2017 Global Reporting Initiative Content Index
GRI Standard

Disclosure

Cross reference or Answer

Additional Notes

GRI 102: General Disclosures 2017
102-1

Name of organization

ON Semiconductor Corporation

102-2

Activities, brands, products and services

Activities: ON Semiconductor (NASDAQ: ON) is a publicly traded global
semiconductor company headquartered in Phoenix, Arizona. We driveenergy efficient innovations, empowering customers to reduce global
energy use. The company is a leading supplier of semiconductor-based
solutions, offering a comprehensive portfolio of energy efficient power
management, analog, sensors, logic, timing, connectivity, discrete,
SoC and custom devices. The company’s products help engineers
solve their unique design challenges in automotive, communications,computing, consumer, industrial, medical, aerospace and defense
applications. ON Semiconductor operates a responsive, reliable, worldclass supply chain and quality program, a robust compliance andethics program and a network of manufacturing facilities, sales offices
and design centers in key markets throughout North America, Europe
and the Asia Pacific regions.
Products: Standard products include Electrically Erasable
Programmable Read-Only Memory (EEPROM), Static rand-accessmemory (SRAM), bipolar transistors, insulated-gate bipolar transistor(IGBTs), thyristors, diodes, junction gate field-effect transistors (JFETs),
protection, rectifiers, amplifiers, filters, metal-oxide-semiconductor
field-effect transistor (MOSFETs), standard logic, linear regulators.

102-3

Location of headquarters

Phoenix, AZ, USA

102-4

Location of operations

Manufacturing: Belgium, Canada, China, Czech Republic, Japan,
Malaysia, Philippines, South Korea, United States, Vietnam
Design Centers: Belgium, Canada, Czech Republic, France, Germany,
India, Ireland, Japan, Korea, Philippines, Romania, Slovak Republic,
Switzerland, Taiwan, United States
Solution Engineering Centers: China, Germany, Japan, South Korea,
Taiwan, United States

102-5

Ownership and legal form

Public corporation

102-6

Markets served

Sectors: Automotive, consumer, computing, communications,networking, industrial, medical, aerospace and defense
Customers: Original equipment manufacturers, distributors, electronic
manufacturing service providers

102-7

Scale of organization

Number of employees: approximately 34,000 globally
Number of operations: 51
Net revenue: $5,543.1 million
Total capitalization: total liabilities –$4,394.1 million; total equity –$2,801.0 million
Quantity of products and services: 72.8 billion units shipped in 2017

Number of operations equals
solution engineering, design,
manufacturing and support sites
with 50+ employees

102-8

Information on employees and other workers(a) Total number of employees by
employment contract and gender

Contractors and interns:
M – 617; F – 367

All data is as of December 31,
2017.

Regular employees:
M –17,795; F – 15,713(b) Total number of employees by
employment contract and region

Contractors and interns:
Americas: 105
Asia: 847
EMEA: 32
Regular employees:
Americas: 4,582
Asia: 25,117
EMEA: 3,809(c) Total number of permanent employees
by employment type and gender

Full time:M – 18,333; F – 16,018
Part time:M – 79; F – 62

Page 2GRI Content Index – 2017

GRI Standard

Disclosure

Cross reference or Answer(d) Report whether a substantial portionof the organization’s workforce isperformed by workers who are legally
recognized as self-employed, or byindividuals other than employees
or supervised workers, including
employees and supervised employees bycontractors.

No(e) Report any significant variations in
employee numbers

N/A

102-9

Description of supply chain

ON Semiconductor’s supply chain has a multifaceted supply structureof direct materials suppliers, foundry and subcontractor providers,indirect material suppliers and professional service providers deployed
across a global sourcing and procurement organization. In 2017 thecompany worked with over 8,000 suppliers and service providers inNorth America, Asia Pacific, Europe and the Middle East of whichapproximately 4,600 were production-related. The various categories
of suppliers are managed through both centralized strategic sourcing
organizations and site procurement teams.

102-10Significant changes to organization and supply
chain

N/A

102-11

Precautionary principle approach

ON Semiconductor has an enterprise risk management (ERM)
program which addresses the precautionary principle. The goal of
the company’s ERM program is to systematically, consistently andeffectively identify, evaluate, prioritize, and manage key risks affecting
the company. To learn more about ON Semiconductor’s ERM program,please refer to page 11 of the company’s 2017 Corporate Social
Responsibility Report.

