CC3220MODASx SimpleLink™ Wi-Fi® and IoT
Solution With MCU LaunchPad™ Hardware

User's Guide

Literature Number: SWRU512
August 2017

Contents
1

CC3220MODASx SimpleLink™ Wi-Fi® and IoT Solution With MCU LaunchPad™ Hardware........... 4
1.1

1.2

1.3
1.4

1.5
1.6
1.7

1.8

1.9

2

Manual Information to the End User ..................................................................................... 46
2.1
2.2

2

Introduction ................................................................................................................... 4
1.1.1 Key Features ........................................................................................................ 5
1.1.2 What is Included .................................................................................................... 5
Overview ...................................................................................................................... 5
1.2.1 LAUNCHCC3220MODASF Features ........................................................................... 10
1.2.2 Key Benefits........................................................................................................ 10
1.2.3 Applications ........................................................................................................ 13
1.2.4 Hardware Description ............................................................................................. 14
Connecting a BoosterPack™ ............................................................................................. 16
Buttons, LEDs, Jumper Settings, and Connectors ..................................................................... 16
1.4.1 Buttons and LEDs ................................................................................................. 16
1.4.2 JTAG Headers ..................................................................................................... 17
1.4.3 I2C Connections ................................................................................................... 18
1.4.4 Default I2C Address ............................................................................................... 18
1.4.5 Power Connections ............................................................................................... 19
1.4.6 UART Signals ...................................................................................................... 19
1.4.7 Sense on Power ................................................................................................... 20
1.4.8 2 × 20-Pin Connector Assignment .............................................................................. 21
Electrical Characteristics .................................................................................................. 22
Antenna Characteristics ................................................................................................... 22
Circuit Design ............................................................................................................... 25
1.7.1 Reference Schematic ............................................................................................. 25
1.7.2 Bill of Materials .................................................................................................... 26
Layout Guidelines .......................................................................................................... 27
1.8.1 CC3220MODx Board Layout .................................................................................... 27
1.8.2 CC3220MODAx Board Layout................................................................................... 31
1.8.3 General Layout Recommendations ............................................................................. 35
1.8.4 RF Layout Recommendations (CC3220MODx) ............................................................... 35
1.8.5 Antenna Placement and Routing (CC3220MODx) ............................................................ 37
1.8.6 Transmission Line Considerations (CC3220MODx) .......................................................... 37
1.8.7 RF Layout Recommendations (CC3220MODAx) ............................................................. 39
Operational Setup and Testing (LAUNCHCC3220MODASF) ........................................................ 40
1.9.1 Power ............................................................................................................... 40
1.9.2 Measuring the CC3220MODAx Current Draw................................................................. 43
1.9.3 Clocking ............................................................................................................ 45
RF Function and Frequency Range .....................................................................................
FCC and IC Certification and Statement ................................................................................
2.2.1 FCC .................................................................................................................
2.2.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement ................................................
2.2.3 End Product Labeling .............................................................................................
2.2.4 Device Classifications ............................................................................................
2.2.5 FCC Definitions ....................................................................................................
2.2.6 Simultaneous Transmission Evaluation ........................................................................

Contents

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46
46
47
48
48
49
49

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2.3

2.4

2.5

EU Certification and Statement...........................................................................................
2.3.1 RF Exposure Information (MPE) ................................................................................
2.3.2 Simplified DoC Statement ........................................................................................
2.3.3 Waste Electrical and Electronic Equipment (WEEE) .........................................................
2.3.4 OEM and Host Manufacturer Responsibilities .................................................................
2.3.5 Antenna Specifications ...........................................................................................
CC3220MODx Approved Antennas ......................................................................................

49
49
49
50
50
50
51

Trademarks ....................................................................................................................... 52

Revision History .......................................................................................................................... 53

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Chapter 1
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CC3220MODASx SimpleLink™ Wi-Fi® and IoT Solution
With MCU LaunchPad™ Hardware

1.1

Introduction
Start your design with the industry's first programmable FCC, IC, CE, MIC, and SRRC Certified wirelessmicrocontroller (MCU) module with built-in Wi-Fi® connectivity. Created for the Internet-of-Things (IoT), theSimpleLink™ CC3220MODx and CC3220MODAx family of devices from Texas Instruments™ are wirelessmodules that integrate two physically separated, on-chip MCUs:• An application processor – ARM® Cortex®-M4 MCU with a user-dedicated 256KB of RAM and an
optional 1MB of Serial Flash.
• A network processor MCU to run all Wi-Fi and Internet logic layers. This ROM based subsystem
includes an 802.11b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secureinternet connections with 256-bit encryption.
The CC3220MODx and CC3220MODAx have four total variants:• CC3220MODSM2MOB– Requires an external antenna• CC3220MODSF12MOB– Requires an external antenna– Contains 1MB of Serial Flash• CC3220MODASM2MON– Contains an integral antenna• CC3220MODASF12MON– Contains an integral antenna– Contains 1MB of Serial FlashThe LAUNCHCC3220MODASF is a low-cost evaluation platform for MCUs based on ARM Cortex-M4F
devices. The LaunchPad™ design highlights the CC3220MODASF Internet-on-a chip™ solution and Wi-Fi
capabilities.
The LAUNCHCC3220MODASF also features temperature and accelerometer sensors, programmableuser buttons, one RBG LED for custom applications, and onboard emulation for debugging. The stackable
headers interface demonstrates how easy it is to expand the functionality of the LaunchPad wheninterfacing with other peripherals on existing BoosterPack™ add-on boards, such as graphical displays,
audio codec, antenna selection, environmental sensing, and more.
Free software development tools are available, including TI’s Eclipse-based Code Composer Studio™
(CSS) and IAR Embedded Workbench®. More information about the LaunchPad, the supported
BoosterPacks, and the available resources are at TI’s LaunchPad portal. Also visit the CC3220 Wiki pagefor design resources and example projects.

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1.1.1 Key Features
•
•
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•
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•
•

CC3220MODASx, SimpleLink Wi-Fi, Internet-on-a-chip solution with integrated MCU
40-pin LaunchPad standard that leverages the BoosterPack ecosystem
XDS110-based JTAG emulation with serial port for flash programming
Two buttons and one RGB LED for user interaction
Backchannel universal asynchronous receiver/transmitter (UART) through USB to PC
Onboard chip antenna with U.FL for conducted testing
Onboard accelerometer and temperature sensor for out-of-box demo
Micro USB connector for power and debug connections

1.1.2 What is Included
Kit contents:• CC3220MODASx LaunchPad development tool (CC3220XX-LAUNCHXL)• Micro USB cable• Quick start guide

1.2

Overview
Figure 1-1 shows a functional block diagram of the CC3220MODx module.
CC3x2040 MHz
RF_ANT1
32.768 kHz
BGN

SPI

MAC/PHY

UART

WRF

F

nResetHIB

2.3 V to 3.6 V
VBAT

PM

32-MbitSFlashCopyright © 2017, Texas Instruments Incorporated

Figure 1-1. CC3220MODx Functional Block Diagram

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Figure 1-2 shows a functional block diagram of the CC3220MODAx module.
CC3x2040 MHz
RF_ANT1
32.768 kHz
BGN

