ON Semiconductor
Is Now

To learn more about onsemi™, please visit our website atwww.onsemi.com

onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.

AND9922/D
ASPM 27 Series Package
Assembly Guidance
INTRODUCTIONASPM 27 series is an advanced Automotive SPM®
module providing a fully−featured, high−performanceinverter output stage for hybrid and electric vehicles. Target
applications are E−compressor, Oil pump, Fuel pump, Water
pump and Cooling Fans. Proper mounting is required toachieve good thermal performance and low mechanicalstress during lifetime of the device. Figure 1 show the two
types of assembly method for ASPM 27 packages.
Assemblies commonly are done using method 1 or method 2
by customer’s determination. This application note isintended to provide recommendations for proper handling,assembly of the package and potential rework in conjunction
with industry standards. Following sections outline
appropriate TIM (Thermal Interface Material) applicationand heat sink mounting as well as soldering procedures toensure a reliable PCB (Printed Circuit Board) connection.
Recommendations in this note are based on simulation andexperimental results from laboratory and field tests.

Method 1

Method 2

www.onsemi.com

APPLICATION NOTE

Table 1. ASPM 27 SERIES
DeviceIGBT Rating

RemarkFAM65V05DF1

50 A / 650 V

Version 1.0

NFVA33065L32

30 A / 650 V

Version 2.0

NFVA34065L32

40 A / 650 V

Version 2.0

NFVA35065L32

50 A / 650 V

Version 2.0

Moduleassembly with
PCB (Soldering)

TIM application

Heat sink
mounting

Screw
tightening

TIM application

Modulemounting toheat sink

Screw
tightening

Moduleassembly with
PCB (Soldering)

Figure 1. ASPM27 Module Assembly Process Flow

© Semiconductor Components Industries, LLC, 2019

September, 2019 − Rev. 1

1

Publication Order Number:
AND9922/D

AND9922/D
GENERAL PACKAGE INFORMATION
Package Surface Specification

The measurement area for the flatness of the package
surface is specified by the package center and the four
outside corners, as shown in Figure 2. Flatness for the
ASPM 27 is specified in Table 2. The surface down withtorque, the thermal compound spreads out and fills the air
gaps between the two contact partners, finally ensuring fullcontact.
ASPM27

Figure 3. Microscopic View of Surfaces. A is Flatness
and B is Roughness (Rz)
Specification of External Lead Pin

Table 4 shows technical features of leads. The capabilityof the leads in terms of pulling and bending are evaluated tocheck the devices to withstand stresses from actual handlingand assembly of the devices in application.
Table 4. MECHANICAL CHARACTERISTICS OF THE
LEADSParameter
Material

Figure 2. Device Flatness Measurement Zone
Table 2. SPECIFICATION OF THE ASPM 27 PACKAGE
SURFACEASPM27

Min.

Typ.

Max.

0

−

+150 mmHeat Sink Surface Specification−50~100 (mm)(b) Geometrical surface
roughness (Rz)

≤10 (mm) to DIN EN ISO 4287

Plating materialSn
Min. 10 sec

Bending strength, Load 9.8 N 90 deg.
bend acc. to JESD22−B105−C

Min 2 times

Lead pull test

Figure 4. Lead Bending and Pull Test Images
Clearance and Creepage Distance

Since electrical isolation is directly related to thereliability of the product and its safety, it is considered as animportant design factor of a power package. The spacing
distance between components that are required to withstanda given working voltage and the environment (depending on
the pollution degree, temperature and relative humidity) is
specified in the terms of Clearance and Creepage in
IEC 61800−5−1. Clearance is defined as the shortest
distance through the air between two conductive parts.
Creepage is defined as the shortest path between two
conductive parts measured along the surface of an isolator.

Table 3. HEAT SINK SURFACE REQUIREMENTS(a) Flatness of heat sink

Cu Alloy

Pulling strength, Load 19.6 N acc. to
EIAJ−ED−4701

Lead bending test

A heat sink is a passive heat exchanger that is designed toabsorb and disperse heat away from the power devices. The
thermal performance of a module is influenced by thequality of the surface contact to the heat sink. To optimize
the thermal dissipation it is required to maintain a highquality of the heat sink surface. Surface flatness androughness are the key factors to be considered whenmanufacturing the heat sink. In order to obtain thespecification given in Table 3 and Figure 3 needs to befollowed. The surface of the heat sink must be clean and freeof particles. Besides the surface quality, the heat sink designis also one of the key factors that improve the heatdissipation capability of a device.

