Create the future with日制钢机电商贸（上海）有限公司
公司介 绍

以独特的构思和技术开拓未来Pioneering the future with unique ideas and technologies
我们的目标是凭借创新的“想象力”和迄今为止培养的“核心竞争力”，
为瞬息万变的行业发展做出贡献，创造辉煌灿烂的未来。
JSW Aktina Syetem is contributing to development in a rapidly changing world
and creates a bright future by “ability to generate innovative ideas" and “core competencies"that has been evolved over the years.

我 们 的 使命
1. 我们致力于技术创新和可持续发展，为解决客户的难题，始终贴近客户
并努力成为最佳合作伙伴。
2. 我们尊重多样性，人与人之间的纽带，为实现真正富有和“激动人心的社会”做出贡献。

Our missions
1. JSW Aktina Syetem aims for continuous technological innovationand sustainable growth in order to be the best partner for all customers
by always providing solutions to their challenges.
2. JSW Aktina Syetem will contribute to the realization of a truly affluent andmotivated society by respecting diversity and connecting people with each other.

2

M E S SAG E

在 需 要 时 ，提 供 需 要 的 产 品
Delivering what’s needed, when it’s needed
JSW AKTINA SYSTEM株式会社是从株式会社日本制钢所（JSW）的平板显示器事业部门独立出来，于2021年10月1日成立的新公司，是电子器件制造设备的生产厂商。
从1995年到今天，我们作为准分子激光退火设备的先锋，一直引领行业，为世界高精细平板显示
器的发展做出了贡献。在逾25年的经验和业绩基础上，为了实现更大的飞跃，我们乘着新船驶向新的领域。
在技术创新周期非常短的半导体/平板显示器市场，与客户的相遇和互动是我们的生命线。在这一
重要的互动中，必须准确把握每个客户的需求，切实满足客户的需求。我们应该去做的事情就是创造“客户需要的产品”，并在“客户需要的时机”提供给客户。
我们将最大程度地灵活应用迄今为止积累的技术、技巧以及人才资源，今后将继续开发想象力和技术，为多样化、高度化的需求提供独特的解决方案。我们将朝着“成为关键时刻客户可以依赖的伙伴”这一目标，勇往直前。
请多多关照。
JSW Aktina System Co., Ltd. was established on October 1, 2021 as a provider of electronic device manufacturing
equipment as a result of the spin-off of The Japan Steel Works, Ltd. (JSW)’s flat-panel display business division.
From 1995 up to today, we have led the industry as a pioneer of excimer laser annealing systems, and havecontinued to contribute to the development of high-definition flat-panel display products around the world. Basedon our experience and achievements over the past 25 years, we have embarked on a voyage into a new realm tomake a further leap forward.
In the semiconductor and flat-panel display markets, where the cycle of technological innovation is extremely
short, our encounters and connections with customers serve as our lifeline. Through close communication withthem, it is essential for us to accurately understand the needs of each and every customer and respond to themwith confidence. We must create what the customer wants, and provide it at the right timing when the customer
needs it.
We will make the most of our resources, including the technology, expertise, and human resources that wehave cultivated over many years, and continue to hone our creativity and technology to offer unique solutions
to increasingly diverse and sophisticated needs. In addition, we will continue to forge ahead toward our goal of
becoming a partner that people can count on in times of need.
We look forward to your continued support and patronage.

董事长兼总经理

谷川贞夫
Sadao Tanigawa
Managing Director3我们以综合全面的解决方案来实现【最 先进的产品制造/价 值创造】
We offer comprehensive solutions to support cutting-edge manufacturing and value creation.

Sales
准确满足各个需求
We cater to the needs of our customers.
由常驻在国内外各分部的销售人员听取客户的需求、商业动向、以及针对设备和技术的需求，通过会议和试验等，提出符合要求
的最佳解决方案。
Sales representatives stationed at each of our locations in Japan andabroad always pay attention to customer needs and business trends
and what kinds of systems and technologies are desired. Then, throughmeetings and demonstration tests, we materialize customer’s requests
to propose optimum solutions.

Customer Ser vice顾客/服务分部 Customer & Service Locations
顾客 Customer

贴 近 客 户，致 力 于 解 决 问 题

We work closely with our customers to solve their problems.
常驻国内外 各分 部的多位各国籍现 场服务工程师，充分应 用
ICT/AI技术，可迅速响应客户需求并解决问题。
Experienced and highly skilled multinational field service engineers,
stationed at each of our domestic and overseas locations, use ICT/AI
technology to quickly respond to customers’ requests and solve theirproblems.
4

销售

客户支持

提供高可靠性的量产设备We offer highly reliable mass-production systems.

开发/设计

制造

D e vel o p m e n t a n d D e s ig n

在平板显示器及半导体用激光退火设备为主的电子制造设备开发/设计的领域，凭借以逾25年的知识和业绩，提供
高性能且实现稳定运行的量产设备。
Based on our knowledge and experience of more than 25 years in the development and design of electronic device manufacturing
equipment, including laser annealing systems for flat-panel displays (FPDs) and semiconductors, we provide mass-production
systems that achieve high performance and stable operation.

工艺精度 Process accuracy（µm）

退火（结晶化、活性化）
Annealing (Crystallization, Activation)

Lift-off（剥离）Lift-off (Debonding)Cutting（切割）Cutting

Drilling（打孔）Drilling (Piercing)1

半导体用μLA设备µLA system forsemiconductors

半导体用LA设备LA system forsemiconductors

10

激光微细孔加工设备
Laser micro-drilling system
FPD用LA设备LA system for FPDs

FPD用FLC设备FLC system for FPDs
FPD用LLO设备
LLO system for FPDs

100

Manufact u r ing
快 速 满足各种各样的需求
We can quickly cater to a wide variety ofcustomer requests.
我们公司位于首都地区的主要公共交通设施附近，交通便利。
同时在公司内设有用于设备制造的无尘室设施，我们可以应对各种客户的需求。
We have a clean room facility for systems manufacturing, conveniently
located close to major public transportation networks in the capitalarea, so we can easily respond to a wide variety of customer needs.

