RM46 Hercules Development Kit (HDK)

User's Guide

Literature Number: SPNU566B
September 2012 – Revised November 2018

Contents
Preface ........................................................................................................................................ 4
1

Introduction ......................................................................................................................... 5
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8

2

5
5
6
6
7
7
7
7

Physical Description............................................................................................................. 9
2.1
2.2

2.3
2.4
2.5
2.6
2.7

A

Scope of Document .........................................................................................................
RM46 HERCULES Development Kit (HDK) Features ..................................................................
HDK Board Block Diagram .................................................................................................
RM46 HDK Contents .......................................................................................................
HDK Specifications ..........................................................................................................
Basic Operation ..............................................................................................................
Memory Map .................................................................................................................
Power Supply.................................................................................................................

Board Layout ................................................................................................................. 9Connectors .................................................................................................................. 10
2.2.1 20-Pin ARM JTAG Header ....................................................................................... 11
2.2.2 Ethernet Interface ................................................................................................. 11
2.2.3 CAN Interface ...................................................................................................... 122.2.4 J19, MIPI ETM Connector........................................................................................ 13
2.2.5 J7, XDS100V2 USB JTAG Interface ............................................................................ 14
2.2.6 P1, +5 V to +12 V Input .......................................................................................... 14
2.2.7 J18, USB Host Connector ........................................................................................ 14
2.2.8 J16, USB Device Connector ..................................................................................... 14
2.2.9 SCI Interface ....................................................................................................... 14
2.2.10 Daughter Card Interface ......................................................................................... 15
LEDs ......................................................................................................................... 18
S2 DIP Switch .............................................................................................................. 18
Jumpers ..................................................................................................................... 19
S4, Power On Reset Switch .............................................................................................. 19
S3, System Reset Switch ................................................................................................. 19

Operation Notices............................................................................................................... 20
A.1

Operation Notices .......................................................................................................... 20

Revision History .......................................................................................................................... 21

2

Contents

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List of Figures
1-1.

RM46 HDK Board Block Diagram ......................................................................................... 6

2-1.

RM46 HDK Board, Interfaces Top Side .................................................................................. 92-2.

Connectors on RM46 HDK ................................................................................................ 10

2-3.

CAN Bus Termination...................................................................................................... 12

2-4.

J2, J3 CAN Bus Interface (Screw Terminal) ............................................................................ 12

2-5.

J19, 60 Pin MIPI ETM Header ............................................................................................ 13

2-6.

+12 V Input Jack ........................................................................................................... 14

2-7.

J9, J10, and J11 on HDK ................................................................................................. 15

2-8.

DIP Switch Settings ........................................................................................................ 18

List of Tables
1-1.

RM46 Memory Map ......................................................................................................... 7

1-2.

Power Test Points ........................................................................................................... 8

2-1.

Connectors on HDK Board ................................................................................................ 11

2-2.

20-Pin ARM JTAG Header ................................................................................................ 11

2-3.

J1, Ethernet Interface ...................................................................................................... 12

2-4.

J19, MIPI Connector Signal Mapping .................................................................................... 13

2-5.

J7, XDS100V2 USB JTAG Interface ..................................................................................... 14

2-6.

Expansion Connector P1 (J9, Left, BottomView) ...................................................................... 15

2-7.

Expansion Connector P2 (J10, Right, BottomView) ................................................................... 16

2-8.

Expansion Connector P3 (J11, Bottom One, TopView) ............................................................... 17

2-9.

Demo LEDs ................................................................................................................. 18

2-10.

Other LEDs as Indicator ................................................................................................... 18

2-11.

S2 DIP Switch Functions .................................................................................................. 19

2-12.

Jumpers ..................................................................................................................... 19

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List of Figures3

(1) (2) (3)PrefaceSPNU566B – September 2012 – Revised November 2018

Read This First
About This ManualThis document describes the board level operations of the RM46 Hercules™ Development Kit (HDK). The
HDK is based on the Texas Instruments RM46L852 Microcontroller. The RM46 HDK is a table top cardthat allows engineers and software developers to evaluate certain characteristics of the RM46L852
microcontroller to determine if the microcontroller meets the designer’s application requirements as well as
begin early application development. Evaluators can create software to execute on board or expand thesystem in a variety of ways.