Description

Main materialwww.onsemi.com
2

AND9922/D
The specification of the electric spacing for ASPM 27 isdescribed in Table 5 as well as in Figure 6. In order tomaintaining certain spacing addressed in the relevant
standard after heat sink and PCB assembly, Creepage andClearance need to be checked and additional measures toenlarge the creepage and clearance distances may need to be
applied. Figure 5 shows one of example how to achieve theenlarger creepage and clearance by modify the heat sink
shape.

Table 5. MINIMUM DISTANCE FOR ISOLATION FOR
ASPM 27

Location

Clearance[mm]

Creepage
Distance[mm]

A

Between power terminals

4.32

4.52

B

Between control terminals

3.05

5.24

C

Between power terminals &
H/S

3.00

4.13

D1

Between control terminals &
H/S

3.00

8.33

3.00

4.53

E

Between Dummy terminals &
H/S

3.00

4.13

F1

Between Dummy terminals &Washer−−−−

Between control terminals &DBC edge

−

12.79

−

8.99

Between power terminals &DBC edge

−

7.29

D2

F2
G1
G2
H

Figure 5. Creepage and Clearance Improvements by
Heat Sink Modification

Clearance Distance > 4.32 mm
Creepage Distance > 4.52 mm

Clearance Distance > 3.05 mm
Creepage Distance > 5.24 mm

Clearance Distance > 3.00 mm
Creepage Distance > 4.13 mm

A. Between power terminals

B. Between control terminals

C. Between power terminals & H/S

Figure 6. Distance for Isolation from Lead to Lead and from Lead to Heat Sink and DBC Edge (ASPM 27)
www.onsemi.com
3

AND9922/D

D1

D2

Clearance Distance > 3.00 mm
Creepage Distance > 8.33 mm

Clearance Distance > 3.00 mm
Creepage Distance > 4.53 mm

Clearance Distance > 3.00 mm
Creepage Distance > 4.13 mm

D. Between control terminals & H/S

E. Between Dummy terminals & H/S

F1

F2

Clearance Distance > 4.80 mm
Creepage Distance > 4.80 mm

Clearance Distance > 7.20 mm
Creepage Distance > 7.20 mm

F. Between Dummy terminals & Washer

G1

G2

Creepage Distance > 12.79 mm

Creepage Distance > 8.99 mm

G. Between control terminals & DBC edge

Creepage Distance > 7.29 mm
H. Between power terminals & DBC edge

Figure 6. Distance for Isolation from Lead to Lead and from Lead to Heat Sink and DBC Edge (ASPM 27) (continued)

www.onsemi.com
4

AND9922/D
ASSEMBLY SEQUENCES
The assembly process can be done in two ways. One
method is mounting the module onto the heat sink first andthen proceeds with soldering. (Section Module Mounting to
the Heat Sink First, then Soldering to the Board) On thecontrary, soldering the module on the PCB can be done firstthen mounting on the heat sink is done after. (Section
Soldering to the PCB, then Mounting to the Heat Sink)
Module Mounting to the Heat Sink First, thenSoldering to the Board

When the module is mounted onto the heat sink before
PCB mounting, a process flow as illustrated in Figure 7 isrecommendable. Firstly, apply TIM on the surface of themodule or heat sink and place the module on the heat sink(a). Recommendable TIM application and screw tightening
method are flowed in Section Thermal Interface Materials(TIMS) for Electronics Cooling and Screw Tightening
Guideline. Tighten the screws down to heat sink (b).Then
the module with the heat sink is placed onto the PCB (c).
Finally, the solder joint between lead pins and PCB is formed(wave soldering process or manual soldering) (d).

Figure 7. Process Flow of Soldering ASPM 27
Package (When Heat Sink Mounting First) (continued)

Manual soldering and wave soldering are the generalpractices to assemble the module onto the PCB. With
manual soldering, both bottom side and top side soldering isavailable. Wave soldering system consists typically ofsolder fluxing, preheating zone, solder wave and the coolingzone. As the board enters the conveyorized process, solder
flux is sprayed or foamed onto the modules. Then it moves
to the preheating zones, normally done by convection,
where the flux is activated. The assembly then moves towave soldering. The assembly is slowly cooled down after.
More details about the soldering process and the conditions
for ASPM 27 packages are described in Section Soldering
Guidelines.
Soldering to the PCB, then Mounting to the Heat Sink

If module is assembled with the PCB first and heat sink
mounting is conducted later, process flow described in
Figure 8 is recommendable. Firstly, the module is place on
the PCB (a). Then, soldering to PCB is done (b). After PCB
assembly is done, TIM (Thermal Interface Material) is
applied on the surface of the module or heat sink (c). Place
module onto the heat sink and screws to the heat sink (d).