羽田机场

Haneda Airport横滨站Yokohama Station5

Products
面向以技术创新日新月异的平板显示器、半导体等为首的最尖端领域，提供激光退火设备、激光剥离设备等高性能、
高可靠性的量产设备
及相应的技术支持。
We provide high-performance, highly reliable mass production systems
such as laser annealing systems and laser lift-off systems,
along with trusted technical support,
for cutting-edge sectors including flat-panel displays and semiconductors,
where technological innovation is advancing day by day

6Products

准分子激光退火装设备Excimer Laser Annealing System

准分子激光退火（ELA）设备是将通过激光照射在玻璃基板上
成膜的非结晶硅膜改性为多晶硅的设备。TF T（薄膜晶体管）
作为高精细面板的驱动部，广泛使用了低温多晶硅，是智能手
机、车载显示器、便携式游戏机等高精细面板的制造不可缺少的设备。

The Excimer Laser Annealing (EL A) system conver ts amorphoussilicon film on a glass substrate into a polycrystalline silicon one. The
low-temperature polycrystalline silicon is generally used in the TFT(Thin Flat Transistor) of the high-resolution panels. ELA System isessential for the production of high-resolution panels, such as
smartphones, automobile monitor and portable gaming devices.

大型准分子激光退火设备（支持六代线基板）Excimer Laser Annealing System (Gen 6)

中型准分子激光退火设备（支持四代线基板）Excimer Laser Annealing System (Gen 4)

Features特性■应用本公司独有的基板搬送技术“StiFloat ™”，进一步提高了工艺性能■通过多循环搬送，成功提高生产效率（较本公司以往提高25%）并降低CoO（较本公司以往降低25%）■通过用户生产支持系统（iSCAN™），实现设备状态的自我监测，为提高成品率做出贡献■为了扩大工艺余量，通过Pulse Extender，成功改善
MURA、实现缓解脉冲的波动■通过延长激光管寿命，改善保养成本■通过振动分析实现耐抗振设计业绩■ Further increase process performance with our original substratetransport technology “StiFloat ™”■ Improved production capacity (25% up) and CoO (25% down) withmultiple cycle handling operation■ Self-monitoring of the system status with data integration anduser production support system (iSCAN™) contributes yield
improvement■ Expansion of process margin to improve nonuniformity (Mura) andmitigation of pulse fluctuation using a Pulse Extender■ Reduction of maintenance cost by extending a tube lifetime■ Anti-vibration design by vibration analysis

Sales Records

自1995年销售以来，已向中国、日本、韩国、
台湾地区和新加坡的显示器制造商交付200多台设备。

Since 1995, we have installed over 200 systems to display companies in China,
Japan, South Korea, Taiwan and Singapore, as one of the top manufacturers of
the ELA system.

■规格 Specifications
G4.5

G6

G8.5

G10.5

Mobile, VR
Automotive or In-Vehicle

Mobile, VR, Foldable
Automotive or In-Vehicle

OLED Tablet & Foldable
8K TV & Monitor

8K TV

730×920 mm

1,500×1,850 mm

2,200×2,500 mm

2,940×3,370 mm

TFT

LTPS

LTPS

LTPS

BG-LTPS

激光 Laser

Vyper

Twin-Vyper
Tri-Vyper

Tri-Vyper

Tri-Vyper

LB750.2

LB1000

LB1500

LB1500XL

StiFloat™ or Air bearing stage

StiFloat™ or Air bearing stage

StiFloat™

StiFloat™

应用 Applications
基板尺寸 Substrate size

光学系 Optical system
工作台 Stage

7

StiFloat™

独创的基板搬送技术 Our original substrate transport technology

优点 Advantages
可支持大型基板（～G10.5），
实现高性能且稳定的ELA工艺Capable of handling large substrates (up to G10.5),
achieving a high-performance, stable ELA process

通过独创的基板搬送技术，提供最佳的ELA工艺。

Our original substrate-transfer technology provides the most optimal
ELA process.

通过提高基板搬送时的匀速来
实现稳定的激光照射工艺

Stable laser irradiation process byimproving velocity stability during substrate transport通过非接触的无摩擦搬送可获得工作台的速度稳定性，
因此照射MURA会减少。

通过提高照射部基板平坦度
来扩大工艺余量

Expanding process margin by increasing flatness of
substrates in irradiation area

与VC＊2方式相比，由于搬送基板的构造，只需将激光照射部的限
定区域平坦化即可，所以，照射区域的平整度得到了提升。
因此，在激光照射时，基板会在激光焦点范围内的固定高度上进
行加工。

The JSW-FLEA system structurally transports only a substrate andincreases the flatness of substrates in irradiation area compared with the
VC✽2 method since only a limited irradiation area needs to be planarized.
Therefore, during laser irradiation, the substrates are processed at aconstant height within the focal range of the laser beam.

减少照射MURA

Reduction of irradiation Mura

在以往的系统中，因N 2 流动或VC引起的MURA问题可以得到
控制

N 2 flow Mura and Mura caused by VCs, which have been issues withconventional ELA systems, are reduced.

