Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505

Offices: 310-530-9400 / Fax: 310-530-9402
www.adsantec.com

ASNT5022-BD
DC-28Gbps/17GHz Signal Distributor 1-to-3
High-speed broadband Data/Clock Amplifier and Distributor



Exhibits low jitter and limited temperature variation over industrial temperature range

One input differential signal port and three differential amplified output signal portsMatched phase delays for all outputs



Fully differential CML input interface

Fully differential CML output interfaces with 600mV single-ended swing

Single +3.3V or -3.3V power supplyPower consumption: 810mW

Fabricated in SiGe for high performance, yield, and reliability

Pad #1

Rev. 1.3.21July 2019

Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505

Offices: 310-530-9400 / Fax: 310-530-9402
www.adsantec.com

DESCRIPTION
out0p

out0n

50505050

cp

out1p

cn

out1n50505050

out2p

out2n

Fig. 1. Functional Block Diagram

The temperature stable ASNT5022-BD SiGe IC provides active broadband data/clock signal splitting, andis intended for use in high-speed measurement / test equipment. The IC shown in Fig. 1 can deliver threephase-matched copies of the broadband data/clock input signal cp/cn to three high-speed differential
outputs out0p/out0n, out1p/out1n, out2p/out2n.
The part’s I/O’s support the CML logic interface with on chip 50Ohm termination to vcc and may be useddifferentially, AC/DC coupled, single-ended, or in any combination (see also POWER SUPPLYCONFIGURATION). In the DC-coupling mode, the input signal’s common mode voltage should comply
with the specifications shown in ELECTRICAL CHARACTERISTICS. In the AC-coupling mode, theinput termination provides the required common mode voltage automatically. The differential DC
signaling mode is recommended for optimal performance.

POWER SUPPLY CONFIGURATION
The part can operate with either negative supply (vcc = 0.0V = ground and vee = −3.3V), or positivesupply (vcc = +3.3V and vee = 0.0V = ground). In case of the positive supply, all I/Os need ACtermination when connected to any devices with 50Ohm termination to ground. Different PCB layouts
will be needed for each different power supply combination.
The chip substrate should be connected to vee or completely isolated. DO NOT connect substrate to vcc!

All the characteristics detailed below assume vcc = 0.0V and vee = -3.3V.
Rev. 1.3.2

2July 2019

Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505

Offices: 310-530-9400 / Fax: 310-530-9402
www.adsantec.com

ABSOLUTE MAXIMUM RATINGS
Caution: Exceeding the absolute maximum ratings shown in Table 1 may cause damage to this productand/or lead to reduced reliability. Functional performance is specified over the recommended operating
conditions for power supply and temperature only. AC and DC device characteristics at or beyond theabsolute maximum ratings are not assumed or implied. All min and max voltage limits are referenced toground (assumed vcc).
Table 1. Absolute Maximum Ratings

Parameter
Supply Voltage (vee)Power Consumption
RF Input Voltage Swing (SE)Storage Temperature
Operational Humidity
Storage Humidity

Min-401010Max-3.60.89
1.0+1009898Units
VW
VºC%%

TERMINAL FUNCTIONSTERMINAL
NameNo.
TypeDESCRIPTION

Namevcc

High-Speed I/Os
20
CML Differential high speed data/clock inputs with internal SE 50Ohm
input termination to vcc
2216
CML Differential high speed data/clock outputs with internal SE 50Ohm
outputtermination to vcc. Require external SE 50Ohm termination to vcc
1410
CML Differential high speed data/clock outputs with internal SE 50Ohm
output termination to vcc. Require external SE 50Ohm termination to vcc
84
CML Differential high speed data/clock outputs with internal SE 50Ohm
output termination to vcc. Require external SE 50Ohm termination to vcc
2
Supply and Termination Voltages
Description
Pin Number
Positive power supply (+3.3V or 0)
1, 3, 5, 7, 9, 11, 13, 15, 17, 19, 21, 23

vee

Negative power supply (0V or -3.3V)

cp
cn
out0p
out0n
out1p
out1n
out2p
out2n

Rev. 1.3.2

6, 12, 18, 243July 2019

Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505

Offices: 310-530-9400 / Fax: 310-530-9402
www.adsantec.com

ELECTRICAL CHARACTERISTICSPARAMETER

MIN

TYP

MAX UNITCOMMENTS
General Parameters-3.1-3.3-3.5
V
±6%
vee
0.0
V
External ground
vcc
Ivee
245mA
Power consumption
810mW
Junction temperature -40
25125°C
HS Input Data/Clock (cp/cn)
Data Rate
DC28Gbps
Frequency
DC17
GHz
Swing
0.05
1.0
V
Differential or SE, p-p
CM Voltage Level
vcc-0.8
vcc
VMust match for both inputs
HS Output Data/Clock (out0p/out0n, out1p/out1n, out2p/out2n)
Data Rate
DC
28
Gbps
Frequency
DC17GHz
Phase mismatch
2ps
Between any two SE outputs
Logic “1” level
Vvcc
Logic “0” levelvcc-0.6
VWith external 50Ohm DC termination
Rise/Fall times
1317
ps
20%-80%Additive Jitter5
ps
Peak-to-peakDuty cycle
455055%For clock signal

DIE INFORMATION
The die has external dimensions of 1.18x1.18µm2 with an approximate thickness of 280µm, and includes
24 octagonal pads: 5 on each side and 4 corner pads. The pad frame parameters are presented in Table 2.
Table 2. Pad Frame Parameters

Pad Type Metal dimensions, µm Opening dimensions, µm Step, µmSide pad
113x74105x66
150
Corner pad
130x92121x88n/a
The part’s identification name is ASNT5022-BD. The first 8 characters of the name before the dashidentify the bare die including general circuit family, fabrication technology, specific circuit type, and partversion while the 2 characters after the dash mark the part as a bare die.
This device complies with the Restriction of Hazardous Substances (RoHS) per EU 2002/95/EC for all six
substances.
Rev. 1.3.24July 2019

Advanced Science And Novel Technology Company, Inc.
2790 Skypark Drive Suite 112, Torrance, CA 90505

Offices: 310-530-9400 / Fax: 310-530-9402
www.adsantec.com

REVISION HISTORY
Revision
1.3.2
1.3.1

Date
07-2019
04-2017

1.2.1

03-2013

1.1.1

02-20131.0.1
1.001-2013
05-2012

Rev. 1.3.2

Changes
Updated Letterhead
Added description of substrate connection
Updated absolute maximum ratings section
Added phase mismatch specifications
Updated description
Revised title
Revised description
Revised power supply configuration
Revised absolute maximum ratings
Revised terminal functions
Revised electrical characteristics
Changed package information to die information
Format correction
Format correction
Initial release5July 2019