Handling and Assembly Guide for SCD30
CO2, humidity, and temperature sensor
PrefaceThis document provides recommendation on handling andassembly process of SCD30.
To measure CO2 concentration, humidity and temperature,
SCD30 requires interacting with the environment. Hence,
special care has to be taken during handling and assemblyin order to achieve best performance.
If the physical characteristics of the sensor change due tomechanical or thermal stress, the calibration might not bevalid anymore. In extreme cases, the sensor might bedestroyed.

Package

StorageThis document provides guidance for handling andassembly of Sensirion SCD30 CO2, humidity andtemperature sensor. The CO2 concentration is measured in
an optical cavity mounted into a PCB cutout. The RH/Tsensor is soldered to the same PCB with thermal isolation.

Storage must be- 40°C and 70°C.

Cavityatatemperature

between

Moisture Sensitivity Level
SCD30 is not meant to be reflow soldered, hence, thesensor does not have an MSL rating. However, for storage
and handling the sensor can be considered to becompatible with MSL1.

Mechanical stress
No mechanical stress shall be applied to any part of thesensor during assembly or usage. Especially, no force shallbe applied directly on the optical cavity. Nevertheless, it isrecommended to perform a recalibration after mounting theSCD30 sensor module to compensate minor mechanicalstresses.

RH/T sensor
Figure 1: Package overview

ESD Protection
It is mandatory to protect the sensor from ESD (ElectrostaticDischarge). Only handle in ESD protected areas underprotected and controlled conditions (ground all personnel
with wrist-straps, ground all non-insulating and conductive
objects, exclude insulating materials from the EPA, operate
only in grounded conductive floor, etc.). Protect sensor
outside the EPA using ESD protective packaging.

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Assembly of SCD30 sensor
It is recommended to solder SCD30 by hand. A pin stripe
with pitch 0.1 inch / 2.54 mm should be used to connect
SCD30 to external electronics. Only contact pins should beused to mount the sensor. SCD30 should not touch any partof the host PCB.

host PCB. When using the assembly jig assembly process
is as follows:

Mount pin stripe on host PCB.

To prevent contact of SCD30 with host PCB, below
recommended standoff height, sh should be maintained.
Place assembly jig on host PCB.

Place SCD30 on assembly jig and plug into pin header.
SymbolValuehc

1.55 mmhp

Varioussh

Solder SCD30 on pin header and subsequently remove jig
from host PCB.

sh ≥ 1 mm

Figure 2 Assembly process of SCD30

sh + hc > hp + 0.5 mm

Table 1: Recommended stand of height.

Mounting Orientation
SCD30 can be mounted facing upwards or downwards.

A planar assembly jig (e.g. a cuboid) with a thickness of sh
can be used for optimal positioning of SCD30 above thewww.sensirion.com

Version 0.2 – February 20192/4

Revision History
DateApril 2018February 2019

Version
0.1
0.2

Page(s)all2

Changes
Initial version
Mechanical stress paragraph extended

Copyright © 2018 by SENSIRION
CMOSens® is a trademark of Sensirion
All rights reserved

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Sensirion AG
Laubisruetistr. 50
CH-8712 Staefa ZH
SwitzerlandSensirion Inc., USA
phone: +1 312 690 5858info-us@sensirion.com
www.sensirion.com

Sensirion Korea Co. Ltd.
phone: +82 31 337 7700~3
info-kr@sensirion.com
www.sensirion.co.kr

phone: +41 44 306 40 00
fax:+41 44 306 40 30
info@sensirion.com
www.sensirion.com

Sensirion Japan Co. Ltd.
phone: +81 3 3444 4940
info-jp@sensirion.com
www.sensirion.co.jp

Sensirion China Co. Ltd.
phone: +86 755 8252 1501
info-cn@sensirion.com
www.sensirion.com.cn

Sensirion Taiwan Co. Ltd
phone: +886 3 5506701
info@sensirion.com
www.sensirion.com

To find your local representative, please visit
www.sensirion.com/distributors

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