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AN52561/D
Image Sensor Handling andBest Practices
Application Note Abstract

This application note describes minimal methods forcustomers to incorporate in their handling, storing, andcleaning processes for image sensors.

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APPLICATION NOTEINTRODUCTION
Glossary of Terms and Definitions

Integrated circuits, including image sensor products are
sensitive to Electrostatic Discharge (ESD).
ESD events can cause immediate damage to a device sothat it is no longer functional. The effect may also not be
noticed until a considerable time has passed, with the unit
operating to specifications for some time. ESD events also
show up as shifts in device characteristics.
ESD events occur by improper handling of the image
sensor. Improper handling includes any operation thatcreates an electrostatic discharge; for example, handling thedevice without a wrist strap. Environmental conditions also
contribute to the likelihood of an ESD event.
The cost of an appropriate ESD control program is welloffset by the savings achieved in avoiding damaged devices(see References [1] and [2]).
This application note discusses minimum required
procedures to minimize the occurrence of an ESD event
when handling image sensors. Requirements listed in thisapplication note are based on IPC/JEDEC JESD625[3].
Image sensor customers should incorporate requirements ofthis Application Note along with IPC/JEDEC JESD625[3]and J−STD−001 into their ESD control systems.

For the purpose of this application note, the following
definitions apply:• Air Ionizer: A source of charged air molecules (ions).
• Antistatic Material: Refers to the property of material
that inhibits tribo-electric charging.
• Conductive Material: A material that has a surface
resistivity less than 105  per square or a volume
resistivity less than 104  centimeter.
• Electrostatic Discharge (ESD): The transfer ofelectrostatic charge between bodies or surfaces that areat different electrostatic potentials.
• Electrostatic Discharge Susceptibility [sensitivity](ESDS): The lowest level of ESD that produces changes
in device characteristics such that the device fails tomeet its specified characteristics.
• ESD-Protective Packaging: A packaging system thatprovides electrostatic protection and limits
tribo-electric charging to levels that do not result in
device damage.
• ESD-Protective Work-Surface: A table top or othersurface on which to work that has a resistance toground of less than 109 .
• Insulation Material: A material having a surface
resistivity of at least 1012  per square or volume
resistivity of at least 1011  centimeter.
• Static Dissipative Material: A material having a surface
resistance between 105  and 108  or a volume
resistivity between 105  centimeters and 108 
centimeters.
• Static Electricity: Electrical charge at rest.
The electrical charge is due to the transfer of electrons
within a body (polarization) or from one body toanother.

Disclaimer

ON Semiconductor is not responsible for damage caused
by improper handling or cleaning of the device after it isreceived by the customer.
RatingON Semiconductor CMOS image sensors, unless statedotherwise in the applicable device datasheet, are rated asfollows for ESD sensitivity according to the
ANSI/ESDA/JEDEC classification method::• Human Body Model: JS−001 Class_2• Charged Device Model: JS−002 Class C2A
NOTE: For CCD devices, unless a class rating is
specified, consider the product to meet Class 0A
for HBM, and Class C0A for CDM.

