User's Guide
SLUUBP1A – June 2017 – Revised April 2018

BOOSTXL-3PhGaNInv Evaluation Module

The BOOSTXL-3PhGaNInv EVM (also referred to as "EVM" throughout this document) realizes a 48-V
and 10-A three-phase GaN inverter with precision in-line shunt-based phase current sensing for accurate
control of precision drives such as servo drives. The EVM offers a TI BoosterPack™ compatible interface
to connect to a C2000™ MCU LaunchPad™ development kit for easy performance evaluation.

1

2

3

Contents
Introduction ................................................................................................................... 2
1.1
Features .............................................................................................................. 2
1.2
Applications .......................................................................................................... 2
1.3
Description ........................................................................................................... 2
Getting Started Hardware and Software .................................................................................. 6
2.1
BOOSTXL-3PhGaNInv EVM PCB Overview ................................................................... 6
2.2
BOOSTXL-3PhGaNInv EVM Jumper Settings .................................................................. 7
2.3
Interface to C2000 InstaSPIN-MOTION LaunchPad™ ........................................................ 7
2.4
InstaSPIN-FOC Example Project for Teknic Servo Motor M-2310P-LN-04K .............................. 8
Schematic, Bill of Materials, and PCB Layout .......................................................................... 12
3.1
Schematics, Bill of Materials and PCB files .................................................................... 123.2
PCB Layout Recommendations ................................................................................. 12
List of Figures

1

Typical Current Shunt Placement in Three-Phase Inverters ........................................................... 2

2

Inline Shunt Phase Current Sensing With INA240 Current Sense Amplifier ........................................ 33

BOOSTXL-3PhGaNInv EVM Block Diagram............................................................................. 44

BOOSTXL-3PhGaNInv EVM PCB—Top View........................................................................... 65

BOOSTXL-3PhGaNInv EVM PCB—Bottom View ....................................................................... 66

BOOSTXL-3PhGaNInv EVM LaunchPad™ Connection Example .................................................... 8

7

Dialog Window for Step 4................................................................................................... 98

Dialog Window for Step 5a ................................................................................................. 99

Dialog Window for Step 5b................................................................................................ 10

10

Dialog Window for Step 6a................................................................................................ 10

11

Dialog Window for Step 6b ................................................................................................ 11
List of Tables

1

BOOSTXL-3PhGaNInv EVM Jumper Settings ........................................................................... 7

Trademarks
BoosterPack, C2000, LaunchPad, InstaSPIN-FOC, InstaSPIN-MOTION, MotorWare, Code Composer
Studio are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.

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1

Introduction

1.1

FeaturesThis EVM supports the following features:• Wide input voltage range 12 V to 60 V
• LMG5200 GaN half-bridge power stage simplifies PCB layout and reduces parasitic inductances for
optimized switching performance; less than 2-ns rise and fall time
• Precision in-line phase current sensing with 5-mΩ shunt (for theoretical ±16.5-A full-scale range), and±10-A peak nominal range for this EVM• TI BoosterPack Compatible Interface With 3.3-V I/O for Easy Performance Evaluation With C2000
MCU LaunchPad Development Kit

1.2

Applications
This EVM can be used in the following applications:• Servo drives and motion control• Computer numerical control (CNC) drives• Manufacturing robots• Service robots• Non-military drones

1.3
1.3.1

Description
System Description
For low-voltage drives, shunt-based current sensing is typically implemented as shown in Figure 1.
VphaseHigh dVdt, up to 100V/ns w/ GaN
Common mode voltage 0 to VDC(for example, 48 V)

VDC (48 V)

Iphase,Vphase
IphaseMotor
Vlowside

Ilowside,Vlowside

Ilowside
PWM cycle

Figure 1. Typical Current Shunt Placement in Three-Phase Inverters
Depending on the location of the shunts, the configuration is either low-side or in-line current sensing.
There are disadvantages with low-side sensing. The inline phase current shunt overcomes these problems
and allows for high-precision, accurate phase current sensing.
However, one of the biggest challenges with in-line shunt-based current sensing is the presence of highcommon-mode voltage transients during PWM switching.
The INA240 is designed for common mode voltages from –4 V to 80 V. The high CMRR allows the
INA240 to suppress common mode transients and provide a clean output voltage that corresponds to thedifferential input.