•流动MURA
利用气浮式结构，充分运用气流控制技术，对激光照射部N2气流进行
了优化设计。
•VC引发的MURA
由于不与VC接触，因此不受VC的槽等引起的基板背面的影响，不会发生VC引起的照射MURA。

• Airflow Mura
The N 2 airflow in the laser irradiation area is optimally designed using
airflow control technology, taking advantage of the float-type structure.
• Mura caused by VCs
Due to the lack of contact with VCs, the backside of the substrate is notaffected by VC grooves, etc., and irradiation Mura caused by VCs does
not occur.

抑制ESD＊3的产生

Reduction of ESD✽3

由于在FELA系统内以几乎非接触的状态搬送基板，因此不会因接触而产生静电。
另外，在进行基板夹持等接触/剥离动作的部位，针对静电问题也
进行了部件选定和结构设计。

Since the substrate is transported in an almost non-contact state in the
JSW-FELA system, static electricity caused by contact is not generated.
In addition, components in contact with substrates such as
substrate-gripping parts are made of materials that prevent ESD generation.

Particle的抑制

Reduction of particle

FELA系统中，只有基板在非接触状态下搬送，所以与现有类型相比，Particle的飞散、附着极少。

In the JSW-FELA system, only substrates are transported in a state of
non-contact, so particles spread and adhered to the substrate are
extremely small compared to conventional systems.

＊1 FELA: 气浮式ELA设备
＊2 VC: 真空吸附式基板保持台＊3 ESD: 静电放电8

Non-contact frictionless transport provides speed stability for the stage,
reducing uneven irradiation.

✽1 FELA: Float-type ELA system✽2 VC: Substrate holding stage of vacuum-suction type
✽3 ESD: Electro-Static Discharge

气浮式工作台

大型基板用气浮式工作台

大型基板的搬运（公司内设备）

Float-type stage

Float-type stage for large substrates

Large substrate handling equipment (in-house equipment)

采用气浮式工作台的JSW-FELA＊1系统的特性通过利用空气使基板浮起，将基板背面的接触限定在最小限度的区域，实现了几乎非接触的搬送。

Features of the JSW-FELA ✽1 system with a float-type stage
The glass substrate (substrate) is transported with almost no contact,
since the contact on the back of the substrate is limited to the minimum by floating the substrate with airflow.

关键技术 Key Technologies■激 光 照 射 位 置 的 玻 璃 基 板 浮 起 量 的 剖 面 图
Cross-sectional plotting of levitation amount of glass substrate at laser irradiation position
激光光路 Laser beam path

在FEL A系统中最重要部分的激 光照射部的
浮板上，通过独创的浮起量控制技术巧妙地赋予约束力，使基板保持平坦且保持一定的悬
浮高度。

The float plates at the laser irradiation area, which
are the most impor tant par ts of the JSW-FEL A
system, are designed to provide a restraining force
so that the substrates are kept flat and the float
height is constant, using our original floating
control technology.

布局设计技术
通过浮板的布局设计技术克服大型基板用的
浮式工作台的原理性问题，即基板中央部鼓起成圆顶状，基板角部的浮起高度降低的现象，
同时能够控制基板的浮起量。
也可以在工作台上进行基板的旋转或纵横2个
方向的搬送。
通过精心设计的工作台布局能够缩短基板的
搬出/搬入时间。
与传统型ELA设备相比，能够缩短运行时间，减少激光器的消耗。

Layout design technology
The layout design technology of the float plates
overcomes the phenomenon that the center of thesubstrate expands into a dome shape and the float
height of the corner of the substrate decreases,
which is the issue of the principle of the float-typestage for large substrates, and the float amount of
the substrate can be controlled. It is also possible
to rotate the substrate on the stage and transport itin two directions, horizontally and vertically.
The ingenious st age layout reduces the timerequired for loading and unloading of substrates.
Takt time and laser consumption can be minimized
compared to conventional ELA systems.

玻璃基板
Glass substrate

搬送方向Transfer direction
浮起区域 Floating area（d）玻璃基板的中央位置（搬送的正交方向）
24µmCenter of glass substrate(Orthogonal totransfer direction)（c）距离玻璃基板端部1,505mm的位置
1,505 mm from glass substrate edge

60

玻璃基板平坦度 Flatness of glass substrate（µm）

Suppression mechanism of
substrate height variationin the laser irradiation area测定点 Measurement point

40
20
0

28µm

（b）距离玻璃基板端部755mm的位置
755 mm from glass substrate edge

1,500
1,400

60

25µm

40

1,200

20

1,000

0

800

（a）距离玻璃基板端部5mm位置
5 mm from glass substrate edge

600

60

400

15µm

40

200

20
0

0

500

1,000

1,500

2,000

60 40 202,500 2,900

玻璃基板位置（搬送方向）
Position of glass substrate (Transfer direction)（mm）

0玻璃基板位置（搬送的正交方向）
Position of glass substrate (Orthogonal to transfer direction)（mm）

激光照射部位基板高度
变动的控制结构

测定点的玻璃基板平坦度
Flatness of glass substrate
at measurement point(μm)■F－E L A 工艺与传 统 型 E L A 工艺 的 运 行 时 间 示 意 图比 较
Image of tact time comparison between FELA process and conventional ELA process

F-ELA工艺 FELA process
激光
照射

激光
照射

激光
照射

激光
照射

激光
照射

激光
照射

激光
照射

时刻
玻璃基板更换

传统型ELA工艺 Conventional ELA process
Laser
irradiation

Laser
irradiation

Laser
irradiation

Laser
irradiation

Laser
irradiation

Laser
irradiation

Time
Glass substrate exchange

9Products

激光剥离设备
Laser Lift-Off System

柔性显示屏具有薄而轻，可弯曲且不破裂的出色优点。激光剥离（LLO）设备是通过激光照射无应力地剥离已形成为载体玻璃状的柔性显示屏的设备。使用波长短的紫外光激光，仅被剥离用的树脂层的表层吸收，因此能够防止对器件的损伤。

Flexible displays have excellent advantages as thin and light, bendable
and unbreakable. The Laser Lift-Off (LLO) system detaches a flexible
display from a carrier glass substrate without applying stress to it. We
select a UV laser of short wavelength that can be absorbed at the only
surface of debonding layer, so that laser irradiation cannot affectflexible display.

