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DesignADS1220
SBAS501C – MAY 2013 – REVISED AUGUST 2016

ADS1220 4-Channel, 2-kSPS, Low-Power, 24-Bit ADC with Integrated PGA and Reference
1 Features

3 Description•

The ADS1220 is a precision, 24-bit, analog-to-digitalconverter (ADC) that offers many integrated features
to reduce system cost and component count inapplications measuring small sensor signals. The
device features two differential or four single-ended
inputs through a flexible input multiplexer (MUX), a
low-noise, programmable gain amplifier (PGA), twoprogrammable excitation current sources, a voltage
reference, an oscillator, a low-side switch, and a
precision temperature sensor.

1

•
•
•
•
•
•
•
•
•
•
•
•

Low Current Consumption:
As Low as 120 μA (typ) in Duty-Cycle Mode
Wide Supply Range: 2.3 V to 5.5 V
Programmable Gain: 1 V/V to 128 V/V
Programmable Data Rates: Up to 2 kSPS
Up to 20-Bits Effective Resolution
Simultaneous 50-Hz and 60-Hz Rejection at
20 SPS with Single-Cycle Settling Digital Filter
Two Differential or Four Single-Ended Inputs
Dual Matched Programmable Current Sources:
10 μA to 1.5 mAInternal 2.048-V Reference: 5 ppm/°C (typ) Drift
Internal 2% Accurate Oscillator
Internal Temperature Sensor:
0.5°C (typ) Accuracy
SPI-Compatible Interface (Mode 1)
Package: 3.5-mm × 3.5-mm × 0.9-mm VQFN

The device can perform conversions at data rates up
to 2000 samples-per-second (SPS) with single-cycle
settling. At 20 SPS, the digital filter offers
simultaneous 50-Hz and 60-Hz rejection for noisy
industrial applications. The internal PGA offers gains
up to 128 V/V. This PGA makes the ADS1220 ideallysuited for applications measuring small sensor
signals, such as resistance temperature detectors(RTDs), thermocouples, thermistors, and resistive
bridge sensors. The device supports measurementsof pseudo- or fully-differential signals when using the
PGA. Alternatively, the device can be configured to
bypass the internal PGA while still providing highinput impedance and gains up to 4 V/V, allowing forsingle-ended measurements.

2 Applications
•

•

•
•

Temperature Sensor Measurements:– Thermistors– Thermocouples– Resistance Temperature Detectors (RTDs):2-, 3-, or 4-Wire Types
Resistive Bridge Sensor Measurements:– Pressure Sensors– Strain Gauges– Weigh Scales
Portable Instrumentation
Factory Automation and Process Control

Power consumption is as low as 120 µA when
operating in duty-cycle mode with the PGA disabled.
The ADS1220 is offered in a leadless VQFN-16 or a
TSSOP-16 package and is specified over atemperature range of –40°C to +125°C.
Device Information(1)PART NUMBER
ADS1220

PACKAGEBODY SIZE (NOM)

VQFN (16)3.50 mm × 3.50 mm

TSSOP (16)5.00 mm × 4.40 mm(1) For all available packages, see the orderable addendum atthe end of the data sheet.

K-Type Thermocouple Measurement
3.3 V

3.3 V
0.1 PF

3.3 V

0.1 PF
REFP0

10 A to1.5 mA

AIN0

REFN0

AVDD
Internal
Reference

DVDD
Reference
MUX

TI Device

PGA

24-Bitû ADC

Digital Filter
and
SPI
Interface

Precision
Temperature
Sensor

Low-Drift
Oscillator

AIN1
AINP
Thermocouple

MUX

Isothermal
Block

AIN2

AIN3

AINN

AVSS

CLK

CS
SCLK
DIN
DOUT/DRDY
DRDY

DGND

Copyright © 2016, Texas Instruments Incorporated

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

ADS1220
SBAS501C – MAY 2013 – REVISED AUGUST 2016

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Table of Contents
1
2
3
4
5
6

Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions ......................... 4
Specifications......................................................... 5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8

Absolute Maximum Ratings ...................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 6
Thermal Information .................................................. 6
Electrical Characteristics........................................... 7
SPI Timing Requirements ......................................... 9
SPI Switching Characteristics ................................... 9
Typical Characteristics ............................................ 10

7

Parameter Measurement Information ................ 16

8

Detailed Description ............................................ 19

7.1 Noise Performance ................................................. 16
8.1
8.2
8.3
8.4

Overview ................................................................. 19
Functional Block Diagram ....................................... 19
Feature Description................................................. 20
Device Functional Modes........................................ 32

8.5 Programming........................................................... 34
8.6 Register Map........................................................... 39

9Application and Implementation ........................ 44
9.1 Application Information............................................ 44
9.2 Typical Applications ................................................ 49

10 Power Supply Recommendations ..................... 60
10.1 Power-Supply Sequencing.................................... 60
10.2 Power-Supply Ramp Rate .................................... 60
10.3 Power-Supply Decoupling..................................... 60

11 Layout................................................................... 61
11.1 Layout Guidelines ................................................. 61
11.2 Layout Example .................................................... 62

12 Device and Documentation Support ................. 63
12.1
12.2
12.3
12.4
12.5
12.6

Documentation Support ........................................ 63
Receiving Notification of Documentation Updates 63
Community Resources.......................................... 63
Trademarks ........................................................... 63
Electrostatic Discharge Caution ............................ 63
Glossary ................................................................ 63

13 Mechanical, Packaging, and Orderable
Information ........................................................... 63

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (February 2015) to Revision C

Page

•

Changed K-Type Thermocouple Measurement figure ........................................................................................................... 1•

Added footnote 1 to Pin Functions table and changed descriptions of AIN0/REFP1, AIN1, AIN2, AIN3/REFN1,
REFN0, and REFP0 pins accordingly .................................................................................................................................... 4•

Changed Functional Block Diagram figure ........................................................................................................................... 19•

Changed Bypassing the PGA section .................................................................................................................................. 24•

Added fourth sentence to Temperature Sensor section....................................................................................................... 31•

Changed last equation in Converting from Digital Codes to Temperature section .............................................................. 31•

Changed description of bits 5:4 in Configuration Register 2 ................................................................................................ 42•

Added Unused Inputs and Outputs section ......................................................................................................................... 47•

Changed Figure 74............................................................................................................................................................... 49•

Changed Figure 77............................................................................................................................................................... 52•

Changed Figure 78............................................................................................................................................................... 55•

Changed Figure 79............................................................................................................................................................... 56•

Changed Figure 82............................................................................................................................................................... 58•

Changed Power Supply Recommendations section: changed Power-Supply Sequencing subsection, added PowerSupply Ramp Rate subsection ............................................................................................................................................. 60

2

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SBAS501C – MAY 2013 – REVISED AUGUST 2016

Changes from Revision A (July 2013) to Revision B

Page

•

Added TI Design, Device Information, ESD Ratings, Recommended Operating Conditions, and Switching
Characteristics tables and Application and Implementation, Power Supply Recommendations, Layout, Device andDocumentation Support, and Mechanical, Packaging, and Orderable Information sections ................................................. 1•

Changed document title, QFN to VQFN throughout document, Features, Applications, Description, Pin Configuration
and Functions, Parameter Measurement Information, Feature Description, Device Functional Modes, Programming,and Register Map sections, and front-page figure ................................................................................................................. 1•

Deleted Product Family table ................................................................................................................................................ 4•

Changed format of Absolute Maximum Ratings table, added minimum junction temperature specification, changed
input current parameter name, and removed momentary input current specification ............................................................ 5•

Changed Analog Inputs and Voltage Reference Inputs sections (specification values were not changed) and addedInternal Oscillator section to Electrical Characteristics table.................................................................................................. 7•

Changed System Performance section: changed VIO parameter name and added PGA disabled row to Offset drift,
Gain error, and Gain drift parameters in System Performance section of Electrical Characteristics table............................ 7•

Changed Internal Voltage Reference section: changed Reference drift parameter maximum specification and added
Long-term drift parameter in Electrical Characteristics table.................................................................................................. 7•

Deleted Clock Sources section and changed Temperature Sensor and Power Supply sections (specification values
were not changed) in Electrical Characteristics table............................................................................................................. 8•

Changed Digital Inputs/Outputs section, VIL parameter minimum specification in Electrical Characteristics table ............... 8•

Changed SPI Timing Requirements and Figure 1 (specification values were not changed), added SPI Switching
Characteristics and Figure 2 .................................................................................................................................................. 9•

Changed format of Typical Characteristics section (actual curves did not change) ............................................................ 10

Changes from Original (May 2013) to Revision A•

Page

Changed document status to Mixed Status; pre-RTM changes made throughout ................................................................ 1

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5 Pin Configuration and Functions
RVA Package
16-Pin VQFNTop View

CLK
DGND

SCLK

DIN

DOUT/DRDY

16

15

14

13

1

DOUT/DRDYCS

PW Package
16-Pin TSSOPTop View

SCLK

1

16

DIN

CS

2

15

DOUT/DRDY

CLK

3

14

DRDY

11 DVDD

DGND

4

13

DVDD

AVSS

5

12

AVDD

AIN3/REFN1

6

11

AIN0/REFP1

AIN2

7

10

AIN1

REFN0

8

9

REFP0

12 DRDY

2
Thermal Pad

4

9
5

6

7

8
AIN1

AIN3/REFN1

REFP0

10 AVDD

REFN0

3

AIN2

AVSS

AIN0/REFP1

Pin Functions
PIN
NO.
RVA

PW

ANALOG OR DIGITALINPUT/OUTPUT

AIN0/REFP1

9

11

Analog input

Analog input 0, positive reference input 1

AIN1

8

10

Analog input

Analog input 1

AIN2

5

7

Analog input

Analog input 2

AIN3/REFN1

4

6

Analog input

Analog input 3, negative reference input 1.
Internal low-side power switch connected between AIN3/REFN1 and AVSS.

AVDD

10

12

AnalogPositive analog power supply

AVSS

3

5

AnalogNegative analog power supply

CLK

1

3

Digital input

External clock source pin. Connect to DGND if not used.

CS

16

2

Digital input

Chip select; active low. Connect to DGND if not used.

DGND

2

4

DigitalDigital ground

DIN

14

16

Digital input

Serial data input

DOUT/DRDY

13

15

Digital output

Serial data output combined with data ready; active low

DRDY

12

14

Digital output

Data ready, active low.
Leave unconnected or tie to DVDD using a weak pull-up resistor if not used.

DVDD

11

13

DigitalPositive digital power supply

REFN0

6

8

Analog input

Negative reference input 0

REFP0

7

9

Analog input

Positive reference input 0

SCLK

15

1

Digital input

Serial clock input

—

—

NAME

Thermal pad(1)

4

DESCRIPTION (1)Thermal power pad. Do not connect or only connect to AVSS.

See the Unused Inputs and Outputs section for unused pin connections.

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6 Specifications
6.1 Absolute Maximum Ratings (1)Power-supply voltage

MIN

MAX

UNIT

AVDD to AVSS

–0.3

7

V

DVDD to DGND

–0.3

7

V

AVSS to DGND

–2.8

0.3

V
V

Analog input voltage

AIN0/REFP1, AIN1, AIN2, AIN3/REFN1, REFP0, REFN0

AVSS – 0.3

AVDD + 0.3

Digital input voltage

CS, SCLK, DIN, DOUT/DRDY, DRDY, CLK

DGND – 0.3

DVDD + 0.3

VInput current

Continuous, any pin except power supply pins

–10

10

mA

Junction, TJ

–40

150

°C

Storage, Tstg

–60

150

°C

Temperature(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings
VALUE
V(ESD)(1)(2)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)

±500

UNIT
V

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN

NOM

MAX

UNIT

POWER SUPPLY
Unipolar analog power supply

Bipolar analog power supply
Digital power supply

AVDD to AVSS

2.3

AVSS to DGND

–0.1

5.5
0

0.1

AVDD to DGND

2.3

2.5

2.75

AVSS to DGND

–2.75

–2.5

–2.3

DVDD to DGND

2.3

V

V

5.5

V

ANALOG INPUTS (1)VIN

Differential input voltage

V(AINx)Absolute input voltage

VCM

Common-mode input voltage

VIN = V(AINP) – V(AINN) (2)–Vref / Gain

Vref / GainV

PGA disabled, gain = 1 to 4

AVSS – 0.1

AVDD + 0.1

V

AVDD + 0.1

V

PGA enabled, gain = 1 to 128
PGA disabled, gain = 1 to 4

See the Low-Noise PGA section
AVSS – 0.1

PGA enabled, gain = 1 to 128

See the Low-Noise PGA section

VOLTAGE REFERENCE INPUTS (3)
Vref

Differential reference input voltage

AVDD

V

V(REFNx)

Absolute negative reference voltage

Vref = V(REFPx) – V(REFNx)

AVSS – 0.1

0.75

2.5

V(REFPx) – 0.75

V

V(REFPx)

Absolute positive reference voltage

V(REFNx) + 0.75

AVDD + 0.1

V

4.5

MHz

EXTERNAL CLOCK SOURCE
f(CLK)

External clock frequency

0.5

Duty cycle

40%

4.096

60%

DGND

DVDD

V

–40

125

°C

DIGITAL INPUTS
Input voltage
TEMPERATURE RANGE
TA

(1)
(2)
(3)

Operating ambient temperature

AINP and AINN denote the positive and negative inputs of the PGA. AINx denotes one of the four available analog inputs.
PGA disabled means the low-noise PGA is powered down and bypassed. Gains of 1, 2, and 4 are still possible in this case.
See the Bypassing the PGA section for more information.
Excluding the effects of offset and gain error.
Limited to ±[(AVDD – AVSS) – 0.4 V] / Gain, when the PGA is enabled.
REFPx and REFNx denote one of two available differential reference input pairs.

6.4 Thermal Information
ADS1220
THERMAL METRIC (1)VQFN (RVA)TSSOP (PW)

16 PINS

16 PINS

UNIT

RθJA

Junction-to-ambient thermal resistance

43.4

99.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

47.3

35.2

°C/W

RθJB

Junction-to-board thermal resistance

18.4

44.3

°C/W

ψJT

Junction-to-top characterization parameter

0.6

2.4

°C/W

ψJB

Junction-to-board characterization parameter

18.4

43.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.0

n/a

°C/W

(1)

6

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

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6.5 Electrical Characteristics
Minimum and maximum specifications apply from TA = –40°C to +125°C. Typical specifications are at TA = 25°C.
All specifications are at AVDD = 3.3 V, AVSS = 0 V, DVDD = 3.3 V, PGA enabled, DR = 20 SPS, and external Vref = 2.5 V(unless otherwise noted). (1)PARAMETERTEST CONDITIONS

MIN

TYP

MAX

UNIT

ANALOG INPUTS
Absolute input current

See the Typical Characteristics

Differential input current

See the Typical Characteristics

SYSTEM PERFORMANCE
Resolution (no missing codes)

24
Normal modeDR

Data rate

Duty-cycle mode

5, 11.25, 22.5, 44, 82.5, 150, 250

Turbo mode

40, 90, 180, 350, 660, 1200, 2000

Noise (input-referred)
INL

Integral nonlinearity

Input offset voltage–15

Gain = 1, differential inputs, TA = 25°C

Offset match
Gain error

Gain drift

NMRR

CMRR

PSRR

Normal-mode rejection ratio (2)Common-mode rejection ratio

Power-supply rejection ratio

±6

–30

±4

ppmFSR

30

µV

0.3

µV/°C

±4

PGA disabled, gain = 1 to 4

0.25

Gain = 1 to 128, TA = –40°C to +85°C (2)0.08

Gain = 1 to 128

0.25

Match between any two inputs±20

PGA disabled, gain = 1 to 4
Gain = 1 to 128, TA = 25°C

15±4Gain = 2 to 128, differential inputs

Offset drift

SPS

See the Noise Performance section
Gain = 1 to 128, VCM = 0.5 AVDD, best fit (2)PGA disabled, gain = 1 to 4, differential inputs

VIO

Bits

20, 45, 90, 175, 330, 600, 1000

µV

±0.015%–0.1%±0.015%

PGA disabled, gain = 1 to 4

1

Gain = 1 to 128 (2)

1

0.1%

4

50 Hz ±3%, DR = 20 SPS, external CLK,
50/60 bit = 1010560 Hz ±3%, DR = 20 SPS, external CLK,
50/60 bit = 11

105

50 Hz or 60 Hz ±3%, DR = 20 SPS,
external CLK, 50/60 bit = 0190

At dc, gain = 1

90

105

f(CM) = 50 Hz, DR = 2000 SPS (2)

95

115

f(CM) = 60 Hz, DR = 2000 SPS (2)

95

115

AVDD at dc, VCM = 0.5 AVDD, gain = 1

80

105

DVDD at dc, VCM = 0.5 AVDD, gain = 1 (2)

100

115

2.045

2.048

2.051

5

30

ppm/°CdB

dB

dB

INTERNAL VOLTAGE REFERENCE
Initial accuracy

TA = 25°C

Reference drift (2)Long-term drift

Vppm/°C

1000 hours

110

ppm

REFP0 = Vref, REFN0 = AVSS

±10

nA

VOLTAGE REFERENCE INPUTS
Reference input current
INTERNAL OSCILLATORInternal oscillator accuracy

(1)
(2)

Normal mode

–2%

±1%

2%

PGA disabled means the low-noise PGA is powered down and bypassed. Gains of 1, 2, and 4 are still possible in this case.
See the Bypassing the PGA section for more information.
Minimum and maximum values are ensured by design and characterization data.

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Electrical Characteristics (continued)
Minimum and maximum specifications apply from TA = –40°C to +125°C. Typical specifications are at TA = 25°C.
All specifications are at AVDD = 3.3 V, AVSS = 0 V, DVDD = 3.3 V, PGA enabled, DR = 20 SPS, and external Vref = 2.5 V(unless otherwise noted).(1)
PARAMETERTEST CONDITIONS

MIN

TYP

MAX

UNIT

EXCITATION CURRENT SOURCES (IDACs)
Current settings

10, 50, 100, 250, 500, 1000, 1500

µA

Compliance voltage

All current settings

AVDD – 0.9

Accuracy

All current settings, each IDAC

Current match

Between IDACs (not valid for 10-µA setting)Temperature drift

Each IDAC (not valid for 10-µA setting)50ppm/°C

Temperature drift matching

Between IDACs (not valid for 10-µA setting)

10ppm/°C

Conversion resolution

14

Bits

Temperature resolution

0.03125

–6%

±1%

V

6%

±0.3%

TEMPERATURE SENSOR

Accuracy

TA = 0°C to +75°C
TA = –40°C to +125°C

°C

–0.5

±0.25

0.5

–1

±0.5

1

0.0625

0.25

3.5

5.5

Ω

30

mA

0.7 DVDD

DVDD

V

DGND

0.3 DVDD

V

Accuracy vs analog supply voltage

°C
°C/V

LOW-SIDE POWER SWITCH
RON

On-resistance
Current through switch

DIGITAL INPUTS/OUTPUTS
VIH

High-level input voltage

VIL

Low-level input voltage

VOH

High-level output voltage

IOH = 3 mA

VOL

Low-level output voltage

IOL = 3 mA

IH

Input leakage, high

VIH = 5.5 V

IL

Input leakage, low

VIL = DGND

0.8 DVDDV
0.2 DVDD

V

–10

10

µA

–10

10

µA

POWER SUPPLY

IAVDD

IDVDD

PD

(3)

8

Analog supply current (3)Digital supply current (3)Power dissipation (3)Power-down mode

0.1

Duty-cycle mode, PGA disabled65

Duty-cycle mode, gain = 1 to 16

95

Duty-cycle mode, gain = 32

115

Duty-cycle mode, gain = 64, 128

135

Normal mode, PGA disabled240

Normal mode, gain = 1 to 16

340

Normal mode, gain = 32

425

Normal mode, gain = 64, 128

510

Turbo mode, PGA disabled

360

Turbo mode, gain = 1 to 16

540

Turbo mode, gain = 32

715

Turbo mode, gain = 64, 128

890

Power-down mode

0.3

Duty-cycle mode

55

Normal mode

75

Turbo mode95

Duty-cycle mode, PGA disabled

0.4

Normal mode, gain = 1 to 16

1.4

Turbo mode, gain = 1 to 16

2.1

3

490

µA

5

110

µA

mW

Internal voltage reference selected, internal oscillator enabled, IDACs turned off, and continuous conversion mode.
Analog supply current increases by 70 µA, typ (normal mode, turbo mode) when selecting an external reference.
Analog supply current increases by 190 µA (typ) when enabling the IDACs (excludes the actual IDAC current).

