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AND90068/D
SPM2 (ASPM 34) Package
Assembly Guidance
For 32L (FSAM−) and 34L (FNA−, NFVA−)
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APPLICATION NOTEINTRODUCTION
ON Semiconductor SPM 2 (ASPM 34) series is a compact
semiconductor power module in Dual Inline withhigh−functionality and high efficiency. Target applications
are motor drives for industrial and automotive use such as air
conditioners, servo motors, electric compressors andgeneral−purpose inverters. Proper mounting is required toachieve good thermal performance and low mechanicalstress during lifetime of the device. Figure 1 shows theassembly process flow for SPM 2 32L and SPM 2(ASPM
34) 34L packages. Assemblies commonly are done using
method 1 or method 2 by customer’s determination.

This application note is intended to provide
recommendations for proper handling, assembly of the
package and potential rework in conjunction with industry
standards. Following sections outline appropriate TIM(Thermal Interface Material) application and heat sink
mounting as well as soldering procedures to ensure a reliable
PCB (Printed Circuit Board) connection. Recommendationsin this note are based on simulation and experimental resultsfrom laboratory and field tests.

Figure 1. SPM 2 (ASPM 34) Module Assembly Process Flow

© Semiconductor Components Industries, LLC, 2020

November, 2020 − Rev. 0

1

Publication Order Number:AND90068/D

AND90068/D
GENERAL PACKAGE INFORMATION

quality of the heat sink surface. Surface flatness androughness are the key factors to be considered whenmanufacturing the heat sink. In order to obtain the maximum
thermal conductivity of heat sink and module, thespecification given in Table 2 and Figure 3 needs to befollowed. The surface of the heat sink must be clean and freeof particles. Besides the surface quality, the heat sink designis also one of the key factors that improve the heatdissipation capability of a device.

Package Surface Specification

The measurement area for the flatness of the package
surface is specified by the package center and the four
outside corners, as shown in Figure 2. Flatness for the
SPM 2 (ASPM 34) is specified in Table 1. The surface
shows a convex bow shape but when the module is screwed
down with torque, the thermal compound spreads out andfills the air gaps between the two contact partners, finallyensuring full contact.

Table 2. HEAT SINK SURFACE REQUIREMENTS

SPM2 32L

Parameter

Requirement(a) Flatness of heat sink

−50 ~ 100 (mm)(b) Geometrical surface
roughness (Rz)

≤10 (mm) to DIN EN ISO 4287

SPM 2 (ASPM 34) 34L

Figure 3. Microscopic View of Surfaces.
A is Flatness and B is Roughness (Rz).
Specification of External Terminals

Table 3 shows technical features of the external terminals.
The capability of the leads in terms of pulling and bending
are evaluated to check the devices to withstand stresses from
actual handling and assembly of the devices in application.
The heat resistance of the terminal is also evaluatedaccording to JESD22−B106.

Figure 2. Device Flatness Measurement Zone
Table 1. SPECIFICATION OF THE SPM 2 (ASPM 34)
PACKAGE SURFACE
PackageMin

Typ

SPM2 32 L

0+120 mm

SPM 2 (ASPM 34) 34 L

0+200 mmTable 3. MECHANICAL CHARACTERISTICS OF
EXTERNAL TERMINALSMax

Parameter
Material

Heat Sink Surface Specification

An heat sink is a passive heat exchanger that is designed
to absorb and disperse heat away from the power devices.
The thermal performance of a module is influenced by thequality of the surface contact to the heat sink. To optimize
the thermal dissipation it is required to maintain a highMain material

Cu Alloy

Plating material

Ag partial plating (min 3 mm)

Pulling strength, Load 19.6 N
acc. to EIAJ−ED−4701

Min. 10 s

Bending strength, Load 9.8 N 90°
bend acc. to JESD22−B105−C

Min. 2 times

Heat resistance test acc. to
JESD22−B106

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Description

260 ±5 °C, 10 ±1 s

AND90068/D
Clearance and Creepage Distanceone of example how to achieve the enlarger creepage andclearance by modify the heat sink shape.

