Guidelines for Reticle Data Management Ver.2.0(English Version)

JEITA (Japan Electronics and Information Technology Industries Association)
Committee on Semiconductor Production Engineering
Sub-committee on Reticle Management System

Sub-committee Members
Nobuyuki Iriki (Renesas)
RENESAS Technology Co.

Michio Honma (NECEL)

Takashi Satoh (Toshiba)

NEC Electronics Corporation
Corporate Strategic Planning UnitTOSHIBA CORPORATION
Process & Manufacturing Engineering Center
Advanced ULSI Engineering Dept.II

Norihiko Miyazaki (Fujitsu)

Toshio Onodera (Oki)Toshiharu Matsuda (SANYO)

FUJITSU LIMITED Semiconductor Group
Manufacturing Technology Development Div.
MASK Technology Dept.

Oki Electric Industry Co., Ltd.
Silicon Manufacturing Company (SiMC)WP Business Div.
WP Business Dept.

SANYO Electric Co.,Ltd.
Semiconductor Company
LSI BUEngineering Dept.

LSI Manufacturing Unit
Wafer Process Engineering Development Div.

Tamotsu Uga (ROHM)
ROHM Co.,Ltd.
MASK Production Dept.
VLSI Operation Div.

Observers
SEMI Japan Reticle Data Management TF: Hidehiro Higashino (Oki)Oki Electric Industry Co., Ltd.
Silicon Manufacturing Company (SiMC)WP Business Div.
WP Business Dept.

Selete: Iwao Higashikawa , Nobuyuki Yoshioka
Semiconductor Leading Edge Technologies Inc.
Advanced Technology Dept.

1

Contents

1. Introduction
1.1 Preface
1.2 The overview of Ver1
1.3 Background from Ver1 to Ver2
1.4 Purpose of Ver2
1.5 Scope
1.6 Standardization objects and definition
1.7 Relationship with the related standardization requirement
2. General guideline
2.1 Sharing of reticle data
2.2 The standardized expression for usability of pattern data
3. Guideline for application
3.1 Creative association among applications that use design information
3.2 Comprehensive reusability in process module optimization
3.3 Strengthening linkage between design and manufacturing
3.4 The prospect through the process (extension from a design to a back process)4. The model of Global Joint Guidance2

1. Introduction
1.1 Preface
Our semiconductor business has experienced the period of severe depression
when market shrank and there was severe competition. Now we are getting overcrisis. The market is recovering and business restructuring progresses. And thenwe are trying evolutional change. In this state Market Innovation and Synergistic
Innovation will be important.

The trend of cost requirements

The trend of speed requirements

A mask cost becomes more important in
SoC business
To shorten a manufacturing work flow(including a work flow of engineering)
To reduce personnel (personnel required
to compensate for loss generated byinsufficient introduction of IT)

The mask feed and preparation for
production that correspond to completion of
20 sheets in 3 days including the previous
process
The mask feed preparation for productionthat corresponds to completion of 5 sheetsin 1 day including the wiring processStandardization of reticle data

Inquiry through IT〜scheduling〜ordertaking process becomes shorter--Speedy action, information war
Risk of losing an order due to plan
confusion by rework

Opportunity loss

The unit price for each function
must be reduced sharply. The
data volume of a maskincreases sharply. Therefore,
epoch-making increase inefficiency is required for costand date of delivery.

1000

100

MPU Chip Cost
(microcents/transistors)
Data Volume(GB)FIG. 1

10
YEAR 2001(node) (130nm)

2004(90nm)

2007(65nm)

Figure 1. ITRS2003 roadmap3

1.2 The overview of Ver1
We proposed the guideline Ver.1 for the efficient data handling except pattern data, inorder to respond to the time of Engineering Collaboration when production manufacturing
and design are performed over plural companies.
FIG.2 shows Guideline Ver1's scope. For SoC Business we must improve efficiency of all
works concerning each one reticle through Design, Mask Fab, and Wafer Fab. Based on
consideration about this work-flow, we focused communication at interfaces. In thisdiagram, design area has design activities based on design tool such as circuit design,pattern design, and design rule check and so on. Mask shop has data conversion andprocess step such as OPC generation, EB exposure, inspection. Wafer Fab has incoming
QA and frame specifications. The numbers from 1 to 5 show focused standardization
scope. We think these interfaces need improvement of efficiency most.
FIG.3
shows summary. Order entry, Recipe Maintenance, Defect Analysis, andEquipment clustering have QC data standardization as common part. If QC data
standardization should be comprehensive, standardization for application would be more
efficient. In other words, heterogeneous representation of QC data in each application
area could be integrated to common representation. Then, for example, data in Order
Entry would be reused in Recipe Maintenance or Defect Analysis.

DesignLogic,
circuitdesignMask Shop

Production
control
department

Designdepartment
PatterndesignMask manufacturing
department
Dummy
generationDRC
GDSII datatransfer server

Dummy

OPC

Frame

In-house processing

Process engineering
department

Wafer
manufacturing
department

4

1 Data server

Mask order sheet
Inspection
specification

Frame specification
approval, issue
Inspection data

Frame
specification

Acceptance
Incoming QA

Frame
generation,frame
specification

EB
conversion

Mask order sheet
Inspection specification
Specification code registration

2
3 MaskInspection
data
Inspection
RecipeStandardization
Scope

1 3

SEMI-WG-C

Order Entry
EB exposure

TransTransport
Mask
port
shipment

Wafer fab.

