No.:
Date:

FCCR−K−HTS−0001
2023. 1. 25/6

Data sheet
Title:

CHIP FUSE; RECTANGULAR TYPE

Style:

FCCR10,16

RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Note: ・Stock conditions
Temperature: +5C  +35C
Relative humidity: 25%  75%
The period of guarantee: Within 2 year from shipmen t by the company.
Solderability shall be satisfied.

・Product specification contained in this data sheet are subject to change at any
time without notice・If you have any questions or a Purchasing Specification for any quality
agreement is necessary, please contact our sales staff.

Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya

No:Title:

FCCR−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPEFCCR10,16

Page:/6

1/9

1. Scope
1.1 This data sheet covers the detail requirements for chip fuses; rectangular type, style of FCCR10,16.
1.2 Applicable documents
UL248−1−2000 Low−Voltage Fuses−Part1: General Requirements
UL248−14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
CSA C22.2 No.248.1−2000 Low−Voltage Fuses−Part1: General Requirements
CSA C22.2 No.248.14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
IEC60127−1 Miniature fuses−part 1: Definitions for miniature fuses and general requirements for miniature fuse−links
IEC60127−4 Miniature fuses−Part4: Universal modular fuse−links (UMF)
2. Classification
Type designation shall be the following form.
(Example)
FCCR
10201
12
3
Style
1 Chip fuses; rectangular type2 Size3 Rated current
201201--> 0.2A
4 Optional codeSymbol
ABAB
4PA
5
Style

ContentStandard

5 Packaging form
B
Bulk (loose package)
PAPress pocket taping
TPPaper taping
3. Safety standard approval• UL248−1 and UL248−14• CSA C22.2, No. 248.1−00 and CSA C22.2, No. 248.14−00
The file number to be designated by UL and C−UL shall be as follows: E176847

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

FCCR−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPEFCCR10,16Page:/62/9

4. Rating
4.1 The ratings shall be in accordance with Table−1.

Style

FCCR10

FCCR16

Rated current
MarkingSymbol(A)symbol151
0.15∩0.2201
Z
0.25
251
C
3210.315D
4010.4
E
501
0.5
F
151
0.15
OB
201
0.2
ZB
251
0.25
CB
321
0.315
DB
401
0.4
EB
501
0.5
FB
0.63
631
IB0.75751
AB
801
0.8
KB
102
1.0
LB
1.25
132
MB
152
1.5
HB
162
1.6
NB
2.0202
SB
2.5
252
TB

Table−1
Rated
Internal
voltage
resistance value（V）(m max.)
1850
1250
880
DC24600
400
300
2300
13501000600
450300220190
DC50165
13011090756540

Breaking
capacity(A)Time / current characteristic
Current

Pre−arcing time

35200%

5 s max.

50200%

5 s max.

4.2 Working temperature range: −55 to +125(C)
5. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Symbol

Packaging form

B

Bulk (loose package)
Press pocket taping
8mm width, 2mm pitches(paper taping)
Paper taping
8mm width, 4mm pitches

PATP

Standard packaging
quantity / units
1,000 pcs.

FCCR10,16

10,000 pcs.

FCCR105,000 pcs.

FCCR16Application

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

FCCR−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPEFCCR10,16

Page:

/6

3/9

6. Dimensions
6.1 The resistor shall be of the design and physical dimensions in accordance with Figure−1 and Table−3.

WLcddHc

Figure−1
Table−3
Style
FCCR10
FCCR16L
1.00.05
1.6±0.1

W0.50.05
0.8 +0.15-0.05

H0.40.05
0.45±0.10

c0.20.1
0.3±0.15

Unit:mmd0.250.10
0.3±0.1

6.2 Net weight (Reference)
Style
Net weight(mg)
FCCR100.8
FCCR162
7. Marking
The Marking symbol of Sub− clause 4.1 shall be marked on over coat side.
(Example)
Style
Optional code
Marking symbol
Content
FCCR10ABZFCCR10 201 AB
FCCR16ABEBFCCR16 401 AB

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

CHIP FUSES; RECTANGULAR TYPEFCCR10,16

FCCR−K−HTS−0001
Page:

/64/9

8. Performance
8.1 Unless otherwise specified, the standard range of atmospheric conditions for tests is as follows;
Ambient temperature: 5 C to 35 C, Relative humidity: 45 % to 85 %, Air presser: 86 kPa to 106 kPa
If there is any doubt the results, measurements shall be made within the following:
Ambient temperature: 20 C  2 C, Relative humidity: 60 % to 70 %, Air presser: 86 kPa to 106 kPa
8.2 The performance shall be satisfied in Table−4.
Table−4(1)No.
Test items
Condition of test
Performance requirements
1Temperature rise
The fuse shall be mounted on the test substrate as 75 C max.
shown in Figure−2.
Measurement temp.: 10 C to 30 C
Test current: Rated current
The temperature at the hottest point on the surface ofthe fuse shall be measured after temperatureequilibrium has been attained.
2Current carrying capacity The fuse shall be mounted on the test substrate as Without opening
shown in Figure−2.
Test current: 110 % of Rated current
Test temp.: 70 C  2 C
Test period: 1hTime / current characteristic
Pre−arcing
3
The fuse shall be mounted on the test substrate as Optional Current
codetime
shown in Figure−2.
AB200%
5 s max.
Test current shall be applied for continuously.
456