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6.6 SPI Timing Requirements
over operating ambient temperature range and DVDD = 2.3 V to 5.5 V (unless otherwise noted)
MIN

MAX

UNIT

td(CSSC)

Delay time, CS falling edge to first SCLK rising edge (1)50nstd(SCCS)

Delay time, final SCLK falling edge to CS rising edge

25

ns

tw(CSH)

Pulse duration, CS high50nstc(SC)SCLK period

150

ns

tw(SCH)

Pulse duration, SCLK high60

nstw(SCL)

Pulse duration, SCLK low

60

nstsu(DI)

Setup time, DIN valid before SCLK falling edge50

nsth(DI)

Hold time, DIN valid after SCLK falling edge

25

SPI timeout (2)

(1)
(2)

ns

Normal mode, duty-cycle mode

13955

t(MOD)

Turbo mode

27910

t(MOD)

CS can be tied low permanently in case the serial bus is not shared with any other device.
See the SPI Timeout section for more information.
t(MOD) = 1 / f(MOD). Modulator frequency f(MOD) = 256 kHz (normal mode, duty-cycle mode) and 512 kHz (turbo mode), when using theinternal oscillator or an external 4.096-MHz clock.
tw(CSH)

CS

ttd(CSSC)tttc(SC)ttw(SCH)ttd(SCCS)tSCLKtsu(DI)

th(DI)

tw(SCL)DIN

NOTE: Single-byte communication is shown. Actual communication may be multiple bytes.

Figure 1. Serial Interface Timing Requirements

6.7 SPI Switching Characteristics
over operating ambient temperature range, DVDD = 2.3 V to 5.5 V (unless otherwise noted)
PARAMETERTEST CONDITIONS

tp(CSDO)

Propagation delay time,
CS falling edge to DOUT driven

DOUT load = 20 pF || 10 kΩ to DGND

tp(SCDO)

Propagation delay time,
SCLK rising edge to valid new DOUT

DOUT load = 20 pF || 10 kΩ to DGND

tp(CSDOZ)

Propagation delay time,
CS rising edge to DOUT high impedance

DOUT load = 20 pF || 10 kΩ to DGND

MIN

0

TYP

MAX

UNIT

50

ns

50

ns

50

ns

CS

SCLK

tp(CSDO)

DOUT/DRDY

tp(SCDO)tp(CSDOZ)

Hi-Z

Hi-Z

NOTE: Single-byte communication is shown. Actual communication may be multiple bytes.

Figure 2. Serial Interface Switching Characteristics
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6.8 Typical Characteristics
At TA = 25°C, AVDD = 3.3 V, AVSS = 0 V, and PGA enabled using external Vref = 2.5 V (unless otherwise noted).
40

40

Gain = 1

Gain = 1

Gain = 128

Gain = 12830

PGA Disabled
Offset Voltage (µV)

Offset Voltage (µV)

30

20

10

0

PGA Disabled

20

10

0

±10

±10
±40

±20

0

20

40

60

80

100

120

Temperature (ƒC)

±40

±20

0

20

40

60

AVDD = 3.3 V

C018

Figure 4. Input-Referred Offset Voltage vs Temperature

500

500

Gain = 1

400

Gain = 1
Gain = 128

PGA Disabled

Gain Error (ppm of FS)

Gain Error (ppm of FS)

120

Figure 3. Input-Referred Offset Voltage vs Temperature

300

200

100

0

400

PGA Disabled

300

200

100

0
±40

±20

0

20

40

60

80

100

Temperature (ƒC)

120

±40

±20

0

15

Gain = 1
Gain = 32
PGA Disabled

80

100

120
C020

Gain = 1
Gain = 32
PGA Disabled

10

5
0
±5
±10
±15
±100

60

Figure 6. Gain Error vs Temperature

INL (ppm of FS)

1040

AVDD = 5.0 V

Figure 5. Gain Error vs Temperature
15

20

Temperature (ƒC)

C019

AVDD = 3.3 V

INL (ppm of FS)

100

AVDD = 5.0 V

Gain = 128

5
0
±5
±10

±75

±50

±25

0

25

50

75

VIN (% of FS)

100

±15
±100

±75

±50

±25

0

25

50

75

VIN (% of FS)

C025

AVDD = 3.3 V, external 2.5-V reference, normal mode

100
C029

AVDD = 5.0 V, external 2.5-V reference, normal mode

Figure 7. Integral Nonlinearity vsDifferential Input Signal

1080Temperature (ƒC)

C017

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Figure 8. Integral Nonlinearity vsDifferential Input Signal

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Typical Characteristics (continued)
At TA = 25°C, AVDD = 3.3 V, AVSS = 0 V, and PGA enabled using external Vref = 2.5 V (unless otherwise noted).
20

20

Gain = 1
Gain = 32
PGA Disabled

15

10
INL (ppm of FS)

10
INL (ppm of FS)

Gain = 1
Gain = 32
PGA Disabled

15

5
0
±5

5
0
±5

±10

±10

±15

±15

±20
±100

±75

±50

±25

0

25

50

75

±20
±100

100

VIN (% of FS)

±75

±50

±25

0

25

50

75

100

VIN (% of FS)

C043

AVDD = 3.3 V, internal reference, normal mode

C044

AVDD = 5.0 V, internal reference, normal mode

Figure 9. Integral Nonlinearity vsDifferential Input Signal

Figure 10. Integral Nonlinearity vsDifferential Input Signal
2.051

1000

AVDD = 3.3 V

Reference Voltage (V)Counts

AVDD = 5.0 V

2.050

800

600

400

200

2.049
2.048
2.047

2.051

2.050

2.049

2.048

2.047

2.046

2.045

2.046
0

Initial Reference Voltage (V)

2.045
±40

±20

0

20

40

60

80

100

Temperature (ƒC)

C042

120
C021

TA = 25°C, data from 5490 devices
Figure 12. Internal Reference Voltage vs Temperature

Figure 11. Internal Reference Voltage Histogram
1.00

0

0.75

±20

0.50

±40

0.25

±60

PSRR (dB)Frequency Error (%)

Gain = 1

0.00
±0.25

±80
±100

±0.50

±120

±0.75

±140

±1.00

Gain = 128

±160
±40

±20

0

20

40

60

Temperature (ƒC)

80

100

120

0.1

1

10

100

Frequency (kHz)

C002

1000
C016

DVDD = 3.3 V, normal mode
Figure 13. Internal Oscillator Accuracy vs Temperature

Figure 14. AVDD Power-Supply Rejection Ratio vsFrequency

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Typical Characteristics (continued)
At TA = 25°C, AVDD = 3.3 V, AVSS = 0 V, and PGA enabled using external Vref = 2.5 V (unless otherwise noted).
15

AIN0
AIN1
AIN2
AIN3

10

Absolute Input Current (nA)

Absolute Input Current (nA)

15

5
0
±5
±10
±15

AIN0
AIN1
AIN2
AIN3

10
5
0
±5
±10
±15

0.5

1.0

1.5

2.0

2.5

3.0

Absolute Input Voltage V(AINx) (V)

0.5

1.0

AVDD = 3.3 V, PGA enabled, TA = –40°C

2.5

3.0
C031

Figure 16. Absolute Input Current vsAbsolute Input Voltage
100

AIN0
AIN1
AIN2
AIN3

10
0

Absolute Input Current (nA)

Absolute Input Current (nA)

20

±10
±20
±30
±40

AIN0
AIN1
AIN2
AIN3

50
0
±50
±100
±150
±200

±50

±250
0.5

1.0

1.5

2.0

2.5

3.0

Absolute Input Voltage V(AINx) (V)

0.5

40
Differential Input Current (nA)

±20

±40

±1.5

±1.0

±0.5

0.0

0.5

1.0

2.5

3.0
C033

Figure 18. Absolute Input Current vsAbsolute Input Voltage

0

±60
±2.0

2.0

AVDD = 3.3 V, PGA enabled, TA = 125°C

Ta = ±40ƒC
Ta = 25°C
Ta = 85°C
Ta = 125°C

20

1.5

Absolute Input Voltage V(AINx) (V)

Figure 17. Absolute Input Current vsAbsolute Input Voltage
40

1.0

C032

AVDD = 3.3 V, PGA enabled, TA = 85°C

Differential Input Current (nA)

2.0

AVDD = 3.3 V, PGA enabled, TA = 25°C

Figure 15. Absolute Input Current vsAbsolute Input Voltage

1.5

2.0

Differential Input Voltage VIN (V)Ta = ±40ƒC
Ta = 25°C
Ta = 85°C
Ta = 125°C

20

0

±20

±40

±60
±2.0

±1.5

±1.0

±0.5

0.0

0.5

1.0

1.5

2.0

Differential Input Voltage VIN (V)

C038

AVDD = 3.3 V, PGA enabled, AINP = AIN0, AINN = AIN1

C039

AVDD = 3.3 V, PGA enabled, AINP = AIN3, AINN = AIN2

Figure 19. Differential Input Current vsDifferential Input Voltage

12

1.5

Absolute Input Voltage V(AINx) (V)C030

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Figure 20. Differential Input Current vsDifferential Input Voltage

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Typical Characteristics (continued)
At TA = 25°C, AVDD = 3.3 V, AVSS = 0 V, and PGA enabled using external Vref = 2.5 V (unless otherwise noted).
15

AIN0
AIN1
AIN2
AIN3

10

Absolute Input Current (nA)

Absolute Input Current (nA)

15

5
0
±5
±10
±15

AIN0
AIN1
AIN2
AIN3

10
5
0
±5
±10
±15

0.5

1.0

1.5

2.0

2.5

3.0

Absolute Input Voltage V(AINx) (V)

0.5

1.0

AVDD = 3.3 V, PGA disabled, TA = –40°C

20

2.5

3.0
C035

Figure 22. Absolute Input Current vsAbsolute Input Voltage
100

AIN0
AIN1
AIN2
AIN3

10
0

Absolute Input Current (nA)

Absolute Input Current (nA)

2.0

AVDD = 3.3 V, PGA disabled, TA = 25°C

Figure 21. Absolute Input Current vsAbsolute Input Voltage

±10
±20
±30
±40

AIN0
AIN1
AIN2
AIN3

50
0
±50
±100
±150
±200

±50

±250
0.5

1.0

1.5

2.0

2.5

3.0

Absolute Input Voltage V(AINx) (V)

0.5

40
Differential Input Current (nA)

±20

±40

±1.5

±1.0

±0.5

0.0

0.5

1.0

2.5

3.0
C037

Figure 24. Absolute Input Current vsAbsolute Input Voltage

0

±60
±2.0

2.0

AVDD = 3.3 V, PGA disabled, TA = 125°C

Ta = ±40ƒC
Ta = 25°C
Ta = 85°C
Ta = 125°C

20

1.5

Absolute Input Voltage V(AINx) (V)

Figure 23. Absolute Input Current vsAbsolute Input Voltage
40

1.0

C036

AVDD = 3.3 V, PGA disabled, TA = 85°C

Differential Input Current (nA)

1.5

Absolute Input Voltage V(AINx) (V)

C034

1.5

2.0

Differential Input Voltage VIN (V)

20

0

±20

±40

±60
±2.0

±1.5

±1.0

±0.5

0.0

0.5

1.0

1.5

2.0

Differential Input Voltage VIN (V)

C040

AVDD = 3.3 V, PGA disabled, AINP = AIN0, AINN = AIN1

Ta = ±40ƒC
Ta = 25°C
Ta = 85°C
Ta = 125°C

C041

AVDD = 3.3 V, PGA disabled, AINP = AIN3, AINN = AIN2

Figure 25. Differential Input Current vsDifferential Input Voltage

Figure 26. Differential Input Current vsDifferential Input Voltage

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Typical Characteristics (continued)
At TA = 25°C, AVDD = 3.3 V, AVSS = 0 V, and PGA enabled using external Vref = 2.5 V (unless otherwise noted).
6

6

IDAC = 1000 µA
IDAC = 500 µA

4Absolute IDAC Error (%)

4
IDAC Error (%)

IDAC = 100 µA
2
0
±2

2
0
±2
±4

±4

±6

±6
0.5

0.6

0.7

0.8

0.9

±40

1.0

Compliance Voltage (V)IDAC = 500 µA

0.50

IDAC = 100 µA

40

60

80

100

120
C005

Figure 28. IDAC Accuracy vs Temperature

IDAC = 1000 µA

0.75

20

600
500
400

0.25

IAVDD (µA)

IDAC Matching Error (%)

0

Temperature (ƒC)

Figure 27. IDAC Accuracy vs Compliance Voltage
1.00

±20

C006

0.00
±0.25

300
200
Gain = 64, 128

±0.50

100

±0.75
±1.00

Gain = 1 to 16
PGA Disabled

0
±40

±20

0

20

40

60

80

100

120

Temperature (ƒC)

±40

±20

0

20

40

60

80

100

120

Temperature (ƒC)

C007

C011

AVDD = 3.3 V, internal reference, normal mode
Figure 29. IDAC Matching vs Temperature

Figure 30. IAVDD vs Temperature
150

1000

125

800

IAVDD (µA)

IAVDD (µA)

100
600

400

75
50

Gain = 64, 128
200

PGA Disabled

0
±40

±20

0

20

40

60

80

100

Temperature (ƒC)

Gain = 64, 128
25

Gain = 1 to 16

Gain = 1 to 16
PGA Disabled

0

120

±40

AVDD = 3.3 V, internal reference, turbo mode

0

20

40

60

80

100

120
C013

AVDD = 3.3 V, internal reference, duty-cycle mode

Figure 31. IAVDD vs Temperature

14

±20

Temperature (ƒC)

C012

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Figure 32. IAVDD vs Temperature

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Typical Characteristics (continued)
600

120

500

100

400

80
IDVDD (µA)

IAVDD (µA)

At TA = 25°C, AVDD = 3.3 V, AVSS = 0 V, and PGA enabled using external Vref = 2.5 V (unless otherwise noted).

300
200

60
40

Gain = 64, 128
100

Turbo Mode
20

Gain = 1 to 16

Normal ModePGA Disabled

0

Duty-Cycle Mode

0
2.5

3.0

3.5

4.0

4.5

5.0

5.5

AVDD (V)

2.5

3.0

3.5

4.0

4.5

5.0

DVDD (V)

C004

5.5
C010

Normal mode, internal reference
Figure 33. IAVDD vs AVDD

Figure 34. IDVDD vs DVDD

120

1.00

Temperature Error (ƒC)

100

IDVDD (µA)

80
60
40
Turbo Mode
20

Normal Mode

±40

±20

0

20

40

60

80

Mean

0.50

Mean - 61

0.25
0.00
±0.25
±0.50
±0.75

Duty-Cycle Mode0

Mean + 61

0.75

100

±1.00

120

Temperature (ƒC)

±40

±20

0

20

40

60

80

100

Temperature (ƒC)

C014

120
C015

DVDD = 3.3 V
Figure 35. IDVDD vs Temperature

Figure 36. Internal Temperature Sensor Accuracy vsTemperature

6
5

RON (

4
3
2
AVDD = 2.3 V
1

AVDD = 3.3 V
AVDD = 5.0 V

0
±40

±20

0

20

40

60

Temperature (ƒC)

80

100

120
C001

Figure 37. Low-Side Power Switch RON vs Temperature

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7 Parameter Measurement Information
7.1 Noise Performance
Delta-sigma (ΔΣ) analog-to-digital converters (ADCs) are based on the principle of oversampling. The input
signal of a ΔΣ ADC is sampled at a high frequency (modulator frequency) and subsequently filtered anddecimated in the digital domain to yield a conversion result at the respective output data rate. The ratio between
modulator frequency and output data rate is called oversampling ratio (OSR). By increasing the OSR, and thus
reducing the output data rate, the noise performance of the ADC can be optimized. In other words, the inputreferred noise drops when reducing the output data rate because more samples of the internal modulator are
averaged to yield one conversion result. Increasing the gain also reduces the input-referred noise, which isparticularly useful when measuring low-level signals.
Table 1 to Table 8 summarize the device noise performance. Data are representative of typical noise
performance at TA = 25°C using the internal 2.048-V reference. Data shown are the result of averaging readings
from a single device over a time period of approximately 0.75 seconds and are measured with the inputs
internally shorted together. Table 1, Table 3, Table 5 and Table 7 list the input-referred noise in units of μVRMS forthe conditions shown. Note that µVPP values are shown in parenthesis. Table 2, Table 4, Table 6 and Table 8 list
the corresponding data in effective number of bits (ENOB) calculated from μVRMS values using Equation 1. Notethat noise-free bits calculated from peak-to-peak noise values using Equation 2 are shown in parenthesis.
The input-referred noise (Table 1, Table 3, Table 5 and Table 7) only changes marginally when using an external
low-noise reference, such as the REF5020. To calculate ENOB numbers and noise-free bits when using areference voltage other than 2.048 V, use Equation 1 to Equation 3:
ENOB = ln (Full-Scale Range / VRMS-Noise) / ln(2)Noise-Free Bits = ln (Full-Scale Range / VPP-Noise) / ln(2)Full-Scale Range = 2 · Vref / Gain

(1)
(2)
(3)

Table 1. Noise in μVRMS (μVPP)
at AVDD = 3.3 V, AVSS = 0 V, Normal Mode, and Internal Reference = 2.048 V
DATA
RATE
(SPS)

GAIN (PGA Enabled)
1

2

4

8

16

32

64

128

20

3.71 (13.67)

1.54 (5.37)

1.15 (4.15)

0.80 (3.36)

0.35 (1.16)

0.23 (0.73)

0.10 (0.35)

0.09 (0.41)

45

7.36 (29.54)

2.93 (13.06)

1.71 (9.28)

0.88 (4.06)

0.50 (2.26)

0.29 (1.49)

0.19 (0.82)

0.12 (0.51)

90

10.55 (47.36)

4.50 (20.75)

2.43 (11.35)

1.51 (6.65)

0.65 (3.62)

0.42 (2.14)

0.27 (1.22)

0.18 (0.85)

175

11.90 (63.72)

6.45 (34.06)

3.26 (17.76)

1.82 (11.20)

1.01 (5.13)

0.57 (3.09)

0.34 (2.14)

0.26 (1.60)

330

19.19 (106.93)

9.38 (50.78)

4.25 (26.25)

2.68 (14.13)

1.45 (7.52)

0.79 (4.66)

0.50 (2.69)

0.34 (1.99)

600

24.78 (151.61)

13.35 (72.27)

6.68 (39.43)

3.66 (19.26)

2.10 (12.77)

1.14 (6.87)

0.70 (4.76)

0.55 (3.34)

1000

37.53 (227.29)

18.87 (122.68)

9.53 (58.53)

5.37 (31.52)

2.95 (18.08)

1.65 (10.71)

1.03 (6.52)

0.70 (4.01)

Table 2. ENOB from RMS Noise (Noise-Free Bits from Peak-to-Peak Noise)at AVDD = 3.3 V, AVSS = 0 V, Normal Mode, and Internal Reference = 2.048 V

16

DATA
RATE
(SPS)

GAIN (PGA Enabled)
1

2

4

8

16

32

64

128

20

20.08 (18.19)

20.34 (18.54)

19.76 (17.91)

