Guidelines for Reticle Data Management Ver.1.0(English Version)

JEITA(Japan Electronics and Information Technology industries Association)
Committee on semiconductor production engineering
Sub-committee on Reticle Management System

Sub-committee Member
Nobuyuki Iriki(Hitachi)

Michio Homma(NEC)

Hitachi Ltd. Semiconductor&Circuits
NEC Electron Devices
Process Engineering Development Div.
Technology&Production Plannning Div.
Wafer Process Manufacturing Technology Dept.

Takashi Sato(Toshiba)
TOSHIBA CORPORATION
Process & Manufacturing Engineering Center
Advanced ULSI Engineering Dept.II

Norihiko Miyazaki(Fujitsu)

Masayoshi Mori(MITSUBISHI) Tadashi Imoriya(Matsushita)

FUJITSU LIMITED Semiconductor Group
Manufacturing Technology Development Div.
MASK Technology Dept.

MITSUBISHI ELECTRIC CORPORATIONULSI Development Center
ULSI Process Integration Dept.

Toshio Onodera(Oki)Toshiharu Matsuda(SANYO)Oki Electric Industry CO., Ltd.
Silicon Solutions Company
Production Division
Process Technology Dept.

SANYO Electric Co.,Ltd.
Semiconductor Company
System LSI Div.
Engineering Dept.

Matsushita Electric Industrial Co.,Ltd.
Semiconductor Company
Corporate Manufacturing & Development Div.
Design Support Group

ObserverSEMI Japan Reticle Data Management TF: Hidehiro Higashino(Oki)Oki Electric Industry CO., Ltd.
Silicon Solutions Company
Production Division
Process Technology Dept.

Selete: Iwao Higashikawa Nobuyuki Yoshioka
Semiconductor Leading Edge Technologies Inc.
Advanced Technology Dept.

1

Contents
1. Introduction
1.1 Background
1.2 Purpose
1.3 Scope
1.4 Standardization objects and definition
1.5 Relationship with the related standardization Requirement
1.6 Requirement
2. General guideline
2.1 Sharing of reticle data
2.2 Sharing that covers design mask fabrication and wafer fabrication
3. Guideline for application
3.1 B to B of order taking and ordering of mask
3.2 Increase in efficiency of reticle defect analysis
3.3 Increase in efficiency of recipe maintenance in wafer fab.
3.4 Clustering of device in mask fab.
3.5 Standardization of QC data
4. Standardization and implementation procedure
4.1 Activity organization and schedule21. Introduction
1.1Background
Through this semiconductor recession, the future situation of semiconductor industry has
become apparent where various kinds of products vie in the limited demand. The trend to
the limited production with a wide variety of SoC (system-on-chip) is remarkable. As aresult, this trend increases severity of the following requirements: shorter life cycle ofproduct, more difficult technique, lower cost, and shorter total TAT from design to shipping
etc. Device venders, system venders, and material venders form a sector of semiconductor
manufacturing technology. They are similarly forced to compete for the value to thebusiness of device makers in the situation where capital investment and procurement cost
continue to decrease.
Thus, in order to seek innovation of higher speed and efficiency, a major move has begun
to utilize IT technology for manufacture of semiconductors. In the overall area of production
technology, e-manufacturing has been introduced to every stage of production as
utilization of IT technology, mainly Internet. Information is shared extensively throughInternet. Not only that, powerful organization is intended to utilize more professional
information such as devices. In this trend, production of a variety of products directly leads
to thorough rationalization of many tasks involved for each reticle. This guideline has beenplanned against recognition of this background.

The trend of cost requirements

The trend of speed requirements

A mask cost become more important in
SoC business
To shorten a manufacturing work flow(including a work flow of engineering)
To reduce personnel (personnel required
to compensate for loss generated byinsufficient introduction of IT)

The mask feed and preparation for
production that correspond to completion of
20 sheets in 3 days including the previous
process
The mask feed preparation for productionthat corresponds to completion of 5 sheetsin 1 day including the wiring processStandardization of reticle data

Inquiry through IT〜scheduling〜ordertaking process becomes shorter--Speedy action, information war
Risk of losing an order due to plan
confusion by rework

Opportunity loss

The unit price for each function
must be reduced sharply. The
data volume of a maskincreases sharply. Therefore,
epoch-making increase inefficiency is required for costand date of delivery.