102-12External initiatives

Boston College Center for Corporate Citizenship
Carbon Disclosure Project
China Power Supply Society
Corporate Secretaries and Governance Professionals
Electronic Components Industry Association
Ethisphere’s Business Ethics Leadership Alliance
Europe’s Energy for Green Society ENIAC JU Project
Fab Owners Association
Global Semiconductor Alliance
Hearing Industries Association
Malaysian Institute of Integrity and Corporate Integrity Pledge
Microelectronic Industry Design Association (MIDAS) IrelandMotor Equipment Manufacturers Association/ Original Equipment
Suppliers Association (MEMA/OESA)
National Association of Corporate Directors
Power Sources Manufactures Association (PSMA)
Responsible Business Alliance (RBA) and their Environmental
Sustainability, Conflict Minerals, Indirect Spend, and Validated Audit
Process (VAP) workgroups
Responsible Minerals Initiative (RMI)
Semiconductor Electronic Industries in Philippines Inc. (SEIPI)
Semiconductor Industry Association (SIA)
Society of Corporate Compliance and Ethics
Sustainability Reporting Group, American Council for an EnergyEfficient Economy (ACEEE)World Semiconductor Council (WSC)

102-13

Membership of associations

Arizona State University, Jeffrey Wincel, Member of Board of Trustees
Association of Corporate Counsel, Mark Rogers, President (Arizona
Chapter)
CEB Compliance & Ethics Leadership Council, Founding Member
Electronic Components Industry Association, Jeff Thompson, Memberof Board of Directors
Juvenile Diabetes Research Foundation, Desert Southwest Chapter,
Kris Pugsley, Member of Board of Directors
Semiconductor Industry Association (SIA), Keith Jackson, Member ofBoard of Directors

ON Semiconductor

Additional Notes

Page 3

GRI Standard

Disclosure

Cross reference or Answer

102-14

Statement from senior decision-makerSee a letter from ON Semiconductor’s President and CEO on page 1of the company’s 2017 Corporate Social Responsibility Report. For
further details on impacts, risks and opportunities please see thecompany’s 2017 SEC Form 10-K.

102-16

Description of organization’s values, principles,standards, and norms of behavior

ON Semiconductor’s Code of Business Conduct outlines the company’svalues, principles, standards and norms of behavior. It is reviewed
annually and all employees and board of directors must read andsign the Code of Business Conduct on an annual basis. Within
ON Semiconductor’s Code of Business Conduct is information on thecompany’s core values:

Additional Notes• Respect: We treat each other with dignity and respect. We
share information and encourage different views in an open
and honest environment. We draw out the best in each other,recognizing that diversity of backgrounds and experience are
key strengths. We all win when we support each other.
• Integrity: We mean what we say and say what we mean. Our
Company has set high standards for our products and individual
conduct. Our reputation depends on the highest standardsof ethical behavior. We are accountable for delivering out
commitments on time with highest quality. We address issues
objectively, using facts and constructive feedback in a work
atmosphere where we do not fear open discussion or questions.
When a decision has been made, we work to support it. We
comply with all legal requirements and hold ourselves to thehighest standards of ethical conduct.
• Initiative: We value people who demonstrate a positive,“can-do” attitude, while collaborating to win. We work
intelligently, with a sense of urgency, while always maintaining
our commitment to comply with applicable laws, regulations
and standards. If a problem exists, we see it through to rapid
resolution while acting in an ethical manner. Each of us is
expected to demonstrate these core values in our roles at
ON Semiconductor. These values apply equally to us all –employees and directors alike.
Please see ON Semiconductor’s CSR Statement of Commitment for
information on the company’s sustainability-related principles.
102-18Governance structure

Governance structure: Board of Directors
Board of Director Committees: Audit Committee, Compensation
Committee, Corporate Governance and Nominating Committee,
Executive Committee, Integration and Oversight Committee andScience and Technology Committee
Committee responsible for decision making on environmental andsocial impacts: Audit Committee; Corporate Social Responsibility
Steering Committee

102-40

List of key stakeholder groups

Employees, customers, suppliers, governments, non-government andnon-profit organizations, communities and investors.

102-41

Percentage of employees covered by collective
bargaining agreements

22.4% globally

102-42 – 102-43

Identifying and selecting stakeholders;Approach to stakeholder engagement

ON Semiconductor believes that the views of its stakeholders areimportant in making operational and strategic decisions. The company
identifies stakeholders that either have a significant impact on or are
significantly impacted by ON Semiconductor’s operations. The method
and frequency of engagement varies by stakeholder type. However,the company aims to engage stakeholders through conferences,membership and associations, surveys, reporting, scorecards,
assessments, philanthropy, employee volunteerism and social media
throughout the year. Further detail on how the company engages
its stakeholders can be found on page 52 of the company’s 2017
Corporate Social Responsibility Report.

Page 4

GRI Content Index – 2017

GRI Standard

Disclosure

Cross reference or Answer

102-44

Key topics and concerns raised

To see key topics raised and issues considered most important by our
stakeholders and company, please see pages 52 of the company’s
2017 Corporate Social Responsibility Report.

102-45

Entities included in the consolidated financial
statements

See Item 1 Business overview and Exhibit 21.1 of 2017 SEC Form 10-K

102-46

Defining report content and topic boundaries

See Report Overview on page 3 of the company’s 2017 Corporate
Social Responsibility Report.

102-47

List of material topics

See Material Topics on page 53 of the company’s 2017 Corporate
Social Responsibility Report.

102-48

Restatements of informationNone

102-49Changes in reportingNone

102-50

Reporting period

2017102-51

Date of most recent report

July, 2017102-52

Reporting cycle

Annual102-53

Contact point for questions

Keenan Evans, Senior Vice President, Corporate Social Responsibility

102-54Claims of reporting in accordance with the GRI
Standards

This report has been prepared in accordance with GRI Standards: Core
option.