Figure 7. Process Flow of Soldering ASPM 27
Package (When Heat Sink Mounting First)

www.onsemi.com
5AND9922/D
Table 6. SPECIFICATION OF H1 AND H2 (UNIT: MM)
ASPM 27

H1

H2

H3

*H4

5.50

1.50

7.00

4.80

*H4 is the extruded lead part from the PCB in case the PCB thickness
is 1.6 mm.

System Considerations

After module is assembled to the PCB and the heat sink as
described above, the overall structural integrity need to beconsidered in terms of mechanical stress to any of the systemcomponents. In case the PCB is large and heavy with othercomponents assembled to it, there is some risk the PCB canbend, creating mechanical stress to the module and the PCB.
In addition, when multiple modules are applied to the same
PCB, height tolerance between modules can result inmechanical stresses to the board and modules. Figure 9
illustrates one of method to prevent PCB bending and stressby using spacers between PCB and heat sink. Various typesof spacer should be added on the heat sink, to prevent any
possible movement of the PCB.

Figure 9. Robust Assembly Method of ASPM 27
Package to Reduce Stresses from PCB Bending

Figure 8. Process Flow of Soldering ASPM 27
Package (When PCB Mounting First)

Figure 10 shows examples of spacer type. Option 1 shows
individual spacers between heat sink and PCB. Option 2shows one body spacer type of heat sink. And, option 3
shows a spacer between module and the PCB.

Minimum distance between PCB and heat sink isdesigned to be H3 and the distance between module and
PCB is H2, as described in Table 6.

www.onsemi.com
6

AND9922/D
Though thermal interface materials with improved
performance are available nowadays, still the mostcommonly used in the industry is thermal grease. Thermal
greases consists of silicone or hydrocarbon oils that containvarious fillers which have good surface wetting
characteristics and flow easily to fill void even at low
mounting pressure. Standard thermal compounds have athermal conductivity between 0.7 − 0.9 W/m−k while thethermal conductivity of high end compounds is in the rangeof 2.0 − 4.0 W/m−k or even above. As an alternative PCM(Phase Change material) provide improved reliability andhigh thermal performances as well as lower overall costs due
to a simplified assembly process. It is recommended tocontact your local On semiconductor representative formore information regarding PCM pre−applied modules.
Manual TIM Application

Thermal grease can be applied to the heat sink or themodule back surface using a rubber roller or spatula or byscreen printing. A rubber roller, as shown in Figure 11, is aneasy and fast method for applying thermal grease. Since thethermal grease has the lowest thermal conductivity in thethermal path, a layer as thin as possible is necessary to keep
the overall thermal resistance low. Recommended thicknessof printing layer is uniform dispense of a minimum 150 mm.
The thermal grease thickness can be checked using
thickness gauges, such as wet film combs or wet film
wheels. Since manual control of printing pressure and speed
can be learned by experience, training is needed to achievea technique for good quality printing in the application.
Figure 10. Examples of the Spacer TypeTHERMAL INTERFACE MATERIALS (TIMS) FOR
ELECTRONICS COOLING
Since the contact surfaces are not perfectly flat, multiple
air gaps can form between two solid contact surfaces. Air isa poor heat conductor preventing the heat transfer andlimiting the effective contact area. Thermal Interface
Materials (TIMs) need to be applied between the heat sinkand the module surface to fill any air gaps and to achieve a
low thermal resistance. The following are the generalconsiderations when choosing the material for theapplication. Besides its thermal conductivity also handlingand rework performance may be important factors while
selecting the proper TIM.
• High thermal conductivity• Ease of distribution with low contact pressure• Minimal thickness• Degradation of characteristics over time
• Environmental• Ease in handling during application or removal

Figure 11. Example of Thermal Grease Application
Using a Rubber Roller

www.onsemi.com
7AND9922/D

Figure 11. Example of Thermal Grease Application
Using a Rubber Roller (continued)
TIM Application by Manual Screen PrinterStencil/screen printing can be utilized for the applicationof thermal paste. It allows a fast, clean and easy handling of
spreadable TIMs. They can be applied to the substrate area,leaving out other parts of the module package using
specifically designed stencils. An optimization of the screenmask pattern and thickness is required to achieve a goodquality of the print and finally and optimum contact.
Figure 12 shows and example of thermal paste application
process using a manual screen print.
Fully automated screen printing is recommended in mass
production. It has a good quality of printing layer with highaccuracy and repeatability.

