Spec. No.:
Date:

RPGW-K-HTS-0001 /2
2023.1.23

Data sheet
Title:FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION

Style:

RPGW16,20,32,35

RoHS COMPLIANCE ITEM
Halogen and Antimony Free
Note: ・Stock conditions
Temperature: +5°C ∼ +35°C
Relative humidity: 25% ∼ 75%
The period of guarantee: Within 2 year from shipmen t by the company.
Solderability shall be satisfied.

・Product specification contained in this data sheet are subject to change at any
time without notice・If you have any questions or a Purchasing Specification for any quality
agreement is necessary, please contact our sales staff.

Hokkaido Research Center
Approval by: T. Sannomiya
Drawing by: M. Shibuya

Title:

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 1/10

1. Scope
1.1 This data sheet covers the detail requirements for fixed thick film chip resistors; rectangular type & high power ⋅ anti surge
anti sulfration, style of RPGW16,20,32,35.
1.2 Applicable documents
JIS C 5201−1: 2011, JIS C 5201−8: 2014, JIS C 5201−8−1: 2014
IEC60115−1: 2008, IEC60115−8: 2009, IEC60115−8−1: 2014
EIAJ RC−2134C−2010
2. Classification
Type designation shall be the following form.
(Example)
RPGW
32
123
J
TP
K
1
2
3
4
5
6
Style
1 Fixed thick film chip resistors; rectangular type & high power ⋅ anti surge anti-sulfration.
2 Rated dissipation and / or dimension
3 Temperature coefficient of resistanceK±100×10−6/ °C
Standard−(Dash)Style

4 Rated resistance123
E24 Series, 3 digit, Ex. 123--> 12kΩ,
1000
E96 Series, 4 digit, Ex. 1000-->100Ω
1022--> 10.2kΩ
5 Tolerance on rated resistance
D
±0.5%
F
±1%
J
±5%
6 Packaging form
B
TPTE

Bulk (loose package)
Paper taping
Embossed taping

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20

Title:

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 2/10

3. Rating
3.1 The ratings shall be in accordance with Table−1.
Table−1
Rateddissipation
(W)

Style

RPGW16

K
Standard
K
Standard
K
Standard
K
Standard
K
Standard
K
Standard
K
Standard
K
Standard

0.33

RPGW200.5

RPGW32

0.66

RPGW350.75

Style
RPGW16
RPGW20
RPGW32
RPGW35

Rated resistance
range (Ω)

Temperature coefficient ofresistance (10-6 / °C)10∼1M
1.0∼9.76
10∼1M
1.0∼9.110∼1M
1.0∼9.76
10∼1M
1.0∼9.110∼1M
1.0∼9.76
10∼1M
1.0∼9.110∼1M
1.0∼9.76
10∼1M
1.0∼9.1

±100
±200
±100
±200
±100
±200
±100
±200
±100
±200
±100
±200
±100
±200
±100
±200

Limiting element voltage(V)
150

Insulation voltage
(V)
150

200

500

3.2 Climatic category
55/155/56

Tolerance on
rated resistance

E24, 96

D(±0.5%),F(±1%)

E24

J(±5%)

E24, 96

D(±0.5%),F(±1%)

E24

J(±5%)

E24, 96

D(±0.5%),F(±1%)

E24

J(±5%)

E24, 96

D(±0.5%),F(±1%)

E24

J(±5%)

Category temperature
range(°C)−55~+155

Lower category temperature
Upper category temperature
Duration of the damp heat, steady state test

3.3 Stability class2%

Preferred
number series
for resistors− 55 °C+155 °C
56daysLimits for change of resistance:−for long−term tests±(2%+0.1Ω)−for short−term tests±(0.5%+0.05Ω)

3.4 Derating
The derated values of dissipation at temperature in excess of 70 °C shall be as indicated by the following curve.
100

Percentage of the
rated dissipation
Area of recommended
operation

(%)
0
−55

70

155

Ambient temperature (°C)

Figure–1 Derating curve

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20

Title:

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 3/10

3.5 Rated voltage
d.c.or a.c.r.m.s.voltage calculated from the square root of the product of the rated resistance and the rated dissipation.
E: Rated voltage (V)
E =
P · R
P: Rated dissipation (W)R: Rated resistance (Ω)
Limiting element voltage can only be applied to resistors when the resistance value is equal to or higher than the criticalresistance value.
At high value of resistance, the rated voltage may not be applicable.
4. Packaging form
The standard packaging form shall be in accordance with Table−2.
Table−2
SymbolB
TP
TE

Packaging form
Bulk (loose package)
Paper taping
Embossed taping

8mm width, 4mm pitches
8mm width, 4mm pitches

Standard packaging
quantity / units
1,000 pcs.
5,000 pcs.
4,000 pcs.