Notational Conventions
This document uses the following conventions.
The RM46 HDK will sometimes be referred to as the HDK.
Program listings, program examples, and interactive displays are shown in a special italic typeface. Hereis a sample program listing:• equations• !rd = !strobe&rw

Information About Cautions
This book may contain cautions.
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your software, or hardware, orother equipment. The information in a caution is provided for your protection. Please read each caution
carefully.

Related Documentation From Texas Instruments
Information regarding this device can be found at the following Texas Instruments website:
http://www.ti.com/rm4

(1)
(2)
(3)

4

Hercules, Code Composer Studio are trademarks of Texas Instruments.
ARM is a registered trademark of ARM Limited.
All other trademarks are the property of their respective owners.
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Chapter 1
SPNU566B – September 2012 – Revised November 2018

Introduction
This development kit provides a product-ready hardware and software platform for evaluating thefunctionality of the Texas Instruments RM46 microcontroller family. Schematics, list of materials, and PCB
layout are available to ease hardware development and reduce time to market.

1.1

Scope of Document
This user's guide lists the contents of the development kit, points out the features of the major
components, and provides the instructions necessary to verify your development kit is in working order.
Any additional usage instructions or details fall outside the scope of this document. Additional resources
will be listed at the end of this user's guide.

1.2

RM46 HERCULES Development Kit (HDK) Features
The HDK comes with a full complement of on board devices that suit a wide variety of application
environments. Key features include:• A Hercules RM46L852 337-pin BGA microcontroller• Integrated USB JTAG Emulator (XDS100v2)• External JTAG Headers (ARM® 20 pin and TI Compact 20-pin CTI)
• 10/100 Mbps Ethernet interface• One USB host connector and one USB device connector• Two CAN transceivers (SN65HVDA541Q1) and screw terminal blocks• One ambient light sensor• One ambient temperature sensor• Microcontroller’s serial communication interface (SCI) universal asynchronous receiver/transmitter(UART) accessible through a USB virtual COM port
• One 8MB SDRAM• Eight user programmable white LEDs around the MCU silicon• One user programmable pushbutton• Three expansion connectors for hardware prototyping• Reset pushbuttons (nPORRST and nRST)• One SD card slot (SPI mode)• Embedded trace macrocell (ETM) debug interface via MIPI connector• Configurable pin mux options• 5 V and 3.3 V analog-to-digital converter (ADC) option jumper• Current measurement capability for 3.3 V IO, 1.2 V core, 1.2 V core, 1.2 V PLL, 3.3 V or 5 V ADC, and
3.3 V VCCP
• Accepts an external power supply between +5V and +12V

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5

HDK Board Block Diagram

1.3

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HDK Board Block Diagram

USB
PHY

CPLD
JTAG

ENET
PHY
MII/
RMII

USB
PHY

Pinmux
DIP

CAN
PHY

SDRAM

EXP Conn3

PWR
EXP Conn2

SPI/ADC
RM46L852
220 MHzCAN/
FRAY/LIN/
GIO/HET

EMIF/
ETM/
SPI2

PIN MUXEXP Conn1

PIN MUX

ETM

3.3V I/O

ENET
RJ45

FTDI
2332

RST

SPI2

Ext JTAG

XDS100V2

3.3V/5V A/D

USB-D

USB
EMU

1.2V Core

POR

SD
Slot

USBH

Figure 1-1 illustrates the HDK block diagram.

