No.:
Date:

RCC-K-HTS-0001
2023. 1. 5

/8

Data sheet
Title:FIXED THICK FILM CHIP RESISTORS;RECTANGULAR TYPE ANDLOW OHM

Style:

RCC10,16,20,32

RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Note: ・Stock conditions
Temperature: +5C  +35C
Relative humidity: 25%  75%
The period of guarantee: Within 2 year from shipmen t by the company.
Solderability shall be satisfied.

・Product specification contained in this data sheet are subject to change at any
time without notice・If you have any questions or a Purchasing Specification for any quality
agreement is necessary, please contact our sales staff.

Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 1/13

Title:

1. Scope
1.1 This data sheet covers the detail requirements for fixed thick film chip resistors; rectangular type and low ohm, style of
RCC10,16,20,32.
1.2 Applicable documents
JIS C 5201−1: 2011, JIS C 5201−8: 2014, JIS C 5201−8−1: 2014
IEC60115−1: 2008, IEC60115−8: 2009, IEC60115−8−1: 2014
EIAJ RC−2144C−2010

2. Classification
Type designation shall be the following form.
(Example)

RCC
1

20
2

R043
3

J
4

TP
5

Style
1 Fixed thick film chip resistors; rectangular type and low ohm
Style
2 Size3 Rated resistance Rated resistance and symbol shall be in accordance with Sub-clause 3.2.
4 Tolerance on rated resistance
F
1%
J
5%
5 Packaging form
B
Bulk (loose package)
TH
Paper taping
TP

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Title:

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 2/13

3. Rating
3.1 The ratings shall be in accordance with Table−1.
Style

Rated
dissipation (W)Rated current
range (A)

RCC10

0.125

1.112.5

RCC16

0.25

1.585.0

RCC20

0.33

1.815.74

RCC32

0.5

2.235.0

Style

Insulation voltage
(V)

RCC10
RCC16
RCC20
RCC32

Table−1
Temperature coefficient ofresistance (10–6/ °C)
150
0+3500~+800150
0+2500+350100
150
0+250100
0+250

Rated resistance
range()0.0510.1
0.0250.05
0.02~0.024
0.0510.1
0.0330.05
0.010.03
0.0510.1
0.030.05
0.010.027
0.0360.1
0.020.033

Tolerance on rated
resistanceF(±1%), J(±5%)

F(±1%), J(±5%)

F(±1%), J(±5%)

F(±1%), J(±5%)

Category temperature
range (°C)

100-55~+155500

3.2 Rated resistance
The rated resistance shall be in accordance with Table−2
Table−2
Rated resistance
Rated resistance
SymbolMarking symbol [m]
SymbolMarking symbol
[m]
10
R010
010
39
R039
039
15
R015
015
40
R040
040
20
R020
020
43
R043
043
22
R022
022
47
R047
047
24
R024
024
50
R050
050
25
R025
025
51
R051
051
27
R027
027
56
R056
056
30
R030
030
60
R060
060
33
R033
033
62
R062
062
36
R036
036
65
R065
065
3.3 Climatic category
55/155/56

Lower category temperature
Upper category temperature
Duration of the damp heat, steady state test

[m]
68
70
75
80
82
90
91
100

Rated resistance
SymbolMarking symbol
R068
068
R070
070
R075
075
R080
080
R082
082
R090
90
R091
091
R100
R10

−55 °C+155 °C
56days

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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.5

Title:

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 3/13

3.4 Stability class5%

Limits for change of resistance:−for long−term tests
5%−for short−term tests
1%

3.5 Derating
The derated values of dissipation at temperature in excess of 70 °C shall be as indicated by the following curve.
100
Percentageof the rated
dissipation(%)

Area of recommended
operation
0
−55

155

70

Ambient temperature (°C)

Figure−1 Derating curve
3.6 Rated voltage
d.c. or a.c. r.m.s. voltage calculated from the square root of the product of the rated resistance and the rated dissipation.
E: Rated voltage (V)
E =
P · R
P: Rated dissipation (W)R: Rated resistance ()3.7 Rated current
The rated current calculated from the square root of the quotient of the rated resistance and the rated dissipation.
I: Rated current (A)
I =
P / R
P: Rated dissipation (W)R: Rated resistance ()The rated current shall be corresponding to rated voltage.