Since electrical isolation is directly related to thereliability of the product and its safety, it is considered as animportant design factor of a power package. The spacing
distance between components that are required to withstanda given working voltage and the environment (depending on
the pollution degree, temperature and relative humidity) is
specified in the terms of Clearance and Creepage in IEC
61800−5−1. Clearance is defined as the shortest distancethrough the air between two conductive parts. Creepage isdefined as the shortest path between two conductive parts
measured along the surface of an isolator.
The specification of the electric spacing between the leads
is described in Table 4 and 5 as well as in Figure 4 and 5.
After heat sink mounting, the minimum clearance andcreepage distance between the leads and the heat sink are
3.8 mm and 6.06 mm respectively. In order to maintaining
certain spacing addressed in the relevant standard after heatsink and PCB assembly, creepage and clearance need to bechecked and additional measures to enlarge the creepage andclearance distances may need to be applied. Figure 6 shows

Table 4. MINIMUM DISTANCE FOR ISOLATION FOR
32L
Location

Clearance[mm]

Creepage
Distance [mm]A. Between Power Terminals

4.42

4.62

B. Between Control Terminals

2.70

4.90

C. Between Terminals & H/S

3.00

4.30

Table 5. MINIMUM DISTANCE FOR ISOLATION FOR
34L
Location

Clearance[mm]

Creepage
Distance [mm]D. Between Power Terminals

7.80

8.00

E. Between Control Terminals

3.05

6.85

F. Between Terminals & H/S

3.80

6.06

Figure 4. Distance for Isolation from Pin To Pin and from Pins to Heat Sink (SPM 2 (ASPM 34) 34L)

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AND90068/D

Figure 5. Distance for Isolation from Pin To Pin and from Pins to Heat Sink (SPM2 32L)

Figure 6. Creepage and Clearance Improvements by Heat Sink Modification

ASSEMBLY SEQUENCES

flux is sprayed or foamed onto the modules. Then it moves
to the preheating zones, normally done by convection,
where the flux is activated. The assembly then moves towave soldering. The assembly is slowly cooled down after[1]. More details about the soldering process and theconditions for SPM 2 (ASPM 34) packages are described in
Section ‘Soldering Guidelines’.

The assembly process can be done in two ways. One
method is mounting the module onto the heat sink first andthen proceed with soldering. (Section ‘Soldering to the
PCB’) On the contrary, soldering the module on the PCB canbe done first, then mounting on the heat sink is done after.
(Section ‘Module Mounting to the Heat Sink First’)
Soldering to the PCB, then Mounting to the Heat Sink

If module is assembled with the PCB first and heat sink
mounting is conducted later, process flow described in
Figure 7 and Figure 8 is recommendable. Firstly, the moduleis placed on the PCB until the lead stopper contacts with the
PCB (a). Then, soldering to PCB is done (b). Minimum
distance between PCB and heat sink is designed to be H1 andthe distance between module and PCB is H2, as described inTable 6.
Manual soldering and wave soldering are the generalpractices to assemble the module onto the PCB. At manualsoldering, both bottom side and top side soldering isavailable. Wave soldering system consists typically ofsolder fluxing, preheating zone, solder wave and the coolingzone. As the board enters the conveyorized process, solder

Figure 7. Process Flow of Soldering a SPM 2(ASPM 34) Package (when PCB mounting first)

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AND90068/D
solder joint between pins and PCB is formed (selective
soldering process, manual) (d).

Table 6. SPECIFICATION OF H1 AND H2
Package

H1

H2

H3

SPM2 32 L

7.20 mm0.98 mm

8.18 mm

SPM 2 (ASPM 34) 34 L

8.00 mm

1.00 mm9.00 mm

After PCB assembly is done, TIM (Thermal Interface
Material) is applied on the surface of DBC or heat sink (c).
Place module onto the heat sink and screws to the heat sink(d). Recommendable TIM application and screw tightening
method are followed in Section ‘Thermal Interface
Materials for Electronics Cooling’ and ‘Screw Tightening
Guideline’ section.