Figure 12. Example of Thermal Grease Application
Using a Manual Screen Print

www.onsemi.com
8

AND9922/D
SCREW TIGHTENING GUIDELINE
Screw and Mounting Torque

ASPM 27 package should be secured on the heat sink via
two M3 screws. The location of the screw holes areillustrated in Figure 13. Table 7 shows the screw
specification and Table 8 is showing the recommended
torque ranges for the ASPM 27 package. Contact pressure
and mounting torque may affect the thermal performance.
The thermal resistance specified can be achieved with theminimum specified torque in the Table 8. Electricscrewdrivers can tighten the screws with the specified
torque. Considering the electrical spacing specified in
Section Clearance and Creepage Distance, additional flat or
spring washers can be applied on packages during mounting.
Figure 14 shows SEMS (Pre−assembled washers and screw)which is a recommended screw type. Appendix I showsthermal resistance variance under various torque levels.

Figure 14. SEMS (Pre−assembled Washers andScrew, Spring Washer ø5.5 and Plain Washer ø7.0)
Screw Tightening Method

Screw tightening can be done in various ways. Figure 15
describes one recommended method for fastening themodule to the heat sink. Fasten two screws with final torquesimultaneously to prevent tilting or rising of top side ofmodule during fastening. The recommended final torque isin the range of 0.6 − 0.8 Nm (6.1 − 8.2 kgf⋅cm), as shown in
Table 8. Method 1 enables to maintain an even thermal
grease layer after mounting.

ASPM 27

Figure 13. Dimension of Screw Clamping Zone (mm)Figure 15. Illustration of Screw Clamping with Heat
Sink (Method 1)

Table 7. SCREW AND WASHER INFO
Parameter

Alternatively, Figure 16 shows another recommended
method to tighten the screws. Fasten the first screw withpre−torque to prevent one side tilting or rising of the module(Step 1). Then insert the second screw to the other side withsame pre−torque (Step 2). The pre−screwing torque is set to20 − 30% of final torque rating. After that, apply full final
torque to the second screw (Step 3). Finally, apply full torqueto the first screw for proper mounting to the heat sink
(Step 4). An insufficient tightening torque may cause anincreased thermal resistance or loosening of the screws
during operation.

Description

Mounting Screw

Metric 3 screw

Spring Washer

D (Nominal) = ø5.5 (mm), t = 1.2

Plain Washer

D (Nominal) = ø7.0 (mm), t = 0.5 (mm)Recommended thread engagement for screws with property
class 4.8 to 6.8 for different materials

Table 8. MOUNTING TORQUE SPECIFICATION FOR
ASPM 27
Parameter
Pre−TorqueFinal Torque

Unit

Min.

Typ.

Max.

[N⋅m]

0.2

−

0.3

[kgf⋅m]

2.0

−

3.1

[N⋅m]

0.6

0.7

0.8

[kgf⋅cm]

6.1

7.1

8.2

Generally, pre−torque is 20 − 30% of the final torque
Recommended final torque is 0.7 N⋅mwww.onsemi.com
9AND9922/D
Potential Failure Modes

Pre−torque (Step 1 " Step 2)

The following are possible root causes of mounting
failures which should be avoided during the mounting
process. Table 9 lists representative examples of mounting
failure mode.
• Excessive torque is applied without pre−torque• Misalignment of screw during tightening with heat sink
• Mechanical stress by mounting height tolerances when
multiple module mounted on the same PCB• Inappropriate type of screws are used
Table 9. EXAMPLES OF MOUNTING FAILURE MODE
Failure Mode andCause1) EMC broken due to toohigh torqueFinal Torque (Step 3 " Step 4)2) Package crack byabnormal heat sinkflatness

Figure 16. Illustration of Screw Clamping with Heat
Sink (Method 2)

3) Ceramic crack(Ceramic substrate is
inked with yellow color)

NOTE:• Avoid applying over torque when mounting screws.
Excessive fastening force may cause damages to thesemiconductor devices, the package or its isolation, as
well as damages to the screws or heat−sink.
• Uneven mounting can cause the ceramic substrate to bedamaged. A smooth surface free of burrs and protrusions
or indentations is required (Table 3). No foreign materials
except thermal interface materials are allowed between
surface of the module and the heat sink.
• The mounting area should be treated as a functional layer.
Do not touch the mounting area of the heat sink and thesubstrate of the module.