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For three-phase inverters, the differential signal from the phase current shunts can be directly connectedto the INA240 differential inputs and a highly-accurate output is available with minimal common-mode
transient artifacts which typically settles out within 2 µs.
Figure 2 shows the in-line phase current shunt topology as realized with the BOOSTXL-3PhGaNInv EVM.
For precision phase-current measurements with high linearity, the EVM design employs three in-line
phase current shunts and three differential precision current sense amplifiers INA240 with high commonmode and high AC common-mode transient immunity.
LMG5200 (x3)

VDC (48 V)

Motor

INA240
ININ+

VS

PWM
Rejection

OUT
REF2
REF1

GND
GND

Figure 2. Inline Shunt Phase Current Sensing With INA240 Current Sense Amplifier
The EVM three-phase inverter is realized with three LMG5200 GaN half-bridge power modules to allow
high PWM switching frequencies and low loss.
The LMG5200 device integrates the driver and two 80-V GaN FETs in a 6-mm × 8-mm QFN package,
which is optimized for extremely-low-gate loop and power loop impedance.

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1.3.2

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Block Diagram
Figure 3 shows the system block diagram of the three-phase GaN inverter with the BOOSTXL-3PhGaNInv
EVM device indicated in the red-dotted box.
C2000 MCU
LaunchPad

BOOSTXL-3PHGANINVDC/DC
48V to 5V
LM5017

5V

Option to provide 3.3V
to Launchpad 3.3V

3.3V

LDO 3.3V
LP38691

VREF 3.3V

IC

REF3333IB

INA240

GPIO/
PWM
TZ

INA240/PWM
enableDC input

LMG5200/PCB
OT alert

LMG5200

LMG5200

Phase A

Phase B

Phase CIBIA

DC input
12V.. 60V

GaN Driver

GaN Driver

6
PWM_AHPWM_ALPWM_BHPWM_BLPWM_CHPWM_CLGaN Driver4

Buffer for PWM w/ OE

VA,VB,VC,
VDC

ePWM

INA240IA
LaunchPad interface connector

ADC

IC

Vth

OCP
PCB overtemp
TMP302Motor terminal
VA

VB

AC Motor

VC

EMI filter (optional,
not provided)

Figure 3. BOOSTXL-3PhGaNInv EVM Block Diagram
The EVM three-phase inverter with shunt-based precision phase current sensing accepts input DC
voltages from 12 V to 60 V; the nominal DC input voltage is 48 V. A wide input voltage range, DC/DC
converter LM5017 generates the 5-V rail to supply the LMG5200 gate driver and the 3.3-V band-gap
reference, a 3.3-V LDO supplies the current sense amplifier, input buffer and other auxiliary circuits.
Each of the three inverter half-bridges employs an integrated 80-V and 10-A GaN half-bridge module(LMG5200), a 5-mΩ phase current shunt and a differential current sense amplifier (INA240) with a gain of
20 V / V and a midpoint voltage of 1.65 V, set by the 3.3-V reference (REF3333). A temperature switch(TMP302) monitors the PCB temperature close to the GaN power module.
The EVM interface connector to a host processor, like C2000 MCU provides the PWM high- and low-side
input signals, the phase current sense amplifier output voltage and the scaled, low-pass filtered phasevoltage for each of the three phases. The PWM signals are buffered. A PWM enable signal (active low)
allows the host processor to enable and disable all three complementary PWM simultaneously through theonboard buffer. The interface connector also provides the scaled DC-link voltage as well as a PCB overtemperature alert (active low).
Hardware overcurrent protection is implemented with the TLV3201. The trip threshold is set to 12 A, with
1-A hysteresis.
The motor is connected to the three-phase motor terminal.

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The C2000 MCU LaunchPad with the TMS320F28069M device is connected to the EVM and implements
a sensorless, speed-variable, field-oriented control of a synchronous motor using the InstaSPIN-FOC™
software. An example firmware for the TMS320F28069M device on the InstaSPIN-MOTION™ LaunchPad
has been provided to evaluate the BOOSTXL-3PhGaNInv EVM design with a 48-V low-voltage servo
motor (http://www.ti.com/tool/lvservomtr).

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2

Getting Started Hardware and Software

2.1

BOOSTXL-3PhGaNInv EVM PCB Overview

Figure 4. BOOSTXL-3PhGaNInv EVM PCB—Top View

Figure 5. BOOSTXL-3PhGaNInv EVM PCB—Bottom View

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2.2

BOOSTXL-3PhGaNInv EVM Jumper Settings
The jumper J6, when populated, provides 3.3 V to the J1-1 interface pin to supply the C2000 LaunchPad
with 3.3 V. The maximum continuous current is 300 mA. When working in a debug session, J6 should beuninstalled if the C2000 LaunchPad is connected to and powered by a USB port.
Table 1 shows the BOOSTXL-3PhGaNInv EVM jumper settings.
Table 1. BOOSTXL-3PhGaNInv EVM Jumper Settings
JumperFunction

Populated

Not Populated

J6

3.3-V supply at J1-1 interface connector to
LaunchPad

3.3 V (default)

Not connected

CAUTION
When the jumper J6 is populated, ensure that the C2000 LaunchPad is not
powered through USB. To ensure this, remove J6, or remove the JP1 and JP2
jumpers on the C2000 InstaSPIN-MOTION LaunchPad.

