Spec. No.:
Date:

RLP−K−HTS−0001 /12
2022. 12. 31

Data sheet
Title:METAL-PLATE CHIP RESISTOR; LOW OHM

Style:

RLP16,20,32,63, MLP20,63

RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Note: ・Stock conditions
Temperature: +5C  +35C
Relative humidity: 25%  75%
The period of guarantee: Within 2 year from shipment by the company.
Solderability shall be satisfied.

・Product specification contained in this data sheet
are subject to change at any time without notice・If you have any questions or a Purchasing Specification for any quality
agreement is necessary, please contact our sales staff.

Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

1/19

1. Scope
1.1 This data sheet covers the detail requirements for metal−plate chip resistor ; low ohm, style of RLP16, 20, 32, 63,
MLP20, 63.
1.2 Applicable documents
JIS C 5201−1: 2011, JIS C 5201−8: 2014, JIS C 5201−8−1: 2014
IEC60115−1: 2008, IEC60115−8: 2009, IEC60115−8−1: 2014

2. Classification
Type designation shall be the following form.
(Example)
RLP
63
R010
K
1
2
3
4
Style
1 Metal - plate chip resistor; low ohm
2 Size
RLP16
RLP20
RLP32
RLP63
MLP20
MLP63

F
5

TE
6

Style

1608 size, 0.33W
2012 size, 0.5W
3216 size, 1W
6332 size, 1W
2012 size, 1W
6332 size, 2W

3 Temperature coefficient of resistanceN±7010-6/ °C
K±10010-6/ °C±15010-6/ °C−(Dash)±25010-6/ °C
4 Rated resistance
1L50
R002

1.5mΩ
2mΩ

5 Tolerance on rated resistance
F
±1%
J
±5%
6 Packaging form
TPTE

Paper taping
Embossed taping

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

2/19

3. Rating
3.1 The ratings shall be in accordance with Table−1.
3.1.1 RLP series
Table−1(1)Style

Rated dissipation
(W)

RLP16

0.33

Rated current (A)
8.1
5.7
15.8
11.1
10.0

RLP20

0.5

9.1
7.9
7.4
7.0
31.6
22.3
18.2
15.8
14.1
12.9
11.9

RLP32

1.0

11.1
10.5
10
9.5
9.1
8.7
8.4
8.1

Temperature coefficient ofresistance (10–6/ °C)
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
±150
−(Standard)
K
100
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70

Rated resistance(m)Tolerance on rated
resistance

5
10
2
4
5
6
8
9
10
1
2
3
4

F(1%)
J(5%)

5
6
7
8
9
10
11
12
13
14
15

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

3/19

Table−1(2)Style

Rated dissipation(W)

Rated current (A)

2.0

44.7
22.3
18.2
15.8
14.1
12.9

RLP63
1.0

11.9
11.1
10.5
10
9.1
8.1

Temperature coefficient ofresistance (10–6/ °C)±150−(Standard)
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70
K
100
N
70

Rated resistance(m)Tolerance on rated
resistance

1
2
3
4
5
6

F(1%)
J(5%)

7
8
9
10
12
15

3.1.2 MLP series
Style

Rated dissipation(W)

Rated current
(A)

MLP20

1.0

10
31.6
25.8
22.3
20

MLP63

2.0

18.2
16.9
15.8
14.9
14.1

Table−1(3)Temperature coefficient ofresistance (10–6/ °C)
K
N
K
N
K
N
K
N
K
N
K
N
K
N
K
N
K
N
K
N

100
70
100
70
100
70
100
70
100
70
100
70
100
70
100
70
100
70
100
70

Rated resistance(m)Tolerance on rated
resistance

10
2
3
4
5
6

F(1%)
J(5%)

78
9
10

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

Style

Insulation voltage(V)

Category temperature range
(°C)

RLP10
RLP16
RLP20
RLP32
RLP63
MLP20
MLP63

100

−55+155

3.2 Climatic category
55/155/56

Lower category temperature
Upper category temperature
Duration of the damp heat, steady state test

3.3 Stability class
5%

4/19

−55 °C+155 °C
56daysLimits for change of resistance:−for long−term tests
5%−for short−term tests
1%

3.4 Derating
The derated values of dissipation at temperature in excess of 70 °C shall be as indicated by the following curve.
100
Percentageof the rated
dissipation

