No.:
Date:

HFC−K−HTS−0001
2023. 1. 26/4

Data sheet
Title:

CHIP FUSE; RECTANGULAR TYPE

Style:

HFC32Optional codeAG

RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Note: ・Stock conditions
Temperature: +5C  +35C
Relative humidity: 25%  75%
The period of guarantee: Within 2 year from shipmen t by the company.
Solderability shall be satisfied.

・Product specification contained in this data sheet are subject to change at any
time without notice・If you have any questions or a Purchasing Specification for any quality
agreement is necessary, please contact our sales staff.

Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya

No:Title:

CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG]

HFC−K−HTS−0001
Page:/41/7

1. Scope
1.1 This data sheet covers the detail requirements for chip fuses; rectangular type, style of HFC32 [Optional code: AG].
1.2 Applicable documents
UL248−1−2000 Low−Voltage Fuses−Part1: General Requirements
UL248−14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
CSA C22.2 No.248.1−2000 Low−Voltage Fuses−Part1: General Requirements
CSA C22.2 No.248.14−2000 Low−Voltage Fuses−Part14: Supplemental Fuses
2. Classification
Type designation shall be the following form.
(Example)
HFC32802
123
Style
1 Chip fuses; rectangular type2 Size
3 Rated current
802802--> 8.0 A
4 Optional code
5 Packaging form
BTPSymbolAGAG
4

TP5Style

Optional code
Standard

Bulk (loose package)
Paper taping

3. Safety standard approval• UL248−1 and UL248−14• CSA C22.2, No. 248.1−00 and CSA C22.2, No. 248.14−00
The file number to be designated by UL and C−UL shall be as follows: E176847

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.26

No:
Title:

HFC−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG]

Page:/4
2/7

4. Rating
4.1 The ratings shall be in accordance with Table−1.
Table−1
Rated current
Style

HFC32

Style
HFC32

Symbol(A)Marking
symbol102132
162
202
252
302
322402502632702
802103
133

1.0
1.25
1.6
2.0
2.5
3.0
3.15
4.0
5.0
6.3
7.0
8.0
10.0
12.5

102
132
162202252302
322402502
632702802103
133

Internal
resistancevalue(m Max.)
180
140
100
60
38
32
30
20
16
12
11
9
7
6

Rated
voltage(Vdc)

Breaking
capacity
(A)

76

50

Time / current characteristic
Current

Pre−arcing time

200%

60s max

Working temperature range(C)−55 to +125

5. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
Symbol

Packaging form

B
TP

Bulk (loose package)
Paper taping
8mm width, 4mm pitches

Standard packaging
quantity / units
1,000 pcs.
5,000 pcs.

6. Dimensions
6.1 The resistor shall be of the design and physical dimensions in accordance with Figure−1 and Table−3.

W

L

cdd

H

c

Figure−1
Table−3
Style
HFC32L
3.2±0.2W
1.6±0.15

H
0.6±0.1

c0.5±0.25

Unit: mmd0.5±0.25

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.26

No:Title:

CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG]

HFC−K−HTS−0001
Page:

/4
3/7

6.2 Net weight (Reference)
Style
Net weight(mg)
HFC32
97. Marking
The Marking symbol of Sub− clause 4.1 shall be marked on over coat side.
(Example) 802 → Content HFC32 802 AG
8. Performance
8.1 Unless otherwise specified, the standard range of atmospheric conditions for tests is as follows;
Ambient temperature: 5 C to 35 C, Relative humidity: 45 % to 85 %, Air presser: 86 kPa to 106 kPa
If there is any doubt the results, measurements shall be made within the following:
Ambient temperature: 20 C  2 C, Relative humidity: 60 % to 70 %, Air presser: 86 kPa to 106 kPa
8.2 The performance shall be satisfied in Table−4.
Table−4(1)No.
Test items
Condition of test
Performance requirements
1
Temperature rise
The fuse shall be mounted on the test substrate as 75 C max.
shown in Figure−2.
Measurement temp.: 10 C to 30 C
Test current: Rated current
The temperature at the hottest point on the surface ofthe fuse shall be measured after temperatureequilibrium has been attained.
2Time / current characteristic The fuse shall be mounted on the test substrate as
Current
Pre−arcing timeshown in Figure−2.
200%
60s max
Test current shall be applied for continuously.
3
Terminal bond strength of JIS C 60068-2-21 Ue1Change of internal resistance:
the face plating
The fuse shall be mounted on the test substrate as 10%
shown in Figure−2.
No evidence of mechanical
Bending value: 3 mm(Among the fulcrums: 90 mm)
damage.
Duration: 10 s  1 s4Resistance to soldering Test by a piece.
Change of internal resistance:
heatTemp. of solder bath: 260 C  5 C
10%No evidence of appearance
Immersion time: 10 s  1 s
After immersion into solder, leaving the room temp. for damage
1h or more, and then measure the internal resistance.
• Reflow soldering
Pre−heating: 150 C  180 C, 120 s max.
Peak: 260 C  5 C, 10 s max.
Reflow cycle: 2 timesAfter immersion into solder, leaving the room temp. for
1h or more, and then measure the internal resistance.
5Solderability