特性

Features■通过自主开发的基板搬送工作台，实现高生产效率
（较本公司以往提高50%*1）■可选择搭载激光的波长：
准分子激光（308nm）或固体激光（343nm）■搭载工艺监控功能（剥离判定）■搭载转向键功能（AI的自动条件提出功能*2）■减少空间面积（较本公司以往减少40%*3）■ Our original substrate transport stage technology brings highproduction capacity. (50% up ✽1)■ Available Excimer laser (308 nm) and DPSS laser (343 nm)■ Process monitoring function (Judgment to detach or not)■ Turnkey operation (Automatic irradiation condition setting by AI✽2)■ Small footprint (40% reduction✽3)＊1 取决于客户使用的线状光束的重叠率。
＊2 通过深层学习进行判定，因此需要在客户协助下，取得多张剥离结果图像。
＊3 支持柔性显示屏（G6.5 Half Size）✽1 Depends on the overlap rate of the line beam used by the customer.
✽2 Process judgment is made with deep learning,
so the customer is required to provide the pictures of their panel after LLO.
✽3 Compatible with flexible panels (G6 half size).

业绩Sales Records

作为量产用设备，向日本、韩国、中国等国家的显示器制造商交货。

Delivered to display companies in Japan, South Korea and China, etc. formass-production system.

■规格 Specifications
准分子激光器 Excimer Laser

固体激光器 DPSS Laser

基板尺寸 Substrate size

1,500×925 mm

1,500×925 mm

激光波长 Laser wavelength

308 nm343 nm输出 Power

600 W

800 W

750×0.35 mm

750×0.03 mm

光束尺寸 Beam size / LA × SA

10

薄膜激光切割设备Products

Film Laser Cutting System
薄膜激光切割设备用于柔性显示器的制造工序，可以进行薄膜
或片材的切割、剥离、清洗等多个工序的处理。搭载两种激 光
器，用CO 2 激光器进行切割薄膜的全切割，以及只切割多层中
的上层的半切割，用UV激 光器可以实现高精度的切割工艺。
另外，也可以加工大型尺寸的基板，最适合作为量产设备。

The Film Laser Cutting system handles multiple processes of cutting,peeling, and cleaning of a film or sheet. With two types of laser, it
processes full-cutting to cut films and half-cutting to cut only upper
layers from the multiple layers of films with CO 2 laser and higher
accuracy cut ting process with UV laser. Available for large-size
substrates, this system can meet the mass-production needs.

Features

特性■通过本公司设计的光学系统和工作台的同步控制实现
精密加工■支持从薄膜切割到剥离、边缘清洗的流水线工艺
■也支持大型基板（TV尺寸）的切割■可加工多种基板厚度（也可以是带玻璃的薄膜）■ Precision machining by synchronized control of the optical system andstage designed in-house■ Inline process including film cutting, peeling and edge cleaning■ Available for cutting large panel sizes (TV)■ Cutting various types of works (available for film on glass)业绩Sales Records

用于柔性有机EL显示器的制造。

It is used to manufacture flexible OLED displays.

■规格 Specifications
激光切割（Full /Half /Pad Cuts） Laser cut (Full/Half/Pad cuts)剥离 Peeling

支持工艺 Process

等离子清洗 Plasma cleaning外观检查 Visual inspection

激光器种类 Laser type

CO2 Laser, UV Laser

切割精度 Cutting accuracy≤ ±50 µm

■加工事例 Process examples
热影响宽度单侧 160μm（CO2激光器）
热影响宽度 HAZ

HAZ (one side) 160 µm (CO2 Laser)

光仅透过消失的部位
Light can pass through at disappearance area only

反射型显微镜图像
Reflective microscope image

消失宽度 Disappearance width扩大Enlarged

透射型显微镜图像
Transmission microscope image

消失宽度 12μm（CO2レーザ）

Disappearance width 12 µm（CO2 Laser）

11

Products

半导体用激光退火设备
Laser Annealing System for Semiconductors

近年来，半导体器件的结构高度集成化，在制造工序中，需要仅
提高表面局部温度的热处理工艺。本公司开发的固体激光退火设备就可以满足这样的需求，主要在高性能图像传感器领域作为量产设备使用。另外，我们也朝着将其应用于其他领域的目标开展研发活动。

Due to the increasing high integration of semiconductor device
structures, there is a growing demand for heat-treatment processes
that target the local surface layer of the device. Our Laser Annealing
system meets such demands, which are now mainly used for the mass
production of high-performance image sensors. We are also engaging
in R&D activities in order to expand the application of our system.

特性■通过脉冲控制可以调整加热时间■深层区域的活性化■浅层区域的活性化■最多可支持12英寸晶片尺寸业绩凭借活性化工艺用途，被半导体制造商采用。

Features■ The heating time can be adjusted by pulse control■ Deep area activation■ Shallow area activation■ Work size: up to 12-inch wafers

Sales Records
We have sold the system used for an activation process toa semiconductor manufacturing company.