Figure 9. Process Flow of Mounting a SPM 2(ASPM 34) Package (when PCB mounting first)
System Considerations

After module is assembled to the PCB and the heat sink as
described above, the overall structural integrity needs to beconsidered in terms of mechanical stress to any of the systemcomponents. In case the PCB is large and heavy with othercomponents assembled to it, there is some risk the PCB canbend, creating mechanical stress to the module and the PCB.
In addition, when multiple modules are applied to the same
PCB, height tolerance between modules can result inmechanical stresses to the board and modules. As an option,
to reduce stress, spacers should be added on the heat sink, as
illustrated in Figure 10, to prevent any possible movementof the PCB.

Figure 8. Process Flow of Mounting a SPM 2(ASPM 34) Package (when PCB mounting first)

Module Mounting to the Heat Sink First, thenSoldering to the Board
When the module is mounted onto the heat sink before
PCB mounting, a process flow as illustrated in Figure 9 isrecommendable. Firstly, apply TIM on the surface of DBC
or heat sink and place the module on the heat sink (a).
Tighten the screws down to heat sink (b). Then the modulewith the heat sink is placed onto the PCB (c). Finally, thewww.onsemi.com
5AND90068/D

Figure 11. Examples of the Spacer Type
Figure 10. Process Flow of a Soldering for
SPM 2 (ASPM 34) Package (when spacers
applied between PCB and heat sink)

When the stopper of the pin touches the PCB the distance
between PCB and heat sink is 7.2 mm for 32L and 8.0 mm
for 34L. Therefore, the height of the spacer should bedesigned to be 7.2 (+0.1/−0.1) mm and 8.0 (+0.1/−0.1) mm.

Figure 11 shows examples of spacer type. Option 1 shows
individual spacers between heat sink and PCB. Option 2shows a special shape of heat sink. And, option 3 is thespacer mounted between module and the PCB.

Figure 12. Height of Spacer and Air Gap

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AND90068/D
THERMAL INTERFACE MATERIALS (TIMs) FOR
ELECTRONICS COOLING
Since the contact surfaces are not perfectly flat, multiple
air gaps can form between two solid contact surfaces. Air isa poor heat conductor preventing the heat transfer andlimiting the effective contact area. Thermal Interface
Materials (TIMs) need to be applied between the heat sinkand the DBC surface of the module to fill any air gaps andto achieve a low thermal resistance. Appendix 1 showsthermal resistance results comparing the assembly with andwithout TIM.
The following are the general considerations whenchoosing the material for the application. Besides its thermal
conductivity also handling and rework performance may be
important factors while selecting the proper TIM.
• High thermal conductivity• Ease of distribution with low contact pressure• Minimal thickness• Degradation of characteristics over time
• Environmental• Ease in handling during application or removal

characteristics and flow easily to fill voids even at low
mounting pressure. Standard thermal compounds have athermal conductivity between 0.7−0.9 W/m−K while thethermal conductivity of high end compounds is in the rangeof 2.0–4.0 W/m−K or even above.
As an alternative PCM (Phase Change Material) provide
improved reliability and high thermal performances as well
as lower overall costs due to a simplified assembly process.
It is recommended to contact your local ON Semiconductor
representative for more information regarding PCM
pre−applied modules.
Manual TIM Application

Thermal grease can be applied to the heat sink or themodule back side using a rubber roller or spatula or byscreen printing. A rubber roller, as shown in Figure 13, is aneasy and fast method for applying thermal grease. Since thethermal grease has the lowest thermal conductivity in thethermal path, a layer as thin as possible is necessary to keep
the overall thermal resistance low. Recommended thicknessof printing layer is uniform dispense of a minimum 150 um.
The thermal grease thickness can be checked using
thickness gauges, such as wet film combs or wet film
wheels. Figure 8 illustrates the application of thermal greaseon the product. Since manual control of printing pressure
and speed can be learned by experience, training is neededto achieve a technique for good quality printing in theapplication.

Though thermal interface materials with improved
performance are available nowadays, still the mostcommonly used in the industry is thermal grease. Thermal
greases consists of silicone or hydrocarbon oils that containvarious fillers which have good surface wetting

Figure 13. Example of Thermal Paste Application Using a Rubber Roller
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7AND90068/D
TIM Application by Manual Screen PrinterStencil/screen printing can be utilized for the applicationof thermal paste It allows a fast, clean and easy handling of
spreadable TIMs. They can be applied to the DBC area,leaving out other parts of the module package using
specifically designed stencils. An optimization of the screenmask pattern and thickness is required to achieve a goodquality of the print and finally an optimum contact.
Figure 14 shows an example of thermal paste application
process using a manual screen print.
Fully automated screen printing is recommended in mass
production. It a good quality of printing layer with highaccuracy and repeatability.

Figure 14. Example (APM 19 Package) of Thermal Paste Application Using a Manual Screen Print

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AND90068/D
SCREW TIGHTENING GUIDELINE

Table 8. MOUNTING TORQUE SPECIFICATION FOR
SPM 2 32L

Screw and Mounting Torque

SPM2 package should be secured on the heat sink via two
M4 screws. The location of the screw holes are illustrated in
Figure 15. Table 7 shows the screw specification and Tables 8−9 are showing the recommended torque ranges for the
SPM 2 (ASPM 34) Packages. Contact pressure andmounting torque may affect the thermal performance. The
thermal resistance specified can be achieved with theminimum specified torque in the Table 8 and 9. Appendix 2
shows thermal resistance variance under various torquelevels. Electric screwdrivers can tighten the screws with thespecified torque. Considering the electrical spacing
specified in Section 2.4, additional flat or spring washers canbe applied on packages during mounting. Figure 16 shows
SEMS (Pre−assembled washers and screw) which is arecommended screw type.

ParameterMin

Pre−TorqueFinal Torque

Typ

Max

Unit

0.2

0.4

N⋅m

2.0

4.1

kgf⋅cm

0.78

0.98

1.17

N⋅m

8.0

10.0

12.0

kgf⋅cmGenerally, pre−torque is 20−30% of the final torque.
Recommended final torque is 0.98 N⋅m.

Table 9. MOUNTING TORQUE SPECIFICATION FOR
SPM 2 (ASPM 34) 34L
ParameterMin

Pre−TorqueFinal Torque

SPM 2 −32L

Typ

Max

Unit

0.2

0.4

N⋅m

2.0

4.1

kgf⋅cm

0.9

1.0

1.5

N⋅m

9.1

10.1

15.1

kgf⋅cmGenerally, pre−torque is 20−30% of the final torque.
Recommended final torque is 1.0 N⋅m.

Figure 16. SEMS (Pre−assembled Washers andScrew, Spring Washer j 7.0 and Plain Washer j 9.0)
SPM 2 (ASPM 34) −34L

Screw Tightening Method

Screw tightening can be done in various ways. Figure 17
describes one recommended method for fastening themodule to the heat sink. Example module is
SPM 2 (ASPM 34) 34L. Fasten two screws with final
torque simultaneously to prevent tilting or rising of one sideof module during fastening. The recommended final torque(Mtorque) is in the range of 0.9−1.5 Nm (9.1− 15.1 kgf⋅cm),
as shown in Table 8. Method 1 enables to maintain an even
thermal grease layer after mounting.

