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10th Generation Intel® Xeon/Core™ Series Processors, High Performance, Expandable
and Modular Rugged Embedded Computer with 2 PCI/PCIe Expansion SlotOverview
The DS-1302 is a powerful embedded computer and brings unrivalled performance. It has versatile functionalities and rich industrial I/O. And mostimportantly, it has dual PCI/PCIe expansion capability. Equipped with Cincoze’s CMI, CFM, MEC modular expansion, customization for additional
I/O or other functionality to fulfill different applications couldn’t be easier. The DS-1302 meets the requirements of industrial environments and iscertified with industry standards. It delivers ultimate and reliable performance for factory automation, industrial automation and rolling stockapplications.

• 10-core 10th-gen Intel® Xeon® and Core™ i9/i7/i5/i3 CPU (max 80 W TDP)
• 2x GbE LAN and optional 2x 10GbE LAN• 2x 2.5" SATA storage, 3x mSATA sockets, 1x M.2 key M for NVMe SSD• 2x PCI/PCIe expansion slots• 3x full-size Mini PCIe sockets, 2x SIM card slots• Optional CMI modules for I/O expansion• Optional CFM modules for ignition sensing & PoE• Wide operating temperature -40°C to 70°C
• MIL-STD-810G military standard and EN50155 (EN 50121-3-2 only)-40~70°C

MIL-STD
810G

EN62368-1

DS-1302

10-Core,Up To 80 W CPU
The DS-1300 series, powered by a workstation-grade 10th-gen
Intel® Xeon® or Core™ i9/i7/i5/i3 CPU with up to 10-core architecture, provides superior processing performance. The DS-1300

10-CORE & 80W

Workstation Grade Processor Support!

supports Xeon® CPU up to 80 W TDP. It incorporates DDR42933/2666 MHz memory up to 128 GB, delivering unparalleledperformance in a rugged, fanless system.

More Powerful & Faster
Multiplies Productivity
The DS-1300 series’s 10th-gen CPU brings to 31% better

multi-tasking compute-intensive application

31%

10th Gen i9-10900E
CPUinteger multi-tasking for compute-intensive application

9th Gen i7-9700

performance than 9th-gen CPUs*. DDR4 2933 MHz memory
further increases speed by 10%**. The processing platform

Transfer ratedelivers the performance required to consolidate multiple
workloads for intelligent devices and applications.

Memory* 31% increase for 10th-gen i9-10900E 65W vs 9th-gen i7-9700 65W CPU

10%DDR4 2933 MHz
DDR4 2666 MHz** 10% increase for 2933 MHz of DS-1300 vs 2666 MHz of DS-1200.

Industrial I/O andModular Expansion
The DS-1300 series offers a vast array of industrial-focused I/O
including up to 2x GbE LAN, 6x USB 3.2, and 2x USB 2.0, 2x
RS232/422/485, 2x 2.5" SATA, 3x mSATA, 1x M.2 key M for NVMe
SSD, 2x SIM card slots, 3x full-size Mini-PCIe and triple independent displays (DisplayPort, HDMI, VGA). It also features modular
expansion

throughCincoze’s

CMI/CFMmodules,addingadditional I/O or other functionality such as high-speed 10GbE
LAN, PoE, and ignition sensing.

DS-1302

PCI/PCIeAdd-on Cards
DS-1302 can accommodate dual PCI/PCIe add-on cards up to 110mm x 237 mm (combined max 110 W). Flexible PCI/PCIe expansion allows the addition of I/O, GPU, image capture, data acquisition, and motion control cards for specific applications.

Adjustable
PCIe Card Retainer
The PCI/PCIe expansion slots include two adjustable card retainers that firmly secure the PCI/PCIe add-on cards. The retainer is acool feature that provides the extra protection needed to prevent
add-on cards from shaking loose in high-vibration environments
like rolling stock.

Rugged Reliability
Against Rigorous Environments

OVP

OCP

9~48VDCThe DS-1300 series’s fanless and cableless industrial-grade-40~70°C

MIL-STD
810G

design can withstand rigorous environments. Its uniquethermal design supports an extended operating temperature
range from -40°C to 70°C. It has also passed stringent
industry

standards,

including

MIL-STD-810G

military

standard and EN50155 (EN 50121-3-2 only) for rolling stockenvironments.

50G/5G

EN62368-1

EN50121-3-2

DS-1302
Specifications
SystemProcessor

Intel® Xeon® Series Processor ( 80W / 35W ):• Intel® Xeon® W-1270E 8 Cores Up to 4.8 GHz, TDP 80W• Intel® Xeon® W-1250E 6 Cores Up to 4.7 GHz, TDP 80W• Intel® Xeon® W-1290TE 10 Cores Up to 4.5 GHz, TDP 35W• Intel® Xeon® W-1270TE 8 Cores Up to 4.4 GHz, TDP 35W• Intel® Xeon® W-1250TE 6 Cores Up to 3.8 GHz, TDP 35W
Intel® Core® Series Processor ( 65W / 35W ):• Intel® Core™ i9-10900E 10 Cores Up to 4.7 GHz, TDP 65W• Intel® Core™ i7-10700E 8 Cores Up to 4.5 GHz, TDP 65W• Intel® Core™ i5-10500E 6 Cores Up to 4.2 GHz, TDP 65W• Intel® Core™ i3-10100E 4 Cores Up to 3.8 GHz, TDP 65W• Intel® Core™ i9-10900TE 10 Cores Up to 4.5 GHz, TDP 35W• Intel® Core™ i7-10700TE 8 Cores Up to 4.5 GHz, TDP 35W• Intel® Core™ i5-10500TE 6 Cores Up to 3.7 GHz, TDP 35W• Intel® Core™ i3-10100TE 4 Cores Up to 3.6 GHz, TDP 35W