■活性化试验结果案例 Activation test results example
基于SIMS和STR的B和P的深度方向的浓度分布
Distribution of B and P concentrations in the depth direction by SIMS and STR

12

浅层区域和深层区域的同时活性化（离子注入条件：P/750keV、B/40keV）

仅深层区域的活性化（离子注入条件：P/3MeV）

Simultaneous shallow and deep areas activation (Ion implantation condition: P/750 keV, B/40 keV)

Only deep-area activation (Ion implantation condition: P/3 MeV)

Products

微型激光退火设备Micro Laser Annealing System

微型激光退火（μLA）设备将由Mask pattern 图案控制的微
小光束照射到基板上的特定位置。通过μLA设备，可以在不使基
底基板达到高温的情况下，在微米要求下，对微小区域的薄膜进行结晶化，活性化，高介电化等改性。

The Micro Laser Annealing (µL A) system irradiates a microbeam
controlled area by a mask pat tern to a specific position on thesubstrate. With the µL A system, thin films of minute area in the
micro-meter order can be cr ystallized, activated, made highly
dielectric, etc. without affecting the base substrate with heat.

特性■以±5μm的位置精度向晶片的特定位置照射■作为量产设备正在运行■晶片搬送■Top Flat光束■Mask投影光学系统

业绩在半导体量产工厂使用。

■规格 Specifications

Features■ A device that irradiates a specific position on awafer with an accuracy of ±5 µm■ In operation as a mass-production system■ Wafer auto handling■ Top Flat beam
■ Mask projection optical system

Sales Records
It is used in semiconductor mass-production factories.

Products

6 inch, 8 inch

工件尺寸 Workpiece size
定位精度

±5 µm

Positioning accuracy

激光
Laser

波长 Wavelength

248 nm脉冲宽度 Pulse width

20 ns

输出 Power

30 W
3 min/wafer（6 inch）

工艺用时 Process throughput

Mask Projection, Top ﬂat beam, Min Sq 10 µm/
Max Sq 2.4 mm, Several pattern on 9 inch Mask

照射 Irradiation
设备尺寸 System dimensions

W 3200×D 4000×H 2500mm（With automatic wafer handling）

激光微细孔加工设备
Laser Micro Drilling System

激光微细孔加工设备能够对聚酰亚胺胶带、玻璃等各种材
料形成以微米为单位的微 细孔。因为是利用激 光进行加工，所以能够进行局部的热处理，因而也被应用于电子器件的制造。本公司开发了最适合本设备的光学系统、照射位
置控制系统，不断积累可满足产业界要求的技术。

特性■直径4μm的微细打
孔加工■槽加工、图案化
■退火业绩用于医疗、美容设备的制造。

Features■ Micro drilling as small as 4 µm
■ Laser scribing and patterning■ Laser annealing

Sales Records

The Laser Micro Drilling system forms fine holes in the unit of a micrometerfor various materials such as polyimide tape, glass and others. This process
is using the laser annealing
technic on local position andis adopted in mass production
for electronic devices. We
have been developing optics
systems and irradiation
position control systems forlaser process and accumulatetechnology to meet industrial
request.

We have sold the system for
medical and beauty equipment.

■加工事例 Process example■规格 Specifications
准分子激光器 Excimer Laser

激光波长 Laser wavelength

248 nm

光束尺寸 Beam size

4×2 mm

最大能量密度 Maximum energy density

1.6 J/cm2

光束扫描 Beam scan

XY Stage

20 µm

50 µm

激光器种类 Laser type

4µm

用LMD设备制作的2阶段加工事例
Example of two-step machining made with the LMD system

13

Customer Support

JSW Aktina System株式会社凭借”高效运行设备“使客户放心。
JSW Aktina System is assuring a high productivity system for customers.
After-sales Service
Field
Support● 定期维护

● Periodic maintenance● 修理● Repair● 故障诊断● Troubleshooting受过培训的服务工程师，从定期的配件更换到紧急情况的应对都能提供精准的支持服务。
在紧急情况下，工程师会根据积累的数据库迅速做出响应。
Well-trained service engineers support the smooth operation of systems from periodic parts replacement to emergencies.
In an emergency, our engineers provide rapid support based on our accumulated knowledge,
various experiences and proper solutions stored in our database.

遍布亚洲的服务分部 Service locations in Asia
各分部配备了经验丰富的工程师，以安心、安全为宗旨提供服务。
Experienced engineers in each location support systems safely.

Ordos

日制钢机电商贸（上海）有限公司
Wuhan
ChengduJSW Electromechanical Trading (Shanghai) Co., Ltd.
Kunshan

Shanghai
Jinshan
XiamenShenzhen

China

Yokohama

ShanghaiTaiwanSingapore

Local service location
本地服务分部
Sales & service location
销售/服务分部
服务部件仓库（保税仓库） Service parts warehouse (Bonded warehouse)

14

JSW AKTINA SYSTEM株式会社
JSW Aktina System Co., Ltd.

在售后服务方面，提供包括激光退火设备在内量产设备的修理、移设、部件销售及保养服务。
销售、开发/设计、制造、服务四位一体，致力于更高精端设备的问题解决和改造。
We offer repair, relocation, parts sales, and maintenance service for mass-production systems including laser-annealing systems.
Our four groups of sales, RD/design, manufacturing, and service closely cooperate to provide higher level of solutions and improvements to your system.

Solution Service
Production
Support● 常驻支持● 部件销售

● On-site support● Parts sales● 培训● 设备记录

● Training● Machine record● 呼叫支持● On call support为了让客户长期安心使用设备，我们还提供设备培训和对应工程师的常驻服务。另外，通过
本公司独创的机器记录系统（设备处理记录）为客户提供服务支持。
To improve uptime and efficiency we are pleased
to offer training and on-site engineer support
ser vice. We use our original machine record
system (to record all system trouble and events)
to support customers.