Terminal bond strength of JIS C 60068-2-21 Ue1
the face platingThe fuse shall be mounted on the test substrate as
shown in Figure−2.
Bending value: 3 mm (Among the fulcrums: 90 mm)
Duration: 10 s  1 s
Resistance to soldering Test by a piece.
heatTemp. of solder bath: 260 C  5 C
Immersion time: 10 s  1 s
After immersion into solder, leaving the room temp.
for 1h or more, and then measure the internalresistance.
• Reflow soldering
Pre−heating: 150 C  180 C, 120 s max.
Peak: 260 C  5 C, 10 s max.
Refrow cycle: 2 times
After immersion into solder, leaving the room temp.
for 1h or more, and then measure the internalresistance.
Solderability
JIS C 60068-2-58
Test by a piece
Flux: Rosin−Methanol
Temp. of solder: bath: 235 C  5 C
Immersion time: 2 s  0.5 s

Change of internal resistance:
10%
No evidence of mechanicaldamage.
Change of internal resistance:
10%
No evidence of appearance
damageThe surface of terminal immersed shallbe min. of 95 % covered with a new
coating of solder.

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:
Title:

FCCR−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPEFCCR10,16

No.
7

Test items
Rapid change temperature

8Endurance test

Page:

Table−4(2)Condition of test
JIS C 60068-2-14 Na
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Upper temperature: +125 C
Lower temperature: −55 C
Duration of exposure at each temperature: 30 min.
Number of cycles: 5 cycles
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Test condition: Nominal ambient temp. and Relativehumidity.
Test potential:
1. Cycle of 1 h “ON” and 15 min. “OFF” at 1.05 times
rated current for 100 cycles.
2. After above the test , 1.25 times rated current for
1h.

/6

5/9

Performance requirements
Change of internal resistance:
10%
No evidence of appearance
damageThe voltage drop across the fuseafter the test shall not haveincreased by more than 10 % ofthe value measured before test.

9. Test substrate
3Unit: mm20Copper clad

0.5

4.2

1033

Solder resista90100cStyleFCCR10FCCR16ba0.30.6cb0.6
1.0c
0.65
0.5

Figure−2 FCCR TEST SUBSTRATE
Remark 1). Material: Epoxide woven glass
Thickness: 1. 6mm Thickness of copper clad: 0. 035mm

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

FCCR−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPEFCCR10,16Page:/66/9

10. Taping
10.1 Applicable documents JIS C 0806−3: 2014, EIAJ ET−7200C: 201010.2 Taping dimensions
10.2.1 Press pocket taping(8mm width, 2mm pitches)
Taping dimensions shall be in accordance with Figure−3 and Table−5.
Unit:mm40.05

t1

1.5 +0.10Sprocket hole1.750.1

B

80.2

At3

Carrier cavity

20.053.50.05

t2Direction of unreeling

Figure−3
Table−5
Style
FCCR10A
0.65±0.1B
1.15±0.1

t1
0.6±0.05

t20.7max.

Unit:mmt30.5±0.05

10.2.2 Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−4 and Table−6.
t1

1.5 +0.1
0Sprocket hole

Unit:mm

40.1
20.051.750.1

B

80.2

A

t2

Carrier cavity

40.1

3.50.05
Direction of unreeling

Style
FCCR16

Figure−4
Table−6AB
1.15±0.15
1.9±0.2t1
0.6±0.1±±±

Unit:mmt20.8 max.

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:
Title:

CHIP FUSES; RECTANGULAR TYPEFCCR10,16

FCCR−K−HTS−0001
Page:/67/91). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following
FCCR10Figure−5,FCCR16 Figure−6.
6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shallmaintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The fuses shall be faced to upward at the over coating side in the carrier cavity.
Top cover tape
Carrier tape165to180

Peel−off(About 300mmmin)

Direction of unreeling

Figure–5
Top cover tape
Carrier tapePeel−off(About 300mmmin)165 to 180
Direction of unreeling

Figure–6

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:
Title:

FCCR−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPEFCCR10,16

Page:/68/910.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−5 and Table−6.
Plastic reel (Based on EIAJ ET−7200C)
Unit: mm0+1
60 0

130.220.5

180 −1.5

Marking A

210.8

Marking B

AB

Figure−5
Table−6
Unit: mmAB
Note
Style
11.4±1.0
Injection
molding
FCCR10,169 +1.0
013±1.0
Vacuum forming
Note Marking label shall be marked on a place of Marking A or two place of marking A and B.
10.4 Leader and trailer tape.
(Example)

400mm min
100mm min

160mm min
EndStartTrailerLeader
Direction of unreeling

Figure−8
11. Marking on package
The label of a minimum package shall be legibly marked with follows.
11.1 Marking A(1) Classification (Style, Rated current, Optional code, Packaging form) (2) Quantity (3) Lot number(5) Manufacturer’s name or trade mark (6) UL and /or C−UL recognized component mark (7) Others
11.2 Marking B (KAMAYA Control label)

Product specification contained in this data sheet are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

FCCR−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPEFCCR10,16

Page:/69/9

12. Recommended Derating for Rated Current•Nominal Derating
Option Code AB: Nominal Derating  75% of Rated Current•Temperature Derating
Please refer to the following graph regarding the current derating value for ambient temperature.

Percent of rated current [%]100806040200-5504070125

Ambient temperature [C]Ex.) • If Optional code: AB (Rated Current:0.5A) is used under ambient temperature 70°C
Kamaya recommends, less than the current value derated as below,
Rated Current: 0.5A  (Nominal Derating : 75%  Temperature Derating : 100%) =0.375A

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25