102-55GRI Content Index

See page 56 of the company’s 2017 Corporate Social Responsibility
Report.

102-56External assurance

ON Semiconductor has not sought external assurance for the contents
included in the company’s 2017 Corporate Social Responsibility Reportand GRI Content Index. However, certain data included is subject toexternal review and all information provided is reviewed internally.

Additional Notes

GRI 103: Management Approach 2017
103-1

Explanation of material topic and its boundary

See Material Topics and Aspect Boundaries on pages 52 – 54 of thecompany’s 2017 Corporate Social Responsibility Report.

103-2

Management approach for material topics

For management approach on our material topics, please see thecompany’s 2017 Corporate Social Responsibility Report.

103-3

Evaluation of management approach

For evaluation of management approach, please see the company’s
2017 Corporate Social Responsibility Report.

GRI 201: Economic Performance 2017
201-1

Direct economic value generated anddistributed (EVG&D)(a) Direct economic value generated

Revenue: $5,543.1 million
Proceeds from sale of assets: $14.3 million(b) Economic value distributed

Cost of revenue: $3,509.3 million
Operating cost: $1,352.9 million
Cash paid for employee wages and benefits: N/A
Cash paid for interest: $92.1 million
Cash paid for taxes: $67.8 million(c) Economic value retained

Net income: $820.3 million(d) EVG&D by country, regional, or market
levelsSee 2017 SEC Form 10-K – Segment Information

201-2

Financial implications and other risks andopportunities due to climate change

To learn about ON Semiconductor’s approach to climate change,
please see page 40 of the company’s 2017 Corporate Social
Responsibility Report.

201-3

Defined benefit obligation plans and otherretirement plans

See ON Semiconductor’s website for Regional Benefits Summaries and2017 SEC Form 10-K.

201-4

Financial assistance received from government

N/A

ON Semiconductor

ON Semiconductor does not
publicly disclose cash paid for
employee wages and benefits.

ON Semiconductor does
not publicly disclose thisinformation.

Page 5GRI Standard

Disclosure

Cross reference or Answer(a) Ratio of standard entry level wage by
gender compared to local minimum
wage

All ON Semiconductor employees are compensated at or above
minimum wage. Minimum wage in all listed regions is gender neutral.

(b) When a significant proportion ofother workers (excluding employees)
performing the organization’s activities
are compensated based on wages
subject to minimum wage rules, describe
the actions taken to determine whether
these workers are paid above minimum
wage.

“Other workers” in this case pertain to employees of
ON Semiconductor suppliers or on-site service providers (e.g. janitorial
staff, cafeteria workers, security, etc.). The company conducts risk
assessments and/or on-site verification of suppliers and on-site service
providers to ensure that RBA standards and legal requirements arebeing met, including those related to minimum wage.

(c) Definition used for ‘significant locationsof operation’.

Manufacturing locations(a) Proportion of senior management hiredfrom the local community

72%(b) Definition used for ‘significant locationsof operation’.

Manufacturing locations

Additional Notes

GRI 202: Market Presence 2017
202-1

202-2

Senior management is siteleader. Local means the country
in which site is located.

GRI 204: Procurement Practices 2017
204-1

Proportion of spending on local suppliers

Asia: 90%; Americas: 92%; EMEA: 77%

GRI 205: Anti-corruption 2017
205-1

205-2

Operations assessed for risks related tocorruption(a) Total number and percentage of
operations assessed for risks related tocorruption

Outside of RBA responsibilities, ON Semiconductor assesses otherrisks related to the company’s operations. All manufacturing locations(100%) were initially considered when risk was assessed, and risks areassessed on an ongoing basis. The company sells its products aroundthe world, and the risk assessment was based on types and locationsof customers.

(b) Significant risks related to corruption
identified through risk assessment

While there are no significant risks that were identified, some areas
presented a greater risk than other areas. In assessing the risks related
to corruption, a major factor is the ranking of the country in which
the factory is located according to the Transparency International
Corruption Perceptions Index. For the 10 countries in which we havefactories, two countries were in the lower half of the 2017 country
rankings – the Philippines (ranked 114) and Vietnam (ranked 113).
Additionally, we have a greater risk with customers in China (ranked80) because a number of electronics manufacturers are state owned
enterprises and their employees are considered government officials
under the U.S. Foreign Corrupt Practices Act.

Communication and training about anticorruption policies and procedures(a) Total number and percentage ofgovernance body members thatthe organization’s anti-corruption
policies and procedures have beencommunicated(b) Total number and percentage of
employees that the organization’s anticorruption policies and procedures havebeen communicated to, broken down by
employee category and region.

Page 6Nine (100%) board members, all of whom are in the United States,
Europe or Asia Pacific received communication on the company’s anticorruption policy.

100% of our employees globally (Asia: 22,540; North America;
4,407; EMEA: 3,208) received communication on the company’s
anti-corruption policy through annual Code of Business Conduct
rollout and training in 2017. Additionally, 10,461 employees (Asia:
5,629; North America: 2,930; EMEA: 1,902), making up 30% of ourorganization, received specialized training on anti-corruption in 2017.
Targeted training is provided to compliance and ethics liaisons, EHS,
facilities, finance, sales and marketing, supply chain, human resources,
legal and security professionals.