Application
RPGW16,20,32,35
RPGW 16,20,32
RPGW 35

W

5. Dimensions
5.1 The resistor shall be of the design and physical dimensions in accordance with Figure−2 and Table−3.
L

c

d

d

H

c

Figure−2
Table−3
0.8 +0.15-0.05

H
0.45±0.10c
0.3±0.2

Unit: mmd
0.3±0.1

2.0±0.1

1.25±0.10

0.55±0.10

0.3±0.2

0.4±0.2

RPGW323.1±0.1

1.6±0.15

0.55±0.10

0.4±0.25

0.5±0.25

RPGW353.1±0.15

2.5±0.15

0.55±0.15

0.4±0.25

0.5±0.25

Style
RPGW16L
1.6±0.1

RPGW20W

5.2 Net weight (Reference)
Style
Net weight(mg)
RPGW162
RPGW205
RPGW32
9
RPGW3516

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20

Title:

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 4/10

6. Marking
The Rated resistance shall be marked in 3 digits (E24) or 4 digits (E96) and marked on over coat side.
• E24 series: 3 digits, E96 series: 4 digits
In case of the resistance value that E96 overlaps with E24, It is marked by either.
The Rated resistance of RPGW16 should not be marked in 4 digits(E96).
Marking example
Contents
Application
RPGW 16,20,32,35
123
12×10 3 ［Ω］ → 12 ［kΩ］Less than 10Ω of RPGW 16,20,32,35
2. 2 ［Ω］
2R2
5623
RPGW 20,32,35
562 ×103 [Ω] → 562 [kΩ]
12R7
RPGW 20,32,35
12.7 [Ω]7. Performance
7.1 The standard condition for tests shall be in accordance with Sub−clause 4.2, JIS C 5201−1: 2011.
7.2 The performance shall be satisfied in Table−4.
Table−4(1)No.
Test items
Performance requirements
Condition of test (JIS C 5201−1)
1
Visual examination
As in 4.4.1
Sub−clause 4.4.1
The marking shall be legible, as
Checked by visual examination.
checked by visual examination.
2
Dimension
As specified in Table−3 of thisSub−clause 4.4.2
specification.
Resistance
As in 4.5.2
Sub−clause 4.5
The
resistance
value
shall
correspond with the rated resistancetaking into account the specified
tolerance.
3
Voltage proof
Sub−clause 4.7
No breakdown or flash over
Method: 4.6.1.4
Test voltage: Alternating voltage with a peakvalue of 1.42 times the insulation
voltage.
Duration: 60 s ± 5 s
R≥1GΩ
Insulation resistance
Test voltage: Insulation voltage
Duration: 1 min.
4
Solderability
As in 4.17.4.5
Sub−clause 4.17
The terminations shall be covered
Without ageing
Flux: The resistors shall be immersed in a with a smooth and bright solder
coating.
non−activated soldering flux for 2s.
Bath temperature: 235 °C ± 5 °C
Immersion time: 2 s ± 0.5 s

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20

Title:No
5

6

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 5/10
Table−4(2)Performance requirements
Condition of test (JIS C 5201−1)
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Sub−clause 4.13
Overload
The applied voltage shall be 2.5 times the rated(in the mounted state)
voltage or twice the limiting element voltage,
whichever is the less severe.
Duration: 2 s
No visible damage
Visual examination∆R ≤ ± (1%+0.05Ω)
Resistance
Solvent resistance of the Sub−clause 4.30
Legible marking
marking
Solvent: 2−propanol
Solvent temperature: 23 °C ± 5 °C
Method 1
Rubbing material: cotton wool
Without recovery
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Bound strength of the end Sub−clause 4.33
face plating
Bent value: 3 mm
Test items