Area of recommended
operation

(%)
0
−55

155
70
Ambient temperature (°C)

Figure−1 Derating curve
3.5 Rated voltage
d.c. or a.c. r.m.s. voltage calculated from the square root of the product of the rated resistance and the rated dissipation.
E: Rated voltage (V)
E =
P · R
P: Rated dissipation (W)R: Rated resistance ()3.6 Rated current
The rated current calculated from the square root of the quotient of the rated resistance and the rated dissipation.
I: Rated current (A)
I =
P / R
P: Rated dissipation (W)R: Rated resistance ()The rated current shall be corresponding to rated voltage.

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

5/19

4. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
SymbolTP
TE

Standard packaging
quantity / units
5,000 pcs.
4,000 pcs.

Packaging form
Paper taping
Embossed taping

8mm width, 4mm pitches
12mm width, 4mm pitches

Application
RLP16, 20, 32, MLP20
RLP63, MLP63

5. Dimensions
5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−2 and Table−3.
5.1.1 RLP series

W

L

c

d

d

H

c

Style
RLP16

RLP20

RLP32

Rated resistance (m)
5
10
2
4
5
6
8
9
10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

L

Figure−2
Table−3(1)W

1.6±0.1

0.8±0.1

2.0±0.15

1.25±0.15

3.2±0.15

1.6±0.15H
0.35±0.10
0.3±0.1
0.22±0.10
0.35±0.10
0.35±0.10
0.35±0.10
0.22±0.10
0.22±0.10
0.22±0.10
0.32±0.15
0.32±0.15
0.35±0.10
0.35±0.10
0.35±0.10
0.35±0.10
0.35±0.10
0.35±0.10
0.3±0.1
0.28±0.10
0.28±0.10
0.22±0.10
0.22±0.10
0.22±0.10
0.22±0.10c
0.2±0.1
0.2±0.1
0.35±0.10
0.35±0.10
0.35±0.10
0.35±0.10
0.35±0.10
0.35±0.10
0.35±0.10
1.1±0.25
0.5±0.25
0.7±0.25
1.1±0.25
1.0±0.25
0.85±0.25
0.7±0.25
0.6±0.25
0.75±0.25
0.5±0.25
0.5±0.25
0.65±0.25
0.65±0.25
0.55±0.25
0.5±0.25

Unit: mmd
0.6±0.1
0.3±0.1
0.55±0.20
0.75±0.20
0.6±0.2
0.47±0.20
0.6±0.2
0.52±0.20
0.47±0.20
1.1±0.25
0.5±0.25
1.3±0.25
1.1±0.25
1.0±0.25
0.85±0.25
0.7±0.25
0.6±0.25
0.75±0.25
0.5±0.25
0.5±0.25
0.65±0.25
0.65±0.25
0.55±0.25
0.5±0.25

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

6/19

W

L

c

d

d

H

c

Style

RLP63

Rated resistance (m)
1
2
3
4
5
6
7
8
9
10
12
15

L

Table−3(2)W
3.2±0.25

6.3±0.25

3.1±0.25H
0.38±0.15
0.38±0.15
0.45±0.15
0.35±0.15
0.34±0.15
0.34±0.15
0.35±0.15
0.35±0.15
0.35±0.15
0.23±0.15
0.23±0.15
0.23±0.15c
2.2±0.25
1.1±0.25
2.2±0.25
2.2±0.25
1.95±0.25
1.75±0.25
1.4±0.25
1.1±0.25
0.8±0.25
1.75±0.25
1.4±0.25
0.95±0.25

Unit: mmd
2.2±0.25
1.1±0.25
2.2±0.25
2.2±0.25
1.95±0.25
1.75±0.25
1.4±0.25
1.1±0.25
0.8±0.25
1.75±0.25
1.4±0.25
0.95±0.25

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

7/19

5.1.2 MLP series

W

L

c

d

d

H

c

Style
MLP20

MLP63

Rated resistance (m)
10
2
3
4
5
6
7
8
9
10

5.2 Net weight (Reference)
Style
Rated resistance (m)
RLP16
5,10
RLP20
2, 4 to 6 , 8 to 10
1 to 3RLP32
4 to 15
1,2
RLP63
3 to 10,12 15
MLP20
10
MLP63
2 to 10