Chipset• Intel® W480E Chipset

Memory• 2x DDR4 SO-DIMM Socket, Support Up to 128GB ( Un-buffered and non-ECC)• Xeon / i9 / i7 Processor Supports Up to 2933MHz• i5 / i3 Processor Supports Up to 2666 MHzBIOS• AMI BIOS

Graphics
Graphics Engine• Integrated Intel® UHD-630 Graphics

Maximum Display Output• Supports Triple Independent Display

HDMI• 1 x HDMI Connector (4096 x 2160@30Hz)DP• 2 x DisplayPort Connector (4096 x 2340@60Hz)

VGA• 1 x VGA Connector (1920 x 1200 @60Hz)

Audio
Audio Codec• Realtek® ALC888, High Definition Audio

Line-out• 1 x Line-out, Phone Jack 3.5mm

Mic-in• 1 x Mic-in, Phone Jack 3.5mmI/OLAN• 2 x GbE LAN, RJ45
- GbE1: Intel® I219- GbE2: Intel® I210

COM

• 2 x RS-232/422/485 with Auto Flow Control ( Supports 5V / 12V ), DB9USB• 2 x 10Gbps USB 3.2 Gen2, Type A• 4 x 5Gbps USB 3.2 Gen1, Type A• 2 x 480Mbps USB 2.0, Type A

PS/2• 1 x PS/2, 6 Pin Mini-DIN Female Connector

DS-1302

Storage
SSD/HDD• 1x 2.5” Front Accessible SATA HDD/SSD Bay ( SATA 3.0 )• 1x 2.5” Internal SATA HDD/SSD Bay ( SATA 3.0 )mSATA• 3x mSATA Socket ( SATA 3.0, shared by Mini-PCIe socket )M.2 SSD• 1x M.2 Key M Type 2280 Socket, Support PCIe x4 NVMe SSD or SATA SSD ( SATA 3.0 )RAID• Support RAID 0/1/5/10Expansion
PCI Express• 2 x PCI/PCIe Expansion Slot with Optional Riser Card
* Supports maximum dimensions of add-on card (H x L) : 110 x 237 mm

Mini PCI Express• 3 x Full-size Mini-PCIe Socket

SIM Socket• 2 x SIM Socket

CMI (Combined MultipleI/O) Interface• 2 x High Speed CMI Interface for optional CMI Module Expansion• 2 x Low Speed CMI Interface for optional CMI Module Expansion

CFM (Control FunctionModule) Interface• 1 x CFM IGN Interface for optional CFM-IGN Module Expansion

Other Function
External FAN Connector• 1 x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS)

Power Ignition Sensing• Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V (With Optional CFM Module)

Clear CMOS Switch• 1 x Clear CMOS Switch

Rest Button• 1 x Rest Button

Instant Reboot• Support 0.2sec Instant Reboot Technology

Watchdog Timer• Software Programmable Supports 256 Levels System ResetPowerPower Button• 1 x ATX Power On/Off Button

Power Mode Switch• 1 x AT/ATX Mode Switch

Power Input• 9 - 48VDC, 3-pin Terminal Block

Remote Power On/Off• 1 x Remote Power On/Off, 2-pin Terminal Block

Remote Power LED• 1 x Remote Power LED, 2-pin Terminal Block

Total Power Budget• 180W

PhysicalDimension ( W x D x H )• 227 x 261 x 128 mm

Weight Information• 5.4 KG

Mechanical Construction• Extruded Aluminum with Heavy Duty MetalMounting• Wall Mount

Physical Design• Fanless Design• Cableless Design• Jumper-less Design• Unibody DesignDS-1302

Reliability & Protection
Reverse Power InputProtection• Yes

Over Voltage Protection• Protection Range: 51~58V• Protection Type: shut down operating voltage, re-power on at the preset level to recoverOver Current Protection• 15ASurge Protection• 2 kVCMOS Battery Backup• SuperCap Integrated for CMOS Battery Maintenance-free Operation

MTBF• 371,393 Hours- Database: Telcordia SR-332 Issue 3, Method 1, Case 3

Operating SystemWindows• Windows® 10Linux• Supports by project

Environment
Operating Temperature• 35W TDP Processor: -40°C to 70°C
• 58W – 65W TDP Processor: -40~50°C (With External Fan Kit)
• 80W TDP Processor: -40~40°C (With External Fan Kit)
* PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling)* With extended temperature peripherals; Ambient with air flow
* According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14

