X8060
Universal
2D/3D X-ray inspection

MXI+µCTX-ray inspection for larger inspection objects
Semi-automatic X-ray inspection
in 2D and 3D Modes

X8060 – the flexible µCT-system
The X8060 was developed for destruction-free inspection in industrial andscientific settings. The typical application areas of the X8060 are character­ized by the system’s ability to handle not only large or heavy inspection objects,
but also to inspect the smallest parts, with the highest magnification.

2D and 3D inspection
without mechanical conversion
Designed for larger, heavier
inspection objects

Optional microfocus computed tomography (µCT) enables 3D inspec­tion and visualization of the inspection object. Along with the spatial
assignment of production defects and material flaws, individual slices
or section images can also be visualized with this process. Due to its
exceptional spatial display capabilities, the µCT improves defect locali­zation and enables direct measurement within the volumetric model.

Precision manipulator withup to 8 CNC-capable axes
Clamping joints,
3D volume reconstruction

High magnification with
angled radiation

The system’s 8-axis manipulator opens up entirely new possibilities
for angled radiation with high magnification. The structure of hidden
solder joints in electronic assemblies, such as with BGAs, is revealed,
and larger inspection objects can be inspected with the same system.
These multiple application possibilities save costs and increase systemutilization. A real-time image processing system provides all im­age refinements without time lag, allowing the operator to concen­
trate fully on the inspection task.

Convenient, direct positioning
by clicking on optical
overview image
Fast, accurate 2D measurement
process independentof magnificationClamping joints, 3D slice
reconstruction withdistance measurement

Microfocus computed tomography(µCT) for volume reconstruction

The core of the X-ray technology is a high-capacity, open microfocus
X-ray tube, designed to provide highest flexibility, outstanding image
quality and stable in-line operation. Its user-friendly design guarantees apractically unlimited service life and quick, easy maintenance, minimizing
costs.

Independent, real-time image processing with Viscom analysis tools
Realistic 3D volume modelwith measurement inall spatial directions

Viscom specializes in automatic inspection. A wide selection of Viscom‘sown analysis tools are also available for the X8060.

Excellent image quality throughhigh-contrast resolution
Defective aluminium
weld seam

X-ray inspection delivers information about the interior of a 3D inspection object. Even in 2D mode, quick, highly magnified views of the third
dimension are possible. But with the help of modern computed tomography,
the 3D mode allows the reconstruction of complete volumetric models,
allowing non-destructive slices to be made or measurements taken in any
direction.

Defective THT solder joints

This flexibility makes the X8060 a valuable inspection tool for various industrial applications. Typical defects recognized by this non-destructive
process are tears, bridges, pores, voids, foreign bodies, form deviations, incorrect positioning, misalignment, or inhomogeneous material transitions.

µCT: Microfocus computed tomography of a turbine rotor

Optical view

3D volumereconstruction

Non-destructive
3D slice througha casting defect

2D X-ray image,casting defects

Technical Specifications
X8060-16 X8060-20 X8060-22 X8060-25
X-ray technology
X-ray tube 	Open all-metal Viscom tube, series XT9000 with reflection ortransmission target
High voltage
10 - 160 kV
10 - 200 kV
10 - 225 kV
10 - 250 kV
Tube current
5 - 1000 µA or 5 - 3000 µA
Target load
Max. 40 W/500 W
Detail recognition< 2 µm/< 1 µmMagnification	Direct geometric magnification without collimator > 4000 x
Image intensifier	High-resolution digital flat panel detectors (12/14/16 bit)
Option0 - 60° angled view with digital flat panel detector
X-ray cabinet	In compliance with the German X-Ray Regulations (RöV)
regarding fully protected devices. Leakage radiation < 1µSv/hSoftware
User interfaceViscom XMCOption	BGA analysis BGA-S
Pore analysis software (void calculation) ACA-S
THT analysis software THT-S
Wire sweep analysis software WSA-SµCT module for all available detectors listed above
System computer
Operating system
Processor

Windows®
Intel® Core™ i7

Sample handling
Manipulator 	4 axes (X, Y, Z and rotation n x 360°)
Horizontal X/Y-axis
Travel range: 610 x 460 mm (24.0" x 18.1")
Vertical Z-axis
Travel range: 800 mm (31.5")
Detector axis (option)
60° pivoting, variable detector distance, travel range: 700 mm (27.6")
Tilt axis± 60° option
Max. sample size X/Y
660 x 510 mm (26.0" x 20.1") (L x W)
Max. sample weight
30 kg (66 lbs), with option tilt axis 10 kg (22 lbs)
Test piece change
Pneumatic front window
OptionPneumatic front slide door
CT axisStandard
Inspection speed		Variable
Other system data
Power requirements	400 V (other voltages on request), 3P/N/PE, 8 A
System dimensions
2211 x 1846 x 1964 mm (87.0" x 72.7" x 77.3") (W x H x D)
WeightApprox. 4000 kg (8818 lbs)

Front view

Side view

Top viewHeadquarters:
Viscom AG
Carl-Buderus-Straße 9 - 15 · 30455 Hanover · Germany
Tel.: +49 511 94996-0 · Fax: +49 511 94996-900
info@viscom.com · www.viscom.com

Visit our website to find international subsidiaries andrepresentatives in Europe, USA and Asia:

www.viscom.com

Specifications subject to change without notice. Windows® and Intel® Core™ i7 are registered trademarks. October 2015

# Viscom_SYS_X8060_EN15100009

Dimensions in mm