Table−3(3)LW
2.0±0.15 1.25±0.15

6.3±0.25

3.1±0.25H
0.22±0.10
0.58±0.15
0.45±0.15
0.34±0.15
0.51±0.15
0.5±0.15
0.5±0.15
0.35±0.15
0.35±0.15
0.35±0.15c
0.33±0.15
2.2±0.25
2.2±0.25
2.2±0.25
1.1±0.25
1.1±0.25
0.6±0.25
1.1±0.25
0.8±0.25
0.5±0.25

Unit: mmd
0.47±0.20
2.2±0.25
2.2±0.25
2.2±0.25
1.1±0.25
1.1±0.25
0.6±0.25
1.1±0.25
0.8±0.25
0.5±0.25

Net weight (mg)
2
3
12
11
47
43
3
60

6. Marking
The Rated resistance of RLP16 should not be marked standard.
6.1 RLP63, MLP63
The rated resistance shall be marked in 4 characters consisting of 3 figures and a letter and marked on over coat side.
(Example) “R010” → 0.01 [] → 10 [m]

“1L50” → 0.0015 [] → 1.5 [m]
6.2 RLP20, 32, MLP20
The rated resistance shall be marked in combination of two figures and underlines and marked on over coat side.
(Example) “05” → 0.005 [] → 5 [m]“10” → 0.01 [] → 10 [m]

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

8/19

7. Performancec

7.1 The standard condition for tests shall be in accordance with Sub−clause 4.2, JIS C 5201−1: 2011.
7.2 The performance shall be satisfied in Table−4.
Table− 4(1)No.
Test items
Performance requirements
Condition of test (JIS C 5201−1)
1
Visual examination
As
in
4.4.1
Sub−clause 4.4.1
The marking shall be legible, as
Checked by visual examination.
checked by visual examination.
2
Dimension
Sub−clause 4.4.2
As specified in Table−3 of thisspecification.
ResistanceResistance value shall be measured by mounting As in 4.5.2
the substrate of the following condition.
The resistance value shallacorrespond with the ratedbCurrent
resistance taking into account theCurrent
terminal
terminal
specified tolerance.
Voltage terminal

Copper cladSolder resist

Unit:mm
Resistance
Style
a
b
c
value(m)
5
0.6
0.8
RLP16
0.9
10,
1.0
0.6
2
0.5
1.1
RLP20
1.36
4 to 6, 8 to 10
0.8
0.95
1
1.0
1.45
2
0.9
2.1
3
0.8
1.55
RLP32
1.7
4
1.0
1.45
5 and 6
1.4
1.25
7 to 15
2.1
0.9
1
1.5
3.0
4.0
2
4.0
1.8
RLP63
3, 4
1.8
2.9
3.5
5
2.4
2.6
6 to 10,12,15
4.0
1.8
MLP20
10
0.8
0.95 1.36
2 to 4
1.8
2.9
MLP63
3.5
5 to 104.0
1.8
Thickness of copper clad 0.035mm
4-Terminal method
Measurement current: 1(A)Note: The measuring apparatus corresponding to
DC Low−ohm Mater (1A) of AX−1152D for ADEXCORPORATION.

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001

RLP10, 16, 20, 32, 63, MLP20, 63

No
3

4

5

6

/12

METAL−PLATE CHIP RESISTOR; LOW OHM

Table−4(2)Test items
Condition of test (JIS C 5201−1)
Voltage proof
Sub−clause 4.7
Method: 4.6.1.4(See Figure−5)
Test voltage: Alternating voltage with a peak valueof 1.42 times the insulation voltage.
Duration: 60 s±5 s
Insulation resistance
Test voltage: Insulation voltage
Duration: 1 min.
Solderability
Sub−clause 4.17
Without aging
Flux: The resistors shall be immersed in a
non−activated soldering flux for 2 s.
Bath temperature: 235 °C±5 °C
Immersion time: 2 s±0.5 s
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: RLP16: Figure−3−1Overload
RLP20, MLP20 Figure−3−2(in the mounted state)
RLP32 Figure−3−3
RLP63, MLP63 Figure−3−4
Sub−clause 4.13
The applied voltage shall be 2.5 times the rated
voltage or the current corresponding to.
Duration: 2 s
Visual examination
Resistance
Solvent resistance of theSub−clause 4.30
marking
Solvent: 2−propanol
Solvent temperature: 23 °C±5 °C
Method 1
Rubbing material: cotton wool
Without recovery
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−4
Bound strength of the end Sub−clause 4.33
face plating
Bent value: 3mm(RLP16, 20, 32, MLP20)
1 mm(RLP63, MLP63)
Resistance
Final measurements
Sub−clause 4.33.6
Visual examination