GRI Content Index – 2017

GRI Standard

205-3

Disclosure

Cross reference or Answer(c) Total number and percentage ofbusiness partners that the organization’s
anti-corruption policies and procedures
have been communicated to, broken
down by type of business partner andregion. Describe if the organization’s
anti-corruption policies and procedures
have been communicated to any otherpersons or organizations.

ON Semiconductor does not maintain a database of business partners
who have received information regarding the policies. The policies areincluded as a regular part of the company’s contracts with distributors
and suppliers working on its behalf.

(d) Total number and percentage ofgovernance body members that havereceived training on anti-corruption,broken down by region.

Nine (100%) board members, all of whom are in the United States,
Europe or Asia Pacific are provided training on the company’s Code ofBusiness Conduct, which includes a component on anti-corruption.

(e) Total number and percentage of
employees that have received training
on anti-corruption, broken down by
employee category and region.

100% of our employees globally (Asia: 22,540; North America;
4,407; EMEA: 3,208) received communication on the company’s
anti-corruption policy through annual Code of Business Conduct
rollout and training in 2017. Additionally, 10,461 employees (Asia:
5,629; North America: 2,930; EMEA: 1,902), making up 30% of ourorganization, received specialized training on anti-corruption in 2017.
Targeted training is provided to compliance and ethics liaisons, EHS,
facilities, finance, sales and marketing, supply chain, human resources,
legal and security professionals.

Confirmed incidents of corruption and actions
taken

Additional Notes

ON Semiconductor does not have knowledge of any confirmed
incidents of corruption.

GRI 206: Anti-Competitive Behavior 2017
206-1

Legal actions for anti-competitive behavior,anti-trust or monopoly practices

ON Semiconductor does not have knowledge of any legal actions
pending or completed during the reporting period regarding
anticompetitive behavior and violations of anti-trust and monopoly
legislation in which the organization has been identified as aparticipant.

GRI 301: Material 2017
301-1

Materials used by weight or volume

N/A

301-2

Percentage of recycled input materials used to
manufacturing organization’s primary products
and services

N/A

301-3

Reclaimed products and their packaging
materials

ON Semiconductor’s take-back and recycle program provides
customers with an environmentally responsible solution for the return,recycling and disposal of their products, including evaluation printed
circuit boards. This program is designed to ensure compliance withthe current and forthcoming regional regulations involving producer
responsibility for recycling and proper disposal of electronic waste
products.

ON Semiconductor spends
over $1 billion on various
parts and raw materials as
the company manufactures
both at internal and externalsites. ON Semiconductor
does not track or estimate
the raw material used in key
manufacturing locations.

GRI 302: Energy 2017
302-1

ON Semiconductor(a) Total fuel consumption within theorganization from non-renewablesources, including fuel types used

629,896 gigajoules(b) Total fuel consumption within theorganization from renewable sources,
including fuel types used

N/A(c) Electricity consumption

1,283,878,940 kWh

Total fuel consumption from
non-renewable sources istracked for manufacturing
facilities. Includes natural gas
and diesel.

Heating, cooling and steam is
not tracked.

Page 7

GRI Standard

Disclosure
N/A

None sold(e) Total energy consumption within theorganization

1,458,855,278 kWh (5,251,879 gigajoules)

Includes electricity, natural gas
and diesel fuel consumption at
manufacturing sites only.

(f) Standards, methodologies, assumptions
and/or calculation tools used

kWh rate per union volume of fuel type(g) Conversion factors used

U.S. Department of Energy

Energy consumption outside the organization

302-3

302-5

Additional Notes(d) Electricity, heating, cooling and steam
sold

302-2

302-4

Cross reference or Answer

N/A

Not evaluated(a) Energy intensity ratio for organization

Wafer fab energy (electricity & fuel) normalization = 0.067 kWh per
unit
Assembly & test energy (electricity & fuel) normalization = 1.414 kWh
per KWBonds.

Intensity ratio calculated
separately for wafer fabs and for
assembly & test operations.

(b) Organization-specific metric (thedenominator) chosen to calculate theratio

Wafer fab normalization unit based on photo move volume. Assembly& Test normalization unit based on wire bond volume.

(c) Types of energy included in the intensity
ratio; whether fuel, electricity, heating,cooling, steam, or all

Electricity and fuel.

(d) Whether the ratio uses energy
consumption within the organization,
outside of it, or both

Includes energy consumed within the organization.