© Semiconductor Components Industries, LLC, 2016

June, 2019 − Rev. 11

1

Publication Order Number:
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AN52561/D
MINIMUM REQUIREMENTS FOR ESD PROTECTED AREAS, WORKSTATIONS, AND TOOLSThe following are the minimum requirements when
• Static generating sources and charged surfaces.
handling image sensors.
♦ Non-essential and personal items should not be
placed on ESD protective work surfaces that are in
ESD Protective Work Surface
use.
When unprotected ESD sensitive (ESDS) devices are♦ No item with an electrostatic potential greater thanhandled, a grounded static protective work surface with
±1000 volts should be closer than 12 inches froma resistance to ground of less than 107  should be used.
unprotected ESDS devices.
♦
Operations, equipment, or clothing generating
ESD Protective Flooring or Floor Mats
electrostatic potential greater than ±1000 volts
Grounded flooring or floor mats are only required when
within 12 inches of unprotected ESDS devices
personnel or mobile ESD protective workstations use floor
should be neutralized or reduced to less thangrounding methods.
±1,000 volts.
Personnel Grounding♦ Charged items must not contact ESDS devices.
Each person handling or within 12 inches of unprotected
Note that the above personnel grounding
ESDS devices, must be grounded using either of these:
recommendations are intended to protect ESDS devices and• Wrist straps:
not the personnel handling them. Safety of personnel is♦ Provide a continuous electrical path directly fromoutside the scope of this document and is not thethe user to ESD ground.
responsibility of ON Semiconductor.
♦ Have an integral resistance at the wrist band end that
limits current to less than 0.5 mA at the highest
ESD Protective Smocks
voltage level that an ESD may be encountered.
When ESD protective smocks are worn, they should cover♦ Be worn by operators handling unprotected ESDS
all personal garments above the waist, except at the neckdevices when seated.
area.
• ESD protective footwear (heel straps, toe straps, or
Air Ionizers
shoes). These should:
As part of customers’ image sensor ESD control systems,♦ Provide a direct continuous electrical path from theionizers
must be used at least as defined in this Application
user to the ESD protective flooring or floor mat.
Note.
♦ Be worn on both feet.
♦ Limit current to less than 0.5 mA through the
ESD Protected Area and Workstation Identification
specific path to ground at the highest power supply
ESD caution signs must be posted at each ESD protectedvoltage that may be encountered.
workstation or at the entrances of defined ESD protected♦ Not be relied upon for grounding of seatedareas.
personnel.
ESD PRECAUTIONS FOR DEVICE HANDLING♦ Avoid any contact of the solution with the sensor
Static charge preventive actions should be used at ESD
glass lid.
protected areas and workstations where electrostatic♦ Do not apply antistatic spray or solutions in any
potentials greater than ±1000 volts are measured andform to energized electrical parts, assemblies,
unprotected ESDS devices are within 12 inches of thepanels, or equipment.
charged sources.
♦ Do not apply antistatic solutions when devices andCharge prevention and neutralization methods include,
packages are directly exposed to spray mists.
but are not limited to, antistatic solution treatments, relative♦ The need for initial application and frequency ofhumidity control, air ionizers, sleeve protectors, and ESD
reapplication can only be established through routine
protective clothing.
electrostatic field measurements during normal• Antistatic Solution:
operations using an electrostatic field meter.
Antistatic chemicals (solutions) can be used to prevent• Relative Humidity Control:
static charge generation on static generating or charging
Relative humidity has a significant impact on thematerials in the work or storage areas. During
generation of static electricity and its control isapplication of any antistatic chemical, consider therequired, where image sensor devices are stored orfollowing:
handled using manual or automated means. At a
♦ Choose the antistatic solutions to avoid
minimum, customers are expected to follow humidity
contamination of ESDS devices.
control requirements as defined in J−STD−001.
Methods to Minimize Static Charging

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AN52561/D• Air Ionizers should conform to the following:♦ Ionizer charge decay performance should be verified

using the method described in EOS/ESD-S3.1
according to IPC/JEDEC JESD625[3].
• ESD Protective Smocks:
When worn, ESD protective smocks must accomplish
the following:♦ The ESD protective smocks must be buttoned(except for the collar) whenever the wearer is at an
ESD protected workstation or in a designated ESD
protected area.
♦ The ESD protective smock manufacturer’s cleaning
instructions should be followed to gain maximum
effectiveness and utility from the smocks.
• Gloves:
Only static dissipative Nitrile gloves must be used
when handling ESDS devices.

♦ Table ionizers should be positioned so that thedevices at the ESD-protected workstations arewithin the ionizer manufacturer’s specified coveragearea. The ionizer should be aimed at the devices andoperator’s hands rather than at the operator.
♦ Ceiling ionizers should be oriented in relation to thework surfaces in keeping with the ionizer
manufacturer’s instructions.
♦ Devices should not be brought closer to the ionizer
than specified by the ionizer manufacturer.
♦ There should be an unrestricted, straight line air
flow between the ionizers and the unprotected
devices.
♦ Ionizer balance (positive and negative ions) shouldbe verified according to IPC/JEDEC JESD625[3].