19.28 (17.22)

19.48 (17.75)

19.10 (17.42)

19.33 (17.49)

18.49 (16.26)

45

19.09 (17.08)

19.42 (17.26)

19.19 (16.75)

19.15 (16.94)

18.95 (16.79)

18.74 (16.39)

18.38 (16.25)

18.00 (15.49)

90

18.57 (16.40)

18.80 (16.59)

18.68 (16.46)

18.37 (16.23)

18.60 (16.11)

18.20 (15.87)

17.87 (15.67)

17.44 (15.20)

175

18.39 (15.97)

18.28 (15.88)

18.26 (15.82)

18.10 (15.48)

17.96 (15.61)

17.78 (15.34)

17.53 (14.87)

16.91 (14.29)

330

17.70 (15.23)

17.74 (15.30)

17.88 (15.25)

17.54 (15.15)

17.43 (15.05)

17.30 (14.74)

16.96 (14.54)

16.50 (13.97)

600

17.33 (14.72)

17.23 (14.79)

17.23 (14.66)

17.09 (14.70)

16.89 (14.29)

16.77 (14.18)

16.48 (13.72)

15.83 (13.23)

1000

16.74 (14.14)

16.73 (14.03)

16.71 (14.09)

16.54 (13.99)

16.41 (13.79)

16.25 (13.54)

15.92 (13.26)

15.49 (12.96)

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Table 3. Noise in μVRMS (μVPP) with PGA Disabledat AVDD = 3.3 V, AVSS = 0 V, Normal Mode, and Internal Reference = 2.048 V
GAIN (PGA Disabled)

DATA RATE
(SPS)

1

2

4

20

3.89 (13.43)

1.85 (6.84)

1.26 (3.91)

45

6.97 (31.98)

2.94 (12.94)

1.41 (5.62)

90

8.50 (42.48)

4.49 (18.92)

2.07 (9.95)

175

12.99 (65.92)

6.24 (35.40)

3.04 (18.92)

330

18.18 (94.24)

8.12 (50.17)

4.71 (28.75)

600

25.29 (138.67)

12.77 (78.13)

6.27 (39.79)

1000

38.04 (260.50)

18.40 (120.97)

9.48 (63.72)

Table 4. ENOB from RMS Noise (Noise-Free Bits from Peak-to-Peak Noise) with PGA Disabledat AVDD = 3.3 V, AVSS = 0 V, Normal Mode, and Internal Reference = 2.048 V
GAIN (PGA Disabled)

DATA RATE
(SPS)

1

2

4

20

20.01 (18.22)

20.08 (18.19)

19.63 (18.00)

45

19.61 (16.97)

19.41 (17.27)

19.47 (17.48)

90

18.88 (16.56)

18.80 (16.72)

18.91 (16.65)

175

18.27 (15.92)

18.32 (15.82)

18.36 (15.72)

330

17.78 (15.41)

17.94 (15.32)

17.73 (15.12)600

17.31 (14.85)

17.29 (14.68)

17.32 (14.65)

1000

16.72 (13.94)

16.76 (14.05)

16.72 (13.97)

Table 5. Noise in μVRMS (μVPP)
at AVDD = 3.3 V, AVSS = 0 V, Turbo Mode, and Internal Reference = 2.048 V
DATA
RATE
(SPS)

GAIN (PGA Enabled)
1

2

4

8

16

32

64

128

40

4.56 (24.17)

2.40 (11.35)

1.22 (4.94)

0.71 (2.84)

0.35 (1.60)

0.19 (0.85)

0.16 (0.71)

0.09 (0.55)

90

5.74 (25.88)

2.97 (14.40)

1.47 (5.80)

1.13 (5.52)

0.50 (2.67)

0.32 (1.32)

0.23 (1.13)

0.15 (0.69)

180

8.49 (46.88)

4.66 (21.36)

2.30 (12.88)

1.24 (7.23)

0.72 (4.82)

0.42 (2.57)

0.28 (1.47)

0.24 (1.34)

350

13.42 (84.72)

5.86 (40.04)

3.39 (19.04)

1.88 (10.13)

1.05 (6.15)

0.64 (3.59)

0.43 (2.29)

0.28 (1.39)

660

17.09 (120.36)

9.34 (47.36)

4.81 (27.83)

2.97 (17.36)

1.54 (10.21)

0.82 (4.43)

0.58 (3.67)

0.41 (2.93)

1200

25.71 (162.35)

12.31 (85.94)

6.81 (44.01)

3.72 (21.55)

2.09 (15.14)

1.23 (7.58)

0.80 (5.31)

0.57 (3.51)

2000

36.23 (265.14)

18.24 (127.32)

9.24 (65.43)

5.49 (37.02)

2.89 (18.89)

1.77 (12.00)

1.13 (7.60)

0.82 (5.81)

Table 6. ENOB from RMS Noise (Noise-Free Bits from Peak-to-Peak Noise)at AVDD = 3.3 V, AVSS = 0 V, Turbo Mode, and Internal Reference = 2.048 V
DATA
RATE
(SPS)

GAIN (PGA Enabled)
1

2

4

8

16

32

64

128

40

19.78 (17.37)

19.71 (17.46)

19.68 (17.66)

19.45 (17.46)

19.47 (17.29)

19.37 (17.21)

18.65 (16.46)

18.40 (15.83)

90

19.45 (17.27)

19.39 (17.12)

19.41 (17.43)

18.79 (16.50)

18.97 (16.55)

18.62 (16.57)

18.11 (15.80)

17.75 (15.49)

180

18.88 (16.42)

18.75 (16.55)

18.76 (16.28)

18.65 (16.11)

18.43 (15.70)

18.23 (15.60)

17.79 (15.41)

17.05 (14.54)

350

18.22 (15.56)

18.42 (15.64)

18.21 (15.71)

18.05 (15.62)

17.89 (15.35)

17.62 (15.12)

17.20 (14.77)

16.78 (14.49)

660

17.87 (15.05)

17.74 (15.40)

17.70 (15.17)

17.39 (14.85)

17.34 (14.61)

17.25 (14.82)

16.75 (14.09)

16.25 (13.42)

1200

17.28 (14.62)

17.34 (14.54)

17.20 (14.51)

17.07 (14.54)

16.90 (14.05)

16.67 (14.04)

16.28 (13.56)

15.77 (13.15)

2000

16.79 (13.92)

16.78 (13.97)

16.76 (13.93)

16.51 (13.76)

16.44 (13.73)

16.14 (13.38)

15.79 (13.04)

15.25 (12.43)

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Table 7. Noise in μVRMS (μVPP) with PGA Disabledat AVDD = 3.3 V, AVSS = 0 V, Turbo Mode, and Internal Reference = 2.048 V
GAIN (PGA Disabled)

DATA RATE
(SPS)

1

2

4

40

4.22 (22.46)

2.30 (10.74)

0.93 (3.91)

90

6.57 (31.01)

3.53 (14.28)

1.59 (6.84)

180

8.41 (55.66)

4.30 (22.09)

2.31 (14.59)

350

12.68 (75.20)

6.02 (34.18)

3.22 (17.64)

660

17.81 (111.08)

9.06 (56.76)

4.24 (27.47)

1200

25.43 (176.03)

12.70 (89.23)

6.28 (40.95)

2000

36.11 (250.98)

17.30 (131.35)

8.77 (68.18)

Table 8. ENOB from RMS Noise (Noise-Free Bits from Peak-to-Peak Noise) with PGA Disabledat AVDD = 3.3 V, AVSS = 0 V, Turbo Mode, and Internal Reference = 2.048 V

18

GAIN (PGA Disabled)

DATA RATE
(SPS)

1

2

4

40

19.89 (17.48)

19.76 (17.54)

20.07 (18.00)

90

19.25 (17.01)

19.15 (17.13)

19.29 (17.19)

180

18.89 (16.17)

18.86 (16.50)

18.76 (16.10)

350

18.30 (15.73)

18.38 (15.87)

18.28 (15.83)

660

17.81 (15.17)

17.79 (15.14)

17.88 (15.19)

1200

17.30 (14.51)

17.30 (14.49)

17.31 (14.61)

2000

16.79 (13.99)

16.85 (13.93)

16.83 (13.87)

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8 Detailed Description
8.1 Overview
The ADS1220 is a small, low-power, 24-bit, ΔΣ ADC that offers many integrated features to reduce system costand component count in applications measuring small sensor signals.
In addition to the ΔΣ ADC core and single-cycle settling digital filter, the device offers a low-noise, high input
impedance, programmable gain amplifier (PGA), an internal voltage reference, and a clock oscillator. The device
also integrates a highly linear and accurate temperature sensor as well as two matched programmable current
sources (IDACs) for sensor excitation. All of these features are intended to reduce the required external circuitry
in typical sensor applications and improve overall system performance. An additional low-side power switch
eases the design of low-power bridge sensor applications. The device is fully configured through four registers
and controlled by six commands through a mode 1 SPI-compatible interface. The Functional Block Diagram
section shows the device functional block diagram.
The ADS1220 ADC measures a differential signal, VIN, which is the difference in voltage between nodes AINP
and AINN. The converter core consists of a differential, switched-capacitor, ΔΣ modulator followed by a digital
filter. The digital filter receives a high-speed bitstream from the modulator and outputs a code proportional to the
input voltage. This architecture results in a very strong attenuation of any common-mode signal.
The device has two available conversion modes: single-shot and continuous conversion mode. In single-shotmode, the ADC performs one conversion of the input signal upon request and stores the value in an internal data
buffer. The device then enters a low-power state to save power. Single-shot mode is intended to provide
significant power savings in systems that require only periodic conversions, or when there are long idle periods
between conversions. In continuous conversion mode, the ADC automatically begins a conversion of the input
signal as soon as the previous conversion is completed. New data are available at the programmed data rate.
Data can be read at any time without concern of data corruption and always reflect the most recently completed
conversion.

8.2 Functional Block Diagram
REFP0

AVDD

REFN0

DVDD

10 A to1.5 mA
Internal
Reference

AIN0/REFP1

AIN1

TI Device

24-Bitû ADC

Digital Filter
and
SPI
Interface

CS

AINP
MUX

AIN2

Reference
MUX

PGA
AINN

AIN3/REFN1

SCLK
DIN
DOUT/DRDY
DRDY

Precision
Temperature
SensorAVSS

Low-Drift
Oscillator

CLK

DGND

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8.3 Feature Description
8.3.1 Multiplexer
The device contains a very flexible input multiplexer, as shown in Figure 38. Either four single-ended signals, twodifferential signals, or a combination of two single-ended signals and one differential signal can be measured.
The multiplexer is configured by four bits (MUX[3:0]) in the configuration register. When single-ended signals aremeasured, the negative ADC input (AINN) is internally connected to AVSS by a switch within the multiplexer. For
system-monitoring purposes, the analog supply (AVDD – AVSS) / 4 or the currently-selected external reference
voltage (V(REFPx) – V(REFNx)) / 4 can be selected as inputs to the ADC. The multiplexer also offers the possibility toroute any of the two programmable current sources to any analog input (AINx) or to any dedicated reference pin(REFP0, REFN0).
System Monitors(V(REFPx) ± V(REFNx)) / 4(AVDD ± AVSS) / 4
AVDD

AVDD

IDAC1

AVDD

AVSS

AVDD

AVSS

IDAC2

(AVDD + AVSS) / 2

AIN0/REFP1
AVDD
AIN1

Burnout Current Source (10 µA)
AVDD

AVSS

AVDD

AVSS

AIN2
AINP
PGA

To ADCAINN

AIN3/REFN1
AVDD

AVSS

Burnout Current Source (10 µA)

REFP0
AVDD

AVSS
AVSS

AVSS

REFN0

Figure 38. Analog Input Multiplexer
Electrostatic discharge (ESD) diodes to AVDD and AVSS protect the inputs. To prevent the ESD diodes fromturning on, the absolute voltage on any input must stay within the range provided by Equation 4:
AVSS – 0.3 V < V(AINx) < AVDD + 0.3 V(4)

If the voltages on the input pins have any potential to violate these conditions, external Schottky clamp diodes orseries resistors may be required to limit the input current to safe values (see the Absolute Maximum Ratings
table). Overdriving an unused input on the device may affect conversions taking place on other input pins. If any
overdrive on unused inputs is possible, TI recommends clamping the signal with external Schottky diodes.
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Feature Description (continued)
8.3.2 Low-Noise PGA
The device features a low-noise, low-drift, high input impedance, programmable gain amplifier (PGA). The PGA
can be set to gains of 1, 2, 4, 8, 16, 32, 64, or 128. Three bits (GAIN[2:0]) in the configuration register are used
to configure the gain. A simplified diagram of the PGA is shown in Figure 39. The PGA consists of two chopperstabilized amplifiers (A1 and A2) and a resistor feedback network that sets the PGA gain. The PGA input isequipped with an electromagnetic interference (EMI) filter.

200 O
AINP

+

25 pF

A1
RF
OUTP

VIN

RG

VOUT = Gain·VIN

RF
OUTN
A2

200 O
AINN

+

25 pF

Figure 39. Simplified PGA Diagram
VIN denotes the differential input voltage VIN = (V(AINP) – V(AINN)). The gain of the PGA can be calculated with
Equation 5:
Gain = 1 + 2 · RF / RG

(5)Gain is changed inside the device using a variable resistor, RG. The differential full-scale input voltage range(FSR) of the PGA is defined by the gain setting and the reference voltage used, as shown in Equation 6:
FSR = ±Vref / Gain

(6)

Table 9 shows the corresponding full-scale ranges when using the internal 2.048-V reference.
Table 9. PGA Full-Scale Range
GAIN SETTING

FSR

1±2.048 V

2±1.024 V

4±0.512 V

8±0.256 V

16±0.128 V

32±0.064 V

64±0.032 V

128±0.016 V

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8.3.2.1 PGA Common-Mode Voltage Requirements
To stay within the linear operating range of the PGA, the input signals must meet certain requirements that are
discussed in this section.
The outputs of both amplifiers (A1 and A2) in Figure 39 can not swing closer to the supplies (AVSS and AVDD)
than 200 mV. If the outputs OUTP and OUTN are driven to within 200 mV of the supply rails, the amplifiers
saturate and consequently become nonlinear. To prevent this nonlinear operating condition the output voltages
must meet Equation 7:
AVSS + 0.2 V ≤ V(OUTN), V(OUTP) ≤ AVDD – 0.2 V(7)Translating the requirements of Equation 7 into requirements referred to the PGA inputs (AINP and AINN) is
beneficial because there is no direct access to the outputs of the PGA. The PGA employs a symmetrical design,
therefore the common-mode voltage at the output of the PGA can be assumed to be the same as the commonmode voltage of the input signal, as shown in Figure 40.
AINP

+

A1
½ V INOUTP

RF½ Gain·V IN
VCM = ½ (V (AINP) + V(AINN))

RG½ Gain·V IN

RF

OUTN

½ V INA2
AINN+

Figure 40. PGA Common-Mode Voltage
The common-mode voltage is calculated using Equation 8:
VCM = ½ (V(AINP) + V(AINN)) = ½ (V(OUTP) + V(OUTN))(8)

The voltages at the PGA inputs (AINP and AINN) can be expressed as Equation 9 and Equation 10:
V(AINP) = VCM + ½ VIN
V(AINN) = VCM – ½ VIN

(9)
(10)

The output voltages (V(OUTP) and V(OUTN)) can then be calculated as Equation 11 and Equation 12:
V(OUTP) = VCM + ½ Gain · VINV(OUTN) = VCM – ½ Gain · VIN

(11)
(12)

The requirements for the output voltages of amplifiers A1 and A2 (Equation 7) can now be translated into
requirements for the input common-mode voltage range using Equation 11 and Equation 12, which are given in
Equation 13 and Equation 14:
VCM (MIN) ≥ AVSS + 0.2 V + ½ Gain · VIN (MAX)VCM (MAX) ≤ AVDD – 0.2 V – ½ Gain · VIN (MAX)

(13)
(14)

In order to calculate the minimum and maximum common-mode voltage limits, the maximum differential input
voltage (VIN (MAX)) that occurs in the application must be used. VIN (MAX) can be less than the maximum possible
FS value.
In addition to Equation 13, the minimum VCM must also meet Equation 15 because of the specific design
implementation of the PGA.
VCM (MIN) ≥ AVSS + ¼ (AVDD – AVSS)
22

(15)

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3.30

3.30

2.75

2.75

2.20

2.20

VCM Range (V)VCM Range (V)Figure 41 and Figure 42 show a graphical representation of the common-mode voltage limits for AVDD = 3.3 V
and AVSS = 0 V, with gain = 1 and gain = 16, respectively.

1.65
AVDD / 4
1.10
0.55

1.65
AVDD / 4
1.10
0.55

0.00
0.0

0.5

1.0

1.5

2.0

2.5

0.00
0.00

3.0

VIN (V)

0.03

0.06

0.09

0.12

0.15

VIN (V)

C009

AVDD = 3.3 V

0.18
C008

AVDD = 3.3 V

Figure 41. Common-Mode Voltage Limits (Gain = 1)

Figure 42. Common-Mode Voltage Limits (Gain = 16)

The following discussion explains how to apply Equation 13 through Equation 15 to a hypothetical application.
The setup for this example is AVDD = 3.3 V, AVSS = 0 V, and gain = 16, using an external reference,
Vref = 2.5 V. The maximum possible differential input voltage VIN = (V(AINP) – V(AINN)) that can be applied is thenlimited to the full-scale range of FSR = ±2.5 V / 16 = ±0.156 V. Consequently, Equation 13 through Equation 15
yield an allowed VCM range of 1.45 V ≤ VCM ≤ 1.85 V.
If the sensor signal connected to the inputs in this hypothetical application does not make use of the entire fullscale range but is limited to VIN (MAX) = ±0.1 V, for example, then this reduced input signal amplitude relaxes the
VCM restriction to 1.0 V ≤ VCM ≤ 2.3 V.
In the case of a fully-differential sensor signal, each input (AINP, AINN) can swing up to ±50 mV around thecommon-mode voltage (V(AINP) + V(AINN)) / 2, which must remain between the limits of 1.0 V and 2.3 V. The
output of a symmetrical wheatstone bridge is an example of a fully-differential signal. Figure 43 shows a situation
where the common-mode voltage of the input signal is at the lowest limit. V(OUTN) is exactly at 0.2 V in this case.
Any further decrease in common-mode voltage (VCM) or increase in differential input voltage (VIN) drives V(OUTN)
below 0.2 V and saturates amplifier A2.
V(AINP) = 1.05 V

+

A1
50 mV

RF

V(OUTP) = 1.8 V
800 mV

VCM = 1.0 V

RF/7.5RF

800 mV
V(OUTN) = 0.2 V

50 mV
A2
V(AINN) = 0.95 V+

Figure 43. Example where VCM is at Lowest Limit

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In contrast, the signal of an RTD is of a pseudo-differential nature (if implemented as shown in the RTD
Measurement section), where the negative input is held at a constant voltage other than 0 V and only the voltage
on the positive input changes. When a pseudo-differential signal must be measured, the negative input in thisexample must be biased at a voltage between 0.95 V and 2.25 V. The positive input can then swing up to
VIN (MAX) = 100 mV above the negative input. Note that in this case the common-mode voltage changes at thesame time the voltage on the positive input changes. That is, while the input signal swings between 0 V ≤ VIN ≤
VIN (MAX), the common-mode voltage swings between V(AINN) ≤ VCM ≤ V(AINN) + ½ VIN (MAX). Satisfying thecommon-mode voltage requirements for the maximum input voltage VIN (MAX) ensures the requirements are met
throughout the entire signal range.
Figure 44 and Figure 45 show examples of both fully-differential and pseudo-differential signals, respectively.