(a) Amount of reduction in energy
consumption achieved as a direct resultof conversation and efficiency initiatives

Wafer fabs: 14.0 % reduction compared to 2016 energy consumption(normalized)
Assembly & Test: 8.6% reduction compared to 2016 energy
consumption (normalized)(b) Types of energy, included in the
reductions

Electricity and fuel(c) Basis for calculating reductions in energy
consumption

Annual comparison(d) Standards, methodologies, assumptions,
and/or calculation tools used

kWh rate per unit volume of fuel type

Reductions in energy requirements of productand services

N/A

GRI 303: Water 2017
303-1(a) Water withdrawal by source

12,169,049,481 liters(b) Standards, methodologies andassumptions used

Direct measurement

303-2

Water sources significantly affected bywithdrawal of water

303-3(a) Water recycled and reused

5,330,683,822 liters(b) Total volume of water recycled andreused as a percentage of total water
withdrawal

44%(c) Standards, methodologies, andassumptions used

Recycled water excludes water used in continuous loop

Quantity not evaluatedaccording to source.

Water sources are not evaluated.
ON Semiconductor’s conservation projects reduced water consumption
by 14% at our wafer fabs and 15% at our assembly and test sites
compared to 2016.

GRI 304: Biodiversity 2017
304-1

Operational sites owned, leased, managed in,Noneor adjacent to, protected areas and areas ofhigh biodiversity value outside protected areas.

304-2

Significant impacts of activities, products andservices on biodiversity

N/A

304-3

Habitats protected or restored

None

Page 8GRI Content Index – 2017

GRI Standard

Disclosure

Cross reference or Answer

Additional Notes

GRI 305: Emissions 2017
305-1

305-2

(a) Direct (Scope 1) GHG emissions

1,416,622 MTCO2(b) Gases included in the calculation;
whether CO2, CH4, N2O, HFCs, PFCs,
SF6, NF3, or all.

CO2, N2O, NF3, CF4, CHF3, C3HF, C2F6, C4F8, C5F8, SF6(c) Biogenic CO2 emissions in metric tons of
CO2 equivalent.

N/A(d) Base year for the calculation, if
applicable, including:2015– The rationale for choosing it;

Annual comparison– Emissions in the base year

1,235,385 MTCO2– Context for any significant changes
in emissions that triggered
recalculations of base year emissions

Acquisition of Fairchild Semiconductor in September 2016(e) Source of the emission factors and theglobal warming potential (GWP) rates
used, or a reference to the GWP source.

IPCC methodology(f) Consolidation approach for emissions;
whether equity share, financial control,or operational control.

Operational control(g) Standards, methodologies, assumptions,
and/or calculation tools used.

IPCC methodology(a) Energy indirect (Scope 2) GHG emissions

649,589 MTCO2(b) If applicable, gross market-based energy
indirect (Scope 2) GHG emissions inmetric tons of CO2 equivalent.

N/A(c) If available, the gases included in thecalculation; whether CO2, CH4, N2O,
HFCs, PFCs, SF6, NF3, or all.

Not available(d) Base year for the calculation, if
applicable, including:2015– The rationale for choosing it;

Emissions are tracked for
manufacturing facilities,
reported each quarter andcompared to average quarterly
consumption in the prior year.
Calculation includes fuel and
PFCs but does not include
transportation.

Emissions are tracked for
manufacturing facilities,
compared to average quarterly
consumption in the prioryear and includes electricity
purchased from utility.

Annual comparison– Emissions in the base year;
606,432 MTCO2– The context for any significant
changes in emissions that triggered
recalculations of base year emissions

ON Semiconductor

Acquisition of Fairchild Semiconductor in September 2016(e) Source of the emission factors and theglobal warming potential (GWP) rates
used, or a reference to the GWP source.

CO2 per kWh Electricity (gram) rate provided by utility source for eachfactory(f) Consolidation approach for emissions;
whether equity share, financial control,or operational control.

Operational control(g) Standards, methodologies, assumptions,
and/or calculation tools used.

CO2 per kWh Electricity (gram) rate provided by utility source for eachfactory.

Page 9

GRI Standard
305-3

305-4

305-5

Disclosure
Other indirect (Scope 3) GHG emissions

Cross reference or Answer

Additional Notes

N/A

ON Semiconductor does
not regularly measure theenvironmental impact of
scope 3 emissions. A study
was conducted several years
ago to measure the change in
ON Semiconductor’s carbon
footprint as it related tochanges the company made in
their logistics network. It was
found that as the company
optimized their network to cuttransportation cost there wasa correlation to improving thecompany’s carbon footprint.

(a) GHG emissions intensity

Wafer fab GHG emissions (electricity, fuel, PFCs)
normalization = 37.592 grams carbon equivalent per unit
Assembly & test energy (electricity, fuel, PFCs ) normalization =267.745 grams carbon equivalent per kWBonds

Intensity ratio calculated
separately for wafer fabs and for
assembly & test operations.

(b) Organization-specific metric(denominator) chosen to calculate ratio

Wafer fab normalization unit based on photo move volume. Assembly& test normalization unit based on wire bond volume.

(c) Types of GHG emissions included in theintensity ratio

Direct (Scope 1) and indirect (Scope 2)(d) Gases included in the calculation;
whether CO2, CH4, N2O, HFCs, PFCs,
SF6, NF3, or all.

CO2, N2O, NF3, CF4, CHF3, C3HF, C2F6, C4F8, C5F8, SF6(a) Reduction of GHG emissions

67,675 metric tons of CO2 through 47 projects in 6 countries(b) Gases included in the calculations;
whether C02, CH4, N2O, HFCs, PFCs, SF6,
NF3, or all.