DEVICE HANDLING• Finger tips of the gloves should be tight to reduce theThis is a general guideline. Imaging sensors must be
handled in an ESD safe area. A ground strap is required
when handling the sensors in a non-ESD safe area. ESD safe
gloves must be used.
While handling imaging sensors:• Wear mouth protection (face mask) to minimize the riskof contaminating the glass lid through saliva or otherparticles.
• Wear gloves that are ESD safe. The gloves must be
clean. Contaminated or dirty gloves need to be changed
or cleaned.

risk of contaminating the glass lid.

• Always handle image sensors at the package; nevertouch the glass lids.
• Handle the pin grid package (PGA package) carefully
to avoid bending the pins.
Static charge can be generated during any assembly or test
process step. Ionizers should be used at each assembly or test
process step requiring manual or automated handling ofimage sensors to avoid any artifacts or damage resulting
from static charge.

COVER GLASS CLEANING
Purpose of Cleaning the Cover Glass

section of this document titled “ESD PROTECTION FOR
DEVICE HANDLING”. Always wear an ESD wrist strap.
Do not touch the cover glass with fingers or anything otherthan a cleaning paper as required in this section. Finger
grease can etch optical coatings and cause permanent
damage. The gloves should be static and powder free.
Gloves should be static dissipative Nitrile gloves.
Materials:• Clean compressed nitrogen• Ultra−clean DI water (4−6 megaohms/centimeters
deionized water that has been filtered)• High-grade IPA (solvent grade/100% pure lab purity
grade)• ESD protective Wipe:♦ For CCD sensors: Berkshire DurX 670♦ For CMOS sensors: Puritech Puritech S1091PRT or
RTMKC002• ESD protective gloves for example: Nitrile Glove,required Ansell 93−401/402 or NiProTect CC529

The packaging of image sensors requires high levels of
cleanliness. High quality glass windows are used instead of
typical ceramic or plastic encapsulation methods. In some
sensors, special coating is placed on the glass to control
spectral properties.
Special handling precautions are required to prevent
scratching, chipping, particulate or other contamination of
the glass and/or coatings.
In particular, electronic module assembly processes
involving image sensors can expose the sensor cover glass
to particles or contaminants. ON Semiconductor
recommends that all handling and assembly processes be
audited and modified to reduce the risk of exposure toparticles or contaminants. In the event that such exposure
cannot be completely eliminated, it may be necessary toclean the cover glass. The following are
ON Semiconductor’s recommendations for proper cleaningof the glass.
Procedure for Cleaning the Cover Glass

Perform the cleaning in an ESD safe protected
workstation including use of ionizers as described in the

Method A: Blow Off

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AN52561/D
ethanol is required as the cleaning agent for CCD image
sensor cover glass.

This method is applicable for loose particle
contamination. This is the only method that guarantees noresidues such as drying spots.
• Remove particles from the glass by blowing with an
ionized-N2 gun.
• Do not blow towards the other parts. If you work undera flow box, try to blow out of the box.

Caution on Cleaning Agents• Use high-grade IPA only to clean the image sensor lid

glass. Other solvents can contaminate the glass, attack
the resin and sealant, and degrade reliability of the
package.
• Do not use acetone because it attacks the resin thatglues the cover glass to the package.
• Do not use methanol due to its toxicity and low quality
cleaning properties.
• Do not use sodium hydroxide (NaOh) because it
degrades the AR coating on the glass.
• Do not use highly alkaline (pH > 8) cleaningchemistries.
• Do not use any solvents commonly used in paintstrippers: toluene, benzene, methyl-ethyl ketones, ester
solvents, acetone or methyl chloride, freons, terpens,anionic surfactants and multi−hydroxyl ethers.