2.3

Interface to C2000 InstaSPIN-MOTION LaunchPad™
The BOOSTXL-3PhGaNInv EVM interface specification is compliant to the TI BoosterPack standard. The
BOOSTXL-3PhGaNInv EVM board can either be connected to the C2000 InstaSPIN-MOTION LaunchPad
headers J1 through J3 and J2 through J4 or to the extended headers J5 through J7 and J6 through J8.
CAUTION•••

When connecting the BOOSTXL-3PhGaNInv EVM to the LaunchPad, pay
attention that the bottom-side solder joints do not touch any jumpers orheaders of the LaunchPad.
The phase current IA, IB, and IC equivalent output voltage at connectors J114, J1-16, and J1-18 is inverted versus the DRV8301 BoosterPack. Thiswas done to facilitate layout.
When J6 is populated so that the BOOSTXL-3PhGaNInv EVM provides the
3.3 V to supply the LaunchPad, ensure that the LaunchPad is not poweredfrom a USB. Alternatively, remove J6 and power the LaunchPad throughUSB by populating JP1 and JP2 jumpers on the InstaSPIN-MOTION
LaunchPad, as Figure 6 shows.

Figure 6 shows the BOOSTXL-3PhGaNInv EVM connected to the InstaSPIN-MOTION LaunchPad
headers J5 through J7 and J6 through J8. Note that the BOOSTXL-3PhGaNInv EVM J6 is removed andthe jumpers JP1 and JP2 on the LaunchPad are populated. The LaunchPad is powered by the USB port
in this configuration.

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Figure 6. BOOSTXL-3PhGaNInv EVM LaunchPad™ Connection Example
Connect the DC power supply (12 to 60 V, 48-V nominal) to the DC input voltage connector (J4) and thethree-phase motor to the three-phase output voltage connector (J3). Validate that the three-phase motor
can handle the high slew rates of the phase voltages during PWM switching; otherwise, consider using a
low-pass LCR filter to reduce the slew rate of the phase voltage according to the requirements of the
motor.

2.4

InstaSPIN-FOC Example Project for Teknic Servo Motor M-2310P-LN-04K
The software example is created for the InstaSPIN-MOTION LaunchPad using headers J5 or J7 and J6 or
J8. Ensure the EVM board is connected to the InstaSPIN-MOTION LaunchPad as Figure 6 shows.
Be sure to install Texas Instrument's MotorWare™ software package in the default install path, forexample C:\ti\motorware\motorware_1_01_00_18.
Unzip the BOOSTXL-3PhGaNInv EVM software package.
Follow the steps in Section 2.4.1 to create an InstaSPIN-FOC project example for the EVM hardware
connected to the InstaSPIN-MOTION LaunchPad.

2.4.1

Set up BOOSTXL-3PhGaNInv EVM Board Specific Project Folders in MotorWare™ Software
1. Navigate to folder: C:\ti\motorware\motorware_1_01_00_18\sw\solutions\instaspin_foc\boards.
2. Create a copy of the boostxldrv8301_revB folder in the same directory and rename it to boostxl3PhGanInv.
3. Navigate to the folder: C:\ti\motorware\motorware_1_01_00_18\sw\modules\hal\boards.
4. Create a copy of the boostxldrv8301_revB folder in the same directory and rename itboostxl-3PhGanInv.
5. Copy the five source files provided with the EVM software package to the boostxl-3PhGanInv project
folders, as follows:
A. Copy user.h and user_j5.h to the following directory:
C:\ti\motorware\motorware_1_01_00_18\sw\solutions\instaspin_foc\boards\boostxl3PhGanInv\f28x\f2806xF\src. Note that this action replaces or overwrites the original files.
B. Copy hal.c and hal.h to the following directory:
C:\ti\motorware\motorware_1_01_00_18\sw\modules\hal\boards\boostxl3PhGanInv\f28x\f2806x\src. Note that this action replaces or overwrites the original files.
C. Copy proj_lab02a-BOOSTXL-3PhGaNInv.c to the following directory:
C:\ti\motorware\motorware_1_01_00_18\sw\solutions\instaspin_foc\src.