Storage Temperature• -40°C to 85°C

Relative Humidity• 95%RH @ 70°C (non-Condensing)Shock• MIL-STD-810G

Vibration• MIL-STD-810G

EMC• CE, FCC, ICES-003 Class A, EN50121-3-2 (Railway)

Safety• IEC/EN 62368-1

DS-1302
External LayoutUniversal I/O Bracket
Ethernet LED

Universal I/O Bracket
USB3.2 Gen2 HDMI

GPIO LED
HDD LED
Temperature LED

Front I/O

DisplayPort
Reset Bu�on

ATX Power
On/Oﬀ
AT/ATX Mode
SwitchRemovable HDD

Antenna

SIM Socket

VGA

CMOS
Ba�eryIGN Se�ng
SwitchPS/2 LAN1 LAN2

COM1
COM2Antenna

RemotePower LED

Rear I/O

DC IN

Remote Power
On/Oﬀ
Line-out
Mic-inUniversal
I/O Bracket

External Fan
USB2.0Power
DisplayPort

USB3.2 Gen1

PCI/PCIe
Expansion

Dimensions

Unit: mm

DS-1302
Ordering Information
Available Models
Model No.

Description

DS-1302

10th Generation Intel Xeon/Core Series Processors, High Performance, Expandable and Modular Rugged Embedded Computerwith 2 PCI/PCIe Expansion Slot

Package Checklist• DS-1302 Embedded System x1• Heatsink Pack x1• Utility DVD Driver x1• Screw Pack x1• Wall Mount Kit x1• Power Terminal Block Connector x1• Remote Function Terminal Block Connector x 2• Fan Terminal Block Connector x 1

Optional I/O Modules

12345Description

12345

CMI-LAN01-R12/ UB1012

CMI Module with 4x Intel I210 GbE LAN, RJ45 Port / 1x Universal Bracket with 4x RJ45 CutoutVV------CMI-M12LAN01-R12 /UB1010

CMI Module with M12 Connector, 4x Intel GbE LAN / 1x Universal Bracket with 4x M12 Cutout

VV--

--

--

CMI-10GLAN03-R10/UB1028

CMI Module with 2x Intel X550 10GbE LAN, RJ45 Port / 1x Universal Bracket with 2x RJ45 Cutout

V----

--

--

CMI-COM02/UB1004

CMI Module with 4x RS232/422/485 Ports (Support 5V/12V) / 1x Universal Bracket with 4x DB9 Cutout

VV------CMI-ICOM01/UB1004

CMI Module with 4x Isolated RS232 Ports (Support 5V/12V) / 1x Universal Bracket with 4x DB9 Cutout

VV

--

--

--

CMI-DIO02/UB1018

CMI Module with 16DIO (8in 8out) / 1x Universal Bracket with DIO Cutout

VV--

--

--

CMI Module with M12 X-Coded Connector, 4x Intel I210 GbE LAN Ports / Universal Bracket with 4x M12 X-Coded Cutout

VV

----

--

Model No.

CMI-XM12LAN01-R10/UB1030-R10

DS-1302

Description

12345

Mini-PCIe Module with 2x RS-232 Ports, 1x Standard DB9 Cable / 2x Universal Bracket each with 1x DB9 Cutout----VVV

MEC-USB-M102-15 /UB0314

Mini-PCIe Module with 2x USB 3.0 Ports, 1x 15cm cable / 1xUniversal Bracket with 2x USB Cutout----VV

V

MEC-LAN-M002-30 /UB0311

Mini-PCIe Module with 2x LAN Ports, 2x 30cm cable / 1x Universal Bracket with 2x RJ45 Cutout

--

--VV

V

Model No.
MEC-COM-M212-DB9 /UB0303

Remark:V : Compatible

Maximum one CMI-COM02 or CMI-ICOM01 module can be installed in this system.

Optional Function Modules
Model No.

Description

CFM-PoE03

CFM Module with PoE Function, Individual Port 25.5W

CFM-IGN101

CFM Module with Power Ignition Sensing Function, 12V/24V Selectable

Optional Riser Cards
Model No.

Description

RC-E8E8-R10Riser Card with 2 x PCIex8 Slots

RC-E16E1-01

Riser Card with 1x PCIex16 and 1x PCIex1 Slots (PCIe x16 Slot Supports Dual Deck Add-on Card)

RC-E16PI-01

Riser Card with 1x PCIex16 and 1x PCI Slots (PCIe x16 Slot Supports Single Deck Add-on Card)

RC-PIPI-01

Riser Card with 2x PCI Slots

Optional Accessories
Model No.

Description

FAN-EX101

External Fan with 4pin Terminal Block Plug and Mounting Bracket, Support Smart Fan

GST120A24-CIN

Adapter AC/DC 24V 5A 120W with 3pin Terminal Block Plug and Tubes, Level VI

GST220A24-CIN

Adapter AC/DC 24V 9.2A 220W with 3pin Terminal Block Plug and Tubes, Level VI

Updated: Dec. 9, 2021.
© Cincoze Co., Ltd. All Rights Reserved. Specifications subject to change without notice.

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