Page:

9/19

Performance requirements
No breakdown or flash overR 1 GAs in 4.17.4.5
The terminations shall be covered
with a smooth and bright solder
coating.

No visible damage
R  ±1%
Legible markingR  ±1%
No visible damage

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP10, 16, 20, 32, 63, MLP20, 63

No
7

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM
Page:

Table−4(3)Test items
Condition of test (JIS C 5201−1)
Resistance to soldering Sub−clause 4.18 (JEITA RC-2144 2.3.2)
heat
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
T1:Pre-heat minimum temp.:150±5 °C
T2:Pre-heat maximum temp.:180±5 °C
T3:Soldering temp.:220 °C
T4:Peak temp.:260 °C
t1:Pre-heat duration:120±5 s
t2:Soldering duration:60 to 90 s
t3:Peak duration(T4-5°C):20 to 40 s
Pre-reflow soldering: 1 time
(Initial measurements)
Reflow soldering: 3 times

10/19

Performance requirements

t3
T4
T3

t2

T2
T1

8

t1

Visual examination
ResistanceComponent
solvent Sub−clause 4.29
resistance
Solvent: 2−propanol
Solvent temperature: 23 °C±5 °C
Method 2
Recovery: 48 h
Visual examination
Resistance
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
Adhesion
Sub−clause 4.32
Force: 5 N
Duration: 10 s±1 s
Visual examination
Rapid change temperature Sub−clause 4.19
Lower category temperature:−55 °C
Upper category temperature:+155 °C
Duration of exposure at each temperature: 30 min.
Number of cycles: 5 cycles.
Visual examination
ResistanceNo visible damage
R  ±1%

No visible damage
R  ±1%

No visible damage

No visible damage
R  ±1%

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001

RLP10, 16, 20, 32, 63, MLP20, 63

No
9

10

11

/12

METAL−PLATE CHIP RESISTOR; LOW OHM

Table−4(4)Test items
Condition of test (JIS C 5201−1)
Climatic sequence
Sub−clause 4.23
−Dry heat
Sub−clause 4.23.2
Test temperature: +155 °C
Duration: 16 h
−Damp heat, cycle
Sub−clause 4.23.3(12+12hour cycle)
Test method: 2First cycle
Test temperature: 55 °C[Severity(2)]−ColdSub−clause 4.23.4
Test temperature −55 °C
Duration: 2h−Damp heat, cycle
Sub−clause 4.23.6(12+12hour cycle)
Test method: 2
Remaining cycle
Test temperature: 55 °C[Severity (2)]
Number of cycles: 5 cycles−D.C. load
Sub−clause 4.23.7
The applied current shall be the rated current.
Duration: 1 min.
Visual examination
Resistance
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: RLP16: Figure−3−1
RLP20, MLP20 Figure−3−2
RLP32 Figure−3−3
RLP63, MLP63 Figure−3−4
Endurance at 70 °C
Sub−clause 4.25.1
Ambient temperature: 70 °C±2 °C
Duration: 1000 h
The current shall be applied in cycles of 1.5 h on
and 0.5 h.
The applied current shall be the rated current
Examination at 48 h, 500 h and1000 h:Visual examination
Resistance
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
Variation of resistance with Sub−clause 4.8
temperature+20 °C / +155 °C

Page:

11/19

Performance requirements

No visible damage
R  ±5 %No visible damage
R  ±5 %As in Table−1

Product specification contained in this data sheet are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001

RLP10, 16, 20, 32, 63, MLP20, 63

No
12

Test items
Mounting

Damp heat, steady state

13

/12

METAL−PLATE CHIP RESISTOR; LOW OHM

Dimensions (detail)