CAN
PHY

GIO
Button

CAN1

CAN2
Light
SensorTemp
SensorFigure 1-1. RM46 HDK Board Block Diagram

1.4

RM46 HDK Contents
The kit contains everything needed to develop and run applications for RM46L852 microcontrollers
including:• Board:– RM46 Card
• Cables and Accessories– Type A to mini B USB cable for using on board XDS100V2 JTAG emulator– Ethernet cable– Flashlight for light sensor demo
• CCS DVD Containing:– Texas Instruments’ Code Composer Studio™ Integrated Development Environments (IDE)• Hercules DVD Containing:– Hercules Safety Demos– Hardware Abstraction Layer Code Generator (HALCoGen)– Training Videos– Device Documentation
Not included:• 12-V power supply
Below are two options that electrically and mechanically will work with the HDK:

6Introduction

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•

•

1.5

HDK Specifications
•
•
•

1.6

QAWA-24-12-US01– 12-V output, 2-A max output current– Positive center– Barrel plug (2.1-mm x 5.5-mm)– Output Protection: Short Circuit, Overvoltage, Overcurrent– Safety approvals: CB, CE, UL, FCC, PSE, LPS, BSMI, RCM, and CCC
SMI24-12-V-P5– 12-V output, 2-A max output current– Positive center– Barrel plug (2.1-mm x 5.5-mm)– Output Protection: Short Circuit, Overvoltage, Overcurrent– Safety approvals: UL/cUL, CCC, RCM, and PSE

Board supply voltage: 5 V–12 V Vdc
Board supply current: 130 mA typ (fully active, CPU at 220 MHz)
Dimensions: 4.90” x 4.30” x 0.85” (LxWxH)

Basic Operation
The HDK is designed to work with TI’s Code Composer Studio and other third party ARM IDEs. The IDE
communicates with the board through the embedded emulator or an external JTAG emulator. To start,
follow the instructions in the Quick Start Guide to install Hercules-specific software. This process will install
all of the necessary development tools, documentation and drivers.

1.7

Memory Map
The RM46 family of MCUs have a large byte addressable address space. Table 1-1 shows the address
space of a RM46L852 microcontroller on the left with specific details of how each region is used by the
HDK on the right. By default, the internal memory sits at the beginning of the address space.
The SDRAM is mapped into CS0 space on the EMIF. CS[4:2] are used for synchronous memory forexample SRAM, NOR Flash, NAND Flash, and so forth.
Table 1-1. RM46 Memory Map

1.8

Start Address

End Address

HDK

0x0000 0000

0x002F FFFF

Flash

0x0800 0000

0x0803 FFFF

RAM

0x0840 0000

0x0843 FFFF

RAM-ECC

0x6000 0000

0x63FF FFFF

CS2 Async RAM

0x6400 0000

0x67FF FFFF

CS3 Async RAM

0x6800 0000

0x7BFF FFFF

CS4 Async RAM

0x8000 0000

0x87FF FFFF

CS0 Sync SDRAM

Power Supply
The HDK board operates from a single +12 V external power supply connected to the main power input(P1), a 2.5 mm, barrel-type plug. Internally, the +12 V input is converted into +1.2 V, +3.3 V and +5.0 V
using Texas Instruments swift voltage regulators and PTH power module. The +1.2 V supply is used for
the MCU core while the +3.3 V supply is used for the MCU's I/O buffers and other module on the board.
The +5.0 V supply is used for ADC power (second option) and USB VBUS.

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There are multiple power test points on the HDK board. The three main test point pairs provide aconvenient mechanism to check the HDK’s current for each supply. Table 1-2 shows the voltages for eachtest point and what the supply is used for.
Table 1-2. Power Test Points

8

Introduction

Test Point Pair

Voltage

Voltage Use

TP14 and TP15

1.2 V

MCU core

TP16 and TP17

3.3 V

MCU IO and logic

TP18 and TP19

1.2 V

MCU PLL

TP20 and TP21

3.3 V

MCU Flash pumpTP22 and TP23

3.3 V or 5.0 V(J8 to enable 5 V)

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Chapter 2
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Physical Description
This section describes the physical layout of the RM46 HDK board and its interfaces.

2.1

Board Layout
The RM46 HDK board is a 4.9 x 4.3 inch (125 x 109 mm) eight layer printed circuit board that is poweredby an external +5 V to approximately +12 V only power supply. Figure 2-1 shows the layout of the RM46
HDK board.