AINP
AINP

VCM
VCM

1.0 V

100 mV

1.0 V

100 mV
AINN

AINN
0V

0V

Figure 44. Fully-Differential Input Signal

Figure 45. Pseudo-Differential Input Signal

NOTE
Remember, common-mode voltage requirements with PGA enabled (Equation 13 toEquation 15) are as follows:• VCM (MIN) ≥ AVSS + ¼ (AVDD – AVSS)• VCM (MIN) ≥ AVSS + 0.2 V + ½ Gain · VIN (MAX)• VCM (MAX) ≤ AVDD – 0.2 V – ½ Gain · VIN (MAX)8.3.2.2 Bypassing the PGA
At gains of 1, 2, and 4, the device can be configured to disable and bypass the low-noise PGA by setting the
PGA_BYPASS bit in the configuration register. Disabling the PGA lowers the overall power consumption andalso removes the restrictions of Equation 13 through Equation 15 for the common-mode input voltage range,
VCM. The usable absolute and common-mode input voltage range is (AVSS – 0.1 V ≤ V(AINx), VCM ≤ AVDD +0.1 V) when the PGA is disabled.
In order to measure single-ended signals that are referenced to AVSS (AINP = VIN, AINN = AVSS), the PGA must
be bypassed. Configure the device for single-ended measurements by either connecting one of the analog inputs
to AVSS externally or by using the internal AVSS connection of the multiplexer (MUX[3:0] settings 1000 through1011). When configuring the internal multiplexer for settings where AINN = AVSS (MUX[3:0] = 1000 through1011) the PGA is automatically bypassed and disabled irrespective of the PGA_BYPASS setting and gain islimited to 1, 2, and 4. In case gain is set to greater than 4, the device limits gain to 4.
When the PGA is disabled, the device uses a buffered switched-capacitor stage to obtain gains of 1, 2, and 4. Aninternal buffer in front of the switched-capacitor stage ensures that the effect on the input loading resulting fromthe capacitor charging and discharging is minimal. See Figure 21 to Figure 26 for the typical values of absolute
input currents (current flowing into or out of each input) and differential input currents (difference in absolutecurrent between positive and negative input) when the PGA is disabled.
For signal sources with high output impedance, external buffering may still be necessary. Note that active buffers
introduce noise and also introduce offset and gain errors. Consider all of these factors in high-accuracy
applications.
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8.3.3 Modulator
A ΔΣ modulator is used in the ADS1220 to convert the analog input voltage into a pulse code modulated (PCM)
data stream. The modulator runs at a modulator clock frequency of f(MOD) = f(CLK) / 16 in normal and duty-cycle
mode and f(MOD) = f(CLK) / 8 in turbo mode, where f(CLK) is either provided by the internal oscillator or the external
clock source. Table 10 shows the modulator frequency for each operating mode using either the internal
oscillator or an external clock of 4.096 MHz.
Table 10. Modulator Clock Frequency for Different
Operating Modes (1)(1)

OPERATING MODEf(MOD)

Duty-cycle mode

256 kHz

Normal mode

256 kHz

Turbo mode

512 kHz

Using the internal oscillator or an external 4.096-MHz clock.

8.3.4 Digital Filter
The device uses a linear-phase finite impulse response (FIR) digital filter that performs both filtering anddecimation of the digital data stream coming from the modulator. The digital filter is automatically adjusted for thedifferent data rates and always settles within a single cycle. At data rates of 5 SPS and 20 SPS, the filter can be
configured to reject 50-Hz or 60-Hz line frequencies or to simultaneously reject 50 Hz and 60 Hz. Two bits
(50/60[1:0]) in the configuration register are used to configure the filter accordingly. The frequency responses ofthe digital filter are illustrated in Figure 46 to Figure 59 for different output data rates using the internal oscillator
or an external 4.096-MHz clock.

0

0

±40

±40
Magnitude (dB)

Magnitude (dB)

The filter notches and output data rate scale proportionally with the clock frequency. For example, a notch thatappears at 20 Hz when using a 4.096-MHz clock appears at 10 Hz if a 2.048-MHz clock is used. Note that theinternal oscillator can vary over temperature as specified in the Electrical Characteristics table. The data rate orconversion time, respectively, and filter notches consequently vary by the same amount. Consider using an
external precision clock source if a digital filter notch at a specific frequency with a tighter tolerance is required.

±80

±120

±160

±80

±120

±160

±200

±200
0

20

40

60

80

100 120 140 160 180 200

Frequency (Hz)Simultaneous 50-Hz and 60-Hz Rejection, 50/60[1:0] = 01
Figure 46. Filter Response(DR = 20 SPS)

46

48

50

52

54

56

58

60

62

Frequency (Hz)

C049

64
C050

Simultaneous 50-Hz and 60-Hz Rejection, 50/60[1:0] = 01
Figure 47. Detailed View of Filter Response(DR = 20 SPS)

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0

0

±40

±40
Magnitude (dB)

Magnitude (dB)

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±80

±120

±160

±80

±120

±160

±200

±200
0

20

40

60

80

100 120 140 160 180 200

Frequency (Hz)

46

47

50

51

52

53

54
C046

50-Hz Rejection Only, 50/60[1:0] = 10

Figure 48. Filter Response(DR = 20 SPS)

Figure 49. Detailed View of Filter Response(DR = 20 SPS)

0

0

±40

±40
Magnitude (dB)

Magnitude (dB)49

Frequency (Hz)50-Hz Rejection Only, 50/60[1:0] = 10

±80

±120

±160

±80

±120

±160

±200

±200
0

20

40

60

80

100 120 140 160 180 200

Frequency (Hz)

56

57

58

59

60

61

62

63

Frequency (Hz)C047

60-Hz Rejection Only, 50/60[1:0] = 11

64
C048

60-Hz Rejection Only, 50/60[1:0] = 11

Figure 50. Filter Response(DR = 20 SPS)

Figure 51. Detailed View of Filter Response(DR = 20 SPS)

0

0

±20

±20
Magnitude (dB)

Magnitude (dB)

48

C045

±40

±60

±40

±60

±80

±80
0

20

40

60

80

100 120 140 160 180 200

Frequency (Hz)

0

C051

20

40

60

80

100 120 140 160 180 200

Frequency (Hz)C052

50/60[1:0] = 00
Figure 52. Filter Response(DR = 20 SPS)

26

Figure 53. Filter Response(DR = 45 SPS)

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0

0

±20

±20
Magnitude (dB)

Magnitude (dB)

www.ti.com

±40

±40

±60

±60

±80

±80
0

0

100 200 300 400 500 600 700 800 900 1000
Frequency (Hz)100 200 300 400 500 600 700 800 900 1000
Frequency (Hz)C053

Figure 55. Filter Response(DR = 175 SPS)

0

0

±20

±20
Magnitude (dB)

Magnitude (dB)Figure 54. Filter Response(DR = 90 SPS)

±40

±40

±60

±60

±80

±80
0

0

200 400 600 800 1000 1200 1400 1600 1800 2000
Frequency (Hz)

500

1000

1500

2000

2500

3000

3500

Frequency (Hz)C055

Figure 56. Filter Response(DR = 330 SPS)

4000
C056

Figure 57. Filter Response(DR = 600 SPS)

0

0

±20

±20
Magnitude (dB)

Magnitude (dB)

C054

±40

±60

±40

±60

±80

±80

0

1

2

3

4

5

6

7

Frequency (kHz)

8

9

10

0

C057

Figure 58. Filter Response(DR = 1 kSPS)

1

2

3

4

5

6

7

8

9

Frequency (kHz)

10
C058

Figure 59. Filter Response(DR = 2 kSPS)

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8.3.5 Output Data Rate
Table 11 shows the actual conversion times for each data rate setting. The values provided are in terms of t(CLK)cycles using an external clock with a clock frequency of f(CLK) = 4.096 MHz. The data rates scale proportionally incase an external clock with a frequency other than 4.096 MHz is used.
Continuous conversion mode data rates are timed from one DRDY falling edge to the next DRDY falling edge.
The first conversion starts 210 · t(CLK) (normal mode, duty-cycle mode) or 114 · t(CLK) (turbo mode) after the last
SCLK falling edge of the START/SYNC command.
Single-shot mode data rates are timed from the last SCLK falling edge of the START/SYNC command to the
DRDY falling edge and rounded to the next t(CLK). In case the internal oscillator is used, an additional oscillator
wake-up time of up to 50 µs (normal mode, duty-cycle mode) or 25 µs (turbo mode) must be added in single-shotmode. The internal oscillator starts to power up at the first SCLK rising edge of the START/SYNC command. If
an SCLK frequency higher than 160 kHz (normal mode, duty-cycle mode) or 320 kHz (turbo mode) is used, theoscillator may not be fully powered up at the end of the START/SYNC command. The ADC then waits until theinternal oscillator is fully powered up before starting a conversion.
Single-shot conversion times in duty-cycle mode are the same as in normal mode. See the Duty-Cycle Modesection for more details on duty-cycle mode operation.
Table 11. Conversion Times
NOMINAL DATA RATE(SPS)ACTUAL CONVERSION TIME (t(CLK))–3-dB BANDWIDTH(Hz)CONTINUOUS CONVERSION MODESINGLE-SHOT MODE

20

13.1

204768204850

45

20.0

91120

91218

90

39.6

46128

46226

175

77.8

23664

23762

330

150.1

12464

12562

600

279.0

6896

6994

1000

483.8

4144

4242

NORMAL MODE

DUTY-CYCLE MODE
5

13.1

823120

n/a

11.25

20.0

364560

n/a

22.5

39.6

184592

n/a

44

77.8

94736

n/a

82.5

150.1

49936

n/a

150

279.0

27664

n/a

250

483.8

16656

n/a

40

26.2

102384102434

TURBO MODE
90

39.9

45560

45618

180

79.2

23064

23122

350

155.6

11832

11890

660

300.3

6232

6290

1200

558.1

3448

3506

2000

967.6

2072

2130

Note that even though the conversion time at the 20-SPS setting is not exactly 1 / 20 Hz = 50 ms, thisdiscrepancy does not affect the 50-Hz or 60-Hz rejection. To achieve the 50-Hz and 60-Hz rejection specified in
the Electrical Characteristics table, the external clock frequency must be 4.096 MHz. When using the internal
oscillator, the conversion time and filter notches vary by the amount specified in the Electrical Characteristics
table for oscillator accuracy.

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8.3.6 Voltage Reference
The device offers an integrated low-drift, 2.048-V reference. For applications that require a different reference
voltage value or a ratiometric measurement approach, the device offers two differential reference input pairs(REFP0, REFN0 and REFP1, REFN1). In addition, the analog supply (AVDD) can be used as a reference.
The reference source is selected by two bits (VREF[1:0]) in the configuration register. By default, the internalreference is selected. The internal voltage reference requires less than 25 µs to fully settle after power-up, whencoming out of power-down mode, or when switching from an external reference source to the internal reference.
The differential reference inputs allow freedom in the reference common-mode voltage. REFP0 and REFN0 are
dedicated reference inputs whereas REFP1 and REFN1 are shared with inputs AIN0 and AIN3, respectively. All
reference inputs are internally buffered to increase input impedance. Therefore, additional reference buffers areusually not required when using an external reference. When used in ratiometric applications, the reference
inputs do not load the external circuitry. Note that the analog supply current increases when using an externalreference because the reference buffers are enabled.
In most cases the conversion result is directly proportional to the stability of the reference source. Any noise anddrift of the voltage reference is reflected in the conversion result.
8.3.7 Clock Source
The device system clock can either be provided by the internal low-drift oscillator or by an external clock sourceon the CLK input. Connect the CLK pin to DGND before power-up or reset to activate the internal oscillator.
Connecting an external clock to the CLK pin at any time deactivates the internal oscillator after two rising edges
on the CLK pin are detected. The device then operates on the external clock. After the ADS1220 switches to theexternal clock, the device can only be switched back to the internal oscillator by cycling the power supplies or by
sending a RESET command.
8.3.8 Excitation Current Sources
The device provides two matched programmable excitation current sources (IDACs) for RTD applications. The
output current of the current sources can be programmed to 10 μA, 50 μA, 100 μA, 250 μA, 500 μA, 1000 μA, or
1500 μA using the respective bits (IDAC[2:0]) in the configuration register. Each current source can be connected
to any of the analog inputs (AINx) as well as to any of the dedicated reference inputs (REFP0 and REFN0). Bothcurrent sources can also be connected to the same pin. Routing of the IDACs is configured by bits (I1MUX[2:0],
I2MUX[2:0]) in the configuration register. Care must be taken not to exceed the compliance voltage of the IDACs.
In other words, limit the voltage on the pin where the IDAC is routed to ≤ (AVDD – 0.9 V), otherwise the specified
accuracy of the IDAC current is not met. For three-wire RTD applications, the matched current sources can beused to cancel errors caused by sensor lead resistance (see the 3-Wire RTD Measurement section for moredetails).
The IDACs require up to 200 µs to start up after the IDAC current is programmed to the respective value using
bits IDAC[2:0]. If configuration registers 2 and 3 are not written during the same WREG command, TI
recommends to first set the IDAC current to the respective value using bits IDAC[2:0] and thereafter select therouting for each IDAC (I1MUX[2:0], I2MUX[2:0]).
In single-shot mode, the IDACs remain active between any two conversions if the IDAC[2:0] bits are set to avalue other than 000. However, the IDACs are powered down whenever the POWERDOWN command is issued.
Note that the analog supply current increases when enabling the IDACs (that is, when the IDAC[2:0] bits are set
to a value other than 000). The IDAC circuit needs this bias current to operate even when the IDACs are notrouted to any pin (I1MUX[2:0] = I2MUX[2:0] = 000). In addition, the selected output current is drawn from theanalog supply when I1MUX[2:0] or I2MUX[2:0] are set to a value other than 000.
8.3.9 Low-Side Power Switch
A low-side power switch with low on-resistance connected between the analog input AIN3/REFN1 and AVSS is
integrated in the device as well. This power switch can be used to reduce system power consumption in bridge
sensor applications by powering down the bridge circuit between conversions. When the respective bit (PSW) in
the configuration register is set, the switch automatically closes when the START/SYNC command is sent andopens when the POWERDOWN command is issued. Note that the switch stays closed between conversions insingle-shot mode in case the PSW bit is set to 1. The switch can be opened at any time by setting the PSW bit to
0. By default, the switch is always open.
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8.3.10 Sensor Detection
To help detect a possible sensor malfunction, the device provides internal 10-µA, burn-out current sources.
When enabled by setting the respective bit (BCS) in the configuration register, one current source sources
current to the positive analog input (AINP) currently selected while the other current source sinks current form theselected negative analog input (AINN).
In case of an open circuit in the sensor, these burn-out current sources pull the positive input towards AVDD andthe negative input towards AVSS, resulting in a full-scale reading. A full-scale reading may also indicate that thesensor is overloaded or that the reference voltage is absent. A near-zero reading may indicate a shorted sensor.
Note that the absolute value of the burn-out current sources typically varies by ±10% and the internal multiplexer
adds a small series resistance. Therefore, distinguishing a shorted sensor condition from a normal reading canbe difficult, especially if an RC filter is used at the inputs. In other words, even if the sensor is shorted, thevoltage drop across the external filter resistance and the residual resistance of the multiplexer causes the output
to read a value higher than zero.
Keep in mind that ADC readings of a functional sensor may be corrupted when the burn-out current sources areenabled. TI recommends disabling the burn-out current sources when preforming the precision measurement,
and only enabling them to test for sensor fault conditions.
8.3.11 System Monitor
The device provides some means for monitoring the analog power supply and the external voltage reference. To
select a monitoring voltage, the internal multiplexer (MUX[3:0]) must be configured accordingly in theconfiguration register. The device automatically bypasses the PGA and sets the gain to 1, irrespective of theconfiguration register settings while the monitoring feature is used. Note that the system monitor function only
provides a coarse result and is not meant to be a precision measurement.
When measuring the analog power supply (MUX[3:0] = 1101), the resulting conversion is approximately (AVDD –AVSS) / 4. The device uses the internal 2.048-V reference for the measurement regardless of what reference
source is selected in the configuration register (VREF[1:0]).
When monitoring one of the two possible external reference voltage sources (MUX[3:0] = 1100), the result isapproximately (V(REFPx) – V(REFNx)) / 4. REFPx and REFNx denote the external reference input pair selected in
the configuration register (VREF[1:0]). The device automatically uses the internal reference for the measurement.
8.3.12 Offset Calibration
The internal multiplexer offers the option to short both PGA inputs (AINP and AINN) to mid-supply (AVDD +AVSS) / 2. This option can be used to measure and calibrate the device offset voltage by storing the result of theshorted input voltage reading in a microcontroller and consequently subtracting the result from each following
reading. TI recommends taking multiple readings with the inputs shorted and averaging the result to reduce theeffect of noise.

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8.3.13 Temperature Sensor
The ADS1220 offers an integrated precision temperature sensor. The temperature sensor mode is enabled by
setting bit TS = 1 in the configuration register. When in temperature sensor mode, the settings of configuration
register 0 have no effect and the device uses the internal reference for measurement, regardless of the selectedvoltage reference source. Temperature readings follow the same process as the analog inputs for starting andreading conversion results. Temperature data are represented as a 14-bit result that is left-justified within the 24bit conversion result. Data are output starting with the most significant byte (MSB). When reading the three databytes, the first 14 bits are used to indicate the temperature measurement result. One 14-bit LSB equals
0.03125°C. Negative numbers are represented in binary twos complement format, as shown in Table 12.
Table 12. 14-Bit Temperature Data Format
TEMPERATURE (°C)

DIGITAL OUTPUT (BINARY)

HEX

128

01 0000 0000 0000

1000

127.96875

00 1111 1111 1111

0FFF

100

00 1100 1000 0000

0C80

75

00 1001 0110 0000

0960

50

00 0110 0100 0000

0640

25

00 0011 0010 0000

0320

0.25

00 0000 0000 1000

0008

0.0312500 0000 0000 0001

0001

0

00 0000 0000 0000

0000

–0.25

11 1111 1111 1000

3FF8

–25

11 1100 1110 0000

3CE0

–40

11 1011 0000 0000

3B00

8.3.13.1 Converting from Temperature to Digital Codes
8.3.13.1.1 For Positive Temperatures (for Example, 50°C):

Twos complement is not performed on positive numbers. Therefore, simply convert the number to binary code in
a 14-bit, left-justified format with the MSB = 0 to denote the positive sign.
Example: 50°C / (0.03125°C per count) = 1600 = 0640h = 00 0110 0100 0000
8.3.13.1.2 For Negative Temperatures (for Example, –25°C):

Generate the twos complement of a negative number by complementing the absolute binary number and adding
1. Then, denote the negative sign with the MSB = 1.
Example: |–25°C| / (0.03125°C per count) = 800 = 0320h = 00 0011 0010 0000
Twos complement format: 11 1100 1101 1111 + 1 = 11 1100 1110 0000
8.3.13.2 Converting from Digital Codes to Temperature
To convert from digital codes to temperature, first check whether the MSB is a 0 or a 1. If the MSB is a 0, simply
multiply the decimal code by 0.03125°C to obtain the result. If the MSB = 1, subtract 1 from the result andcomplement all bits. Then, multiply the result by –0.03125°C.
Example: The device reads back 0960h: 0960h has an MSB = 0.
0960h · 0.03125°C = 2400 · 0.03125°C = 75°C
Example: The device reads back 3CE0h: 3CE0h has an MSB = 1.
Subtract 1 and complement the result: 3CE0h → 0320h
0320h · (–0.03125°C) = 800 · (–0.03125°C) = –25°C

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8.4 Device Functional Modes
8.4.1 Power-Up and Reset
When the device powers up, a reset is performed. The reset process takes approximately 50 µs. After thispower-up reset time, all internal circuitry (including the voltage reference) are stable and communication with thedevice is possible. As part of the reset process, the device sets all bits in the configuration registers to therespective default settings. By default, the device is set to single-shot mode. After power-up, the device performs
a single conversion using the default register settings and then enters a low-power state. When the conversion iscomplete, the DRDY pin transitions from high to low. The high-to-low transition of the DRDY pin can be used tosignal that the ADS1220 is operational and ready to use. The power-up behavior is intended to prevent systems
with tight power-supply requirements from encountering a current surge during power-up.
8.4.2 Conversion Modes
The device can be operated in one of two conversion modes that can be selected by the CM bit in theconfiguration register. These conversion modes are single-shot and continuous conversion mode.
8.4.2.1 Single-Shot ModeIn single-shot mode, the device only performs a conversion when a START/SYNC command is issued. The
device consequently performs one single conversion and returns to a low-power state afterwards. The internal
oscillator and all analog circuitry (except for the excitation current sources) are turned off while the device waits
in this low-power state until the next conversion is started. In addition, every write access to any configuration
register also starts a new conversion. Writing to any configuration register while a conversion is ongoing
functions as a new START/SYNC command that stops the current conversion and restarts a single newconversion. Each conversion is fully settled (assuming the analog input signal settles to its final value before theconversion starts) because the device digital filter settles within a single cycle.
8.4.2.2 Continuous Conversion ModeIn continuous conversion mode, the device continuously performs conversions. When a conversion completes,the device places the result in the output buffer and immediately begins another conversion.
In order to start continuous conversion mode, the CM bit must be set to 1 followed by a START/SYNC command.
The first conversion starts 210 · t(CLK) (normal mode, duty-cycle mode) or 114 · t(CLK) (turbo mode) after the last
SCLK falling edge of the START/SYNC command. Writing to any configuration register during an ongoing
conversion restarts the current conversion. TI recommends always sending a START/SYNC command
immediately after the CM bit is set to 1.