ORC OPC
generation

Pattern data are
excluded from V1.0

2 4

SEMI-WG-B

Recipe Maintenance5

Mask
Inspection

5

SEMI-WG-A

Defect/Repair/Review
clustering

FIG. 24

Introduced Application Topics
in JEITA Guideline Ver.1.0
Order Entry
Spec Sheet

QC data Standardization
should be Comprehensive

Defect Analysis
Procedure

Data Matching

Pattern
data
Deliveryspecification

Dictionary

QC DataStandardization

FocusedRecipe Parameter Data Matching

Recipe Maintenance

Framework

QC data(with structure)

Geometry
structure

Additional
data

Image
data

Process
specification

Calibration
data

Clustering of Equipment

FIG. 35

1.3 Background from Ver1 to Ver2

With progress of device scaling, because it becomes necessary to optimize in every
individual product, the optimization which considers lithography and etching process
and further optimization of the whole which took the design into consideration havebegun beyond the conventional optimization of an exposure process only. Therefore,
the efficiency of data handling should be improved in order to do the linkage with thedesign information on an individual mask efficiently.
For example, it is considered to introduce production systems such as IP shuttle thatcarries two or more products on one reticle for the purpose of mask cost reduction
indispensable to SoC business. It is necessary to share a means to solve thecomplicated data handling accompanying this among designer shops in pluralcompanies and manufacturers.
New Engineering Chain Management Concept is emerging
for Collaborative Innovation.

21st Century

20th Century
Integrated Domestic Manufacturing（Vertical Integration)

DesignDesignMask Process

Mask Process

Wafer Process

Wafer Process

Synergistic Innovation

DesignMask Process

DesignMask Process

Wafer Process Wafer Process

FIG. 46

1.4 Purpose of Ver2
The purpose is the linkage between design and manufacturing for the synergistic
innovation.
The key of the synergistic innovation is deign optimization based on
manufacturability, pattern printability, process specification,and manufacturing optimization based on
integrated process module, pattern dependency device specification.

7

1.5 Scope
This guideline deals with expression for usage of the information relevant to thereticle. This expression will be considered from the view of engineer's activity
using pattern data. This guideline dose not deal with pattern data format itself,that handled in EDA tool such as Stream Format. If both sides are wellstandardized, these will be connected easily in successive activity.

The Outline and Scope of Guideline Ver2.0
The Outline of Guideline Ver2.0

The Scope
scope ofof Guideline
Guideline Ver2.0
Ver2.01. Device Technology

1. Optimization of Process Modules

Differentiation
Technology

2. OPC/PSM/Pattern
Assurance

2. Pattern Data Usability Model
3. The Prospect through the ProcessStandardization
Technology

4. Linkage with Design Information

1. Pattern Application
soft
2. RDM handling
Data

5. Consideration on thecollaboration of standard activity
1. IP Shuttle
Collaboration
Technology

2. Consortium Linkage
3. UDM Linkage

FIG. 58

1.6 Standardization objects and definition

1) Index terminology and expression to handle pattern data
2) Common QC data expression related with various other information that will beneeded in engineering in wafer fab and MASK shops.

Mask nameRegistration measured pattern
Origin coordinate
Measured cell
Measure coordination

Pattern data format
Optimized for processing speed→non-text data
→difficult to use

Expression (Meta data)
Definition ofknowledge・view・property for retrieve・annotation・reference・relation…
About patter data
Standardization of meta data enables

Association among application, automation, and customization for each engineering

FIG. 6 Relation between “expression” and “format”

9

1.7 Relationship with the related standardization requirement
The activities of the overseas organizations that have complementary relationshipare mentioned below:
・SEMI-Japan Reticle Data Management Task ForceThe standardization activities of micro patterning divisiona) It discusses the data-exchange method of the information relevant to a reticle.
b) It intends to draft a guideline.
c) It incorporates mask data into stepper recipe data preparation. It performs
standardization of communication of reticle-related information among design ~mask vender ~ wafer fab.
・SEMI-NA Mask Data Path Task Force
Standardization activities of UDM (Universal Data Mode) Working Group.
a) It discusses the data-exchange method of the information relevant to a reticle.
b) It intends to draft a guideline.
c) In this, Open Access Coalition of Silicon Integration Initiative (Si2) is introduced.
This consortium aims at offering the open standard to the IC design data access.
・MOPXE (Mask Order Processing in the Extended Enterprise)This activity about the mask supply chain is proposed from IMS (Intelligent
Manufacturing System).
The activity is carried out mainly in Europe.

102. General guideline
2.1 Sharing of reticle data

The standardization of expression of reticle related information including design
information such as pattern data should be established, in order to make easy
information exchange (it contains when it consists of two or more companies)
relevant to the reticle, covering mask manufacture and wafer manufacture from adesign.
The environment that can be utilized in common from design to wafer fab. must be
established to fulfill the following conditions.
Conditions :1. Reticle data and reticle-related data must be correlated with a hierarchic
configuration.
2. Reticle data and reticle-related data must be delivered in a standardized method ateach interface.
3. Reticle data and reticle-related data must be defined clearly in their contents.
4. Reticle data and reticle-related data must be stored for each fab. so that therequired data can be taken out whenever necessary.
5. Reticle data and reticle-related data must be protected by the reasonable security
system.
In Ver2, these include standardized expression to use design information such as
pattern data.
In SEMI-TF activities based on guideline ver1, standardized expression are
considered with XML technology.

11

2.2 The standardized expression for usability of pattern data

Apart from standardization of the data format of the pattern data itself, expression ofreferencing pattern data and other additional information that are associated in casepattern data is utilized should be standardized.
Pattern data itself is complexly structured and huge in volume. If it will be used in wafer
fab, standardized expression is necessary considered from the point of view how
engineers use it. Such expression works as indexing, annotating, relating with otheruseful information and combining several application. Figure 7 shows the image of thisstandardized expression. Engineering Chain Management must refer to Design Datathrough Quality Consideration, Process Consideration, and Cost Consideration.