SPI

2.3 V to 3.6 V
VBAT

MAC/PHY

UART

WRF

F

PM

32-MbitSFlashCopyright © 2017, Texas Instruments Incorporated

Figure 1-2. CC3220MODAx Functional Block Diagram

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Figure 1-3 shows a functional block diagram of the LAUCNCC3220MODASF SimpleLink LaunchPad.
Acc
BMA222FTDI
FT2232DandSWD Circuit

JTAG and SWD

INT (GPIO13)UART (Flashing)

I 2C
Temperature
Sensor
TMP006USB
Connector

Serial Flash
8 Mbit

M25PX80-VMN6TP
W25Q80BLUXIG

CC3220MODASF12MON
VCC

LDO
3.3 V

Two AA
Battery
Connectors

ReverseProtection
Two 20-pin LaunchPad headers(compatible with TI MCU standard)

Push buttons
GPIO13, GPIO22

LEDs
GPIO9, GPIO10, GPIO11
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Figure 1-3. LAUNCHCC3220MODASF Functional Block Diagram

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Figure 1-4 shows the hardware implementation of the LAUNCHCC3220MODASF.
USB
Connector

Reset
ButtonOP-AMP
Enable Power

Factory Reset Switch

Switch SW2
Switch SW3
Direct Flash AccessSensor Pullups

LED Enable

Reset Pullup Enable

CC3220MODASx

VDD Flash
PullupExternal
Battery
Connector

Figure 1-4. Hardware Implementation of LAUNCHCC3220MODASF

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Figure 1-5 shows the top overlay of the LAUNCHCC3220MODASF.

Figure 1-5. LAUNCHCC3220MODASF Top Overlay
Figure 1-6 shows the top solder of the LAUNCHCC3220MODASF.

Figure 1-6. LAUNCHCC3220MODASF Top Solder

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Overviewwww.ti.com

1.2.1 LAUNCHCC3220MODASF Features
The LAUNCHCC3220MODASF SimpleLink LaunchPad includes the following features:• CC3220MODASF, SimpleLink Wi-Fi, Internet-on-a chip solution with integrated MCU• 40-pin LaunchPad standard that leverages the BoosterPack ecosystem• TI standard, XDS110-based JTAG emulation with serial port for Flash programming• Supports 4-wire JTAG and 2-wire SWD• Two buttons and three LEDs for user interaction• Virtual COM port UART through USB on PC• Onboard chip antenna with U.FL for conducted testing selectable using 0-Ω resistors• Onboard accelerometer and temperature sensor for out-of-box demo with option to isolate the sensors
from the inter-integrated circuit (I2C) bus• Micro-USB connector for power and debug connections• Headers for current measurement and external JTAG connection (option to use the onboard XDS110
to debug customer platforms)• Bus-powered device with no external power required for Wi-Fi• Long-range transmission with highly optimized antenna (200 m typical in open air using an accesspoint with 6-dBi antenna AP)• Can be powered externally, with two AA or two AAA alkaline batteries working down to 2.3-V typical(typ)• Four-layer PCB• Dimensions: 103.1 mm (L) × 58.42 mm (W)

1.2.2 Key Benefits
The CC3220MODx and CC3220MODASx modules offer the following benefits:• CC3220MODS and CC3220MODAS are Wi-Fi modules that consist of the CC3220SM2ARGK while
the CC3220MODSF and the CC3220MODASF consist of the CC3220SF12ARGK single-chip MCUs,
respectively. The fully integrated, industrial temperature grade, green modules include all required
clocks, SPI Flash, and passives.
• The CC3220MODAx modules include an integral antenna for easy integration into the host system.
• CC3220MODx and CC3220MODAx SimpleLink Wi-Fi wireless MCU System-on-Chip (SoC) is a singlechip with two separate execution environments:– User application dedicated ARM Cortex-M4 MCU– Network processor MCU to run all Wi-Fi and Internet logical layers• FCC, IC, CE, MIC, and SRRC certified• Wi-Fi CERTIFIED™ modules, can request certificate transfer for Wi-Fi Alliance members• 1.27-mm pitch LGA package for easy assembly and low-cost PCB design• Applications MCU subsystem– ARM Cortex-M4 core at 80 MHz– Embedded memory• CC3220MODS and CC3220MODAS variant includes 256KB of RAM• CC3220MODSF and CC3220MODASF variant is flash-based MCU with integrated 1MB ofFlash and 256KB of RAM• Peripheral drivers in ROM– McASP supports two I2S channels
– SD
– SPI
– I2C
– UART
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Submit Documentation FeedbackOverviewwww.ti.com•– 8-bit synchronous image interface– Four general-purpose timers (GPTs) with 16-bit PWM mode
– One watchdog timer module– 4-channel, 12-Bit Analog-to-Digital Converters (ADCs)– Debug interfaces: JTAG, cJTAG, and SWD
Wi-Fi network processor subsystem– Wi-Fi Internet-on-a chip dedicated ARM MCU completely offloads Wi-Fi and Internet protocols fromthe application MCU– Wi-Fi modes• 802.11b/g/n station• 802.11b/g/n access point supports up to four stations• Wi-Fi Direct® client and group owner WPA2 personal and enterprise security: WEP, WPA,
WPA2 PSK, and WPA2 Enterprise (802.1x)• IPv4 and IPv6 TCP and IP stack• Industry-standard BSD socket application programming interfaces (APIs)• 16 simultaneous TCP or UDP sockets• 6 simultaneous TLS and SSL sockets• IP addressing: StaticIP, LLA, DHCPv4, DHCPv6 with DAD• SimpleLink technology connection manager for autonomous and fast Wi-Fi connections• Flexible Wi-Fi provisioning With SmartConfig™ technology, AP mode, and WPS2 options• RESTful API support using internal HTTP server• Embedded network applications running on dedicated network processor• Wide set of security features• Hardware features:• Separation execution environments• Device identity• Hardware crypto engine for advanced fast security, including: AES, DES, 3DES, SHA2,
MD5, CRC, and Checksum• Initial secure programming• Debug security• JTAG and debug ports are locked• Personal and enterprise Wi-Fi security• Secure sockets (SSLv3, TLS1.0, TLS1.1, TLS1.2)• Networking security• HTTPS server• Truster root-certificate catalog• TI root-of-trust public key• SW IP protection• Secure key storage• File system security• Software tamper detection• Cloning protection• Secure boot: validate integrity and authenticity of runtime binary during boot• Embedded network applications running on dedicated network processor• HTTP and HTTPS web server with dynamic user callbacks• mDNS, DNS-SD, and DHCP servers

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Overview

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www.ti.com• Ping• Recovery mechanism: can recover to factory defaults or to complete factory image– Wi-Fi TX power• 17.0 dBm at 1 DSSS
• 16.5 dBm at MCS0
– Wi-Fi RX sensitivity• –95.0 dBm at 1 DSSS
• –73.5 dBm at 54 OFDM– Application throughput• UDP: 16 Mbps
• TCP: 13 Mbps
Power-management subsystem– Integrated DC-DC converter with a wide-supply voltage:• VBAT: 2.3 to 3.6 V– Advanced low-power modes:• Shutdown: 1 µA
• Hibernate: 6 µA
• Low-power deep sleep (LPDS): 135 μA (measured on CC3220MODS and CC3220MODSF with
256-KB RAM retention)• RX traffic (MCU active): 59 mA (measured on CC3220MODS; CC3220MODSF consumes anadditional 15 mA) at 54 OFDM
• TX traffic (MCU active): 223 mA (measured on CC3220MODS; CC3220MODSF consumes anadditional 15 mA) at 54 OFDM, maximum power• Idle connected (MCU in LPDS): 710 μA (measured on CC3220MODS and CC3220MODSF with
256-KB RAM retention) at DTIM = 1
Additional integrated components– 40.0-MHz crystal– 32.768-kHz crystal (RTC)– 32-Mbit SPI Serial Flash RF filter and passive components
LGA package for easy assembly and low-cost PCB design– CC3220MODx: 1.27-mm pitch, 63-pin, 20.5-mm × 17.5-mm– CC3220MODAx: 1.27mm pitch, 63-pin, 20.5-mm x 25.0-mm
Operating temperature– Ambient temperature range: –40°C to +85°C
Module supports SimpleLink developers ecosystem