N/A(c) Base year or baseline, including therationale for choosing it.

2015; Annual comparison(d) Scopes in which reductions took place;whether direct (Scope 1), energy indirect(Scope 2), and/or other indirect (Scope
3).

Energy indirect (scope 2)(e) Standards, methodologies, assumptions,
and/or calculation tools used.

CO2 per kWh Electricity (gram) rate provided by Utility source for eachproject.

305-6

Emissions of ozone-depleting substances
(ODS)

Zero

305-7

Nitrogen oxides, sulfur oxides, and othersignificant air emissions

Air emissions do not exceed local regulation air emission permit limits.
Emission concentrations are tracked at local facilities; data is not
calculated for global value.

ODS included in calculation

GRI 306: Effluents and Waste 2017306-1

Water discharge by quality and destination

306-2(a) Total weight of hazardous waste, witha breakdown by the following whereapplicable:– ReuseIndustrial water discharge is managed per local regulation. Discharge
is monitored at local facilities; data is not calculated for global value.

Included in recycle– Recycle

3,799,503 kg– Composting

N/A– Recovery, including energy recovery
Included in recycle

Page 10– Incineration (mass burn)

N/A– Deep well injection

N/A– Landfill

N/A– On-site storage

N/A

GRI Content Index – 2017

GRI Standard

Disclosure– Other (to be specified byorganization)(b) Total weight of non-hazardous waste,with a breakdown by the following
disposal methods where applicable:– Reuse

Cross reference or Answer

Additional Notes

Hazardous waste disposal site: 6,345,210 kg

Included in recycle– Recycling

9,719,278 kg– Composting

N/A– Recovering, including energy recovery
N/A– Incineration (mass burn)

N/A– Deep well injection

N/A– Landfill

12,032,012 kg– On-site storage

N/A– OtherN/A(c) How the waste disposal method has
been determined

Information provided by the waste disposal contractor; organizational
defaults of the waste disposal contractor

306-3

Significant spills

None

306-4

Hazardous waste transported

6,345,210 kg

Hazardous waste imported

Zero

Hazardous waste exported

Location and amount tracked at manufacturing facilities.

Hazardous waste treated

Location and amount tracked at manufacturing facilities.

Percentage of hazardous waste shippedinternationally

N/A

Standards, methodologies and assumptions
used

N/A

Water bodies affected by water discharges
and/or runoff

Not evaluated306-5

GRI 307: Environmental Compliance 2017
307-1

Non-compliance with environmental laws andregulations

None of significant value

GRI 308: Supplier Environmental Assessment 2017308-1

New suppliers that were screened using
environmental criteria

New suppliers are not pre-screened using environmental
criteria. However, all suppliers are provided ON Semiconductor’s
Corporate Social Responsibility Statement of Commitment throughON Semiconductor’s Supplier Handbook. Furthermore top suppliersby spend are required to sign ON Semiconductor’s Corporate Social
Responsibility Statement of Conformance and complete a risk
assessment with environmental criteria every other year.

308-2

Negative environmental impacts in the supply
chain and actions taken

ON Semiconductor is not aware of any negative environmental
impacts in the supply chain for 2017.

GRI 401: Employment 2017
401-1

New employee hires by age group, gender andregionAge
Under 30 years: 5,197
30 – 50 years: 2,179
50+ years: 244
Gender:M – 3,982; F – 3,638
Region:Americas: 695
Asia: 6,247
EMEA: 678

ON Semiconductor

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GRI Standard

Disclosure
Employee turnover by age group, gender andregionCross reference or Answer
Age:
Under 30 years: 1,450
30 – 50 years: 1,270
50+ years: 396

Additional Notes
15 (0.5%) cases of turnover by
age are unavailable for 2017.

Gender:M – 1,807 ; F – 1,324
Region:Americas: 435
Asia: 2,397
EMEA: 299
401-2

Benefits provided to full-time employees thatare not provided to temporary employees

N/A

ON Semiconductor does notdisclose this information
publicly.

401-3

Parental leave

N/A

ON Semiconductor does notdisclose this information
publicly.

GRI 402: Labor/Management Relations 2017402-1(a) Minimum notice periods regarding
operational changes

ON Semiconductor provides advance notice or makes changes to thecontract mid-term by mutual consent in accordance with collective
bargaining agreements entered and local requirements in the different
locations where the company operates.

(b) For organizations with collective
bargaining agreements report whether
the notice period and provisions for
consultation and negotiation are
specified in collective agreements.

Belgium: No
Czech Republic: No
China YesJapan: Yes
Korea: No
USA: Yes
Vietnam: No

GRI 403: Occupational Health and Safety 2017
403-1

403-2

Page 12(a) Worker representation in formal joint
management-worker health and safetycommittees

Formal joint management – worker health and safety committees
exist at an operational level. Employees participate in the safety andhealth management system at all factory locations.

(b) Percentage of workers whose work,or workplace, is controlled by theorganization, that are represented byformal joint management-worker healthand safety committees.