Ex) Specification in desired pattern based on check Rule A
1. Check Pattern(must be assessed impact on wafer)
a. Minimum space in dense patternaddress
center of the area
location to be checked
area to be observed
b. Gap between Line End and Corner
Address
center of the area
location to be checked
area to be observed
gap definition
upper edge
down edgec. Severe Line for performance

FIG. 712

3. Guideline for application
3.1 Creative association among applications that use design information
The standardized representation should be considered with practical usage in order tomake it possible to associate applications using design information.
For example, the Flexible Mask Specification Methodology proposed from TOSHIBA in
2002 Photo Mask Japan associates several concepts of applications. The Hot Spot
Pattern is selected as most critical each reticle by verification tool. And Mask
Specification is decided considering process window by simulation.

Pattern Data Usability Models
Usability Models would be proposed that are
abstracted and constructed based on
consideration about such examples.

for example....
Flexible mask specification
Specificpatterns

Devicepatterns

Hot spot
patterns

Design Data
conventional

Focus

Other
Knowledge
SourceQuality
Considerations

Process
Constraints

Cost
Considerations

Pattern Data Usability Models
Engineering Chain Management(Integrated Process Optimization)

Dose

Lithography Window
with mask errors

Flexibility identified patterns to
decide mask specification
S.Nojima et. al.(TOSHIBA ) /PMJ 2002

FIG. 813

3.2 Comprehensive reusability in process module optimization

Standardized expression should be comprehensible for every process in a module andbe reusable.
Recently process optimization is considered based on integrated process modules. Like
this device process consists of multiple process modules. And each process module
consists of many process steps like this. And then nowadays all process steps need to
be aware of pattern layout dependency. For this reason process engineers must refer tohuge storage of design information. If there are comprehensive models between processmodules and Mega Storage of design information, they will be convenient to optimize forengineering chain management. As Figure 9 shows, they are thin layer that processengineers use to index design information. This guideline is intensive only on Reticle
Data Management, but naturally, they would be reused in all process modules,

Isolation

ChannelGate

Contact

Interconnect[1] Optimization of the Integrated process module
All Process Steps need to be aware of pattern layout dependency
Eachintegrated
Depomask/wafer
CMP fabrication
Litho processes
Etchis compacted
Depo to oneCMP
process moduleProcessthat is categorizedby isquality
and steps of fabrication.
Optimizationconsidered
And this
one module
shouldbe unified
as a single
function unit.
Inspection
Inspection
Inspection
Inspection
Inspection
Inspection
based
on Integrated
Process
Module.
Ver2.0: Comprehensive Usability Model for end-user application

Mega Storage of Informationin UDM and legacy in-house systems

FIG. 914

3.3 Strengthening linkage between design and manufacturing

Standardized expression should be able to strengthen linkage between design andmanufacturing that can improve mutual optimization based on understanding
relations with extensibility and reusability.
Corresponding to the future production system of design/manufacture cooperation,
the standardized expression should be extensible so that the design side informationsuch as DRC information, adding to pattern data, and the manufacture sideinformation such as process margin evaluation can communicate mutually, and sothat it is reusable to optimization of pattern data dependency even with processes
other than lithography process. Like Figure 10, Design and Manufacturing aredepending and encouraging each other. Through this circulating communication,
optimizations will be improved. In Design these are Optimizations based on
Manufacturability, Pattern Printability, and Process Specification. In manufacturing
these are Optimizations based on Integrated Process Module Performance, Pattern
Dependency, and Device Specification.

Enforcement of Linkages between Design and Manufacturing

Depending& Encouraging
Ver.1.0 Ver.2.0
Reticle Frame Data

Ver.2.0(Pattern Image)(Electric Characteristics)

Design
QC point Coordinates
Defect Coordinates

Order Entry
Recipe Maintenance

Manufacturing(Design Rule Check)Optimization based on
Manufacturability,
Pattern Printability
Process Specification…

Ver.1.0(Quality Control)(Robust Design)(Flexible Methods)Clustering of Equipment
Defect Analysis

Depending& Encouraging
Optimization based on
Integrated Process Module,
Pattern Dependency
Device Specification…

FIG. 1015

3.4 The prospect through the process (extension from a design to a backprocess)

The standard expression of data exchange ranging from design to wafer processintensively (mentioned in Ver1), should be considered so that it is reused in Back
End Processes, such as testing and defect analysis.
Same as in process module optimization, standardized expression might be reusedthrough the process namely Design to Delivery. Already Wafer Map Information
should be standardized through the process. If there would be the hierarchical model
raging from wafer map to pattern data, they might promote pervasive integration in
the semiconductor-manufacturing world. In the same way as process module
integration, these guidelines are intensive only on Reticle Data, but it is possible tohave such expectation.

Prospect Through The Process:Design to Delivery

Universal Data Model with Usability Model will be the Passport
validate in all around Semiconductor Engineering Chain.
Product
Planning

DeviceDesignMask
Fabrication

Wafer
Fabrication

Testing &Packaging

QA &DeliveryVer2.0: Comprehensive Usability Model for end-user application
Mega Storage of Informationin UDM and legacy in-house systems
Our guidelines
Guidelinesare
areintensive
intensiveonly
onlyononReticle
ReticleData
DataUsability
UsabilityModel,
Model,
Our
but naturally,naturally,theybuttheywould
would bebe reusedreusedininall
allthetheEngineering
EngineeringChain.
Chain.
FIG. 1116

4. The model of Global Joint Guidance

So that standard expression of RDM may cooperate with the standardization activities for thecommon interface of database storing information used in RDM, they should be considered tobe convertible.

Standard Data Modelfor all EDA Tool

Standard TAG System
for user engineer's usage

XML Representationof Standard TAG System

exampleOPC Tune

Open Function
for Access EDA data

Exposure Tool

P10
Pattern Data
Usability Model

DRC

Pattern Data
Usability Model

Simulation

API
Data
Model

Defect Analysis
Inspection
Recipi

Positioning of Ver2

API

All
EDA
Data

temporary or extended
Temporaryextended data
data

FIG. 1217

Contact JEITA Reticle Management Subcommittee Members
Role

Name

Company
Oki Electric Industry Co.,Ltd.