1000

100

MPUChipCost(microcents/transistors)
Data Volume(GB)10
YEAR 2001(node) (130nm)

2004(90nm)

2007(65nm)

Figure 1. ITRS2001 roadmap3

1.2 Purpose
As mentioned in 1.1 Background, the speed from design to merchandising is critical for
digital electric household appliance and Internet-related devices. These devices are
represented by SoC. Especially, in order to cope with the limited production with a wide
variety of products, the speed for reticle tasks becomes critical. They include reticle feed,
reticle-related preparation in manufacture, analysis of defect caused by reticle etc. The
information related to reticle covers widely design, mask manufacture, and wafer
manufacture. Despite a progress of partial automation, many exchanges of data rely on aconventional method such as telephone, resulting in loss of person-hours and time.
This guideline is primarily intended to address this issue by increasing efficiency
consistently based on standardization that ranges from design, to mask manufacture, andto wafer manufacture.
Secondly, this guideline is intended to support efficient deployment of new automation
application business of device and production system venders, by enabling them to share
information among the systems in the innovation where a variety of product are produced
in a small quantity.

Items to be improved:0) Business（（environment)
1) B to B

Design2) Defect Analysis
3) Recipe Maintenance

Mask Fab
Wafer Fab

4) Clustering Equipments in Mask Fab5) Security4

1.3 Scope
The following items, (1) through (5), are related to interfaces for information exchange(necessary minimum data structure for universal use of information) .
The scope proposes the guidelines for standardization of these interfaces.
(1)Production schedule, WIP tracking(2) or (4)Quality Control in wafer fab.(recipe, device management, process monitor)(3)Interchange and utilization of inspection, measurement data, and defect data(5)Preparation of recipe of device in mask fab.
However, we exclude device H/W that is used for pattern data
(graphic data required for CAD, OPC, PSM, TEG, and exposure/inspection),communication medium (network circuit, protocol), and device that is used for
information interchange. In addition, the interfaces of above-mentioned(1) through (5) are so structured as to permit the mutual reuse of information.

DesignDesigndepartment
Logic,
circuitdesignPatterndesignStandardization target

Pattern data
Production are excluded
Mask manufacturingcontrol
department
department
Dummy
generationDRC
GDSII datatransfer
server

Dummy

OPC

Frame

In-house processing

Process
engineering
department
Wafer
manufacturing
department

Wafer fab.

41

Mask order
sheet
Inspection
specification

Frame specification
approval, issue
Inspection data

Frame
specification

Acceptance
Incomming QA

Data server

ORC OPC
generation

Frame
generation,frame
specification

EB
conversion

Mask order sheet
Inspection specification
Specification code registration

2EB
exposure

Inspection
data
Inspection

3 Mask Recipe
Transport

5

Mask
Inspection

Mask
shipment

Mask fab.
5

1.4 Standardization objects and definition
To be excluded from these standardization objects
1) Circuit pattern data
A data part of a product (GDS data, plot data, comparison inspection data)

To be included in these standardization objects
2) Reticle data (calling the incidental data except circuit pattern data)
Reticle set specification sheet data (halftone, standard etc.)
Individual specification sheet
Pattern data (frame data and processing specification for CAD, plot, and inspection)
Inspection data (dimension, defect etc.)
Recipe data, correction parameter data
3) Reticle-related data
Management of plural reticle
Wafer inspection data (defect, dimension etc.)
History data
Tracking data
Order sheet data6

Supplement
The above-mentioned standardization objects are controlled by the example sheets
mentioned below.
Reticle order sheet
Reticle specification sheet
Delivery control sheet

Design house

Reticle data fabrication sheet

Frame data sheet

Frame fabrication sheet

Wafer map data sheet

Mask Fab.
Defect inspection sheet
Defect correction sheet
CD inspection sheet
Coordinate inspection sheet

Wafer Fab.
Reticle shipment
inspection sheet

Exposure Equipment recipe
sheet

Frame data sheet

CD measurement Equipment
recipe sheet

Wafer map sheet
Delivery/change sheet

Alignment measurement
Equipment recipe sheet
Defect inspection Equipment
Defect inspection Equipment
result sheet

Mask vender, mask
deviceCAD, WP device, WP

CAD, WP device, WP

Mask vender, WP

Related to reticle data handling in mask house
1)Mask vender2)Mask device vender3)Selete