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1.2.3 Applications
The CC3220MODx and CC3220MODAx modules are designed for the following Internet of Things (IoT)
applications:• Cloud connectivity• Internet gateway• Home and building automation• Appliances• Access control• Security systems• Smart energy• Industrial control• Smart plug and metering• Wireless audio• IP network sensor nodes• Asset tracking• Medical devices

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1.2.4 Hardware Description
Figure 1-7 shows the top view of the LAUNCHCC3220MODASF.

Figure 1-7. LAUNCHCC3220MODASF Top View

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Figure 1-8 shows the bottom view of the LAUNCHCC3220MODASF.

Figure 1-8. LAUNCHCC3220MODASF Bottom View

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Connecting a BoosterPack™

1.3

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Connecting a BoosterPack™
A compatible BoosterPack can be stacked on top of the LaunchPad using the 2 × 20-pin connectors. The
connectors do not have a key to prevent the misalignment of the pins or reverse connection. Ensure that
the VCC and 5-V pins are aligned with the BoosterPack header pins. On the LAUNCHCC3220MODASF
LaunchPad, a small white symbol is provided near pin 1 (see Figure 1-9) to orient all BoosterPacks. Thissame marking, provided on compatible BoosterPacks, must be aligned before powering up the boards.

Figure 1-9. Pin 1 Marking on the LaunchPad™ (Tag With 3V3 Mark)

1.4

Buttons, LEDs, Jumper Settings, and Connectors

1.4.1 Buttons and LEDs
Table 1-1 lists the push-button settings.
Table 1-1. Push Buttons

16

Reference

Use

Comments

SW1

Reset

This button is used to reset the CC3220MODASF device. This signal is also output on the 20pin connector to reset any external BoosterPack which may be stacked. The reset button can beisolated using the jumper block at the center of the board.

SW2

GPIO_13

When pushed, GPIO_13 is pulled to VCC.

SW3

GPIO_22

When pushed, GPIO_22 is pulled to VCC.

SW4

Factory default

Pressing this button and toggling the reset restores the factory default image on the serial flash.
This can be used to recover a corrupted serial flash, provided the s-flash was programmed witha recovery image.

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Table 1-2 lists the LED settings.
Table 1-2. LEDs
Reference

Color

Use

Comments

D3

Yellow

nRESET

This LED is used to indicate the state of nRESET pin. If this LED is glowing,
the device is functional.

D2, D1

Green

Debug

Indicates state of the JTAG emulator. For TI use only.

D8

Red

Power

Indicates when the 3.3-V power is supplied to the board.

D7

RGB

GPIO_11 (1)Glows when the GPIO is logic-1.

RGB

GPIO_10 (1)Glows when the GPIO is logic-1.

RGB

GPIO_09

Glows when the GPIO is logic-1.

FRST

Factory reset

Indicates that the push-button for the factory reset is pressed down.

D6(1)

GPIO_10 and GPIO_11 are used as I2C also. So whenever the pullups are enabled, the LEDs glow by default without
configuring the GPIOs.

1.4.2 JTAG Headers
The headers are provided on the board to isolate the CC3220MODASF module from the onboard XDS10based JTAG emulator. These jumpers are shorted by default when the board is shipped from TI (seeFigure 1-10).

Figure 1-10. Jumpers on JTAG Lines
To connect an external emulator, remove the jumpers highlighted in Figure 1-10 and place the external
emulator on the JTAG IN connector (see Figure 1-11).

Figure 1-11. JTAG Input Connector for Using External Emulator

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Table 1-3 lists the JTAG headers.
Table 1-3. JTAG Headers
Reference

Use

Comments

J3 5 – 6 (TCK) (1)

JTAG

Short: Routes the onboard emulator to the CC3220 device.
Open: Isolate the onboard emulator from the CC3220 device.

J3 7 – 8 (TMS) (1)J3 3 – 4 (TDI)
J3 1 – 2 (TDO)(1)

For SWD mode, only TCK and TMS must be shorted to the CC3220 device.

1.4.3 I2C Connections
The board features an accelerometer and a temperature sensor for the out-of-box demo. These
components are connected to the I2C bus and can be isolated using the jumpers provided (see Figure 112).

Figure 1-12. I2C Connections
By removing J15 and J14, the accelerometer and the temperature sensors are isolated from the I2C bus.
Note that this setup also removes any pullup resistor from the I2C bus and any sensors connected to thebus require external pullups.
Table 1-4 lists the I2C connection jumper settings.
Table 1-4. I2C Jumper Settings
Reference

Use

Comments

J15

I2C SDA

Short: Connect the CC3220MODASF I2C bus to the onboard sensors withpullup.
Open: Isolate the sensors from the CC3220 device.

J14

I2C SCL

Short: Connect the CC3220MODASF I2C bus to the onboard sensors withpullup.
Open: Isolate the sensors from the CC3220 device.

1.4.4 Default I2C Address
Table 1-5 lists the default I2C address.
Table 1-5. Default I2C Address

18

Sensor Type

Reference

Part Number

Slave Address

Temperature sensor

U10

TMP0060x41

Accelerometer

U11

BMA222E

0x18

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1.4.5 Power Connections
The board can be powered using the onboard micro USB connector. An onboard DC-DC converter
provides 3.3 V for the CC3220MODASF device and the rest of the board to operate. This supply can beisolated from the DC-DC converter using the jumpers on the board.
Table 1-6 lists the power jumper settings.
Table 1-6. Power Jumper Settings
Reference

Use

Comments

J18

Current measurement

Measures the current flowing into the CC3220MODASF device. Thisjumper also includes the serial flash and any stacked BoosterPack.

J16

Board power

Short: supply the board power from the onboard DC-DC converter. The
board power includes the sensors, LED, and the OPAMP used to drive
the ADC input.

J9

OPAMP EN

If uninstalled, this jumper cuts off the power supply to the OPAMP. Thiscan be used to enable low power measurements.

J23, J24, J25

LED EN

If uninstalled, the LEDs connected to the GPIO would be disabled. Thiscan be used to enable low power measurements.

J17

VSENSE

This jumper is used to power the level shifters located on the emulatorside of the board. The level shifters can be powered by shorting thisjumper. Removing this jumper enables low current measurement.

J19

5-V power

5-V output from the USB VBUS (has a diode drop of up to 0.4 V)

J21

3.3-V power input

Can be used to power the board from an external 2 × AA battery pack.
This jumper has built-in reverse voltage protection to prevent the battery
from being plugged in the reverse manner.