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Device Functional Modes (continued)
8.4.3 Operating Modes
In addition to the different conversion modes, the device can also be operated in different operating modes thatcan be selected to trade-off power consumption, noise performance, and output data rate. These modes are:normal mode, duty-cycle mode, turbo mode, and power-down mode.
8.4.3.1 Normal Mode
Normal mode is the default mode of operation after power-up. In this mode, the internal modulator of the ΔΣ ADC
runs at a modulator clock frequency of f(MOD) = f(CLK) / 16, where the system clock (f(CLK)) is either provided by theinternal oscillator or the external clock source. The modulator frequency is 256 kHz when using the internal
oscillator. Normal mode offers output data rate options ranging from 20 SPS to 1 kSPS with the internal
oscillator. The data rate is selected by the DR[2:0] bits in the configuration register. In case an external clock
source with a clock frequency other than 4.096 MHz is used, the data rates scale accordingly. For example,
using an external clock with f(CLK) = 2.048 MHz yields data rates ranging from 10 SPS to 500 SPS.
8.4.3.2 Duty-Cycle Mode
The noise performance of a ΔΣ ADC generally improves when lowering the output data rate because more
samples of the internal modulator can be averaged to yield one conversion result. In applications where power
consumption is critical, the improved noise performance at low data rates may not be required. For theseapplications, the device supports an automatic duty-cycle mode that can yield significant power savings by
periodically entering a low-power state between conversions. In principle, the device runs in normal mode with aduty cycle of 25%. This functionality means the device performs one conversion in the same manner as whenrunning in normal mode but then automatically enters a low power-state for three consecutive conversion cycles.
The noise performance in duty-cycle mode is therefore comparable to the noise performance in normal mode atfour times the data rate. Data rates in duty-cycle mode range from 5 SPS to 250 SPS with the internal oscillator.
8.4.3.3 Turbo Mode
Applications that require higher data rates up to 2 kSPS can operate the device in turbo mode. In this mode, theinternal modulator runs at a higher frequency of f(MOD) = f(CLK) / 8. f(MOD) equals 512 kHz when the internal
oscillator or an external 4.096-MHz clock is used. Note that the device power consumption increases because
the modulator runs at a higher frequency. Running the ADS1220 in turbo mode at a comparable output data rate
as in normal mode yields better noise performance. For example, the input-referred noise at 90 SPS in turbo
mode is lower than the input-referred noise at 90 SPS in normal mode.
8.4.3.4 Power-Down Mode
When the POWERDOWN command is issued, the device enters power-down mode after completing the current
conversion. In this mode, all analog circuitry (including the voltage reference and both IDACs) are powered
down, the low-side power switch is opened, and the device typically only uses 400 nA of current. While in powerdown mode, the device holds the configuration register settings and responds to commands, but does not
perform any data conversions.
Issuing a START/SYNC command wakes up the device and either starts a single conversion or starts continuous
conversion mode, depending on the conversion mode selected by the CM bit. Note that writing to any
configuration register wakes up the device as well, but only starts a single conversion regardless of the selected
conversion mode (CM).

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8.5 Programming
8.5.1 Serial Interface
The SPI-compatible serial interface of the device is used to read conversion data, read and write the device
configuration registers, and control device operation. Only SPI mode 1 (CPOL = 0, CPHA = 1) is supported. Theinterface consists of five control lines (CS, SCLK, DIN, DOUT/DRDY, and DRDY) but can be used with only fouror even three control signals as well. The dedicated data-ready signal (DRDY) can be configured to be sharedwith DOUT/DRDY. If the serial bus is not shared with any other device, CS can be tied low permanently so that
only signals SCLK, DIN, and DOUT/DRDY are required to communicate with the device.
8.5.1.1 Chip Select (CS)
Chip select (CS) is an active-low input that selects the device for SPI communication. This feature is useful when
multiple devices share the same serial bus. CS must remain low for the duration of the serial communication.
When CS is taken high, the serial interface is reset, SCLK is ignored, and DOUT/DRDY enters a high-impedancestate; as such, DOUT/DRDY cannot indicate when data are ready. In situations where multiple devices arepresent on the bus, the dedicated DRDY pin can provide an uninterrupted monitor of the conversion status. If theserial bus is not shared with another peripheral, CS can be tied low.
8.5.1.2 Serial Clock (SCLK)The serial clock (SCLK) features a Schmitt-triggered input and is used to clock data into and out of the device on
the DIN and DOUT/DRDY pins, respectively. Even though the input has hysteresis, TI recommends keeping the
SCLK signal as clean as possible to prevent glitches from accidentally shifting the data. When the serial interface
is idle, hold SCLK low.
8.5.1.3 Data Ready (DRDY)
DRDY indicates when a new conversion result is ready for retrieval. When DRDY falls low, new conversion data
are ready. DRDY transitions back high on the next SCLK rising edge. When no data are read during continuous
conversion mode, DRDY remains low but pulses high for a duration of 2 · t(MOD) prior to the next DRDY fallingedge. The DRDY pin is always actively driven, even when CS is high.
8.5.1.4 Data Input (DIN)
The data input pin (DIN) is used along with SCLK to send data (commands and register data) to the device. The
device latches data on DIN on the SCLK falling edge. The device never drives the DIN pin.
8.5.1.5 Data Output and Data Ready (DOUT/DRDY)
DOUT/DRDY serves a dual-purpose function. This pin is used with SCLK to read conversion and register datafrom the device. Data on DOUT/DRDY are shifted out on the SCLK rising edge. DOUT/DRDY goes to a highimpedance state when CS is high.
In addition, the DOUT/DRDY pin can also be configured as a data-ready indicator by setting the DRDYM bit highin the configuration register. DOUT/DRDY then transitions low at the same time that the DRDY pin goes low toindicate new conversion data are available. Both signals can be used to detect if new data are ready. However,
because DOUT/DRDY is disabled when CS is high, the recommended method of monitoring the end of aconversion when multiple devices are present on the SPI bus is to use the dedicated DRDY pin.
8.5.1.6 SPI Timeout
The ADS1220 offers an SPI timeout feature that can be used to recover communication when a serial interface
transmission is interrupted. This feature is especially useful in applications where CS is permanently tied low andis not used to frame a communication sequence. Whenever a complete command is not sent within 13955 ·t(MOD) (normal mode, duty-cycle mode) or 27910 · t(MOD) (turbo mode), the serial interface resets and the next
SCLK pulse starts a new communication cycle. See the Modulator section for details on the modulator frequency(f(MOD) = 1 / t(MOD)) in the different operating modes. For the RREG and WREG commands, a complete commandincludes the command byte itself plus the register bytes that are read or written.

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Programming (continued)
8.5.2 Data Format
The device provides 24 bits of data in binary twos complement format. The size of one code (LSB) is calculatedusing Equation 16.
1 LSB = (2 · Vref / Gain) / 224 = +FS / 223(16)

A positive full-scale input [VIN ≥ (+FS – 1 LSB) = (Vref / Gain – 1 LSB)] produces an output code of 7FFFFFh anda negative full-scale input (VIN ≤ –FS = –Vref / Gain) produces an output code of 800000h. The output clips atthese codes for signals that exceed full-scale.
Table 13 summarizes the ideal output codes for different input signals.
Table 13. Ideal Output Code versus Input Signal
INPUT SIGNAL, VIN(AINP – AINN)
23≥ FS (2IDEAL OUTPUT CODE (1)23– 1) / 2

7FFFFFh

FS / 223

000001h0000000h
23(1)–FS / 2FFFFFFh≤ –FS

800000h

Excludes the effects of noise, INL, offset, and gain errors.

Mapping of the analog input signal to the output codes is shown in Figure 60.
7FFFFFh

000001h000000h
FFFFFFh¼

Output Code¼

7FFFFEh

800001h
800000h

¼ 0 ¼

-FS
2

23

-1

-FS
2

FS

Input Voltage VIN
23

2

23

FS
2

-1
23

Figure 60. Code Transition Diagram

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8.5.3 Commands
The device offers six different commands to control device operation, as shown in Table 14. Four commands are
stand-alone instructions (RESET, START/SYNC, POWERDOWN, and RDATA). The commands to read (RREG)
and write (WREG) configuration register data from and to the device require additional information as part of the
instruction.
Table 14. Command Definitions
COMMAND

COMMAND BYTE (1)DESCRIPTIONRESETReset the device

0000 011x

START/SYNC

Start or restart conversions

0000 100x

POWERDOWNEnter power-down mode

0000 001x

RDATA

Read data by command

0001 xxxx

RREG

Read nn registers starting at address rr0010 rrnn

WREG

Write nn registers starting at address rr

0100 rrnn(1)

Operands: rr = configuration register (00 to 11), nn = number of bytes – 1 (00 to 11), and x = don't care.

8.5.3.1 RESET (0000 011x)
Resets the device to the default values. Wait at least (50 µs + 32 · t(CLK)) after the RESET command is sent
before sending any other command.
8.5.3.2 START/SYNC (0000 100x)In single-shot mode, the START/SYNC command is used to start a single conversion, or (when sent during an
ongoing conversion) to reset the digital filter, and then restarts a single new conversion. When the device is set
to continuous conversion mode, the START/SYNC command must be issued one time to start converting
continuously. Sending the START/SYNC command while converting in continuous conversion mode resets thedigital filter and restarts continuous conversions.
8.5.3.3 POWERDOWN (0000 001x)
The POWERDOWN command places the device into power-down mode. This command shuts down all internal
analog components, opens the low-side switch, turns off both IDACs, but holds all register values. In case the
POWERDOWN command is issued while a conversion is ongoing, the conversion completes before the
ADS1220 enters power-down mode. As soon as a START/SYNC command is issued, all analog components
return to their previous states.
8.5.3.4 RDATA (0001 xxxx)
The RDATA command loads the output shift register with the most recent conversion result. This command canbe used when DOUT/DRDY or DRDY are not monitored to indicate that a new conversion result is available. If aconversion finishes in the middle of the RDATA command byte, the state of the DRDY pin at the end of the read
operation signals whether the old or the new result is loaded. If the old result is loaded, DRDY stays low,indicating that the new result is not read out. The new conversion result loads when DRDY is high.
8.5.3.5 RREG (0010 rrnn)
The RREG command reads the number of bytes specified by nn (number of bytes to be read – 1) from thedevice configuration register, starting at register address rr. The command is completed after nn + 1 bytes areclocked out after the RREG command byte. For example, the command to read three bytes (nn = 10) starting at
configuration register 1 (rr = 01) is 0010 0110.
8.5.3.6 WREG (0100 rrnn)
The WREG command writes the number of bytes specified by nn (number of bytes to be written – 1) to thedevice configuration register, starting at register address rr. The command is completed after nn + 1 bytes areclocked in after the WREG command byte. For example, the command to write two bytes (nn = 01) starting at
configuration register 0 (rr = 00) is 0100 0001. The configuration registers are updated on the last SCLK falling
edge.
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8.5.4 Reading Data
Output pins DRDY and DOUT/DRDY (if the DRDYM bit is set high in the configuration register) transition low
when new data are ready for retrieval. The conversion data are written to an internal data buffer. Data can beread directly from this buffer on DOUT/DRDY when DRDY falls low without concern of data corruption. An
RDATA command does not have to be sent. Data are shifted out on the SCLK rising edges, MSB first, andconsist of three bytes of data.
Figure 61 to Figure 63 show the timing diagrams for reading conversion data in continuous conversion mode andsingle-shot mode when not using the RDATA command.
§

§

CS

1

Hi-Z

DRDY

9

DATA MSB

17

DATA§ § § §

DOUT/DRDY§ § § § §SCLKDATA LSB

Next Data Ready
2· t(MOD)
§

§

DIN

Figure 61. Continuous Conversion Mode (DRDYM = 0)

§

§

CS

1

Hi-Z

DRDY

9

DATA MSB

17

DATA§ § § §

DOUT/DRDY§ § § § §SCLKDATA LSB

Next Data Ready
2· t(MOD)
§

§

DIN

Figure 62. Continuous Conversion Mode (DRDYM = 1)

§

§

CS

1

DRDY

9

DATA MSB17DATA

DATA LSB

Next Data Ready
START/SYNC

§

§

DIN

Hi-Z

§ § § §

DOUT/DRDY1§ § § § §SCLK

Figure 63. Single-Shot Mode (DRDYM = 0)
Data can also be read at any time without synchronizing to the DRDY signal using the RDATA command. Whenan RDATA command is issued, the conversion result currently stored in the data buffer is shifted out on
DOUT/DRDY on the following SCLK rising edges. Data can be read continuously with the RDATA command as
an alternative to monitoring DRDY or DOUT/DRDY. The DRDY pin can be polled after the LSB is clocked out todetermine if a new conversion result was loaded. If a new conversion completes during the read operation but
data from the previous conversion are read, then DRDY is low. Otherwise, if the most recent result is read,
DRDY is high. Figure 64 and Figure 65 illustrate the behavior for both cases.

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§

§

CS

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1

Hi-Z

DRDY

DATA MSB17DATA

DATA LSB
Next Data Ready

§

RDATA

§

DIN

9

§ § §

DOUT/DRDY1§ § § § §SCLK

Figure 64. State of DRDY when a New Conversion Finishes During an RDATA Command

§

§

CS

1

Hi-Z

DRDY

DATA MSB17DATA

DATA LSB

Next Data Ready
RDATA

§

§

DIN

9

§ § § §

DOUT/DRDY1§ § § § §SCLK

Figure 65. State of DRDY when the Most Recent Conversion Result is Read During an RDATA Command
8.5.5 Sending Commands
The device serial interface is capable of full-duplex operation while reading conversion data when not using the
RDATA command. Full-duplex operation means commands are decoded at the same time that conversion data
are read. Commands can be sent on any 8-bit data boundary during a data read operation. When a RREG or
RDATA command is recognized, the current data read operation is aborted and the conversion data arecorrupted, unless the command is sent while the last byte of the conversion result is retrieved. The device starts
to output the requested data on DOUT/DRDY at the first SCLK rising edge after the command byte. To read data
without interruption, keep DIN low while clocking out data.
A WREG command can be sent without corrupting an ongoing read operation. Figure 66 shows an example forsending a WREG command to write two configuration registers while reading conversion data in continuous
conversion mode. After the command is clocked in (after the 32nd SCLK falling edge), the device resets thedigital filter and starts converting with the new register settings. The WREG command can be sent on any of the
8-bit boundaries.
§

§

CS

1

17

25

DATA MSBDATADATA LSB
§

DRDY

Hi-Z

9

§ §

DOUT/DRDY§ § § § §SCLK

Next Data Ready
2· t(MOD)WREG

REG_DATAREG_DATA

§

§

DIN

Figure 66. Example of Reading Data while Simultaneously Sending a WREG Command
Note that the serial interface does not decode commands while an RDATA or RREG command is executed. Thatis, all 24 bits of the conversion result must be read after the RDATA command is issued and all requested
registers must be read after a RREG command is sent before a new command can be issued.

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8.5.6 Interfacing with Multiple Devices
When connecting multiple ADS1220 devices to a single SPI bus, SCLK, DIN, and DOUT/DRDY can be safely
shared by using a dedicated chip-select (CS) line for each SPI-enabled device. When CS transitions high for therespective device, DOUT/DRDY enters a 3-state mode. Therefore, DOUT/DRDY cannot be used to indicate
when new data are available if CS is high, regardless of the DRDYM bit setting in the configuration register. Only
the dedicated DRDY pin indicates that new data are available, because the DRDY pin is actively driven evenwhen CS is high.
In some cases the DRDY pin cannot be interfaced to the microcontroller. This scenario can occur if there areinsufficient GPIO channels available on the microcontroller or if the serial interface must be galvanically isolated
and thus the amount of channels must be limited. Therefore, in order to evaluate when a new conversion of oneof the devices is ready, the microcontroller can periodically drop CS to the respective device and poll the state of
the DOUT/DRDY pin. When CS goes low, the DOUT/DRDY pin immediately drives either high or low, provided
that the DRDYM bit is configured to 1. If the DOUT/DRDY line drives low, when CS is taken low, new data are
currently available. If the DOUT/DRDY line drives high, no new data are available. This procedure requires that
DOUT/DRDY is high after reading each conversion result and before taking CS high. To make sure DOUT/DRDY
is taken high, send 8 additional SCLKs with DIN held low after each data read operation. DOUT/DRDY reads
high during the eight SCLKs after the conversion result is read, as shown in Figure 67. Alternatively, valid data
can be retrieved from the device at any time without concern of data corruption by using the RDATA command.
§

§

CS

1

17

25

DATA MSBDATADATA LSB

§

Hi-Z

9

§

DOUT/DRDY§ § § §SCLK§
Next Data Ready

DRDY

§

§

DIN

Figure 67. Example of Taking DOUT/DRDY High After Reading a Conversion Result

8.6 Register Map
8.6.1 Configuration Registers
The device has four 8-bit configuration registers that are accessible through the serial interface using the RREG
and WREG commands. The configuration registers control how the device operates and can be changed at any
time without causing data corruption. After power-up or reset, all registers are set to the default values (which are
all 0). All registers retain their values during power-down mode. Table 15 shows the register map of theconfiguration registers.
Table 15. Configuration Register Map
REGISTER
(Hex)

BIT 7

BIT 6

00h

03h

BIT 4

BIT 3

MUX[3:0]

01h
02h

BIT 5

I1MUX[2:0]

BIT 1

GAIN[2:0]

DR[2:0]
VREF[1:0]

BIT 2

MODE[1:0]
50/60[1:0]

CM

BIT 0
PGA_BYPASS

TS

PSW

IDAC[2:0]

I2MUX[2:0]

DRDYM

BCS

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8.6.1.1 Configuration Register 0 (offset = 00h) [reset = 00h]
Figure 68. Configuration Register 0
7

6

5

4

3

MUX[3:0]
R/W-0h2
GAIN[2:0]
R/W-0h1

0
PGA_BYPASS
R/W-0hLEGEND: R/W = Read/Write; -n = value after reset

Table 16. Configuration Register 0 Field Descriptions
Bit

Field

Type

Reset

Description
Input multiplexer configuration
These bits configure the input multiplexer.
For settings where AINN = AVSS, the PGA must be disabled (PGA_BYPASS = 1)
and only gains 1, 2, and 4 can be used.