Toshio Onodera

Silicon Manufacturing Company
WP Business Div.
WP Business Dept.

Takashi SatohTOSHIBA CORPORATION
Process & Manufacturing
Engineering Center
Advanced ULSI Engineering
Dept.Ⅱ

Toshiharu Matsuda

Michio Honma

Address〒193-8550
550-1 Higashi-asakawacho Hachiouji-shi Tokyo
TEL (0426)62-6234
FAX (0426)62-6709
E-M onodera021@oki.com〒235-8522
8 Shinsugita Isogo-ku Yokohama-shi Kanagawa
Yokohama Office
TEL (045)770-3605
FAX (045)770-3570
E-M ta.sato@toshiba.co.jp

Semiconductor Company
LSI BUEngineering Dept.

〒370-0596
1-1-1 Sakata Oizumi-Machi Ora-gun Gunma
TEL (0276)61-8043
FAX (0276)61-8836
E-M mats067701@sanyo.co.jp

NEC Electronics Corporation〒211-8668

SANYO Electric Co.,Ltd.

Corporate Strategic Planning Unit 1753 Shimonumabe, Nakahara-Ku,Kawasaki Kanagawa
TEL (044)435-1406
FAX (044)435-1870
E-M m-honma@cp.jp.nec.com

Sub-Leader

Norihiko Miyazaki

FUJITSU LIMITED
Semiconductor Group
Manufacturing Technology
Development Div.
MASK Technology Dept.

LeaderNobuyuki Iriki

RENESAS Technology Co.
LSI Manufacturing Unit
Wafer Process Engineering
Development Div.

Tamotsu Uga

ROHM CO., LTD.
MASK Production Dept.
VLSI Operation Div.

〒197-0833
50 Fuchigami Akiruno-shi Tokyo(Akiruno Technology Center)
TEL (042)532-2158
FAX (042)532-2882
E-M miyazaki.norihi@jp.fujitsu.com〒312-8504
6-16-3 Horiguchi Hitachinakashi,Ibaraki-ken
TEL (029)270-2185
FAX (029)270-1792
E-M iriki.nobuyuki@renesas.com〒615-8585
21, Saiin Mizosaki-cho, Ukyo-ku,
Kyoto, JapanTEL (075)321-5120
FAX (075)315-3231
E-M Tamotsu.Uga@lsi.rohm.co.jp

18Appendix
Guidelines for Reticle Data Management Ver.1.0(English Version)

19

Contents
1. Introduction
1.1 Background
1.2 Purpose
1.3 Scope
1.4 Standardization objects and definition
1.5 Relationship with the related standardization Requirement
1.6 Requirement
2. General guideline
2.1 Sharing of reticle data
2.2 Sharing that covers design mask fabrication and wafer fabrication
3. Guideline for application
3.1 B to B of order taking and ordering of mask
3.2 Increase in efficiency of reticle defect analysis
3.3 Increase in efficiency of recipe maintenance in wafer fab.
3.4 Clustering of device in mask fab.
3.5 Standardization of QC data
4. Standardization and implementation procedure
4.1 Activity organization and schedule20

1. Introduction
1.1Background
Through this semiconductor recession, the future situation of semiconductor industry has
become apparent where various kinds of products vie in the limited demand. The trend to
the limited production with a wide variety of SoC (system-on-chip) is remarkable. As aresult, this trend increases severity of the following requirements: shorter life cycle ofproduct, more difficult technique, lower cost, and shorter total TAT from design to shipping
etc. Device venders, system venders, and material venders form a sector of semiconductor
manufacturing technology. They are similarly forced to compete for the value to thebusiness of device makers in the situation where capital investment and procurement cost
continue to decrease.
Thus, in order to seek innovation of higher speed and efficiency, a major move has begun
to utilize IT technology for manufacture of semiconductors. In the overall area of production
technology, e-manufacturing has been introduced to every stage of production as
utilization of IT technology, mainly Internet. Information is shared extensively throughInternet. Not only that, powerful organization is intended to utilize more professional
information such as devices. In this trend, production of a variety of products directly leads
to thorough rationalization of many tasks involved for each reticle. This guideline has beenplanned against recognition of this background.

The trend of cost requirements

The trend of speed requirements

A mask cost become more important in
SoC business
To shorten a manufacturing work flow(including a work flow of engineering)
To reduce personnel (personnel required
to compensate for loss generated byinsufficient introduction of IT)

The mask feed and preparation for
production that correspond to completion of
20 sheets in 3 days including the previous
process
The mask feed preparation for productionthat corresponds to completion of 5 sheetsin 1 day including the wiring processStandardization of reticle data

Inquiry through IT〜scheduling〜ordertaking process becomes shorter--Speedy action, information war
Risk of losing an order due to plan
confusion by rework

Opportunity loss

The unit price for each function
must be reduced sharply. The
data volume of a maskincreases sharply. Therefore,
epoch-making increase inefficiency is required for costand date of delivery.

1000

100

MPUChipCost(microcents/transistors)
Data Volume(GB)10
YEAR 2001(node) (130nm)

2004(90nm)

2007(65nm)

Figure 1. ITRS2001 roadmap

21

1.2 Purpose
As mentioned in 1.1 Background, the speed from design to merchandising is critical for
digital electric household appliance and Internet-related devices. These devices are
represented by SoC. Especially, in order to cope with the limited production with a wide
variety of products, the speed for reticle tasks becomes critical. They include reticle feed,
reticle-related preparation in manufacture, analysis of defect caused by reticle etc. The
information related to reticle covers widely design, mask manufacture, and wafer
manufacture. Despite a progress of partial automation, many exchanges of data rely on aconventional method such as telephone, resulting in loss of person-hours and time.
This guideline is primarily intended to address this issue by increasing efficiency
consistently based on standardization that ranges from design, to mask manufacture, andto wafer manufacture.
Secondly, this guideline is intended to support efficient deployment of new automation
application business of device and production system venders, by enabling them to share
information among the systems in the innovation where a variety of product are produced
in a small quantity.

