No.:Date:

SBF−K−HTS−0001
2023. 1. 25/5

Data sheet
Title:

CHIP FUSE; RECTANGULAR TYPE

Style:

SBF32Optional codeAS

RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Note: ・Stock conditions
Temperature: +5C  +35C
Relative humidity: 25%  75%
The period of guarantee: Within 2 year from shipmen t by the company.
Solderability shall be satisfied.

・Product specification contained in this data sheet are subject to change at any
time without notice・If you have any questions or a Purchasing Specification for any quality
agreement is necessary, please contact our sales staff.

Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya

No:Title:

CHIP FUSES; RECTANGULAR TYPE
SBF32[Optional code: AS]

SBF−K−HTS−0001
Page:/51/7

1. Scope
1.1 This data sheet covers the detail requirements for chip fuses; rectangular type, style of SBF32 [Optional code: AS].
1.2 Applicable documents
UL248−1−2000 Low−Voltage Fuses−Part1: General Requirements
UL248−14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
CSA C22.2 No.248.1−2000 Low−Voltage Fuses−Part1: General Requirements
CSA C22.2 No.248.14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
2. Classification
Type designation shall be the following form.
(Example)
SBF
32802
123
Style
1 Chip fuses; rectangular type2 Size
3 Rated current
802802--> 8.0,AAS4TP5
Style

4 Optional codeSymbolAS
5 Packaging form
B
TPOptional code
Standard

Bulk (loose package)
Paper taping

3. Safety standard approval• UL248−1 and UL248−14• CSA C22.2, No. 248.1−00 and CSA C22.2, No. 248.14−00
The file number to be designated by UL and C−UL shall be as follows: E176847

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:
Title:SBF−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
SBF32[Optional code: AS]

Page:/5
2/7

4. Rating
4.1 The ratings shall be in accordance with Table−1.
Table−1
Rated current
Style

SBF32

Style
SBF32

Symbol(A)Markingsymbol

102132
152
202
252
302
402
502
602
702
802

1.0
1.25
1.5
2.0
2.5
3.0
4.0
5.0
6.0
7.0
8.0

S10
S13
S15
S20
S25
S30
S40
S50
S60
S70
S80

Internalresistancevalue(m Typ.)
130
94
68
40
30
24
15
12
10
76

Rated
voltage(Vdc)

Breaking
capacity(A)

Time / current characteristic
Current

Pre−arcing time

100%
200%
300%
800%

4h min.
1120s max
0.02s3.0s max
0.0015s0.05s max

63

50
32

Working temperature range(C)−55 to +125

5. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Symbol

Packaging form

BTPBulk (loose package)
Paper taping
8mm width, 4mm pitches

Standard packaging
quantity / units
1,000 pcs.
5,000 pcs.

6. Dimensions
6.1 The resistor shall be of the design and physical dimensions in accordance with Figure−1 and Table−3.

WL

cdd

H

c

Figure−1
Table−3
Style
SBF32

L
3.2±0.2W
1.6±0.15H
0.65±0.10

c0.5±0.25

Unit: mmd0.5±0.25

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

SBF−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
SBF32[Optional code: AS]

Page:

/5
3/7

6.2 Net weight (Reference)
Style
Net weight(mg)SBF32
107. Marking
The Marking symbol of Sub− clause 4.1 shall be marked on over coat side.
(Example) S80 → Content SBF32 802 AS
8. Performance
8.1 Unless otherwise specified, the standard range of atmospheric conditions for tests is as follows;
Ambient temperature: 5 C to 35 C, Relative humidity: 45 % to 85 %, Air presser: 86 kPa to 106 kPa
If there is any doubt the results, measurements shall be made within the following:
Ambient temperature: 20 C  2 C, Relative humidity: 60 % to 70 %, Air presser: 86 kPa to 106 kPa
8.2 The performance shall be satisfied in Table−4.
No.
1

2

34

5

Table−4(1)Test items
Condition of test
Performance requirements
Temperature riseThe fuse shall be mounted on the test substrate as 75 C max.
shown in Figure−2.
Measurement temp.: 10 C to 30 C
Test current: Rated current
The temperature at the hottest point on the surfaceof the fuse shall be measured after temperatureequilibrium has been attained.
Time / current characteristic The fuse shall be mounted on the test substrate asCurrent
Pre−arcing time
4h min.
shown in Figure−2.
100%
1120s max
Test current shall be applied for continuously.
200%
0.02s3.0s max
300%
0.0015s0.05s max
800%
Terminal bond strength of JIS C 60068-2-21 Ue1Change of internal resistance:
the face plating
The fuse shall be mounted on the test substrate as 10%
shown in Figure−2.
No evidence of mechanical
Bending value: 3 mm(Among the fulcrums: 90 mm) damage.
Duration: 10 s  1 s
Resistance to soldering Test by a piece.
Change of internal resistance:
heatTemp. of solder bath: 260 C  5 C
10%No evidence of appearance
Immersion time: 10 s  1 s
After immersion into solder, leaving the room temp. damage
for 1h or more, and then measure the internalresistance.