4. Packaging form
The standard packaging form shall be in accordance with Table−3.
Table−3
SymbolB
TH
TP

Packaging form
Bulk (loose package)
Paper taping
Paper taping

8mm width, 2mm pitches
8mm width, 4mm pitches

Standard packaging
quantity / units
1,000 pcs.
10,000 pcs.
5,000 pcs.

Application
RCC10,16,20,32
RCC10
RCC16, 20, 32

Product specification contained in this data sheet are subject to change at any time without notice.
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Title:

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 4/13

5. Dimensions
5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−2 and Table−4.

LW

The upper surface

c

d

d

H

c

The lower side

Style
RCC10
RCC16
RCC20
RCC32

Rated resistance range
All resistance range
20mR
R20m
20mR
R20m
All resistance range

Figure−2
Table−4LW
1.0±0.05
0.5±0.05

H
0.35 +0.05-0.10

c0.25 +0.05-0.10

1.60.1

0.8 +0.15-0.05

0.50.1

0.30.1

2.00.15

1.250.10

0.60.1

0.40.2

3.10.2

1.60.15

0.60.1

0.50.25

Unit: mmd0.25 +0.05-0.10
0.30.1
0.550.10
0.40.2
0.60.2
0.50.25

5.2 Net weight (Reference)
Style
Net weight (mg)
RCC10
0.6
RCC16
2
RCC20
5
RCC32
9
6. Marking
The rated resistance of marking symbol of Sub−clause 3.2 shall be marked on substrate side.
The Rated resistance of RCC10 and RCC16 should not be marked.
(Example) “050” → 0.05 [] → 50m (Application: 10m→91m)“90” → 0.09 [] → 90m (Application: 90m only)“R10” → 0.1 [] → 100m (Application: 100m or above

Product specification contained in this data sheet are subject to change at any time without notice.
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Title:

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 5/13

7. Performance
7.1 The standard condition for tests shall be in accordance with Sub−clause 4.2, JIS C 5201−1: 2011.
7.2 The performance shall be satisfied in Table−5.
Table− 5(1)No.
Test items
Performance requirements
Condition of test (JIS C 5201−1)
1
Visual examination
As in 4.4.1
Sub−clause 4.4.1
The marking shall be legible, as
Checked by visual examination.
checked by visual examination.
2
Dimension
Sub−clause 4.4.2
As specified in Table−4 of thisspecification.
Resistance
As in 4.5.2
Sub−clause 4.5
The resistance value shall correspondMeasurement current: 1(A)
Note:
The
measuringapparatus with the rated resistance taking into
corresponding to DC Low−ohm Mater account the specified tolerance.
(1A)of
AX−1152DforADEX
CORPORATION.
3
Voltage proof
No breakdown or flash overSub−clause 4.7
Method: 4.6.1.4(See Figure−5)
Test voltage: Alternating voltage with a peakvalue of 1.42 times the insulation voltage.
Duration: 60 s±5 s
R  1 G
Insulation resistance
Test voltage: Insulation voltage
Duration: 1 min.
4
Solderability
As in 4.17.4.5
Sub−clause 4.17
The terminations shall be covered with
Without aging
Flux: The resistors shall be immersed in a a smooth and bright solder coating.
non−activated soldering flux for 2 s.
Bath temperature: 235 °C±5 °C
Immersion time: 2 s±0.5 s
5Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Overload
Sub−clause 4.13
(in the mounted state)
The applied voltage shall be 2.5 times the
rated voltage or the current corresponding to.
Duration: 2 s
No visible damage
Visual examination
R  ±1%
Resistance
Solvent resistance of the Sub−clause 4.30
Legible marking
marking
Solvent: 2−propanol
Solvent temperature: 23 °C±5 °C
Method 1
Rubbing material: cotton wool
Without recovery
6
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−4
Bound strength of the end Sub−clause 4.33
face plating
Bent value: 3 mm
R  ±1%
Resistance
Final measurements
Sub−clause 4.33.6
No visible damage
Visual examination

