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SPECIFICATION FOR APPROVAL
1/8W 0816 LOW RESISTNACE CHIP RESISTOR
1. Scope
This specification applies to 0.8mm x 1.60mm size 1/8W, fixed metal film chip resistors rectangulartype for use in electronic equipment.
2. Type Designation
RL0816□ −(1)Where□□□
(2)

□(3)

(1) Series No :refer to paragraph 4-1
RL0816T or RL0816S(2) Resistance value: refer to paragraph 4-1
For example—
Three digits of number ( 0.1 ≤ R)
R10 = 0.1Ω
1R0 = 1.0ΩFour digits of number（R < 0.1Ω）
R022 = 0.022Ω(3) Resistance tolerance:
F = ± 1%G = ± 2%

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SPECIFICATION FOR APPROVAL
3. Construction and Physical Dimensions
L
aDimensions (mm)aCodeLetter

Single sideStructureL

1.60 ± 0.10

1.60 ± 0.10

W

0.80 ± 0.10

0.80 ± 0.10

t0.50 ± 0.10

0.45 ± 0.10

a0.20 ± 0.15

0.20 ± 0.15

b0.20 ± 0.15

0.20 ± 0.15

Double sidesStructureWtbb

Figure 1-1. Double sides structure (≤ 0.091Ω )a③ Protective coat
④ Substratemass : 2mg (ref.)

aW

tb

Note :① Resistive clement② Electrodeb

Figure 1-2. Single side structure ( > 0.091Ω )Nickel alloy film
plating
Sn 100% ( Lead free)
Epoxy Resin coating
Alumina ceramic

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SPECIFICATION FOR APPROVAL
4. Ratings
4-1 Specification
Power Rating*

1/8 W

Series No.
Resistance Value

RL0816T

RL0816S

0.015Ω, 0.020Ω ~ 0.091Ω

0.1Ω ~ 6.8Ω

± 1%(F) , ± 2%(G)Resistance Tolerance

Note*:
Power Rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistors operated at ambient temperature in excess of 70℃, the maximum load shall bederated in accordance with the following curve.
%Rateddissipation
ratio

100
50
0-55

70125

Ambient temperature
Figure 2

Derating Curve

4-2 Rated Voltage
The rated voltage shall be determined by the following expression.
V = P×R

Where V：Rated voltage (V)R：Nominal resistance value (Ω)
P：Rated dissipation (W)4-3 Operating and Storage Temperature Range-55 to +125℃℃

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SPECIFICATION FOR APPROVAL
5. Characteristics
5-1 Electrical
5-1-1 Resistance and tolerance
Resistance value shall be within the tolerance specified in paragraph 4-1
Refer to IEC 60115-1 Sub-clause 4.5.
5-1-2 Temperature Coefficient of ResistanceNot exceed the temperature coefficient of resistance specified in paragraph 4-1
Room temperature → Room temperature + 100℃
Refer to IEC 60115-1 Sub-clause 4.13.
5-1-3 Short Time Overload
Resistance Change : ± (0.5%)
Without significant damage by flashover (spark ,arching),burning or breakdown etc.
Test voltage : 2.5 times the rated voltage.
Duration : 5 seconds
Refer to IEC 60115-1 Sub-clause 4.13.
5-1-4 Insulation Resistance(1) Between Electrode and Protection Film
100MΩ or over(2) Between Electrode and Substrate
1,000MΩ or over
The resistor shall be cramped in the metal block and tested , as shown below.
Test voltage : 100 ± 15VDC for 1 minute
Refer to IEC 60115-1 Sub-clause 4.6.
Pressure Rod(Metal)

Insulation PlateSpring

Measurement Point A(R0.25mm ~ R0.5mm)

Sample Electrode

SubstrateA

Over coat Film

BVoltage Supply
Metal Block
Measurement Point B

Substrate SideDOCUMENT: RLI00000N

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SPECIFICATION FOR APPROVAL
5-1-5 Voltage Proof
Resistance Change : ± (0.5%)
Without damage by flashover, fire or breakdown, as shown below.
The resistor shall be tested as shown in paragraph 4-1-4
The voltage : 100VAC (rms.) for 1 minute
Refer to IEC 60115-1 Sub-clause 4.7.
5-2 Mechanical5-2-1 Terminal Strength
Resistance Change : ± (0.5%)
Without mechanical damage such as breaks.
Electrical characteristics shall be satisfied.
If there are electrodes on both surfaces, it shall satisfy the above specifications on whicheversurface may be fixated.
Bending Amplitude : 3 mm 30 seconds
Refer to IEC 60115-1 Sub-clause 4.33.
50
Pressure

20

Amplitude
3 mmPress Jig
R230

Refer to EIAJ RC-2530

Test PC Board
SampleSolderSupports

45

Within ± 2mm

45Unit : mm

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SPECIFICATION FOR APPROVAL
5-2-2 Body StrengthResistance Change : ± (0.5%)
Without mechanical damage such as breaks.
A load of 10N using a R0.5 pressure rod shall be applied to the center in the direction ofthe arrow and held for 10 ± 1 seconds.
Pressure rod