SystemUpdate● 保养、修理● Overhaul and repair● 移设● Relocation● 改良、改造● Upgrade and retrofit
我们承接客户设备的移设及为改善质量而实
施的修理、改造。如果有需要解决的问题，请
随时咨询。
We offer system relocation and overhaul/upgradefor quality improvement. If there is a request or
issues with your system, please contact us.

Process
Support● 生产支援系统（iSCAN™） ● User production support system (iSCAN™)● 质量改善调查● Quality improvement survey● 分析（SEM、AFM）● Analysis (SEM, AFM)

iSCAN™
结合各系统和AI的用户生产支援系统

User production support system combined each monitoring systems with AI

分析工具

Analysis tool监控系统

Monitoring system

设备数据System dataAI我们可以满足和提高生产效率、改 To increase productivity and improve
善质量/成品率的需求。近年来，我 product quality/yield, we can provide
们还致力于开发使用AI的生産支援 technical solutions. Recently, wedeveloped a production suppor t
系统（iSCAN™）。
system (iSCAN™) using AI.

iSCAN™
预防保全、减少停机时间、减少不合格品
For preventive maintenance, downtime reduction, and process quality improvement

15

Technology
随着平板显示器的高精细化和半导体电路的高集成化的不断发展，对量产设备的性能要求也越来越高。
我们每天都努力开发新技术，除了开发最符合客户所需系统的光学设计外，还钻研极其精细的各种控制技术等。
As flat-panel displays become more high-definitionand semiconductor circuits more highly integrated, mass production systems are
increasingly required to provide a sophisticated performance.
We are constantly striving to improve our technological expertise by
developing optical designs optimized for the systems that customers need,and by creating various fine-tuned control technologies.

16Solution 1

Technology

光学设计技术
Optical Design Technology

JSW Aktina System株式会社可提供适用于各种激光工艺的
光学系统方案。

We are able to make suggestions for suitable optical systems for various
laser processes.

■最佳激光光源的选定■聚光光学系统、投影光学系统的构建■光束轮廓仪、光功率计量等辅助类设备的选定
提供可将光学要素、支架类、测量设备等系统进行升级，并提供在生产设备上可运用的激光设备。

■ Select optimal laser source■ Build condensing and projection optical systems■ Select auxiliary equipment including beam profilers and optical power
meters. We set up optical elements, mounts, measuring equipment,
and provide laser systems to operate as production systems.

特殊投影透镜的设计、制作案例

Example of design and fabrication for special projection lens

用于缩小与被摄体距离（WD）长度的投影系统用透镜

Projection lens for reduced-size projection system with long working distance (WD)

长WD投影透镜
Projection lens for long WD

投影透镜的波前像差测试案例
Example of measuring wavefront aberration on projection lens

半导体晶片用LD光学系统的案例结合多个红外激光二极管的输出，形成光束状的光学系统

Example of LD optical system for semiconductor wafers
Optical system that changes shape from several infrared laser diodes to line beam combining laser outputs
矩形光纤
Rectangular optical fibers

四芯光纤阵列4-core fiber arrays

投影面（晶片面）的光束强度分布Beam intensity profiles of a plane of projection (wafer plane)

17Solution 2

决定高精度定位的控制技术

Technology

High-Precision Positioning Control Technology
在最先进的激光工艺中，对工件的玻璃基板和半导体晶片的精密搬送技术是不可缺少。
本公司考虑各种激光工艺和光学系统的特性，设计最合适的工作
台搬送系统，并在客户的工厂实施从安装到运转的业务。
我们拥有高精度工作台的精度保证所需的激光干涉仪、自动准值仪、校准器等，有助于设备的稳定运行。另外，为了充分发挥高精度工作台的性能，控制程序也很重要。我们提供将运动控制器、定位光学系统、位移传感器等组合而成的综合控制技术，来保证稳定运行工作台的搬送系统。

The high-precision transport technology is necessary for workpiecesof glass substrates or semiconductor wafers with cutting-edge laser
processing.
We build an optimal stage transport system considered characteristics
for various laser processes and optical systems, and then set andlaunch our products at customers' manufacturing plants.
We have laser inter ferometers, auto-collimators and levelers toguarantee the accuracy of high-precision stages, and manage them forstable operation of our products. Also, a control program is essential
to take advantage of the performance of high-precision stages. We
provide stage transport systems with stable operation, using total
control technology combined with motion controllers, alignment
optical systems, and displacement sensors.

在激光退火工艺中，工件搬送的匀速性非常重要。
下面表示匀速性测定结果的一例。
It is indispensable that the workpiece transport velocity remains stable in the laser annealing process.
Measurement result example of velocity stability is shown.
+0.4

速度稳定性 Velocity stability（%）+0.3

ForwardBackward

+0.2
+0.1

激光照射区域±0.18%以内

0.0

In irradiation area within ±0.18%

-0.1
-0.2

激光照射区域

-0.3
-0.4
0

Irradiation area
20

40

60

80

100

120

时间 Time（s）

X-Y工作台绝对位置定位精度的测定案例
即使在工艺时间较长的情况下，通过实施对应技术，也能保持高水平的绝对定位精度。

Measurement example of absolute positioning accuracy on X-Y stages

Even in a long-process time case, apply countermeasure technology to maintain high absolute positioning accuracy.

