KODAK FLEXIBLE PRINTED ELECTRONICS

Realize your next product – in unrivaled detailWith Kodak as your functional printing partner
Making your vision real
At Kodak, we’ve spent years developing our expertiseand assets in the design and manufacture of fully
additive, transparent, flexible electronics. And now
we’re sharing them with you.
You may be looking to develop your own proof ofconcept or cost-effective prototypes. You may evenbe ready for full-scale production. Whatever yourvision, we’re ready to offer our expertise and support,
our groundbreaking KODAK EKTAFLEX functional
print technology — and our world-class cleanroom
facility — to propel you on your path, without you
having to risk a major capital investment.

What we’ll do
We can image your designs in ultra-high resolution to flexographically produce
features that simply aren’t possible with screen or inkjet printing — in pilot or mass
production quantities. We’ll even do this on both sides of a substrate simultaneously.
Our seasoned specialists will remain by your side throughout the process, giving
you the confidence to integrate your functional print innovations, seize newopportunities, and make even your most future-facing ideas a reality — fast.
How we do it
We’ve taken the huge advances we’ve made in flexography over the past decade
to develop our KODAK EKTAFLEX functional printing tools. KODAK EKTAFLEX
patterned plates can be used to print ultra-high-resolution features on arange of substrates.

We can produce transparent, highly-conductive
patterned film products
for your applications:

We use a highly productive, cost-effective roll-to-roll flexo printing process tocreate extremely detailed patterns on flexible substrates for integration intoyour products. This patterning is enabled by our KODAK EKTAFLEX imager that
produces patterns on flexographic plates at 12,800 dpi. We can:• Conductive traces & passive circuitry• Manufacture multilayer printed electronic components in our cleanroom• Surface heating• Add value to your product with transparent conductive film components
with copper micro-wires formed by printing a catalyst and electroless plating
copper for conductivity• Capacitive sensing• Antennas and RF shielding
Alternatively we can partner to commercialize yourcleanroom manufactured printed electronics productin our facility.

• Further obscure these elements with a neutral color passivation layer andadditional graphics inks
We’ve long since proven this technology in our own manufacturing operations.
Now we want to see where you can take it.
A revolution in resolution.

KODAK FLEXIBLE PRINTED ELECTRONICS
Design Services
Supported file types

Most vector formats, such as: AI, PDF, DXF and other CAD and PCB formats;
Preferred multi-layered DWG/DXF; wire-frame, closed polyline for contract manufacturing
and copper micro-wire products

Design translationOptimization for performance and transparency for copper micro-wire products

Imaging resolution

12,800 dpi imager, 2 µm edge definition

Substrate Specifications
StandardPET, 50 µm to 125 µm (2-mil to 5-mil)

Alternative substrates

Certification of customer specified substrates from 50 µm to 125 µm (2-mil to 5-mil)

WidthStandard roll width @ 17"

Standard design area

337 mm x 566 mm

Supporting Graphics Content
Inks / colors / etc.

UV curable preferred; black and yellow graphics inks standard

Logos, labels, etc.

Customer defined process color possible

Camouflage

Pattern and color matched to copper micro-wire patterns for improved covert integration

Marks for downstream processing

Customer defined marks and fiducials for downstream integration (black ink standard)

Serialization

Unique 2D data matrix barcode & human readable text inkjet printed on each part (black)

Functional Patterns (Contract Manufacturing Products)
Functional inks

Conductive Ag and dielectric inks available

Customer supplied/defined inks

Standard process for ink certification for contract manufactured products

Functional Patterns (Copper Micro-Wire Products)
Copper thickness

Cu thickness from .5 µm to 1.5 µm

Passivation

Standard option for environmental stability and color neutralization

Copper minimum feature size

10 µm standard; below 7-10 µm available depending on design

Delivered Product Specifications
Release testingElectrical, optical and/or dimensional testing available

Finished format

Roll, sheet, or die cut

Protective liner

Optional on one or both sides

Contact us at sales.printedelectronics@kodak.com
Eastman Kodak Company 343 State Street Rochester, NY 14650 USA. Produced using KODAK Technology.
©Kodak, 2022. Kodak, Ektaflex and the Kodak logo are trademarks of Kodak. K-1000.22.10.25.EN.01