Method B: High-Grade IPA Clean or Ultra−Clean DI Water• Apply cleaning solvent using a separate lab−warequality polypropylene squeeze bottle (Nalgene tradename), not the original bottle• Use a lint free wipe in one direction, with even pressure
across the glass surface.
• Never wipe the cover glass with a dry cloth. The
cleaning solvent should be applied directly to thecleaning wipe and never directly on the cover glass.
• The ESD protective wipe should not be saturated, only
dampened with the cleaning agent.
• After each wipe, either start with a fresh wipe or fold
the wipe to provide a fresh surface for glass cleaning

If the surface is not clean, repeat these procedures. If thecontaminant is not removed in two or three wipes, it ispossible that the cover glass is permanently damaged.
Inspect the device in optical microscope for permanent
damage.

Note: High grade IPA or ultra-clean DI water are
acceptable for cleaning both plain glass and AR coatedglass.
Note: Method A and B are acceptable methods to clean
the CCD image sensor cover glass with the following
exception. DI Water or IPA is not recommended forcleaning the CCD image sensor cover glass. Instead, 100%

CAUTION:ON Semiconductor recommends customers
evaluate cleaning process to ensure that nodamage to the image sensor component occurs.

SENSOR MOUNTING AND SOLDERING CONSIDERATIONS• The soldering period for each pin should be less than

Mounting for SMD• Image sensors require special considerations whenthree seconds.

soldering to printed circuit boards. Image sensors withcolor filter arrays (CFA) and micro-lens are especiallysensitive to high temperatures. Prolonged heating atelevated temperatures may result in deterioration of theperformance of the sensor.
• The cover glass, with or without coatings, is sensitive tocontamination. Avoid spilling solder flux on the coverglass and particularly glass with coatings. Avoid
mechanical or particulate damage to the cover glass.

Wave Soldering
Preferably, place image sensors in a PGA package ina socket, where the socket, and not the image sensor, issubjected to the mounting reflow procedures such as IR,
convection, or wave soldering.
CAUTION:• Do not place the image sensor in the socket during thereflow process.
• Do not mount PGA packages using IR or convection
solder reflow. Wave soldering is preferable formounting PGA packages, if a socket is not used.

Pin Grid Array − PGA

Hand Soldering
When a soldering iron is used to solder devices toa through-hole board, the following conditions should be
followed:• Use a soldering iron with temperature controlled tip(30−80 W).
• The soldering iron tip temperature should not exceed
350°C.

CSP (BGA) Handling

For Chip Scale Packaging assembly process, follow
J−STD 020 [6] and JEDEC/IPC J−STD−033 [7] to prevent
failure. For more information about mounting andsoldering, refer to ON Semiconductor’s number [9].

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4AN52561/D
Solder Paste and Flux

the other electronic components on the same board. The
package thickness and volume can affect the reflow
profile requirement. Refer to the package dimensions on
the product datasheet and the JEDEC Standard
J−STD−020−01[6].
Image Sensors parts may be moisture sensitive; use proper
handling and baking techniques according to the moisturesensitivity classification IPC/JEDEC J−STD−033[7].

Solder Paste should be compatible with the BGA’s solder.
For details refer to applicable device datasheet. The flux
type should be no-clean and Halide-free (no corrosive
residue is allowed).
Reflow Profile

In general, reflow profile considerations rely upon PCB
material, solder paste manufacturer recommendations and

GLASS PROTECTIVE FILM
sensors. The actual size and shape of the protective film
varies by device and package type. Refer to the applicabledevice datasheet for configuration details by product.