Hercules
RM46L852

Figure 2-1. RM46 HDK Board, Interfaces Top SideSPNU566B – September 2012 – Revised November 2018
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Connectors
The HDK board has 16 interfaces to various peripherals. These interfaces are described in the following
sections.

J7

P1

J16

J15

J1

J18

J17
J4

J6
RM46L852

J10

J9

J12

J19
J11
J2

J3

Figure 2-2. Connectors on RM46 HDK

10Physical Description

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Table 2-1. Connectors on HDK Board
Connector

Size

Function

J1

RJ45

Ethernet

J2

3 terminal, 2.54mm

DCAN1

J3

3 terminal, 2.54mm

DCAN2

J4

10x2, 2.54mm

ARM 20pin JTAG header

J6

19x2, mictor

RTP

J7

4pin, Mini-B USB

J933x2, 2mm

Exp P1, SPI1, SPI5, ADC

J1033x2, 2mm

EXP P2, SPI2, EMIF, ECLK

J1140x2, 2mm

EXP P3, SPI3, GIO, NHET, DCAN, LIN

J1219x2, mictor

DMM

XDS100V2 USB

J15

SD cardJ16

4pin, Type B

USB Device

J17

4pin, Type A

Not Populated

J18

4pin, Type A

USB Host

J1930x2, MIPIETM MIPI Header

P1

2.5mm

+12 V In2.2.1 20-Pin ARM JTAG Header
In addition to on board XDS100V2 JTAG, one 20-pin ARM JTAG header is added for using external
emulator. This is the standard interface used by JTAG emulators to interface to ARM microcontrollers. The
pinout for the connector is shown in Table 2-2.
Table 2-2. 20-Pin ARM JTAG Header
Signal Name

Pin Number

Pin Number

Signal Name

Vref

1

2

VCC

nTRST

3

4

GND

TDI

5

6

GND

TMS

7

8

GND

TCK

9

10

GND

RTCK

11

12

GND

TDO

13

14

GND

nRST

15

16

GND

NC

17

18

GND

NC

19

20

GND

2.2.2 Ethernet Interface
The RM46L852 integrates an MII/RMII Ethernet MAC on chip. This interface is routed to the on board
PHY via CBT switches. The board uses a DP83640 PHY. The interface is isolated and brought out to a
RJ-45 connector with integrated magnetics, J1. The pinmux control DIP S2 is used to control the CBT FET
switch for RMII, MII or other functions.
The J1 connector is used to provide a 10/100 Mbps Ethernet interface. This is a standard RJ-45
connector. The cable end pinout for the J1 connector is shown in Table 2-3.

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Table 2-3. J1, Ethernet Interface
Pin Number

SignalPin Number

1

D0+

2

Signal
D0-

3

D1-

4

D2+

5

D2-

6

D1-

7

D3+

8

D3-

Two LEDs are embedded into the connector to report link status (green LED) and transmit and receive
status of the PHY (yellow LED).

2.2.3 CAN Interface
The RM46L852 has up to three DCAN interfaces that provide a high-speed serial interface. Two 3-pin
screw terminal blocks, J2, J3, are used to interface to the DCAN bus. The pinouts for this connector are
shown in Figure 2-4. H means CAN High (CAN H), and L means CAN Low (CAN L).
CAN Bus termination is used to minimize signal reflection on the bus. ISO-11898 requires that the CAN
bus have a nominal characteristic line impedance of 120 Ω. Therefore, the typical terminating resistor
value for each end of the bus is 120 Ω. A split termination method is used to help increase EMC
performance. Split termination is a concept that is growing in popularity because emission reduction canbe achieved very easily. Split termination is a modified standard termination in which the single 120 Ω
resistor on each end of the bus is split into two 60 Ω resistors, with a bypass capacitor tied between theresistors and to ground. The two resistors should match as close as possible.