4) Bolts broken

www.onsemi.com
10

ExampleAND9922/D
SOLDERING GUIDELINES
Wave soldering or hand soldering are the general practicefor through−hole type (THT) components. This section
assesses characteristics of the soldering process for
ASPM 27 modules at the assembly to a PCB (Printed Circuit
Board).
Wave Soldering

Assemblies are placed on a carrier belt moving throughthe soldering process contacting a solder wave. The wave
soldering process typically uses a thermal profile which
consists of four stages: solder fluxing, preheating zone,
solder wave and cooling zone. Solder flux is either sprayedor foamed onto the components. Then the parts move to thepreheating zones, normally done by convention, where theflux is activated. The assembly then moves to wave
soldering and finally is getting cooled down slowly. Keyelements such as preheat ramp rate, conveyor speed, peaktemperature and time forms a wave solder profile. The wave
soldering profile should be optimized in the assembly site
since it strongly depends on the equipment condition and thematerial type used in application. A typical soldering profile
and its conditions are illustrated in Figure 17 and Table 10.
Preheat: Preheating is required to avoid thermal stress due
to overheat. Preheat temperatures and the preheating timeshould be set according to the flux specification. Too hightemperature and too long preheat time may break down theflux activation systems which causes shorts. On the other
hand, too low preheat temperature may cause unwanted
residues left on the PCB. A ramp up rate between 1~4°C per
second is suggested in the preheat zone.
Wave soldering: Dual−wave soldering is the mostcommon method. The 1st wave which has turbulent wave
crest ensures wetting of all the land pads allowing the molten
solder to find its way to all joints on the PCB. The 2nd wave,
which has a laminar flow, drains the excess solder from theboard after the 1st wave thus removing the solder bridges. It
is recommended to keep the maximum soldering
temperature up to 260°C for 10 sec to establish a goodquality of the solder joint and to avoid package damage bythermal shock.
Cooling: Gradually cool the processed board down. A
cooling down rate between 1 − 5°C/s is recommended ingeneral.

Figure 17. Typical Dual Wave Soldering Profile
Table 10. TYPICAL DUAL WAVE SOLDERING
CONDITION (AT LEAD SURFACE)
Profile Feature

SnPb Eutectic
AssemblyPb−free
Assembly

Average ramp up rate

~200°C/sec~200°C/sec

Preheat ramp up rate

Typical 1 − 2,
max 4°C/sec

Typical 1 − 2,
max 4°C/sec

Final preheat temp.

~130°C~130°C

Peak wave soldering
temperature

max 235°C,
max 10 sec

max 260°C,
max 10 sec

Ramp down rate

5°C/sec max

5°C/sec max

Detailed conditions of the soldering profile should be
defined by users as it depends on the equipment and thematerials.
Manual Soldering

The recommended conditions for manual soldering arelisted in Table 11. Considering the glass transition
temperature (Tg) of the package mold resin and the thermal
withstand capability of internal chips and assembly, thetemperature of the lead root part should be kept below
150°C. Iron tip should touch the lead at its tip, away from thepackage mold body.
Manual soldering is not recommended for mass
production as it may be difficult to control the amount ofsolder applied and the time and temperature of the soldering
step.
Table 11. EXAMPLE OF MANUAL SOLDERING
CONDITION
Parameter

Single Side
Circuit Board

Double / Multi Layers
Circuit Board

Iron tip temperature

385 ±10°C

420 ±10°C

Soldering time

2~6 seconds

4~10 seconds

www.onsemi.com
11

AND9922/D
Soldering Quality Inspection

Literature

Monitoring the soldering quality is essential sinceabnormal solder joints are potential risks. IPC−A−610
standard specifies the soldering quality criteria for soft
soldering. For the examination of a solder joint, visual or
X−ray inspection and automatic optical inspection (AOI)
are suitable evaluation methods.

1. AN−5082, “Power56 Wave−Soldering Board
Assembly Considerations”, 2015, Fairchild.
2. SARVAR, F., WHALLEY, “Thermal interface
materials − a review of the state of the art”,
September 2006.
3. IPC−A−610−D, “Acceptance of Electronic
Assemblies,” February 2005.
4. IPC J−STD−001D, “Requirements for SolderedElectrical and Electronic Assemblies.”
5. IPC−SM−7525A, “Stencil Design Guidelines,”
May 2000.
6. JEDEC, JESD22−B102D, “Solderability,” VA,
Sept. 2004.

APPENDIX I
Thermal Performance under Various Mounting TorqueSince the module surface and heat sink are not perfectly
flat, contact pressure and mounting torque can affect thermal
performance. According to the results shown in Figure 18,
thermal resistance values (Rthjc) were measured stablevalues at torque levels ranging between 5~7 (kg⋅f−cm) with
ASPM 27 package.

Figure 18. Thermal Resistance under Various
Mounting Torque

SPM is registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
ON Semiconductor andare trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are notdesigned, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, andexpenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if suchclaim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com◊

N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910

www.onsemi.com
12

ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative

AND9922/D