Items to be improved:0) Business（environment)
1) B to B

Design2) Defect Analysis
3) Recipe Maintenance

Mask Fab
Wafer Fab

4) Clustering Equipments in Mask Fab5) Security

22

1.3 Scope
The following items, (1) through (5), are related to interfaces for information exchange(necessary minimum data structure for universal use of information) .
The scope proposes the guidelines for standardization of these interfaces.
(1)Production schedule, WIP tracking(2) or (4)Quality Control in wafer fab.(recipe, device management, process monitor)(3)Interchange and utilization of inspection, measurement data, and defect data(5)Preparation of recipe of device in mask fab.
However, we exclude device H/W that is used for pattern data
(graphic data required for CAD, OPC, PSM, TEG, and exposure/inspection),communication medium (network circuit, protocol), and device that is used for
information interchange. In addition, the interfaces of above-mentioned(1) through (5) are so structured as to permit the mutual reuse of information.

DesignDesigndepartment
Logic,
circuitdesignPatterndesignStandardization target

Pattern data
Production are excluded
Mask manufacturingcontrol
department
department
Dummy
generationDRC
GDSII datatransfer
server

Dummy

OPC

Frame

In-house processing

Process
engineering
department
Wafer
manufacturing
department

Wafer fab.

41

Mask order
sheet
Inspection
specification

Frame specification
approval, issue
Inspection data

Frame
specification

Acceptance
Incomming QA

Data server

ORC OPC
generation

Frame
generation,frame
specification

EB
conversion

Mask order sheet
Inspection specification
Specification code registration

2EB
exposure

Inspection
data
Inspection

3 Mask Recipe
Transport

5

Mask
Inspection

Mask
shipment

Mask fab.
23

1.4 Standardization objects and definition
To be excluded from these standardization objects
1) Circuit pattern data
A data part of a product (GDS data, plot data, comparison inspection data)

To be included in these standardization objects
2) Reticle data (calling the incidental data except circuit pattern data)
Reticle set specification sheet data (halftone, standard etc.)
Individual specification sheet
Pattern data (frame data and processing specification for CAD, plot, and inspection)
Inspection data (dimension, defect etc.)
Recipe data, correction parameter data
3) Reticle-related data
Management of plural reticle
Wafer inspection data (defect, dimension etc.)
History data
Tracking data
Order sheet data24

Supplement
The above-mentioned standardization objects are controlled by the example sheets
mentioned below.
Reticle order sheet
Reticle specification sheet
Delivery control sheet

Design house

Reticle data fabrication sheet

Frame data sheet

Frame fabrication sheet

Wafer map data sheet

Mask Fab.
Defect inspection sheet
Defect correction sheet
CD inspection sheet
Coordinate inspection sheet

Wafer Fab.
Reticle shipment
inspection sheet

Exposure Equipment recipe
sheet

Frame data sheet

CD measurement Equipment
recipe sheet

Wafer map sheet
Delivery/change sheet

Alignment measurement
Equipment recipe sheet
Defect inspection Equipment
Defect inspection Equipment
result sheet

Mask vender, mask
deviceCAD, WP device, WP

CAD, WP device, WP

Mask vender, WP

Related to reticle data handling in mask house
1)Mask vender2)Mask device vender3)Selete

Related to frame data (exposure device mark, inspection
device mark, TEG, etc.)
1)WP device vender (exposure device, CD, alignment,
defect inspection device)2)CAD (frame CAD vender)
3)Wafer fab. user (JEITA)
Related to order-taking and ordering, specification, delivery,change, inspection result
1)Mask vender2)Wafer fab. user (JEITA)

25

1.5 Relationship with related standardization
This guideline deals with the interface of the data exchange of the information
relevant to the reticle except pattern data. The activities of the overseas organizations
that have complementary relationship are mentioned below..
(1) SEMI-Japan Reticle Data Management Task ForceThe standardization activities of micro patterning division·It discusses the data-exchange method of the information relevant to a reticle.
·It intends to draft a guideline.
·It incorporates mask data into stepper recipe data preparation. It performs standardizationof communication of reticle-related information among design〜mask vender〜 wafer fab.
(2) SEMI-NA Mask Data Path Task Force
Standardization activities of UDM(Universal Data Model) Working Group·It discusses the data-exchange method of the information relevant to a reticle.
·It intends to draft a guideline.
·In this, Open Access Coalition of Silicon Integration Initiative (Si2) is introduced.
This consortium aims at offering the open standard to the IC design data access.
(3) MOPXE(Mask Order Processing In the eXtended Enterprise).
·This activity about the mask supply chain is proposed from IMS(Intelligent Manufacturing System). The activity is carried out mainly in Europe26

1.6 Requirement for establishment of common language
for reticle-related information
The requirements for SoC business of small production of many kinds of products
lead to requirement for establishment of common language through requirement
for total IT utilization. Utilization of many techniques that is based on XML in IT area
must be so developed as to support the requirements for SoC business.
Requirements for total IT integration

systematization oftechnology

Speed(to shorten total TAT)

Requirements for
Requirement for quality establishment ofcommon platform

Flexibility(to address a change)
Growth of business(ROI)

Security
Low-pricing(cost reduction)

1) Technical systematization
The speed of technical accumulation is accelerated by IT technology. For that purpose,technical systematization that aims at high availability is required. The reticle-related
information must be formulized in terminology/definition/methodology about several
aspects of utilization, accumulation, and exchange in a wide area.
Domain ofbusiness unit

Domainof technology
Domain ofapplication

Litho
process

Litho
Equip.

Mask
manufacture

Lithoprocess

Recipemaintenance

Defectanalysis

Mask
Equip.