225mm
（X）
×80mm
（Y）

漂移 Drift（µm）

X轴（无对策） X axis (without CT）

Y轴（稳定化对策） Y axis (with CT）
X轴（稳定化对策） X axis (with CT）

位置漂移用测定点
Measurement points for position driftY轴（无对策） Y axis (without CT）
X-Y工作台动作模式
X-Y stages operating pattern经过时间 Time（h）

18

Solution 3

Technology

照射环境/Particle控制技术
Irradiation Atmosphere/Particle Control Technology

随着FPD的高精细化，更 加严格的要求工艺管理变得重要起
来。本公司注重以激光照射部环境及腔室内的气流分析技术，为
提高客户的产品成品率做出贡献。

With the needs of high-resolution flat-display panels, stricter process
management is important. Our accumulated technology over analysis
of irradiation atmosphere and air flow in chamber assuredly improves
customer’s production yield.

Solution 4

Technology

工艺分析技术
Process Analysis Technology

我们致力于激光照射的Si结晶化工艺以及分析技术的研发。在各种分析技术的基础上，满足客户的要求。

We have been developing a process for laser cr ystallization of
amorphous silicon and engaged in R&D ac tivities of analysis
technique. Our various analysis technique will provide customers withsolutions.

分析案例Analysis example

通过扫描探针显微镜分析结晶化Si表面形状
Analysis of surface profile by scanning-probe microscope on crystalized silicon

由激光照射的照射间距而引起的形状变化
Profile change associated withlaser irradiation pitch

200µm

使用电场发射扫描型电子显微镜分析结晶化Si2次电子图像和结晶方位的案例
Analysis examples of secondary electron image and orientation of crystalized silicon by field emission SEM

2.5µm

2.5µm

19

设备开发的业绩

Achievements of system development

激光退火设备
Laser Annealing System
JSW Aktina System株式会社不仅研发了主
力ELA设备，还开发了各种类型的激光退火设备，交付给显示屏制造商和半导体制造商。
JSW Aktina System株式会社根据工艺需求
提供适用于各种退火工艺设备。
JSW Aktina Syetem has developed not only the ELA
system but also various t ypes of laser annealing
systems used by end users.
JSW Aktina Syetem proposes annealing processes andsystem suitable for the process.

SLS设备Sequential Lateral Solidification (SLS) System

对aSi膜进行激光照射熔融、固化后，Si膜沿着面内横向生成
结晶（Lateral solidification）。SLS是通过激光照射Mask
pattern，控制结晶生成的起点，在基板的整个面上形成均匀
粒径的pSi膜的方法。
JSW Aktina System株式会社为SLS方法开发了设备，并于
2004年向显示屏制造商交付。SLS设备通过投影透镜向玻璃基
板上的aSi膜照射300W的准分子激光。在大功率激光器中的光学系统的稳定性和工作台位置控制方面，采用了各种各样的功能和技术。
When the aSi film is melted and solidified by irradiating it with a laser,
the Si film grows laterally along the in-plane (Lateral solidification).
SLS is a method of controlling the starting point of crystal growth byirradiating a mask pattern with a laser to form a pSi film with a uniform
grain size on the whole surface of the substrate.
JSW Aktina System has developed a system for the SLS method anddelivered it to display manufactures in 2004. The SLS device irradiates
the aSi film on the glass substrate with a 300-W excimer laser using a
projection lens. It is equipped with various functions and know-how forstabilizing the optical system and controlling the stage position in
high-power lasers.

20

SLS设备
SLS system

SLS法的Beam Patterns和pSi结晶（SEM）
Irradiation beam patterns using SLS method and pSi grain (SEM)SLA设备

Solid state Laser Annealing (SLA) System

SLA设备是为了使aSi膜向一个方向连续结晶而研发的设备，于2007年向显示屏制造商交付。SLA设备搭载脉冲宽度可变（300～1200ns）的固体绿色激光，通过将光束宽度8μm的线状光束向一个方向扫描并退火，形成面方位一致的大粒径的pSi。SLA设备也可适用于半导体晶片，现在也用于CMOS图
像传感器的制造。
The SLA system was developed to continuously crystallize the aSi filmin one direction and was delivered to display manufacturers in 2007.
The SLA system is equipped with a solid-state green laser with variable
pulse width (300 to 1200 ns), and by scanning and annealing a line
beam with a beam width of 8 µm in one direction, a large particle size
pSi with uniform surface orientation is formed. SLA systems has also
been expanded to semiconductor applications and is still used in the
manufacture of CMOS image sensors.

应用于半导体的设备
SLA system for semiconductors

应用于FPD的设备
SLA system for FPD

pSi晶体（SEM）
pSi grain (SEM)

pSi晶体（EBSD）
pSi grain (EBSD)

R－SPC设备

Rapid Solid Phase Crystallization (R-SPC) System

R－SPC是通过固相生成技术实现aSi膜结晶化的设备，于2010年向显示屏制造商交付。R－SPC设备高速地向aSi膜照射连续
波（CW）的激光。能够以微秒级改变加热时间，以最佳的加热时间在G2基板的整面形成高品质微细的pSi膜（Grain Size10～20nm，迁移度2～5cm2/V·s）。
The R-SPC system is used for crystallizing aSi film by solid phasegrow th, and was delivered to display manufacturers in 2010. The
R-SPC system scans a continuous wave (CW) laser beam onto the aSi
film at high speed. Therefore, the heating time can be controlled in the
microseconds order, and a high-quality fine pSi film (grain size: 10 to
20 nm, mobility: 2 to 5 cm2 / V·s) can be applied to the whole surfaceof the G2 substrate at the optimum heating time.

R-SPC的pSi晶体（SEM）
pSi grain made by R-SPC system (SEM)

21

公司信息

Company Information

公司概要 Corporate Profile
公司名称

JSW Aktina System株式会社

Company Name成立

2021年10月1日

JSW Aktina System Co., Ltd.