ON Semiconductor assembles and tests image sensors ina clean room environment. Customer manufacturing
processes can generate contamination and are often not
performed in a clean room environment. Glasscontamination or damage compromises the quality andfunctionality of the image sensors. For added cover glass
protection, ON Semiconductor offers an optional protective
film on select image sensor devices.
Currently, ON Semiconductor uses two different
protective films for this purpose. The first, used on devices
with part numbers beginning with “A”, “M”, or “N”, canwithstand standard surface mount technology (SMT) reflow
at a maximum temperature of 260°C. They are qualified
according JEDEC J−STD−020−01[6] reflow standards with
3× reflow test with no adverse material issues. The second,
used on part numbers beginning with “K”, cannot withstandhigh temperatures and is not intended for soldering usinga reflow process. Neither of these protective films are
qualified for any aqueous or chemical wash steps.
In all cases, the protective film at a minimum covers theglass directly above the active array of packaged image

Required Removal Procedure

For all devices, the protective film should be removedprior to testing of the final product, as the film may impact
optical test results if present. Removal of the protective film
must be performed using standard ESD precautions in
a controlled humidity environment. Use of ionization fans
focused on the device during tape removal is required to
avoid creating a charge that could impair the performance ofthe sensor. It is required to peel the protective film withtweezers in a smooth steady motion, in a parallel direction
to its placement on the glass, with no twisting, and with theionized air aimed directly at the newly exposed tape/glass
interface, as shown below.
Since the protective film could potentially adhere to othersurfaces, it should be disposed of immediately after
removal. Protective film should not be reapplied to thesensor.

Peel Direction

IonizedAir
Flow

Figure 1. Glass Protective Film

ON Semiconductor does not guarantee that the protective
film adhesive will not leave a residue on the glass after
removal. In the event that some residue remains, the glasscan be cleaned per the required process described in thesection “Cover Glass Cleaning”.

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STORING UNMOUNTED IMAGE SENSORS
Short-Term Storage

Long-term storage, if done improperly, may cause theleads/pins to oxidize or corrode, which may affect thelead/pin solderability. When devices are stored for time
periods in excess of one year, the lead/pin solderability
should be confirmed prior to use. Additionally, the electricalcharacteristics should be confirmed, as necessary, prior touse.

Unsealed devices should always be stored under the
long-term conditions. Assembled devices with sealed coverglass should always be stored in their 1st-level packaging
which is a moisture proof, vacuum-sealed, anti-static bag(Moisture Barrier Bag − MBB). The sensors in their 1st-levelpackaging should be stored indoors, in a dust-free, enclosed
environment with the following conditions:
Description

Dry Pack Description

Dry pack consists of a desiccant and a Humidity Indicator
Card (HIC), sealed inside a Moisture Barrier Bag (MBB)
and a barcode label. The MBB provides ESD protection andhas the required mechanical strength and flexibility, ispuncture-resistant and heat-sealable. The desiccant packed
in each bag will keep the internal relative humidity level
below 10% at 25°C. The Humidity Indicator Card provides
the customer with a simple and efficient means to verify theinternal humidity.

Condition

Time Limit< 1 YearTemperature

20°C to 40°C

Relative Humidity< 60%

CAUTION: Avoid storage locations with the following
characteristics:
Description

Condition

Direct Sunlight

Carriers (tubes, trays, or single unit
carriers) may deform or color filter
arrays may fade.

Corrosive Gases

Leads/pins may oxidize or corrode.

Excessive Loads

Devices may be damaged if heavy
objects are stacked on packing boxes.

Radiation

Imaging defects may be induced.

Electromagnetic Fields

Imaging defects may be induced.

Static Electricity

Storage Requirements and Time Limits out of Dry
Pack

The MSL at which each product is classified determines
the appropriate packaging storage and handlingrequirements when the product is out of dry pack . Refer
to JEDEC standard IPC/JEDEC J−STD−033[7],IPC−610[8] for the packaging, storage conditions andfloor life before the assembly process. Non-SMD
packages, such as PGA, JLCC, are not recommended forreflow and hence non-SMD products do not have anassigned MSL level. Nevertheless, storage requirements
as are applicable for these packages and the recommended
floor life is 168 hrs. If the floor life is exceeded, theaffected product must undergo bake prior to any reflow
process.
CAUTION: During the ramp down of the bake out process,it is required that the ramp down
rate is gradual to prevent condensation on theunderside of the glass lid.