1.4.6 UART Signals
The board supports a USB-based virtual COM port, using the Tiva MCU. The LaunchPad is shipped with
the UART lines from the CC3220MODASF connected to the UART on the Tiva MCU (see Figure 1-13).
The CC3220MODASF UART can also be routed to the 20-pin connector for use as a GPIO or an external
UART (see Figure 1-14). The selection is performed using jumpers on the board.

Figure 1-13. UART Routed to the USB COM Port

Figure 1-14. UART Routed to the 20-Pin Connector

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Table 1-7 lists the UART signals.
Table 1-7. UART Signals
Reference

Use

Comments

J5, J6

UART for flash programming

Short 1 – 2: Route the signals to the 20-pin connector.
Short 2 – 3: Route the signals to the USB for flash
programming.

1.4.7 Sense on PowerThe CC3220MODASF module can be set to operate in four different modes based on the state of thesense on power (SOP) lines. The SOP lines are pins 23, 24, and 34 on the CC3220MODx andCC3220MODAx modules. Table 1-8 lists the state of the device.
Table 1-8. SOP[2:0]
Value

Function

100

Flash programming000

Functional mode + 4-wire JTAG

001

Functional mode + SWD

010

Functional mode + flash

NOTE: SOP[2:0] corresponds to J12 in the LaunchPad schematic design.

Figure 1-15 shows the SOP jumpers.

Figure 1-15. SOP Jumpers

NOTE: Placing no jumpers on the block ensures that the line is pulled low using 100-K pulldown
resistors. Placing the jumper pulls the pin high using a 1-K resistor.

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1.4.8 2 × 20-Pin Connector Assignment
Table 1-9, Table 1-10, Table 1-11, and Table 1-12 show the signal assignment on the 2 × 20-pin
connectors.
NOTE: All signals are 3.3-V CMOS logic levels and are referred to with respect to the CC3220 IC.
For example, UART_TX is an output from the CC3220 IC. For the SPI lines, theCC3220MODASF can act as a master or slave.

Table 1-9. P1 Connector Assignment
Pin Number

MCU Standard
Definition

CC3220MODASx
Pin Map

CC3220MODASx
Pin Number

P1.1

VCC (3.3 V)

VCC (3.3 V)—

VCC (3.3 V)

P1.2

ANALOG_IN

GPIO_03*58

ADC_CH1

P1.3

UART_RXGPIO_13

4

UART0_RX

P1.4

UART_TX

GPIO_123

UART0_TX

P1.5

GPIO

GPIO_06

61

GPIO

P1.6

ANALOG_IN

GPIO_04*59

ADC_CH2

P1.7

SPI_CLKGPIO_145

SPI_CLK

P1.8

GPIO

GPIO_07

62

GPIO

P1.9

I2C_SCL

GPIO_10

1

I2C_SCL

P1.10

I2C_SDAGPIO_112

I2C_SDA

Primary Function

Table 1-10 lists the P2 connector assignment.
Table 1-10. P2 Connector Assignment
Pin Number

MCU Standard
Definition

CC3220MODASx
Pin Map

P2.1

GND

GND

—

GND

P2.2

GPIO

GPIO_28

18

GPIO

P2.3

SPI_CW (wireless)

GPIO_178

SPI_CS

P2.4

TEST

GPIO_31

45

GPIO

P2.5

RST

RESET_OUT—RESET_OUT

P2.6

SPI_MOSIGPIO_16

7

SPI_DOUT

P2.7

SPI_MISO

GPIO_15

6

SPI_DIN

P2.8

SPI_CS (display) / GPIO GPIO_25

21

GPIO

P2.9

SPI_CS (other) / GPIOGPIO_01

55

GPIO

P2.10

GPIO

GPIO_2215GPIO

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Table 1-11 lists the P3 connector assignment.
Table 1-11. P3 Connector Assignment
Pin Number

MCU Standard
Definition

CC3220MODASx
Pin Map

CC3220MODASx
Pin Number

P3.1

5V

5V

—

5V

P3.2

GND

GND

—

GND

P3.3

ANALOG_IN

GPIO_0257

ADC_CH0

P3.4

ANALOG_IN

GPIO_0560

ADC_CH3

P3.5

ANALOG_IN

GPIO_0358

ADC_CH1

P3.6

ANALOG_IN

GPIO_0459

ADC_CH2

P3.7

ANALOG_IN / AUD_FS

GPIO_0863

AUD_SYNC

P3.8

ANALOG_IN /AUD_CLKGPIO_3053

AUD_CLK

P3.9

ANALOG OUT /AUD_OUTGPIO_0964

AUD_DOUT

P3.10

ANALOG OUT /AUD_IN

GPIO_00

50

AUD_DIN

Primary Function

Table 1-12 lists the P4 connector assignment.
Table 1-12. P4 Connector Assignment
Pin Number

MCU Standard
Definition

CC3220MODASx
Pin Map

CC3220MODASx
Pin Number

P4.1

PWM

GPIO_11*

2

PWM

P4.2

PWM

GPIO_10*

1

PWM

P4.3

PWM

GPIO_24*

17

PWM

P4.4

PWM

GPIO_09*

64

PWM

P4.5

CCAP

GPIO_25*21

CCAP / GPIO

P4.6

CCAP

GPIO_28*18

CCAP / GPIO

P4.7

GPIO

GPIO_07*

62

GPIO

P4.8

GPIO

GPIO_05*

60

GPIO

P4.9

GPIO

GPIO_23

16

GPIO

P4.10

GPIO

GPIO_24

17

GPIO

Primary Function

The signal mappings are as indicated in Table 1-9 through Table 1-12. All of the signals are referred to by
the pin number in the SDK and Table 1-9 through Table 1-12 show the default mappings. Some of thepins are repeated across the connector. For example, pin 62 is available on P1 and P4, but only P1 isconnected by default. The signal on P4 is marked with an asterisk (*) to signify that it is not connected bydefault. The signal on P4 can be routed to the pin by using a 0-Ω resistor in the path. For the exact
resistor placement, see the full design implementation at CC3220MODx SimpleLink™ Wi-Fi® and Internetof Things Hardware Design Files.

1.5

Electrical Characteristics
For electrical characteristics for the CC3220MODx and CC3220MODAx modules, see CC3220MOD
SimpleLink™ Wi-Fi® CERTIFIED™ Wireless Module Solutions (S and SF).

1.6

Antenna Characteristics
The CC3220MODSM2MOB and the CC3220MODSF12MOB reference design detail the use of an on-chipantenna. For more information on the antenna VSWR, efficiency, and electrical characteristics, seeAH316M245001-T.

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The CC3220MODASM2MON and CC3220MODASF12MON devices have an integral antenna. Thisantenna has a nominal efficiency of 70%, and a maximum gain of 2.5 dBi. Figure 1-16 shows themeasured S-parameters of the integral antenna on the CC3220MODAx.

Figure 1-16. Integral Antenna S-Parameters on CC3220MODAx Modules
Figure 1-17 shows the measured radiation pattern of the integral antenna on the CC3220MODAx in the XZ plane.

Figure 1-17. CC3220MODAx X-Z Plane Radiated Pattern of the Integral Antenna

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Figure 1-18 shows the measured radiation pattern of the integral antenna on the CC3220MODAx in the YZ plane.

Figure 1-18. CC3220MODAx Y-Z Plane Radiated Pattern of the Integral Antenna
Figure 1-19 shows the measured radiation pattern of the integral antenna on the CC3220MODAx in the XY plane.