Incorporated

October 1, 2021

董事长兼总经理 谷川贞夫

Managing Director

Sadao Tanigawa

总公司地址〒236-0004
神奈川县横滨市金泽区福浦二丁目2番地1

Head Office2-1, Fukuura 2-chome, Kanazawa-ku,
Yokohama-shi, Kanagawa 236-0004, Japan资本金

110百万日元

Share Capital

110 million yen

事业内容平板显示器及电子器件相关设备/装置的制
造、销售、修理、改造、移设、部件销售及维护事业等

Business Lineup

Production, sales, repair, modification, relocation,
parts sales, and maintenance service for
equipment/systems related flat-panel displays
and electronic devices

沿革 Corporate History
1907年

北海道炭矿轮船（株）和英国阿姆斯特朗·惠特沃斯公司

1907

The Japan Steel Works, Ltd. was founded as a joint venture by（Sir W.G. Armstrong, Whitworth & Co., Ltd.）、

three companies:

维克斯公司（Vickers Sons and Maxim, Ltd.）三家公

Hokkaido Colliery Steamship Company of Japan,

司共同出资成立株式会社日本制钢所

Armstrong Whitworth Co., Ltd., UK, and

1936年

横滨制作所在横滨市金泽区泥龟町竣工并开始运营

Vickers Sons and Maxim, Ltd., UK.

1983年

将横滨制作所搬迁到现在的金泽区福浦

1995年

1936

开始准分子激光退火设备的生产（第一台设备交付）

2006年 ·作为准分子激光退火设备的售后服务公司，成立了JSW

1983

2011年

G5/G6准分子激光退火设备上市

2014年

以株式会社日本制钢所在中国设立的法人公司JSW

1995
2006

2021年 ·JSW IT SERVICE株式会社继承株式会社日本制钢所
10月
的平板显示器事业，成立了JSW AKTINA SYSTEM株• Delivery of the 100th Excimer Laser Annealing System.
2011
2014

会社的100%出资公司，设立日制钢机电商贸（上海）有限公司

G5/G6 Excimer Laser Annealing System was launched.
JSW Machinery Trading (Shanghai) Co., Ltd., a Chinese subsidiary of
The Japan Steel Works, Ltd., started system sales andafter-sales service business of Excimer Laser Annealing System

式会社。
·在中国的法人公司，作为JSW AKTINA SYSTEM株式• JSW IT SERVICE CO. was founded as an after-sales service companyof Excimer Laser Annealing System.

子激光退火设备的中国销售/服务业务。
准分子激光退火设备 200台交付

Production of Excimer Laser Annealing System started(delivery of the first system).

Machinery Trading（Shanghai）Co., Ltd.开始准分
2019年

Relocation of Yokohama Plant to the current Fukuura,
Kanazawa-ku, Yokohama-shi, is completed.

IT SERVICE株式会社·准分子激光退火设备 100台交付

Construction of the Yokohama Plant is completed and goes into
operation at Deiki-cho, Kanazawa-ku, Yokohama-shi.

2019

Delivery of the 200th Excimer Laser Annealing System

Oct. 2021 • JSW IT SERVICE CO., Ltd. took over the manufacturing systembusiness for flat-panel display of The Japan Steel Works, Ltd. andestablished as JSW Aktina System Co., Ltd.
• JSW Electromechanical Trading (Shanghai) Co., Ltd. established in
China as a wholly owned subsidiary of JSW Aktina System Co., Ltd.

22

组织图 Organization Chart
股东大会

董事会

董事长兼总经理

General Meeting of
Shareholders

Board of Directors

Managing Director监事
Audit & Supervisory
Board Member战略规划室 Strategic Planning Office
销售部 Sales Department
管理部 Administration Department
管理组 General Affairs Group生产管理组 Production Control Group
采购组 Procurement Group开发设计部 Development and Design Department
一组 GroupⅠ
二组 Group Ⅱ质量保证部 Quality Assurance Department质量保证組 Quality Assurance Group检查组 Inspection Group客户支持部 Customer Support Department现场服务组 Field Service Group工厂服务组 Factory Service Group
技术服务组 Technical Service Group23

Locations
日制钢机电商贸（上海）有限公司

JSW Electromechanical Trading (Shanghai) Co., Ltd.

销售/服务分部
Sales & service location

China

JSW AKTINA SYSTEM株式会社
JSW Aktina System Co., Ltd.

Yokohama

ShanghaiTaiwanSingapore

Head Quarter
JSW AKTINA SYSTEM株式会社
邮编236-0004 神奈川县横滨市金泽区福浦二丁目2番地1
TEL：+ 81-(0)45-787-8462 FAX：+ 81-(0)45-785-1379

JSW Aktina System Co., Ltd.

2-1, Fukuura 2-chome, Kanazawa-ku, Yokohama-shi, Kanagawa 236-0004, Japan
TEL: +81-(0)45-787-8462 FAX: +81-(0)45-785-1379

Sales Office日制钢机电商贸（上海）有限公司
JSW Electromechanical Trading (Shanghai) Co., Ltd.

304, Metro Plaza, 555 Loushanguan Road, Changning District, Shanghai, China
TEL: +86-21-52665155

JSW Plastics Machinery (Taiwan) Corp.

1F., No.21, Da Hu 1st Road, Guieshan Shiang, Taoyuan, Country 33373 Taiwan, R.O.C.
TEL: +886-3-396-2102

The Japan Steel Works (Singapore) Pte. Ltd.
17 Gul Lane, Singapore 629413
TEL: +65-6861-4511

https://www.jsw-aktina.co.jp/
Printed in Japan 50 MG 2023.12