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2.4.2

Set up BOOSTXL-3PhGaNInv EVM Board Specific Project With Code Composer Studio™ (CCS)
Software
1. Start the CCS software, choose boostxl-3PhGanInv as the new workspace, and import the
boostxl-3PhGanInv project from:
C:\ti\motorware\motorware_1_01_00_18\sw\solutions\instaspin_foc\boards\boostxl3PhGanInv\f28x\f2806xF\projects\ccs.
2. Make the proj_lab02a project active.
3. In the CCS Project explorer for proj_lab02a, select the proj_lab02a.c source file and exclude it from thebuild.
4. Add proj_lab02a-BOOSTXL-3PhGaNInv.c to the project by browsing to the following folder:
C:\ti\motorware\motorware_1_01_00_18\sw\solutions\instaspin_foc\src. In the dialog window, add theoption for adding proj_lab02a-BOOSTXL-3PhGaNInv.c as per Figure 7 and click the OK button.

Figure 7. Dialog Window for Step 4
5. In the CCS Project explorer, open the properties window of the proj_lab02 project.
a. In the File menu, navigate to "Resources" → "Linked Resources", and in the dialog window click
the tab on the right for linked resources, as Figure 8 shows:

Figure 8. Dialog Window for Step 5a
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b. Select the hal.c file (in the "Resource Name" column) and edit the existing link (in the "Location"column) with the new link to the boostxl-3PhGanInv project:
MW_INSTALL_DIR\sw\modules\hal\boards\boostxl-3PhGanInv\f28x\f2806x\src\hal.c, as Figure 9shows:

Figure 9. Dialog Window for Step 5bc. Click the OK button to close the dialog window.
6. In the CCS Project explorer, open the properties window of the proj_lab02 project.
a. In the File menu, navigate to Build → C2000 Compiler → Include Options to view the following
options in Figure 10:

Figure 10. Dialog Window for Step 6a

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b. Select the path highlighted ${MW_INSTALL_DIR} and change this to${MW_INSTALL_DIR}/sw/modules/hal/boards/boostxl-3PhGanInv\f28x/f2806x/src/ as Figure 11
shows:

Figure 11. Dialog Window for Step 6bc. Click the OK button to close the properties window.
2.4.3

Compile and Run BOOSTXL-3PhGaNInv EVM Project Example
1. Compile the proj_lab02a project and download to the TMS329F28069F target processor on the
InstaSPIN-MOTION LaunchPad.
2. Open the document instaspin_labs.pdf from:
C:\ti\motorware\motorware_1_01_00_18\docs\labs\instaspin_labs.pdf.
3. Navigate to the Lab 2a - "Using InstaSPIN for the First Time out of ROM", follow the instructions to
identify and run your specific motor.
The default motor defined in this sample project is the Teknic M-2310P-LN-04K. Corresponding files havebeen properly setup so no further file editing is necessary if the same motor is used. When using a
different motor, please follow the setup procedure outlined in the instaspin_labs.pdf. After the files areproperly setup, follow the rest of the procedure to run the motor.

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Schematic, Bill of Materials, and PCB Layout

3.1

Schematics, Bill of Materials and PCB files
To download the schematics, BOM and other PCB files, please visit BOOSTXL-3PhGaNInv EVM.

3.2

PCB Layout Recommendations
For design theory and layout recommendations of the LMG5200 device, see the TIDA-00909 design.
For design theory and layout recommendations of the INA240 device, see the TIDA-00913 design.

Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (June 2017) to A Revision ......................................................................................................... Page••

12

Changed LM5018 to LM5017 in Figure 3. ............................................................................................. 4
Changed LM5018 to LM5017 in the paragraph following Figure 3. ................................................................ 4

Revision History

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STANDARD TERMS FOR EVALUATION MODULES
1.

Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordancewith the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused byneglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that havebeen altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall bewarranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

3

Regulatory Notices:
3.1 United States
3.1.1

Notice applicable to EVMs not FCC-Approved:

FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold orotherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:••••

Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada
3.2.1

For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247

Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur
3.3 Japan
3.3.1

Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2

Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.

2.
3.

Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, orUse of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けていないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.

電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3

Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

3.4 European Union
3.4.1

For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment thisproduct may cause radio interference in which case the user may be required to take adequate measures.

4

EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1

User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.

4.3.2

EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.

Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.

6.

Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESSFOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.

7.

USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8.

Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDEDHEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9.

Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated

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TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
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represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures thatmight cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, youwill thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated