No.:
Date:

MLP−K−HTS−0002
2023. 1. 20/2Data sheet
Title:METAL-PLATE CHIP RESISTOR; LOW OHM

Style:

MLP63CRoHS COMPLIANCE ITEM
Halogen and Antimony Free
Note: ・Stock conditions
Temperature: +5°C ∼ +35°C
Relative humidity: 25% ∼ 75%
The period of guarantee: Within 2 year from shipmen t by the company.
Solderability shall be satisfied.

・Product specification contained in this data sheet are subject to change at any
time without notice・If you have any questions or a Purchasing Specification for any quality
agreement is necessary, please contact our sales staff.

Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya

No: MLP−K−HTS−0002
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C

Page:

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1/13

1. Scope
1.1 This data sheet covers the detail requirements for metal−plate chip resistor ; low ohm, style of MLP63C.
1.2 Applicable documents
JIS C 5201−1: 2011, JIS C 5201−8: 2014, JIS C 5201−8−1: 2014
IEC60115−1: 2008, IEC60115−8: 2009, IEC60115−8−1: 2014

2. Classification
Type designation shall be the following form.
(Example)
RLP
63C
R010
K
1
2
3
4
Style
1 Metal - plate chip resistor; low ohm
2 Size
MLP63C 6332 size, 3W

F
5

TE
6

Style

3 Temperature coefficient of resistance±70×10-6/ °C±100×10-6/ °CNK
4 Rated resistance
1L50
R002

1.5mΩ
2mΩ

5 Tolerance on rated resistance
F
J

±1%
±5%

6 Packaging form
TE

Embossed taping:

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No: MLP−K−HTS−0002
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C

Page:

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2/13

3. Rating
3.1 The ratings shall be in accordance with Table−1.
Style

Rated dissipation(W)

Rated current
(A)
54.7
44.7
38.7
34.6
31.6
27.3

MLP63C

3.0
24.4
22.3
20.7
19.3
18.2
17.3

Style
MLP63C

Insulation voltage(V)100

3.2 Climatic category
55/170/56

3.3 Stability class
5%

Table−1
Temperature coefficient ofresistance (10–6/ °C)
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70
K
100
N
±70

Rated resistance(mΩ)

Tolerance on rated
resistance

1
1.5
2
2.5
3
4
5

F(±1%)
J(±5%)

67
8
9
10

Category temperature range(°C)−55∼+170

Lower category temperature
Upper category temperature
Duration of the damp heat, steady state test

−55 °C+170 °C
56daysLimits for change of resistance:−for long−term tests±5%−for short−term tests±1%

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No: MLP−K−HTS−0002
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C

Page:

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3/13

3.4 Derating
The derated values of dissipation at temperature in excess of 70 °C shall be as indicated by the following curve.
100
Percentageof the rated
dissipation

Area of recommended
operation

(%)
0
−55

70

170

Ambient temperature (°C)

Figure−1 Derating curve
3.5 Rated voltage
d.c. or a.c. r.m.s. voltage calculated from the square root of the product of the rated resistance and the rated dissipation.
E: Rated voltage (V)
E =
P · R
P: Rated dissipation (W)R: Rated resistance (Ω)
3.6 Rated current
The rated current calculated from the square root of the quotient of the rated resistance and the rated dissipation.
I: Rated current (A)
I =
P / R
P: Rated dissipation (W)R: Rated resistance (Ω)
The rated current shall be corresponding to rated voltage.
4. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
SymbolTE

Packaging form
Embossed taping

12mm width, 4mm pitches

Standard packaging
quantity / units
4,000 pcs.

Product specification contained in this data sheet are subject to change at any time without notice.
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No: MLP−K−HTS−0002
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C

Page:

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4/13

5. Dimensions
5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−2 and Table−3.

W

L

c

d

d

H

c

Style

MLP63C

Rated resistance (mΩ)
1
1.5
2
2.5
3
4
5
6
7
8
9
10

5.2 Net weight (Reference)
Style
Rated resistance (mΩ)
1
1.5
2
2.5
3
4
MLP63C
5
6
7
8
9
10

L

Figure−2
Table−3W

6.3±0.25

3.1±0.25H
0.38±0.15
0.38±0.15
0.58±0.15
0.45±0.15
0.45±0.15
0.34±0.15
0.51±0.15
0.5±0.15
0.5±0.15
0.35±0.15
0.35±0.15
0.35±0.15c
2.2±0.25
1.5±0.25
2.2±0.25
2.4±0.25
2.2±0.25
2.2±0.25
1.1±0.25
1.1±0.25
0.6±0.25
1.1±0.25
0.8±0.25
0.5±0.25

Unit: mmd
2.2±0.25
1.5±0.25
2.2±0.25
2.4±0.25
2.2±0.25
2.2±0.25
1.1±0.25
1.1±0.25
0.6±0.25
1.1±0.25
0.8±0.25
0.5±0.25

Net weight (mg)60

Product specification contained in this data sheet are subject to change at any time without notice.
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No: MLP−K−HTS−0002
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C

Page:

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5/13

6. Marking
The rated resistance shall be marked in 4 characters consisting of 3 figures and a letter and marked on over coat side.
(Example) “R010” → 0.01 [Ω] → 10 [mΩ]
“1L50” → 0.0015 [Ω] → 1.5 [mΩ]c

7. Performance
7.1 The standard condition for tests shall be in accordance with Sub−clause 4.2, JIS C 5201−1: 2011.
7.2 The performance shall be satisfied in Table−4.
Table− 4(1)Test items
Performance requirements
No.
Condition of test (JIS C 5201−1)
1
Visual examination
As
in
4.4.1
Sub−clause 4.4.1
The
markingshall be legible, as
Checked by visual examination.
checked by visual examination.
2
Dimension
Sub−clause 4.4.2
As specified in Table−3 of thisspecification.
ResistanceResistance value shall be measured by mounting As in 4.5.2
the substrate of the following condition.
The resistance value shallacorrespond with the ratedbCurrent
resistance taking into account theCurrent
terminal
terminal
specified tolerance.
Voltage terminal

3

Voltage proof:Copper clad
:Solder resist

Unit:mm
Resistance
Style
a
b
c
value(mΩ)
1 to 41.8
2.9
MLP63C
3.5
1.5, 5 to 10
4.0
1.8
Thickness of copper clad: 0.035mm
4-Terminal method
Measurement current: 1(A)Note: The measuring apparatus corresponding to
DC Low−ohm Mater (1A) of AX−1152D for ADEXCORPORATION.
No breakdown or flash overSub−clause 4.7
Method: 4.6.1.4(See Figure−5)
Test voltage: Alternating voltage with a peak valueof 1.42 times the insulation voltage.
Duration: 60 s±5 s
R≥ 1 GΩ
Insulation resistance
Test voltage: Insulation voltage
Duration: 1 min.

Product specification contained in this data sheet are subject to change at any time without notice.
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No: MLP−K−HTS−0002
Title:No
4

5

6

METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C
Table−4(2)Test items
Condition of test (JIS C 5201−1)
Solderability
Sub−clause 4.17
Without aging
Flux: The resistors shall be immersed in a
non−activated soldering flux for 2 s.
Bath temperature: 235 °C±5 °C
Immersion time: 2 s±0.5 s
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−2Overload
Sub−clause 4.13
(in the mounted state)
The applied voltage shall be 2.5 times the rated
voltage or the current corresponding to.
Duration: 2 s
Visual examination
Resistance
Solvent resistance of the Sub−clause 4.30
marking
Solvent: 2−propanol
Solvent temperature: 23 °C±5 °C
Method 1
Rubbing material: cotton wool
Without recovery
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−4
Bound strength of the end Sub−clause 4.33
face plating
Bent value: 1 mm
Resistance
Final measurements
Sub−clause 4.33.6
Visual examination

Page:

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6/13

Performance requirements
As in 4.17.4.5
The terminations shall be covered
with a smooth and bright solder
coating.

No visible damage∆R ≤ ±1%
Legible marking∆R ≤ ±1%
No visible damage

Product specification contained in this data sheet are subject to change at any time without notice.
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No: MLP−K−HTS−0002
Title:No
7

METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C

Page:

Table−4(3)Test items
Condition of test (JIS C 5201−1)
Resistance to soldering Sub−clause 4.18 (JEITA RC-2144 2.3.2)
heat
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
T1:Pre-heat minimum temp.:150±5 °C
T2:Pre-heat maximum temp.:180±5 °C
T3:Soldering temp.:220 °C
T4:Peak temp.:250 °C
t1:Pre-heat duration:120±5 s
t2:Soldering duration:60 to 90 s
t3:Peak duration(T4-5°C):20 to 40 s
Pre-reflow soldering: 1 time
(Initial measurements)
Reflow soldering: 3 times

/2
7/13

Performance requirements

t3
T4
T3

t2

T2
T1

8

t1

Visual examination
ResistanceComponent
solvent Sub−clause 4.29
resistance
Solvent: 2−propanol
Solvent temperature: 23 °C±5 °C
Method 2
Recovery: 48 h
Visual examination
Resistance
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
Adhesion
Sub−clause 4.32
Force: 5 N
Duration: 10 s±1 s
Visual examination
Rapid change temperature Sub−clause 4.19
Lower category temperature:−55 °C
Upper category temperature:+155 °C
Duration of exposure at each temperature: 30 min.
Number of cycles: 5 cycles.
Visual examination
ResistanceNo visible damage∆R ≤ ±1%

No visible damage∆R ≤ ±1%

No visible damage

No visible damage∆R ≤ ±1%

Product specification contained in this data sheet are subject to change at any time without notice.
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No: MLP−K−HTS−0002
Title:

No
9

10

11

METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C
Table−4(4)Test items
Condition of test (JIS C 5201−1)
Climatic sequence
Sub−clause 4.23
−Dry heat
Sub−clause 4.23.2
Test temperature: +155 °C
Duration: 16 h
−Damp heat, cycle
Sub−clause 4.23.3(12+12hour cycle)
Test method: 2First cycle
Test temperature: 55 °C[Severity(2)]−ColdSub−clause 4.23.4
Test temperature −55 °C
Duration: 2h−Damp heat, cycle
Sub−clause 4.23.6(12+12hour cycle)
Test method: 2
Remaining cycle
Test temperature: 55 °C[Severity (2)]
Number of cycles: 5 cycles−D.C. load
Sub−clause 4.23.7
The applied current shall be the rated current.
Duration: 1 min.
Visual examination
Resistance
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−2
Endurance at 70 °C
Sub−clause 4.25.1
Ambient temperature: 70 °C±2 °C
Duration: 1000 h
The current shall be applied in cycles of 1.5 h on
and 0.5 h.
The applied current shall be the rated current
Examination at 48 h, 500 h and1000 h:Visual examination
Resistance
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
Variation of resistance with Sub−clause 4.8
temperature+20 °C / +155 °C

Page:

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8/13

Performance requirements

No visible damage∆R ≤ ±5 %No visible damage∆R ≤ ±5 %As in Table−1

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No: MLP−K−HTS−0002
Title:No
12

METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C

Test items
Mounting
Damp heat, steady state

13

Dimensions (detail)

Table−4(5)Condition of test (JIS C 5201−1)
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
Sub−clause 4.24
Ambient temperature: 40 °C±2 °C
Relative humidity: 93 -+23 %Without current applied.
Visual examination
ResistanceSub−clause 4.4.3

Page:

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Performance requirements

No visible damage
Legible marking∆R ≤ ±5%
As in Table−4

Mounting

Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
Enduranceatupper Sub−clause 4.25.3
category temperature
Ambient temperature:170 °C±2 °C
Duration: 1000 h
Examination at 48 h, 500 h and1000 h:Visual examination
ResistanceNo visible damage∆R ≤ ±5%

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No: MLP−K−HTS−0002
Title:METAL−PLATE CHIP RESISTOR; LOW OHM
MLP63C

Page:

/2
10/13

8. Test substratecd:Solder resist

27.6

e

:Copper clad

6

e

b

a

b

6

Unit: mm

9

1.6

72

Style

Rated resistance (mΩ)
1 to 4
MLP63C
1.5, 5 to 10
Figure−3−1 MLP63C TEST SUBSTRATE
Remark: Material: Epoxy resin based as glass fabric(Specified in JIS C 6484).
Thickness: 1.6mm
Thickness of copper clad: 0.035mm

ａ
1.8
4.0

b
2.9
1.8

c

d

e

3.5

7.6

3.5

ａ

b

c

1.8
4.0

2.9
1.8

3.5

Unit: mm28

:Copper cladb

:Solder resist

48

35

a

c

b

Style

0.4

3

MLP63C

68

5

Rated resistance(mΩ)
1 to 4
1.5, 5 to 10

5

Figure−3−2 MLP63C TEST SUBSTRATE
Remark: Material: Epoxy resin based as glass fabric(Specified in JIS C 6484).
Thickness: 1.6mm
Thickness of copper clad: 0.07mm
Remark: In the case of connection by connector, the connecting terminals are gold plated.
However, the plating is not necessary when the connection is made by soldering.

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No: MLP−K−HTS−0002
Title:/2

METAL−PLATE CHIP RESISTOR; LOW OHM

MLP63C

Page:

11/13

Unit: mm:Copper clad
:Solder resist

b

40

a

c

b

Style
MLP63C

Rated resistance (mΩ)
1 to 4
1.5, 5 to 10

ａ
1.8
4.0

b
2.9
1.8

c
3.5

100
MLP63C BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE
Figure−4
Remark. Material: Epoxy resin based as glass fabric(Specified in JIS C 6484).
Thickness: 1.6mm
Thickness of copper clad: 0.035mm
Insulation plate

Metal block measurement
Point A

Metal plate

R0.5mmMeasurement
point B
Insulation surface

Component

Pressure byspring (1±0.2N)

Figure−5

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No: MLP−K−HTS−0002
Title:/2

METAL−PLATE CHIP RESISTOR; LOW OHM

MLP63C

Page:

12/13

9. Taping
9.1 Applicable documents JIS C 0806−3: 2014, EIAJ ET−7200C: 2010
9.2 Taping dimensions
9.2.1 Embossed taping (12mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−6 and Table−5.
Unit: mm

0.3 max.
2±0.05
Sprocket hole

φ1.5+0.101.75±0.1

4±0.1

Carrier cavity

t1

W

B

E

A

Direction of unreeling

4±0.1

Figure−6
Table−5
Style
MLP63CA
3.6±0.2B
6.9±0.2W
12.0±0.3E
5.5±0.05

Unit: mmt1
1.1±0.15

1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following Figure−7.
6). When the tape is bent with the minimum radius for 30mm, the tape shall not be damaged and the components shallmaintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
Top cover tapePeel−off

Carrier tape(About 300mm/min)
165° to 180°

Direction of unreeling

Figure−7

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No: MLP−K−HTS−0002
Title:/2

METAL−PLATE CHIP RESISTOR; LOW OHM

MLP63C

Page:

13/13

9.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−8 and Table−6.
Plastic reel (Based on EIAJ ET–7200C)
Unit: mm

0

+1
φ60 0

φ13±0.22±0.5φ180 −1.5

Marking A

φ21±0.8

Marking B

A

B

Figure−8
Table−6
Unit: mm
A
B
Note
Style
MLP63C17±1.0Vacuum forming
13 +1.00Note : Marking label shall be marked on a place of Marking A or two place of Marking A and B.
9.4 Leader and trailer tape.
400mm min.
100mm min.

160mm min.
End

Start
Trailer

LeaderDirection of unreeling

Figure−9
10. Marking on package
The label of a minimum package shall be legibly marked with follows.
10.1 Marking A(1) Classification(Style, Temperature coefficient of resistance, Rated resistance, Tolerance on rated resistance, Packaging form)(2) Lot number (3) Quantity (4) Manufacturer’s name or trade mark (5) Others
10.2 Marking B (KAMAYA Control label)

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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20