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Title:No
7

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 6/13

Test items
Resistance to soldering heat

Table−5(2)Condition of test (JIS C 5201−1)
Sub−clause 4.18 (JEITA RC-2144 2.3.2)
T1:Pre-heat minimum temp.:150±5 °C
T2:Pre-heat maximum temp.:180±5 °C
T3:Soldering temp.:220 °C
T4:Peak temp.:250 °C
t1:Pre-heat duration:120±5 s
t2:Soldering duration:60 to 90 s
t3:Peak duration(T4-5°C):20 to 40 s
Pre-reflow soldering: 1 time
(Initial measurements)
Reflow soldering: 3 times

Performance requirements

t3
T4
T3

t2

T2
T1

Visual examination
solvent ResistanceSub−clause 4.29
Solvent: 2−propanol
Solvent temperature: 23 °C±5 °C
Method 2
Recovery: 48 h
Visual examination
Resistance
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Adhesion
Sub−clause 4.32
Force: 5 N
Duration: 10 s±1 s
Visual examination
Rapid change temperature
Sub−clause 4.19
Lower category temperature: −55 °C
Upper category temperature: +155 °C
Duration of exposure at each temperature: 30
min.
Number of cycles: 5 cycles.
Visual examination
ResistanceComponent
resistance8t1

No visible damage
R  ±1%

No visible damage
R  ±1%

No visible damage

No visible damage
R  ±1%

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Title:No
9

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 7/13

Test items
Climatic sequence−Dry heat−Damp heat, cycle(12+12hour cycle)
First cycle−Cold−Damp heat, cycle(12+12hour cycle)
Remaining cycle−D.C. load

10

Mounting

Endurance at 70 °C

Table−5(3)Condition of test (JIS C 5201−1)
Sub−clause 4.23
Sub−clause 4.23.2
Test temperature: +155 °C
Duration: 16 h
Sub−clause 4.23.3
Test method: 2
Test temperature: 55 °C[Severity(2)]Sub−clause 4.23.4
Test temperature −55 °C
Duration: 2h
Sub−clause 4.23.6
Test method: 2
Test temperature: 55 °C[Severity (2)]
Number of cycles: 5 cycles
Sub−clause 4.23.7
The applied current shall be the rated current.
Duration: 1 min.
Visual examination
ResistanceSub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Sub−clause 4.25.1
Ambient temperature: 70 °C±2 °C
Duration: 1000 h
The current shall be applied in cycles of 1.5 h
on and 0.5 h.
The applied current shall be the rated current
Examination at 48 h, 500 h and1000 h:Visual examination
Resistance

Performance requirements

No visible damage
R  ±5 %No visible damage
R  ±5 %Product specification contained in this data sheet are subject to change at any time without notice.
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Title:

No
11

12

13

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 8/13
Table−5(4)Condition of test (JIS C 5201−1)
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Variation of resistance with Sub−clause 4.8
temperature+20 °C / +155 °C
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Damp heat, steady state
Sub−clause 4.24
Ambient temperature: 40 °C±2 °C
Relative humidity: 93 -+23 %Without current applied.
Visual examination
Test items

ResistanceSub−clause 4.4.3
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3
Enduranceatupper Sub−clause 4.25.3
category temperature
Ambient temperature:155 °C±2 °C
Duration: 1000 h
Examination at 48 h, 500 h and1000 h:Visual examination
ResistanceDimensions (detail)
Mounting

Performance requirements

As in Table−1

No visible damage
Legible markingR  ±5%
As in Table−4

No visible damage
R  ±5%

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Title:

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 9/13

8. Test substrate
Unit: mm
6

c

27.6

Solder resist

6

e

b

d

a

b

e

Copper clad

9

1.6

72

ａ
1.0
0.6
1.3
0.8
2.1

Style

Rated resistance range
20mR
RCC16
R20m
20mR
RCC20
R20m
All resistance range
RCC32
RCC16,20,32 TEST SUBSTRATE
c

b
0.6
0.8
0.7
0.95
0.9

c
0.8
0.9
1.25
1.35
1.7

d

e

2.2

6.2

2.7

5.95

3.9

5.35

e

Solder resist

6

e

b

27.6

6

Copper clad

d

a

b

Unit: mm

9

1.6

72

Style
RCC10
RCC10 TEST SUBSTRATE

ａ
0.6

b
0.5

c
0.7

d
1.6

e
6.5

Remark 1). Material: Epoxide woven glass
Thickness: 1.6mm Thickness of copper clad: 0.035mm
2). In the case of connection by connector, the connecting terminals are gold plated.
However, the plating is not necessary when the connection is made by soldering.
Figure−3