7-4

MUX[3:0]R/W

0h0000 : AINP = AIN0, AINN = AIN1 (default)
0001 : AINP = AIN0, AINN = AIN20010 : AINP = AIN0, AINN = AIN30011 : AINP = AIN1, AINN = AIN20100 : AINP = AIN1, AINN = AIN30101 : AINP = AIN2, AINN = AIN30110 : AINP = AIN1, AINN = AIN00111 : AINP = AIN3, AINN = AIN2
1000 : AINP = AIN0, AINN = AVSS
1001 : AINP = AIN1, AINN = AVSS
1010 : AINP = AIN2, AINN = AVSS
1011 : AINP = AIN3, AINN = AVSS
1100 : (V(REFPx) – V(REFNx)) / 4 monitor (PGA bypassed)
1101 : (AVDD – AVSS) / 4 monitor (PGA bypassed)
1110 : AINP and AINN shorted to (AVDD + AVSS) / 2
1111 : Reserved
Gain configuration
These bits configure the device gain.
Gains 1, 2, and 4 can be used without the PGA. In this case, gain is obtained bya switched-capacitor structure.

3-1

0GAIN[2:0]

PGA_BYPASS

R/W

R/W

0h

0h

000 : Gain = 1 (default)
001 : Gain = 2
010 : Gain = 4011 : Gain = 8
100 : Gain = 16
101 : Gain = 32
110 : Gain = 64
111 : Gain = 128
Disables and bypasses the internal low-noise PGA
Disabling the PGA reduces overall power consumption and allows the commonmode voltage range (VCM) to span from AVSS – 0.1 V to AVDD + 0.1 V.
The PGA can only be disabled for gains 1, 2, and 4.
The PGA is always enabled for gain settings 8 to 128, regardless of the
PGA_BYPASS setting.
0 : PGA enabled (default)
1 : PGA disabled and bypassed

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8.6.1.2 Configuration Register 1 (offset = 01h) [reset = 00h]
Figure 69. Configuration Register 1
7

6
DR[2:0]
R/W-0h543MODE[1:0]
R/W-0h2
CM
R/W-0h1
TS
R/W-0h0
BCS
R/W-0hLEGEND: R/W = Read/Write; -n = value after reset

Table 17. Configuration Register 1 Field Descriptions
Bit

Field

Type

Reset

Description

7-5

DR[2:0]R/W

0h

Data rate
These bits control the data rate setting depending on the selected operating
mode. Table 18 lists the bit settings for normal, duty-cycle, and turbo mode.
Operating mode
These bits control the operating mode the device operates in.

4-3

2

1

MODE[1:0]

CM

TS

R/W

R/W

R/W

0h

0h

0h

00 : Normal mode (256-kHz modulator clock, default)
01 : Duty-cycle mode (internal duty cycle of 1:4)
10 : Turbo mode (512-kHz modulator clock)
11 : Reserved
Conversion modeThis bit sets the conversion mode for the device.
0 : Single-shot mode (default)
1 : Continuous conversion mode
Temperature sensor modeThis bit enables the internal temperature sensor and puts the device intemperature sensor mode.
The settings of configuration register 0 have no effect and the device uses theinternal reference for measurement when temperature sensor mode is enabled.
0 : Disables temperature sensor (default)
1 : Enables temperature sensor

0

BCS

R/W

0h

Burn-out current sources
This bit controls the 10-µA, burn-out current sources.
The burn-out current sources can be used to detect sensor faults such as wire
breaks and shorted sensors.
0 : Current sources off (default)
1 : Current sources on

Table 18. DR Bit Settings (1)(1)

NORMAL MODE

DUTY-CYCLE MODE

TURBO MODE

000 = 20 SPS

000 = 5 SPS

000 = 40 SPS

001 = 45 SPS

001 = 11.25 SPS

001 = 90 SPS

010 = 90 SPS

010 = 22.5 SPS

010 = 180 SPS

011 = 175 SPS

011 = 44 SPS

011 = 350 SPS

100 = 330 SPS

100 = 82.5 SPS

100 = 660 SPS

101 = 600 SPS

101 = 150 SPS

101 = 1200 SPS

110 = 1000 SPS

110 = 250 SPS

110 = 2000 SPS

111 = Reserved

111 = Reserved

111 = Reserved

Data rates provided are calculated using the internal oscillator or an external 4.096-MHz clock. The data rates scale proportionally withthe external clock frequency when an external clock other than 4.096 MHz is used.

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8.6.1.3 Configuration Register 2 (offset = 02h) [reset = 00h]
Figure 70. Configuration Register 2
76

5

VREF[1:0]
R/W-0h450/60[1:0]
R/W-0h3
PSW
R/W-0h2

1
IDAC[2:0]
R/W-0h0

LEGEND: R/W = Read/Write; -n = value after reset

Table 19. Configuration Register 2 Field Descriptions
Bit

Field

Type

Reset

Description
Voltage reference selection
These bits select the voltage reference source that is used for the conversion.

7-6

5-4

3

VREF[1:0]

50/60[1:0]

PSW

R/W

R/W

R/W

0h

0h

0h

00 : Internal 2.048-V reference selected (default)
01 : External reference selected using dedicated REFP0 and REFN0 inputs
10 : External reference selected using AIN0/REFP1 and AIN3/REFN1 inputs
11 : Analog supply (AVDD – AVSS) used as reference
FIR filter configuration
These bits configure the filter coefficients for the internal FIR filter.
Only use these bits together with the 20-SPS setting in normal mode and the 5SPS setting in duty-cycle mode. Set to 00 for all other data rates.
00 : No 50-Hz or 60-Hz rejection (default)
01 : Simultaneous 50-Hz and 60-Hz rejection
10 : 50-Hz rejection only
11 : 60-Hz rejection only
Low-side power switch configuration
This bit configures the behavior of the low-side switch connected between
AIN3/REFN1 and AVSS.
0 : Switch is always open (default)
1 : Switch automatically closes when the START/SYNC command is sent andopens when the POWERDOWN command is issued
IDAC current setting
These bits set the current for both IDAC1 and IDAC2 excitation current sources.

2-0

42

IDAC[2:0]

R/W

0h000 : Off (default)
001 : 10 µA
010 : 50 µA
011 : 100 µA
100 : 250 µA
101 : 500 µA
110 : 1000 µA
111 : 1500 µA

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8.6.1.4 Configuration Register 3 (offset = 03h) [reset = 00h]
Figure 71. Configuration Register 3
7

6
I1MUX[2:0]
R/W-0h5

4

3
I2MUX[2:0]
R/W-0h2

1
DRDYM
R/W-0h00
R/W-0hLEGEND: R/W = Read/Write; -n = value after reset

Table 20. Configuration Register 3 Field Descriptions
Bit

Field

Type

Reset

Description
IDAC1 routing configuration
These bits select the channel where IDAC1 is routed to.

7-5

I1MUX[2:0]

R/W

0h

000 : IDAC1 disabled (default)
001 : IDAC1 connected to AIN0/REFP1
010 : IDAC1 connected to AIN1
011 : IDAC1 connected to AIN2
100 : IDAC1 connected to AIN3/REFN1
101 : IDAC1 connected to REFP0
110 : IDAC1 connected to REFN0
111 : Reserved
IDAC2 routing configuration
These bits select the channel where IDAC2 is routed to.

4-2

I2MUX[2:0]

R/W

0h

1

DRDYM

R/W

0h

0

Reserved

R/W

0h

000 : IDAC2 disabled (default)
001 : IDAC2 connected to AIN0/REFP1
010 : IDAC2 connected to AIN1
011 : IDAC2 connected to AIN2
100 : IDAC2 connected to AIN3/REFN1
101 : IDAC2 connected to REFP0
110 : IDAC2 connected to REFN0
111 : Reserved
DRDY modeThis bit controls the behavior of the DOUT/DRDY pin when new data are ready.
0 : Only the dedicated DRDY pin is used to indicate when data are ready (default)
1 : Data ready is indicated simultaneously on DOUT/DRDY and DRDY
Reserved
Always write 0

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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

9.1 Application Information
The ADS1220 is a precision, 24-bit, ΔΣ ADC that offers many integrated features to ease the measurement of
the most common sensor types including various types of temperature and bridge sensors. Primaryconsiderations when designing an application with the ADS1220 include analog input filtering, establishing anappropriate external reference for ratiometric measurements, and setting the common-mode input voltage for theinternal PGA. Connecting and configuring the serial interface appropriately is another concern. These
considerations are discussed in the following sections.
9.1.1 Serial Interface Connections
The principle serial interface connections for the ADS1220 are shown in Figure 72.

GPIO/IRQ

DVSS

DVDD

DIN
47 O

0.1 PF

47 O

47 O

47 O

47 O

GPIO

SCLK

DOUT

Microcontroller with SPI Interface

3.3 V

1 SCLKDIN 16

2 CS

DOUT/DRDY 15

3 CLK

DRDY 14

4 DGND

3.3 V

DVDD 13
Device

5 AVSS
6 AIN3/REFN1AVDD 12
AIN0/REFP1 11

7 AIN2

AIN1 108 REFN0

REFP0 93.3 V

0.1 PF

0.1 PF

Figure 72. Serial Interface Connections
Most microcontroller SPI peripherals can operate with the ADS1220. The interface operates in SPI mode 1
where CPOL = 0 and CPHA = 1. In SPI mode 1, SCLK idles low and data are launched or changed only on
SCLK rising edges; data are latched or read by the master and slave on SCLK falling edges. Details of the SPI
communication protocol employed by the device can be found in the SPI Timing Requirements section.
TI recommends placing 47-Ω resistors in series with all digital input and output pins (CS, SCLK, DIN,
DOUT/DRDY, and DRDY). This resistance smooths sharp transitions, suppresses overshoot, and offers someovervoltage protection. Care must be taken to meet all SPI timing requirements because the additional resistors
interact with the bus capacitances present on the digital signal lines.
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Application Information (continued)
9.1.2 Analog Input Filtering
Analog input filtering serves two purposes: first, to limit the effect of aliasing during the sampling process andsecond, to reduce external noise from being a part of the measurement.
As with any sampled system, aliasing can occur if proper antialias filtering is not in place. Aliasing occurs whenfrequency components are present in the input signal that are higher than half the sampling frequency of the
ADC (also known as the Nyquist frequency). These frequency components are folded back and show up in theactual frequency band of interest below half the sampling frequency. Note that inside a ΔΣ ADC, the input signal
is sampled at the modulator frequency f(MOD) and not at the output data rate. The filter response of the digital filter
repeats at multiples of the sampling frequency (f(MOD)), as shown in Figure 73. Signals or noise up to a frequency
where the filter response repeats are attenuated to a certain amount by the digital filter depending on the filter
architecture. Any frequency components present in the input signal around the modulator frequency or multiples
thereof are not attenuated and alias back into the band of interest, unless attenuated by an external analog filter.
Magnitude

SensorSignalUnwanted
Signals

Unwanted
Signals

OutputData Ratef(MOD)/2f(MOD)

Frequencyf(MOD)

Frequencyf(MOD)

Frequency

Magnitude
Digital Filter

Aliasing of
Unwanted Signals

OutputData Ratef(MOD)/2

Magnitude

External
Antialiasing Filter
Roll-OffOutputData Ratef(MOD)/2

Figure 73. Effect of Aliasing

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Application Information (continued)
Many sensor signals are inherently bandlimited; for example, the output of a thermocouple has a limited rate ofchange. In this case the sensor signal does not alias back into the pass-band when using a ΔΣ ADC. However,any noise pick-up along the sensor wiring or the application circuitry can potentially alias into the pass-band.
Power line-cycle frequency and harmonics are one common noise source. External noise can also be generated
from electromagnetic interference (EMI) or radio frequency interference (RFI) sources, such as nearby motors
and cellular phones. Another noise source typically exists on the printed circuit board (PCB) itself in the form ofclocks and other digital signals. Analog input filtering helps remove unwanted signals from affecting themeasurement result.
A first-order resistor-capacitor (RC) filter is (in most cases) sufficient to either totally eliminate aliasing, or to
reduce the effect of aliasing to a level within the noise floor of the sensor. Ideally, any signal beyond f(MOD) / 2 isattenuated to a level below the noise floor of the ADC. The digital filter of the ADS1220 attenuates signals to acertain degree, as illustrated in the filter response plots in the Digital Filter section. In addition, noise components
are usually smaller in magnitude than the actual sensor signal. Therefore, using a first-order RC filter with acutoff frequency set at the output data rate or 10x higher is generally a good starting point for a system design.
Internal to the device, prior to the PGA inputs, is an EMI filter; see Figure 39. The cutoff frequency of this filter isapproximately 31.8 MHz, which helps reject high-frequency interferences.
9.1.3 External Reference and Ratiometric Measurements
The full-scale range of the ADS1220 is defined by the reference voltage and the PGA gain (FSR = ±Vref / Gain).
An external reference can be used instead of the integrated 2.048-V reference to adapt the FSR to the specificsystem needs. An external reference must be used if VIN > 2.048 V. For example, an external 5-V reference andan AVDD = 5 V are required in order to measure a single-ended signal that can swing between 0 V and 5 V.
The reference inputs of the device also allow the implementation of ratiometric measurements. In a ratiometricmeasurement the same excitation source that is used to excite the sensor is also used to establish the reference
for the ADC. As an example, a simple form of a ratiometric measurement uses the same current source to excite
both the resistive sensor element (such as an RTD) and another resistive reference element that is in series withthe element being measured. The voltage that develops across the reference element is used as the reference
source for the ADC. Because current noise and drift are common to both the sensor measurement and thereference, these components cancel out in the ADC transfer function. The output code is only a ratio of thesensor element and the value of the reference resistor. The value of the excitation current source itself is not partof the ADC transfer function.
9.1.4 Establishing a Proper Common-Mode Input Voltage
The ADS1220 can be used to measure various types of input signal configurations: single-ended, pseudodifferential, and fully-differential signals (which can be either unipolar or bipolar). However, configuring the device
properly for the respective signal type is important.
Signals where the negative analog input is fixed and referenced to analog ground (V(AINN) = 0 V) are commonly
called single-ended signals. The common-mode voltage of a single-ended signal consequently varies between
0 V and VIN / 2. If the PGA is disabled and bypassed, the common-mode input voltage of the ADS1220 can be
as low as 100 mV below AVSS and as large as 100 mV above AVDD. Therefore, the PGA_BYPASS bit must be
set in order to measure single-ended signals when a unipolar analog supply is used (AVSS = 0 V). Gains of 1, 2,
and 4 are still possible in this configuration. Measuring a 0-mA to 20-mA or 4-mA to 20-mA signal across a load
resistor of 100 Ω referenced to GND is a typical example. The ADS1220 can directly measure the signal acrossthe load resistor using a unipolar supply, the internal 2.048-V reference, and gain = 1 when the PGA is
bypassed.
If gains larger than 4 are needed to measure a single-ended signal, the PGA must be enabled. In this case, abipolar supply is required for the ADS1220 to meet the common-mode voltage requirement of the PGA.
Signals where the negative analog input (AINN) is fixed at a voltage other the 0 V are referred to as pseudodifferential signals. The common-mode voltage of a pseudo-differential signal varies between V(AINN) and V(AINN) +VIN / 2.
Fully-differential signals in contrast are defined as signals having a constant common-mode voltage where thepositive and negative analog inputs swing 180° out-of-phase but have the same amplitude.
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Application Information (continued)
The ADS1220 can measure pseudo-differential and fully-differential signals both with the PGA enabled or
bypassed. However, the PGA must be enabled in order to use gains greater than 4. The common-mode voltageof the input signal must meet the input-common mode voltage restrictions of the PGA (as explained in the PGA
Common-Mode Voltage Requirements section) when the PGA is enabled. Setting the common-mode voltage ator near (AVSS + AVDD) / 2 in most cases satisfies the PGA common-mode voltage requirements.
Signals where both the positive and negative inputs are always ≥ 0 V are called unipolar signals. These signals
can in general be measured with the ADS1220 using a unipolar analog supply (AVSS = 0 V). As mentioned
previously, the PGA must be bypassed in order to measure single-ended, unipolar signals when using a unipolar
supply.
A signal is called bipolar when either the positive or negative input can swing below 0 V. A bipolar analog supply(such as AVDD = 2.5 V, AVSS = –2.5 V) is required in order to measure bipolar signals with the ADS1220. A
typical application task is measuring a single-ended, bipolar ±10 V signal where AINN is fixed at 0 V while AINP
swings between –10 V and 10 V. The ADS1220 cannot directly measure this signal because the 10 V exceeds
the analog power-supply limits. However, one possible solution is to use a bipolar analog supply (AVDD = 2.5 V,
AVSS = –2.5 V), gain = 1, and a resistor divider in front of the ADS1220. The resistor divider must divide thevoltage down to ≤ ±2.048 V to be able to measure it using the internal 2.048-V reference.
9.1.5 Unused Inputs and Outputs
To minimize leakage currents on the analog inputs, leave unused analog and reference inputs floating, orconnect the inputs to mid-supply or to AVDD. AIN3/REFN1 is an exception. Leave the AIN3/REFN1 pin floatingwhen not used in order to avoid accidently shorting the pin to AVSS through the internal low-side switch.
Connecting unused analog or reference inputs to AVSS is possible as well, but can yield higher leakage currents
than the previously mentioned options.
Do not float unused digital inputs; excessive power-supply leakage current can result. Tie all unused digital
inputs to the appropriate levels, DVDD or DGND, even when in power-down mode. If CS is not used, tie this pin
to DGND. If the internal oscillator is used, tie the CLK pin to DGND. If the DRDY output is not used, leave the pin
unconnected or tie the pin to DVDD using a weak pullup resistor.

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Application Information (continued)
9.1.6 Pseudo Code Example
The following list shows a pseudo code sequence with the required steps to set up the device and themicrocontroller that interfaces to the ADC in order to take subsequent readings from the ADS1220 in continuous
conversion mode. The dedicated DRDY pin is used to indicate availability of new conversion data. The default
configuration register settings are changed to gain = 16, continuous conversion mode, and simultaneous 50-Hz
and 60-Hz rejection.
Power-up;
Delay to allow power supplies to settle and power-up reset to complete (minimum of 50 µs);
Configure the SPI interface of the microcontroller to SPI mode 1 (CPOL = 0, CPHA = 1);
If the CS pin is not tied low permanently, configure the microcontroller GPIO connected to CS as an
output;Configure the microcontroller GPIO connected to the DRDY pin as a falling edge triggered interrupt
input;
Set CS to the device low;
Delay for a minimum of td(CSSC);
Send the RESET command (06h) to make sure the device is properly reset after power-up;
Delay for a minimum of 50 µs + 32 · t(CLK);
Write the respective register configuration with the WREG command (43h, 08h, 04h, 10h, and 00h);
As an optional sanity check, read back all configuration registers with the RREG command (23h);
Send the START/SYNC command (08h) to start converting in continuous conversion mode;
Delay for a minimum of td(SCCS);
Clear CS to high (resets the serial interface);
Loop{
Wait for DRDY to transition low;
Take CS low;
Delay for a minimum of td(CSSC);
Send 24 SCLK rising edges to read out conversion data on DOUT/DRDY;
Delay for a minimum of td(SCCS);
Clear CS to high;}Take CS low;
Delay for a minimum of td(CSSC);
Send the POWERDOWN command (02h) to stop conversions and put the device in power-down mode;
Delay for a minimum of td(SCCS);
Clear CS to high;

TI recommends running an offset calibration before performing any measurements or when changing the gain of
the PGA. The internal offset of the device can, for example, be measured by shorting the inputs to mid-supply(MUX[3:1] = 1110). The microcontroller then takes multiple readings from the device with the inputs shorted andstores the average value in the microcontroller memory. When measuring the sensor signal, the microcontroller
then subtracts the stored offset value from each device reading to obtain an offset compensated result. Note thatthe offset can be either positive or negative in value.