Figure 2-3. CAN Bus Termination

J2

J3

H L

H

L

Figure 2-4. J2, J3 CAN Bus Interface (Screw Terminal)

12

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2.2.4 J19, MIPI ETM Connector
Figure 2-5 and Table 2-4 show the 60 pin MIPI header.
Pin 1

Figure 2-5. J19, 60 Pin MIPI ETM Header
Table 2-4. J19, MIPI Connector Signal Mapping
MCU
SignalsPin
NumberPin
MCU
Number Signals

3.3 V

1

2

TMS

TCK

3

4

TDO

TDI

5

6

System reset

RTCK

7

8

nTRST

NC

9

10

NC

NC

11

12

3.3 V

NC

13

14

NC

GND

15

16

GND

NC

17

18

NC

NC

19

20

NC

NC

21

22

NC

NC

23

24

NC

NC

25

26

NC

NC

27

28

NC

NC

29

30

NC

NC

31

32

NC

NC

33

34

NC

NC

35

36

NC

NC

37

38

NC

NC

39

40

NC

NC

41

42

NC

NC

43

44

NC

NC

45

46

NC

NC

47

48

NC

NC

49

50

NC

NC

51

52

NC

NC

53

54

NC

NC

55

56

NC

GND

57

58

GND

NC

59

60

NC

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2.2.5 J7, XDS100V2 USB JTAG Interface
The USB connector J7 is used to connect to the host development system that is running the softwaredevelopment IDE, Code Composer Studio. The signals on this connector are shown in Table 2-5.
Table 2-5. J7, XDS100V2 USB JTAG Interface
Pin Number

Signal Name

1

USBVDD

2

D-

3

D+

4

NC

5

USBVSS

Before the board is shipped, the XDS100V2 port1 is configured as JTAG, and port2 is configured as SCI.
The CPLD on the board is also programmed to route the JTAG signals to the MCU.
There is a circuitry to detect the external JTAG emulator. If a device is plugged onto the header J4 andJ19, the DS1 LED will be turned on, and XDS100V2 JTAG is disabled.

2.2.6 P1, +5 V to +12 V Input
Connector P1 is the input power connector. This connector brings in +5 V to +12 V to the HDK board. Thisis a 2.5 mm jack. Figure 2-6 shows this connector as viewed from the card edge.
+12V

GND
P1

PC Board

Figure 2-6. +12 V Input Jack

2.2.7 J18, USB Host Connector
Connector J18 is a type-A USB host connector. The RM46L852 device supports two OHCI ports. OHCI0
signals are pinmuxed with SPI, NHET, and GIO, and so forth. To use OHCI0, the channel 1 of dip switch
S2 has to be set to “ON”. OHCI provides 5 V VBUS through power switch U12.
The second USB host connector is not populated. Its footprint is overlapped with J16.

2.2.8 J16, USB Device Connector
The RM46L852 device has one W2FC module for USB device. Connector J16 is a type-B USB device
connector. To use W2FC, the channel 3 of dip switch S2 has to be set to “ON”. Two different connectors
can be mounted at location J16. The default connector is USB host.

2.2.9 SCI Interface
The internal SCI on the RM46L852 device is connected to the second port of the XDS100V2. The
XDS100V2 USB driver makes the FT2232H second channel appear as a virtual COM port (VCP). This
allows the user to communicate with the USB interface via a standard PC serial emulation port.

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2.2.10 Daughter Card Interface
The HDK provides expansion connectors that can be used to accept plug-in daughter cards. The daughtercard allows users to build on their EVM platform to extend its capabilities and provide customer andapplication specific I/O. The expansion connectors are for all major interfaces including asynchronous
memory, peripherals, and A/D expansion.
There are three daughter card interfaces: J9, J10, J11. These connectors are described in Table 2-6.