78%

Types of injury and rates of injury, occupational
diseases, lost days, and absenteeism, andnumber of work-related fatalities

Injury rate (including first aid cases): 0.99 per 100 employees• Abrasion: 10%• Avulsion: 0.4%
• Burn: 4%• Concussion: 0.4%
• Contusion: 9%• Crushing: 1%• Cumulative stress disorder: 5%• Cut: 8%• Fracture – closed: 1.1%
• Inflammation: 2%• Irritation: 12%• Laceration: 8%• Puncture: 3%• Sprain: 6%• Sting: 0.4%
• Strain/torn muscle: 19%
Occupational disease rate: <0.02 per 100 employees
Absentee rate: not tracked at a corporate level
Lost days: 2.29 per 100 employees (calendar days, beginning the day
after the incident)
Work related fatalities: Zero

Data not published by region orgender.

GRI Content Index – 2017

GRI Standard

Disclosure

Cross reference or Answer

The system of rules applied in recording andreporting accident statistics.

Injury incidents are tracked and reported to the local government
per legal requirements at all locations. All manufacturing facilities
report injury incidents including first aid only to corporate EHS.
Regional analysis is not conducted. The corporate EHS level data did
not include: independent contractors, gender of person injured orabsentee rate.

403-3

Workers with high incidence or high risk of
diseases related to their occupation

None

403-4

Health and safety topics covered in formal
agreements with trade unions(a) Whether Health and safety topics
covered in formal agreements with tradeunionsYes(b) Extent (%)

Additional Notes

10

GRI 404: Training and Education 2017404-1

Average hours of training per year per
employee
By region

ON Semiconductor does nottrack average training hours per
employee.

404-2

Programs for upgrading employee skills andtransition assistance programs

ON Semiconductor offers a variety of training programs, including but
not limited to:• 8D training• Anti-corruption• Anti-harassment• Business acumen• Code of business conduct• Communication skills• Corporate social responsibility (including Responsible Business
Alliance)• EHS• English• Information security awareness• Leadership• Lean Six Sigma• Microsoft office• Modification and repair of electronics assembly• Program Management• Semiconductor device physics• Softskills training
The company provides transition assistance in special situations.
Examples include job placement assistance and resume writing
services.

404-3

Percentage of employees receiving regularperformance review and career development
areas

100% of employees in all gender and employee categories received aperformance appraisal in 2017.

GRI 405: Diversity and Equal Opportunity 2017
405-1

Percentage of individuals within theorganization’s governance bodies in each of
the following diversity categories:(a) Gender:

Under 30 years: 0%30 – 50 years: 0%
Over 50 years: 100%(c) Other

N/A

Percentage of employees per employee
category in each of the following diversity
categories:(a) Gender

ON Semiconductor

M – 89%; F – 11%(b) Age group

Contractors and Interns:
M – 63%; F – 37%
Regular employees:
M – 53%; F – 47%

Page 13GRI Standard

Disclosure(b) Age group

Cross reference or Answer

Additional Notes

Contractors and Interns:
Under 30 Years Old: 73%
30-50 Years Old: 24%
Over 50 Years Old: 3%
Regular employees:
Under 30 Years Old: 33%
30-50 Years Old: 52%
Over 50 Years Old: 15%(c) Other405-2

Ratio of basic salary and remuneration of
women to men

Regular employees:
American Indian or Alaska Native: 0.3%
Asian: 15.4%
Black or African American: 1.4%
Hispanic or Latino: 4.2%
Native Hawaiian or other Pacific Islander: 0.4%
Two or more races: 0.7%
White: 64.1%
Undeclared: 13.7%

Race and ethnicity statistics
provided is for the U.S. only.

N/A

ON Semiconductor does
not publicly disclose thisinformation.

GRI 406: Non-Discrimination 2017406-1

Incidents of discrimination and corrective
actions taken

None known

GRI 407 – 409: Freedom of Association and Collective Bargaining, Child Labor and Forced Labor 2017407-1 – 409-1

Operations and suppliers in which the rightof freedom of association and collective
bargaining may be at risk; operations andsuppliers at significant risk of incidents of childlabor; operations and suppliers at significant
risk of incidents of forced labor.

ON Semiconductor works with suppliers in countries where the riskof violating labor and human standards is recognized as being higher.
To actively address this, ON Semiconductor requires suppliers tocomplete self-assessment questionnaires, provides training and also
conducts on-site verification. In the event that any risk of violating
the right to freedom of association, existence of child labor or forcedlabor is identified, ON Semiconductor works closely and diligently with
its suppliers through corrective action plans. If the nonconformance
is not adequately addressed by the supplier in a timely fashion,
ON Semiconductor may choose to terminate its contract with the
supplier.
For more information on the company’s management systems related
to child labor and forced labor please see page 34 of the company’s
2017 Corporate Social Responsibility Report.

GRI 410: Security Practices 2017
410-1

Security personnel trained in human rights
policies or procedures

ON Semiconductor uses both in-house and third party organizations
for security personnel. Approximately 90% of security personnel aretrained in the company’s human rights policies.