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Title:

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 10/13
Unit: mm

Copper cladbSolder resist

40

b

c

a

Style
RCC16

100

RCC20
RCC32

Rated resistance range
20mR
R20m
20mR
R20m
All resistance range

a
1.0
0.6
1.3
0.8
2.1

b
0.6
0.8
0.7
0.95
0.9

c
0.8
0.9
1.25
1.35
1.7

RCC16,20,32 BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE
Unit: mm

Copper cladbSolder resist

40

a

c

b

Style
RCC10

a
0.6

b
0.5

c
0.7

100
RCC10 BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE
Remark 1). Material: Epoxide woven glass
Thickness: 1.6mm Thickness of copper clad: 0.035mm
Figure−4
 RCC16,20,32

 RCC10
Insulation plate

Metal block measurement
Point A

Metal plate

R0.25R0.5mm
Measurement
point B
Insulation surface
Component

V

Pressure byspring (10.2N)

Figure−5

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Title:

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 11/13

9. Taping
9.1 Applicable documents JIS C 0806−3: 2014, EIAJ ET−7200C: 2010
9.2 Taping dimensions
9.2.1 Paper taping (8mm width, 2mm pitches)
Taping dimensions shall be in accordance with Figure−6 and Table−6.
Unit: mm

t1

40.1

1.5 +000.1

Sprocket hole1.750.1

B

80.2

A

t2

20.05Carrier cavity

3.50.05
Direction of unreeling

Style
RCC10

Figure−6
Table−6B
1.15 +0.05−0.10

A
0.65 +0.05
−0.10

t1
0.4 ± 0.05

Unit: mmt2
0.5max.

9.2.2 Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−7 and Table−7.
Unit: mm40.1
t1

1.5 +0.1
0Sprocket hole20.051.750.1

B

80.2

A

t2

Carrier cavity

40.1

3.50.05
Direction of unreeling

Style
RCC16
RCC20
RCC32

A
1.150.15
1.65±0.15
2.00±0.15

Figure−7
Table−7B
1.9 ± 0.2
2.5 ± 0.2
3.6 ± 0.2±±±t1
0.6 ± 0.1

Unit: mmt2
0.8max.

0.8 ± 0.1

1.0max.

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Title:

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 12/13

1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following RCC 10
Figure−8, RCC16,20,32 Figure−9
6). When the tape is bent with the minimum radius for 25mm, the tape shall not be damaged and the components shallmaintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The resistors shall be faced to upward at the substrate side in the carrier cavity.
Top cover tape

Top cover tape
Carrier tapePeel−off(About 300mmmin)

165to180

Carrier tape165to180

Direction of unreelingPeel−off(About 300mmmin)

Direction of unreeling

Figure−8

Figure−99.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−10 and Table−8.
Plastic reel (Based on EIAJ ET−7200C)
Unit: mm

0

+1
60 0

130.220.5

180 −1.5

Marking A

210.8

Marking B

A

B

Figure−10
Table−8
Unit: mm
A
B
Note
Style
11.4±1.0
Injection
molding
RCC10,16,20,32
9 +1.0013±1.0Vacuum forming
Note Marking label shall be marked on a place of Marking A or two place of marking A and B.

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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.5

Title:

No: RCC−K−HTS−0001/8
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND LOW OHM
RCC10,16,20,32
Page: 13/13

9.4 Leader and trailer tape.
(Example)

400mm min
100mm min

160mm min
End

Start
Trailer

LeaderDirection of unreeling

Figure−11
10. Marking on package
The label of a minimum package shall be legibly marked with follows.
10.1 Marking A(1) Classification (Style, Rated resistance, Tolerance on rated resistance, Packaging form) (2) Quantity(3) Lot number (4) Manufacturer’s name or trade mark (5) Others
10.2 Marking B (KAMAYA control label)

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.5