UC-8100-ME SeriesComponent Compatibility Guide
A list of peripheral components suitable for use with the UC-8100-ME Series computers
2018/06/06 Version 2.1© 2018 Moxa Inc. All rights reserved.

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All rights reserved.

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Information in this document is subject to change without notice and does not represent a commitment on the part ofMoxa.
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1. Introduction
This document lists hardware components that are proven to provide the performance listed in thespecification when used with the Moxa UC-8100-ME Series embedded computers, or computersthat share basic design features with the UC-8100-ME Series. Moxa computers come with multiple
peripheral options and are engineered to work with components having different hardware
specifications. This flexibility could sometimes lead to compatibility issues. When used with theUC-8100-ME Series embedded computers, peripherals from one manufacturer may not work as
well as the ones made by another manufacturer. Moxa provides this list of UC-8100-ME
Series-compatible components, so that users can be certain of a reliable performance from theUC-8100-ME Series, when it is used with the components listed in this document.

2. Testing Methods
To validate that a component meets the Moxa standards for quality and performance, the following
five key compatibility tests are run:•••••Ambient temperature burn-in
Low temperature hard start
Heat/humidity burn-in
Cyclic high-low temperature burn-in
Vibration test

Ambient Temperature Burn-In

The component is mounted on to an UC-8100-ME computer and put through a series of stresstests at an ambient temperature of around 25˚C, for a specified period of time. The duration of thetest is determined based on the class of peripherals being tested.

Low Temperature Hard Start

The component is mounted on to an unpowered UC-8100-ME computer and then the system isbooted up at an extremely low temperature. The designated low temperature value depends on thecomputer model being tested.

Heat/Humidity Burn-InThe component is mounted on to an UC-8100-ME computer, placed in a temperature- andhumidity-controlled enclosure, and then put through the burn-in test for a specified period of time.
The temperature, humidity, and time targets vary depending on the specification of the computermodel used in the test.

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Cyclic High-Low Temperature Burn-In

The component is mounted on to an UC-8100-ME computer, placed in a temperature controlled
enclosure, and then put through the burn-in test wherein the temperature is cyclically varied fromvery high to very low and back again, over a specified period of time. The target temperature range
and the duration of the test can vary depending on the specification of the computer model used inthe test.

Vibration Test

The component is mounted on to an UC-8100-ME computer that is bound inside anelectromagnetic vibrator, and then put through random vibration tests along three orthogonal axes:
longitudinal, transverse, and vertical. The vibration tests are compliant with theEN50155/IEC61373 vibration standards.

3. Storage Endurance
Storage media, such as SSDs, CF cards, SD cards, Disk on Module, and Cfast, are composed ofdifferent electrical components. The main electrical components in these storage media, theNAND-flash memory and NAND-flash controller, impact the storage endurance and lifespan of thestorage media.

NAND-Flash Memory Endurance

NAND-flash memories have a limit on the number of times they can be programmed and erased(P/E). The P/E cycle as well as the erase count of a NAND-flash memory can be used to determine
this limit. For example, an SLC (single-level cell) flash memory has a 60,000 P/E cycle, an MLC(multi-level cell) flash memory has a 3,000 P/E cycle, and TLC NAND flash memories have P/Ecycle values up to 1,000. Each flash memory type has a different endurance level, which is why thestorage lifespan is based on the flash memory type. Storage that uses SLC type flash memory
could have the best endurance level compared with the MLC type storage. SLC storage usuallycomes with a 5-year OEM warranty (the actual warranty period depends on the originalmanufacturer). MLC storage only comes with a 1- to 3-year warranty. The major differences
between SLC and MLC are: (a) The SLC NAND flash has a lifespan that is around 20 times that ofan MLC, and (b) The price can differ by a factor of 4 to 5. The SLC type of storage is recommended
for systems that are expected to have high reliability, and for applications that need to frequently
write data to a storage medium.

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Terabytes Written (TBW)

TBW is the unit used to evaluate SSD endurance. In actual applications, storage is used for routine
operations and data access. Therefore the physical P/E cycle is not appropriate for describing thetotal rewritable data capacity. The management efficiency of the storage controller also affects thetotal rewritable data capacity result. For these reasons, Joint Electron Device Engineering Council(JEDEC) has defined a standard for SSD endurance evaluation called JESD218, which uses TBW
to measure the endurance of the storage memory. By referring to this TBW value, users can easily
estimate the storage specification and select a suitable storage for real-life use cases. For example,
when routine operations need a maximum of 20 GB and the expected storage lifespan is 3 years,
the total rewritable data demand would be 21.9 TBW (20 GB x 365 x 3). In this case, a storage thathas more than 21.9 TBW will meet the requirement. We recommend selecting a storage media
with a TBW that is greater than the calculated value.

4. Declaration for Liability Exclusion
The specifications, warranty terms, and liability of items listed in this guide are the sole
responsibility of the original manufacturers. Moxa does not take any responsibility in this regard.
Please visit the manufacturers’ official websites for up-to-date product information before
purchasing the components.

5. Compatible Components
Peripheral components that have been tested and found suitable for use with the UC-8100-ME
Series computers are listed in this section. The following table lists the Test Codes and theirdescriptions:
Test CodeDescriptionA

The component has passed the ambient temperature verification test

BThe component has passed the low temperature verification test

CThe component has passed the heat/humidity verification test

DThe component has passed the cyclic high-low temperature verification testEF

The component has not been tested, but is similar to another component thathas been tested in terms of its material and design.
The component has passed the vibration verification test

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VendorStorageSize

Moxa’s PN

Vendor’s PN

FlashMemoryBrand

Apacer

1 GB

1352000012020

AP-ISD01GIS2B-3T

Apacer

128 GB

1352001282011

InnoDisk

1 GB

1352000012010

SDFlashMemorySpec

Controller

FirmwareWarranty

Warranty
Exclusion

Test
CodesToshiba

SLC

N/A

N/A

3 years

Endurance > 60,000

B, C, D

AP-ISD128GIA-1FTM

Toshiba

MLC

N/A

N/A

2 years

Endurance > 3,000

B, C, D

DS2A-01GI81W1B

Toshiba

SLC

N/A

N/A

5 years

Endurance > 60,000

B, C, D

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