Table−4(5)Condition of test (JIS C 5201−1)
Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
Sub−clause 4.24
Ambient temperature: 40 °C±2 °C
Relative humidity: 93 +2-3 %Without current applied.
Visual examination
ResistanceSub−clause 4.4.3

Page:

12/19

Performance requirements

No visible damage
Legible markingR  ±5%
As in Table−4

Mounting

Sub−clause 4.31
Substrate material: Epoxide woven glass
Test substrate: Figure−3−1
Enduranceatupper Sub−clause 4.25.3
category temperature
Ambient temperature:155 °C±2 °C
Duration: 1000 h
Examination at 48 h, 500 h and1000 h:Visual examination
ResistanceNo visible damage
R  ±5%

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

13/19

8. Test substratecdSolder resist

27.6

e

Copper clad

6

e

b

a

b

6

Unit: mm

9

1.6

72

Style

Rated resistance (m)
5
RLP16
10
2
RLP20
4 to 6, 8 to 10
1
2
3
RLP32
4
5 and 6
7 to 15
1
2
RLP63
3, 4
5
6 to 10,12,15
MLP20
10
2 to 4MLP63
5 to 10Figure−3−1 RLP, MLP TEST SUBSTRATE
Remark: Material Epoxy resin based as glass fabric(Specified in JIS C 6484).
Thickness 1.6mm
Thickness of copper clad 0.035mm

a
0.6
1.0
0.5
0.8
1.0
2.1
0.8
1.0
1.4
2.1
1.5
4.0
1.8
2.4
4.0
0.8
1.8
4.0

b
0.9
0.6
1.1
0.95
1.45
0.9
1.55
1.45
1.25
0.9
3.05
1.8
2.9
2.6
1.8
0.95
2.9
1.8

c

d

e

0.9

2.2

6.2

1.36

2.7

5.95

1.7

3.9

5.35

3.5

7.6

3.5

1.36

2.7

5.95

3.5

7.6

3.5

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

14/19

Unit: mme

ソルダーレジスト

6

e

b

27.6

6

銅箔パターン

d

a

b

c

12

2

72

Style

a
Rated resistance (m)
2
0.5
RLP20
4 to 6, 8 to 10
0.8
MLP20
10
0.8
Figure−3−2 RLP20, MLP20 TEST SUBSTRATE
Remark: Material Epoxy resin based as glass fabric(Specified in JIS C 6484).
Thickness 1.6mm
Thickness of copper clad 0.035mm

b
1.1
0.95
0.95

c

d

e

1.36

2.7

5.95

Unit: mme

Solder resist

f

b

e

a

g

f

Copper clad

d

b

c

18

2.5
72

Style

a
b
c
Rated resistance (m)
1
1.0
1.45
2
2.1
0.9
3
0.8
1.55
RLP32
1.7
4
1.0
1.45
5 and 6
1.4
1.25
7 to 15
2.1
0.9
Figure−3−3 RLP32, MLP32 TEST SUBSTRATE
Remark: Material Epoxy resin based as glass fabric(Specified in JIS C 6484).
Thickness 1.6mm
Thickness of copper clad 0.07mm

d

e

3.9

5.35

f
11.68

g
39

6.0

27.6

11.68

39

6.0

27.6

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

15/19

Unit: mm28

Copper clad
a

b

c

48

Solder resist
35

b

Style

3

0.4

RLP63

5

5

68

MLP63

Rated resistance
(m)
1
2
3, 4
5
6 to 10,12,15
2 to 45 to 10

a

b

c

2.0
4.0
1.8
2.4
4.0
1.8
4.0

3.0
1.8
2.9
2.6
1.8
2.9
1.8

4.0

b
0.9
0.6
1.1
0.95
1.45
0.9
1.55
1.45
1.25
0.9
0.95

c

3.5

3.5

Figure−3−4 RLP63, MLP63 TEST SUBSTRATE
Remark: Material Epoxy resin based as glass fabric(Specified in JIS C 6484).
Thickness 1.6mm
Thickness of copper clad 0.07mm
Remark: In the case of connection by connector, the connecting terminals are gold plated.
However, the plating is not necessary when the connection is made by soldering.
Unit: mm

