LCP based Flexible Copper Clad Laminate
used for high frequency PCB
Direct laminated LCP-FCCL with low profile LCP/Cu interface
for subtractive process

Material composition

Non roughening Cu(Rz=0.6μm)

Non roughening Cu foil
Thickness：12μm, 18um

LCP film
Thickness：25μm, 50um, 100um

Width:Max510mm
Type : Roll, Sheet

Under
development

LCP

2μm

Transmission loss using 50μm LCP※LCP：Company C※Cu foil：Non-roughning electrodeposited Cu foil

Toyokohan FCCL
ConventionalFCCL
LCP

LCP

2um2umVarious company’s LCP canbe applied“Smooth interface” reducestransmission loss

Comparison of high-frequency transmission
characteristics using various company's LCP

Comparison of high-frequency transmission
characteristics using various copper foils

Wiring shape

General properties

Good wiring shape

Item

Test conditions

Non roughness
Cu foil FCCL

Peel strength

Cu thickness：18μm
At R.T＞0.6 N/mm

L/S=70μm/70μm

L/S=70/70μm
50μm

Using non roughening Cu foil
（Toyokohan FCCL）

dielectric constantdissipation factor
Solder heat
resistance
Bending resistance

0.002

288℃,10sec

Pass

R=0.38/135°/4.9N

Dimensional stability After Et,After heating
Using roughening Cu foil
(Conventional FCCL)

3.3

SPDR method,
20GHz

Chemical resistance HCl、NaOH、IPA＞300 times＜±0.1%
pass

The above data presents typical values that are not guaranteed.

【Contact】 Toyokohan Co., Ltd. Marketing Dept.
TEL:+81-833-44-2544, E-mail:tk-marketing@tkworks.jp

Flexible Copper Clad Laminate
used for fine pitch wiring

Under
development

Direct laminated material, ultrathin copper foil with carrier on LCP,
also possible to form fine pitch wiring using MSAP

Material composition

Carrier
18μmCarrier Cu foil
Thickness：18um
Ultra thin Cu foil
Thickness：1.5um

Ultrathin Cu
1.5μm
Width:Max510mm
Type : Roll, Sheet

10μm

LCP

LCP film
Thickness：25μm, 50um,100um

The carrier copper foil can be easily and evenly peeled off

Achieved lamination of ultra thin copper layer with low profile

Ultrathin Cu : 1.5μm

Ultrathin Cu : 1.5μm

5μm

LCP5μmLCP

Low profile Cu foil Rz：0.9μm

Conventional profile Cu foil Rz：1.3μm

General properties

Fine pitch wiringusing MSAP
L/S=25μm/15μm,
Wiring Height=20μm

ItemTest conditions

Non roughness
Cu foil FCCL

Peel strength

Cu thickness：18μm
At R.T

1.0 N/mm

Carrier peel strength At R.T

LCP

50μm

dielectric constantdissipation factor

Solder heat
resistance

0.03N/mm
3.3

SPDR method,
20GHz

0.002

288℃,10sec

Pass

Bending resistance

R=0.38/135°/4.9N＞300 times

Dimensional stability

After Cu plating,After Et,After heating＜±0.1%

Chemical resistance HCl、NaOH、IPA

pass

The above data presents typical values that are not guaranteed.

【Contact】 Toyokohan Co., Ltd. Marketing Dept.
TEL:+81-833-44-2544, E-mail:tk-marketing@tkworks.jp

Flexible Copper Plated Material
for very fine pitch wiring

開発品
Underdevelopment

Very thin Copper plated material, on LCP with low profile interface,also possible to form very fine pitch wiring using SAP

Electroless Cu plating layer
0.1μm

LCP
Fine pitch wiring using SAP

2μm

Transmission loss
using 50μm LCP
Δ15%@40GHz

L/S=15/15μm

LCP

20μm

Test conditions
Cu thickness：18μm

Peel strength At R.T
After 150℃,168hr
dielectric
constant
dissipation
factor
Solder heat
resistanceFabry-perot method
28GHz

260℃,5sec

Comparison with Roughening Cu foil-1

Toyokohan
FCCL-2

Smooth-4

Conventional
FCCL

Rough-5

0.7 N/mm

2μm

LCP0

Cu Plating
FCCL

2μm

LCP-3-6

General properties
ItemTransmission loss（dB/100mm）

0102030
Frequency（GHz）

Process saving
Plating on pre-pored film

0.7 N/mm
3.3

Through-hole

Uniform
Plating

0.002
pass

The above data presents typical values that are not guaranteed.

Cross section【Contact】 Toyokohan Co., Ltd. Marketing Dept.
TEL:+81-833-44-2544, E-mail:tk-marketing@tkworks.jp

20μm40