Final measurements
7

Resistance to soldering heat

Component
resistanceResistanceSub−clause 4.33.6
Visual examination
Sub−clause 4.18
Solder temperature: 260 °C ± 5 °C
Immersion time: 10 s ± 0.5 s
Visual examination

Resistancesolvent Sub−clause 4.29
Solvent: 2−propanol
Solvent temperature: 23 °C ± 5 °C
Method 2
Recovery: 48 h
Visual examination
Resistance∆R ≤ ± (0.5%+0.05Ω)
No visible damage

As in 4.18.3.4
No sign of damage such as cracks.
∆R ≤ ± (0.5%+0.05Ω)

No visible damage∆R ≤ ± (0.5%+0.05Ω)

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20

Title:No
8

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 6/10

Test items
Mounting
Adhesion

Rapid change temperature

9

Climatic sequence−Dry heat−Damp heat, cycle(12+12hour cycle)
First cycle−Cold−Damp heat, cycle(12+12hour cycle)
Remaining cycle−D.C. load

10

Mounting
Endurance at 70 °C

Table−4(3)Condition of test (JIS C 5201−1)
Sub−clause 4.31
Substrate material: Epoxide woven glass
Sub−clause 4.32
Force: 5 N
Duration: 10 s ± 1 s
Visual examination
Sub−clause 4.19
Lower category temperature:−55 °C
Upper category temperature:+155 °C
Duration of exposure at each temperature:
30 min.
Number of cycles: 5 cycles.
Visual examination
ResistanceSub−clause 4.23
Sub−clause 4.23.2
Test temperature: +155 °C
Duration: 16 h
Sub−clause 4.23.3
Test method: 2
Test temperature: 55 °C[Severity(2)]Sub−clause 4.23.4
Test temperature −55 °C
Duration: 2h
Sub−clause 4.23.6
Test method: 2
Test temperature: 55 °C[Severity (2)]
Number of cycles: 5 cycles
Sub−clause 4.23.7
The applied voltage shall be the rated voltage
or the limiting element voltage whichever is thesmaller.
Duration: 1 min.
Visual examination
ResistanceSub−clause 4.31
Substrate material: Epoxide woven glass
Sub−clause 4.25.1
Ambient temperature: 70 °C ± 2 °C
Duration: 1000 h
The voltage shall be applied in cycles of 1.5 h
on and 0.5 h.
The applied voltage shall be the rated voltage
or the limiting element voltage whichever is thesmaller.
Examination at 48 h , 500 h and1000 h:Visual examination
Resistance

Performance requirements

No visible damage

No visible damage∆R ≤ ±(0.5%+0.05Ω)

No visible damage∆R ≤ ± (2%+0.1Ω)

No visible damage∆R ≤ ± (2%+0.1Ω)

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20

Title:

No
11

12

13

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 7/10
Table−4(4)Performance requirements
Condition of test (JIS C 5201−1)
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Variation of resistance with Sub−clause 4.8
As in Table−1
temperature−55 °C / +20 °C+20 °C / +155°C
Mounting
Sub−clause 4.31
Substrate material: Epoxide woven glass
Damp heat, steady state
Sub−clause 4.24
Ambient temperature: 40 °C ± 2 °C
Relative humidity : 93 +2−3 %a) 1st group: without voltage applied.
b) 2nd group: The d. c. voltage shall be applied
continuously.
The voltage shall be accordance with
Sub−clause 4.24.2.1 b). without polarizing
voltage [4.24.2.1, c)]No visible damage
Visual examination
Legible marking∆R ≤ ± (2%+0.1Ω)
Resistance
Test items

Dimensions (detail)Sub−clause 4.4.3

As in Table−3

Mounting

14

Sub−clause 4.31
Substrate material: Epoxide woven glass
Endurance at upper category Sub−clause 4.25.3
temperature
Ambient temperature:155 °C ± 2 °C
Duration: 1000 h
Examination at 48 h, 500 h and1000 h:Visual examination
Resistance
Humid Sulfur vapor test
ASTM B809(FOS)
Reagent: Sulfur (Saturated vapor)
Test temp.: 60°C
Relative humidity: 95%RH
Test period: 1000h
ResistanceNo visible damage∆R ≤ ± (2%+0.1Ω)∆R ≤ ± (1%+0.05Ω)