J9

J10

J11
Figure 2-7. J9, J10, and J11 on HDK
Table 2-6. Expansion Connector P1 (J9, Left, BottomView)
Signal Name

Pin Number

NumberPin Number

EXP_12V1

2

EXP_12V

3

4

Signal Name
GND
GND

MibSPI1ENA

G19

5

6

F18

MibSPI1CLKMibSPI1CS[1]

F3

7

8

R2

MibSPI1CS[0]MibSPI1CS[3]

J3

9

10

G3

MibSPI1CS[2]MibSPI1SIMO

F19

11

12

G18

MibSPI1SOMI

13

14

GND

GND

MibSPI5ENA

H18

15

16

H19

MibSPI5CLKMibSPI5CS[1]

B6

17

18

E19

MibSPI5CS[0]MibSPI5CS[3]

T12

19

20

W6

MibSPI5CS[2]MibSPI5SIMO[0]

J19

21

22

MibSPI5SIMO[1]

E16

23

24

E17

MibSPI5SOMI[1]MibSPI5SIMO[2]

H17

25

26

H16

MibSPI5SOMI[2]MibSPI5SIMO[3]

G17

27

28

G16

MibSPI5SOMI[3]GND

MibSPI5SOMI[0]2930AD1IN[1]

V17

31

32

W14

AD1IN[0]AD1IN[3]

T17

33

34

V18

AD1IN[2]AD1IN[5]

R17

35

36

U18

AD1IN[4]AD1IN[7]

V14

37

38

T19

AD1IN[6]

39

40

GND

GND

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Table 2-6. Expansion Connector P1 (J9, Left, BottomView) (continued)
Signal Name

Pin Number

NumberPin Number

Signal Name

AD2IN[1]

U13

41

42

V13

AD2IN[0]AD2IN[3]

U16

43

44

U14

AD2IN[2]AD2IN[5]

T15

45

46

U15

AD2IN[4]AD2IN[7]

R16

47

48

R19

AD2IN[6]

49

50

AGND

GND

AD1IN[9]

W17

51

52

P18

AD1IN[8]AD1IN[11]

U19

53

54

U17

AD1IN[10]AD1IN[13]

T18

55

56

T16

AD1IN[12]AD1IN[15]

P19

57

58

R18

AD1IN[14]

59

60

GND

POR_RSTn

ADREFHI

V15

61

62

V16

ADREFLO

AD1EVT

N19

63

64

V10

AD2EVT

65

66

EXP_12V

GND

Table 2-7. Expansion Connector P2 (J10, Right, BottomView)
Signal Name

Pin Number

EXP_12V
ECLK

A12

RST

Pin Number

Signal Name

1

2

3

4

B14

GND
ERRORn5

6

M17

EMIF_CS[4]

7

8

C16

NC

NC

C17

NC

C15

9

10

D15

NC

NC

C14

11

12

D14

NC

NC

C13

13

14

C12

NC

NC

C11

15

16

C10

EMIF_ADDR[12]EMIF_ADDR[11]

C9

17

18

C8

EMIF_ADDR[10]EMIF_ADDR[9]

C7

19

20

C6

EMIF_ADDR[8]EMIF_ADDR[7]

C5

21

22

C4

EMIF_ADDR[6]EMIF_ADDR[5]

D9

23

24

D8

EMIF_ADDR[4]EMIF_ADDR[3]

D7

25

26

D6

EMIF_ADDR[2]EMIF_ADDR[1]

D5

27

28

D4

EMIF_ADDR[0]

GND

29

30

EMIF_Wen

D17

31

32

K17

EMIF_CS[3]EMIF_Oen

D12

33

34

L17

EMIF_CS[2]EMIF_BA[1]

D16

35

36

D11

EMIF_DQMn[1]EMIF_BA[0]

D13

37

38

D10

EMIF_DQMn[0]

39

40

GND

GND

GND

EMIFDATA[1]

L16

41

42

K16

EMIFDATA[0]EMIFDATA[3]

N16

43

44

M16

EMIFDATA[2]EMIFDATA[5]

F4

45

46

E4

EMIFDATA[4]EMIFDATA[7]

K4

47

48

G4

EMIFDATA[6]EMIFDATA[9]

M4

49

50

L4

EMIFDATA[8]EMIFDATA[11]

P4

51

52

N4

EMIFDATA[10]EMIFDATA[13]

T6

53

54

T5

EMIFDATA[12]EMIFDATA[15]

T8

55

56

T7

EMIFDATA[14]