Figure 15. Dimension of Screw Clamping Zone
Table 7. SCREW AND WASHER
Parameter

Description

Mounting Screw

Metric 4 screw

Spring Washer

D = ∅ 7.0 (mm) to DIN 127 or DIN 128

Plain Washer

D = ∅ 9.0 (mm) to DIN 125

Recommended thread engagement for screws with property
class 4.8 to 6.8 for different materials.

Figure 17. Illustration of Screw Clamping with Heat
Sink (Method 1)

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9AND90068/D• Uneven mounting can cause the SPM ceramic substrate

Alternatively, Figure 18 shows another recommended
method to tighten the screws. Fasten the first screw withpre−torque to prevent one side tilting or rising of the module(Step 1). Then insert the second screw to the other side withsame pre−torque (Step 2). The pre−screwing torque is set to20~30 % of final torque rating. After that, apply full final
torque to the first screw (Step 3). Finally, apply full torqueto the second screw for proper mounting to the heat sink
(Step 4). An insufficient tightening torque may cause anincreased thermal resistance or loosening of the screws
during operation.

to be damaged. A smooth surface free of burrs andprotrusions or indentations is required (Table 2). No
foreign materials except thermal interface materials areallowed between DBC of the module and the heat sink.
• The mounting area should be treated as a functional
layer. Do not touch the mounting area of the heat sinkand the substrate of the module.
Potential Failure Modes

The following are possible root causes of mounting
failures which should be avoided during the mounting
process. Table 10 lists representative examples of mounting
failure mode.
• Excessive torque is applied without pre−torque• Misalignment of screw during tightening with heat sink
• Mechanical stress by mounting height tolerances when
multiple module mounted on the same PCB• Inappropriate type of screws are used

Pre−torque

Table 10. EXAMPLES OF MOUNTING FAILURE
MODE (VARIOUS TYPES OF SPM PACKAGES)
Failure Mode and Cause
1) EMC broken due to too hightorqueFinal torque2) Package crack by abnormal
heat sink flatness

3) Ceramic crack by abnormal
heat sink flatness

Figure 18. Illustration of Screw Clamping with Heat
Sink (Method 2)

Note:• Avoid applying over torque when mounting screws.
Excessive fastening force may cause damages to thesemiconductor devices, the package or its isolation, as
well as damages to the screws or heat−sink.

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ExampleAND90068/D
SOLDERING GUIDELINES
Wave soldering or hand soldering are the general practicefor through−hole type (THT) components. This section
assesses characteristics of the soldering process for SPM 2(ASPM 34) modules at the assembly to a PCB (Printed
Circuit Board).
Wave Soldering

Assemblies are placed on a carrier belt moving throughthe soldering process contacting a solder wave. The wave
soldering process typically uses a thermal profile which
consists of four stages: solder fluxing, preheating zone,
solder wave and cooling zone. Solder flux is either sprayedor foamed onto the components. Then the parts move to thepreheating zones, normally done by convention, where theflux is activated. The assembly then moves to wave
soldering and finally is getting cooled down slowly[1]. Keyelements such as preheat ramp rate, conveyor speed, peaktemperature and time forms a wave solder profile. The wave
soldering profile should be optimized in the assembly site
since it strongly depends on the equipment condition and thematerial type used in application. A typical soldering profile
and its conditions are illustrated in Figure 19 and Table 11.
Preheat: Preheating is required to avoid thermal stressdue to overheat. Preheat temperatures and the preheatingtime should be set according to the flux specification. Toohigh temperature and too long preheat time may break down
the flux activation systems which causes shorts. On the other
hand, too low preheat temperature may cause unwanted
residues left on the PCB[1]. A ramp up rate between 1~4 °C
per second is suggested in the preheat zone.
Wave soldering: Dual−wave soldering is the mostcommon method. The 1st wave which has turbulent wave
crest ensures wetting of all the land pads allowing the molten
solder to find its way to all joints on the PCB. The 2nd wave,
which has a laminar flow, drains the excess solder from theboard after the 1st wave thus removing the solder bridges[1].
It is recommended to keep the maximum soldering
temperature up to 260 °C for 10 sec to establish a goodquality of the solder joint and to avoid package damage bythermal shock.
Cooling: Gradually cool the processed board down. A
cooling down rate between 1 − 5 °C/s is recommended ingeneral.