Figure 1-19. CC3220MODAx X-Y Plane Radiated Pattern of the Integral Antenna

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1.7

Circuit Design

1.7.1 Reference Schematic
Figure 1-20 shows the typical application schematic using the CC3220MODx module.
The CC3220MODx and CC3220MODAx modules share the same reference schematic. The difference between the two references is the antenna
and its matching circuitry. Pin 31 is not accessible to the designer in the CC3220MODAx module because it contains an integral antenna. The full
LAUNCHCC3220MODAx reference schematic is available at CC3220MODx SimpleLink™ Wi-Fi® and Internet of Things Hardware Design Files.
Optional:
Consider adding extra decoupling
capacitors if the battery cannot source
the peak cu rrents.

VCC

VCC

C3
0.1µF
C6
100µF

C7
100µF

GND
C4
0.1µF

U7

1
2
16
27
28
30
32
38
43
55
56
57
58
59
60
61
62
63

VBAT1
VBAT2

VBAT_RESET
RESET

GND

37

GND

40

GND

36
35

JTAG_TDIJTAG_TDO
JTAG_TCKJTAG_TMS

12
18
21
22

RF_BG

31

SEE TABLE 4-1 FOR
VBAT_RESET and nRESETCONNECTION OPTIONSJTAG_TDIJTAG_TDO
JTAG_TCKJTAG_TMS

Matching circuit shown below is forthe antenna. The module is matched
E1
internally to 50 Ω. Final solution
may require antenna matching
optimization with a pi-network
JTAG /DEBUG

2

GPIO_0
GPIO_01
GPIO_02
GPIO_03
GPIO_04
GPIO_05
GPIO_06
GPIO_07
GPIO_08
GPIO_09
GPIO_10
GPIO_11
GPIO_12
GPIO_13
GPIO_14
GPIO_15
GPIO_16
GPIO_17
GPIO_22
GPIO_28
GPIO_30

1

At a minimum, pull thes pins out
to test points to aid in debug:
Pin 48: CC_
WL_RS232_TX
Pin 49: CC_WL_RS232_RX
Pin 50: CC_WL_UART_TX
Pin 52: CC_NPW_UART_TX

44
46
47
48
49
50
51
52
53
54
3
4
9
10
5
6
7
8
11
19
42

P50_GPIO_00
P55_GPIO_01
P57_GPIO_02
P58_GPIO_03
P59_GPIO_04
P60_GPIO_05
P61_GPIO_06
P62_GPIO_07
P63_GPIO_08
P64_GPIO_09
P01_GPIO_10
P02_GPIO_11
P03_GPIO_12
P04_GPIO_13
P05_GPIO_14
P06_GPIO_15
P07_GPIO_16
P08_GPIO_17
P15_GPIO_22
P18_GPIO_28
P53_GPIO_30

L1
3.3nH

ANT_SEL1
ANT_SEL2
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND

SOP0
SOP1
SOP2

C2
1pF

GND GND

VCC
2526

P29_GPIO_26
P30_GPIO_27

R1
270
SOP[2:0] USED FOR
FACTORY RESTORE 1

34
24
23

GND

2
4
6

3
5

J1
FLASH_SPI_CLK
FLASH_SPI_CS_IN
FLASH_SPI_MOSIFLASH_SPI_MISO
NC
NC
NC
NC
NC
NC

15
14
17
13

SFL_CLKSFL_nCS
SFL_MOSISFL_MISO

EXTERNAL
PROGRAMMING

20
29
33
39
41
45

CC3220MODSF12MOBR

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GND

Figure 1-20. CC3220MODx Typical Application Schematic

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1.7.2 Bill of Materials
The CC3220MODx and CC3220MODAx modules share the same reference BOM. The difference
between the two references is the antenna and its matching circuitry. Pin 31 is not accessible to thedesigner in the CC3220MODAx module because it contains an integral antenna.
Table 1-13 lists the bill of materials for the CC3220MODx main engine area. The full
LAUNCHCC3220MODAx reference BOM is available at CC3220MODx SimpleLink™ Wi-Fi® and Internetof Things Hardware Design Files.
Table 1-13. Bill of Materials
QTY

PART
REFERENCE

VALUE

MANUFACTURERPART NUMBER

DESCRIPTION

1

C2 (1)

1 pF

Murata

GRM1555C1H1R0BA01D

Capacitor, ceramic, 1 pF,
50 V, ±10%, C0G/NP0, 0402

3

C3, C4, C5

0.1 µF

Murata

GRM155R61A104KA01D

Capacitor, ceramic, 0.1 μF,
10 V, ±10%, X5R, 0402

2

C6, C7100 µF

Murata

LMK325ABJ107MMHT

Capacitor, ceramic, 100 μF,
10 V, ±20%, X5R,
AEC-Q200 Grade 3, 1210

1

E1 (1)

2.45-GHz Ant

Taiyo Yuden

AH316M245001-T

Antenna Bluetooth WLAN
ZigBee® WIMAX1

L1 (1)

3.3 nH

Murata

LQG15HS3N3S02D

Inductor, multilayer,
air core, 3.3 nH,
0.3 A, 0.17 Ω, SMD

1

R1

270

Vishay-Dale

CRCW0402270RJNEDRES, 270, 5%,0.063 W, 0402

CC3220MODSF12MOBR

SimpleLink Wi-Fi and Internetof-Things Module Solution, aSingle-Chip Wireless MCU,
MOB0063A (SIP MODULE-63)

1
(1)

26

U1

CC3220MODSF

Texas Instruments

For CC3220MODAx: C2, L1, and E1 are not present.

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1.8

Layout Guidelines
The integrator of the CC3220MODx and CC3220MODAx modules must comply with the PCB layout
recommendations described in the following subsections to preserve and minimize the risk with regulatory
certifications for FCC, IC, CE, MIC, and SRRC. Also, TI recommends that customers follow the guidelines
described in this section to achieve similar performance.

1.8.1 CC3220MODx Board Layout
The reference layout consists of a four-layer design. Figure 1-21 shows the CC3220MODx top layer.

Figure 1-21. CC3220MODx Top Layer

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Figure 1-22 shows the CC3220MODx first inner layer.

Figure 1-22. CC3220MODx First Inner Layer

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Figure 1-23 shows the CC3220MODx second inner layer.

Figure 1-23. CC3220MODx Second Inner Layer

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Figure 1-24 shows the CC3220MODx bottom layer.

Figure 1-24. CC3220MODx Bottom Layer

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1.8.2 CC3220MODAx Board Layout
The reference layout consists of a four-layer design. Figure 1-25 shows the LAUNCHCC3220MODASF
top layer.

Figure 1-25. LAUNCHCC3220MODASF Top Layer

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Figure 1-26 shows the LAUNCHCC3220MODASF first inner layer.

Figure 1-26. LAUNCHCC3220MODASF First Inner Layer

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Figure 1-27 shows the LAUNCHCC3220MODASF second inner layer.

Figure 1-27. LAUNCHCC3220MODASF Second Inner Layer

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Figure 1-28 shows the LAUNCHCC3220MODASF bottom layer.

Figure 1-28. LAUNCHCC3220MODASF Bottom Layer

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1.8.3 General Layout Recommendations
Ensure that the following general layout recommendations are followed:• Have a solid ground plane and ground vias under the module for stable system and thermal
dissipation.
• Do not run signal traces underneath the module on a layer where the module is mounted.