57

58

59

60

GND
SPI2_SOMI

16

NumberPhysical Description

D2

GND
P3

EMIF_nWAIT

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Connectors

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Table 2-7. Expansion Connector P2 (J10, Right, BottomView) (continued)
Signal Name

Pin Number

Pin Number

Signal Name

SPI2_SIMO

D1

61

62

D3

SPI2_CS1

SPI2_CS0

N3

63

64

E2

SPI2_CLK65

66

EXP_12V

NumberGND

Table 2-8. Expansion Connector P3 (J11, Bottom One, TopView)
Signal Name

Pin Number

NumberPin Number

EXP_12V1

2

EXP_12V

3

4

Signal Name
GND
GND

LINRX

A7

5

6

B7

LINTX

CAN1RX

B10

7

8

A10

CAN1TXCAN2RX

H1

9

10

H2

CAN2TX

CAN3RX

M19

11

12

M18

CAN3TXFRAYRX1

A15

13

14

A8

FRAYRX2

FRAYTX1

B15

15

16

B8

FRAYTX2

FRAYTXEN1

B16

17

18

B9

FRAYTXEN2

GIOA[1]

C2

19

20

A5

GIOA[0]

GIOA[3]

E1

21

22

C1

GIOA[2]

GIOA[5]

B5

23

24

A6

GIOA[4]

GIOA[7]

M1

25

26

H3

GIOA[6]

GIOB[1]

K2

27

28

M2

GIOB[0]

GIOB[3]

W10

29

30

F2

GIOB[2]

GIOB[5]

G2

31

32

G1

GIOB[4]

GIOB[7]

F1

33

34

J2

GIOB[6]

GND

35

36

NHET1[1]

V2

37

38

K18

NHET1[0]NHET1[3]

U1

39

40

W5

NHET1[2]NHET1[5]

V6

41

42

B12

NHET1[4]NHET1[7]

T1

43

44

W3

NHET1[6]NHET1[9]

V7

45

46

E18

NHET1[8]NHET1[11]

E3

47

48

D19

NHET1[10]NHET1[13]

N2

49

50

B4

NHET1[12]NHET1[15]

N1

51

52

A11

NHET1[14]NHET1[17]

A13

53

54

A4

NHET1[16]NHET1[19]

B13

55

56

J1

NHET1[18]NHET1[21]

H4

57

58

P2

NHET1[20]NHET1[23]

J4

59

60

B3

NHET1[22]NHET1[25]

M3

61

62

P1

NHET1[24]NHET1[27]

A9

63

64

A14

NHET1[26]

NHET1[29]

A3

65

66

K19

NHET1[28]

NHET1[31]

J17

67

68

B11

NHET1[30]

GND

GND

69

70

MibSPI3CS[3]

C3

71

72

B2

MibSPI3CS[2]MibSPI3SIMO

W8

73

74

V8

MibSPI3SOMI

MibSPI3CS[1]

V5

75

76

V10

MibSPI3CS[0]MibSPI3ENA

W9

77

78

V9

MibSPI3CLK7980

EXP_12VGND

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GND

Physical Description

17

LEDs

2.3

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LEDs
The RM46 HDK board has 19 LEDs. Eight of these LEDs (shown in Table 2-9) are under user control.
Those LEDs are controlled and programmed by NHET signals.
LEDs DS2, DS3, DS4, and DS5 indicate the presence of the power (+1.2 V, +5 V, 3.3 V, and 12 V) s on
the board. The LED functions are summarized in Table 2-9 and Table 2-10.
Table 2-9. Demo LEDs
LED Number

Location

Signals

Color

D3

Left TopNHET1[17]

White

D4

Top

NHET1[31]

White

D5

Right TopNHET1[0]

White

D6

Right Bottom

NHET1[25]

White

D7

BottomNHET1[18]

White

D8

Left bottom

NHET1[29]

White

LED1

Left

NHET1[27]

White

LED2

Right

NHET1[05]White

Table 2-10. Other LEDs as Indicator

2.4

NumberLED

D1

nERROR

Color
Red

D10

XDS100V2 SCI RX

Blue

D11

XDS100V2 SCI TX

Blue

D12

XDS100V2 PWRENn

Blue

D2

JTAG TDIBlue

D9

Ethernet Speed

Blue

DS1

ARM JTAG Plugin

Blue

DS2

VCC_1V2

Blue

DS3

VCC_5VBlue

DS4

VCC_3V3

Blue

DS5

VCC_12VBlue

S2 DIP Switch
There is one 4-position DIP switches located on the left-bottom corner at reference designator S2. By
default, all of the switches are set to the “OFF” position and should remain in that position whencompleting the steps in this user's guide.
1 2

1
2

3
4

3
4

Figure 2-8. DIP Switch Settings

18

Physical Description

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Jumpers

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The S2 DIP switch is reserved for user application general purpose. Table 2-11 describes the function ofeach channel on S2.
Table 2-11. S2 DIP Switch Functions
SwitchOFF Position

ON Position(1)

USB Host0 Disabled

USB Host0 Enabled

S2:2 (2)USB Host1 Disabled

USB Host1 Enabled

S2:3 (2)USB Device Disabled

USB Device Enabled

S2:4 (3)Ethernet Disabled

Ethernet Enabled

S2:1

(1)
(2)
(3)

2.5

S2:1 indicates slide 1 on the S2 DIP switch, S2:2 indicates slide 2 on the S2 DIP switch, and so on.
S2:2 and S2:3 cannot be enabled at the same time since those two ports have pinmux.
To use Ethernet, S2:4 should be enabled and all other have to be disabled.

Jumpers
The HDK board has two jumpers that are used to enable and disable the on-board SDRAM and select 5 V
or 3.3 V ADC.
Table 2-12. Jumpers
Jumper Number

2.6

OFF

ON

J8

5 V ADC

3.3 V ADCJ13

SDRAM onSDRAM OffS4, Power On Reset Switch
RM46 MCU has two resets: warm reset (nRST) and power-on reset (nPORRST). Switch S4 is a
momentary switch that asserts power on reset to the RM46L852 device. The nPORRST condition isintended to reset all logic on the device including the test and emulation circuitry.

2.7

S3, System Reset Switch
Switch S3 is used to assert a warm reset the RM46L852 device. Warm reset does not reset any test or
emulation logic. The reset signal from window watchdog will also assert a warm reset to the MCU. The
warm reset can be invoked by pushing nRST button, or by RESET signals from XDS100 CPLD, ARM
JTAG SREST.

SPNU566B – September 2012 – Revised November 2018
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Physical Description

19

Appendix A
SPNU566B – September 2012 – Revised November 2018

Operation Notices
A.1

Operation Notices
The user assumes all responsibility and liability for proper and safe handling of the boards. It is the user's
responsibility to take any and all appropriate precautions with regard to electrostatic discharge.
• For additional information regarding the embedded emulation, see the XDS100 USB wiki on the TI web
site at the following URL: http://tiexpressdsp.com/index.php?title=XDS100• Code Composer Studio support is available via a forum at: http://community.ti.com/forums/138.aspx• Hercules MCU support is available via a forum at: http://www.ti.com/hercules-support

20

Operation Notices

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Revision History

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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (September 2013) to B Revision .......................................................................................... Page•

Updated RM46 HDK Contents power supply information. ........................................................................... 6

SPNU566B – September 2012 – Revised November 2018
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Revision History

21

STANDARD TERMS FOR EVALUATION MODULES
1.

Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordancewith the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused byneglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that havebeen altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall bewarranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

3

Regulatory Notices:
3.1 United States
3.1.1

Notice applicable to EVMs not FCC-Approved:

FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold orotherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:••••

Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada
3.2.1

For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247

Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur
3.3 Japan
3.3.1

Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2

Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.

2.
3.

Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, orUse of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けていないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.

電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3

Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

3.4 European Union
3.4.1

For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment thisproduct may cause radio interference in which case the user may be required to take adequate measures.

4

EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1

User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.

4.3.2

EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.

Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.

6.

Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESSFOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.

7.

USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8.

Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDEDHEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9.

Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.

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