MSL & Mounting Conditions
Date: 2019.07.24
The following information is used for the reflow conditions of Lyontek Products, and please
follows the package type to choose the suitable conditions. All the conditions are compliant withJEDEC J-STD-020 and IPC-1066.
1. SRAM
Package Type
SOP/SOJPDIP 300mil(28P)/600 mil

TSOP I

Pin Count

2832

28

32

32

48

32

44

54

28

32

36

48

90

MSL*1

33

1

1

33333333332 Level
Interconnect*2e3e3e3e3e3e3e3e3e3e3e3e1e1e1

Peak Temp. (℃)

250245245245

260

260260260 260

260260260

260

260

TSOP IIsTSOP

BGAnd※1. MSL: Moisture Sensitivity Level.
2. IPC-1066 item 5.1 Solder Finish Categories, e1 – 96.5Sn3.0Ag0.5Cu & e3-100% Sn
2. Audio
Package TypeDFN /MSOP

SOP

TSSOP

QFN

WCSP

LQFP

Pin Count

8816162028

1616

91848

*1

333333333332Level
Interconnect*2e3e3

e3e3e3e3e3

e3

e1

e1e3

Peak Temp. (℃)

260260260

260

260

260

260

260

260

260

260

MSLnd※1. MSL: Moisture Sensitivity Level.
2. IPC-1066 item 5.1 Solder Finish Categories, e1 – 96.5Sn3.0Ag0.5Cu & e3-100% Sn

The information contained herein is the exclusive property of Lyontek Inc. and shall not be distributed,
reproduced or disclosed in whole or in part without prior written permission of Lyontek Inc.

Ver.101

3. Moisture-Sensitive Caution and RoHS Compliance Label:
Attached on the Moisture Barrier Bag of the delivery products.
(1) Type 1 for PDIP (MSL: 1)※ IPC-1066 item 5.1 Solder Finish Categories, e3 – Sn(2) Type 2 for BGA/WCSP (MSL: 3)※ IPC-1066 item 5.1 Solder Finish Categories, e1 – SnAgCu

The information contained herein is the exclusive property of Lyontek Inc. and shall not be distributed,
reproduced or disclosed in whole or in part without prior written permission of Lyontek Inc.

Ver.102(3) Type 3 for SOP / SOJ / STSOP / TSOP-l / TSOP-ll / MSOP / DFN / QFN / TSSOP / QFP(MSL: 3)

※ IPC-1066 item 5.1 Solder Finish Categories, e3 – Sn
4. Reflow Temperature Profile(1) For Infrared Reflow
Far/Medium IR (longer wave length) conditions are recommended for solder mounting byinfrared reflow, Because Near infrared (shorter wave length) radiant heat applied to the moldresin is high and it heat the surface as well as inside of package at the same time. This typeof stress is often associated with adversely affecting the quality of the products.
Top and bottom heating method for far/medium infrared is recommended (See Fig. 1).

Flow ofproducts

Far infrared Zones

Medium infrared Zones(Pre heater)(Reflow heater)

Fig. 1
The information contained herein is the exclusive property of Lyontek Inc. and shall not be distributed,reproduced or disclosed in whole or in part without prior written permission of Lyontek Inc.

Ver.103Temperature of package and PCB surface should be below Peak Temperature and timewithin 5 °C of actual Peak Temperature should be 30 seconds, and reflow must be
performed at 217℃ 60~150 seconds. The number of reflow is 3 cycles at most.
An example of recommended reflow temperature profile is shown in Fig. 2.

Temp(℃)
300
Peak (Max)

250

217℃

200
150
30sec

100
50

60~150sec

60~120sec0Fig. 2Time (sec)Guide Lines
A. Preheat:
If the rate exceeds 1~3°C, thermal shock or cracking of component is risked. Over-baking
the paste and exceed the glass transition temperature of the epoxy should be avoided.
B. Heating:
Extended duration above the solder melting point may damage the board and sensitive
components. This value should be minimized but should also be chosen to allow for goodsolder joint.
C. Peak Temperature:
Exposure time to peak temperature should be minimized.
D. Cooling:
Faster cooling rates induce small grain size of the solder, and higher fatigue resistance.

The information contained herein is the exclusive property of Lyontek Inc. and shall not be distributed,reproduced or disclosed in whole or in part without prior written permission of Lyontek Inc.

Ver.104(2) For Hot Air Reflow and Wave Soldering
It is the same as that of far-infrared reflow method.
Temperature of package and PCB surface should be below Peak Temperature and timewithin 5 °C of actual Peak Temperature should be 30 seconds, and reflow must beperformed at 217℃ 60~150 seconds. The number of reflow is 3 cycles at most.
Recommended temperature profile is the same as Fig. 2.
(3) For Manual Soldering/ Repairing
When using soldering iron, the time should be limited to ≦ 10 seconds and the temperature
should not exceed 300℃; or ≦ 3 seconds in the temperature 350℃. If a heat gun is used,
the time should be limited to less than 10 seconds and the temperature should not exceed
290℃.

The information contained herein is the exclusive property of Lyontek Inc. and shall not be distributed,
reproduced or disclosed in whole or in part without prior written permission of Lyontek Inc.

Ver.105