R0.5Resistor
1/2LLUnit : mm

5-2-3 Solderability
A new uniform coating of solder shall cover minimum of 95% of the surface being immersed.
Temperature of solder : 245 ± 5℃
Immersion duration : 2 ± 0.5 seconds
Refer to IEC 60115-1 Sub-clause 4.17.
5-2-4 Resistance to Soldering Heat
Resistance Change : ± (0.5%)
Electrical characteristics shall be satisfied.
Without distinct deformation in appearance.
(1) Solder bath method
Pre-heat : 100 to 110℃
30 seconds
Temperature : 270 ± 5℃
10 ± 1seconds(2) Reflow Soldering method
Peak temperature : 260 ± 5℃
10 seconds or lessTemperature : 220 ± 5℃
60 seconds max.
The heating apparatus shall be the upper-heated oven and temperature shall be
the board surface temperature.
(3) Soldering iron method
Bit temperature : 350 ± 5℃
3 ± 1/0 seconds
The resistor shall be stored at standard atmospheric conditions for 1 hour, after
which the measurements shall be made.
Refer to IEC 60115-1 Sub-clause 4.18.

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SPECIFICATION FOR APPROVAL
5-2-5 Resistance to Solvent
Without mechanical damage and distinct damage in appearance.
Immersion cleaning
At normal temperature 300 seconds in Isopropyl Alcohol.
Refer to IEC 60115-1 Sub-clause 4.29.
5-3 Endurance
5-3-1 Rapid Change of Temperature
Resistance Change : ± (0.5%)
Without distinct damage
Resistance shall be subjected to 5 cycles of the temperature cycle as following :-55 ± 3℃, 30 minutes→ room temperature, 2 ~ 3 minutes→ +125 ± 2℃, 30 minutes → room temperature, 2 ~ 3 minutes
Refer to IEC 60115-1 Sub-clause 4.19.
5-3-2 Dump Heat with Load
Resistance Change : ± (1.0%)
Without distinct damage
60 ± 2℃ with relative humidity of 90 to 95%
DC rated voltage for 1.5 hours on 0.5 hour off
1,000 + 48 / - 0 hours
5-3-3 Endurance at 70℃
Resistance Change : ± (1.0%)
Without distinct damage
70 ± 2℃
DC rated voltage for 1.5 hours on 0.5 hour off
1,000 + 48 / -0 hours
Refer to IEC 60115-1 Sub-clause 4.25.

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SPECIFICATION FOR APPROVAL
Mounting of the test sample onto the test board shall be either of following methods.
(1) Mounting by solder dipping
Epoxy based glue shall be applied in the middle of two lands of the test board. Theresistor shall be mounted in such a way that the electrodes of resistors will be evenly
placed in the land area and then adhesive resin shall be cured. After applying the Resin
Flux with 25 weight % Methyl Alcohol, the board shall be soldered by dipping into a
molten solder bath with 260 ± 5℃ for 3 to 5 seconds(2) Mounting by Reflow soldering
Solder paste with approximate 200µm thickness shall be applied to the land of test board.
The resistor shall be mounted in such way that the electrodes of resistors will be evenly
placed in the land area and then shall be soldered under the circumstance that the surface
temperature of the board shall be raised 245 ± 5℃(peak temperature) for 5 to 10 seconds
in an upper-heater oven.

Test Board
Material : Glass Fabric Epoxy Resin (Refer to JIS C 6484)
Board thickness : 1.6mm
Copper foil thickness : 0.035mm(1) Test board A
Solder resistbLand40c4.5fa100

Unit : mmabcf

1.0

3.0

1.2(2.0)

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SPECIFICATION FOR APPROVAL(2) Test board B ( For another test )

27.0

18.5
8.5

5.3

6.94

1.00
4.00

2.4
0.40

4.46

5.08

1.32
(5.08x9=45.72)

1.2258.5

Unit : mm

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6. Packaging
6-1 Dimensions
6-1-1 Tape packaging dimensions+-1.5 0.1
0.0

0.6 ± 0.05

4.0 ± 0.1

Sprocket hole

2.0 ± 0.05A

3.5 ± 0.05

B

0.65 ± 0.1

1.75 ± 0.1

8.0 ± 0.3
4.0 ± 0.1

Carries cavity

Pull Direction※Pre.emptied holes：75 holes (or 30cm) or more
Code Letter

ABDimension

1.1 ± 0.1

1.9 ± 0.1

6-1-2 Reel Dimensions

Unit : mm

SPECIFICATION FOR APPROVAL
6-2 Peel force of top cover tape
The peel speed shall be about 300 mm/min.
The peel force of top cover tape shall be between 0.1 to 0.7 N.
Top Cover Tape

165 ~ 180°0.1~0.7 N

6-3 Numbers of taping
5,000 pieces/reel
6-4 Label marking
The following items shall be marked on single of the reel.
(1) Type designation .
(2) Quantity(3) Manufacturing date code(4) Manufacturer’s name(5) The country of origin(6) Shipping number(7) Identification showing lead free products.
6-5 Note
Manufactured by our joint company. ( Susumu Co., Ltd. )DOCUMENT: RLI00000N

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