T-MicroFrom chip level to 12” wafer level 3D processing

Tohoku-MicroTec Co., Ltd.
We provide cutting-edge 3D-IC R&D Prototyping and Pilot / Low-Volume Production Service State-of-the-art technologies◦ 200mm and 300mm 3D process engineering lines and advanced technology platforms- design / layout / mask making- wafer / chip thinning- forming TSV on chip / wafer (front side / backside TSV)
- redistribution routing- both side u-bumps formation on chip / wafer- chip / wafer stacking

 3D stacking LSIs prototype manufacturing service◦ Prototyping of proof of concepts using commercial/customized 2D chips◦ die-level 3D hetero-integration with backside TSV technology

 Support your small-volume, special customized 3D productions◦ base-line process set-up for the pilot production◦ facilitate your product development

 2.5D interposer R&D foundry and pilot production service◦ Large area interposer◦ Interposer with passive devices

 Development innovative 3D stacking technologies for creative 3D products andapplications
 Supply IP and special customized TEG wafers for process-induced reliabilitycharacterization

SoC: System on Chip (System LSI)Advantages of 3D IC
Conventional SoC

3D-SoC
Length of TSV:
20-150mm

Compound semiconductor

Sync.
clock

segment 2D-SoC
into functional
blockLong Global interconnect
 large RC delay, large CP-Short global interconnect
small RC delay, small CP-High band width-Small form factor

1. Maximization of electrical performances
2. Increase of circuit density
3. New Architecture (Hyper-parallel processing, Multifunction, etc)
4. Heterogeneous integration
5. Cost reduction
6. Realization of high performance detector with ~100% area factor in chipTechnology / Samples
Low cost 3D-Soc Manufacturing Technology

Au micro-bump connection
We focus on a versatile bonding technology for silicon LSI,
compound semiconductor, and microelectromechanical system
devices at temperatures of less than 200 C for heterogeneousintegration. Our new gold (Au) micro-bump technology is one of thepromising candidates for this purpose.

TSV
Micro-bumpHeterogeneous Integration
Low cost fabrication

Cylinder bump for fragile material

5μm pitch Au Cone bump
Overall view

1.3 mmμ-bump
μ-TSV (10k~1M TSVs/chip)

5μm 5μm

5μm38 chips stack

CdTeSi

3D-Sensor/DetectorTSV Process
0.7μmΦ

3D-MEMS/Hetero-Integration

5-10μmΦ3μmΦ

Cu Sidewall

18μm

30μm

MEMS Chip

LSI Chip

Substrate

3D Stacked Imager Sensor
Vertically Stacked MEMS on LSI Chip

3μm

Back gate Metal

Cu Sidewall

UT

Cu-TSV (Via last)

Chip

MEMS Chip

Cu-TSV (Via middle)

W-TSVInterposer

2.5D Interposer

5μｍ

Inductor
Chip

LTUT: upper tier
LT: lower tier

50mm

LSI ChipCavity Chip
Beam
Lead

12-inch Wafer

Cu TSV

3D Stacked SOI pixel detector

MicroProbes for Neural recording
・Diagnosis and treatment for brain disorder・Research for BMI/BCI
Practical use
Epilepsy
245,000

Essential Tremor[Double-sided Si Probe]

Research/Investigation

LSI
Chip

Hetero-Integrated LSI-MEMS
Multi-Chip ModuleOthers

Double–sided
Si Probes

Depression
775,000

80,000Parkinson’s Disease
216,000

Obsessive-Compulsive
Disorder (OCD)
Dystonia

Capacitor
Chip

Lineup of Neural
Microprobes

Neurodegenerative
Disease3,500,000

4-shunkDouble–sided
Si Probes[ Tungsten core Omnidirectional probe]
w/ optical waveguide

Array type
Microelectrode

Diagnosis of Epilepsy patient

Microprobe
w/ μ-fluidic channel

200mm/300mm 3D Integration Process Facilities

NpD for conebump

Self-Assembly MultichipBonder

Metal Etcher

Low Temp.
Asher

High-Aspect-Ratio Sputter

Self-Assembly System

Wafer Debonder

T-MicroWafer Grinder CMP

Electroplating System

Temporary Bonder

Deep Si RIEDeveloper

Double sided
i-Line Stepper

CtW / WtW Aligner and Bonder

Edge Trimming Dicing Saw

Tohoku-MicroTec Co., Ltd.

CtC / CtW Flip-Chip Bonder

Evaporator for Metal Bump

TSV Liner-CVD(http://www.t-microtec.com)

Headquarter （Japan)
6-6-40 Aza-Aoba Suite 203, Aramaki, Aoba-ku,
Sendai, 980-8579 Japan
Phone:+81-22-398-6264, Fax:+81-22-398-6265
info@t-microtec.com
US Office
750 North King Road #206 San Jose CA 95133
USAPhone: 408-464-7972
hasegawa@t-microtec.com

Ver.9.0
Information in this document is subject to change without notice.
Copyright (C) 2016 Tohoku-MicroTec Co., Ltd. All Right Reserved.