Related to frame data (exposure device mark, inspection
device mark, TEG, etc.)
1)WP device vender (exposure device, CD, alignment,
defect inspection device)2)CAD (frame CAD vender)
3)Wafer fab. user (JEITA)
Related to order-taking and ordering, specification, delivery,change, inspection result
1)Mask vender2)Wafer fab. user (JEITA)

7

1.5 Relationship with related standardization
This guideline deals with the interface of the data exchange of the information
relevant to the reticle except pattern data. The activities of the overseas organizations
that have complementary relationship are mentioned below..
(1) SEMI-Japan Reticle Data Management Task ForceThe standardization activities of micro patterning division·It discusses the data-exchange method of the information relevant to a reticle.
·It intends to draft a guideline.
·It incorporates mask data into stepper recipe data preparation. It performs standardizationof communication of reticle-related information among design〜mask vender〜 wafer fab.
(2) SEMI-NA Mask Data Path Task Force
Standardization activities of UDM(Universal Data Model) Working Group·It discusses the data-exchange method of the information relevant to a reticle.
·It intends to draft a guideline.
·In this, Open Access Coalition of Silicon Integration Initiative (Si2) is introduced.
This consortium aims at offering the open standard to the IC design data access.
(3) MOPXE(Mask Order Processing In the eXtended Enterprise).
·This activity about the mask supply chain is proposed from IMS(Intelligent Manufacturing System). The activity is carried out mainly in Europe81.6 Requirement for establishment of common language
for reticle-related information
The requirements for SoC business of small production of many kinds of products
lead to requirement for establishment of common language through requirement
for total IT utilization. Utilization of many techniques that is based on XML in IT area
must be so developed as to support the requirements for SoC business.
Requirements for total IT integration

systematization oftechnology

Speed(to shorten total TAT)

Requirements for
Requirement for quality establishment ofcommon platform

Flexibility(to address a change)
Growth of business(ROI)

Security
Low-pricing(cost reduction)

1) Technical systematization
The speed of technical accumulation is accelerated by IT technology. For that purpose,technical systematization that aims at high availability is required. The reticle-related
information must be formulized in terminology/definition/methodology about several
aspects of utilization, accumulation, and exchange in a wide area.
Domain ofbusiness unit

Domainof technology
Domain ofapplication

Litho
process

Litho
Equip.

Mask
manufacture

Lithoprocess

Recipemaintenance

Defectanalysis

Mask
Equip.

Mask
process

Equipments
clustering

BtoB

DesignPatterndesignChippattern

Order-taking
Datapreparation and ordering

Framepattern

Deliverycontrol

Qualitystandard

Production
QC dataplan

Necessity of interoperability among various domains
Reticle-related information is used by the entire area of domains through partial relationship.

Necessity of semantic interoperability is large.

92) Flexibility
Production technology must continue to innovate obsolete technology to cope withan ever-changing market, and IT technology must be easily updated. In addition,
the reticle-related information is generated and use in various aspects, and a data modelwith high flexibility is required.
3) Return of investment in business
Activation of information service based on standardization is required to reducethe introduction cost. Owners and users should be clarified according to information
classification. Collaboration should be realized among device makers, mask makers,
equipment makers, and system makers. For that purpose, various business model
should be built where security is precisely set up and license and fees are established.

Application

Application

Application

Application

Information source
based on common platform

Standard data exchangeof XML base
Information Information Information
sourcesourcesourceDifferent kinds ofinformation sources

1) Application eliminates the connection cost,and emphasizes functions that create values.
It is possible to obtain the development flexibility
that overcomes the speed of obsolescence.
Both distribution and IP of application are attempted.

2) By controlling the meaning and source of information,
it is possible to measure the value of
information supplied and to activate business.
3) It is possible to instantly monitor various informationthat is generated widely and asynchronously in Internet.
4) Data are standardized by XML and wrapped for dataexchange. It is possible to permit Inconsistence of various
data between different kinds of information sources.
Thus, it promotes development of individual information sources.

4) Security
The information about a reticle must be maintained at high security for a customer.
Share information must be systematized to set up security management that is partitioned
appropriately and efficiently for various security requirements and usability requirements.