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9.2 Typical Applications
9.2.1 K-Type Thermocouple Measurement (–200°C to +1250°C)
Figure 74 shows the basic connections of a thermocouple measurement system when using the internal highprecision temperature sensor for cold-junction compensation. Apart from the thermocouple itself, the only
external circuitry required are two biasing resistors, a simple low-pass, antialiasing filter, and the power-supply
decoupling capacitors.
3.3 V

3.3 V

0.1 PF

0.1 PF

3.3 V

REFP0

RB2

10 A to1.5 mA

CCM2
RF2

REFN0

AVDD

AIN0

DVDD
Internal
Reference

Reference
MUX

TI Device

24-Bitû ADC

Digital Filter
and
SPI
Interface

CDIF
RF1

AIN1

CS

AINP
Thermocouple

RB1

CCM1

MUX

Isothermal
Block

AIN2

AIN3

PGA
AINN

SCLK
DIN
DOUT/DRDY
DRDY

Precision
Temperature
Sensor

Low-Drift
Oscillator

AVSS

CLK

DGND

Copyright © 2016, Texas Instruments Incorporated

Figure 74. Thermocouple Measurement
9.2.1.1 Design Requirements
Table 21. Design Requirements
DESIGN PARAMETER

(1)

VALUE

Supply voltage

3.3 V

Reference voltage

Internal 2.048-V reference

Update rate

≥10 readings per second

Thermocouple typeK

Temperature measurement range–200°C to +1250°C

Measurement accuracy at TA = 25°C (1)±0.2°CNot accounting for error of the thermocouple and cold-junction temperature measurement;
offset calibration at T(TC) = T(CJ) = 25°C; no gain calibration.

9.2.1.2 Detailed Design Procedure
The biasing resistors RB1 and RB2 are used to set the common-mode voltage of the thermocouple to within thespecified common-mode voltage range of the PGA (in this example, to mid-supply AVDD / 2). If the application
requires the thermocouple to be biased to GND, either a bipolar supply (for example, AVDD = 2.5 V and AVSS =–2.5 V) must be used for the device to meet the common-mode voltage requirement of the PGA, or the PGA
must be bypassed. When choosing the values of the biasing resistors, care must be taken so that the biasing
current does not degrade measurement accuracy. The biasing current flows through the thermocouple and cancause self-heating and additional voltage drops across the thermocouple leads. Typical values for the biasing
resistors range from 1 MΩ to 50 MΩ.

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In addition to biasing the thermocouple, RB1 and RB2 are also useful for detecting an open thermocouple lead.
When one of the thermocouple leads fails open, the biasing resistors pull the analog inputs (AIN0 and AIN1) to
AVDD and AVSS, respectively. The ADC consequently reads a full-scale value, which is outside the normal
measurement range of the thermocouple voltage, to indicate this failure condition.
Although the device digital filter attenuates high-frequency components of noise, TI recommends providing a firstorder, passive RC filter at the inputs to further improve performance. The differential RC filter formed by RF1, RF2,and the differential capacitor CDIF offers a cutoff frequency that is calculated using Equation 17.
fC = 1 / [2π · (RF1 + RF2) · CDIF](17)

Two common-mode filter capacitors (CM1 and CM2) are also added to offer attenuation of high-frequency,
common-mode noise components. TI recommends that the differential capacitor CDIF be at least an order ofmagnitude (10x) larger than the common-mode capacitors (CM1 and CM2) because mismatches in the commonmode capacitors can convert common-mode noise into differential noise.
The filter resistors RF1 and RF2 also serve as current-limiting resistors. These resistors limit the current into theanalog inputs (AIN0 and AIN1) of the device to safe levels if an overvoltage on the inputs occur. Care must be
taken when choosing the filter resistor values because the input currents flowing into and out of the device causea voltage drop across the resistors. This voltage drop shows up as an additional offset error at the ADC inputs.
TI recommends limiting the filter resistor values to below 1 kΩ.
The filter component values used in this design are: RF1 = RF2 = 1 kΩ, CDIF = 100 nF, and CCM1 = CCM2 = 10 nF.
The highest measurement resolution is achieved when matching the largest potential input signal to the FSR of
the ADC by choosing the highest possible gain. From the design requirement, the maximum thermocouple
voltage occurs at T(TC) = 1250°C and is V(TC) = 50.644 mV as defined in the tables published by the National
Institute of Standards and Technology (NIST) using a cold-junction temperature of T(CJ) = 0°C. A thermocouple
produces an output voltage that is proportional to the temperature difference between the thermocouple tip andthe cold junction. If the cold junction is at a temperature below 0°C, the thermocouple produces a voltage larger
than 50.644 mV. The isothermal block area is constrained by the operating temperature range of the device.
Therefore, the isothermal block temperature is limited to –40°C. A K-type thermocouple at T(TC) = 1250°C
produces an output voltage of V(TC) = 50.644 mV – (–1.527 mV) = 52.171 mV when referenced to a cold-junction
temperature of T(CJ) = –40°C. The maximum gain that can be applied when using the internal 2.048-V referenceis then calculated as (2.048 V / 52.171 mV) = 39.3. The next smaller PGA gain setting the device offers is 32.
The device integrates a high-precision temperature sensor that can be used to measure the temperature of thecold junction. To measure the internal temperature of the ADS1220, the device must be set to internal
temperature sensor mode by setting the TS bit to 1 in the configuration register. For best performance, carefulboard layout is critical to achieve good thermal conductivity between the cold junction and the device package.
However, the device does not perform automatic cold-junction compensation of the thermocouple. This
compensation must be done in the microcontroller that interfaces to the device. The microcontroller requests one
or multiple readings of the thermocouple voltage from the device and then sets the device to internal temperature
sensor mode (TS = 1) to acquire the temperature of the cold junction. An algorithm similar to the following must
be implemented on the microcontroller to compensate for the cold-junction temperature:
1. Measure the thermocouple voltage, V(TC), between AIN0 and AIN1.
2. Measure the temperature of the cold junction, T(CJ), using the temperature sensor mode of the ADS1220.
3. Convert the cold-junction temperature into an equivalent thermoelectric voltage, V(CJ), using the tables or
equations provided by NIST.
4. Add V(TC) and V(CJ) and translate the summation back into a thermocouple temperature using the NIST tables
or equations again.
In some applications, the integrated temperature sensor of the ADS1220 cannot be used (for example, if theaccuracy is not high enough or if the device cannot be placed close enough to the cold junction). The additional
analog input channels of the device can be used in this case to measure the cold-junction temperature with athermistor, RTD, or an analog temperature sensor.
To get an approximation of the achievable temperature resolution, the rms-Noise of the ADS1220 at Gain = 32
and DR = 20 SPS (0.23 µVrms) is divided by the average sensitivity of a K-type thermocouple (41 µV/°C), as
shown in Equation 18.
Temperature Resolution = 0.23 µV / 41 µV/°C = 0.006°C

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The register settings for this design are shown in Table 22.
Table 22. Register Settings
REGISTERSETTING00h

0Ah

AINP = AIN0, AINN = AIN1, gain = 32, PGA enabled

DESCRIPTION

01h

04h

DR = 20 SPS, normal mode, continuous conversion mode

02h

10h

Internal voltage reference, simultaneous 50-Hz and 60-Hz rejection

03h

00h

No IDACs used

9.2.1.3 Application Curves
Figure 75 and Figure 76 show the measurement results. The measurements are taken at TA = T(CJ) = 25°C. A
system offset calibration is performed at T(TC) = 25°C, which translates to a V(TC) = 0 V when T(CJ) = 25°C. No
gain calibration is implemented. The data in Figure 75 are taken using a precision voltage source as the input
signal instead of a thermocouple. The respective temperature measurement error in Figure 76 is calculated fromthe data in Figure 75 using the NIST tables.

0.01

0.2

0.005

0.1

Measurement Error (°C)

Measurement Error (mV)The design meets the required temperature measurement accuracy given in Table 21. Note that themeasurement error shown in Figure 76 does not include the error of the thermocouple itself and themeasurement error of the cold-junction temperature. Those two error sources are in general larger than 0.2°C
and therefore, in many cases, dominate the overall system measurement accuracy.

0-0.005

-0.01
-10

0

10
20
30
Thermocouple Voltage (mV)

40

50

0

-0.1

-0.2
-200

D002

Figure 75. Voltage Measurement Error vs V(TC)

0

200

400
600
Temperature (°C)

800

1000

1200
D001

Figure 76. Temperature Measurement Error vs T(TC)

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9.2.2 3-Wire RTD Measurement (–200°C to +850°C)
The ADS1220 integrates all necessary features (such as dual-matched programmable current sources, bufferedreference inputs, and a PGA) to ease the implementation of ratiometric 2-, 3-, and 4-wire RTD measurements.
Figure 77 shows a typical implementation of a ratiometric 3-wire RTD measurement using the excitation current
sources integrated in the device to excite the RTD as well as to implement automatic RTD lead-resistancecompensation.
RREF

IIDAC1 + IIDAC2

3.3 V

RF3
CCM3

0.1 PF

10 A to1.5 mARLEAD3RLEAD2

AVDD

RF4

CDIF2

REFP0

3.3 V

CCM4

REFN0

0.1 PF

DVDD

CCM2

RF2

AIN0

3-Wire RTD

Internal
Reference

Reference
MUX

TI Device

24-Bitû ADC

Digital Filter
and
SPI
Interface

CDIF1
RLEAD1

RF1

AIN1

CS

AINP
CCM1
MUX
AIN2

PGA
AINN

Precision
Temperature
Sensor

AIN3

DIN
DOUT/DRDY
DRDY(IDAC1)(IDAC2)SCLK

Low-Drift
Oscillator

AVSS

CLK

DGND

Copyright © 2016, Texas Instruments Incorporated

Figure 77. 3-Wire RTD Measurement
9.2.2.1 Design Requirements
Table 23. Design Requirements
DESIGN PARAMETER

VALUE

Supply voltage

3.3 V

Update rate

20 readings per second

RTD type

3-wire Pt100

Maximum RTD lead resistance15 Ω

RTD excitation current

500 µA

Temperature measurement range
Measurement accuracy at TA = 25°C
(1)–200°C to +850°C(1)±0.2°CNot accounting for error of RTD;
offset calibration is performed with RRTD = 100 Ω; no gain calibration.

9.2.2.2 Detailed Design Procedure
The circuit in Figure 77 employs a ratiometric measurement approach. In other words, the sensor signal (that is,the voltage across the RTD in this case) and the reference voltage for the ADC are derived from the same
excitation source. Therefore, errors resulting from temperature drift or noise of the excitation source cancel out
because these errors are common to both the sensor signal and the reference.

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In order to implement a ratiometric 3-wire RTD measurement using the device, IDAC1 is routed to one of theleads of the RTD and IDAC2 is routed to the second RTD lead. Both currents have the same value, which is
programmable by the IDAC[2:0] bits in the configuration register. The design of the device ensures that both
IDAC values are closely matched, even across temperature. The sum of both currents flows through a precision,
low-drift reference resistor, RREF. The voltage, Vref, generated across the reference resistor (as shown inEquation 19) is used as the ADC reference voltage. Equation 19 reduces to Equation 20 because IIDAC1 = IIDAC2.
Vref = (IIDAC1 + IIDAC2) · RREF
Vref = 2 · IIDAC1 · RREF

(19)
(20)

To simplify the following discussion, the individual lead resistance values of the RTD (RLEADx) are set to zero.
Only IDAC1 excites the RTD to produce a voltage (VRTD) proportional to the temperature-dependable RTD value
and the IDAC1 value, as shown in Equation 21.
VRTD = RRTD (at temperature) · IIDAC1(21)

The device internally amplifies the voltage across the RTD using the PGA and compares the resulting voltage
against the reference voltage to produce a digital output code proportional to Equation 22 through Equation 24:
Code ∝ VRTD · Gain / Vref
Code ∝ (RRTD (at temperature) · IIDAC1 · Gain) / (2 · IIDAC1 · RREF)
Code ∝ (RRTD (at temperature) · Gain) / (2 · RREF)

(22)
(23)
(24)

As can be seen from Equation 24, the output code only depends on the value of the RTD, the PGA gain, and thereference resistor (RREF), but not on the IDAC1 value. The absolute accuracy and temperature drift of theexcitation current therefore does not matter. However, because the value of the reference resistor directly affects
the measurement result, choosing a reference resistor with a very low temperature coefficient is important to limit
errors introduced by the temperature drift of RREF.
The second IDAC2 is used to compensate for errors introduced by the voltage drop across the lead resistance of
the RTD. All three leads of a 3-wire RTD typically have the same length and, thus, the same lead resistance.
Also, IDAC1 and IDAC2 have the same value. Taking the lead resistance into account, the differential voltage(VIN) across the ADC inputs, AIN0 and AIN1, is calculated using Equation 25:
VIN = IIDAC1 · (RRTD + RLEAD1) – IIDAC2 · RLEAD2(25)

When RLEAD1 = RLEAD2 and IIDAC1 = IIDAC2, Equation 25 reduces to Equation 26:
VIN = IIDAC1 · RRTD

(26)

In other words, the measurement error resulting from the voltage drop across the RTD lead resistance iscompensated, as long as the lead resistance values and the IDAC values are well matched.
A first-order differential and common-mode RC filter (RF1, RF2, CDIF1, CCM1, and CCM2) is placed on the ADC
inputs, as well as on the reference inputs (RF3, RF4, CDIF2, CCM3, and CCM4). The same guidelines for designing
the input filter apply as described in the Thermocouple Measurement section. For best performance, TI
recommends matching the corner frequencies of the input and reference filter. More detailed information onmatching the input and reference filter can be found in application report RTD Ratiometric Measurements andFiltering Using the ADS1148 and ADS1248 (SBAA201).
The reference resistor RREF not only serves to generate the reference voltage for the device, but also sets thecommon-mode voltage of the RTD to within the specified common-mode voltage range of the PGA.
When designing the circuit, care must also be taken to meet the compliance voltage requirement of the IDACs.
The IDACs require that the maximum voltage drop developed across the current path to AVSS be equal or lessthan AVDD – 0.9 V in order to operate accurately. This requirement means that Equation 27 must be met at all
times.
AVSS + IIDAC1 · (RLEAD1 + RRTD) + (IIDAC1 + IIDAC2) · (RLEAD3 + RREF) ≤ AVDD – 0.9 V(27)The device also offers the possibility to route the IDACs to the same inputs used for measurement. If the filter
resistor values RF1 and RF2 are small enough and well matched, IDAC1 can be routed to AIN1 and IDAC2 to
AIN0 in Figure 77. In this manner, even two 3-wire RTDs sharing the same reference resistor can be measured
with a single device.

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This design example discusses the implementation of a 3-wire Pt100 measurement to be used to measuretemperatures ranging from –200°C to +850°C as stated in Table 23. The excitation current for the Pt100 is
chosen as IIDAC1 = 500 µA, which means a combined current of 1 mA is flowing through the reference resistor,
RREF. As mentioned previously, besides creating the reference voltage for the ADS1220, the voltage across RREF
also sets the common-mode voltage for the RTD measurement. In general, choose the largest reference voltage
possible while still maintaining the compliance voltage of the IDACs as well as meeting the common-mode
voltage requirement of the PGA. TI recommends setting the common-mode voltage at or near half the analog
supply (in this case 3.3 V / 2 = 1.65 V), which in most cases satisfies the common-mode voltage requirements of
the PGA. The value for RREF is then calculated by Equation 28:
RREF = Vref / (IIDAC1 + IIDAC2) = 1.65 V / 1 mA = 1.65 kΩ

(28)

The stability of RREF is critical to achieve good measurement accuracy over temperature and time. Choosing areference resistor with a temperature coefficient of ±10 ppm/°C or better is advisable. If a 1.65 kΩ value is notreadily available, another value near 1.65 kΩ (such as 1.62 kΩ or 1.69 kΩ) can certainly be used as well.
As a last step, the PGA gain must be selected in order to match the maximum input signal to the FSR of the
ADC. The resistance of a Pt100 increases with temperature. Therefore, the maximum voltage to be measured(VIN(MAX)) occurs at the positive temperature extreme. At 850°C, a Pt100 has an equivalent resistance ofapproximately 391 Ω as per the NIST tables. The voltage across the Pt100 equates to Equation 29:
VIN (MAX) = VRTD (at 850°C) = RRTD (at 850°C) · IIDAC1 = 391 Ω · 500 µA = 195.5 mV(29)

The maximum gain that can be applied when using a 1.65-V reference is then calculated as (1.65 V / 195.5 mV)= 8.4. The next smaller PGA gain setting available in the ADS1220 is 8. At a gain of 8, the ADS1220 offers a
FSR value as described in Equation 30:
FSR = ±Vref / Gain = ±1.65 V / 8 = ±206.25 mV(30)This range allows for margin with respect to initial accuracy and drift of the IDACs and reference resistor.
After selecting the values for the IDACs, RREF, and PGA gain, make sure to double check that the settings meetthe common-mode voltage requirements of the PGA and the compliance voltage of the IDACs. To determine thetrue common-mode voltage at the ADC inputs (AIN0 and AIN1) the lead resistance must be taken into accountas well.
The smallest common-mode voltage occurs at the lowest measurement temperature (–200°C) with RLEADx = 0 Ω
and is calculated using Equation 31 and Equation 32.
VCM (MIN) = Vref + (IIDAC1 + IIDAC2) · RLEAD3 + IIDAC2 · RLEAD2 + ½ IIDAC1 · RRTD (at –200°C)
VCM (MIN) = 1.65 V + ½ 500 µA · 18.52 Ω = 1.655 V

(31)
(32)

Actually, assuming VCM (MIN) = Vref is a sufficient approximation.
VCM (MIN) must meet two requirements: Equation 15 requires VCM (MIN) to be larger than AVDD / 4 = 3.3 V / 4 =0.825 V and Equation 13 requires VCM (MIN) to meet Equation 33:
VCM (MIN) ≥ AVSS + 0.2 V + ½ Gain · VIN (MAX) = 0 V + 0.2 V + ( ½ · 8 · 195.5 mV) = 982 mV(33)

Both restrictions are satisfied in this design with a VCM (MIN) = 1.65 V.
The largest common-mode voltage occurs at the highest measurement temperature (850°C) and is calculatedusing Equation 34 and Equation 35.
VCM (MAX) = Vref + (IIDAC1 + IIDAC2) · RLEAD3 + IIDAC2 · RLEAD2 + ½ IIDAC1 · RRTD (at 850°C)
VCM (MAX) = 1.65 V + 1 mA · 15 Ω + 500 µA · 15 Ω + ½ 500 µA · 391 Ω = 1.77 V

(34)
(35)

VCM (MAX) does meet the requirement given by Equation 14, which in this design equates to Equation 36:
VCM (MAX) ≤ AVDD – 0.2 V – ½ Gain · VIN (MAX) = 3.3 V – 0.2 V – ( ½ · 8 · 195.5 mV) = 2.318 V(36)Finally, the maximum voltage that can occur on input AIN1 must be calculated to determine if the compliancevoltage (AVDD – 0.9 V = 3.3 V – 0.9 V = 2.4 V) of IDAC1 is met. Note that the voltage on input AIN0 is smaller
than the one on input AIN1. Equation 37 and Equation 38 show that the voltage on AIN1 is less than 2.4 V, evenwhen taking the worst-case lead resistance into account.
VAIN1 (MAX) = Vref + (IIDAC1 + IIDAC2) · RLEAD3 + IIDAC1 · (RRTD (at 850°C) + RLEAD1)
VAIN1 (MAX) = 1.65 V + 1 mA · 15 Ω + 500 µA · (391 Ω + 15 Ω) = 1.868 V

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The register settings for this design are shown in Table 24.
Table 24. Register Settings
REGISTERSETTING