Solderability• Reflow soldering
Pre−heating: 150 C  180 C, 120 s max.
Peak: 260 C  5 C, 10 s max.
Reflow cycle: 2 times
After immersion into solder, leaving the room temp.
for 1h or more, and then measure the internal
resistance.
JIS C 60068-2-58
The surface of terminal immersed
Test by a pieceshall be min. of 95 % covered witha new coating of solder.
Flux: Rosin−MethanolTemp. of solder: bath: 235 C  5 C
Immersion time: 2 s  0.5 s

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

No.
6

SBF−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
SBF32[Optional code: AS]

Test items
Rapid change temperaturePage:

表－4(2)
Condition of test
ＪＩＳ C 60068-2-14 Na
The fuse shall be mounted on the test substrate
as shown in Figure−2.
Lower temperature: −55 C
Upper temperature: +125 C
Duration of exposure at each temperature: 30
min.
Number of cycles: 5 cycles/54/7

Performance requirements
Change of internal resistance:
10%
No evidence of appearance
damage9. Test substrate
3Unit: mm20Copper clad

0.5

4.2

1033

Solder resist

a90
100c

Style
SBF32bc

a1.8

b2.2

c
0.85

Figure−2 SBF TEST SUBSTRATE
Remark 1). Material: Epoxide woven glass
Thickness: 1. 6mm Thickness of copper clad: 0. 035mm

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

SBF−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
SBF32[Optional code: AS]

Page:/5
5/7

10. Taping
10.1 Applicable documents JIS C 0806−3: 2014, EIAJ ET−7200C: 201010.2 Taping dimensions
Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−3 and Table−5.
Unit: mmt1

40.1

1.5 +0.10Sprocket hole20.051.750.1

B80.2

At240.1

Carrier cavity

3.50.05
Direction of unreeling

Style
SBF32

A
2.0±0.15

Figure−3Table−5B
3.6±0.2t1
0.8±0.1±±±

Unit: mmt2
1.0max.

1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following Figure−4.
6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shallmaintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The fuses shall be faced to upward at the over coating side in the carrier cavity.
Top cover tapeCarrier tapePeel−off(About 300mmmin)165 to 180
Direction of unreelingFigure–4

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

SBF−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
SBF32[Optional code: AS]

Page:/5
6/7

10.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−5 and Table−6.
Plastic reel (Based on EIAJ ET−7200C)
Unit: mm0+1
60 0

130.220.5

180 −1.5

Marking A

210.8

Marking BAAStyle

Figure−5
Table−6BB

Unit: mmNote

11.4±1.0
Injection molding
13±1.0Vacuum forming
Note Marking label shall be marked on a place of Marking A or two place of marking A and B.
SBF32

9 +1.0010.4 Leader and trailer tape.
400mm min
100mm min

160mm min
EndStart
Trailer

LeaderDirection of unreeling

Figure−6
11. Marking on package
The label of a minimum package shall be legibly marked with follows.
11.1 Marking A(1) Classification (Style, Rated current, Optional code, Packaging form) (2) Quantity (3) Lot number(4) Manufacturer’s name or trade mark (5) UL and /or C−UL recognized component mark (6) Others
11.2 Marking B (KAMAYA Control label)

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25

No:Title:

SBF−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
SBF32[Optional code: AS]

Page:/5
7/7

12. Recommended Derating for Rated Current
This fuse will recommend use by the current reduction value according to the following derating curve.
• Nominal Derating
Nominal Derating  75% of Rated Current• Temperature Derating
Please refer to the following graph regarding the current derating value for ambient temperature.
Ex.) If SBF32 801 (Rated Current 8.0A) is used under ambient temperature 70°C,
Kamaya recommends, less than the current value derated as below,
Rated Current : 8.0A  (Nominal Derating : 75%  Temperature Derating : 80%) = 4.8A

Derating curve
130

Percentage of rated current(%)

1201101009080706050403020100-60 -50 -40 -30 -20 -10010 20 30

40 50 60 70 80 90 100 110 120 130

Ambient temperature (℃）

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.25