Declaration of Compliance with the REACH

We hereby represent that the products, including the parts and the components consisted
thereof, supplied on and after 1st October 2010 by our company conform to the EU REACH(Registration, Evaluation, Authorization and Restriction of Chemicals, EC 1907/2006) and theSVHC (Substances of Very High Concern) chemical substance including Appendix XVIIrestrictions.
In addition, we declare, to the best of our knowledge, the products comply with therequirements of each of 241 substances which are announced by ECHA as “Substances ofVery High Concern (SVHC) on 27th Jun. 2024.
Note:
For DRAM and SSD products, the SVHC substances of Lead monoxide (Lead oxide) CAS
No.1317-36-8 and 2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone CAS No.71868-10-5
might contained in raw material(the concentration are over 0.1%), however, the final products(components) will not exist above substance (the concentration are less than 0.1% in thecomponent).

Jennie_Liu
Quality Management Division/ Director

Substances of Very High Concern (SVHC) contained in the listed article in product.
ProductSVHC
ItemCAS No.

Substance Name981317-36-8

Lead monoxide (Lead oxide)

Resistor

170

80-05-7

4,4’-isopropylidenediphenol(bisphenol A)

Substrate BT material
Substrate&PP

1857439-92-1

Lead

Resistor
Substrate&PP

203

71868-10-5

2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone

Substrate&PP

981317-36-8

Lead monoxide (Lead oxide)

Resistor

170

80-05-7

4,4’-isopropylidenediphenol(bisphenol A)

Substrate BT material/ Substrate&PP
Substrate Core resin/ Substrate Prepreg

182556-67-2

Octamethylcyclotetrasiloxane (D4)

Package ink

183

541-02-6

Decamethylcyclopentasiloxane (D5)

Package ink
Silicone: Sealant184540-97-6

Dodecamethylcyclohexasiloxane (D6)

Package ink
Silicone: Sealant1857439-92-1

Lead

Resistor
Solder ball
Substrate&PP/ Substrate Core resin/
Substrate Prepreg

202

119313-12-1 2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone

20371868-10-5

2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one Substrate_Solder mask/ Substrate&PP

981317-36-8

Lead monoxide (Lead oxide)

Resistor

DRAM
Module

SSD

UFD

HDD

CardPower
bankArticle Location

photo initiator_substrate
Substrate/Substrate solder mask AUS308

17080-05-7

4,4’-isopropylidenediphenol(bisphenol A)

Substrate BT material/ Substrate&PP
Substrate Core resin/ Substrate Prepreg

1857439-92-1

LeadResistor
Substrate&PP

202

119313-12-1 2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone

203

71868-10-5

Photo initiator_substrate
Substrate
2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one Substrate_Solder mask/ Substrate&PP

981317-36-8

Lead monoxide (Lead oxide)

Resistor
R-U & Over coating of CHIP RESISTOR

170

80-05-7

4,4’-isopropylidenediphenol(bisphenol A)

Substrate&PP

183541-02-6

Decamethylcyclopentasiloxane (D5)

Silicone: Sealant184

540-97-6

Dodecamethylcyclohexasiloxane (D6)

Silicone: Sealant

1857439-92-1

Lead

Resistor

1857439-92-1

Lead

Resistor
Substrate&PP
solder & Solder flake & Chip & Solder Pasteof Diode203

71868-10-5

2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone

Substrate&PP&Substrate_BT17080-05-7

4,4’-isopropylidenediphenol(bisphenol A)

Substrate

1857439-92-1

Lead

Resistor

202

119313-12-1 2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone

Substrate
Photo initiator_substrate

203

71868-10-5

2-benzyl-2-dimethylamino-4'-morpholinobutyrophenone

Substrate_Solder mask

20471850-09-4

Diisohexyl phthalate

Substrate_Solder mask

167

1120-71-4

1,3-propanesultone

Electrolyte

196

129-00-0;
1718-52-1

PyreneCoatings*The listed table is based on supplier’s response before the date of issue of this declaration.