1.8.4 RF Layout Recommendations (CC3220MODx)
The RF section of this wireless module gets top priority in terms of layout. It is very important for the RF
section to be laid out correctly to ensure optimum performance from the module. A poor layout can cause
low-output power, EVM degradation, sensitivity degradation, and mask violations.
Figure 1-29 shows the RF placement and routing of the CC3220MODx module.

Copyright © 2017, Texas Instruments Incorporated

Figure 1-29. RF Section Layout
Use the following RF layout recommendations for the CC3220MODx module:• RF traces must have 50-Ω impedance.
• RF trace bends must be made with gradual curves, and 90 degree bends must be avoided.
• RF traces must not have sharp corners.
• There must be no traces or ground under the antenna section.
• RF traces must have via stitching on the ground plane beside the RF trace on both sides.
• RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edgeof the PCB product in consideration of the product enclosure material and proximity.

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For optimal RF performance, ensure the copper cut out on the top layer under the RF-BG pin (pin 31) is
as shown in Figure 1-30.

Copyright © 2017, Texas Instruments Incorporated

Figure 1-30. Top Layer Copper Pullback on RF Pads

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1.8.5 Antenna Placement and Routing (CC3220MODx)
The antenna is the element used to convert the guided waves on the PCB traces to the free spaceelectromagnetic radiation. The placement and layout of the antenna are the keys to increased range anddata rates. Table 1-14 provides a summary of the recommended antennas to use with the CC3220MODx
module.
Table 1-14. Antenna Guidelines
SR NO.

GUIDELINES

1

Place the antenna on an edge or corner of the PCB.

2

Ensure that no signals are routed across the antenna elements on all the layers of the
PCB.

3

Most antennas, including the chip antenna used on the LaunchPad, require groundclearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers
as well.

4

Ensure that there is provision to place matching components for the antenna. These mustbe tuned for best return loss when the complete board is assembled. Any plastics or
casing must also be mounted while tuning the antenna because this can impact the
impedance.

5

Ensure that the antenna impedance is 50 Ω because the module is rated to work onlywith a 50-Ω system.

6

In case of printed antenna, ensure that the simulation is performed with the solder mask
in consideration.

7

Ensure that the antenna has a near omnidirectional pattern.

8

The feed point of the antenna is required to be grounded. This is only for the antenna
type used on the CC3220MODx LaunchPad. See the specific antenna data sheets for therecommendations.

1.8.6 Transmission Line Considerations (CC3220MODx)
The RF signal from the module is routed to the antenna using a Coplanar Waveguide with ground (CPWG) structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to
the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides
additional shielding. Figure 1-31 shows a cross section of the coplanar waveguide with the criticaldimensions.

Figure 1-31. Coplanar Waveguide (Cross Section)

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Figure 1-32 shows the top view of the coplanar waveguide with GND and via stitching.

S
W

Figure 1-32. CPW With GND and Via Stitching (Top View)
The recommended values for the PCB are provided for 2-layer boards in Table 1-15 and 4-layer boards inTable 1-16.
Table 1-15. Recommended PCB Values for 2-Layer
Board (L1 to L2 = 42.1 mils)
PARAMETER

VALUE

UNIT

W

24.5

mils

S

6.5

mils

H

42.1

mils

Er (FR-4 substrate)

4.8

Table 1-16. Recommended PCB Values for 4-Layer
Board (L1 to L2 = 16 mils)
PARAMETER

38

VALUE

UNITS

W

21

mils

S

10

mils

H

16

mils

Er (FR-4 substrate)

4.5

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1.8.7 RF Layout Recommendations (CC3220MODAx)
Figure 1-33 shows the guidelines to lay out the CC3220MODAx module.
• The module must have an overhang of 1 mm from the PCB edge.
• The module must have a 6-mm clearance on all layers (no copper) to the left and right of the module
placement.
• There must be at least one ground-reference plane under the module on the main PCB.
6 mm

6 mm
1 mm

6 mm

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Figure 1-33. CC3220MODAx Layout Guidelines

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Operational Setup and Testing (LAUNCHCC3220MODASF)

1.9

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Operational Setup and Testing (LAUNCHCC3220MODASF)
A compatible BoosterPack can be stacked on top of the LaunchPad using the two, 20-pin connectors. The
connectors do not have a key to prevent the misalignment of the pins or reverse connection. Ensure that
the VCC and 5-V pins are aligned with the BoosterPack header pins. On the CC3220MODASx
LaunchPad, a small white symbol is provided near pin 1 (see Figure 1-34) to orient all BoosterPacks.

Figure 1-34. Pin 1 Marking on LaunchPad (3V3 Mark)1.9.1 PowerThe LaunchPad is designed so that it can be powered by the USB connection or by two external AA or
AAA batteries.

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1.9.1.1

USB Power

The LaunchPad is designed to work from the USB provided power supply. The LaunchPad enumerates asa bus-powered device on the computer. When the board is powered from the USB connector, ensure thatthe jumpers are placed on the following headers, shown in Figure 1-35.

(1)Yellow blocks show jumper placements.

Figure 1-35. Powering From USB

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1.9.1.2

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Battery Power (Two 1.5 V)

The LaunchPad can also be powered from an external battery pack by feeding the voltage on the J21
header. This input features reverse voltage protection to ensure that the board is not damaged due to an
accidental reverse voltage. Use the following precautions while using the board with a battery.
• Remove the USB cable.
• Plug in the battery pack on J20 with correct polarity (see Figure 1-36).

2 x AA

Figure 1-36. Battery Power42

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1.9.1.3

Battery Powering the CC3220MODASF and Serial FlashIn some cases, there may be a requirement to power only the CC3220MODASF module and the SerialFlash from the battery. The use may not require LEDs or OPAMP for the ADC and the sensors. In such a
condition, the other sections can be powered off by removing the appropriate jumpers. Figure 1-37 shows
how the board would look with the correct jumpers on.

2 x AA

Figure 1-37. Battery Powering the CC3220MODASF and Serial Flash

1.9.2 Measuring the CC3220MODAx Current Draw
To measure the current draw of the CC3220 device when powering with a USB cable, use the VBAT
jumper on the jumper isolation block (J18). The current measured in this mode includes only theCC3220MODASx device and the Serial Flash current and no external blocks. However, if a GPIO of theCC3220MODASx is driving a high current load like the LED, then that is also included in thismeasurement.

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1.9.2.1

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Low-Current Measurement with USB Power (< 1 mA)

See the following instructions to measure ultra-lower power when powering with a USB cable (seeFigure 1-38).
1. Remove the 3V3 jumper (J18) and attach an ammeter across this jumper.
2. Ensure that the CC3220MODASx device is not driving any high current loads directly, like an LED,
because that can cause large current drawn.
3. Begin target execution and set the device to low-power modes (LPDS or hibernate).
4. Measure the current. Remember that if the current levels are fluctuating, it may be difficult to get astable measurement. It is easier to measure quiescent states.

mA

Figure 1-38. Low Current Measurement

1.9.2.2

Low-Current Measurement with Battery Power (< 1 mA)

See the following instructions to measure ultra-lower power when powering with batteries.
1. Remove the jumpers, as shown in Figure 1-37.
2. Connect an ammeter in series with your external power supply.
3. Ensure that the CC3220MODASx device is not driving any high current loads directly, like an LED,
because that can cause large current drawn.
4. Begin target execution and set the device to low-power modes (LPDS or hibernate).
5. Measure the current. Remember that if the current levels are fluctuating, it may be difficult to get astable measurement. It is easier to measure quiescent states.
Figure 1-39 shows the current measurement with battery power.