Copper cladbSolder resist

40

c

b

a

Style

a
Rated resistance (m)
5
0.6
RLP16
10
1.0
2,3
0.5
RLP20
100
4 to 6, 8 to 10
0.8
1
1.0
2
2.1
3
0.8
RLP32
4
1.0
5 and 6
1.4
7 to 15
2.1
MLP20
10
0.8
RLP, MLP BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE

0.9
1.36

1.7

1.36

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

16/19

Unit: mm

Copper cladSolder resist

b

40

a

c

b

Style

a
Rated resistance (m)
1
1.5
2
4.0
RLP63
3, 4
1.8
5
2.4
100
6 to 10,12,15
4.0
2 to 41.8
MLP63
5 to 10
4.0
RLP 63, MLP63 BOUND STRENGTH OF THE END FACE PLATING TEST SUBSTRATE
Figure−4
Remark. Material Epoxy resin based as glass fabric(Specified in JIS C 6484).
Thickness 1.6mm
Thickness of copper clad 0.035mm

b
3.05
1.8
2.9
2.6
1.8
2.9
1.8

c
4.0
3.5

3.5

Insulation plate

Metal block measurement
Point A

Metal plate

R0.5mmMeasurement
point B
Insulation surface

Component

Pressure byspring (10.2N)

Figure−5

Product specification contained in this data sheet are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

17/19

9. Taping
9.1 Applicable documents JIS C 0806−3: 2014, EIAJ ET−7200C: 2010
9.2 Taping dimensions
9.2.1 Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−6 and Table−5.
Unit: mm40.1
1.5 +0.1
0Sprocket holet1

20.051.750.1

B

80.2

A

t2

Carrier cavity

40.1

3.50.05
Direction of unreeling

Style
RLP16
RLP20
MLP20
RLP32

A
1.150.15

Figure−6
Table−5B
1.9 ± 0.2

t1
0.6±0.1±±±
Unit: mmt2
0.8max.

1.65±0.15

2.5±0.2

0.6±0.1

0.8max.

2.00±0.15

3.6±0.2

0.6±0.1

0.8max.

9.2.2 Embossed taping (12mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−7 and Table−6.
Unit: mm
0.3 max.
20.05
Sprocket hole

1.5+0.1
01.750.1

40.1

W

B

E

A

Carrier cavity

t1

Direction of unreeling40.1

Figure−7
Table−6
Style
RLP63
MLP63

A

B

W

E

Unit: mmt1

3.60.2

6.90.2

12.00.3

5.50.05

1.10.15

Product specification contained in this data sheet are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

18/19

1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following RLP16,
20, 32, MLP20: Figure−8, RLP63, MLP63: Figure−9
6). When the tape is bent with the minimum radius for (RLP16, 20, 32, MLP20 25mm, RLP63, MLP63  30mm) the tape shallnot be damaged and the components shall maintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
Top cover tape
Carrier tapePeel−off(About 300mmmin)

165to180
Direction of unreeling

Figure−8
Top cover tapePeel−off

Carrier tape(About 300mmmin)165 to 180

Direction of unreeling

Figure−9

Product specification contained in this data sheet are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31

No:
Title:

RLP−K−HTS−0001/12

METAL−PLATE CHIP RESISTOR; LOW OHM

RLP10, 16, 20, 32, 63, MLP20, 63

Page:

19/19

9.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−10 and Table−7.
Plastic reel (Based on EIAJ ET–7200C)
Unit: mm

0

+1
60 0

130.220.5

180 −1.5

Marking A

210.8

Marking B

A

B

Figure−10
Table−7A

Unit: mmB
Note
11.4±1.0
Injection
molding
RLP16, 20, 32, MLP20
9 +1.0013±1.0Vacuum forming
RLP63, MLP63
17±1.0Vacuum forming
13 +1.00Note  Marking label shall be marked on a place of Marking A or two place of Marking A and B.
Style

9.4 Leader and trailer tape.
400mm min
100mm min

160mm min
End

Start
Trailer

LeaderDirection of unreeling

Figure−11
10. Marking on package
The label of a minimum package shall be legibly marked with follows.
10.1 Marking A(1) Classification(Style, Temperature coefficient of resistance, Rated resistance, Tolerance on rated resistance, Packaging form)(2) Lot number (3) Quantity (4) Manufacturer’s name or trade mark (5) Others
10.2 Marking B (KAMAYA Control label)

Product specification contained in this data sheet are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2022.12.31