Information source
based on common platform

Security management
technique bases on
precise classification

Information source
based on common platform

Standard data exchangeof XML baseStandard data exchangeof XML base

Information Information Information
sourcesourcesourceInformation Information Information
sourcesourcesourceDifferent kinds ofinformation sources

Different kinds ofinformation sources105) Quality
As the technology becomes more difficult, lack of consideration about quality
generates the maximum loss. Application of IT technology to semiconductor
production technology is not limited to a superficial support for quality control. It needs to support by incorporating analysis, which was difficult because of
shortage of labor in the past. The requirements for quality of a reticle are also
increased. Therefore, efficient development should be supported.

Preset filter

Visualization ofpotential influence
relationship

6) CostIn order to reduce the cost for every reticle under small production of various
products, it is necessary to eliminate every loss that is dispersed and generated
in an extensive area and to obtain an integral effect. Not only that, it is necessary
to establish standardization that is suitable for Internet technology in order torealize a wide information exchange inexpensively.
7) TAT
In order to make it contribute to ultimate product TAT realization, you should
eliminate break and leakage in a total work flow. For that purpose, you should
consider main stream design data that range from design to mask manufacture
and to wafer manufacture. Not only that, you should include information that is
information generated derivatively and consider possibility of wide reuse.
Parallel processing of
preparation and postprocessing

Conversion task
loss

loss

loss

loss

loss
loss

loss

loss

11

2. General guideline
2.1 Sharing of reticle data
The environment that can be utilized in common from design to wafer fab. must be
established being fulfilled the following conditions.
Conditions :1. Reticle data and reticle-related data must be correlatedwith a hierarchic configuration.
2. Reticle data and reticle-related data must be delivered
in a standardized method at each interface.
3. Reticle data and reticle-related data must be defined clearly in their contents.
4. Reticle data and reticle-related data must be stored for each fab.
so that the required data can be taken out whenever necessary.
5. Reticle data and reticle-related data must be protectedby the reasonable security system.

QualityData(Defect)
Qualitydata(CD)SpecsSheet
Design
House

Mask
Fab.

Wafer
Fab.

OrderEntry
Delivery Info.

·It extends freely
according toa business·Minimum data structure
required to share information·Standardized
information isavailable at any time.
·Connection isunrestricted

Platform·Security·Data matching

Example122.2 Outline of shared guideline
covering design, mask manufacture and wafer manufactureInterchange of various data that were explained above has been built by individual
association at B to B until now. The left-hand figure shows continuing building ofindividual
association, while the right-hand figure is based on standardization of processes
that ranges from design of reticle data and reticle-related data to mask manufacture
andto wafer manufacture. The individual know-how and the common data exchange areassociated and controlled respectively, and overall complex processes can be
simplified.

Wafer
DesignMask

B to B

Fab.

Wafer
DesignShared data

Design house
Mask fab

Mask fab.
Wafer fab.

Wafer fab.
Design house.

Chip size
Block configuration
Reticle set markCD (On wafer/reticle)
DefectOrthogonality
ShrinkAlignment mark

Mask

Fab.

Items for standardization
QC flow
Data handling
Guideline for mask order-taking andordering system and data handling(toward creation of standardization
format) (ref: P10)
Guideline related to frame data
(exposure device mark, inspection
device mark etc.)(toward creation of standardization
format)Guideline for design (technology unit)
and photolitho manufacture standard(wafer, reticle accuracy)(toward creation of standardization
format)13

3. Guidlines for Applications
3.1 Order-taking and Ordering of Mask
(1)Guideline for Order-taking and Ordering of Mask
Mask order-taking abd ordering information must be shared from design to mask fab.
and to wafer fab

For data handling, a business model must be flexible enough to meet the requirementsof both parties concerning various formats for drawing, text, GDS, Mebes etc.

The status report of each mask must be shared among order-taking, ordering, andproduction control of reticle database in order to report mask making progress reportand forecast deliverly it for customer. This mask supply is and will be a key for a finepatterned device. This will be an issue whether you produce a mask in-house or not.
[Common items for order-taking and ordering of mask]
1) Design data (drawing, GDS II, Mebes etc) (including frame data)
2) Manufacture request sheet (a masking name, new edition, revision, reprint, size,
pellicle class, specified date of delivery, destination)3) Manufacture conditions (manufacture data specification, exposure data
arrangement
specification, manufacture specification, and inspection specification)4) Progress5) Specification (grade)6) Quality (dimension, arrangement, defect, phase difference, transmittance)7) Inquiry
Shared environment oforder-taking and ordering

DesignMask

Wafer Fab.