GRI 411: Rights of indigenous Peoples 2017411-1

Incidents of violations involving rights ofindigenous peoples

To the best of ON Semiconductor’s knowledge there have been no
identified incidents of violations involving the rights of indigenous
peoples during the reporting period.

GRI 412: Human Rights Assessments 2017412-1

Operations that have been subject to humanrights reviews or impact assessments

ON Semiconductor manufacturing sites are subject to corporate
internal and RBA Valid Audit Process (VAP) audits. The audit criteria
pertaining to labor and health and safety cover human rights topics.

412-2

Employee training on human rights policies
and procedures

100%

412-3

Significant investment agreements andcontracts that include human rights clauses orthat underwent human rights screening

Contracts with suppliers contain terms and conditions related
to human rights, such as forced and indentured labor and equal
employment opportunity. The company’s master service agreements
also contain terms and conditions related to the RBA Code of Conduct.

Page 14GRI Content Index – 2017

GRI Standard

Disclosure

Cross reference or Answer

Additional Notes

GRI 413: Local Communities 2017413-1

Operations with local community engagement,
impact assessments, and development
programs

All ON Semiconductor sites globally are involved with community
engagement and development programs through the company’s
workplace giving program and employee volunteerism. To learn more
about the company’s community engagement efforts, please see
the Our Community section of the company’s 2017 Corporate Social
Responsibility Report.

413-2

Operations with significant actual andpotential negative impacts on local
communities

None

GRI 414: Supplier Social Assessment 2017414-1

New suppliers that were screened using social
criteria

New suppliers are not pre-screened against social criteria. However, all
suppliers are provided ON Semiconductor’s Supplier Handbook whichreferences the company’s Corporate Social Responsibility Statementof Commitment. Furthermore top suppliers by spend are required tosign ON Semiconductor’s Corporate Social Responsibility Statementof Conformance and complete a risk assessment with social criteria
every other year.

414-2

Negative social impacts in the supply chain
and actions taken

ON Semiconductor works closely and diligently with its suppliers. If
negative social impacts are identified within the company’s supply
chain, ON Semiconductor works with its suppliers to address thoseissues through corrective action plans.

GRI 415: Public Policy 2017415-1

Political contributions

None

GRI 416: Customer Health and Safety 2017
416-1

Assessment of health and safety impacts ofproduct and service categories

Over 95% of ON Semiconductor products are available in leadfree (Pb-free) packaging. ON Semiconductor also supports the aimof REACH in improving the protection of human health and theenvironment through better and earlier identification of the intrinsic
property of chemical substances. ON Semiconductor meets REACH
requirements and is committed to provide customers with information
about substances in their products according to REACH requirements.

416-2

Incidents of non-compliance concerning thehealth and safety impacts of products andservices

ON Semiconductor is not aware of any non-compliance concerning thehealth and safety impacts of their products and services.

GRI 417: Marketing and Labeling 2017417-1

Requirements for product and service
information and labeling:(a) The sourcing of components of productor service

Not required(b) Content, particularly with regard to
substances that might produce anenvironmental or social impact

Per labeling requirements of JEDEC standard JESD97, all shippinglabels show whether or not the products are Restriction on Hazardous
Substances (RoHS) compliant/Pb-free. ON Semiconductor labeling also
indicates information regarding hazardous material to comply with
the China RoHS directive.

(c) Safe use of the product or service

Not required(d) Disposal of the product andenvironmental or social impacts

Not required

Percentage of significant product or service
categories by and assessed for compliancewith such procedures.

N/A

417-2

Incidents of non-compliance concerning
product and service information and labelingTo the best of ON Semiconductor’s knowledge the company has notreceived fines for non-compliance concerning product and service
information and labeling.

417-3

Incidents of non-compliance concerningmarketing communication

ON Semiconductor is not aware of any non-compliance concerningmarketing communication.

ON Semiconductor

The company does not evaluate
this metric.

Page 15

GRI Standard

Disclosure

Cross reference or Answer

Substantiated complaints concerning breachesof customer privacy and losses of customerdata

ON Semiconductor is not aware of any such substantiated complaints.

Additional Notes

GRI 418: Customer Privacy 2017
418-1

GRI 419: Socioeconomic Compliance 2017
419-1

Page 16

Non-compliance with laws and regulations inthe social and economic area

To the best of ON Semiconductor’s knowledge the company has
not received significant fines or non-monetary sanctions for noncompliance with laws or regulations in the social or economic areas.

GRI Content Index – 2017

®

ON Semiconductor ®
5005 East McDowell Road, Phoenix, Arizona 85008 USA

www.onsemi.com

CONTACT US
ON Semiconductor Headquarters
5005 East McDowell Road
Phoenix, AZ 85008
USA

ON Semiconductor Website: www.onsemi.com
Corporate Social Responsibility Page: www.onsemi.com/social-responsibility
Corporate Environmental Programs Page: www.onsemi.com/evp
Visit us on:

Tel: (602) 244-6600
Customer Inquiries: (888) 743-7826
Contact for CSR report inquiries: Keenan Evans, Senior Vice President, Global Quality, Reliability, EHS and Corporate Social Responsibility

ON Semiconductor

Page 17

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