Mask
process

Equipments
clustering

BtoB

DesignPatterndesignChippattern

Order-taking
Datapreparation and ordering

Framepattern

Deliverycontrol

Qualitystandard

Production
QC dataplan

Necessity of interoperability among various domains
Reticle-related information is used by the entire area of domains through partial relationship.

Necessity of semantic interoperability is large.

272) Flexibility
Production technology must continue to innovate obsolete technology to cope withan ever-changing market, and IT technology must be easily updated. In addition,
the reticle-related information is generated and use in various aspects, and a data modelwith high flexibility is required.
3) Return of investment in business
Activation of information service based on standardization is required to reducethe introduction cost. Owners and users should be clarified according to information
classification. Collaboration should be realized among device makers, mask makers,
equipment makers, and system makers. For that purpose, various business model
should be built where security is precisely set up and license and fees are established.

Application

Application

Application

Application

Information source
based on common platform

Standard data exchangeof XML base
Information Information Information
sourcesourcesourceDifferent kinds ofinformation sources

1) Application eliminates the connection cost,and emphasizes functions that create values.
It is possible to obtain the development flexibility
that overcomes the speed of obsolescence.
Both distribution and IP of application are attempted.

2) By controlling the meaning and source of information,
it is possible to measure the value of
information supplied and to activate business.
3) It is possible to instantly monitor various informationthat is generated widely and asynchronously in Internet.
4) Data are standardized by XML and wrapped for dataexchange. It is possible to permit Inconsistence of various
data between different kinds of information sources.
Thus, it promotes development of individual information sources.

4) Security
The information about a reticle must be maintained at high security for a customer.
Share information must be systematized to set up security management that is partitioned
appropriately and efficiently for various security requirements and usability requirements.

Information source
based on common platform

Security management
technique bases on
precise classification

Information source
based on common platform

Standard data exchangeof XML baseStandard data exchangeof XML base

Information Information Information
sourcesourcesourceInformation Information Information
sourcesourcesourceDifferent kinds ofinformation sources

Different kinds ofinformation sources

285) Quality
As the technology becomes more difficult, lack of consideration about quality
generates the maximum loss. Application of IT technology to semiconductor
production technology is not limited to a superficial support for quality control. It needs to support by incorporating analysis, which was difficult because of
shortage of labor in the past. The requirements for quality of a reticle are also
increased. Therefore, efficient development should be supported.

Preset filter

Visualization ofpotential influence
relationship
6) CostIn order to reduce the cost for every reticle under small production of various
products, it is necessary to eliminate every loss that is dispersed and generated
in an extensive area and to obtain an integral effect. Not only that, it is necessary
to establish standardization that is suitable for Internet technology in order torealize a wide information exchange inexpensively.
7) TAT
In order to make it contribute to ultimate product TAT realization, you should
eliminate break and leakage in a total work flow. For that purpose, you should
consider main stream design data that range from design to mask manufacture
and to wafer manufacture. Not only that, you should include information that is
information generated derivatively and consider possibility of wide reuse.
Parallel processing of
preparation and postprocessing

Conversion task
loss

loss

loss

loss

loss
loss

loss

loss

29

2. General guideline
2.1 Sharing of reticle data
The environment that can be utilized in common from design to wafer fab. must be
established being fulfilled the following conditions.
Conditions :1. Reticle data and reticle-related data must be correlatedwith a hierarchic configuration.
2. Reticle data and reticle-related data must be delivered
in a standardized method at each interface.
3. Reticle data and reticle-related data must be defined clearly in their contents.
4. Reticle data and reticle-related data must be stored for each fab.
so that the required data can be taken out whenever necessary.
5. Reticle data and reticle-related data must be protectedby the reasonable security system.

QualityData(Defect)
Qualitydata(CD)SpecsSheet
Design
House

Mask
Fab.

Wafer
Fab.

OrderEntry
Delivery Info.

·It extends freely
according toa business·Minimum data structure
required to share information·Standardized
information isavailable at any time.
·Connection isunrestricted

Platform·Security·Data matching

Example30

2.2 Outline of shared guideline
covering design, mask manufacture and wafer manufactureInterchange of various data that were explained above has been built by individual
association at B to B until now. The left-hand figure shows continuing building ofindividual
association, while the right-hand figure is based on standardization of processes
that ranges from design of reticle data and reticle-related data to mask manufacture
andto wafer manufacture. The individual know-how and the common data exchange areassociated and controlled respectively, and overall complex processes can be
simplified.

Wafer
DesignMask

B to B

Fab.

Wafer
DesignShared data

Design house
Mask fab

Mask fab.
Wafer fab.

Wafer fab.
Design house.

Chip size
Block configuration
Reticle set markCD (On wafer/reticle)
DefectOrthogonality
ShrinkAlignment mark

Mask

Fab.

Items for standardization
QC flow
Data handling
Guideline for mask order-taking andordering system and data handling(toward creation of standardization
format) (ref: P10)
Guideline related to frame data
(exposure device mark, inspection
device mark etc.)(toward creation of standardization
format)Guideline for design (technology unit)
and photolitho manufacture standard(wafer, reticle accuracy)(toward creation of standardization
format)31

3. Guidelines for Applications
3.1 Order-taking and Ordering of Mask
(1)Guideline for Order-taking and Ordering of Mask
Mask order-taking and ordering information must be shared from design to mask fab.
and to wafer fab

For data handling, a business model must be flexible enough to meet the requirementsof both parties concerning various formats for drawing, text, GDS, Mebes etc.

The status report of each mask must be shared among order-taking, ordering, andproduction control of reticle database in order to report mask making progress reportand forecast delivery it for customer. This mask supply is and will be a key for a finepatterned device. This will be an issue whether you produce a mask in-house or not.
[Common items for order-taking and ordering of mask]
1) Design data (drawing, GDS II, Mebes etc) (including frame data)
2) Manufacture request sheet (a masking name, new edition, revision, reprint, size,
pellicle class, specified date of delivery, destination)3) Manufacture conditions (manufacture data specification, exposure data
arrangement
specification, manufacture specification, and inspection specification)4) Progress5) Specification (grade)6) Quality (dimension, arrangement, defect, phase difference, transmittance)7) Inquiry
Shared environment oforder-taking and ordering

DesignMask

Wafer Fab.