2 x AAmA

Figure 1-39. Current Measurement with Battery Power44

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1.9.2.3

Active Current Measurements

mA

0.1 R

See the following instructions to measure active power (see Figure 1-40).
1. Remove the VBAT jumper (J18).
2. Solder a 0.1-Ω resistor on a wire which can be connected to a voltmeter/oscilloscope, as shown in
Figure 1-40. Or, attach a jumper across J18 so that it can be used with a current probe.
3. Measure the voltage across the resistor using an oscilloscope with a differential probe. For the current
probe, coil the wire around the sensor several times for good sensitivity.
• An ammeter can also be used for this measurement, but the results may be erroneous due to theswitching nature of the current.

Figure 1-40. Active Current Measurement

1.9.3 Clocking
All of the required clocks are inside the module. There is no need to supply any external clock.

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Chapter 2
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Manual Information to the End User
The OEM integrator must be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual must include all required regulatory information and warnings as shown in this manual.

2.1

RF Function and Frequency Range
The CC3220MODSM2MOB, CC3220MODSF12MOB, CC3220MODASM2MON, andCC3220MODASF12MON devices are designed to operate in the WLAN 2.4-GHz band. The
CC3220MODSM2MOB, CC3220MODSF12MOB, CC3220MODASM2MON, and CC3220MODASF12MON
devices support the following channels dependent on the region of operation:• FCC and IC: Channels 1 through 11 (2142 MHz to 2462 MHz)• EU: Channels 1 through 13 (2142 MHz to 2472 MHz)• JP: Channels 1 through 13 (2142 MHz to 2472 MHz)
Note that the CC3220MODx and CC3220MODAx devices do not support determination of its region
through any external mechanism. The region is set by the application SW, or at the time of programmingof the device. The end user is unable to change the region of operation at any time.
NOTE: The maximum RF power transmitted in each WLAN 2.4-GHz band is 18 dBm.

2.2

FCC and IC Certification and Statement
This device is intended for OEM integrators under the following conditions:• The antenna must be installed so 20 cm of space is maintained between the antenna and the users.
• The transmitter module may not be colocated with any other transmitter of antenna.
• To comply with FCC and IC regulations limiting maximum RF output power and human exposure to RF
radiation, the maximum antenna gain including cable loss in a mobile exposure condition must notexceed:– +2.5 dBi in WLAN 2.4 G.
In the event that these conditions cannot be met (for example, certain laptop configurations or colocation
with another transmitter), then the FCC and IC authorization is no longer considered valid and the FCC
and IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and
IC authorization.

2.2.1 FCCThe TI CC3220MODx and CC3220MODAx modules are certified for FCC as a single-modular transmitter.
The module is an FCC-certified radio module that carries a modular grant.
You are cautioned that changes or modifications not expressly approved by the party responsible forcompliance could void the user’s authority to operate the equipment. This device complies with Part 15 of
the FCC Rules.
Operation is subject to the following two conditions:• This device may not cause harmful interference.
• This device must accept any interference received, including interference that may cause undesired
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operation of the device.
CAUTIONFCC RF Radiation Exposure Statement:This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated
with a minimum distance of 20 cm between the radiator and your body.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmfulinterference in a residential installation. this equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particularinstallation. If this equipment does cause harmful interference to radio or television reception, which canbe determined by turning the equipment off and on, the user is encouraged to try to correct theinterference by one or more of the following measures:• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from the one the receiver is connected to.
• Consult the dealer or an experienced radio or TV technician for help.
The antennas listed in Section 2.4 of this document were verified in the compliance testing. Use only theantennas listed in Section 2.4. A separate approval is required for all other operating configurations,
including different antenna configurations.

2.2.2 CAN ICES-3(B) and NMB-3(B) Certification and Statement
The TI CC3220MODx and CC3220MODAx modules are certified for IC as a single-modular transmitter.
The TI CC3220MODx and CC3220MODAx modules meet IC modular approval and labeling requirements.
The IC follows the same testing and rules as the FCC regarding certified modules in authorized
equipment.
This device complies with Industry Canada license-exempt RSS standards.
Operation is subject to the following two conditions:• This device may not cause interference.
• This device must accept any interference, including interference that may cause undesired operation of
the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts delicence.
L'exploitation est autorisée aux deus conditions suivantes:• L'appareil ne doit pas produire de brouillage.
• L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage ests
susceptible d'en compromettre lu fonctionnement.

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FCC and IC Certification and Statement

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CAUTIONIC RF Radiation Exposure Statement:This equipment complies with IC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated
with a minimum distance of 20 cm between the radiator and your body.
Déclaration d'exposition aux radiations:Cut équipement est conforme aux limites d'exposition aux rayonnements ICétablies pour un environnement non contrôlé. Cet équipement doit être installéet utilisé avec un minimum de 20 cm de distance entre la source derayonnement et votre corps.

This radio transmitter (451I-CC3120MOD) has been approved by Industry Canada to operated with theantenna types listed in Section 2.4 of this document with the maximum permissible gain indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for thattype, are strictly prohibited for use with this device.
The antennas listed in Section 2.4 of this document were verified in the compliance testing. Use only theantennas listed in Section 2.4. A separate approval is required for all other operating configurations,
including different antenna configurations.

2.2.3 End Product LabelingThis module is designed to comply with the FCC statement, FCC ID: Z64-CC3220MOD. The host systemusing this module must display a visible label indicating the following text:• Contains FCC ID: Z64-CC3220MOD
This module is designed to comply with the IC statement, IC: 451I-CC3220MOD. The host system using
this module must display a visible label indicating the following text:• Contains IC: 451I-CC3220MOD
This module is designed to comply with JP statement 201-170386. The host system using this module
must display a visible label indicating the following text:• Contains transmitter module with certificate module 201-170386

2.2.4 Device Classifications
Because host devices vary widely with design features and configurations, module integrators shallreference the following guidelines regarding device classification and simultaneous transmission, and seek
guidance from their preferred regulatory test lab to determine how regulatory guidelines will impact thedevice compliance. Proactive management of the regulatory process will minimize unexpected schedule
delays and costs due to unplanned testing activities.
The module integrator must determine the minimum distance required between their host device and the
body of the user. The FCC provides device classification definitions to assist in making the correct
determination. Note that these classifications are guidelines only; strict adherence to a deviceclassification may not satisfy the regulatory requirement as near-body device design details may vary
widely. The user-preferred test lab will be able to assist in determining the appropriate device category forthe host product and if a KDB or PBA must be submitted to the FCC.
Note, the module that the user is using has been granted modular approval for mobile applications.
Portable applications may require further RF exposure (SAR) evaluations. It is also likely that the host andmodule combination will need to undergo testing for FCC Part 15, regardless of the device classification.
The preferred test lab of the user will be able to assist in determining the exact tests which are required on
the host and module combination.

