0.5 µm to 65 nm BCD & High-Voltage
Technologies• Internal & external IP offerings• FoundryPlusSM Added-Value Services – wafer sort,thinning, backside metalization, packaging, testing• Custom Process Expertise – development,
transfers, & modifications

Experience• Servicing Foundry customers in aerospace, defense,
industrial, automotive, & consumer markets for over
50 years• Long-term strategic relationships• Flexible manufacturing options• Process longevity• Full service optimized supply chainWORLD CLASSMODELS ANDTOOLSEXTENSIVE
LIBRARIES &QUALIFIED IP

Quality

Page 10• Quality culture – Road To Zero Defects• QML (DoD) Certifications• ISO-9001, AS9100• TS-16949, ISO-26262, AEC-Q100• Trusted Supplier, ITAR Certification• OHSAS 18001

onsemiAutomotive Die/Wafer Sales
The automotive die sales program from onsemi is designed to meet the requirements of today’s automotive
market. Demands for increased component density, improved subsystem reliability, and reduced functionalcosts accompany the increasing complexity of electronic systems. onsemi offers thousands of discrete
and integrated circuit devices in chip form to address today’s market needs. Built around our manufacturing
Center of Excellence, we offer thorough electrical testing and visual inspection of every die we produce
under our bare die program.

The onsemi Advantage• Dedicated die center of excellence• 100% electrical testing per device specification• 100% visual inspection• Whole wafers or Surftape®
• Certified to ISO/TS-16949• Certified to ISO 9001
• AEC qualified die/wafers available

Wafer Sales
100% Probe

Surftape Detail

Surftape
100% Probe

Punched Plastic Carrier

Cover

Sample Saw
Inspection

100%
Inspection

100%
Inspection

Pick/Place
Surftape

Pack & Ship

Wafer Mount

100% Final
Inspection

Wafer Saw

Pack & Ship

ESD
Protective
Foam
Bare
Die

Blue Nitto
Sticky Tape Strips

Inserts

WafersStacked Wafer Carrier
100% Probe and Inspection

Custom Foundry Solutions

Page 11

Commercial Die/Wafer Sales
The commercial die sales program from onsemi is designed to meet the challenges of today’s consumer market.
Rapid device miniaturization, increased thermal and electrical performance and improved reliability requires module
designs utilizing bare die. onsemi offers thousands of products in various packaging options to meet these evolving
market requirements. Our manufacturing Center of Excellence performs electrical and visual inspection testing toensure our bare die exceed customer requirements.
Wafer Sales

The onsemi Advantage• Dedicated die center of excellence• Sample electrical testing per device specification

Surftape

Probe

Probe

Sample Saw
Inspection

Inspection

Inspection

Pick/Place
Surftape

Pack & Ship

Wafer Mount

Final
Inspection

Wafer Saw

Pack & Ship

• Whole wafers or Surftape• Certified to ISO 9001

Third-Party Partners• Micross• Semi Dice

Sales and Design AssistanceWorldwide Technical Support
www.onsemi.com/support

For a comprehensive listing of onsemi Sales Offices,
Distributors, and Rep Firms, please visit:
Americas & EMEA: www.onsemi.com/sales
China: www.onsemi.cn/sales
Japan: www.onsemi.jp/sales

HighQ is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. Arm is a registered trademarks of Arm Limited (or its
subsidiaries) in the EU and/or elsewhere. All other brand names and product names appearing in this document are trademarks of their respective holders.

onsemi,, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of theinformation, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the applicationor use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its
products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications
information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does notconvey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component inlife support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in thehuman body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part.
onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION
LITERATURE REQUESTS
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
BRD8044-17 | GELATO | POD

TECHNICAL SUPPORTNorth American Technical Support:
Voice Mail: 1 800-282-9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910

Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative

BRD8044/D