Figure 19. Typical Dual Wave Soldering Profile
Table 11. TYPICAL DUAL WAVE SOLDERING
CONDITION (AT EXTERNAL TERMINALS)
Profile Feature

SnPb Eutentic
Assembly

Pb−Free
Assembly

Average ramp up rate

~200 °C/s~200 °C/s

Preheat ramp up rate

Typical 1−2, max
4 °C/sTypical 1−2, max
4 °C/sFinal preheat temp.

~130 °C/s~130 °C/s

Peak wave soldering
temperature

max 235 °C,
max 10 s

max 260 °C,
max 10 s

Ramp down rate

5 °C/s max

5 °C/s max

Detailed conditions of the soldering profile should be
defined by users as it depends on the equipment and thematerials.
Manual Soldering

The recommended conditions for manual soldering arelisted in Table 12. Considering the glass transition
temperature (Tg) of the package mold resin and the thermal
withstand capability of internal chips and assembly, thetemperature of the terminal root part should be kept below
150 °C. Iron tip should touch the lead terminal at its tip, awayfrom the package mold body.
Manual soldering is not recommended for mass
production as it may be difficult to control the amount ofsolder applied and the time and temperature of the soldering
step.
Table 12. EXAMPLE OF MANUAL SOLDERING
CONDITION
Parameter

Single Side
Circuit Board

Double/multi Layers
Circuit Board

Iron tip temperature

385 ± 10 °C

420 ± 10 °C

Soldering time2 ~ 6 seconds

4 ~ 10 seconds

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AND90068/D
Soldering Quality Inspection

Literature

Monitoring the soldering quality is essential sinceabnormal solder joints are potential risks. IPC−A−610
standard specifies the soldering quality criteria for soft
soldering. For the examination of a solder joint, visual or
X−ray inspection and automatic optical inspection (AOI)
are suitable evaluation methods.

[1] AN−5082, “Power56 Wave−Soldering Board Assembly
Considerations,” 2015, Fairchild[2] SARVAR,F., WHALLEY, “Thermal interface
materials− a review of the state of the art”, September 2006
[3] IPC−A−610−D, “Acceptance of Electronic Assemblies,”
February 2005
[4] IPC J−STD−001D, “Requirements for SolderedElectrical and Electronic Assemblies.”[5] IPC−SM−7525A, “Stencil Design Guidelines,” May
2000[6] JEDEC, JESD22−B102D, “Solderability,” VA, Sept.
2004

APPENDIX 1
Thermal Performance Under Various Mounting
Torque [3]Since the module surface and heat sink are not perfectly
flat, contact pressure and mounting torque can affect thermal
performance. AN−9079 shows a correlation between themounting torque and the thermal resistance for a 1200 V
Motion SPM 2 (ASPM34) module. According to the results
shown in Figure 20, higher thermal resistance values (Rthjc)
were measured at low torque levels ranging between
1~4 (kg⋅f−cm) while the thermal resistance reaches lower
and stable values above 5 (kg⋅f−cm) torque.

Related Datasheets

FSAM10SH60A/D
FSAM15SH60A/D
FSAM20SH60A/D
FSAM30SH60A/D
FSAM20SM60A/D
FSAM30SM60A/D
FSAM50SM60A/D
FSAM75SM60A/D
FNA23060/D
FNA25060/D
FNA27560/D
FNA21012A/D
FNA22512A/D
FNA23512A/D
FNA25012A/D
NFVA22512NP2T/D
NFVA23512NP2T/D
NFVA25012NP2T/D

Figure 20. Thermal Resistance under Various
Mounting Torque

ON Semiconductor andare trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are notdesigned, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, andexpenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if suchclaim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.

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