[Effects]•You can service all customers more quickly than now•You can reduce system development cost32

(2) Mask Progress report and Delivery forecast program

Mask fab. should offer wafer fab. the updated information including delivery scheduleof rework of reticle manufacture. Both should offer the standardized interface.

Reticle data management ―Just-in-time program

Timely prediction of delivery(● part) is added to the conventional B to B (○ part)in the standardization. Thus, B to B cooperation can eliminate waste that is observed
by a customer.

LSI chip delivery date(specified by a LSI chip customer)

Production planat wafer fab.

Keepdelivery date of chip

Wafer fab. Production Wafer fab. Production
plan re-simulation
plan check

Preset delivery dateat the order of the reticle

Progress reportduring manufacture

Defect occurrence
during manufacture

Production planat mask fab.

Reticle manufacture

Improved accuracyof production plan

Change (delay)
information

Rework plan
simulation

Observance ofdelivery date of reticle

33

(3) Mask Ordering Data forXML (Structured Reticle Data for Order)

Mask Order
Mask Order
Mask
MaskName
Name

Order
Ordercode
code

Accounting
Accounting Logistic
Logistic
info.
info.
info.
info.

Manufacture
Manufacturespec
speccode
code

Manufacture
Manufacture
control code
control code

Logistic
Logistic
info.
info.

Work
Work
sheet
sheet

Manufacture
Manufacture
process
processcodecode

Quality
Quality
info.
info.

Tool
Tool
info.
info.

Data
Dataprocessing
processing Material Tolerance Processing
Processing
Material Tolerance
code
Tool
code
Tool

Processing
Processing Processing
Processing
Tool
Spec.
Tool
Spec.

34

3.2 Increase in efficiency of analysis of reticle defect
The reticle data and reticle-related data must be ready for wafer fab. to refer
those for analysis of quality in wafer fab. (defect, dimension etc.) whenevernecessary.
Example 1) You use the reticle data and reticle-related data so that you can judge
whether the quality in wafer fab. originates in a reticle or not.
Example 2) You correlate quality information of a reticle with that of wafer so thatyou can increase efficiency of the process improvement of reticle manufacture.
[Examples of effects]· You can improve the quality of mask
· You can increase efficiency of the quality analysis in wafer fab.
· You can clarify the criteria of quality, optimize mask production process, andreduce a manufacturing cost
· You can reduce the cost to develop a tool to analyze correlation between mask
quality and wafer printing characteristics.
[Example of methods]· You feed back the wafer printing result to the mask fab. and accumulate thedata about correlation between mask quality and wafer printing characteristics· You feed forward the quality information of mask manufacture process to thewafer fab. and utilize it for the quality analysis at wafer fab.

Wafer Fab.

Mask Fab.

Wafer quality
inspection Tool

Reticle quality inspection
Tool Reticle repair Tool
Mask quality data
Mask nameDimension data
Defect data
Position data
OthersWafer quality data
Mask nameDimension data
Defect data
Position data
OthersCoordinatetransformation

Mask
Fab.

Wafer
Fab.

Defectinformation
on wafer

Coordinatetransformation

Commonlanguage
Defect informationand correction
information on reticle

35

3.3 Increase in efficiency of recipe build in wafer fab

Guideline of Standardized Reticle design information and QC data
to make reusable it for recipe build in Wafer Fab.
1) The data that are related to recipe build of systems, such as exposure tools,
inspection tools, APC, MES, etc. are generated in various data sources throughout thedesign shop, mask fab. and wafer fab. In order to address various quality requirementsin the future, you need a flexible method based on the common formats of data.

[Effects]· The time of recipe building at wafer fab. will become quick.
· The cost for developing recipe build system will be minimized.
[Methods]· Mask flame information, mask quality information, wafer map and sample
plans are provided as standardized format data from each site. Recipe builders
import these data and make recipe.

DesignMask Fab

Flame Information

QC Data

Wafer Map,
Sample plan, etc

Conversion

Conversion

Conversion

Standardization
RecipeBuilder A
Exposure Tool
RecipeRecipeBuilder B
CD SEM
RecipeRecipeBuilder C

Wafer Fab

Defect Inspection
Recipe36

3.4 Data sharing within mask fab.

The data and information within Mask Fab.; inspection, defect correct
and review tool, should be able to be shared for mutual reference ofdata as necessary.
1) Reticle defect correction process use many tools;inspection, defectcorrection and review. This correction will be efficient, if tools canshare there results and recipe.
[Effects]- Can shorten the time to create a recipe at the process of mask defect inspection, defectcorrection and review by reuse of information i.e. coordinates information etc.
- Can reduce the development cost of a recipe by preparing standard or flexible data format- Can improve mask quality by integrate information related to mask defect.
[Methods]- Collect, store, report and analyze the information about mask defect and processing
information.
- Associate and integrate the information about mask defect at wafer manufacture process
and the information at mask manufacture process.