[Effects]•You can service all customers more quickly than now•You can reduce system development cost14

(2) Mask Progress report and Deliverly forecast program

Mask fab. should offer wafer fab. the updated information including delivery scheduleof rework of reticle manufacture. Both should offer the standardized interface.

Reticle data management ―Just-in-time program

Timely prediction of delivery(● part) is added to the conventional B to B (○ part)in the standardization. Thus, B to B cooperation can eliminate waste that is observed
by a customer.

LSI chip delivery date(specified by a LSI chip customer)

Production planat wafer fab.

Keepdelivery date of chip

Wafer fab. Production Wafer fab. Production
plan re-simulation
plan check

Preset delivery dateat the order of the reticle

Progress reportduring manufacture

Defect occurrence
during manufacture

Production planat mask fab.

Reticle manufacture

Improved accuracyof production plan

Change (delay)
information

Rework plan
simulation

Observance ofdelivery date of reticle

15

(3) Mask Ordering Data forXML (Structured Reticle Data for Order)

Mask Order
Mask Order
Mask
MaskName
Name

Order
Ordercode
code

Accounting
Accounting Logistic
Logistic
info.
info.
info.
info.

Manufacture
Manufacturespec
speccode
code

Manufacture
Manufacture
control code
control code

Logistic
Logistic
info.
info.

Work
Work
sheet
sheet

Manufacture
Manufacture
process
processcodecode

Quality
Quality
info.
info.

Tool
Tool
info.
info.

Data
Dataprocessing
processing Material Torelance Processing
Processing
Material Torelance
code
Tool
code
Tool

Processing
Processing Processing
Processing
Tool
Spec.
Tool
Spec.

16

3.2 Increase in efficiency of analysis of reticle defect
The reticle data and reticle-related data must be ready for wafer fab. to refer
those for analysis of quality in wafer fab. (defect, dimension etc.) whenevernecessary.
Example 1) You use the reticle data and reticle-related data so that you can judge
whether the quality in wafer fab. originates in a reticle or not.
Example 2) You correlate quality information of a reticle with that of wafer so thatyou can increase efficiency of the process improvement of reticle manufacture.
[Examples of effects]· You can improve the quality of mask
· You can increase efficiency of the quality analysis in wafer fab.
· You can clarify the criteria of quality, optimize mask production process, andreduce a manufacturing cost
· You can reduce the cost to develop a tool to analyze correlation between mask
quality and wafer printing characteristics.
[Example of methods]· You feed back the wafer printing result to the mask fab. and accumulate thedata about correlation between mask quality and wafer printing characteristics· You feed forward the quality information of mask manufacture process to thewafer fab. and utilize it for the quality analysis at wafer fab.

Wafer Fab.

Mask Fab.

Wafer quality
inspection Tool

Reticle quality inspection
Tool Reticle repair Tool
Mask quality data
Mask nameDimension data
Defect data
Position data
OthersWafer quality data
Mask nameDimension data
Defect data
Position data
OthersCoordinatetransformation

Mask
Fab.

Wafer
Fab.

Defectinformation
on wafer

Coordinatetransformation

Commonlanguage
Defect informationand correction
information on reticle

173.3 Increase in efficiency of recipe build in wafer fab

Guideline of Standardized Reticle design information and QC data
to make reusable it for recipe build in Wafer Fab.
1) The data that are related to recipe build of systems, such as exposure tools,
inspection tools, APC, MES, etc. are generated in various data sources throughout thedesign shop, mask fab. and wafer fab. In order to address various quality requirementsin the future, you need a flexible method based on the common formats of data.

[Effects]· The time of recipe building at wafer fab. will become quick.
· The cost for developing recipe build system will be minimized.
[Methods]· Mask flame information, mask quality information, wafer map and sample
plans are provided as standardized format data from each site. Recipe builders
import these data and make recipe.