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2.2.5 FCC Definitions
Portable: (§2.1093)— A portable device is defined as a transmitting device designed to be used so thatthe radiating structures of the device is or are within 20 centimeters of the body of the user.
Mobile: (§2.1091) (b)— A mobile device is defined as a transmitting device designed to be used in otherthan fixed locations and to generally be used in such a way that a separation distance of at least 20
centimeters is normally maintained between the transmitter’s radiating structures and the body ofthe user or nearby persons. Per §2.1091d(d)(4) In some cases (for example, modular or desktop
transmitters), the potential conditions of use of a device may not allow easy classification of thatdevice as either Mobile or Portable. In these cases, applicants are responsible for determining
minimum distances for compliance for the intended use and installation of the device based on
evaluation of either specific absorption rate (SAR), field strength, or power density, whichever ismost appropriate.

2.2.6 Simultaneous Transmission Evaluation
This module has not been evaluated or approved for simultaneous transmission as it is impossible todetermine the exact multi-transmission scenario that a host manufacturer may choose. Any simultaneoustransmission condition established through module integration into a host product must be evaluated per
the requirements in KDB447498D01(8) and KDB616217D01,D03 (for laptop, notebook, netbook, andtablet applications).
These requirements include, but are not limited to:• Transmitters and modules certified for mobile or portable exposure conditions can be incorporated in
mobile host devices without further testing or certification when:– The closest separation among all simultaneous transmitting antennas is > 20 cm
or– Antenna separation distance and MPE compliance requirements for ALL simultaneous transmitting
antennas have been specified in the application filing of at least one of the certified transmitterswithin the host device. In addition, when transmitters certified for portable use are incorporated in a
mobile host device, the antennas must be > 5 cm from all other simultaneous transmitting antennas• All antennas in the final product must be at least 20 cm from users and nearby persons.

2.3

EU Certification and Statement

2.3.1 RF Exposure Information (MPE)This device has been tested and meets applicable limits for Radio Frequency (RF) exposure. To comply
with the RF exposure requirements, this module must be installed in a host platform that is intended to be
operated in a minimum of 20-cm separation distance to the user.

2.3.2 Simplified DoC Statement
2.3.2.1

CC3220MODx and CC3220MODAx Modules

Hereby, Texas Instruments declares that the radio equipment type CC3220MODSM2MOB,
CC3220MODSF12MOB, CC3220MODASM2MON, and CC3220MODASF12MON are in compliance with
Directive 2014/53/EU.
The full text of the EU declarations of conformity are available at:• CC3220MODSM2MOB EC Declaration of Conformity (DoC)• CC3220MODSF12MOB EC Declaration of Conformity (DoC)• CC3220MODASM2MON EC Declaration of Conformity (DoC)• CC3220MODASF12MON EC Declaration of Conformity (DoC)SWRU512 – August 2017
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EU Certification and Statement

2.3.2.2

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LAUNCHCC3220MODASF

Hereby, Texas Instruments declares that the radio equipment type LAUNCHCC3220MODASF is incompliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity are available at LAUNCHCC3220MODASF EC
Declaration of Conformity (DoC).

2.3.3 Waste Electrical and Electronic Equipment (WEEE)
Waste Electrical and Electronic Equipment (WEEE)This symbol means that according to local laws and regulations yourproduct and/or battery shall be disposed of separately from household
waste. When this product reaches its end of life, take it to a collection point
designated by local authorities. Proper recycling of your product will protect
human health and the environment.

2.3.4 OEM and Host Manufacturer Responsibilities
OEM and host manufacturers are ultimately responsible for the compliance of the host and module. The
final product must be reassessed against all of the essential requirements of the RED before it can beplaced on the EU market. This includes reassessing the transmitter module for compliance with the radioand EMF essential requirements of the RED. This module must not be incorporated into any other device
or system without retesting for compliance as multi-radio and combined equipment.

2.3.5 Antenna Specifications
In all cases, assessment of the final product must be met against the Essential requirements of RE
Directive Article 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3
requirements.
1. The antennas listed in Section 2.4 were verified in the conformity testing, and for compliance theantenna shall not be modified. A separate approval is required for all other operating configurations,
including different antenna configurations.
2. If any other simultaneous transmission radio is installed in the host platform together with this module,
or above restrictions cannot be kept, a separate RF exposure assessment and CE equipment
certification is required.

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2.4

CC3220MODx Approved Antennas
Table 2-1 lists the antennas approved for use with the CC3220MOD module.
Table 2-1. CC3220MODx Approved Antennas
Antenna Information
Brand

Antenna Type

Model

2.4-GHz Gain

1

FoxConPCB

T77H533

2.5 dBi

2

Ethertronics

Dipole1000423–0.6 dBi

001-0012

2.0 dBi

080-0013

2.0 dBi

080-0014

2.0 dBi

001-0016

2.5 dBi

001-0021

2.5 dBiCAF94504

2.0 dBiCAF94505

2.0 dBi

AT3216-BR2R7HAA

0.5 dBi

3
4

Rubber Whip / Dipole

5

LSR

6

PIFA

7
8

Laird

9
10
11
12
13
14
15

PCB

ACX

Multilayer Chip

TDK

Multilayer Ceramic Chip
Antenna

Mitsubishi Material

16
17

Taiyo Yuden

AT312-T2R4PAA

1.5 dBi

ANT016008LCD2442MA1

1.6 dBi

ANT016008LCD2442MA22.5 dBi

Chip Antenna

AM03DP-ST01

1.6 dBi

Antenna UnitUB18CP-100ST01–1.0 dBi

Chip Antenna / Herical
Monopole

AF216M245001

1.5 dBi

AH212M245001

1.3 dBiAH316M245001

1.9 dBi

AA2402SPU

2.0 dBi

Chip Antenna / Monopole
Type

18
19
20

AA2402RSPU

2.0 dBi

AA2402A-UFLLP

2.0 dBi

22

AA2402AU-UFLLP

2.0 dBi

23

1019-016

2.14 dBi

24

1019-017

2.14 dBi

1019-018

2.14 dBi

1019-019

2.14 dBi

27

MEIWX-2411SAXX-2400

2.0 dBi

28

MEIWX-2411RSXX-2400

2.0 dBiMEIWX-282XSAXX-2400

2.0 dBi

30

MEIWX-282XRSXX-2400

2.0 dBi

31

MEIWF-HP01RS2X-2400

2.0 dBi

ANT3216A063R2400A

1.69 dBi

LTA-3216-2G4S3-A1

1.0 dBi

21

Antenna Technology

Staf

25

DipoleMonopole

26

29

Map Electronics

32
33
34

Rubber Whip

Yageo

Chip

May Layers Scientific

Chip

Advantech

Rubber Whip / Dipole

35

LTA-3216-2G4S3-A3

2.0 dBi

AN2450-5706RS

2.38 dBi

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CC3220MODx Approved Antennas

2.5

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Trademarks
SimpleLink, Texas Instruments, LaunchPad, Internet-on-a chip, BoosterPack, Code Composer Studio,
SmartConfig are trademarks of Texas Instruments.
IAR Embedded Workbench is a registered trademark of Texas Instruments.
ARM is a registered trademark of ARM Limited.
Cortex is a registered trademark of ARM.
Wi-Fi CERTIFIED is a trademark of Wi-Fi Alliance.
Wi-Fi, Wi-Fi Direct are registered trademarks of Wi-Fi Alliance.
ZigBee is a registered trademark of ZigBee Alliance.
All other trademarks are the property of their respective owners.

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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Date

Revision

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