00h

66h

AINP = AIN1, AINN = AIN0, gain = 8, PGA enabled

DESCRIPTION

01h

04h

DR = 20 SPS, normal mode, continuous conversion mode

02h

55h

External reference (REFP0, REFN0), simultaneous 50-Hz and 60-Hz
rejection, IDAC = 500 µA

03h

70h

IDAC1 = AIN2, IDAC2 = AIN3

9.2.2.2.1 Design Variations for 2-Wire and 4-Wire RTD Measurements

Implementing a 2- or 4-wire RTD measurement is very similar to the 3-wire RTD measurement illustrated in
Figure 77, except that only one IDAC is required.
Figure 78 shows a typical circuit implementation of a 2-wire RTD measurement. The main difference compared
to a 3-wire RTD measurement is with respect to the lead resistance compensation. The voltage drop across thelead resistors, RLEAD1 and RLEAD2, in this configuration is directly part of the measurement (as shown inEquation 39) because there is no means to compensate the lead resistance by use of the second current source.
Any compensation must be done by calibration.
VIN = IIDAC1 · (RLEAD1 + RRTD + RLEAD2)

(39)
RREF

IIDAC1

3.3 V

RF3
CCM3

0.1 PFRLEAD2RF2

2-Wire RTD

CCM2

10 A to1.5 mA

AVDD

AIN0

CDIF2

REFP0
Internal
Reference

3.3 V

RF4
CCM4

0.1 PF

REFN0

DVDD

Reference
MUX

TI Device

24-Bitû ADC

Digital Filter
and
SPI
Interface

CDIF1
RLEAD1

RF1

AIN1

CS

AINP
CCM1

MUX
AIN2

AIN3
(IDAC1)

PGA
AINN

SCLK
DIN
DOUT/DRDY
DRDY

Precision
Temperature
SensorAVSS

Low-Drift
Oscillator

CLK

DGND

Copyright © 2016, Texas Instruments Incorporated

Figure 78. 2-Wire RTD Measurement

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Figure 79 shows a typical circuit implementation of a 4-wire RTD measurement. Similar to the 2-wire RTD
measurement, only one IDAC is required for exciting and measuring a 4-wire RTD in a ratiometric manner. The
main benefit of using a 4-wire RTD is that the ADC inputs are connected to the RTD in the form of a Kelvinconnection. Apart from the input leakage currents of the ADC, there is no current flow through the lead resistors
RLEAD2 and RLEAD3 and therefore no voltage drop is created across them. The voltage at the ADC inputs
consequently equals the voltage across the RTD and the lead resistance is of no concern.
RREF

IIDAC1

3.3 V

RF3
CCM3

0.1 PF

10 A to1.5 mARLEAD4RLEAD3RF2

4-Wire RTD

AVDD

RF4

CDIF2

3.3 V

CCM4

REFP0

REFN0

0.1 PF

DVDD

CCM2
AIN0

Internal
Reference

Reference
MUX

TI Device

24-Bitû ADC

Digital Filter
and
SPI
Interface

CDIF1
RLEAD2

RF1

AIN1

CS

AINP
CCM1
MUX

RLEAD1AIN2AIN3(IDAC1)

PGA
AINN

SCLK
DIN
DOUT/DRDY
DRDY

Precision
Temperature
Sensor

Low-Drift
Oscillator

AVSS

CLK

DGND

Copyright © 2016, Texas Instruments Incorporated

Figure 79. 4-Wire RTD Measurement
Note that because only one IDAC is used and flows through the reference resistor, RREF, the transfer function ofa 2- and 4-wire RTD measurement differs compared to the one of a 3-wire RTD measurement by a factor of 2,
as shown in Equation 40.
Code ∝ (RRTD (at Temperature) · Gain) / RREF

(40)

In addition, the common-mode and reference voltage is reduced compared to the 3-wire RTD configuration.
Therefore, some further modifications may be required in case the 3-wire RTD design is used to measure 2- and4-wire RTDs as well. If the decreased common-mode voltage does not meet the VCM (MIN) requirements of the
PGA anymore, either increase the value of RREF by switching in a larger resistor or, alternatively, increase theexcitation current while decreasing the gain at the same time.

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9.2.2.3 Application Curves
Figure 80 and Figure 81 show the measurement results. The measurements are taken at TA = 25°C. A system
offset calibration is performed using a reference resistor of 100 Ω. No gain calibration is implemented. The data
in Figure 80 are taken using precision resistors instead of a 3-wire Pt100. The respective temperature
measurement error in Figure 81 is calculated from the data in Figure 80 using the NIST tables.

0.1

0.2

0.05

0.1

Measurement Error (°C)

Measurement Error (:)

The design meets the required temperature measurement accuracy given in Table 23. Note that themeasurement error shown in Figure 81 does not include the error of the RTD itself.

0

-0.05

-0.1
0

50

100

150
200
250
RTD Value (:)

300

350

400

0

-0.1

-0.2
-200

D003

Figure 80. Resistance Measurement Error vs RRTD

0

200
400
600
Temperature (°C)

800

1000
D004

Figure 81. Temperature Measurement Error vs T(RTD)

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9.2.3 Resistive Bridge Measurement
The device offers several features to ease the implementation of ratiometric bridge measurements (such as a
PGA with gains up to 128, buffered, differential reference inputs, and a low-side power switch).
5.0 V

3.3 V

0.1 PF

0.1 PF
REFP0

10 A to1.5 mA

5.0 V

AVDD

REFP1

RF2

REFN0
DVDD

Internal
Reference

Reference
MUX

TI Device

24-Bitû ADC

Digital Filter
and
SPI
Interface

CCM2
AIN1

CS

AINP
CDIF1

CDIF2

RF1

MUX
AIN2

PGA
AINN

SCLK
DIN
DOUT/DRDY
DRDY

CCM1
Precision
Temperature
SensorREFN1

Low-Drift
Oscillator

AVSS

CLK

DGND

Copyright © 2016, Texas Instruments Incorporated

Figure 82. Resistive Bridge Measurement
9.2.3.1 Design Requirements
Table 25. Design Requirements
DESIGN PARAMETER

VALUE

Analog supply voltage

5.0 V

Digital supply voltage

3.3 V

Load cell type4-wire load cell

Load cell maximum capacity

1 kg

Load cell sensitivity

3 mV/V

Excitation voltage

5V

Repeatability

50 mg

9.2.3.2 Detailed Design Procedure
To implement a ratiometric bridge measurement, the bridge excitation voltage is simultaneously used as thereference voltage for the ADC, as shown in Figure 82. With this configuration, any drift in excitation voltage also
shows up on the reference voltage, consequently canceling out drift error. Either of the two device reference
input pairs can be connected to the bridge excitation voltage. However, only the negative reference input(REFN1) can be internally routed to a low-side power switch. By connecting the low side of the bridge to REFN1,
the device can automatically power-down the bridge by opening the low-side power switch. When the PSW bit in
the configuration register is set to 1, the device opens the switch every time a POWERDOWN command isissued and closes the switch again when a START/SYNC command is sent.
The PGA offers gains up to 128, which helps amplify the small differential bridge output signal to make optimaluse of the ADC full-scale range. Using a symmetrical bridge with the excitation voltage equal to the supply
voltage of the device ensures that the output signal of the bridge meets the common-mode voltage requirementof the PGA.

58

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Note that the maximum input voltage of ADS1220 is limited to VIN (MAX) = ±[(AVDD – AVSS) – 0.4 V] / Gain,which means the entire full-scale range, FSR = ±(AVDD – AVSS) / Gain, cannot be used in this configuration.
This limitation is a result of the output drive capability of the PGA amplifiers (A1 and A2); see Figure 39. The
output of each amplifier must stay 200 mV away from the rails (AVDD and AVSS), otherwise the PGA becomes
nonlinear. Consequently, the maximum output swing of the PGA is limited to VOUT = ±[(AVDD – AVSS) – 0.4 V].
Using a 3-mV/V load cell with a 5-V excitation yields a maximum differential output voltage of VIN (MAX) = ±15 mV,
which meets Equation 41 when using a gain of 128.
VIN (MAX) ≤ ±[(AVDD – AVSS) – 0.4 V] / Gain = ±(5 V – 0.4 V) / 128 = ±36 mV(41)

A first-order differential and common-mode RC filter (RF1, RF2, CDIF1, CCM1, and CCM2) is placed on the ADC
inputs. The reference has an additional capacitor CDIF2 to limit reference noise. Care must be taken to maintain alimited amount of filtering or the measurement is no longer ratiometric.
To find the repeatability of the readings, perform the following calculation. The load cell produces an output
voltage of 15 mV at the maximum load of 1 kg. At a Gain = 128 and DR = 20 SPS the ADS1220 offers a noisefree resolution of 0.41 µVpp. The repeatability is then calculated as shown in Equation 42.
Repeatability = (1 kg / 15 mV) · 0.41 µV = 27 mg(42)

The register settings for this design are shown in Table 26.
Table 26. Register Settings
REGISTERSETTING00h

3Eh

AINP = AIN1, AINN = AIN2, gain = 128, PGA enabled

DESCRIPTION

01h

04h

DR = 20 SPS, normal mode, continuous conversion mode

02h

98h

External reference (REFP1, REFN1), simultaneous 50-Hz and 60-Hz
rejection, PSW = 1

03h

00h

No IDACs used

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10 Power Supply Recommendations
The device requires two power supplies: analog (AVDD, AVSS) and digital (DVDD, DGND). The analog power
supply can be bipolar (for example, AVDD = 2.5 V, AVSS = –2.5 V) or unipolar (for example, AVDD = 3.3 V,
AVSS = 0 V) and is independent of the digital power supply. The digital supply sets the digital I/O levels.

10.1 Power-Supply Sequencing
The power supplies can be sequenced in any order, but in no case must any analog or digital inputs exceed therespective analog or digital power-supply voltage and current limits. Ramping DVDD together with or before
AVDD minimizes any leakage current through AIN3/REFN1 because of the low-side switch connected to this
input. If AVDD ramps before DVDD, then the low-side switch is in an unknown state and can short the
AIN3/REFN1 input to AVSS until DVDD has ramped. Wait approximately 50 µs after all power supplies arestabilized before communicating with the device to allow the power-up reset process to complete.

10.2 Power-Supply Ramp Rate
For proper device power-up over the entire temperature range, the power-supply ramp rate must be monotonic
and slower than 1 V per 50 µs, as shown in Figure 83.
DVDD

1V

-50 s-

Figure 83. Power-Supply Ramp Rate

10.3 Power-Supply Decoupling
Good power-supply decoupling is important to achieve optimum performance. AVDD, AVSS (when using abipolar supply) and DVDD must be decoupled with at least a 0.1-µF capacitor, as shown in Figure 84 andFigure 85. Place the bypass capacitors as close to the power-supply pins of the device as possible using lowimpedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low
equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes.
For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting
the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers
the overall inductance and is beneficial for connections to ground planes. TI recommends connecting analog anddigital ground together as close to the device as possible.
1 SCLK

1 SCLKDIN 16

2 CS

DOUT/DRDY 15

3 CLK

DRDY 14

4 DGND

3.3 V

DOUT/DRDY 15

3 CLK

DRDY 14

4 DGND

DVDD 13

6 AIN3/REFN1AVDD 12
AIN0/REFP1 11

3.3 V

0.1 PFDVDD 13

5 AVSS-2.5 V
0.1 PF

0.1 PF

6 AIN3/REFN1AVDD 12
AIN0/REFP1 11

7 AIN2

AIN1 10

7 AIN2

AIN1 108 REFN0

REFP0 98 REFN0

REFP0 9Figure 84. Unipolar Analog Power Supply
60

3.3 V

DeviceDevice
5 AVSSDIN 16

2 CS

2.5 V

0.1 PF

0.1 PF

Figure 85. Bipolar Analog Power Supply

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11 Layout11.1 Layout Guidelines
TI recommends employing best design practices when laying out a printed circuit board (PCB) for both analog
and digital components. This recommendation generally means that the layout separates analog components[such as ADCs, amplifiers, references, digital-to-analog converters (DACs), and analog MUXs] from digitalcomponents [such as microcontrollers, complex programmable logic devices (CPLDs), field-programmable gatearrays (FPGAs), radio frequency (RF) transceivers, universal serial bus (USB) transceivers, and switchingregulators]. An example of good component placement is shown in Figure 86. Although Figure 86 provides agood example of component placement, the best placement for each application is unique to the geometries,
components, and PCB fabrication capabilities employed. That is, there is no single layout that is perfect for every
design and careful consideration must always be used when designing with any analog component.

Microcontroller

DeviceGround Fill or
Ground Plane

SupplyGeneration

Optional: Split
Ground Cut

SignalConditioning(RC Filters
andAmplifiers)

Ground Fill or
Ground Plane

Optional: Split
Ground Cut

Ground Fill or
Ground Plane

Interface
Transceiver

Connector
or Antenna
Ground Fill or
Ground Plane

Figure 86. System Component Placement
The use of split analog and digital ground planes is not necessary for improved noise performance (although forthermal isolation this option is a worthwhile consideration). However, the use of a solid ground plane or groundfill in PCB areas with no components is essential for optimum performance. If the system being used employs asplit digital and analog ground plane, TI generally recommends that the ground planes be connected together as
close to the device as possible. A two-layer board is possible using common grounds for both analog and digital
grounds. Additional layers can be added to simplify PCB trace routing. Ground fill may also reduce EMI and RFI
issues.
TI also strongly recommends that digital components, especially RF portions, be kept as far as practicallypossible from analog circuitry in a given system. Additionally, minimize the distance that digital control traces run
through analog areas and avoid placing these traces near sensitive analog components. Digital return currents
usually flow through a ground path that is as close to the digital path as possible. If a solid ground connection toa plane is not available, these currents may find paths back to the source that interfere with analog performance.
The implications that layout has on the temperature-sensing functions are much more significant than for ADC
functions.
Supply pins must be bypassed to ground with a low-ESR ceramic capacitor. The optimum placement of the
bypass capacitors is as close as possible to the supply pins. If AVSS is connected to a negative supply, thenconnect an additional bypass capacitor from AVSS to AGND as well. The ground-side connections of the bypass
capacitors must be low-impedance connections for optimum performance. The supply current flows through thebypass capacitor terminal first and then to the supply pin to make the bypassing most effective.
Analog inputs with differential connections must have a capacitor placed differentially across the inputs. Best
input combinations for differential measurements are AIN0, AIN1 and AIN2, AIN3. The differential capacitors
must be of high quality. The best ceramic chip capacitors are C0G (NPO), which have stable properties and low
noise characteristics. Thermally isolate a copper region around the thermocouple input connections to create athermally-stable cold junction. Obtaining acceptable performance with alternate layout schemes is possible aslong as the above guidelines are followed.

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Vias connect to either the bottom layer oran internal plane. The bottom layer orinternal plane are dedicated GND planes(GND = DGND = AVSS).

REFN0

REFP0

11.2 Layout Example

AIN1

AIN2

AIN0

AVDD

9: REFP0

8: REFN0

10: AIN1

7: AIN2

11: AIN0

6: AIN3

12: AVDD

5: AVSS

13: DVDD

4: DGND

14: DRDY

3: CLK

15: DOUT

2: CS

16: DIN

1: SCLK

AIN3

CS

SCLK

DIN

DOUT

DRDY

DVDD

Figure 87. Layout Example

62

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SBAS501C – MAY 2013 – REVISED AUGUST 201612 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:• REF50xx Low-Noise, Very Low Drift, Precision Voltage Reference (SBOS410)• RTD Ratiometric Measurements and Filtering Using the ADS1148 and ADS1248 (SBAA201)

12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that haschanged. For change details, review the revision history included in any revised document.

12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms ofUse.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools andcontact information for technical support.

12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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63PACKAGE OPTION ADDENDUM
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11-Jul-2024

PACKAGING INFORMATION
Orderable Device

Status(1)

Package Type Package Pins Package
Drawing
Qty

Eco Plan(2)

Lead finish/
Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking(3)

Samples

(4/5)

(6)

ADS1220IPW

ACTIVE

TSSOP

PW

16

90

RoHS & Green

NIPDAU

Level-2-260C-1 YEAR

-40 to 125

ADS1220

Samples

ADS1220IPWR

ACTIVE

TSSOP

PW

16

2500

RoHS & Green

NIPDAU

Level-2-260C-1 YEAR

-40 to 125

ADS1220

Samples

ADS1220IRVAR

ACTIVE

VQFN

RVA

16

3000

RoHS & Green

NIPDAU

Level-1-260C-UNLIM-40 to 125

1220

Samples

ADS1220IRVATACTIVE

VQFN

RVA

16

250

RoHS & Green

NIPDAU

Level-2-260C-1 YEAR

-40 to 125

1220

Samples(1)

The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to twolines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1

PACKAGE OPTION ADDENDUM
www.ti.com

11-Jul-2024

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION
www.ti.com

20-Apr-2023

TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSIONS
K0

P1

B0 W
Reel
DiameterCavity
A0
B0
K0
W
P1

A0

Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers

Reel Width (W1)QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes

Q1

Q2

Q1

Q2

Q3

Q4

Q3

Q4

User Direction of Feed

Pocket Quadrants*All dimensions are nominal

DevicePackage Package Pins
Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

ADS1220IPWR

TSSOP

PW

16

2500

330.0

12.4

6.9

5.6

1.6

8.0

12.0

Q1

ADS1220IRVAR

VQFN

RVA

16

3000

330.0

ADS1220IRVAT

VQFN

RVA

16

250

180.0

12.4

3.75

3.75

1.15

8.0

12.0

Q2

12.4

3.75

3.75

1.15

8.0

12.0

Q2

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION
www.ti.com

20-Apr-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)

W

L

H

*All dimensions are nominal

DevicePackage Type

Package Drawing

Pins

SPQ

Length (mm)Width (mm)Height (mm)

ADS1220IPWR

TSSOP

PW

16

2500

367.0

367.0

35.0

ADS1220IRVAR

VQFN

RVA

16

3000

346.0

346.0

33.0

ADS1220IRVAT

VQFN

RVA

16

250

210.0

185.0

35.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION
www.ti.com

20-Apr-2023

TUBE
T - TubeheightL - Tube length

W - Tubewidth

B - Alignment groove width*All dimensions are nominal

DevicePackage Name

Package Type

Pins

SPQ

L (mm)W (mm)

T (µm)B (mm)ADS1220IPW

PW

TSSOP

16

90

530

10.2

3600

3.5

Pack Materials-Page 3

PACKAGE OUTLINE

PW0016ATSSOP - 1.2 mm max height
SCALE 2.500

SMALL OUTLINE PACKAGESEATING
PLANE
C

6.6
TYP
6.2

A

0.1 C

PIN 1 INDEX AREA

14X 0.65
16

1

2X
5.1
4.9
NOTE 3

4.55

8
9
B

0.30
0.19
0.1
C A B

16X

4.5
4.3
NOTE 4

1.2 MAX(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05

0 -8

0.75
0.50

DETAIL A
A 20

TYPICAL
4220204/A 02/2017

NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.

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EXAMPLE BOARD LAYOUT

PW0016ATSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

SYMM

16X (1.5)(R0.05) TYP

1
16

16X (0.45)

SYMM

14X (0.65)

8

9

(5.8)

LAND PATTERN EXAMPLEEXPOSED METAL SHOWNSCALE: 10X

SOLDER MASKOPENINGMETAL UNDERSOLDER MASKMETALSOLDER MASKOPENINGEXPOSED METALEXPOSED METAL
0.05 MAXALL AROUNDNON-SOLDER MASKDEFINED(PREFERRED)

0.05 MIN
ALL AROUNDSOLDER MASKDEFINEDSOLDER MASK DETAILS
15.0004220204/A 02/2017

NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com

EXAMPLE STENCIL DESIGN

PW0016ATSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE

16X (1.5)

SYMM(R0.05) TYP

1
16X (0.45)

16

SYMM

14X (0.65)

8

9

(5.8)

SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCILSCALE: 10X

4220204/A 02/2017

NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

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