DesignMask Fab

Flame Information

QC Data

Wafer Map,
Sample plan, etc

Conversion

Conversion

Conversion

Standardization
RecipeBuilder A
Exposure Tool
RecipeRecipeBuilder B
CD SEM
RecipeRecipeBuilder C

Wafer Fab

Defect Inspection
Recipe18

3.4 Data sharing within mask fab.

The data and information within Mask Fab.; inspection, defect correct
and review tool, should be able to be shared for mutual reference ofdata as necessary.
1) Reticle defect correction process use many tools;inspection, defectcorrection and review. This correction will be efficient, if tools canshare there results and recipe.
[Effects]- Can shorten the time to create a recipe at the process of mask defect inspection, defectcorrection and review by reuse of information i.e. coordinates information etc.
- Can reduce the development cost of a recipe by preparing standard or flexible data format- Can improve mask quality by integrate information related to mask defect.
[Methods]- Collect, store, report and analyze the information about mask defect and processing
information.
- Associate and integrate the information about mask defect at wafer manufacture process
and the information at mask manufacture process.

Inspection recipe
Inspection
Inspection

Defect Record

DBDB

Defect Data
Automatic
MES
MES

DB
DB

DB
DB

Repair Record

Repair recipe

RepairRepairReview Record

Repair Data
Automatic

Review recipe

Review
Review

19

Example) XML Data Tree of Inspection Tool

Process No

Tool Information_nDate/Time Stamps

Start Date
Start Time

Tool Information_X

Complete Date
Complete Time
Processing Hours

Basic

Reference Area DB
Basic Area DB

Tool_No

Coordinate Definition

Date of Preparation

Date

Operator of Preparation

Time

3)

Inspection Method
Data of Inspection Area

Inspection Area

Size_x
Size_yChip Number

Chip_n_x

Chip Size

Chip Size_x

Chip_n_y

Chip Size_y
Inspection Result_n1)
Rotation
MirrorFlip
Origin_n

Coordinate_x
Coordinate_y
Image Data

1)

Inspection Result n

Summary

Date/Time Stamps

4)

Start Date
Start Time

Inspection Result X

Complete Date
Complete Time
Processing Hours
RecipeName of Recipe
Mode/Level

Summary of Detection
Operator

Customer/Supplier Agreement

Total NoClass Code n: Total No

Judge
Defect No. n

Position_x
Position_y
JudgeDefect No. X

Fatal/Repair/No needClass CodeUpdated Evaluation 2)

Evaluation
Image Data

Image Data n

4)

Repair_n

Data Post Repair QC

2)20

3.5 Reusable QC Data
At B to B, standards information should be exchanged in the standardized items.
1. Classification of information
1) Wafer Fab. standards information- Order sheet - Spec sheet
2) Mask Fab. standards information- QC sheet
2. Merit: Improvement of productivity and reduction of cost

Methods :Expansion of reusability of QC information by standardization of different section(definition and usage of QC data at Wafer, Mask and Design)
1) As to QC data, you standardize such components that can be stratified and shared.
You should deal with data handling in a standardized method.
2) You should use classification and stratification for communalization. You should
promote first the area that is easy to communalize, namely that is highly common
or highly abstract.

Order Entry

Defect Analysis

Spec Sheet

Data Matchingprocedure

Pattern
data
deliveryspec.

dictionary
QC DataStandardization

Recipe Parameter

Recipe Maintenance

QC data
FocusedData Matching

Framework(with structure)

Geometry
structure

Process
spec.
Calibration
data

Additional Image
data
data

Clustering of Equipment

Introduced Topics

QC data Standardization

21

Examples of sharing of procedure and pattern data

Order Entry

Defect Analysis

Spec Sheet

Procedure

Data Matching

Pattern
data
deliveryspec.

dictionary
QC DataStandardization

Recipe Parameter

Recipe Maintenance

QC data
FocusedFramework

Geometry
structure

Data Matching(with structure)

Additional
data

Process
spec.

Calibration
Image data
data

Clustering of Equipment

QC data Standardization

Introduced Topics

Procedure

PatternData
GDSII,
Mebes etc

Dictionary
Conversion
Rule

Reticle DataManagement
TargetXSD

XSLTranslator Translator
Translator
QC Data With Structure
Formatter

Example22

Example)
QC data of order-taking and ordering of mask
1) Shipped Mask Number(for each type of product, each grade, each technology, each size,
new edition, revision, reprint)
2) Just-in-time Delivery Deticle Ratio
3)TAT
4)Quality (CD:uniformity/mean to target, Distortion, Defect)5)Tool (Tool Up Ratio, QC/Pre Maintenance result )6)Failure data
* : Data must be read on a platform. Production control and quality contro
l should be shown daily, weekly, and monthly.
Those data must be updated to reticle production planand development plan.