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20

Title:

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 8/10

8. Taping
8.1 Applicable documents JIS C 0806−3: 2014, EIAJ ET−7200C: 2010
8.2 Taping dimensions
8.2.1 Taping dimensions shall be in accordance with Figure−3 and Table−5.
Unit: mm4±0.1
Sprocket holet1

2±0.05

φ1.5 +0.101.75±0.1

B

8±0.2

A

t2

Carrier cavity

4±0.1

3.5±0.05
Direction of unreeling

Style
RPGW16
RPGW20
RPGW32

Figure−3
Table−5AB
1.15±0.15
1.9±0.2
1.65±0.15
2.5±0.2
2.00±0.15
3.6±0.2t1
0.6±0.1
0.8±0.1
0.8±0.1

Unit: mmt2
0.8max.
1.0max.
1.0max.

8.2.2 Embossed taping dimensions shall be in accordance with Figure−4 and Table−6.
Unit: mm
0.3 max.
2±0.05
Sprocket hole

φ1.5+0.101.75±0.1

4±0.1

Carrier cavity

t1

W

B

E

A

Direction of unreeling

4±0.1

Figure−4
Table−6
Style
RPGW35A
2.85±0.20

B
3.5±0.2W
8.0±0.3E
3.5±0.05

Unit: mmt1
1.0±0.2

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20

Title:

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 9/10

1). The cover tapes shall not cover the sprocket holes.
2). Tapes in adjacent layers shall not stick together in the packing.
3). Components shall not stick to the carrier tape or to the cover tape.
4). Pitch tolerance over any 10 pitches ±0.2mm.
5). The peel strength of the top cover tape shall be with in 0.1N to 0.5N on the test method as shown in the following
RPGW16,20,32:Figure−4,RPGW35:Figure-5.
6). When the tape is bent with the minimum radius for 25 mm, the tape shall not be damaged and the components shallmaintain their position and orientation in the tape.
7). In no case shall there be two or more consecutive components missing.
The maximum number of missing components shall be one or 0.1%, whichever is greater.
8). The resistors shall be faced to upward at the over coating side in the carrier cavity.
Top cover tape
Carrier tape
165°to180°

Peel−off( About 300mm/ min)Direction of unreeling

Figure−5

Top cover tape
Carrier tape
165°to180°

Peel−off(About 300mm/ min)Direction of unreeling

Figure−6

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20

No: RPGW −K−HTS−0001/2
FIXED THICK FILM CHIP RESISTORS; RECTANGULAR TYPE AND
HIGH POWER ⋅ ANTI SURGE ANTI-SULFRATION RPGW16,20,32,35
Page: 10/10

Title:

8.3 Reel dimension
Reel dimensions shall be in accordance with the following Figure−7 and Table−7.
Plastic reel (Based on EIAJ ET−7200C)
Unit: mm

0

+1
φ60 0

φ13±0.22±0.5φ180 −1.5

Marking A

φ21±0.8

Marking B

A

B

Figure−7
Table−7
Unit: mm
A
B
Note
Style
11.4±1.0
Injection molding
RPGW16,20,32,35
9 +1.0013±1.0Vacuum forming
Note: Marking label shall be marked on a place of Marking A or two place of marking A and B.
8.4 Leader and trailer tape.
(Example)

400mm min.
100mm min.

160mm min.
End

Start
Trailer

LeaderDirection of unreeling

Figure−8
9. Marking on package
The label of a minimum package shall be legibly marked with follows.
9.1 Marking A(1) Classification(Style, Temperature coefficient of resistance, Rated resistance, Tolerance on rated resistance, Packaging form)(2) Quantity (3) Lot number (4) Manufacturer’s name or trade mark9.2 Marking B (KAMAYA control label)(5) Others

Product specification contained in this data sheet are subject to change at any time without notice.
If you have any questions or a Purchasing Specification for any quality agreement is necessary, please contact our sales staff.
Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2023.1.20