Inspection recipe
Inspection
Inspection

Defect Record

Defect Data
Automatic
MES
MES

DB
DB

DB
DB

DB
DB

Repair Record

Repair recipe

RepairRepairReview Record

Repair Data
Automatic

Review recipe

Review
Review

37

Example) XML Data Tree of Inspection Tool

Process No

Tool Information_nDate/Time Stamps

Start Date
Start Time

Tool Information_X

Complete Date
Complete Time
Processing Hours

Basic

Reference Area DB
Basic Area DB

Tool_No

Coordinate Definition 3)

Date of Preparation

Date

Operator of Preparation

Time

Inspection Method
Data of Inspection Area

Inspection Area

Size_x
Size_yChip Number

Chip_n_x

Chip Size

Chip Size_x

Chip_n_y

Chip Size_y
Inspection Result_n1)
Rotation
MirrorFlip
Origin_n

Coordinate_x
Coordinate_y
Image Data

1)

Inspection Result n

Summary

Date/Time Stamps

4)

Start Date
Start Time

Inspection Result X

Complete Date
Complete Time
Processing Hours
RecipeName of Recipe
Mode/Level

Summary of Detection
Operator

Customer/Supplier Agreement

Total NoClass Code n: Total No

Judge
Defect No. n

Position_x
Position_y
JudgeDefect No. X

Fatal/Repair/No needClass CodeUpdated Evaluation 2)

Evaluation
Image Data

Image Data n

4)

Repair_n

Data Post Repair QC

2)38

3.5 Reusable QC Data
At B to B, standards information should be exchanged in the standardized items.
1. Classification of information
1) Wafer Fab. standards information- Order sheet - Spec sheet
2) Mask Fab. standards information- QC sheet
2. Merit: Improvement of productivity and reduction of cost

Methods :Expansion of reusability of QC information by standardization of different section(definition and usage of QC data at Wafer, Mask and Design)
1) As to QC data, you standardize such components that can be stratified and shared.
You should deal with data handling in a standardized method.
2) You should use classification and stratification for communalization. You should
promote first the area that is easy to communalize, namely that is highly common
or highly abstract.

Order Entry

Defect Analysis

Spec Sheet

Data Matchingprocedure

Pattern
data
deliveryspec.

dictionary
QC DataStandardization

Recipe Parameter

Recipe Maintenance

QC data
FocusedData Matching

Framework(with structure)

Geometry
structure

Process
spec.
Calibration
data

Additional Image
data
data

Clustering of Equipment

Introduced Topics

QC data Standardization

39

Examples of sharing of procedure and pattern data

Order Entry

Defect Analysis

Spec Sheet

Pricedata

Data Matching

Pattern
data
deliveryspec.

dictionary
QC DataStandardization

Recipe Parameter

Recipe Maintenance

QC data
FocusedFramework

Geometry
structure

Data Matching(with structure)

Additionnal
data

Process
spec.

Calibration
Image data
data

Clustering of Equipment

QC data Standardization

Introduced Topics

Procedure

PatternData
GDSII,
Mebes etc

Dictionary
Conversion
Rule

Reticle DataManagement
TargetXSD

XSLTranslator Translator
Translator
QC Data With Structure
Formatter

Example40

Example)
QC data of order-taking and ordering of mask
1) Shipped Mask Number(for each type of product, each grade, each technology, each size,
new edition, revision, reprint)
2) Just-in-time Delivery Reticle Ratio
3)TAT
4)Quality (CD:uniformity/mean to target, Distortion, Defect)5)Tool (Tool Up Ratio, QC/Pre Maintenance result )6)Failure data
* : Data must be read on a platform. Production control and quality contro
l should be shown daily, weekly, and monthly.
Those data must be updated to reticle production planand development plan.

41

Contact JEITA Reticle Management Subcommittee Members
Role

Name

Company
Oki Electric Industry Co.,Ltd.

Toshio Onodera

Silicon Manufacturing Company
WP Business Div.
WP Business Dept.

Takashi SatohTOSHIBA CORPORATION
Process & Manufacturing
Engineering Center
Advanced ULSI Engineering
Dept.Ⅱ

Toshiharu Matsuda

SANYO Electric Co.,Ltd.
Semiconductor Company
LSI BUEngineering Dept.

Michio Honma

Sub-Leader

Norihiko Miyazaki

Nobuyuki Iriki

FUJITSU LIMITEDRENESAS Technology Co.

Matsushita Electric IndustrialCo., Ltd.
Semiconductor Company
Corporate Manufacturing& Development Div.
Design Support Group

Masayoshi Mori

〒235-8522
8 Shinsugita Isogo-ku Yokohama-shi Kanagawa
Yokohama Office
TEL (045)770-3605
FAX (045)770-3570
E-M ta.sato@toshiba.co.jp〒370-0596
1-1-1 Sakata Oizumi-Machi Ora-gun Gunma
TEL (0276)61-8043
FAX (0276)61-8836
E-M mats067701@sanyo.co.jp〒211-8668
1753 Shimonumabe, Nakahara-Ku,Kawasaki Kanagawa
Corporate Strategic Planning Unit TEL (044)435-1406
FAX (044)1870
E-M m-honma@cp.jp.nec.com

LSI Manufacturing Unit
Wafer Process Engineering
Development Div.

Tadashi Imoriya〒193-8550
550-1 Higashi-asakawacho Hachiouji-shi Tokyo
TEL (0426)62-6234
FAX (0426)62-6709
E-M onodera021@oki.com

NEC Electronics Corporation

Semiconductor Group
Manufacturing Technology
Development Div.
MASK Technology Dept.

LeaderAddress

MITSUBISHI ELECTRICCORPORATIONULSI Development Center
ULSI Process
Integration Dept.

〒197-0833
50 Fuchigami Akiruno-shi Tokyo(Akiruno Technology Center)
TEL (042)532-2158
FAX (042)532-2882
E-M miyazaki.norihi@jp.fujitsu.com〒312-8504
6-16-3 Horiguchi Hitachinakashi,Ibaraki-ken
TEL (029)270-2185
FAX (029)270-1792
E-M iriki.nobuyuki@renesas.com〒601-8413
19 Nishikujokasugamati Minami-ku
Kyoto-shi Kyoto
TEL (075)662-7357
FAX (075)662-6154
E-M PAN84968@pas.mei.co.jp〒664-8641
4-1 Zuihara Itami-shi Hyogo
TEL (0727)84-7532
FAX (0727)80-2597
E-M Mori.Masayoshi@lsi.melco.co.jp

42