23

4. Standardization and implementation procedure
4.1 Activity organization and schedule

Reticle data management―Future schedule０１

０２

Creation of
JEITA Guideline

０３

data model
study with I&CC

JEITA common platform draft

Creation of common
language draft within
SELETE mask fab.
SEMI Standardization
Study Working

Development ofcommunalization
with mask fab.
for SELETE Asuka
SEMI standardization
draft creation

Data environment
for standardization

Remark) SEMI reticle data management TF schedule

Mask vender, WP

Mask vender, mask
Equipment

CAD, WP
Equipment, WP
CAD, WP
Equipment, WP

2002/0 2002/0
4
5
Reque Eachststandafromrdizati
JEITA, on
SEMI workforkickstanda off
rdization
work
cooperation

Reticle order,
specification,
inspection, delivery
control

Inspection Equipment,
Repair Equipment

SEMI
application
development
result feedback

2003/03

Others

2003/03
Eachwork
standardization 2nddraft
to besubmit
ted

Each
work
standardization 1stdraft
to besubmitted

Exposure Tool

CD, alignment, defectExposure Tool

CD, alignment, defect24

Contact JEITA Reticle Management Subcommittee Member
Role

Name

Company
Oki Electric Industry CO.,Ltd.

Toshio Onodera

Silicon Solution Company
Production Division
Process Technology Dept.

Takashi SatohTOSHIBA CORPORATION
Process & Manufacturing
Engineering Center
Advanced ULSI Engineering
Dept.Ⅱ

Toshiharu Matsuda

SANYO Electric Co.,Ltd.
Semiconductor Company
System LSI Div.
Engineering Dept.

Michio Homma

NEC Corporation
NEC Electron Device
Technology&Production
Planning Division

Sub‑Leader Norihiko Miyazaki

FUJITSU LIMITED
Semiconductor Group
Manufacturing Technology
Development Div.
MASK Technology Dept.

LeaderNobuyuki Iriki

Tadashi Imoriya〒193‑8550
550‑1 Higashi‑asakawacho Hachiouji‑shi Tokyo
TEL (0426)62‑6234
FAX (0426)62‑6709
E‑M onodera021@oki.co.jp〒235‑8522
8 Shinsugita Isogo‑ku Yokohama‑shi Kanagawa
Yokohama Office
TEL (045)770‑3605
FAX (045)770‑3570
E‑M ta.sato@toshiba.co.jp〒370‑0596
1‑1‑1 Sakata Ooizumi‑cho Ora‑gun Gunma
TEL (0276)61‑8043
FAX (0276)61‑8836
E‑M matsu067701@swan.sanyo.co.jp〒229‑1198
1120 Shimokuzawa Sagamihara‑shi Kanagawa
TEL (042)779‑6305
FAX (042)771‑0955
E‑M m‑honma@cp.jp.nec.com〒197‑0833
50 Fuchigami Akiruno‑shi Tokyo(Akiruno Technology Center)
TEL (042)532‑2158
FAX (042)532‑2882
E‑M miyazaki.norihi@jp.fujitsu.com

Hitachi Ltd.

Semiconductor&Circuits
Group
Process Engineering
Development Div.
Wafer Process
Manufacturing Technology
Dept.

〒198‑8512
6‑16‑3 Shin‑machi Oume Tokyo（Device Development Center）
TEL (0428)33‑2222
FAX (0428)33‑2092
E‑M iriki‑nobuyuki@sic.hitachi.co.jp

Matsushita Electric IndustrialCo., Ltd.

〒601‑8413
19 Nishikujokasugamati Minami‑ku
Kyoto‑shi Kyoto
TEL (075)662‑7357
FAX (075)662‑6154
E‑M PAN84968@pas.mei.co.jp

Semiconductor Company
Corporaate Manufacturing&Development Div.
Design Support Group

Masayoshi Mori

Address

MITSUBISHI ELECTRICCORPORATIONULSI Development Center
ULSI Process
Integration Dept.

〒664‑8641
4‑1 Zuihara Itami‑shi Hyogo
TEL (0727)84‑7532
FAX (0727)80‑2597
E‑M Mori.Masayoshi@lsi.melco.co.jp

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