Device may suffer catastrophic
damage. If devices are stored in open
trays, full ESD protection must be
used to avoid damage when handlingthe devices.

Long-Term Storage

Assembled devices stored for longer than one year are
considered to be in long-term storage. When long-term
storage is anticipated, the devices in carriers should beplaced into moisture proof, vacuum-sealed, anti-static bags
or in an electrostatically safe, moisture proof enclosure toprevent device degradation of the electrical characteristics
and/or deterioration of the leads/pins. Ideally, this would
include a dry nitrogen flow. The moisture proof
package/enclosure should be stored indoors, in a dust-free,
enclosed environment with the following conditions:
Description

Condition

Time Limit

1 to 5 Years

Temperature

20°C to 40°C

Relative Humidity< 60%

The storage avoidance characteristics noted above under
Short-Term Storage also apply to Long-Term Storage.

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AN52561/D
SAFE STORAGE REQUIREMENTS
CAUTION: Image sensors (surface mounted orotherwise) with a cavity will gather water vapor if placedin a high water vapor pressure environment. The
environment can be a high relative humidity and/or
temperature for an extended period. Baking the image
sensor for an extended period may remove the previously
gathered water vapor from the cavity. ON Semiconductor
recommends preventing the ingress of water vapor bystoring the image sensor in one of the three methods
mentioned above.

Moisture Absorption

If the customer cannot mount the product within thespecified time limit, or factory conditions exceed thespecified maximum temperature and/or humidity level, thenthe customer can abate moisture absorption by following
any of the safe storage methods to maintain the floor life:
Dry Pack: The calculated shelf life for dry packed SMD
packages while in a MBB, when stored in an environment
maintained at < 40°C/ 90% RH is a minimum of 12 months.
Dry Cabinet at 10% RH: Integrated circuits not sealed
in a MBB may be placed in a dry atmosphere cabinet
maintained at ≤10% RH up to a maximum time specified in
IPC/JEDEC J−STD−033[7]. If the time limit is exceeded,bake is required to restore the floor life.
Dry Cabinet at 5% RH: Integrated circuits not sealed ina MBB may be placed in a dry atmosphere cabinet
maintained at ≤5% RH for an unlimited shelf life equivalent
to storage in a MBB.

Solderability Degradation

If the customer cannot mount the product within 24
months after the assembly date, ON Semiconductor
recommends performing a solderability test in order tocheck for lead condition (discoloration, etc.) prior tomounting the product.
The customer can abate solderability degradation bystoring the product in a nitrogen environment.

DRYING PROCEDURES AND REQUIREMENTS
Product that are not handled or stored within requiredconditions must undergo bake for drying prior to reflow toreset floor life. Re-sealing in an MBB with a desiccant isrequired if product is not used after bake.

Refer to JEDEC standard IPC/JEDEC J−STD−033[7],IPC−610[8] for the bake conditions.

REFERENCES[5] IPC-7095L: Chapter 6: Printed Circuit assembly
design considerations and Chapter 7: Assembly of
BGA on printed circuit boards.
[6] Reference: JSTD020−01 Jedec Standard for
Moisture/Reflow Classification.
[7] IPC/JEDEC J-STD-033 Handling, packing,Shipping, and Use of Moisture/Reflow Sensitive
Surface Mount Devices.
[8] IPC−610: Acceptability of electrical assemblies.
[9] SOLDERM/D: ON Semiconductor’s Soldering andMounting Techniques Reference Manual.

[1] Enhancing Profits With Effective ESD Control by
Stephen Halperin, in collaboration with Ron Gibson
Dec 1, 2004, Conformity
http://www.conformity.com/artman/publish/printer_
107.shtml[2] White paper: A Case for Lowering Component Level
HBM/MM ESD Specifications and Requirements.
[3] IPC/JEDEC JESD625 Requirements for handlingelectrostatic discharge sensitive (ESDS) devices.
[4] IPC/JEDEC Standard No. 22−C101.01.

ON Semiconductor andare trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are notdesigned, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, andexpenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if suchclaim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.

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