JIS C 60068-2-58
Test by a piece
Flux: Rosin−Methanol
Temp. of solder: bath: 235 C  5 C
Immersion time: 2 s  0.5 s

The surface of terminal
immersed shall be min. of 95 %covered with a new coating ofsolder.

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.26

No:Title:No.
6

HFC−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG]

Test items
Rapid change temperature

Page:

Table−4(2)Condition of test
JIS C 60068-2-14 Na
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Lower temperature: −55 C
Upper temperature: +125 C
Duration of exposure at each temperature: 30 min.
Number of cycles: 5 cycles/4
4/7

Performance requirements
Change of internal resistance:
10%
No evidence of appearance
damage9. Test substrate
3Unit: mm

20Copper clad

0.5

4.21033

Solder resist
Wa90
100

Style

Rated current
ab252502
HFC32
1.82.2632103
133
Figure−2 HFC TEST SUBSTRATE
Remark 1). Material: Epoxide woven glass
Thickness: 1. 6mm

cc0.85

W57.5
10bc

Thickness of copper clad
0.035
0.07

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.26

No:Title:

HFC−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG]

Page:

/4
5/7

10. Taping
10.1 Applicable documents JIS C 0806−3:2014, EIAJ ET−7200C: 201010.2 Taping dimensions
Paper taping (8mm width, 4mm pitches)
Taping dimensions shall be in accordance with Figure−3 and Table−5.
Unit: mmt1

40.1

1.5 +0.10Sprocket hole20.051.750.1

B80.2At2

40.1

Carrier cavity

3.50.05
Direction of unreeling

StyleHFC32A
2.0±0.15

Figure−3
Table−5B
3.6±0.2t1
0.8±0.1±±±

Unit: mmt21.0max.

1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following Figure−4.
6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shallmaintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The fuses shall be faced to upward at the over coating side in the carrier cavity.
Top cover tape
Carrier tapePeel−off(About 300mmmin)165 to 180
Direction of unreeling

Figure–4

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.26

No:
Title:

HFC−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG]

Page:/4
6/7

10.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−5 and Table−6.
Plastic reel (Based on EIAJ ET−7200C)
Unit: mm0+1
60 0

130.220.5

180 −1.5

Marking A

210.8

Marking BAA

Style

Figure−5Table−6BB

Unit: mmNote

11.4±1.0
Injection molding
13±1.0Vacuum forming
Note Marking label shall be marked on a place of Marking A or two place of marking A and B.
HFC32

9 +1.00

10.4 Leader and trailer tape.
400mm min
100mm min

160mm min
EndStart
Trailer

LeaderDirection of unreeling

Figure−6
11. Marking on package
The label of a minimum package shall be legibly marked with follows.
11.1 Marking A(1) Classification (Style, Rated current, Optional code, Packaging form) (2) Quantity (3) Lot number(4) Manufacturer’s name or trade mark (5) UL and /or C−UL recognized component mark (6) Others
11.2 Marking B (KAMAYA Control label)

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.26

No:Title:

HFC−K−HTS−0001

CHIP FUSES; RECTANGULAR TYPE
HFC32[Optional code: AG]

Page:

/4
7/7

12. Recommended Derating for Rated Current
This fuse will recommend use by the current reduction value according to the following derating curve.
• Nominal Derating
Nominal Derating  75% of Rated Current• Temperature Derating
Please refer to the following graph regarding the current derating value for ambient temperature.
Ex.) If HFC32 801 (Rated Current 8.0A) is used under ambient temperature 70°C,
Kamaya recommends, less than the current value derated as below,
Rated Current : 8.0A  (Nominal Derating : 75%  Temperature Derating : 80%) = 4.8ADerating curve
130

Percentage of rated current(%)

1201101009080706050403020100-60 -50 -40 -30 -20 -10010 20 3040 50 60 70 80 90 100 110 120 130

Ambient temperature (℃）

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.26